Communication apparatus, communication method and device

Abstract

The present application relates to the technical field of electronics. Provided are a communication apparatus, a communication method and a device, which are used to improve the scalability and operational flexibility of baseband dies in communication apparatuses. The communication apparatus comprises: a first baseband die and a second baseband die which are coupled, wherein the first baseband die is coupled to at least one first radio frequency channel, and the at least one first radio frequency channel is configured to couple to at least one first antenna; and the second baseband die is coupled to at least one second radio frequency channel, and the at least one second radio frequency channel is configured to couple to at least one second antenna. The communication apparatus has a first operating mode and a second operating mode. In the first operating mode, the first baseband die and the second baseband die operate independently, and in the second operating mode, the first baseband die and the second baseband die operate cooperatively.

Description

A communication device, communication method and equipment

[0001] This application claims priority to Chinese Patent Application No. 202510089663.3, filed on January 20, 2025, entitled "A Communication Device, Communication Method and Equipment", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of electronic technology, and in particular to a communication device, communication method and equipment. Background Technology

[0003] The continuous improvement of wireless system specifications has led to a significant increase in the resource area of ​​individual chips, making it difficult to control chip yield and production costs. At the same time, as Moore's Law approaches its physical limits and the pace of chip process iteration slows down, the approach of improving chip capabilities and reducing production costs through process evolution is being hampered.

[0004] Furthermore, as the number of antennas and bandwidth supported by wireless systems increase, the computational complexity of baseband chips also needs to rise significantly. In traditional chip manufacturing models, to upgrade to higher-specification wireless systems, designers and manufacturers need to redesign and produce higher-specification baseband chips. However, the types of wireless products supported by these higher-specification baseband chips are fixed and lack scalability; simultaneously, when backward compatible with lower-specification products, these higher-specification baseband chips cannot fully utilize their capabilities, resulting in low resource utilization. Summary of the Invention

[0005] This application provides a communication device, communication method, and equipment, which can improve the scalability and flexibility of the baseband dies in the communication device by coupling and splicing multiple isomorphic baseband dies.

[0006] In a first aspect, a communication device is provided, comprising: a coupled first baseband die and a second baseband die, for example, both the first baseband die and the second baseband die are ASICs; the first baseband die is coupled to at least one first radio frequency (RF) channel, the at least one first RF channel being used for coupling with at least one first antenna; the second baseband die is coupled to at least one second RF channel, the at least one second RF channel being used for coupling with at least one second antenna; wherein the communication device has a first operating mode and a second operating mode, in the first operating mode the first baseband die and the second baseband die operate independently, and in the second operating mode the first baseband die and the second baseband die operate collaboratively. Optionally, the at least one first RF channel and the at least one second RF channel may be provided in the communication device, or they may not be provided in the communication device.

[0007] In the above scheme, when the communication device is used to adapt to low-specification wireless systems, it can operate in a first operating mode, in which the first baseband die and the second baseband die work independently. When the communication device is used to adapt to high-specification wireless products, it can operate in a second operating mode, in which the first baseband die and the second baseband die work together to provide a larger baseband processing capability. In this way, the baseband processing capability of the communication device can be switched by switching the operating mode without modifying individual baseband dies. This reduces the cost and complexity of the baseband dies while improving the scalability and flexibility of the baseband dies in the communication device.

[0008] In one possible implementation of the first aspect, the first baseband die and the second baseband die operate independently, including: the first baseband die independently processes data of the at least one first radio frequency channel; and / or, the second baseband die independently processes data of the at least one second radio frequency channel; the first baseband die and the second baseband die operate collaboratively, including: the first baseband die and the second baseband die process data of the at least one first radio frequency channel in parallel; and / or, the first baseband die and the second baseband die process data of the at least one second radio frequency channel in parallel. In the above possible implementations, by selecting whether the first baseband die and the second baseband die operate independently or collaboratively, the baseband processing capability in the communication device can be switched without modifying a single baseband die, thereby improving the scalability and flexibility of the baseband die in the communication device while reducing the cost and complexity of the baseband die.

[0009] In one possible implementation of the first aspect, the communication device further includes at least one packaging structure in which the first baseband die and the second baseband die are disposed. In the above possible implementations, the first baseband die and the second baseband die can be disposed in the same packaging structure or different packaging structures as needed, thereby improving the diversity and flexibility of the packaging of the first baseband die and the second baseband die in the communication device.

[0010] In one possible implementation of the first aspect, the at least one packaging structure includes a first packaging structure and a second packaging structure, with a first baseband die disposed in the first packaging structure and a second baseband die disposed in the second packaging structure. In the above possible implementations, by disposing of the first baseband die and the second baseband die in different packaging structures, the deployment flexibility of the first baseband die and the second baseband die in the communication device can be improved.

[0011] In one possible implementation of the first aspect, the communication device further includes a printed circuit board, on which the first package structure and the second package structure are disposed. In the above possible implementation, the first baseband die and the second baseband die can be coupled via the printed circuit board, thereby enabling the communication device to be applied in centralized networking scenarios, thus improving communication performance in centralized networking scenarios.

[0012] In one possible implementation of the first aspect, the communication device further includes a first printed circuit board for setting a first package structure and a second printed circuit board for setting a second package structure, the first package structure and the second package structure being connected by a connecting wire. In the above possible implementations, by separately packaging the first baseband die and the second baseband die and setting them on different printed circuit boards, the communication device can achieve a wider coverage and greater flexibility.

[0013] In one possible implementation of the first aspect, the at least one first radio frequency channel is used to couple with the at least one first antenna via at least one first radio frequency remote unit; the at least one second radio frequency channel is used to couple with the at least one second antenna via at least one second radio frequency remote unit. The above possible implementations provide a communication device for a distributed networking scenario, thereby improving communication performance in a distributed networking scenario.

[0014] In one possible implementation of the first aspect, the at least one first radio frequency channel is further configured to be coupled to at least two first radio frequency remote units via at least one first power divider / combiner; the at least one second radio frequency channel is further configured to be coupled to at least two second radio frequency remote units via at least one second power divider / combiner. In the above possible implementations, by providing a power divider / combiner between the radio frequency channel and the antenna, the flexibility of baseband die processing in the communication device can be improved.

[0015] In one possible implementation of the first aspect, a first baseband die is used to provide services to a first cell through the at least one first radio frequency channel; a second baseband die is used to provide services to a second cell through the at least one second radio frequency channel, wherein the first cell and the second cell are different. In the above possible implementation, the first baseband die and the second baseband die can provide services to different cells, thereby reducing interference between users when there are a large number of users.

[0016] In one possible implementation of the first aspect, the first baseband die and the second baseband die are further used to: provide services to the same cell through the at least one first radio frequency channel and the at least one second radio frequency channel, respectively. In the above possible implementations, the first baseband die and the second baseband die can work together to provide services to the same cell, thereby providing a unified high-specification cell and improving user throughput.

[0017] In one possible implementation of the first aspect, the first baseband die is further used to transmit data to the second baseband die based on a preset granularity; and / or, the second baseband die is further used to transmit data to the first baseband die based on the preset granularity; wherein the preset granularity includes at least one of the following: multiple-input multiple-output (MIMO) channels, subcarriers, users, data streams, or code blocks; each MIMO channel-level data includes one or more subcarrier-level data, each subcarrier-level data includes one or more user-level data, each user-level data includes one or more data streams, and each data stream includes multiple code blocks. In the above possible implementations, the first and second baseband dies can flexibly interact with each other according to actual needs, i.e., deploying interaction points between the baseband dies, enabling data interaction and parallel processing between the first and second baseband dies, thereby splicing together multiple homogeneous baseband dies with small bandwidth and small stream counts into a high-specification baseband chip with large bandwidth and high stream counts.

[0018] In one possible implementation of the first aspect, the first baseband die is further configured to: transmit at least one MIMO channel-level data to the second baseband die at the granularity of the MIMO channel or the subcarrier, and / or transmit equalized data to the second baseband die at the granularity of the user or the data stream, and / or transmit modulated data to the second baseband die at the granularity of the code block, and / or transmit encoded data to the second baseband die at the granularity of the code block, and / or transmit modulated data to the second baseband die at the granularity of the user or the data stream, and / or transmit precoded data to the second baseband die at the granularity of the MIMO channel or the subcarrier. And / or, the second baseband die is further configured to: transmit at least one MIMO channel-level data to the first baseband die at the granularity of the MIMO channel or the subcarrier, and / or, transmit equalized data to the first baseband die at the granularity of the user or the data stream, and / or, transmit modulated data to the first baseband die at the granularity of the code block, and / or, transmit encoded data to the first baseband die at the granularity of the code block, and / or, transmit modulated data to the first baseband die at the granularity of the user or the data stream, and / or, transmit precoded data to the first baseband die at the granularity of the MIMO channel or the subcarrier. In the above possible implementations, the first baseband die and the second baseband die can be flexibly exchanged for data according to actual needs. That is, the interaction points between the baseband dies can be deployed to enable data interaction and parallel processing between the first baseband die and the second baseband die, thereby splicing multiple homogeneous baseband dies with small bandwidth and small stream count into a high-specification baseband chip with large bandwidth and high stream count.

[0019] In a second aspect, a communication method is provided, applied in a communication device having a first operating mode and a second operating mode. The communication device includes a coupled first baseband die and a second baseband die, the first baseband die being coupled to at least one first radio frequency channel, and the second baseband die being coupled to at least one second radio frequency channel. The at least one first radio frequency channel and the at least one second radio frequency channel are used for coupling with an antenna. The method includes: in the first operating mode, the first baseband die and the second baseband die operate independently; in the second operating mode, the first baseband die and the second baseband die operate collaboratively.

[0020] In one possible implementation of the second aspect, the first baseband die and the second baseband die operate independently, including: the first baseband die independently processes data of the at least one first radio frequency channel; and / or, the second baseband die independently processes data of the at least one second radio frequency channel; the first baseband die and the second baseband die operate collaboratively, including: the first baseband die and the second baseband die process data of the at least one first radio frequency channel in parallel; and / or, the first baseband die and the second baseband die process data of the at least one second radio frequency channel in parallel.

[0021] In one possible implementation of the second aspect, in the first operating mode, the method further includes: a first baseband die providing services to a first cell through the at least one first radio frequency channel; and a second baseband die providing services to a second cell through the at least one second radio frequency channel, wherein the first cell and the second cell are different.

[0022] In one possible implementation of the second aspect, in the second operating mode, the method further includes: a first baseband die and a second baseband die respectively providing services to the same cell through the at least one first radio frequency channel and the at least one second radio frequency channel.

[0023] In one possible implementation of the second aspect, the method further includes: a first baseband die transmitting data to a second baseband die based on a preset granularity; and / or, the second baseband die transmitting data to the first baseband die based on the preset granularity; wherein the preset granularity includes at least one of the following: MIMO channel, subcarrier, user, data stream, or code block; each MIMO channel-level data includes one or more subcarrier-level data, each subcarrier-level data includes one or more user-level data, each user-level data includes one or more data streams, and each data stream includes multiple code blocks.

[0024] In one possible implementation of the second aspect, the first baseband die transmits data to the second baseband die based on a preset granularity, including: transmitting at least one MIMO channel-level data to the second baseband die based on the granularity of the MIMO channel or the subcarrier, and / or transmitting equalized data to the second baseband die based on the granularity of the user or the data stream, and / or transmitting modulated data to the second baseband die based on the granularity of the code block, and / or transmitting encoded data to the second baseband die based on the granularity of the code block, and / or transmitting modulated data to the second baseband die based on the granularity of the user or the data stream, and / or transmitting precoded data to the second baseband die based on the granularity of the MIMO channel or the subcarrier. The second baseband die transmits data to the first baseband die based on the preset granularity, including: transmitting at least one MIMO channel-level data to the first baseband die based on the granularity of the MIMO channel or the subcarrier, and / or transmitting equalized data to the first baseband die based on the granularity of the user or the data stream, and / or transmitting modulated data to the first baseband die based on the granularity of the code block, and / or transmitting encoded data to the first baseband die based on the granularity of the code block, and / or transmitting modulated data to the first baseband die based on the granularity of the user or the data stream, and / or transmitting precoded data to the first baseband die based on the granularity of the MIMO channel or the subcarrier.

[0025] Thirdly, a communication device is provided, comprising: a communication apparatus provided in the first aspect or any possible implementation thereof, at least one first antenna coupled to at least one first radio frequency channel in the communication apparatus, and at least one second antenna coupled to at least one second radio frequency channel in the communication apparatus.

[0026] Fourthly, a computer-readable storage medium is provided, wherein instructions are stored therein, which, when executed on a device, cause the device to perform the communication method provided by the second aspect or any possible implementation thereof.

[0027] Fifthly, a computer program product is provided, comprising a computer program that, when executed by a device, causes the device to perform the communication method provided by the second aspect or any possible implementation thereof.

[0028] In a sixth aspect, a chip is provided, including a processor for retrieving and executing instructions stored in a memory, such that a communication device on which the chip is mounted performs the method provided by performing the second aspect or any possible implementation thereof.

[0029] In a seventh aspect, a chip is provided, comprising: an input interface, an output interface, a processor, and a memory, wherein the input interface, the output interface, the processor, and the memory are connected via an internal connection path, and the processor is used to execute code in the memory, wherein when the code is executed, the processor is used to perform the method provided by the second aspect or any possible implementation thereof.

[0030] It is understood that the beneficial effects achieved by any of the communication methods, communication devices, computer-readable storage media and computer program products provided above can be referred to in relation to the beneficial effects of the communication devices provided above, and will not be repeated here. Attached Figure Description

[0031] Figure 1 is a schematic diagram of a wireless communication system provided in an embodiment of this application;

[0032] Figure 2 is a schematic diagram of the structure of a wireless communication device provided in an embodiment of this application;

[0033] Figure 3 is a schematic diagram of the structure of a communication device provided in an embodiment of this application;

[0034] Figure 4 is a schematic diagram of another communication device provided in an embodiment of this application;

[0035] Figure 5 is a schematic diagram of another communication device provided in an embodiment of this application;

[0036] Figure 6 is a schematic diagram of another communication device provided in an embodiment of this application;

[0037] Figure 7 is a schematic diagram of another communication device provided in an embodiment of this application;

[0038] Figure 8 is a schematic diagram of the processing nodes included in a baseband die according to an embodiment of this application;

[0039] Figure 9 is a flowchart of the processing of a baseband die in the receiving direction according to an embodiment of this application;

[0040] Figure 10 is a schematic diagram of inter-baseband die data interaction provided in an embodiment of this application;

[0041] Figure 11 is a flowchart of another baseband die processing in the receiving direction provided in an embodiment of this application;

[0042] Figure 12 is a flowchart of another type of baseband die processing in the receiving direction provided by an embodiment of this application;

[0043] Figure 13 is a flowchart of the processing of a baseband die in the transmission direction according to an embodiment of this application;

[0044] Figure 14 is a flowchart of another type of baseband die processing in the transmission direction provided by an embodiment of this application;

[0045] Figure 15 is a schematic diagram of the working mode of a communication device provided in an embodiment of this application;

[0046] Figure 16 is a schematic diagram of the structure of a baseband die provided in an embodiment of this application;

[0047] Figure 17 is a schematic diagram of another baseband die provided in an embodiment of this application. Detailed Implementation

[0048] The technical solutions in the embodiments of this application will be described below with reference to the accompanying drawings. In this application, "at least one" means one or more, and "more than one" means two or more. "And / or" describes the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist simultaneously, or B exists alone, where A and B can be singular or plural. The character " / " generally indicates that the related objects before and after are in an "or" relationship. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one of a, b, or c can mean: a, b, c, a and b, a and c, b and c, a, b, and c; where a, b, and c can be single or multiple.

[0049] The embodiments of this application use terms such as "first" and "second" to distinguish objects with similar names, functions, or effects. Those skilled in the art will understand that the terms "first" and "second" do not limit the quantity or order of execution. The term "coupling" is used to indicate an electrical connection, including direct connection via wires or terminals or indirect connection via other devices. Therefore, "coupling" should be considered as a broad type of electronic communication connection.

[0050] In this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or illustration. Any embodiment or design described as "exemplary" or "for example" in this application should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0051] Before introducing the embodiments of this application, the relevant background of this application will be explained first.

[0052] The continuous improvement of wireless system specifications has led to a significant increase in the resource area of ​​a single chip, making it difficult to control chip yield and production costs. At the same time, as Moore's Law approaches its physical limits, the pace of chip process iteration has slowed down, hindering the approach of improving chip capabilities and reducing production costs through process evolution.

[0053] On the other hand, as the number of antennas and bandwidth supported by wireless systems increase, the computational complexity of baseband chips also needs to increase significantly; these baseband chips can also be called wireless baseband chips. In practical applications, baseband chips are typically designed as monolithic chips to implement wireless transmission and reception with specific space-time streams and bandwidth specifications. To upgrade to higher-specification wireless systems, in the traditional chip manufacturing model, designers and manufacturers need to redesign higher-specification baseband chips and start production again. Baseband chips designed and manufactured in this way support a fixed range of wireless products and lack scalability. Furthermore, when high-specification baseband chips are backward compatible with low-specification wireless products, their capabilities cannot be fully utilized, leading to reduced resource utilization.

[0054] The widespread use of chiplet technology has opened up another iterative path for the evolution of semiconductor technology. Chiplet technology is an advanced packaging technology that combines different dies into a single package, using die-to-die interconnect technology to achieve inter-die interconnection and assemble them into a complete chiplet system. This chiplet system can also be called a system-on-a-chip (SoC). The die itself can also be called a chiplet, die, or chiplet.

[0055] The advantages of chip-level technology mainly include the following three points. First, it enables agile chip design through chip-level intellectual property (IP) reuse or prefabrication and combination. Since chips can be designed and assembled independently, manufacturers can choose different types, specifications, or manufacturers of chips to combine according to specific needs, improving the flexibility and customizability of chip design. This not only meets the "fragmented" requirements of application scenarios but also significantly shortens the chip production cycle. Second, smaller chip size leads to higher yield and reduced manufacturing costs. By breaking down large chips into several smaller chips, chip-level technology greatly reduces the probability of failure occurring on a single chip. The resulting integrated chip-level system can achieve breakthroughs in manufacturing area and yield, significantly reducing manufacturing costs. Third, different chips can use different process technologies, overcoming the limitations of single-process technologies. Under the chip-level system architecture, chips responsible for different functions no longer need to iterate to a unified process technology. Instead, different chips with optimal node implementations can be mixed and integrated, not only reducing the cost of a single engineering process but also significantly shortening the product production cycle.

[0056] Common chip packaging methods include 2D multi-chip module (MCM) packaging, 2.5D chip-on-wafer-on-substrate (CoWos) packaging, embedded multi-die interconnect bridge (EMIB) packaging, and 3D hybrid bonding packaging. MCM packaging directly utilizes substrate traces for die-to-die interconnection, resulting in low packaging cost, but limited trace length, lower interface speed, and higher latency. CoWos is a packaging process based on interposer interconnection, offering higher transmission speeds compared to MCM packaging. EMIB is a bridging package based on a silicon bridge, combining cost and efficiency, but with higher technical complexity.

[0057] Based on this, embodiments of this application provide a communication device including a coupled first baseband die and a second baseband die. The first baseband die is coupled to at least one first radio frequency channel, and the second baseband die is coupled to at least one second radio frequency channel. The communication device has a first operating mode and a second operating mode. In the first operating mode, the first and second baseband dies operate independently; in the second operating mode, the first and second baseband dies work collaboratively. Thus, when the communication device is used to adapt to low-specification wireless systems, it can operate in the first operating mode; when the communication device is used to adapt to high-specification wireless products, it can operate in the second operating mode, where the first and second baseband dies work collaboratively to provide greater baseband processing capabilities. In this way, switching the operating mode allows for switching of baseband processing capabilities within the communication device without requiring modifications to individual baseband dies. This reduces the cost and complexity of the baseband dies while improving the scalability of the baseband dies and the flexibility of the communication device.

[0058] Optionally, the first baseband die and the second baseband die mentioned above can be application-specific integrated circuits (ASICs) or complex programmable logic devices (CPLDs), etc.

[0059] The technical solutions provided in this application can be applied to various wireless communication systems. For example, these wireless communication systems may include, but are not limited to: Wi-Fi communication systems, Long Time Evolution (LTE) systems, Frequency Division Duplex (FDD) systems, Time Division Duplex (TDD) systems, Code Division Multiple Access (CDMA) systems, Universal Mobile Telecommunication System (UMTS), Worldwide Interoperability for Microwave Access (WiMAX) communication systems, Public Land Mobile Network (PLMN) systems, hybrid networking communication systems, or future communication systems. The technical solutions in this application can include various application scenarios, such as enhanced mobile broadband (eMBB), ultra-reliable and low-latency communication (uRLLC), and massive machine-type communication (mMTC).

[0060] The wireless communication systems and application scenarios described in this application are intended to more clearly illustrate the technical solutions of this application and do not constitute a limitation on the technical solutions provided in this application. As those skilled in the art will know, with the evolution of communication systems and the emergence of new application scenarios, the technical solutions provided in this application are also applicable to similar technical problems.

[0061] It should be understood that in this wireless communication system, the devices can be divided into devices that provide wireless network services and devices that use wireless network services. The devices providing wireless network services can also be called network equipment or network units; for example, such network equipment includes wireless access devices. The devices using wireless network services can be called terminal devices or simply terminals. Terminal devices can establish connections with network equipment and provide wireless communication services to users based on the services offered by the network equipment. The following example, using wireless access devices and terminal devices, illustrates the structure of this wireless communication system.

[0062] Figure 1 is a schematic diagram of a wireless communication system provided in an embodiment of this application. The wireless communication system may include one or more wireless access devices 10 and one or more terminal devices 20. The terminal devices 20 can communicate wirelessly with the wireless access devices 10, and different wireless access devices 10 and different terminal devices 20 can also communicate with each other. In this wireless communication system, the wireless access device 10 can provide communication coverage for a specific geographical area through integrated or external antenna devices. Terminal devices 20 located within the communication coverage area of ​​the wireless access device 10 can access the wireless access device 10 and communicate with it. Figure 1(a) illustrates an example of a wireless communication system including one wireless access device 10 and three terminal devices 20.

[0063] Optionally, the wireless access device 10 may include a base station, which may also be referred to as a wireless access point or a transmission reception point (TRP). In one possible example, the base station may be a generation Node B (gNB) in a new radio (NR) system, an evolutionary Node B (eNB) in a long term evolution (LTE) system, etc. Depending on the physical form or transmission power of the base station, it may be classified as a macro base station or a micro base station; a micro base station may also be referred to as a small base station or a small cell.

[0064] Optionally, the terminal device 20 may include, but is not limited to: mobile phones, tablets, laptops, desktop computers, handheld computers, ultra-mobile personal computers (umPCs), mobile internet devices (MIDs), netbooks, cameras, camcorders, wearable devices (such as smartwatches and smart bracelets), in-vehicle devices (such as cars, bicycles, electric vehicles, airplanes, ships, trains, high-speed trains, etc.), virtual reality (VR) devices, augmented reality (AR) devices, wireless terminals in industrial control, smart home devices (such as refrigerators, televisions, air conditioners, electricity meters, etc.), smart robots, workshop equipment, wireless terminals in self-driving, wireless terminals in remote medical surgery, wireless terminals in smart grids, wireless terminals in transportation safety, wireless terminals in smart cities, or wireless terminals in smart homes, and flying devices (such as smart robots, hot air balloons, drones, airplanes), etc.

[0065] In one possible embodiment, as shown in FIG1(b), the wireless communication system is a Wi-Fi communication system, the wireless access device 10 is an access point (AP), and the terminal device 20 is a station (STA). Exemplarily, the Wi-Fi communication system includes an AP and three STAs connected to the AP, which can communicate with the AP.

[0066] In this embodiment, both the wireless access device 10 and the terminal device 20 can be referred to as wireless communication devices. The following description uses a mobile phone as an example to illustrate the structure of the wireless communication device.

[0067] Figure 2 is a schematic diagram of the structure of a wireless communication device provided in an embodiment of this application. The wireless communication device may include components such as a radio frequency (RF) circuit 110, a memory 120, an input unit 130, a display unit 140, a sensor 150, an audio circuit 160, a processor 170, and a power supply 180.

[0068] The RF circuit 110 can be used to transmit and receive information, or to receive or send signals during a call. Specifically, it receives downlink information from the base station and processes it in the processor 170; additionally, it transmits uplink data to the base station. Typically, the RF circuit 110 includes, but is not limited to, an antenna, at least one amplifier, a transceiver, a coupler, a low-noise amplifier (LNA), a duplexer, etc. Furthermore, the RF circuit 110 can also communicate wirelessly with networks and other devices.

[0069] The memory 120 can be used to store data, software programs, and modules; it includes a program storage area and a data storage area. The program storage area can store the operating system and application programs required for at least one function, such as sound playback and image playback functions. The data storage area can store data created based on the use of the wireless communication device, such as audio data, image data, and a phone book. Furthermore, the wireless communication device may include high-speed random access memory and non-volatile memory, such as at least one disk storage device, flash memory device, or other volatile solid-state storage device. Optionally, the memory may include multiple memories.

[0070] Input unit 130 can be used to receive input digital or character information, and to generate key signal inputs related to user settings and function control of the wireless communication device. Input unit 130 may include touch screen 131 and other input devices 132. Touch screen 131 can collect touch operations on or near the user and drive corresponding connection devices according to a pre-set program. For example, touch operations may include operations performed by the user using a finger, stylus, or any suitable object or accessory on or near the touch screen. Optionally, other input devices 132 may include, but are not limited to, one or more of physical keyboards, function keys, mice, joysticks, etc., such as volume control buttons, power switch buttons, etc.

[0071] Display unit 140 can be used to display information input by the user or information provided to the user, as well as various menus of the wireless communication device. In one example, display unit 140 may include display screen 141, which may be configured as a liquid crystal display (LCD), organic light-emitting diode (OLED), or similar form. Further, touchscreen 131 may cover display screen 141. When touchscreen 131 detects a touch operation on or near it, it transmits the information to processor 170 to determine the type of touch event. Subsequently, processor 170 provides corresponding visual output on display screen 141 based on the type of touch event. Although in the figures, touchscreen 131 and display screen 141 are shown as two separate components to implement the input and output functions of the wireless communication device, in some embodiments, touchscreen 131 and display screen 141 can be integrated to implement the input and output functions of the wireless communication device.

[0072] Sensor 150 may include one or more sensors for providing status assessments of various aspects of the wireless communication device. Sensor 150 may include a light sensor, which can be used in imaging applications, i.e., as a component of a camera or video camera. Furthermore, sensor 150 may also include an accelerometer, gyroscope, magnetometer, pressure sensor, or temperature sensor. Sensor 150 can detect acceleration / deceleration, orientation, on / off state, relative positioning of components, or temperature changes of the wireless communication device, etc.

[0073] Audio circuitry 160, a speaker, and a microphone provide an audio interface between the user and the wireless communication device. Audio circuitry 160 converts received audio data into electrical signals, transmits them to the speaker, and the speaker converts them into sound signals for output. On the other hand, the microphone converts collected sound signals into electrical signals, which are received by audio circuitry 160, converted into audio data, and then output to RF circuitry 110 for transmission to, for example, another mobile phone, or to memory 120 for further processing.

[0074] The processor 170 is the control center of the wireless communication device. It connects various parts of the device via various interfaces and lines, and performs overall control by running or executing software programs and / or modules stored in the memory 120, and by calling data stored in the memory 120, thereby executing various functions and processing data. Optionally, the processor 170 includes one or more processing units, which may include, but are not limited to: a central processing unit (CPU), a baseband processor, a network processing unit (NPU), a graphics processing unit (GPU), an image signal processor (ISP), a tensor processing unit (TPU), a data processing unit (DPU), a digital signal processor (DSP), a microcontroller, or a microprocessor. Furthermore, processor 170 may also include other hardware circuitry or accelerators, such as application-specific integrated circuits (ASICs), complex programmable logic devices (CPLDs), field-programmable gate arrays (FPGAs), or other programmable logic devices, transistor logic devices, hardware components, or any combination thereof. Optionally, processor 170 may also be a combination that implements computational functions, such as a combination of one or more microprocessors, a digital signal processor, and a microprocessor.

[0075] The wireless communication device may also include a power supply 180 (e.g., a battery) to power various components. The power supply 180 can be logically connected to the processor 170 via a power management system, thereby enabling functions such as charging, discharging, and power consumption management through the power management system. Optionally, the power management system can simultaneously support fast charging and non-fast charging technologies. In practical applications, the power management system can charge the battery in the power supply 180 using either fast charging or non-fast charging technologies.

[0076] Optionally, the wireless communication device may also include a Wi-Fi module, a Bluetooth module, etc., which will not be described in detail in this embodiment. Those skilled in the art will understand that the structure of the wireless communication device shown in FIG2 does not constitute a limitation on the wireless communication device, and may include more or fewer components than shown, or combine certain components, or have different component arrangements.

[0077] Furthermore, the wireless communication device also includes a communication unit, which may integrate one or more components of the wireless communication device, or integrate bare dies corresponding to one or more components. The structure of the communication unit is described below.

[0078] Figure 3 is a schematic diagram of a communication device provided in an embodiment of this application. This communication device can be applied to network devices or terminal devices. The communication device includes: a coupled first baseband die D1 and a coupled second baseband die D2. The first baseband die D1 is coupled to at least one first radio frequency channel CH1, which is used to couple to at least one first antenna ANT1. The second baseband die D2 is coupled to at least one second radio frequency channel CH2, which is used to couple to at least one second antenna ANT2. Figure 3 illustrates an example where the at least one first radio frequency channel CH1 includes two first radio frequency channels CH1, one first radio frequency channel CH1 is coupled to one first antenna ANT1, and the at least one second radio frequency channel CH2 includes two second radio frequency channels CH2, one second radio frequency channel CH2 is coupled to one second antenna ANT2.

[0079] The at least one first radio frequency channel CH1 and the at least one second radio frequency channel CH2 may or may not be provided in the communication device. For example, when the at least one first radio frequency channel CH1 and the at least one second radio frequency channel CH2 are not provided in the communication device, the communication device may be a baseband chip. Figure 3 illustrates this using the example of the at least one first radio frequency channel CH1 and the at least one second radio frequency channel CH2 being provided in the communication device.

[0080] Furthermore, the at least one first RF channel CH1 and the at least one second RF channel CH2 can be integrated into one or more RF chips. The same RF chip may include only the first RF channel CH1, only the second RF channel CH2, or both. For example, the at least one first RF channel CH1 and the at least one second RF channel CH2 are integrated into the same RF chip; or, the at least one first RF channel CH1 is integrated into a first RF chip, and the at least one second RF channel CH2 is integrated into a second RF chip.

[0081] Furthermore, in one possible embodiment, the communication device further includes at least one packaging structure, in which the first baseband die D1 and the second baseband die D2 are disposed. The at least one packaging structure may include one or more packaging structures; the first baseband die D1 and the second baseband die D2 may be disposed in the same packaging structure, or the first baseband die D1 and the second baseband die D2 may be disposed in different packaging structures.

[0082] Optionally, the communication device also includes a printed circuit board (PCB). When the first baseband die D1 and the second baseband die D2 are disposed in the same package structure, the package structure can be disposed on one PCB; when the first baseband die D1 and the second baseband die D2 are disposed in two different package structures, the two package structures can be disposed on the same PCB or on different PCBs.

[0083] As an example, as shown in Figure 4(a), the communication device further includes a package structure P0 and a printed circuit board PCB 0. A first baseband die D1 and a second baseband die D2 are disposed within the package structure P0, which is mounted on the printed circuit board PCB 0.

[0084] As another example, as shown in Figure 4(b), the communication device further includes a first package structure P1, a second package structure P2, and a printed circuit board PCB 0. The first baseband die D1 is disposed in the first package structure P1, the second baseband die D2 is disposed in the second package structure P2, and the first package structure P1 and the second package structure P2 are disposed on the printed circuit board PCB 0. Optionally, the first baseband die D1 and the second baseband die D2 can be coupled (or interconnected) via an interface, for example, this interface can be a serializer / deserializer (SerDers), which can also be called a serial port; or, the first baseband die D1 and the second baseband die D2 can be coupled via the printed circuit board PCB 0.

[0085] As another example, as shown in Figure 4(c), the communication device further includes a first package structure P1, a second package structure P2, a first printed circuit board PCB 1, and a second printed circuit board PCB 2. A first baseband die D1 is disposed in the first package structure P1, which is mounted on the first printed circuit board PCB 1; a second baseband die D2 is disposed in the second package structure P2, which is mounted on the second printed circuit board PCB 2; the first package structure P1 and the second package structure P2 are connected by a connecting line. For example, this connecting line can be a cable or an optical fiber.

[0086] Optionally, the communication device may also include a greater number of baseband dies, and may also include other types of dies, such as processing dies and storage dies. For example, the processing dies may include a central processing unit (CPU), a neural network processing unit (NPU), a digital signal processor (DSP), or a graphics processing unit (GPU); the storage dies may include random access memory (RAM), read-only memory (ROM), or a cache.

[0087] For example, as shown in Figure 5(a), the communication device includes: a coupled first baseband die D1, a second baseband die D2, and a third baseband die D3. The first baseband die D1, the second baseband die D2, and the third baseband die D3 can be independently packaged, and different baseband dies can be coupled to each other via SerDers. Alternatively, as shown in Figure 5(b), the communication device includes the coupled first baseband die D1, the second baseband die D2, and the third baseband die D3; the communication device also includes a CPU die, which can be coupled to one of the baseband dies, for example, the CPU die is coupled to the second baseband die D2; the first baseband die D1, the second baseband die D2, the third baseband die D3, and the CPU die can be disposed in the same package structure.

[0088] Furthermore, in a distributed networking scenario, the at least one first antenna ANT1 and the at least one second antenna ANT2 can be extended further by multiple radio remote units (RRUs) to improve the coverage of the communication device.

[0089] In one possible embodiment, the at least one first radio frequency channel CH1 is used to couple with the at least one first antenna ANT1 via at least one first radio frequency remote unit RRU1; the at least one second radio frequency channel CH2 is used to couple with the at least one second antenna ANT2 via at least one second radio frequency remote unit RRU2. For example, referring to FIG3, as shown in FIG6, each first radio frequency channel CH1 is provided with a first radio frequency remote unit RRU1 between it and the corresponding first antenna ANT1, and each second radio frequency channel CH2 is provided with a second radio frequency remote unit RRU2 between it and the corresponding second antenna ANT2.

[0090] The baseband portion of the aforementioned communication device is composed of two baseband dies spliced ​​together. Each RF channel can be extended to different RRUs via feed lines to cover different areas. With each baseband die coupled to two RF channels, the communication device can jointly perform 4-antenna, 4-stream multiple-input multiple-output (MIMO) processing. Optionally, if the air interface conditions corresponding to different RF channels are inconsistent, the signals received by the two baseband dies may differ. In this case, the two baseband dies can perform differentiated processing on the received data based on the air interface conditions of different RF channels to improve signal processing performance.

[0091] Optionally, the at least one first RF channel CH1 is further configured to be coupled to at least two first RF remote units RRU1 via at least one first power divider / combiner 11; the at least one second RF channel CH2 is further configured to be coupled to at least two second RF remote units RRU2 via at least one second power divider / combiner 22. For example, referring to FIG6, as shown in FIG7, each of the at least one first RF channel CH1 can be coupled to two first RF remote units RRU1 via a first power divider / combiner 11, and each of the at least one second RF channel CH2 can be coupled to two second RF remote units RRU2 via a second power divider / combiner 22.

[0092] The structure of the communication device provided in the embodiments of this application has been described above. The working process of the communication device will be described below.

[0093] In this embodiment, the communication device may have a first operating mode and a second operating mode. In the first operating mode, the first baseband die D1 and the second baseband die D2 operate independently; in the second operating mode, the first baseband die D1 and the second baseband die D2 operate collaboratively.

[0094] Optionally, the first baseband die D1 and the second baseband die D2 operate independently, including: the first baseband die D1 independently processes the data of the at least one first radio frequency channel CH1; and / or, the second baseband die D2 independently processes the data of the at least one second radio frequency channel CH2.

[0095] Optionally, the first baseband die D1 and the second baseband die D2 work together, including: the first baseband die D1 and the second baseband die D2 processing the data of the at least one first radio frequency channel in parallel; and / or, the first baseband die D1 and the second baseband die D2 processing the data of the at least one second radio frequency channel in parallel.

[0096] In one possible embodiment, the first baseband die D1 independently processes the data of the at least one first radio frequency channel CH1. Specifically, this may include: in the receiving direction, the received data received by the at least one first radio frequency channel CH1 through the at least one first antenna ANT1 is processed only by the first baseband die D1, and the second baseband die D2 does not participate in the processing of the received data; in the transmitting direction, the transmitted data of the first baseband die D1 is transmitted only by the at least one first radio frequency channel CH1 through the at least one first antenna ANT1, and the at least one first radio frequency channel CH1 is not used to transmit the transmitted data of the second baseband die D2. Similarly, the second baseband die D2 independently processes the data of the at least one second radio frequency channel CH2. Specifically, this may include: in the receiving direction, the received data received by the at least one second radio frequency channel CH2 through the at least one second antenna ANT2 is processed only by the second baseband die D2, and the first baseband die D1 does not participate in the processing of the received data; in the transmitting direction, the transmitting data of the second baseband die D2 is transmitted only by the at least one second radio frequency channel CH2 through the at least one second antenna ANT2, and the at least one second radio frequency channel CH2 is not used to transmit the transmitting data of the first baseband die D1.

[0097] For example, as shown in Figure 8, the first baseband die D1 or the second baseband die D2 can be used to perform multiple processing steps on the data in the receiving or transmitting direction, respectively. In the receiving direction, for the data output from the RF channel, the following processing steps can be performed: analog front end (AFE), digital front end (DFE), Fast Fourier Transform (FFT), channel estimation, equalization, demodulation, and decoding. The decoded data enters the Media Access Control (MAC) layer (RX) in the receiving direction. In the transmitting direction, for the data output from the TX MAC layer (TX) in the transmitting direction, the following processing steps can be performed: coding, modulation, precoding, Inverse Fast Fourier Transform (IFFT), DFE, and AFE. The data processed by AFE is transmitted through the RF channel. Optionally, the channel estimation in the receiving direction can also be multiplexed in the transmitting direction; for example, the result of the channel estimation in the receiving direction can be output to the precoding processing in the transmitting direction. The aforementioned processing steps can also be referred to as multiple processing nodes. That is, the first baseband die D1 or the second baseband die D2 can each include multiple processing nodes in the transmission and reception directions. These processing nodes can also be simply referred to as nodes.

[0098] Figure 8 above illustrates this using the example of a single-input single-output (SISO) configuration for either the first baseband die D1 or the second baseband die D2. In practical applications, when the first baseband die D1 or the second baseband die D2 supports multiple-input multiple-output (MIMO), it can further include multiple MIMO channels coupled to the channel estimation node and the precoding node, respectively. Each MIMO channel coupled to the channel estimation node can include AFE, DFE, and FFT, etc., and each MIMO channel coupled to the precoding node can include AFE, DFE, and IFFT, etc.

[0099] In one possible implementation, when the first baseband die D1 and the second baseband die D2 operate independently, the first baseband die D1 can be used to provide services to a first cell through at least one first radio frequency channel CH1, and the second baseband die D2 can be used to provide services to a second cell through at least one second radio frequency channel CH2. That is, the first baseband die D1 can be used to receive or transmit data from the first cell through at least one first radio frequency channel CH1, and the second baseband die D2 can be used to receive or transmit data from the second cell through at least one second radio frequency channel CH2.

[0100] The first and second cells mentioned above are different. For example, the BSS ID of the basic service set (BSS) of the first cell is different from the BSS ID of the second cell. Optionally, the first and second cells can be inter-frequency cells.

[0101] For ease of understanding, the following example illustrates the following: the first baseband die D1 is coupled to two first antennas ANT1 via two first radio frequency channels CH1, and the second baseband die D2 is coupled to two second antennas ANT2 via two second radio frequency channels CH2. Both the first baseband die D1 and the second baseband die D2 include two MIMO channels. The first baseband die D1 is used to provide services for the first cell, and the second baseband die D2 is used to provide services for the second cell. When this communication device is applied to a receiver, the processing flow of the first baseband die D1 and the second baseband die D2 in the receiving direction will be illustrated.

[0102] For example, referring to Figure 8, when this communication device is applied to a receiver, the processing flow of the first baseband die D1 and the second baseband die D2 in the receiving direction is shown in Figure 9. Specifically, when the first baseband die D1 receives data from two first antennas ANT1 through two first radio frequency channels CH1, with each first antenna ANT1 having a data bandwidth of 160MHz, it performs AFE, DFE, and FFT processing on the two 160MHz data through the two MIMO channels of the first baseband die D1, and then sequentially performs channel estimation, equalization, demodulation, and decoding on the two 160MHz data output from the two MIMO channels. Similarly, when the second baseband die D2 receives data from two second antennas ANT2 through two second radio frequency channels CH2, with each second antenna ANT2 having a data bandwidth of 160MHz, it performs AFE, DFE, and FFT processing on the two 160MHz data through the two MIMO channels of the second baseband die D2, and then sequentially performs channel estimation, equalization, demodulation, and decoding on the two 160MHz data output from the two MIMO channels. Figure 9 shows the first baseband die D1 and the second baseband die D2. Taking the processing bandwidth of AFE, DFE and FFT as 160MHz and the processing bandwidth of channel estimation, equalization and demodulation as 160MHz for two antennas as an example, this will be explained.

[0103] It is understandable that the first baseband die D1 and the second baseband die D2 can establish two different cells, and the frequency bands of these two cells can be different. For example, the first baseband die D1 can establish a first cell, the frequency band of which can be the 5GHz band, and the specifications of the first cell can be 2 receive, 2 data streams, and 160MHz bandwidth, represented as 2R2SS160MHz; the second baseband die D2 can establish a second cell, the frequency band of which can be the 6GHz band, and the specifications of the second cell can also be 2R2SS160MHz.

[0104] In one possible embodiment, the first baseband die D1 and the second baseband die D2 process the data of the at least one first radio frequency channel in parallel. Specifically, this may include: during the processing of the data of the at least one first radio frequency channel CH1, the first baseband die D1 may send partial data to the second baseband die D2 at at least one of a plurality of processing nodes, and the first baseband die D1 and the second baseband die D2 process the data of the at least one first radio frequency channel CH1 in parallel at that at least one processing node. Similarly, the first baseband die D1 and the second baseband die D2 process the data of the at least one second radio frequency channel in parallel. Specifically, during the processing of the data of the at least one second radio frequency channel CH2, the second baseband die D2 may send at least partial data to the first baseband die D1 at at least one of a plurality of processing nodes, and the first baseband die D1 and the second baseband die D2 process the data of the at least one second radio frequency channel CH2 in parallel at that at least one processing node. In other words, the first baseband die D1 and the second baseband die D2 can exchange data and process it in parallel during the data processing process.

[0105] For example, as shown in Figure 10, the first baseband die D1 and the second baseband die D2 can each include multiple processing nodes in both the receiving and transmitting directions. Assume these multiple processing nodes include processing node 1, processing node 2, processing node 3, ..., processing node X, where X is a positive integer. The first baseband die D1 and the second baseband die D2 can exchange data for parallel processing after processing node 1, or after processing node 2, or after other processing nodes besides processing node 1 and processing node 2. For example, in the receiving direction, these multiple processing nodes can include, but are not limited to: Fast Fourier Transform, channel estimation, equalization, demodulation, and decoding; in the transmitting direction, these multiple processing nodes can include, but are not limited to: encoding, modulation, precoding, and Inverse Fast Fourier Transform.

[0106] Optionally, when the first baseband die D1 and the second baseband die D2 interact with data at any processing node, the data can be split into multiple blocks and processed in parallel on multiple baseband dies based on the parallelism of that processing node. For example, for any baseband die, after completing the corresponding data processing, the upper-level processing node can, based on the parallelism characteristics of the lower-level processing nodes, split the data according to granularity such as MIMO channels, subcarriers (or bandwidth), users, data streams, or code blocks, and transmit the split data blocks to the lower-level processing nodes of the baseband die and other baseband dies respectively. After the lower-level processing nodes of the baseband die and other baseband dies complete the corresponding data processing, subsequent data processing can continue according to this scheme.

[0107] In one possible implementation, a first baseband die D1 and a second baseband die D2 are used to provide services for the same cell through the at least one first radio frequency channel CH1 and the at least one second radio frequency channel CH2.

[0108] Optionally, when the first baseband die D1 and the second baseband die D2 serve the same cell, the first baseband die D1 may transmit data to the second baseband die D2 based on a preset granularity, and / or the second baseband die D2 may transmit data to the first baseband die D1 based on the preset granularity. The preset granularity includes at least one of the following: MIMO channel, subcarrier, user, data stream, or code block. Each MIMO channel-level data includes one or more subcarrier-level data, each subcarrier-level data includes one or more user-level data, each user-level data includes one or more data streams, and each data stream includes multiple code blocks.

[0109] For ease of understanding, the following example illustrates the following: the first baseband die D1 is coupled to two first antennas ANT1 via two first radio frequency channels CH1, and the second baseband die D2 is coupled to two second antennas ANT2 via two second radio frequency channels CH2. Both the first baseband die D1 and the second baseband die D2 include two MIMO channels. The first baseband die D1 and the second baseband die D2 are used to provide services for the same cell. When this communication device is applied to a receiver and a transmitter, the processing flow of the first baseband die D1 and the second baseband die D2 in the receiving direction and the transmitting direction will be illustrated by example.

[0110] In the first example, referring to Figure 8, when this communication device is applied to a receiver, the processing flow of the first baseband die D1 and the second baseband die D2 in the receiving direction can be as shown in Figure 11. First, when the first baseband die D1 receives data from the two first antennas ANT1 through the two first radio frequency channels CH1, and the data bandwidth of each first antenna ANT1 is 160MHz, it performs AFE, DFE, and FFT processing on the two 160MHz data through the two MIMO channels of the first baseband die D1, that is, each MIMO channel independently processes the 160MHz data of the corresponding antenna. Similarly, when the second baseband die D2 receives data from the two second antennas ANT2 through the two second radio frequency channels CH2, and the data bandwidth of each second antenna ANT2 is 160MHz, it performs AFE, DFE, and FFT processing on the two 160MHz data through the two MIMO channels of the second baseband die D2, that is, each MIMO channel independently processes the 160MHz data of the corresponding antenna. Subsequently, the first baseband die D1 and the second baseband die D2 exchange 80MHz data from the two antennas. For example, the first baseband die D1 sends the lower 80MHz data from the 160MHz data output of the FFT of each MIMO channel to the second baseband die D2, and the second baseband die D2 sends the higher 80MHz data from the 160MHz data output of the FFT of each MIMO channel to the first baseband die D1. The first baseband die D1 performs channel estimation and equalization processing on the four higher 80MHz data to obtain four 80MHz data streams (i.e., 4SS), which can be represented as SS1 to SS4. The second baseband die D2 performs channel estimation and equalization processing on the four lower 80MHz data to obtain four 80MHz data streams, which can be represented as SS1 to SS4. Then, the first baseband die D1 and the second baseband die D2 exchange 2SS 80MHz data. For example, the first baseband die D1 sends SS1 and SS2 from the four data streams output by the equalization processing in the first baseband die D1 to the second baseband die D2, and the second baseband die D2 sends SS3 and SS4 from the four data streams output by the equalization processing in the second baseband die D2 to the first baseband die D1. The first baseband die D1 demodulates the 2SS 160MHz data (i.e., data streams SS3 and SS4) to obtain multiple first code blocks. SS3 and SS4 can be the data streams of the first user, that is, the first baseband die D1 only processes the data streams of the first user during demodulation. The second baseband die D2 demodulates the 2SS 160MHz data (i.e., data streams SS1 and SS2) to obtain multiple second code blocks. SS1 and SS2 can be the data streams of the second user, that is, the second baseband die D2 only processes the data streams of the second user during demodulation.Finally, the first baseband die D1 can send a portion of the code blocks from multiple first code blocks to the second baseband die D2, and the second baseband die D2 can send a portion of the code blocks from multiple second code blocks to the first baseband die D1. The first baseband die D1 decodes the remaining code blocks from the multiple first code blocks and a portion of the code blocks from the multiple second code blocks; the second baseband die D2 decodes a portion of the code blocks from the multiple first code blocks and the remaining code blocks from the multiple second code blocks. The resulting bitstream data can be aggregated at the RX MAC.

[0111] The first baseband die D1 and the second baseband die D2 shown in Figure 11 above are illustrated using the example of a processing bandwidth of 160MHz for AFE, DFE and FFT, a processing bandwidth of 80MHz for channel estimation and equalization for 4 antennas, and a processing bandwidth of 160MHz for demodulation.

[0112] It is understandable that when the first baseband die D1 and the second baseband die D2 are used to provide services for the same cell, if the first baseband die D1 and the second baseband die D2 each support the reception processing of 2 antennas with a bandwidth of 160MHz, then the first baseband die D1 and the second baseband die D2 can achieve the reception processing of 4 antennas with a bandwidth of 160MHz when working together.

[0113] In the second example, referring to Figure 8, when this communication device is applied to a receiver, the processing flow of the first baseband die D1 and the second baseband die D2 in the receiving direction can be as shown in Figure 12. First, when the first baseband die D1 receives data from the two first antennas ANT1 through the two first radio frequency channels CH1, and the data bandwidth of each first antenna ANT1 is 160 MHz, the two 160 MHz data are processed by AFE, DFE, and FFT through the two MIMO channels of the first baseband die D1, that is, each MIMO channel independently processes the 160 MHz data of the corresponding antenna. Similarly, when the second baseband die D2 receives data from the two second antennas ANT2 through the two second radio frequency channels CH2, and the data bandwidth of each second antenna ANT2 is 160 MHz, the two 160 MHz data are processed by AFE, DFE, and FFT through the two MIMO channels of the second baseband die D2, that is, each MIMO channel independently processes the 160 MHz data of the corresponding antenna. Next, the second baseband die D2 sends 160MHz data from two antennas to the first baseband die D1. For example, the second baseband die D2 sends the 160MHz data output from the FFT of the two MIMO channels to the first baseband die D1. The first baseband die D1 sequentially performs channel estimation and equalization processing on the four antenna 160MHz data, obtaining four 160MHz data streams (i.e., 4SS160MHz data). Then, the first baseband die D1 demodulates and decodes the 4SS160MHz data output from the equalization processing in the first baseband die D1. The decoded bitstream data is then transmitted to the RX MAC.

[0114] In Figure 12 above, the processing bandwidth of AFE, DFE and FFT in the first baseband die D1 and the second baseband die D2 is 160MHz, and the processing bandwidth of channel estimation, equalization and demodulation in the first baseband die D1 is 160MHz for 4 antennas, as an example for illustration.

[0115] Understandably, compared with the processing flow shown in Figure 11, the data interaction between the first baseband die D1 and the second baseband die D2 is greatly reduced in Figure 12, thereby reducing the complexity of the processing flow. However, it is necessary to increase the resources of the baseband die, for example, to double the processing capability of the first baseband die D1 at nodes such as channel estimation, equalization and demodulation.

[0116] In the third example, referring to Figure 8, when this communication device is applied to a transmitter, the processing flow of the first baseband die D1 and the second baseband die D2 in the transmission direction can be as shown in Figure 13. First, the first baseband die D1 encodes the first bitstream data from the TX MAC to obtain multiple first code blocks; the second baseband die D2 encodes the second bitstream data from the TX MAC to obtain multiple second code blocks; the first baseband die D1 and the second baseband die D2 exchange partial code blocks. For example, the first baseband die D1 sends a portion of the multiple first code blocks to the second baseband die D2, and the second baseband die D2 sends a portion of the multiple second code blocks to the first baseband die D1. After the interaction, the first baseband die D1 obtains the first user data code block, and the second baseband die D2 obtains the second user data code block. Subsequently, the first baseband die D1 modulates the first user data code block to obtain two 160MHz data streams, denoted as SS3 and SS4. The first user data code block includes the remaining code blocks from multiple first code blocks and a portion of the code blocks from multiple second code blocks. That is, the first baseband die D1 is used to process the first user 2SS160MHz data. The second baseband die D2 modulates the second user data code block to obtain two 160MHz data streams, denoted as SS1 and SS2. The second user data code block includes a portion of the code blocks from multiple first code blocks and the remaining code blocks from multiple second code blocks. That is, the second baseband die D2 only processes the second user 2SS160M data. Then, the first baseband die D1 and the second baseband die D2 exchange 2SS 80MHz data. For example, the first baseband die D1 sends the low 80MHz data from the two data streams SS3 and SS4 to the second baseband die D2, and the second baseband die D2 sends the high 80MHz data from the two data streams SS1 and SS2 to the first baseband die D1. The first baseband die D1 performs precoding processing on the high 80MHz data from the four data streams SS1 to SS4 to obtain 4-antenna high 80MHz data. The second baseband die D2 performs precoding processing on the low 80MHz data from the four data streams SS1 to SS4 to obtain 4-antenna low 80MHz data.Finally, the first baseband die D1 sends the 2-antenna high 80MHz data corresponding to the second baseband die D2 from the 4-antenna high 80MHz data to the second baseband die D2, so that the second baseband die D2 obtains 2-antenna 160MHz data; the second baseband die D2 sends the 2-antenna low 80MHz data corresponding to the first baseband die D1 from the 4-antenna low 80MHz data to the first baseband die D1, so that the first baseband die D1 obtains 2-antenna 160MHz data; the first baseband die D1 processes the 2-antenna 160MHz data through its two MIMO channels respectively using IFFT, DFE, and AFE, and then transmits it through two first RF channels CH1 and multiple first antennas ANT1; the second baseband die D2 processes the 2-antenna 160MHz data through its two MIMO channels respectively using IFFT, DFE, and AFE, and then transmits it through two second RF channels CH2 and multiple second antennas ANT2.

[0117] The first baseband die D1 and the second baseband die D2 shown in Figure 13 above are illustrated using the following example: the demodulation processing bandwidth is 160MHz, the encoding processing bandwidth is 80MHz for 4 antennas, and the processing bandwidth for IFFT, DFE and AFE is 160MHz.

[0118] It is understandable that when the first baseband die D1 and the second baseband die D2 are used to provide services for the same cell, if the first baseband die D1 and the second baseband die D2 each support the transmission processing of 2 antennas with a bandwidth of 160MHz, then the first baseband die D1 and the second baseband die D2 can achieve the transmission processing of 4 antennas with a bandwidth of 160MHz when working together.

[0119] In another example, referring to Figure 8, when this communication device is applied to a transmitter, the processing flow of the first baseband die D1 and the second baseband die D2 in the transmission direction can be as shown in Figure 14. First, the first baseband die D1 encodes the data to be encoded to obtain multiple code blocks. Then, the first baseband die D1 modulates these multiple code blocks to obtain four 160MHz data streams (i.e., 4SS160MHz), which are represented as SS1 to SS4. Then, the first baseband die D1 precodes the four 160MHz data streams to obtain 4-antenna 160MHz data. Finally, the first baseband die D1 sends the 160MHz data from two of the four 160MHz antennas to the second baseband die D2, so that the second baseband die D2 can obtain the 160MHz data from two antennas. The first baseband die D1 processes the 160MHz data from two antennas through its two MIMO channels using IFFT, DFE, and AFE, respectively, and then transmits it through two first RF channels CH1 and multiple first antennas ANT1. The second baseband die D2 processes the 160MHz data from two antennas through its two MIMO channels using IFFT, DFE, and AFE, respectively, and then transmits it through two second RF channels CH2 and multiple second antennas ANT2.

[0120] In Figure 14 above, the modulation processing bandwidth of the first baseband die D1 is 4SS160MHz, the precoding processing bandwidth is 4 antennas160MHz, and the IFFT, DFE and AFE processing bandwidth in the first baseband die D1 and the second baseband die D2 are 160MHz, as an example for illustration.

[0121] It is understandable that, compared with the processing flow shown in Figure 13, the data interaction between the first baseband die D1 and the second baseband die D2 is greatly reduced in Figure 14, thereby reducing the complexity of the processing flow. However, it is necessary to increase the resources of the baseband die, for example, to double the processing capability of the first baseband die D1 at nodes such as modulation and precoding.

[0122] In this embodiment, the interaction points between baseband dies can be flexibly deployed according to actual needs. In this way, multiple baseband dies can interact and process data in parallel, and multiple baseband dies with small bandwidth and low stream count can be spliced ​​together into a high-specification baseband chip with large bandwidth and high stream count.

[0123] In this embodiment, for both centralized and distributed scenarios, the multiple baseband chips in the communication device can either establish independent cells in a first operating mode or collaboratively establish a unified high-specification cell in a second operating mode. The first operating mode can also be called a split mode, where the multiple baseband chips form multiple cells, each processing independently and serving different cells. The second operating mode can also be called a unified mode, where the multiple baseband chips in the communication device process together to jointly serve the high-specification cell. In practical applications, these two modes can be flexibly switched according to the actual network topology and air interface scenario. For example, taking Wi-Fi networking as an example, when signal conditions are good and there is little interference between users, the communication device can adopt the unified mode to improve cell specifications and capacity; when there are many users and severe conflicts, the communication device can adopt the split mode to establish multiple independent inter-frequency cells to reduce inter-cell interference.

[0124] For example, as shown in Figure 15, assume the communication device includes a first baseband die D1 and a second baseband die D2, each baseband die coupled to four antennas, each antenna having a bandwidth of 80MHz. In the unified mode, the first baseband die D1 and the second baseband die D2 can jointly establish an 8-antenna 80MHz cell, resulting in high user throughput, for example, with two users. If the number of users increases (e.g., from two to four) and inter-user interference strengthens, the communication device adopts a split mode (or cell splitting), where the first baseband die D1 and the second baseband die D2 each establish a 4-antenna 40MHz cell, i.e., two independent 4-antenna 40MHz cells, each with two users. Figure 15(a) illustrates a unified mode scenario; Figure 15(b) illustrates a split mode scenario, where the filled portion represents the coverage area of ​​the second baseband die D2, and the unfilled portion represents the coverage area of ​​the first baseband die D1.

[0125] In this embodiment, by splicing together multiple isomorphic baseband dies, the area and power consumption of a single baseband die can be effectively reduced, and the production yield can be improved. Secondly, the baseband chip formed by splicing multiple baseband dies in this embodiment has high scalability and can be flexibly spliced ​​into different specifications. Furthermore, multiple baseband dies in this communication device can be obtained through a single wafer fabrication and can cover different models, from high-end to low-end. Finally, the baseband service mode of this communication device can be flexibly transformed. Each baseband die can work as a single cell or as several independent cells with different frequencies. Multiple baseband dies can also work together to establish cells with higher specifications.

[0126] This application also provides a communication method applicable to the communication device described above. The method includes: in a first operating mode, a first baseband die and a second baseband die operate independently; in a second operating mode, the first baseband die and the second baseband die operate collaboratively.

[0127] Optionally, the first baseband die and the second baseband die operate independently, including: the first baseband die independently processes the data of the at least one first radio frequency channel; and / or, the second baseband die independently processes the data of the at least one second radio frequency channel.

[0128] Optionally, the first baseband die and the second baseband die work together, including: the first baseband die and the second baseband die processing the data of the at least one first radio frequency channel in parallel; and / or, the first baseband die and the second baseband die processing the data of the at least one second radio frequency channel in parallel.

[0129] Furthermore, in the first operating mode, the method further includes: a first baseband die providing services to a first cell through the at least one first radio frequency channel; and a second baseband die providing services to a second cell through the at least one second radio frequency channel, wherein the first cell and the second cell are different.

[0130] Furthermore, in the second operating mode, the method further includes: the first baseband die and the second baseband die respectively providing services to the same cell through the at least one first radio frequency channel and the at least one second radio frequency channel.

[0131] In another possible embodiment, the method further includes: a first baseband die transmitting data to a second baseband die based on a preset granularity; and / or, the second baseband die transmitting data to the first baseband die based on the preset granularity. The preset granularity includes at least one of the following: MIMO channel, subcarrier, user, data stream, or code block. Each MIMO channel-level data includes one or more subcarrier-level data, each subcarrier-level data includes one or more user-level data, each user-level data includes one or more data streams, and each data stream includes multiple code blocks.

[0132] For example, the first baseband die sends data to the second baseband die based on a preset granularity, including: sending at least one MIMO channel-level data to the second baseband die based on the granularity of the MIMO channel or the subcarrier, and / or sending equalized data to the second baseband die based on the granularity of the user or the data stream, and / or sending modulated data to the second baseband die based on the granularity of the code block, and / or sending encoded data to the second baseband die based on the granularity of the code block, and / or sending modulated data to the second baseband die based on the granularity of the user or the data stream, and / or sending precoded data to the second baseband die based on the granularity of the MIMO channel or the subcarrier.

[0133] For example, the second baseband die sends data to the first baseband die based on the preset granularity, including: sending at least one MIMO channel-level data to the first baseband die based on the granularity of the MIMO channel or the subcarrier, and / or sending equalized data to the first baseband die based on the granularity of the user or the data stream, and / or sending modulated data to the first baseband die based on the granularity of the code block, and / or sending encoded data to the first baseband die based on the granularity of the code block, and / or sending modulated data to the first baseband die based on the granularity of the user or the data stream, and / or sending precoded data to the first baseband die based on the granularity of the MIMO channel or the subcarrier.

[0134] The above mainly describes the solution provided by the embodiments of this application from the perspective of the interaction between the first baseband die and the second baseband die. It is understood that, in order to achieve the above functions, the first baseband die and the second baseband die include hardware structures and / or software modules corresponding to the execution of each function. Those skilled in the art should readily recognize that, in conjunction with the units and algorithm steps of the various examples described in the embodiments disclosed herein, this application can be implemented in hardware or a combination of hardware and computer software. Whether a function is executed in hardware or by computer software driving hardware depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0135] This application embodiment can divide the first baseband die and the second baseband die into functional modules according to the above method example. For example, each function can be divided into a separate functional module, or two or more functions can be integrated into one module. The integrated module can be implemented in hardware or as a software functional module. It should be noted that the module division in this application embodiment is illustrative and only represents one logical functional division. In actual implementation, there may be other division methods. The following description uses the division of each functional module according to each function as an example.

[0136] Figure 16 shows a schematic diagram of a baseband die involved in the above embodiments when using integrated units. The baseband die can be a first baseband die or a second baseband die. The baseband die includes a transmitting unit 301, a receiving unit 302, and a processing unit 303. In one possible embodiment, the transmitting unit 301 can be used to support the baseband die in performing the steps of transmitting data through the radio frequency channel in the above method embodiments, or in transmitting data to other baseband dies; the receiving unit 302 can be used to support the baseband die in receiving data from the radio frequency channel, or in receiving data from other baseband dies; the processing unit 303 can be used to support the baseband die in performing one or more steps such as AEF, DEF, FFT, IFFT, channel estimation, equalization, demodulation, decoding, encoding, modulation, or precoding on the data, and / or other processes described herein. All relevant content of each step involved in the above method embodiments can be referenced to the functional description of the corresponding functional module, and will not be repeated here.

[0137] Based on hardware implementation, the processing unit 303 in this embodiment can be the processor of the baseband die, the transmitting unit 301 can be the transmitter of the baseband die, and the receiving unit 302 can be the receiver of the baseband die. The transmitter can usually be integrated with the receiver as a transceiver. The specific transceiver can also be called a communication interface or interface circuit.

[0138] Figure 17 shows a schematic diagram of another baseband die structure involved in the above embodiments provided in this application. The baseband die can be used as a first baseband die or a second baseband die. The baseband die includes a processor 312, a memory 311 and a communication interface 313, and the processor 312, the memory 311 and the communication interface 313 are coupled.

[0139] The processor 312 is used to control and manage the operation of the baseband die. In one possible embodiment, the processor 312 can be used to support the baseband die in performing one or more of the steps described in the above method embodiments, such as AEF, DEF, FFT, IFFT, channel estimation, equalization, demodulation, decoding, encoding, modulation, or precoding, and / or other processes described herein. The communication interface 313 is used to support the baseband die in communication, such as supporting the baseband die to communicate with other baseband dies.

[0140] In this embodiment, processor 312 may include a central processing unit, a localization accelerometer, a general-purpose processor, a digital signal processor, an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or other programmable logic devices, transistor logic devices, hardware components, or any combination thereof. It can implement or execute various exemplary logic blocks, modules, and circuits described in conjunction with the disclosure of this application. The processor may also be a combination that implements computational functions, such as a combination of one or more microprocessors, a combination of a digital signal processor and a microprocessor, etc.

[0141] In another embodiment of this application, a communication device is provided, which includes the communication apparatus provided above and an antenna coupled to at least one first radio frequency channel and at least one second radio frequency channel of the communication apparatus; wherein the communication apparatus can be used to perform the steps of the first baseband die and the second baseband die in the embodiments provided above.

[0142] In another aspect of this application, a chip is provided, the chip including a processor for calling and executing instructions stored in a memory, causing a communication device on which the chip is mounted to perform the steps of the first baseband die or the second baseband die in the embodiments provided above.

[0143] In another aspect of this application, a chip is provided, comprising: an input interface, an output interface, a processor, and a memory. The input interface, the output interface, the processor, and the memory are connected through an internal connection path. The processor is used to execute code in the memory. When the code is executed, the processor is used to perform the steps of the first baseband die or the second baseband die in the embodiments provided above.

[0144] It is understood that all relevant content of each step involved in the above method embodiments can be referenced in the embodiments of the baseband die and the embodiments of the communication device, and will not be repeated here.

[0145] In the several embodiments provided in this application, it should be understood that the disclosed apparatus and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative. For instance, the division of modules or units is merely a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another apparatus, or some features may be ignored or not executed.

[0146] The units described as separate components may or may not be physically separate. A component shown as a unit can be one or more physical units; that is, it can be located in one place or distributed in multiple different locations. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0147] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a readable storage medium. This readable storage medium may include various media capable of storing program code, such as a USB flash drive, external hard drive, read-only memory, random access memory, magnetic disk, or optical disk. Based on this understanding, the technical solution of the embodiments of this application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product.

[0148] In another embodiment of this application, a computer-readable storage medium is also provided, which stores computer-executable instructions for a device or processor to execute the steps of the first baseband die in the above method embodiment.

[0149] In another embodiment of this application, a computer-readable storage medium is also provided, which stores computer-executable instructions for a device or processor to execute the steps of the second baseband die in the above method embodiment.

[0150] In another embodiment of this application, a computer program product is also provided, the computer program product including computer instructions that, when executed by at least one processor of a device, cause the device to perform the steps of the first baseband die in the above method embodiment.

[0151] In another embodiment of this application, a computer program product is also provided, the computer program product including computer instructions that, when executed by at least one processor of a device, cause the device to perform the steps of the second baseband die in the above method embodiment.

[0152] Finally, it should be noted that the above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A communication device, characterized in that, The communication device includes: Coupled first and second baseband dies; The first baseband die is coupled to at least one first radio frequency channel, the at least one first radio frequency channel being used to couple to at least one first antenna; The second baseband die is coupled to at least one second radio frequency channel, which is used to couple to at least one second antenna; The communication device has a first working mode and a second working mode. In the first working mode, the first baseband die and the second baseband die work independently, and in the second working mode, the first baseband die and the second baseband die work together.

2. The communication device according to claim 1, characterized in that, The first baseband die and the second baseband die operate independently, including: the first baseband die independently processes data of at least one first radio frequency channel; and / or, the second baseband die independently processes data of at least one second radio frequency channel; The first baseband die and the second baseband die work together, including: the first baseband die and the second baseband die processing data of at least one first radio frequency channel in parallel; and / or, the first baseband die and the second baseband die processing data of at least one second radio frequency channel in parallel.

3. The communication device according to claim 1 or 2, characterized in that, The communication device further includes at least one packaging structure, in which the first baseband die and the second baseband die are disposed.

4. The communication device according to claim 3, characterized in that, The at least one packaging structure includes a first packaging structure and a second packaging structure, wherein the first baseband die is disposed in the first packaging structure and the second baseband die is disposed in the second packaging structure.

5. The communication device according to claim 4, characterized in that, The communication device further includes a printed circuit board, on which the first packaging structure and the second packaging structure are disposed.

6. The communication device according to claim 4, characterized in that, The communication device further includes a first printed circuit board for setting the first packaging structure and a second printed circuit board for setting the second packaging structure, wherein the first packaging structure and the second packaging structure are connected by a connecting line.

7. The communication device according to any one of claims 1-6, characterized in that, The at least one first radio frequency channel is used to couple with the at least one first radio frequency remote unit through the at least one first antenna; The at least one second radio frequency channel is used to couple with the at least one second radio frequency remote unit.

8. The communication device according to claim 7, characterized in that, The at least one first radio frequency channel is also used to couple with at least two first radio frequency remote units via at least one first power divider / combiner; The at least one second radio frequency channel is also used to couple with at least two second radio frequency remote units via at least one second power divider / combiner.

9. The communication device according to any one of claims 1-8, characterized in that, The first baseband die is used to provide services to the first cell through the at least one first radio frequency channel; The second baseband die is used to provide services to a second cell through the at least one second radio frequency channel, wherein the first cell and the second cell are different.

10. The communication device according to any one of claims 1-9, characterized in that, The first baseband die and the second baseband die are also used to provide services to the same cell through the at least one first radio frequency channel and the at least one second radio frequency channel, respectively.

11. The communication device according to claim 10, characterized in that, The first baseband die is also used to send data to the second baseband die based on a preset granularity; and / or, The second baseband die is also used to send data to the first baseband die based on the preset granularity; The preset granularity includes at least one of the following: multiple-input multiple-output (MIMO) channel, subcarrier, user, data stream, or code block; Each MIMO channel-level data includes one or more subcarrier-level data, each subcarrier-level data includes one or more user-level data, each user-level data includes one or more data streams, and each data stream includes multiple code blocks.

12. The communication device according to claim 11, characterized in that, The first baseband die is further configured to: send at least one MIMO channel-level data to the second baseband die at the granularity of the MIMO channel or the subcarrier, and / or send equalized data to the second baseband die at the granularity of the user or the data stream, and / or send modulated data to the second baseband die at the granularity of the code block, and / or send encoded data to the second baseband die at the granularity of the code block, and / or send modulated data to the second baseband die at the granularity of the user or the data stream, and / or send precoded data to the second baseband die at the granularity of the MIMO channel or the subcarrier; and / or, The second baseband die is further configured to: send at least one MIMO channel-level data to the first baseband die at the granularity of the MIMO channel or the subcarrier, and / or send equalized data to the first baseband die at the granularity of the user or the data stream, and / or send modulated data to the first baseband die at the granularity of the code block, and / or send encoded data to the first baseband die at the granularity of the code block, and / or send modulated data to the first baseband die at the granularity of the user or the data stream, and / or send precoded data to the first baseband die at the granularity of the MIMO channel or the subcarrier.

13. A communication method, characterized in that, An application in a communication device having a first operating mode and a second operating mode, the communication device comprising a coupled first baseband die and a second baseband die, the first baseband die being coupled to at least one first radio frequency (RF) channel, and the second baseband die being coupled to at least one second RF channel, the at least one first RF channel and the at least one second RF channel being used for coupling with an antenna, the method comprising: In the first operating mode, the first baseband die and the second baseband die operate independently; In the second operating mode, the first baseband die and the second baseband die work together.

14. The communication method according to claim 13, characterized in that, The first baseband die and the second baseband die operate independently, including: the first baseband die independently processes data of at least one first radio frequency channel; and / or, the second baseband die independently processes data of at least one second radio frequency channel; The first baseband die and the second baseband die work together, including: the first baseband die and the second baseband die processing data of at least one first radio frequency channel in parallel; and / or, the first baseband die and the second baseband die processing data of at least one second radio frequency channel in parallel.

15. The communication method according to claim 13 or 14, characterized in that, In the first operating mode, the method further includes: The first baseband die provides services to the first cell through the at least one first radio frequency channel; The second baseband die provides services to a second cell through the at least one second radio frequency channel, and the first cell and the second cell are different.

16. The communication method according to claim 13 or 14, characterized in that, In the second operating mode, the method further includes: The first baseband die and the second baseband die provide services to the same cell through the at least one first radio frequency channel and the at least one second radio frequency channel, respectively.

17. The communication method according to claim 16, characterized in that, The method further includes: The first baseband die sends data to the second baseband die based on a preset granularity; and / or, The second baseband die sends data to the first baseband die based on the preset granularity; The preset granularity includes at least one of the following: multiple-input multiple-output (MIMO) channel, subcarrier, user, data stream, or code block; Each MIMO channel-level data includes one or more subcarrier-level data, each subcarrier-level data includes one or more user-level data, each user-level data includes one or more data streams, and each data stream includes multiple code blocks.

18. The communication method according to claim 17, characterized in that, The first baseband die sends data to the second baseband die based on a preset granularity, including: Send at least one MIMO channel-level data to the second baseband die at the granularity of the MIMO channel or the subcarrier, and / or send equalized data to the second baseband die at the granularity of the user or the data stream, and / or send modulated data to the second baseband die at the granularity of the code block, and / or send encoded data to the second baseband die at the granularity of the code block, and / or send modulated data to the second baseband die at the granularity of the user or the data stream, and / or send precoded data to the second baseband die at the granularity of the MIMO channel or the subcarrier; The second baseband die sends data to the first baseband die based on the preset granularity, including: Send at least one MIMO channel-level data to the first baseband die at the granularity of the MIMO channel or the subcarrier, and / or send equalized data to the first baseband die at the granularity of the user or the data stream, and / or send modulated data to the first baseband die at the granularity of the code block, and / or send encoded data to the first baseband die at the granularity of the code block, and / or send modulated data to the first baseband die at the granularity of the user or the data stream, and / or send precoded data to the first baseband die at the granularity of the MIMO channel or the subcarrier.

19. A communication device, characterized in that, The communication device includes: a communication apparatus as claimed in any one of claims 1-12, at least one first antenna coupled to at least one first radio frequency channel of the communication apparatus, and at least one second antenna coupled to at least one second radio frequency channel of the communication apparatus.

20. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores instructions that, when executed on the device, cause the device to perform the communication method as described in any one of claims 13-18.

21. A computer program product, characterized in that, The computer program product includes a computer program that, when executed by a device, causes the device to perform the communication method as described in any one of claims 13-18.

Images