Display panel, display module and manufacturing method therefor, and electronic device

Abstract

The present application relates to the technical field of display, and provides a display panel, a display module and a manufacturing method therefor, and an electronic device. The display module comprises a display panel, a driver chip, and a conducting medium. The display panel comprises a substrate, an insulating dielectric layer, a driving circuit, and an electrical connection structure. The substrate comprises a first organic layer, a first inorganic layer, a second organic layer, and a second inorganic layer that are stacked, wherein the first inorganic layer is provided with an opening region, and the second organic layer passes through the first inorganic layer via the opening region of the first inorganic layer to come into contact with and be connected to the first organic layer. The electrical connection structure comprises a first conductive wire and a second conductive wire. A first segment of the conducting medium is arranged on the first organic layer, and a second segment of the conducting medium passes through the opening region of the first inorganic layer and is arranged on the second organic layer. The first segment of the conducting medium is electrically connected to the driver chip and the second segment of the conducting medium, and the second segment of the conducting medium is electrically connected to the first conductive wire. The display module has a relatively small non-display region area and a relatively narrow bezel.

Description

Display panel, display module, preparation method thereof and electronic equipment

[0001] The present application claims priority to the Chinese patent application No. 202510061209.7, filed on January 14, 2025, entitled "Display panel, display module, preparation method thereof and electronic equipment", the Chinese patent application No. 202510081881.2, filed on January 17, 2025, entitled "Display panel, display module, preparation method thereof and electronic equipment", the contents of which are incorporated herein by reference in their entirety. TECHNICAL FIELD

[0002] The present application relates to the technical field of display, in particular to a display panel, a display module, a preparation method thereof and an electronic equipment. BACKGROUND

[0003] With the development of display equipment, display panels pursue the limit of "black border" around the display area, so that the display panel can have a narrow frame (the smaller the width of "black border", the narrower the frame), thereby highlighting the display area itself, providing a wider field of view for consumers and improving user visual experience to ensure product competitiveness under the condition that the screen area size of the display panel remains unchanged. Therefore, how to reduce the "black border" area of the display panel screen as much as possible to obtain a larger screen display within a limited size has become an important research direction for all parties in the industry. SUMMARY

[0004] The present application provides a display panel with a narrow frame, a display module, a preparation method thereof and an electronic equipment.

[0005] In a first aspect, embodiments of this application provide a display module. The display module includes a display panel, a driver chip, and a conductive medium. The display panel includes a substrate, an insulating dielectric layer, a driver circuit, and an electrical connection structure. Along the thickness direction of the display panel, the substrate includes a first organic layer, a first inorganic layer, a second organic layer, and a second inorganic layer stacked together. The first inorganic layer has an opening region, and the second organic layer passes through the opening region of the first inorganic layer to contact and connect with the first organic layer. The electrical connection structure includes a first conductive trace and a second conductive trace. The first conductive trace is disposed on the second inorganic layer, the insulating dielectric layer is disposed on the second inorganic layer and covers the first conductive trace, and the second conductive trace is disposed within the insulating dielectric layer. The second conductive trace electrically connects the driver circuit and the first conductive trace. Along the thickness direction of the display panel, the projection of a first portion of the first conductive trace onto the first inorganic layer at least partially overlaps with the opening region of the first inorganic layer. The driver chip is disposed on the first organic layer, the first segment of the conductive medium is disposed on the first organic layer, the second segment of the conductive medium passes through the opening area of ​​the first inorganic layer and is disposed on the second organic layer. In the opening area of ​​the first inorganic layer, the second segment of the conductive medium and the first inorganic layer are separated by the second organic layer. The first segment of the conductive medium is electrically connected to the driver chip and the second segment of the conductive medium, and the second segment of the conductive medium is electrically connected to the first conductive trace.

[0006] It is understood that by setting an electrical connection structure inside the display panel, combined with a conductive medium, the display module can achieve an internal electrical connection between the driving circuit and the driving chip. The driving signal output by the driving chip is transmitted to the driving circuit of the display panel through the conductive medium and the electrical connection structure 5, without needing to pass through the side of the display panel. The technical solution of the embodiment of this application does not include the electrical connection structure shown in FIG1b, and there is no bent portion of the electrical connection structure shown in FIG1b, which is beneficial to reduce the non-display area of ​​the display module, thereby achieving a narrow bezel of the display module and improving the screen ratio of the display module. Furthermore, the electrical connection structure and conductive medium of this application are directly disposed within the insulating dielectric layer and the substrate, without bending, so the electrical connection structure is not prone to breakage, the electrical connection between the driving chip and the driving circuit has better reliability, and the display reliability of the display panel is better.

[0007] In the process of manufacturing display modules, an un-drilled substrate can be prepared first. After completing the other structural differences of the display panel, holes can be drilled on the second side of the display panel onto the un-drilled substrate. During the hole-drilling process, since the substrate simultaneously has organic and inorganic layers, and the coefficients of thermal expansion and etching / ablation rates of organic and inorganic materials differ, drilling holes in both organic and inorganic layers simultaneously makes it difficult to control the flatness of the hole walls and the hole depth, resulting in a challenging process. In the technical solution of this application, an opening area is set in the first inorganic layer, and the second organic layer passes through the opening area of ​​the first inorganic layer to contact and connect with the first organic layer. During the hole-drilling process, holes can be drilled at the opening area of ​​the first inorganic layer, thus avoiding penetration through the first inorganic layer. The first organic layer forms a first through-hole, and the first segment of the conductive medium fills the first through-hole. The second organic layer forms a second through-hole, which passes through the opening area. The first conductive trace is located at the bottom of the second through-hole, and the second segment of the conductive medium fills the second through-hole and contacts and connects with the first conductive trace. This avoids the problem of poor hole wall smoothness caused by the difference in etching / ablation rate between films of different materials and with different coefficients of thermal expansion.

[0008] In the opening region of the first inorganic layer, the second segment of the conductive medium is separated from the first inorganic layer by a second organic layer. During the hole-punching process, the cross-sectional areas of the first and second through-holes are made smaller than the area of ​​the opening region of the first inorganic layer. The second organic layer is disposed between the hole wall of the second through-hole and the first inorganic layer. This avoids the problem of laser directly irradiating the interface between the first and second organic layers during drilling, thus preventing the separation of the first and second inorganic layers. The first inorganic layer can better prevent moisture, oxygen, and impurity ions from corroding the interior of the display panel.

[0009] In one possible implementation, the minimum distance between the first inorganic layer and the conductive medium is greater than or equal to 0.5 micrometers.

[0010] Understandably, during the opening process, the edge of the opening area of ​​the first inorganic layer is covered by an organic layer with a thickness of at least 0.5 micrometers. This helps to reduce the heat transferred to the interface between the inorganic and organic layers, and can further reduce the probability of separation problems between the inorganic and organic layers.

[0011] In one possible implementation, the cross-sectional area of ​​the first segment of the conductive medium is greater than the cross-sectional area of ​​the second segment. The cross-sectional area of ​​the first segment of the conductive medium refers to the area of ​​its cross-section. The cross-section of the first segment of the conductive medium is parallel to the plane containing the display panel. The term "cross-sectional area" in the following text will be interpreted in this way.

[0012] It is understandable that the cross-sectional area of ​​the first segment is larger than that of the second segment. From the second surface of the substrate toward the first surface, the perimeter of the cross-section of the conductive medium gradually decreases, which helps to reduce the diffusion channels when water vapor and impurity ions erode the display panel, and reduces the risk of display defects caused by water vapor and impurity ions erode the display panel.

[0013] In one possible implementation, the first segment of the conductive medium includes a first portion and a second portion. Along the thickness direction of the display panel, the second portion of the first segment of the conductive medium is connected between the first portion and the second segment of the conductive medium. The cross-sectional area of ​​the first portion of the first segment of the conductive medium is larger than the cross-sectional area of ​​the second portion. Along the thickness direction of the display panel, the conductive medium and the first inorganic layer are separated by a first organic layer.

[0014] It is understandable that the surface of the first organic layer furthest from the second inorganic layer serves as the second surface of the substrate. Compared to a scheme where the first and second portions of the first segment of the conductive medium have the same cross-sectional area, in this embodiment, when the opening shape and size of the first through-hole on the second surface remain unchanged, the first segment of the conductive medium is further divided into two portions with different cross-sectional areas, and the first portion closer to the second surface has a larger cross-sectional area. This helps to reduce the perimeter of the conductive medium's cross-section at the opening area, which helps to reduce the diffusion channels when water vapor and impurity ions erode the display panel, reducing the risk of display defects caused by water vapor and impurity ions eroding the display panel, and resulting in better environmental reliability of the display module.

[0015] In one possible implementation, along the thickness direction of the display panel, the projection of the surface of the first portion of the first segment of the conductive medium facing the second organic layer onto the first inorganic layer covers the opening area of ​​the first inorganic layer. This helps to reduce the diffusion channels when moisture and impurity ions erode the display panel, lowering the risk of display defects caused by moisture and impurity ions eroding the display panel, and resulting in better environmental reliability of the display module.

[0016] In one possible implementation, the display module further includes a circuit board, which comprises an insulating substrate and conductive traces disposed on the insulating substrate. The insulating substrate is disposed on a first organic layer, and the conductive traces electrically connect the driver chip and the conductive medium.

[0017] Understandably, insulating substrates can be used for insulation and protection of conductive traces. Conductive traces electrically connect the conductive medium and the driver chip. The driver chip can be electrically connected to the conductive medium through the conductive traces on the circuit board.

[0018] In one possible implementation, the second surface of the substrate includes a first portion of a first through-hole, an insulating substrate portion is located within the first portion of the first through-hole, a conductive trace portion is located within the first portion of the first through-hole, and a conductive dielectric electrically connects the conductive trace within a first organic layer.

[0019] Understandably, this helps to further reduce the height of the conductive medium in the thickness direction of the display panel, thereby reducing the resistance of the conductive medium. Reducing the number of times the conductive medium climbs the corner slope from the first through-hole to the second surface of the display panel helps to reduce cracks in the conductive medium, resulting in better electrical and mechanical reliability. The second surface of the display panel is the surface of the first organic layer that is furthest from the first inorganic layer.

[0020] In one possible implementation, a conductive medium electrically connects conductive traces to the surface of an insulating substrate facing away from the first organic layer.

[0021] It is understandable that the surface of the insulating substrate facing away from the first organic layer is the bottom surface of the circuit board. The conductive medium electrically connects the conductive traces to the bottom surface of the circuit board. The side of the bottom surface of the circuit board away from the substrate has a larger space, making it easier to manufacture and form. The conductive medium can connect to the circuit board better, resulting in better electrical connection reliability.

[0022] In one possible implementation, a conductive medium electrically connects conductive traces to the surface of an insulating substrate facing the first organic layer.

[0023] It is understood that the surface of the insulating substrate facing the first organic layer is the top surface of the circuit board. Compared to the scheme where the conductive medium is electrically connected to the conductive traces on the bottom surface of the circuit board, in this embodiment, the conductive medium can be electrically connected to the circuit board on the top surface of the circuit board. The top surface of the circuit board is located on the side of the bottom surface of the circuit board closer to the substrate. The height of the conductive medium in the thickness direction of the display panel is smaller, the electrical connection path between the first conductive trace and the driver chip is shorter, and the resistance of the conductive medium is lower.

[0024] In one possible implementation, the display module includes an electrical connection board, which comprises an insulating substrate, an insulating layer, and conductive traces. Along the thickness direction of the display panel, the insulating substrate includes a first insulating substrate, a second insulating substrate, and a third insulating substrate stacked sequentially. The first insulating substrate is disposed between a first organic layer and the second insulating substrate. The insulating layer is disposed on the surface of the third insulating substrate away from the second insulating substrate. The conductive traces are disposed on the insulating layer and electrically connect a driver chip and a conductive medium. The first insulating substrate and the first organic layer use the same organic insulating material, the second insulating substrate and the first inorganic layer use the same inorganic insulating material, and the third insulating substrate and the second organic layer use the same organic insulating material.

[0025] It is understood that the first insulating substrate and the first organic layer use the same organic insulating material. The first insulating substrate and the first organic layer can be formed in the same process. The second insulating substrate and the first inorganic layer use the same inorganic insulating material. The second insulating substrate and the first inorganic layer are formed in the same process. The third insulating substrate and the second organic layer use the same organic insulating material. The third insulating substrate and the second organic layer are formed in the same process. The insulating substrate of the electrical connection board can be formed in the same process as the substrate. The insulating layer and conductive traces of the electrical connection board can also be formed in the same process as other layers of the display panel. The electrical connection board can be manufactured together with the display panel. The manufacturing process of the display panel has high precision. In this embodiment, the contact holes of the electrical connection board used for electrical connection with the conductive medium can be smaller. More contact holes can be arranged in a limited area, and more electrical signals can be transmitted to achieve more complex display effects.

[0026] In one possible implementation, the first conductive trace includes a first portion and a second portion. The first portion of the first conductive trace is embedded in a second inorganic layer. Along the thickness direction of the display panel, the second portion of the first conductive trace is disposed between the first portion and the second conductive trace. The first portion of the first conductive trace is electrically connected to a second segment of a conductive medium and the second portion of the first conductive trace, and the second portion of the first conductive trace is electrically connected to the second conductive trace. The second inorganic layer is disposed between the second portion of the first conductive trace and the second organic layer.

[0027] Understandably, the second inorganic layer can be used to enhance the connection strength between the first conductive trace and the second organic layer, reducing the risk of the first conductive trace and the second organic layer detaching.

[0028] In one possible implementation, a first portion of the first conductive trace contacts and connects the second organic layer and a second segment of the conductive dielectric.

[0029] Understandably, during the fabrication of the display module, before forming the first conductive trace, the second inorganic layer can be etched to form a third via, which penetrates the second inorganic layer. The first conductive trace can be partially formed within the third via and partially formed on the surface of the second inorganic layer facing the insulating dielectric layer. This way, subsequent drilling of the substrate to fill the conductive dielectric does not require penetrating the second inorganic layer, further avoiding the problems of peeling and poor hole wall smoothness caused by differences in film materials and thermal expansion coefficients.

[0030] In one possible implementation, a first portion of the second inorganic layer is disposed between a first portion of the first conductive trace and the second organic layer, and a second portion of the second inorganic layer is disposed between the second portion of the first conductive trace and the second organic layer. The second inorganic layer includes a fourth through-hole penetrating the second inorganic layer, and a third segment of the conductive medium is disposed in the fourth through-hole of the second inorganic layer, electrically connecting the first portion of the first conductive trace and the second segment of the conductive medium. Along the thickness direction of the display panel, the second inorganic layer serves to completely separate the first conductive trace and the second organic layer.

[0031] It is understood that in this embodiment, the second inorganic layer can be used to further enhance the connection strength between the first conductive trace and the second organic layer, reducing the risk of the first conductive trace and the second organic layer detaching.

[0032] In one possible implementation, the display panel further includes a shielding structure disposed on the second inorganic layer and covered by an insulating dielectric layer, wherein the shielding structure is separate from and does not contact the first conductive trace.

[0033] It is understood that the insulating dielectric layer can be used for spacing insulation between the first conductive trace and the shielding structure. Exemplarily, the first conductive trace and the shielding structure are formed in the same process, requiring no additional steps and thus not increasing production costs, which helps reduce the design complexity of the display panel.

[0034] In one possible implementation, the display panel further includes a label disposed on the second inorganic layer and covered by an insulating dielectric layer, the label being separate from and not in contact with the first conductive trace.

[0035] It is understandable that, during the fabrication of the second conductive trace, the marker can serve as a positioning structure for forming the second conductive trace. For example, the marker can be formed in the same process as the shielding structure, without requiring additional steps, thus not increasing production costs and helping to reduce the design complexity of the display panel.

[0036] In one possible implementation, a first organic layer has a first through-hole penetrating the first organic layer, and a second organic layer has a second through-hole penetrating the second organic layer. A first segment of the conductive medium is located within the first through-hole, and a second segment of the conductive medium is located within the second through-hole. The number of conductive media and the number of second through-holes are both multiple and equal. One first through-hole connects multiple second through-holes, and multiple conductive media fill each second through-hole through the first through-hole, without contacting each other within the first through-hole.

[0037] Understandably, a first through-hole connects to multiple second through-holes. The cross-sectional area of ​​the first through-hole can be relatively large. When the driver chip is electrically connected to the conductive medium via the circuit board, part or all of the circuit board can be disposed within the first through-hole. Furthermore, the driver chip can also be disposed within the first through-hole. The conductive medium can achieve electrical connection with the driver chip within the first through-hole, which helps to reduce the height of the conductive medium along the thickness direction of the display panel and lower the resistance of the conductive medium.

[0038] In one possible implementation, a first organic layer has a first through-hole penetrating the first organic layer, and a second organic layer has a second through-hole penetrating the second organic layer. A first segment of the conductive medium is located within the first through-hole, and a second segment of the conductive medium is located within the second through-hole. The number of conductive media, the number of first through-holes, and the number of second through-holes are all multiple and equal. The conductive media, first through-holes, and second through-holes are arranged in a one-to-one correspondence. Multiple conductive media fill each second through-hole through each first through-hole, and the multiple conductive media do not contact each other.

[0039] It is understandable that, compared to one first through hole corresponding to multiple second through holes, in this embodiment, each conductive medium corresponds to one first through hole, and the sum of the cross-sectional areas of multiple first through holes can be set to be smaller, which is beneficial to reduce the diffusion channels when water vapor and impurity ions erode the display panel, and reduce the risk of water vapor and impurity ions erode the display module and cause display defects.

[0040] In one possible implementation, the first via includes a first portion and a second portion. Along the thickness direction of the first organic layer, the second portion of the first via connects the first portion of the first via and the second via. The first portion of the first segment of the conductive medium is located within the first portion of the first via, and the second portion of the first segment of the conductive medium is located within the second portion of the first via.

[0041] In one possible implementation, the number of first segments of conductive medium, the number of second segments of conductive medium, the number of second portions of first through holes, and the number of second through holes are all multiple and equal. The first portion of a first through hole connects to the second portions of multiple first through holes. The first segments of multiple conductive mediums fill the second portions of each first through hole through the first portions of the first through holes respectively. The second segments of multiple conductive mediums fill each second through hole respectively. The multiple conductive mediums do not contact each other within the first portions of the first through holes.

[0042] It is understandable that the first portion of a first through-hole connects to the second portions of multiple first through-holes. The cross-sectional area of ​​the first portion of the first through-hole can be relatively large. When the driver chip is electrically connected to the conductive medium through the circuit board, part or all of the circuit board can be disposed within the first portion of the first through-hole. Furthermore, the driver chip can also be disposed within the first portion of the first through-hole. The conductive medium can achieve electrical connection with the driver chip within the first portion of the first through-hole, which helps to reduce the height of the conductive medium along the thickness direction of the display panel and reduce the resistance of the conductive medium.

[0043] In one possible implementation, the number of first segments of conductive medium, the number of second segments of conductive medium, the number of first portions of first through holes, the number of second portions of first through holes, and the number of second through holes are all multiple and equal. The conductive medium, the first portion of the first through hole, the second portion of the first through hole, and the second through hole are arranged in a one-to-one correspondence. The first segments of multiple conductive media fill the second portion of each first through hole through the first portion of each first through hole, and the second segments of multiple conductive media fill each second through hole. The multiple conductive media do not contact each other.

[0044] It is understandable that, compared to the first part of a first through hole connecting to the second parts of multiple first through holes, in this embodiment, each conductive medium corresponds to the first part of a first through hole, and the sum of the cross-sectional areas of the first parts of multiple first through holes can be set to be smaller. This is beneficial to reduce the diffusion channels when water vapor and impurity ions erode the display panel, and reduce the risk of water vapor and impurity ions erode the display module, leading to display defects.

[0045] In one possible implementation, the display module further includes an insulating protective layer that covers the conductive medium and the first through-hole, and fills the space between two adjacent conductive media to insulate the two adjacent conductive media.

[0046] It is understandable that when a first through hole corresponds to multiple second through holes, a portion of the insulating protective layer can be filled in the first through hole to insulate the first section of the multiple conductive media in the first through hole, and a portion is located on the surface of the first organic layer away from the first inorganic layer and is filled between two adjacent conductive media to insulate the portions of the two adjacent conductive media extending out of the first organic layer.

[0047] In one possible implementation, the second conductive trace includes a first trace, which contacts a second surface of the first conductive trace. The second surface of the first conductive trace faces the insulating dielectric layer. The first trace extends along the thickness direction of the insulating dielectric layer and is electrically connected to the driving circuit. Thus, signals on the first conductive trace are transmitted to the driving circuit via the second conductive trace, which extends along the thickness direction of the display panel.

[0048] In one possible implementation, the first organic layer has a first through-hole that penetrates the first organic layer, and a conductive medium fills and covers the first through-hole.

[0049] Understandably, the conductive medium can better fill the first through hole, and it can better prevent moisture and oxygen from eroding the interior of the display panel, which is beneficial to improving environmental reliability.

[0050] Secondly, embodiments of this application provide an electronic device. The electronic device includes a housing and a display module, with the display module mounted on the housing. It is understood that the display module has a narrow bezel, resulting in a larger display area and a better user experience.

[0051] Thirdly, embodiments of this application provide a display panel. The display panel includes a substrate, an insulating dielectric layer, a driving circuit, and an electrical connection structure. Along the thickness direction of the display panel, the substrate includes a first organic layer, a first inorganic layer, a second organic layer, and a second inorganic layer stacked together. The first inorganic layer has an opening area, and the second organic layer passes through the opening area of ​​the first inorganic layer to contact and connect with the first organic layer. The electrical connection structure includes a first conductive trace and a second conductive trace. The first conductive trace is disposed on the second inorganic layer, the insulating dielectric layer is disposed on the second inorganic layer and covers the first conductive trace, and the second conductive trace is disposed within the insulating dielectric layer and electrically connects the driving circuit and the first conductive trace. A first portion of the first conductive trace is embedded in the second inorganic layer, and along the thickness direction of the display panel, the projection of the first portion of the first conductive trace on the first inorganic layer at least partially overlaps with the opening area.

[0052] Understandably, in the process of manufacturing a display module, a display panel is first manufactured. The display panel includes a substrate. In the process of manufacturing the display module, holes are drilled in the first organic layer, the second organic layer, and the second inorganic layer of the substrate to form holes that penetrate the first organic layer, the second organic layer, and the second inorganic layer. The bottom of the hole is a first conductive trace. A conductive medium is injected into the hole. The conductive medium can contact and electrically connect the first conductive trace, thereby electrically connecting the first conductive trace and the driver chip.

[0053] In the process of creating vias in a substrate, the differences in thermal expansion coefficients and etching / ablation rates between organic and inorganic materials make it difficult to control the smoothness of the via walls and the depth of the vias if both organic and inorganic layers are created simultaneously, leading to difficulties in process implementation. In the technical solution of this application, an opening region is formed in the first inorganic layer, and the second organic layer passes through this opening region to contact and connect with the first organic layer. During the substrate creation process, the via can be created at the opening region of the first inorganic layer, thus avoiding the need to penetrate the first inorganic layer. The first organic layer forms a first through-hole, and the first segment of the conductive medium fills the first through-hole. The second organic layer forms a second through-hole, with a first conductive trace located at the bottom of the second through-hole. The second segment of the conductive medium fills the second through-hole and contacts and connects with the first conductive trace. This avoids the problem of poor via wall smoothness caused by differences in etching / ablation rates between films of different materials and thermal expansion coefficients.

[0054] In one possible implementation, the first conductive trace includes a first portion and a second portion. Along the thickness direction of the display panel, the second portion of the first conductive trace is disposed between the first portion and the second conductive trace, and the second conductive trace contacts the surface of the second portion of the first conductive trace that is away from the first portion. A first portion of a second inorganic layer is disposed between the first portion of the first conductive trace and the second organic layer, and a second portion of the second inorganic layer is disposed between the second portion of the first conductive trace and the second organic layer, with the first conductive trace and the second organic layer completely separated by the second inorganic layer.

[0055] Understandably, a first portion of the first conductive trace is embedded in the second inorganic layer. A portion of the second portion of the first conductive trace is located on the surface of the first portion of the first conductive trace away from the second organic layer, and a portion is located on the surface of the second inorganic layer away from the second organic layer. The cross-sectional area S2 of the second portion of the first conductive trace is larger than the cross-sectional area S1 of the first conductive trace. The second portion of the first conductive trace can have a larger area for contacting and connecting the second conductive trace. The second inorganic layer can be used to enhance the connection strength between the first conductive trace and the second organic layer, reducing the risk of detachment between the first conductive trace and the second organic layer.

[0056] In one possible implementation, a first portion of the first conductive trace passes through the second inorganic layer and contacts the second organic layer.

[0057] Understandably, before forming the first conductive trace, the second inorganic layer can be etched to form the third via, which penetrates the second inorganic layer. The first conductive trace can be partially formed within the third via and partially formed on the surface of the second inorganic layer facing the insulating dielectric layer. This way, in the subsequent manufacturing process of the display module, drilling holes in the substrate to fill the conductive dielectric does not need to penetrate the second inorganic layer, further avoiding the problems of peeling and poor hole wall smoothness caused by differences in film materials and thermal expansion coefficients.

[0058] Fourthly, embodiments of this application provide a method for manufacturing a display module. The method for manufacturing a display module includes:

[0059] A first organic layer and a first inorganic layer to be treated are sequentially formed on a substrate, with the first inorganic layer located on the surface of the first organic layer away from the substrate. The first inorganic layer is etched to form a first inorganic layer, which has a first through-hole that penetrates the first inorganic layer and forms an opening region. A second organic layer to be treated is formed on the first inorganic layer and the first organic layer, with a portion of the second organic layer filling the first through-hole and contacting the first organic layer through it. A second inorganic layer is formed on the surface of the second organic layer away from the first inorganic layer. The second inorganic layer is etched to form a pre-treated second inorganic layer, which has a groove that does not penetrate the second inorganic layer. The groove forms an opening on the surface of the pre-treated second inorganic layer opposite to the second organic layer, and along the thickness direction of the pre-treated second inorganic layer, the projection of the groove onto the first inorganic layer at least partially overlaps with the opening region of the first inorganic layer. A metal layer to be processed is formed on the pre-treated second inorganic layer, and a portion of the metal layer to be processed fills a groove. The metal layer to be processed is etched to form a first conductive trace. An insulating dielectric layer is formed on the pre-treated second inorganic layer and the first conductive trace, and a second conductive trace is formed on the first conductive trace. The insulating dielectric layer is disposed on the pre-treated second inorganic layer and covers the first conductive trace. The second conductive trace is disposed on the insulating dielectric layer and connects to the first conductive trace. The substrate is removed, and holes are drilled in the first organic layer, the second organic layer to be processed, and the pre-treated second inorganic layer. A first via is formed in the first organic layer, and the first via penetrates the first organic layer. A second via is formed in the second organic layer, and the second via passes through the first through-hole and penetrates the second organic layer. A fourth via is formed in the second inorganic layer, and the fourth via penetrates the second inorganic layer. The first via connects to the second via, and the second via connects to the fourth via. A driver chip is mounted on the first organic layer. Conductive dielectric is filled in the first via, the second via, and the fourth via. The conductive dielectric contacts and connects to the first conductive trace and is electrically connected to the driver chip.

[0060] It is understandable that in the process of manufacturing display modules, an un-drilled substrate can be prepared first, and then after the other structures of the display panel are completed, holes can be drilled in the un-drilled substrate to form holes that penetrate the first organic layer, the second organic layer, and the second inorganic layer, so that the bottom of the hole is the first conductive trace. A conductive medium is injected into the hole, and the conductive medium can contact and electrically connect the first conductive trace, thereby electrically connecting the first conductive trace and the driver chip.

[0061] In the process of creating vias in a substrate, the differences in thermal expansion coefficients and etching / ablation rates between organic and inorganic materials make it difficult to control the smoothness of the via walls and the depth of the vias if both organic and inorganic layers are created simultaneously, leading to difficulties in process implementation. In the technical solution of this application, an opening region is formed in the first inorganic layer, and the second organic layer passes through this opening region to contact and connect with the first organic layer. During the substrate creation process, the via can be created at the opening region of the first inorganic layer, eliminating the need to penetrate the first inorganic layer. Only the first and second organic layers need to be created. The first organic layer forms a first through-hole, and the first segment of the conductive medium fills the first through-hole. The second organic layer forms a second through-hole, with a first conductive trace located at the bottom of the second through-hole. The second segment of the conductive medium fills the second through-hole and contacts and connects with the first conductive trace. This avoids the problem of poor via wall smoothness caused by differences in etching / ablation rates between films of different materials and thermal expansion coefficients.

[0062] In one possible implementation, etching the metal layer to be processed includes: forming a marker in a portion of the metal layer to be processed, forming a first conductive trace in a portion of the metal layer to be processed, and using the marker to align the formation of the second conductive trace and to make contact with the first conductive trace.

[0063] Understandably, the first conductive trace and the marking are formed in the same process, without the need for additional processes, thus not increasing production costs and helping to reduce the design difficulty of the display panel.

[0064] In one possible implementation, etching the metal layer to be treated further includes: a portion of the metal layer to be treated forming a shielding structure.

[0065] Understandably, the markings and shielding structure can be formed in the same process, without the need for additional steps, thus not increasing production costs and reducing the design difficulty of the display panel.

[0066] In one possible implementation, drilling holes in the first organic layer to be treated, the second organic layer to be treated, and the pre-treated second inorganic layer includes: drilling holes in the first organic layer to be treated, the second organic layer to be treated, and the pre-treated second inorganic layer using a laser process, wherein the cross-sectional area of ​​the second through hole is smaller than the cross-sectional area of ​​the first through hole, and the wall of the second through hole and the wall of the first through hole do not contact each other.

[0067] Understandably, laser technology is easy to operate, requires minimal equipment, and is readily implemented.

[0068] In one possible implementation, the distance between the wall of the second through hole and the wall of the first through hole is greater than or equal to 0.5 micrometers.

[0069] It is understandable that during the opening process, the edge of the opening area of ​​the first inorganic layer, that is, the wall of the first through hole, is covered by an organic layer with a thickness of at least 0.5 micrometers. This helps to reduce the heat transferred to the interface between the inorganic and organic layers and can reduce the probability of separation problems between the inorganic and organic layers.

[0070] In one possible implementation, the first via includes a first portion and a second portion. Along the thickness direction of the first organic layer, the second portion of the first via connects the first portion of the first via and the second via. The cross-sectional area of ​​the first portion of the first via is larger than the cross-sectional area of ​​the second portion of the first via. The distance between the bottom surface of the first portion of the first via and the first inorganic layer is greater than or equal to 0.5 micrometers.

[0071] Understandably, in the drilling process, the first through hole can be designed as a stepped hole, and it can be etched in two steps. The wall of the first through hole is a stepped surface, and the conductive medium is formed by contacting the stepped surface. The climbing height of the first conductive medium during the forming process is small, making it easier for the conductive medium to adhere to the wall of the through hole. The surface of the conductive medium is less prone to cracking, and the conductive performance and mechanical reliability of the conductive medium are better.

[0072] During the drilling process of the first organic layer, along the thickness direction of the display panel, the bottom surface of the first part of the first through hole and the first inorganic layer are spaced at least 0.5um apart. This can prevent the laser from directly irradiating the interface between the first inorganic layer and the first organic layer during the drilling of the first organic layer, which could cause peeling problems. Attached Figure Description

[0073] To illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be described below.

[0074] Figure 1a is a schematic diagram of the structure of a display module in a traditional technical solution;

[0075] Figure 1b is a partial cross-sectional view of the module at point AA;

[0076] Figure 2a is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0077] Figure 2b is an exploded view of the electronic device shown in Figure 2a;

[0078] Figure 3 is a front view of the plane in which the module is located;

[0079] Figure 4a is a partial cross-sectional view showing one embodiment of the module at the BB line;

[0080] Figure 4b is a schematic diagram of one embodiment of the second organic layer, first conductive trace, and shielding structure of the substrate shown in Figure 4a;

[0081] Figure 4c is a cross-sectional view of one embodiment of the structure shown in Figure 4b at line DD;

[0082] Figure 4d is a cross-sectional view of one embodiment of the structure shown in Figure 4b at the EE line;

[0083] Figure 5a is a planar front view of one embodiment of the display module shown in Figure 4a on the second surface;

[0084] Figure 5b is a partial cross-sectional view showing another embodiment of the module at the BB line;

[0085] Figure 6a is a partial cross-sectional view showing another embodiment of the module at the BB line;

[0086] Figure 6b is a front plan view of one embodiment of the display module shown in Figure 6a on the second side;

[0087] Figures 7 to 15 are cross-sectional views of the product structure corresponding to one of the manufacturing processes of the display module shown in Figure 6a;

[0088] Figure 16 is a structural schematic diagram of another embodiment of the display module shown in Figure 6a at point C;

[0089] Figures 17 and 18 are cross-sectional views of the product structure corresponding to one of the manufacturing processes of the display module shown in Figure 16;

[0090] Figure 19 is a structural schematic diagram of another embodiment of the display module shown in Figure 6a at point C;

[0091] Figure 20 is a structural schematic diagram of another embodiment of the display module shown in Figure 6a at point C;

[0092] Figure 21 is a structural schematic diagram of another embodiment of the display module shown in Figure 6a at point C;

[0093] Figure 22 is a structural schematic diagram of another embodiment of the display module shown in Figure 6a at point C;

[0094] Figure 23 is a structural schematic diagram of another embodiment of the display module shown in Figure 6a at point C;

[0095] Figure 24 is a schematic diagram of one embodiment of the first organic layer and the second organic layer shown in Figure 21;

[0096] Figure 25 is a schematic diagram of one embodiment of the conductive medium, circuit board, first organic layer, and second organic layer shown in Figure 4a;

[0097] Figure 26 is a schematic diagram of another embodiment of the structure shown in Figure 24;

[0098] Figure 27 is a schematic diagram of another embodiment of the structure shown in Figure 25;

[0099] Figure 28 is a structural schematic diagram of another embodiment of the display module shown in Figure 6a at point C;

[0100] Figure 29 is a structural schematic diagram of another embodiment of the display module shown in Figure 6a at point C;

[0101] Figure 30 is a structural schematic diagram of another embodiment of the display module shown in Figure 6a at point C;

[0102] Figure 31 is a schematic diagram of one embodiment of the conductive medium, circuit board, first organic layer, and second organic layer shown in Figure 30;

[0103] Figure 32 is a front plan view of one embodiment of the conductive medium, circuit board, first organic layer, and second organic layer shown in Figure 30.

[0104] Figure 33 is a schematic diagram of another embodiment of the structure shown in Figure 30;

[0105] Figure 34 is a partial cross-sectional view showing another embodiment of the module at the BB line;

[0106] Figure 35 is a cross-sectional view of the product structure corresponding to one of the manufacturing processes of the display module shown in Figure 34. Detailed Implementation

[0107] The embodiments of this application are described below with reference to the accompanying drawings. The embodiments described herein with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.

[0108] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. It should be understood that in this application, "electrical connection" can be understood as components physically contacting and conducting electricity; it can also be understood as a form of connection between different components in a circuit structure through physical lines that can transmit electrical signals, such as copper foil or wires on a printed circuit board (PCB). "Connection" and "connected" can both refer to a mechanical connection relationship or a physical connection relationship. For example, A connecting to B or A being connected to B can mean that there are fastening components (such as screws, bolts, rivets, glue, etc.) between A and B, or that A and B are in contact with each other and A and B can be separated.

[0109] Furthermore, the term "fixed" in this document should be interpreted broadly. For example, "fixed" can mean direct fixing or indirect fixing through an intermediate medium. "Fixed" refers to connections where the relative positional relationship remains unchanged after connection. The directional terms used in the embodiments of this application, such as "upper" and "lower," are merely for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. "Multiple" refers to two or more.

[0110] In the description of the embodiments of this application, unless otherwise stated, " / " means "or". For example, A / B can mean A or B. The "and / or" in the text is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist simultaneously, and B exists alone.

[0111] In the embodiments of this application, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," "third," and "fourth" may explicitly or implicitly include one or more of that feature.

[0112] References to "one embodiment" or "some embodiments" as used in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0113] It is understood that the specific embodiments described herein are merely for explaining the relevant application and not for limiting the application. It should also be noted that, for ease of description, only the parts relevant to the application are shown in the accompanying drawings.

[0114] Figure 1a is a schematic diagram of the structure of a display module 4100 in a conventional technical solution. Figure 1b is a partial cross-sectional view of the display module 4100 at point AA. Figure 1b only shows a portion of the structure along line AA. For ease of description, the length direction of the display module 4100 is defined as the X-axis. The width direction of the display module 4100 is defined as the Y-axis. The thickness direction of the display module 4100 is defined as the Z-axis. The plane containing the display module 4100 is parallel to the XY plane.

[0115] As shown in Figures 1a and 1b, the display module 4100 may include a display panel 3100 and a driver chip 310. The display panel 3100 may include a substrate 301, an inorganic insulating layer 302, an organic insulating layer 303, a driving circuit 304, an electrical connection structure 305, and a pixel structure 306. The pixel structure 306 may include a cathode 3061, an anode 3062, and a light-emitting structure 3063. The light-emitting structure 3063 is connected between the cathode 3061 and the anode 3062. The substrate 301, the inorganic insulating layer 302, and the organic insulating layer 303 are stacked. The inorganic insulating layer 302 is located between the organic insulating layer 303 and the substrate 301. A first portion 3041 of the driving circuit 304 is disposed within the inorganic insulating layer 302, and a second portion 3042 of the driving circuit 304 is disposed within the organic insulating layer 303. The second portion 3042 of the driving circuit 304 is electrically connected to the first portion 3041 of the driving circuit 304 and the pixel structure 306. The first portion 3041 of the driving circuit 304 includes functional components of the driving circuit 304, such as thin-film transistors, capacitors, etc. The second portion 3042 of the driving circuit 304 can be used for electrical connections between different components of the driving circuit 304, as well as for electrical connections between the pixel structure 306 and the first portion 3041 of the driving circuit. The driving chip 310 is disposed on the surface of the substrate 301 away from the inorganic insulating layer 302.

[0116] An electrical connection structure 305 is located on one side of the display panel 3100 and is used to electrically connect the second part 3042 of the driving circuit 304 and the driving chip 310. Exemplarily, the electrical connection structure 305 may include a conductive trace 3051 and a flexible substrate 3052. The conductive trace 3051 is embedded within the flexible substrate 3052. The flexible substrate 3052 can be used for protection and insulation of the conductive trace 3051, and to provide a bendable base. The conductive trace 3051 electrically connects the driving chip 310 and the driving circuit 304. Exemplarily, the flexible substrate 3052 may include a first substrate 3053, a second substrate 3054, and a third substrate 3055 stacked together. For example, the first substrate 3053 can be formed in the same process as the substrate 301 of the display panel 3100, the second substrate 3054 can be formed in the same process as the inorganic insulating layer 302 of the display panel 3100, and the third substrate 3055 can be formed in the same process as the organic insulating layer 303 of the display panel 3100. Conductive traces 3051 are embedded in the third substrate 3055.

[0117] For example, the display panel 3100 may include a display area 307 and a non-display area 308. Figure 1a illustrates the distinction between the display area 307 and the non-display area 308 using dotted lines and filled patterns. The display area 307 can display images. The area containing multiple pixel structures 306 is the display area 307 of the display panel 3100. The non-display area 308 may consist of non-displayable structures surrounding the display area 307, such as electrical connection structures 305. The ratio of the area of ​​the display area 307 to the area of ​​the non-display area 308 can also be called the screen-to-body ratio. When the sum of the areas of the display area 307 and the non-display area 308 remains constant, the smaller the area of ​​the non-display area 308 and the larger the display area 307, the higher the screen-to-body ratio. Increasing the screen-to-body ratio of the display panel 3100 improves the user experience.

[0118] It is understandable that the electrical connection structure 305 can be fabricated in the same process as the second part 3042 of the driving circuit 304 and the organic insulating layer 303; or it can be fabricated after the substrate 301, inorganic insulating layer 302, organic insulating layer 303, driving circuit 304 and pixel structure 306 are fabricated, and the electrical connection structure 305 is electrically connected to the second part 3042 of the driving circuit 304 during the fabrication process.

[0119] In some conventional technical solutions, the fourth portion 3044 of the driving circuit 304 is disposed within the organic insulating layer 303. The fourth portion 3044 of the driving circuit 304 is electrically connected to the driving circuit 304 and the electrical connection structure 305. The fourth portion 3044 of the driving circuit 304 can be used to lead the electrical signal of the driving circuit 304 from the display area 307 to the non-display area 308.

[0120] In conventional solutions, the driver chip 310 is placed on the back of the display panel 3100, that is, on the surface of the substrate 301 away from the inorganic insulating layer 302. This reduces the area of ​​the non-display area 308 of the display panel 3100 and increases the screen-to-body ratio. An electrical connection structure 305 is bent to electrically connect the driver circuit 304 and the driver chip 310 from the side. A portion of the non-display area 308 of the display panel 3100 is used to accommodate the electrical connection structure 305, resulting in a relatively large area of ​​the non-display area 308. Furthermore, the electrical connection structure 305 requires bending, causing significant stress on the conductive traces 3051 and the flexible substrate 3052 after bending. This can easily lead to breakage of the conductive traces 3051 and the flexible substrate 3052. Cracks in the conductive traces 3051 reduce their conductivity, thus affecting the display effect of the display panel 3100.

[0121] The following will, with reference to the accompanying drawings, specifically illustrate how this application further reduces the area of ​​the non-display area 308 of the display panel 3100 and increases the screen-to-body ratio of the display panel 3100. Furthermore, the technical solution of this application can also improve the reliability of the electrical connection between the driving circuit 304 and the driving chip 310 while reducing the area of ​​the non-display area 308 of the display panel 310.

[0122] Figure 2a is a schematic diagram of the structure of an electronic device 1000 provided in an embodiment of this application. It should be noted that the accompanying drawings of this application only schematically show some components included in the electronic device 1000, and the actual size, actual position and actual structure of these components are not limited by the drawings.

[0123] As shown in Figure 2a, this application embodiment provides an electronic device 1000. The electronic device 1000 can be a mobile phone, tablet personal computer, laptop computer, personal digital assistant (PDA), personal computer, television, laptop computer, in-vehicle equipment, wearable device, augmented reality (AR) glasses, AR headset, virtual reality (VR) glasses, or VR headset, or any other device with a display module. The electronic device 1000 in the embodiment shown in Figure 2a is described using a mobile phone as an example.

[0124] Figure 2b is an exploded view of the structure of the electronic device 1000 shown in Figure 2a.

[0125] As shown in Figures 2a and 2b, the electronic device 1000 includes a display module 100, a housing 200, and electronic components 300. The housing 200 can serve as a structural support component for the display module 100 and the electronic components 300. Specifically, this application does not limit the structure of the housing 200.

[0126] For example, the display module 100 is mounted on the housing 200. The display module 100 and the housing 200 can enclose the internal space of the electronic device 1000. The display module 100 can be a flat screen, that is, the edges of the display module 100 are not curved to form an arc surface. Alternatively, the display module 100 can be a curved screen, that is, the edges of the display module 100 are curved to form an arc surface. In addition, the display module 100 can be a non-foldable rigid screen or a foldable screen.

[0127] For example, the electronic device 300 can be mounted on the housing 200, and the electronic device 300 can be located inside the electronic device 1000. The electronic device 300 can be a camera module, a fingerprint module, a home button, an earpiece, or a speaker, etc.

[0128] As shown in Figure 2a, the display module 100 may include a display panel 10 and a cover plate 20. The cover plate 20 is stacked on the top surface 10a of the display panel 10. The cover plate 20 can be used to protect the display panel 10. For ease of description, the length direction of the display panel 10 is defined as the X-axis. The width direction of the display panel 10 is defined as the Y-axis. The thickness direction of the display panel 10 is defined as the Z-axis.

[0129] For example, the cover plate 20 can be made of glass or polyimide, etc. The display panel 10 can be an organic light-emitting diode (OLED) panel, a quantum dot light-emitting diode (QLED) panel, an active-matrix organic light-emitting diode (AMOLED) panel, etc. This embodiment will be described using an OLED display panel 10 as an example.

[0130] Figure 3 is a front view of the display module 100 in the plane. The plane containing the display module 100 is parallel to the XY plane. Figure 3 illustrates the positional relationship between the display panel 10 and the circuit board 50 of the display module 100 in the plane containing the display module 100.

[0131] As shown in Figure 3, the display panel 10 may include a display area 101 (Active Area, AA) and a non-display area 102. Exemplarily, the non-display area 102 may surround the display area 101. Figure 3 schematically distinguishes the display area 101 and the non-display area 102 using dotted lines and fill patterns. The display area 101 can display images. The non-display area 102 may consist of non-displayable structures surrounding the display area 101. It is understood that the ratio of the area of ​​the display area 101 to the area of ​​the non-display area 102 can also be called the screen-to-body ratio. When the sum of the areas of the display area 101 and the non-display area 102 remains constant, the smaller the area of ​​the non-display area 102 and the larger the display area 101, the larger the screen-to-body ratio. Increasing the screen-to-body ratio of the display panel 10 is beneficial for improving the user experience.

[0132] Figure 4a is a partial cross-sectional view of one embodiment of the display module 100 at the BB line. It is understood that a partial cross-sectional view means that Figure 4a only illustrates the structure of the display module 100 at the BB line that is related to the technical solution of this application. The display module 100 can have more structures at the BB line. The partial cross-sectional views below will also be explained in this way, and will not be repeated below.

[0133] As shown in Figures 2b, 3, and 4a, the display module 100 may further include a driver chip 30 and a conductive medium 40. The driver chip 30 may be disposed on the surface of the display panel 10 away from the cover plate 20. The driver chip 30 may be used to drive the display panel 10 to display images. The conductive medium 40 electrically connects the driver chip 30 and the display panel 10, and the driving signal output by the driver chip 30 may be transmitted to the display panel 10 through the conductive medium 40.

[0134] As shown in Figures 3 and 4a, the display panel 10 may include a substrate 1, an insulating dielectric layer 2, a driving circuit 3, an electrical connection structure 5, a pixel structure 6, and a shielding structure 4. In this embodiment, during use, the pixel structure 6 is located on the side of the substrate 1 closer to the user. Figure 4a only illustrates one pixel structure 6 and part of the driving circuit 3; in other locations, the display panel 10 may have more pixel structures 6 and driving circuit 3 functional components.

[0135] For example, substrate 1 serves as a carrier for the layers above it, such as drive circuit 3. It is understood that substrate 1 can be made of a single material or a composite of multiple different materials. Substrate 1 can be a single-layer structure or a multi-layer structure; compared to a single-layer structure, a multi-layer structure can provide substrate 1 with better strength and reliability.

[0136] For example, along the thickness direction of the display panel 10, the substrate 1 may include a first organic layer 11, a first inorganic layer 12, a second organic layer 13, and a second inorganic layer 14 stacked together. The first organic layer 11 and the second organic layer 13 can serve to support and bend the display panel 10. The first inorganic layer 12, disposed between the first organic layer 11 and the second organic layer 13, can be used to isolate moisture, oxygen, and impurity ions, preventing moisture, oxygen, and impurity ions from corroding the internal components of the display panel 10, such as the driving circuit 3 and the pixel structure 6.

[0137] For example, the materials of the first organic layer 11 and the second organic layer 13 can be polyimide (PI), or the materials of the first organic layer 11 and the second organic layer 13 can also be polyethylene terephthalate (PET). The material of the second organic layer 13 can be the same as or different from the material of the first organic layer 11. For example, the materials of the first inorganic layer 12 and the second inorganic layer 14 can include silicon dioxide (SiO2). X Materials include monocrystalline silicon, etc. The materials of the first inorganic layer 12 and the second inorganic layer 14 can be the same or different.

[0138] In some embodiments, along the thickness direction of the substrate 1, the substrate 1 may include a first surface 103 and a second surface 104 disposed opposite to each other. The first surface 103 may be located on the side of the second surface 104 near the top surface 10a of the display panel 10. Exemplarily, the second surface 104 may be the bottom surface of the display panel 10. The first surface 103 may be the surface of the second organic layer 13 away from the first inorganic layer 12. The second surface 104 may be the surface of the second inorganic layer 14 away from the second organic layer 13. Exemplarily, the driving chip 30 may be disposed on the second surface 104 of the substrate 1, that is, the surface of the first organic layer 11 away from the first inorganic layer 12.

[0139] As shown in Figure 4a, the shielding structure 4 can be disposed on the second inorganic layer 14. Exemplarily, the shielding structure 4 can be disposed on the first surface 103 of the substrate 1. It is understood that the shielding structure 4 can be used to shield device signals on the second surface 104 of the substrate 1, as well as the electrical signals of impurity ions inside the substrate 1, to avoid interference with the internal devices of the display panel 10. The shielding structure 4 can be made of a metallic material, such as molybdenum (Mo).

[0140] In some embodiments, the insulating dielectric layer 2 may be disposed on the second inorganic layer 14 and cover the shielding structure 4. Exemplarily, the material of the insulating dielectric layer 2 may include organic insulating materials and inorganic insulating materials.

[0141] As shown in Figure 4a, the pixel structure 6 can be disposed on the surface of the insulating dielectric layer 2 away from the substrate 1. The pixel structure 6 can be used to realize the display function of the display panel 10, and the pixel structure 6 is also called a light-emitting device. The area where the pixel structure 6 is located is the display area 101 of the display panel 10. It can be understood that the display panel 10 can include one or more pixel structures 6. When there are multiple pixel structures 6, the multiple pixel structures 6 can be arranged in an array in the plane of the display panel 10.

[0142] The driving circuit 3 can be used to control the display panel 10 to display images. The driving circuit 3 can be electrically connected to the pixel structure 6 to drive the pixel structure 6 to emit light / turn off. The driving circuit 3 can be disposed on the insulating dielectric layer 2.

[0143] The electrical connection structure 5 can electrically connect the driving circuit 3 and the conductive medium 40. Exemplarily, the electrical connection structure 5 may include a first conductive trace 51 and a second conductive trace 52. The first conductive trace 51 may be disposed on the second inorganic layer 14. The insulating dielectric layer 2 may be disposed on the second inorganic layer 14 and cover the first conductive trace 51. The second conductive trace 52 is disposed within the insulating dielectric layer 2. The first conductive trace 51 is electrically connected to the conductive medium 40. The second conductive trace 52 is electrically connected to the driving circuit 3 and the first conductive trace 51. The electrical connection structure 5 can be used for signal transmission between the driving chip 30 and the driving circuit 3. Understandably, in the process of fabricating the display module 100, an un-drilled substrate can be prepared first. Then, after completing the other structural differences of the display panel 10, holes can be drilled in the un-drilled substrate on the second surface 104 of the display panel 10, forming holes that penetrate the first organic layer 11 and the second organic layer 13. The bottom of the hole becomes the first conductive trace 51. A conductive medium 40 is injected into the hole, which can contact and electrically connect to the first conductive trace 51, thereby electrically connecting the first conductive trace 51 and the driver chip 30. In the process of drilling holes in the display panel 10, the first conductive trace 51 can serve as a positioning mark to facilitate the determination of the hole location.

[0144] For example, the first conductive trace 51 and the shielding structure 4 are separate and do not contact each other. The insulating dielectric layer 2 may be used for spacing insulation between the first conductive trace 51 and the shielding structure 4.

[0145] Figure 4b is a schematic diagram of one embodiment of the second organic layer 13, the first conductive trace 51, and the shielding structure 4 of the substrate 1 shown in Figure 4a.

[0146] As shown in Figures 4a and 4b, the second inorganic layer 14 can be partially disposed between the first conductive trace 51 and the second organic layer 13, partially disposed between the shielding structure 4 and the second organic layer 13, and partially disposed between the insulating dielectric layer 2 and the second organic layer 13. The second inorganic layer 14 can be used to enhance the connection strength between the first conductive trace 51 and the second organic layer 13, reducing the risk of detachment between the first conductive trace 51 and the second organic layer 13.

[0147] For example, along the thickness direction of the display panel 10, the first conductive trace 51 may include a first portion 511 and a second portion 512 connected in sequence. The first portion 511 of the first conductive trace 51 may be embedded in the second inorganic layer 14. A portion of the second portion 512 of the first conductive trace 51 is disposed between the first portion 511 and the insulating dielectric layer 2, and a portion is disposed between the second organic layer 13 and the insulating dielectric layer 2. The first portion 511 of the first conductive trace 51 is electrically connected to the second portion 512 of the first conductive trace 51 and the conductive dielectric 40. The second portion 512 of the first conductive trace 51 is electrically connected to the second conductive trace 52. It is understood that a portion of the second inorganic layer 14 may be disposed between the second portion 512 of the first conductive trace 51 and the second organic layer 13.

[0148] Figure 4c is a cross-sectional view of one embodiment of the structure shown in Figure 4b at line DD. Figure 4d is a cross-sectional view of one embodiment of the structure shown in Figure 4b at line EE.

[0149] As shown in Figures 4b to 4c, the cross-sectional area S2 of the second part 512 of the first conductive trace 51 is greater than the cross-sectional area S1 of the first part 511 of the first conductive trace 51.

[0150] It is understandable that the cross-sectional area of ​​the second part 512 of the first conductive trace 51 is larger than the cross-sectional area of ​​the first part 511 of the first conductive trace 51, and the second part 512 of the first conductive trace 51 can have a larger area for connecting the second conductive trace 52.

[0151] It is understood that the number of first conductive traces 51 can be one or more. When there are multiple first conductive traces 51, adjacent first conductive traces 51 are separated by an insulating dielectric layer 2, which can be used to insulate adjacent first conductive traces 51.

[0152] In some embodiments of this application, the first conductive trace 51 may not have a second portion 512, and the first conductive trace 51 may be entirely embedded in the second inorganic layer 14.

[0153] In some embodiments, as shown in FIG4a, the shielding structure 4 can be disposed opposite to the driving circuit 3 along the thickness direction of the display panel 10. In this way, the shielding structure 4 can be used to shield device signals on the second surface 104 side of the substrate 1, as well as electrical signals from impurity ions inside the substrate 1, avoiding interference with the driving circuit 3. It should be understood that, in this application, the opposite disposal of component A and component B along the target direction can mean that component A is projected along the target direction to obtain projection C, and component B is projected along the target direction to obtain projection D, with projection C and projection D at least partially overlapping.

[0154] In some embodiments, the first conductive trace 51 and the shielding structure 4 can be formed in the same process during the fabrication of the display module 100. It is understood that forming the first conductive trace 51 and the shielding structure 4 in the same process eliminates the need for additional steps, avoids increasing production costs, and helps reduce the design complexity of the display panel 10.

[0155] In some embodiments, the material of the first conductive trace 51 can be a conductive metal or other non-metallic conductive material, and this application does not impose any restrictions. The material of the second conductive trace 52 can be a conductive metal or other non-metallic conductive material.

[0156] For example, the material of the first conductive trace 51 can be a metallic material, such as molybdenum (Mo). Thus, the surface where the first conductive trace 51 contacts the conductive dielectric 40 is made of a metallic material. It is understood that the conductive dielectric 40, with its surface near the insulating dielectric layer 2 in direct contact with the metallic material, exhibits better connection strength between structures of the same material type, and consequently, better connection strength between the conductive dielectric 40 and the first conductive trace 51.

[0157] In some embodiments, the shielding structure 4 can be made of a material with good light-shielding properties. The shielding structure 4 can also be used to block the light source at the bottom of the display panel 10, preventing light from entering the interior of the display panel 10 from the bottom and affecting the driving circuit 3.

[0158] In some embodiments, the display panel 10 may further include a marker 7. The marker 7 and the first conductive trace 51 may both be disposed on the second inorganic layer 14 of the substrate 1, and the marker 7 may be covered by an insulating dielectric layer 2. The marker 7 and the first conductive trace 51 are separate and do not contact each other. The marker 7 and the first conductive trace 51 may be spaced apart by the insulating dielectric layer 2, which may be used to insulate the marker 7 from the first conductive trace 51. Exemplarily, the marker 7 may be formed in the same process as the shielding structure 4. It is understood that during the fabrication of the second conductive trace 52, the marker 7 may serve as a positioning structure for forming the second conductive trace 52.

[0159] Figure 5a is a planar front view of one embodiment of the display module 100 shown in Figure 4a on the second surface 104. The relative arrangement of the opening area 121 and the second through hole 131 projected onto the second surface 104 along the thickness direction of the display panel 10 is illustrated by dashed lines in Figure 5a.

[0160] As shown in Figures 4a and 5a, the first inorganic layer 12 has an opening region 121, and the second organic layer 13 can pass through the opening region 121 of the first inorganic layer 12 to contact and connect with the first organic layer 11. A first segment 41 of the conductive medium 40 is disposed on the first organic layer 11, and a second segment 42 of the conductive medium 40 passes through the opening region 121 of the first inorganic layer 12 and is disposed on the second organic layer 13. In Figure 4a, the first segment 41 and the second segment 42 of the conductive medium 40 are schematically distinguished by dashed lines. Along the thickness direction of the display panel 10, the projection of the first conductive trace 51 on the first inorganic layer 12 at least partially overlaps with the opening region 121. Thus, along the thickness direction of the display panel 10, the portion of the first conductive trace 51 and the opening region 121 facing each other is an organic layer on the side closest to the first organic layer 11.

[0161] Understandably, in the process of fabricating the display module 100, holes can be made in the substrate 1, such that the first organic layer 11 forms a first through-hole 111, which penetrates the first organic layer 11; the second organic layer 13 forms a second through-hole 131, which penetrates the second organic layer 13; and the first conductive trace 51 is exposed within the second through-hole 131. The second through-hole 131 passes through the opening region 121 of the first inorganic layer 12 and connects to the first through-hole 111. A conductive medium 40 is formed within the first through-hole 111 and the second through-hole 131, and the conductive medium 40 contacts and electrically connects to the first conductive trace 51.

[0162] The conductive medium 40 electrically connects the display panel 10 and the driver chip 30, and can be used for the transmission of drive signals between the driver chip 30 and the display panel 10. Exemplarily, a first segment 41 of the conductive medium 40 is electrically connected to the driver chip 30 and a second segment 42 of the conductive medium 40, and the second segment 42 of the conductive medium 40 is electrically connected to the first conductive trace 51. Exemplarily, when the driver chip 30 is disposed on the second surface 104 of the substrate 1, a portion of the first segment 41 of the conductive medium 40 can be disposed within the substrate 1 for electrically connecting to the second segment 42 of the conductive medium 40, and a portion can protrude from the second surface 104 of the substrate 1 for electrically connecting to the driver chip 30.

[0163] It is understood that by setting an electrical connection structure 5 inside the display panel 10 and combining it with a conductive medium 40, the display module 100 can achieve an electrical connection between the driving circuit 3 and the driving chip 30 internally. The driving signal output by the driving chip 30 is transmitted to the driving circuit 3 of the display panel 10 through the conductive medium 40 and the electrical connection structure 5, without needing to pass through the side of the display panel 10. The electrical connection structure 5 can extend along the thickness direction of the display panel 10, forming a circuit that is approximately parallel to the thickness direction of the display panel 10, allowing for a certain angle, such as 5°, 10°, 20°, 30°, etc. As shown in FIG1b, the technical solution of the embodiment of this application does not include the electrical connection structure 305 shown in FIG1b, and does not have the bent portion of the electrical connection structure 305 shown in FIG1b, which is beneficial to reducing the area of ​​the non-display area 102 of the display module 100, thereby achieving a narrow bezel of the display module 100 and improving the screen ratio of the display module 100. Furthermore, the electrical connection structure 5 and the conductive medium 40 of this application are directly disposed within the insulating medium layer 2 and the substrate 1, without the need for bending. Therefore, the electrical connection structure 5 is not prone to breakage, the electrical connection between the driver chip 30 and the driver circuit 3 has better reliability, and the display panel 10 has better display reliability.

[0164] During the process of creating holes in substrate 1, due to the differences in the coefficients of thermal expansion and etching / ablation rates between organic and inorganic materials, it is difficult to control the flatness of the hole walls and the depth of the holes if holes are created in both organic and inorganic layers at the same time, making the process difficult to implement. In the technical solution of this application, by setting an opening region 121 in the first inorganic layer 12, the second organic layer 13 passes through the opening region 121 of the first inorganic layer 12 and contacts the first organic layer 11. During the process of drilling the substrate 1, the hole can be drilled at the opening region 121 of the first inorganic layer 12. In this way, it is not necessary to penetrate the first inorganic layer 12. Only the first organic layer 11 and the second organic layer 13 need to be drilled. The first organic layer 11 forms a first through hole 111, the first segment 41 of the conductive medium 40 fills the first through hole 111, the second organic layer 13 forms a second through hole 131, the first conductive trace 51 is located at the bottom of the second through hole 131, and the second segment 42 of the conductive medium 40 fills the second through hole 131 and contacts the first conductive trace 51. This avoids the problem of poor hole wall morphology smoothness caused by the difference in etching / ablation rate of films with different materials and different thermal expansion coefficients. Figure 5a illustrates the relative positions of an embodiment of the opening region 121 of the first inorganic layer 12, the first through-hole 111 of the first organic layer 11, and the second through-hole 131 of the second organic layer 13. The cross-sectional areas of the first through-hole 111 and the second through-hole 131 can both be smaller than the area of ​​the opening region 121.

[0165] For example, holes in the first organic layer 11 and the second organic layer 13 can be drilled using a laser process. It is understood that laser processes are easy to operate, require minimal equipment, and are readily implemented. In some embodiments of this application, holes in the first organic layer 11 and the second organic layer 13 can also be drilled using a hard mask process combined with photolithography.

[0166] In some embodiments of this application, the substrate 1 may further include more organic and inorganic layers, with multiple organic and inorganic layers arranged alternately. In this case, multiple inorganic layers can each be provided with an opening region 121 on the first inorganic layer 12. The opening regions of multiple inorganic layers can be arranged relative to each other along the thickness direction of the display panel 10, so that the organic layer can pass through the inorganic layer in the opening region and contact the adjacent organic layer. In the process of opening the substrate 1, the opening at the position of the opening region 121 only involves the opening through the organic layer, avoiding the problem of poor hole wall morphology flatness caused by the difference in etching / ablation rate of multiple film layers with different materials and different thermal expansion coefficients.

[0167] As shown in Figures 4a and 5a, inside the substrate 1, at the opening region 121 of the first inorganic layer 12, the second organic layer 13 is disposed between the first inorganic layer 12 and the second segment 42 of the conductive medium 40, with the first inorganic layer 12 and the second segment 42 of the conductive medium 40 separated by the second organic layer 13. It is understood that in the drilling process of the substrate 1, making the cross-sectional areas of the first through-hole 111 and the second through-hole 131 smaller than the area of ​​the opening region 121 of the first inorganic layer 12, and the second organic layer 13 disposed between the hole wall of the second through-hole 131 and the first inorganic layer 12, can avoid the problem of the laser directly irradiating the interface between the first inorganic layer 12 and the first organic layer 11 and the second organic layer 13 during drilling, thus preventing the separation of the first inorganic layer 12 and the first organic layer 11, as well as the separation of the first inorganic layer 12 and the second organic layer 13. The first inorganic layer 12 can better prevent water vapor, oxygen and impurity ions from corroding the interior of the display panel 10.

[0168] In some embodiments, the first inorganic layer 12 and the conductive medium 40 are separated by a first organic layer 11 and a second organic layer 13. The minimum distance between the first inorganic layer 12 and the conductive medium 40 is greater than or equal to 0.5 micrometers (μm). That is, during the opening process, the edge of the opening region 121 of the first inorganic layer 12 is covered by an organic layer with a thickness of at least 0.5 micrometers, which helps to reduce the heat transferred to the interface between the inorganic and organic layers, and can further reduce the probability of separation problems between the inorganic and organic layers. For example, the minimum distance between the first inorganic layer 12 and the conductive medium 40 can be 0.5 μm, 0.6 μm, 0.7 μm, 0.8 μm, 0.9 μm, 1.0 μm, etc.

[0169] As shown in Figure 4a, the minimum distance D between the first inorganic layer 12 and the conductive medium 40 is: the distance D1 between the first inorganic layer 12 and the second segment 42 of the conductive medium 40 in the direction perpendicular to the display panel 10. D1 is greater than or equal to 0.5 μm. It can be understood that in the hole-opening process of the substrate 1, making the distance between the hole wall of the second through hole 131 and the first inorganic layer 12 in the direction perpendicular to the thickness of the display panel 10 greater than or equal to 0.5 μm can effectively avoid the problem of separation (peeling) caused by the laser directly irradiating the connection interface between the first inorganic layer 12 and the first organic layer 11 and the second organic layer 13 when drilling the first organic layer 11. The first inorganic layer 12 can better block water vapor and impurity ions from eroding the interior of the display panel 10, and can also better enhance the connection strength between the first organic layer 11 and the second organic layer 13. For example, the minimum distance between the first inorganic layer 12 and the conductive medium 40 can be 0.5μm, 0.6μm, 0.7μm, 0.8μm, 0.9μm, 1.0μm, etc.

[0170] For example, the number of conductive media 40 can be one or more. When there are multiple conductive media 40, the substrate 1 can be disposed between two adjacent conductive media 40. The substrate 1 can be used to insulate the two adjacent conductive media 40.

[0171] In some embodiments, compared to the structure shown in FIG. 1b, the width of the non-display area 102 of the display module 100 in this application embodiment can be reduced by more than 50%. For example, compared to the structure shown in FIG. 1b, the width reduction of the non-display area 102 of the display module 100 in this application embodiment can be 50%, 60%, 70%, etc. The specific reduction value is related to the size of the display module 100. For example, compared to the structure shown in FIG. 1b, the width of the non-display area 102 of the display module 100 in this application embodiment can be reduced by 0.5 millimeters (mm) or more. For example, the width of the non-display area 102 can be reduced by 0.5mm, 0.55mm, 0.6mm, 0.7mm, etc.

[0172] For example, the conductive medium 40 may also be made of conductive silver paste. In some embodiments of this application, the conductive medium 40 may also be made of conductive copper paste, conductive carbon paste, or polymer conductive material.

[0173] In some embodiments, the conductive medium 40 can fill the holes in the substrate 1 and cover the openings of the holes on the second surface 104 of the substrate 1. The conductive medium 40 can also be used to block moisture and impurity ions, reducing the erosion of the interior of the display panel 10 by moisture and impurity ions along the gap between the conductive medium 40 and the substrate 1, which helps to improve environmental reliability. For example, the conductive medium 40 can fill the first through hole 111 and cover the first through hole 111.

[0174] In some embodiments, the portion of the conductive medium 40 within the substrate 1 may be a solid structure. The first conductive trace 51 includes a first surface 5101 and a second surface 5102 disposed opposite to each other, with the second surface 5102 facing the insulating dielectric layer 2. The conductive medium 40 extends within the substrate 1 along the thickness direction of the display panel 10, contacting and connecting to the first surface 5101 of the first conductive trace 51. The second conductive trace 52 contacts and connects to the second surface 5102 of the second conductive trace 52.

[0175] In some embodiments, along the thickness direction of the display panel 10, the projection of the first portion 511 of the first conductive trace 51 onto the first inorganic layer 12 at least partially overlaps with the opening region 121 of the first inorganic layer 12. Thus, along the thickness direction of the display panel 10, the portions of the first portion 511 of the first conductive trace 51 and the opening region 121 facing each other are both organic layers on the side closest to the first organic layer 11. Exemplarily, the surface of the first portion 511 of the first conductive trace 51 facing away from the insulating dielectric layer 2 is the first surface 5101, and the surface of the second portion 512 of the first conductive trace 51 facing the insulating dielectric layer 2 is the second surface 5102. Exemplarily, a portion of the first surface 5101 of the first conductive trace 51 contacts and connects to the conductive dielectric 40, and a portion contacts and connects to the second organic layer 13.

[0176] Understandably, during the fabrication of the display module 100, before forming the first conductive trace 51, the second inorganic layer 14 can be etched to form a third via 141, which penetrates the second inorganic layer. The first conductive trace 51 can be partially formed within the third via 141 and partially formed on the surface of the second inorganic layer 14 facing the insulating dielectric layer 2. This way, when subsequently drilling holes in the substrate 1 to fill the conductive dielectric 40, it is not necessary to penetrate the second inorganic layer 14, further avoiding the problems of peeling and poor hole wall smoothness caused by differences in film materials and thermal expansion coefficients.

[0177] For example, the diameter of the contact surface of the conductive medium 40 connecting the conductive medium 40 to the first conductive trace 51 is greater than or equal to 10 micrometers. In this way, the contact area between the conductive medium 40 and the first conductive trace 51 is large, and the electrical connection between the conductive medium 40 and the first conductive trace 51 has better reliability.

[0178] It is understandable that the number of conductive media 40, the number of first conductive lines 51, and the number of second conductive lines 52 can be the same, with one conductive media 40 corresponding to one first conductive line 51 and one first conductive line 51 corresponding to one second conductive line 52. Alternatively, the number of conductive media 40, the number of first conductive lines 51, and the number of second conductive lines 52 may be different. For example, one conductive media 40 may correspond to multiple first conductive lines 51, one first conductive line 51 may correspond to one or more second conductive lines 52, and one second conductive line 52 may correspond to one or more pixel structures 6. In this way, the driving signals of multiple pixel structures 6 can be aggregated, reducing the opening of the second surface 104 of the substrate 1, thereby reducing the path for moisture to erode the interior of the display panel 10 from the substrate 1.

[0179] In some embodiments, the second conductive trace 52 may include a first trace 523. The first trace 523 contacts and connects to the second surface 5102 of the first conductive trace 51. The second surface 5102 of the first conductive trace 51 faces the insulating dielectric layer 2. The first trace 523 extends along the thickness direction of the insulating dielectric layer 2 and is electrically connected to the first conductive trace 51 and the driving circuit 3. In this way, the signal on the first conductive trace 51 is transmitted to the driving circuit via the second conductive trace 52, first extending along the thickness direction of the display panel 10, and then horizontally. The extension direction of the first trace 523 is not absolutely parallel to the thickness direction of the display panel 10; it may have a slight angle, such as 2°, 5°, 8°, or 10°.

[0180] In some embodiments, the second conductive trace 52 may further include a second trace (not shown). The extension direction of the second trace is perpendicular to the thickness direction of the display panel 10, allowing for slight errors. For example, the angle between the extension direction of the second trace and the thickness direction support of the display panel 10 is 80°, 85°, 95°, or 100°. The second trace connects the first trace 523 and the driving circuit 3, providing an electrical connection between the first trace 523 and the driving circuit 3.

[0181] In some embodiments, the display module 100 may further include a circuit board 50. The circuit board 50 may be disposed on the second surface 104 of the substrate 1. Exemplarily, the circuit board 50 may be fixedly connected to the second surface 104 of the substrate 1 using non-conductive film (NCF). Exemplarily, the circuit board 50 may include an insulating substrate 501 and conductive traces 502. The conductive traces 502 are disposed on the insulating substrate 501, which serves to insulate and protect the conductive traces 502. The conductive traces 502 electrically connect to a conductive medium 40 and a driver chip 30. The conductive medium 40 is electrically connected to the conductive traces 502 on the second surface 104 of the substrate 1, and is electrically connected to the driver chip 30 through the conductive traces 502. Thus, the driver chip 30 can be electrically connected to the conductive medium 40 through the conductive traces 502 of the circuit board 50. Exemplarily, the circuit board 50 may be a printed circuit board (PCB) or a flexible printed circuit (FPC). The material of the conductive traces 502 may be metallic copper. Understandably, the manufacturing process of circuit board 50 is mature, readily available, and low in cost.

[0182] In some embodiments, the circuit board 50 may include a top surface 53 and a bottom surface 54 disposed opposite to each other. The top surface 53 of the circuit board 50 faces the substrate 1. The bottom surface 54 of the circuit board 50 faces away from the substrate 1. Conductive traces 502 may be exposed on the bottom surface 54 of the circuit board 50. The conductive medium 40 may be electrically connected to the conductive traces 502 on the bottom surface 54 of the circuit board 50. It is understood that, compared to the scheme in which the conductive medium 40 is electrically connected to the conductive traces 502 on the top surface 53 of the circuit board 50, in this embodiment, the conductive medium 40 is electrically connected to the conductive traces 502 on the bottom surface 54 of the circuit board 50. The side of the bottom surface 54 of the circuit board 50 away from the substrate 1 has a larger space, making the fabrication and molding process easier. The conductive medium 40 can be better connected to the circuit board 50, resulting in better electrical connection reliability.

[0183] In some embodiments, the display module 100 may further include an insulating protective layer 60. The insulating protective layer 60 may be disposed on the substrate 1 and cover the conductive medium 40 and the first through-hole 111. The insulating protective layer 60 may be used to insulate and protect the conductive medium 40. Exemplarily, the material of the insulating protective layer 60 may be a waterproof resin. This further prevents moisture from eroding the interior of the display panel 10 along the gap between the conductive medium 40 and the substrate 1. When there are multiple conductive media 40, a portion of the insulating protective layer 60 may also fill between two adjacent conductive media 40, thereby insulating the two adjacent conductive media 40.

[0184] In some embodiments, the circuit board 50 may also include a connector 55. The connector 55 is fixed to the insulating substrate 501 and electrically connected to the conductive traces 502 of the circuit board 50. The conductive medium 40 may be electrically connected to the connector 55. The conductive medium 40 may be electrically connected to the driver chip 30 through the connector 55 and the conductive traces 502 of the circuit board 50. For example, the connector 55 may be disposed on the bottom surface 54 of the circuit board 50. The conductive medium 40 may be electrically connected to the conductive traces 502 on the bottom surface 54 of the circuit board 50 through the connector 55.

[0185] As shown in Figures 3 and 4a, when there are multiple pixel structures 6, the electrical connection structure 5 can be located on one side of the multiple pixel structures 6. In this way, during the fabrication of the display panel 10, the structure near the location of the pixel structure 6 does not need to be changed, and the internal structure of the display panel 10 can be modified less, which helps to reduce the design and fabrication difficulty of the display panel 10. For example, the electrical connection structure 5 can be located in the non-display area 102 of the display panel 10.

[0186] It is understandable that the electrical connection structure 5 can be located in the non-display area 102 of the display panel 10, and the electrical connection structure 5 can be connected to the driving circuit 3 in the non-display area 102. Placing the electrical connection structure 5 in the non-display area 102 will not affect the device arrangement in the display area 101. During the fabrication of the display panel 10, the device arrangement in the display area 101 of the display panel 10 does not need to be changed, which helps reduce the design and fabrication difficulty of the display panel 10. Furthermore, if the electrical connection structure 5 is placed in the display area 101, during the fabrication of the display panel 10, creating the electrical connection structure 5 requires opening holes in the substrate 1, which reduces the waterproof performance of the display area 101, making the pixel structure 6 susceptible to moisture erosion and thus affecting its light-emitting performance. In this embodiment, Figure 3 illustrates the positional relationship between the first conductor of the electrical connection structure 5 and the display area 101. As can be seen from Figures 3 and 4a, by placing the electrical connection structure 5 in the non-display area 102, during the fabrication of the display panel 10, opening holes in the non-display area 102 to form the electrical connection structure 5 has a relatively small impact on the waterproof performance of the display area 101. The pixel structure 6 is not easily corroded by water vapor, and the light emission reliability of the pixel structure 6 is better.

[0187] In some embodiments of this application, the electrical connection structure 5 may be partially located in the non-display area 102 and partially located in the display area 101. For example, along the thickness direction of the display panel 10, the projection of the electrical connection structure 5 onto the substrate 1 may partially coincide with the projection of the pixel structure 6 onto the substrate 1.

[0188] In some embodiments, the same technical content as that of the display module 100 in the previous embodiments (as shown in FIG. 4a) will not be described again. FIG. 5b is a partial cross-sectional view of the display module 100 at line BB in another embodiment.

[0189] As shown in Figure 5b, along the thickness direction of the display panel 10, the first portion 1401 of the second inorganic layer 14 can be disposed between the first portion 511 of the first conductive trace 51 and the second organic layer 13, and the second portion 1402 of the second inorganic layer 14 can be disposed between the second portion 512 of the first conductive trace 51 and the second organic layer 13. Figure 5b schematically distinguishes the first portion 1401 and the second portion 1402 of the second inorganic layer 14 by dashed lines. The second inorganic layer 14 can be used to completely separate the first conductive trace 51 and the second organic layer 13. Compared to the embodiment shown in Figure 4a, in this embodiment, the second inorganic layer 14 can be used to further enhance the connection strength between the first conductive trace 51 and the second organic layer 13, reducing the risk of detachment between the first conductive trace 51 and the second organic layer 13.

[0190] In some embodiments, along the thickness direction of the display panel 10, the distance D4 between the first portion 511 of the first conductive trace 51 and the second organic layer 13 can be greater than or equal to... and less than or equal to For example, the distance D4 between the first portion 511 of the first conductive trace 51 and the second organic layer 13 can be or

[0191] In some embodiments, during the fabrication of the display module 100, before forming the first conductive trace 51, a second inorganic layer 14 may be etched, forming a groove 961 in the second inorganic layer 14. The groove 961 forms an opening on the surface of the second inorganic layer 14 facing the insulating dielectric layer 2, and the groove 961 does not penetrate the second inorganic layer 14. The first conductive trace 51 may be partially formed within the groove 961 and partially formed on the surface of the second inorganic layer 14 facing the insulating dielectric layer 2.

[0192] In some embodiments, during the fabrication of the display module 100, after the pixel structure 6 is completed, an opening can be made in the substrate 1 from the second surface 104 of the display panel 10. A fourth through-hole 142 is formed in the second inorganic layer 14. The fourth through-hole 142 penetrates the second inorganic layer 14 and connects to the groove 961. The first conductive trace 51 can be located at the bottom of the fourth through-hole 142. Exemplarily, the conductive medium 40 may also include a third segment 43. The third segment 43 of the conductive medium 40 is disposed in the second inorganic layer 14, electrically connecting the second segment 42 of the conductive medium 40 and the first conductive trace 51. It is understood that when the substrate 1 is opened, a portion of the conductive medium 40 fills the fourth through-hole 142, forming the third segment 43 of the conductive medium 40.

[0193] In some embodiments, along the thickness direction of the display panel 10, the projection of the first portion 511 of the first conductive trace 51 onto the first inorganic layer 12 at least partially overlaps with the opening region 121 of the first inorganic layer 12. Along the thickness direction of the display panel 10, the thickness of the first portion 1401 of the second inorganic layer 14 is less than the thickness of the second portion 1402 of the second inorganic layer 14, allowing the fourth via 142 to penetrate the first portion 1401 of the second inorganic layer 14. It is understood that, compared to a solution where the fourth via 142 penetrates the second portion 1402 of the second inorganic layer 14, in this embodiment, the fourth via 142 can penetrate the first portion 1401 of the second inorganic layer 14, resulting in a smaller thickness of the second inorganic layer 14 when drilling to form the fourth via 142.

[0194] In some embodiments, the cross-sectional area of ​​the third segment 43 of the conductive medium 40 may be smaller than the cross-sectional area of ​​the first portion 511 of the first conductive trace 51. A portion of the first surface 5101 of the first conductive trace 51 contacts the conductive medium 40, and a portion contacts the second inorganic layer 14. It is understood that when the substrate 1 is perforated, the cross-sectional area of ​​the fourth through hole 142 is made smaller than the cross-sectional area of ​​the groove 961, so that the cross-sectional area of ​​the third segment 43 of the conductive medium 40 can be smaller than the cross-sectional area of ​​the first portion 511 of the first conductive trace 51. This prevents the second inorganic layer 14 from being exposed in the fourth through hole 142, and avoids the third segment 43 of the conductive medium 40 contacting the second inorganic layer 14, which would affect the electrical contact performance between the third segment 43 of the conductive medium 40 and the first conductive trace 51.

[0195] In some embodiments of this application, the cross-sectional area of ​​the third segment 43 of the conductive medium 40 may be equal to the cross-sectional area of ​​the first portion 511 of the first conductive trace 51. The groove 961 and the fourth through hole 142 have the same shape and size, and the first surface 5101 of the first portion 511 of the first conductive trace 51 may be connected only to the third segment 43 of the conductive medium 40.

[0196] In some embodiments of this application, the second inorganic layer 14 may further include a third portion 1403, a fourth portion 1404, and a fifth portion 1405. Figure 5b schematically distinguishes the first portion 1401, the second portion 1402, the third portion 1403, the fourth portion 1404, and the fifth portion 1405 of the second inorganic layer 14 by dashed lines. Along the thickness direction of the display panel, the third portion 1403 of the second inorganic layer 14 is disposed between the insulating dielectric layer 2 and the second organic layer 13; the fourth portion 1404 of the second inorganic layer 14 is disposed between the shielding structure 4 and the second organic layer 13; and the fifth portion 1405 of the second inorganic layer 14 is disposed between the identifier 7 and the second organic layer 13.

[0197] In some embodiments, the same technical content as that of the display module 100 in the previous embodiments (as shown in FIG. 4a) will not be described again. FIG. 6a is a partial cross-sectional view of the display module 100 at line BB in another embodiment.

[0198] As shown in Figures 3 and 6a, the conductive medium 40 may include a first segment 41 and a second segment 42. In Figure 6a, the first segment 41 and the second segment 42 of the conductive medium 40 are schematically distinguished by dashed lines. The cross-sectional area of ​​the first segment 41 of the conductive medium 40 may be larger than the cross-sectional area of ​​the second segment 42. It is understood that the cross-sectional area of ​​the first segment 41 of the conductive medium 40 refers to the area of ​​the cross-section of the first segment 41 of the conductive medium 40. The cross-section of the first segment 41 of the conductive medium 40 is parallel to the plane of the display panel 10. When the cross-sectional area of ​​the first segment 41 of the conductive medium 40 is different at various points along the thickness direction of the display module 100, the average cross-sectional area of ​​the first segment 41 of the conductive medium 40 is taken.

[0199] It is understandable that the cross-sectional area of ​​the first segment 41 is larger than that of the second segment 42. From the second surface 104 of the substrate 1 towards the first surface 103, the perimeter of the conductive medium 40's cross-section gradually decreases. This helps reduce the diffusion channels when moisture and impurity ions erode the display panel 10, thus lowering the risk of display defects caused by moisture and impurity ions eroding the display panel 10. For example, during the hole-making process, the diameter of the first through-hole 111 can be larger than the diameter of the second through-hole 131.

[0200] Figure 6b is a planar front view of one embodiment of the display module 100 shown in Figure 6a on the second surface 104. The shape of the first through-hole 111 in Figure 6b schematically shows the opening shape of the first through-hole 111 on the second surface 104. The shape of the second through-hole 131 schematically shows the projection shape of the opening of the second through-hole 131 on the second surface 104 along the thickness direction of the display panel 10 on the surface of the second organic layer 13 near the first organic layer 11.

[0201] As shown in Figures 6a and 6b, the first segment 41 of the conductive medium 40 includes a first portion 411 and a second portion 412. Along the thickness direction of the display panel 10, the second portion 412 of the first segment 41 of the conductive medium 40 connects the first portion 411 and the second segment 42 of the conductive medium 40. In Figure 6a, the first portion 411 and the second portion 412 of the first segment 41 of the conductive medium 40 are schematically distinguished by dashed lines. The second portion 412 of the first segment 41 of the conductive medium 40 is electrically connected to the first portion 411 and the second segment 42 of the conductive medium 40. The first portion 411 of the first segment 41 of the conductive medium 40 is electrically connected to the driver chip 30. The cross-sectional area of ​​the first portion 411 of the first segment 41 of the conductive medium 40 can be larger than the cross-sectional area of ​​the second portion 412 of the first segment 41 of the conductive medium 40.

[0202] It is understandable that when the opening shape of the first through hole 111 on the second surface 104 in Figure 6a is the same as the opening shape of the first through hole 111 on the second surface 104 in Figure 4a, and the opening area of ​​the first through hole 111 on the second surface 104 in Figure 6a is the same as the opening area of ​​the first through hole 111 on the second surface 104 in Figure 4a, compared with the scheme in Figure 4a where the opening area 121 of the first inorganic layer 12 is larger than the opening area of ​​the first through hole 111 on the second surface 104, in this embodiment, the opening area 121 of the first inorganic layer 12 can be smaller than the opening area of ​​the first through hole 111 on the second surface 104. This is beneficial to reducing the perimeter of the cross-section of the conductive medium 40 at the opening area 121, which is beneficial to reducing the diffusion channels when water vapor and impurity ions erode the display panel 10, reducing the risk of display panel 10 having display defects due to water vapor and impurity ions erode the display panel 10, and improving the environmental reliability of the display module 100.

[0203] Alternatively, when the opening shape of the first through hole 111 on the surface of the first organic layer 11 facing the second organic layer 13 in FIG6a is the same as the opening shape of the first through hole 111 on the surface of the first organic layer 11 facing the second organic layer 13 in FIG4a, and the opening area of ​​the first through hole 111 on the surface of the first organic layer 11 facing the second organic layer 13 in FIG6a is the same as the opening area of ​​the first through hole 111 on the surface of the first organic layer 11 facing the second organic layer 13 in FIG4a, the first part 411 of the first segment 41 in this embodiment can be set to be larger, which is beneficial to the electrical connection with the circuit board 50.

[0204] In some embodiments, along the thickness direction of the display panel 10, the projection of the first portion 411 of the first segment 41 of the conductive medium 40 toward the second organic layer 13 onto the first inorganic layer 12 covers the opening region 121 of the first inorganic layer 12. This helps to reduce the diffusion channels when moisture and impurity ions erode the display panel 10, reducing the risk of display defects caused by moisture and impurity ions eroding the display panel 10, and improving the environmental reliability of the display module 100.

[0205] Exemplarily, the first through-hole 111 may include a first portion 1111 and a second portion 1112. Along the thickness direction of the first organic layer 11, the second portion 1112 of the first through-hole 111 connects the first portion 1111 and the second through-hole 111. The aperture of the first portion 1111 of the first through-hole 111 may be larger than the aperture of the second portion 1112. The first portion 411 of the first segment 41 of the conductive medium 40 may be disposed in the first portion 1111 of the first through-hole 111. The second portion 412 of the first segment 41 of the conductive medium 40 may be disposed in the second portion 1112 of the first through-hole 111. It is understood that during the drilling process of the first organic layer 11, the first through-hole 111 may be configured as a stepped hole, and the first through-hole 111 may be formed in two steps. The wall surface of the first through-hole 111 is a stepped surface, and the conductive medium 40 is formed in contact with the stepped surface. The first conductive medium 40 has a smaller ramp height during the molding process, making it easier for the conductive medium 40 to adhere to the wall of the through hole. The surface of the conductive medium 40 is less prone to cracking, and the conductive medium 40 has good conductivity and mechanical reliability.

[0206] In some embodiments, the conductive medium 40 and the first inorganic layer 12 are separated by a first organic layer 11 along the thickness direction of the display panel 10. Exemplarily, the first organic layer 11 is disposed between a first portion 411 of the first segment 41 of the conductive medium 40 and the first inorganic layer 12 along the thickness direction of the display panel 10. During the process of creating the first through-hole 111 in the first organic layer 11, the peeling problem caused by direct laser irradiation at the interface between the first inorganic layer 12 and the first organic layer 11 during drilling can be avoided.

[0207] For example, along the thickness direction of the display panel 10, the distance D2 between the first portion 411 of the first segment 41 of the conductive medium 40 and the first inorganic layer 12 is greater than or equal to 0.5 micrometers. Thus, during the drilling process of the first organic layer 11, the distance between the hole wall of the first through-hole 111 and the first inorganic layer 12 is at least 0.5 μm along the thickness direction of the display panel 10, which can prevent the laser from directly irradiating the interface between the first inorganic layer 11 and the first organic layer 12 during drilling of the first organic layer 11, thus avoiding peeling problems.

[0208] In some embodiments, the first inorganic layer 12 of the substrate 1 may include multiple inorganic sublayers. Exemplarily, the first inorganic layer 12 may include a first inorganic sublayer 122 and a second inorganic sublayer 123. The first inorganic sublayer 122 is disposed between the second inorganic sublayer 123 and the first organic layer 11. The material of the first inorganic sublayer 122 may be silicon oxide, used to prevent moisture, oxygen, and impurity ions from corroding the interior of the display panel 10. The material of the second inorganic sublayer 123 may be monocrystalline silicon, used to enhance the connection strength between the first inorganic sublayer 122 and the second organic layer 13, and also to prevent moisture, oxygen, and impurity ions from corroding the interior of the display panel 10.

[0209] In some embodiments, the insulating dielectric layer 2 may include multiple layers of insulating material. Exemplarily, the insulating dielectric layer 2 may include an inorganic insulating layer 21 and an organic insulating layer 22. Exemplarily, the inorganic insulating layer 21 may include a first inorganic insulating layer 211, a second inorganic insulating layer 212, a third inorganic insulating layer 213, a fourth inorganic insulating layer 214, a fifth inorganic insulating layer 215, and a sixth inorganic insulating layer 216. Two adjacent insulating layers may use different insulating materials to achieve better insulation. For example, the first inorganic insulating layer 211, the third inorganic insulating layer 213, and the fifth inorganic insulating layer 215 may be made of silicon oxide, and the second inorganic insulating layer 212, the fourth inorganic insulating layer 214, and the sixth inorganic insulating layer 216 may be made of silicon nitride (SiNx). The organic insulating layer 22 may be made of an organic insulating material, such as polyimide (PI), or polyethylene terephthalate (PET). Exemplarily, the organic insulating layer 22 can also be configured in the same way as the inorganic insulating layer 21, including multiple layers of organic insulators made of different materials. For example, the organic insulating layer 22 may include a first organic insulating layer 221 and a second organic insulating layer 222. The organic insulating layer 22 can also serve a planarization function to facilitate the subsequent configuration of the pixel structure 6.

[0210] For example, the second conductive trace 52 of the electrical connection structure 5 may include a first portion 521 and a second portion 522. The first portion 521 of the second conductive trace 52 may be disposed on a first inorganic insulating layer 211, a second inorganic insulating layer 212, a third inorganic insulating layer 213, a fourth inorganic insulating layer 214, a fifth inorganic insulating layer 215, and a sixth inorganic insulating layer 216. The second portion 522 of the second conductive trace 52 may be disposed on an organic insulating layer 22. The first portion 521 of the second conductive trace 52 may be electrically connected to the first conductive trace 51 and the second portion 522 of the second conductive trace 52. The second portion 522 of the second conductive trace 52 may be electrically connected to the driving circuit 3.

[0211] It is understood that the first portion 521 and the second portion 522 of the second conductive trace 52 can be formed in two processes. For example, the first portion 521 of the second conductive trace 52 can be formed in the same process as the source / drain trace of the first layer of the driving circuit 3. The second portion 522 of the second conductive trace 52 can be formed in the same process as the source / drain trace of the second layer of the driving circuit 3.

[0212] It is understood that the second conductive trace 52 of the electrical connection structure 5 in Figure 6a is electrically connected to the driving circuit 3 within the organic insulating layer 22. In some embodiments of this application, the second conductive trace 52 may be electrically connected to the driving circuit 3 within the inorganic insulating layer 21. This application does not impose any limitations.

[0213] As shown in Figure 6a, the pixel structure 6 may include an anode 61, an emission layer 62, and a cathode 63 stacked sequentially. The emission layer 62 is located between the anode 61 and the cathode 63.

[0214] For example, the material of the anode 61 can be a conductive material, such as indium tin oxide.

[0215] For example, the material of the luminescent structure 62 can be an organic material, including organic small molecule luminescent materials, coordination luminescent materials, and polymers.

[0216] For example, the cathode 63 may be made of a magnesium-silver alloy or other silver-containing alloy.

[0217] As shown in Figure 6a, the display panel 10 may further include a pixel definition layer 801. The pixel definition layer 801 may be disposed on the surface of the insulating dielectric layer 2 away from the substrate 1. Pixel structures 6 may be embedded in the pixel definition layer 801. For example, multiple anodes 61 and multiple light-emitting structures 62 included in multiple pixel structures 6 may be embedded in the pixel definition layer 801. The pixel definition layer 801 may be composed of a light-shielding material and an insulating material, and may be used for insulation between multiple anodes 61; it may also be used for light shielding between multiple light-emitting structures 62, preventing the light from two adjacent light-emitting structures 62 from interfering with each other, so that the light emitted by the light-emitting structures 62 can be emitted from the display surface of the display panel 10 as much as possible.

[0218] In some embodiments, the display panel 10 may further include a support structure 802 (PS). The support structure 802 may be disposed on the surface of the pixel definition layer 801 away from the insulating dielectric layer 2. The cathode 63 may be partially disposed on the surface of the pixel definition layer 801 away from the insulating dielectric layer 2 and cover the support structure 802. It is understood that during the molding process of the light-emitting structure 6, the support structure 802 may be used to prevent damage to the surface of the pixel definition layer 801 away from the insulating dielectric layer 2.

[0219] In some embodiments, the display panel 10 may further include an encapsulation layer 803. The encapsulation layer 803 may be disposed on the surface of the pixel definition layer 801 and the plurality of pixel structures 6 away from the insulating dielectric layer 2. Exemplarily, the encapsulation layer 803 includes a first encapsulation layer 831, a second encapsulation layer 832, and a flexible interlayer 833. The first encapsulation layer 831 is located on the surface of the cathode 63 away from the light-emitting structure 62. The flexible interlayer 833 is located between the first encapsulation layer 831 and the second encapsulation layer 832.

[0220] Understandably, since the material of the light-emitting structure 62 is organic, organic materials are easily oxidized when exposed to moisture and oxygen, leading to the failure of the light-emitting structure 62. In this case, the encapsulation layer 803 is used to encapsulate the pixel structure 6 of the display area 101, thus protecting the pixel structure 6 and preventing moisture and oxygen in the air from affecting the lifespan of the light-emitting structure 62. The flexible interlayer 833 can act as a buffer for the driving circuit 3, pixel structure 6, and other structures below the encapsulation layer 803, reducing encapsulation failure. The first encapsulation layer 831 and the second encapsulation layer 832 can also seal the flexible interlayer 833.

[0221] For example, the first encapsulation layer 831 and the second encapsulation layer 832 can be SiO2 layers or Si3N4 layers fabricated by chemical vapor deposition (CVD). The flexible interlayer 833 can be an acrylate or cured polyester polymer organic layer formed by inkjet printing (IJP) technology.

[0222] In some embodiments of this application, the display panel 10 may further include a touch layer. The touch layer may be located on the surface of the encapsulation layer 803 away from the substrate 1. It is understood that Figures 4a and 6a are examples of one implementation of the display panel 10, and in some embodiments of this application, the display panel 10 may further include more functional layers or fewer layer structures.

[0223] In some embodiments, the method for fabricating the display panel 10 may include: forming an un-drilled substrate 109 on a substrate 91; forming a first conductive trace 51 on the un-drilled substrate 109; forming a driving circuit 3 on the un-drilled substrate 109; forming an insulating dielectric layer 2 on the un-drilled substrate 109 and the first conductive trace 51; and forming a second conductive trace 52 on the first conductive trace 51. The insulating dielectric layer 2 is disposed on the un-drilled substrate 109 and covers the first conductive trace 51. The driving circuit 3 and the second conductive trace 52 are disposed on the insulating dielectric layer 2. The second conductive trace 52 is electrically connected to the driving circuit 3 and the first conductive trace 51. Other layer structures of the display panel 10, such as a pixel structure 6, are further formed on the insulating dielectric layer 2; the substrate 91 is removed to form the display panel 10.

[0224] In some embodiments, the method for fabricating the display module 100 may include: drilling holes in the un-drilled substrate 109 of the display panel 10 to form a substrate 1, with a first conductive trace 51 at the bottom of the hole in the substrate 1; mounting a driver chip 30 and a circuit board 50 on the substrate 1, with the driver chip 30 electrically connected to the circuit board 50; forming a conductive medium 40 in the hole in the substrate 1, with the conductive medium 40 contacting and connecting the first conductive trace 51, and the conductive medium 40 electrically connecting the circuit board 50 and the first conductive trace 51 to form the display module 100.

[0225] By way of example, taking the display module 100 shown in FIG. 6a as an example, one embodiment of the manufacturing method will be described. FIG. 7 to FIG. 15 are cross-sectional views of the product structure corresponding to one manufacturing process of the display module 100 shown in FIG. 6a.

[0226] As shown in Figure 7, a first organic layer 92 and a first inorganic layer 93 to be processed are sequentially formed on a substrate 91. The first inorganic layer 93 to be processed is located on the surface of the first organic layer 92 that is away from the substrate 91.

[0227] For example, the substrate 91 may be made of glass. The first organic layer 92 to be treated can be prepared by a coating process. The first inorganic layer 93 to be treated can be deposited by chemical vapor deposition (CVD).

[0228] For example, when the first inorganic layer 12 of the display panel 10 includes a first inorganic sublayer 122 and a second inorganic sublayer 123, the first inorganic layer 93 to be processed may include a first inorganic sublayer 931 to be processed and a second inorganic sublayer 932 to be processed. The first inorganic sublayer 931 to be processed is located between the first organic layer 92 to be processed and the second inorganic sublayer 932 to be processed.

[0229] As shown in Figures 7 and 8, the first inorganic layer 93 to be processed is etched to form the first inorganic layer 12. The first inorganic layer 12 is provided with a first through hole 124, which penetrates the first inorganic layer 12.

[0230] For example, the first inorganic layer 93 to be treated can be exposed, developed and etched to form the first inorganic layer 12.

[0231] For example, the first inorganic layer 93 to be processed may include a first inorganic sublayer 931 to be processed and a second inorganic sublayer 932 to be processed. The first inorganic sublayer 931 to be processed is etched to form a first inorganic sublayer 122, and the second inorganic sublayer 932 to be processed is etched to form a second inorganic sublayer 123. The first inorganic sublayer 122 has a first sub-hole 1221 that penetrates the first inorganic sublayer 122. The second inorganic sublayer 123 has a second sub-hole 1231 that penetrates the second inorganic sublayer 123. The first sub-hole 1221 communicates with the second sub-hole 1231. The first sub-hole 1221 and the second sub-hole 1231 constitute a first through-hole 124. Along the thickness direction of the first organic layer 92 to be processed, the projection of the first sub-hole 1221 onto the second inorganic sublayer 123 coincides with or partially coincides with the second sub-hole 1231. It is understandable that the projection of the first sub-hole 1221 onto the second inorganic sub-layer 123 coincides with the second sub-hole 1231. The first inorganic sub-layer 931 to be processed and the second inorganic sub-layer 932 to be processed can be formed by exposure, development and etching in one step, which helps to simplify the design process.

[0232] As shown in Figures 8 and 9, a second organic layer 94 to be processed is formed on the first inorganic layer 12 and the first organic layer 92 to be processed. A portion of the second organic layer 94 to be processed fills the first through hole 124, passes through the first inorganic layer 12, and contacts the first organic layer 92 to be processed. The location of the first through hole 124 forms an opening region 121 of the first inorganic layer 12.

[0233] For example, a coating process can be used to prepare the second organic layer 94 to be treated.

[0234] As shown in Figures 9 and 10, a second inorganic layer 95 is formed on the surface of the second organic layer 94 to be treated, away from the first inorganic layer 12.

[0235] For example, chemical vapor deposition (CVD) can be used to form the second inorganic layer 95 to be treated.

[0236] As shown in Figures 10 and 11, the second inorganic layer 95 to be treated is etched to form a pre-treated second inorganic layer 96. The pre-treated second inorganic layer 96 has a groove 961, which does not penetrate the pre-treated second inorganic layer 96. The groove 961 forms an opening on the surface of the pre-treated second inorganic layer 96 facing away from the second organic layer 94 to be treated. Along the thickness direction of the second inorganic layer 14, the projection of the groove 961 onto the first inorganic layer 12 at least partially overlaps with the opening region 121 of the first inorganic layer 12. The first organic layer 92 to be treated, the first inorganic layer 12, the second organic layer 94 to be treated, and the pre-treated second inorganic layer 96 form an un-drilled substrate 109.

[0237] For example, the second inorganic layer 95 to be treated can be exposed, developed, and etched to form a pretreated second inorganic layer 96.

[0238] For example, along the thickness direction of the pretreated second inorganic layer 96, the distance between the bottom wall of the groove 961 and the second organic layer 94 to be treated can be... or

[0239] As shown in Figures 11 and 12, a metal layer 97 to be processed is formed on the pre-processed second inorganic layer 96, and a portion of the metal layer 97 to be processed fills the groove 961.

[0240] For example, the metal layer 97 to be treated can be formed using a physical vapor deposition (PVD) process. For example, the material of the metal layer 97 to be treated can be molybdenum (Mo).

[0241] As shown in Figures 12 and 13, the metal layer 97 to be processed is etched to form the first conductive trace 51 and the identifier 7. A portion of the metal layer 97 forms the identifier 7, and a portion forms the first conductive trace 51. The first conductive trace 51 fills the groove 961. The first conductive trace 51 and the second organic layer 13 are completely separated by a pre-treated second inorganic layer 96. The first conductive trace 51 and the identifier 7 can be formed in the same process, without requiring additional steps, thus reducing production costs and simplifying the design of the display panel 10.

[0242] For example, the metal layer 97 to be processed filled in the groove 961 forms a first portion 511 of the first conductive trace 51. The first portion 511 of the first conductive trace 51 is embedded in the pre-processed second inorganic layer 96. The metal layer 97 to be processed outside the groove 961 forms a second portion 512 of the first conductive trace 51.

[0243] For example, etching the metal layer 97 can also form a shielding structure 4 (see Figure 6a). A portion of the metal layer 97 forms the shielding structure 4. The first conductive trace 51 and the identifier 7 can be formed in the same process as the shielding structure 4, without the need for additional processes, thus not increasing production costs and reducing the design complexity of the display panel 10.

[0244] For example, etching the metal layer 97 to be processed may also form only the first conductive trace 51. The identifier 7 and / or the shielding structure 4 may be formed by etching other metal layers.

[0245] As shown in Figures 13 and 14, an insulating dielectric layer 2 and a driving circuit 3 are formed on the pre-processed second inorganic layer 96 and the first conductive trace 51, and a second conductive trace 52 is formed on the first conductive trace 51. The insulating dielectric layer 2 is disposed on the pre-processed second inorganic layer 96 and covers the first conductive trace 51 and the identifier 7. The first conductive trace 51 and the identifier 7 are separated by the insulating dielectric layer 2. The second conductive trace 52 is disposed on the insulating dielectric layer 2 and connects to the first conductive trace 51. The driving circuit 3 and the second conductive trace 52 are disposed on the insulating dielectric layer 2. The insulating dielectric layer 2 may be partially disposed between the driving circuit 3 and the first conductive trace 51, partially disposed between the driving circuit 3 and the identifier 7, and partially disposed between the first conductive trace 51 and the identifier 7. The second conductive trace 52 is connected to the first conductive trace 51 and is electrically connected to the first conductive trace 51. The driving circuit 3 and the second conductive trace 52 are separated and insulated by the insulating dielectric layer 2.

[0246] For example, when a portion of the metal layer 97 to be processed forms the shielding structure 4, the insulating dielectric layer 2 may also cover the shielding structure 4. The shielding structure 4 and the first conductive trace 51, and the shielding structure 4 and the identifier 7, may be separated by the insulating dielectric layer 2.

[0247] In some implementations, the identifier 7 can be used to align the formation of the second conductive trace 52 and its contact with the first conductive trace 51.

[0248] As shown in Figure 14, other layer structures of the display panel 10, such as pixel structure 6, are formed on the insulating dielectric layer 2. The substrate 91 is then removed to form the display panel 10. The first organic layer 92 to be processed, the first inorganic layer 12, the second organic layer 94 to be processed, and the pre-processed second inorganic layer 96 constitute the unperforated substrate 109 of the display panel 10.

[0249] As shown in Figures 14 and 15, the substrate 91 is removed, and holes are made in the un-drilled substrate 109 to form the substrate 1 of the display module 100. Exemplarily, holes are made in the first organic layer 92 to be processed, the second organic layer 94 to be processed, and the pre-processed second inorganic layer 96 to form a first organic layer 11, a second organic layer 13, and a second inorganic layer 14, respectively. A first through-hole 111 is formed in the first organic layer 11, penetrating the first organic layer 11. A second through-hole 131 is formed in the second organic layer 13, passing through the first through-hole 124 and penetrating the second organic layer 13. A fourth through-hole 142 is formed in the second inorganic layer 14, penetrating the second inorganic layer 14 and connecting to the groove 961. The second through-hole 131 connects the first through-hole 111 and the fourth through-hole 142, and a first conductive trace 51 is exposed in the fourth through-hole 142. The cross-sectional area of ​​the second through hole 131 is smaller than that of the first through hole 124, and the wall of the second through hole 131 and the wall of the first through hole 124 do not contact each other. The second organic layer 13 is disposed between the wall of the second through hole 131 and the first inorganic layer 12.

[0250] For example, the distance between the wall of the second through hole 131 and the wall of the first through hole 124 is greater than or equal to 0.5 micrometers. It is understood that during the hole-making process, the edge of the opening region 121 of the first inorganic layer 12 (the wall of the first through hole 124) is covered by an organic layer with a thickness of at least 0.5 micrometers, which helps to reduce the heat transferred to the interface between the inorganic and organic layers and can reduce the probability of separation problems between the inorganic and organic layers.

[0251] For example, a laser can be used to create openings in the first organic layer 92, the second organic layer 94, and the pre-treated second inorganic layer 96 of the display panel 10. Laser processing is easy to operate, requires minimal equipment, and is readily implemented. Alternatively, the openings can be created by etching the first organic layer 92, the second organic layer 94, and the pre-treated second inorganic layer 96 using a Hard Mask process.

[0252] As shown in Figures 15 and 6a, a driver chip 30 and a circuit board 50 are mounted on a substrate 1. The driver chip 30 is electrically connected to the circuit board 50. A conductive medium 40 is formed in the first through hole 111, the second through hole 131 and the fourth through hole 142. The conductive medium 40 contacts and connects to the first conductive trace 51 and is electrically connected to the circuit board 50, forming a display module 100 as shown in Figure 6a.

[0253] For example, the conductive medium 40 can be formed by ink spraying.

[0254] For example, in the drilling process, the first through hole 111 can be configured as a stepped hole, and the first through hole 111 can be etched and formed in two steps. The wall surface of the first through hole 111 is a stepped surface, and the conductive medium 40 is formed by contacting the stepped surface. The climbing height of the first conductive medium 40 during the forming process is small, the conductive medium 40 is easier to adhere to the wall surface of the through hole, the surface of the conductive medium 40 is less prone to cracking, and the conductive performance and mechanical reliability of the conductive medium 40 are good.

[0255] For example, as shown in Figures 6a and 15, the first through-hole 111 may include a first portion 1111 and a second portion 1112. Along the thickness direction of the first organic layer 11, the second portion 1112 of the first through-hole 111 connects the first portion 1111 of the first through-hole 111 and the second through-hole 131. The cross-sectional area of ​​the first portion 1111 of the first through-hole 111 may be larger than the cross-sectional area of ​​the second portion 1112 of the first through-hole 111. The first portion 411 of the first segment 41 of the conductive medium 40 is located within the first portion 1111 of the first through-hole 111, and the second portion 412 of the first segment 41 of the conductive medium 40 is located within the second portion 1112 of the first through-hole 111.

[0256] For example, the distance between the bottom surface of the first portion 1111 of the first through-hole 111 and the first inorganic layer 12 is greater than or equal to 0.5 micrometers. In this way, during the drilling process of the first organic layer 11, along the thickness direction of the display panel 10, the distance between the hole wall of the first portion 1111 of the first through-hole 111 and the first inorganic layer 12 is at least 0.5 μm, which can avoid the peeling problem caused by the laser directly irradiating the interface between the first inorganic layer 12 and the first organic layer 11 when drilling the first organic layer 11.

[0257] In some embodiments, when there are multiple conductive media 40, the first portion 1111 of the first through hole 111 can be connected to the second portion 1112 of the multiple first through holes 111, or the first portion 1111 of the multiple first through holes 111 can be connected to the second portion 1112 of the multiple first through holes 111 in a one-to-one correspondence.

[0258] For example, the number of first segments 41 of conductive medium 40, the number of second segments 42 of conductive medium 40, the number of second portions 1112 of first through holes 111, and the number of second through holes 131 are all multiple and equal. The first portion 1111 of one first through hole 111 connects to the second portions 1112 of multiple first through holes 111. The first segments 41 of multiple conductive mediums 40 fill the second portions 1112 of each first through hole 111 through the first portions 1111 of the first through holes 111 respectively. The second segments 42 of multiple conductive mediums 40 fill each second through hole 131 respectively. The multiple conductive mediums 40 do not contact each other within the first portions 1111 of the first through holes 111.

[0259] Understandably, the first portion 1111 of a first through-hole 111 connects to the second portions 1112 of multiple first through-holes 111. The space of the first portion 1111 of a first through-hole 111 is relatively large and can be used to accommodate the driver chip 30 and / or the circuit board 50. The conductive medium 40 can achieve electrical connection with the driver chip 30 within the first portion 1111 of the first through-hole 111. The height of the conductive medium 40 in the thickness direction of the display panel 10 can be set to be small, which helps to reduce the resistance of the conductive medium 40.

[0260] For example, the number of first segments 41 of conductive medium 40, the number of second segments 42 of conductive medium 40, the number of first portions 1111 of first through holes 111, the number of second portions 1112 of first through holes 111, and the number of second through holes 131 are all multiple and equal. The conductive medium 40, the first portions 1111 of first through holes 111, the second portions 1112 of first through holes 111, and the second through holes 131 are arranged in a one-to-one correspondence. The first segments 41 of the multiple conductive media 40 fill the second portions 1112 of each first through hole 111 through the first portions 1111 of each first through hole 111, and the second segments 42 of the multiple conductive media 40 fill each second through hole 131. The multiple conductive media 40 do not contact each other.

[0261] It is understandable that, compared to the first part 1111 of a first through hole 111 connecting to the second part 1112 of multiple first through holes 111, in this embodiment, each conductive medium corresponds to the first part 1111 of a first through hole 111. The sum of the cross-sectional areas of the first parts 1111 of multiple first through holes 111 can be set to be smaller, which is beneficial to reduce the diffusion channels when water vapor and impurity ions erode the display panel 10, and reduce the risk of water vapor and impurity ions erode the display module 100 and cause display defects.

[0262] For example, when there are multiple conductive media 40, the insulating protective layer 60 can cover the first through hole 111 and the conductive media 40, and fill the space between two adjacent conductive media 40, so that the two adjacent conductive media 40 are insulated.

[0263] Furthermore, the arrangement of the first through hole 111 and the second through hole 131 can refer to the arrangement of the first part 1111 and the second part 1112 of the first through hole 111. One first through hole 111 can connect to multiple second through holes 131, or the number of both first through holes 111 and second through holes 131 can be multiple and equal, with each of the multiple first through holes 111 corresponding to one of the multiple second through holes 131. This will be illustrated in the accompanying drawings below and will not be elaborated further here.

[0264] It is understandable that when there are multiple conductive media 40, the arrangement of the first part 1111 of the first through hole 111, the second part 1112 of the first through hole 111, and the second through hole 131 can be selectively designed according to requirements.

[0265] Figure 16 is a schematic diagram of another embodiment of the display module 100 shown in Figure 6a at point C. Figure 16 only shows a portion of the structure of the display module 100 shown in Figure 7 at point C.

[0266] As shown in Figure 16, the side surface 401 of the conductive dielectric 40 can be a continuous slope. The slope forms an angle with the display panel 10. It is understood that during the drilling process of the first organic layer 11 and the second organic layer 13, the first through hole 111 of the first organic layer 11 and the second through hole 131 of the second organic layer 13 can be formed in one process.

[0267] For example, when the side surface 401 of the conductive medium 40 is an inclined surface, the minimum distance D3 between the first inorganic layer 12 and the conductive medium 40 is: the distance from the edge of the opening region 121 of the first inorganic layer 12 to the side surface 401 of the conductive medium 40 along the direction perpendicular to the side surface 401 of the conductive medium 40, as shown in FIG16.

[0268] In some embodiments of this application, the first conductive trace 51 includes a first surface 5101 and a second surface 5102 disposed opposite to each other. A portion of the first surface 5101 of the first conductive trace 51 is in contact with the second organic layer 13, and a portion is in contact with the conductive dielectric 40.

[0269] Understandably, in the process of fabricating the display panel 10, the second inorganic layer 14 is etched to form the third through hole 141, which penetrates the second inorganic layer 14. The first conductive trace 51 passes through the second inorganic layer 14 and contacts the second organic layer 13. Therefore, when drilling holes in the substrate 1 to fill the conductive medium 40, it is not necessary to penetrate the second inorganic layer 14. This further avoids the problems of peeling and poor hole wall morphology caused by the differences in film materials and thermal expansion coefficients.

[0270] Figures 17 and 18 are cross-sectional views of the product structure corresponding to one manufacturing process of the display module 100 shown in Figure 16. The technical details of the manufacturing method of the display module 100 in the previous embodiments (as shown in Figures 7 to 15) will not be repeated.

[0271] As shown in Figures 10, 17, and 18, during the fabrication of the display module 100, the second inorganic layer 95 to be processed is etched to directly form the second inorganic layer 14. The second inorganic layer 14 has a third through-hole 141 that penetrates through the second inorganic layer 14. The second organic layer 13 is exposed within the third through-hole 141. The first organic layer 92 to be processed, the first inorganic layer 12, the second organic layer 94 to be processed, and the second inorganic layer 14 constitute the un-drilled substrate 109 of the display panel 10. A metal layer 97 to be processed is formed on the second inorganic layer 14 and the second organic layer 13. A portion of the metal layer 97 fills the third through-hole 141, and the second organic layer 13 is contacted and connected within the third through-hole 141.

[0272] Figure 19 is a schematic diagram of another embodiment of the display module 100 shown in Figure 6a at point C. Figure 20 is a schematic diagram of another embodiment of the display module 100 shown in Figure 6a at point C. Figure 21 is a schematic diagram of another embodiment of the display module 100 shown in Figure 6a at point C.

[0273] As shown in Figures 19 to 21, the conductive medium 40 may include a first segment 41 and a second segment 42. The first segment 41 and the second segment 42 are schematically distinguished by dashed lines in Figure 6a. The first segment 41 is disposed on the first organic layer 11, and the second segment 42 is disposed on the second organic layer 13. The surface of the first segment 41 of the conductive medium 40 near the second organic layer 13 can be partially connected to the second organic layer 13 and partially connected to the second segment 42 of the conductive medium 40. It can be understood that the contact surfaces between the substrate 1 and the first segment 41 and the second segment 42 of the conductive medium 40 can be stepped surfaces, resulting in a smaller ramp height for the conductive medium 40 during the molding process and better mechanical reliability and strength of the formed conductive medium 40.

[0274] It is understandable that, as shown in Figures 19 and 20, the side surface 4101 of the first segment 41 and the side surface 4201 of the second segment 42 of the conductive medium 40 can have a partially smooth transition, that is, there are contact connections between the side surface 4101 of the first segment 41 and the side surface 4201 of the second segment 42. For example, in Figure 19, the side surface 4101 of the first segment 41 and the side surface 4101 of the second segment 42 are contacted on the left side. As another example, in Figure 20, the side surface 4101 of the first segment 41 and the side surface 4101 of the second segment 42 are contacted on the right side. As shown in Figure 21, the side surface 4101 of the first segment 41 and the side surface 4201 of the second segment 42 of the conductive medium 40 may also not be in contact. The different relative positions of the first segment 41 and the second segment 42 can be achieved by adjusting the relative positions of the first through-hole 111 and the second through-hole 131 when the first organic layer 11 is opened with a first through-hole 111 and the second organic layer 13 is opened with a second through-hole 131.

[0275] Figure 22 is a structural schematic diagram of another embodiment of the display module 100 shown in Figure 6a at point C. Figure 23 is a structural schematic diagram of another embodiment of the display module 100 shown in Figure 6a at point C.

[0276] As shown in Figure 21, the central axis O1 of the first segment 41 of the conductive medium 40 and the central axis O2 of the second segment 42 of the conductive medium 40 can coincide. As shown in Figures 22 and 23, the central axis O1 of the first segment 41 of the conductive medium 40 and the central axis O2 of the second segment 42 of the conductive medium 40 can also be offset. For example, as shown in Figure 22, the central axis O1 of the first segment 41 of the conductive medium 40 can be located to the right of the central axis O2 of the second segment 42 of the conductive medium 40. As another example, the central axis O1 of the first segment 41 of the conductive medium 40 can be located to the left of the central axis O2 of the second segment 42 of the conductive medium 40.

[0277] Figure 24 is a schematic diagram of one embodiment of the first organic layer 11 and the second organic layer 13 shown in Figure 21. Figure 25 is a schematic diagram of one embodiment of the conductive medium 40, circuit board 50, first organic layer 11, and second organic layer 13 shown in Figure 4a. Both Figures 24 and 25 are views of the display panel 10 from the second surface 104 side. The structure below the conductive medium 40 is indicated by dashed lines in Figure 25. For ease of understanding, Figures 24 and 25 are schematic diagrams of the approximate positions of the components; the actual size, scale, actual position, and actual construction of these components are not limited by the figures.

[0278] As shown in Figures 24 and 25, in the drilling process, a first through hole 111 provided in the first organic layer 11 can simultaneously connect to multiple second through holes 131.

[0279] As shown in Figures 21, 24, and 25, the first segment 41 of the conductive medium 40 is located within the first through-hole 111, and the second segment 42 of the conductive medium 40 is located within the second through-hole 131. The number of conductive media 40 and the number of second through-holes 131 are both multiple and equal. One first through-hole 111 connects multiple second through-holes 131, and multiple conductive media 40 fill each second through-hole 131 respectively through the first through-hole 111. The multiple conductive media 40 do not contact each other within the first through-hole 111. Exemplarily, the multiple conductive media 40 can be spaced apart within the first through-hole 111 by an insulating protective layer 60. The insulating protective layer 60 can insulate adjacent conductive media 40 from each other.

[0280] It is understood that a first through-hole 111 connects to multiple second through-holes 131. The cross-sectional area of ​​the first through-hole 111 can be relatively large. When the driver chip 30 is electrically connected to the conductive medium 40 through the circuit board 50, part or all of the circuit board 50 can be disposed within the first through-hole 111, as illustrated in the accompanying drawings below. Furthermore, the driver chip 30 can also be disposed within the first through-hole 111. The conductive medium 40 can achieve electrical connection with the driver chip 30 within the first through-hole 111, which helps to reduce the height of the conductive medium 40 along the thickness direction of the display panel 10 and reduce the resistance of the conductive medium 40.

[0281] Figure 26 is a schematic diagram of another embodiment of the structure shown in Figure 24. Figure 27 is a schematic diagram of another embodiment of the structure shown in Figure 25. The structure below the conductive medium 40 is shown by dashed lines in Figure 27.

[0282] As shown in Figures 26 and 27, in the drilling process, one first through-hole 111 corresponds to one second through-hole 131. A conductive medium 40 covers the opening of the first through-hole 111 on the second surface 104 of the display panel 10. In this way, the conductive medium 40 can effectively fill the first through-hole 111, and can better prevent moisture and oxygen from eroding the interior of the display panel 10, thus improving environmental reliability.

[0283] As shown in Figures 21, 26, and 27, the first segment 41 of the conductive medium 40 is located within the first through hole 111, and the second segment 42 of the conductive medium 40 is located within the second through hole 131. The number of conductive media 40, the number of first through holes 111, and the number of second through holes 131 are all multiple and equal. The conductive media 40, the first through holes 111, and the second through holes 131 are arranged in a one-to-one correspondence. Multiple conductive media 40 fill each second through hole 131 through each first through hole 111, and the multiple conductive media 40 do not contact each other.

[0284] It is understandable that, compared to one first through hole 111 corresponding to multiple second through holes 131, in this embodiment, each conductive medium 40 corresponds to one first through hole 111, and the sum of the cross-sectional areas of multiple first through holes 111 can be set to be smaller, which is beneficial to reduce the diffusion channels when water vapor and impurity ions erode the display panel 10, and reduce the risk of water vapor and impurity ions erode the display module and cause display failure.

[0285] Figure 28 is a structural schematic diagram of another embodiment of the display module 100 shown in Figure 6a at point C.

[0286] As shown in Figure 28, the first segment 41 of the conductive medium 40 includes a first portion 411 and a second portion 412. Along the thickness direction of the display panel 10, the second portion 412 of the first segment 41 of the conductive medium 40 connects the first portion 411 and the second segment 42 of the conductive medium 40. The cross-sectional area of ​​the first portion 411 of the first segment 41 of the conductive medium 40 is larger than the cross-sectional area of ​​the second portion 412 of the first segment 41 of the conductive medium 40. The cross-sectional area of ​​the second portion 412 of the first segment 41 of the conductive medium 40 can be larger than the cross-sectional area of ​​the second segment 42 of the conductive medium 40. Thus, compared to Figure 6a where the cross-sectional area of ​​the second portion 412 of the first segment 41 of the conductive medium 40 is equal to the cross-sectional area of ​​the second segment 42 of the conductive medium 40, in this embodiment, the ramp height of the conductive medium 40 during the molding process can be further reduced, which is beneficial to improving the conductivity of the conductive medium 40.

[0287] For example, Figures 6a and 19 to 23 illustrate that within the substrate 1, along the thickness direction of the display panel 10, the conductive medium 40 can be divided into two segments with different cross-sectional areas. Figure 28 illustrates that within the substrate 1, along the thickness direction of the display panel 10, the conductive medium 40 can be divided into three segments with different cross-sectional areas. It can be understood that within the substrate 1, along the direction from the second surface 104 to the first surface 103, the conductive medium 40 can be divided into multiple segments with different cross-sectional areas, and the cross-sectional areas gradually decrease. During the fabrication of the conductive medium 40, steps can be provided to form the conductive medium 40. The conductive medium 40 can include multiple segments with different cross-sectional areas. When the thickness of the substrate 1 remains constant, multiple stepped surfaces help reduce the climbing height of the conductive medium 40, resulting in a greater amount of conductive medium 40 adhering to the hole walls, less likelihood of cracks forming on the surface of the conductive medium 40, and lower resistance, which is beneficial for improving the conductivity and overall mechanical reliability of the conductive medium 40.

[0288] It is understood that during the forming process of the conductive medium 40, the conductive medium 40 can form different cross-sectional areas at both ends by passing through one step, and can form three different cross-sectional areas by passing through two steps. The number of steps can be one or more, and is not limited to one shown in Figures 6a, 19 to 23 of this application, or two shown in Figure 28.

[0289] It is understandable that the steps can be formed in various ways during the fabrication of the display module 100. For example, the first through hole 111 can be set as a stepped hole; or the second through hole 131 can be set as a stepped hole; or the diameters of the first through hole 111 and the second through hole 131 can be set differently; or the cross-sectional shape of the first through hole 111 and the cross-sectional shape of the second through hole 131 can be different.

[0290] For example, the cross-sectional shape of the first through hole 111 can be trapezoidal, rectangular, circular, or elliptical, etc. The cross-sectional shape of the second through hole 131 can be trapezoidal, rectangular, circular, or elliptical, etc. In the embodiments of this application, the cross-sectional shape of the through hole refers to the cross-sectional shape of the through hole in the plane where the display module 100 is located. The cross-sectional shape of the first through hole 111 and the cross-sectional shape of the second through hole 131 can be the same or different.

[0291] Figure 29 is a structural schematic diagram of another embodiment of the display module 100 shown in Figure 6a at point C.

[0292] As shown in Figure 29, the circuit board 50 may include a top surface 53 and a bottom surface 54 disposed opposite to each other. The top surface 53 of the circuit board 50 faces the substrate 1. The bottom surface 54 of the circuit board 50 faces away from the substrate 1. The conductive medium 40 can electrically connect the conductive traces 502 of the circuit board 50 to the top surface 53 of the circuit board 50. Exemplarily, the circuit board 50 may also include a connector 55. The connector 55 is disposed on the top surface 53 of the circuit board 50. The connector 55 is fixedly connected to the surface of the insulating substrate facing the first organic layer 11 and electrically connected to the conductive traces 502. The conductive medium 40 can electrically connect to the connector 55.

[0293] It is understandable that, compared to the scheme in Figure 4a where the conductive medium 40 is electrically connected to the conductive trace 502 on the bottom surface 54 of the circuit board 50, in this embodiment, the conductive medium 40 can be electrically connected to the circuit board 50 on the top surface 53 of the circuit board 50. The top surface 53 of the circuit board 50 is located on the side of the bottom surface 54 of the circuit board 50 closer to the substrate 1. The height of the conductive medium 40 in the thickness direction of the display panel 10 is smaller, the electrical connection path between the first conductive trace 51 and the driving chip 30 is shorter, and the resistance of the conductive medium 40 is smaller.

[0294] Figure 30 is a structural schematic diagram of another embodiment of the display module 100 shown in Figure 6a at point C. Figure 31 is a structural schematic diagram of one embodiment of the conductive medium 40, circuit board 50, first organic layer 11, and second organic layer 13 shown in Figure 30. Figure 32 is a planar front view of one embodiment of the conductive medium 40, circuit board 50, first organic layer 11, and second organic layer 13 shown in Figure 30. Referring to the coordinate system, both Figures 31 and 32 are views of the display panel 10 shown from the second surface 104 side of the substrate 1.

[0295] As shown in Figures 30 to 32, the circuit board 50 can extend into the substrate 1. Exemplarily, a portion of the insulating substrate 501 and a portion of the conductive trace 502 can be disposed within a hole in the substrate 1; for example, a portion of the insulating substrate 501 and a portion of the conductive trace 502 can be disposed within the first through-hole 111. The substrate 1 and the circuit board 50 can be disposed opposite each other along a direction perpendicular to the thickness of the display panel 10. In this way, the conductive medium 40 can be entirely disposed within the hole in the substrate 1, enabling electrical connection with the circuit board 50 within the hole in the substrate 1, without needing to protrude from the second surface 104 of the substrate 1. The solution of this embodiment is advantageous in further reducing the height of the conductive medium 40 in the thickness direction of the display panel 10, thereby reducing the resistance of the conductive medium 40. Furthermore, during the preparation process, the conductive medium 40 is not easy to adhere at the corners and is prone to cracking. Compared with the embodiment in Figure 29, in this embodiment, the conductive medium 40 climbs up the corner of the second surface 104 of the display panel 10 from the first through hole 111 one less time, which helps to reduce the cracking of the conductive medium 40. The electrical connection reliability of the conductive medium 40 is better, and the mechanical reliability is also better.

[0296] For example, the first organic layer 11 can be disposed opposite to the circuit board 50 in a direction perpendicular to the thickness of the display panel 10.

[0297] Figure 33 is a schematic diagram of another embodiment of the structure shown in Figure 30.

[0298] As shown in Figure 33, it can be understood that when the circuit board 50 is embedded in the substrate 1, the connector 55 of the circuit board 50 can be disposed on the top surface 53 of the circuit board 50, and the conductive medium 40 can be electrically connected to the connector 55 on the top surface 53 of the circuit board 50. In this way, compared with the solution in Figure 30, this embodiment is advantageous in further reducing the height of the conductive medium 40 in the thickness direction of the display panel 10, thereby reducing the resistance of the conductive medium 40.

[0299] It is understandable that in the process of manufacturing the display module 100, a portion of the circuit board 50 can be installed in the first through hole 111, and a portion can be installed on the second surface 104 of the substrate 1; or, the circuit board 50 and the driver chip 30 can both be installed in the first through hole 111. When a portion of the circuit board 50 is installed in the first through hole 111 and a portion is installed on the second surface 104 of the substrate 1, the portion of the circuit board 50 disposed in the first through hole 111 can be installed simultaneously on the bottom surface and the side surface of the first through hole 111 (as shown in Figure 30); or, it can be installed only on the side surface of the first through hole 111; or, it can be installed only on the bottom surface of the first through hole 111.

[0300] It is understandable that the driver chip 30 can be installed in the first through hole 111 or on the second surface 104 of the substrate 1.

[0301] For example, as shown in Figures 30 and 33, when the first through-hole 111 includes a first portion 1111 and a second portion 1112, the second surface 104 of the substrate 1 may include the first portion 1111 of the first through-hole 111, that is, the opening of the first portion 1111 of the first through-hole 111 may be on the second surface 104. The insulating substrate 501 may be partially located within the first portion 1111 of the first through-hole 111, the conductive trace 502 may be partially located within the first portion 1111 of the first through-hole 111, and the conductive medium 40 may electrically connect the conductive trace 502 within the first organic layer 11. The portion of the insulating substrate 501 disposed within the first portion 1111 of the first through-hole 111 may be mounted on the bottom surface of the first portion 1111 of the first through-hole 111, or mounted on the side surface, or simultaneously mounted on the bottom surface and the side surface. The portion of the conductive trace located within the first part 1111 of the first through hole 111 can be installed on the bottom surface of the first part 1111 of the first through hole 111, or on the side surface, or simultaneously on the bottom surface and the side surface.

[0302] In some embodiments, the same technical content as that of the display module 100 in the previous embodiments (as shown in FIG. 4a) will not be described again. FIG. 34 is a partial cross-sectional view of the display module 100 at line BB in another embodiment.

[0303] As shown in Figure 34, the display module 100 may include an electrical connection plate 80. The electrical connection plate 80 may be fixedly connected to the second surface 104 of the substrate 1. The electrical connection plate 80 is electrically connected between the driver chip 30 and the conductive medium 40 to realize the electrical connection between the driver chip 30 and the conductive medium 40. Exemplarily, the electrical connection plate 80 may be fixedly connected to the second surface 104 of the substrate 1 by means of non-conductive film 70 (NCF).

[0304] For example, the electrical connection board 80 may include an insulating base plate 81, an insulating layer 82, and conductive traces 83. Along the thickness direction of the display panel 10, the insulating base plate 81 includes a first insulating base plate 811, a second insulating base plate 812, and a third insulating base plate 813 stacked sequentially. The insulating layer 82 is disposed on the surface of the third insulating base plate 813 away from the second insulating base plate 812. The conductive traces 83 are disposed on the insulating layer 82, and the conductive traces 83 electrically connect the driver chip 30 and the conductive medium 40.

[0305] In some embodiments, the insulating base plate 81 of the electrical connection plate 80 can be formed in the same process as the substrate 1. Exemplarily, the first insulating base plate 811 can be formed in the same process as the first organic layer 11. The second insulating base plate 812 and the first inorganic layer 12 can be formed in the same process. The third insulating base plate 813 and the second organic layer 13 can be formed in the same process. The first insulating base plate 811 and the first organic layer use the same organic insulating material, the second insulating base plate 812 and the first inorganic layer use the same inorganic insulating material, and the third insulating base plate 813 and the second organic layer use the same organic insulating material.

[0306] In some embodiments, the insulating layer 82 and the insulating dielectric layer 2 can be formed in the same process. The insulating layer 82 and the insulating dielectric layer 2 can be made of the same material. When the insulating dielectric layer 2 comprises a multilayer structure, those skilled in the art can select either the insulating layer 82 or the insulating dielectric layer 2 to be formed in the same process according to specific needs.

[0307] In some embodiments, the conductive trace 83 can be formed in the same process as the driving circuit 3 / second conductive trace 52. The conductive trace 83 and the driving circuit 3 / second conductive trace 52 can be made of the same material. When the driving circuit 3 includes a multilayer structure, those skilled in the art can, according to specific requirements, select that the conductive trace 83 and any layer of the driving circuit 3 be formed in the same process. When the second conductive trace 52 includes a multilayer structure, those skilled in the art can, according to specific requirements, select that the conductive trace 83 and any layer of the second conductive trace 52 be formed in the same process.

[0308] Figure 35 is a cross-sectional view of the product structure corresponding to one manufacturing process of the display module 100 shown in Figure 34. The technical content of the same manufacturing method as the display module 100 in the previous embodiments (as shown in Figures 7 to 15) will not be repeated.

[0309] As shown in Figures 34 and 35, during the fabrication of the display module 100, the electrical connection plate 80 can be formed together with the display panel 10. The structure of the electrical connection plate 80 can be formed together with the structure within the display panel 10. It is understood that, compared to the circuit board 50, the fabrication process of the display panel 10 has higher precision. In this embodiment, the contact holes of the electrical connection plate 80 used for electrical connection with the conductive medium 40 can be smaller, allowing for more contact holes to be arranged within a limited area, thus transmitting more electrical signals and achieving more complex display effects.

[0310] It is understandable that the structure of the electrical connection board 80 can be formed together with the structure within the display panel 10, and the electrical connection board 80 and the display panel 10 are in a connected state. After the various layers of the display panel 10 are prepared, in the cutting process of the display panel 10, the electrical connection board 80 and the display panel 10 are cut apart, and the cut-off electrical connection board 80 is fixed to the second surface 104 of the display panel 10 for electrical connection of the driver chip 30 and the conductive medium 40. Alternatively, the electrical connection board 80 and the display panel 10 are not cut first, but the driver chip 30 is first installed on the electrical connection board 80 in the display module 100 section, and the conductive trace 83 is electrically connected. Then the electrical connection board 80 and the display panel 10 are cut, and the driver chip 30 and the electrical connection board 80 are installed together on the second surface 104 of the display panel 10. The conductive medium 40 is prepared for electrical connection of the electrical connection board 80 and the first conductive trace 51 of the display panel 10.

[0311] It is understandable that the drilling of the display panel 10 can be done before the electrical connection plate 80 is installed on the second side 104 of the display panel 10, or after the electrical connection plate 80 is installed on the second side 104 of the display panel 10.

[0312] In some embodiments, when the substrate 1 of the display panel 10 further includes a second inorganic layer 14, the insulating base plate 81 of the electrical connection plate 80 may further include a fourth insulating base plate 814, which may be located between the third insulating base plate 813 and the insulating layer 82. The fourth insulating base plate 814 may be made of an inorganic insulating material. Exemplarily, the fourth insulating base plate 814 may be formed in the same process as the second inorganic layer 14.

[0313] It is understood that, without conflict, the embodiments and features in the embodiments of this application can be combined with each other, and any combination of features in different embodiments is also within the protection scope of this application. That is to say, the multiple embodiments described above can also be arbitrarily combined according to actual needs.

[0314] It is understood that all the above figures are exemplary illustrations of this application and do not represent the actual size of the product. Furthermore, the dimensional proportions between the components in the figures are not intended to limit the actual product of this application.

[0315] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A display module (100), characterized in that, It includes a display panel (10), a driver chip (30), and a conductive medium (40); The display panel (10) includes a substrate (1), an insulating dielectric layer (2), a driving circuit (3), and an electrical connection structure (5); Along the thickness direction of the display panel (10), the substrate (1) includes a first organic layer (11), a first inorganic layer (12), a second organic layer (13), and a second inorganic layer (14) stacked together. The first inorganic layer (12) has an opening area (121), and the second organic layer (13) passes through the first inorganic layer (12) and contacts the first organic layer (11) at the opening area (121). The electrical connection structure (5) includes a first conductive trace (51) and a second conductive trace (52). The first conductive trace (51) is disposed on the second inorganic layer (14). The insulating dielectric layer (2) is disposed on the second inorganic layer (14) and covers the first conductive trace (51). The second conductive trace (52) is disposed in the insulating dielectric layer (2). The second conductive trace (52) is electrically connected to the driving circuit (3) and the first conductive trace (51). Along the thickness direction of the display panel (10), the projection of the first portion (511) of the first conductive trace (51) onto the first inorganic layer (12) and the opening area (121) of the first inorganic layer (12) at least partially overlap. The driving chip (30) is disposed on the first organic layer (11), the first segment (41) of the conductive medium (40) is disposed on the first organic layer (11), the second segment (42) of the conductive medium (40) passes through the opening area (121) of the first inorganic layer (12) and is disposed on the second organic layer (13). In the opening area (121) of the first inorganic layer (12), the second segment (42) of the conductive medium (40) and the first inorganic layer (12) are separated by the second organic layer (13). The first segment (41) of the conductive medium (40) is electrically connected to the driving chip (30) and the second segment (42) of the conductive medium (40). The second segment (42) of the conductive medium (40) is electrically connected to the first conductive trace (51).

2. The display module (100) as described in claim 1, characterized in that, The minimum distance between the first inorganic layer (12) and the conductive medium (40) is greater than or equal to 0.5 micrometers.

3. The display module (100) as described in claim 1 or 2, characterized in that, The cross-sectional area of ​​the first segment (41) of the conductive medium (40) is greater than the cross-sectional area of ​​the second segment (42) of the conductive medium (40).

4. The display module (100) as described in any one of claims 1 to 3, characterized in that, The first segment (41) of the conductive medium (40) includes a first part (411) and a second part (412). Along the thickness direction of the display panel (10), the second part (412) of the first segment (41) of the conductive medium (40) is connected between the first part (411) of the first segment (41) of the conductive medium (40) and the second segment (42) of the conductive medium (40). The cross-sectional area of ​​the first part (411) of the first segment (41) of the conductive medium (40) is larger than the cross-sectional area of ​​the second part (412) of the first segment (41) of the conductive medium (40). Along the thickness direction of the display panel (10), the conductive medium (40) and the first inorganic layer (12) are separated by the first organic layer (11).

5. The display module (100) as described in claim 4, characterized in that, Along the thickness direction of the display panel (10), the projection of the surface of the first portion (411) of the first segment (41) of the conductive medium (40) facing the second organic layer (13) onto the first inorganic layer (12) covers the opening area (121) of the first inorganic layer (12).

6. The display module (100) as described in any one of claims 1 to 5, characterized in that, The display module (100) further includes a circuit board (50), which includes an insulating substrate (501) and conductive traces (502), the conductive traces (502) being disposed on the insulating substrate (501). The insulating substrate (501) is disposed on the first organic layer (11), and the conductive trace (502) is electrically connected to the driving chip (30) and the conductive medium (40).

7. The display module (100) as described in claim 6, characterized in that, The second surface (104) of the substrate (1) includes a first portion (1111) of a first through hole (111), the insulating substrate (501) is partially located within the first portion (1111) of the first through hole (111), the conductive trace (502) is partially located within the first portion (1111) of the first through hole (111), and the conductive medium (40) is electrically connected to the conductive trace (502) within the first organic layer (11).

8. The display module (100) as described in claim 6 or 7, characterized in that, The conductive medium (40) is electrically connected to the conductive trace (502) on the surface of the insulating substrate (501) opposite to the first organic layer (11).

9. The display module (100) as described in claim 6 or 7, characterized in that, The conductive medium (40) electrically connects the conductive trace (502) to the surface of the insulating substrate (501) facing the first organic layer (11).

10. The display module (100) as described in any one of claims 1 to 5, characterized in that, The display module (100) includes an electrical connection board (80), which includes an insulating base plate (81), an insulating layer (82), and conductive traces (83). Along the thickness direction of the display panel (10), the insulating base plate (81) includes a first insulating base plate (811), a second insulating base plate (812), and a third insulating base plate (813) stacked sequentially. The first insulating base plate (811) is disposed between the first organic layer (11) and the second insulating base plate (812). The insulating layer (82) is disposed on the surface of the third insulating base plate (813) away from the second insulating base plate (812). The conductive trace (83) is disposed on the insulating layer (82) and the conductive trace (83) is electrically connected to the driving chip (30) and the conductive medium (40). The first insulating base plate (811) and the first organic layer (11) are made of the same organic insulating material, the second insulating base plate (812) and the first inorganic layer (12) are made of the same inorganic insulating material, and the third insulating base plate (813) and the second organic layer (13) are made of the same organic insulating material.

11. The display module (100) as described in any one of claims 1 to 10, characterized in that, The first conductive trace (51) includes a first part (511) and a second part (512). The first part (511) of the first conductive trace (51) is embedded in the second inorganic layer (14). Along the thickness direction of the display panel (10), the second part (512) of the first conductive trace (51) is disposed between the first part (511) of the first conductive trace (51) and the second conductive trace (52). The first part (511) of the first conductive trace (51) is electrically connected to the second segment (42) of the conductive medium (40) and the second part (512) of the first conductive trace (51). The second part (512) of the first conductive trace (51) is electrically connected to the second conductive trace (52). The second inorganic layer (14) is disposed between the second portion (512) of the first conductive trace (51) and the second organic layer (13).

12. The display module (100) as described in claim 11, characterized in that, The first portion (511) of the first conductive trace (51) contacts and connects the second organic layer (13) and the second segment (42) of the conductive medium (40).

13. The display module (100) as described in claim 11, characterized in that, The first part (1401) of the second inorganic layer (14) is disposed between the first part (511) of the first conductive trace (51) and the second organic layer (13), the second part (1402) of the second inorganic layer (14) is disposed between the second part (512) of the first conductive trace (51) and the second organic layer (13), the second inorganic layer (14) includes a fourth through hole (142) that penetrates the second inorganic layer (14), the third segment (43) of the conductive medium (40) is disposed in the fourth through hole (142) of the second inorganic layer (14), and the third segment (43) of the conductive medium (40) is electrically connected to the first part (511) of the first conductive trace (51) and the second segment (42) of the conductive medium (40); Along the thickness direction of the display panel (10), the second inorganic layer (14) is used to completely separate the first conductive trace (51) and the second organic layer (13).

14. The display module (100) as described in any one of claims 1 to 13, characterized in that, The display panel (10) further includes a shielding structure (4), which is disposed on the second inorganic layer (14) and covered by the insulating dielectric layer (2). The shielding structure (4) and the first conductive trace (51) are separate and do not contact each other.

15. The display module (100) as described in any one of claims 1 to 14, characterized in that, The display panel (10) also includes a mark (7), which is disposed on the second inorganic layer (14) and covered by the insulating dielectric layer (2). The mark (7) is separate from and does not contact the first conductive trace (51).

16. The display module (100) as described in any one of claims 1 to 15, characterized in that, The first organic layer (11) is provided with a first through hole (111) that penetrates the first organic layer (11), and the second organic layer (13) is provided with a second through hole (131) that penetrates the second organic layer (13). The first segment (41) of the conductive medium (40) is located in the first through hole (111), and the second segment (42) of the conductive medium (40) is located in the second through hole (131). The number of conductive media (40) and the number of second through holes (131) are both multiple and equal. One first through hole (111) connects multiple second through holes (131). Multiple conductive media (40) fill each second through hole (131) through the first through hole (111) respectively. Multiple conductive media (40) do not contact each other in the first through hole (111).

17. The display module (100) as described in any one of claims 1 to 15, characterized in that, The first organic layer (11) is provided with a first through hole (111) that penetrates the first organic layer (11), and the second organic layer (13) is provided with a second through hole (131) that penetrates the second organic layer (13). The first segment (41) of the conductive medium (40) is located in the first through hole (111), and the second segment (42) of the conductive medium (40) is located in the second through hole (131). The number of conductive media (40), the number of first through holes (111), and the number of second through holes (131) are all multiple and equal. The conductive media (40), the first through holes (111), and the second through holes (131) are arranged in a one-to-one correspondence. The multiple conductive media (40) fill each second through hole (131) through each first through hole (111), and the multiple conductive media (40) do not contact each other.

18. The display module (100) as described in claim 16, characterized in that, The first through hole (111) includes a first part (1111) and a second part (1112). Along the thickness direction of the first organic layer (11), the second part (1112) of the first through hole (111) is connected between the first part (1111) of the first through hole (111) and the second through hole (131). The first part (411) of the first segment (41) of the conductive medium (40) is located in the first part (1111) of the first through hole (111), and the second part (412) of the first segment (41) of the conductive medium (40) is located in the second part (1112) of the first through hole (111).

19. The display module (100) as described in claim 18, characterized in that, The number of first segments (41) of the conductive medium (40), the number of second segments (42) of the conductive medium (40), the number of second portions (1112) of the first through hole (111), and the number of second through holes (131) are all multiple and equal. The first portion (1111) of one first through hole (111) connects to the second portions (1112) of multiple first through holes (111). The first segments (41) of multiple conductive media (40) fill the second portions (1112) of each first through hole (111) through the first portions (1111) of the first through hole (111). The second segments (42) of multiple conductive media (40) fill each second through hole (131). The multiple conductive media (40) do not contact each other in the first portion (1111) of the first through hole (111).

20. The display module (100) as described in claim 18, characterized in that, The number of first segments (41) of the conductive medium (40), the number of second segments (42) of the conductive medium (40), the number of first portions (1111) of the first through hole (111), the number of second portions (1112) of the first through hole (111), and the number of second through holes (131) are all multiple and equal. The conductive medium (40), the first portions (1111) of the first through hole (111), the second portions (1112) of the first through hole (111), and the second through hole (131) are arranged in a one-to-one correspondence. The first segments (41) of the multiple conductive media (40) fill the second portions (1112) of each first through hole (111) through the first portions (1111) of each first through hole (111), and the second segments (42) of the multiple conductive media (40) fill the second through hole (131) respectively. The multiple conductive media (40) do not contact each other.

21. The display module (100) as described in any one of claims 16 to 20, characterized in that, The display module (100) further includes an insulating protective layer (60) that covers the conductive medium (40) and the first through hole (111) and fills the space between two adjacent conductive media (40) to make the two adjacent conductive media (40) insulated.

22. The display module (100) as described in any one of claims 1 to 21, characterized in that, The second conductive trace (52) includes a first trace (523), the first trace (523) is in contact with the second surface (5102) of the first conductive trace (51), the second surface (5102) of the first conductive trace (51) faces the insulating dielectric layer (2), the first trace (523) extends along the thickness direction of the insulating dielectric layer (2), and the first trace (523) is electrically connected to the first conductive trace (51) and the driving circuit (3).

23. The display module (100) as described in any one of claims 1 to 22, characterized in that, The first organic layer (11) is provided with a first through hole (111), the first through hole (111) penetrates the first organic layer (11), and the conductive medium (40) fills the first through hole (111) and covers the first through hole (111).

24. An electronic device (1000), characterized in that, It includes a housing (200) and a display module (100) as claimed in any one of claims 1 to 23, the display module (100) being mounted on the housing (200).

25. A display panel (10), characterized in that, It includes a substrate (1), an insulating dielectric layer (2), a driving circuit (3), and an electrical connection structure (5); Along the thickness direction of the display panel (10), the substrate (1) includes a first organic layer (11), a first inorganic layer (12), a second organic layer (13), and a second inorganic layer (14) stacked together. The first inorganic layer (12) has an opening area (121), and the second organic layer (13) passes through the first inorganic layer (12) and contacts the first organic layer (11) at the opening area (121). The electrical connection structure (5) includes a first conductive trace (51) and a second conductive trace (52). The first conductive trace (51) is disposed on the second inorganic layer (14). The insulating dielectric layer (2) is disposed on the second inorganic layer (14) and covers the first conductive trace (51). The second conductive trace (52) is disposed in the insulating dielectric layer (2) and electrically connects the driving circuit (3) and the first conductive trace (51). The first portion (511) of the first conductive trace (51) is embedded in the second inorganic layer (14). Along the thickness direction of the display panel (10), the projection of the first portion (511) of the first conductive trace (51) on the first inorganic layer (12) at least partially overlaps with the opening area (121).

26. The display panel (10) as claimed in claim 25, characterized in that, The first conductive trace (51) includes a first part (511) and a second part (512). Along the thickness direction of the display panel (10), the second part (512) of the first conductive trace (51) is disposed between the first part (511) of the first conductive trace (51) and the second conductive trace (52). The second conductive trace (52) contacts and connects the surface of the second part (512) of the first conductive trace (51) that is away from the first part (511) of the first conductive trace (51). The first portion (1401) of the second inorganic layer (14) is disposed between the first portion (511) of the first conductive trace (51) and the second organic layer (13), and the second portion (1402) of the second inorganic layer (14) is disposed between the second portion (512) of the first conductive trace (51) and the second organic layer (13). The first conductive trace (51) and the second organic layer (13) are completely separated by the second inorganic layer (14).

27. The display panel (10) as claimed in claim 25, characterized in that, The first portion (511) of the first conductive trace (51) passes through the second inorganic layer (14) and contacts the second organic layer (13).

28. A method for preparing a display module (100), characterized in that, include: A first organic layer (92) to be treated and a first inorganic layer (93) to be treated are sequentially formed on a substrate (91), wherein the first inorganic layer (93) to be treated is located on the surface of the first organic layer (92) away from the substrate (91); The first inorganic layer (93) to be processed is etched to form a first inorganic layer (12). The first inorganic layer (12) is provided with a first through hole (124). The first through hole (124) penetrates the first inorganic layer (12) and forms an opening region (121) of the first inorganic layer (12). A second organic layer (94) is formed on the first inorganic layer (12) and the first organic layer (92) to be treated, a portion of which fills the first through hole (124) and contacts the first organic layer (92) to be treated through the first inorganic layer (12). The second inorganic layer (95) to be treated is formed on the surface of the second organic layer (94) away from the first inorganic layer (12); The second inorganic layer (95) to be treated is etched to form a pre-treated second inorganic layer (96). The pre-treated second inorganic layer (96) is provided with a groove (961). The groove (961) does not penetrate the pre-treated second inorganic layer (96). The groove (961) forms an opening on the surface of the pre-treated second inorganic layer (96) facing away from the second organic layer (94) to be treated. Along the thickness direction of the pre-treated second inorganic layer (96), the projection of the groove (961) on the first inorganic layer (12) and the opening area (121) of the first inorganic layer (12) at least partially overlap. A metal layer (97) to be processed is formed on the pre-treated second inorganic layer (96), and a portion of the metal layer (97) to be processed fills the groove (961); The metal layer to be processed (97) is etched to form a first conductive trace (51); An insulating dielectric layer (2) is formed on the pre-treated second inorganic layer (96) and the first conductive trace (51), and a second conductive trace (52) is formed on the first conductive trace (51). The insulating dielectric layer (2) is disposed on the pre-treated second inorganic layer (96) and covers the first conductive trace (51). The second conductive trace (52) is disposed on the insulating dielectric layer (2) and connected to the first conductive trace (51). Remove the substrate (91), and drill holes in the first organic layer (92), the second organic layer (94), and the pre-treated second inorganic layer (96). The first organic layer (11) forms a first through hole (111), which penetrates the first organic layer (11). The second organic layer (13) forms a second through hole (131), which passes through the first through hole (124) and penetrates the second organic layer (13). The second inorganic layer (14) forms a fourth through hole (142), which penetrates the second inorganic layer (14). The first through hole (111) connects to the second through hole (131), and the second through hole (131) connects to the fourth through hole (142). A driver chip (30) is mounted on the first organic layer (11), and a conductive medium (40) is filled in the first through hole (111), the second through hole (131) and the fourth through hole (142). The conductive medium (40) is in contact with the first conductive trace (51) and electrically connected to the driver chip (30).

29. The preparation method according to claim 28, characterized in that, The etched metal layer (97) includes: A portion of the metal layer to be processed (97) forms a mark (7), and a portion of the metal layer to be processed (97) forms the first conductive trace (51). The mark (7) is used to align the formation of the second conductive trace (52) and the contact with the first conductive trace (51).

30. The preparation method according to claim 29, characterized in that, The etched metal layer (97) further includes: A portion of the metal layer to be processed (97) forms a shielding structure (4).

31. The preparation method according to any one of claims 28 to 30, characterized in that, The drilling of the first organic layer (92), the second organic layer (94), and the pretreated second inorganic layer (96) includes: The first organic layer (92), the second organic layer (94), and the pre-treated second inorganic layer (96) are perforated by laser process. The cross-sectional area of ​​the second through hole (131) is smaller than that of the first through hole (124), and the hole wall of the second through hole (131) and the hole wall of the first through hole (124) do not contact each other.

32. The preparation method according to claim 31, characterized in that, The distance between the wall of the second through hole (131) and the wall of the first through hole (124) is greater than or equal to 0.5 micrometers.

33. The preparation method according to any one of claims 28 to 32, characterized in that, The first through hole (111) includes a first part (1111) and a second part (1112). Along the thickness direction of the first organic layer (11), the second part (1112) of the first through hole (111) is connected between the first part (1111) and the second through hole (131). The cross-sectional area of ​​the first part (1111) of the first through hole (111) is larger than the cross-sectional area of ​​the second part (1112) of the first through hole (111). The distance between the bottom surface of the first portion (1111) of the first through hole (111) and the first inorganic layer (12) is greater than or equal to 0.5 micrometers.

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