Semi-solid adhesive film, module lamp panel, and display module

Abstract

Disclosed in the present application are a semi-solid adhesive film, a module lamp panel, and a display module. The semi-solid adhesive film comprises a transfer film body, a semi-solid adhesive film body, and a release film body, which are sequentially arranged in a stacked manner. The transfer film body comprises a PET base film layer and a black functional transfer layer that are arranged in a stacked manner, wherein the black functional transfer layer is located between the PET base film layer and the semi-solid adhesive film body. The semi-solid adhesive film body is a tacky gel-like structure at room temperature.

Description

Semi-solid adhesive film, module light board and display module

[0001] This application claims priority to Chinese patent application No. 202520102315.0, filed on January 14, 2025, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of display technology, and in particular to a semi-solid adhesive film, a module lamp board, and a display module. Background Technology

[0003] Currently, the packaging technology for Mini LED (Mini Light Emitting Diode) display modules is mainly based on Chip on Board (COB) packaging. Because Mini LEDs require high precision, manufacturers currently use molding processes to seal and protect them. Summary of the Invention

[0004] This application is defined by the appended independent claims, and the relevant improvements are set forth in the dependent claims.

[0005] This application provides a semi-solid adhesive film, a module light board, and a display module, aiming to improve the display module that uses molding process for sealing and protection.

[0006] In a first aspect, embodiments of this application provide a semi-solid adhesive film used in the encapsulation of a module light panel, comprising a transfer film, a semi-solid adhesive film, and a release film stacked sequentially. The transfer film comprises a polyethylene terephthalate (PET) base film layer and a black functional transfer layer stacked together. The black functional transfer layer is located between the PET base film layer and the semi-solid adhesive film. The semi-solid adhesive film has a viscous gel structure at room temperature.

[0007] In some possible embodiments, the semi-solid film is a modified epoxy resin colloid doped with a curing agent and additives, wherein the content of the curing agent is 10% to 50% and the content of the additives is 1% to 20%.

[0008] In some possible implementations, the additive includes a diffusion material, the content of which is 5% to 20%.

[0009] In some possible implementations, the additive includes a black material, the content of which is 1% to 5%.

[0010] In some possible implementations, the black functional transfer layer is an anti-glare transfer layer; and / or,

[0011] The light transmittance of the black functional transfer layer is 20% to 80%.

[0012] In some possible implementations, the release film is a polyester film doped with a release agent.

[0013] In some possible implementations, the release force of the release film is 3 gf / in to 12 gf / in.

[0014] In some possible implementations, the thickness of the semi-solid film is 50 μm to 500 μm; and / or,

[0015] The thickness of the transfer film is 50 μm to 100 μm; and / or,

[0016] The thickness of the release film is 50μm to 100μm. Secondly, embodiments of this application also provide a module light board, which is obtained by encapsulating the aforementioned semi-solid adhesive film.

[0017] Thirdly, embodiments of this application also provide a display module, including the module light panel described above.

[0018] The technical solution provided in this application, because the semi-solid adhesive film has a viscous gel structure at room temperature, allows the release film to adhere well to the corresponding side surface of the semi-solid adhesive film when it is not used in the encapsulation of the module light panel, thanks to the inherent adhesiveness of the semi-solid adhesive film itself. When the semi-solid adhesive film is used in the encapsulation of the module light panel, on the one hand, the release film itself can be quickly torn open using its release force, and then the semi-solid adhesive film can be quickly bonded to the lamp surface of the module light panel using methods such as roller bonding. Furthermore, the semi-solid adhesive film can cure quickly after bonding, significantly improving the production efficiency of the display module. On the other hand, the gel structure itself has high elasticity, allowing the semi-solid adhesive film to remain flat under the surface tension of the transfer film, thus ensuring excellent flatness of the encapsulation layer formed after the semi-solid adhesive film has cured. Furthermore, the inherent uniformity of the gel structure prevents material changes and flow during the rapid curing process of the semi-solid film, ensuring a uniform distribution of the encapsulating adhesive layer after curing, without ring marks or flow marks, thus guaranteeing the aesthetics and display effect of the display module. In addition, after the semi-solid film has cured, the PET base film layer of the transfer film can be peeled off, allowing the black functional transfer layer to quickly form the corresponding black functional layer, improving the display effect of the display module. This eliminates the need for an additional black functional film application process, effectively reducing the production steps of the entire display module and further improving production efficiency. Moreover, compared to the black functional layer formed by applying a black functional film, which is prone to edge peeling, this embodiment uses a black functional transfer layer to quickly form the corresponding black functional layer, ensuring complete adhesion between it and the corresponding encapsulating adhesive layer, preventing edge peeling. It is evident that the technical solution of this application can effectively improve the problem of low production efficiency of existing display modules due to the use of encapsulating adhesive molding and attaching a black functional film for sealing and protection. It can also improve the technical problem that when diffusion materials or melanin are added to the encapsulating adhesive, uneven ring marks or flow marks are easily caused in the cured encapsulating adhesive, which in turn affects the aesthetics and light-emitting effect of the display module. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 is a schematic diagram of the structure of the semi-solid adhesive film in an embodiment of this application.

[0021] Figure 2 is a schematic diagram of the module light panel in an embodiment of this application.

[0022] Figure 3 is a schematic diagram of the roller bonding equipment performing roller bonding on the module light panel separately in an embodiment of this application.

[0023] Figure 4 is a schematic diagram of the roller bonding equipment in the embodiment of this application performing roller bonding on the module light panel under vacuum. Embodiments of the present invention

[0024] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0025] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0026] Furthermore, the use of terms such as "first" and "second" in this application is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of a person skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, the user should consider such a combination of technical solutions to be non-existent and not within the scope of protection claimed in this application.

[0027] Currently, Mini LED display module packaging technology mainly uses COB packaging. Due to the high precision requirements of Mini LEDs, manufacturers currently use molding processes for sealing and protection. Commonly used encapsulating adhesives are thermosetting materials, such as epoxy resin or silicone resin, which have long curing times, typically in two stages: initial curing takes over 4 minutes, and long curing takes about 3 hours. This results in relatively low production efficiency for display modules. Furthermore, to achieve better display module performance, manufacturers not only add diffusion materials or melanin to the encapsulating adhesive but also further attach a black functional film to the surface of the encapsulating adhesive layer after curing, forming a corresponding black functional layer. When diffusion materials or melanin are added to the encapsulating adhesive, the temperature rises during molding, causing significant viscosity changes. This can lead to uneven distribution of the diffusion materials or melanin during the flow process, resulting in uneven ring marks (commonly known as "carrot lines") or flow marks on the cured encapsulating adhesive, thus affecting the aesthetics and luminous effect of the display module. The process of applying the black functional film makes the entire production process of the display module more complicated, which will further reduce the production efficiency of the display module.

[0028] Therefore, one objective of this application is to provide a semi-solid adhesive film, a module light board, and a display module to improve the sealing and protection of display modules using molding processes. In particular, it aims to improve the current method of sealing and protecting display modules by molding with encapsulating adhesive and attaching a black functional film. This method not only results in low production efficiency of the display module, but also easily leads to uneven curing of the encapsulating adhesive and the appearance of ring marks or flow marks when diffusing materials or melanin are added to the encapsulating adhesive, thus affecting the aesthetics and luminous effect of the display module.

[0029] In some embodiments, as shown in FIG1, this application provides a semi-solid adhesive film 100, which mainly includes a transfer film 110, a semi-solid adhesive film 120, and a release film 130 stacked sequentially. The transfer film 110 includes a PET base film layer 111 and a black functional transfer layer 112 stacked together. The black functional transfer layer 112 is located between the PET base film layer 111 and the semi-solid adhesive film 120. The semi-solid adhesive film 120 has a viscous gel structure at room temperature.

[0030] It is understood that the semi-solid adhesive film 100 in this embodiment is mainly used in the encapsulation of the module light panel. That is, by pressing the semi-solid adhesive film body 120 of the semi-solid adhesive film 100 onto the lamp surface of the module light panel and allowing it to solidify, an encapsulation and protection of the lamp surface of the module light panel is formed. Since the semi-solid adhesive film body 120 has a viscous gel structure at room temperature, when the semi-solid adhesive film 100 in this example is not used for the encapsulation of the module light panel, the transfer film body 110 (specifically the PET base film layer 111) and the release film body 130 located on both sides of the semi-solid adhesive film body 120 can form a good enclosure and protection for the semi-solid adhesive film body 120. In order to further ensure the enclosure and protection effect of the transfer film body 110 and the release film body 130 on the semi-solid adhesive film body 120, the size of the transfer film body 110 (specifically the PET base film layer 111) and the size of the release film body 130 should both be larger than the size of the semi-solid adhesive film body 120. Generally speaking, the semi-solid adhesive film 100 is mainly rectangular in structure. Therefore, the dimensions mentioned above mainly refer to the length and width. That is, the length of the transfer film 110 (specifically the PET base film layer 111) and the length of the release film 130 should both be greater than the length of the semi-solid adhesive film 120, and the width of the transfer film 110 (specifically the PET base film layer 111) and the width of the release film 130 should both be greater than the width of the semi-solid adhesive film 120.

[0031] In this way, the semi-solid adhesive film 120 of the semi-solid adhesive film 100 in this embodiment has an adhesive gel structure at room temperature. Therefore, when the semi-solid adhesive film 100 is applied to the encapsulation of the module lamp panel, the adhesiveness of the semi-solid adhesive film 120 itself ensures that the release film 130 adheres well to the corresponding side surface of the semi-solid adhesive film 120. When the semi-solid adhesive film 100 is applied to the encapsulation of the module lamp panel, the release film 130 can be quickly torn open using the release force of the release film 130 itself, and then the semi-solid adhesive film 120 can be quickly bonded to the lamp surface of the module lamp panel using methods such as roller bonding. After bonding, the semi-solid adhesive film 120 can be quickly cured, significantly improving the production efficiency of the display module. The gel structure itself possesses high elasticity, allowing the semi-solid adhesive film 120 to remain flat under the surface tension of the transfer film 110. This ensures excellent flatness of the encapsulation layer formed after the semi-solid adhesive film 120 cures. Furthermore, the uniformity of the gel structure prevents material changes and flow during rapid curing of the semi-solid film 120, ensuring a uniform distribution of the encapsulation layer after curing, without ring marks or flow marks, thus guaranteeing the aesthetics and display effect of the display module. In addition, after the semi-solid adhesive film 120 cures, the PET base film layer 111 of the transfer film 110 can be peeled off, allowing the black functional transfer layer 112 to quickly form the corresponding black functional layer, improving the display effect of the display module. This eliminates the need for an additional black functional film application process, effectively reducing the production steps of the entire display module and further improving production efficiency. Meanwhile, compared to the black functional layer formed by attaching a black functional film, which is prone to edge peeling, the embodiments of this application use a black functional transfer layer 112 to quickly form the corresponding black functional layer, which can ensure that the black functional layer and the corresponding encapsulating adhesive layer are completely bonded together and there will be no edge peeling problem.

[0032] In some examples, as shown in Figure 1, the semi-solid adhesive film 120 can specifically be a modified epoxy resin adhesive layer doped with a curing agent and additives, with the curing agent content ranging from 10% to 50% and the additive content from 1% to 20%. Thus, through this structural configuration, on the one hand, by using a modified epoxy resin adhesive layer as the main body, the semi-solid adhesive film 120, being an epoxy system, possesses high hardness, thereby ensuring that the encapsulating adhesive layer formed after the semi-solid adhesive film 120 cures provides good protection for the lamp surface of the module's lamp panel. On the other hand, by setting a certain proportion of curing agent, the curing efficiency after the semi-solid adhesive film 120 is bonded to the lamp surface of the module's lamp panel can be effectively improved. Furthermore, by setting a certain proportion of additives, the encapsulating adhesive layer formed after the semi-solid adhesive film 120 cures can have a corresponding additive effect on the display effect of the display module.

[0033] It is understood that the curing agents mentioned in this example include, but are not limited to, ultraviolet (UV) curing agents and thermosetting agents. The additives mentioned in this example include, but are not limited to, diffusion materials, black materials, defoamers, and anti-settling agents.

[0034] In some examples, as shown in Figure 1, the additives include a diffusing material, the content of which is 5% to 20%. Thus, through the above structural configuration, the encapsulating adhesive layer formed after the semi-solid adhesive film 120 cures can be effectively ensured to have good light diffusion properties, thereby achieving uniform light distribution in the display module.

[0035] It is understood that the diffusion materials mentioned in this example include, but are not limited to, glass microspheres, silica, and organosilicon.

[0036] In some examples, as shown in Figure 1, the additives include a black material, with a content of 1% to 5%. Thus, through the above structural configuration, the encapsulating adhesive layer formed after the semi-solid film 120 cures effectively covers the background color of the module light panel, thereby improving the uniformity of the ink color on the light surface of the module light panel and meeting the contrast requirements of the light surface.

[0037] It is understood that the black materials mentioned in this example include, but are not limited to, carbon black, toner, and black dyes.

[0038] In some examples, as shown in Figure 1, the black functional transfer layer 112 is specifically an anti-glare transfer layer. Thus, with the above structural configuration, the semi-solid adhesive film 100 can be applied to the encapsulation of the module light panel. When the black functional transfer layer 112 forms a corresponding black functional layer on the corresponding module light panel, this black functional layer can effectively improve the anti-glare effect of the corresponding module light panel. Furthermore, the light transmittance of the black functional transfer layer is 20%–80%. Thus, through the above parameter settings, the anti-glare characteristics of the black functional layer can be ensured while the light transmittance of the black functional layer better meets the light transmittance requirements of the corresponding module light panel.

[0039] In some examples, as shown in Figure 1, the release film 130 is a polyester film layer doped with a release agent. Thus, with the above structural configuration, when the semi-solid adhesive film 100 in this example is not used for encapsulating the module light panel, the polyester film layer on one side of the semi-solid adhesive film 120 can provide good enclosure and protection for the semi-solid adhesive film 120. When the semi-solid adhesive film 100 in this example is used for encapsulating the module light panel, the polyester film layer on the corresponding side of the semi-solid adhesive film 120 can be quickly peeled off from the surface of the corresponding side of the semi-solid adhesive film 120 through the application of a corresponding release agent, ensuring the effective encapsulation of the module light panel by the semi-solid adhesive film 120. Furthermore, the release force of the release film 130 is 3 gf / in to 12 gf / in. Thus, with the above parameter settings, when the semi-solid adhesive film 100 in this example is used for the encapsulation of the module light board, the release film 130 can be quickly peeled off to expose the surface of the corresponding side of the semi-solid adhesive film 120, thereby facilitating the quick bonding of the semi-solid adhesive film 120 with the lamp surface of the module light board to complete the encapsulation of the module light board.

[0040] In some examples, as shown in Figure 1, the thickness of the semi-solid adhesive film 120 is 50 μm to 500 μm. Thus, by setting the above parameters, the protective effect of the encapsulating adhesive layer formed after the semi-solid adhesive film 120 cures on the lamp surface of the module lamp board can be ensured.

[0041] It is understandable that the specific thickness of the semi-solid adhesive film 120 in this example may depend on the height of the LED beads in the module light board. Generally speaking, the thickness of the encapsulation adhesive layer formed after the semi-solid adhesive film 120 is cured should be at least 50 micrometers greater than the height of the LED beads in the module light board.

[0042] In some examples, as shown in Figure 1, the thickness of the transfer film 110 is 55 μm to 120 μm. Thus, by setting the above parameters, it can be ensured that the transfer film 110 provides good enclosure and protection for the corresponding surface of the semi-solid adhesive film 120.

[0043] It is understood that in this example, the thickness of the PET base film layer 111 in the transfer film 110 is preferably 50 μm to 100 μm to ensure the aforementioned protective effect. The thickness of the black functional transfer layer 112 is preferably 5 μm to 20 μm to ensure the aforementioned protective effect.

[0044] In some examples, as shown in Figure 1, the thickness of the release film 110 is 50 μm to 100 μm. Thus, by setting the above parameters, it can be ensured that the release film 130 provides good enclosure and protection for the corresponding surface of the semi-solid adhesive film 120.

[0045] In one embodiment, as shown in FIG2, this application embodiment also provides a modular light panel 200, which includes a light panel body 210, a plurality of LED beads 220, an encapsulating adhesive layer 230, and a black functional layer 240. The plurality of LED beads 220 are regularly distributed on one side surface of the light panel body 210, the encapsulating adhesive layer 230 covers the plurality of LED beads 220, and the black functional layer 240 is disposed on the side surface of the encapsulating adhesive layer away from the light panel body 210. The encapsulating adhesive layer 230 is obtained by bonding the semi-solid adhesive film 120 of the semi-solid adhesive film 100 in the above embodiment with the side surface of the light panel body 210 where the plurality of LED beads 220 are disposed, and then curing it. The black functional layer 240 is the black functional transfer layer of the semi-solid adhesive film 100 in the above embodiment. The plurality of PET base film layers 111 can be peeled off after the semi-solid adhesive film 120 is bonded to the side surface of the plurality of LED beads 220.

[0046] It is understood that the module lamp board 200 in this embodiment mainly adopts the semi-solid adhesive film 100 encapsulated in the above embodiment. That is, after multiple LED beads 220 (i.e., multiple LED chip units, each LED chip unit may specifically include three chips: R / G / B) are set on one side surface of the lamp board body 210, the lamp board body 210 is placed on the carrier 400 shown in FIG. 3, and the release film 130 of the semi-solid adhesive film 100 is removed, so that the surface of the semi-solid adhesive film body 120 of the semi-solid adhesive film 100 on the corresponding side is in contact with the side surface of the lamp board body 210 where multiple LED beads 220 are set (i.e., the lamp surface). At this time, the semi-solid adhesive film 100 can be rolled by the roller bonding equipment 300 and then debubbled, so that the semi-solid adhesive film body 120 is completely bonded to the side surface of the lamp board body 210 where multiple LED beads 220 are set (i.e., the lamp surface). Finally, after the semi-solid adhesive film 120 has rapidly cured to form the corresponding encapsulating adhesive layer 240, the PET base film layer 111 of the transfer film 110 can be peeled off, so that the black functional transfer layer 112 of the transfer film 110 can quickly form the corresponding black functional layer 240.

[0047] As shown in Figure 3, the roller bonding equipment 300 mentioned above can be a common roller bonding device, mainly including a vacuum suction plate 310 and a rubber roller 320. The roller pressing process mentioned above is mainly completed in a conventional cleanroom. After the lamp board body 210 with corresponding LED beads 220 is placed on the carrier 400, the rubber roller 320 moves up and down to align and press one end of the semi-solid adhesive film 100 onto one end of the lamp surface of the lamp board body 210. The vacuum suction plate 310 moves to the other end of the lamp surface of the lamp board body 210 and drags the rubber roller 320 to roll, so as to press the semi-solid adhesive film 120 onto the lamp surface of the lamp board body 210. Since the semi-solid adhesive film 120 has a gel structure at room temperature and has high adhesion and high filling capacity, it can be completely bonded to the lamp surface of the lamp board body 210 (which can be pre-coated with a full-surface protective coating to facilitate the filling of the gaps between the multiple LED beads 220 by the semi-solid adhesive film 120). The above-mentioned roller bonding process is generally completed in 3 to 10 seconds. The speed is adjusted according to the bonding effect. After bonding, degassing is required to ensure that the encapsulating adhesive layer 230 formed after the semi-solid adhesive film 120 is cured has a better display effect. Preferably, as shown in Figure 4, a vacuum chamber 500 can be added to move the entire roller bonding process of the roller bonding equipment 300 to the vacuum chamber 500. That is, the roller bonding equipment 300 is completely placed in the vacuum chamber 500. At the same time, the vacuum chamber 500 is also provided with a first material box 510 for temporarily storing the semi-solid adhesive film 100 and a second material box 520 for temporarily storing the lamp board 210 with the corresponding multiple LED beads 220. Generally speaking, a vacuuming operation (generally 20 to 50 seconds) of the vacuum chamber 500 can meet the bonding operation of multiple modules. Meanwhile, before the roll forming process, it is not necessary to pre-coat the entire surface of the lamp panel body 210 with protective coating. Roll forming in a vacuum environment can ensure that there is no air between the adhesive film and the module, so there is no need for subsequent debubbling treatment.

[0048] In this way, the module light board in this embodiment of the application, which is encapsulated by the semi-solid adhesive film 100 in the above embodiment, can improve the production efficiency of the display module and ensure the aesthetics and display effect of the display module.

[0049] In one embodiment, as shown in FIG2, this application embodiment also provides a display module, which may specifically include the module light panel 200 in the above embodiment.

[0050] It is understood that the display module in this application embodiment can be used for standalone display or can be specifically applied in a display module to form a corresponding display module by arranging multiple display modules in a certain manner. The display module in this application embodiment can adopt a structure design with a bottom shell or a structure design without a bottom shell. When a structure design with a bottom shell is adopted, in addition to including the module lamp board 200, it also includes a module bottom shell, which is installed on the surface of the module lamp board 200 away from the lamp beads 220.

[0051] Thus, the display module in this embodiment of the application, since it adopts the module lamp board 200 in the above embodiment, has the same function and technical effect as the above embodiment, which will not be repeated here.

[0052] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit it. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A semi-solid adhesive film used in the encapsulation of module light boards, wherein, The semi-solid adhesive film includes a transfer film, a semi-solid adhesive film, and a release film stacked sequentially. The transfer film includes a polyethylene terephthalate (PET) base film layer and a black functional transfer layer stacked together. The black functional transfer layer is located between the PET base film layer and the semi-solid adhesive film. The semi-solid adhesive film has a viscous gel structure at room temperature.

2. The semi-solid adhesive film according to claim 1, wherein, The semi-solid film is a modified epoxy resin colloid doped with a curing agent and additives. The content of the curing agent in the semi-solid film is 10% to 50%, and the content of the additives in the semi-solid film is 1% to 20%.

3. The semi-solid adhesive film according to claim 2, wherein, The additives include a diffusion material, and the content of the diffusion material in the semi-solid membrane is 5% to 20%.

4. The semi-solid adhesive film according to claim 2, wherein, The additives include a black material, and the content of the black material in the semi-solid film is 1% to 5%.

5. The semi-solid adhesive film according to any one of claims 1 to 4, wherein, The black functional transfer layer is an anti-glare transfer layer; and / or, The light transmittance of the black functional transfer layer is 20% to 80%.

6. The semi-solid adhesive film according to any one of claims 1 to 5, wherein, The release film is a polyester film doped with a release agent.

7. The semi-solid adhesive film according to any one of claims 1 to 6, wherein, The release force of the release film is 3 gf / in to 12 gf / in.

8. The semi-solid adhesive film according to any one of claims 1-7, wherein, The thickness of the semi-solid film is 50 μm to 500 μm; and / or, The thickness of the transfer film is 55 μm to 120 μm; and / or, The thickness of the release film is 50 μm to 100 μm.

9. A modular light panel, wherein, The module light board is obtained by encapsulation with a semi-solid film as described in any one of claims 1 to 8.

10. The module light panel according to claim 9, wherein, The module light board includes a light board body, multiple light-emitting diode (LED) beads, an encapsulating adhesive layer, and a black functional layer. The multiple LED beads are regularly distributed on one side surface of the light board body. The encapsulating adhesive layer covers the multiple LED beads, and the black functional layer is located on the side surface of the encapsulating adhesive layer away from the light board body. The encapsulating adhesive layer is obtained by bonding the semi-solid adhesive film in the semi-solid adhesive film with the surface of the lamp board body on one side where multiple LED beads are provided and then curing it. The black functional layer is composed of multiple black functional transfer layers in the semi-solid adhesive film.

11. A display module, wherein, Includes the module light panel as described in any one of claims 9 to 10.

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