Display panel and preparation method therefor, and display device

Abstract

The present application relates to a display panel and a preparation method therefor, and a display device. The preparation method for a display panel comprises: providing a substrate; forming on a side of the substrate a first pixel definition layer having a plurality of first pixel openings; and using a plasma process to remove residual material, wherein the process gas for the plasma process comprises a first gas, and the atomic mass of the first gas is less than the atomic mass of oxygen.

Description

Display panel and its manufacturing method, display device

[0001] Related applications

[0002] This application claims priority to Chinese Patent Application No. 2025100857041, filed January 17, 2025, entitled "Display Panel and Method for Manufacturing the Same Thereof, Display Device", and to Chinese Patent Application No. 2025110723518, filed July 31, 2025, entitled "Display Panel and Method for Manufacturing the Same Thereof, Display Device", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of display technology, and in particular to a display panel, a method for manufacturing the same, and a display device. Background Technology

[0004] OLED (Organic Light Emitting Diode) display panels are currently a hot topic in display panel research. OLED displays offer advantages such as low energy consumption, low cost, self-emissiveness, wide viewing angles, and fast response times. To improve light transmittance and reduce panel thickness and power consumption, current OLED displays typically employ COE (Color Filter on Encapsulation) technology, combining a color filter (CF) and a black matrix (BM) to replace polarizers. However, the display performance of panels using COE technology still needs improvement. Summary of the Invention

[0005] Therefore, it is necessary to provide a display panel, its manufacturing method, and a display device that improve the above-mentioned problems.

[0006] In a first aspect, embodiments of this application provide a method for manufacturing a display panel, comprising:

[0007] Provide a base;

[0008] A first pixel definition layer with multiple first pixel openings is formed on one side of the substrate;

[0009] The residual first pixel definition material is removed using a plasma process; wherein the process gas of the plasma process includes a first gas, the atomic mass of which is less than the atomic mass of oxygen.

[0010] Preferably, the second gas is oxygen;

[0011] Preferably, the volumetric flow rate ratio of the first gas to the second gas is C, and 0.5 ≤ C ≤ 2.

[0012] Preferably, forming a second pixel definition layer on the side of the first pixel definition layer opposite to the substrate includes:

[0013] A second pixel definition material layer is formed by coating the side of the first pixel definition layer away from the substrate;

[0014] The second pixel definition material layer is exposed and developed to form the second pixel definition layer.

[0015] Preferably, the step of performing a first cleaning operation on the residual first pixel definition material includes:

[0016] The first cleaning operation is performed using deionized water to remove the remaining first pixel definition material.

[0017] Preferably, after the step of curing the product following the first cleaning, the method further includes:

[0018] A second cleaning operation is performed on the remaining material defining the first pixel.

[0019] Preferably, a stripping solution is used to perform a second cleaning operation on the residual first pixel definition material.

[0020] Secondly, this application provides another method for manufacturing a display panel, comprising:

[0021] Provide a base;

[0022] A first pixel definition layer with multiple first pixel openings is formed on one side of the substrate;

[0023] A first cleaning operation is performed on the first pixel definition material remaining in the first pixel opening;

[0024] After the first cleaning operation, the first pixel definition layer is solidified.

[0025] In one embodiment, after the first cleaning operation, the first pixel definition layer is solidified, and then the preparation method includes:

[0026] Multiple light-emitting units are formed, and each light-emitting unit is at least partially located in the corresponding first pixel opening;

[0027] An encapsulation layer is formed on the side of the light-emitting unit away from the substrate;

[0028] A color filter layer is formed on the side of the encapsulation layer away from the substrate. The color filter layer includes a black matrix and color resist units. The black matrix includes a plurality of light-transmitting openings. The color resist units are at least partially located within the corresponding light-transmitting openings.

[0029] Preferably, the orthographic projection of the first pixel opening on the substrate is located within the orthographic projection of the corresponding light-transmitting opening on the substrate;

[0030] Preferably, the first pixel defining material includes black photoresist.

[0031] In one embodiment, forming a color filter layer on the side of the encapsulation layer away from the substrate includes:

[0032] A touch-enabled layer is formed on the side of the encapsulation layer away from the substrate;

[0033] The color filter layer is formed on the side of the touch function layer away from the substrate;

[0034] Preferably, the orthographic projection of the touch function layer on the substrate is located within the orthographic projection of the black matrix on the substrate.

[0035] Thirdly, this application provides a display panel, including:

[0036] Base;

[0037] A first pixel definition layer is disposed on one side of the substrate. The first pixel definition layer is provided with a plurality of first pixel openings. The first pixel definition layer includes a first sub-slope surface, and the first sub-slope surface surrounds and forms the first pixel opening.

[0038] A second pixel definition layer is disposed on the side of the first pixel definition layer away from the substrate. The second pixel definition layer has a plurality of second pixel openings, and the second pixel openings are connected to the corresponding first pixel openings. The second pixel definition layer includes a second sub-slope surface, and the second sub-slope surface surrounds to form the second pixel opening.

[0039] Wherein, the ratio of the roughness of the first sub-slope surface to the roughness of the second sub-slope surface is A, and 0.6≤A≤12.

[0040] Preferably, the roughness of the first sub-slope surface is α, where 2nm ≤ α ≤ 7nm;

[0041] Preferably, the roughness of the second sub-slope surface is b, where 0.5nm ≤ b ≤ 3nm;

[0042] Preferably, the transmittance of the first pixel definition layer is less than the transmittance of the second pixel definition layer;

[0043] Preferably, the material of the first pixel definition layer includes black photoresist.

[0044] Preferably, the orthographic projection of the first sub-climbing surface on the base is connected to the orthographic projection of the second sub-climbing surface on the base;

[0045] Preferably, the end of the second sub-climbing surface near the base is connected to the end of the first sub-climbing surface away from the base;

[0046] Preferably, in the orthographic projection of the first sub-climbing surface onto the substrate, the distance between the end of the orthographic projection near the center of the first pixel opening and the end of the orthographic projection away from the center of the first pixel opening is h1, and 2μm≤h1≤6μm.

[0047] Preferably, the ratio of the roughness of the third sub-slope surface to the roughness of the second sub-slope surface is B, and 2≤B≤4;

[0048] Preferably, the roughness of the third sub-slope surface is c, and 2nm≤c≤7nm;

[0049] Preferably, along a direction parallel to the base plane, the distance between the end of the third sub-climbing surface near the first flat surface and the end of the first sub-climbing surface near the center of the first pixel opening is h2, and 9μm≤h2≤30μm.

[0050] In one embodiment, the display panel further includes a light-emitting device layer disposed on one side of the substrate. The light-emitting device layer includes a plurality of light-emitting units disposed corresponding to the first pixel opening and the second pixel opening. At least a portion of each light-emitting unit is disposed within the corresponding first pixel opening and the second pixel opening.

[0051] The light-emitting unit includes a first electrode, a light-emitting layer, and a second electrode stacked along a direction away from the substrate; the first pixel definition layer covers the edge region of the first electrode, and the first pixel opening exposes the central region of the first electrode; the light-emitting layer covers the first sub-slope surface and the second sub-slope surface.

[0052] Preferably, the orthographic projection of the first sub-climbing surface onto the substrate at least partially covers the orthographic projection of the corresponding first electrode onto the substrate;

[0053] Preferably, the display panel further includes an encapsulation layer disposed on the side of the light-emitting device layer away from the substrate;

[0054] Preferably, the display panel further includes a color filter layer, the color filter layer including a plurality of color resist units, the color resist units being disposed corresponding to the first pixel opening and the second pixel opening;

[0055] Preferably, the color filter layer further includes a black matrix, the black matrix including a plurality of light-transmitting openings, the light-transmitting openings being disposed corresponding to the first pixel opening and the second pixel opening, the color resist unit being disposed corresponding to the light-transmitting opening, and the color resist unit being at least partially disposed within the corresponding light-transmitting opening;

[0056] Preferably, the display panel further includes a touch function layer, which is disposed on the side of the color filter layer facing the substrate;

[0057] Preferably, the orthographic projection of the touch function layer on the substrate is located within the orthographic projection of the black matrix on the substrate;

[0058] Preferably, the touch function layer includes a first metal layer and a second metal layer stacked sequentially along a direction away from the substrate;

[0059] Preferably, the encapsulation layer includes a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer, which are sequentially stacked along a direction away from the substrate.

[0060] Fourthly, this application provides a display panel, comprising:

[0061] Base;

[0062] A first pixel definition layer is disposed on one side of the substrate. The first pixel definition layer includes a plurality of first pixel openings. The surface of the first pixel definition layer away from the substrate includes a first sub-slope surface facing the first pixel openings. The surface roughness of the first sub-slope surface is less than or equal to 10 nm.

[0063] In one embodiment, the display panel further includes:

[0064] Multiple light-emitting units are disposed on one side of the substrate, and the light-emitting units are at least partially located within the corresponding first pixel opening;

[0065] An encapsulation layer is disposed on the side of the light-emitting unit away from the substrate;

[0066] A color filter layer is disposed on the side of the encapsulation layer away from the substrate. The color filter layer includes a black matrix and color resist units. The black matrix includes a plurality of light-transmitting openings, and the color resist units are at least partially located within the corresponding light-transmitting openings.

[0067] Preferably, the material of the first pixel definition layer includes black photoresist;

[0068] Preferably, the orthographic projection of the first pixel opening on the substrate is located within the orthographic projection of the corresponding light-transmitting opening on the substrate;

[0069] Preferably, the light-emitting unit includes a first electrode, a light-emitting layer, and a second electrode stacked sequentially in a direction away from the substrate, wherein the first electrode is located between the substrate and the first pixel definition layer, and the first electrode is at least partially exposed to the corresponding first pixel opening;

[0070] Preferably, the encapsulation layer includes a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer, which are sequentially stacked along a direction away from the substrate.

[0071] Preferably, the display panel further includes a touch function layer disposed between the encapsulation layer and the color filter layer;

[0072] Preferably, the orthographic projection of the touch function layer on the substrate is located within the orthographic projection of the black matrix on the substrate;

[0073] Preferably, the touch function layer includes a first metal layer and a second metal layer stacked sequentially in a direction away from the substrate.

[0074] Preferably, the ratio of the roughness of the first sub-slope surface to the roughness of the second sub-slope surface is A, and 2≤A≤4;

[0075] Preferably, the roughness of the first sub-slope surface is α, where 2nm ≤ α ≤ 7nm;

[0076] Preferably, the roughness of the second sub-slope surface is b, where 0.5nm ≤ b ≤ 3nm;

[0077] Preferably, the material of the first pixel definition layer includes black photoresist.

[0078] Fifthly, this application provides a display device comprising a display panel prepared by the method described in any of the above embodiments, or comprising the display panel in any of the embodiments of the third or fourth aspect.

[0079] Details of one or more embodiments of this application are set forth in the following drawings and description. Other features, objects, and advantages of this application will become apparent from the specification, drawings, and claims. Attached Figure Description

[0080] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the disclosed drawings without creative effort.

[0081] Figure 1 is a schematic diagram of the structure of a display panel in the related technology.

[0082] Figure 2 is a flowchart of a method for preparing a display panel according to an embodiment of this application.

[0083] Figure 3 is another flowchart of a method for preparing a display panel according to an embodiment of this application.

[0084] Figure 4 is a schematic diagram of the structure of a display panel provided in an embodiment of this application during the manufacturing process.

[0085] Figure 5 is a schematic cross-sectional view of a display panel provided in an embodiment of this application.

[0086] Figure 6 is a schematic cross-sectional view of another display panel provided in an embodiment of this application.

[0087] Figure 7 is a cross-sectional structural diagram of another display panel provided in an embodiment of this application.

[0088] Figure 8 is a cross-sectional structural diagram of another display panel provided in an embodiment of this application.

[0089] Figure 9 is a cross-sectional structural diagram of another display panel provided in an embodiment of this application.

[0090] Figure 10 is a cross-sectional structural diagram of another display panel provided in an embodiment of this application.

[0091] Figure 11 is a roughness comparison diagram of the first sub-slope surface of the first pixel definition layer in the embodiments of this application and related technologies.

[0092] Figure 12 shows the CV curve of one pixel in the scheme of this application and the comparative example.

[0093] Figure 13 shows the CV curves of the R / G / B pixels of the present application scheme and the comparative example.

[0094] Explanation of reference numerals in the attached figures:

[0095] 100. Display panel; 1. Substrate; 2. First pixel definition layer; 20. First pixel opening; 21. First sub-slope surface; 22. First flat surface; 23. Third sub-slope surface; 3. Light-emitting unit; 31. First electrode; 32. Light-emitting layer; 33. Second electrode; 34. First common layer; 35. Second common layer; 4. Encapsulation layer; 41. First inorganic encapsulation layer; 42. Organic encapsulation layer; 43. Second inorganic encapsulation layer; 5. Color filter layer; 51. Black matrix; 510. Light-transmitting opening; 52. Color resist unit; 6. Touch function layer; 61. First metal layer; 62. Second metal layer; 7. Second pixel definition layer; 70. Second pixel opening; 71. Second sub-slope surface; 8. Optical adhesive layer; 9. First pixel definition material layer. Detailed Implementation

[0096] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0097] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0098] In the OLED display industry, COE technology can reduce power consumption (by approximately 30%) and reflectivity (by approximately 6.5%). To reduce the reflectivity of the display, black photoresist is generally used as the pixel defining material. However, since black photoresist contains dye particles, these particles cannot be effectively removed after exposure and development. Therefore, during the fabrication process, an O2 plasma (oxygen plasma treatment) process is typically used to remove photoresist residue (dye particles) from the pixel openings.

[0099] Referring to Figure 1, in the related technology, the display panel 100 includes a substrate 1 and a first pixel definition layer 2. The first pixel definition layer 2 includes a plurality of first pixel openings 20, and the sidewalls of the first pixel openings 20 are first sub-slope surfaces 21. Typically, after the first pixel definition layer 2 is cured, plasma treatment is used to remove residual material from the first pixel openings 20. However, this process damages the first sub-slope surface 21, increasing the roughness of the first pixel definition layer 2 and making its morphology porous and rough. The inventors found that this display panel 100 exhibits severe low-grayscale image retention. Further research revealed that because a rough surface more easily adsorbs charges, the first pixel definition layer 2 easily adsorbs parasitic capacitance in subsequent processes. During display, the cathode above the first sub-slope surface 21 and the anode below it form a capacitor. On the one hand, the rough first sub-slope surface 21 causes significant fluctuations in the capacitor dielectric; on the other hand, the rough surface adsorbs ions (charges) and generates parasitic capacitance. Due to the influence of parasitic capacitance, the image retention level of the display panel decreases.

[0100] In view of the above problems, this application provides a display panel that aims to improve the low grayscale ghosting phenomenon of the display panel.

[0101] In a first aspect, referring to FIG2, an embodiment of this application provides a method for manufacturing a display panel 100, which may be an organic light-emitting diode display panel 100 (OLED) or a quantum dot light-emitting diode display panel 100 (QLED).

[0102] Specifically, the method includes the following steps:

[0103] S10: Provides substrate 1.

[0104] S20: A first pixel definition layer 2 having a plurality of first pixel openings 20 is formed on one side of the substrate 1. Specifically, as shown in FIG4, a first pixel definition material layer 9 is first formed on one side of the substrate 1, and then the first pixel definition material layer 9 is exposed and developed to obtain the first pixel definition layer 2.

[0105] S30: The residual first pixel defining material is removed using a plasma process. The process gas in the plasma process includes a first gas, the atomic mass of which is less than the atomic mass of oxygen. In other words, the atomic mass of the first gas is less than 8; for example, the atomic mass of the first gas can be 1, 4, etc. The first pixel defining material is the material remaining after exposure and development of the first pixel defining material layer 9.

[0106] The aforementioned method for fabricating the display panel 100 reduces residual material within the first pixel opening 20 by employing a plasma process to remove it; in other words, it reduces residual material on the first electrode 31. By using a first gas with a mass smaller than oxygen atoms as the plasma process gas, excessive etching of the sidewalls of the first pixel opening 20 during the plasma process can be avoided. Compared to related technologies, this application reduces the roughness of the sidewalls of the first pixel opening 20, making them smoother and reducing pits. This reduces the dielectric fluctuation between the cathode above the sidewalls of the first pixel opening 20 and the anode below the sidewalls of the first pixel opening 20, reducing parasitic charges in this area and improving the low-grayscale retention phenomenon of the display panel 100. Furthermore, because the sidewalls of the first pixel opening 20 have lower roughness (smoother surface), the residue of ions in the etching solution of subsequent processes on the sidewalls of the first pixel opening 20 is reduced, further improving the low-grayscale retention phenomenon of the display panel 100.

[0107] Here, low grayscale ghosting refers to the phenomenon where, when the image on the display panel 100 changes, the electrodes fail to reach a stable state quickly due to factors such as parasitic capacitance, resulting in the previous frame image remaining in its original position or another position, thus affecting the user's visual experience.

[0108] In one embodiment, the first gas includes an inert gas. By using an inert gas, the safety of the process can be improved; at the same time, it can further reduce the additional impact of impurities.

[0109] In one embodiment, the first gas is one or more of helium and nitrogen.

[0110] It is understandable that the process gas for plasma processing may consist of only the first gas. Furthermore, the first gas may consist of only one type of gas.

[0111] In one example, the first gas is nitrogen. In another example, the first gas is a mixture of helium and nitrogen. In a preferred example, the first gas is helium. This allows for a smaller atomic mass in the first gas, resulting in less etching of the sidewalls of the first pixel opening 20 and improving the roughness of the first pixel opening 20. Furthermore, since helium is relatively inexpensive, the manufacturing cost of the display panel 100 can be reduced.

[0112] The first pixel definition layer 2 includes a first sub-climbing surface 21, which encloses and forms a first pixel opening 20. In other words, the first sub-climbing surface 21 is the sidewall of the first pixel opening 20. The second pixel definition layer 7 includes a second sub-climbing surface 71, which encloses and forms a second pixel opening 70. In other words, the second sub-climbing surface 71 is the sidewall of the second pixel opening 70.

[0113] In the step of removing the residual first pixel definition material using plasma technology, the ratio of the roughness of the first sub-slope surface 21 to the roughness of the second sub-slope surface 71 is A, and 0.6≤A≤12. For example, A can be 0.6, 1.5, 3, 5, 7, 9, 12 or any two of the above values.

[0114] It should be noted that in related technologies, the ratio of the roughness of the first sub-slope surface 21 to the roughness of the second sub-slope surface 71 is usually greater than 12. With the roughness of the second sub-slope surface 71 remaining unchanged, compared to related technologies, the embodiments of this application reduce the roughness of the first sub-slope surface 21.

[0115] The display panel 100 prepared by the above method, by setting the roughness ratio of the first sub-slope surface 21 to the roughness of the second sub-slope surface 71 to A, can reduce the roughness of the first sub-slope surface 21 compared to related technologies. This reduces the fluctuation of the medium between the cathode above the first sub-slope surface 21 and the anode below the first sub-slope surface 21, reduces parasitic charges in this area, and improves the low-grayscale retention phenomenon of the display panel 100. Furthermore, because the roughness of the first sub-slope surface 21 is relatively small (relatively smooth), the residue of ions in the etching solution of subsequent processes on the first sub-slope surface 21 is reduced, parasitic capacitance is reduced, and the low-grayscale retention phenomenon of the display panel 100 is further improved.

[0116] In one embodiment, the ratio of the roughness of the first sub-climbing surface 21 to the roughness of the second sub-climbing surface 71 is A, and 2 ≤ A ≤ 4. Exemplarily, A can be 2, 2.5, 3, 3.5, 4, or any two of the above values. This allows for a smaller roughness of the first sub-climbing surface 21, which is more conducive to reducing parasitic capacitance.

[0117] Preferably, the roughness of the first sub-slope surface 21 is 'a', where 2nm ≤ a ≤ 7nm. For example, 'a' can be 2nm, 4nm, 5nm, 6nm, 7nm, or any two of the above values. This allows for a smaller roughness of the first sub-slope surface 21, which is beneficial for reducing parasitic capacitance.

[0118] Preferably, the roughness of the second sub-slope surface 71 is b, where 0.5 nm ≤ b ≤ 3 nm. For example, b can be 0.5 nm, 1 nm, 1.5 nm, 2 nm, 2.5 nm, 3 nm, or any two of the above values. This allows for a smaller roughness of the second sub-slope surface 71, which is beneficial for forming a common layer and / or cathode with relatively uniform film thickness.

[0119] In one embodiment, the process gas of the plasma process further includes a second gas, the second gas having an atomic mass greater than that of the first gas.

[0120] It should be noted that during the fabrication of the display panel 100, the stage transports the substrate 1 from one device to another. Static electricity is easily generated between the substrate 1 and the stage. The first gas is not easy to remove the static electricity on the substrate 1. By setting the second gas, it is beneficial to remove the static electricity on the substrate 1.

[0121] Preferably, the second gas is oxygen. This allows for better removal of static electricity from the substrate 1. The oxygen plasma neutralizes static electricity through charged particles, thereby reducing the risk of static electricity buildup.

[0122] Preferably, the volumetric flow rate ratio of the first gas and the second gas is C, and 0.5 ≤ C ≤ 2. For example, C can be 0.5, 0.8, 1.2, 1.6, 1.8, 2, or any two of the above values. It should be noted that if C is less than 0.5, the content of the second gas is relatively high, which can easily lead to over-etching of the sidewalls of the first pixel opening 20, resulting in increased roughness; if C is greater than 2, the content of the first gas is relatively high, resulting in poor static electricity removal.

[0123] In one embodiment, the preparation method further includes the following step: after the step of removing the residual first pixel definition material using a plasma process;

[0124] S40: A second pixel definition layer 7 is formed on the side of the first pixel definition layer 2 away from the substrate 1. The second pixel definition layer 7 is provided with a plurality of second pixel openings 70, and the second pixel openings 70 are connected to the corresponding first pixel openings 20.

[0125] In one embodiment, S40: forming a second pixel definition layer 7 on the side of the first pixel definition layer 2 facing away from the substrate 1 includes the following steps:

[0126] S41: A second pixel definition material layer is formed by coating the first pixel definition layer 2 on the side opposite to the substrate 1.

[0127] S42: Expose and develop the second pixel definition material layer to form the second pixel definition layer 7.

[0128] In one embodiment, S30: The residual first pixel definition material is removed using a plasma process. Before this, the process further includes the following steps:

[0129] S25: Perform the first cleaning operation on the remaining first pixel definition material.

[0130] S26: After the first cleaning, perform a curing treatment.

[0131] Thus, before curing the first pixel definition layer 2, the residual first pixel definition material within the first pixel opening 20 is cleaned and removed. This makes the residual first pixel definition material easy to remove, and also removes other impurities remaining within the first pixel opening 20, ensuring the smooth progress of subsequent processes and reducing the impact of residual substances within the first pixel opening 20 on the luminous efficiency of the display panel 100. Therefore, this application utilizes the characteristic of easily removable uncured pixel definition material to improve the luminous efficiency of the display panel 100 and enhance display quality.

[0132] It should be noted that the first pixel defining material layer 9 can be photoresist. Curing can be performed by baking (OVEN), a heat treatment that promotes photoresist curing, makes its chemical structure more stable, improves its resistance in subsequent processes, and prevents deformation or damage to the photoresist in other process steps, thereby ensuring the accuracy of the photolithography pattern. Additionally, during photoresist coating, solvents are used to adjust the viscosity of the photoresist to facilitate uniform coating. Baking allows the solvent to evaporate, enhancing the adhesion between the photoresist and the substrate 1. Cleaning refers to using a cleaning solution or other cleaning medium to clean the first pixel opening 20 to remove residual material within the first pixel opening 20. Of course, removal refers to the desired ideal effect; cleaning may not completely remove all residual material within the first pixel opening 20.

[0133] In one embodiment, S25: Perform a first cleaning operation on the residual first pixel definition material, including the following steps:

[0134] S251: Perform a first cleaning operation using deionized water to remove residual first pixel definition material. Deionized water (DI water, also known as pure water) has high purity and contains virtually no ionic impurities, effectively preventing the introduction of new contaminants during cleaning and ensuring process cleanliness. Before curing, using deionized water removes at least some of the material remaining within the first pixel opening 20.

[0135] In one embodiment, S26: After the first cleaning, a curing process is performed, followed by the following steps:

[0136] S27: Perform a second cleaning operation on the remaining first pixel definition material.

[0137] Thus, after the first pixel definition layer 2 is cured, a secondary cleaning can be performed, which can replace the plasma treatment process in related technologies to ensure the cleanliness of the first pixel opening 20 and avoid the adverse effects of particulate impurities on subsequent processes and product performance.

[0138] Preferably, a stripping solution (STR) is used for a second cleaning operation on the residual material. Using a stripping solution effectively removes residual particles within the first pixel opening 20 with minimal impact on the cured first pixel definition layer 2 located outside the first pixel opening 20. Furthermore, the STR solution significantly reduces the surface roughness of the first pixel definition layer 2, making its surface smoother and flatter, reducing the risk of parasitic charge introduction due to increased roughness, improving the progress bar ghosting of the display panel 100, and thus enhancing the electrical performance of the display panel 100. Progress bar ghosting refers to the phenomenon on a display device where, after a change in the progress bar image, the pixel electrodes fail to quickly reach a stable state due to factors such as parasitic capacitance, causing the previous frame image to remain in its original or other positions, affecting the user's accurate judgment of the progress and visual experience.

[0139] Preferably, the stripping solution includes water, N-methylformamide (NMF), diethylene glycol monomethyl ether (MDG), nitrogen-containing organic compound groups (Amine), and organic amine solvents (such as monoethanolamine).

[0140] Preferably, the water content ranges from 0.004% to 0.008% by mass, the N-methylformamide content ranges from 45% to 55% by mass, the diethylene glycol methyl ether content ranges from 42% to 50% by mass, the amine content ranges from 1.5% to 2.5% by mass, and the organic amine solvent content ranges from 1% to 1.6% by mass.

[0141] Furthermore, the stripping solution may also include iron ions, potassium ions, and sodium ions. Specifically, the concentration range of iron ions is 0.6 μg / ml to 1 μg / ml, the concentration range of potassium ions is 0.3 μg / ml to 0.5 μg / ml, and the concentration range of sodium ions is 0.08 μg / ml to 0.12 μg / ml. In addition, the stripping solution may also contain some impurity particles, with the number of particles ranging from 12 ea / ml to 16 ea / ml.

[0142] In one embodiment, the first pixel defining layer 2 includes black photoresist. When ambient light passes through the color resist unit 52, the first pixel defining layer 2 can absorb light that is not reflected or absorbed by the light-emitting unit 3, thereby reducing reflected light and improving the contrast of the displayed image on the display panel 100. Furthermore, as a light-blocking layer, the first pixel defining layer 2 prevents light leakage between sub-pixels, ensuring independent and accurate light emission from each pixel, and improving image edge sharpness and text clarity.

[0143] In one embodiment, S20: forming a first pixel definition layer 2 having a plurality of first pixel openings 20 on one side of the substrate 1 includes the following steps:

[0144] S21: A black photoresist layer is coated on one side of substrate 1 to form a black photoresist layer.

[0145] S22: Expose and develop the black photoresist layer. This allows for the convenient acquisition of the first pixel definition layer 2.

[0146] In one embodiment, the material of the first pixel defining layer 2 includes black photoresist. The material of the second pixel defining layer 7 includes photoresist, and the transmittance of the first pixel defining layer 2 is less than the transmittance of the second pixel defining layer 7. The material of the second pixel defining layer 7 includes photoresist. The difference between black photoresist and photoresist lies in whether black pigments or dyes (such as carbon black or organic black dyes) are added. Adding black pigments or dyes results in black photoresist, while not adding black pigments or dyes results in photoresist.

[0147] Secondly, as shown in Figure 3, this application embodiment provides another method for manufacturing a display panel 100, including the following steps:

[0148] S100: Provides a substrate 1.

[0149] S200: A first pixel definition layer 2 with a plurality of first pixel openings 20 is formed on one side of the substrate 1.

[0150] S300: Perform the first cleaning operation on the residual first pixel definition material within the first pixel opening 20.

[0151] S400: After the first cleaning operation, the first pixel definition layer 2 is solidified.

[0152] In the above-described method for manufacturing the display panel 100, before curing the first pixel definition layer 2, the residual first pixel definition material within the first pixel opening 20 is cleaned and removed. Utilizing the easily removable nature of the uncured first pixel definition material, other impurities remaining within the first pixel opening 20 are also removed, ensuring the smooth progress of subsequent processes and reducing the impact of residual substances within the first pixel opening 20 on the luminous efficiency of the display panel 100. Therefore, by utilizing the easily removable nature of the uncured pixel definition material, this application can improve the luminous efficiency of the display panel 100 and enhance display quality.

[0153] Specifically, the first pixel defining material can be photoresist, and the patterning process can be photolithography (PHO), forming a pattern with a first pixel opening 20 on the substrate 1. The first pixel opening 20 has a bottom wall and sidewalls, with the sidewalls inclined relative to the bottom wall, forming a first sub-slope surface 21. The curing process can be baking (OVEN), a heat treatment that promotes the curing of the photoresist, making its chemical structure more stable, improving its resistance in subsequent processes, and preventing deformation or damage to the photoresist in other process steps, thereby ensuring the accuracy of the photolithographic pattern. Additionally, during the photoresist coating process, solvents are used to adjust the viscosity of the photoresist to facilitate uniform coating. Baking allows the solvent to evaporate, enhancing the adhesion between the photoresist and the substrate 1.

[0154] It should be noted that cleaning the residual first pixel definition material within the first pixel opening 20 refers to using a cleaning solution or other cleaning medium to clean the first pixel opening 20 to remove the residual first pixel definition material. Of course, removal is the desired outcome; the cleaning operation may not completely remove all the residual first pixel definition material within the first pixel opening 20.

[0155] In one embodiment, S300: A first cleaning operation is performed on the residual first pixel definition material within the first pixel opening 20, including the following steps:

[0156] S310: Use deionized water to perform the first cleaning operation on the residual first pixel definition material in the first pixel opening 20.

[0157] Deionized water (DI water), also known as pure water, has high purity and contains almost no ionic impurities. This effectively prevents the introduction of new contaminants during the cleaning process, ensuring the cleanliness of the process. Before curing, using deionized water can remove at least some of the first pixel defining material, such as photoresist, remaining within the first pixel opening 20.

[0158] In one embodiment, S400: After the first cleaning operation, the first pixel definition layer 2 is cured, and then the preparation method includes the following steps:

[0159] S500: Perform a second cleaning operation on the residual first pixel definition material within the first pixel opening 20.

[0160] In one embodiment, a stripping solution is used to perform a second cleaning operation on the residual first pixel definition material within the first pixel opening 20. The stripping solution (STR solution) is used to perform the second cleaning operation on the residual pixel definition material within the pixel opening 20.

[0161] Preferably, after the second cleaning operation, the roughness of the first sub-slope surface 21 located within the first pixel opening 20 on the surface of the first pixel definition layer 2 away from the substrate 1 includes 3nm-10nm. For example, the roughness can be 3nm, 4nm, 5nm, 6nm, 7nm, 8nm, 9nm, or 10nm, etc.

[0162] In this process, a secondary cleaning is performed after the first pixel definition layer 2 has cured. This can replace the plasma treatment process in related technologies to ensure the cleanliness of the first pixel opening 20 and avoid the adverse effects of particulate impurities on subsequent processes and product performance. Specifically, a stripping solution is used for cleaning. On the one hand, it can effectively remove residual particles inside the first pixel opening 20 and has minimal impact on the cured first pixel definition layer 2 located outside the first pixel opening 20. On the other hand, the stripping solution can significantly reduce the surface roughness of the first pixel definition layer 2, making the surface of the first pixel definition layer 2 smoother and flatter, reducing the risk of parasitic charge introduction caused by increased roughness, improving the progress bar ghosting of the display panel 100, and thus improving the electrical performance of the display panel 100.

[0163] In one embodiment, the first pixel defining material includes photoresist.

[0164] In one embodiment, S200: forming a first pixel definition layer 2 having a plurality of first pixel openings 20 on one side of the substrate 1, including:

[0165] S210: Coating, exposing, and developing photoresist.

[0166] Photoresist is a photosensitive material whose properties allow for chemical changes during light exposure, thereby enabling pattern transfer. In this embodiment, the patterning process is photolithography, which includes:

[0167] Coating: Photoresist is uniformly coated on the surface of substrate 1.

[0168] Exposure: Using light of a specific wavelength (such as ultraviolet light) to illuminate the photoresist through a mask with a pre-designed pattern, the light shines through the transparent area of ​​the mask onto the photoresist, causing the photoresist to undergo a photochemical reaction in these areas.

[0169] Development: After exposure, the exposed and unexposed areas of the photoresist have different chemical properties. The unwanted parts of the photoresist are removed by the developer, leaving a photoresist pattern that is the same as the mask pattern. For example, multiple first pixel openings 20 are formed in the first pixel definition layer 2.

[0170] In one embodiment, S400: After the first cleaning operation, a curing treatment is performed, and then the preparation method includes the following steps:

[0171] S600: A plurality of light-emitting units 3 are formed, and the light-emitting units 3 are at least partially located in the corresponding first pixel opening 20.

[0172] S700: An encapsulation layer 4 is formed on the side of the light-emitting unit 3 away from the substrate 1.

[0173] S800: A color filter layer 5 is formed on the side of the encapsulation layer 4 away from the substrate 1. The color filter layer 5 includes a black matrix 51 and color resist units 52. The black matrix 51 includes a plurality of light-transmitting openings 510. The color resist units 52 are at least partially located within the corresponding light-transmitting openings 510.

[0174] Preferably, the orthographic projection of the first pixel opening 20 on the substrate 1 is located within the orthographic projection of the corresponding light-transmitting opening 510 on the substrate 1.

[0175] Specifically, a black matrix 51 can be formed on the side of the encapsulation layer 4 away from the substrate 1, and then color resist units 52 can be formed within the light-transmitting openings 510 of the black matrix 51. The color resist units 52 act as color filters, filtering the light emitted by the corresponding light-emitting units 3. Different color resist units 52 can be configured as needed, so that the light emitted from the corresponding area of ​​each color resist unit 52 is of a certain type. For example, a color resist unit 52 that only allows red light to pass through can be configured, and the light emitted from the corresponding area of ​​this color resist unit 52 will be red light. The black matrix 51 uses a light-absorbing material. When ambient light is incident on the display panel 100, the black matrix 51 can absorb the externally incident light to reduce the reflection intensity of the display panel 100 to ambient light, thereby improving display performance.

[0176] Specifically, each first pixel opening 20 on the first pixel definition layer 2 defines a sub-pixel area. A light-emitting unit 3 corresponding to each first pixel opening 20 corresponds to one sub-pixel. Typically, three types of sub-pixels—R, G, and B—are used to emit red, green, and blue light, respectively. In the thickness direction of the display panel 100, the light-transmitting opening 510 is positioned directly opposite the first pixel opening 20, thereby allowing light emitted from the light-emitting unit 3 to pass through the corresponding light-transmitting opening 510.

[0177] Optionally, the light-emitting unit 3 corresponds one-to-one with the color resist unit 52. Alternatively, adjacent light-emitting units 3 emitting the same color share the same color resist unit 52.

[0178] Preferably, the first pixel defining material includes black photoresist, which is a light-absorbing material. When ambient light passes through the color resist unit 52, the first pixel defining layer 2 can absorb light that is not reflected or absorbed by the light-emitting unit 3, thereby reducing reflected light and improving the contrast of the displayed image on the display panel 100. Furthermore, as a light-blocking layer, the first pixel defining layer 2 prevents light leakage between sub-pixels, ensuring independent and accurate light emission from each pixel, and improving image edge sharpness and text clarity.

[0179] Specifically, the encapsulation layer 4 covers multiple light-emitting units 3, and the color filter layer 5 is located on the side of the encapsulation layer 4 facing away from the substrate 1. The light-emitting units 3 are sensitive to environmental factors such as moisture and oxygen. The encapsulation layer 4 can block moisture and air, thereby ensuring the performance reliability of the display panel 100. In addition, the color filter layer 5 does not require isolation from moisture and oxygen, so it can be located on the side of the encapsulation layer 4 facing away from the substrate 1.

[0180] Specifically, the encapsulation layer 4 includes a first inorganic encapsulation layer 41, an organic encapsulation layer 42, and a second inorganic encapsulation layer 43 stacked together. The organic encapsulation layer 42 has a large thickness and a planarization function, while the first inorganic encapsulation layer 41 and the second inorganic encapsulation layer 43 have high density and can isolate water and oxygen.

[0181] In one embodiment, S800: Forming a color filter layer 5 on the side of the encapsulation layer 4 away from the substrate 1 includes the following steps:

[0182] S810: A touch function layer 6 is formed on the side of the encapsulation layer 4 away from the substrate 1.

[0183] S820: A color filter layer 5 is formed on the side of the touch function layer 6 away from the substrate 1.

[0184] Preferably, the orthographic projection of the touch function layer 6 onto the substrate 1 is located within the orthographic projection of the black matrix 51 onto the substrate 1.

[0185] Preferably, the orthographic projection of the touch function layer 6 on the substrate 1 is located within the orthographic projection of the black matrix 51 on the substrate 1.

[0186] Specifically, the display panel 100 integrates a touch function, which can sense the user's touch operation through the touch function layer 6 and convert the sensed touch operation into an electrical signal and transmit it to the driving circuit on the substrate 1.

[0187] Optionally, the touch function layer 6 includes a first metal layer 61 and a second metal layer 62 stacked sequentially along the direction away from the substrate 1, and the touch function layer 6 can be a multi-layer structure.

[0188] In other embodiments, the touch function layer 6 may also be a single-layer structure.

[0189] The touch function layer 6 can be directly fabricated on the encapsulation layer 4 to reduce the overall thickness of the display panel 100. A protective layer, specifically an OC protective layer, can be provided on the side of the color filter layer 5 away from the substrate 1. The protective layer covers and protects the color filter layer 5.

[0190] In other embodiments, a buffer layer may be provided between the touch function layer 6 and the encapsulation layer 4.

[0191] Thirdly, referring to Figures 5 and 6, this application embodiment provides a display panel 100, including a substrate 1, a first pixel definition layer 2, and a second pixel definition layer 7. The first pixel definition layer 2 is disposed on one side of the substrate 1, and has a plurality of first pixel openings 20. The first pixel definition layer 2 includes a first sub-slope surface 21, which surrounds and forms the first pixel opening 20; in other words, the first sub-slope surface 21 is the sidewall of the first pixel opening 20. The second pixel definition layer 7 is disposed on the side of the first pixel definition layer 2 away from the substrate 1, and has a plurality of second pixel openings 70, which are connected to the corresponding first pixel openings 20. The second pixel definition layer 7 includes a second sub-slope surface 71, which surrounds and forms the second pixel opening 70; in other words, the second sub-slope surface 71 is the sidewall of the second pixel opening 70.

[0192] The ratio of the roughness of the first sub-slope surface 21 to the roughness of the second sub-slope surface 71 is A, and 0.6 ≤ A ≤ 12. For example, A can be 0.6, 1.5, 3, 5, 7, 9, 12 or any two of the above values.

[0193] It should be noted that in related technologies, the ratio of the roughness of the first sub-slope surface 21 to the roughness of the second sub-slope surface 71 is usually greater than 12. With the roughness of the second sub-slope surface 71 remaining unchanged, compared to related technologies, the embodiments of this application reduce the roughness of the first sub-slope surface 21.

[0194] The aforementioned display panel 100, by setting the roughness ratio of the first sub-slope surface 21 to the second sub-slope surface 71 to be A, reduces the roughness of the first sub-slope surface 21 compared to related technologies. This reduces the dielectric fluctuation between the cathode above the first sub-slope surface 21 and the anode below the first sub-slope surface 21, decreases parasitic charges in this area, and improves the low-grayscale retention phenomenon of the display panel 100. Furthermore, because the roughness of the first sub-slope surface 21 is relatively small (smoother), the residue of ions in the etching solution of subsequent processes on the first sub-slope surface 21 is reduced, parasitic capacitance is reduced, and the low-grayscale retention phenomenon of the display panel 100 is further improved.

[0195] In one embodiment, the ratio of the roughness of the first sub-climbing surface 21 to the roughness of the second sub-climbing surface 71 is A, and 2 ≤ A ≤ 4. Exemplarily, A can be 2, 2.5, 3, 3.5, 4, or any two of the above values. This allows for a smaller roughness of the first sub-climbing surface 21, which is more conducive to reducing parasitic capacitance.

[0196] Preferably, the roughness of the first sub-slope surface 21 is 'a', where 2nm ≤ a ≤ 7nm. For example, 'a' can be 2nm, 4nm, 5nm, 6nm, 7nm, or any two of the above values. This allows for a smaller roughness of the first sub-slope surface 21, which is beneficial for reducing parasitic capacitance.

[0197] Preferably, the roughness of the second sub-slope surface 71 is b, where 0.5 nm ≤ b ≤ 3 nm. For example, b can be 0.5 nm, 1 nm, 1.5 nm, 2 nm, 2.5 nm, 3 nm, or any two of the above values. This allows for a smaller roughness of the second sub-slope surface 71, which is beneficial for forming a common layer and / or cathode with relatively uniform film thickness.

[0198] Preferably, the transmittance of the first pixel definition layer 2 is less than the transmittance of the second pixel definition layer 7.

[0199] Preferably, the material of the first pixel definition layer 2 includes black photoresist. The material of the second pixel definition layer 7 includes photoresist. The difference between black photoresist and photoresist is whether black pigment or dye (such as carbon black or organic black dye) is added. If black pigment or dye is added, it is black photoresist; if no black pigment or dye is added, it is photoresist.

[0200] In one embodiment, as shown in FIG6, the orthographic projection of the first sub-climbing surface 21 on the substrate 1 is outside the orthographic projection of the second pixel definition layer 7 on the substrate 1, and the orthographic projection of the first sub-climbing surface 21 on the substrate 1 is connected to the orthographic projection of the second pixel definition layer 7 on the substrate 1. In other words, the second pixel definition layer 7 is located above the first pixel definition layer 2, the second pixel definition layer 7 does not cover the first sub-climbing surface 21, and the second pixel definition layer 7 is connected to the first sub-climbing surface 21. In this way, the opening of the second pixel opening 70 can be made larger, which is beneficial to the light emission unit 3 under a wide viewing angle and improves the display effect under a wide viewing angle.

[0201] Preferably, the first pixel definition layer 2 further includes a first flat surface 22, and the second pixel definition layer 7 covers the first flat surface 22. In other words, in the embodiment of FIG6, the side of the first pixel definition layer 2 facing away from the substrate 1 includes only the first flat surface 22 and the first sub-slope surface 21.

[0202] Preferably, the roughness of the first flat surface 22 is equal to the roughness of the first sub-slope surface 21.

[0203] Preferably, the orthographic projection of the first sub-climbing surface 21 on the base 1 is connected to the orthographic projection of the second sub-climbing surface 71 on the base 1. In other words, the second sub-climbing surface 71 does not cover the first sub-climbing surface 21, and the orthographic projection of the second sub-climbing surface 71 is connected to the orthographic projection of the first sub-climbing surface 21.

[0204] Preferably, the end of the second sub-climbing surface 71 closest to the base 1 is connected to the end of the first sub-climbing surface 21 furthest from the base 1. Here, "connection" means that the two are directly connected.

[0205] Preferably, as shown in FIG6, in the orthographic projection of the first sub-climbing surface 21 onto the substrate 1, the distance between the end of the orthographic projection near the center of the first pixel opening 20 and the end of the orthographic projection away from the center of the first pixel opening 20 is h1, and 2μm≤h1≤6μm. For example, h1 can be 2μm, 3μm, 4μm, 5μm, 6μm, or any two of the above values. This is beneficial for making the opening of the first pixel opening 20 larger, which is beneficial for the light-emitting unit 3 to emit light at a wide viewing angle, thus improving the display effect at a wide viewing angle.

[0206] In one embodiment, as shown in FIG5, the first pixel definition layer 2 further includes a first flat surface 22 and a third sub-climbing surface 23. The first flat surface 22 is disposed on the side of the first pixel definition layer 2 facing away from the substrate 1, and the third sub-climbing surface 23 connects the first flat surface 22 and the first sub-climbing surface 21. The orthographic projection of the second pixel definition layer 7 on the substrate 1 covers the orthographic projection of the first flat surface 22 on the substrate 1, as well as the orthographic projection of the third sub-climbing surface 23 on the substrate 1. In other words, the first sub-climbing surface 21 and the third sub-climbing surface 23 are both climbing surfaces on the first pixel definition layer 2. The second pixel definition layer 7 covers a portion of the climbing surface of the first pixel definition layer 2, which helps to make the area of ​​the first sub-climbing surface 21 smaller, reducing ion adsorption, thereby further reducing parasitic capacitance.

[0207] Preferably, the ratio of the roughness of the third sub-slope surface 23 to the roughness of the second sub-slope surface 71 is B, and 0.6 ≤ B ≤ 12. For example, B can be 0.6, 1.5, 3, 4, 5, 7, 9, 12 or between any two of the above values.

[0208] Preferably, the ratio of the roughness of the third sub-slope surface 23 to the roughness of the second sub-slope surface 71 is B, and 2 ≤ B ≤ 4. For example, B can be 2, 2.5, 3, 3.5, 4, or any two of the above values. This allows for a smaller roughness of the third sub-slope surface 23, which is more conducive to reducing parasitic capacitance.

[0209] Preferably, the roughness of the third sub-slope surface 23 is equal to the roughness of the first sub-slope surface 21.

[0210] Preferably, the roughness of the third sub-slope surface 23 is c, and 2nm ≤ c ≤ 7nm. For example, c can be 2nm, 4nm, 5nm, 6nm, 7nm, or any two of the above values. This allows for a smaller roughness of the third sub-slope surface 23, which is beneficial for forming a common layer and / or cathode with relatively uniform film thickness.

[0211] Preferably, as shown in FIG5, along a direction parallel to the plane of the substrate 1, the distance between the end of the third sub-climbing surface 23 near the first flat surface 22 and the end of the first sub-climbing surface 21 near the center of the first pixel opening 20 is h2, and 9μm≤h2≤30μm. For example, h2 can be 9μm, 15μm, 25μm, 30μm, or any two of the above values. This allows for a larger opening in the first pixel opening 20, which is beneficial for the light-emitting unit 3 to emit light at a wide viewing angle, thus improving the display effect at a wide viewing angle.

[0212] In one embodiment, as shown in FIG7, the display panel 100 further includes a light-emitting device layer disposed on one side of the substrate 1. The light-emitting device layer includes a plurality of light-emitting units 3 disposed corresponding to the first pixel opening 20 and the second pixel opening 70. At least a portion of each light-emitting unit 3 is disposed within the corresponding first pixel opening 20 and the second pixel opening 70; in other words, one light-emitting unit 3 corresponds to one first pixel opening 20 and one second pixel opening 70, and the light-emitting unit 3 is located in the corresponding first pixel opening 20 and the second pixel opening 70. The light-emitting unit 3 includes a first electrode 31, a light-emitting layer 32, and a second electrode 33 stacked along the direction away from the substrate 1. The first pixel definition layer 2 covers the edge region of the first electrode 31, and the first pixel opening 20 exposes the central region of the first electrode 31; the light-emitting layer 32 covers the first sub-slope surface 21 and the second sub-slope surface 71. Exemplarily, the first electrode 31 is an anode, and the second electrode 33 is a cathode.

[0213] Preferably, the light-emitting unit 3 further includes a first common layer 34, which is disposed between the light-emitting layer 32 and the first electrode 31. Exemplarily, the first common layer 34 may include a hole injection layer, a hole transport layer, etc.

[0214] Preferably, the light-emitting unit 3 further includes a second common layer 35, which is disposed between the light-emitting layer 32 and the second electrode 33. Exemplarily, the second common layer 35 may include an electron injection layer and an electron transport layer.

[0215] Preferably, the orthographic projection of the first sub-climbing surface 21 onto the substrate 1 at least partially covers the orthographic projection of the corresponding first electrode 31 onto the substrate 1; in other words, a portion of the structure of the first electrode 31 is located below the first sub-climbing surface 21.

[0216] Preferably, the display panel 100 further includes an encapsulation layer 4, which is disposed on the side of the light-emitting device layer away from the substrate 1.

[0217] Preferably, the display panel 100 further includes a color filter layer 5, which includes a plurality of color resist units 52. The color resist units 52 are correspondingly disposed with respect to the first pixel opening 20 and the second pixel opening 70; in other words, one color resist unit 52 corresponds to one first pixel opening 20 and one second pixel opening 70. The color resist units 52 are located above the corresponding first pixel opening 20 and second pixel opening 70.

[0218] Preferably, the color filter layer 5 further includes a black matrix 51, which includes a plurality of light-transmitting openings 510. The light-transmitting openings 510 are correspondingly disposed with respect to the first pixel opening 20 and the second pixel opening 70. Color resist units 52 are correspondingly disposed with respect to the light-transmitting openings 510, and the color resist units 52 are at least partially disposed within the corresponding light-transmitting openings 510. In other words, one light-transmitting opening 510 corresponds to one first pixel opening 20 and one second pixel opening 70. The light-transmitting openings 510 are located above the corresponding first pixel opening 20 and second pixel opening 70.

[0219] Preferably, the display panel 100 further includes a touch function layer 6, which is disposed on the side of the color filter layer 5 facing the substrate 1.

[0220] Preferably, the orthographic projection of the touch functional layer 6 onto the substrate 1 lies within the orthographic projection of the black matrix 51 onto the substrate 1. This prevents the touch functional layer 6 from affecting the light emission of the light-emitting unit 3.

[0221] Preferably, the touch function layer 6 includes a first metal layer 61 and a second metal layer 62 sequentially stacked along a direction away from the substrate 1. For example, the first metal layer 61 may be a touch electrode layer, and the second metal layer 62 may be a bridging layer.

[0222] Preferably, the encapsulation layer 4 includes a first inorganic encapsulation layer 414, an organic encapsulation layer 424, and a second inorganic encapsulation layer 434, which are sequentially stacked along the direction away from the substrate 1.

[0223] Preferably, the display panel 100 further includes an optical adhesive layer 8, which is disposed on the side of the color filter layer 5 away from the substrate 1.

[0224] Fourthly, referring to Figures 8, 9, and 10, an embodiment of this application provides a display panel 100, including a substrate 1 and a first pixel definition layer 2. The first pixel definition layer 2 is disposed on one side of the substrate 1, and the first pixel definition layer 2 includes a plurality of first pixel openings 20; the surface of the first pixel definition layer 2 away from the substrate 1 includes a first sub-slope surface 21 facing the first pixel openings 20, and the surface roughness of the first sub-slope surface 21 is less than or equal to 10 nm.

[0225] It should be noted that the cathode above the first sub-slope surface 21 and the anode below the first sub-slope surface 21 are equivalent to the upper and lower substrates of the capacitor structure. In the aforementioned display panel 100, by making the roughness of the first sub-slope surface 21 less than or equal to 10 nm, compared to related technologies, the roughness of the first sub-slope surface 21 is reduced, thereby reducing the dielectric fluctuation between the cathode above the first sub-slope surface 21 and the anode below the first sub-slope surface 21, reducing parasitic charges in this area, and improving the low-grayscale retention phenomenon of the display panel 100. Furthermore, because the roughness of the first sub-slope surface 21 is relatively small (relatively smooth), the residue of ions in the etching solution of subsequent processes on the first sub-slope surface 21 is reduced, further improving the low-grayscale retention phenomenon of the display panel 100, thus enhancing product competitiveness.

[0226] In one embodiment, the display panel 100 further includes a plurality of light-emitting units 3, an encapsulation layer 4, and a color filter layer 5. The plurality of light-emitting units 3 are disposed on one side of the substrate 1, with each light-emitting unit 3 at least partially located within a corresponding first pixel opening 20. The encapsulation layer 4 is disposed on the side of the light-emitting units 3 away from the substrate 1. The color filter layer 5 is disposed on the side of the encapsulation layer 4 away from the substrate 1, and the color filter layer 5 includes a black matrix 51 and color resist units 52. The black matrix 51 includes a plurality of light-transmitting openings 510, and the color resist units 52 are at least partially located within corresponding light-transmitting openings 510.

[0227] Specifically, the encapsulation layer 4 covers multiple light-emitting units 3, and the color filter layer 5 is located on the side of the encapsulation layer 4 facing away from the substrate 1. The light-emitting units 3 are highly sensitive to environmental factors such as moisture and oxygen. The encapsulation layer 4 can block moisture and air, thereby ensuring the performance reliability of the display panel 100. In addition, the color filter layer 5 does not require isolation from moisture and oxygen, so it can be located on the side of the encapsulation layer 4 facing away from the substrate 1.

[0228] Preferably, the surface roughness of the first pixel defining layer 2 on the side away from the substrate 1 is d, and 3nm≤d≤10nm; for example, the roughness can be 3nm, 4nm, 5nm, 6nm, 7nm, 8nm, 9nm or 10nm, etc.

[0229] Preferably, the orthographic projection of the first pixel opening 20 onto the substrate 1 lies within the orthographic projection of the corresponding light-transmitting opening 510 onto the substrate 1. This ensures that most of the light emitted by the light-emitting unit 3 can pass through the color-blocking unit 52.

[0230] Preferably, the light-emitting unit 3 includes a first electrode 31, a light-emitting layer 32 and a second electrode 33 stacked sequentially in a direction away from the substrate 1. The first electrode 31 is located between the substrate 1 and the first pixel definition layer 2, and the first electrode 31 is at least partially exposed to the corresponding first pixel opening 20.

[0231] Preferably, the encapsulation layer 4 includes a first inorganic encapsulation layer 41, an organic encapsulation layer 42, and a second inorganic encapsulation layer 43, which are sequentially stacked along the direction away from the substrate 1.

[0232] Preferably, the display panel 100 further includes a touch function layer 6, which is disposed between the encapsulation layer 4 and the color filter layer 5;

[0233] Preferably, the orthographic projection of the touch function layer 6 onto the substrate 1 lies within the orthographic projection of the black matrix 51 onto the substrate 1;

[0234] Preferably, the touch function layer 6 includes a first metal layer 61 and a second metal layer 62 stacked sequentially along the direction away from the substrate 1.

[0235] In one embodiment, the display panel 100 further includes a second pixel definition layer 7 located on the side of the first pixel definition layer 2 away from the substrate 1; the second pixel definition layer 7 is provided with a plurality of second pixel openings 70, and the second pixel openings 70 are connected to the corresponding first pixel openings 20; the second pixel definition layer 7 includes a second sub-slope surface 71, and the second sub-slope surface 71 surrounds to form the second pixel opening 70; wherein, the ratio of the roughness of the first sub-slope surface 21 to the roughness of the second sub-slope surface 71 is A, and 0.6≤A≤12;

[0236] Preferably, the ratio of the roughness of the first sub-slope surface 21 to the roughness of the second sub-slope surface 71 is A, and 2 ≤ A ≤ 4; for example, A can be 2, 2.5, 3, 3.5, 4, or any two of the above values. In this way, the roughness of the first sub-slope surface 21 can be smaller, which is more conducive to reducing parasitic capacitance.

[0237] Preferably, the roughness of the first sub-slope surface 21 is 'a', where 2nm ≤ a ≤ 7nm; for example, 'a' can be 2nm, 4nm, 5nm, 6nm, 7nm, or any two of the above values. This allows for a smaller roughness of the first sub-slope surface 21, which helps reduce parasitic capacitance.

[0238] Preferably, the roughness of the second sub-slope surface 71 is b, where 0.5 nm ≤ b ≤ 3 nm; for example, b can be 0.5 nm, 1 nm, 1.5 nm, 2 nm, 2.5 nm, 3 nm, or between any two of the above values. In this way, the roughness of the second sub-slope surface 71 can be relatively small, which is beneficial for forming a common layer and / or cathode with a relatively uniform film thickness.

[0239] Preferably, the transmittance of the first pixel definition layer 2 is less than the transmittance of the second pixel definition layer 7;

[0240] Preferably, the material of the first pixel definition layer 2 includes black photoresist, which is a light-absorbing material. When ambient light passes through the color resist unit 52, the first pixel definition layer 2 can absorb light that is not reflected or absorbed by the light-emitting unit 3, thereby reducing reflected light and improving the contrast of the displayed image on the display panel 100. Furthermore, as a light-blocking layer, the first pixel definition layer 2 prevents light leakage between sub-pixels, ensuring independent and accurate light emission from each pixel, and improving image edge sharpness and text clarity.

[0241] Fifthly, this application provides a display device comprising a display panel prepared by the method of any of the above embodiments, or comprising the display panel in any of the embodiments of the third or fourth aspects.

[0242] The display device can be a portable electronic device such as a mobile phone, smartphone, tablet PC, mobile communication terminal, e-notebook, e-reader, portable multimedia player (PMP), navigation device, and ultra-mobile PC (UMPC). In embodiments, for example, the display device can be a display unit of a television, laptop computer, monitor, billboard, or Internet of Things (IoT) device. In embodiments, for example, the display device can be a wearable device such as a smartwatch, watch phone, glasses display, and head-mounted display (HMD).

[0243] Referring to Figures 11 and 12 and Table 1 below, the inventors conducted experimental verification for one embodiment of this application and related technologies (comparative examples). Figure 11(a) shows the morphology of the roughness of the first sub-slope surface (oxygen plasma treatment) measured using atomic force microscopy (AFM) in the related technology. Figure 11(b) shows the morphology of the roughness of the first sub-slope surface treated with plasma technology (helium) measured using atomic force microscopy (AFM) in the embodiment of this application. The CV curve in Figure 12 is a capacitance-voltage curve, with the vertical axis representing capacitance and the horizontal axis representing voltage, used to characterize the relationship between the capacitance characteristics of a material or device and voltage; it illustrates the capacitance-voltage comparison curve of one pixel. In Table 1 below, JND is the difference perception threshold, used as a unit to measure the degree of progress bar ghosting. RMS (root mean square roughness) refers to the root mean square value of the surface profile deviating from the average line, used to quantify surface roughness.

[0244] Table 1

[0245] Specifically, according to Table 1 and Figure 12, the roughness value RMS of the ramp surface in the comparative example is 13.5 nm; the roughness value RMS of the first sub-ramp surface in the present application is 6.25 nm. Compared with the comparative example, the present application can significantly reduce the roughness of the first sub-ramp surface of the first pixel definition layer.

[0246] Furthermore, the progress bar ghosting in the comparative example is 13.4 JND for T0 seconds and 5.6 JND for T10 seconds; the progress bar ghosting in this application is 1.9 JND for T0 seconds and 1.2 JND for T10 seconds. The ghosting situation is significantly improved, enhancing product competitiveness. Therefore, compared to the comparative example, the solution in this application can improve the low-grayscale ghosting situation.

[0247] Meanwhile, the capacitance value of the comparative method is larger under different voltages, while the capacitance value of the scheme in this application is significantly smaller, which can reduce parasitic capacitance.

[0248] Furthermore, referring to Figure 13 and Table 2 below, the inventors conducted experimental verification for another embodiment of this application and related technologies (comparative examples). The process flow of the comparative example is: patterning → curing → ashing (oxygen plasma treatment). The process flow of the solution in this application is: patterning → cleaning → curing → wet peeling (STR chemical cleaning). The three sets of curves in Figure 13 are the capacitance-voltage comparison curves of R-pixel, G-pixel, and B-pixel, respectively. R-pixel, G-pixel, and B-pixel correspond to light-emitting units with emission colors of red, green, and blue, respectively. In the table below, JND is the difference perception threshold, used as a unit to measure the degree of progress bar afterimage. RMS root mean square roughness refers to the root mean square value of the surface profile deviating from the average line, used to quantify surface roughness.

[0249] Table 2

[0250] Specifically, the RMS roughness of the first sub-slope surface of the first pixel definition layer in the comparative example is 11.2 nm; the RMS roughness of the first sub-slope surface of the first pixel definition layer in this application is 5.23 nm. Compared with the comparative example, the solution in this application can significantly reduce the roughness of the first sub-slope surface of the first pixel definition layer.

[0251] Furthermore, the progress bar ghosting in the comparative example is 13.4 JND at T0 seconds and 5.6 JND at T10 seconds; the progress bar ghosting in this application is 1.54 JND at T0 seconds and 1.05 JND at T10 seconds, showing a significant improvement in ghosting performance and enhancing product competitiveness. Therefore, compared to the comparative example, this application's solution can improve low-grayscale ghosting performance.

[0252] Finally, judging from the CV curves of the R / G / B pixels in Figure 13, the capacitance value of the comparative example is larger, while the capacitance value of the scheme in this application is significantly smaller, which can reduce parasitic capacitance.

[0253] In the above embodiments, the roughness is the root mean square roughness obtained by AFM testing, which refers to the root mean square value of the surface profile deviating from the average line and can be used to quantify surface roughness.

[0254] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0255] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A method for manufacturing a display panel, wherein, include: Provide a base; A first pixel definition layer with multiple first pixel openings is formed on one side of the substrate; The residual first pixel definition material is removed using a plasma process; wherein the process gas of the plasma process includes a first gas, the atomic mass of which is less than the atomic mass of oxygen.

2. The method for manufacturing a display panel according to claim 1, wherein, The first gas includes an inert gas; Alternatively, the first gas may be one or more of helium and nitrogen.

3. The method for manufacturing a display panel according to claim 2, wherein, The process gas for the plasma process also includes a second gas, the atomic mass of which is greater than that of the first gas.

4. The method for manufacturing a display panel according to claim 1, wherein, After the step of removing the residual first pixel definition material using plasma technology; it further includes: A second pixel definition layer is formed on the side of the first pixel definition layer opposite to the substrate. The second pixel definition layer has a plurality of second pixel openings, and the second pixel openings are connected to the corresponding first pixel openings.

5. The method for manufacturing a display panel according to any one of claims 1-4, wherein, Before the step of removing residual first pixel definition material using plasma technology, the following steps are included: Perform the first cleaning operation on the remaining first pixel definition material; After the first cleaning, it is subjected to a curing process.

6. The method for manufacturing a display panel according to any one of claims 1-4, wherein, The first pixel definition layer includes black photoresist; The step of forming a first pixel definition layer having a plurality of first pixel openings on one side of the substrate includes: A black photoresist layer is coated on one side of the substrate to form a black photoresist layer; The black photoresist layer is exposed and developed.

7. A method for manufacturing a display panel, wherein, include: Provide a base; A first pixel definition layer with multiple first pixel openings is formed on one side of the substrate; A first cleaning operation is performed on the first pixel definition material remaining in the first pixel opening; After the first cleaning operation, the first pixel definition layer is solidified.

8. The method for manufacturing a display panel as described in claim 7, wherein, The first cleaning operation on the residual first pixel definition material within the first pixel opening includes: The first cleaning operation was performed using deionized water to clean the residual first pixel definition material inside the first pixel opening.

9. The method for manufacturing a display panel as described in claim 8, wherein, After the first cleaning operation, the first pixel definition layer is solidified. Then, the preparation method includes: A second cleaning operation is performed on the residual first pixel definition material inside the first pixel opening.

10. The method for manufacturing a display panel as described in claim 9, wherein, A second cleaning operation is performed using a stripping solution to remove any remaining first pixel definition material within the first pixel opening.

11. The method for manufacturing a display panel as described in claim 7, wherein, The first pixel is defined by a material including photoresist; The step of forming a first pixel definition layer having a plurality of first pixel openings on one side of the substrate includes: The photoresist is coated, exposed, and developed.

12. A display panel, wherein, include: Base; A first pixel definition layer is disposed on one side of the substrate. The first pixel definition layer is provided with a plurality of first pixel openings. The first pixel definition layer includes a first sub-slope surface, and the first sub-slope surface surrounds and forms the first pixel opening. A second pixel definition layer is disposed on the side of the first pixel definition layer away from the substrate. The second pixel definition layer has a plurality of second pixel openings, and the second pixel openings are connected to the corresponding first pixel openings. The second pixel definition layer includes a second sub-slope surface, and the second sub-slope surface surrounds to form the second pixel opening. Wherein, the ratio of the roughness of the first sub-slope surface to the roughness of the second sub-slope surface is A, and 0.6≤A≤12.

13. The display panel according to claim 12, wherein, The ratio of the roughness of the first sub-slope surface to the roughness of the second sub-slope surface is A, and 2≤A≤4.

14. The display panel according to claim 12, wherein, The orthographic projection of the first sub-climbing surface on the substrate is outside the orthographic projection of the second pixel definition layer on the substrate, and the orthographic projection of the first sub-climbing surface on the substrate is connected to the orthographic projection of the second pixel definition layer on the substrate.

15. The display panel according to claim 12, wherein, The first pixel definition layer further includes a first flat surface and a third sub-slope surface. The first flat surface is located on the side of the first pixel definition layer away from the substrate, and the third sub-slope surface connects the first flat surface and the first sub-slope surface. The orthographic projection of the second pixel definition layer on the substrate covers the orthographic projection of the first flat surface on the substrate, and also covers the orthographic projection of the third sub-slope surface on the substrate.

16. The display panel according to claim 15, wherein, The ratio of the roughness of the third sub-slope surface to the roughness of the second sub-slope surface is B, and 0.6≤B≤12.

17. A display panel, wherein, include: Base; A first pixel definition layer is disposed on one side of the substrate, and the first pixel definition layer includes a plurality of first pixel openings; The surface of the first pixel definition layer on the side away from the substrate includes a first sub-slope surface facing the opening of the first pixel, and the surface roughness of the first sub-slope surface is less than or equal to 10 nm.

18. The display panel according to claim 17, wherein, The display panel further includes a second pixel definition layer located on the side of the first pixel definition layer away from the substrate; the second pixel definition layer is provided with a plurality of second pixel openings, and the second pixel openings are connected to the corresponding first pixel openings; the second pixel definition layer includes a second sub-slope surface, and the second sub-slope surface surrounds to form the second pixel opening; wherein, the ratio of the roughness of the first sub-slope surface to the roughness of the second sub-slope surface is A, and 0.6≤A≤12.

19. The display panel according to claim 18, wherein, The transmittance of the first pixel definition layer is less than that of the second pixel definition layer.

20. A display device, wherein, The display panel includes one prepared by the method according to any one of claims 1-11, or one prepared by any one of claims 12-19.

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