Stereo camera and electronic device

Abstract

Disclosed in some embodiments of the present disclosure are a stereo camera and an electronic device. The stereo camera comprises a first housing, a middle frame, a second housing, a first PCB assembly and a second PCB assembly, wherein the middle frame is arranged between the first housing and the second housing; the first housing and the portion of the middle frame close to the first housing form a first chamber; the second housing and the portion of the middle frame close to the second housing form a second chamber; the middle frame comprises a first heat-conducting portion; and the second housing comprises a second heat-conducting portion. The first PCB assembly is located in the first chamber. The first PCB assembly comprises a light source. The first heat-conducting portion is configured to conduct heat generated by the first PCB assembly to the middle frame. The second PCB assembly is located in the second chamber. The second PCB assembly comprises a processor. The second heat-conducting portion is configured to conduct heat generated by the second PCB assembly to the second housing.

Description

3D cameras and electronic devices Technical Field

[0001] This disclosure relates to the field of visual technology, and more particularly to a stereo camera and electronic device. Background Technology

[0002] Stereo cameras are an important component in realizing visual functions in related industries. However, stereo cameras generally have high power consumption, leading to significant temperature rise during operation, which affects performance and reduces operational stability and lifespan. Summary of the Invention

[0003] Some embodiments of this disclosure provide a stereo camera and electronic device.

[0004] In a first aspect, some embodiments of this disclosure provide a stereo camera. The stereo camera includes a first housing, a middle frame, a second housing, a first PCB assembly, and a second PCB assembly. The first housing, the middle frame, and the second housing are connected; the middle frame is disposed between the first housing and the second housing; the portions of the first housing and the middle frame near the first housing enclose a first cavity; the portions of the second housing and the middle frame near the second housing enclose a second cavity; the middle frame includes a first heat-conducting portion; the second housing includes a second heat-conducting portion. The first PCB assembly is located within the first cavity; the first heat-conducting portion is used to conduct heat generated by the first PCB assembly to the middle frame. The second PCB assembly is located within the second cavity; the second heat-conducting portion is used to conduct heat generated by the second PCB assembly to the second housing.

[0005] In some embodiments of the stereo camera provided in this disclosure, a first heat-conducting part conducts heat generated by the first PCB assembly to the middle frame, and a second heat-conducting part conducts heat generated by the second PCB assembly to the second housing. The heat generated by the first PCB assembly and the heat generated by the second PCB assembly can be conducted to the portion of the middle frame near the first housing and the second housing, respectively. In this way, the middle frame and the second housing can be used together for heat dissipation, improving heat dissipation efficiency and preventing heat concentration, thus solving the problem of large temperature rise during stereo camera operation and improving the operational stability and service life of the stereo camera.

[0006] Optionally, the mid-frame also includes a third heat-conducting section; the third heat-conducting section is spaced apart from the first heat-conducting section; the third heat-conducting section is closer to the second housing than the first heat-conducting section. The stereo camera also includes a third PCB assembly. The third PCB assembly is located within the second cavity; the third heat-conducting section is used to conduct the heat generated by the third PCB assembly to the mid-frame.

[0007] Optionally, the third PCB assembly is located on the side of the second PCB assembly away from the second housing; the third PCB assembly is used at least to access logic signals and power signals.

[0008] Optionally, the stereo camera also includes a first elastic thermal pad. The first elastic thermal pad is located between the third PCB assembly and the third thermally conductive part, and is in contact with the third thermally conductive part.

[0009] Optionally, the first PCB assembly includes a first body board and a light source. The first body board has a first surface and a second surface disposed opposite to each other, with the second surface closer to the second housing than the first surface; the light source is disposed on the first surface of the first body board. The stereo camera also includes a second elastic thermal pad. The second elastic thermal pad is located between the second surface of the first body board and the first thermally conductive portion, and is directly opposite the light source.

[0010] Optionally, the stereo camera also includes a third elastic thermal pad and a shield. The third elastic thermal pad is located on the side of the second elastic thermal pad away from the first main body plate and is in contact with the first thermally conductive part. The shield is disposed between the second and third elastic thermal pads; the shield protrudes in a direction away from the third elastic thermal pad.

[0011] Optionally, the first PCB assembly further includes a first thermally conductive coating and a second thermally conductive coating. The first thermally conductive coating is disposed on a first surface of the first main board and is positioned to avoid the light source; the first thermally conductive coating is in contact with the first housing. The second thermally conductive coating is located between the first main board and the second elastic thermally conductive pad.

[0012] Optionally, the stereo camera also includes a fourth elastic thermal pad. The fourth elastic thermal pad is located between the second PCB assembly and the second thermally conductive part, and is in contact with the second thermally conductive part.

[0013] Optionally, the first PCB assembly includes multiple light sources spaced apart; and / or, the second PCB assembly includes a processor; and / or, the third PCB assembly includes multiple functional modules spaced apart.

[0014] Optionally, the middle frame includes an outer frame portion and a partition portion. The partition portion is fixed to the inner wall of the outer frame portion; the partition portion includes a first heat-conducting portion and a third heat-conducting portion.

[0015] Optionally, the partition portion further includes a first recessed portion, which is recessed along the direction close to the second housing. The stereo camera also includes a TOF lens assembly and a first heat-conducting block. The TOF lens assembly includes a TOF lens module and a first sensing component, with the first sensing component closer to the second housing than the TOF lens module. The TOF lens module passes through the first housing and the first PCB assembly; the first sensing component is located between the TOF lens module and the first recessed portion, and together with the first recessed portion, forms a first filling cavity. The first heat-conducting block is disposed within the first filling cavity and contacts the first sensing component.

[0016] Optionally, the mid-frame also includes a second recessed portion, which is recessed along a direction close to the second housing. The stereo camera also includes a color lens assembly and a second heat-conducting block. The color lens assembly includes a color lens module and a second sensing component, with the second sensing component closer to the second housing than the color lens module; the color lens module passes through the first housing and the first PCB assembly; the second sensing component is located between the color lens module and the second recessed portion, and together with the second recessed portion, forms a second filling cavity. The second heat-conducting block is disposed within the second filling cavity and contacts the second sensing component.

[0017] Optionally, the outer frame includes a first outer frame and a second outer frame connected to each other, with the first outer frame closer to the first housing than the second outer frame. The stereo camera also includes at least one air duct disposed on the outer periphery of the first outer frame.

[0018] Optionally, the stereo camera also includes a plurality of spaced-apart fins. A portion of the fins is fixed to the wall surface of the first housing away from the middle frame, another portion of the fins is fixed to the wall surface of the second housing away from the middle frame, and yet another portion of the fins is fixed to the side of the second outer frame.

[0019] Optionally, the stereo camera also includes multiple grooves formed on the outer peripheral surface of the first housing.

[0020] Secondly, some embodiments of this disclosure provide an electronic device. The electronic device includes a controller and a stereo camera as described in the first aspect above. The controller is coupled to the stereo camera.

[0021] The beneficial effects that the electronic devices provided in some embodiments of this disclosure can achieve are the same as the beneficial effects that the stereo camera provided in the first aspect above can achieve, and will not be repeated here. Attached Figure Description

[0022] The accompanying drawings, which are included to provide a further understanding of embodiments of this disclosure, form part of this disclosure. The illustrative embodiments and descriptions of this disclosure are used to explain this disclosure and do not constitute an undue limitation thereof.

[0023] Figure 1 is a structural diagram of a stereo camera provided in some embodiments of this disclosure.

[0024] Figure 2 is a structural diagram of a stereo camera provided in some other embodiments of this disclosure.

[0025] Figure 3 is a PCB architecture diagram of a stereo camera provided in some embodiments of this disclosure.

[0026] Figure 4 is a structural diagram of a stereo camera provided in some other embodiments of this disclosure.

[0027] Figure 5 is a cross-sectional view of a stereo camera provided in some embodiments of this disclosure.

[0028] Figure 6 is a structural diagram of a first housing provided in some embodiments of this disclosure.

[0029] Figure 7 is a structural diagram of a first housing provided by some other embodiments of this disclosure.

[0030] Figure 8 is a structural diagram of a mid-frame provided in some embodiments of this disclosure.

[0031] Figure 9 is a structural diagram of a middle frame provided in some other embodiments of this disclosure.

[0032] Figure 10 is a structural diagram of a second housing provided in some embodiments of this disclosure.

[0033] Figure 11 is a structural diagram of an electronic device provided by some embodiments of this disclosure.

[0034] Explanation of reference numerals in the attached drawings: 1000 - Stereo camera; 110 - First housing; 111 - First opening; 110a - Inner surface of the first housing; 110b - Wall of the first housing away from the middle frame; 120 - Middle frame; 121 - First heat-conducting part; 122 - Third heat-conducting part; 123 - Outer frame; 1231 - First outer frame; 12311 - Main body; 12312 - Connecting post; 1232 - Second outer frame; 1232a - Side of the second outer frame; 124 - Partition; 130 - Second housing; 131 - Second heat-conducting part; 101 - First bolt; 102 - Second opening; 103 - Indicator light panel; 104 - Transparent light guide; 105 - Sealing ring; 108 - Second mounting hole; 109 - First mounting hole; K1 - First chamber, K2 - Second chamber, X - First direction, Q - Sealing ring mounting groove, K3 - First filling cavity, K4 - Second filling cavity; 210 - First PCB assembly, 211 - First main board, 211a - First surface of the first main board, 211b - Second surface of the first main board, 212 - Light source, 213 - First thermally conductive coating, 214 - Second thermally conductive coating; 220 - Second PCB assembly, 221 - Second main board, 222 - Processor, 223 - Transceiver module, 222A - System-on-a-Chip (SOC), 222B - Embedded Multimedia Card (EMMC), 222C - Double Data Rate (DDR) Synchronous Dynamic Random Access Memory; 230 - Third PCB assembly, 231 - Third main board, 232 - Functional module, 232A - Field Programmable Gate Array (FPGA) module, 232B - First DC-DC module, 232C - Second DC-DC module; 201-First aviation connector, 202-Second aviation connector, 203-First mounting screw; 310-First elastic thermal pad, 320-Second elastic thermal pad, 330-Third elastic thermal pad, 340-Fourth elastic thermal pad, 350-First thermal block; 410-Shielding cover; 510-TOF lens assembly, 511-TOF lens module, 512-First sensor assembly; 520-Color lens assembly, 521-Color lens module, 522-Second sensor assembly; 501-Second mounting screw, 502-Third mounting screw, 503-Third opening, 504-Fourth opening; 610-Air duct, 620-Fin, 621-First annular fin, 630-Groove, 640-Annular groove; 2000-Electronic device, 2100-Controller. Detailed Implementation

[0035] The following description, in conjunction with the accompanying drawings, provides a clear and complete account of some embodiments of this disclosure. The described embodiments are merely some, not all, of the embodiments disclosed herein. All other embodiments obtained by those skilled in the art based on the embodiments provided herein are within the scope of protection of this disclosure.

[0036] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiment," "example," or "some examples" are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific feature, structure, material, or characteristic may be included in any suitable manner in any one or more embodiments or examples.

[0037] In the description of embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more.

[0038] As used herein, “parallel,” “perpendicular,” and “equal” include the described situation and situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where an acceptable range of deviation for approximate parallelism may be, for example, within 5°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where an acceptable range of deviation for approximate perpendicularity may also be, for example, within 5°; “equal” includes absolute equality and approximate equality, where an acceptable range of deviation for approximate equality may be, for example, the difference between the two equalities being less than or equal to 5% of either one.

[0039] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

[0040] In the description of the embodiments disclosed herein, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0041] It should be noted that, for example, 1 / 2 in the accompanying drawings of this disclosure can refer to both structure 1 and structure 2. For example, 222A / 222 in Figure 3 can be represented by this structure, indicating that both processor 222 and system-on-chip 222A can be represented by this structure. Other similar reference numerals in the drawings also follow the above description.

[0042] With the rapid development of the robotics and AIoT industries, the demand for higher levels of intelligence in related products is increasing. Stereo cameras, as a core component for achieving vision and intelligent perception, are experiencing rapid market demand growth. Based on the different methods of implementing visual functions, stereo cameras can be categorized into at least three types: binocular stereo cameras, structured light stereo cameras, and time-of-flight (TOF) stereo cameras, each with distinct application scenarios.

[0043] In visual scenarios involving small size, medium precision, and medium to long distances, such as robotics, logistics, warehousing, and general AIoT, Time-of-Flight (TOF) stereo cameras offer advantages such as smaller size, wider dynamic range, lower burden on backend processing modules, and lower cost. In related technologies, TOF stereo cameras used in industries such as logistics or warehousing are referred to as industrial-grade TOF stereo cameras.

[0044] In some embodiments, the TOF stereo camera includes a light source driver board (e.g., a laser driver board) and a TOF lens assembly. The light source is disposed on the light source driver board.

[0045] Based on the above setup, the working principle of a TOF stereo camera can be as follows: The TOF stereo camera sends a beam of light to the target object, which is reflected by the target object to produce reflected light. The TOF lens assembly receives the reflected light and measures the time of flight (TOF) of the light to obtain the time it takes for the light to travel from the TOF stereo camera to the target object and then back to the TOF stereo camera, thereby determining the distance to the target object.

[0046] In some embodiments, the TOF stereo camera further includes a core board. The core board includes one or more processors, and / or a transceiver module. The transceiver module is used to send signals to the controller and receive signals from the controller.

[0047] In some implementations, stereo cameras (such as industrial-grade TOF stereo cameras) consume a large amount of power, resulting in significant temperature rise during operation. As an electronic product, high temperature rise can negatively impact performance, reduce operational stability, and shorten the product's lifespan.

[0048] For example, the power consumption of a selected TOF stereo camera was measured. The total power consumption of this TOF stereo camera was 11.1W, resulting in a significant temperature rise. The two components with the highest power consumption were the light source driver board and the core board. The light source in the driver board consumed 4W, accounting for 36.0% of the total power consumption; the three processors and transceiver modules in the core board consumed a total of 3.8W, accounting for 34.2% of the total power consumption. This indicates that the light source driver board and the core board are the two components with the largest temperature rise in the TOF stereo camera.

[0049] Based on this, some embodiments of the present disclosure provide a stereo camera 1000. Referring to Figures 1 and 2, the stereo camera 1000 includes a first housing 110, a middle frame 120, and a second housing 130. The first housing 110, the middle frame 120, and the second housing 130 are connected; the middle frame 120 is disposed between the first housing 110 and the second housing 130; the portions of the first housing 110 and the middle frame 120 near the first housing 110 enclose a first chamber K1; the portions of the second housing 130 and the middle frame 120 near the second housing 130 enclose a second chamber K2; the middle frame 120 includes a first heat-conducting part 121 (see Figure 9); the second housing 130 includes a second heat-conducting part 131.

[0050] Referring to Figure 3, and also to Figures 2 and 4, the stereo camera 1000 includes a first PCB assembly 210 and a second PCB assembly 220. The first PCB assembly 210 is located within a first chamber K1; it includes a light source 212; a first heat-conducting part 121 is used to conduct the heat generated by the first PCB assembly 210 to the middle frame 120. The second PCB assembly 220 is located within a second chamber K2; it includes a processor 222; a second heat-conducting part 131 is used to conduct the heat generated by the second PCB assembly 220 to the second housing 130.

[0051] For example, referring to FIG1, the first housing 110, the middle frame 120, and the second housing 130 are connected sequentially along the first direction X. By including the first housing 110, the middle frame 120, and the second housing 130 in the stereo camera 1000, the number of structural components contained in the housing of the stereo camera 1000 can be reduced, thereby reducing the assembly complexity of the stereo camera 1000.

[0052] For example, the first housing 110 and the middle frame 120, and / or the middle frame 120 and the second housing 130, can be fixedly connected by either bolts or clips. For instance, referring to Figure 2, the first housing 110, the middle frame 120, and the second housing 130 can be fixedly connected using four first bolts 101 (e.g., hexagonal studs) distributed at the four corners of the stereo camera 1000. This optimizes the installation position of the first bolts 101 and improves connection stability.

[0053] In some examples, referring to Figure 2, to improve the connection stability between the first housing 110 and the middle frame 120, and between the middle frame 120 and the second housing 130, the stereo camera 1000 also includes a sealing ring 105 mounted in the sealing ring mounting groove Q (see Figure 6). There can be two sealing rings 105, one located between the first housing 110 and the middle frame 120, and the other located between the middle frame 120 and the second housing 130.

[0054] In some examples, the first chamber K1 and the second chamber K2 are two independent and non-communicating chambers. In still other examples, referring to Figure 2 and Figure 8, the first chamber K1 and the second chamber K2 are connected through a second opening 102. This reduces the weight of the middle frame 120 to some extent, making the stereo camera 1000 lighter.

[0055] For example, in order to enable the light emitted by the light source 212 (see Figure 4) to exit, referring to Figure 7, the first housing 110 includes one or more first openings 111 through which the light emitted by one or more light sources 212 can exit.

[0056] By way of example, referring to FIG3 and FIG2, the second PCB assembly 220 includes a second body board 221, on which one or more processors 222 are mounted. In some examples, the second PCB assembly 220 also includes a transceiver module 223 (e.g., a transceiver module PHY (Physical)) mounted on the second body board 221. It should be understood that the inclusion of processor 222 in the second PCB assembly 220 allows at least a portion of the second PCB assembly 220 to form a core board.

[0057] For example, referring to FIG3, the processor 222 is configured to at least process the signal acquired by the stereo camera 1000 into a visual image. For example, if the stereo camera 1000 is a TOF stereo camera, the processor 222 is configured to at least receive the signal from the TOF lens assembly and process the signal into a visual image.

[0058] For example, referring to FIG3, processor 222 may include at least one of the following: system-on-a-chip (SOC) 222A, embedded multi-media card (EMMC) 222B, and double data rate (DDR) synchronous dynamic random access memory 222C.

[0059] In some examples, referring to FIG10, the second heat-conducting part 131 is protruding relative to the inner surface of the second housing 130. In this case, the second heat-conducting part 131 can also be referred to as the second heat-conducting boss.

[0060] Here, the number of second heat-conducting parts 131 included in the second housing 130 is not limited. For example, the second housing 130 may include multiple second heat-conducting parts 131, which correspond (e.g., one-to-one) to multiple processors 222 and are disposed on one side of the multiple processors 222 (see Figure 3). For another example, in some cases, the position of the processors 222, etc., on the second main body plate 221 is determined by the logic circuit of the stereo camera 1000's operating platform, and the room for variation is small. Therefore, referring to Figures 10 in conjunction with Figures 2 and 3, the second housing 130 may include one second heat-conducting part 131, and the orthogonal projections of the multiple processors 222 and the possibly present transceiver module 223 along the first direction X onto the second housing 130 are covered by the second heat-conducting part 131.

[0061] Similarly, referring to Figure 9, there is no limitation on the number of first heat-conducting parts 121 included in the middle frame 120. In some examples, the middle frame 120 includes one first heat-conducting part 121. In still other examples, the middle frame 120 includes multiple first heat-conducting parts 121.

[0062] Understandably, referring to Figure 9 and Figure 2, when the first heat-conducting part 121 conducts the heat generated by the first PCB assembly 210 to the middle frame 120, and the second heat-conducting part 131 conducts the heat generated by the second PCB assembly 220 to the second housing 130, the heat generated by the first PCB assembly 210 and the heat generated by the second PCB assembly 220 can be respectively conducted to the portion of the middle frame 120 near the first housing 110 and the second housing 130. In this way, the middle frame 120 and the second housing 130 can be used for joint heat dissipation, improving heat dissipation efficiency and preventing heat concentration. This solves the problem of large temperature rise during the operation of the stereo camera 1000, and improves the operational stability and service life of the stereo camera 1000.

[0063] In some examples, referring to FIG2, the stereo camera 1000 includes an indicator light panel 103 disposed within the second cavity K2, the indicator light panel 103 being used at least to indicate the operating status of the stereo camera 1000. In this case, the stereo camera 1000 may also include a transparent light guide post 104 penetrating the side of the second housing 130, so that the light emitted by the indicator light on the indicator light panel 103 can pass through the transparent light guide post 104 and be emitted.

[0064] The aforementioned indicator panel 103 consumes relatively low power during operation. In some examples, the power consumption of the indicator panel of the selected TOF stereo camera was measured, and the power consumption of the indicator lights on the panel was 0.2W, making the power consumption of the indicator panel account for 1.8% of the total power consumption. This indicates that the indicator panel 103 is the part of the TOF stereo camera with the smallest temperature rise. Exemplarily, natural heat dissipation can be used to cool the indicator panel 103.

[0065] In some examples, referring to FIG4, the first PCB assembly 210 includes a first body board 211, and a light source 212 is mounted on the first body board 211. It should be understood that the first PCB assembly 210 includes the light source 212 such that at least a portion of the first PCB assembly 210 can form a light source driver board.

[0066] For example, the light source 212 can be a laser, such as a vertical-cavity surface-emitting laser (VCSEL, also known as a vertical resonant surface-emitting laser).

[0067] Here, there is no limit to the number of light sources 212 included in the first PCB assembly 210.

[0068] In some examples, the first PCB assembly 210 includes a light source 212.

[0069] Figure 3 is a PCB architecture diagram of the stereo camera 1000 in some embodiments of this disclosure.

[0070] In some examples, referring to FIG3, the first PCB assembly 210 includes a plurality of light sources 212, which are spaced apart.

[0071] By setting it up in this way, the multiple light sources 212 can be distributed, that is, the heat sources on the first PCB assembly 210 can be distributed, thus avoiding heat concentration and reducing the temperature rise of the first PCB assembly 210.

[0072] Referring to Figure 3 and Figure 9, when the first PCB assembly 210 includes multiple light sources 212, the middle frame 120 may include multiple first heat-conducting parts 121. Among the multiple first heat-conducting parts 121, some first heat-conducting parts 121 are used to conduct heat generated by some light sources 212 to the middle frame 120, and other first heat-conducting parts 121 are used to conduct heat generated by other light sources 212 to the middle frame 120.

[0073] For example, referring to Figure 3 and Figure 9, the first PCB assembly 210 includes four spaced-apart light sources 212, and the middle frame 120 may include two first heat-conducting parts 121. One first heat-conducting part 121 is used to conduct the heat generated by two of the light sources 212 to the middle frame 120, and the other first heat-conducting part 121 is used to conduct the heat generated by the other two light sources 212 to the middle frame 120.

[0074] In some embodiments, referring to FIG2, the stereo camera 1000 further includes a third PCB assembly 230, which is used to receive logic signals and power signals at least. For example, the third PCB assembly 230 can be used to supply power to the first PCB assembly 210 and the second PCB assembly 220, and to input and output logic signals.

[0075] For example, referring to FIG2, the stereo camera 1000 further includes a first aviation connector 201 and a second aviation connector 202. One of the first aviation connector 201 and the second aviation connector 202 can be used to connect a control signal to the third PCB assembly 230, and the other can be used to connect a power signal to the third PCB assembly 230.

[0076] For example, the third PCB assembly 230 is electrically connected to at least a portion of the first PCB assembly 210 and to at least a portion of the second PCB assembly 220.

[0077] In some examples, referring to FIG3 and FIG2, the third PCB assembly 230 includes a third main board 231 and a functional module 232 mounted on the third main board 231.

[0078] For example, referring to FIG3, functional module 232 may include at least one of the following: a field-programmable gate array (FPGA) module 232A and a DC-to-DC converter (DCDC) module. Furthermore, the number of FPGA modules and DCDC modules may be one or more. For example, referring to FIG3, the DCDC modules on the third PCB assembly 230 include a first DCDC module 232B and a second DCDC module 232C.

[0079] The aforementioned functional module 232 generates a certain amount of power consumption during operation. In some examples, the power consumption of the third PCB assembly of the selected TOF stereo camera was measured. The power consumption of the three functional modules on the third PCB assembly were 0.1W, 0.4W, and 0.6W, respectively, totaling 1.1W. This means that the power consumption of the third PCB assembly accounts for 9.9% of the total power consumption, indicating that the third PCB assembly 230 is the part of the TOF stereo camera with the largest temperature rise.

[0080] In some examples, the heat from the third PCB assembly 230 is conducted to other parts of the second housing 130 except for the second heat-conducting part 131. In this case, the heat generated by the second PCB assembly 220 and the third PCB assembly 230 is relatively concentrated.

[0081] In some embodiments, referring to FIG2, and referring to FIGS. 8 and 9, the middle frame 120 further includes a third heat-conducting portion 122; the third heat-conducting portion 122 and the first heat-conducting portion 121 are spaced apart; the third heat-conducting portion 122 is closer to the second housing 130 than the first heat-conducting portion 121. The third PCB assembly 230 is located in the second chamber K2; the third heat-conducting portion 122 is used to conduct the heat generated by the third PCB assembly 230 to the middle frame 120.

[0082] In some examples, referring to Figure 2 in conjunction with Figures 3 and 8, the functional module 232 of the third PCB assembly 230 is mounted on the surface of the third main board 231 near the first housing 110. This facilitates heat conduction between the functional module 232 and the third heat-conducting part 122.

[0083] Referring here to Figure 8, the number of third heat-conducting parts 122 included in the middle frame 120 is not limited here. In some examples, the middle frame 120 includes one third heat-conducting part 122. In still other examples, the middle frame 120 includes multiple third heat-conducting parts 122.

[0084] When the third heat-conducting part 122 conducts the heat generated by the third PCB assembly 230 to the middle frame 120, the heat generated by the third PCB assembly 230 can also be conducted to the portion of the middle frame 120 near the second housing 130. In this way, the heat generated by the first PCB assembly 210, the second PCB assembly 220, and the third PCB assembly 230 can be conducted to the portions of the middle frame 120 near the first housing 110, the second housing 130, and the portions of the middle frame 120 near the second housing 130, respectively. This improves heat dissipation efficiency, prevents heat concentration, and reduces the temperature rise during the operation of the stereo camera 1000.

[0085] In some embodiments, referring to FIG3, multiple functional modules 232 are arranged at intervals.

[0086] By setting it up in this way, multiple functional modules 232 can be distributed, that is, the heat sources on the third PCB assembly 230 can be distributed, thus avoiding heat concentration and reducing the temperature rise of the third PCB assembly 230.

[0087] Referring to Figure 3 and Figure 8, when the third PCB assembly 230 includes multiple functional modules 232, the middle frame 120 may include multiple third heat-conducting parts 122. Some of the multiple third heat-conducting parts 122 are used to conduct heat generated by some functional modules 232 to the middle frame 120, while other third heat-conducting parts 122 are used to conduct heat generated by other functional modules 232 to the middle frame 120.

[0088] For example, referring to Figure 3 and Figure 8, the third PCB assembly 230 includes an FPGA module 232A, a first DC-DC module 232B, and a second DC-DC module 232C spaced apart. The power consumption of the FPGA module 232A is less than that of the DC-DC module. In this case, the middle frame 120 may include two third heat-conducting parts 122. One third heat-conducting part 122 is used to conduct the heat generated by the first DC-DC module 232B to the middle frame 120, and the other third heat-conducting part 122 is used to conduct the heat generated by the second DC-DC module 232C to the middle frame 120.

[0089] In related technologies, it is generally desirable for the stereo camera 1000 to have a smaller external dimension on the end face facing the target object (which can be understood as the front end face of the stereo camera 1000 in the installed state). In some examples, referring to Figure 2, the second main board 221 of the second PCB assembly 220 and the third main board 231 of the third PCB assembly 230 are the same motherboard. That is, the second PCB assembly 220 and the third PCB assembly 230 are integrated on a single motherboard, and the second PCB assembly 220 and the third PCB assembly 230 are arranged side by side, which makes the cross-sectional dimension of the stereo camera 1000 perpendicular to the first direction X smaller, thereby making the external dimension of the end face of the stereo camera 1000 facing the target object smaller.

[0090] In some embodiments, referring to FIG2, the third PCB assembly 230 is located on the side of the second PCB assembly 220 away from the second housing 130.

[0091] Through the above settings, on the one hand, the cross-sectional dimension of the stereo camera 1000 perpendicular to the first direction X can be made smaller, which is beneficial to the compression of the end face dimension of the stereo camera 1000 facing the target object. This enables the miniaturization design of the stereo camera 1000, making the overall structure of the stereo camera 1000 small and compact. In some examples, the overall size of the stereo camera 1000 can reach 80mm×75mm×65mm. On the other hand, referring to Figure 2, the second PCB assembly 220 can be made closer to the second heat-conducting part 131 in the second housing 130, and the third PCB assembly 230 can be made closer to the third heat-conducting part 122 in the middle frame 120 (see Figure 8). This optimizes the spatial position of the above-mentioned structural components.

[0092] It should be noted that, in conjunction with Figure 2, and referring to Figures 8 and 9, the embodiments of this disclosure do not limit the arrangement of the first heat-conducting part 121 and / or the third heat-conducting part 122, as long as the heat generated by the first PCB assembly 210 or the third PCB assembly 230 can be conducted to the middle frame 120.

[0093] In some embodiments, referring to Figures 8 and 9, the middle frame 120 includes an outer frame portion 123 and a partition portion 124. The partition portion 124 is fixed to the inner wall of the outer frame portion 123; the partition portion 124 includes a first heat-conducting portion 121 and a third heat-conducting portion 122.

[0094] For example, when the middle frame 120 includes a partition portion 124, the second opening 102 may be formed in the partition portion 124.

[0095] For example, the first heat-conducting part 121 is provided to protrude from the portion of the partition portion 124 adjacent to the first heat-conducting part 121. In this case, the first heat-conducting part 121 may also be referred to as the first heat-conducting boss.

[0096] For example, the third heat-conducting portion 122 is provided to protrude from the portion of the partition portion 124 adjacent to the third heat-conducting portion 122. In this case, the third heat-conducting portion 122 may also be referred to as the third heat-conducting boss.

[0097] With the above configuration, the first heat-conducting part 121 and the third heat-conducting part 122 can be formed as one piece, which simplifies the structure of the middle frame 120 and simplifies the process of forming the first heat-conducting part 121 and the third heat-conducting part 122.

[0098] Hereinafter, with reference to FIG2, the heat conduction methods of the first PCB assembly 210, the second PCB assembly 220 and the third PCB assembly 230 will be described by way of example.

[0099] In some examples, heat conduction is achieved through direct contact between the third PCB assembly 230 (see Figure 2) and the third heat-conducting part 122 (see Figure 8). In this case, in order to improve the contact effect between the third PCB assembly 230 and the third heat-conducting part 122, the installation accuracy requirements for the third PCB assembly 230 and the middle frame 120 (see Figure 2) are relatively high.

[0100] In some embodiments, referring to FIG8 and FIG5, the stereo camera 1000 further includes a first elastic thermal pad 310. The first elastic thermal pad 310 is located between the third PCB assembly 230 and the third thermal conductive part 122, and is in contact with the third thermal conductive part 122.

[0101] For example, the material of the first elastic thermal pad 310 can be a high-performance gap-filling thermally conductive material, such as thermal grease or thermal gel.

[0102] It should be understood that the number of first elastic thermal pads 310 can be one or more. For example, when the number of third thermal conductive parts 122 (see Figure 8) is multiple (e.g., two), the number of first elastic thermal pads 310 (see Figure 5) can be multiple, and multiple first elastic thermal pads 310 can be attached to multiple third thermal conductive parts 122 in a one-to-one correspondence.

[0103] With the above configuration, referring to Figure 8 and Figure 5, one surface of the first elastic thermal pad 310 can be attached to the third PCB assembly 230 (e.g., to the functional module 232, see Figure 3), and the other surface can be attached to the third thermal conductive part 122, thereby achieving indirect contact between the third PCB assembly 230 and the third thermal conductive part 122. Furthermore, the material of the first elastic thermal pad 310 has a certain degree of elasticity, which can improve the tightness of the fit between the first elastic thermal pad 310 and the third PCB assembly 230, and between the first elastic thermal pad 310 and the third thermal conductive part 122. This prevents gaps between the closely approaching surfaces of the third PCB assembly 230 and the third thermal conductive part 122, thus improving the heat conduction effect and enhancing the heat conduction between the third PCB assembly 230 and the third thermal conductive part 122.

[0104] In some embodiments, referring to FIG5, the first main body plate 211 has a first surface 211a and a second surface 211b disposed opposite to each other, the second surface 211b being closer to the second housing 130 than the first surface 211a; referring to FIG4 in conjunction with FIG5, the light source 212 is disposed on the first surface 211a of the first main body plate 211.

[0105] With the above configuration, referring to Figure 4, the light emitted by the light source 212 can be directed toward the first housing 110 and pass through the first opening 111 (see Figure 7) before exiting.

[0106] It should be understood that, in conjunction with Figures 5 and 9 and referring to Figure 4, the surface of the light source 212 near the second housing 130 is in contact with the first main body plate 211, so that the surface of the light source 212 near the second housing 130 cannot come into contact with the first heat-conducting part 121.

[0107] Therefore, in some examples, referring to Figures 4, 5, and 9, the second surface 211b of the first main body plate 211 contacts the first heat-conducting part 121, allowing the heat generated by the light source 212 to be conducted to the first heat-conducting part 121 through the first main body plate 211. In this case, to improve the contact effect between the first PCB assembly 210 and the first heat-conducting part 121, the installation accuracy requirements for the first PCB assembly 210 and the middle frame 120 are relatively high.

[0108] In some embodiments, referring to Figures 4 and 5, the stereo camera 1000 further includes a second elastic thermal pad 320. The second elastic thermal pad 320 is located between the second surface 211b of the first main body plate 211 and the first thermally conductive portion 121, and is directly opposite the light source 212.

[0109] For example, the material of the second elastic thermal pad 320 can be a high-performance gap-filling thermally conductive material.

[0110] It should be understood that the number of second elastic thermal pads 320 can be one or more. For example, referring to FIG4, when the number of first thermal conductive parts 121 is multiple (e.g., two), the number of second elastic thermal pads 320 can be multiple, and multiple second elastic thermal pads 320 can be attached to multiple first thermal conductive parts 121 in a one-to-one correspondence.

[0111] With the above configuration, referring to Figures 4 and 5, the heat generated by the light source 212 can be conducted to the first heat-conducting part 121 through at least the first main body plate 211 and the second elastic thermal pad 320. Furthermore, since the second elastic thermal pad 320 is directly opposite the light source 212, the heat conduction distance generated by the light source 212 is relatively short, improving the heat conduction effect. In addition, the material of the second elastic thermal pad 320 has a certain degree of elasticity, which can improve the adhesion between the second elastic thermal pad 320 and the first PCB assembly 210, thereby enhancing the heat conduction effect between the second elastic thermal pad 320 and the first PCB assembly 210.

[0112] In some examples, referring to Figure 4, the second elastic thermal pad 320 can be in direct contact with the first thermally conductive part 121. In this case, the second elastic thermal pad 320 and the first thermally conductive part 121 are in close contact.

[0113] In some implementations, stereo cameras exhibit significant electromagnetic radiation, posing a safety risk. In some cases, hardware modifications are necessary to reduce overall electromagnetic radiation, hindering product development. The light source (e.g., a laser) is one of the components in a stereo camera that generates relatively high levels of electromagnetic radiation.

[0114] Therefore, in some embodiments, referring to FIG4, the stereo camera 1000 further includes a third elastic thermal conductive pad 330 and a shield 410. The third elastic thermal conductive pad 330 is located on the side of the second elastic thermal conductive pad 320 away from the first main body plate 211 and is in contact with the first thermal conductive part 121. The shield 410 is disposed between the second elastic thermal conductive pad 320 and the third elastic thermal conductive pad 330; the shield 410 protrudes in a direction away from the third elastic thermal conductive pad 330.

[0115] For example, the material of the third elastic thermal pad 330 can be a high-performance gap-filling thermally conductive material.

[0116] It should be understood that, referring to Figure 4, the number of third elastic thermal conductive pads 330 can be one or more. Similarly, the number of shielding covers 410 can be one or more. For example, when the number of second elastic thermal conductive pads 320 is multiple (e.g., two), the number of third elastic thermal conductive pads 330 and shielding covers 410 can both be multiple. Multiple shielding covers 410 can be attached to multiple second elastic thermal conductive pads 320 in a one-to-one correspondence, and multiple third elastic thermal conductive pads 330 can be attached to multiple shielding covers 410 in a one-to-one correspondence.

[0117] For example, the material of the shield 410 is a material with good thermal conductivity and shielding performance, such as nickel silver.

[0118] Referring to Figure 4, the stereo camera 1000 also includes a shielding cover 410, which can reduce the external electromagnetic radiation of the light source 212, thereby reducing the external electromagnetic radiation of the stereo camera 1000. Furthermore, when the shielding cover 410 is positioned between the second elastic thermal pad 320 and the third elastic thermal pad 330, and is directly opposite the light source 212, the effectiveness of the shielding cover 410 in reducing the external electromagnetic radiation of the light source 212 is enhanced.

[0119] Furthermore, through the above arrangement, the heat generated by the light source 212 can be conducted to the first heat-conducting part 121 through at least the first main body plate 211, the second elastic thermal conductive pad 320, the shielding cover 410, and the third elastic thermal conductive pad 330 arranged in sequence. Moreover, the materials of the second elastic thermal conductive pad 320 and the third elastic thermal conductive pad 330 both have a certain degree of elasticity, which allows the second elastic thermal conductive pad 320 to fit tightly against the shielding cover 410, the shielding cover 410 to the third elastic thermal conductive pad 330, and the third elastic thermal conductive pad 330 to the first heat-conducting part 121, thereby improving the heat conduction effect between the first PCB assembly 210 and the first heat-conducting part 121.

[0120] In some examples, referring to Figure 4, the second elastic thermal pad 320 is in direct contact with the first main body plate 211.

[0121] In some embodiments, referring to FIG5 and FIG4, the first PCB assembly 210 further includes a first thermally conductive coating 213. The first thermally conductive coating 213 is disposed on the first surface 211a of the first main body plate 211 and is disposed away from the light source 212; the first thermally conductive coating 213 is in contact with the first housing 110.

[0122] For example, the material of the first thermally conductive coating 213 includes copper.

[0123] For example, referring to FIG6, and referring to FIGS. 2 and 4, the first main body plate 211 is fixed to the first housing 110 by a plurality of (e.g., six) first mounting screws 203 installed in the first mounting holes 109. In this way, the first main body plate 211 can be locked onto the first housing 110 to enhance the connection stability between the first main body plate 211 and the first housing 110, and improve the adhesion between the first thermally conductive coating 213 and the first housing 110, thereby enhancing the heat conduction effect of the first thermally conductive coating 213.

[0124] Referring to Figure 4 and Figure 5, when the first thermally conductive coating 213 is applied to the first surface 211a of the first main body plate 211 and is in contact with the first housing 110 (e.g., the inner surface 110a of the first housing 110, see Figure 6), a portion of the heat conducted from the light source 212 to the first main body plate 211 can be conducted to the first housing 110 via the first thermally conductive coating 213. Thus, the combined heat dissipation of the middle frame 120 and the first housing 110 can be utilized, improving the heat dissipation efficiency of the first PCB assembly 210. Furthermore, the first thermally conductive coating 213 has the advantage of good thermal conductivity, which can improve the heat transfer efficiency between the first main body plate 211 and the first housing 110. In addition, the first thermally conductive coating 213 has the advantages of easy application and thin thickness, balancing ease of assembly with high heat dissipation efficiency.

[0125] In some embodiments, referring to FIG4, the first PCB assembly 210 further includes a second thermally conductive coating 214. The second thermally conductive coating 214 is located between the first body plate 211 and the second elastic thermally conductive pad 320.

[0126] It should be understood that the first PCB assembly 210 may include a second thermally conductive coating 214, or it may include a plurality of second thermally conductive coatings 214 spaced apart. For example, when there are multiple second elastic thermally conductive pads 320 (e.g., two), a plurality of second thermally conductive coatings 214 spaced apart may be included, and the plurality of second thermally conductive coatings 214 may be bonded to the plurality of second elastic thermally conductive pads 320 in a one-to-one correspondence.

[0127] For example, the material of the second thermally conductive coating 214 includes copper.

[0128] With the second thermally conductive coating 214 located between the first main board 211 and the second elastic thermally conductive pad 320, the heat conduction efficiency of the first main board 211 and the second elastic thermally conductive pad 320 can be improved by utilizing the second thermally conductive coating 214, thereby improving the heat dissipation efficiency of the first PCB assembly 210.

[0129] In some examples, referring to Figure 2, the second PCB assembly 220 and the second heat-conducting part 131 achieve heat conduction through direct contact. In this case, in order to improve the contact effect between the second PCB assembly 220 and the second heat-conducting part 131, the installation accuracy requirements for the second PCB assembly 220 and the second housing 130 are relatively high.

[0130] In some embodiments, referring to FIG2, the stereo camera 1000 further includes a fourth elastic thermal pad 340. The fourth elastic thermal pad 340 is located between the second PCB assembly 220 and the second thermally conductive part 131, and is in contact with the second thermally conductive part 131.

[0131] For example, the material of the fourth elastic thermal pad 340 can be a high-performance gap-filling thermally conductive material.

[0132] It should be understood that the number of fourth elastic thermal pads 340 can be one or more. For example, referring to FIG2, when the number of second thermal conductive parts 131 is one, the number of fourth elastic thermal pads 340 can be one, and the fourth elastic thermal pad 340 can be attached to the second thermal conductive part 131.

[0133] For example, referring to FIG3 and FIG2, the processor 222 and / or transceiver module 223 included in the second PCB assembly 220 are mounted on the surface of the second main board 221 away from the first housing 110. At this time, the fourth elastic thermal pad 340 can be attached to the processor 222 and / or transceiver module 223, thereby reducing the heat conduction distance and improving the heat conduction effect.

[0134] With the above settings, referring to Figure 2, similarly to the aforementioned part, the fourth elastic thermal pad 340 can achieve indirect contact between the second PCB assembly 220 and the second thermal conductive part 131, and can improve the tightness of the fit between the fourth elastic thermal pad 340 and the second PCB assembly 220, as well as between the fourth elastic thermal pad 340 and the second thermal conductive part 131, avoiding gaps between the close surfaces of the second PCB assembly 220 and the second thermal conductive part 131 that would affect the heat conduction effect, thereby improving the heat conduction effect between the second PCB assembly 220 and the second thermal conductive part 131.

[0135] As mentioned above, the stereo camera 1000 can achieve visual functions by receiving light reflected from a target object. The lens assembly in the stereo camera 1000 used to receive light reflected from a target object will be described below as an example.

[0136] In some embodiments, referring to FIG3 and FIG2, the stereo camera 1000 further includes a TOF lens assembly 510, which includes a TOF lens module 511 and a first sensing component 512. The first sensing component 512 is closer to the second housing 130 than the TOF lens module 511. The TOF lens module 511 passes through the first housing 110 and the first PCB assembly 210.

[0137] For example, the TOF lens module 511 is fixed to the partition portion 124 (see Figure 8) by a second mounting screw 501.

[0138] For example, referring to FIG7, the first housing 110 has a third opening 503 for forming a window of the TOF lens assembly 510.

[0139] For example, the first sensing component 512 includes a first image sensor and a first sensor mounting plate, the first sensor mounting plate being closer to the TOF lens module 511 than the first image sensor.

[0140] The aforementioned TOF lens assembly 510 generates a certain amount of power consumption during operation. In some examples, the power consumption of the TOF lens assembly of the selected TOF stereo camera was measured. The power consumption of the TOF lens assembly was 1.5W, accounting for 13.5% of the total power consumption. This indicates that the TOF lens assembly 510 is the part of the TOF stereo camera with the largest temperature rise. Among them, the first sensing component 512 (e.g., including the first image sensor) is the part of the TOF lens assembly 510 with the largest power consumption.

[0141] In some embodiments, referring to FIG3 and FIG5, the partition portion 124 further includes a first recessed portion (not shown in the figure), which is recessed in a direction close to the second housing 130. The stereo camera 1000 also includes a first heat-conducting block 350. The first sensing component 512 is located between the TOF lens module 511 and the first recessed portion, and together with the first recessed portion, forms a first filling cavity K3. The first heat-conducting block 350 is disposed within the first filling cavity K3 and contacts the first sensing component 512.

[0142] It should be understood that the material of the first heat-conducting block 350 includes thermally conductive gel, which makes the first heat-conducting block 350 relatively soft and able to absorb stress generated in the surrounding environment.

[0143] For example, the material of the first heat-conducting block 350 may be a paste-like semi-fluid heat-conducting material.

[0144] Understandably, the first sensing component 512 (e.g., including a first image sensor) is relatively sensitive to stress and strain. Furthermore, stress or strain on the first sensing component 512 may affect the imaging performance of the stereo camera 1000. Referring to FIG3 and FIG5, this embodiment of the present disclosure further includes a first heat-conducting block 350 in the stereo camera 1000. On the one hand, the first heat-conducting block 350 can conduct the heat generated by the first sensing component 512 to the first recessed portion, and then to the middle frame 120. On the other hand, compared to other heat-conducting structures (e.g., heat-conducting pads), the first heat-conducting block 350 is relatively soft. In this way, while ensuring the heat-conducting function of the first heat-conducting block 350, the impact of surrounding stress or strain on the first sensing component 512 can be reduced, thereby improving the imaging performance of the stereo camera 1000.

[0145] In some embodiments, referring to FIG3 and FIG2, the stereo camera 1000 further includes a color lens assembly (e.g., an RGB lens assembly) 520, which includes a color lens module 521 and a second sensing component 522. The second sensing component 522 is closer to the second housing 130 than the color lens module 521. The color lens module 521 extends through the first housing 110 and the first PCB assembly 210.

[0146] For example, referring to FIG8 and FIG2, the color lens module 521 is fixed to the partition portion 124 by a third mounting screw 502.

[0147] For example, referring to FIG7, the first housing 110 has a fourth opening 504 for forming a window of the color lens assembly 520.

[0148] For example, referring to FIG3 and FIG2, the second sensing component 522 includes a second image sensor and a second sensor mounting plate, the second sensor mounting plate being closer to the color lens module 521 than the second image sensor.

[0149] The aforementioned color lens assembly 520 generates a certain amount of power consumption during operation. In some examples, the power consumption of the color lens assembly of the selected TOF stereo camera was measured, and the power consumption of the color lens assembly was 0.5W, accounting for 4.5% of the total power consumption. This indicates that the color lens assembly 520 is the part of the TOF stereo camera with a relatively large temperature rise. Among them, the second sensing component 522 (e.g., including a second image sensor) is the part of the color lens assembly 520 with a relatively large power consumption.

[0150] In some embodiments, referring to FIG. 2 and FIG. 3 and referring to FIG. 9, the partition portion 124 further includes a second recessed portion (not shown in the figure), which is recessed in a direction close to the second housing 130. The stereo camera 1000 also includes a second heat-conducting block (not shown in the figure). The second sensing component 522 is located between the color lens module 521 and the second recessed portion, and together with the second recessed portion, forms a second filling cavity K4. The second heat-conducting block is disposed within the second filling cavity K4 and contacts the second sensing component 522.

[0151] Similarly to the previous part, the material of the second heat-conducting block includes thermally conductive gel, which makes the second heat-conducting block softer and able to absorb stress generated in the surrounding environment.

[0152] For example, the material of the second heat-conducting block can be a paste-like semi-fluid heat-conducting material.

[0153] Similarly, referring to Figure 2 and Figure 3, when the second sensing component 522 (e.g., including a second image sensor) is subjected to stress or strain, the imaging effect of the stereo camera 1000 may be affected. This embodiment of the present disclosure further includes a second heat-conducting block in the stereo camera 1000, which can conduct the heat generated by the second sensing component 522 to the second recessed portion, and then to the middle frame 120. This reduces the impact of surrounding stress or strain on the second sensing component 522 while ensuring the heat conduction function of the second heat-conducting block, thereby improving the imaging effect of the stereo camera 1000.

[0154] Referring to FIG2, the above describes by way of exemplarily conducting heat to the first housing 110, the middle frame 120, or the second housing 130 of the high power consumption structure in the stereo camera 1000. Hereinafter, the method of dissipating the heat conducted to the first housing 110, the middle frame 120, or the second housing 130 to the outside will be described by way of example.

[0155] In some embodiments, referring to FIG2 and FIG8, the outer frame portion 123 includes a first outer frame portion 1231 and a second outer frame portion 1232 connected to each other, wherein the first outer frame portion 1231 is closer to the first housing 110 than the second outer frame portion 1232. The stereo camera 1000 also includes at least one air duct 610 disposed on the outer periphery of the first outer frame portion 1231.

[0156] There are no restrictions on the form and number of air ducts 610 here.

[0157] For example, referring to FIG5, the first outer frame portion 1231 includes a main body portion 12311 and four connecting posts 12312 fixedly connected to the four corners of the main body portion 12311. The connecting posts 12312 can be used to install the first bolt 101 (see FIG2). With this arrangement, the space between the rectangular frame enclosed by the main body portion 12311 and the four connecting posts 12312 can form an annular air duct 610. Moreover, the annular air duct 610 can communicate with the outside through the gaps between the connecting posts 12312, thereby enhancing the air circulation effect.

[0158] In some examples, referring to Figure 2, and referring to Figures 4 and 5, the first heat-conducting block 350, the second heat-conducting block, and the second elastic heat-conducting pad 320 are located within the space enclosed by the main body 12311. In this way, the heat generated by the first PCB assembly 210, the TOF lens assembly 510, and the color lens assembly 520 can be dissipated through the air duct 610.

[0159] For example, the number of air ducts 610 can be one; and for example, referring to FIG5, the number of air ducts 610 (e.g., annular air ducts 610) can be multiple (e.g., three).

[0160] Understandably, referring to Figure 5, firstly, by providing at least one air duct 610 on the outer periphery of the first outer frame 1231, the air in the air duct 610 can exchange heat with the outside air, thus improving the heat dissipation efficiency of the stereo camera 1000. Secondly, through the above arrangement, the location of the air duct 610 can avoid the first chamber K1, that is, avoid the larger second PCB assembly 220, so that the arrangement of the air duct 610 will not increase the appearance size of the stereo camera 1000, which is conducive to the reduction of the appearance size of the stereo camera 1000. Thirdly, in conjunction with Figure 2, and referring to Figures 4 and 5, when the first heat-conducting block 350, the second heat-conducting block, and the second elastic heat-conducting pad 320 are located within the space enclosed by the main body 12311, the heat generated by the relatively concentrated and high-power first PCB assembly 210, TOF lens assembly 510, and color lens assembly 520 can be conducted to the main body 12311 and dissipated from the air duct 610, making the location of the air duct 610 more compatible with the heat dissipation requirements.

[0161] In some embodiments, referring to FIG1, the stereo camera 1000 further includes a plurality of fins 620 spaced apart. A portion of the plurality of fins 620 is fixed to the wall surface 110b of the first housing 110 away from the middle frame 120, another portion is fixed to the wall surface of the second housing 130 away from the middle frame 120, and yet another portion is fixed to the side surface 1232a of the second outer frame portion 1232.

[0162] For example, referring to FIG1, when the stereo camera 1000 includes a first aviation connector 201 and a second aviation connector 202, the first aviation connector 201 and the second aviation connector 202 penetrate through the second housing 130. In this case, the fins 620 fixed to the wall surface of the second housing 130 away from the middle frame 120 are arranged to avoid the first aviation connector 201 and the second aviation connector 202.

[0163] In some examples, referring to Figure 2, the openings in the first housing 110 for mounting the TOF lens assembly 510 and the color lens assembly 520 were optimized based on parameters such as the field of view (FOV) and through-the-lens (TTL) of different lenses. Furthermore, the mounting space in the middle frame 120 for mounting the TOF lens assembly 510 and the color lens assembly 520 was designed for compatibility. This enabled the serialization of the stereo camera 1000 (e.g., an industrial-grade TOF camera), allowing for the reuse of the first housing 110, middle frame 120, second housing 130, first PCB assembly 210, second PCB assembly 220, and third PCB assembly 230 for small-field-of-view, medium-field-of-view, and large-field-of-view camera models. This reduced the number of structural components, enhanced the structural compatibility of the housing with product serialization, lowered the structural development cost of the stereo camera 1000, and improved assembly line efficiency, significantly reducing structural component development costs and material management costs.

[0164] For example, referring to Figures 4 and 7, the fins 620 fixed to the wall surface 110b of the first housing 110 away from the middle frame 120 include first annular fins 621 disposed on the edge of the wall surface 110b of the first housing 110 away from the middle frame 120. With this arrangement, an annular air channel can be formed by the first annular fins 621, which can improve the heat dissipation efficiency at the first housing 110.

[0165] For example, referring to FIG4 and FIG7, when the plurality of fins 620 include the first annular fin 621, an annular groove 640 located inside the first annular fin 621 can be formed on the wall surface 110b of the first housing 110 away from the middle frame 120. In this way, the airflow of the aforementioned annular air channel can be further increased, thereby further improving the heat dissipation efficiency at the first housing 110.

[0166] For example, referring to FIG1, the dimensions of the plurality of fins 620 fixed to the wall surface 110b of the first housing 110, which is located away from the middle frame 120, along the first direction X are larger than the dimensions of the plurality of fins 620 fixed to the side surface 1232a of the second outer frame portion 1232 along the first direction X. And / or, the number of the plurality of fins 620 fixed to the wall surface 110b of the first housing 110, which is located away from the middle frame 120, is greater than the number of the plurality of fins 620 fixed to the wall surface 110b of the first housing 110, which is located away from the middle frame 120, and the number of the plurality of fins 620 fixed to the side surface 1232a of the second outer frame portion 1232. This configuration has several advantages. First, it improves the heat dissipation efficiency of the second housing 130. Second, referring to Figure 2 and Figure 1, as mentioned above, the size of the stereo camera 1000 along the first direction X can be relatively large. This configuration allows full use of the space of the stereo camera 1000 along the first direction X to accommodate the fins 620. Third, it ensures that the arrangement of the fins 620 matches the high power consumption and high heat dissipation requirements of the second PCB assembly 220.

[0167] Referring to Figure 1, the stereo camera 1000 also includes a plurality of spaced-apart fins 620. Heat conducted to the first housing 110, the second outer frame 1232, and the second housing 130 can be further conducted to the fins 620 and dissipated through them, thus improving the heat dissipation efficiency of the stereo camera 1000. Furthermore, the wall 110b of the first housing 110 away from the middle frame 120, the wall of the second housing 130 away from the middle frame 120, and the side 1232a of the second outer frame 1232 have the advantage of a large structural surface area, allowing for the placement of more fins 620, further enhancing heat dissipation efficiency.

[0168] Furthermore, referring to Figures 1 and 2, when the fourth elastic thermal pad 340 is located in the second cavity K2 and multiple fins 620 are provided on the side 1232a of the second outer frame 1232, the heat generated by the relatively low power consumption third PCB assembly 230 can be conducted to the second outer frame 1232 and the multiple fins 620. In this way, the placement of the fins 620 on the middle frame 120 can be better matched with the heat dissipation requirements.

[0169] In some embodiments, referring to Figures 4 and 7, the stereo camera 1000 further includes a plurality of grooves 630 formed on the outer peripheral surface of the first housing 110.

[0170] For example, there are eight grooves 630, which are evenly distributed on the outer peripheral surface of the first housing 110.

[0171] With the above configuration, the structural surface area of ​​the first housing 110 can be increased, and the heat dissipation area of ​​the first housing 110 can be increased, thereby improving the heat dissipation efficiency of the first housing 110.

[0172] Referring to FIG11, some embodiments of this disclosure also provide an electronic device 2000. The electronic device 2000 includes a controller 2100 and a stereo camera 1000 provided in the above embodiments. The controller 2100 is coupled to the stereo camera 1000.

[0173] The beneficial effects that the electronic device 2000 provided in some embodiments of this disclosure can achieve are the same as the beneficial effects that the stereo camera 1000 provided in the above embodiments can achieve, and will not be repeated here.

[0174] In some examples, the electronic device 2000 can be a logistics robot, etc., so that the stereo camera 1000 can be applied to small-volume, medium-precision, medium-to-long-range vision scenarios such as robots, logistics, warehousing or general AIoT.

[0175] Here, there are no limitations on the mounting method of the stereo camera 1000 on the electronic device 2000. For example, referring to FIG4, a second mounting hole 108 is provided on the outer peripheral surface of the middle frame 120, and the stereo camera 1000 can be connected to other parts of the electronic device 2000 (e.g., a mounting bracket) by bolts installed in the second mounting hole 108.

[0176] For example, the controller 2100 may be coupled to at least the third PCB assembly 230 (see Figure 2).

[0177] Referring to Figure 11, when the controller 2100 is coupled to the stereo camera 1000, the controller 2100 can input drive signals to the stereo camera 1000 and acquire the visual information generated by the stereo camera 1000. Of course, the controller 2100 can also perform other functions, which will not be listed here.

[0178] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A stereo camera, characterized in that, include: The first housing, the middle frame, and the second housing are connected together; The middle frame is disposed between the first housing and the second housing; the portion of the first housing and the middle frame near the first housing encloses to form a first chamber; the portion of the second housing and the middle frame near the second housing encloses to form a second chamber; the middle frame includes a first heat-conducting part; the second housing includes a second heat-conducting part; A first PCB assembly is located within the first cavity; the first heat-conducting part is used to conduct the heat generated by the first PCB assembly to the middle frame. as well as, The second PCB assembly is located within the second cavity; the second heat-conducting part is used to conduct the heat generated by the second PCB assembly to the second housing.

2. The stereo camera according to claim 1, characterized in that, The middle frame also includes a third heat-conducting part; the third heat-conducting part and the first heat-conducting part are spaced apart; the third heat-conducting part is closer to the second housing than the first heat-conducting part; The stereo camera also includes: The third PCB assembly is located within the second cavity; the third heat-conducting part is used to conduct the heat generated by the third PCB assembly to the middle frame.

3. The stereo camera according to claim 2, characterized in that, The third PCB assembly is located on the side of the second PCB assembly away from the second housing; the third PCB assembly is used to access logic signals and power signals.

4. The stereo camera according to claim 2 or 3, characterized in that, The stereo camera also includes: The first elastic thermal pad is located between the third PCB assembly and the third thermal conductive part, and is in contact with the third thermal conductive part.

5. The stereo camera according to any one of claims 1 to 4, characterized in that, The first PCB assembly includes a first main board and a light source; the first main board has a first surface and a second surface disposed opposite to each other, the second surface being closer to the second housing than the first surface; The light source is disposed on the first surface of the first main body plate; The stereo camera also includes: The second elastic thermal pad is located between the second surface of the first main body plate and the first thermally conductive part, and is directly opposite the light source.

6. The stereo camera according to claim 5, characterized in that, The stereo camera also includes: A third elastic thermal conductive pad is located on the side of the second elastic thermal conductive pad away from the first main body plate and is in contact with the first thermal conductive portion; and, A shielding cover is disposed between the second elastic thermal conductive pad and the third elastic thermal conductive pad; the shielding cover protrudes in a direction away from the third elastic thermal conductive pad.

7. The stereo camera according to claim 5 or 6, characterized in that, The first PCB assembly also includes: A first thermally conductive coating is disposed on the first surface of the first main body plate and is positioned to avoid the light source; the first thermally conductive coating is in contact with the first housing; and, The second thermally conductive coating is located between the first main body plate and the second elastic thermally conductive pad.

8. The stereo camera according to any one of claims 1 to 7, characterized in that, The stereo camera also includes: The fourth elastic thermal pad is located between the second PCB assembly and the second thermal conductive part, and is in contact with the second thermal conductive part.

9. The stereo camera according to any one of claims 1 to 8, characterized in that, The stereo camera further includes: a third PCB assembly located within the second cavity; The first PCB assembly includes multiple light sources, which are spaced apart; and / or, The second PCB assembly includes a processor; and / or, The third PCB assembly includes multiple functional modules, which are spaced apart.

10. The stereo camera according to any one of claims 1 to 9, characterized in that, The middle frame also includes: A third heat-conducting part; the third heat-conducting part and the first heat-conducting part are arranged at a distance; the third heat-conducting part is closer to the second housing than the first heat-conducting part; Outer frame; and, The partition portion is fixed to the inner wall of the outer frame portion; the partition portion includes the first heat-conducting portion and the third heat-conducting portion.

11. The stereo camera according to claim 10, characterized in that, The partition portion further includes a first groove portion, which is recessed along a direction close to the second housing. The stereo camera also includes: A TOF lens assembly includes a TOF lens module and a first sensing component; the first sensing component is closer to the second housing than the TOF lens module; the TOF lens module penetrates the first housing and the first PCB assembly; the first sensing component is located between the TOF lens module and the first recessed portion, and together with the first recessed portion, forms a first filling cavity; and... The first heat-conducting block is disposed in the first filling cavity and is in contact with the first sensing component.

12. The stereo camera according to claim 10 or 11, characterized in that, The middle frame also includes a second recessed portion, which is recessed along the direction close to the second housing. The stereo camera also includes: A color lens assembly includes a color lens module and a second sensing component; the second sensing component is closer to the second housing than the color lens module; the color lens module penetrates the first housing and the first PCB assembly; the second sensing component is located between the color lens module and the second recess, and together with the second recess, forms a second filling cavity; and... The second heat-conducting block is disposed in the second filling cavity and is in contact with the second sensing component.

13. The stereo camera according to any one of claims 10 to 12, characterized in that, The outer frame portion includes a first outer frame portion and a second outer frame portion connected to each other, wherein the first outer frame portion is closer to the first housing than the second outer frame portion; The stereo camera further includes at least one air duct located on the outer periphery of the first outer frame.

14. The stereo camera according to claim 13, characterized in that, The stereo camera also includes: Multiple fins are spaced apart; a portion of the multiple fins is fixed to the wall surface of the first housing away from the middle frame, another portion of the multiple fins is fixed to the wall surface of the second housing away from the middle frame, and yet another portion of the multiple fins is fixed to the side surface of the second outer frame.

15. The stereo camera according to any one of claims 1 to 14, characterized in that, The stereo camera also includes: Multiple grooves are formed on the outer peripheral surface of the first housing.

16. An electronic device, characterized in that, include: The stereo camera as described in any one of claims 1 to 15; as well as, The controller is coupled to the stereo camera.

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