Display module and display apparatus

Abstract

A display module (000) and a display apparatus (100), relating to the technical field of display. The display module (000) comprises a display panel (00), a detection assembly (10), and a flexible printed circuit (20). The display panel (00) has a display area (01) and a non-display area (02) surrounding the periphery of the display area (01). The non-display area (02) comprises a first bonding area (02a) and a second bonding area (02b) arranged in a first direction (X). The detection assembly (10) is bonded and connected to a first pin group (03) in the first bonding area (02a). The flexible printed circuit (20) is bonded and connected to a second pin group (04) in the second bonding area (02b), and the flexible printed circuit (20) has at least two third target pins (21a) and at least one test capacitor (22). The at least two third target pins (21a) are correspondingly bonded to at least two second target pins (04a). By bonding the detection assembly (10) to the display panel (00) and providing the test capacitor (22) on the flexible printed circuit (20), after the flexible printed circuit (20) is bonded and connected to the second bonding area (02b), the detection assembly (10) can measure a capacitance signal of the test capacitor (22), so as to determine the state of bonding between the second target pins (04a) and the corresponding third target pins (21a).

Description

Display module and display device

[0001] This application claims priority to Chinese Patent Application No. 202510084999.0, filed on January 20, 2025, entitled “Display Module and Display Device”, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of display technology, and in particular to a display module and display device. Background Technology

[0003] With the rapid development of Organic Light-Emitting Diode (OLED) display technology, the precision and reliability of module assembly have become one of the core indicators for measuring product quality. Especially in the bonding process between flexible printed circuit boards (FPCs) and display modules, the quality of this bonding directly affects the product's display performance and lifespan.

[0004] Currently, although FPC bonding impedance testing can be used during the assembly stage to assess the initial quality of bonding to some extent, its limitations are significant. In particular, it cannot cover various unexpected situations that may occur during the product lifecycle, such as potential damage after the entire unit is assembled or accidental drops during consumer use. These can all silently affect the integrity of FPC bonding and thus affect the display effect. Summary of the Invention

[0005] This application provides a display module and display device. It solves the problem in the prior art that FPC bonding quality cannot be detected in real time. The technical solution is as follows:

[0006] On the one hand, a display module is provided, including: a display panel, a detection component, and a flexible circuit board;

[0007] The display panel has a display area and a non-display area surrounding the display area; the non-display area includes: a first bonding area and a second bonding area arranged in a first direction, the first bonding area being closer to the display area than the second bonding area; a portion of the display panel distributed within the first bonding area has a first pin group, and a portion of the display panel distributed within the second bonding area has a second pin group; at least two first target pins in the first pin group and at least two second target pins in the second pin group are electrically connected; the at least two second target pins are arranged along a second direction; the second direction intersects the first direction;

[0008] The detection component is bound and connected to the first pin group within the first binding area;

[0009] The flexible circuit board is bonded to the second pin group in the second bonding area, and the flexible circuit board has: at least two third target pins and at least one test capacitor; the at least two third target pins are correspondingly bonded to the at least two second target pins, each pair of the at least two third target pins corresponds to one test capacitor, and the first capacitor electrode and the second capacitor electrode of one test capacitor are electrically connected to the corresponding two third target pins respectively.

[0010] Optionally, in the same test capacitor, the first capacitor electrode and the second capacitor electrode are disposed in the same layer and are made of the same material.

[0011] Optionally, in the same test capacitor, the arrangement direction of the first capacitor electrode and the second capacitor electrode is parallel to the first direction, or the arrangement direction of the first capacitor electrode and the second capacitor electrode is parallel to the second direction.

[0012] Optionally, in the same test capacitor, the first capacitor electrode has a cutout area, and the orthographic projection of the second capacitor electrode on the substrate in the flexible circuit board is located within the orthographic projection of the cutout area on the substrate in the flexible circuit board.

[0013] Optionally, the first capacitor electrode is a square ring electrode, and the second capacitor electrode is a square electrode;

[0014] Alternatively, the first capacitor electrode is a rectangular ring electrode, and the second capacitor electrode is a rectangular electrode;

[0015] Alternatively, the first capacitor electrode is a circular ring electrode, and the second capacitor electrode is a circular electrode;

[0016] Alternatively, the first capacitor electrode may be an elliptical ring electrode, and the second capacitor electrode may be an elliptical electrode.

[0017] Optionally, when the second capacitor electrode is a rectangular or elliptical electrode, the angle between the length direction of the second capacitor electrode and the second direction is greater than or equal to 0° and less than or equal to 180°.

[0018] Optionally, in the same test capacitor, the first capacitor electrode and the second capacitor electrode are disposed in different layers;

[0019] Wherein, the orthographic projection of the first capacitor electrode on the substrate of the flexible circuit board overlaps with the orthographic projection of the second capacitor electrode on the substrate of the flexible circuit board.

[0020] Optionally, both the first capacitor electrode and the second capacitor electrode are square, rectangular, circular, or elliptical electrodes.

[0021] Optionally, the two third target pins corresponding to the same test capacitor are arranged adjacent to each other in the second direction.

[0022] Optionally, when there are multiple test capacitors, the multiple test capacitors include a first test capacitor and a second test capacitor;

[0023] The flexible circuit board also has a plurality of third type pins; in the second direction, the two third target pins corresponding to the first test capacitor are distributed on one side of the plurality of third type pins, and the two third target pins corresponding to the second test capacitor are distributed on the other side of the plurality of third type pins;

[0024] The second pin group further includes: a plurality of second type pins, wherein the plurality of second type pins are bonded to the plurality of third type pins.

[0025] Optionally, the first pin group further includes: a plurality of touch pins; a portion of the display panel within the display area has a touch electrode layer; the touch electrode layer is electrically connected to the plurality of touch pins;

[0026] The detection component has multiple pairs of first-type touch interfaces and at least one pair of second-type touch interfaces; the multiple pairs of first-type touch interfaces are correspondingly connected to the multiple touch pins, and the at least one pair of second-type touch interfaces is correspondingly connected to the at least two first target pins;

[0027] Wherein, the at least one pair of second-type touch interfaces corresponds to at least one test capacitor; for the touch driving interface and touch sensing interface in the pair of second-type touch interfaces, and the first capacitor electrode and the second capacitor electrode in the corresponding test capacitor, the touch driving interface is used to connect to the first capacitor electrode, and the touch sensing interface is used to connect to the second capacitor electrode.

[0028] Optionally, the first pin group further includes: a plurality of data driving pins; the portion of the display panel within the display area also has a plurality of data signal lines; the plurality of data signal lines are connected to the plurality of data driving pins accordingly;

[0029] The display module further includes a driver chip that is bonded to and connected to the first pin group within the first bonding area, and the driver chip is connected to the plurality of data driving pins.

[0030] Optionally, the detection component and the driving chip are integrated into one unit.

[0031] Optionally, the first pin group further includes a plurality of first-type pins; the second pin group further includes a plurality of second-type pins; the plurality of first-type pins and the plurality of second-type pins are electrically connected accordingly.

[0032] On the other hand, a display device is provided, comprising: a control component and any of the above-described display modules, wherein the control component is electrically connected to the display module.

[0033] The beneficial effects of the technical solutions provided in this application are:

[0034] By bonding a detection component to the first bonding area of ​​the display panel and placing a test capacitor on the flexible circuit board, and after the flexible circuit board is bonded to the second bonding area, a third target pin on the flexible circuit board is bonded to a corresponding second target pin on the second bonding area. The detection component is electrically connected to the second target pin on the second bonding area via the first target pin, and then electrically connected to the test capacitor via the second target pin on the second bonding area and the third target pin on the flexible circuit board. In this way, the detection component can measure the capacitance signal of the test capacitor, which can be used to characterize the bonding state between the second target pin and the corresponding third target pin; based on this, the bonding state between the flexible circuit board and the display panel can be determined. Attached Figure Description

[0035] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0036] Figure 1 is a schematic diagram of the structure of a display module before binding;

[0037] Figure 2 is a schematic diagram of the display module provided in the embodiment of the application;

[0038] Figure 3 is a schematic diagram of the structure of the non-display area of ​​the display panel provided in an embodiment of this application;

[0039] Figure 4 is a schematic diagram of the structure of the flexible circuit board provided in an embodiment of this application;

[0040] Figure 5 is a schematic diagram of the film layer at point A-A' in Figure 2;

[0041] Figure 6 is a schematic diagram of another display module provided in an embodiment of this application;

[0042] Figure 7 is a schematic diagram of another display module provided in an embodiment of this application;

[0043] Figure 8 is a schematic diagram of another display module provided in an embodiment of this application;

[0044] Figure 9 is a schematic diagram of the membrane layer at point B-B' in Figure 8;

[0045] Figure 10 is a schematic diagram of the structure of the test capacitor provided in an embodiment of this application;

[0046] Figure 11 is a schematic diagram of another test capacitor provided in an embodiment of this application;

[0047] Figure 12 is a schematic diagram of another test capacitor provided in an embodiment of this application;

[0048] Figure 13 is a schematic diagram of another test capacitor provided in an embodiment of this application;

[0049] Figure 14 is a schematic diagram of the structure of a test capacitor provided in another embodiment of this application;

[0050] Figure 15 is a schematic diagram of the structure of a display module provided in another embodiment of this application;

[0051] Figure 16 is a schematic diagram of the film layer at C-C' in Figure 15;

[0052] Figure 17 is a schematic diagram of the structure of a display module provided in another embodiment of this application;

[0053] Figure 18 is a schematic diagram of the detection component and driving chip provided in an embodiment of this application;

[0054] Figure 19 is a schematic diagram of the structure of the display device provided in the embodiment of this application. Detailed Implementation

[0055] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0056] Please refer to Figure 1, which is a structural schematic diagram of a display module before bonding. The display module includes a display panel 0 and a flexible circuit board 3. The display panel 0 may have a display area 1 and a non-display area 2 surrounding the display area 1. The non-display area 2 may include a bonding area 2a, and the flexible circuit board 3 is bonded to the bonding area 2a. The portion of the display panel 0 distributed within the bonding area 2a may have multiple first-type pins 2b, and the flexible circuit board 3 has multiple second-type pins 3a. After the flexible circuit board 3 is bonded to the bonding area 2a, the first-type pins 2b and the second-type pins 3a are electrically connected accordingly, such as in a one-to-one correspondence.

[0057] Currently, during the bonding process of the flexible circuit board 3 to the bonding area 2a, there are instances where the first type of pin 2b and the second type of pin 3a are not electrically connected according to the designed correspondence. For example, the design requires the first first type of pin 2b on the left side of Figure 1 to be connected to the first second type of pin 3a on the left side, but after actual bonding, the first first type of pin 2b on the left side is connected to other second type of pins 3a. This situation can be defined as bonding offset. Another example is that the first type of pin 2b and the second type of pin 3a are electrically connected, but after bonding, due to abnormal conditions (such as improper operation, dropping of the display device, etc.), the bonding area 2a between the flexible circuit board 3 and the display panel 0 is torn, resulting in a disconnection or unreliable connection between the first type of pin 2b and the second type of pin 3a. This situation can be defined as bonding tear.

[0058] Current methods for detecting FPC bonding status involve measuring the impedance between the first type pin 2b and the corresponding second type pin 3a after the display module is assembled. This determines whether the first type pin 2b and the second type pin 3a are electrically connected. If all first type pins 2b and second type pins 3a are electrically connected, the FPC bonding is considered normal. However, this detection method has significant limitations, especially in that it cannot cover various unexpected situations that may occur during the product lifecycle. Potential damage after assembly or accidental drops during consumer use can silently affect the integrity of the FPC bonding, thereby impacting the display performance.

[0059] First, traditional impedance testing methods are limited by the module's condition and cannot capture subtle changes in the bonding status in real time after the entire unit is assembled or during consumer use. If the entire unit suffers accidental drops or improper operation that damages the FPC bonding (such as bonding tearing), traditional testing methods often require disassembly for testing. This not only increases repair costs but also prolongs troubleshooting time, seriously affecting the consumer experience.

[0060] Secondly, traditional impedance testing methods fall short when dealing with uncontrollable factors on the consumer side, such as accidental drops or impacts to the phone. Consumers often struggle to determine whether display abnormalities stem from FPC bonding issues, while professional testing requires cumbersome disassembly procedures, undoubtedly increasing consumer frustration and dissatisfaction.

[0061] In this embodiment, please refer to Figures 2 to 4. Figure 2 is a structural schematic diagram of the display module provided in this embodiment, Figure 3 is a structural schematic diagram of the non-display area of ​​the display panel provided in this embodiment, and Figure 4 is a structural schematic diagram of the flexible circuit board provided in this embodiment. The display module 000 may include: a display panel 00, a detection component 10, and a flexible circuit board 20.

[0062] The display panel 00 may have a display area 01 and a non-display area 01 surrounding the display area 01. The non-display area 01 may include a first bonding area 02a and a second bonding area 02b arranged in a first direction X, wherein the first bonding area 02a is closer to the display area 01 than the second bonding area 02b. The portion of the display panel 00 distributed within the first bonding area 02a may have a first pin group 03, and the portion of the display panel 00 distributed within the second bonding area 02b may have a second pin group 04.

[0063] The first pin group 03 may include at least two first target pins 03a, and the second pin group 04 may include at least two second target pins 04a. Here, the at least two first target pins 03a in the first pin group 03 and the at least two second target pins 04a in the second pin group 04 are electrically connected. It should be noted that the at least two second target pins 04a in the second pin group 04 may be arranged along a second direction Y; this second direction Y intersects with the first direction X. For example, in this embodiment, the second direction Y is perpendicular to the first direction X.

[0064] For example, referring to Figure 3, the portion of the display panel 000 located between the first bonding area 02a and the second bonding area 02b may have at least two first connecting lines L1 (shown as solid lines in Figure 3 to distinguish them from the second connecting lines L2). One end of each of the at least two first connecting lines L1 may be electrically connected to at least two corresponding first target pins 03a, and the other end of each of the at least two first connecting lines L1 may be electrically connected to at least two corresponding second target pins 04a. Therefore, each first target pin 03a and its corresponding second target pin 04a can be electrically connected via a corresponding first connecting line L1.

[0065] The detection component 10 is bonded and connected to the first pin group 03 within the first binding area 02a.

[0066] The flexible circuit board 20 is bonded to the second pin group 04 within the second bonding area 02b, and the flexible circuit board 20 may have at least two third target pins 21a and at least one test capacitor 22. The at least two third target pins 21a are bonded to at least two second target pins 04a, and every two third target pins 21a correspond to one test capacitor 22.

[0067] Among them, the first capacitor electrode 221 and the second capacitor electrode 222 in a test capacitor 22 are electrically connected to the corresponding two third target pins 21a.

[0068] In this embodiment, the detection component 10 can be electrically connected to the first capacitor electrode 221 and the second capacitor electrode 222 of a test capacitor 22 via two first target pins 03a in the first pin group 03, two corresponding second target pins 04a in the second bonding area 02b, and two corresponding third target pins 21a on the flexible circuit board 20. Thus, the detection component 10 can measure the capacitance signal of the test capacitor 22. When the flexible circuit board 20 and the display panel 00 are properly bonded, the third target pins 21a of the flexible circuit board 20 are bonded to the second target pins 04a of the display panel 00, and the detection component 10 measures the capacitance signal of the test capacitor 22 within a design range, such as a capacitance value within a certain range. When the bonding between the flexible circuit board 20 and the display panel 00 is abnormal, the bonding between the third target pins 21a of the flexible circuit board 20 and the second target pins 04a of the display panel 00 is abnormal, and the detection component 10 measures the capacitance signal of the test capacitor 22 outside the design range. For example, in the event of a bond tear, the bond between the second target pin 04a and the third target pin 21a is broken, and the electrical connection between the corresponding test capacitor 22 and the detection component 10 is broken. In this case, the detection component 10 cannot measure the capacitance signal of the test capacitor 22. Similarly, in the event of a bond misalignment, the detection component 10 also cannot measure the capacitance signal of the test capacitor 22.

[0069] For ease of description, within the same test capacitor 22, the loop between one second target pin 04a and the first capacitor electrode 221 is defined as the transmitting loop (Tx loop), and the loop between the other second target pin 04a and the second capacitor electrode 222 is defined as the receiving loop (Rx loop). The detection component 10 can send a drive signal to the transmitting loop and receive an alternating voltage signal as a capacitance signal through the receiving loop. The magnitude of the capacitance signal is affected by the integrity of the transmitting and receiving loops. In the event of an anomaly between the detection component 10 and the transmitting loop or between the detection component 10 and the receiving loop (such as bonding offset or bonding tear), the detection component 10 cannot effectively receive the capacitance signal.

[0070] The detection component 10 detects the capacitance signal of the test capacitor 22. The detection component 10 can communicate with the control component of the display device. The control component or the detection component 10 can determine the FPC bonding status based on the capacitance signal. In the event of a bonding abnormality, the control component at the consumer end can control the display area 01 of the display panel 00 to display a message indicating that the current display abnormality is due to an FPC bonding problem, facilitating the consumer to send the device for inspection and repair.

[0071] As can be seen, in this embodiment, a detection component is bonded to the first bonding area of ​​the display panel, a test capacitor is disposed on the flexible circuit board, and after the flexible circuit board is bonded to the second bonding area, the third target pin on the flexible circuit board is bonded to the corresponding second target pin on the second bonding area. The detection component is electrically connected to the second target pin on the second bonding area through the first target pin, and then electrically connected to the test capacitor through the second target pin on the second bonding area and the third target pin on the flexible circuit board. In this way, the detection component can measure the capacitance signal of the test capacitor, and the capacitance signal can be used to characterize the bonding state between the second target pin and the corresponding third target pin; based on this, the bonding state between the flexible circuit board and the display panel can be determined according to the capacitance signal.

[0072] In one possible implementation, please refer to Figure 5, which is a schematic diagram of the film layers at A-A' in Figure 2. The flexible circuit board 20 may include: a substrate 201, and at least one conductive layer 202 and at least one insulating layer 203 alternately arranged on one side of the substrate 201. In the same test capacitor 22, the first capacitor electrode 221 and the second capacitor electrode 222 are disposed in the same layer and made of the same material. That is, the first capacitor electrode 221 and the second capacitor electrode 222 may be formed by patterning the same conductive layer 202 and are located in the same conductive layer 202.

[0073] Please refer to Figures 2, 6, and 7. Figure 6 is a schematic diagram of another display module provided in an embodiment of this application, and Figure 7 is a schematic diagram of yet another display module provided in an embodiment of this application. This application does not limit the shape or positional relationship of the first capacitor electrode 221 and the second capacitor electrode 222. However, the larger the shape of the first capacitor electrode 221 and the second capacitor electrode 222, the better, and the smaller the interval between them, the better, as this can produce a more sensitive capacitance detection effect. Both the first capacitor electrode 221 and the second capacitor electrode 222 can be square, rectangular, circular, or elliptical electrodes.

[0074] For example, please refer to Figure 6. For instance, both the first capacitor electrode 221 and the second capacitor electrode 222 can be circular electrodes. Circular electrodes have a lower discharge effect at the edges than square electrodes, which can improve the effect of resisting electrostatic discharge.

[0075] For example, in the same test capacitor 22, as shown in Figure 2, the arrangement direction of the first capacitor electrode 221 and the second capacitor electrode 222 is parallel to the first direction X, or as shown in Figure 7, the arrangement direction of the first capacitor electrode 221 and the second capacitor electrode 222 is parallel to the second direction Y.

[0076] The test capacitor 22 can be arranged in a way that is parallel to the first direction X or the second direction Y. The test capacitor 22 can be placed at the edge of the flexible circuit board 20. In this way, the test capacitor 22 can avoid the traces on the flexible circuit board 20, which has greater flexibility.

[0077] In one possible implementation, please refer to Figures 8 to 10. Figure 8 is a schematic diagram of another display module structure provided in an embodiment of this application. Figure 9 is a schematic diagram of the film layer at B-B' in Figure 8. Figure 10 is a schematic diagram of the test capacitor structure provided in an embodiment of this application. In the same test capacitor 22, the first capacitor electrode 221 may have a hollow area 221a, and the orthographic projection of the second capacitor electrode 222 on the substrate 201 is located within the orthographic projection of the hollow area 221a on the substrate 201.

[0078] In this embodiment, the second capacitor electrode 222 is embedded in the hollow area 221a of the first capacitor electrode 221. In this way, the first capacitor electrode 221 and the second capacitor electrode 222 can form a ring-shaped induced electric field around the perimeter, which greatly enhances the sensing of the detection component 10 to the signal. In other words, it has better detection sensitivity and a higher sensing quality factor for detecting small signals.

[0079] In the embodiments of this application, please refer to Figures 10 to 14. Figure 11 is a schematic diagram of another test capacitor provided in the embodiment of this application. Figure 12 is a schematic diagram of yet another test capacitor provided in the embodiment of this application. Figure 13 is a schematic diagram of yet another test capacitor provided in the embodiment of this application. Figure 14 is a schematic diagram of a test capacitor provided in another embodiment of this application. The shapes of the first capacitor electrode 221 and the second capacitor electrode 222 are not limited.

[0080] For example, as shown in Figure 10, the first capacitor electrode 221 can be a square ring electrode, and the second capacitor electrode 222 can be a square electrode. As shown in Figure 11, the first capacitor electrode 221 can be a rectangular ring electrode, and the second capacitor electrode 222 can be a rectangular electrode. As shown in Figure 12, the first capacitor electrode 221 can be a circular ring electrode, and the second capacitor electrode 222 can be a circular electrode. As shown in Figures 13 and 14, the first capacitor electrode 221 can be an elliptical ring electrode, and the second capacitor electrode 222 can be an elliptical electrode.

[0081] For example, referring to Figures 11, 13, and 14, when the second capacitor electrode 222 is a rectangular or elliptical electrode, the angle between the length direction of the second capacitor electrode 222 and the second direction Y is greater than or equal to 0° and less than or equal to 180°. Furthermore, the length direction of the first capacitor electrode 221 can also be parallel to the length direction of the second capacitor electrode 222 to avoid a short circuit between the first capacitor electrode 221 and the second capacitor electrode 222.

[0082] By changing the shape and length direction of the first capacitor electrode 221 and the second capacitor electrode 222, different test capacitors 22 can be designed to accommodate different FPC reserved spaces, ensuring that the test capacitor 22 has wide adaptability. For example, elliptical electrodes can provide better flexibility to avoid interference from subsequent traces on the flexible circuit board 20.

[0083] In one possible implementation, please refer to Figures 15 and 16. Figure 15 is a structural schematic diagram of a display module provided in another embodiment of this application, and Figure 16 is a schematic diagram of the film layer at C-C' in Figure 15. In the same test capacitor 22, the first capacitor electrode 221 and the second capacitor electrode 222 are disposed in different layers; that is, the first capacitor electrode 221 and the second capacitor electrode 222 are respectively formed by patterning two conductive layers 202 and are respectively located in the two conductive layers 202.

[0084] The orthographic projection of the first capacitor electrode 221 on the substrate 201 in the flexible circuit board 20 overlaps with the orthographic projection of the second capacitor electrode 222 on the substrate 201 in the flexible circuit board 20.

[0085] Since the flexible circuit board 20 generally has multiple conductive layers 202, the first capacitor electrode 221 and the second capacitor electrode 222 can be set in different layers according to the requirements. At this time, the area of ​​the test capacitor 22 projected onto the substrate 201 can be minimized, and the occupied space can be minimized.

[0086] For example, referring to Figure 15, both the first capacitor electrode 221 and the second capacitor electrode 222 can be square, rectangular, circular, or elliptical electrodes. This application does not limit the shape of the first capacitor electrode 221 and the second capacitor electrode 222. For example, using a circular electrode, which has a lower edge discharge effect than a square electrode, can improve the effect of resisting electrostatic discharge.

[0087] In one possible implementation, referring to Figures 2, 4, 5 to 8, and 15, two third target pins 21a corresponding to the same test capacitor 22 are arranged adjacently in the second direction Y. The routing between the adjacent third target pins 21a and the test capacitor 22 does not need to be bridged by other traces, thus avoiding interference with the routing of the flexible circuit board 20.

[0088] In one possible implementation, please refer to Figures 2, 4, 5 to 8 and 15. When there are multiple test capacitors 22, the multiple test capacitors 22 may include a first test capacitor and a second test capacitor, such as the left and right test capacitors 22 shown in the figure.

[0089] Referring to Figure 4, the flexible circuit board 20 may also have multiple third-type pins 21b; in the second direction Y, the two third-target pins 21a corresponding to the first test capacitor are distributed on one side of the multiple third-type pins 21b, and the two third-target pins 21a corresponding to the second test capacitor are distributed on the other side of the multiple third-type pins 21b.

[0090] Please refer to Figure 3. The second pin group 04 may also include: a plurality of second type pins 04b, which are bonded to a plurality of third type pins 21b.

[0091] For ease of understanding, in Figure 3, the second type pin 04b and the second target pin 04a are shown at different lengths in the first direction X, which does not limit their actual shape and size. Similarly, in Figure 4, the third type pin 21b and the third target pin 21a are shown at different lengths in the first direction X, which does not limit their actual shape and size.

[0092] In this embodiment, the first test capacitor and the second test capacitor can be respectively disposed on both sides of the flexible circuit board 20 in the second direction Y. The two third target pins 21a corresponding to the first test capacitor are distributed on one side of the plurality of third type pins 21b, and the two third target pins 21a corresponding to the second test capacitor are distributed on the other side of the plurality of third type pins 21b. Thus, in the event of bonding misalignment or bonding tear between the flexible circuit board 20 and the display panel 00, the first parts to misalign or tear are the two sides of the flexible circuit board 20 in the second direction Y. At this time, the bonding between the third target pins 21a located on both sides and the corresponding second target pins 04a is broken or abnormal. Based on this, the detection component 10 can measure the change in the capacitance signal.

[0093] The display module 00 provided in this application embodiment can have sensing traces for the transmitting and receiving circuits arranged on both outer sides of the flexible circuit board 20 in the second direction Y, without affecting the traces in the inner area of ​​the display panel 00 and the flexible circuit board 20, thus reducing the design complexity of the display panel 00 and the flexible circuit board 20. The detection system composed of the detection component 10 and the test capacitor 20 can not only perform detection during the production assembly process to ensure the integrity of FPC bonding after each process, but also perform detection in the whole machine state. The bonding state can be quickly evaluated without any disassembly, improving the timeliness and accuracy of detection and reducing the cost and inconvenience caused by disassembly detection.

[0094] In one possible implementation, please refer to Figure 17, which is a schematic diagram of the structure of a display module provided in another embodiment of this application. At least two third target pins 21a are arranged along the second direction Y. The test capacitor 22 may include a third test capacitor. The flexible circuit board 20 may also have multiple third type pins 21b. In the second direction Y, the two third target pins 21a connected to the third test capacitor are distributed on both sides of the multiple third type pins 21b.

[0095] In this embodiment, a test capacitor 22 can be provided, and the two third target pins 21a connected to the test capacitor 22 are respectively located on both sides of the third type pin 21b, that is, on both sides of the flexible circuit board 20 in the second direction Y. Thus, in the event of bonding offset or bonding tearing between the flexible circuit board 20 and the display panel 00, the first offset or tear will occur on both sides of the flexible circuit board 20 in the second direction Y. At this time, the third target pins 21a located on both sides will break the bond with the corresponding second target pins 04a. Based on this, the detection component 10 can measure the change in the capacitance signal. Compared to Figures 2, 4, 5 to 8, and 15, which require two test capacitors 22 for detection, the scheme shown in Figure 17 only requires one test capacitor 22 to achieve detection on both sides of the flexible circuit board 20.

[0096] In one possible implementation, referring to Figure 3, the first pin group 03 may further include: a plurality of touch pins 03b; the portion of the display panel 00 within the display area 01 may have a touch electrode layer; the touch electrode layer is electrically connected to the plurality of touch pins 03b.

[0097] Please refer to Figures 3 and 18. Figure 18 is a schematic diagram of the structure of the detection component and the driver chip provided in the embodiment of this application. The detection component 10 may have multiple pairs of first-type touch interfaces 11 and at least one pair of second-type touch interfaces 12. The multiple pairs of first-type touch interfaces 11 are correspondingly connected to multiple touch pins 03b, and the at least one pair of second-type touch interfaces 12 is correspondingly connected to at least two first target pins 03a.

[0098] At least one pair of second-type touch interfaces 12 corresponds to at least one test capacitor 22. For the touch driving interface 12a and touch sensing interface 12b in the pair of second-type touch interfaces 12, and the first capacitor electrode 221 and the second capacitor electrode 222 in the corresponding test capacitor 22, the touch driving interface 12a is used to connect to the first capacitor electrode 221, and the touch sensing interface 12b is used to connect to the second capacitor electrode 222.

[0099] For ease of understanding, different filling methods are used in Figure 3 to distinguish the touch pin 03b and other pins in the first pin group 03. Different filling methods are used in Figure 18 to distinguish the first type of touch interface 11, the second type of touch interface 12, and other interfaces. The same filling method is used in Figures 3 and 18 to illustrate the corresponding electrical connection between the first pin group 03 and the detection component 10, but the above correspondence is not a limitation on the specific implementation of the display module 000 provided in this application embodiment.

[0100] For example, the touch electrode layer may include multiple touch driving electrodes and multiple touch sensing electrodes. Touch pin 03b may correspondingly include multiple touch driving pins and multiple touch sensing pins. These multiple touch driving pins and multiple touch sensing pins are arranged in multiple rows and columns, with touch driving electrodes in the same row connected and touch sensing electrodes in the same column connected. One row of touch driving electrodes is connected to one touch driving pin, and one column of touch sensing electrodes is connected to one touch sensing pin. For a pair of first-type touch interfaces 11, the touch driving interface of the first-type touch interface 11 is connected to one touch driving pin, and the touch sensing interface of the first-type touch interface 11 is connected to one touch sensing pin.

[0101] In other words, the detection component 10 can be implemented using a capacitive touch chip. The touch chip can have multiple touch interfaces. Some touch interfaces (first type touch interface 11) are electrically connected to the touch electrode layer, and the remaining touch interfaces (second type touch interface 12) can be used to electrically connect to the test capacitor 22. In other words, the display module 000 provided in this application embodiment, when the display panel 00 is bound to a touch chip, does not need to add an additional chip to realize the function of the detection component 10. Utilizing the remaining touch interfaces will not affect the normal use of the display device. By setting the test capacitor 22 on the flexible circuit board 20 and adding a second target pin 04a, a third target pin 21a, and corresponding traces to the display panel 00 and the flexible circuit board 20, real-time detection of the bonding state between the flexible circuit board 20 and the display panel 00 can be achieved, greatly improving the timeliness and accuracy of detection and reducing the cost and inconvenience caused by disassembly for testing.

[0102] In one possible implementation, referring to Figures 2 and 18, the first pin group 03 may further include: multiple data drive pins 03c; the portion of the display panel 00 within the display area 01 may also have multiple data signal lines; the multiple data signal lines are correspondingly connected to the multiple data drive pins 03c.

[0103] The display module 000 may further include: a driver chip 30 that is bonded to and connected to the first pin group 03 in the first binding area 02a. The driver chip 30 is connected to multiple data driving pins 03c. The driver chip 30 can drive the display of sub-pixels in the display area 01 through the data driving pins 03c.

[0104] The driver chip 30 may have multiple data driver interfaces 31 and multiple data input interfaces 32. The data input interfaces 32 are electrically connected to the first type pin 03d of the first pin group 03, and then electrically connected to the third type pin 21b through the second type pin 04b, thereby realizing the electrical connection between the driver chip 30 and the control component of the display device through the flexible circuit board 20.

[0105] In one possible implementation, as shown in FIG18, the detection component 10 and the driver chip 30 are integrated into one unit. For example, the display panel 00 may also include a touch chip, which may include the aforementioned detection component 10. The touch chip and the driver chip 30 may be packaged into a TDDI (Touch and Display Driver Integration) chip, and the TDDI chip is bonded and connected within the first bonding area 02a.

[0106] The TDDI chip can accurately detect any minute tears, weak bonding, or misalignment at the bonding point between the display panel 00 and the flexible circuit board 20. Once a significant attenuation of the capacitance signal of the test capacitor 22 is detected, the problem can be quickly identified and reported, providing an accurate basis for subsequent maintenance and repair. This real-time, efficient monitoring method not only improves the overall reliability of the product but also significantly shortens the fault response time, bringing consumers a more reassuring and convenient user experience.

[0107] In one possible implementation, referring to Figure 3, the first pin group 03 may further include a plurality of first-type pins 03d; the second pin group 04 may further include a plurality of second-type pins 04b; the plurality of first-type pins 03d and the plurality of second-type pins 04b are electrically connected accordingly. The detection component 10 may also have a plurality of touch input interfaces 13, the plurality of touch input interfaces 13 being electrically connected to the plurality of first-type pins 03d of the first pin group 03, and the first-type pins 03d being electrically connected to the second-type pins 04b accordingly.

[0108] For example, referring to Figure 3, the portion of the display panel 000 located between the first bonding area 02a and the second bonding area 02b may have multiple second connecting lines L2 (shown as dashed lines in Figure 3 to distinguish them from the first connecting lines L1). One end of each of the multiple second connecting lines L2 may be electrically connected to a corresponding multiple first-type pins 03d, and the other end of each of the multiple second connecting lines L2 may be electrically connected to a corresponding multiple second-type pins 04b. Therefore, each first-type pin 03d and its corresponding second-type pin 04b can be electrically connected via one or more corresponding second connecting lines L2.

[0109] In summary, the display module may include a display panel, a detection component, and a flexible circuit board. The detection component is bonded to a first bonding area of ​​the display panel, and a test capacitor is placed on the flexible circuit board. After the flexible circuit board is bonded to a second bonding area, a third target pin on the flexible circuit board is bonded to a corresponding second target pin on the second bonding area. The detection component is electrically connected to the second target pin on the second bonding area via the first target pin, and then electrically connected to the test capacitor via the second target pin on the second bonding area and the third target pin on the flexible circuit board. In this way, the detection component can measure the capacitance signal of the test capacitor, which can be used to characterize the bonding state between the second target pin and the corresponding third target pin. Based on this, the bonding state between the flexible circuit board and the display panel can be determined according to the capacitance signal.

[0110] Please refer to Figure 19, which is a schematic diagram of the structure of the display device provided in the embodiment of this application. The display device 100 may include: a control component 40 and any of the above-mentioned display modules 000. The control component 40 is electrically connected to the display module 000.

[0111] The control component 40 is configured to: acquire the capacitance signal of the test capacitor 22 through the detection component 10, and determine the bonding state between the second target pin 04a and the corresponding third target pin 21a based on the capacitance signal.

[0112] For example, if the bonding state between the second target pin 04a and the corresponding third target pin 21a is abnormal, the control component 40 can display the abnormal information through the display area 01 to alert the consumer to the abnormal situation, making it easier for the consumer to send the device for inspection and repair; it can also generate a system log, which maintenance personnel can use to query the abnormal situation.

[0113] Furthermore, the display device 000 can display detection controls within the display area 01 of the display panel 00. These detection controls generate detection commands upon user triggering. After receiving the detection command, the control component 40 obtains the capacitance information of all test capacitors 22 through the detection component 10. It then detects and judges the bonding state between the second target pin 04a connected to each test capacitor 22 and the corresponding third target pin 21a, thereby enabling the detection of the bonding state between the flexible circuit board 20 and the display panel 00. This allows for user-initiated self-testing.

[0114] In this embodiment, the display device 100 can be a display screen in a display device such as a mobile phone, tablet computer, laptop computer, monitor, or smart TV. The display device 100 can also have the technical effects of the display module 000 described above, which will not be repeated here.

[0115] It should be noted that the dimensions of layers and regions may be exaggerated in the accompanying drawings for clarity. Furthermore, it is understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element, or there may be intermediate layers. Additionally, it is understood that when an element or layer is referred to as being "below" another element or layer, it can be directly below the other element, or there may be more than one intermediate layer or element. Furthermore, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between the two layers or two elements, or there may be more than one intermediate layer or element. Similar reference numerals throughout indicate similar elements.

[0116] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multiple" refers to two or more unless otherwise expressly defined.

[0117] The above description is merely an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A display module, characterized in that, include: Display panels, testing components, and flexible circuit boards; The display panel has a display area and a non-display area surrounding the display area; The non-display area includes: a first bonding area and a second bonding area arranged in a first direction, wherein the first bonding area is closer to the display area than the second bonding area; a portion of the display panel distributed within the first bonding area has a first pin group, and a portion of the display panel distributed within the second bonding area has a second pin group; at least two first target pins in the first pin group and at least two second target pins in the second pin group are electrically connected; the at least two second target pins are arranged along a second direction; the second direction intersects the first direction; The detection component is bound and connected to the first pin group within the first binding area; The flexible circuit board is bonded to the second pin group in the second bonding area, and the flexible circuit board has: at least two third target pins and at least one test capacitor; the at least two third target pins are correspondingly bonded to the at least two second target pins, each pair of the at least two third target pins corresponds to one test capacitor, and the first capacitor electrode and the second capacitor electrode of one test capacitor are electrically connected to the corresponding two third target pins respectively.

2. The display module according to claim 1, characterized in that, In the same test capacitor, the first capacitor electrode and the second capacitor electrode are disposed in the same layer and are made of the same material.

3. The display module according to claim 2, characterized in that, In the same test capacitor, the arrangement direction of the first capacitor electrode and the second capacitor electrode is parallel to the first direction, or the arrangement direction of the first capacitor electrode and the second capacitor electrode is parallel to the second direction.

4. The display module according to claim 2, characterized in that, In the same test capacitor, the first capacitor electrode has a cutout area, and the orthographic projection of the second capacitor electrode on the substrate of the flexible circuit board is located within the orthographic projection of the cutout area on the substrate of the flexible circuit board.

5. The display module according to claim 4, characterized in that, The first capacitor electrode is a square ring electrode, and the second capacitor electrode is a square electrode; Alternatively, the first capacitor electrode is a rectangular ring electrode, and the second capacitor electrode is a rectangular electrode; Alternatively, the first capacitor electrode is a circular ring electrode, and the second capacitor electrode is a circular electrode; Alternatively, the first capacitor electrode may be an elliptical ring electrode, and the second capacitor electrode may be an elliptical electrode.

6. The display module according to claim 5, characterized in that, When the second capacitor electrode is a rectangular or elliptical electrode, the angle between the length direction of the second capacitor electrode and the second direction is greater than or equal to 0° and less than or equal to 180°.

7. The display module according to claim 1, characterized in that, In the same test capacitor, the first capacitor electrode and the second capacitor electrode are disposed in different layers; Wherein, the orthographic projection of the first capacitor electrode on the substrate of the flexible circuit board overlaps with the orthographic projection of the second capacitor electrode on the substrate of the flexible circuit board.

8. The display module according to claim 3 or 7, characterized in that, Both the first capacitor electrode and the second capacitor electrode are square, rectangular, circular, or elliptical electrodes.

9. The display module according to any one of claims 1-7, characterized in that, The two third target pins corresponding to the same test capacitor are arranged adjacent to each other in the second direction.

10. The display module according to claim 9, characterized in that, When there are multiple test capacitors, the multiple test capacitors include a first test capacitor and a second test capacitor; The flexible circuit board also has a plurality of third type pins; in the second direction, the two third target pins corresponding to the first test capacitor are distributed on one side of the plurality of third type pins, and the two third target pins corresponding to the second test capacitor are distributed on the other side of the plurality of third type pins; The second pin group further includes: a plurality of second type pins, wherein the plurality of second type pins are bonded to the plurality of third type pins.

11. The display module according to any one of claims 1-7 and 10, characterized in that, The first pin group further includes: a plurality of touch pins; the display panel has a touch electrode layer in a portion within the display area; the touch electrode layer is electrically connected to the plurality of touch pins; The detection component has multiple pairs of first-type touch interfaces and at least one pair of second-type touch interfaces; the multiple pairs of first-type touch interfaces are correspondingly connected to the multiple touch pins, and the at least one pair of second-type touch interfaces is correspondingly connected to the at least two first target pins; Wherein, the at least one pair of second-type touch interfaces corresponds to at least one test capacitor; for the touch driving interface and touch sensing interface in the pair of second-type touch interfaces, and the first capacitor electrode and the second capacitor electrode in the corresponding test capacitor, the touch driving interface is used to connect to the first capacitor electrode, and the touch sensing interface is used to connect to the second capacitor electrode.

12. The display module according to claim 11, characterized in that, The first pin group further includes: a plurality of data driving pins; the portion of the display panel within the display area also has a plurality of data signal lines; the plurality of data signal lines are connected to the plurality of data driving pins accordingly; The display module further includes a driver chip that is bonded to and connected to the first pin group within the first bonding area, and the driver chip is connected to the plurality of data driving pins.

13. The display module according to claim 12, characterized in that, The detection component and the driving chip are integrated into one unit.

14. The display module according to claim 13, characterized in that, The first pin group further includes: a plurality of first-type pins; the second pin group further includes: a plurality of second-type pins; the plurality of first-type pins and the plurality of second-type pins are electrically connected accordingly.

15. A display device, characterized in that, include: The control component and the display module according to any one of claims 1-14, wherein the control component is electrically connected to the display module.

Images