Connecting assembly and semiconductor process device

Abstract

The present application relates to the technical field of semiconductor processing, and discloses a connecting assembly and a semiconductor process device. The connecting assembly is connected between a process chamber and a transfer chamber. The connecting assembly comprises a connecting plate, a first sealing ring, and a second sealing ring. The connecting plate is provided with a transfer port. The transfer port passes through the connecting plate in the thickness direction of the connecting plate. A first surface of the connecting plate facing the process chamber is provided with a first sealing groove and a second sealing groove. The second sealing groove is provided around and outside the first sealing groove. The first sealing ring is provided in the first sealing groove, and the second sealing ring is provided in the second sealing groove. Both the first sealing ring and the second sealing ring are used for sealingly connecting the first surface of the connecting plate and the process chamber. The connecting assembly can solve the problem that, in an existing semiconductor process device, a sealing ring provided between a process chamber and a connecting plate is prone to failure.

Description

Connectivity components and semiconductor process equipment Technical Field

[0001] This application belongs to the field of semiconductor processing technology, specifically relating to a connection component and semiconductor process equipment. Background Technology

[0002] Chemical vapor deposition is a common process in semiconductor processing. During the deposition process, the wafer needs to be transferred from the transfer chamber to the process chamber. The transfer chamber is equipped with a transfer valve, which is opened and closed as needed.

[0003] During the deposition process, the transfer valve needs to be closed. In order to ensure relatively high sealing reliability of the process chamber, a connecting plate is usually provided between the transfer valve and the process chamber. The surface of the connecting plate is provided with a sealing groove, and a sealing ring is provided in the sealing groove. The sealing ring is used to form a sealed connection between the surfaces of the process chamber and the connecting plate facing each other.

[0004] However, since the deposition process is usually carried out at relatively high temperatures, this can have a significant adverse effect on the sealing reliability of the sealing ring, which can lead to sealing failure in the process chamber. Summary of the Invention

[0005] The purpose of this application is to provide a connection component and semiconductor process equipment to solve the problem that the sealing rings disposed between the process chamber and the connection plate in current semiconductor process equipment are prone to failure.

[0006] In a first aspect, embodiments of this application disclose a connecting assembly for connecting a process chamber and a transfer chamber. The connecting assembly includes a connecting plate, a first sealing ring, and a second sealing ring. The connecting plate has a transfer port that extends through the connecting plate along its thickness direction. The first surface of the connecting plate facing the process chamber has a first sealing groove and a second sealing groove. The second sealing groove is arranged around the first sealing groove. The first sealing ring is disposed in the first sealing groove, and the second sealing ring is disposed in the second sealing groove. Both the first sealing ring and the second sealing ring are used to seal the first surface of the connecting plate and the process chamber.

[0007] Secondly, embodiments of this application disclose a semiconductor process apparatus, which includes a process chamber, a transfer chamber, and the aforementioned connecting assembly. The process chamber and the transfer chamber are respectively fixedly installed on opposite sides of the connecting assembly, and a first sealing ring and a second sealing ring are pressed and disposed between the process chamber and the connecting plate.

[0008] This application discloses a connection assembly that can connect a process chamber and a transfer chamber. The connection assembly includes a connection plate with a transfer port that extends through the connection plate along its thickness direction, allowing a wafer to pass through and be transferred between the process chamber and the transfer chamber. Simultaneously, the first surface of the transfer plate facing the process chamber has a first sealing groove and a second sealing groove. The second sealing groove surrounds the first sealing groove. By placing a first sealing ring in the first sealing groove and a second sealing ring in the second sealing groove, both the first and second sealing rings can seal the connection between the first surface and the process chamber. In this case, even if the reliability of the first sealing ring, which is relatively close to the transfer port, decreases due to high temperatures, the presence of a second sealing ring outside the first sealing ring ensures that the sealing reliability between the process chamber and the connection plate remains relatively high, preventing sealing failure in the process chamber. Attached Figure Description

[0009] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0010] Figure 1 is a schematic diagram of the assembly of the connection components disclosed in an embodiment of this application;

[0011] Figure 2 is a schematic diagram of the assembly of the connecting components with the process chamber and the transmission chamber disclosed in the embodiments of this application;

[0012] Figure 3 is a schematic cross-sectional view of the connection component, process chamber, and transmission chamber disclosed in the embodiments of this application.

[0013] Figure 4 is an enlarged schematic diagram of part of the structure in Figure 3;

[0014] Figure 5 is a schematic cross-sectional view of the connection component, process chamber and transfer chamber disclosed in the embodiments of this application at another location;

[0015] Figure 6 is an enlarged schematic diagram of part of the structure in Figure 5;

[0016] Figure 7 is a schematic diagram of the structure of the connection component disclosed in an embodiment of this application;

[0017] Figure 8 is a schematic diagram of the connection component disclosed in the embodiment of this application in another direction.

[0018] Reference numerals: 100-Connecting plate, 110-Plate body, 111a-First sealing groove, 111b-Second sealing groove, 112-Transfer port, 113a-First purge channel, 113b-Second purge channel, 113c-Connecting channel, 116a-First recessed platform, 116b-Second recessed platform, 116c-Third recessed platform, 117-Mounting hole, 118a-First contact surface, 118b-Second contact surface, 118c-Mounting contact surface, 119-First suction channel, 120-Heat dissipation fins, 210-First sealing ring, 220-Second sealing ring, 230-Third sealing ring, 240-Fourth sealing ring, 300-Heat insulation component, 400-Process chamber, 410-First clearance recessed platform. 500 - Transmission chamber, 510 - Chamber, 511a - Third sealing groove, 511b - Fourth sealing groove, 513 - Second suction channel, 514 - Fourth sinking platform, 515 - Second clearance sinking platform, 520 - Transmission valve. Detailed Implementation

[0019] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0020] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0021] As shown in Figures 1-8, embodiments of this application disclose a connection component that can be applied in semiconductor process equipment. More specifically, the aforementioned semiconductor process equipment is used to perform chemical vapor deposition processes, and it further includes a process chamber 400 and a transfer chamber 500.

[0022] As shown in Figures 1 to 3, the connecting component disclosed in this embodiment can be connected between the process chamber 400 and the transfer chamber 500 to establish a connection between them. Simultaneously, to ensure that the process chamber 400 is isolated from the transfer chamber 500 during processing, the transfer chamber 500 may include a cavity 510 and a transfer valve 520. The transfer valve 520 has an opening and closing function; therefore, before processing, the transfer valve 520 can be controlled to close, and correspondingly, when wafer transfer is required, the transfer valve 520 can be controlled to open. In this case, to ensure that the process chamber 400 can form a sealed state, the sealing effect between the connecting component and the process chamber 400 needs to be relatively good.

[0023] Furthermore, in this embodiment of the application, the connecting assembly may include a connecting plate 100, a first sealing ring 210, and a second sealing ring 220. The connecting plate 100 is the main structure of the connecting assembly, and it can usually be formed of a material with relatively high structural strength, such as metal. The connecting plate 100 is a plate-shaped structural component, which is sandwiched between the process chamber 400 and the transmission chamber 500. Both the process chamber 400 and the transmission chamber 500 can be reliably fixedly connected to the connecting plate 100 by bolts or other connecting components.

[0024] Of course, to ensure that the connecting plate 100 does not obstruct the normal operation of wafer transfer, as shown in Figure 3, the connecting plate 100 is provided with a transfer port 112. The transfer port 112 is provided through the connecting plate 100 along its thickness direction, so that when wafer transfer is required, the wafer in the transfer chamber 500 can be sent into the process chamber 400 through the transfer port 112. Specifically, the size and shape of the transfer port 112 can be flexibly selected according to the size of the wafer, as well as the shape and size of the transfer chamber 500 and the process chamber 400, etc., and this article does not impose any restrictions on this.

[0025] Meanwhile, in order to ensure that the connecting plate 100 can form a relatively reliable sealing fit with the process chamber 400, as described above, the connecting assembly includes a first sealing ring 210 and a second sealing ring 220. In this embodiment, the first surface of the connecting plate 100 facing the process chamber 400 is also provided with a first sealing groove 111a and a second sealing groove 111b, and the second sealing groove 111b is arranged around the first sealing groove 111a. In this case, by setting the first sealing ring 210 in the first sealing groove 111a and the second sealing ring 220 in the second sealing groove 111b, the first sealing ring 210 and the second sealing ring 220 are used to seal the first surface of the connecting plate 100 and the process chamber 400. Under the combined action of the nested first sealing ring 210 and the second sealing ring 220, the double sealing principle is used to make the sealing effect of the gap between the connecting plate 100 and the process chamber 400 relatively good.

[0026] Specifically, both the first sealing ring 210 and the second sealing ring 220 can be formed of elastic materials such as rubber, thereby ensuring that both the first sealing ring 210 and the second sealing ring 220 can be compressed to a certain extent by the process chamber 400 and the connecting plate 100 to achieve a good sealing purpose. Of course, the specific dimensions and other parameters of the first sealing ring 210 and the second sealing ring 220 can be flexibly selected according to the actual situation, and this article does not limit them.

[0027] In addition, the first sealing groove 111a and the second sealing groove 111b provided on the connecting plate 100 can be designed according to the specific shape and size of the first sealing ring 210 and the second sealing ring 220, so that a part of the first sealing ring 210 can be embedded in the first sealing groove 111a and a part of the second sealing ring 220 can be embedded in the second sealing groove 111b in the thickness direction of the connecting plate 100. Thus, the first sealing groove 111a and the second sealing groove 111b provide a limiting function for the first sealing ring 210 and the second sealing ring 220 respectively, preventing the first sealing ring 210 and the second sealing ring 220 from rubbing during the sealing process, which would have an adverse effect on the sealing effect of the first sealing ring 210 and the second sealing ring 220.

[0028] Meanwhile, with the first sealing ring 210 and the second sealing ring 220 provided, the contact area between the first sealing ring 210 and the second sealing ring 220 and the process chamber 400 can be reduced to a certain extent, thereby minimizing the adverse effects of high temperature on the service life of the first sealing ring 210 and the second sealing ring 220, and thus improving the service life of the first sealing ring 210 and the second sealing ring 220.

[0029] More specifically, both the first sealing groove 111a and the second sealing groove 111b can be rectangular grooves, that is, both the first sealing groove 111a and the second sealing groove 111b are rectangular grooves. In another embodiment of this application, both the first sealing groove 111a and the second sealing groove 111b can be double dovetail grooves, which can improve the limiting effect on the first sealing ring 210 and the second sealing ring 220.

[0030] In another embodiment of this application, the first sealing groove 111a is a single-sided dovetail groove, that is, the first sealing groove 111a includes a rectangular groove portion and a dovetail groove portion, which are interconnected to form a complete first sealing groove 111a. More specifically, the aforementioned rectangular groove portion can be arranged around the dovetail groove portion, or the aforementioned dovetail groove portion can be arranged around the rectangular groove portion. In this case, the dovetail groove portion can provide a relatively stable limiting effect for the first sealing ring 210, and the rectangular groove portion can provide a relatively large accommodating space. Thus, even if the heat conducted from the process chamber 400 to the first sealing ring 210 causes the first sealing ring 210 to expand during the process, the rectangular groove portion in the first sealing groove 111a can provide sufficient expansion space for the first sealing ring 210, preventing the first sealing ring 210 from expanding due to heat and precipitating out, thereby adversely affecting the sealing relationship between the process chamber 400 and the connecting plate 100. In addition, by adopting the above technical solution, it is also convenient to remove the first sealing ring 210 from the first sealing groove 111a, thereby facilitating the replacement of the first sealing ring 210.

[0031] Similarly, in order to ensure that the second sealing ring 220 also has a good limiting effect while preventing the second sealing ring 220 from being precipitated due to thermal expansion, in a specific embodiment of this application, the second sealing groove 111b is also a single-sided dovetail groove, which can also reduce the difficulty of replacing the second sealing ring 220.

[0032] This application discloses a connection component that can be connected between a process chamber 400 and a transfer chamber 500. The connection plate 100 in the connection component is provided with a transfer port 112, and the transfer port 112 is provided through the connection plate 100 along the thickness direction of the connection plate 100 so that the wafer can pass through the transfer port 112 and be transferred between the process chamber 400 and the transfer chamber 500. Meanwhile, the first surface of the transfer plate facing the process chamber 400 is provided with a first sealing groove 111a and a second sealing groove 111b. The second sealing groove 111b is arranged around the first sealing groove 111a. By setting the first sealing ring 210 in the connecting assembly in the first sealing groove 111a and the second sealing ring 220 in the connecting assembly in the second sealing groove 111b, both the first sealing ring 210 and the second sealing ring 220 can be used to seal the connection between the first surface and the process chamber 400. In this case, even if the reliability of the first sealing ring 210, which is relatively close to the transfer port 112, decreases due to high temperature, the second sealing ring 220 is provided outside the first sealing ring 210, which ensures that the sealing reliability between the process chamber 400 and the connecting plate 100 is always relatively high, preventing the process chamber 400 from failing to seal.

[0033] As described above, both the first sealing ring 210 and the second sealing ring 220 can be formed of materials such as rubber. In one specific embodiment of this application, the first sealing ring 210 and the second sealing ring 220 can be formed of the same material. To further improve the sealing reliability between the connecting assembly and the process chamber 400 disclosed in this application embodiment, in this application embodiment, the corrosion resistance of the first sealing ring 210 can be higher than that of the second sealing ring 220, and the leakage rate of the second sealing ring 220 can be lower than that of the first sealing ring 210.

[0034] With the above technical solution, even if the first sealing ring 210, which is relatively close to the transfer port, frequently comes into contact with process gases and other materials in the process chamber 400, the aging rate of the first sealing ring 210 can be ensured to be relatively slow, thereby making the service life of the first sealing ring 210 relatively long. At the same time, by making the sealing performance of the second sealing ring 220 better than that of the first sealing ring 210, the overall sealing reliability of the first sealing ring 210 and the second sealing ring 220 remains relatively high. Specifically, the first sealing ring 210 can be a perfluorinated sealing ring, and the second sealing ring 220 can be a fluororubber sealing ring.

[0035] In the above embodiments, by designing the materials of the first sealing ring 210 and the second sealing ring 220, the service life of the first sealing ring 210 and the second sealing ring 220 can be improved as a whole, thereby ensuring that the overall sealing performance of the first sealing ring 210 and the second sealing ring 220 is relatively good.

[0036] In another embodiment of this application, the adverse effects of high temperature on the sealing ring can be reduced by cooling, thereby improving the service life of the first sealing ring 210 and the second sealing ring 220.

[0037] In detail, in this embodiment, at least one first purge channel 113a can be provided on the connecting plate 100, and each first purge channel 113a is arranged around the transmission port 112. The first end of each first purge channel 113a is connected to a purge gas source, and the second end of each first purge channel 113a is connected to the transmission port 112. This allows the purge gas to be transported to the transmission port 112 through each first purge channel 113a, so that during the flow of the purge gas within each first purge channel 113a, it can absorb heat from the surrounding area, thereby reducing the temperature in the corresponding area of ​​the connecting plate 100 and achieving the purpose of cooling the first sealing ring 210 and the second sealing ring 220. The number of first purge channels 113a can be one or more.

[0038] Of course, in order to make each first purge channel 113a relatively closer to the first sealing ring 210 and the second sealing ring 220, so as to improve the cooling efficiency of the first sealing ring 210 and the second sealing ring 220, in this embodiment of the application, in the thickness direction of the connecting plate 100, the distance between the second end of each first purge channel 113a and the first surface can be less than half the size of the connecting plate 100. That is, compared with the second surface of the connecting plate 100 facing the transmission chamber 500, each first purge channel 113a is relatively closer to the first surface of the connecting plate 100 facing the process chamber 400. In this case, the distance between the first sealing ring 210 and the second sealing ring 220 and each first purge channel 113a is relatively smaller, thereby improving the cooling effect of the purge gas on the first sealing ring 210 and the second sealing ring 220.

[0039] Specifically, each first purge channel 113a can be a straight channel, and each first purge channel 113a can be formed by penetrating inward from the outer wall of the connecting plate 100. In another embodiment of this application, an annular channel can also be provided, and one end of each first purge channel 113a can be connected to the aforementioned annular channel. In this case, by connecting the annular channel to the purge air source, it can be ensured that multiple first purge channels 113a can be indirectly connected to the purge air source, thereby reducing assembly difficulty.

[0040] Furthermore, in this embodiment, each of the first purge channels 113a is arranged in a ring shape, and the second end of each first purge channel 113a extends to the transfer port 112, so that the gas blown out in each first purge channel 113a can form an air wall, thereby preventing reactants and by-products from accumulating at the transfer port 112, and preventing reactants and by-products from adhering to the inner wall of the transfer port 112 of the connecting plate 100, thus ensuring a relatively high wafer process effect.

[0041] Accordingly, in order to maximize the cooling effect on the first sealing ring 210 and the second sealing ring 220, as well as the purging effect on the transmission port 112, in this embodiment of the application, without affecting the structural strength of the connecting plate 100 by a qualitative change, the number of first purging channels 113a can be increased as much as possible. Furthermore, without hindering the sealing reliability between the first surface of the connecting plate 100 and the process chamber 400, the second end of each first purging channel 113a can be brought as close as possible to the first surface of the connecting plate 100 in the axial direction of the transmission port 112, thereby improving the comprehensiveness of the purging of the transmission port 112.

[0042] Correspondingly, during the arrangement of the first sealing groove 111a, the distance between the first sealing groove 111a and the transmission port 112 can be relatively small, and while ensuring that the structural strength of the first sealing groove 111a meets the requirements, the first sealing groove 111a can be placed as close as possible to the transmission port 112. In this case, the distance between the first sealing ring 210 and the first purge channel 113a is also relatively small. More intuitively, in a specific embodiment of this application, the minimum distance between each first purge channel 113a and the first sealing ring 210 can be between 1.5 and 2 mm. This can ensure that the purge gas in the first purge channel 113a can provide a relatively good cooling effect for the first sealing ring 210, while also ensuring that the first sealing groove 111a has good structural stability.

[0043] As described above, a relatively reliable sealed connection can be formed between the connecting plate 100 and the process chamber 400 through the first sealing ring 210 and the second sealing ring 220. Similarly, a sealed connection can also be formed between the connecting plate 100 and the transmission chamber 500 through corresponding sealing rings, so as to ensure a relatively reliable sealed assembly relationship between the transmission chamber 500 and the process chamber 400.

[0044] Therefore, in one specific embodiment of this application, a third sealing ring 230 may be provided on the side of the connecting plate 100 facing away from the process chamber 400, thereby using the third sealing ring 230 to seal the second surface of the connecting plate 100 facing the transmission chamber 500 and the transmission chamber 500. Specifically, the third sealing ring 230 may be formed of an elastic material such as rubber, and during the assembly process, the third sealing ring 230 may be pressed between the connecting plate 100 and the transmission chamber 500 to ensure that the third sealing ring 230 can provide a good sealing effect.

[0045] As shown above, the third sealing ring 230 is located on the side of the connecting plate 100 away from the process chamber 400. In this case, although the third sealing ring 230 does not directly contact the process chamber 400, the heat of the process chamber 400 will be conducted to the third sealing ring 230 through the connecting plate 100 during the process. Therefore, the third sealing ring 230 can also be cooled to improve its service life.

[0046] In detail, the connecting plate 100 may also be provided with at least one second purge channel 113b. Each second purge channel 113b is arranged around the transmission port 112, and the first end of each second purge channel 113b is connected to the purge gas source, and the second end of each second purge channel 113b is connected to the transmission port 112. Thus, similar to the first purge channel 113a, when the purge gas flows in the second purge channel 113b, it absorbs the heat around the second purge channel 113b to reduce the temperature in the corresponding area of ​​the connecting plate 100, thereby achieving the purpose of cooling the third sealing ring 230. The number of second purge channels 113b can be one or more.

[0047] Accordingly, in order to ensure that the gas in the second purge channel 113b has a better cooling effect on the third sealing ring 230, in this embodiment of the application, in the thickness direction of the connecting plate 100, the distance between the second end of each second purge channel 113b and the second surface can be less than half the size of the connecting plate 100. In this case, each second purge channel 113b can also be as close as possible to the side where the third sealing ring 230 is located, thereby improving the cooling effect of the purge gas in the second purge channel 113b on the third sealing ring 230.

[0048] Similarly, in the axial direction of the transmission port 112, the second end of the second purge channel 113b can be made as close as possible to the second surface of the connecting plate 100, and the distance between the third sealing ring 230 and the transmission port 112 can be relatively small, thereby ensuring that the purge gas in the second purge channel 113b can provide better cooling for the third sealing ring 230. More intuitively, in a specific embodiment of this application, the minimum distance between each second purge channel 113b and the third sealing ring 230 can be between 1.5 and 2 mm.

[0049] As described above, the first ends of each of the first purge channels 113a and the second purge channels 113b are connected to the purge air source. Based on this, in order to reduce the assembly difficulty, in a specific embodiment of this application, as shown in FIG5, the connecting plate 100 is provided with a connecting channel 113c, and the connecting channel 113c is a closed ring structure. By making the first ends of each of the first purge channels 113a and the second purge channels 113b connected to the connecting channel 113c, and making the connecting channel 113c connected to the purge air source, the connection difficulty between the multiple first purge channels 113a and the multiple second purge channels 113b and the purge air source is relatively lower, thereby improving the assembly efficiency of the connecting components.

[0050] To further improve the sealing effect between the connecting plate 100 and the transmission chamber 500, in a specific embodiment of this application, a fourth sealing ring 240 may be provided on the side of the connecting plate 100 facing the transmission chamber 500, and the fourth sealing ring 240 is arranged around the third sealing ring 230. In this case, the third sealing ring 230 and the fourth sealing ring 240 are used together to seal the second surface of the connecting plate 100 facing the transmission chamber 500 and the transmission chamber 500, thereby further improving the sealing reliability between the connecting plate 100 and the transmission chamber 500.

[0051] Specifically, both the third sealing ring 230 and the fourth sealing ring 240 can be formed of the same rubber material. In another embodiment of this application, the corrosion resistance of the third sealing ring 230 can be higher than that of the fourth sealing ring 240, and the leakage rate of the fourth sealing ring 240 can be lower than that of the third sealing ring 230. This minimizes the aging efficiency of the third sealing ring 230, which is closer to the transmission port 112, and improves the service life of the third sealing ring 230. At the same time, the fourth sealing ring 240, which has better sealing performance, provides a more stable sealing effect on the outer periphery of the third sealing ring 230, making the overall sealing reliability of the third sealing ring 230 and the fourth sealing ring 240 relatively higher.

[0052] To prevent the third sealing ring 230 and the fourth sealing ring 240 from rubbing together, in this embodiment, a third sealing groove 511a and a fourth sealing groove 511b can be formed on the second surface of the connecting plate 100 facing the transmission chamber 500. The third sealing ring 230 is installed in the third sealing groove 511a, and the fourth sealing ring 240 is installed in the fourth sealing groove 511b. In this case, the third sealing groove 511a and the fourth sealing groove 511b can provide a limiting function for the third sealing ring 230 and the fourth sealing ring 240 respectively, ensuring that the assembly stability between the third sealing ring 230 and the fourth sealing ring 240 and the connecting plate 100 is relatively better.

[0053] Similarly, to ensure that the third sealing groove 511a and the fourth sealing groove 511b have both good limiting function and accommodating capacity, in this embodiment, both the third sealing groove 511a and the fourth sealing groove 511b are single-sided dovetail grooves, which makes the replacement of the third sealing ring 230 and the fourth sealing ring 240 relatively easy. In this embodiment, both the third sealing groove 511a and the fourth sealing groove 511b include a rectangular groove portion and a dovetail groove portion. The rectangular groove portion is disposed on the inner or outer side of the dovetail groove portion, and the two are interconnected. Of course, the specific dimensions of the third sealing groove 511a and the fourth sealing groove 511b can be designed according to the actual dimensions of the third sealing ring 230 and the fourth sealing ring 240, and this document does not limit this.

[0054] As described above, the connecting component disclosed in this application is sandwiched between the process chamber 400 and the transfer chamber 500. Therefore, the opposing first and second surfaces of the connecting plate 100 in the connecting component need to contact or even fit with the process chamber 400 and the transfer chamber 500 respectively, so as to ensure that a relatively good sealing connection relationship can be formed between the process chamber 400 and the transfer chamber 500 and the connecting plate 100.

[0055] In this situation, heat from the process chamber 400 is conducted to the connecting plate 100, causing both the first sealing ring 210 and the second sealing ring 220 to be in a high-temperature environment, which will adversely affect the service life of the first sealing ring 210 and the second sealing ring 220. Therefore, in a specific embodiment of this application, the connecting assembly may further include a heat insulation element 300 to block heat conduction from the process chamber 400 to the connecting plate 100 as much as possible.

[0056] Meanwhile, to prevent the heat insulation component 300 from obstructing the transfer process, the heat insulation component 300 is provided with a clearance opening to avoid the transfer port 112. In addition, as mentioned above, the second sealing ring 220 is disposed around the first sealing ring 210, thereby allowing a portion of the heat insulation component 300 to be sandwiched between the first sealing ring 210 and the second sealing ring 220, thereby further increasing the heat insulation area of ​​the heat insulation component 300. It should be noted that the second sealing ring 220 is a closed ring structure. Therefore, when a part of the heat insulation component 300 is sandwiched between the first sealing ring 210 and the second sealing ring 220, the part of the heat insulation component 300 sandwiched between the first sealing ring 210 and the second sealing ring 220 is separated from the part of the heat insulation component 300 located outside the second sealing ring 220. In order to complete the installation process of the heat insulation component 300 with the aforementioned structure, the heat insulation component 300 can be bonded to the connecting plate 100, or the heat insulation component 300 can be fixedly installed on the first surface of the connecting plate 100 using screws or other connectors.

[0057] In another embodiment of this application, considering that the area sandwiched between the first sealing ring 210 and the second sealing ring 220 is relatively small, the structure of the heat insulation member 300 may not be provided between the first sealing ring 210 and the second sealing ring 220. In this case, the heat insulation member 300 can be arranged around the second sealing ring 220, which makes the heat insulation member 300 an integral structural component, thereby greatly reducing the installation difficulty of the heat insulation member 300.

[0058] In addition, in this embodiment, the portion of the connecting plate 100 located between the first sealing ring 210 and the second sealing ring 220 can be recessed relative to other positions of the connecting plate 100. This allows the portion of the connecting plate 100 located between the first sealing ring 210 and the second sealing ring 220 to form a gap with the process chamber 400, thereby preventing the heat from the process chamber 400 from being directly conducted to the portion of the connecting plate 100 located between the first sealing ring 210 and the second sealing ring 220, thereby reducing the service life of the first sealing ring 210 and the second sealing ring 220.

[0059] In embodiments where the connecting assembly includes a heat insulation element 300, during the assembly of the connecting plate 100, to ensure that the connecting plate 100 can provide good compression to the first sealing ring 210 and the second sealing ring 220, thereby achieving a sealing fit between the connecting plate 100 and the process chamber 400 through the first sealing ring 210 and the second sealing ring 220, the heat insulation element 300 cannot be completely sandwiched between the connecting plate 100 and the process chamber 400. In other words, when the connecting assembly includes a connecting plate 100 and a heat insulation element 300, a portion of the first surface of the connecting plate 100 facing the process chamber 400 still directly contacts or adheres to the process chamber 400.

[0060] Based on this, in this embodiment of the application, the first surface of the connecting plate 100 may be provided with a first recess 116a, so as to accommodate the heat insulation component 300. That is, in this embodiment of the application, the heat insulation component 300 is embedded in the first recess 116a. Correspondingly, the part of the first surface located outside the edge of the first recess 116a can still contact or fit with the surface of the process chamber 400, thereby ensuring that the connecting plate 100 can still normally apply the compressive force to the process chamber 400, thereby ensuring that both the first sealing ring 210 and the second sealing ring 220 can provide a good sealing effect.

[0061] Accordingly, based on the thickness of the heat insulation component 300, the recess size of the first recessed platform 116a relative to the first surface can be determined. In designing the first recessed platform 116a, the recess size can be greater than the thickness of the heat insulation component 300, or it can be equal to the thickness of the heat insulation component 300. Both designs ensure that the heat insulation component 300 can provide normal heat insulation. That is, in this embodiment, in the thickness direction of the connecting plate 100, the surface of the heat insulation component 300 facing the process chamber 400 can be flush with the first surface of the connecting plate 100, or the surface of the heat insulation component 300 facing the process chamber 400 can be recessed relative to the first surface of the connecting plate 100. In addition, if the surface of the heat insulation component 300 facing the process chamber 400 can be flush with the first surface of the connecting plate 100, a first clearance platform 410 can be provided on the side of the process chamber 400 facing the heat insulation component 300 so that a gap can still be formed between the process chamber 400 and the heat insulation component 300, thereby reducing the heat transfer efficiency between the two.

[0062] Of course, to ensure that the heat insulation component 300 has good thermal barrier capabilities, it needs to be formed using a heat insulation material, i.e., a material with relatively low thermal conductivity. In a specific embodiment of this application, a non-metallic material, such as polytetrafluoroethylene or polyetheretherketone, can be used to form the heat insulation component 300. Furthermore, during the formation of the first recess 116a, the proportion of the first recess 116a in the first surface can be made as large as possible, while also ensuring that a portion of the first surface remains in contact with the process chamber 400.

[0063] As described above, during the assembly of the connecting components, screws and other connectors can be used to form a fixed connection between the connecting plate 100 and the process chamber 400. During the installation of screws and other connectors, the connectors can pass through the connecting plate 100 and the heat insulation component 300 together.

[0064] To improve the connection reliability between the connecting plate 100 and the process chamber 400, and to enhance the locking force of the aforementioned screws and other connecting components on the first sealing ring 210 and the second sealing ring 220, in another embodiment of this application, the connecting assembly further includes at least one fixing connector. The connecting plate 100 has at least one mounting hole 117, and each fixing connector is correspondingly inserted into each mounting hole 117 and fixedly connected to the process chamber 400. The fixing connector can be a screw or bolt, etc., and correspondingly, the mounting hole 117 can be a threaded hole or a through hole.

[0065] As described above, in this embodiment of the application, the fixing connectors do not pass through the heat insulation 300, or in other words, the fixing connectors are all located outside the heat insulation 300. In this case, the fixing connectors can directly act on the part of the first surface of the connecting plate 100 that directly contacts or fits with the process chamber 400, thereby making the connection between the connecting plate 100 and the process chamber 400 more reliable.

[0066] To further distinguish between the portion of the connecting plate 100 that directly contacts or adheres to the process chamber 400 and the portion of the connecting plate 100 that cooperates with the process chamber 400 through the heat insulation component 300, the connecting plate 100 includes a plate body 110. The plate body 110 is provided with a transmission port 112, a first sealing groove 111a, and a second sealing groove 111b. Meanwhile, the first surface of the plate body 110 includes a first contact surface 118a, a second contact surface 118b, and a plurality of mounting contact surfaces 118c. The first contact surface 118a and the second contact surface 118b are both arranged around the transmission port 112, and the first sealing groove 111a and the second sealing groove 111b are sandwiched between the first contact surface 118a and the second contact surface 118b. The plurality of mounting contact surfaces 118c are all located on the outer edge of the first recess 116a, and each mounting contact surface 118c is provided with a mounting hole 117.

[0067] That is, in this embodiment of the application, a first contact surface 118a is provided between the first sealing groove 111a and the transmission port 112 on the first surface of the connecting plate 100, and a second contact surface 118b is provided around the second sealing groove 111b. After the connecting plate 100 and the process chamber 400 are assembled together, the first sealing groove 111a and the second sealing groove 111b can be surrounded by the first contact surface 118a and the second contact surface 118b, thereby ensuring that the compression effect of the first sealing ring 210 and the second sealing ring 220 is relatively good, and the sealing reliability between the first surface of the connecting plate 100 and the process chamber 400 is relatively high.

[0068] Meanwhile, by arranging multiple mounting contact surfaces 118c at the outer edge of the first recess 116a, the distance between the multiple mounting contact surfaces 118c and the first sealing ring 210 and the second sealing ring 220 is relatively large. This minimizes the amount of heat conducted from the process chamber 400 through the multiple mounting contact surfaces 118c to the first sealing ring 210 and the second sealing ring 220. Of course, the heat from the process chamber 400 acting on the first sealing ring 210 and the second sealing ring 220 through the first contact surfaces 118a and 118b can be carried away by the aforementioned purge gas, thereby extending the service life of the first sealing ring 210 and the second sealing ring 220.

[0069] Furthermore, by providing the aforementioned mounting holes 117 on the relatively outer mounting contact surfaces 118c, the locking effect provided by the fixing connector to the connecting plate 100 is made more reliable. More specifically, the connecting plate 100 can be generally a rectangular plate structure. Therefore, the mounting contact surfaces 118c can also be rectangular in shape, and the number of mounting contact surfaces 118c can be four, distributed at the four corners of the plate body 110 of the connecting plate 100.

[0070] To further enhance the locking effect between the connecting plate 100 and the process chamber 400, other mounting contact surfaces 118c can be provided on the outer periphery of the second contact surface 118b, and mounting holes 117 can also be provided on the aforementioned mounting contact surfaces 118c. In this case, by providing additional fixing connectors at positions closer to the first sealing ring 210 and the second sealing ring 220, the locking effect of the fixing connectors on the first sealing ring 210 and the second sealing ring 220 is more obvious, resulting in relatively better sealing performance of the first sealing ring 210 and the second sealing ring 220.

[0071] As described above, purge gas can be delivered through the first purge channel 113a to remove the heat conducted by the first contact surface 118a and the second contact surface 118b. Corresponding purge channels can also be provided for the heat conducted by the multiple mounting contact surfaces 118c located on the outer edge of the first recess 116a.

[0072] To reduce processing difficulty and further improve the heat dissipation efficiency of the entire board 110, in a specific embodiment of this application, multiple heat dissipation fins 120 can be provided on both the upper and lower sides of the board 110. This allows the heat of the board 110 to be dissipated more quickly under the action of the multiple heat dissipation fins 120, thereby reducing the temperature of multiple mounting contact surfaces 118c and lowering the overall temperature of the board 110. This can further improve the service life of the first sealing ring 210 and the second sealing ring 220.

[0073] As described above, a heat insulation member 300 may be provided on the side of the connecting plate 100 facing the first surface of the process chamber 400. Similarly, in a further embodiment of this application, a second recess 116b may be provided on the second surface of the connecting plate 100 facing the transmission chamber 500, and a heat insulation member 300 is also embedded in the second recess 116b. In the thickness direction of the connecting plate 100, the surface of the heat insulation member 300 facing the transmission chamber 500 is flush with the second surface of the connecting plate 100, or the surface of the heat insulation member 300 facing the transmission chamber 500 is recessed relative to the second surface of the connecting plate 100. In this case, the amount of heat conduction between the connecting plate 100 and the transmission chamber 500 is relatively small, thereby making the service life of the third sealing ring 230 and even the fourth sealing ring 240 provided between the connecting plate 100 and the transmission chamber 500 relatively long. Similarly, when the surface of the heat insulation member 300 facing the transmission chamber 500 and the second surface of the connecting plate 100 are flush, a second clearance platform 515 can be provided on the side of the transmission chamber 500 facing the connecting plate 100 so that a gap can still be formed between the transmission chamber 500 and the heat insulation member 300, thereby reducing the heat conduction efficiency between the two.

[0074] Specifically, the heat insulation members 300 disposed on opposite sides of the connecting plate 100 can be made of the same material, and their shapes can also be substantially the same. Similarly, when the connecting plate 100 has a third sealing groove 511a and a fourth sealing groove 511b on its second surface facing the transmission chamber 500, the heat insulation member 300 embedded in the second recess 116b of the connecting plate 100 can be arranged around the fourth sealing groove 511b. Correspondingly, multiple mounting contact surfaces 118c are also provided on the inner and outer edges of the second recess 116b of the connecting plate 100 to ensure that the connecting plate 100 and the transmission chamber 500 can also form a fixed connection relationship through the fixed connector.

[0075] More specifically, the mounting hole 117 in the connecting plate 100 for connecting to the process chamber 400 can be a through hole, and the mounting hole 117 in the connecting plate 100 for connecting to the transmission chamber 500 can be a threaded hole. At the same time, by extending the upper and lower edges of the transmission chamber 500 beyond the upper and lower edges of the connecting plate 100 respectively, during the assembly of the connecting assembly, the connecting plate 100 can be fixed to the process chamber 400 first using a fixing connector, and then the process chamber 400 and the connecting plate 100 can be connected to the transmission chamber 500 as a whole.

[0076] To further improve the service life of the third sealing ring 230 and the fourth sealing ring 240, in a specific embodiment of this application, a third sealing groove 511a and a fourth sealing groove 511b can be provided on the side surface of the transmission chamber 500 facing the connecting plate 100. That is, in this embodiment of the application, the third sealing groove 511a and the fourth sealing groove 511b are no longer provided on the side of the connecting plate 100 facing the transmission chamber 500, thereby reducing the contact area between the connecting plate 100 and the third sealing ring 230 and the fourth sealing ring 240, and thus significantly reducing the heat acting on the third sealing ring 230 and the fourth sealing ring 240.

[0077] As described above, the first surface of the connecting plate 100 facing the process chamber 400 is provided with a first sealing groove 111a and a second sealing groove 111b. Considering that the first sealing ring 210 usually cannot completely fill the first sealing groove 111a, correspondingly, the second sealing ring 220 usually cannot completely fill the second sealing groove 111b. This may result in a certain amount of gas remaining in the first sealing groove 111a and the second sealing groove 111b, which may have an adverse effect on the process environment of the process chamber 400.

[0078] Therefore, in a specific embodiment of this application, a first suction channel 119 can be provided on the connecting plate 100, and the first suction channel 119 can be connected to the vacuum hole of the transmission chamber 500. Then, by connecting the first sealing groove 111a and the second sealing groove 111b to the first suction channel 119, when the vacuum mechanism of the transmission chamber 500 is working, the vacuum hole can be used to perform vacuum operation on the first sealing groove 111a and the second sealing groove 111b at the same time, so that there is no need to configure separate vacuum equipment for the first sealing groove 111a and the second sealing groove 111b, thereby reducing the overall cost of the connecting components and the entire semiconductor process equipment. Specifically, the bottoms of the first sealing groove 111a and the second sealing groove 111b facing the process chamber 400 can be connected to the first suction channel 119, so that the vacuuming mechanism of the transmission chamber 500 can perform vacuuming operations on the first sealing groove 111a and the second sealing groove 111b through the vacuuming hole and the first suction channel 119. This can also improve the sealing effect of the first sealing ring 210 and the second sealing ring 220.

[0079] In another embodiment of this application, a third recessed platform 116c may be provided on the first surface. The third recessed platform 116c is arranged around the first sealing groove 111a, and the second sealing groove 111b is arranged around the third recessed platform 116c. The third recessed platform 116c is recessed relative to the first surface. The size of the recess can be determined according to parameters such as the depth of the first sealing groove 111a and the second sealing groove 111b. In this case, the third recessed platform 116c can form a first communicating cavity with the process chamber 400. By extending the edge of the third recessed platform 116c to the first sealing groove 111a and the second sealing groove 111b respectively, the first sealing groove 111a and the second sealing groove 111b can be connected to the first communicating cavity. In this case, by connecting the first communicating cavity with the first suction channel 119, the first sealing groove 111a and the second sealing groove 111b can be vacuumed simultaneously using the first communicating cavity. In addition, when the technical solution disclosed in the embodiments of this application is adopted, the area where the third sink 116c in the connecting plate 100 is located can be isolated from the process chamber 400, thereby further reducing the heat conducted from the process chamber 400 to the first sealing ring 210 and the second sealing ring 220 through the connecting plate 100, and improving the service life of the first sealing ring 210 and the second sealing ring 220.

[0080] As described above, the connecting assembly may further include a third sealing ring 230 and a fourth sealing ring 240, and a third sealing groove 511a and a fourth sealing groove 511b may be provided on the side surface of the transmission chamber 500 facing the connecting plate 100. In this case, in order to prevent gas from remaining in the third sealing groove 511a and the fourth sealing groove 511b, which would adversely affect the sealing effect of the third sealing ring 230 and the fourth sealing ring 240, in a specific embodiment of this application, a second suction channel 513 may also be provided on the transmission chamber 500, and the second suction channel 513 may be connected to the vacuum hole of the transmission chamber 500. In this case, by making both the third sealing groove 511a and the fourth sealing groove 511b connected to the second suction channel 513, the vacuum mechanism of the transmission chamber 500 may also extract the gas in the third sealing groove 511a and the fourth sealing groove 511b through the second suction channel 513 and the vacuum hole.

[0081] Similarly, the second suction channel 513 can be connected to the bottom of the third sealing groove 511a and the fourth sealing groove 511b. Alternatively, in another embodiment of this application, the transmission chamber 500 can be provided with a fourth recess 514 on the side surface facing the connecting plate 100. The fourth recess 514 is arranged around the third sealing groove 511a, and the fourth sealing groove 511b is arranged around the fourth recess 514. The fourth recess 514 is used to form a second communicating cavity with the second surface of the connecting plate 100. The second communicating cavity is connected to the second suction channel 513. The first suction channel 119, the third sealing groove 511a, and the fourth sealing groove 511b are all connected to the second communicating cavity. In this case, by extending the edges of the fourth sinking platform 514 to the third sealing groove 511a and the fourth sealing groove 511b respectively, the vacuuming mechanism can perform vacuuming operations on the third sealing groove 511a and the fourth sealing groove 511b together through the second suction channel 513 and the second connecting cavity. This can further isolate the transmission chamber 500 and the connecting plate 100, thereby reducing the heat conducted from the connecting plate 100 to the third sealing ring 230 and the fourth sealing ring 240, and further improving the service life of the third sealing ring 230 and the fourth sealing ring 240.

[0082] Based on the connection components disclosed in any of the above embodiments, this application also discloses a semiconductor process apparatus, which includes a process chamber 400, a transfer chamber 500, and the aforementioned connection components. The process chamber 400 and the transfer chamber 500 are respectively fixedly installed on opposite sides of the connection components. A first sealing ring 210 and a second sealing ring 220 are pressed together between the process chamber 400 and the connecting plate 100. Furthermore, to ensure a relatively good sealing effect between the connecting plate 100 and the transfer chamber 500 in the connection components, a third sealing ring 230 can be provided between the connecting plate 100 and the transfer chamber 500. Further, a fourth sealing ring 240 can also be provided. Moreover, to improve the assembly stability of the third sealing ring 230 and the fourth sealing ring 240, a third sealing groove 511a and a fourth sealing groove 511b can be provided on the side of the transfer chamber 500 facing the connecting plate 100. Furthermore, a fourth sinking platform 514 and a second suction channel 513 can be provided on the side of the transmission chamber 500 facing the connecting plate 100, and the third sealing groove 511a and the fourth sealing groove 511b are both connected to the fourth sinking platform 514. The fourth sinking platform 514 is also connected to the vacuum hole of the transmission chamber 500 through the second suction channel 513. Thus, the vacuuming mechanism of the transmission chamber 500 can be used to perform vacuuming operations through the vacuum hole and the second suction channel 513 with the third sealing groove 511a and the fourth sealing groove 511b.

[0083] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, it should be noted that the scope of the methods and apparatuses in the embodiments of this application is not limited to performing functions in the order shown or discussed, but may also include performing functions substantially simultaneously or in the reverse order, depending on the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

[0084] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A connecting assembly connected between a process chamber (400) and a transfer chamber (500), characterized in that, The connecting assembly includes a connecting plate (100), a first sealing ring (210), and a second sealing ring (220). The connecting plate (100) has a transmission port (112) that extends through the connecting plate (100) along its thickness direction. The connecting plate (100) has a first sealing groove (111a) and a second sealing groove (111b) on its first surface facing the process chamber (400). The second sealing groove (111b) surrounds the first sealing groove (111a). The first sealing ring (210) is disposed in the first sealing groove (111a), and the second sealing ring (220) is disposed in the second sealing groove (111b). Both the first sealing ring (210) and the second sealing ring (220) are used to seal and connect the first surface of the connecting plate (100) to the process chamber (400).

2. The connection component according to claim 1, characterized in that, The corrosion resistance of the first sealing ring (210) is higher than that of the second sealing ring (220), and the leakage rate of the second sealing ring (220) is lower than that of the first sealing ring (210).

3. The connection component according to claim 1, characterized in that, The connecting plate (100) is provided with at least one first purge channel (113a), each first purge channel (113a) is arranged around the transmission port (112), and the first end of each first purge channel (113a) is connected to the purge air source, and the second end of each first purge channel (113a) is connected to the transmission port (112). In the thickness direction of the connecting plate (100), the distance between the second end of each first purge channel (113a) and the first surface is less than half the size of the connecting plate (100).

4. The connecting component according to claim 3, characterized in that, The connecting plate (100) is provided with a third sealing ring (230) on the side opposite to the process chamber (400). The third sealing ring (230) is used to seal and connect the second surface of the connecting plate (100) facing the transmission chamber (500) and the transmission chamber (500). The connecting plate (100) is provided with at least one second purge channel (113b), each second purge channel (113b) is arranged around the transmission port (112), and the first end of each second purge channel (113b) is connected to the purge air source, and the second end of each second purge channel (113b) is connected to the transmission port (112). In the thickness direction of the connecting plate (100), the distance between the second end of each second purge channel (113b) and the second surface is less than half the size of the connecting plate (100).

5. The connecting component according to claim 4, characterized in that, The connecting plate (100) is provided with a connecting channel (113c), which is a closed ring structure, and the first ends of each of the first purge channels (113a) and each of the second purge channels (113b) are connected to the purge air source through the connecting channel (113c).

6. The connecting component according to claim 4, characterized in that, The minimum distance between each of the first purge channels (113a) and the first sealing ring (210) is between 1.5 and 2 mm; and / or, The minimum distance between each of the second purge channels (113b) and the third sealing ring (230) is between 1.5 and 2 mm.

7. The connection component according to claim 1, characterized in that, The connecting assembly further includes a heat insulation element (300), which has a clearance opening for avoiding the transmission port (112), and the heat insulation element (300) is arranged around the second sealing ring (220). The first surface of the connecting plate (100) is further provided with a first recessed platform (116a), in which the heat insulation member (300) is embedded. In the thickness direction of the connecting plate (100), the surface of the heat insulation member (300) facing the process chamber (400) is flush with the first surface of the connecting plate (100), or the surface of the heat insulation member (300) facing the process chamber (400) is recessed relative to the first surface of the connecting plate (100).

8. The connection component according to claim 7, characterized in that, The connecting assembly further includes at least one fixing connector. The connecting plate (100) is provided with at least one mounting hole (117), and each fixing connector is correspondingly inserted into each mounting hole (117) and fixedly connected to the process chamber (400).

9. The connection component according to claim 8, characterized in that, The connecting plate (100) includes a plate body (110), which is provided with the transmission port (112), the first sealing groove (111a) and the second sealing groove (111b); The first surface of the plate (110) includes a first contact surface (118a), a second contact surface (118b), and a plurality of mounting contact surfaces (118c). The first contact surface (118a) and the second contact surface (118b) are both arranged around the transmission port (112), and the first sealing groove (111a) and the second sealing groove (111b) are sandwiched between the first contact surface (118a) and the second contact surface (118b). The plurality of mounting contact surfaces (118c) are all located on the outer edge of the first recess (116a), and each mounting contact surface (118c) is provided with the mounting hole (117).

10. The connection component according to claim 7, characterized in that, The connecting plate (100) has a second recessed platform (116b) on its second surface facing the transmission chamber (500). The heat insulation member (300) is embedded in the second recessed platform (116b). In the thickness direction of the connecting plate (100), the surface of the heat insulation member (300) facing the transmission chamber (500) is flush with the second surface of the connecting plate (100), or the surface of the heat insulation member (300) facing the transmission chamber (500) is recessed relative to the second surface of the connecting plate (100).

11. The connection component according to claim 1, characterized in that, The connecting plate (100) is also provided with a first suction channel (119), which is used to communicate with the vacuum hole of the transmission chamber (500), and the first sealing groove (111a) and the second sealing groove (111b) are both connected to the first suction channel (119).

12. The connection component according to claim 11, characterized in that, The first surface is further provided with a third recessed platform (116c), which surrounds the first sealing groove (111a) and the second sealing groove (111b) surrounds the third recessed platform (116c). The third recessed platform (116c) is used to form a first communicating cavity with the process chamber (400). The first sealing groove (111a) and the second sealing groove (111b) are both connected to the first communicating cavity, and the first communicating cavity is connected to the first suction channel (119).

13. The connection component according to claim 11, characterized in that, The connecting plate (100) may be provided with a third sealing ring (230) and a fourth sealing ring (240) on the side opposite to the process chamber (400), and the fourth sealing ring (240) is arranged around the third sealing ring (230). The third sealing ring (230) and the fourth sealing ring (240) are used to seal and connect the second surface of the connecting plate (100) facing the transmission chamber (500) and the transmission chamber (500).

14. The connection component according to claim 13, characterized in that, The third sealing ring (230) has higher corrosion resistance than the fourth sealing ring (240), and the leakage rate of the fourth sealing ring (240) is lower than that of the third sealing ring (230).

15. The connection component according to claim 13, characterized in that, The transmission chamber (500) may be provided with a third sealing groove (511a) and a fourth sealing groove (511b) on the side surface facing the connecting plate (100). The third sealing ring (230) is installed in the third sealing groove (511a), and the fourth sealing ring (240) is installed in the fourth sealing groove (511b).

16. The connection component according to claim 15, characterized in that, Both the third sealing groove (511a) and the fourth sealing groove (511b) are single-sided dovetail grooves.

17. The connection component according to claim 15, characterized in that, The transmission chamber (500) may also be provided with a second suction channel (513), which is connected to the vacuum hole of the transmission chamber (500), and the third sealing groove (511a) and the fourth sealing groove (511b) are both connected to the second suction channel (513).

18. The connection component according to claim 17, characterized in that, The transmission chamber (500) may also be provided with a fourth recess (514) on the side surface facing the connecting plate (100). The fourth recess (514) is arranged around the third sealing groove (511a), and the fourth sealing groove (511b) is arranged around the fourth recess (514). The fourth recess (514) is used to form a second communicating cavity with the second surface of the connecting plate (100). The second communicating cavity is connected to the second suction channel (513). The first suction channel (119), the third sealing groove (511a) and the fourth sealing groove (511b) are all connected to the second communicating cavity.

19. The connection component according to claim 1, characterized in that, The first sealing groove (111a) is a single-sided dovetail groove; the second sealing groove (111b) is a single-sided dovetail groove.

20. A semiconductor process apparatus, characterized in that, The assembly includes a process chamber (400), a transfer chamber (500), and a connecting component as described in any one of claims 1-19. The process chamber (400) and the transfer chamber (500) are respectively fixedly installed on opposite sides of the connecting component, and the first sealing ring (210) and the second sealing ring (220) are pressed between the process chamber (400) and the connecting plate (100).

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