Micro-electro-mechanical sensor, micro-electro-mechanical module, and electronic device
By designing a radially arranged structure of multiple electrode sheets in a MEMS acoustic sensor and optimizing the arrangement and connection of the electrode sheets, the problem of insufficient sensitivity of MEMS acoustic sensors in artificial intelligence voice interaction is solved, and the resolution of signal detection and the linearity of capacitance change are improved.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- HUAWEI TECH CO LTD
- Filing Date
- 2025-09-18
- Publication Date
- 2026-07-23
AI Technical Summary
How to optimize the performance of MEMS acoustic sensors to meet the needs of artificial intelligence voice interaction, and improve their sensitivity and signal detection resolution.
Design a microelectromechanical sensor by radially arranging multiple first and second electrode plates on a diaphragm to increase the number and area variation of the electrode plates, using a bias voltage to increase the capacitance variation between the electrode plates, and optimizing the arrangement and connection structure of the electrode plates to improve sensitivity.
It enhances the sensitivity of the microelectromechanical sensor, improves the resolution of signal detection and the linearity of capacitance change, expands the acoustic overload point, and optimizes the performance of the MEMS acoustic sensor.
Smart Images

Figure CN2025122294_23072026_PF_FP_ABST