Chassis and computing device

Abstract

The embodiments of the present application provide a chassis and a computing device. The chassis is applied to the computing device. The chassis comprises a housing. The computing device comprises computing modules, a power supply module, and a tubing assembly that are disposed in the housing. The computing modules comprise liquid cooling modules and compute boards, wherein the liquid cooling modules are provided with cooling flow channels for a cooling medium to flow, and the cooling flow channels are in communication with the tubing assembly. The chassis defines an accommodating cavity and a pipe cavity, wherein the accommodating cavity is configured to accommodate the computing modules and the power supply module, and the pipe cavity is configured to accommodate the tubing assembly. In this way, the computing modules, the power supply module and the tubing assembly are integrated, thereby facilitating maintenance and reducing the space occupied by the chassis. In addition, the tubing assembly can be concealed within the pipe cavity of the chassis, thereby making the external appearance of the chassis neater and more aesthetically pleasing.

Description

Chassis and computing devices

[0001] This application claims priority to Chinese Patent Application No. 2025100899843, filed on January 20, 2025, entitled "Chassis and Computing Device", the entire contents of which are incorporated herein by reference.

[0002] This application claims priority to Chinese Patent Application No. 202520133782X, filed on January 20, 2025, entitled "Chassis and Computing Device", the entire contents of which are incorporated herein by reference.

[0003] This application claims priority to Chinese Patent Application No. 2025201337656, filed on January 20, 2025, entitled "Cooling Apparatus and Computing Device", the entire contents of which are incorporated herein by reference.

[0004] This application claims priority to Chinese Patent Application No. 2025201344607, filed on January 20, 2025, entitled "Liquid Cooling Module, Cooling Device and Computing Equipment", the entire contents of which are incorporated herein by reference.

[0005] This application claims priority to Chinese Patent Application No. 2025201331109, filed on January 20, 2025, entitled “Computing Device”, the entire contents of which are incorporated herein by reference.

[0006] This application claims priority to Chinese Patent Application No. 2025106691571, filed on May 22, 2025, entitled "Chassis and Computing Device", the entire contents of which are incorporated herein by reference.

[0007] This application claims priority to Chinese Patent Application No. 2025210248609, filed on May 22, 2025, entitled "Chassis and Computing Device", the entire contents of which are incorporated herein by reference.

[0008] This application claims priority to Chinese Patent Application No. 2025210250562, filed on May 22, 2025, entitled "Cooling Apparatus and Computing Device", the entire contents of which are incorporated herein by reference.

[0009] This application claims priority to Chinese Patent Application No. 2025210264029, filed on May 22, 2025, entitled "Liquid Cooling Module, Cooling Device and Computing Equipment", the entire contents of which are incorporated herein by reference.

[0010] This application claims priority to Chinese Patent Application No. 2025210249654, entitled "Computing Device", filed on May 22, 2025, the entire contents of which are incorporated herein by reference. Technical Field

[0011] This application relates to the field of electronic equipment technology, and more particularly to a chassis and computing device. Background Technology

[0012] Electronic devices generate a lot of heat during operation. An effective heat dissipation structure can ensure that electronic devices operate within a safe temperature range and prevent performance degradation and hardware damage due to overheating.

[0013] In related technologies, fans are used to dissipate heat from electronic devices. However, since the cooling airflow can only flow through a limited number of components, the overall heat dissipation effect of computing devices still needs to be improved. Summary of the Invention

[0014] This application provides a chassis and computing device to solve or alleviate one or more technical problems in the prior art.

[0015] As one aspect of the embodiments of this application, this application provides a chassis for use in a computing device, the computing device including:

[0016] The casing and computing device include a computing module, a power module and a piping assembly disposed within the casing. The computing module includes a liquid cooling module and a computing board. The liquid cooling module has a cooling channel for the flow of cooling medium, and the cooling channel is connected to the piping assembly.

[0017] The chassis is divided into a housing cavity and a conduit cavity. The housing cavity is used to house the computing module and the power supply module, and the conduit cavity is used to house the conduit assembly.

[0018] In one embodiment, the housing includes a partition for dividing the chassis into at least two receiving spaces, one of which is a receiving cavity and the other is a piping cavity.

[0019] In one embodiment, the housing includes a bottom shell and a partition, the bottom shell having a chamber, the partition being disposed within the chamber and dividing the chamber into a receiving chamber and a piping chamber arranged side-by-side in a first direction.

[0020] In one embodiment, the partition and the outer casing are dimensionally identical in a second direction, which is perpendicular to the first direction.

[0021] In one embodiment, the partition of the outer casing has a first conduit port for inserting a conduit housed in the conduit cavity into the conduit cavity.

[0022] In one embodiment, the bottom shell of the housing includes a first panel, which is distributed opposite to and spaced apart from the partition of the housing in a first direction to define a conduit cavity with the partition.

[0023] In one embodiment, the first panel of the housing has a second conduit port for inserting conduits located outside the conduit cavity into the conduit cavity.

[0024] In one embodiment, the number of first conduit ports on the partition is greater than the number of second conduit ports on the first panel.

[0025] In one embodiment, the first pipe socket is provided with a seal, which is used to seal the gap between the pipe and the first pipe socket.

[0026] In one embodiment, the material of the seal includes rubber.

[0027] In one embodiment, the fixing part is a screw hole.

[0028] In one embodiment, the housing further includes a first top cover and a second top cover, the first top cover covering the upper side of the receiving cavity for sealing the receiving cavity, and the second top cover disposed on the upper side of the pipeline cavity for sealing the pipeline cavity.

[0029] In one embodiment, the partition of the outer casing has a snap-fit ​​portion, and the second top cover of the outer casing has a snap-fit ​​mating portion, wherein the snap-fit ​​portion and the snap-fit ​​mating portion are adapted to snap-fit ​​together.

[0030] In one embodiment, the snap-fit ​​part is a snap-fit ​​opening, and the snap-fit ​​mating part is a snap fastener.

[0031] In one embodiment, the size of the receiving cavity in the first direction is larger than the size of the conduit cavity in the first direction.

[0032] In one embodiment, the piping assembly includes an inlet pipe and a return pipe, wherein the inlet pipe is connected to the input end of the cooling channel and the return pipe is connected to the output end of the cooling channel.

[0033] The pipeline cavity is used to accommodate at least a portion of the inlet pipeline and / or at least a portion of the return pipeline.

[0034] In one embodiment, the power module has built-in cooling pipes, which are connected to the cooling channel through a pipe assembly.

[0035] In one embodiment, the piping assembly further includes a first connecting pipe, which is connected between the output end of the cooling piping and the input end of the cooling flow channel; the liquid inlet pipe of the piping assembly is connected to the input end of the cooling piping.

[0036] The conduit cavity is used to accommodate the first connecting conduit.

[0037] In one implementation, the number of computing modules is multiple;

[0038] The piping assembly also includes at least one second connecting pipe, which connects to two adjacent cooling channels connected in series;

[0039] The conduit cavity is used to accommodate at least one second connecting conduit.

[0040] In one embodiment, the first pipe inlet of the outer casing partition and the first pipe inlet of the first panel respectively include a liquid inlet and a liquid return inlet, the liquid inlet being for the liquid inlet pipe to pass through, and the liquid return inlet being for the liquid return pipe to pass through.

[0041] In one embodiment, the housing includes a sliding guide for mounting a computing module and / or a power module.

[0042] In one embodiment, the sliding guide device includes a first slide plate disposed on one side of the computing module adjacent to the power module. The first slide plate has a clearance structure for ensuring that at least a portion of the power connection device of the power module does not spatially contact or overlap with at least a portion of the first slide plate.

[0043] In one embodiment, the clearance structure is a clearance opening, and the end of the first slide plate adjacent to the power connection device has a clearance opening.

[0044] In one embodiment, the outer shell of the chassis has an opening on the side opposite to the piping cavity in a first direction, and the chassis also includes a panel assembly that at least partially covers the opening.

[0045] In one embodiment, the panel assembly has a positioning and clearance structure that cooperates with a portion of the power connection device structure, the positioning and clearance structure being used to position the panel assembly and to make way for the portion of the power connection device structure.

[0046] In one embodiment, the positioning and avoidance structure includes a positioning member, the inner side of the panel assembly has the positioning member, the positioning member has an avoidance slot for avoiding a portion of the structure of the power connection device.

[0047] In one embodiment, the sliding guide device includes a first slide plate, and the first slide plate and the computing module have a first slide structure that cooperates with each other, the first slide structure being used to allow the computing module to slide into the chassis.

[0048] In one embodiment, a first slide plate is disposed within the receiving cavity, dividing the receiving cavity into at least two sub-cavities.

[0049] In one embodiment, the first slide plate divides the receiving cavity into a first sub-cavity and a second sub-cavity distributed along a second direction.

[0050] In one embodiment, a first sub-cavity is used to accommodate a computing module, and a first slide structure is located in the first sub-cavity.

[0051] In one embodiment, the second sub-cavity is used to house the power supply module.

[0052] In one embodiment, the first slide structure includes a first guide ridge and a first slide;

[0053] The liquid cooling module of the computing module has a first guide protrusion extending along the first direction on the first side in the second direction;

[0054] The first slide plate has a first slide extending in a first direction on the side facing the liquid cooling module, and the first slide is used to slide and adapt to the first guide protrusion.

[0055] In one embodiment, the sliding guide device further includes a second slide plate, which is disposed on the side of the computing module away from the power supply module;

[0056] The second slide plate and the computing module have a mutually cooperating second slide structure, which is used to allow the computing module to slide into the chassis.

[0057] In one embodiment, the second slide structure includes a second guide protrusion and a second slide;

[0058] The liquid cooling module of the computing module has a second guide protrusion extending along the first direction on the second side in the second direction;

[0059] The second slide plate has a second slide extending along a first direction on the side facing the liquid cooling module. The second slide is used to slide and adapt to the second guide protrusion.

[0060] In one embodiment, the panel assembly includes a second panel that covers the opening.

[0061] In one embodiment, the panel assembly includes two connecting guides, which are respectively disposed at both ends of the second panel in a second direction. The connecting guides include connecting mating plates having mounting holes. The connecting mating plates are used to be fixed to the connecting mating plates of an adjacent computing device by fasteners passing through the mounting holes.

[0062] In one embodiment, the connecting guide further includes a guide plate extending from the inner side of the connecting mating plate toward the receiving cavity, the guide plate having a plurality of guide pieces spaced apart in a third direction, the guide pieces being bent inward at the ends away from the connecting mating plate.

[0063] In one embodiment, the second slide plate of the housing has a plurality of clearance openings spaced apart in a third direction at the end facing the connecting mating plate. The plurality of clearance openings correspond one-to-one with a plurality of guide pieces of the adjacent guide plate, and the guide pieces are engaged with the corresponding clearance openings.

[0064] In one embodiment, the second panel includes a plate body and at least one flap, the flap extending from at least one side of the plate body in a third-order orientation toward a receiving cavity, the flap including a first guide portion bent inward away from the plate body.

[0065] In one embodiment, the flap includes at least one inwardly bent second guide portion, the at least one second guide portion being located on at least one side of the first guide portion in a second direction.

[0066] As another aspect of the present application, the present application also provides a computing device including the chassis of any of the above.

[0067] In one embodiment, the computing device has at least two computing modules, and the cooling channels of adjacent computing modules are connected.

[0068] In one implementation, the cooling channels of adjacent computing modules are connected in series or in parallel.

[0069] In one implementation, at least two computing modules are stacked on top of each other in a third-party manner.

[0070] In one embodiment, the cooling channels of the computing module of the computing device are connected to the cooling pipes of the power module of the computing device.

[0071] In one implementation, the cooling channels of the computing module are connected in series with the cooling pipes of the power supply module.

[0072] In one embodiment, the cooling channels of the computing device include a first channel and a second channel, the output end of the first channel is connected to the input end of the second channel, and the flow direction of the first channel is opposite to that of the second channel.

[0073] In one embodiment, the input end of the first flow channel, the output end of the second flow channel, the input end of the second flow channel, and the output end of the first flow channel are arranged sequentially on the side of the liquid cooling module facing the pipeline cavity in the first direction.

[0074] In one embodiment, the piping assembly of the computing device includes an inlet pipe and a return pipe, the inlet pipe being connected to the input end of the cooling channel and the return pipe being connected to the output end of the cooling channel.

[0075] In one embodiment, the input end of the first channel of the cooling channel is connected to the output end of the liquid inlet pipe of the pipe assembly, and the output end of the second channel of the cooling channel is connected to the input end of the liquid return pipe of the pipe assembly.

[0076] In one embodiment, the pipeline assembly of the computing device further includes a first connecting pipeline, which is connected between the output end of the cooling pipeline of the power module and the input end of the first flow channel, and the input end of the cooling pipeline is connected to the output end of the liquid inlet pipeline of the pipeline assembly.

[0077] In one embodiment, the cooling channels of the liquid cooling modules of at least two adjacent computing modules are connected in series.

[0078] The piping assembly also includes at least one second connecting pipe that connects to two adjacent cooling channels connected in series.

[0079] In one implementation, the number of second connecting pipes is at least three;

[0080] In two adjacent liquid cooling modules, a second connecting pipe is connected between the output end of the first flow channel of the first liquid cooling module and the input end of the first flow channel of the second liquid cooling module, a second connecting pipe is connected between the output end of the first flow channel of the second liquid cooling module and the input end of the second flow channel of the second liquid cooling module, and a second connecting pipe is connected between the output end of the second flow channel of the second liquid cooling module and the input end of the second flow channel of the first liquid cooling module.

[0081] In one embodiment, the liquid cooling module of the computing device includes a liquid cooling plate, the interior of which defines a cooling channel, and at least one side surface of the liquid cooling plate is formed with a liquid cooling surface; one side of the computing board has a heat-generating component, and the side of the computing board with the heat-generating component is disposed opposite to the liquid cooling surface.

[0082] In one embodiment, the liquid cooling module of the computing device includes at least one cover plate connected to the liquid cooling plate of the liquid cooling module for fixing the computing board to the liquid cooling surface of the liquid cooling plate; the side of the computing board away from the cover plate has heat-generating components.

[0083] In one embodiment, the power module includes a power module and a power connection device for electrically connecting the power module and the computing board.

[0084] In one embodiment, the power connection device has a bent structure for fitting into the chassis.

[0085] In one embodiment, the power connection device includes a second conductive element connected to the computing module. The second conductive element has a bending structure that bends away from a first slide plate of the chassis, and a clearance space is defined between the bending structure and the first slide plate.

[0086] In one embodiment, the power connection device of the computing device and / or the first slide plate of the chassis have a clearance structure, the clearance structure being used to ensure that at least a portion of the power connection device does not spatially contact or overlap with at least a portion of the first slide plate.

[0087] In one embodiment, the clearance structure of the first slide plate includes a first clearance opening and a second clearance opening, and the end of the first slide plate adjacent to the power connection device has the first clearance opening and the second clearance opening.

[0088] The power connection device includes a first conductive element that extends through a first clearance opening, and the power connection device includes a second conductive element that is connected to the computing module and extends through a second clearance opening.

[0089] In one embodiment, the first conductive element of the power connection device connects to at least two stacked computing modules.

[0090] In one embodiment, a first conductive element rigidly connects two stacked computing modules.

[0091] In one embodiment, the power module has a first power supply terminal, and the computing board has a first power connection terminal;

[0092] The first conductive element of the power connection device is electrically connected to the first power supply terminal and the first power connection terminal of the computing board of at least one computing module.

[0093] In one embodiment, the second conductive element of the power connection device connects at least two stacked computing modules.

[0094] In one embodiment, the second conductive element rigidly connects the two stacked computing modules.

[0095] In one embodiment, the power module has a second power supply terminal, and the computing board has a second power connection terminal;

[0096] The second conductive element of the power connection device is electrically connected to the second power supply terminal and the second power connection terminal of the computing board of at least one computing module.

[0097] In one embodiment, the power connection device further includes:

[0098] At least one second conductive component is provided corresponding to at least one computing module. The first conductive component, which includes a first conductive element and a second conductive element, is electrically connected to the computing board of at least one computing module through at least one second conductive component.

[0099] In one embodiment, the second conductive component includes a first electrical connector and a second electrical connector. The first conductive component is electrically connected to a first power terminal of the computing board through the first electrical connector, and the second conductive component is electrically connected to a second power terminal of the computing board through the second electrical connector.

[0100] In one embodiment, the power connection device further includes:

[0101] At least one third conductive component is provided corresponding to at least one computing board of the computing module, and the second conductive component is electrically connected to at least one computing board of the corresponding computing module through at least one third conductive component.

[0102] In one embodiment, the third conductive component includes a first conductive base and a second conductive base. The first electrical connector of the second conductive component is electrically connected to the first power terminal of the computing board through the first conductive base, and the second electrical connector of the second conductive component is electrically connected to the second power terminal of the computing board through the second conductive base.

[0103] In one embodiment, the computing module includes two computing boards spaced apart in a third direction. The computing module is provided with two third conductive components, which correspond one-to-one with the two computing boards. The first electrical connector of the second conductive component is electrically connected to the two first conductive bases corresponding to the two computing boards, and the second electrical connector of the second conductive component is electrically connected to the two second conductive bases corresponding to the two computing boards.

[0104] In one embodiment, the two first conductive seats and two second conductive seats corresponding to the computing module are spaced apart along a second direction, and the two first conductive seats are located between the two second conductive seats in the second direction.

[0105] In one embodiment, the second conductive base located on the outer side engages with the clearance slot of the positioning member on the second panel of the chassis.

[0106] In one embodiment, the power connection device is located on the side of the chassis away from the piping cavity;

[0107] The first power supply terminal and the second power supply terminal of the power module are located on the side of the power module away from the pipeline cavity in the first direction;

[0108] The first and second power terminals of the computing board are located on the side of the computing board away from the pipeline cavity in the first direction.

[0109] In one embodiment, the computing device further includes a control board, which is signal-connected to both the computing module and the power supply module, and is located on the side of the computing module away from the piping assembly.

[0110] In one embodiment, the control board is fixed to the inside of the second panel of the chassis, and the control board is parallel to the second panel.

[0111] In one embodiment, the control board is perpendicular to the bottom plate of the chassis's bottom shell.

[0112] In one embodiment, the control board is positioned close to the computing module in the second direction.

[0113] According to embodiments of this application, the chassis is defined with a receiving cavity and a piping cavity. The receiving cavity is used to house the computing module and the power supply module, and the piping cavity is used to house the piping assembly. This integration of the computing module, power supply module, and piping assembly facilitates maintenance and reduces the space occupied by the chassis. In addition, since the piping assembly can be hidden inside the piping cavity of the chassis, the chassis has a cleaner and more aesthetically pleasing appearance.

[0114] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of this application will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0115] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments disclosed in this application and should not be construed as limiting the scope of this application.

[0116] Figure 1A shows a schematic diagram of the structure of a computing device according to an embodiment of this application;

[0117] Figure 1B shows a partial exploded view of a computing device according to an embodiment of this application;

[0118] Figure 1C shows an overall exploded view of a computing device according to an embodiment of this application;

[0119] Figure 2A shows an exploded view of the chassis of a computing device according to an embodiment of this application;

[0120] Figure 2B shows an exploded view of the casing of a computing device according to an embodiment of this application;

[0121] Figure 3A shows a schematic diagram of the structure of the panel assembly of the chassis of a computing device according to an embodiment of this application;

[0122] Figure 3B shows an exploded view of the panel assembly of the chassis of a computing device according to an embodiment of this application;

[0123] Figure 4A shows a cross-sectional view of the liquid cooling module of the computing module of the computing device according to an embodiment of the present application;

[0124] Figures 4B, 4C, 4D, and 4E show cross-sectional views of liquid cooling plates of different examples of computing devices according to embodiments of this application;

[0125] Figure 4F shows an exploded view of the computing module of a computing device according to an embodiment of this application;

[0126] Figure 4G shows a schematic diagram of the computing board of a computing device according to an embodiment of this application;

[0127] Figure 4H shows a cross-sectional view of a computing module of a computing device according to an embodiment of this application;

[0128] Figure 4I shows an enlarged view of region A in Figure 4H;

[0129] Figure 4J shows an enlarged view of region B in Figure 4H;

[0130] Figures 4K, 4L, and 4M respectively show schematic diagrams of different examples of computing modules of a computing device according to embodiments of this application;

[0131] Figure 4N shows a schematic diagram of the structure of the cover plate of the computing module of the computing device according to an embodiment of the present application;

[0132] Figure 5A shows a partial structural schematic diagram of a computing device according to an embodiment of this application;

[0133] Figure 5B shows an exploded view of a power connection device for a computing device installed in a computing device according to an embodiment of this application.

[0134] Figure 5C shows a schematic diagram of the structure of a third conductive component of a computing device according to an embodiment of the present application mounted on a computing board;

[0135] Figure 5D shows a schematic diagram of the overall structure of a computing device according to an embodiment of this application;

[0136] Figure 5E shows a schematic diagram of the structure of a second conductive component of a computing device according to an embodiment of this application;

[0137] Figure 5F shows a schematic diagram of another power connection device for a computing device according to an embodiment of the present application, installed on the computing device;

[0138] Figure 5G shows an exploded view of another power connection device of the computing device according to an embodiment of the present application, installed on the computing device;

[0139] Figure 5H shows a schematic diagram of the power module of a computing device according to an embodiment of the present application from one side view.

[0140] Figure 5I shows a structural schematic diagram of a power module according to an embodiment of this application from another side view.

[0141] Explanation of reference numerals in the attached drawings: 1. Computing device; 11. Chassis; 100. Liquid cooling module; 110. Liquid cooling plate; 111. Cooling channel; 1111. First channel; 1111a. First sub-channel; 1112. Second channel; 1112a. Second sub-channel; 1112b. First clearance area; 1112c. Second clearance area; 112. Liquid cooling surface; 113. Positioning hole; 114. First liquid inlet; 115. Second liquid inlet; 116. First liquid outlet; 117. 120. Second liquid outlet; 121. Cover plate; 122. First through hole; 123. Recessed part; 124. Groove; 125. Support part; 126. Support pad; 127. Support arm; 128. Support protrusion; 129. Heat dissipation hole; 120. Fastener; 131. Connecting post; 132. Limiting boss; 133. Locking part; 134. Second guide protrusion; 135. First guide protrusion; 140. Turbulence structure; 20. Computing module; 21. First computing module; 22. Second computing module; 200. Computing board; 201. First computing board; 202. Second computing board; 210. Computing chip; 220. Second through hole; 230. Power connection assembly; 231. First power connection; 232. Second power connection; 30. Piping assembly; 31. Liquid inlet pipe; 32. Liquid return pipe; 33. Liquid inlet connector; 331. Nut; 34. Liquid return connector; 351. First connecting pipe; 352. Second connecting pipe; 36. Connecting connector; 400. Power connection device; 40. Power module; 400. Power connection device; 410. First conductive component; 411. First conductive element; 412. Second conductive element; 412a. Bending structure; 4111. First conductive plate; 4112. Second conductive plate; 4112a. First conductive area; 4113. First connecting plate; 4121. Third conductive plate; 4122. Fourth conductive plate; 4123. Second connecting plate; 4122a. Second conductive area; 420. Second conductive component; 421. First electrical connector; 422. Second electrical connector; 421a. First electrical contact surface; 422a. Third electrical contact surface; 4211. First folded edge; 4212. Second folded edge; 4221. Third folded edge; 4222. Fourth folded edge; 42111. First electrical connecting plate; 42211. Second electrical connecting plate; 430. Third conductive component; 431. First conductive base; 432. Second conductive base; 4311. Fifth folded edge; 4312. Sixth folded edge; 4321. Seventh folded edge; 4322. Eighth folded edge; 440. Fastener; 4211a. First connecting hole; 4211b. Second connecting hole; 430a. Third connecting hole; 430b. Fourth connecting hole; 500. Power module; 501. Protrusion; 502. Grip; 503. Power switch; 504. Electrical connection terminal; 510. Power supply terminal assembly; 511. First power supply terminal; 512. Second power supply terminal; 520. Power input terminal; 60. Housing;61. Bottom shell; 62. Top cover body; 621. First top cover; 622. Partition; 6221. Buckle; 63. First slide plate; 631. First slide; 632. First clearance opening; 633. Second clearance opening; 634. Third clearance opening; 64. Second slide plate; 641. Second slide; 642. Clearance opening; 65. Second top cover; 651. Buckle; 601. Receiving cavity; 602. First sub-cavity; 603. Second sub-cavity; 604. Piping cavity; 605. Liquid inlet; 606. Liquid return inlet; 607. Connection inlet; 608. Seal; 609. Rivet hole; 610. Detection port; 611. First panel; 612. Side plate; 613. Bottom plate; 614. Protrusion; 615. Recess; 616. Through hole; 617. First fixing post; 618. Through hole; 619. Indicator light; 620. Opening; 70. Panel assembly; 71. Second panel; 71a. First hole; 71b. Second hole; 71c. Third hole; 71d. Fourth hole; 711. Panel body; 712. Folding piece; 7121. First guide part; 7122. Second guide part; 713. Second fixing post; 712a. First notch; 712b. Second notch; 712c. Third notch; 72. Positioning component; 721. Positioning part; 722. Clearance slot; 73. Connecting guide component; 731. Connecting mating plate; 7311. Mounting hole; 732. Guide plate; 7321. Guide piece; 74. Handle; 80. Control panel; X. First direction; Y. Second direction; Z. Third direction. Detailed Implementation

[0142] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this application. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0143] This application provides a computing device that can process complex algorithms and achieve high-efficiency computing capabilities. The computing device includes a chassis, a computing module, a power supply module, and a piping assembly housed within the chassis casing. The computing module includes a liquid cooling module and a computing board. The liquid cooling module has cooling channels for the flow of cooling medium, and these channels are connected to the piping assembly. The liquid cooling module dissipates heat from the computing board through its cooling channels, ensuring that the computing board operates within a safe temperature range and preventing performance degradation or damage due to overheating.

[0144] In related technologies, computing modules, power supply modules, and piping assemblies are often dispersed within computing devices, resulting in low integration and increased space waste. This also complicates the maintenance and upgrades of the computing devices. Furthermore, the piping assemblies are located on the outside of the chassis, affecting the aesthetics of the computing device.

[0145] The computing device of this application embodiment has a chassis with a housing cavity and a piping cavity. The computing module and power supply module are both integrated within the housing cavity, resulting in higher integration, higher space utilization, and easier maintenance. In addition, the piping assembly is housed within the piping cavity and is not exposed, making the computing device more streamlined and aesthetically pleasing.

[0146] The following detailed description uses specific embodiments and illustrations.

[0147] Figure 1A shows a structural schematic diagram of a computing device 1 according to an embodiment of the present application, Figure 1B shows a partially exploded schematic diagram of a computing device 1 according to an embodiment of the present application, and Figure 1C shows an overall exploded schematic diagram of a computing device 1 according to an embodiment of the present application.

[0148] As shown in Figure 1C, and in conjunction with Figures 1A and 1B, the computing device 1 of this embodiment includes a chassis 11, a computing module 20, and a power supply module 40. The computing module 20 includes a liquid cooling module 100 and a computing board 200. The liquid cooling module 100 has a cooling channel 111 (as shown in Figure 4A), which is used for the flow of cooling medium to dissipate heat from the computing board 200.

[0149] The chassis 11 is defined by a receiving cavity 601 and a conduit cavity 604. The receiving cavity 601 is used to accommodate the computing module 20 and the power supply module 40, and the conduit cavity 604 is used to accommodate the conduit assembly 30, thereby integrating the computing module 20, the power supply module 40 and the conduit assembly 30, which is easy to maintain and reduces the space occupied by the chassis 11. In addition, since the conduit assembly 30 can be hidden in the conduit cavity 604 of the chassis 11, the appearance of the chassis 11 is more neat and beautiful.

[0150] Furthermore, at least a portion of the computing module 20 and at least a portion of the power supply module 40 are flush with each other, meaning that at least a portion of the computing module 20 and at least a portion of the power supply module 40 can be approximately located on the same plane. This allows for a more compact arrangement of the computing module 20 and the power supply module 40, thereby improving the space utilization of the chassis 11. Alternatively, at least a portion of the computing module 20 and at least a portion of the power supply module 40 can not be flush with each other, meaning that at least a portion of the computing module 20 and at least a portion of the power supply module 40 are not located on the same plane. This also allows for a more reasonable placement of the computing module 20 and the power supply module 40 within the chassis 11.

[0151] Figure 2A shows an exploded view of the chassis 11 of the computing device 1 according to an embodiment of the present application. Figure 2B shows an exploded view of the outer shell 60 of the chassis 11 of the computing device 1 according to an embodiment of the present application. Figure 3A shows a structural schematic diagram of the panel assembly 70 of the chassis 11 of the computing device 1 according to an embodiment of the present application. Figure 3B shows an exploded view of the panel assembly 70 of the chassis 11 of the computing device 1 according to an embodiment of the present application.

[0152] The structure of the chassis 11 will be described in detail below with reference to Figures 2A to 3B.

[0153] As shown in Figure 2A and in conjunction with Figure 2B, the chassis 11 includes an outer shell 60, and the outer shell 60 includes a partition 622. The partition 622 is used to divide the chassis 11 into at least two receiving spaces, one of which is a receiving cavity 601, and the other is a piping cavity 604. The partition 622 isolates the receiving cavity 601 and the piping cavity 604, allowing the computing module 20 and power supply module 40 in the receiving cavity 601 to remain spatially independent from the piping assembly 30 in the piping cavity 604. This prevents accidental leakage of cooling medium from directly contacting the computing module 20 and power supply module 40, improving safety, and also facilitates separate maintenance of different modules, improving maintenance convenience.

[0154] In some examples, the housing 60 may be integrally formed to create at least two receiving spaces divided by a partition 622.

[0155] In some examples, the housing 60 includes a bottom shell 61 and a partition 622. The bottom shell 61 has a chamber, and the partition 622 is disposed in the chamber, dividing the chamber into a receiving chamber 601 and a conduit chamber 604 arranged side by side in a first direction X.

[0156] In some examples, the partition 622 has the same dimensions as the housing 60 in the second direction Y, where the second direction Y is perpendicular to the first direction X. That is, the partition 622 extends from one side of the housing 60 in the second direction Y to the opposite side, making full use of the space of the housing 60 in the second direction Y and improving the space utilization of the chassis 11.

[0157] In some examples, the size of the receiving cavity 601 in the first direction X is larger than the size of the conduit cavity 604 in the first direction X, so as to increase the space of the receiving cavity 601 and provide sufficient space for the computing module 20 and the power module 40.

[0158] For example, as shown in Figures 2A and 2B, in order to close the receiving cavity 601 and the pipeline cavity 604, the upper side of the receiving cavity 601 and the upper side of the pipeline cavity 604 can be covered by a first top cover 621 and a second top cover 65, respectively. The first top cover 621, the second top cover 65, together with the bottom shell 61 and the partition 622, define the mutually isolated receiving cavity 601 and pipeline cavity 604.

[0159] In some examples, as shown in Figures 2A and 2B, the first top cover 621 and the partition 622 can be integrally formed, that is, the first top cover 621 and the partition 622 are a single piece, namely the top cover body 62, to simplify assembly.

[0160] In other examples, the first top cover 621 and the partition 622 may be separate components, for example, assembled by fasteners, welding or snap-fitting, and are not limited to this.

[0161] In some examples, as shown in Figures 2A and 2B, the second top cover 65 can be separately configured from the partition 622, the first top cover 621, and the bottom shell 61. That is, the second top cover 65 is installed as an independent component on the partition 622, the first top cover 621, and the bottom shell 61, so that the second top cover 65 can be opened separately to expose the pipeline cavity 604, which facilitates the maintenance of the pipeline assembly 30 inside the pipeline cavity 604.

[0162] In other examples, the second top cover 65 can also be integrally set with the first top cover 621. By disassembling and assembling the integrally set second top cover 65 and first top cover 621, it is convenient to maintain and manage the pipeline assembly 30 in the pipeline cavity 604 and the computing module 20 and power supply module in the receiving cavity 601.

[0163] In the example where the second top cover 65 and the partition 622 are separately configured, the second top cover 65 and the partition 622 are connected by a connecting structure, which can be a fastener, a snap-fit, a magnetic component, etc., and is not limited to these. Among them, the fastener can be a bolt, a screw, a rivet, a pin, etc., and is not limited to these.

[0164] For example, the partition 622 has a snap-fit ​​portion, and the second top cover 65 has a snap-fit ​​mating portion. The snap-fit ​​portion and the snap-fit ​​mating portion are adapted to snap-fit ​​together to realize the connection between the second top cover 65 and the partition 622.

[0165] In a specific example, one of the snap-fit ​​part and the snap-fit ​​mating part is a snap-fit ​​opening, and the other is a snap fastener. As shown in Figures 2A and 2B, the second top cover 65 and the partition 622 can be connected by a snap fastener 651. That is, one of the second top cover 65 and the partition 622 has a snap fastener 651, and the other has a snap-fit ​​opening 6221. The snap fastener 651 and the snap fastener 6221 are adapted to snap together, which simplifies the disassembly and assembly of the partition 622 and facilitates the maintenance of the pipeline assembly 30. As shown in Figure 2A, the second top cover 65 has multiple snap fasteners 651 spaced apart in the second direction Y on one side in the first direction X. As shown in Figure 2B, the partition 622 has multiple snap fasteners 6221 that correspond one-to-one with the multiple snap fasteners 651. The snap fasteners 651 are adapted to snap together with the corresponding snap fasteners 6221 to fasten the second top cover 65 and the partition 622.

[0166] For example, as shown in Figures 2A and 2B, the bottom shell 61 includes a first panel 611, which is opposite to and spaced apart from the partition 622 in the first direction X, so as to define the pipeline cavity 604 together with the partition 622. That is, the first panel 611, the partition 622, the second top cover 65 and the bottom shell 61 together form the pipeline cavity 604, which closes the pipeline cavity 604.

[0167] For example, as shown in FIG2B, the bottom shell 61 may further include a bottom plate 613 and two side plates 612, the two side plates 612 being connected to both sides of the bottom plate 613 in the second direction Y, and the first panel 611 being connected to one side of the bottom plate 613 in the first direction X.

[0168] In some examples, the base plate 613, the two side plates 612, and the first panel 611 of the base shell 61 can be integrally formed to improve structural strength and assembly efficiency. In other examples, the base plate 613, the two side plates 612, and the first panel 611 of the base shell 61 can be separate components, for example, connected by fasteners or welding, and are not limited to this.

[0169] In some examples, the partition 622 can be integrally formed with the base plate 613 and the side plate 612 or can be set separately.

[0170] In the example of the split configuration, the partition 622 may have multiple fixing parts, and the partition 622 is fixed to the bottom plate 613 and the side plate 612 respectively through the fixing parts.

[0171] In a specific example, the partition 622 has multiple first fixing parts at both ends in the second direction Y, and the partition 622 is fixed to the side plate 612 through the multiple first fixing parts. The lower end of the partition 622 has multiple second fixing parts, and the partition 622 is fixed to the bottom plate 613 through the multiple second fixing parts.

[0172] In a specific example, the fixing part can be a screw hole.

[0173] For example, in order to form a medium circulation loop between the medium cooling device outside the chassis 11 and the piping assembly 30 inside the chassis 11 and the cooling channel 111, the area of ​​the housing 60 of the chassis 11 defining the receiving cavity 601 needs to have a first pipe socket, and the area of ​​the housing 60 of the chassis 11 defining the piping cavity 604 needs to have a second pipe socket.

[0174] In some examples, the partition 622 has a first pipe inlet to connect the cooling channel 111 of the computing module 20 within the housing 601 to the piping assembly within the external piping cavity 604. In other examples, the location of the first pipe inlet may be on the first top cover 621, but is not limited to this; for example, the location of the first pipe inlet may also be on the side plate 612 or the bottom plate 613.

[0175] In some examples, a second pipe socket may be formed on the first panel 611 to connect the pipe assembly within the pipe cavity 604 to the media cooling device outside the chassis 11. In other examples, the location of the second pipe socket may be on the side panel 612 or the bottom plate 613, and is not limited thereto; for example, the location of the second pipe socket may also be on the second top cover 65.

[0176] In a specific example, as shown in Figure 2B, and in conjunction with Figures 1A and 1B, both the first and second pipe inlets include an inlet 605 and a return 606, meaning the first panel 611 and the partition 622 respectively have an inlet 605 and a return 606. Correspondingly, the pipe assembly 30 includes an inlet pipe 31 and a return pipe 32, with the inlet 605 for the inlet pipe 31 to pass through and the return 606 for the return pipe 32 to pass through.

[0177] The inlet pipe 31 is connected to the input end of the cooling channel 111, and the return pipe 32 is connected to the output end of the cooling channel 111. The pipe cavity 604 is used to accommodate at least a portion of the inlet pipe 31 and / or at least a portion of the return pipe 32.

[0178] In some examples, as shown in Figure 1A, both the inlet line 31 and the return line 32 are housed within the pipe cavity 604. In other examples, one of the inlet line 31 and the return line 32 is housed within the pipe cavity 604, while the other may be located outside the pipe cavity 604.

[0179] In some examples, the liquid inlet pipe 31 can be directly connected to the input end of the cooling channel 111, that is, the cooling medium only cools the computing board 200 of the computing module and does not flow through the power module 40.

[0180] In other examples, the power module 40 has built-in cooling pipes (not shown), which are connected to the cooling channel 111 via pipe assembly 30. The cooling medium flows through the cooling pipes, pipe assembly 30, and cooling channel 111, which can simultaneously dissipate heat from the power module 40 and the computing board 200, ensuring the stability of the computing device 1 and thus improving the computing efficiency of the computing device 1.

[0181] In other examples, the liquid inlet pipe 31 can be connected to the cooling channel 111 through the cooling pipe. That is, the cooling medium flows through the liquid inlet pipe 31 first through the cooling pipe to dissipate heat from the power module 40, and then flows through the cooling channel 111 to dissipate heat from the computing board 200.

[0182] In other examples, the liquid inlet pipe 31 can be connected to the cooling pipe through the cooling channel 111. That is, the cooling medium flows through the liquid inlet pipe 31 first through the cooling channel 111 to dissipate heat from the computing board 200, and then flows through the cooling pipe to dissipate heat from the power module 40.

[0183] In a specific example, as shown in Figures 1A and 1B, the pipe assembly 30 further includes a first connecting pipe 351, which is housed in the pipe cavity 604 and is connected between the output end of the cooling pipe and the input end of the cooling channel 111. The liquid inlet pipe 31 of the pipe assembly 30 is connected to the input end of the cooling pipe to achieve communication between the cooling pipe located inside the power module 40 and the cooling channel 111 located inside the computing module 20.

[0184] In some examples, when there are multiple computing modules 20, there are correspondingly multiple cooling channels 111. To facilitate the connection between multiple cooling channels 111, the pipe group 30 also includes at least one second connecting pipe 352. The second connecting pipe 352 is connected between two adjacent cooling channels in series, and the pipe cavity is used to accommodate at least one second connecting pipe 352.

[0185] For example, to facilitate the connection between the first connecting pipe 351 and the cooling pipe inside the power module 40, and to facilitate the connection between the second connecting pipe 352 and the cooling channel 111 inside the computing module 20, the first pipe socket on the partition 622 includes a plurality of connecting sockets 607, that is, a plurality of connecting sockets 607 are provided on the partition 622, one of which is used for the insertion of the first connecting pipe 351, and the other connecting sockets 607 are used for the insertion of the second connecting pipe 352.

[0186] Since some of the first pipe connectors (partial connection connectors 607) on the partition 622 are for inserting the first connection pipe 351 to connect the cooling pipes inside the power module 40 to the input end of the cooling flow channel 111 inside the computing module 20, and another part of the first pipe connectors (partial connection connectors 607) on the partition 622 are for inserting the second connection pipe 352 to connect the cooling flow channels 111 of the multiple computing modules 20, and yet another part of the first pipe connectors on the partition 622 (liquid inlet connector 605 and liquid return connector 606) are for inserting the liquid inlet pipe 31 and the liquid return pipe 32, while the second pipe connectors on the first panel 611 only need to accommodate the insertion of the liquid inlet pipe 31 and the liquid return pipe 32, the number of first pipe connectors on the partition 622 should be greater than the number of second pipe connectors on the first panel 611.

[0187] For example, as shown in Figures 1A and 4A, the input and output ends of the first connecting pipe 351 are respectively provided with connecting connectors 36 to realize the series connection of the cooling pipe of the power module 40 and the cooling channel 111 of the computing module 20. The input and output ends of the second connecting pipe 352 are respectively provided with connecting connectors 36 to realize the series connection between the cooling channels 111 of adjacent computing modules 20. The connecting connectors 36 are inserted into the corresponding connecting sockets 607.

[0188] For example, as shown in FIG2B, the first pipe inlet (including the connecting inlet 607 and the liquid inlet 604 and the liquid return inlet 606 on the partition 622) is provided with a sealing element 608. The sealing element 608 is used to seal the gap between the pipe and the first pipe inlet to prevent the cooling medium from leaking out.

[0189] In some examples, seal 608 can be a structural component, such as an O-ring, V-ring, or U-seal, and is not limited thereto. The material of seal 608 can be rubber, polyurethane, or polytetrafluoroethylene, and is not limited thereto.

[0190] In other examples, the seal 608 may be a packing material, such as graphite, fiber, or polytetrafluoroethylene packing, and is not limited to this.

[0191] For example, as shown in Figures 1B and 4A, the inlet pipe 31 is provided with an inlet connector 33 at its input end and an outlet pipe 32 is provided with an outlet connector 34 at its input end and an outlet pipe 32. The inlet port 605 is used to insert the inlet connector 33, and the outlet port 606 is used to insert the outlet connector 34. That is, an inlet connector 33 and an outlet connector 34 are respectively inserted at the inlet port 605 and the outlet port 606 of the first panel 611, and an inlet connector 33 and an outlet connector 34 are respectively inserted at the inlet port 605 and the outlet port 606 of the partition 622. In the example where the inlet pipe 31 is connected to the cooling channel 111 via the cooling pipe, the inlet connector 33 inserted at the inlet port 605 on the partition 622 can be connected to the input end of the cooling pipe, and the return connector 34 inserted at the return port 606 on the partition 622 is connected to the output end of the cooling channel 111. This forms a media circulation loop between the external media cooling device of the chassis 11 and the internal piping group 30, cooling pipes, and cooling channel 111, ensuring that the cooling medium can continuously cool the computing device 1.

[0192] In the example where the liquid inlet pipe 31 is directly connected to the cooling channel 111, the liquid inlet connector 33 inserted at the liquid inlet port 605 on the partition 622 can be connected to the input end of the cooling channel 111, and the liquid return connector 34 inserted at the liquid return port 606 on the partition 622 is connected to the output end of the cooling channel 111.

[0193] The liquid inlet connector 33 inserted at the liquid inlet port 605 of the first panel 611 is connected to the output end of the external medium cooling device through a pipeline, and the liquid return connector 34 inserted at the liquid return port 606 of the first panel 611 is connected to the liquid return end of the external medium cooling device through a pipeline.

[0194] In some examples, the liquid inlet 605, liquid return 606, and connection 607 can be regular shapes, such as rectangles, squares, circles, ellipses, etc., and are not limited to these.

[0195] In other examples, the inlet port 605, the return port 606, and the connection port 607 may be irregularly shaped, such as cross-shaped, star-shaped, etc., and are not limited to these.

[0196] In some examples, as shown in Figure 2B and in conjunction with Figure 1A, two inlet ports 605 face each other in the first direction X, and two return ports 606 face each other in the first direction X. Accordingly, the inlet pipe 31 and the return pipe 32 can be straight pipes to reduce the flow resistance of the cooling medium, reduce pipe wear, and simplify pipe installation.

[0197] In other examples, the two inlet ports 605 may be staggered in the first direction X, and the two return ports 606 may be staggered in the first direction X. Accordingly, the inlet pipe 31 and the return pipe 32 may be bends. This is merely an example and does not constitute a limitation of this application.

[0198] In some examples, the inlet connector 33 and the return connector 34 can be fixed to the inlet port 605 and the return port 606 respectively by fasteners. That is, fasteners are respectively fitted on both ends of the inlet connector 33 at the inlet port 605, and fasteners are respectively fitted on both ends of the return connector 34 at the return port 606, so as to keep the inlet connector 33 and the return connector 34 stable and facilitate their disassembly and assembly.

[0199] In some examples, the fastener can be a bolt, screw, rivet, or nut. In other examples, the fastener can be a clamp or jig, and is not limited to these. In a specific example, as shown in Figure 1B, the fastener can be a nut 331, and the outer peripheral walls of the inlet connector 33 and the return connector 34 are threaded. The inlet connector 33 is fitted with a nut 331 on one side of the inlet socket 605, and the inlet connector 33 is also fitted with a nut 331 on the other side of the inlet socket 605 (see Figure 2B) (the nut on the other side is not shown in Figure 1B). The nuts 331 on both sides abut tightly against the two sides of the first panel 611, thereby securing the inlet connector 33 to the inlet socket 605.

[0200] In other examples, the inlet connector 33 and the return connector 34 can be fixed to the inlet port 605 and the return port 606 by a fixing structure, which can be a magnetic component, adhesive or buckle, etc., and is not limited to these.

[0201] For example, as shown in Figures 1A, 1B and 2B, the partition 622 also has a detection port 610 for a detection pipe to pass through and communicate with the cooling channel 111. The first panel 611 may have a through hole (not shown) through which the detection pipe extends to the outside of the chassis 11 to detect the temperature and / or flow rate of the cooling medium in the cooling channel 111 outside the chassis 11 by means of a temperature sensor and / or a flow sensor.

[0202] To facilitate monitoring of the temperature and / or flow rate of the cooling medium, a test circuit board (not shown) may be installed inside or outside the chassis 11. This test circuit board is connected to a temperature sensor and / or a flow sensor. In some examples, the test circuit board may be mounted externally to the chassis 11, for example, on the outer surface of the first panel 611 or the outer surface of the first top cover 621 of the chassis 11, but is not limited thereto. In other examples, the test circuit board may be mounted internally to the chassis 11, for example, on the inner side of the first panel 611 or the inner side of the side panel 612 of the chassis 11, and is not limited thereto.

[0203] In a specific example, the test circuit board is disposed on the inner side of the first panel 611, as shown in Figure 2A. The inner side of the first panel 611 has a first fixing post 617, and the test circuit board is fixed to the inner side of the first panel 611 by fasteners fastened to the first fixing post 617. This is only an example; the test circuit board can also be fixed to the first panel 611 in other ways, such as snap-fit ​​connection or magnetic connection, and is not limited to this.

[0204] Referring again to Figure 2A, the bottom of the base 61 may have a through-hole 616, which communicates with the pipe cavity 604. In some examples, the through-hole 616 is used for a detection line to pass through, which is used to electrically connect an external temperature sensor and / or flow sensor to a test circuit board. This allows the temperature and / or flow rate of the cooling medium in the cooling channel 111 to be transmitted to the test circuit board, which displays the temperature and / or flow rate of the cooling medium for user convenience.

[0205] In some examples, the through hole 616 can be used for leakage, so that when a leak occurs in the piping assembly 30, the cooling medium in the piping cavity 604 can flow out through the through hole 616 to prevent the cooling medium from depositing in the piping cavity 604.

[0206] In some examples, referring to Figures 2A and 2B, the via 616 may be located in the area of ​​the bottom plate 613 of the bottom shell 61 corresponding to the conduit cavity 604, that is, the bottom of the conduit cavity 604 has a via 616, and the test line passes through the via 616 to enter the conduit cavity 604, which facilitates the connection of the test line to the test circuit board inside the conduit cavity 604.

[0207] In a specific example, the through hole 616 can extend upward from the base plate 613 to the first panel 611, that is, the through hole 616 is formed on the base plate 613 and the first panel 611, so as to increase the size of the entire through hole 616 while reducing the size of the opening on the base plate 613 and the first panel 611, so as to facilitate the passage of the detection line.

[0208] In other examples, the through hole 616 may be formed in the area corresponding to either side plate 612 and the conduit cavity 604, and is not limited thereto. For example, the through hole 616 may also be formed on the third top cover 65.

[0209] The test circuit board may have an indicator component that can emit light or sound signals to show the user the flow status of the cooling medium.

[0210] In a specific example, as shown in Figure 1A, the indicating component is an indicator light 619, that is, the test circuit board has an indicator light 619, the first panel 611 has a through hole 618, the through hole 618 is used to expose the indicator light 619 of the test board, the color or on / off state of the indicator light 619 can indicate different states of the temperature and / or flow of the cooling medium, so as to intuitively show the user the flow status of the cooling medium.

[0211] For example, the outer shell 60 of the chassis 11 also includes a sliding guide device for mounting the computing module 20 and / or the power module 40. This sliding guide device can be screw-fixed, snap-fitted, or guided, but is not limited to the examples listed above. Specifically, as shown in Figure 2A and in conjunction with Figure 1C, the sliding guide device includes a first slide plate 63. The first slide plate 63 and the computing module 20 have a mutually cooperating first slide structure. The first slide structure is used to allow the computing module 20 to slide into the chassis, facilitating the assembly of the computing module 20 within the chassis.

[0212] For example, a first slide plate 63 is disposed within the receiving cavity 601, dividing the receiving cavity 601 into at least two sub-cavities to provide independent receiving spaces for the computing module 20 and the power supply module 40, respectively. In a specific example, the first slide plate 63 divides the receiving cavity 601 into a first sub-cavity 602 and a second sub-cavity 603 distributed in the second direction Y. The first sub-cavity 602 is used to accommodate the computing module 20, and the second sub-cavity 603 is used to accommodate the power supply module. In this way, the computing module 20 and the power supply module are isolated by the first slide plate 63, avoiding interference between the two in spatial position, while improving structural compactness and increasing the space utilization of the chassis 11.

[0213] In this embodiment, interference refers to at least a portion of the structures of the computing module 20 and the power module being in spatial contact or overlapping. The first slide plate 63 isolates the two, thereby preventing the computing module 20 and the power module from contacting or overlapping in space, improving the ease of installation and structural compactness of the computing module 20 and the power module.

[0214] In some examples, the first slide plate 63 is disposed on the side of the computing module 20 adjacent to the power module 40. The first slide plate 63 may be a straight plate extending in a first direction. In other examples, the first slide plate 63 may be a curved plate whose overall extension trend is in the first direction.

[0215] In some examples, the first slide structure that cooperates between the first slide plate 63 and the computing module 20 is a combination of a slide and a ridge, that is, the first slide structure includes a first slide and a first guide ridge. In a specific example, as shown in FIG4F, the liquid cooling module 100 of the computing module 20 has a first guide ridge 135 extending along the first direction X on the first side in the second direction Y. As shown in FIG2B and in conjunction with FIG1C, the side of the first slide plate 63 facing the liquid cooling module 100 has a first slide 631 extending along the first direction X. The first slide 631 is used to slide and adapt to the first guide ridge 135 to guide the first side of the computing module 20 in the second direction Y. In other examples, the first slide structure can be a combination of a slide rail and a slider or a combination of a roller and a slide rail, etc., and is not limited to these.

[0216] To maintain the stability of the assembly of the computing module 20, in some examples, continuing to refer to FIG2B, the sliding guide device further includes a second slide plate 64, which is disposed on the side of the computing module 20 away from the power supply module 40. The second slide plate 64 and the computing module 20 have a mutually cooperating second slide structure for the computing module 20 to slide into the chassis.

[0217] The second slide plate 64 is disposed inside the outer casing 60, located on the side of the first sub-cavity 602 opposite to the first slide plate 63 in the second direction Y. The second slide plate 64 can guide the computing module 20 on the second side in the second direction Y.

[0218] In some examples, the second slide structure in which the second slide plate 64 and the computing module 20 cooperate is a combination of a slide and a ridge, that is, the second slide structure includes a second slide and a second guide ridge.

[0219] In a specific example, as shown in Figure 1C, the liquid cooling plate of the liquid cooling module 100 has a second guide protrusion 134 extending along the first direction X on its second side in the second direction Y. As shown in Figure 2B, the second slide plate 64 has a second slide rail 641 extending along the first direction X, which is used to slide and adapt to the second guide protrusion 134. Thus, through the cooperation of the first slide rail 631 and the second slide rail 641 with the first guide protrusion 135 and the second guide protrusion 134 of the liquid cooling plate, the computing module 20 is guided into the first sub-cavity 602, facilitating the assembly of the computing module 20.

[0220] To increase the compactness of the internal components of the chassis 60 and improve the space utilization of the chassis 60, the first slide plate 63 has a clearance structure. The clearance structure is used to ensure that at least a portion of the power connection device 400 of the power module 40 (as shown in FIG. 5A) does not spatially contact or overlap with at least a portion of the first slide plate 63. By providing clearance structures on the first slide plate 63 and / or the power connection device 400, the two can avoid each other, thereby preventing the first slide plate 63 from affecting the installation of the power connection device 400, improving the installation convenience and structural compactness of the power connection device 400 in the computing device 1.

[0221] In some examples, the clearance structure may be located at the end of the first slide plate 63 adjacent to the power connection device 400. Specifically, the clearance structure may be a clearance opening that penetrates the first slide plate 63 to connect the two sub-cavities. Part of the structure of the power connection device 400 may pass through the clearance opening so that the power connection device 400 can be electrically connected to the power supply terminal group of the power module 500 (see FIG. 1C) and the power connection terminal group of the computing module 20 (see FIG. 1C) in the two sub-cavities, respectively.

[0222] In other examples, a clearance structure may be provided on the power connection device 400. Specifically, the clearance structure may be a bent structure, wherein the power connection device 400 is configured as a bent structure at a position corresponding to the first slide plate 63, so that the power connection device 400 can clearance with the end of the power connection device 400 adjacent to the first slide plate 63 through the bent structure.

[0223] In a specific example, as shown in FIG5F, the power connection device 400 has a bending structure 412a, which can be bypassed by the outer side of the end of the first slide plate 63 away from the conduit cavity 604, thereby avoiding the first slide plate 63.

[0224] It should be noted that in other examples of this application, avoidance structures can be provided on the first slide plate 63 and the power connection device 400, respectively. For example, the first slide plate 63 is provided with an avoidance notch, and the power connection device 400 is provided with a bending structure to avoid contact between the first slide plate 63 and the power connection device 400. In a specific example, the avoidance opening may include a first avoidance opening 632 on the first slide plate 63. Specifically, as shown in FIG2B and in conjunction with FIG2A, the end of the first slide plate 63 away from the pipeline cavity 604 has a first avoidance opening 632. The first avoidance opening 632 is used to avoid the first conductive member 411 of the power connection device 400, so that the first conductive member 411 (see FIG5A) can be electrically connected to the first power supply terminal 511 (see FIG5B) and the first power connection terminal 231 (see FIG5C) located on opposite sides of the first slide plate 63 in the second direction Y, respectively.

[0225] Referring to Figures 5B and 5C, the power module of computing device 1 includes a power module 500 and a power connection device 400. The power module 500 has a first power supply terminal 511, and the power connection device 400 includes a first conductive element 411. The computing board 200 has a first power receiving terminal 231. The first conductive element 411 is connected to the first power supply terminal 511 and the first power receiving terminal 231. A clearance opening 632 (see Figure 2B) of the first slide plate 63 provides clearance space for the first conductive element 411. The first conductive element 411 extends through the first clearance opening 632 toward the computing board 200, increasing compactness. At the same time, the first clearance opening 632 provides positioning for the assembly of the first conductive element 411.

[0226] In some examples, the clearance may include a second clearance 633 on the first slide plate 60. Specifically, as shown in FIG2B, the end of the first slide plate 63 facing away from the conduit cavity 604 has a second clearance 633, which is used for the passage of the second conductive element 412 (as shown in FIG5B). Referring to FIGS. 5B and 5C, the power module 500 of the power supply module has a second power supply terminal 512, the power connection device 400 of the power supply module includes the second conductive element 412, and the computing board 200 has a second power connection terminal 232. The second conductive element 412 is connected to the second power supply terminal 512 and the second power connection terminal 232. The second conductive element 412 extends towards the computing board 200 through the second clearance 633 (see FIG2B) of the first slide plate 63, providing clearance for the second conductive element 412 while increasing the compactness of the layout.

[0227] In other examples, the second conductive element 412 can bypass the end of the first slide plate 63 away from the conduit cavity 604 and extend from its outer side toward the computing board 200, as shown in Figures 1C and 2A. The middle section of the second conductive element 412 protrudes outward and extends from the outer side of the first slide plate 63 toward the computing board 200, without interfering with the end of the first slide plate 63 away from the conduit cavity 604. Specifically, as shown in Figure 5F, the second conductive element 412 has a bending structure 412a, which can be bypassed from the outer side of the end of the first slide plate 63 away from the conduit cavity 604, thereby avoiding the first slide plate 63.

[0228] Continuing with Figure 2B and referring to Figure 2A, the end of the first slide plate 63 facing away from the conduit cavity 604 may have a third clearance opening 634, which is used for cables to pass through. The cables can be used to electrically connect the control board 80 of the computing device 1 (as shown in Figure 1C) to the power module. The third clearance opening 634 provides fixed space for the cables, reducing cable clutter and making the cables more organized.

[0229] In some examples, the first slide plate 63 may be made of a material containing at least one metal, such as aluminum or a metal alloy, to enhance its strength, but is not limited to this. In examples where the first slide plate 63 has a clearance structure, the clearance structure prevents the first slide plate 63 from interfering spatially with the power connection device 400, and also prevents the power connection device 400 from contacting the first slide plate 63 and short-circuiting, thereby ensuring the safety of the connection between the power connection device 400 and the power module 500.

[0230] In other examples, the first slide plate 63 may be made of a non-conductive material, such as plastic, but is not limited to this, in order to reduce costs.

[0231] It should be noted that the above are merely examples and do not constitute a limitation on this application. Those skilled in the art will understand that the first slide plate 63 may also have other materials, such as an outer surface of metal coated or electroplated with insulating materials, and is not limited to these.

[0232] In some examples, the first slide plate 63 and the second slide plate 64 can be riveted to the first top cover 621 and the bottom plate 613 of the housing 60. As shown in FIG2B, the upper and lower sides of the first top cover 621, the bottom plate 613, and the first slide plate 63 and the second slide plate 64 respectively have a plurality of rivet holes 609 spaced apart in the first direction X. The first slide plate 63 and the second slide plate 64 are fixed to the first top cover 621 and the bottom plate 613 by rivets riveted to the rivet holes 609, and the first top cover 621 and the bottom plate 613 are connected at the same time.

[0233] In other examples, the first slide plate 63 and the second slide plate 64 may also be fixed to the first top cover 621 and the bottom plate 613 by other fasteners or clips, etc., and are not limited to these.

[0234] To prevent the power module 500 from scratching its surface due to friction with the second sub-cavity 603 of the chassis 60 during disassembly and assembly, the inner wall of the chassis 60 may have anti-friction parts, which may be protrusions or recesses, to reduce the contact area between the power module 500 and the inner wall of the chassis 60 and prevent large-area scratches on the outer surface of the power module 500.

[0235] In a specific example, as shown in Figure 2B and in conjunction with Figure 2A, the inner surface of the bottom plate 613 of the outer casing 60 corresponding to the second sub-cavity 603 may have multiple protrusions 614, the inner surface of the side plate 612 of the chassis 11 corresponding to the second sub-cavity 603 may have multiple protrusions (not shown), and the outer surface of the side plate 612 of the chassis 11 corresponding to the second sub-cavity 603 may have recesses 615 corresponding to the protrusions. The presence of the protrusions 614 and protrusions of the outer casing 60 can reduce the contact area between the inner wall surface of the outer casing 60 and the power module, preventing the power module from making large-area contact with the inner wall surface of the outer casing 60 and scratching it when the second sub-cavity 603 is pushed in or pulled out, which is beneficial to maintaining the aesthetic appearance of the power module.

[0236] In some examples, as shown in Figure 2B, the protrusion 614 extends along a first direction X. Multiple protrusions 614 may be distributed along the first direction X to align with the direction in which the power module is pushed or pulled, thereby reducing wear on the outer surface of the power module. This is merely an example and does not constitute a limitation of this application. The protrusion 614 may also extend along a second direction Y or other directions, and is not limited thereto.

[0237] As shown in Figure 1C, the outer peripheral wall of the power module 500 of the power module has a plurality of protrusions 501 extending along the first direction X. The plurality of protrusions 501 are arranged in the second direction Y, so that the outer peripheral wall of the power module presents a regular slightly convex and concave surface. Compared with a smooth surface, the slightly convex and concave surface can reduce the visual effect of wear and improve the visual aesthetics.

[0238] For example, as shown in Figures 1C and 2A, the housing 60 has an opening 620 on the side of the housing 601 facing away from the conduit cavity 604 in the first direction X. That is, the receiving cavity 601 is open on the side of the housing 601 facing away from the conduit cavity 604 in the first direction X. The computing module 20 and the power module can be pushed into the receiving cavity 601 or pulled out from the receiving cavity 601 through the opening 620, thereby facilitating the assembly and disassembly of the computing module 20 and the power module.

[0239] To protect the computing module 20 and power supply module from the external environment, the opening 620 can be closed by a panel. Exemplarily, as shown in Figures 3A and 3B, the chassis 11 also includes a panel assembly 70, at least partially covering the opening 620 of the housing 60. In a specific example, the panel assembly 70 includes a second panel 71, as shown in Figure 2A, which covers the outside of the opening 620, closing the housing 601 on the side facing away from the conduit cavity 604 in the first direction X, thus preventing the computing module 20 and power supply module inside the housing 601 from being exposed, improving both security and aesthetics.

[0240] For example, the control board 80 of the computing device 1 can be installed inside the second panel 71 for easy connection to the computing module 20 and the power module. The control board 80 is signal-connected to the computing module 20 and the power module 40 respectively, and the control board 80 is located on the side of the computing module 20 away from the conduit assembly 30.

[0241] In some examples, the control board 80 is perpendicular to the base plate 631 of the chassis 11. In some examples, the control board 80 is parallel to the second panel 71, reducing the space occupied by the control board 80 and increasing compactness. In a specific example, as shown in FIG3A, the inner side of the second panel 71 has a fixing post, namely the second fixing post 713, and the control board 80 (as shown in FIG1C) is fixed to the second panel 71 by fasteners fastened to the second fixing post 713. In other examples, the control board 80 can be fixed to the inner side of the second panel 71 by means of snaps, riveting, or magnetic attraction, and is not limited to these. Exemplarily, as shown in FIG3B, the second panel 71 may have a first hole 71a for a network cable to pass through to connect to the control board 80 of the computing device 1, facilitating communication between the control board 80 and the outside.

[0242] For example, as shown in Figure 3B, the second panel 71 may have multiple second holes 71b, which are used to expose multiple function buttons on the control panel 80. These function buttons may be, for example, a power button, a setting button, an IP address search button, etc., and are not limited to these.

[0243] For example, as shown in FIG3B, the second panel 71 may have a third hole 71c, which is used to expose the power input terminal 520 of the power module 500 of the power module (as shown in FIG5H), so as to facilitate the connection of the external power cord to the power input terminal 520.

[0244] For example, as shown in FIG3B, the second panel 71 may have a fourth hole 71d, which is used to expose the power switch 503 of the power module 500 of the power module (as shown in FIG5H), so as to facilitate the user to operate the power switch 503.

[0245] To facilitate the installation of the panel assembly 70 and improve the structural compactness of the chassis 11, the panel assembly 70 and the power connection device 400 inside the chassis 11 can have a mutually cooperating positioning and avoidance structure. The positioning and avoidance structure is used to position the installation of the panel assembly 70, and at the same time, it can make way for part of the structure of the power connection device 400 to avoid interference between the panel assembly 70 and the power connection device 400.

[0246] In this example, interference refers to at least a portion of the structure of the panel assembly 70 and the power connection device 400 being in spatial contact or overlapping. By providing positioning and avoidance structures on the panel assembly 70 and / or the power connection device 400, they can avoid each other, thereby preventing the installation of the power connection device 400 from being affected by the installation and positioning of the panel assembly 70, and improving the installation convenience and structural compactness of the power connection device 400 in the computing device 1.

[0247] For example, the positioning and avoidance structure can be a positioning member 72 with an avoidance slot 722 provided on the panel assembly 70, the avoidance slot 722 being used to avoid part of the structure of the power connection device 400.

[0248] Specifically, as shown in Figures 3A and 3B, the inner side of the second panel 71 is provided with a positioning member 72 extending toward the receiving cavity 601. The positioning member 72 has an avoidance slot 722, which is used to avoid the first conductive seat 431 or the second conductive seat 432 of the power connection device 400. As shown in Figure 5B, the first conductive member 411 of the power connection device 400 is electrically connected to the first power terminal 231 of the computing board 200 of the computing module 20 through the first conductive seat 431, and the second conductive member 412 of the power connection device 400 is electrically connected to the second power terminal 232 of the computing board 200 through the second conductive seat 432.

[0249] On the one hand, the clearance slot 722 provides clearance space to prevent the positioning member 72 from interfering with the power connection device 400. On the other hand, the cooperation between the clearance slot 722 and the corresponding first conductive seat 431 or second conductive seat 432 of the power connection device 400 can position the panel assembly 70 for installation, facilitating the assembly and stability of the panel assembly 70.

[0250] In the example where the computing module 20 includes multiple computing boards 200, the power connection device 400 correspondingly has multiple first conductive seats 431 and multiple second conductive seats 432. In this example, the positioning member 72 correspondingly has multiple clearance slots 722 corresponding to the multiple first conductive seats 431 or the multiple second conductive seats 432. Specifically, as shown in FIG3A, the positioning member 72 has multiple positioning portions 721 spaced apart in the third direction Z on the side facing the receiving space in the first direction X, and clearance slots 722 are defined between adjacent positioning portions 721.

[0251] In some examples, the positioning element 72 may be made of a material containing at least one metal, such as aluminum or a metal alloy, to enhance its strength, but is not limited to this. In examples where the positioning element 72 has a clearance slot 722, the clearance slot 722 prevents spatial interference between the panel assembly 70 and the power connection device 400, and also prevents the power connection device 400 from contacting the panel assembly 70 and short-circuiting, thereby ensuring the safety of the connection between the power connection device 400 and the power module 500.

[0252] In other examples, the positioning element 72 may be made of a non-conductive material, such as plastic, but is not limited to this, in order to reduce costs.

[0253] It should be noted that the above are merely examples and do not constitute a limitation on this application. Those skilled in the art will understand that the positioning element 72 may also have other materials, such as an outer surface of metal coated or electroplated with insulating materials, and is not limited to these.

[0254] In some examples, the positioning element 72 can be integrally formed with the second panel 71, that is, the positioning element 72 and the second panel 71 are a single piece, to simplify installation.

[0255] In other examples, the positioning element 72 may be separately disposed from the second panel 71, and the positioning element 72 may be fixed to the inside of the second panel 71 by means of fasteners, snaps or magnetic attraction, etc., and is not limited to this.

[0256] For example, as shown in FIG3A, a handle 74 is provided on the outer side of the second panel 71 to facilitate the assembly and disassembly of the panel assembly 70.

[0257] For example, as shown in FIG3A, the panel assembly 70 further includes two connecting guides 73, which are respectively disposed at both ends of the second panel 71 in the second direction Y. The connecting guides 73 include connecting mating plates 731, which have mounting holes 7311. The connecting mating plates 731 are used to fix the connecting mating plates 731 to the connecting mating plates 731 of adjacent computing devices 1 by fasteners passing through the mounting holes 7311. Data centers generally have multiple computing devices 1. By fixing the chassis 11 of adjacent computing devices 1 with connecting mating plates 731, the stability of each computing device 1 is improved.

[0258] For example, as shown in Figures 3A and 3B, the connecting guide 73 further includes a guide plate 732 extending from the inner side of the connecting mating plate 731 toward the receiving cavity 601. The guide plate 732 has a plurality of guide tabs 7321 spaced apart in the third direction Z. The guide tabs 7321 are bent inward from their ends away from the connecting mating plate 731. It can be understood that the inward bending here refers to bending toward the center direction of the panel assembly 70 in the second direction Y. The inwardly bent guide tabs 7321 can guide the assembly of the panel assembly 70 with the housing 60, facilitating the quick installation of the panel assembly 70 and making it easy to install into place.

[0259] In some examples, the connecting mating plate 731 and the guide plate 732 of the connecting guide 73 can be integrally provided to simplify assembly and improve the structural strength of the connecting guide 73. In other examples, the connecting mating plate 731 and the guide plate 732 can be provided separately, for example, by means of fasteners, welding or snap-fit ​​connection, and are not limited to this.

[0260] The connecting guide 73 can be fixed to the second panel 71 by means of fasteners, welding or snap-fit ​​connection, and is not limited to these methods.

[0261] For example, to avoid the spatial structural mutual influence between the guide piece 7321 and the second slide plate 64, as shown in FIG2B, the end of the second slide plate 64 facing the connecting mating plate 731 has a plurality of clearance openings 642 spaced apart in the third direction Z. The plurality of clearance openings 642 correspond one-to-one with the plurality of guide pieces 7321 of the adjacent guide plate 732. The guide piece 7321 can be engaged with the corresponding clearance opening 642, avoiding the mutual influence between the two in the spatial structure. At the same time, the second slide plate 64 provides a limit for the guide piece 7321, which facilitates the assembly of the panel assembly 70 and improves the stability of the assembly of the panel assembly 70.

[0262] For example, to facilitate the installation of the panel assembly 70, as shown in FIG3A, the second panel 71 includes a plate body 711 and at least one flap 712. The at least one flap 712 extends from at least one side of the plate body 711 in the third direction Z toward the receiving cavity 601. The flap 712 includes a first guide portion 7121 that bends inward away from the plate body 711. As shown in FIG3A, the plate body 711 has a flap 712 on each side in the third direction Z. The bending inward away from the plate body 711 can be understood as bending toward the center direction of the panel assembly 70 in the third direction Z. That is, the flap 712 on the upper side of the plate body 711 has a first guide portion 7121 that bends downward away from the plate body 711, and the flap 712 on the lower side of the plate body 711 has a first guide portion 7121 that bends upward away from the plate body 711. The inwardly bent first guide portion 7121 can guide the assembly of the panel assembly 70 and the housing 60, facilitating the quick installation of the panel assembly 70 and making it easy to install in place.

[0263] For example, to improve the accuracy and speed of panel assembly 70 installation, as shown in FIG3A, the folding tab 712 further includes at least one inwardly bent second guide portion 7122, which is located on at least one side of the first guide portion 7121 in the second direction Y. As shown in FIG3A, the first guide portion 7121 has a second guide portion 7122 on each side in the second direction Y. The second guide portion 7122 is adjacent to the first guide portion 7121 and maintains a certain gap. The second guide portion 7122 can also guide the assembly of panel assembly 70 and housing 60, facilitating the rapid installation of panel assembly 70.

[0264] For example, as shown in FIG3B, the folding tab 712 also has a first notch 712a, which is used to avoid the second slide plate 64 of the housing 60. The end of the second slide plate 64 facing the panel assembly 70 can be engaged with the first notch 712a to provide a limit for the panel assembly 70 and improve the stability of the panel assembly 70 assembly.

[0265] For example, as shown in FIG3B, the flap 712 also has a second notch 712b, which is used to avoid the power module 500 of the power module, so as to avoid the power module 500 and the flap 712 from interfering with each other in spatial structure.

[0266] For example, as shown in FIG3B, the folding tab 712 also has a third notch 712c, which is used to avoid the first slide plate 63. The end of the first slide plate 63 facing the panel assembly 70 can be engaged with the third notch 712c to provide a limit for the panel assembly 70 and improve the stability of the panel assembly 70 assembly.

[0267] Figure 4A shows a cross-sectional view of the liquid cooling module of the computing module 20 of the computing device 1 according to an embodiment of the present application; Figures 4B, 4C, and 4D show cross-sectional views of different liquid cooling plates of the computing device according to an embodiment of the present application; Figure 4E shows an exploded view of the computing module 20 of the computing device 1 according to an embodiment of the present application; Figure 4F shows a structural schematic diagram of the computing board of the computing device 1 according to an embodiment of the present application; Figure 4G shows a cross-sectional view of the computing module 20 of the computing device 1 according to an embodiment of the present application; Figure 4H shows an enlarged view of region A in Figure 4G; Figure 4I shows an enlarged view of region B in Figure 4G; Figures 4J, 4K, and 4L show structural schematic diagrams of different examples of the computing module 20 of the computing device 1 according to an embodiment of the present application; Figure 4M shows a structural schematic diagram of the cover plate of the computing module 20 of the computing device 1 according to an embodiment of the present application.

[0268] The computing module 20 of the computing device 1 in this embodiment will be described in detail below with reference to Figures 4A to 4M.

[0269] In some examples, the number of modules 20 is calculated as one.

[0270] In the example where the power module 40 has cooling pipes, the cooling channel 111 of the computing module 20 is connected to the cooling pipes of the power module 40. That is, the cooling medium input through the liquid inlet pipe can flow through the cooling pipes and the cooling channel 111 to dissipate heat from both the computing board 200 and the power module 500 simultaneously.

[0271] In some examples, the cooling channel 111 is connected in parallel with the cooling pipes, that is, one inlet pipe is connected to the inlet of the cooling channel 111 and the inlet of the cooling pipe through two input terminals respectively, or two inlet pipes are connected to the inlet of the cooling channel 111 and the inlet of the cooling pipe respectively. This allows the cooling medium to be delivered to both the cooling channel 111 and the cooling pipes simultaneously.

[0272] In other examples, the cooling channel 111 is connected in series with the cooling pipe. For instance, the cooling channel 111 is connected downstream of the cooling pipe, with the inlet end of the liquid inlet pipe connected to the inlet end of the cooling pipe, the outlet end of the cooling pipe connected to the inlet end of the cooling channel 111, and the outlet end of the cooling channel 111 connected to the inlet end of the return pipe. Yet another example is that the cooling channel 111 is connected upstream of the cooling pipe, meaning the cooling medium output from the liquid inlet pipe first flows through the cooling channel 111 and then through the cooling pipe.

[0273] In the example where the cooling channel 111 is connected in series with the cooling pipe, the output end of the cooling pipe is connected to the input end of the cooling channel 111 through the first connecting pipe 351.

[0274] In other examples, the number of computing modules 20 is at least two. These at least two computing modules 20 can be stacked in a third-order direction to increase the computing power of the computing device. This third-order direction can be understood as the height of the chassis.

[0275] The cooling channels 111 of two adjacent computing modules 20 are connected. For example, the cooling channels 111 of two adjacent computing modules 20 are connected in series or in parallel.

[0276] In the example where the cooling channels 111 of two adjacent computing modules are connected in series, the two adjacent cooling channels 111 are connected by a second connecting pipe 352.

[0277] The computing module 20 can have one or more liquid cooling modules, such as one, two, three, or four, etc. Each liquid cooling module 100 can cool at least one computing board 200. It should be noted that the above is only an example and does not constitute a limitation of this application. Those skilled in the art will understand that different numbers of liquid cooling modules 100 can be set according to the cooling requirements of the computing board 200 and the size of the chassis 11, and are not limited to this.

[0278] For example, the cooling channels 111 of two adjacent liquid cooling modules 100 are connected in series. That is, in the example where the computing module 20 includes at least two liquid cooling modules 100 and the number of computing modules 20 is one or at least two, the cooling channels 111 of two adjacent liquid cooling modules 100 are connected in series; or, when the computing module 20 includes a single liquid cooling module 100 and the number of computing modules 20 is at least two, the cooling channels 111 of two adjacent liquid cooling modules 100 are connected in series.

[0279] By connecting the cooling channels 111 of two adjacent computing modules 20 or two adjacent liquid cooling modules 100 in series, the computing device 1 can be equipped with a liquid inlet pipe 31 and a liquid return pipe 32, which reduces the number of pipes and the complexity of pipe layout, helps to simplify pipe installation and maintenance, and improves layout rationality.

[0280] For example, the cooling channel 111 includes at least one channel. Referring to Figures 4A to 4E, the cooling channel 111 includes a first channel 1111 and a second channel 1112. The input end of the first channel 1111 is directly connected to the output end of the liquid inlet pipe or connected to the output end of the liquid pipe through the cooling pipe to receive the cooling medium introduced by the liquid inlet pipe. The output end of the second channel 1112 is connected to the input end of the liquid return pipe to return the cooling medium to the liquid return pipe, forming a circulation path for the cooling medium.

[0281] In the example where the cooling channels 111 of two adjacent computing modules 20 or two adjacent liquid cooling modules 100 are connected in series, the number of second connecting pipes 352 connecting the adjacent cooling channels 111 is at least three. In the two adjacent liquid cooling modules 100, a second connecting pipe 352 is connected between the output end of the first channel 1111 of the first liquid cooling module and the input end of the first channel 1111 of the second liquid cooling module, a second connecting pipe 352 is connected between the output end of the first channel 1111 of the second liquid cooling module and the input end of the second channel 1112 of the second liquid cooling module, and a second connecting pipe 352 is connected between the output end of the second channel 1112 of the second liquid cooling module and the input end of the second channel 1112 of the first liquid cooling module.

[0282] In an example where there are at least two computing modules 20 or liquid cooling modules 100, as shown in Figure 4A and in conjunction with Figure 1A, the input end of the second flow channel 1112 at the downstream end of the medium flow path is connected to a connector 36. The input and output ends of the first flow channel 1111 at the downstream end of the medium flow path are also connected to connectors 36. The input and output ends of the first flow channel 1111 and the second flow channel 1112 of other cooling channels are also connected to connectors 36. A second connecting pipe 352 is connected between the two corresponding connectors 36. In this way, the cooling channels of each liquid cooling plate 110 are connected in series to improve the cooling effect on multiple computing boards.

[0283] In the example where the power module 40 has a cooling pipe, the input end of the first flow channel 1111 at the uppermost end of the medium flow path and the output end of the cooling pipe of the power module 40 are respectively connected to a connecting connector 36. The connecting connectors 36 are connected to each other through the first connecting pipe 351, thereby circulating the cooling medium flowing through the cooling pipe of the power module to the cooling flow channel 111 of the liquid cooling module 100.

[0284] In a specific example where there are two cooling modules 100, the input end of the first flow channel 1111 of the first liquid cooling module 100 is connected to the output end of the cooling pipe of the power module 40, the output end of the first flow channel 1111 of the first liquid cooling module 100 is connected to the input end of the first flow channel 1111 of the second liquid cooling module 100, the output end of the first flow channel 1111 of the second liquid cooling module 100 is connected to the input end of the second flow channel 1112 of the second liquid cooling module 100, the output end of the second flow channel 1112 of the second liquid cooling module 100 is connected to the input end of the second flow channel 1112 of the first liquid cooling module 100, and a return connector 34 is connected to the output end of the second flow channel 1112 of the first liquid cooling module 100.

[0285] In a specific example where there are three liquid cooling modules 100, the input terminal of the first flow channel 1111 of the first liquid cooling module 100 is connected to the output terminal of the cooling pipe of the power module 40; the output terminal of the first flow channel 1111 of the first liquid cooling module 100 is connected to the input terminal of the first flow channel 1111 of the second liquid cooling module 100; the output terminal of the first flow channel 1111 of the second liquid cooling module 100 is connected to the input terminal of the first flow channel 1111 of the third liquid cooling module 100; and the third liquid cooling module 100... The output end of the first flow channel 1111 is connected to the input end of the second flow channel 1112 of the third liquid cooling module 100. The output end of the second flow channel 1112 of the third liquid cooling module 100 is connected to the input end of the second flow channel 1112 of the second liquid cooling module 100. The output end of the second flow channel 1112 of the second liquid cooling module 100 is connected to the input end of the second flow channel 1112 of the first liquid cooling module 100. The output end of the second flow channel 1112 of the first liquid cooling module 100 is connected to a return liquid connector 34.

[0286] It should be noted that this is merely an example and does not constitute a limitation on this application. Those skilled in the art will understand that the number of liquid cooling modules 100 can be selected according to actual needs and is not limited thereto. Exemplarily, the liquid cooling module 100 includes a cooling structure and at least one clamping structure. The cooling structure can be a liquid cooling fin, a liquid cooling box, a liquid cooling plate 110, etc., but is not limited to the examples listed above. Specifically, the cooling structure can be a liquid cooling plate 110 (see Figure 4F), and the clamping structure can be a structure for fixing the computing board 200 to the liquid cooling surface 112, such as a bolt clamping structure, a spring clamping structure, a pneumatic or hydraulic clamping structure, etc., but is not limited to the examples listed above.

[0287] This cooling structure is used to cool heat-generating components that are in contact with or near it. The cooling structure can be a liquid-cooled surface 112, a liquid-cooled curved surface, a liquid-cooled pad, etc., but is not limited to the examples listed above. In a specific example, as shown in Figures 4E to 4G, the cooling structure is a liquid-cooled plate 110. The interior of the liquid-cooled plate 110 defines cooling channels 111 for the flow of cooling medium. At least one surface of the liquid-cooled plate 110 forms a liquid-cooled surface. One side of the computing board 200 has a heat-generating component, and the side of the computing board 200 with the heat-generating component is positioned opposite to the liquid-cooled surface. The heat-generating component can be a computing chip 210.

[0288] For example, the clamping structure is a cover plate 120. The cover plate 120 is connected to the liquid cooling plate 110 and is used to fix the computing board 200 to the liquid cooling surface 112. The side of the computing board 200 facing away from the cover plate 120 has a heat-generating component. In this embodiment, the computing board 200 is fixed to the liquid cooling surface 112 of the liquid cooling plate 110 by the cover plate 120. That is, by the way the computing board 200 and the liquid cooling surface 112 are in contact, it is ensured that the heat generated by the computing board 200 can be quickly transferred to the liquid cooling plate 110 through the liquid cooling surface 112, thereby improving the heat dissipation efficiency of the computing board 200. Secondly, the cooling medium flows through the cooling channels 111 inside the liquid cooling plate 110, continuously absorbing and carrying away the heat generated by the computing board 200 during operation, thus providing continuous cooling for the computing board 200. This allows the computing board 200 to maintain a low temperature during high-load operations, reducing the risk of performance degradation or damage due to overheating. In this embodiment, the cover plate 120 is a structure that can fix the computing board 200 to the liquid-cooled surface 112 of the liquid cooling plate 110. For example, it can be a strip-shaped clamping member, a clamping screw, an elastic clamping member, a clamping fastener, etc., and is not limited to these.

[0289] In this embodiment, the cooling medium is a liquid capable of absorbing and reducing heat. Specifically, the cooling medium can be a liquid capable of continuously absorbing and carrying away the heat generated by the computing board 200 during the operation process, such as water, fluorinated liquid, ethylene glycol, etc., and is not limited to these.

[0290] For example, the number of cover plates 120 can be one, two, three, or four, etc. It should be noted that the above is merely illustrative and does not constitute a limitation on this application. Those skilled in the art will understand that a corresponding number of cover plates 120 can be provided according to the shape of the liquid cooling plate 110, and is not limited thereto.

[0291] For example, liquid cooling plates 110 have liquid cooling surfaces 112 formed on opposite sides, and two cover plates 120 are connected to the two liquid cooling surfaces 112 respectively. The shape of the liquid cooling plate 110 may include the shape of the opposite surfaces, such as plate-shaped, strip-shaped, disc-shaped, etc., but its shape is not limited to the above examples. Specifically, the liquid cooling plate 110 may be cuboid in shape, and there are two cover plates 120. The two cover plates 120 are respectively disposed on opposite sides of the liquid cooling plate 110, and the two cover plates 120 fix the two computing boards 200 to opposite sides of the liquid cooling plate 110, so that one liquid cooling plate 110 can cool two computing boards 200 simultaneously.

[0292] By placing the computing boards 200 on opposite sides of the liquid cooling plate 110, the distance between the two computing boards 200 can be effectively increased. This allows the heat from the two computing boards 200 to be transferred to opposite sides of the liquid cooling plate 110, preventing heat from concentrating at the same location on the liquid cooling plate 110. Consequently, the liquid cooling plate 110 can maintain a lower temperature even when the two computing boards 200 are operating under high load, which is beneficial to improving the cooling effect of the computing device 1. Furthermore, with the two computing boards 200 located on opposite sides of the cooling channel 111, the heat from the two computing boards 200 can be transferred to the cooling channel 111 through the two liquid cooling surfaces 112, further enhancing the heat dissipation effect of the liquid cooling plate 110.

[0293] It should be noted that the above is only an exemplary description and should not be construed as a limitation of this application. In other examples of this application, the number of liquid cooling surfaces 112 of the liquid cooling plate 110 can be more than two, so that more than two computing boards 200 can be cooled simultaneously by one liquid cooling plate 110.

[0294] In some examples, in two adjacent liquid cooling modules 100, computing boards 200 are respectively provided on both sides of the first liquid cooling module 100, and computing boards 200 are provided on one side of the second liquid cooling module 100.

[0295] For example, there are three computing boards 200, namely a first computing board, a second computing board, and a third computing board. The first computing board and the second computing board are respectively attached to both sides of the liquid cooling plate 110 of the first liquid cooling module 100, and the third computing board is attached to one side of the liquid cooling plate 110 of the second liquid cooling module 100. The cooling medium in the first flow channel 1111 and the second flow channel 1112 of the first liquid cooling module 100 carries away the heat of the first computing board and the second computing board when it flows, and the cooling medium in the first flow channel 1111 and the second flow channel 1112 of the second liquid cooling module 100 carries away the heat of the third computing board when it flows.

[0296] In some examples, the first liquid cooling module 100 includes a first computing board and a second computing board, and the second liquid cooling module 100 includes a third computing board. The first and second computing boards are respectively disposed on both sides of the first liquid cooling module 100 in the thickness direction, and the third computing board is disposed on one side of the second liquid cooling module 100 in the thickness direction. The output end of the first flow channel 1111 of the first liquid cooling module 100 is connected to the input end of the first flow channel 1111 of the second liquid cooling module 100, the output end of the first flow channel 1111 of the second liquid cooling module 100 is connected to the input end of the second flow channel 1112 of the second liquid cooling module 100, and the output end of the second flow channel 1112 of the second liquid cooling module 100 is connected to the input end of the second flow channel 1112 of the first liquid cooling module 100.

[0297] For example, the first computing board is attached to one side of the first liquid cooling plate 110 in the thickness direction, the second computing board is attached to the other side of the first liquid cooling plate 110 in the thickness direction, and the third computing board is attached to one side of the second liquid cooling plate 110 in the thickness direction. With this configuration, the first flow channel 1111 and the second flow channel 1112 of the first liquid cooling module 100 can simultaneously remove the heat from the first computing board and the second computing board, and the first flow channel 1111 and the second flow channel 1112 of the second liquid cooling module 100 can remove the heat from the third computing board.

[0298] In two adjacent liquid cooling modules 100, the cooling medium enters from the input end of the first flow channel 1111 of the first liquid cooling module 100, flows sequentially through the first flow channel 1111 of the first liquid cooling module 100, the first flow channel 1111 of the second liquid cooling module 100, the second flow channel 1112 of the second liquid cooling module 100, and the second flow channel 1112 of the first liquid cooling module 100, and finally exits from the output end of the second flow channel 1112 of the first liquid cooling module 100. In this embodiment, the first liquid cooling module 100 is responsible for cooling the first computing board and the second computing board, and the second liquid cooling module 100 is responsible for cooling the third computing board.

[0299] In other examples, the first liquid cooling module 100 includes a first computing board and a second computing board, and the second liquid cooling module 100 includes a third computing board and a fourth computing board. The first and second computing boards are respectively disposed on both sides of the first liquid cooling module 100 in the thickness direction, and the third and fourth computing boards are respectively disposed on both sides of the second liquid cooling module 100 in the thickness direction. The output end of the first flow channel 1111 of the first liquid cooling module 100 is connected to the input end of the first flow channel 1111 of the second liquid cooling module 100, the output end of the first flow channel 1111 of the second liquid cooling module 100 is connected to the input end of the second flow channel 1112 of the second liquid cooling module 100, and the output end of the second flow channel 1112 of the second liquid cooling module 100 is connected to the input end of the second flow channel 1112 of the first liquid cooling module 100.

[0300] For example, the first computing board is attached to one side of the first liquid cooling plate 110 in the thickness direction, the second computing board is attached to the other side of the first liquid cooling plate 110 in the thickness direction, the third computing board is attached to one side of the second liquid cooling plate 110 in the thickness direction, and the fourth computing board is attached to the other side of the second liquid cooling plate 110 in the thickness direction. With this configuration, the first flow channel 1111 and the second flow channel 1112 of the first liquid cooling module 100 can simultaneously remove the heat from the first computing board and the second computing board, and the first flow channel 1111 and the second flow channel 1112 of the second liquid cooling module 100 can simultaneously remove the heat from the third computing board and the fourth computing board.

[0301] In two adjacent liquid cooling modules 100, the cooling medium enters from the input end of the first flow channel 1111 of the first liquid cooling module 100, flows sequentially through the first flow channel 1111 of the first liquid cooling module 100, the first flow channel 1111 of the second liquid cooling module 100, the second flow channel 1112 of the second liquid cooling module 100, and finally exits from the output end of the second flow channel 1112 of the first liquid cooling module 100. Since the temperature of the cooling medium gradually increases as it flows through the cooling flow channel 111, carrying away heat from the computing board 200, the cooling medium temperatures in the flow channel are ordered from low to high as follows: first flow channel 1111 of the first liquid cooling module 100, first flow channel 1111 of the second liquid cooling module 100, second flow channel 1112 of the second liquid cooling module 100, and second flow channel 1112 of the first liquid cooling module 100. The cooling medium temperature of the first flow channel 1111 of the first liquid cooling module 100 is a first temperature, the cooling medium temperature of the second flow channel 1112 of the first liquid cooling module 100 is a second temperature, the cooling medium temperature of the first flow channel 1111 of the second liquid cooling module 100 is a third temperature, and the cooling medium temperature of the second flow channel 1112 of the second liquid cooling module 100 is a third temperature. The sum of the first temperature and the second temperature is approximately equal to the sum of the third temperature and the fourth temperature. Based on this, the embodiments of this application are configured such that the first liquid cooling module 100 cools the first computing board and the second computing board, and the second liquid cooling module 100 cools the third computing board and the fourth computing board, thereby ensuring the balance of heat dissipation effect of the first computing board, the second computing board, the third computing board, and the fourth computing board, and improving the temperature balance and stability of each computing board 200.

[0302] It should be noted that this is merely an example and does not constitute a limitation on this application. Those skilled in the art will understand that the number of computing boards 200 corresponding to each liquid cooling plate 110 is not limited to this.

[0303] In some examples, the liquid cooling plate 110 is cuboid in shape, with three liquid cooling surfaces 112 formed on the three side surfaces of the liquid cooling plate 110. Three cover plates 120 are also present, each disposed on one of the three liquid cooling surfaces 112 of the liquid cooling plate 110. These cover plates 120 fix three computing boards 200 to the three liquid cooling surfaces 112 of the liquid cooling plate 110, enabling one liquid cooling plate 110 to simultaneously cool three computing boards 200.

[0304] In other examples, the liquid cooling plate 110 is cuboid in shape, with four liquid cooling surfaces 112 formed on the four side surfaces of the liquid cooling plate 110. Four cover plates 120 are also present, each disposed on one of the four liquid cooling surfaces 112 of the liquid cooling plate 110. These cover plates 120 fix four computing boards 200 to the four liquid cooling surfaces 112 of the liquid cooling plate 110, enabling one liquid cooling plate 110 to simultaneously cool four computing boards 200.

[0305] It should be noted that this is only an example, and the number of liquid cooling surfaces 112 on the liquid cooling plate 110 can be set according to the actual situation, and the number of corresponding cover plates 120 is not limited to the above example.

[0306] The liquid cooling plate 110 is provided with at least two liquid inlet structures and at least two liquid outlet structures for conveying the cooling medium. The liquid inlet structures can be liquid inlets, liquid inlets, liquid inlets, liquid inlets, liquid inlets, etc., and the liquid outlet structures can be liquid outlets, liquid inlets, liquid inlets, liquid inlets, liquid inlets, etc., but are not limited to the above examples. The liquid cooling plate 110 is provided with at least two liquid inlets and at least two liquid outlets, wherein at least one liquid outlet is connected to at least one liquid inlet. By providing at least two liquid inlets and at least two liquid outlets, the cooling channel 111 allows the cooling medium to be distributed and flow more evenly within the liquid cooling plate 110, thereby avoiding localized overheating of the liquid cooling plate 110 and improving overall cooling efficiency. Furthermore, the multiple liquid inlets and outlets optimize the distribution of the cooling channel 111 within the liquid cooling plate 110, allowing the cooling medium to more effectively cover and cool the entire surface of the liquid cooling plate 110, improving heat exchange efficiency.

[0307] In the embodiments of this application, the number of inlet and outlet can be one, two, three, four, etc. It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art will understand that the number of inlet and outlet can be selected according to actual needs and is not limited thereto.

[0308] For example, referring to Figure 4B, at least two liquid inlets include a first liquid inlet 114 and a second liquid inlet 115, and at least two liquid outlets include a first liquid outlet 116 and a second liquid outlet 117. The first liquid outlet 116 and the second liquid inlet 115 are connected.

[0309] For example, the input end of the first flow channel 1111 is connected to the output end of the inlet pipe through the first liquid inlet 114, the output end of the first flow channel 1111 is connected to the first liquid outlet 116, the input end of the second flow channel 1112 is connected to the second liquid inlet 115, and the output end of the second flow channel 1112 is connected to the input end of the return pipe through the second liquid outlet 117. The structure of the first flow channel 1111 and the second flow channel 1112 can be adapted to the shape of the liquid cooling plate 110 to facilitate the flow of the cooling medium. For example, the extension path of the first flow channel 1111 from the first liquid inlet 114 to the first liquid outlet 116 can be as follows: extending from the input end of the first flow channel 1111 along the first direction X to the first edge of the liquid cooling plate 110, then extending a predetermined distance along the second direction Y and then extending again along the first direction X to the second edge, then extending a predetermined distance along the second direction Y and then extending again along the first direction X to the first edge, and so on, to form the first flow channel 1111. The first edge and the second edge are two opposite edges of the liquid cooling plate 110 in the first direction X. It should be noted that this is merely an example and does not constitute a limitation on this application. Those skilled in the art will understand that the extension path of the first flow channel 1111 can also be extended along multiple directions to adapt to the heat dissipation requirements of the computing board 200, and is not limited to this.

[0310] Exemplarily, the extension path of the second flow channel 1112 from the second inlet 115 to the second outlet 117 can be as follows: extending from the input end of the second flow channel 1112 along the first direction X to the first edge of the liquid cooling plate 110, then extending a predetermined distance along the second direction Y and then extending again along the first direction X to the second edge, then extending a predetermined distance along the second direction Y and then extending again along the first direction X to the first edge, and so on, to form the second flow channel 1112. The first edge and the second edge are two opposite edges of the liquid cooling plate 110 in the first direction X. It should be noted that this is merely an example and does not constitute a limitation of this application. Those skilled in the art will understand that the extension path of the second flow channel 1112 can also extend along multiple directions to adapt to the heat dissipation requirements of the computing board 200, and is not limited to this.

[0311] Thus, the cooling medium forms a circulating flow path within the liquid cooling plate 110 through the first flow channel 1111 and the second flow channel 1112, which can effectively utilize the internal space of the liquid cooling plate 110, making the liquid cooling module 100 more compact and efficient, ensuring that the cooling medium can fully cover the area that needs heat dissipation, ensuring that the heat of the computing board 200 can be quickly carried away, and improving the overall heat dissipation efficiency of the computing device 1.

[0312] In this embodiment, the flow directions of the first flow channel 1111 and the second flow channel 1112 are opposite, and the first flow channel 1111 and the second flow channel 1112 are at least partially adjacent. Since the temperature of the cooling medium in the second flow channel 1112 is always higher than the temperature of the cooling medium in the first flow channel 1111, the first flow channel 1111 and the second flow channel 1112 can achieve heat conduction, and the heat can be uniformly transferred between the first flow channel 1111 and the second flow channel 1112, avoiding local overheating or overcooling of the first flow channel 1111 and the second flow channel 1112, and ensuring the uniformity of the temperature distribution of the first flow channel 1111 and the second flow channel 1112.

[0313] It should be noted that the flow direction of the first flow channel 1111 can be understood as the flow direction of the cooling medium from the input end to the output end of the first flow channel 1111. Similarly, the flow direction of the second flow channel 1112 can be understood as the flow direction of the cooling medium from the input end to the output end of the second flow channel 1112. The fact that the flow directions of the first flow channel 1111 and the second flow channel 1112 are opposite means that the general flow direction of the cooling medium within the first flow channel 1111 is generally opposite to the general flow direction within the second flow channel 1112. For example, the flow direction of the cooling medium in the adjacent portions of the first flow channel 1111 and the second flow channel 1112 is opposite.

[0314] The flow direction of the second flow channel 1112 can be understood as the flow direction of the cooling medium from the inlet to the outlet of the second flow channel 1112. The flow direction of the first flow channel 1111 is opposite to that of the second flow channel 1112, meaning that the general flow direction of the cooling medium in the first flow channel 1111 is opposite to that in the second flow channel 1112. For example, the flow direction of the cooling medium in the adjacent portions of the first flow channel 1111 and the second flow channel 1112 is opposite.

[0315] For example, as shown in Figures 4B to 4E, and in conjunction with Figure 4A, the cooling medium enters the first flow channel 1111 of the liquid cooling plate 110 through the first inlet 114. Then, the cooling medium inside the first flow channel 1111 is discharged through the first outlet 116. The cooling medium discharged from the first outlet 116 enters the second flow channel 1112 through the second inlet 115, and the cooling medium in the second flow channel 1112 is discharged through the second outlet 117. Thus, the arrangement of the first inlet 114, the first outlet 116, the second inlet 115, and the second outlet 117 allows the cooling medium to circulate within the liquid cooling plate 110, enabling more uniform distribution and flow of the cooling medium within the liquid cooling plate 110. This avoids localized overheating of the liquid cooling plate 110, thereby improving overall cooling efficiency. Secondly, the arrangement of multiple inlet and outlet ports optimizes the distribution of cooling channels 111 within the liquid cooling plate 110, allowing the cooling medium to more effectively cover and cool the entire surface of the liquid cooling plate 110, thereby improving heat exchange efficiency. For example, as shown in Figure 4B and in conjunction with Figure 1C, the first inlet 114, the second inlet 115, the first outlet 116, and the second outlet 117 are respectively located on the same side of the liquid cooling plate 110 in the first direction X, i.e., on the side of the liquid cooling plate 110 adjacent to the pipe cavity 604 in the first direction X, to facilitate the connection of the first inlet 114, the second inlet 115, the first outlet 116, and the second outlet 117 to the connecting pipe via connecting joints.

[0316] The input end of the first flow channel 1111 defines a first clearance region 1112b that communicates with the second inlet 115. The first clearance region 1112b extends in a direction away from the first outlet 116. By setting the first clearance region 1112b, the distance between the input end of the second flow channel 1112 and the output end of the first flow channel 1111 can be increased, thereby increasing the distance between the second inlet 115 and the first outlet 116, and further increasing the distance between the connecting joints that connect to the second inlet 115 and the first outlet 116 respectively. This reduces the degree of bending of the connecting pipe between the two connecting joints and reduces flow resistance.

[0317] The output end of the second flow channel 1112 defines a second clearance region 1112c that communicates with the second liquid outlet 117. The second clearance region 1112c extends in a direction away from the first liquid inlet 114. By setting the second clearance region 1112c, the distance between the input end of the first flow channel 1111 and the output end of the second flow channel 1112 can be increased, thereby increasing the distance between the first liquid inlet 114 and the second liquid outlet 117, and further increasing the distance between the two connecting joints that are respectively connected to the first liquid inlet 114 and the second liquid outlet 117. This reduces the degree of bending of the pipe connecting the two connecting joints and reduces flow resistance.

[0318] It is understood that the diameters of the first flow channel 1111 and the second flow channel 1112 can be selected according to the computing chip 210 on the computing board 200. For example, to improve the heat dissipation effect of the computing board 200, the diameters of the first flow channel 1111 and the second flow channel 1112 can be adapted to the width of the computing chip 210. With this configuration, when the computing chip 210 is attached to the liquid cooling surface 112 of the liquid cooling plate 110, the orthographic projection of the computing chip 210 on the liquid cooling surface 112 falls within the orthographic projections of the first flow channel 1111 and the second flow channel 1112 on the liquid cooling surface 112, so that the first flow channel 1111 and the second flow channel 1112 can cover the computing chip 210. It should be noted that this is merely an example and does not constitute a limitation of this application. Those skilled in the art will understand that the diameters of the first flow channel 1111 and the second flow channel 1112 can also be larger than the width of the computing chip 210, and are not limited thereto.

[0319] For example, the liquid cooling plate has a mounting structure on at least one side in the second direction Y. This mounting structure is used to mount the liquid cooling plate 110 into the housing. The mounting structure can be screw-fixed, snap-fit, guided, etc., but is not limited to the above examples. Specifically, the mounting structure is a guide structure, which is used to mount the liquid cooling plate 110 into the housing 60 along a certain direction. The guide structure can be a limiting protrusion, a guide plate, a guide block, etc., but is not limited to the above examples.

[0320] Specifically, the mounting structure can be guide protrusions. For example, the liquid cooling plate has a first guide protrusion 135 and a second guide protrusion 134 extending along the first direction X on both sides in the second direction Y. The first guide protrusion 135 is adapted to the first slide rail 631 of the first slide rail plate 63 of the chassis 11, and the second guide protrusion 134 is adapted to the second slide rail 641 of the second slide rail plate 64 of the chassis 11. Thus, through the cooperation of the first slide rail and the second slide rail 641 with the first guide protrusion 135 and the second guide protrusion 134 of the liquid cooling plate, the computing module 20 is guided into the first sub-cavity 602, facilitating the assembly of the computing module 20.

[0321] For example, the outer surface of the liquid cooling plate 110 is provided with an insulating structure, which includes, but is not limited to, an insulating layer, an insulating coating, or an insulating film layer. Specifically, the insulating structure can be an insulating layer to prevent electrical short circuits in the computing board 200.

[0322] For example, the liquid cooling plate 110 is generally made of aluminum plate to improve its thermal conductivity. Based on this, this application utilizes the characteristic that the liquid cooling plate 110 is made of aluminum plate to prepare an alumina insulating layer, which can effectively improve the preparation efficiency of the insulating layer. In the preparation process of the insulating layer, in the embodiments of this application, the aluminum liquid cooling plate 110 is placed as the anode in an electrolytic cell, and then a lead plate or stainless steel plate is used as the cathode. A DC power supply is connected to the anode and the cathode, and finally, an alumina insulating layer is formed on the outer surface of the liquid cooling plate 110 through an oxidation process.

[0323] The electrolytic cell contains an electrolyte, commonly a solution of sulfuric acid (H3SO4), oxalic acid (H2C2O4), or phosphoric acid (H3PO4). Sulfuric acid solution is the most commonly used choice, with a concentration generally between 15-20%. It should be noted that the electrolyte type described here is merely an example and does not constitute a limitation of this application.

[0324] It should be noted that this is merely an example and does not constitute a limitation on this application. Those skilled in the art will understand that the cathode can also be made of other materials according to actual needs, and is not limited to this. Furthermore, the insulating layer can also be made using other processes and materials, such as forming a glass fiber coating, polytetrafluoroethylene, silicone coating, ceramic coating, or polymer coating on the outer surface of the liquid cooling plate 110 by spraying.

[0325] It should be noted that if the liquid cooling plate is made of a light-colored metal, the insulation layer can be a dark-colored insulation layer, such as black. If the outer surface of the liquid cooling plate 110 is damaged, the dark-colored insulation layer will be damaged first. Therefore, the location of the damage on the outer surface of the liquid cooling plate 110 can be quickly found based on the damage to the insulation layer.

[0326] In some examples, when an aluminum oxide insulating layer is formed on the outer surface of the liquid cooling plate 110 through an oxidation process, the aluminum oxide layer can be made to exhibit a dark color, such as black, blue, or red, by controlling the electrolyte and current. Secondly, these dark colors can also be achieved through a dyeing process.

[0327] For example, referring to Figure 4A, the input end of the first flow channel 1111, the output end of the second flow channel 1112, the input end of the second flow channel 1112, and the output end of the first flow channel 1111 are arranged sequentially on the same side of the liquid cooling plate 110 in the first direction X, so that the input end and the output end of the entire cooling flow channel are located on the same side of the liquid cooling plate 110 in the first direction X, so that the pipe assembly 30 connected to the input end and the output end of the cooling flow channel can be integrated on the same side of the liquid cooling plate 110 in the first direction X, thereby making the layout of the pipe assembly 30 more concentrated and helping to simplify the installation and maintenance of the pipe assembly 30.

[0328] For example, referring to Figure 4A, the second flow channel 1112 is located inside the first flow channel 1111. In other examples, the first flow channel 1111 is located inside the second flow channel 1112. It should be noted that this is merely an example and does not constitute a limitation of this application. Those skilled in the art will understand that the spacing order of the first flow channel 1111 and the second flow channel 1112 can be arranged according to actual pipeline requirements and is not limited thereto.

[0329] In some embodiments, referring to FIG4A, the input end of the first flow channel 1111 and the output end of the second flow channel 1112 are disposed adjacent to one side of the liquid cooling plate 110 in the second direction Y, and the output end of the first flow channel 1111 and the input end of the second flow channel 1112 are disposed adjacent to the other side of the liquid cooling plate 110 in the second direction Y, wherein the second direction Y is perpendicular to the first direction X.

[0330] This configuration increases the distance between the input and output ends of the first flow channel 1111, as well as the distance between the input and output ends of the second flow channel 1112. This increases the flow distance of the cooling medium between the input and output ends of the first flow channel 1111 and the second flow channel 1112. On the one hand, this effectively utilizes the internal space of the liquid cooling plate 110, improving compactness; on the other hand, the cooling medium can fully cover the areas of the computing board 200 that require heat dissipation, ensuring that the heat from the computing board 200 is quickly dissipated, thus improving the overall heat dissipation efficiency of the computing device 1.

[0331] For example, referring to Figure 4A, the extension path of the first flow channel 1111 is the same as the extension path of the second flow channel 1112. This configuration can increase the area covered by the first flow channel 1111 and the second flow channel 1112 on the liquid cooling plate 110, reduce the gap between the first flow channel 1111 and the second flow channel 1112, and increase the flow distance and coverage area of ​​the cooling medium in the first flow channel 1111 and the second flow channel 1112. On the one hand, it can effectively utilize the internal space of the liquid cooling plate 110, making the structure more compact. On the other hand, the cooling medium can fully cover the areas on the computing board 200 that need heat dissipation, ensuring that the heat of the computing board 200 can be quickly removed, thereby improving the overall heat dissipation efficiency of the computing device 1.

[0332] In some embodiments, referring to Figures 4F and 4G, a plurality of computing chips 210 are arranged at intervals along the second direction Y on the computing board 200, and a plurality of chips in each set of computing chips 210 are arranged adjacently along the first direction X.

[0333] Understandably, the computing chips 210 on the computing board 200 are usually the most heat-generating parts. These chips (such as CPUs and GPUs) generate a lot of heat when running under high load. If they are not cooled in a timely and effective manner, they may overheat, which may affect system performance and stability, or even damage the hardware.

[0334] Based on the above issues, referring to Figures 4A and 4F, the first flow channel 1111 of this embodiment includes a plurality of sequentially connected first sub-flow channels 1111a, and the second flow channel 1112 includes a plurality of sequentially connected second sub-flow channels 1112a. The extending directions of the first sub-flow channels 1111a and the extending directions of the second sub-flow channels 1112a are parallel to the first direction X. Each set of computing chips 210 corresponds to at least one first sub-flow channel 1111a and / or at least one second sub-flow channel 1112a. It should be noted that, since the cooling medium in the first sub-channel 1111a and the second sub-channel 1112a is constantly flowing and thus carrying away the heat of the liquid cooling plate 110, the temperature is lower and the cooling rate is faster in the liquid cooling module 100 closer to the first sub-channel 1111a and the second sub-channel 1112a. Therefore, in this embodiment, the computing chip 210 is respectively associated with the first sub-channel 1111a or the second sub-channel 1112a, so that the position in the liquid cooling plate 110 with the faster cooling rate is attached to the computing chip 210, thereby further improving the heat dissipation efficiency of the computing board 200.

[0335] For example, the computing chip 210 can be attached to a position in the liquid cooling plate 110 corresponding to the first sub-flow channel 1111a, so that the cooling medium flowing in the first sub-flow channel 1111a can carry away the heat of the computing chip 210 at that position. In other examples, the computing chip 210 can be attached to a position in the liquid cooling plate 110 corresponding to the second sub-flow channel 1112a, so that the cooling medium flowing in the second sub-flow channel 1112a can carry away the heat of the computing chip 210 at that position. In still other examples, the computing chip 210 can be attached to positions in the liquid cooling plate 110 corresponding to both the first sub-flow channel 1111a and the second sub-flow channel 1112a, so that the cooling medium flowing in both sub-flow channels 1111a and 1112a can carry away the heat of the computing chip 210 at that position. It should be noted that these are merely examples and do not constitute a limitation of this application. Those skilled in the art will understand that the computing chip 210 can be selected to correspond to the first sub-channel 1111a and / or the second sub-channel 1112a according to heat dissipation requirements, and is not limited thereto.

[0336] In some examples, multiple first sub-channels 1111a are arranged at equal intervals in the direction from the input end of the first channel 1111 to the output end of the first channel 1111.

[0337] For example, the computing board 200 is provided with multiple sets of computing chips 210 arranged at equal intervals along the second direction Y. Multiple computing chips 210 in each set are arranged adjacently along the first direction X. Multiple first sub-channels 1111a extend along the first direction X, such that the extension directions of the multiple first sub-channels 1111a are parallel, and the spacing between adjacent first sub-channels 1111a in the second direction Y is equal. This arrangement ensures that the multiple first sub-channels 1111a and the multiple sets of computing chips 210 are arranged in a one-to-one correspondence, guaranteeing that the cooling medium is evenly distributed within the cooling channels 111. That is, the proportion of cooling medium at both ends in the first direction X is equal or approximately equal, and the proportion of cooling medium at both ends in the second direction Y is equal or approximately equal. This avoids localized overheating of the liquid cooling plate 110, thereby ensuring a more uniform temperature distribution on the liquid cooling plate 110.

[0338] In other examples, multiple first sub-channels 1111a are arranged at non-equal intervals in the direction from the input end of the first channel 1111 to the output end of the first channel 1111.

[0339] For example, referring to Figures 4A and 4F, the computing board 200 is provided with multiple sets of computing chips 210 arranged at non-equidistant intervals along the second direction Y. Multiple computing chips 210 in each set are arranged adjacently along the first direction X. Multiple first sub-channels 1111a extend along the first direction X, such that the extension directions of the multiple first sub-channels 1111a are parallel, and the spacing between adjacent first sub-channels 1111a in the second direction Y is unequal. This arrangement ensures that the multiple first sub-channels 1111a and the multiple sets of computing chips 210 are arranged in a one-to-one correspondence, thereby adapting the positions of the multiple first sub-channels 1111a to the positions of the multiple sets of computing chips 210.

[0340] In some embodiments, in the direction from the input end of the first flow channel 1111 to the output end of the first flow channel 1111, the distance between two adjacent first sub-flow channels 1111a in the plurality of first sub-flow channels 1111a gradually decreases.

[0341] For example, the computing board 200 is provided with multiple sets of computing chips 210 arranged at intervals along the second direction Y. In the second direction Y, the distance between adjacent sets of computing chips 210 gradually decreases. Multiple computing chips 210 in each set are arranged adjacently along the first direction X. Multiple first sub-channels 1111a extend along the first direction X, such that the extension directions of the multiple first sub-channels 1111a are parallel, and the distance between adjacent first sub-channels 1111a gradually decreases. This arrangement ensures that the multiple first sub-channels 1111a and the multiple sets of computing chips 210 are arranged in a one-to-one correspondence, thereby adapting the positions of the multiple first sub-channels 1111a to the positions of the multiple sets of computing chips 210.

[0342] It should be noted that this is merely an example and does not constitute a limitation on this application. Those skilled in the art will understand that the arrangement of the first sub-channels 1111a can also be partially equidistant or partially unequal, and is not limited thereto.

[0343] In some embodiments, referring to FIG1, in the direction from the input end of the first flow channel 1111 to the output end of the first flow channel 1111, a plurality of first sub-flow channels 1111a are divided into multiple groups, and the distance between two adjacent groups of first sub-flow channels 1111a is greater than the distance between adjacent first sub-flow channels 1111a within each group.

[0344] This configuration, by increasing the distance between adjacent sets of first sub-channels 1111a, allows the cooling medium to flow more easily between adjacent sets of first sub-channels 1111a during the flow process, reducing the possibility of flow blockage in the coiled first sub-channels 1111a, thereby improving the cooling efficiency of the liquid cooling plate 110. Secondly, since each set of first sub-channels 1111a is in contact with at least one computing board 200, the distance between adjacent first sub-channels 1111a within each set in this embodiment is small, which is conducive to generating turbulence in the cooling medium within each set of first sub-channels 1111a during fluid flow, increasing the contact area between the cooling medium and the wall of the first sub-channel 1111a, thereby improving the heat exchange efficiency of the liquid cooling plate 110.

[0345] In some embodiments, the extension directions of the plurality of second sub-channels 1112a are parallel to the first direction X, and the extension path of the first channel 1111 is the same as the extension path of the second channel 1112.

[0346] This configuration increases the area covered by the first flow channel 1111 and the second flow channel 1112 on the liquid cooling plate 110, reduces the gap between the first flow channel 1111 and the second flow channel 1112, and increases the flow distance and coverage area of ​​the cooling medium in the first flow channel 1111 and the second flow channel 1112. On the one hand, this embodiment of the application can effectively utilize the internal space of the liquid cooling plate 110, thereby making the liquid cooling module 100 more compact. On the other hand, the cooling medium can fully cover the area on the computing board 200 that needs heat dissipation, ensuring that the heat of the computing board 200 can be quickly removed, thereby improving the overall heat dissipation efficiency of the liquid cooling module 100.

[0347] In some embodiments, referring to FIG4A, the input and output ends of the first flow channel 1111 and the input and output ends of the second flow channel 1112 are arranged at intervals on the same side of the liquid cooling plate 110 in the first direction X, so that the liquid inlet and liquid outlet of the entire liquid cooling module 100 are located on the same side of the liquid cooling plate 110 in the first direction X, so that the pipes connected to the liquid inlet and liquid outlet of the liquid cooling module 100 can be integrated on the same side of the liquid cooling plate 110 in the first direction X, thereby making the pipeline layout of the liquid cooling module 100 more concentrated, which helps to simplify the installation and maintenance of the liquid cooling module 100.

[0348] For example, the second flow channel 1112 is located inside the first flow channel 1111. In other examples, the first flow channel 1111 is located inside the second flow channel 1112. It should be noted that this is merely an example and does not constitute a limitation of this application. Those skilled in the art will understand that the spacing order of the first flow channel 1111 and the second flow channel 1112 can be arranged according to actual pipeline requirements and is not limited thereto.

[0349] It should be noted that this is merely an example and does not constitute a limitation on this application. Those skilled in the art will understand that the liquid cooling plate 110 may include multiple first sub-channels 1111a or multiple second sub-channels 1112a, or simultaneously include multiple first sub-channels 1111a and multiple second sub-channels 1112a, and can be selected according to actual needs, and is not limited thereto.

[0350] In some embodiments, referring to FIG4A, in the direction from the input end of the first flow channel 1111 to the output end of the first flow channel 1111, a plurality of first sub-flow channels 1111a and second sub-flow channels 1112a are divided into multiple flow channel groups, and the distance between two adjacent flow channel groups is greater than the distance between adjacent first sub-flow channels 1111a and / or second sub-flow channels 1112a within each flow channel group.

[0351] This configuration, by increasing the distance between the channels of two adjacent channel groups, allows the cooling medium to flow more easily between the two adjacent channel groups during the flow process, reducing the possibility of flow blockage in the first sub-channel 1111a and the second sub-channel 1112a after the coiling arrangement, thereby improving the cooling efficiency of the liquid cooling plate 110. Secondly, since each channel group is attached to at least one computing board 200, the distance between adjacent first sub-channels 1111a and / or second sub-channels 1112a within each channel group in this embodiment is small. This is beneficial for the cooling medium in the first sub-channel 1111a and / or second sub-channel 1112a within each channel group to generate turbulence during the fluid flow process, increasing the contact area between the cooling medium and the walls of the first sub-channel 1111a and / or second sub-channel 1112a, thereby improving the heat exchange efficiency.

[0352] For example, there are multiple computing modules 20, which are stacked. Correspondingly, there are multiple liquid cooling modules 100, which are stacked.

[0353] In some examples, multiple liquid cooling modules 100 can be stacked in a direction perpendicular to the liquid cooling plate 110. This arrangement makes full use of the vertical space of the computing device 1, making the computing device 1 more compact and efficient. The stacked design not only optimizes space utilization but also adapts to the needs of high-density computing environments, thereby achieving better heat dissipation capabilities within a limited space.

[0354] In other examples, multiple liquid cooling modules 100 may be stacked in the first direction X or in the second direction Y. It should be noted that these are merely examples and do not constitute a limitation of this application. Those skilled in the art will understand that the stacking method of the liquid cooling modules 100 can be selected according to the actual layout of the computing device 1 and is not limited thereto. In some embodiments, each group of computing chips 210 includes three columns of computing chips spaced apart along the second direction Y. Each group of computing chips 210 corresponds to two first sub-channels 1111a and one second sub-channel 1112a. Alternatively, each group of computing chips 210 corresponds to one first sub-channel 1111a and two second sub-channels 1112a.

[0355] For example, when the computing board 200 is attached to the liquid cooling surface, a set of computing chips 210 on the computing board 200 are attached to the liquid cooling surface 112 at positions corresponding to two first sub-channels 1111a and one second sub-channel 1112a, or a set of computing chips 210 on the computing board 200 are attached to the liquid cooling surface 112 at positions corresponding to one first sub-channel 1111a and two second sub-channels 1112a.

[0356] This configuration allows the computing chip 210, which generates the most heat on the computing board 200, to be placed in the position where the liquid cooling plate 110 provides the best cooling and heat dissipation effect. This enables the liquid cooling plate 110 to remove the heat from the computing chip 210 on the computing board 200 to the maximum extent, thereby improving the heat dissipation efficiency of the computing module 2020.

[0357] In some embodiments, the distance between two adjacent sets of computing chips 210 is greater than the distance between adjacent computing chips 210 within each set. The multiple sets of computing chips 210 include two first sets of computing chips 210 and two second sets of computing chips 210, which are arranged at intervals along a second direction Y. Each first set of computing chips 210 corresponds to one first sub-channel 1111a and two second sub-channels 1112a, and each second set of computing chips 210 corresponds to two first sub-channels 1111a and one second sub-channel 1112a.

[0358] For example, each group of computing chips 210 extends along the first direction X, and the distance between two adjacent groups of computing chips 210 in the second direction Y is greater than the distance between adjacent computing chips 210 within each group, so that each group of computing chips 210 can correspond as closely as possible to the positions of the first sub-channel 1111a and the second sub-channel 1112a. Secondly, the cooling channels composed of the first sub-channel 1111a and the second sub-channel 1112a are coiled together, with six of each. To increase the proportion of the first sub-channel 1111a and the second sub-channel 1112a on the liquid cooling plate 110, the first sub-channel 1111a and the second sub-channel 1112a are arranged at intervals along the second direction Y within the liquid cooling plate 110. Based on this, to increase the power of the four groups of computing chips 210 on the computing board 200... To improve the temperature balance among the four sets of computing chips 210, this application arranges the first sub-channels 1111a and the second sub-channels 1112a at intervals along the second direction Y. The first set of computing chips 210 is associated with one first sub-channel 1111a and two second sub-channels 1112a, and the second set of computing chips 210 is associated with two first sub-channels 1111a and one second sub-channel 1112a. This results in three cooling channels corresponding to the four sets of computing chips 210, thereby making the heat dissipation effect of the four sets of computing chips 210 more balanced.

[0359] As shown in Figures 4B to 4E, at least one of the first sub-flow channel 1111a and the second sub-flow channel 1112a is provided with at least one turbulence structure 140, that is, at least one turbulence structure 140 is provided in the first sub-flow channel 1111a or the second sub-flow channel 1112a, or at least one turbulence structure 140 is provided in the first sub-flow channel 1111a and the second sub-flow channel 1112a respectively.

[0360] When the cooling medium flows in the first sub-channel 1111a and / or the inner second sub-channel 1112a, it will collide with the turbulence structure 140. At this time, the cooling medium around the turbulence structure 140 can obtain a larger local flow velocity due to the collision, thereby generating turbulence in the cooling medium of the first sub-channel 1111a and / or the inner second sub-channel 1112a, accelerating the heat transfer between the cooling medium and the computing board 200, and accelerating the heat transfer inside the cooling medium in the cooling channel 111, thereby giving the liquid cooling module 100 of this application a stronger heat exchange capacity.

[0361] For example, within the same sub-channel, the number of turbulence structures 140 can be one, two, three, four, etc. It should be noted that the above is merely illustrative and does not constitute a limitation on this application. Those skilled in the art will understand that the selection can be based on the length and width of the cooling channel 111, and is not limited thereto.

[0362] For example, a turbulence-inducing structure 140 may be provided in one of the plurality of first sub-flow channels 1111a. Alternatively, a turbulence-inducing structure 140 may be provided in two of the plurality of first sub-flow channels 1111a. Yet another example is that a turbulence-inducing structure 140 may be provided in three of the plurality of first sub-flow channels 1111a. And, for yet another example, a turbulence-inducing structure 140 may be provided in two or three of the plurality of second sub-flow channels 1112a, but the examples are not limited thereto.

[0363] In this embodiment, a turbulence structure 140 is provided in the first sub-channel 1111a, which enables the turbulence structure 140 in the first sub-channel 1111a to generate turbulence in the cooling medium in the corresponding first sub-channel 1111a, thereby accelerating the heat transfer between the cooling medium and the computing board 200, and accelerating the heat transfer inside the cooling medium in the first sub-channel 1111a, so that the liquid cooling module 100 of this application has a stronger heat exchange capacity.

[0364] For example, as shown in FIG4A, the extension direction of the first sub-channel 1111a is parallel to the first direction X, and a plurality of first sub-channels 1111a are spaced apart along the second direction Y, wherein the first direction X is perpendicular to the second direction Y.

[0365] For example, when the computing board 200 is attached to the liquid cooling surface 112 of the liquid cooling plate 110, the extension direction of the computing chip 210 on the computing board 200 is the same as the extension direction and the spacing direction of the first sub-channel 1111a, so that when the computing board 200 is attached to the liquid cooling plate 110, the area corresponding to the first sub-channel 1111a and the computing chip 210 on the computing board 200 is maximized, ensuring that the heat of the computing board 200 can be quickly carried away, thereby improving the overall heat dissipation efficiency of the liquid cooling module 100.

[0366] In some embodiments, the number of turbulence structures 140 in different first sub-channels 1111a and different second sub-channels 1112a is equal in the flow direction of the cooling channel 111. This arrangement ensures that the cooling medium is subjected to the same turbulence effect when flowing through different first sub-channels 1111a and second sub-channels 1112a, so that the flow rate and heat transfer of the cooling medium in different first sub-channels 1111a and second sub-channels 1112a are the same, and so that the cooling medium has a fixed heating rate in the flow direction of the cooling channel 111.

[0367] In other embodiments, the number of turbulence structures 140 in different first sub-channels 1111a and different second sub-channels 1112a gradually increases in the flow direction of the cooling channel 111. More turbulence structures 140 can increase the contact area and mixing effect between the cooling medium and the walls of the first sub-channels 1111a and second sub-channels 1112a, thereby gradually increasing the turbulence in the flow direction of the first sub-channels 1111a and second sub-channels 1112a. Combined with the gradual increase in temperature of the cooling medium in the flow direction of the first sub-channels 1111a and second sub-channels 1112a, the temperature of the first sub-channels 1111a and second sub-channels 1112a in the flow direction of this application embodiment becomes more uniform.

[0368] With this configuration, even if the temperature of the cooling medium in the first sub-channel 1111a and the second sub-channel 1112a gradually increases in the flow direction, as the number of turbulence structures 140 in the flow direction of the first sub-channel 1111a and the second sub-channel 1112a increases, the fluid path of the first sub-channel 1111a and the second sub-channel 1112a gradually becomes more complex, and the heat dissipation effect of the first sub-channel 1111a and the second sub-channel 1112a in the flow direction becomes better. This makes the temperature of the first sub-channel 1111a and the second sub-channel 1112a more uniform at different positions in the flow direction, thereby improving the heat dissipation effect of the liquid cooling plate 110, ensuring the uniformity of the heat dissipation effect of the liquid cooling plate 110, and improving the temperature balance and stability of the liquid cooling module 100.

[0369] It should be noted that this is merely an example and does not constitute a limitation on this application. Those skilled in the art will understand that the number of perturbation structures 140 can be selected according to actual needs and is not limited thereto.

[0370] In some examples, the turbulence structure 140 includes at least one of the following: cylindrical turbulence element (see FIG. 4B), frustum-shaped turbulence element (not shown in the figure), prism-shaped turbulence element (not shown in the figure), pyramid-shaped turbulence element (see FIG. 4C), waist-shaped columnar turbulence element (not shown in the figure), and trapezoidal columnar turbulence element (not shown in the figure). In this application, the multiple turbulence structures 140 may include a variety of turbulence elements with different structures, or they may include a turbulence element with a single structure.

[0371] In some examples, referring to Figure 4B, the turbulence structure 140 includes a cylindrical turbulence element that can provide a uniform turbulence effect suitable for most cooling medium flow conditions. The cylindrical turbulence element can generate a uniform turbulence effect during the flow of the cooling medium, thereby improving the heat exchange efficiency within the cooling channel 111.

[0372] In some examples, the turbulence structure 140 includes a frustum-shaped turbulence element, which can provide a gradual turbulence effect for the cooling medium, suitable for cooling medium flow conditions with large velocity variations. The frustum-shaped turbulence element can generate a gradual turbulence effect during the flow of the cooling medium, which is beneficial for optimizing the flow path of the cooling medium.

[0373] In some examples, the turbulence structure 140 includes prismatic turbulence elements, which can provide a strong directional turbulence effect for the cooling medium and are suitable for cooling medium flow conditions with a relatively fixed flow direction. Prismatic turbulence elements can generate a strong directional turbulence effect during fluid flow, which is beneficial for improving heat transfer efficiency.

[0374] In some examples, referring to Figure 4C, the turbulence structure 140 includes a pyramidal turbulence element, which can provide a strong concentrated turbulence effect and is suitable for cooling medium flow conditions where the heat source distribution is relatively concentrated. The pyramidal turbulence element can generate a strong concentrated turbulence effect during the flow of the cooling medium, which is beneficial to improving the local heat transfer efficiency of the liquid cooling plate 110.

[0375] In some examples, the turbulence structure 140 includes a waist-shaped columnar turbulence element, which provides a streamlined turbulence effect suitable for cooling medium flow conditions with high flow velocities. The waist-shaped columnar turbulence element can generate a streamlined turbulence effect during the flow of the cooling medium, which helps to reduce the flow resistance of the cooling medium and improve the heat exchange efficiency of the liquid cooling plate 110.

[0376] In some examples, the turbulence structure 140 includes trapezoidal columnar turbulence elements, which can provide a combination of gradual and concentrated turbulence effects on the cooling medium, suitable for cooling medium flow conditions with large variations in flow velocity and heat source distribution. The trapezoidal columnar turbulence elements can generate a combination of gradual and concentrated turbulence effects during the flow of the cooling medium, which is beneficial for optimizing the flow path of the cooling medium and improving heat transfer efficiency.

[0377] It should be noted that this is merely an example and does not constitute a limitation on this application. Those skilled in the art will understand that the turbulence structure 140 may also include turbulence elements of other structures, and the turbulence structure 140 may include a variety of different turbulence elements, or it may include a single turbulence element, and is not limited thereto.

[0378] In some examples, see Figures 4C and 4H, the cross-sectional area of ​​the turbulence structure 140 gradually decreases in the direction of the flow of the cooling channel 111.

[0379] According to the continuity equation in fluid mechanics, this configuration, with its smaller cross-sectional area, leads to an increase in flow velocity. This, in turn, gradually increases the velocity of the cooling medium within the cooling channel 111, thereby improving the heat exchange efficiency of the liquid cooling plate 110 and allowing the heat from the computing board 200 to be transferred to the cooling medium more quickly. Secondly, the gradually decreasing cross-sectional area of ​​the turbulence structure 140 causes the cooling medium to continuously change direction and velocity during flow, increasing the turbulence. This turbulence breaks the laminar flow state, increasing the contact area between the cooling medium and the sidewalls of the cooling channel 111, further improving the heat exchange efficiency of the liquid cooling plate 110 and allowing the heat from the computing board 200 to be transferred to the cooling medium more quickly. Furthermore, the gradually decreasing cross-sectional area of ​​the turbulence structure 140 optimizes the flow path of the cooling medium, preventing stagnation or excessively low velocity in certain areas, thus ensuring uniform distribution of the cooling medium within the cooling channel 111 and improving the cooling effect of the liquid cooling plate 110.

[0380] In other examples, see Figures 4D and 4E, the turbulence structure 140 includes a turbulence plate disposed within the cooling channel 111 along the flow direction of the cooling channel 111.

[0381] This design allows the baffle to generate turbulence during the flow of the cooling medium, creating complex flow paths within the cooling channel 111. By increasing the degree of turbulence within the cooling channel 111, this application can significantly improve the heat exchange efficiency of the cooling medium. Secondly, the baffle can guide the fluid to form diverse flow paths within the channel, preventing stagnation or excessively low flow rates in certain areas of the cooling medium and avoiding localized overheating of the liquid cooling plate 110. Furthermore, the baffle can disrupt the thermal boundary layer formed by the cooling medium near the channel wall, allowing heat to be transferred to the cooling medium more quickly, thereby improving the heat transfer efficiency of the cooling medium within the cooling channel 111.

[0382] In some examples, the cooling channel 111 is provided with multiple sets of turbulence-disrupting elements along its flow direction. Each turbulence-disrupting element set includes at least one turbulence-disrupting structure 140. The turbulence-disrupting directions of the turbulence-disrupting structures 140 of at least two adjacent turbulence-disrupting element sets are different. In the flow direction of the cooling channel 111, multiple turbulence-disrupting structures 140 are staggered.

[0383] For example, the first group of turbulence-disrupting components has three turbulence structures 140, with a first gap between two adjacent turbulence structures 140. The second group of turbulence-disrupting components has two turbulence structures 140. In the flow direction of the cooling channel 111, the turbulence structures 140 of the second group of turbulence-disrupting components correspond to the first gap in the first group of turbulence-disrupting components, thereby achieving a staggered arrangement of multiple turbulence structures 140. The staggered arrangement of the turbulence structures 140 can generate more complex turbulence effects during the flow of the cooling medium, causing the cooling medium to form diverse flow paths within the cooling channel 111, thereby significantly improving the heat exchange efficiency of the cooling medium. Secondly, the staggered arrangement of multiple turbulence structures 140 can guide the cooling medium to form diverse flow paths within the cooling channel 111, avoiding stagnation or excessively low flow rates in certain areas of the cooling medium, and preventing localized overheating of the liquid cooling plate 110.

[0384] In some embodiments, the cooling channel 111 includes a plurality of third sub-channels, the input end and the output end of the cooling channel 111 are arranged at intervals on opposite sides of the liquid cooling plate 110 in the first direction X, the plurality of third sub-channels are arranged at intervals along the second direction Y, and at least one turbulence structure 140 is provided in each third sub-channel, the first direction X and the second direction Y are perpendicular to each other.

[0385] For example, a plurality of baffles are provided in the cooling channel 111, and the baffles extend along a first direction X. A third sub-channel is defined between two adjacent baffles, thereby defining a plurality of third sub-channels that extend along the first direction X respectively. A first diversion region is defined between the input end of the cooling channel 111 and the input end of the third sub-channel, and a second diversion region is defined between the output end of the cooling channel 111 and the output end of the third sub-channel. The cooling medium enters from the input end of the cooling channel 111, passes through the first diversion region, and then enters the third sub-channel from the input ends of different third sub-channels respectively. After being discharged from the output end of the third sub-channel, the cooling medium flows out from the output end of the cooling channel 111 through the second diversion region.

[0386] With this configuration, the input and output ends of the cooling channels 111 are spaced apart along the first direction X at opposite ends of the liquid cooling plate 110. This allows the cooling medium to be evenly distributed within the liquid cooling plate 110, preventing localized overheating and achieving uniform cooling of the computing board 200. Uniform cooling helps maintain the computing board 200 within its optimal operating temperature range, preventing performance degradation or malfunctions caused by localized overheating, thus extending the equipment's lifespan. Furthermore, each third sub-channel is equipped with a turbulence structure 140, making the flow path within the third sub-channel more complex and increasing the degree of turbulence, which significantly enhances the heat exchange efficiency of the liquid cooling plate 110.

[0387] It should be noted that this is merely an example and does not constitute a limitation on this application. Those skilled in the art will understand that there are many other ways to define the third sub-channel, such as forming the third sub-channel by cutting a groove in the liquid cooling plate 110, and it is not limited to this.

[0388] In some examples, the spacing of the third sub-channels in the second direction Y is equal.

[0389] This configuration, with equal spacing between the third sub-channels in the second direction Y, prevents the cooling medium from stagnating or flowing too slowly in certain areas, thus ensuring uniform distribution of the cooling medium within the liquid cooling plate 110. Furthermore, the uniform cooling effect and efficient heat exchange performance help maintain the computing board 200 within its optimal operating temperature range, preventing performance degradation or malfunctions caused by localized overheating, thereby extending the service life of the computing board 200.

[0390] It should be noted that this is merely an example and does not constitute a limitation on this application. Those skilled in the art will understand that the spacing of the third sub-channels in the second direction Y may not be completely equal, and is not limited thereto.

[0391] For example, the liquid cooling module 100 also includes multiple connection structures for connecting the cover plate 120, the computing board 200, and the liquid cooling plate 110 to each other. These connection structures can be bolted connections, snap-fit ​​connections, magnetic connections, tenon and mortise structures, etc., and are not limited to these. Specifically, as shown in Figures 4A to 4N, with particular attention to Figure 4I, the connection structure is the fastener 130 shown in Figure 4I. The cover plate 120 has multiple first through holes 121, the computing board 200 has multiple second through holes 220, and the liquid cooling plate 110 has multiple positioning holes 113. Multiple fasteners 130, multiple first through holes 121, and multiple second through holes 220 are arranged in a one-to-one correspondence. The fasteners 130 are sequentially inserted into the corresponding first through holes 121, second through holes 220, and positioning holes 113. This arrangement prevents relative movement between the cover plate 120, the computing board 200, and the liquid cooling plate 110, and enables the fixing of the computing board 200, the cover plate 120, and the liquid cooling plate 110, thereby improving the connection stability between the cover plate 120, the computing board 200, and the liquid cooling plate 110.

[0392] For example, a first through hole 121 is provided at each of the four corners of the cover plate 120, four second through holes 220 are provided on the computing board 200, and positioning holes 113 are provided at each of the four corners of the liquid cooling plate 110. There are four fasteners 130, and the four fasteners 130 pass through the four first through holes 121, the four second through holes 220 and the four positioning holes 113 respectively, so that the corners of the computing board 200, the cover plate 120 and the liquid cooling plate 110 are limited, thereby realizing the fixation between the computing board 200, the cover plate 120 and the liquid cooling plate 110. Furthermore, in order to improve the connection stability between the cover plate 120, the computing board 200, and the liquid cooling plate 110, this embodiment of the application can also provide a plurality of first through holes 121 at intervals in the middle position of the cover plate 120, a plurality of second through holes 220 at intervals in the middle position of the computing board 200, and a plurality of positioning holes 113 at intervals in the middle position of the liquid cooling plate 110. By means of fasteners 130 passing through the first through holes 121 in the middle position of the cover plate 120, the second through holes 220 in the middle position of the computing board 200, and the positioning holes 113 in the middle position of the liquid cooling plate 110 respectively, the connection stability between the computing board 200, the cover plate 120, and the liquid cooling plate 110 can be further improved.

[0393] Of course, the above-described interval settings are merely illustrative examples and do not constitute a limitation on this application. The positions of the first through hole 121, the first through hole 121, and the positioning hole 113 are not limited to the above examples. Provided that a stable connection is achieved between the computing board 200, the cover plate 120, and the liquid cooling plate 110, all other variations or alternatives that can be conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the protection scope of this application.

[0394] In some embodiments, referring to Figures 4H and 4I, the fastener 130 includes a connecting post 131 and a limiting boss 135, the limiting boss 135 being formed by protruding outward from the outer peripheral wall of the connecting post 131. The connecting post 131 is sequentially inserted through the corresponding first through hole 121, second through hole 220, and positioning hole 113. The limiting boss 135 is located between the liquid cooling plate 110 and the computing board 200. The two end faces of the limiting boss 135 abut against the liquid cooling surface 112 of the liquid cooling plate 110 and the surface of the computing board 200 adjacent to the liquid cooling plate 110, respectively. This prevents relative sliding between the liquid cooling plate 110 and the cover plate 120, and also provides additional support for both the liquid cooling plate 110 and the cover plate 120, ensuring the stability of the liquid cooling plate 110 and the cover plate 120 during long-term operation.

[0395] In some examples, the two end faces of the limiting boss 135 are both planes. On the one hand, making the two end faces of the limiting boss plane increases the contact area between the limiting boss 135 and the liquid cooling plate 110 and the cover plate 120 respectively. The larger contact area allows the limiting boss 135 to provide a more stable mechanical connection between the liquid cooling plate 110 and the cover plate 120 respectively, reducing the relative sliding and displacement between the liquid cooling plate 110 and the cover plate 120, thereby ensuring the stability and reliability of the liquid cooling module 100 during operation. On the other hand, making the end faces of the limiting boss 135 plane allows the supporting force applied by the limiting boss 135 to the liquid cooling plate 110 and the computing board 200 to be more uniform, reducing the local stress concentration of the liquid cooling plate 110 and the computing board 200, and avoiding the deformation or damage of the liquid cooling plate 110 and the cover plate 120 due to excessive local stress.

[0396] It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art will understand that the two end faces of the limiting boss 135 can also be curved surfaces or arc-shaped surfaces, etc., and are not limited to these.

[0397] In some examples, the cross-section of the limiting boss 135 can be square or circular.

[0398] In some embodiments, referring to FIG4I, the fastener 130 further includes a locking portion 133, which is detachably connected to a portion of the connecting post 131 located on the side of the cover plate 120 away from the liquid cooling plate 110, and the locking portion 133 abuts against the surface of the cover plate 120 on the side away from the computing board 200.

[0399] For example, referring to Figures 4H and 4I, when installing the liquid cooling plate 110 and the cover plate 120, the connecting post 131 is first inserted into the positioning hole 113 of the liquid cooling plate 110. Then, the computing board 200 is placed on the liquid cooling surface 112 on one side of the liquid cooling plate 110, and the connecting post 131 is inserted into the corresponding second through hole 220. At this time, the two end faces of the limiting boss 135 abut against the liquid cooling surface 112 of the liquid cooling plate 110 and the surface of the computing board 200 adjacent to the liquid cooling plate 110, respectively. Then, the first through hole 121 of the cover plate 120 is aligned with the connecting post 131 to cover the computing board 200. Finally, the locking part 133 is connected to the part of the connecting post 131 that protrudes from the first through hole 121. With this configuration, the cover plate 120 can be pressed tightly onto the limiting boss 135 by the locking part 133.

[0400] It should be noted that the cross-sectional area of ​​the limiting boss 135 is larger than the cross-sectional area of ​​the first through hole 121, and the cross-sectional area of ​​the locking part 133 is larger than the cross-sectional area of ​​the first through hole 121, so that the limiting boss 135 and the locking part 133 can respectively abut against the two opposite end faces of the cover plate 120.

[0401] In some examples, the connecting post 131 can be a stud, and the limiting boss 135 is formed by the stud extending radially outward. Part of the stud is inserted into the positioning hole 113 of the liquid cooling plate 110. Then, the computing board 200 is placed on the liquid cooling surface 112 on one side of the liquid cooling plate 110, and the stud is inserted into the corresponding second through hole 220. At this time, the two end faces of the limiting boss 135 abut against the liquid cooling surface 112 of the liquid cooling plate 110 and the surface of the computing board 200 adjacent to the liquid cooling plate 110, respectively. Then, the first through hole 121 of the cover plate 120 is aligned with the stud to cover the computing board 200. Finally, the locking part 133 is connected to the part of the stud protruding from the first through hole 121. With this configuration, the cover plate 120 can be pressed tightly onto the limiting boss 135 by the locking part 133.

[0402] In some examples, referring to Figure 4I, the portion of the stud protruding from the first through hole 121 is provided with external threads, and the locking part 133 is an anti-slip nut. After aligning the first through hole 121 of the cover plate 120 with the stud to cover the computing board 200, the cover plate 120 is pressed onto the computing board 200 by the anti-slip thread and the external thread of the stud.

[0403] It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art will understand that the fastener 130 can also be a screw, bolt, or rivet, etc., and it should be understood that these exemplary physical connection methods should not be construed as limitations on this application.

[0404] In some embodiments, referring to FIG4I, the cover plate 120 has a recessed portion 122 surrounding the outer periphery of the first through hole 121. The recessed portion 122 is recessed along the side facing the computing board 200, and the surface of the recessed portion 122 adjacent to the computing board 200 abuts against the surface of the computing board 200. This arrangement allows the cover plate 120 to abut against the surface of the computing board 200 through the recessed portion 122, thereby creating a gap between the cover plate 120 and the computing board 200 except at the location of the recessed portion 122. This allows air to enter between the cover plate 120 and the computing board 200 through the gap, thereby carrying away the heat on the computing board 200. On the one hand, the recessed portion 122 abuts against the surface of the computing board 200, thereby fixing the computing board 200 and the cover plate 120. On the other hand, by forming a gap between the cover plate 120 and the computing board 200, the airflow can be used to carry away heat more efficiently, reducing the heat dissipation burden, improving heat dissipation efficiency, and helping to improve the heat dissipation performance of the computing device 1.

[0405] For example, the number of recesses 122 is multiple, and the multiple recesses 122 are spaced apart on the side of the cover plate 120 facing the computing board 200. The multiple recesses 122 are evenly arranged in the middle of the cover plate 120. This arrangement can improve the supporting effect of the cover plate 120 on the computing board 200.

[0406] In some embodiments, referring to FIG4I, the recess 122 has a supporting plane defined on the side facing the computing board 200. The supporting plane abuts against the computing board 200. The provision of the supporting plane can increase the contact area between the recess 122 and the computing board 200. A larger contact area can improve the supporting effect between the recess 122 and the computing board 200. Secondly, the provision of the supporting plane can make the supporting force applied by the recess 122 to the computing board 200 more uniform, reduce the phenomenon of local stress concentration on the computing board 200, and avoid the computing board 200 from deforming or being damaged due to excessive local stress.

[0407] It should be noted that the above is merely illustrative and does not constitute a limitation on this application. Those skilled in the art will understand that the surface of the recessed portion 122 facing the computing board 200 can also be a curved or arc-shaped surface, and is not limited thereto.

[0408] In this embodiment, the connection between the supporting plane and the side of the recess 122 is rounded, thereby forming an arc-shaped surface at the connection between the supporting plane and the side of the recess 122, effectively preventing the recess 122 from damaging the computing board 200. It should be noted that other designs can also be used at the connection between the supporting plane and the side of the recess 122; the above are merely illustrative examples and do not constitute a limitation on this application.

[0409] In some embodiments, referring to FIG4I, the recess 122 defines a groove 123 on the side opposite to the computing board 200, and at least a portion of the locking portion 133 is accommodated within the groove 123. By accommodating at least a portion of the locking portion 133 within the groove 123, this application reduces the displacement and loosening of the locking portion 133 in the radial direction, thereby ensuring the connection stability between the cover plate 120 and the computing board 200. Furthermore, by embedding the locking portion 133 within the groove 123, the occupancy of external space is reduced, optimizing the layout of the computing device 1.

[0410] For example, referring to Figures 4J to 4N, the cover plate 120 is provided with a support structure that abuts against the surface of the computing board 200. This support structure protrudes from the cover plate 120 toward the computing board 200, providing additional support points compared to the recessed portion 122, increasing the contact area between the cover plate 120 and the computing board 200, thereby enhancing the connection stability between the cover plate 120 and the computing board 200.

[0411] In some examples, the support structure can be a support portion 124. The support portion 124 can effectively distribute the pressure between the cover plate 120 and the computing board 200, avoiding stress concentration caused by a single contact point, and improving the stability and seismic resistance of the entire computing module 20. In some examples, multiple support portions 124 are provided, with multiple support portions 124 spaced apart on the side of the cover plate 120 facing the computing board 200, and multiple support portions 124 are evenly distributed in the middle position of the cover plate 120. This arrangement can improve the supporting effect of the cover plate 120 on the computing board 200.

[0412] In this embodiment, the recessed portion 122 and the supporting portion 124 are arranged at intervals on the side of the cover plate 120 facing the computing board 200. It should be noted that the interval arrangement of the recessed portion 122 and the supporting portion 124 can also adopt other designs. The above is only an example and does not constitute a limitation of this application.

[0413] In some embodiments, referring to FIG4K, the support portion 124 includes a plurality of support pads 1241, which are disposed on the side of the support portion 124 facing the liquid cooling module 100, and the surfaces of the plurality of support pads 1241 abut against the surface of the computing board 200. The support pads 1241 may be rubber elastic elements, spring elements, sponges, etc., but are not limited to the above-mentioned examples. The material of the support pads 1241 includes elastic materials. The support pads 1241 made of elastic materials can provide additional cushioning when subjected to external pressure and impact, further enhancing the pressure resistance and impact resistance of the computing module 20. The arrangement of the plurality of support pads 1241 can further disperse vibration and impact forces, reducing the impact on the computing board 200 when the computing device 1 vibrates.

[0414] In some embodiments, referring to FIG4L, the support portion 124 includes a plurality of support arms 1242, and the cover plate 120 has a plurality of hollowed-out heat dissipation holes 125, through which external air can enter the gap between the computing board 200 and the cover plate 120, further improving the airflow between the computing board 200 and the cover plate 120. One end of the support arm 1242 is connected to the edge of the corresponding heat dissipation hole 125, and the other end of the support arm 1242 is bent and abuts against the surface of the computing board 200.

[0415] For example, the support arm 1242 has a certain elasticity. One end of the support arm 1242 is connected to the edge of the heat dissipation hole 125, and the other end of the support arm 1242 is bent and abuts against the surface of the computing board 200. On the one hand, the support arm 1242 can provide support for the computing board 200. On the other hand, the support arm 1242 can provide additional buffer when subjected to external pressure and impact, further enhancing the pressure resistance and impact resistance of the liquid cooling module 100. The arrangement of multiple support arms 1242 can further disperse vibration and impact force, reducing the impact on the computing board 200 when the computing device 1 vibrates.

[0416] In some embodiments, referring to Figures 4M and 4N, the support portion 124 includes a plurality of support protrusions 1243, which are formed by a portion of the cover plate 120 protruding in the direction toward the computing board 200. The surface of the support protrusion 1243 abuts against the surface of the computing board 200. The support protrusion 1243 can provide additional cushioning when subjected to external pressure and impact, further enhancing the pressure resistance and impact resistance of the computing module 20. The arrangement of multiple support protrusions 1243 can further disperse vibration and impact force, reducing the impact on the computing board 200 when the computing device 1 vibrates.

[0417] Figure 5A shows a partial structural schematic diagram of a computing device 1 according to an embodiment of the present application; Figure 5B shows an exploded schematic diagram of a power connection device 400 of a computing device 1 installed on a computing device 1 according to an embodiment of the present application; Figure 5C shows a structural schematic diagram of a third conductive component 430 of a computing device 1 installed on a computing board according to an embodiment of the present application; Figure 5D shows an overall structural schematic diagram of a computing device 1 according to an embodiment of the present application; Figure 5E shows a structural schematic diagram of a second conductive component 420 of a computing device 1 according to an embodiment of the present application; Figure 5F shows a structural schematic diagram of another power connection device 400 of a computing device 1 installed on a computing device 1 according to an embodiment of the present application; Figure 5G shows an exploded schematic diagram of another power connection device 400 of a computing device 1 installed on a computing device 1 according to an embodiment of the present application; Figure 5H shows a structural schematic diagram of a power module 500 of a computing device 1 from one side view according to an embodiment of the present application; Figure 5I shows a structural schematic diagram of a power module 500 of a computing device 1 from another side view according to an embodiment of the present application.

[0418] The power supply module of computing device 1 will be described in detail below with reference to Figures 5A to 5I.

[0419] The computing device 1 of this application embodiment includes a power connection device 400. The conductive components of the power connection device 400 are electrically connected to the power supply terminal of the power module 500 and the power connection terminal of the computing board, which simplifies the internal wiring of the computing device 1 and facilitates the internal space management of the computing device 1. The conductive components are electrically connected to the power supply terminal of the power module 500 and the power connection terminal of the computing board of at least one computing module 20, which enables the power supply of multiple computing modules 20, improves the power supply efficiency of the computing device 1, and simplifies the modification of the power connection when it is necessary to add or replace computing modules 20, thereby improving the scalability of the system.

[0420] Specifically, as shown in Figures 5A to 5C, and in conjunction with Figure 1C, the power module 500 has a first power supply terminal 511 and a second power supply terminal 512 on the side facing away from the conduit cavity 604 in the first direction X. The computing board 200 has a power connection terminal group 230 on the side facing away from the conduit cavity 604 in the first direction X. The power connection terminal group 230 may include a first power connection terminal 231 and a second power connection terminal 232. The power connection device 400 may include a first conductive component 410. The first conductive component 410 includes a first conductive element 411 and a second conductive element 412. The first conductive element 411 may be electrically connected to the first power supply terminal 511 and the first power connection terminal 231 of the computing board 200 of at least one computing module 20. The second conductive element 412 may be electrically connected to the second power supply terminal 512 and the second power connection terminal 232 of the computing board 200 of at least one computing module 20.

[0421] It should be noted that, to meet the high-throughput computing requirements, computing device 1 can integrate a high-performance computing module 20. During power supply, the power module 500 of computing device 1 can form an electrical connection with at least one computing module 20 to supply power to the computing module 20. In this embodiment, the number of computing modules 20 can be set to one or more, for example, one, two, three, four, etc. The number of computing boards 200 integrated within the same computing module 20 can be set to one or more, for example, one, two, three, four, etc., to meet the corresponding computing power requirements. It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application.

[0422] For example, the computing device 1 may include multiple computing modules 20, which may be arranged at intervals along a third direction Z. The computing modules 20 and the power module 500 may be arranged adjacent to each other along a second direction Y. The power supply terminal group 510 of the power module 500 and the power receiving terminal group 230 of the computing module 20 may be integrated on the same side of the chassis 11 in the first direction X, and arranged at corresponding intervals along the second direction Y, which can make the layout of the power supply components of the computing device 1 more concentrated and help to provide efficient power supply to the computing modules 20. The first conductive element 411 and the second conductive element 412 may extend along the second direction Y respectively and be electrically connected to the power supply terminal group of the power supply device and the power receiving terminal group 230 of the computing board 200 of at least one computing module 20 to realize the power supply of at least one computing module 20.

[0423] In some examples, the power supply terminal of the power module 500 can be electrically connected to the power connection terminal of each computing board 200 in each computing module 20 to supply power to all computing boards 200 in the computing device 1 to ensure the computing power of the computing device 1.

[0424] In other examples, the power supply terminal of the power module 500 can be electrically connected to the power connection terminal of some computing boards 200 within some computing modules 20 to supply power to some computing boards 200 within the computing device 1 to meet the specific computing power requirements of the computing boards 200. For example, as shown in Figures 5A and 5B, the computing device 1 may include a power module 500 and two computing modules 20. Each computing module 20 may include two computing boards 200, which are electrically connected to each other. The power module 500 can be electrically connected to any computing board 200 in each computing module 20, thereby enabling simultaneous power supply to the four computing boards 200 included in the two computing modules 20 within the computing device 1. It should be noted that the above are merely illustrative examples and do not constitute a limitation of this application. Those skilled in the art will understand that a corresponding number of computing modules 20 and computing boards 200 can be set according to the computing power requirements of the computing device 1 based on specific application scenarios.

[0425] In some examples, the side of the power module 500 corresponding to the power connection device 400 and the side of the computing board 200 corresponding to the power connection device 400 can be flush, that is, the side of the power module 500 corresponding to the power connection device 400 and the side of the computing board 200 corresponding to the power connection device 400 can be approximately located on the same surface. This allows the arrangement of the power module 500 and the computing board 200 to be more compact, thereby improving the utilization rate of the chassis 11 space.

[0426] In this embodiment, the power module 500 can be electrically connected to at least one computing module 20 via the first conductive component 410 to supply power to the at least one computing module 20. At least a portion of the first conductive component 410 is parallel to the plane containing at least a portion of the computing board 200.

[0427] For example, the plane containing the computing board 200 is parallel to the first direction X and the second direction Y, respectively, that is, the plane containing the computing board 200 is perpendicular to the third direction Z. The first conductive component 410 may include at least one metal busbar, with two ends of the metal busbar extending to a power supply terminal group and a power receiving terminal group, respectively, so that the two ends of the metal busbar are electrically connected to the power supply terminal group and the power receiving terminal group, respectively. The portion of the metal busbar located between the two ends may be parallel to the plane containing the computing board 200.

[0428] It should be noted that the multiple computing boards 200 included in the computing module 20 are spaced apart in the third direction Z. Therefore, the space occupied by the computing module 20 in the first direction X and the second direction Y is greater than the space occupied in the third direction Z. By arranging a portion of the first conductive component 410 parallel to the plane where the computing board 200 is located, the space occupied by the first conductive component 410 in the third direction Z can be reduced, thereby improving the space utilization of the computing device 1 and reducing the size of the computing device 1 in the third direction.

[0429] Referring to Figures 5B and 5C, the first conductive component 410 may include a first conductive element 411 and a second conductive element 412. The first conductive element 411 may be electrically connected to a first power supply terminal 511 of the power supply device and a first power connection terminal 231 of the computing board 200 of at least one computing module 20, and the second conductive element 412 may be electrically connected to a second power supply terminal 512 of the power supply device and a second power connection terminal 232 of the computing board 200 of at least one computing module 20.

[0430] For example, the first power supply terminal 511 and the second power supply terminal 512 of the power module 500 can provide positive and negative power supplies respectively to ensure the correct flow of current and achieve stable power supply. In some examples, as shown in Figures 5A, 5B, 5C and 5D, the first power supply terminal 511 of the power module 500 can be the positive power supply terminal of the power module 500, and the second power supply terminal 512 can be the negative power supply terminal of the power module 500. The first connection terminal 231 of the computing board 200 can be the positive connection terminal of the computing board 200, and the second connection terminal 232 can be the negative connection terminal of the computing board 200. The first conductive element 411 can be electrically connected to the positive power supply terminal of the power module 500 and the positive connection terminal of the computing board 200, and the second conductive element 412 can be correspondingly electrically connected to the negative power supply terminal of the power module 500 and the negative connection terminal of the computing board 200. In power supply application scenarios, current can flow from the positive power supply terminal of the power module 500 to the positive power connection terminal of at least one computing board 200 in at least one computing module 20. After passing through the computing board 200, the current flows back from the negative power connection terminal of the computing board 200 to the negative power supply terminal of the power module 500, completing the current loop and realizing the power supply of at least one computing module 20 in the computing device 1.

[0431] In other examples, the positive and negative terminals of the first power supply terminal 511 and the second power supply terminal 512, as well as the positive and negative terminals of the first power connection terminal 231 and the second power connection terminal 232, can be reversed compared to the examples described above. In this case, the first conductive element 411 can be electrically connected to the negative power supply terminal of the power module 500 and the negative power connection terminal of the computing board 200, and the second conductive element 412 can be electrically connected to the positive power supply terminal of the power module 500 and the positive power connection terminal of the computing board 200, so as to provide power to at least one computing module 20 in the computing device 1. The specific current flow direction will not be described in detail.

[0432] In this embodiment, the first conductive element 411 and the second conductive element 412 can form a stable electrical connection with the power module 500 and the computing module 20. The power module 500 can effectively transmit power to at least one computing module 20, simplifying the complexity of the power connection and ensuring the stable operation of the computing module 20.

[0433] In some examples, where the number of computing modules 20 is at least two, a first conductive element 411 connects at least two stacked computing modules 20, and / or a second conductive element 412 connects at least two stacked computing modules 20, in order to reduce the number of conductive elements, save space inside the chassis, and increase the compactness of the computing modules.

[0434] In some examples, the first conductive element 411 rigidly connects two stacked computing modules 20, and / or the second conductive element 412 rigidly connects two stacked computing modules 20. The first conductive element 411 and / or the second conductive element 412 can provide a certain supporting force to the computing module 20 to ensure the stability of the computing module 20.

[0435] In some examples, the first conductive element 411 is electrically connected to the power module 500 and the computing module 20 respectively through direct connection, and the second conductive element 412 is electrically connected to the power module 500 and the computing module 20 respectively through direct connection. The first conductive element 411 and the second conductive element 412 can be electrically connected between the power module 500 and the computing module 20 by methods such as welding, crimping or bolting, which increases the conductivity efficiency and ensures the firmness and reliability of the connection.

[0436] In other examples, the first conductive element 411 is electrically connected to the power module 500 and the computing module 20 through indirect connections, and the second conductive element 412 is also electrically connected to the power module 500 and the computing module 20 through indirect connections. The first conductive element 411 and the second conductive element 412 can form indirect electrical connections with the power module 500 and the computing module 20 through intermediate connecting components, such as terminals, plugs, sockets, or connectors, increasing connection flexibility and facilitating subsequent maintenance and replacement of the computing device 1.

[0437] In other examples, the connection between the first conductive element 411, the second conductive element 412 and the power receiving terminal and the power supply terminal can be designed as a plug-in connection, which facilitates quick installation and disassembly and improves the maintainability of the computing device 1, and is not limited to this.

[0438] For example, the shapes of the first conductive element 411 and the second conductive element 412 can be set according to the specific spatial layout inside the computing device 1.

[0439] In one example, the power supply terminals of the power module 500 and the power connection terminals of the computing board 200 can be arranged flush, that is, the power supply terminals and the power connection terminals are arranged coplanarly along the second direction Y. The first conductive component 410 can adopt a planar structure, that is, all parts of the first conductive component 410 can be located on the same plane to realize a simple point-to-point connection between the power supply terminal group and the power connection terminal group 230.

[0440] In another specific example, the power supply terminals of the power module 500 and the power connection terminals of the computing board 200 can be non-flushly arranged, that is, the power supply terminals and the power connection terminals are not coplanar along the second direction Y. The first conductive member 411 can be partially bent into a stepped structure, and the bent part can be perpendicular to the other part to bypass the components that form obstacles, and cooperate with other structures of the computing device 1 to achieve its own installation, saving the compact space inside the computing device 1, while increasing the stability of the installation.

[0441] It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. The embodiments of this application do not impose specific limitations on the geometric properties such as the shape and size of the first conductive component 410.

[0442] For example, the contact area between the first conductive component 410 and the power supply terminal and the power receiving terminal of the computing module 20 can be selected according to the current load requirements to ensure connection stability and power supply efficiency. The thickness and width of the first conductive component 410 can also be selected according to the specific requirements of the current load to ensure that the conductive component can withstand the operating current without causing severe overheating or damage. This application embodiment does not impose specific limitations on the thickness, width, contact area with the power supply terminal and the power receiving terminal, etc. of the first conductive component 410.

[0443] For example, the surface of the first conductive component 410 may be plated with gold, silver or other coatings to improve conductivity and oxidation resistance and extend service life.

[0444] In some examples, the surface of the first conductive component 410 may be gold-plated to reduce contact resistance, making it suitable for applications with high requirements for conductivity and corrosion resistance.

[0445] In other examples, the surface of the first conductive component 410 can be silver-plated or nickel-plated to achieve good conductivity and corrosion resistance at low cost, making it suitable for applications where cost control is a high priority. It should be noted that the above are merely illustrative examples and do not constitute a limitation of this application.

[0446] In this way, the power connection device 400 for computing device 1 provided in this embodiment of the application has conductive components electrically connected to the power supply terminal of the power module 500 and the power receiving terminal of the computing board 200, which simplifies the internal wiring of computing device 1 and facilitates the internal space management of computing device 1. The conductive components are electrically connected to the power supply terminal of the power module 500 and the power receiving terminal of the computing board 200 of at least one computing module 20, which can realize the power supply of multiple computing modules 20, improve the power supply efficiency of computing device 1, and simplify the modification of power connection when it is necessary to add or replace computing modules 20, thereby improving the scalability of the system.

[0447] In one embodiment, referring to Figures 5B and 5C, the first conductive element 411 may include a first conductive plate 4111 and a second conductive plate 4112 spaced apart in the second direction Y. The first conductive plate 4111 may be electrically connected to the first power supply terminal 511, and the second conductive plate 4112 may be electrically connected to the first power receiving terminal 231.

[0448] For example, the planes containing the first conductive plate 4111 and the second conductive plate 4112 are perpendicular to the first direction X, and are also perpendicular to the planes containing the power supply terminal and the power receiving terminal, respectively. Thus, the first conductive plate 4111 is correspondingly disposed in surface contact with the first power supply terminal 511, and the second conductive plate 4112 is correspondingly disposed in surface contact with the first power receiving terminal 231, thereby improving the reliability of the electrical connection between the first conductive member 411 and the first power supply terminal 511 and the first power receiving terminal 231.

[0449] In one embodiment, referring to FIG5B, the first conductive element 411 may further include a first connecting plate 4113 connected between the first conductive plate 4111 and the second conductive plate 4112; wherein the planes on which the first conductive plate 4111 and the second conductive plate 4112 are located are arranged in parallel, and the plane on which the first connecting plate 4113 is located is arranged perpendicular to the plane on which the first conductive plate 4111 is located.

[0450] For example, in a power supply application scenario, the current supplied by the power module 500 can be conducted through the first conductive plate 4111, the second conductive plate 4112, and the first connecting plate 4113 between the first conductive plate 4111 and the second conductive plate 4112 to power at least one computing module 20. As shown in Figures 5A and 5B, the first conductive element 411 may include the first conductive plate 4111, the second conductive plate 4112, and the first connecting plate 4113 connected between the first conductive plate 4111 and the second conductive plate 4112. The planes on which the first conductive plate 4111 and the second conductive plate 4112 are located may be arranged in parallel, and the plane on which the first connecting plate 4113 is located may be arranged perpendicular to the plane on which the first conductive plate 4111 is located.

[0451] For example, referring to FIG5B, the computing device 1 may include multiple computing modules 20, which may be stacked along the third direction Z. Each computing module 20 may include multiple computing boards 200, which may be spaced apart along the third direction Z and electrically connected to each other. A first conductive plate 4111 may extend along the third direction Z and form an electrical connection with the first power supply terminal 511 of the power supply device. The direction and range of the extension of the first conductive plate 4111 may be set according to the installation position of the power supply terminal group 510, and this embodiment does not impose specific limitations.

[0452] The second conductive plate 4112 can extend along a third direction Z to form an electrical connection with the multiple computing modules 20 it passes through. Specifically, referring to Figures 5B and 5C, the second conductive plate 4112 can form an electrical connection with the first power terminals 231 of multiple computing boards 200 in the computing module 20 it passes through, so as to supply power to all computing boards 200 in the computing module 20. The direction and range of the extension of the first conductive plate 4111 can be set according to the number of computing modules 20 and computing boards 200, and the position of the power terminal group 230 of computing boards 200. This application embodiment does not impose specific limitations. The first connecting plate 4113 can be connected between the first conductive plate 4111 and the second conductive plate 4112 and extends along the second direction Y.

[0453] As shown in Figure 5D and in conjunction with Figure 5B, the computing device 1 may include two computing modules 20, each computing module 20 may include two computing boards 200, and the computing boards 200 are electrically connected to each other. The first conductive element 411 may be an integrally formed stepped three-dimensional structure. The first conductive plate 4111 and the second conductive plate 4112 are spaced apart in a plane parallel to the third direction Z. The first connecting plate 4113 extends along the second direction Y and connects between the first conductive plate 4111 and the second conductive plate 4112. The second conductive plate 4112 may pass through the two computing modules 20 and form an electrical connection with one computing board 200 in each computing module 20 to supply power to all computing boards 200 in that computing module 20.

[0454] Specifically, the first conductive component 411 can be formed by bending a monolithic part or by direct casting. Specifically, the first conductive plate 4111 can be bent at the junction of the first conductive plate 4111 and the first connecting plate 4113, so that the plane of the first conductive plate 4111 is perpendicular to the plane of the first connecting plate 4113. Correspondingly, the second conductive plate 4112 can be bent at the junction of the second conductive plate 4112 and the first connecting plate 4113, so that the plane of the second conductive plate 4112 is perpendicular to the plane of the first connecting plate 4113. Using a monolithic molding process simplifies the manufacturing process, reduces production costs, and provides stable mechanical support and high electrical connection efficiency for the first conductive component 411. In specific application scenarios, the bending positions and directions of the first conductive plate 4111 and the second conductive plate 4112 in the first conductive component 411 can be adjusted according to the actual installation space; this embodiment does not impose specific limitations.

[0455] In other examples, the first conductive element 411 can be formed in separate parts and then assembled to form a stepped three-dimensional structure. Specifically, the first conductive element 411 can be formed by combining the first conductive plate 4111, the second conductive plate 4112, and the first connecting plate 4113 through plugging, bolting, or other methods, increasing the flexibility and scalability of the first conductive element 411.

[0456] It should be noted that the above are merely illustrative examples. The application examples provided in this application embodiment are for ease of understanding. This application embodiment does not specifically limit the formation method of the first conductive element 411.

[0457] For example, the first conductive plate 4111 and the second conductive plate 4112 may be located on the same plane perpendicular to the first direction X, or the first conductive plate 4111 and the second conductive plate 4112 may be located on different planes perpendicular to the first direction X and parallel to each other, so as to match the specific position distribution of the power supply terminal group and the power receiving terminal group 230 (see FIG. 5C) in the computing device 1 in the first direction X, thereby forming a stable electrical connection between the power supply terminal group and the power receiving terminal group 230.

[0458] For example, the first slide plate 63 of the chassis 11 and / or the power connection device 400 are provided with a clearance structure, which is configured to prevent interference between the first slide plate 63 and the power connection device 400.

[0459] In this embodiment, interference refers to at least a portion of the structure of the first slide plate 63 and the power connection device 400 being in spatial contact or overlapping. By providing a clearance structure on the first slide plate 63 and / or the power connection device 400, the two can avoid each other, thereby preventing the first slide plate 63 from affecting the installation of the power connection device 400 and improving the installation convenience and structural compactness of the power connection device 400 in the computing device 1.

[0460] In some examples, the clearance structure may be located at the end of the first slide plate 63 adjacent to the power connection device 400. Specifically, the clearance structure may be a clearance opening that penetrates the first slide plate 63 to connect the two sub-cavities. Part of the structure of the power connection device 400 may pass through the clearance opening so that the power connection device 400 can be electrically connected to the power supply terminal group of the power module 500 and the power connection terminal group of the computing module 20 in the two sub-cavities, respectively.

[0461] In a specific example, as shown in Figures 5D and 5F, and in conjunction with Figure 2B, the clearance structure includes a first clearance opening 632 and a second clearance opening 633. The end of the first slide plate 63 facing away from the pipeline cavity 604 has a first clearance opening 632, which is used to clear the first conductive element 411 of the power connection device 400, so that the first conductive element 411 (see Figure 5A) can be electrically connected to the first power supply terminal 511 (see Figure 5B) and the first electrical connection terminal 231 (see Figure 5C) located on opposite sides of the first slide plate 63 in the second direction Y, respectively.

[0462] Specifically, in the example where the first conductive element 411 includes a first connecting plate 4113, the first connecting plate 4113 can extend through the first clearance notch 632, increasing the compactness of the layout. At the same time, the first clearance notch 632 provides a limit for the first conductive element 411, improving the overall stability of the first conductive element 411.

[0463] It should be noted that in other examples, the first conductive element 411 may have a bending structure to avoid the first slide plate 63. By designing the first conductive element 411 with a bending feature, the internal space of the computing device 1 can be utilized more effectively to install conductive components, making the internal layout of the computing device 1 compact and rationally realizing the power supply of the computing module 20. The bending structure of the first conductive element 411 can be used to limit the first conductive element 411, prevent the first conductive element 411 from shaking, and ensure the stability of the electrical connection.

[0464] As shown in Figure 2B, the end of the first slide plate 63 facing away from the pipe cavity 604 has a second clearance opening 633, which is used for the second conductive element 412 (as shown in Figure 5B) to pass through. Referring to Figures 5B and 5C, the power module 500 of the power supply unit has a second power supply terminal 512, and the power connection device 400 of the power supply unit includes the second conductive element 412. The computing board 200 has a second power connection terminal 232, and the second conductive element 412 is connected to the second power supply terminal 512 and the second power connection terminal 232. The second conductive element 412 extends towards the computing board 200 through the second clearance opening 633 (see Figure 2B) of the first slide plate 63. The second clearance opening 633 provides clearance for the second conductive element 412 and increases the compactness of the layout.

[0465] In some examples, the power connection device 400 has a bent structure that matches the chassis. Specifically, referring to FIG5F, the second conductive element 412 of the power connection device 400 has a bent structure 412a that can bypass the outer side of the end of the first slide plate 63 away from the conduit cavity 604 to define a clearance space with the first slide plate 63, thereby avoiding the first slide plate 63.

[0466] The position of the power connection device 400 corresponding to the first slide plate 63 is configured as a bent structure, which can avoid the end of the power connection device 400 adjacent to the first slide plate 63 through the bent structure.

[0467] It should be noted that in other examples of this application, avoidance structures are provided on the first slide plate 63 and the power connection device 400 respectively. For example, an avoidance opening can be provided on the first slide plate 63 and a bending structure can be provided on the power connection device 400 at the same time to avoid contact between the first slide plate 63 and the power connection device 400.

[0468] Referring to Figures 5B and 5C, in one embodiment, the second conductive element 412 may include a third conductive plate 4121 and a fourth conductive plate 4122 disposed at intervals along the second direction Y. The third conductive plate 4121 may be electrically connected to the second power supply terminal 512, and the fourth conductive plate 4122 may be electrically connected to the second power receiving terminal 232.

[0469] In one embodiment, the second conductive element 412 may further include a second connecting plate 4123 connected between the third conductive plate 4121 and the fourth conductive plate 4122; wherein the planes on which the second connecting plate 4123, the third conductive plate 4121 and the fourth conductive plate 4122 are located may be arranged in parallel.

[0470] For example, the third conductive plate 4121 can be electrically connected to the second power supply terminal 512, and the fourth conductive plate 4122 can be electrically connected to the second power connection terminal 232. In power supply application scenarios, the current supplied by the power module 500 can be conducted through the third conductive plate 4121, the second connecting plate 4123, and the fourth conductive plate 4122 to power at least one computing module 20.

[0471] For example, the planes containing the second connecting plate 4123, the third conductive plate 4121, and the fourth conductive plate 4122 of the second conductive member 412 can be arranged in parallel. The third conductive plate 4121 and the fourth conductive plate 4122 can be located on the same plane perpendicular to the first direction X, or the third conductive plate 4121 and the fourth conductive plate 4122 can be located on different planes perpendicular to the first direction X and parallel to each other, so as to match the specific position distribution of the power supply terminal group and the power receiving terminal group 230 in the computing device 1 in the first direction X, so that a stable electrical connection is formed between the power supply terminal group and the power receiving terminal group 230.

[0472] In some examples, as shown in Figure 5D and in conjunction with Figure 2B, the second conductive element 412 extends through the second clearance opening 633 of the first slide plate 63 of the chassis 11. Specifically, as shown in Figure 5B, the second connecting plate 4123 of the second conductive element 412 can be a straight plate parallel to the plane defined by the second direction Y and the third direction Z. The second connecting plate 4123 extends through the second clearance opening 633 of the first slide plate 63 of the chassis 11, increasing the compactness of the layout. At the same time, the second clearance opening 633 provides a limit for the second conductive element 412, improving the overall stability of the second conductive element 412.

[0473] In other examples, as shown in Figure 5F and in conjunction with Figure 2B, the second conductive element 412 bypasses the outer side of the end of the first slide plate 63 away from the conduit cavity 604. Specifically, as shown in Figure 5F, the second conductive element 412 has a bent structure 412a that can bypass the outer side of the end of the first slide plate 63 away from the conduit cavity 604, thereby avoiding the first slide plate 63.

[0474] For example, the computing module 20 may include multiple computing boards 200, which are spaced apart along a third direction Z and electrically connected to each other. A third conductive plate 4121 extends along a third direction Z and forms an electrical connection with the second power supply terminal 512 of the power supply device. The direction and range of the extension of the third conductive plate 4121 can be set according to the installation position of the power supply terminal group 510 on the power module 500, and this embodiment does not impose specific limitations. A fourth conductive plate 4122 extends along a third direction Z and forms an electrical connection with at least one computing module 20 it passes through. Specifically, the fourth conductive plate 4122 can form an electrical connection with the second power connection terminal 232 of at least one computing board 200 in the passing computing module 20 to supply power to all computing boards 200 within the computing module 20. The direction and range of the extension of the fourth conductive plate 4122 can be set according to the number of computing modules 20 and computing boards 200, and the position of the power connection terminal group 230 of the computing boards 200, and this embodiment does not impose specific limitations. The second connecting plate can connect the first conductive plate 4111 and the second conductive plate 4112, and extends along the second direction Y.

[0475] For example, as shown in FIG5D and in conjunction with FIG5B, computing device 1 may include two computing modules 20, each computing module 20 may include two computing boards 200, which are electrically connected to each other. The second conductive member 412 may be a planar structure, and the second connecting plate, the third conductive plate 4121, and the fourth conductive plate 4122 may be located on the same plane perpendicular to the first direction X. The second conductive member 412 may be L-shaped, and the fourth conductive plate 4122 may pass through the two computing modules 20 to form an electrical connection with one computing board 200 in each computing module 20, so as to supply power to all computing boards 200 in the computing module 20.

[0476] In some examples, the second conductive element 412 can be a single-piece molded part, which can simplify the manufacturing process, reduce production costs, and improve electrical connection efficiency.

[0477] In other examples, the second conductive element 412 can be formed separately and then assembled. Specifically, the second conductive element 412 can be formed by combining the third conductive plate 4121, the fourth conductive plate 4122, and the second connecting plate through plugging, bolting, or other means, increasing the flexibility and scalability of the second conductive element 412.

[0478] It should be noted that the above are merely illustrative examples. The application examples provided in this application embodiment are for ease of understanding. This application embodiment does not specifically limit the formation method of the second conductive element 412.

[0479] In one embodiment, a first avoidance area is defined between the first conductive plate 4111 and the second conductive plate 4112 in a second direction Y, and the second conductive member 412 may be located in the first avoidance area.

[0480] For example, as shown in Figures 5B and 5D, the first conductive plate 4111 and the second conductive plate 4112 can extend in the same direction along a third direction Z, and the first connecting plate 4113 can be connected between the first conductive plate 4111 and the second conductive plate 4112, extending along a second direction Y. A first clearance area can be defined between the first conductive plate 4111 and the second conductive plate 4112, providing space for the installation and arrangement of the second conductive component 412, which helps to optimize space utilization and ensure electrical isolation between the conductive components.

[0481] In one embodiment, the material of the first conductive component 410 may include at least one of copper, aluminum, and silver. In some examples, the material of the first conductive component 410 may be a single piece of copper, a single piece of silver, or a single piece of aluminum, ensuring that the first conductive component 410 has good conductivity and corrosion resistance. In other examples, the first conductive component 410 may be modularly formed, assembled from dissimilar modular components such as copper and aluminum parts, to fully utilize the advantages of multiple materials and optimize conductivity and mechanical properties.

[0482] It should be noted that the above are merely illustrative examples. The application examples provided in this application embodiment are for ease of understanding. This application embodiment does not specifically limit the material of the first conductive component 410.

[0483] In one embodiment, the length of the first conductive element 411 is 15 to 19 mm, the width of the first conductive element 411 is 2 to 3 mm, and the thickness of the first conductive element 411 is 0.2 to 0.4 mm; the length of the second conductive element 412 is 6 to 8 mm, the width of the second conductive element 412 is 2 to 3 mm, and the thickness of the second conductive element 412 is 0.2 to 0.4 mm.

[0484] For example, the length of the first conductive element 411 refers to its dimension in the second direction Y, the width of the first conductive element 411 refers to its dimension in the third direction Z, and the thickness of the first conductive element 411 refers to its dimension in the first direction X. Similarly, the length of the second conductive element 412 refers to its dimension in the second direction Y, the width of the second conductive element 412 refers to its dimension in the first direction X, and the thickness of the second conductive element 412 refers to its dimension in the third direction Z.

[0485] In a specific example, the first conductive element 411 has a length of 17 mm, a width of 2.5 mm, and a thickness of 0.3 mm. The second conductive element 412 has a length of 7 mm, a width of 2.5 mm, and a thickness of 0.3 mm.

[0486] It should be noted that the product of the width and thickness of the first conductive element 411 and the second conductive element 412 is the cross-sectional area. The size of the cross-sectional area is negatively correlated with the resistance of the first conductive element 411 and the second conductive element 412. In other words, the larger the cross-sectional area of ​​the conductive element, the lower its resistance, and the smaller the cross-sectional area of ​​the conductive element, the higher its resistance. By setting the width and thickness of the first conductive element 411 and the second conductive element 412 to 2 to 3 mm and 0.2 to 0.4 mm, respectively, the first conductive element 411 and the second conductive element 412 can have a larger cross-sectional area, thereby reducing the resistance of the first conductive element 411 and the second conductive element 412, thus reducing the loss of the first conductive component 410 during power transmission, and also reducing the heat generated by the first conductive component 410 during power transmission.

[0487] It is understood that the above is only an exemplary description. The specific dimensions of the first conductive element 411 and the second conductive element 412 can be flexibly set according to the distance between the power supply terminal group and the power receiving terminal group, the internal space dimensions of the housing 11, and the impedance of the conductive element itself. This application embodiment does not make specific limitations in this regard.

[0488] In one embodiment, the power connection device 400 may further include: at least one second conductive component 420, corresponding to at least one computing module 20, wherein at least a portion of the second conductive component 420 is parallel to the plane containing at least a portion of the computing board 200. A first conductive component 410 may be electrically connected to the computing board 200 of at least one computing module 20 via at least one second conductive component 420.

[0489] For example, the plane containing the computing board 200 is parallel to the first direction X and the second direction Y, respectively, that is, the plane containing the computing board 200 is perpendicular to the third direction Z. The second conductive component 420 may include at least one metal busbar, with two ends of the metal busbar extending to the first conductive component 410 and the power connection terminal group, respectively, so that the two ends of the metal busbar are electrically connected to the first conductive component 410 and the power connection terminal group, respectively. The portion of the metal busbar located between the two ends may be parallel to the plane containing the computing board 200.

[0490] It should be noted that the multiple computing boards 200 included in the computing module 20 are spaced apart in the third direction Z. Therefore, the space occupied by the computing module 20 in the first direction X and the second direction Y is greater than the space occupied in the third direction Z. By arranging a portion of the second conductive component 4210 parallel to the plane where the computing board 200 is located, the space occupied by the second conductive component 420 in the third direction Z can be reduced, thereby improving the space utilization of the computing device 1 and reducing the size of the computing device 1 in the third direction Z.

[0491] In this embodiment of the application, referring to Figures 5B and 5C, the computing device 1 may include at least one computing module 20, and the computing module 20 may include at least one computing board 200. The power connection device 400 may include at least one second conductive component 420 corresponding to at least one computing module 20. Exemplarily, the second conductive component 420 may be configured one-to-one with the computing module 20. The second conductive component 420 may be electrically connected to the first conductive component 410, and may also be electrically connected to the power terminal group 230 of at least one computing board 200 within the same computing module 20. It is understood that in the scenario where the computing device 1 includes multiple computing modules 20, and each computing module 20 includes multiple computing boards 200, the second conductive component 420 may enable the multiple computing boards 200 within the same computing module 20 to form an electrical connection with each other. During the power supply process, the current generated by the power module 500 can form a loop between multiple computing boards 200 in the computing module 20 through the first conductive component 410 and the second conductive component 420, thereby enabling simultaneous power supply to multiple computing modules 20 and multiple computing boards 200 and improving power supply efficiency.

[0492] In one embodiment, the second conductive component 420 may include a first electrical connector 421 and a second electrical connector 422. The first conductive component 411 can be electrically connected to the first power terminal 231 of the computing board 200 through the first electrical connector 421, and the second conductive component 412 can be electrically connected to the second power terminal 232 of the computing board 200 through the second electrical connector 422.

[0493] For example, the first electrical connector 421 and the second electrical connector 422 can be installed in the same computing module 20. The first electrical connector 421 can form an electrical connection with the first power terminal 231 of each computing board 200 in the computing module 20, and the second electrical connector 422 can form an electrical connection with the second power terminal 232 of each computing board 200 in the computing module 20. Specifically, the first electrical connector 421 can be provided with a folded edge structure, which may include at least one electrical connection plate. The at least one electrical connection plate can be provided in a one-to-one correspondence with at least one computing board 200 in the computing module 20 and can be electrically connected to the first power terminal 231 of at least one computing board 200. Correspondingly, the second electrical connector 422 can be provided with at least one folded edge. The at least one folded edge of the second electrical connector 422 can be provided in a one-to-one correspondence with at least one computing board 200 in the computing module 20 and can be electrically connected to the second power terminal 232 of at least one computing board 200.

[0494] It should be noted that the above are merely illustrative examples. The application examples provided in this application embodiment are for ease of understanding. This application embodiment does not specifically limit the connection structure of the second conductive component 420.

[0495] In this embodiment, the electrical connection plate of the second conductive component 420 can be configured to correspond to all or part of the computing boards 200 integrated within the same computing module 20. For example, the number of computing boards 200 included in the same computing module 20 can be one, two, three, four, etc., and the number of electrical connection plates corresponding to the second conductive component 420 can also be one, two, three, four, etc. This embodiment does not impose specific limitations. The direction and range of the extension of the electrical connection plate in the second conductive component 420 can be set according to the installation position of the computing board 200 relative to the computing device 1; this embodiment does not impose specific limitations. It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application.

[0496] For example, in a scenario where the same computing module 20 includes multiple computing boards 200, the electrical connection plate of the first electrical connector 421 can correspond one-to-one with the multiple computing boards 200 in the same computing module 20 and can be electrically connected to the first power terminal 231 of the multiple computing boards 200. Correspondingly, the electrical connection plate of the second electrical connector 422 can correspond one-to-one with the multiple computing boards 200 in the same computing module 20 and can be electrically connected to the second power terminal 232 of the multiple computing boards 200, so that an electrical connection is formed between the multiple computing boards 200 in the same computing module 20. During power supply, the power module 500 can form an electrical connection with the first power terminal 231 of multiple computing boards 200 through the first conductive element 411 and the first electrical connector 421, and form an electrical connection with the second power terminal 232 of multiple computing boards 200 through the second conductive element 412 and the second electrical connector 422. The current can form a loop among the multiple computing boards 200 in the computing module 20, so as to realize the simultaneous power supply of multiple computing boards 200 in the same computing module 20 and improve the power supply efficiency.

[0497] For example, the first power supply terminal 511 and the second power supply terminal 512 of the power module 500 can provide positive and negative power respectively to ensure power supply.

[0498] In some examples, as shown in Figures 5A, 5B, 5C, and 5D, the first power supply terminal 511 of the power module 500 can be the positive terminal of the power module 500, and the second power supply terminal 512 can be the negative terminal of the power module 500. The first electrical connection terminal 231 of the computing board 200 can be the positive terminal of the computing board 200, and the second electrical connection terminal 232 can be the negative terminal of the computing board 200. The first electrical connector 421 can be electrically connected to the positive terminal of the computing board 200 and the first conductive plate 4111, and the second electrical connector 422 can be correspondingly electrically connected to the negative terminal of the computing board 200 and the second conductive plate 4112. In the power supply application scenario, the current can flow from the positive terminal of the power module 500 to the positive terminal of at least one computing board 200 in at least one computing module 20, and after passing through the computing board 200, it flows back from the negative terminal of the computing board 200 to the negative terminal of the power module 500, completing the current loop and realizing the power supply to at least one computing module 20 in the computing device 1.

[0499] In other examples, the positive and negative terminals of the first power supply terminal 511 and the second power supply terminal 512, as well as the positive and negative terminals of the first power connection terminal 231 and the second power connection terminal 232, can be reversed compared to the examples described above. In this case, the first electrical connector 421 can be electrically connected to the negative terminal of the computing board 200 and the first conductive plate 4111, and the second electrical connector 422 can be electrically connected to the positive terminal of the computing board 200 and the second conductive plate 4112, so as to provide power to at least one computing module 20 in the computing device 1. The specific current flow direction will not be described in detail.

[0500] It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art can flexibly configure the power supply and connection terminals according to specific application scenarios.

[0501] In this embodiment, the first electrical connector 421 and the second electrical connector 422 enable a stable electrical connection between multiple computing boards 200 within the same computing module 20. This facilitates the power module 500 to effectively transmit power to the multiple computing boards 200 of the computing module 20, thereby improving the power supply efficiency of the computing device 1. When it is necessary to add or replace computing boards 200, the modification of the power connection is simple, thus improving the scalability of the system.

[0502] In one embodiment, the first electrical connector 421 may include a first electrical contact surface 421a and a second electrical contact surface, the first electrical contact surface 421a being used to make electrical contact with the first conductive element 411, and the second electrical contact surface being used to make electrical connection with the first power terminal 231 of the computing board 200.

[0503] In one embodiment, the second electrical connector 422 may include a third electrical contact surface 422a and a fourth electrical contact surface disposed opposite to each other. The third electrical contact surface 422a may be used to make electrical contact with the second conductive element 412, and the fourth electrical contact surface may be used to make electrical connection with the second power terminal 232 of the computing board 200.

[0504] For example, as shown in Figures 5D, 5E, and 5G, the first electrical connector 421 and the second electrical connector 422 can be double-sided electrical contact devices. The first electrical connector 421 may include opposing first electrical contact surfaces 421a and 422a (not shown in the figures), and the second electrical connector 422 may include opposing third and fourth electrical contact surfaces (not shown in the figures). The contact area between the second conductive component 420 and the first conductive component 410 and the power connection terminal group 230 of the computing board 200 can be selected according to the current load requirements to ensure connection stability and power supply efficiency. This application embodiment does not impose specific limitations in this regard.

[0505] For example, each computing module 20 may include two computing boards 200. Taking the installation scenario of the power connection device 400 as an example, the first electrical connector 421 may be first installed on the first power connection terminal 231 of the two computing boards 200 in the computing module 20, and the second electrical connector 422 may be installed on the second power connection terminal 232 of the two computing boards 200 in the computing module 20. The second electrical contact surface of the first electrical connector 421 may form an electrical connection with the first power connection terminal 231 of the computing board 200, and the fourth electrical contact surface of the second electrical connector 422 may be used to form an electrical connection with the second power connection terminal 232 of the computing board 200. The first conductive plate 4111 of the first conductive member 411 may be installed on the power supply terminal group of the power module 500, and the second conductive plate 4112 may be installed on the first folded edge 4211 of the first electrical connector 421, wherein the second conductive plate 4112 may form an electrical contact with the first electrical contact surface 421a of the first electrical connector 421. The third conductive plate 4121 of the second conductive component 412 can be installed on the power supply terminal group of the power module 500, and the fourth conductive plate 4122 can be installed on the third folded edge 4221 of the second electrical connector 422. The fourth conductive plate 4122 can form electrical contact with the third electrical contact surface 422a of the second electrical connector 422. During power supply, the current generated by the power module 500 can form a loop between multiple computing boards 200 within the computing module 20 through the first conductive component 410 and the second conductive component 420, thereby enabling simultaneous power supply to multiple computing modules 20 and multiple computing boards 200 and improving power supply efficiency.

[0506] In one embodiment, referring to FIG5B, the first electrical connector 421 may include a first folded edge 4211 and a second folded edge 4212 connected to each other. The first folded edge 4211 may be arranged perpendicularly to the plane where the second folded edge 4212 is located. The two opposite side surfaces of the first folded edge 4211 may respectively form a first electrical contact surface and a second electrical contact surface. The second folded edge 4212 may be attached to the computing board 200.

[0507] In one embodiment, the second electrical connector 422 may include a third folded edge 4221 and a fourth folded edge 4222 connected to each other. The third folded edge 4221 may be arranged perpendicularly to the plane where the fourth folded edge 4222 is located. The two opposite side surfaces of the third folded edge 4221 may respectively form a third electrical contact surface and a fourth electrical contact surface. The fourth folded edge 4222 may be attached to the computing board 200.

[0508] For example, the first conductive component 410 can be electrically connected to the power terminal group 230 of the computing board 200 through the folded edge structure of the second conductive component 420. As shown in Figures 5B to 5G, two computing boards 200, namely the first computing board 201 and the second computing board 202, can be integrated in the computing module 20. The first electrical connector 421 can be correspondingly provided with a first folded edge 4211 extending along the third direction Z, and the second electrical connector 422 can be correspondingly provided with a third folded edge 4221 extending along the third direction Z. Among them, the two side surfaces of the first folded edge 4211 opposite to each other along the first direction X can respectively form a first electrical contact surface 421a and a second electrical contact surface, and the two side surfaces of the third folded edge 4221 opposite to each other along the first direction X can respectively form a third electrical contact surface 422a and a fourth electrical contact surface. The first folded edge 4211 of the first electrical connector 421 can form an electrical connection with the second conductive plate 4112 through the first electrical contact surface 421a, and can simultaneously form an electrical connection with the first power terminal 231 of the first computing board 201 and the first power terminal 231 of the second computing board 202 through the second electrical contact surface. Correspondingly, the third folded edge 4221 of the second electrical connector 422 can form an electrical connection with the fourth conductive plate 4122 through the third electrical contact surface 422a, and can simultaneously form an electrical connection with the second power terminal 232 of the first computing board 201 and the second power terminal 232 of the second computing board 202 through the fourth electrical contact surface. The first folded edge 4211 may include two first electrical connection plates 42111 corresponding to the first computing board 201 and the second computing board 202, and the third folded edge 4221 may include two second electrical connection plates 42211 corresponding to the first computing board 201 and the second computing board 202. The first electrical connector 421 can be electrically connected to the first power terminal 231 of the first computing board 201 and the second computing board 202 via the two electrical connection plates of the first folded edge 4211. The second electrical connector 422 can be electrically connected to the second power terminal 232 of the first computing board 201 and the second computing board 202 via the electrical connection plate of the third folded edge 4221, so that the first computing board 201 and the second computing board 202 within the same computing module 20 are electrically connected. During the power supply process, the power module 500 can be electrically connected to the power terminals of multiple computing boards 200 via the first conductive component 410 and the second electrical connector 422. The current can form a loop among the multiple computing boards 200 within the computing module 20, realizing the simultaneous power supply to multiple computing boards 200 in the same computing module 20, thereby improving the power supply efficiency.

[0509] It should be noted that the above are merely illustrative examples. The application examples provided in this application embodiment are for ease of understanding. This application embodiment does not specifically limit the connection structure of the second conductive component 420.

[0510] In this way, multiple computing boards 200 within the same computing module 20 can be electrically connected through the second conductive component 420. During power supply, all computing boards 200 within the computing module 20 can receive power, improving the power supply efficiency of the computing device 1. It should be noted that the above is merely a specific example and does not constitute a limitation on this application.

[0511] In this embodiment of the application, the first folded edge 4211 may be arranged perpendicularly to the plane where the second folded edge 4212 is located, and the third folded edge 4221 may be arranged perpendicularly to the plane where the fourth folded edge 4222 is located.

[0512] In some examples, the second conductive component 420 can be a one-piece stepped three-dimensional structure. Specifically, the second conductive component 420 can be formed by bending a one-piece molded part, or it can be directly cast using a mold. Taking the first electrical connector 421 as an example, multiple first folds 4211 can be bent at the junction of multiple first folds 4211 and second folds 4212, so that the plane containing the first folds 4211 is perpendicular to the plane containing the second folds 4212, thus forming the first electrical connector 421. This configuration simplifies the manufacturing process, reduces production costs, and provides stable mechanical support and high electrical connection efficiency for the second conductive component 420. In specific application scenarios, the bending position and direction of the first folds 4211 in the first electrical connector 421 can be adjusted according to the actual installation space, and this application embodiment does not impose specific limitations.

[0513] In other examples, the second conductive component 420 can be a stepped three-dimensional structure formed by separate molding and assembly. Specifically, the second conductive component 420 can be formed by combining the first folded edge 4211 and the second folded edge 4212 through methods such as plugging and bolting, increasing the flexibility and scalability of the second conductive component 420.

[0514] It should be noted that the above are merely illustrative examples. The application examples provided in this application embodiment are for ease of understanding. This application embodiment does not specifically limit the formation method of the second conductive component 420.

[0515] In one embodiment, the first electrical connector 421 has a length of 14 to 16 mm, a width of 2 to 3 mm, and a thickness of 0.2 to 0.4 mm; the second electrical connector 422 has a length of 17 to 21 mm, a width of 2 to 3 mm, and a thickness of 0.2 to 0.4 mm.

[0516] For example, the length of the first electrical connector 421 refers to its dimension in the second direction Y, the width of the first electrical connector 421 refers to its dimension in the third direction Z, and the thickness of the first electrical connector 421 refers to its dimension in the first direction X. Similarly, the length of the second electrical connector 422 refers to its dimension in the second direction Y, the width of the second electrical connector 422 refers to its dimension in the third direction Z, and the thickness of the second electrical connector 422 refers to its dimension in the first direction X.

[0517] In a specific example, the first electrical connector 421 has a length of 15 mm, a width of 2.5 mm, and a thickness of 0.3 mm. The second electrical connector 422 has a length of 19 mm, a width of 2.5 mm, and a thickness of 0.3 mm.

[0518] It should be noted that the product of the width and thickness of the first electrical connector 421 and the second electrical connector 422 is the cross-sectional area. The size of the cross-sectional area is negatively correlated with the resistance of the first electrical connector 421 and the second electrical connector 422. In other words, the larger the cross-sectional area of ​​the conductive component, the lower its resistance; conversely, the smaller the cross-sectional area of ​​the conductive component, the higher its resistance. By setting the width and thickness of the first electrical connector 421 and the second electrical connector 422 to 2 to 3 mm and 0.2 to 0.4 mm, respectively, the first electrical connector 421 and the second electrical connector 422 can have a larger cross-sectional area. This reduces the resistance of the first electrical connector 421 and the second electrical connector 422, thereby reducing the loss of the second conductive component 420 during power transmission and also reducing the heat generated by the second conductive component 420 during power transmission.

[0519] It is understood that the above is only an exemplary description. The specific dimensions of the first electrical connector 421 and the second electrical connector 422 can be flexibly set according to the distance between the power supply terminal group and the power receiving terminal group, the size of the second conductive component 420, the internal space size of the chassis 11, and the impedance of the electrical connector itself. This application embodiment does not make specific limitations in this regard.

[0520] As shown in Figure 5D, the second folded edge 4212 and the fourth folded edge 4222 of the second conductive component 420 can be fitted together with the computing board 200 to support the second conductive component 420 in supplying power. Specifically, the second folded edge 4212 and the fourth folded edge 4222 can be mechanically fixed to the computing board 200, such as by screws or clips, to ensure the stability and reliability of the second conductive component 420 during use.

[0521] This design, through the bending design of the second conductive component 420, allows for more efficient use of the internal space of the computing device 1 to install the conductive components, resulting in a compact and rational internal layout of the computing device 1 and enabling power supply to the computing module 20. The bent edge structure of the second conductive component 420 can be used to fix and support the first conductive component 411, ensuring the stability of the electrical connection. The bent edge structure of the second conductive component 420 is scalable, allowing for flexible addition or removal of the computing board 200 to adapt to different computing power requirements.

[0522] In one embodiment, the first folded edge 4211 of the second conductive component 420 and the second conductive plate 4112 of the first conductive member 411 can be fixedly connected by fasteners 440.

[0523] In one embodiment, the third folded edge 4221 of the second conductive component 420 and the fourth conductive plate 4122 of the second conductive element 412 can be fixedly connected by a fastener 440. Exemplarily, as shown in Figures 5B, 5C, and 5D, the first conductive component 410, the second conductive component 420, and the third conductive component 430 at the power connection terminal group 230 of the computing board 200 can each be provided with a plurality of connection holes arranged in rows along the second direction Y. The first conductive component 410, the second conductive component 420, and the third conductive component 430 at the power connection terminal group 230 of the computing board 200 can be fixedly connected by a fastener 440. The fastener 440 can be a conductive element, can be a screw structure, and can be made of at least one of copper, aluminum, and silver.

[0524] In some examples, fastener 440 can be made of silver, which is suitable for scenarios where high resistance to corrosion and conductivity are required.

[0525] In other examples, fastener 440 can be made of aluminum, which is suitable for scenarios where weight control is a critical requirement.

[0526] It should be noted that the above are merely illustrative examples. The application examples provided in this application embodiment are for ease of understanding. This application embodiment does not specifically limit the material and shape of the fastener 440.

[0527] As shown in Figures 5B to 5D, during the installation of the power connection device 400, the fastener 440 can pass through the connection holes of the first conductive component 410, the second conductive component 420, and the third conductive component 430 at the power connection terminal group 230 of the computing board 200 in sequence, so that the first conductive component 410, the second conductive component 420, and the third conductive component 430 fit tightly together, thereby achieving a stable electrical connection between the first conductive component 410, the second conductive component 420, and the third conductive component 430 and the computing board 200.

[0528] For example, as shown in Figures 5A to 5E, computing device 1 may include two computing modules 20, and each computing module 20 may include two computing boards 200. Taking the process of mounting the first conductive plate 4111 onto the first electrical connector 421 as an example, the first folded edge 4211 of the first electrical connector 421 may be provided with a plurality of connection holes arranged side by side along the second direction Y, including a first connection hole 4211a and a second connection hole 4211b. The first connection hole 4211a can be used for fasteners 440 to pass through the first electrical connector 421, the first conductive member 411, and the third conductive component 430 mounted on the first computing board 201, so that the first electrical connector 421, the first conductive member 411, and the third conductive component 430 form a tight electrical connection. The second connection hole 4211b can be used for fasteners 440 to pass through the first electrical connector 421 and the third conductive component 430 mounted on the second computing board 202, so that the first electrical connector 421 and the third conductive component 430 form a tight electrical connection. The number of the first connecting hole 4211a and the second connecting hole 4211b can be at least one. In this embodiment, the specific number of the first connecting hole 4211a and the second connecting hole 4211b is not specifically limited. This arrangement ensures that the power connection device 400 will not loosen or shift due to vibration or other external forces during the operation of the computing device 1, and also improves the conduction efficiency of the electrical connection.

[0529] In some examples, the inner peripheral walls of multiple connection holes can be threaded to accommodate fasteners 440, allowing the fasteners 440 to pass through and be tightened, ensuring the stability of the connection between conductive components.

[0530] In other examples, the connection between conductive components can be completed by using nuts and fasteners 440, which increases the tightness of the fit between conductive components and reduces the processing cost of conductive components.

[0531] It should be noted that the above are merely illustrative examples. The application examples provided in this application embodiment are for ease of understanding. This application embodiment does not limit the specific method by which the fastener 440 passes through the connection hole to fasten multiple conductive components.

[0532] In one embodiment, as shown in Figures 5B to 5E, the computing module 20 may include two computing boards 200 spaced apart; the first folded edge 4211 of the first electrical connector 421 may include two first electrical connection plates 42111 spaced apart along the second direction Y, and the two first electrical connection plates 42111 may be electrically connected to the first power terminals 231 of the two computing boards 200 respectively; the third folded edge 4221 of the second electrical connector 422 may include two second electrical connection plates 42211 spaced apart along the second direction Y, and the two second electrical connection plates 42211 may be electrically connected to the second power terminals 232 of the two computing boards 200 respectively.

[0533] For example, as shown in Figures 5B and 5E, during the installation of the power connection device 400, the fastener 440 can pass through the connection holes of the first conductive component 410, the second conductive component 420, and the third conductive component 430 at the power connection terminal group 230 of the computing board 200 in sequence, so that the first conductive component 410, the second conductive component 420, and the third conductive component 430 fit tightly together, thereby achieving a stable electrical connection between the first conductive component 410, the second conductive component 420, and the computing board 200.

[0534] In one embodiment, the first folded edge 4211 and the third folded edge 4221 may be located between the two computing boards 200, respectively.

[0535] For example, as shown in FIG5D, the power connection terminal group 230 of the first computing board 201 and the second computing board 202 can be arranged opposite each other along the third direction Z. The first folded edge 4211 and the third folded edge 4221 are installed between the two computing boards 200 along the third direction Z, making the power connection path more direct and simple, and optimizing the wiring of the power connection structure.

[0536] In one embodiment, the third folded edge 4221 may have a second clearance area, and two second electrical connection plates 42211 may be located on opposite sides of the second clearance area in the second direction Y, while two first electrical connection plates 42111 are located in the second clearance area.

[0537] For example, as shown in Figures 5B and 5D, the first folded edge 4211 and the third folded edge 4221 can extend in the same direction along the third direction Z, and the fourth folded edge 4222 can be connected between the two second electrical connection plates 42211 of the third folded edge 4221, extending along the second direction Y. A second clearance area can be defined between the two second electrical connection plates 42211 of the third folded edge 4221, providing space for the installation and arrangement of the first electrical connector 421. This arrangement can ensure electrical isolation between the conductive components, help optimize space utilization, and meet the requirements of the compact computing device 1.

[0538] In one embodiment, the material of the second conductive component 420 may include at least one of copper, aluminum, and silver.

[0539] In some examples, the material of the second conductive component 420 may be a copper integral component, a silver integral component, or an aluminum integral component, to ensure that the second conductive component 420 has good conductivity and corrosion resistance.

[0540] In other examples, the second conductive component 420 may be modularly formed, assembled from dissimilar components such as copper and aluminum parts, to fully utilize the advantages of multiple materials and optimize conductivity and mechanical properties.

[0541] It should be noted that the above are merely illustrative examples. The application examples provided in this application embodiment are for ease of understanding. This application embodiment does not specifically limit the material of the second conductive component 420.

[0542] In one embodiment, the power connection device 400 may further include at least one third conductive component 430, which is correspondingly disposed with at least one computing board 200 of the computing module 20. The second conductive component 420 is electrically connected to the corresponding computing board 200 of the computing module 20 through the at least one third conductive component 430. At least a portion of the third conductive component 430 is parallel to the plane containing at least a portion of the computing board 200.

[0543] For example, the portion of the third conductive component 430 that is electrically connected to the terminal on the computing board 200 is arranged parallel to the plane on which the computing board 200 is located. The third conductive component 430 and the computing board 200 can be fixedly connected by means of snap-fit ​​connection, fastener connection, welding connection, etc.

[0544] By arranging a portion of the third conductive component 430 parallel to the plane where the computing board 200 is located, the size of the third conductive component 430 in the third direction Z can be reduced, thereby saving space occupied by the computing device 1 in the third direction Z. On the other hand, it is also beneficial to improve the stability and reliability of the connection between the third conductive component 430 and the power connection terminal of the computing board 200.

[0545] In this embodiment, the computing device 1 may include at least one computing module 20, and each computing module 20 may include at least one computing board 200. The power connection device 400 may include at least one third conductive component 430 corresponding to each computing board 200. For example, as shown in FIG5C, the third conductive component 430 may be configured one-to-one with each computing board 200. The third conductive component 430 may be electrically connected to the power receiving terminal group 230 of the computing board 200, and simultaneously electrically connected to the second conductive component 420. It is understood that in scenarios where the computing device 1 includes multiple computing modules 20, and each computing module 20 includes multiple computing boards 200, the third conductive component 430 may cooperate with the first conductive component 410 and the second conductive component 420 to supply power to the computing board 200. During the power supply process, the current generated by the power module 500 can form a loop between multiple computing boards 200 in the computing module 20 through the first conductive component 410, the second conductive component 420 and the third conductive component 430, thereby enabling simultaneous power supply to multiple computing modules 20 and multiple computing boards 200 and improving power supply efficiency.

[0546] In one embodiment, the third conductive component 430 may include a first conductive base 431 and a second conductive base 432. The first electrical connector 421 of the second conductive component 420 may be electrically connected to the first power terminal 231 of the computing board 200 through the first conductive base 431, and the second electrical connector 422 of the second conductive component 420 may be electrically connected to the second power terminal 232 of the computing board 200 through the second conductive base 432.

[0547] For example, the first power supply terminal 511 and the second power supply terminal 512 of the power module 500 can provide positive and negative power respectively. The first power connection terminal 231 of the computing board 200 can be the positive power connection terminal of the computing board 200, and the second power connection terminal 232 can be the negative power connection terminal of the computing board 200. The first conductive base 431 can be electrically connected to the positive power supply terminal of the computing board 200, and the second conductive base 432 can be correspondingly electrically connected to the negative power connection terminal of the computing board 200. In the power supply application scenario, the current can flow through the first conductive base 431 to the positive power connection terminal of at least one computing board 200 in at least one computing module 20, and after passing through the computing board 200, it flows back from the negative power connection terminal of the computing board 200 to the negative power supply terminal of the power module 500 through the second conductive base 432, completing the current loop and realizing the power supply to at least one computing module 20 in the computing device 1.

[0548] In other examples, the positive and negative terminals of the first power supply terminal 511 and the second power supply terminal 512, as well as the positive and negative terminals of the first power connection terminal 231 and the second power connection terminal 232, can be reversed compared to the examples described above. In this case, the first conductive base 431 can be electrically connected to the negative power connection terminal of the computing board 200, and the second conductive base 432 can be electrically connected to the positive power connection terminal of the computing board 200, so as to power at least one computing module 20 in the computing device 1. The specific current flow direction will not be described in detail.

[0549] It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art can flexibly configure the power supply and connection terminals according to specific application scenarios. In one embodiment, the computing module 20 may include two computing boards 200 spaced apart. Each computing board 200 may be provided with a third conductive component 430. The first electrical connector 421 of the second conductive component 420 is electrically connected to two corresponding first conductive seats 431 of the two computing boards 200, and the second electrical connector 422 of the second conductive component 420 is electrically connected to two corresponding second conductive seats 432 of the two computing boards 200.

[0550] For example, as shown in Figures 5D and 5E, each computing module 20 may include two computing boards 200 spaced apart. Taking the installation scenario of the power connection device 400 as an example, the first conductive base 431 may be first installed on the first power connection terminal 231 of the two computing boards 200 in the computing module 20, and the second conductive base 432 may be installed on the second power connection terminal 232 of the two computing boards 200 in the computing module 20. The first electrical connector 421 may simultaneously form an electrical connection with the first conductive base 431 installed on the two computing boards 200, and the second electrical connector 422 may simultaneously form an electrical connection with the second conductive base 432 installed on the two computing boards 200. During power supply, the current generated by the power module 500 can form a loop between the multiple computing boards 200 in the computing module 20 through the first conductive component 410, the second conductive component 420, and the third conductive component 430, thereby realizing simultaneous power supply to multiple computing modules 20 and multiple computing boards 200 and improving power supply efficiency.

[0551] In one embodiment, the first conductive base 431 may include a fifth folded edge 4311 and a sixth folded edge 4312 connected to each other. The planes on which the fifth folded edge 4311 and the sixth folded edge 4312 are located are perpendicular to each other. The fifth folded edge 4311 is used to make electrical contact with the first folded edge 4211 of the first electrical connector 421, and the sixth folded edge 4312 is used to make electrical contact with the first power terminal 231 of the computing board 200.

[0552] In one embodiment, the second conductive base 432 includes a seventh folded edge 4321 and an eighth folded edge 4322 connected to each other. The planes on which the seventh folded edge 4321 and the eighth folded edge 4322 are located are perpendicular to each other. The seventh folded edge 4321 is used to make electrical contact with the third folded edge 4221 of the second electrical connector 422, and the eighth folded edge 4322 is used to make electrical contact with the second power terminal 232 of the computing board 200.

[0553] In some examples, the third conductive component 430 can be a one-piece stepped three-dimensional structure. Specifically, the third conductive component 430 can be formed by bending a one-piece molded part, or it can be directly cast using a mold. Taking the first conductive base 431 as an example, the fifth fold 4311 can be bent at the junction of the fifth fold 4311 and the sixth fold 4312, so that the plane where the fifth fold 4311 is located is perpendicular to the plane where the sixth fold 4312 is located, forming the first electrical connector 421. This configuration simplifies the manufacturing process, reduces production costs, and provides stable mechanical support and high electrical connection efficiency for the third conductive component 430. In specific application scenarios, the bending position and direction of the fifth fold 4311 in the first conductive base 431 can be adjusted according to the actual installation space, and this application embodiment does not impose specific limitations.

[0554] In other examples, the third conductive component 430 can be a stepped three-dimensional structure formed by separate molding and assembly. Specifically, the third conductive component 430 can be formed by combining the fifth fold 4311 and the sixth fold 4312 through methods such as plugging and bolt fixing, increasing the flexibility and scalability of the third conductive component 430.

[0555] It should be noted that the above are merely illustrative examples. The application examples provided in this application embodiment are for ease of understanding. This application embodiment does not specifically limit the formation method of the third conductive component 430.

[0556] As shown in Figure 5C, the sixth fold 4312 and the eighth fold 4322 can be fitted together with the computing board 200 to support the conductive base for power supply. Specifically, the sixth fold 4312 and the eighth fold 4322 can be mechanically fixed to the computing board 200 by means of screws, clips, etc., to form a firm electrical connection to ensure the stability and reliability of the third conductive component 430 during use.

[0557] This design, through the bending design of the third conductive component 430, allows for more efficient use of the internal space of the computing device 1 to install the conductive components, resulting in a compact and rational internal layout of the computing device 1 and enabling power supply to the computing module 20. The folded edge structure of the third conductive component 430 can be used to fix and support the conductive base, ensuring the stability of the electrical connection.

[0558] In one embodiment, the fifth folded edge 4311 and the first folded edge 4211 can be fixedly connected by fastener 440. The sixth folded edge 4312 and the computing board 200 can be fixedly connected by fastener 440. The seventh folded edge 4321 and the third folded edge 4221 can be fixedly connected by fastener 440. The eighth folded edge 4322 and the computing board 200 can be fixedly connected by fastener 440.

[0559] For example, as shown in Figures 5A to 5D, taking the process of installing the first electrical connector 421 onto the first conductive base 431 as an example, the sixth folded edge 4312 of the first conductive base 431 and the eighth folded edge 4322 of the second conductive base 432 can be installed on the computing board 200, forming a stable electrical connection with the computing board 200 respectively. The fifth folded edge 4311 and the seventh folded edge 4321 of the third conductive component 430 can be provided with a plurality of third connecting holes 430a and fourth connecting holes 430b arranged in rows along the second direction Y. The first conductive component 410 and the second conductive component 420 can be provided with corresponding connecting through holes with reference to the third connecting holes 430a and fourth connecting holes 430b. In some examples, the third connecting hole 430a can be used for fasteners 440 to pass through the first conductive component 410, the second conductive component 420, and the third conductive component 430, so that the first conductive component 410, the second conductive component 420, and the third conductive component 430 form a tight electrical connection. The fourth connection hole 430b can be used for the fastener 440 to pass through the second conductive component 420 and the third conductive component 430, thereby forming a secure electrical connection between the second conductive component 420 and the third conductive component 430. In other examples, the third connection hole 430a can be used for the fastener 440 to pass through the second conductive component 420 and the third conductive component 430, thereby forming a secure electrical connection between the second conductive component 420 and the third conductive component 430. The fourth connection hole 430b can be used for the fastener 440 to pass through the first conductive component 410, the second conductive component 420, and the third conductive component 430, thereby forming a secure electrical connection between the first conductive component 410, the second conductive component 420, and the third conductive component 430. It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art can flexibly configure the power connection group 230 of the computing board 200 according to specific application scenarios.

[0560] For example, the number of the third connecting hole 430a and the fourth connecting hole 430b can be at least one. The specific number of the third connecting hole 430a and the fourth connecting hole 430b is not specifically limited in the embodiments of this application.

[0561] This configuration ensures that the power connection device 400 will not loosen or shift due to vibration or other external forces during the operation of the computing device 1, while also improving the conduction efficiency of the electrical connection.

[0562] In one embodiment, the two first conductive bases 431 and the two second conductive bases 432 corresponding to the computing module 20 may be located between the two computing boards 200.

[0563] For example, two first conductive bases 431 and two second conductive bases 432 can be arranged opposite each other in the third direction Z between the two computing boards 200 of the computing module 20, making the power connection path more direct and simple, and optimizing the wiring of the power connection structure.

[0564] In one embodiment, the two first conductive seats 431 and the two second conductive seats 432 corresponding to the computing module 20 can be arranged at intervals along the second direction Y, with the two first conductive seats 431 located between the two second conductive seats 432 in the second direction Y.

[0565] For example, as shown in FIG5B, the computing module 20 may include two computing boards 200 spaced apart. The two first conductive seats 431 and two second conductive seats 432 corresponding to the two computing boards 200 may be spaced apart along the second direction Y. The two first conductive seats 431 are located between the two second conductive seats 432 in the second direction Y. This arrangement can ensure electrical isolation between the conductive components, help optimize space utilization, and meet the requirements of the compact computing device 1.

[0566] In some examples, as shown in Figure 5B and in conjunction with Figure 3A, the second conductive base 432 located on the outside is engaged with the clearance slot 722 of the positioning member 72 of the second panel 71 of the chassis 11. The clearance slot 722 of the positioning member 72 of the second panel 71 and the second conductive base 432 mutually limit each other, enhancing the stability of both.

[0567] In other examples, two second conductive seats 432 may be located between two first conductive seats 431 in the second direction Y. Accordingly, the first conductive seats 431 located on the outside may be engaged with the clearance slots 722 of the positioning members 72 of the second panel 71 of the chassis 11.

[0568] In one embodiment, the material of the third conductive component 430 may include at least one of copper, aluminum, and silver.

[0569] In some examples, the third conductive component 430 may be made of a single piece of copper, silver, or aluminum to ensure that the second conductive component 420 has good conductivity and corrosion resistance.

[0570] In other examples, the third conductive component 430 can be modularly formed, assembled from dissimilar components such as copper and aluminum parts, to fully utilize the advantages of multiple materials and optimize conductivity and mechanical properties.

[0571] It should be noted that the above are merely illustrative examples. The application examples provided in this application embodiment are for ease of understanding. This application embodiment does not specifically limit the material of the third conductive component 430.

[0572] In one embodiment, referring to FIG5B, a plurality of computing modules 20 may be arranged at intervals along a third direction Z; wherein, the second conductive plate 4112 of the first conductive member 411 may extend along a third direction Z, having a plurality of first conductive regions 4112a arranged along a third direction Z, the plurality of first conductive regions 4112a being electrically connected to the plurality of computing modules 20 in a one-to-one correspondence; the fourth conductive plate 4122 of the second conductive member 412 extends along a third direction Z, having a plurality of second conductive regions 4122a arranged along a third direction Z, the plurality of second conductive regions 4122a being electrically connected to the plurality of computing modules 20 in a one-to-one correspondence.

[0573] For example, as shown in Figures 5A to 5D, the computing device 1 may include two computing modules 20, namely, a first computing module 21 and a second computing module 22 arranged at intervals along a third direction Z. A power module 500 can be electrically connected to the first computing module 21 and the second computing module 22 via a first conductive component 410 to simultaneously power both computing modules 20. The second conductive plate 4112 extends along a third direction Z and has two first conductive regions 4112a arranged along the third direction Z. These two first conductive regions 4112a can be electrically connected to the first power terminals 231 of the first computing module 21 and the second computing module 22 respectively. Correspondingly, the fourth conductive plate 4122 of the second conductive component 412 extends along a third direction Z and has two second conductive regions 4122a arranged along the third direction Z. These two second conductive regions 4122a can be electrically connected to the second power terminals 232 of the first computing module 21 and the second computing module 22 respectively. Specifically, the first conductive region 4112a and the second conductive region 4122a may be provided with multiple connecting holes arranged in rows along the second direction Y. The first conductive region 4112a and the second conductive region 4122a may be electrically connected to the first computing module 21 and the second computing module 22 through fasteners 440.

[0574] It should be noted that the above are merely illustrative examples. The application examples provided in this application embodiment are for ease of understanding. This application embodiment does not specifically limit the electrical connection structure of the first conductive component 410.

[0575] In this embodiment, the number of computing modules 20 can be set to one or more, such as one, two, three, four, etc. The number of computing boards 200 integrated within the same computing module 20 can be set to one or more, such as one, two, three, four, etc., to meet the corresponding computing power requirements. The direction and range of the first conductive region 4112a and the second conductive region 4122a, the number and position of the connecting holes can be set according to the number of computing modules 20 and computing boards 200, and the position of the power connection terminal group 230 of the computing boards 200. This embodiment does not impose specific limitations. With this setting, multiple computing modules 20 and multiple computing boards 200 can be powered simultaneously, improving power supply efficiency. It also allows for flexible addition or removal of computing modules 20 in the computing device 1, as well as flexible adjustment of computing boards 200 within the computing modules 20, increasing the scalability of the computing device 1.

[0576] For example, the power module 500 may have a power supply terminal group 510, which may include a first power supply terminal 511 and a second power supply terminal 512. As shown in Figures 5H and 5I, and in conjunction with Figure 1C, the power supply terminal group 510 may be disposed on the side of the power module 500 facing away from the pipe cavity 604 in the first direction X, while the input and output terminals of the cooling pipes of the power module 500 are located on the side adjacent to the pipe cavity 604 in the first direction X. By separating the power supply terminal group from the input and output terminals of the cooling pipes, the adverse effects of the inflow and outflow of the cooling medium on the electrical connection can be avoided, ensuring the stable operation of the computing device 1.

[0577] As shown in Figure 5I and in conjunction with Figure 1A, the input end of the cooling pipe of the power module 500 can be equipped with a liquid inlet connector 33, and the output end of the cooling pipe can be equipped with a connecting connector 36. The liquid inlet connector 33 is connected to the output end of the external medium cooling device of the computing device through the liquid inlet pipe 31 and another liquid inlet connector 33. The connecting connector 36 is connected to the input end of the cooling channel of the liquid cooling module of the computing module through the connecting pipe 35. The cooling medium flows in the cooling pipe, which can continuously absorb and remove the heat generated by the power module 500 during operation, so as to continuously provide cooling for the power module 500, enabling the power module 500 to maintain a low temperature during high-load operation and reducing the possibility of performance degradation or damage to the power module 500 due to overheating.

[0578] In some examples, the side of the power module 500 corresponding to the power connection device 400 and the side of the computing board 200 corresponding to the power connection device 400 may not be flush, that is, the side of the power module 500 corresponding to the power connection device 400 and the side of the computing board 200 corresponding to the power connection device 400 may be located on different sides.

[0579] As shown in Figures 5F and 5G, in one embodiment, the first computing module may include two computing boards 200, and the second computing module may include one computing board 200. The power connection device may include a first conductive component, a second conductive component, and a third conductive component. The first conductive component includes a first conductive element 411 and a second conductive element 412; the second conductive component includes a first electrical connector 421 and a second electrical connector 422; and the third conductive component includes a first conductive base 431 and a second conductive base 432. The first conductive component is electrically connected to the power supply terminal group of the power module 500, the first conductive element 411 is electrically connected to the first power supply terminal, and the second conductive element is electrically connected to the second power supply terminal. The third conductive component is electrically connected to the corresponding power connection terminal groups of each computing board. The first power connection terminal 231 of each computing board is electrically connected to the first conductive base 431, and the second power connection terminal 232 of each computing board is electrically connected to the second conductive base 432. The first conductive component is electrically connected to the corresponding third conductive component of each computing board through the second conductive component.

[0580] Referring again to Figure 5G, the first conductive element 411 includes a first conductive plate 4111 and a second conductive plate 4112. The first conductive plate 4111 is electrically connected to the first power supply terminal 511. The first electrical connector 421 is electrically connected to the corresponding first conductive bases 431 on the three computing boards, and the second conductive plate 4112 is electrically connected to the first electrical connector 421. Thus, the first power supply terminal 511 is electrically connected to the first power terminals 231 of the three computing boards. The second conductive element 412 includes a third conductive plate 4121 and a fourth conductive plate 4122. The third conductive plate 4121 is electrically connected to th...

Claims

1. A chassis for use in computing devices, characterized in that, The chassis includes an outer shell, and the computing device includes a computing module, a power module, and a piping assembly disposed within the outer shell. The computing module includes a liquid cooling module and a computing board. The liquid cooling module has a cooling channel for supplying cooling medium, and the cooling channel is connected to the piping assembly. The chassis defines a receiving cavity and a piping cavity, the receiving cavity being used to accommodate the computing module and the power supply module, and the piping cavity being used to accommodate the piping assembly.

2. The chassis according to claim 1, characterized in that, The housing includes a partition for dividing the chassis into at least two receiving spaces, one of which is the receiving cavity and the other of which is the piping cavity.

3. The chassis according to claim 1, characterized in that, The outer casing includes a bottom shell and a partition. The bottom shell has a chamber, and the partition is disposed in the chamber, dividing the chamber into the receiving chamber and the pipeline chamber, which are arranged side by side in a first direction.

4. The chassis according to claim 3, characterized in that, The partition and the outer shell have the same dimensions in a second direction, which is perpendicular to the first direction.

5. The chassis according to claim 1, characterized in that, The partition of the outer casing has a first conduit port for inserting conduits that are housed in the conduit cavity into the cavity.

6. The chassis according to claim 1, characterized in that, The bottom shell of the outer casing includes a first panel, which is distributed opposite to and spaced apart from the partition of the outer casing in a first direction, so as to define the pipeline cavity with the partition.

7. The chassis according to claim 5, characterized in that, The first panel of the housing has a second conduit port for inserting conduits located outside the conduit cavity into the conduit cavity.

8. The chassis according to claim 7, characterized in that, The number of first pipe sockets in the partition is greater than the number of second pipe sockets in the first panel.

9. The chassis according to claim 5, characterized in that, The first pipe inlet is provided with a sealing element, which is used to seal the gap between the pipe and the first pipe inlet.

10. The chassis according to claim 9, characterized in that, The material of the seal includes rubber.

11. The chassis according to claim 1, characterized in that, The partition of the outer shell has multiple fixing parts, which are used to fix the partition to the bottom plate and side plate of the outer shell respectively.

12. The chassis according to claim 11, characterized in that, The fixing part is a screw hole.

13. The chassis according to claim 1, characterized in that, The outer casing also includes a first top cover and a second top cover. The first top cover covers the upper side of the receiving cavity and is used to close the receiving cavity. The second top cover is disposed on the upper side of the pipeline cavity and is used to close the pipeline cavity.

14. The chassis according to claim 1, characterized in that, The partition of the outer shell has a snap-fit ​​portion, and the second top cover of the outer shell has a snap-fit ​​mating portion, wherein the snap-fit ​​portion and the snap-fit ​​mating portion are adapted to snap-fit ​​together.

15. The chassis according to claim 14, characterized in that, The snap-fit ​​part is a snap-fit ​​opening, and the snap-fit ​​mating part is a snap fastener.

16. The chassis according to claim 1, characterized in that, The dimension of the receiving cavity in the first direction is larger than the dimension of the pipeline cavity in the first direction.

17. The chassis according to claim 1, characterized in that, The pipeline assembly includes an inlet pipeline and a return pipeline. The inlet pipeline is connected to the input end of the cooling channel, and the return pipeline is connected to the output end of the cooling channel. The pipeline cavity is used to accommodate at least a portion of the inlet pipeline and / or at least a portion of the return pipeline.

18. The chassis according to claim 1, characterized in that, The power module has a built-in cooling pipe, which is connected to the cooling channel through the pipe assembly.

19. The chassis according to claim 18, characterized in that, The piping assembly further includes a first connecting pipe, which is connected between the output end of the cooling piping and the input end of the cooling channel; the liquid inlet pipe of the piping assembly is connected to the input end of the cooling piping. The conduit cavity is used to accommodate the first connecting conduit.

20. The chassis according to claim 1, characterized in that, The number of computing modules is multiple; The piping assembly further includes at least one second connecting pipe, which connects to two adjacent cooling channels connected in series. The conduit cavity is used to accommodate the at least one second connecting conduit.

21. The chassis according to claim 1, characterized in that, The first pipe inlet of the partition plate of the outer shell and the first pipe inlet of the first panel respectively include a liquid inlet and a liquid return inlet. The liquid inlet is used for the liquid inlet pipe to pass through, and the liquid return inlet is used for the liquid return pipe to pass through.

22. The chassis according to claim 1, characterized in that, The housing includes a sliding guide device for mounting the computing module and / or the power module.

23. The chassis according to claim 22, characterized in that, The sliding guide device includes a first slide plate, which is disposed on the side of the computing module adjacent to the power module. The first slide plate has a clearance structure, which is used to ensure that at least a portion of the power connection device of the power module does not contact or overlap with at least a portion of the first slide plate in space.

24. The chassis according to claim 23, characterized in that, The clearance structure is a clearance opening, and the first slide plate has the clearance opening at the end adjacent to the power connection device.

25. The chassis according to claim 1, characterized in that, The outer shell of the chassis has an opening on the side opposite to the piping cavity in a first direction, and the chassis also includes a panel assembly that at least partially covers the opening.

26. The chassis according to claim 25, characterized in that, The panel assembly has a positioning and avoidance structure that cooperates with a portion of the power connection device structure. The positioning and avoidance structure is used to position the panel assembly and to make way for a portion of the power connection device structure.

27. The chassis according to claim 26, characterized in that, The positioning and avoidance structure includes a positioning member, which is located on the inner side of the panel assembly. The positioning member has an avoidance slot, which is used to avoid a portion of the structure of the power connection device.

28. The chassis according to claim 22, characterized in that, The sliding guide device includes a first slide plate, and the first slide plate and the computing module have a first slide structure that cooperates with each other. The first slide structure is used to allow the computing module to slide into the chassis.

29. The chassis according to claim 28, characterized in that, The first slide plate is disposed in the receiving cavity, dividing the receiving cavity into at least two sub-cavities.

30. The chassis according to claim 29, characterized in that, The first slide plate divides the receiving cavity into a first sub-cavity and a second sub-cavity distributed along a second direction.

31. The chassis according to claim 30, characterized in that, The first sub-cavity is used to accommodate the computing module, and the first slide structure is located in the first sub-cavity.

32. The chassis according to claim 30, characterized in that, The second sub-cavity is used to house the power module.

33. The chassis according to claim 28, characterized in that, The first slide structure includes a first guide ridge and a first slide; The liquid cooling module of the computing module has a first guide protrusion extending along the first direction on the first side in the second direction; The first slide plate has a first slide extending in a first direction on the side facing the liquid cooling module, and the first slide is used to slide and adapt to the first guide protrusion.

34. The chassis according to claim 22, characterized in that, The sliding guide device further includes a second slide plate, which is disposed on the side of the computing module away from the power supply module; The second slide plate and the computing module have a mutually cooperating second slide structure, which is used to allow the computing module to slide into the chassis.

35. The chassis according to claim 34, characterized in that, The second slide structure includes a second guide ridge and a second slide. The liquid cooling module of the computing module has a second guide protrusion extending along the first direction on its second side in the second direction; The second slide plate has a second slide extending in a first direction on the side facing the liquid cooling module, and the second slide is used to slide and adapt to the second guide protrusion.

36. The chassis according to claim 25, characterized in that, The panel assembly includes a second panel that covers the opening.

37. The chassis according to claim 36, characterized in that, The panel assembly includes two connecting guides, which are respectively disposed at both ends of the second panel in a second direction. Each connecting guide includes a connecting mating plate with a mounting hole. The connecting mating plate is used to fix itself to the connecting mating plate of an adjacent computing device by fasteners passing through the mounting holes.

38. The chassis according to claim 37, characterized in that, The connecting guide further includes a guide plate extending from the inner side of the connecting mating plate toward the receiving cavity, the guide plate having a plurality of guide pieces spaced apart in a third direction, the ends of the guide pieces away from the connecting mating plate being bent inward.

39. The chassis according to claim 38, characterized in that, The second slide plate of the outer casing has a plurality of clearance openings at intervals in the third direction at the end facing the connecting mating plate. The plurality of clearance openings correspond one-to-one with the plurality of guide pieces of the adjacent guide plate, and the guide pieces are engaged with the corresponding clearance openings.

40. The chassis according to claim 36, characterized in that, The second panel includes a plate and at least one flap, the at least one flap extending from at least one side of the plate in a third-direction orientation toward the receiving cavity, the flap including a first guide portion bent inward away from the plate.

41. The chassis according to claim 40, characterized in that, The folding tab includes at least one inwardly bent second guide portion, the at least one second guide portion being located on at least one side of the first guide portion in a second direction.

42. A computing device, characterized in that, Includes the chassis as described in any one of claims 1 to 41.

43. The computing device according to claim 42, characterized in that, The computing device has at least two computing modules, and the cooling channels of adjacent computing modules are connected.

44. The computing device according to claim 43, characterized in that, The cooling channels of adjacent computing modules are connected in series or in parallel.

45. The computing device according to claim 43, characterized in that, At least two of the computing modules are stacked on top of each other in a third-party manner.

46. ​​The computing device according to claim 42, characterized in that, The cooling channels of the computing module of the computing device are connected to the cooling pipes of the power module of the computing device.

47. The computing device according to claim 46, characterized in that, The cooling channel of the computing module is connected in series with the cooling pipe of the power supply module.

48. The computing device according to claim 42, characterized in that, The cooling channels of the computing device include a first channel and a second channel. The output end of the first channel is connected to the input end of the second channel, and the flow direction of the first channel is opposite to that of the second channel.

49. The computing device according to claim 48, characterized in that, The input end of the first flow channel, the output end of the second flow channel, the input end of the second flow channel, and the output end of the first flow channel are arranged sequentially on the side of the liquid cooling module facing the pipeline cavity in the first direction.

50. The computing device according to claim 42, characterized in that, The piping assembly of the computing device includes an inlet pipe and a return pipe. The inlet pipe is connected to the input end of the cooling channel, and the return pipe is connected to the output end of the cooling channel.

51. The computing device according to claim 48, characterized in that, The input end of the first channel of the cooling channel is connected to the output end of the liquid inlet pipe of the pipe group, and the output end of the second channel of the cooling channel is connected to the input end of the liquid return pipe of the pipe group.

52. The computing device according to claim 48, characterized in that, The pipeline assembly of the computing device further includes a first connecting pipeline, which is connected between the output end of the cooling pipeline of the power module and the input end of the first flow channel. The input end of the cooling pipeline is connected to the output end of the liquid inlet pipeline of the pipeline assembly.

53. The computing device according to claim 43, characterized in that, The cooling channels of the liquid cooling modules of at least two adjacent computing modules are connected in series; The piping assembly further includes at least one second connecting pipe, which connects to two adjacent cooling channels connected in series.

54. The computing device according to claim 53, characterized in that, The number of the second connecting pipes is at least three; In two adjacent liquid cooling modules, a second connecting pipe is connected between the output end of the first flow channel of the first liquid cooling module and the input end of the first flow channel of the second liquid cooling module, a second connecting pipe is connected between the output end of the first flow channel of the second liquid cooling module and the input end of the second flow channel of the second liquid cooling module, and a second connecting pipe is connected between the output end of the second flow channel of the second liquid cooling module and the input end of the second flow channel of the first liquid cooling module.

55. The computing device according to claim 42, characterized in that, The liquid cooling module of the computing device includes a liquid cooling plate, the interior of which defines the cooling channel, and at least one side surface of the liquid cooling plate forms a liquid cooling surface; one side of the computing board has a heat-generating component, and the side of the computing board with the heat-generating component is disposed opposite to the liquid cooling surface.

56. The computing device according to claim 42, characterized in that, The liquid cooling module of the computing device includes at least one cover plate, which is connected to the liquid cooling plate of the liquid cooling module and is used to fix the computing board to the liquid cooling surface of the liquid cooling plate; the side of the computing board away from the cover plate has heat-generating components.

57. The computing device according to claim 42, characterized in that, The power module includes a power module and a power connection device, which is used to electrically connect the power module and the computing board.

58. The computing device according to claim 57, characterized in that, The power connection device has a bending structure for fitting with the chassis.

59. The computing device according to claim 58, characterized in that, The power connection device includes a second conductive element connected to the computing module. The second conductive element has a bending structure that bends away from a first slide plate of the chassis, and the bending structure defines a clearance space between itself and the first slide plate.

60. The computing device according to claim 42, characterized in that, The power connection device of the computing device and / or the first slide plate of the chassis have a clearance structure, the clearance structure being used to ensure that at least a portion of the power connection device does not spatially contact or overlap with at least a portion of the first slide plate.

61. The computing device according to claim 60, characterized in that, The first slide plate has a first clearance opening and a second clearance opening at its end adjacent to the power connection device. The first conductive element of the power connection device extends through the first clearance opening, and the power connection device includes a second conductive element connected to the computing module, the second conductive element extending through the second clearance opening.

62. The computing device according to claim 57, characterized in that, The first conductive element of the power connection device connects to at least two stacked computing modules.

63. The computing device according to claim 62, characterized in that, The first conductive element rigidly connects the two stacked computing modules.

64. The computing device according to claim 57, characterized in that, The power module has a first power supply terminal, and the computing board has a first power connection terminal; The first conductive element of the power connection device is electrically connected to the first power supply terminal and the first power terminal of the computing board of at least one computing module.

65. The computing device according to claim 57, characterized in that, The second conductive element of the power connection device connects at least two stacked computing modules.

66. The computing device according to claim 65, characterized in that, The second conductive element rigidly connects the two stacked computing modules.

67. The computing device according to claim 57, characterized in that, The power module has a second power supply terminal, and the computing board has a second power connection terminal; The second conductive element of the power connection device is electrically connected to the second power supply terminal and the second power terminal of the computing board of at least one computing module.

68. The computing device according to claim 57, characterized in that, The power connection device further includes: At least one second conductive component is provided corresponding to the at least one computing module. The first conductive component, which includes a first conductive element and a second conductive element, is electrically connected to the computing board of the at least one computing module through the at least one second conductive component.

69. The computing device according to claim 68, characterized in that, The second conductive component includes a first electrical connector and a second electrical connector. The first conductive component is electrically connected to a first power terminal of the computing board through the first electrical connector, and the second conductive component is electrically connected to a second power terminal of the computing board through the second electrical connector.

70. The computing device according to claim 68, characterized in that, The power connection device further includes: At least one third conductive component is provided corresponding to at least one computing board of the computing module, and the second conductive component is electrically connected to at least one computing board of the corresponding computing module through at least one third conductive component.

71. The computing device according to claim 70, characterized in that, The third conductive component includes a first conductive base and a second conductive base. The first electrical connector of the second conductive component is electrically connected to the first power terminal of the computing board through the first conductive base, and the second electrical connector of the second conductive component is electrically connected to the second power terminal of the computing board through the second conductive base.

72. The computing device according to claim 71, characterized in that, The computing module includes two computing boards spaced apart in a third direction. The computing module is provided with two third conductive components, which correspond one-to-one with the two computing boards. The first electrical connector of the second conductive component is electrically connected to the two first conductive bases corresponding to the two computing boards, and the second electrical connector of the second conductive component is electrically connected to the two second conductive bases corresponding to the two computing boards.

73. The computing device according to claim 72, characterized in that, The two first conductive seats and two second conductive seats corresponding to the computing module are spaced apart along the second direction, and the two first conductive seats are located between the two second conductive seats in the second direction.

74. The computing device according to claim 73, characterized in that, The second conductive base located on the outside is engaged with the clearance slot of the positioning component on the second panel of the chassis.

75. The computing device according to claim 57, characterized in that, The power connection device is located on the side of the chassis away from the piping cavity; The first power supply terminal and the second power supply terminal of the power module are located on the side of the power module facing away from the pipeline cavity in the first direction. The first and second power terminals of the computing board are located on the side of the computing board away from the pipeline cavity in a first direction.

76. The computing device according to claim 42, characterized in that, The computing device also includes a control board, which is connected to the computing module and the power supply module via signals. The control board is located on the side of the computing module away from the pipeline assembly.

77. The computing device according to claim 76, characterized in that, The control board is fixed to the inside of the second panel of the chassis, and the control board is parallel to the second panel.

78. The computing device according to claim 76, characterized in that, The control board is perpendicular to the bottom plate of the chassis.

79. The computing device according to claim 76, characterized in that, The control board is positioned in the second direction close to the computing module.

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