High-speed parallel wire pair having heat dissipation function
By introducing a temperature difference heat dissipation mechanism between a heat dissipation layer and an electrocooled main body layer in high-speed parallel pairing, the problem of core heating affecting signal transmission is solved, achieving self-heating and signal stability, and improving signal transmission efficiency and accuracy.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- ZHONGTIAN RADIO FREQUENCY CABLE CO LTD
- Filing Date
- 2026-01-13
- Publication Date
- 2026-07-23
AI Technical Summary
Existing high-speed parallel lines are prone to overheating during operation, which affects the efficiency and accuracy of signal transmission.
It adopts a high-speed parallel alignment structure with heat dissipation function, including a shielding layer, a heat dissipation layer and a sheath layer. The heat dissipation layer consists of a cold end layer, an electro-cooling main body layer and a hot end layer. The electro-cooling main body layer creates a temperature difference between the cold end layer and the hot end layer, thereby dissipating heat from the shielding layer and transferring the heat to the sheath layer for heat dissipation.
It effectively avoids the impact of wire core heating on signal transmission efficiency and accuracy, achieves self-heating of high-speed parallel pairs, and ensures the stability and quality of signal transmission.
Smart Images
Figure CN2026072231_23072026_PF_FP_ABST
Abstract
Description
High-speed parallel alignment with heat dissipation function Technical Field
[0001] This application relates to the field of high-speed parallel line technology, and in particular to a high-speed parallel line with heat dissipation function. Background Technology
[0002] High-speed parallel lines typically consist of two parallel conductors, enabling high-speed, high-precision signal transmission. However, existing high-speed parallel lines are prone to conductor overheating during operation, affecting signal transmission efficiency and accuracy. Summary of the Invention
[0003] This application provides a high-speed parallel pair with heat dissipation function to solve the problem of signal transmission being affected by the heat generation of the wire core in the known high-speed parallel pair.
[0004] This application provides a high-speed parallel-paired wire with heat dissipation function, including two wire cores, a shielding layer, a heat dissipation layer, and a sheath layer. The two wire cores are arranged in parallel along a first direction. The shielding layer is disposed around the outer periphery of the two wire cores. The heat dissipation layer is disposed around the outer periphery of the shielding layer. The sheath layer is disposed around the outer periphery of the heat dissipation layer. The heat dissipation layer includes a cold end layer, an electrocooling main body layer, and a hot end layer arranged sequentially. The cold end layer is thermally coupled to the shielding layer, and the hot end layer is thermally coupled to the sheath layer. The electrocooling main body layer is configured to form a temperature difference between the cold end layer and the hot end layer after being energized, so as to transfer the heat of the shielding layer to the sheath layer.
[0005] In one possible implementation, the high-speed parallel pair with heat dissipation function further includes a temperature sensing wire disposed within the shielding layer and located between the two wire cores, the temperature sensing wire being configured to monitor the temperature of the environment within the shielding layer.
[0006] In one possible implementation, the high-speed parallel pair with heat dissipation function further includes a ground wire, which is disposed within the shielding layer and located between the two wire cores.
[0007] In one possible implementation, the ground wire and the temperature measuring wire are spaced apart along a second direction, and the second direction intersects the first direction;
[0008] The high-speed parallel pair with heat dissipation function also includes a support frame. Along the first direction, the support frame is located between the two wire cores, and along the second direction, the support frame is located between the temperature measuring wire and the ground wire.
[0009] In one possible implementation, the support frame is made of a thermally conductive material, and the support frame is thermally coupled to the two wire cores and the temperature measuring wire.
[0010] In one possible implementation, along the second direction, the temperature measuring wire is clamped between the inner wall of one side of the shielding layer and one end of the support frame, and the ground wire is clamped between the inner wall of the other side of the shielding layer and the other end of the support frame.
[0011] Along the first direction, one of the wire cores is clamped between the inner wall of one side of the shielding layer and one side of the support frame, and the other wire core is clamped between the inner wall of the other side of the shielding layer and the other side of the support frame.
[0012] In one possible implementation, along the first direction, the support frame is provided with first receiving grooves on opposite sides, and the two wire cores are respectively partially received in the two first receiving grooves.
[0013] Along the second direction, the two opposite ends of the support frame are respectively provided with second receiving grooves, and the temperature measuring wire and the ground wire are respectively partially received in the two second receiving grooves.
[0014] In one possible implementation, the shielding layer is filled with a filling structure.
[0015] In one possible implementation, the high-speed parallel line with heat dissipation function further includes a control element connected to the temperature sensing line for receiving the temperature signal detected by the temperature sensing line. Based on the temperature signal, the control element controls the magnitude of the current flowing into the electrocooling body layer.
[0016] In one possible implementation, the sheath layer is made of a thermally conductive and insulating material.
[0017] In the high-speed parallel pairing with heat dissipation function of this application, a heat dissipation layer is provided between the shielding layer and the sheath layer. The heat dissipation layer is composed of a cold end layer, an electro-cooled main body layer and a hot end layer. The electro-cooled main body layer can be connected to an external power supply to form a temperature difference between the cold end layer and the hot end layer. The cold end layer then dissipates heat from the shielding layer and transfers the heat to the hot end layer. The hot end layer then transfers the heat to the sheath layer. Thus, the heat dissipation of the shielding layer and its inner wire core can be completed by dissipating heat from the sheath layer. It can complete its own heat dissipation when the high-speed parallel pairing is working, and avoid the signal transmission efficiency and signal transmission accuracy being affected by the heat of the wire core. Attached Figure Description
[0018] Figure 1 is a schematic diagram of the structure of the high-speed parallel alignment with heat dissipation function in one embodiment of this application.
[0019] Figure 2 is a schematic diagram of the high-speed parallel-aligned heat dissipation layer with heat dissipation function shown in Figure 1.
[0020] Figure 3 is a schematic diagram of signal transmission in one embodiment of the high-speed parallel alignment with heat dissipation function of this application.
[0021] Explanation of key component symbols:
[0022] High-speed parallel alignment 100 with heat dissipation function
[0023] First direction X
[0024] Second direction Z
[0025] Third direction Y
[0026] Control element 1
[0027] Power supply component 2
[0028] 10 wire cores
[0029] Wire 11
[0030] Insulation layer 12
[0031] Temperature measuring line 20
[0032] Thermal insulation component 30
[0033] Support frame 40
[0034] First receiving tank 41
[0035] Second receiving tank 42
[0036] Ground wire 50
[0037] Shielding layer 60
[0038] Heat dissipation layer 70
[0039] Cold end layer 71
[0040] Electro-cooled main body layer 72
[0041] Hot end layer 73
[0042] Sheath layer 80
[0043] Filling structure 90
[0044] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation
[0045] The following description will refer to the accompanying drawings to provide a more complete picture of the present application. The drawings illustrate exemplary embodiments of the present application. However, the present application may be implemented in many different forms and should not be construed as limited to the exemplary embodiments set forth herein. These exemplary embodiments are provided to make the present application thorough and complete, and to fully convey the scope of the present application to those skilled in the art. Similar reference numerals denote the same or similar components.
[0046] The terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to limit the application. As used herein, unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “the” are intended to also include the plural forms. Furthermore, when used herein, “comprising” and / or “including” and / or “having,” integers, steps, operations, components, and / or components, but does not exclude the presence or addition of one or more other features, regions, integers, steps, operations, components, and / or groups thereof.
[0047] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. Furthermore, unless expressly defined herein, terms such as those defined in a general dictionary should be interpreted as having the same meaning as they have in the relevant art and in the content of this application, and will not be interpreted as having an idealized or overly formal meaning.
[0048] The specific embodiments of this application will be further described in detail below with reference to the accompanying drawings.
[0049] As shown in Figure 1, this embodiment provides a high-speed parallel pair 100 with heat dissipation function, including two wire cores 10, a shielding layer 60, a heat dissipation layer 70, and a sheath layer 80.
[0050] For ease of reading, this application introduces a first direction X, a second direction Z, and a third direction Y to describe the embodiments of this application. The first direction X, the second direction Z, and the third direction Y can be three non-parallel straight lines in space; further, the first direction X, the second direction Z, and the third direction Y can be three mutually perpendicular directions in a three-dimensional coordinate system (a three-dimensional Cartesian coordinate system). In subsequent embodiments, the first direction X is described as the X-axis direction of the three-dimensional coordinate system, the second direction Z is the Z-axis direction of the three-dimensional coordinate system, and the third direction Y is the Y-axis direction of the three-dimensional coordinate system.
[0051] Along the first direction X, two wire cores 10 are arranged in parallel, and the extension directions of both wire cores 10 are parallel to the third direction Y. A shielding layer 60 is disposed around the outer periphery of the two wire cores 10, and the inner peripheral surface of the shielding layer 60 at least partially abuts against the outer peripheral surface of the two wire cores 10. A heat dissipation layer 70 is disposed around the outer periphery of the shielding layer 60, and the inner peripheral surface of the heat dissipation layer 70 abuts against the outer peripheral surface of the shielding layer 60. A sheath layer 80 is disposed around the outer periphery of the heat dissipation layer 70, and the inner peripheral surface of the sheath layer 80 abuts against the outer peripheral surface of the heat dissipation layer 70. The heat dissipation layer 70 includes a cold end layer 71, an electrocooling main body layer 72, and a hot end layer 73 arranged sequentially from the inside to the outside. The cold end layer 71 is thermally coupled to the shielding layer 60, and the hot end layer 73 is thermally coupled to the sheath layer 80. The electrocooling main body layer 72 is configured to create a temperature difference between the cold end layer 71 and the hot end layer 73 after being energized, so as to transfer the heat of the shielding layer 60 to the sheath layer 80.
[0052] Thus, in the high-speed parallel pair 100 with heat dissipation function of this application, a heat dissipation layer 70 is provided between the shielding layer 60 and the sheath layer 80. The heat dissipation layer 70 is composed of a cold end layer 71, an electrocooling main body layer 72, and a hot end layer 73. The electrocooling main body layer 72 can be connected to an external power supply to form a temperature difference between the cold end layer 71 and the hot end layer 73. The cold end layer 71 then dissipates heat from the shielding layer 60 and transfers the heat to the hot end layer 73. The hot end layer 73 then transfers the heat to the sheath layer 80. Thus, by dissipating heat from the sheath layer 80, heat dissipation of the shielding layer 60 and its inner wire core 10 can be completed. It can complete its own heat dissipation when the high-speed parallel pair is working, and avoid the signal transmission efficiency and signal transmission accuracy being affected by the heat of the wire core 10.
[0053] Referring again to Figure 1, in one embodiment, the wire core 10 includes a conductor 11 and an insulation layer 12 covering the outer periphery of the conductor 11. The conductor 11 is an aluminum wire or the like. The insulation layer 12 can be made of polytetrafluoroethylene (PTFE) composite material or polyimide (PI) composite material to ensure that the insulation layer 12 has excellent electrical insulation performance. The insulation layer 12 of the two wire cores 10 can initially prevent signal crosstalk between the two wire cores 10.
[0054] It is understood that, in other embodiments, thermally conductive fillers may be added to the insulating layer 12 to improve its thermal conductivity. The thermally conductive fillers may be glass fiber or graphite, etc.
[0055] Referring again to Figure 1, in one embodiment, along the first direction X, two wire cores 10 are spaced apart, and the opposite sides of the two wire cores 10 respectively abut against the adjacent sides of the inner peripheral surface of the shielding layer 60.
[0056] The high-speed parallel-paired cable 100 with heat dissipation function also includes a temperature sensing wire 20. The temperature sensing wire 20 is located inside the shielding layer 60 and between the two wire cores 10. The temperature sensing wire 20 is configured to monitor the temperature of the environment inside the shielding layer 60. The temperature sensing wire 20 can be a temperature-sensing optical fiber. The outer peripheral surface of the temperature sensing wire 20 abuts against the inner peripheral surface of the shielding layer 60 and the outer peripheral surface of the two wire cores 10. On the one hand, the temperature sensing wire 20 presses the two wire cores 10 against the inner peripheral surface of the shielding layer 60 respectively. On the other hand, it can directly contact the two wire cores 10 to accurately detect the temperature of the wire cores 10. The input power of the electrocooling main body layer 72 can be adjusted according to the current temperature change of the wire cores 10, thereby adjusting the heat dissipation capacity of the electrocooling main body layer 72 and realizing dynamic adjustment of heat dissipation capacity. This ensures heat dissipation effect while reducing energy consumption costs.
[0057] Furthermore, the high-speed parallel pair 100 with heat dissipation function also includes a ground wire 50. The ground wire 50 is disposed within the shielding layer 60 and located between the two wire cores 10, which can reduce interference between the two wire cores 10 and ensure the stability of signal transmission. Along the second direction Z, the ground wire 50 is parallel to and spaced apart from the temperature sensing wire 20. The outer peripheral surface of the ground wire 50 abuts against the inner peripheral surface of the shielding layer 60, and the outer peripheral surface of the ground wire 50 abuts against the outer peripheral surfaces of the two wire cores 10, so that the ground wire 50 can work with the temperature sensing wire 20 to simultaneously press the two wire cores 10 against the inner peripheral surface of the shielding layer 60, ensuring that the positions of the two wire cores 10 will not shift and disrupt their parallelism, thus affecting signal transmission.
[0058] Referring again to Figure 1, in one embodiment, the high-speed parallel pair 100 with heat dissipation function further includes a support frame 40. Along the first direction X, the support frame 40 is located between the two wire cores 10, and along the second direction Z, the support frame 40 is located between the temperature measuring wire 20 and the ground wire 50.
[0059] Along the second direction Z, the temperature measuring wire 20 is clamped between the inner wall of one side of the shielding layer 60 and one end of the support frame 40, and the ground wire 50 is clamped between the inner wall of the other side of the shielding layer 60 and the other end of the support frame 40. Along the first direction X, one wire core 10 is clamped between the inner wall of one side of the shielding layer 60 and one side of the support frame 40, and the other wire core 10 is clamped between the inner wall of the other side of the shielding layer 60 and the other side of the support frame 40. Thus, by setting a support frame 40 between the temperature measuring wire 20, the ground wire 50, and the two wire cores 10, the support frame 40 can simultaneously press the temperature measuring wire 20, the ground wire 50, and the two wire cores 10 against the inner circumferential surface of the shielding layer 60. In conjunction with the temperature measuring wire 20 and the ground wire 50, the two wire cores 10 are pressed against the inner circumferential surface of the shielding layer 60, ensuring that the temperature measuring wire 20, the ground wire 50, and the two wire cores 10 are completely limited in the plane containing the first direction X and the second direction Z. This ensures that during the operation of the high-speed parallel parallel line 100 with heat dissipation function, the positions of the two wire cores 10 will not shift and affect the parallelism between them.
[0060] Furthermore, along the first direction X, the support frame 40 has first receiving grooves 41 on opposite sides, and the two wire cores 10 are respectively partially received in the two first receiving grooves 41. The groove walls of the first receiving grooves 41 are curved and adapted to the shape of the wire cores 10, so as to improve the stability of the support frame 40 in limiting the two wire cores 10.
[0061] Along the second direction Z, the two opposite ends of the support frame 40 are respectively provided with second receiving grooves 42, and the temperature measuring wire 20 and the ground wire 50 are respectively partially received in the two second receiving grooves 42. The groove walls of the second receiving grooves 42 are curved and adapted to the shape of the temperature measuring wire 20 and the ground wire 50, so as to improve the stability of the support frame 40 in limiting the temperature measuring wire 20 and the ground wire 50.
[0062] In this embodiment, the support frame 40 is made of a thermally conductive material and is thermally coupled to the two wire cores 10 and the temperature sensing wire 20. The support frame 40 can be made of metal such as aluminum or copper, or its outer surface can be plated with aluminum or copper. Thus, when the temperature of the two wire cores 10 is high, due to the large contact area between the two wire cores 10 and the support frame 40, the two wire cores 10 can quickly transfer heat to the support frame 40, which in turn transfers the heat to the temperature sensing wire 20. This allows the temperature sensing wire 20 to more accurately measure the current temperature of the wire cores 10, avoiding the problems of slow and inaccurate temperature measurement caused by only the temperature sensing wire 20 contacting the wire cores 10.
[0063] Furthermore, as mentioned above, since the support frame 40 is made of metal materials such as aluminum or copper, or can be plated with aluminum or copper on its outer surface, the support frame 40 located between the two wire cores 10 can form electromagnetic shielding between the two wire cores 10, avoiding crosstalk and other problems during signal transmission. In addition, along the second direction Z, one side of the temperature measuring wire 20 is pressed against the shielding layer 60, and the other side of the temperature measuring wire 20 is pressed against one end of the support frame 40. One side of the ground wire 50 is pressed against the shielding layer 60, and the other side of the ground wire 50 is pressed against the other end of the support frame 40. This, together with the temperature measuring wire 20, the support frame 40, and the ground wire 50, forms a partition structure, dividing the inner cavity of the shielding layer 60 into two separated cavities. The two wire cores 10 are located in these two separated cavities, further ensuring that crosstalk and other problems do not occur between the two wire cores 10, thus improving the quality of signal transmission.
[0064] In this embodiment, the shielding layer 60 is filled with a filling structure 90. The filling structure 90 can be a cured polytetrafluoroethylene (PTFE) composite material or a polyimide (PI) composite material. The filling structure 90 fills the gaps between the wire core 10, the temperature measuring wire 20, the ground wire 50, the support frame 40, and the shielding layer 60, thereby limiting the wire core 10, the temperature measuring wire 20, the ground wire 50, and the support frame 40, and ensuring the structural strength of the high-speed parallel pair. In addition, the filling structure 90, which is uniformly filled in the shielding layer 60, can also improve the impedance uniformity of the high-speed parallel pair and reduce the attenuation jitter of the high-speed parallel pair.
[0065] Referring again to Figure 1, in one embodiment, the shielding layer 60 is made of aluminum or copper. For example, the shielding layer 60 can be made of hot-melt self-adhesive aluminum foil or hot-melt self-adhesive copper foil. The shielding layer 60 can form a good electromagnetic shielding function between the core 10 and the outside world, preventing external environmental interference with the signal transmission of the core 10. In addition, the shielding layer 60 is made of aluminum or copper, which has good thermal conductivity. The shielding layer 60 can quickly transfer the heat of the core 10 in contact with its inner peripheral surface to the heat dissipation layer 70 in contact with its outer peripheral surface, thereby achieving rapid heat dissipation of the core 10.
[0066] Specifically, the high-speed parallel parallel line 100 with heat dissipation function also includes a heat insulation component 30. The heat insulation component 30 is attached to the inner circumferential surface of the shielding layer 60. The side of the temperature measuring line 20 away from the support frame 40 abuts against the heat insulation component 30 to avoid direct contact between the temperature measuring line 20 and the shielding layer 60, which would affect the temperature measuring effect of the temperature measuring line 20. The heat insulation component 30 can be made of thermal insulation materials such as glass wool.
[0067] Referring again to Figures 1 to 3, in one embodiment, the electrocooling main body layer 72 can be made of silicon-based materials or III-V group semiconductor materials, etc., and can achieve heat transfer based on the Peltier effect. When the electrocooling main body layer 72 is energized, it can transfer the heat of the cold end layer 71 to the hot end layer 73. The electrocooling main body layer 72 can be externally connected to a power supply component 2 via conductive wires, so that the power supply component 2 can supply power to the electrocooling main body layer 72.
[0068] In this embodiment, the electrocooling main body layer 72 can be integrally formed with the hot end layer 73 and the cold end layer 71, and the three are wrapped around the outer peripheral surface of the shielding layer 60, which can improve production efficiency.
[0069] In other embodiments, the electrocooling body layer 72 may be a semiconductor cooling chip. The semiconductor cooling chip is embedded between the hot end layer 73 and the cold end layer 71, and the hot end of the semiconductor cooling chip is thermally coupled to the hot end layer 73, and its cold end is thermally coupled to the cold end layer 71. Multiple semiconductor cooling chips are arranged sequentially and at intervals along the third direction Y to improve heat dissipation uniformity.
[0070] Furthermore, the heat dissipation layer 70 is disposed on the outer peripheral surface of the shielding layer 60, and the heat dissipation layer 70 is made of the aforementioned silicon-based material or III-V group semiconductor material, etc., which can form a shielding structure on the outside of the shielding layer 60. Thus, the shielding layer 60 and the heat dissipation layer 70 form a double-layer shielding structure to protect the wire core 10 inside the shielding layer 60 from external electromagnetic interference, thereby improving the signal transmission quality of the high-speed parallel line.
[0071] Referring again to Figure 1, in one embodiment, the sheath layer 80 is made of a thermally conductive and insulating material. For example, the sheath layer 80 can be made of polytetrafluoroethylene (PTFE) composite material or polyimide (PI) composite material, and thermally conductive fillers can be added to the sheath layer 80 to improve its thermal conductivity. The thermally conductive fillers can be glass fiber or graphite, etc.
[0072] The sheath layer 80 is thermally coupled to the hot end layer 73, which can conduct the heat of the hot end layer 73 to the outside. In addition, the heat dissipation of the sheath layer 80 can be accelerated by blowing cool air onto it with a fan, so as to avoid heat accumulation at the sheath layer 80.
[0073] Referring again to Figures 1 and 3, in one embodiment, the high-speed parallel line 100 with heat dissipation function further includes a control element 1. The control element 1 is signal-connected to the temperature sensing line 20 and is used to receive the temperature signal detected by the temperature sensing line 20. Based on the temperature signal, the control element 1 controls the magnitude of the current flowing into the electrocooling main body layer 72.
[0074] The control element 1 has pre-set current values corresponding to different temperature signals. The control element 1 is also signal-connected to the power supply component 2. Based on the temperature signal, the control element 1 retrieves the current value corresponding to that temperature signal and sends a control signal to the power supply component 2. Based on this control signal, the power supply component 2 outputs a corresponding current to the electrocooling main body layer 72, thereby dynamically adjusting the cooling effect of the heat dissipation layer 70.
[0075] Furthermore, when the electrocooling main body layer 72 adopts the aforementioned structure of multiple semiconductor cooling chips, each semiconductor cooling chip is electrically connected to the power supply component 2 via conductive lines. Along the third direction Y, the semiconductor cooling chips are spaced apart and evenly distributed in different regions of the high-speed parallel line. When the temperature sensing line 20 uses a temperature sensing fiber, it can monitor the temperature of different regions along the extension direction of the high-speed parallel line and transmit the temperature signals of different regions to the control element 1. The control element 1 can control the current supplied to the corresponding semiconductor cooling chip based on the temperature signals of different regions, thereby achieving dynamic adjustment of the heat dissipation capacity of different regions of the high-speed parallel line 100 with heat dissipation function. This reduces energy consumption and achieves precise heat dissipation, avoiding uneven heat dissipation from affecting the signal transmission of the high-speed parallel line 100 with heat dissipation function.
[0076] The specific embodiments of this application have been described above with reference to the accompanying drawings. However, those skilled in the art will understand that various changes and substitutions can be made to the specific embodiments of this application without departing from the scope of this application. All such changes and substitutions fall within the scope defined by this application.
Claims
1. A high-speed parallel alignment system with heat dissipation function, characterized in that, include: Two wire cores are arranged in parallel along a first direction; A shielding layer is disposed around the outer periphery of the two said wire cores; A heat dissipation layer is disposed around the outer periphery of the shielding layer; A sheath layer is provided around the outer periphery of the heat dissipation layer; The heat dissipation layer includes a cold end layer, an electrocooling main body layer, and a hot end layer arranged sequentially. The cold end layer is thermally coupled to the shielding layer, and the hot end layer is thermally coupled to the sheath layer. The electrocooling main body layer is configured to form a temperature difference between the cold end layer and the hot end layer after being energized, so as to transfer the heat of the shielding layer to the sheath layer.
2. The high-speed parallel alignment line with heat dissipation function as described in claim 1, characterized in that, The high-speed parallel line with heat dissipation function also includes a temperature measuring line, which is located inside the shielding layer and between the two wire cores. The temperature measuring line is configured to monitor the temperature of the environment inside the shielding layer.
3. The high-speed parallel alignment with heat dissipation function as described in claim 2, characterized in that, The high-speed parallel pair with heat dissipation function also includes a ground wire, which is located inside the shielding layer and between the two wire cores.
4. The high-speed parallel alignment line with heat dissipation function as described in claim 3, characterized in that, Along the second direction, the ground wire and the temperature measuring wire are spaced apart, and the second direction intersects the first direction; The high-speed parallel pair with heat dissipation function also includes a support frame. Along the first direction, the support frame is located between the two wire cores, and along the second direction, the support frame is located between the temperature measuring wire and the ground wire.
5. The high-speed parallel alignment line with heat dissipation function as described in claim 4, characterized in that, The support frame is made of a thermally conductive material, and the support frame is thermally coupled to the two wire cores and the temperature measuring wire.
6. The high-speed parallel alignment with heat dissipation function as described in claim 4, characterized in that, Along the second direction, the temperature measuring wire is clamped between the inner wall of one side of the shielding layer and one end of the support frame, and the ground wire is clamped between the inner wall of the other side of the shielding layer and the other end of the support frame; Along the first direction, one of the wire cores is clamped between the inner wall of one side of the shielding layer and one side of the support frame, and the other wire core is clamped between the inner wall of the other side of the shielding layer and the other side of the support frame.
7. The high-speed parallel alignment line with heat dissipation function as described in claim 4, characterized in that, Along the first direction, the support frame is provided with first receiving grooves on opposite sides, and the two wire cores are respectively partially received in the two first receiving grooves; Along the second direction, the two opposite ends of the support frame are respectively provided with second receiving grooves, and the temperature measuring wire and the ground wire are respectively partially received in the two second receiving grooves.
8. The high-speed parallel alignment line with heat dissipation function as described in claim 4, characterized in that, The shielding layer is filled with a filling structure.
9. The high-speed parallel alignment line with heat dissipation function as described in claim 2, characterized in that, The high-speed parallel line with heat dissipation function also includes a control element, which is connected to the temperature measuring line and is used to receive the temperature signal detected by the temperature measuring line. Based on the temperature signal, the control element controls the magnitude of the current flowing into the electrocooling main body layer.
10. The high-speed parallel alignment line with heat dissipation function as described in claim 1, characterized in that, The sheath layer is made of a thermally conductive and insulating material.