Display panel and display module

Abstract

Disclosed in the present application are a display panel and a display module. The display panel comprises a flexible substrate, a pixel driving circuit, a light-emitting device, a bridge trace and an organic protective layer, wherein the bridge trace is electrically connected to the pixel driving circuit and at least partially located in a bending region; and the thickness of the part of the flexible substrate in a display region is greater than that of the part of the flexible substrate in the bending region, and the thickness of the organic protective layer is less than the thickness of the flexible substrate in the display region. In the present application, the thickness of the part of the flexible substrate in the bending region is set to be less than that of the part of the flexible substrate in the display region, and the thickness of the organic protective layer is set to be less than the thickness of the part of the flexible substrate in the display region, such that the thicknesses of film layers distributed on two sides of the bridge trace distributed in the bending region have a small difference or are equal, and in the process of bending the display panel, the compressive stress or tensile stress borne by the bridge trace located in the bending region is reduced, thereby further reducing the bending radius and improving the screen-to-body ratio of the display module.

Description

Display panel and display module

[0001] This application claims priority to Chinese Patent Application No. 202510056510.9, filed on January 14, 2025, entitled “Display Panel and Display Module”, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of display device technology, and in particular to a display panel and a display module. Background Technology

[0003] AMOLED (Active-matrix organic light-emitting diode) displays have attracted much attention due to their advantages such as vibrant colors, wide viewing angles, high contrast, fast response times, and low power consumption. AMOLED displays have even broader application prospects in the future display field, with significant potential in mobile displays, automotive displays, medical displays, and many other areas.

[0004] Currently, the development of full-screen displays has been rapid in recent years, which has placed new demands on the form factor of display screens. For full-screen displays, reducing the bezels is crucial. Typically, a display module (i.e., the display screen) can include a display panel and a driver chip bonded to the display panel. To increase the screen-to-body ratio of the display module, the portion of the display panel containing the driver chip needs to be bent, placing the driver chip at the back of the display module.

[0005] However, the bending radius of the part of the display panel that is currently bent to bind the driver chip is relatively large, resulting in a relatively large bezel width of the display module, which in turn affects the screen ratio of the display module. Summary of the Invention

[0006] This application provides a display panel and a display module. It solves the problem that the bending radius of existing display panels is not small enough. The technical solution is as follows:

[0007] On one hand, a display panel is provided, the display panel having a display area and a non-display area located around the display area, the non-display area including a bending area; the display panel includes: a flexible substrate, a pixel driving circuit, a light-emitting device, a bridging trace and an organic protective layer;

[0008] The pixel driving circuit is located on one side of the flexible substrate and is distributed within the display area;

[0009] The light-emitting device is located on the side of the pixel driving circuit away from the flexible substrate and is electrically connected to the pixel driving circuit.

[0010] The bridging trace is electrically connected to the pixel driving circuit, and at least a portion of the bridging trace is located within the bending area;

[0011] The organic protective layer is located on the side of the bridging trace away from the flexible substrate, and at least a portion of the organic protective layer is located within the bending region;

[0012] Wherein, the thickness of the portion of the flexible substrate within the display area is greater than the thickness of the portion of the flexible substrate within the bending area, and the thickness of the organic protective layer is less than the thickness of the flexible substrate within the display area.

[0013] Optionally, within the bending region, the distance between the side of the bridging trace away from the flexible substrate and the side of the organic protective layer away from the flexible substrate is equal to the distance between the side of the bridging trace facing the flexible substrate and the side of the flexible substrate away from the bridging trace.

[0014] Optionally, the flexible substrate includes: a first substrate layer and a second substrate layer stacked together, wherein the second substrate layer is closer to the pixel driving circuit than the first substrate layer;

[0015] In this configuration, a portion of the first substrate layer is located within the display area, and another portion is located within the non-display area; the second substrate layer is at least distributed within the display area, and the orthographic projection of the second substrate layer onto the first substrate layer does not coincide with the orthographic projection of the bending area onto the first substrate layer.

[0016] Optionally, the second substrate layer has a first through-groove, the orthographic projection of the first through-groove onto the first substrate layer covering the orthographic projection of the bending region onto the first substrate layer.

[0017] Optionally, the groove surface of the first through groove near the display area is the first groove surface;

[0018] The display panel further includes: an organic filling portion, which is located at least within the first through groove and at least covers the surface of the first groove;

[0019] Specifically, in a direction parallel to the display panel and perpendicular to the bending axis of the bending area, there is a portion of the bridging trace located on the side of the organic filling portion away from the first groove surface.

[0020] Optionally, within the first through-groove, at least a portion of the bridging traces is located on the side of the organic filler portion opposite to the first substrate layer.

[0021] Optionally, within the first through-groove, the orthographic projection of the bridging trace on the first substrate layer lies within the orthographic projection of the organic filler portion on the first substrate layer;

[0022] Alternatively, within the first through-groove, a portion of the orthographic projection of the bridging trace onto the first substrate layer lies within the orthographic projection of the organic filler portion onto the first substrate layer, while another portion lies outside the orthographic projection of the organic filler portion onto the first substrate layer.

[0023] Optionally, the display panel further includes: a plurality of inorganic insulating layers stacked together, the plurality of inorganic insulating layers being located between the flexible substrate and the light-emitting device;

[0024] The plurality of inorganic insulating layers have a second through groove communicating with the first through groove, and the orthographic projection of the second through groove on the first substrate layer covers the orthographic projection of the bending area on the first substrate layer; the groove surface of the second through groove near the display area is the second groove surface;

[0025] The organic filling portion includes a part located outside the first through groove, and the part of the organic filling portion located outside the first through groove is in contact with the second groove surface.

[0026] Optionally, the non-display area further includes a bonding area, which is located on the side of the bending area opposite to the display area; the second substrate layer is also distributed within the bonding area;

[0027] The groove surface of the first through groove near the binding area is the third groove surface; the organic filling part also covers the third groove surface;

[0028] Specifically, in the direction parallel to the display panel and perpendicular to the bending axis of the bending area, there is a portion of the bridging trace located on the side of the organic filling portion away from the third groove surface.

[0029] Optionally, the display panel further includes: a first conductive layer, a first planarization layer, and a second conductive layer stacked together, wherein the first conductive layer is closer to the flexible substrate than the second conductive layer;

[0030] The second conductive layer includes the bridging trace, and the portion of the first flat layer located within the bending area is the organic filler portion.

[0031] Optionally, the display panel further includes: a first conductive layer, the first conductive layer including the bridging trace;

[0032] The orthographic projection of the organic filler portion onto the first substrate layer is located outside the display area.

[0033] Optionally, it also includes: a multilayer organic insulating layer located on the side of the pixel driving circuit away from the flexible substrate, wherein at least one of the organic insulating layers located within the bending region is the organic protective layer.

[0034] Optionally, the at least one organic insulating layer includes: an organic planarization layer, a pixel definition layer, a support layer, and a touch organic protective layer stacked together;

[0035] The organic protective layer includes at least one of the organic planarization layer, the pixel definition layer, the support layer, and the touch organic protective layer.

[0036] Optionally, the flexible substrate further includes a barrier layer; the barrier layer is located between the first substrate layer and the second substrate layer, and covers the side of the first substrate layer facing the second substrate layer.

[0037] On the other hand, a display module is provided, including: any of the display panels described above, and a driver chip bonded and connected to the display panel.

[0038] The beneficial effects of the technical solutions provided in this application are:

[0039] By setting the thickness of the flexible substrate in the bending area to be less than that in the display area, and setting the thickness of the organic protective layer to be less than that in the display area, the thickness difference of the film layers distributed on both sides of the bridging traces in the bending area is small or equal. This reduces the compressive or tensile stress received by the bridging traces in the bending area during the bending of the display panel, thereby further reducing the bending radius and increasing the screen-to-body ratio of the display module. Attached Figure Description

[0040] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0041] Figure 1 is a schematic diagram of a display panel structure;

[0042] Figure 2 is a schematic diagram of the membrane structure at point A-A' in Figure 1;

[0043] Figure 3 is a schematic diagram of the structure of a display panel provided in an embodiment of this application;

[0044] Figure 4 is a schematic diagram of the film structure of the display panel at B-B' shown in Figure 3;

[0045] Figure 5 is a schematic diagram of the structure of the flexible substrate and inorganic insulating layer provided in the embodiment of this application;

[0046] Figure 6 is a schematic diagram of another film layer structure of the display panel shown in Figure 3 at B-B';

[0047] Figure 7 is a schematic diagram of another film layer structure of the display panel shown in Figure 3 at B-B';

[0048] Figure 8 is a schematic diagram of another film layer structure of the display panel shown in Figure 3 at B-B';

[0049] Figure 9 is a schematic diagram of the film structure of the display panel at C-C' shown in Figure 3;

[0050] Figure 10 is a schematic diagram of a film structure of another embodiment of the display panel shown in Figure 3 at B-B';

[0051] Figure 11 is a schematic diagram of another film structure of another embodiment of the display panel shown in Figure 3 at B-B';

[0052] Figure 12 is a schematic diagram of the film structure of the display panel at point D-D' shown in Figure 3;

[0053] Figure 13 is a flowchart illustrating the manufacturing method of the display panel provided in an embodiment of this application;

[0054] Figure 14 is a schematic diagram of the structure of a display module provided in an embodiment of this application. Detailed Implementation

[0055] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0056] Please refer to Figures 1 and 2. Figure 1 is a schematic diagram of the structure of a display panel, and Figure 2 is a schematic diagram of the film layer structure at A-A' in Figure 1. As shown in Figure 1, the display panel 00 has a display area 01 and a non-display area located around the display area 01. The non-display area includes a bending area 02 and a bonding area 03 located on the side of the bending area 02 away from the display area 01. The bonding area 03 can be used to bond with a driver chip.

[0057] As shown in Figure 2, the current display panel 00 may include: a flexible substrate 10, and a pixel driving circuit 30 and a light-emitting device 40 located on the flexible substrate 10. A bridging trace 20 is provided in the bending area 02, which can realize the electrical connection between the bonding area 03 and the display area 01.

[0058] To improve the lifespan of the display panel 00, the flexible substrate 10 is generally a multilayer substrate structure. For example, as shown in Figure 2, the flexible substrate 10 may include at least two organic substrate layers (such as organic substrate layer 11 and organic substrate layer 12) and at least one barrier layer 13. The barrier layer 13 may be located between two adjacent organic substrate layers to achieve the barrier against moisture. As shown in Figure 2, the top of the bridging trace 20 is generally covered with an organic protective layer 50. The organic protective layer 50 may be an organic insulating layer such as a planarization layer. It can be seen that the film structure in the bending region 02 may include organic substrate layer 11, barrier layer 13, organic substrate layer 12, part of inorganic layer 31, bridging trace 20, and organic protective layer 50. It can be seen that the film thickness of the bridging trace 20 on the side away from the flexible substrate 10 is thinner, and the film thickness on the side facing the flexible substrate 10 is thicker. When bending the bending area 02, the bridging trace 20 is subjected to greater stress due to the difference in film thickness on the upper and lower sides, which makes it impossible to further reduce the bending radius.

[0059] Please refer to Figures 3 and 4. Figure 3 is a schematic diagram of the structure of a display panel provided in an embodiment of this application, and Figure 4 is a schematic diagram of the film layer structure of the display panel shown in Figure 3 at B-B'. The display panel 000 has a display area 001 and a non-display area located around the display area 001. The non-display area may include a bending area 002.

[0060] As shown in Figure 4, the display panel 000 may include: a flexible substrate 100, a pixel driving circuit 200, a light-emitting device 300, a bridging trace 401, and an organic protective layer 500.

[0061] The pixel driving circuit 200 is located on one side of the flexible substrate 100 and is distributed within the display area 001. There can be multiple pixel driving circuits 200, which are arranged in an array within the display area 001.

[0062] The light-emitting device 300 is located on the side of the pixel driving circuit 200 opposite to the flexible substrate 100 and is electrically connected to the pixel driving circuit 200. For example, there can be multiple light-emitting devices 300, each electrically connected to one of the multiple pixel driving circuits 200. For instance, the light-emitting device 300 may include an anode, a light-emitting layer, and a cathode, and the anode of the light-emitting device 300 may be electrically connected to the pixel driving circuit 200.

[0063] The bridging trace 401 is electrically connected to the pixel driving circuit 200, and at least a portion of the bridging trace 401 is located within the bending region 002. Furthermore, the bridging trace 401 may also be distributed within the bonding region 003.

[0064] The organic protective layer 500 is located on the side of the bridging trace 401 away from the flexible substrate 100, and at least a portion of the organic protective layer 500 is located within the bending region 002. The organic protective layer 500 may include one or more organic insulating layers.

[0065] Among them, the thickness h1 of the portion of the flexible substrate 100 in the display area 001 is greater than the thickness h2 of the portion of the flexible substrate 100 in the bending area 002, and the thickness h3 of the organic protective layer 500 is less than the thickness h1 of the flexible substrate 100 in the display area 001.

[0066] In summary, the display panel provided in this application includes: a flexible substrate, a pixel driving circuit, a light-emitting device, bridging traces, and an organic protective layer. By setting the thickness of the flexible substrate in the bending region to be less than the thickness of the flexible substrate in the display region, and setting the thickness of the organic protective layer to be less than the thickness of the flexible substrate in the display region, the thickness difference of the film layers distributed on both sides of the bridging traces distributed in the bending region is small or equal. This reduces the compressive or tensile stress received by the bridging traces in the bending region during the bending process of the display panel, thereby further reducing the bending radius and increasing the screen-to-body ratio of the display module.

[0067] It should be noted that the embodiments of this application do not limit the materials of each structural layer of the display panel 000, and existing materials that can be used in display panels can be referred to. The specific formation process of the structural layers, such as etching, deposition, or exposure and development, can refer to existing processes, and this application does not limit them.

[0068] In some feasible implementations, within the bending region 002, the distance between the side of the bridging trace 401 facing away from the flexible substrate 100 and the side of the organic protective layer 500 facing away from the flexible substrate 100 is equal to the distance between the side of the bridging trace 401 facing the flexible substrate 100 and the side of the flexible substrate 100 facing away from the bridging trace 401. That is, the thickness h2 of the portion of the flexible substrate 100 within the bending region 002 is equal to the thickness h3 of the organic protective layer 500.

[0069] When the thickness of the film layers on both sides of the bridging trace 401 facing the flexible substrate 100 and away from the flexible substrate 100 is the same, the stress on the bridging trace 401 during the bending process of the bending area 002 is minimal, and it can be bent to the maximum extent, which greatly improves the screen ratio of the display module.

[0070] Please refer to Figure 5, which is a schematic diagram of the structure of the flexible substrate and inorganic insulating layer provided in an embodiment of this application. In some possible implementations, the flexible substrate 100 may include a first substrate layer 101 and a second substrate layer 102 stacked together, wherein the second substrate layer 102 is closer to the pixel driving circuit 200 than the first substrate layer 101.

[0071] In this configuration, a portion of the first substrate layer 101 is located within the display area 001, and another portion is located within the non-display area. The second substrate layer 102 is at least distributed within the display area 001, and the orthographic projection of the second substrate layer 102 onto the first substrate layer 101 does not coincide with the orthographic projection of the bending area 002 onto the first substrate layer 101. That is, the second substrate layer 102 is not distributed within the bending area 002 of the display panel 000.

[0072] The flexible substrate 100 may further include a barrier layer 103; the barrier layer 103 is located between the first substrate layer 101 and the second substrate layer 102, and covers the side of the first substrate layer 101 facing the second substrate layer 102. That is, the barrier layer 103 can be distributed in both the display area 001 and the non-display area.

[0073] For example, both the first substrate layer 101 and the second substrate layer 102 can be PI layers, and the barrier layer 103 can be an inorganic insulating layer, such as a silicon oxide layer or a silicon nitride layer. In this embodiment, since the flexible substrate 100 includes a multilayer substrate structure stacked together, only the second substrate layer 102 in the flexible substrate 100 can be patterned to remove the portion of the second substrate layer 102 located within the bending region 002; without patterning the first substrate layer 101 and the barrier layer 103 in the flexible substrate 100. This ensures that the thickness of the portion of the flexible substrate 100 located within the bending region 002 is less than the thickness of the portion located within the display region 001.

[0074] Please refer to Figure 6, which is a schematic diagram of another film layer structure of the display panel shown in Figure 3 at point B-B'. As shown in Figures 5 and 6, the second substrate layer 102 has a first through-groove 104, and the orthogonal projection of the first through-groove 104 onto the first substrate layer 101 covers the orthogonal projection of the bending region 002 onto the first substrate layer 101. In this way, by providing the first through-groove 104 on the second substrate layer 102, it can be ensured that the second substrate layer 102 is not distributed within the bending region 002.

[0075] In some possible implementations, as shown in Figure 6, the groove surface of the first through groove 104 near the display area 001 is the first groove surface 104a; the display panel 000 may also include: an organic filling portion 601, the organic filling portion 601 being located at least within the first through groove 104 and at least covering the first groove surface 104a.

[0076] Among them, in the direction parallel to the display panel 000 and perpendicular to the bending axis of the bending area 002, there is a portion of the bridging trace 401 located on the side of the organic filling portion 601 away from the first groove surface 104a.

[0077] Generally, after patterning an organic substrate, the resulting surface exhibits unevenness and uniformity. This leads to surface uniformity issues on the first groove surface 104a of the first through-groove 104, which is detrimental to the flatness requirements of the bridging trace 401. Therefore, in this embodiment, an organic filler portion 601 is used to cover the first groove surface 104a. Utilizing the smooth and flat surface properties of organic materials, a flat surface is formed on the first groove surface 104a, ensuring that the flatness of the bridging trace 401 meets the requirements. The organic filler portion 601 can be made of the same material as the organic planarization layer.

[0078] In some possible implementations, as shown in FIG6, at least a portion of the bridging traces 401 are located on the side of the organic filler 601 facing away from the first substrate 101 within the first through-groove 104. That is, the organic filler 601 not only covers the first groove surface 104a but also partially covers the first substrate 101.

[0079] As shown in Figure 5, the display panel 000 also includes multiple inorganic insulating layers 201 on the flexible substrate 100. For ease of description, the multiple inorganic insulating layers are drawn as a whole in Figure 5, but in reality, they may include multiple inorganic insulating layers of the same or different materials. When patterning the flexible substrate 100, organic and inorganic materials are patterned at different rates. For example, when using dry etching for patterning, organic materials are patterned at a higher rate than inorganic materials. Furthermore, for the same material, the patterning rates in the transverse and longitudinal directions may also differ. Based on this, as shown in Figures 5 and 6, when the flexible substrate 100 in this embodiment is patterned, the first groove surface 104a of the second substrate layer 102 will be concave inwards. That is, the first groove surface 104a is a concave surface. If this concave area is not processed and the jumper traces 401 are directly deposited, it is difficult to deposit high-quality jumper traces 401 on the first groove surface 104a, and line breaks will occur in the concave area.

[0080] In order to ensure that the organic filling portion 601 can fully cover the first groove surface 104a, a portion of the organic filling portion 601 is also formed on the flexible substrate 100. The side of the organic filling portion 601 facing away from the first groove surface 104a can have a good slope, which can provide a good deposition plane for the bridging trace 401, thereby improving the problem of line breakage that may occur in the concave region for subsequent deposition of the bridging trace 401.

[0081] Please refer to Figures 7 and 8. Figure 7 is a schematic diagram of another film layer structure of the display panel at B-B' shown in Figure 3, and Figure 8 is a schematic diagram of yet another film layer structure of the display panel at B-B' shown in Figure 3. In other possible implementations, the patterning process of the organic substrate is generally dry etching. The surface formed by dry etching has unevenness and uniformity problems. Thus, the surface of the flexible substrate 100 facing the bridging trace 401 in the bending region 002 will also have uniformity problems, which is not conducive to the flatness requirements of the bridging trace 401. Therefore, in this embodiment, by using an organic filling portion 601 to cover the surface of the flexible substrate 100 in the bending region 002, the smooth and flat surface characteristics of the organic material are utilized to form a flat surface on the flexible substrate 100, so that the flatness of the bridging trace 401 meets the requirements.

[0082] In this embodiment of the application, as shown in FIG7, in the first through groove 104, a portion of the orthographic projection of the bridging trace 401 on the first substrate 101 is located within the orthographic projection of the organic filler portion 601 on the first substrate 101, and the other portion is located outside the orthographic projection of the organic filler portion 601 on the first substrate 101.

[0083] As shown in Figure 8, within the first through groove 104, the orthogonal projection of the bridging trace 401 on the first substrate 101 lies within the orthogonal projection of the organic filler portion 601 on the first substrate 101.

[0084] In other words, within the bending region 002, organic filler portions 601 are provided on the side of the bridging trace 401 facing the flexible substrate 100. The organic filler portions 601 can provide a flat surface, making the surface of the portion of the bridging trace 401 within the bending region 002 smoother. The organic filler portions 601 can be formed in the required areas according to the flatness requirements of the bridging trace 401.

[0085] In some possible implementations, as shown in Figures 5 and 6, the display panel 000 may further include: a plurality of inorganic insulating layers 201 stacked together, the plurality of inorganic insulating layers 201 being located between the flexible substrate 100 and the light-emitting device 300.

[0086] Multiple inorganic insulating layers 201 have a second through groove 202 that communicates with the first through groove 104. The orthographic projection of the second through groove 202 on the first substrate 101 covers the orthographic projection of the bending area 002 on the first substrate 101. The groove surface of the second through groove 202 near the display area 001 is the second groove surface 202a.

[0087] The organic filling part 601 has a portion located outside the first through groove 104, and the portion of the organic filling part 601 located outside the first through groove 104 is in contact with the second groove surface 202a.

[0088] As shown in Figures 6 to 8, after patterning, the interface between the first groove surface 104a and the second groove surface 202a may have an uneven transition. If the organic protective layer 500 only covers the first groove surface 104a, the transition between the organic protective layer 500 on the first groove surface 104a and the second groove surface 202a is not smooth enough, and the bridging trace 401 may also experience a break at this interface. Therefore, by having the organic protective layer 500 also contact the second groove surface 202a, that is, by having the organic protective layer 500 cover the interface between the first groove surface 104a and the second groove surface 202a, the potential breakage problem of the bridging trace 401 at this interface can be improved.

[0089] Please refer to Figure 9, which is a schematic diagram of the film layer structure of the display panel at C-C' shown in Figure 3. As shown in Figures 3 and 9, in this embodiment, the non-display area of ​​the display panel 000 may further include a fan-out area 004 located between the bending area 002 and the display area 001, and a bonding area 003 located on the side of the bending area 002 away from the display area 001. The bonding area 003 can be used to bond with the driver chip.

[0090] As shown in Figure 9, fan-out leads 402 are distributed in the fan-out area 004, and bridging traces 401 are electrically connected to the pixel driving circuit 200 through the fan-out leads 402; bonding pads 403 are also distributed in the bonding area 003, and the pins of the driving chip can be soldered to the bonding pads 403, and bridging traces 401 are electrically connected to the driving chip through the bonding pads 403.

[0091] The bonding area 003 is located on the side of the bending area 002 that is away from the display area 001; the second substrate layer 102 is also distributed within the bonding area 003.

[0092] The groove surface of the first through groove 104 near the binding area 003 is the third groove surface 104b; the organic filling part 601 also covers the third groove surface 104b.

[0093] Among them, in the direction parallel to the display panel 000 and perpendicular to the bending axis of the bending area 002, there is a portion of the bridging trace 401 located on the side of the organic filling part 601 away from the third groove surface 104b.

[0094] The third groove surface 104b of the first through groove 104 also suffers from the concavity problem of the first groove surface 104a of the first through groove 104. Therefore, the bridging trace 401 will also have problems with wire breakage and flatness at the third groove surface 104b. Therefore, the organic filling part 601 is used to cover the third groove surface 104b to improve the above-mentioned problems of wire breakage and flatness.

[0095] Similarly, the groove surface of the second through groove 202 near the binding area 003 is the fourth groove surface 202b, wherein there is a portion of the organic filling part 601 located outside the first through groove 104, and the portion of the organic filling part 601 located outside the first through groove 104 contacts the fourth groove surface 202b of the second through groove 202.

[0096] The connection interface between the third groove surface 104b of the first through groove 104 and the fourth groove surface 202b of the second through groove 202 will also have a problem similar to that between the first groove surface 104a of the first through groove 104 and the second groove surface 202a of the second through groove 202. Therefore, the organic filling part 601 also covers the connection interface between the third groove surface 104b and the fourth groove surface 202b to improve the wire breakage problem of the bridging trace 401 at this interface.

[0097] Please refer to Figure 10, which is a schematic diagram of a film structure of another embodiment of the display panel shown in Figure 3 at B-B'. In some possible implementations, the display panel 000 provided in this application embodiment may further include: a first conductive layer 700, a first planarization layer 600, and a second conductive layer 400 stacked together, wherein the first conductive layer 700 is closer to the flexible substrate 100 than the second conductive layer 400.

[0098] The second conductive layer 400 may include a bridging trace 401, and the portion of the first planarization layer 600 located within the bending region 002 is an organic filler portion 601.

[0099] The bridging trace 401 can be formed by patterning the second conductive layer 400. Therefore, based on the existing manufacturing process, there is no need to perform additional deposition and patterning on the bridging trace 401, and no additional photolithography process is required.

[0100] Based on the display panel 000 shown in FIG10, the organic filling portion 601 can also be the technical solution shown in FIG7 to FIG9. The organic filling portion 601 can partially or completely cover the second groove surface 202a and the fourth groove surface 202b of the inorganic insulating layer 201. In the bending area 002, the organic filling portion 601 can also be partially located on the side of the bridging trace 401 facing the flexible substrate 100, or the bridging trace 401 facing the flexible substrate 100 can both have the organic filling portion 601.

[0101] Please refer to Figure 11, which is a schematic diagram of another film layer structure of the display panel shown in Figure 3 at B-B'. In some possible implementations, the display panel 000 provided in this application embodiment may further include: a first conductive layer 700, which may include a bridging trace 401. The organic filler portion 601 has its orthographic projection on the first substrate layer 101 located outside the display area 001.

[0102] The bridging trace 401 can be formed by patterning the first conductive layer 700. Therefore, based on the existing manufacturing process, there is no need to perform additional deposition and patterning on the bridging trace 401, and no need to add photolithography process.

[0103] Based on the display panel 000 shown in FIG11, the organic filling portion 601 can also be the technical solution shown in FIG6 to FIG9. The organic filling portion 601 can partially or completely cover the second groove surface 202a and the fourth groove surface 202b of the inorganic insulating layer 201. In the bending area 002, the organic filling portion 601 can also be partially located on the side of the bridging trace 401 facing the flexible substrate 100, or the bridging trace 401 facing the flexible substrate 100 can both have the organic filling portion 601.

[0104] In the embodiments of this application, as shown in Figures 10 and 11, the display panel 000 may further include: a multilayer organic insulating layer located on the side of the pixel driving circuit 200 away from the flexible substrate 100, wherein at least one organic insulating layer is an organic protective layer 500 located within the bending region 002.

[0105] For example, at least one organic insulating layer may include: an organic planarization layer 800, a pixel definition layer, a support layer, and a touch organic protective layer 900 stacked together.

[0106] The organic protective layer 500 may include at least one of an organic planarization layer 800, a pixel definition layer, a support layer, and a touch organic protective layer 900.

[0107] For example, in Figures 10 and 11, the organic insulating layer includes a stacked organic planarization layer 800 and a touch organic protective layer 900. Since the display panel fabrication process after completing the pixel driving circuit 200 involves layer structures of various organic insulating materials, these layer structures can be used to simultaneously form the organic protective layer 500. For instance, in the processes of fabricating the light-emitting device 300, fabricating the encapsulation layer on the side of the light-emitting device 300 facing away from the flexible substrate 100, and fabricating the touch layer on the side of the encapsulation layer facing away from the flexible substrate 100, at least the processing of the organic planarization layer 800, the pixel definition layer, the support layer, and the touch organic protective layer 900 are involved. The organic protective layer 500 can be formed simultaneously on the bending region 002 during the processing of the aforementioned organic insulating layer. Therefore, the organic protective layer 500 does not require additional photolithography or etching, and does not add any additional process steps.

[0108] It should be noted that, based on the thickness difference between the portion of the flexible substrate 100 in the display area 001 and the portion of the flexible substrate 100 in the bending area 002, one or more of the aforementioned organic insulating layers can be selectively used to form the organic protective layer 500, so that the thickness h3 of the organic protective layer 500 is as equal as possible to the thickness h2 of the portion of the flexible substrate 100 in the bending area 002.

[0109] Please refer to Figure 12, which is a schematic diagram of the film structure of the display panel at point D-D' shown in Figure 3. In this embodiment, the display panel may include: a flexible substrate 100, and an active layer 203, a first gate insulating layer 204, a third conductive layer (co-layered with the first electrode 206 and the gate layer 205 and made of the same material), a second gate insulating layer 207, a fourth conductive layer (co-layered with the second electrode 208 and made of the same material), an interlayer dielectric layer 210, a first conductive layer 700, a first planarization layer 600, a second conductive layer 400, an organic planarization layer 800, an anode layer 301, a pixel definition layer 304, a light-emitting layer 302, a support layer 305, a cathode layer 303, an encapsulation layer 902, a touch electrode layer 901, and an organic touch protection layer 900, all stacked on one side of the flexible substrate 100.

[0110] The active layer 203, gate layer 205, third conductive layer, first conductive layer 700, and second conductive layer 400 are used to form multiple pixel driving circuits 200 electrically connected to the light-emitting device 300, as well as various signal lines electrically connected to the pixel driving circuits 200. The light-emitting device 300 includes an anode layer 301, a light-emitting layer 302, and a cathode layer 303 stacked together. The pixel driving circuits 200 can be electrically connected to the anode layer 301 in the light-emitting device 300.

[0111] A pixel driving circuit 200 may include at least two transistors and a storage capacitor. A first conductive layer 700 may include the source and drain of the transistors. A third conductive layer may include the gate layer 205 of the transistors and the first electrode 206 of the storage capacitor. A fourth conductive layer may include the second electrode 208 of the storage capacitor.

[0112] In this application, the multilayer inorganic insulating layer 201 in the above embodiments may include at least the first gate insulating layer 204, the second gate insulating layer 207, and the interlayer dielectric layer 210.

[0113] Please refer to Figure 13, which is a schematic diagram comparing the manufacturing process of the display panel provided in this application embodiment with that of an existing display panel. As shown in Figure 13, this application embodiment also provides a method for manufacturing a display panel, which may include the following steps:

[0114] Step S101: Provide a flexible substrate and form a pixel driving circuit on the flexible substrate.

[0115] Step S102: Pattern the multilayer inorganic insulating layer and flexible substrate in the bending area.

[0116] Step S103: A second conductive layer is formed on the side of the pixel driving circuit away from the flexible substrate, and the second conductive layer is patterned to obtain the bridging trace.

[0117] Step S104: Form a light-emitting device on the side of the pixel driving circuit away from the flexible substrate.

[0118] Compared with the display module 00 shown in Figure 2, the display module 000 provided in this embodiment only requires patterning the flexible substrate 100 before forming the bridging trace 401, reducing the thickness of the flexible substrate 100 in the bending region 002, and then fabricating the bridging trace 401. This only adds one etching of the flexible substrate 100 in the bending region 002. A mask for patterning the inorganic insulating layer can be used, without the need for additional masks and photolithography processes. Other fabrication processes can be the same as those of existing display modules, without adding any additional patterning processes.

[0119] In summary, the display panel provided in this application includes: a flexible substrate, a pixel driving circuit, a light-emitting device, bridging traces, and an organic protective layer. By setting the thickness of the flexible substrate in the bending region to be less than the thickness of the flexible substrate in the display region, and setting the thickness of the organic protective layer to be less than the thickness of the flexible substrate in the display region, the thickness difference of the film layers distributed on both sides of the bridging traces distributed in the bending region is small or equal. This reduces the compressive or tensile stress received by the bridging traces in the bending region during the bending process of the display panel, thereby further reducing the bending radius and increasing the screen-to-body ratio of the display module.

[0120] Please refer to Figure 14, which is a schematic diagram of the structure of a display module provided in an embodiment of this application. In this embodiment, the display module may include: the display panel 000 described in any of the above embodiments, and the driver chip 010 that is bound and connected to the display panel 000.

[0121] For example, the driver chip 010 can be fixed in the bonding area 003. The display module can have the technical effects of the display panel 000 described in any of the above embodiments, and will not be repeated here.

[0122] This application also provides a display device, which includes the aforementioned display module. The display device can be a display screen in a display device such as a mobile phone, tablet computer, laptop computer, or monitor. The display device can have the technical effects of the aforementioned display module, which will not be described again here.

[0123] It should be noted that the dimensions of layers and regions may be exaggerated in the accompanying drawings for clarity. Furthermore, it is understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element, or there may be intermediate layers. Additionally, it is understood that when an element or layer is referred to as being "below" another element or layer, it can be directly below the other element, or there may be more than one intermediate layer or element. Furthermore, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between the two layers or two elements, or there may be more than one intermediate layer or element. Similar reference numerals throughout indicate similar elements.

[0124] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multiple" refers to two or more unless otherwise expressly defined.

[0125] The above description is merely an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A display panel, characterized in that, The display panel has a display area and a non-display area located around the display area, the non-display area including a bending area; the display panel includes: a flexible substrate, a pixel driving circuit, a light-emitting device, a bridging trace and an organic protective layer; The pixel driving circuit is located on one side of the flexible substrate and is distributed within the display area; The light-emitting device is located on the side of the pixel driving circuit away from the flexible substrate and is electrically connected to the pixel driving circuit. The bridging trace is electrically connected to the pixel driving circuit, and at least a portion of the bridging trace is located within the bending area; The organic protective layer is located on the side of the bridging trace away from the flexible substrate, and at least a portion of the organic protective layer is located within the bending region; Wherein, the thickness of the portion of the flexible substrate within the display area is greater than the thickness of the portion of the flexible substrate within the bending area, and the thickness of the organic protective layer is less than the thickness of the flexible substrate within the display area.

2. The display panel according to claim 1, characterized in that, Within the bending region, the distance between the side of the bridging trace away from the flexible substrate and the side of the organic protective layer away from the flexible substrate is equal to the distance between the side of the bridging trace facing the flexible substrate and the side of the flexible substrate away from the bridging trace.

3. The display panel according to claim 1 or 2, characterized in that, The flexible substrate includes: a first substrate layer and a second substrate layer stacked together, wherein the second substrate layer is closer to the pixel driving circuit than the first substrate layer; In this configuration, a portion of the first substrate layer is located within the display area, and another portion is located within the non-display area; the second substrate layer is at least distributed within the display area, and the orthographic projection of the second substrate layer onto the first substrate layer does not coincide with the orthographic projection of the bending area onto the first substrate layer.

4. The display panel according to claim 3, characterized in that, The second substrate has a first through-groove, the orthographic projection of the first through-groove onto the first substrate covers the orthographic projection of the bending region onto the first substrate.

5. The display panel according to claim 4, characterized in that, The groove surface of the first through groove near the display area is the first groove surface; The display panel further includes: an organic filling portion, which is located at least within the first through groove and at least covers the surface of the first groove; Specifically, in a direction parallel to the display panel and perpendicular to the bending axis of the bending area, there is a portion of the bridging trace located on the side of the organic filling portion away from the first groove surface.

6. The display panel according to claim 5, characterized in that, Within the first through-groove, at least a portion of the bridging traces is located on the side of the organic filler layer opposite to the first substrate layer.

7. The display panel according to claim 6, characterized in that, Within the first through-groove, the orthographic projection of the bridging trace onto the first substrate layer lies within the orthographic projection of the organic filler portion onto the first substrate layer; Alternatively, within the first through-groove, a portion of the orthographic projection of the bridging trace onto the first substrate layer lies within the orthographic projection of the organic filler portion onto the first substrate layer, while another portion lies outside the orthographic projection of the organic filler portion onto the first substrate layer.

8. The display panel according to claim 5, characterized in that, The display panel further includes: a plurality of inorganic insulating layers stacked together, the plurality of inorganic insulating layers being located between the flexible substrate and the light-emitting device; The plurality of inorganic insulating layers have a second through groove communicating with the first through groove, and the orthographic projection of the second through groove on the first substrate layer covers the orthographic projection of the bending area on the first substrate layer; the groove surface of the second through groove near the display area is the second groove surface; The organic filling portion includes a part located outside the first through groove, and the part of the organic filling portion located outside the first through groove is in contact with the second groove surface.

9. The display panel according to claim 5, characterized in that, The non-display area also includes a bonding area, which is located on the side of the bending area opposite to the display area; the second substrate layer is also distributed within the bonding area. The groove surface of the first through groove near the binding area is the third groove surface; the organic filling part also covers the third groove surface; Specifically, in the direction parallel to the display panel and perpendicular to the bending axis of the bending area, there is a portion of the bridging trace located on the side of the organic filling portion away from the third groove surface.

10. The display panel according to any one of claims 5-9, characterized in that, The display panel further includes: a first conductive layer, a first planarization layer and a second conductive layer stacked together, wherein the first conductive layer is closer to the flexible substrate than the second conductive layer; The second conductive layer includes the bridging trace, and the portion of the first flat layer located within the bending area is the organic filler portion.

11. The display panel according to any one of claims 5-9, characterized in that, The display panel further includes: a first conductive layer, the first conductive layer including the bridging trace; The orthographic projection of the organic filler portion onto the first substrate layer is located outside the display area.

12. The display panel according to any one of claims 1-9, characterized in that, Also includes: The multilayer organic insulating layer located on the side of the pixel driving circuit away from the flexible substrate, at least one of the organic insulating layers located within the bending region is the organic protective layer.

13. The display panel according to claim 12, characterized in that, The at least one organic insulating layer includes: an organic planarization layer, a pixel definition layer, a support layer, and a touch organic protective layer stacked together; The organic protective layer includes at least one of the organic planarization layer, the pixel definition layer, the support layer, and the touch organic protective layer.

14. The display panel according to any one of claims 3-9, characterized in that, The flexible substrate further includes a barrier layer; the barrier layer is located between the first substrate layer and the second substrate layer, and covers the side of the first substrate layer facing the second substrate layer.

15. A display module, characterized in that, include: The display panel according to any one of claims 1-14, and the driver chip bonded to the display panel.

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