Computing device

Abstract

Embodiments of the present application provide a computing device, comprising: a power supply module; at least one computing module, each computing module comprising a compute board; and a chassis defining an accommodating cavity, the power supply module and the computing module being arranged side by side in the accommodating cavity. According to the technology in the embodiments of the present application, the power supply module and the at least one computing module are arranged side by side in the accommodating cavity of the chassis, so that the integration level of the computing device is improved, power supply to the computing module can be realized, and power supply efficiency of the computing device is improved. When the computing module needs to be added or replaced, modification of the power supply connection is simple, and the scalability of a system is improved.

Description

Computing device

[0001] This application claims priority to a Chinese patent application No. 2025100899843, filed on January 20, 2025, and entitled “Chassis and computing device”, the content of which is incorporated herein by reference in its entirety.

[0002] This application claims priority to a Chinese patent application No. 202520133782X, filed on January 20, 2025, and entitled “Chassis and computing device”, the content of which is incorporated herein by reference in its entirety.

[0003] This application claims priority to a Chinese patent application No. 2025201337656, filed on January 20, 2025, and entitled “Cooling device and computing device”, the content of which is incorporated herein by reference in its entirety.

[0004] This application claims priority to a Chinese patent application No. 2025201344607, filed on January 20, 2025, and entitled “Liquid cooling module, cooling device and computing device”, the content of which is incorporated herein by reference in its entirety.

[0005] This application claims priority to a Chinese patent application No. 2025201331109, filed on January 20, 2025, and entitled “Computing device”, the content of which is incorporated herein by reference in its entirety.

[0006] This application claims priority to a Chinese patent application No. 2025106691571, filed on May 22, 2025, and entitled “Chassis and computing device”, the content of which is incorporated herein by reference in its entirety.

[0007] This application claims priority to a Chinese patent application No. 2025210248609, filed on May 22, 2025, and entitled “Chassis and computing device”, the content of which is incorporated herein by reference in its entirety.

[0008] This application claims priority to a Chinese patent application No. 2025210250562, filed on May 22, 2025, and entitled “Cooling device and computing device”, the content of which is incorporated herein by reference in its entirety.

[0009] This application claims priority to the Chinese Patent Application No. 2025210264029, filed on May 22, 2025, and entitled "Liquid cooling module, cooling device, and computing device", the content of which is incorporated herein by reference in its entirety.

[0010] This application claims priority to the Chinese Patent Application No. 2025210249654, filed on May 22, 2025, and entitled "Computing device", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0011] The present application relates to the technical field of electronic devices, and in particular to a computing device. BACKGROUND

[0012] High-performance data centers, server clusters, and other terminals usually integrate multiple computing modules, which need to be efficiently powered by power supplies to meet large-scale data processing requirements. In related technologies, a computing device integrating computing modules and power supply modules transmits power from the power supply modules to each computing module through a cable. However, since the power supply modules and the computing modules are usually located at different positions, for example, the power supply modules are arranged outside the case and the computing modules are arranged inside the case, the wiring of the power supply modules and the computing modules is inconvenient. SUMMARY

[0013] Embodiments of the present application provide a computing device to solve or alleviate one or more technical problems in the prior art.

[0014] The computing device provided by the embodiments of the present application includes: a power supply module; at least one computing module, each computing module including a computing power board; and a case defining a receiving cavity, the power supply module and the computing modules being arranged side by side in the receiving cavity.

[0015] In an embodiment, the computing device further includes a power supply connecting device electrically connected between the power supply module and the computing modules.

[0016] In an embodiment, the power supply connecting device has a positive electrode connecting portion and a negative electrode connecting portion.

[0017] In an embodiment, the power supply connecting device includes a first conductive component, the first conductive component including a first conductive piece and a second conductive piece.

[0018] In an embodiment, at least one of the first conductive piece and the second conductive piece is L-shaped.

[0019] In an embodiment, the length of the first conductive piece is greater than that of the second conductive piece.

[0020] In an embodiment, the power connection device comprises a third conductive assembly, which is arranged on the computing power board.

[0021] In an embodiment, the third conductive assembly comprises a first conductive seat and a second conductive seat.

[0022] In an embodiment, the cabinet is provided with a first sliding plate, which divides the accommodation cavity into two sub-cavities, and the power module and the computing module are respectively accommodated in the two sub-cavities.

[0023] In an embodiment, the first sliding plate and / or the power connection device is provided with a avoiding structure, which is configured to avoid interference between the first sliding plate and the power connection device.

[0024] In an embodiment, the avoiding structure is arranged along the first direction.

[0025] In an embodiment, the power connection device comprises a second conductive assembly, which comprises a first electric connection and a second electric connection.

[0026] In an embodiment, the length of the first electric connection is less than the length of the second electric connection.

[0027] In an embodiment, the power connection device has a bending structure, which is used to match the cabinet.

[0028] In an embodiment, the bending structure is parallel to the bottom wall of the cabinet.

[0029] In an embodiment, the power connection device further has a non-bending structure, and the width of the bending structure is consistent with the non-bending structure.

[0030] In an embodiment, the power module has a power supply end group, the computing power board has an electricity receiving end group, and the power connection device is connected between the power supply end group and the electricity receiving end group.

[0031] In an embodiment, the number of computing modules is multiple, and the first conductive assembly connects at least two computing modules.

[0032] In an embodiment, the number of computing modules is two, and the first conductive assembly connects two computing modules.

[0033] In an embodiment, the first conductive member and the second conductive member respectively connect two computing modules.

[0034] In an embodiment, the power supply end group comprises a first power supply end and a second power supply end, and the electricity receiving end group comprises a first electricity receiving end and a second electricity receiving end.

[0035] The first conductive member is electrically connected to the first power supply end and a first power connection end of the computing power board of the at least one computing module, and the second conductive member is electrically connected to the second power supply end and a second power connection end of the computing power board of the at least one computing module.

[0036] In an embodiment, the first conductive member includes a first conductive plate and a second conductive plate arranged at intervals in the second direction, the first conductive plate being electrically connected to the first power supply end, and the second conductive plate being electrically connected to the first power connection end.

[0037] In an embodiment, a first avoiding area is defined between the first conductive plate and the second conductive plate, and the second conductive member is located in the first avoiding area.

[0038] In an embodiment, the first conductive member further includes a first connecting plate connected between the first conductive plate and the second conductive plate; wherein a plane in which the first conductive plate and the second conductive plate are arranged is arranged in parallel, and a plane in which the first connecting plate is arranged is arranged perpendicularly to the plane in which the first conductive plate is arranged.

[0039] In an embodiment, the second conductive member includes a third conductive plate and a fourth conductive plate arranged at intervals in the second direction, the third conductive plate being electrically connected to the second power supply end, and the fourth conductive plate being electrically connected to the second power connection end.

[0040] In an embodiment, the second conductive member further includes a second connecting plate connected between the third conductive plate and the fourth conductive plate; wherein a plane in which the second connecting plate, the third conductive plate and the fourth conductive plate are arranged is arranged in parallel.

[0041] In an embodiment, a material of the first conductive assembly includes at least one of copper, aluminum and silver.

[0042] In an embodiment, a length dimension of the first conductive member is 15 to 19 mm, a width dimension of the first conductive member is 2 to 3 mm, and a thickness dimension of the first conductive member is 0.2 to 0.4 mm; a length dimension of the second conductive member is 6 to 8 mm, a width dimension of the second conductive member is 2 to 3 mm, and a thickness dimension of the second conductive member is 0.2 to 0.4 mm.

[0043] In an embodiment, the computing device further includes:

[0044] At least one second conductive assembly is arranged corresponding to the at least one computing module, and the first conductive assembly is electrically connected to the computing power board of the at least one computing module through the at least one second conductive assembly.

[0045] In an embodiment, the number of the second conductive assemblies is two, and each second conductive assembly corresponds to one computing module.

[0046] In an embodiment, each computing module comprises at least one computing board, and each second conductive component is connected to all the computing boards in one computing module.

[0047] In an embodiment, each computing module comprises two computing boards, and each second conductive component is connected to the two computing boards in one computing module.

[0048] In an embodiment, the second conductive component comprises a first electrical connector and a second electrical connector, the first electrical connector is connected to the at least one computing board, and the second electrical connector is connected to the at least one computing board.

[0049] In an embodiment, the first electrical connector is connected to the two computing boards, and the second electrical connector is connected to the two computing boards.

[0050] In an embodiment, the first conductive member is electrically connected to the first electrical connection end of the computing board through the first electrical connector, and the second conductive member is electrically connected to the second electrical connection end of the computing board through the second electrical connector.

[0051] In an embodiment, the first electrical connector comprises opposite first and second electrical contact surfaces, the first electrical contact surface is used for electrical contact with the first conductive member, and the second electrical contact surface is used for electrical connection with the first electrical connection end of the computing board.

[0052] In an embodiment, the first electrical connector comprises a first and a second connecting flaps, the first connecting flap is arranged perpendicularly to the plane in which the first and second connecting flaps are located, opposite side surfaces of the first connecting flap form the first and second electrical contact surfaces respectively, and the second connecting flap is arranged in close contact with the computing board.

[0053] In an embodiment, the first connecting flap is fixedly connected to the second conductive plate of the first conductive member through a fastener.

[0054] In an embodiment, the second electrical connector comprises opposite third and fourth electrical contact surfaces, the third electrical contact surface is used for electrical contact with the second conductive member, and the fourth electrical contact surface is used for electrical connection with the second electrical connection end of the computing board.

[0055] In an embodiment, the second electrical connector comprises a third and a fourth connecting flaps, the third connecting flap is arranged perpendicularly to the plane in which the third and fourth connecting flaps are located, opposite side surfaces of the third connecting flap form the third and fourth electrical contact surfaces respectively, and the fourth connecting flap is arranged in close contact with the computing board.

[0056] In an embodiment, the third connecting flap is fixedly connected to the fourth conductive plate of the second conductive member through a fastener.

[0057] In an embodiment, the computing module comprises two computing boards arranged at intervals; the first folding edge of the first electrical connector comprises two first electrical connection boards arranged at intervals along the second direction, and the two first electrical connection boards are respectively electrically connected to the first electrical connection ends of the two computing boards; and the third folding edge of the second electrical connector comprises two second electrical connection boards arranged at intervals along the second direction, and the two second electrical connection boards are respectively electrically connected to the second electrical connection ends of the two computing boards.

[0058] In an embodiment, the first folding edge and the third folding edge are respectively located between the two computing boards.

[0059] In an embodiment, the third folding edge is provided with a second avoiding area, the two second electrical connection boards are located on opposite sides of the second avoiding area in the second direction, and the two first electrical connection boards are located in the second avoiding area.

[0060] In an embodiment, the material of the second conductive assembly comprises at least one of copper, aluminum and silver.

[0061] In an embodiment, the length of the first electrical connector is 14-16 mm, the width of the first electrical connector is 2-3 mm, and the thickness of the first electrical connector is 0.2-0.4 mm; the length of the second electrical connector is 17-21 mm, the width of the second electrical connector is 2-3 mm, and the thickness of the second electrical connector is 0.2-0.4 mm.

[0062] In an embodiment, the computing device further comprises:

[0063] At least one third conductive assembly is arranged corresponding to at least one computing board of the computing module, and the second conductive assembly is electrically connected to the at least one computing board of the corresponding computing module through the at least one third conductive assembly.

[0064] In an embodiment, the third conductive assembly comprises a first conductive seat and a second conductive seat, the first electrical connector of the second conductive assembly is electrically connected to the first electrical connection end of the computing board through the first conductive seat, and the second electrical connector of the second conductive assembly is electrically connected to the second electrical connection end of the computing board through the second conductive seat.

[0065] In an embodiment, the computing module comprises two computing boards arranged at intervals, the computing module is provided with two third conductive assemblies corresponding to the two computing boards, and the two third conductive assemblies correspond one-to-one to the two computing boards; the first electrical connector of the second conductive assembly is respectively electrically connected to the two first conductive seats corresponding to the two computing boards, and the second electrical connector of the second conductive assembly is respectively electrically connected to the two second conductive seats corresponding to the two computing boards.

[0066] In one embodiment, the first conductive base includes a fifth folded edge and a sixth folded edge connected to each other. The planes on which the fifth folded edge and the sixth folded edge are located are perpendicular to each other. The fifth folded edge is used to make electrical contact with the first folded edge of the first electrical connector, and the sixth folded edge is used to make electrical contact with the first electrical terminal of the computing board.

[0067] In one embodiment, the fifth folded edge is fixedly connected to the first folded edge by fasteners.

[0068] In one implementation, the sixth fold edge is fixedly connected to the computing board by fasteners.

[0069] In one embodiment, the second conductive base includes a seventh fold and an eighth fold connected to each other. The plane in which the seventh fold and the eighth fold are located is perpendicular to each other. The seventh fold is used to make electrical contact with the third fold of the second electrical connector, and the eighth fold is used to make electrical contact with the second electrical terminal of the computing board.

[0070] In one embodiment, the seventh fold edge is fixedly connected to the third fold edge by fasteners.

[0071] In one embodiment, the eighth fold is fixedly connected to the computing board by fasteners.

[0072] In one implementation, the two first conductive bases and two second conductive bases corresponding to the computing module are located between the two computing boards.

[0073] In one embodiment, the two first conductive bases and two second conductive bases corresponding to the computing module are spaced apart along a second direction, with the two first conductive bases located between the two second conductive bases in the second direction.

[0074] In one embodiment, the material of the third conductive component includes at least one of copper, aluminum, and silver.

[0075] In one implementation, multiple computing modules are spaced apart along a third direction;

[0076] The first conductive element has a second conductive plate extending along a third direction, having multiple first conductive regions arranged along the third direction, each of which is electrically connected to a multiple computing module; the second conductive element has a fourth conductive plate extending along a third direction, having multiple second conductive regions arranged along the third direction, each of which is electrically connected to a multiple computing module.

[0077] In one embodiment, the power supply terminal group is disposed on one side of the power supply module in the first direction, the power connection terminal group is disposed on one side of the computing board in the first direction, and the power supply module and the computing module are disposed side by side along the second direction, which is perpendicular to the first direction.

[0078] In one embodiment, the power supply terminal group and the power connection terminal group are arranged flush in a first direction.

[0079] In one embodiment, the computing device further includes:

[0080] The power module includes a power module and a housing. The power module is housed inside the housing, which also contains cooling pipes.

[0081] In one embodiment, the power module has a power supply terminal group, which includes a first power supply terminal and a second power supply terminal; the cooling pipeline has a medium inlet and a medium outlet; wherein the power supply terminal group is disposed on one side of the housing in a first direction, and the medium inlet and the medium outlet are disposed on the other side of the housing in the first direction.

[0082] In one embodiment, the power module further has a power input terminal, which is spaced apart from the power supply terminal group and disposed on the same side of the housing.

[0083] In one implementation, the power input terminal includes a three-phase AC input terminal.

[0084] In one embodiment, the medium input port is provided with a liquid inlet connector, and the medium output port is provided with a liquid outlet connector; wherein, the liquid outlet connector is connected to the liquid inlet end of the cooling channel of the cooling module of the computing device through a connecting pipe.

[0085] According to the technology of the embodiments of this application, the power supply module and at least one computing module are arranged side by side in the housing cavity of the chassis, which improves the integration of the computing device. The power connection device is electrically connected to the power supply terminal of the power supply module and the power connection terminal of the computing board, which simplifies the internal wiring of the computing device and facilitates the internal space management of the computing device. The power connection device is electrically connected to the power supply terminal of the power supply module and the power connection terminal of the computing board of at least one computing module, which can realize the power supply of multiple computing modules, improve the power supply efficiency of the computing device, and simplify the modification of the power connection when it is necessary to add or replace computing modules, thereby improving the scalability of the system.

[0086] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of this application will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0087] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments disclosed in this application and should not be construed as limiting the scope of this application.

[0088] Figure 1 shows a partial structural schematic diagram of a computing device according to an embodiment of this application.

[0089] Figure 2 shows an exploded structural diagram of a computing device according to an embodiment of this application.

[0090] Figure 3 shows a schematic diagram of the structure of the third conductive component installed on the computing board in an embodiment of this application.

[0091] Figure 4 shows a schematic diagram of the overall structure of the power connection device installed on the computing device in an embodiment of this application.

[0092] Figure 5 shows a schematic diagram of the structure of the second conductive component in an embodiment of this application.

[0093] Figure 6A shows a schematic diagram of another power connection device in an embodiment of this application.

[0094] Figure 6B shows an exploded view of another power connection device in an embodiment of this application.

[0095] Figure 7 shows a schematic diagram of the power module from one side view in an embodiment of this application.

[0096] Figure 8 shows a schematic diagram of the power module in an embodiment of this application from another side view.

[0097] Figure 9 shows an exploded view of the liquid cooling module in an embodiment of this application.

[0098] Figure 10 shows a schematic diagram of the cooling device of a computing device according to an embodiment of this application.

[0099] Explanation of reference numerals in the attached drawings: 1. Computing device; 11. Chassis; 10. Cooling device; 100. Liquid cooling module; 110. Liquid cooling plate; 111. Cooling channel; 112. Liquid cooling surface; 100a. Medium inlet; 100b. Medium outlet; 120. Cover plate; 20. Computing module; 21. First computing module; 22. Second computing module; 200. Computing board; 201. First computing board; 202. Second computing board; 210. Computing unit; 230. Power connection group; 231. First power connection; 232. Second power connection; 310. Liquid inlet connector; 320. Liquid outlet connector; 40. Power supply module; 400. Power connection device; 410. First conductive component; 411. First conductive element; 412. Second conductive element; 412a. Bending structure; 4111. First conductive plate; 4112. Second conductive plate; 4112a. First conductive area; 4113. First connecting plate; 4121. Third conductive plate; 4122. Fourth conductive plate; 4123. Second connecting plate; 4122a. Second conductive area;

[0100] 420. Second conductive component; 421. First electrical connector; 422. Second electrical connector; 421a. First electrical contact surface; 422a. Third electrical contact surface; 4211. First folded edge; 4212. Second folded edge; 4221. Third folded edge; 4222. Fourth folded edge; 42111. First electrical connection plate; 42211. Second electrical connection plate; 430. Third conductive component; 431. First conductive base; 432. Second conductive base; 4311. Fifth folded edge; 4312. Sixth folded edge; 4321. Seventh folded edge; 4322. Eighth folded edge; 440. Fastener; 4211a. First connecting hole; 4211b. Second connecting hole; 430a. Third connecting hole; 430b. Fourth connecting hole; 500, Power module; 510, Power supply terminal group; 511, First power supply terminal; 512, Second power supply terminal; 520, Power input terminal; 530, Housing; 63, First slide plate; 632, First clearance notch; X, First direction; Y, Second direction; Z, Third direction. Detailed Implementation

[0101] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this application. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0102] High-performance data centers, server clusters, and other terminals typically integrate multiple computing modules. These modules require efficient power supplies to meet the demands of large-scale data processing. In related technologies, computing devices integrating computing and power modules transmit power from the power module to each computing module via cables. However, since the power module and computing modules are usually located in different locations—for example, the power module is located externally to the chassis while the computing modules are located internally—the cabling between the power module and computing modules is inconvenient.

[0103] The computing device provided in this application embodiment has a power supply module and at least one computing module arranged side-by-side within the housing cavity of the chassis, improving the integration of the computing device. Furthermore, by providing a power connection device electrically connecting the power supply terminal of the power supply module and the power connection terminal of the computing board, the internal wiring of the computing device is simplified, which is beneficial for the internal space management of the computing device. It enables power supply to multiple computing modules, improving the power supply efficiency of the computing device. When it is necessary to add or replace computing modules, the modification of the power connection is simple, improving the scalability of the system.

[0104] Figure 1 shows a partial structural schematic diagram of a computing device according to an embodiment of this application. Figure 2 shows an exploded structural schematic diagram of a computing device according to an embodiment of this application. Figure 3 shows a structural schematic diagram of a third conductive component mounted on a computing board according to an embodiment of this application. As shown in Figures 1, 2, and 3, the computing device 1 includes a power module 500, at least one computing module 20, and a chassis 11. Each computing module 20 includes a computing board 200. The chassis 11 defines a receiving cavity, in which the power module 500 and the computing module 20 are arranged side by side.

[0105] It should be noted that, to meet the high-throughput computing requirements, computing device 1 may integrate a high-performance computing module 20. During power supply, the power module 500 of computing device 1 may form an electrical connection with at least one computing module 20 to supply power to the computing module 20. In this embodiment, the number of computing modules 20 may be set to one or more, for example, one, two, three, four, etc. The number of computing boards 200 integrated within the same computing module 20 may be set to one or more, for example, one, two, three, four, etc., to meet the corresponding computing power requirements. It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application.

[0106] For example, the computing device 1 may include a computing module, which includes a plurality of computing modules 20, which may be arranged at Z-intervals along a third direction. Furthermore, the computing module may also include a liquid cooling module.

[0107] Figure 4 shows a schematic diagram of the overall structure of the power connection device installed on the computing device in an embodiment of this application. In this embodiment, as shown in Figures 1, 2, and 4, the first direction X can be parallel to the length direction of the chassis 11, which can be understood as a straight line extending from one end of the longest side of the chassis 11 to the other. The computing module 20 and the power module 500 can be arranged adjacently along the second direction Y, which can be the width direction of the chassis 11. The third direction Z can be perpendicular to both the first direction X and the second direction Y, for example, it can be the height direction of the chassis 11. When the computing device 1 is normally placed and operating, the third direction Z can be consistent with gravity or the height direction, i.e., a direction perpendicular to the horizontal ground, upwards or downwards. It should be noted that the above are merely illustrative examples. The application examples provided in this embodiment are for ease of understanding, and this embodiment does not specifically limit the specific direction settings and positional relationships of the first direction X, the second direction Y, and the third direction Z.

[0108] It is understandable that "perpendicular" refers to the state where the angle formed by two lines, a line and a surface, or a surface and a surface is 89° to 91°. Equal distances or equal angles refer to the state where the tolerance range is -1% to 1%.

[0109] In one embodiment, the computing device 1 may include a power connection device 400, which may be electrically connected between the power module 500 and the computing module 20.

[0110] As exemplarily shown in Figures 1, 2, and 3, the power module 500 may have a power supply terminal group, the computing board 200 may have a power receiving terminal group, and the power connection device 400 may be electrically connected between the power supply terminal group and the power receiving terminal group. The power supply terminal of the power module 500 may be electrically connected to the power receiving terminal of at least one computing board 200 within at least one computing module 20 to provide power to at least one computing board 200 and improve the power supply efficiency of the computing device.

[0111] In some examples, the side of the power module 500 corresponding to the power connection device 400 and the side of the computing board 200 corresponding to the power connection device 400 can be flush, that is, the side of the power module 500 corresponding to the power connection device 400 and the side of the computing board 200 corresponding to the power connection device 400 can be approximately located on the same surface. This allows the arrangement of the power module 500 and the computing board 200 to be more compact, thereby improving the utilization rate of the chassis 11 space.

[0112] In one embodiment, the power connection device 400 may have a positive connection portion and a negative connection portion.

[0113] In this embodiment, the power connection device 400 can be electrically connected to the negative power supply terminal of the power module 500 and the negative power connection terminal of the computing board 200, and simultaneously electrically connected to the positive power supply terminal of the power module 500 and the positive power connection terminal of the computing board 200, so as to provide power to at least one computing module 20 in the computing device 1 and improve the power supply efficiency of the computing device. Specifically, the positive connection portion is electrically connected between the positive power supply terminal of the power module 500 and the negative power connection terminal of the computing board 200, and the negative connection portion is electrically connected between the negative power supply terminal of the power module 500 and the negative power connection terminal of the computing board 200.

[0114] For example, the positive electrode connection portion and the negative electrode connection portion may each include at least one conductive busbar. The conductive busbar may be a busbar structure made of any other conductive material such as copper or aluminum. When the positive electrode connection portion and the negative electrode connection portion each include one conductive busbar, the conductive busbar in the positive electrode connection portion is electrically connected between the positive power supply terminal and the positive connection terminal, and the conductive busbar in the negative electrode connection portion is electrically connected between the negative power supply terminal and the negative connection terminal. When the positive electrode connection portion and the negative electrode connection portion each include multiple conductive busbars, the multiple conductive busbars in the positive electrode connection portion are sequentially electrically connected between the positive power supply terminal and the positive connection terminal, and the multiple conductive busbars in the negative electrode connection portion are sequentially electrically connected between the positive power supply terminal and the negative power supply terminal.

[0115] In one embodiment, the power connection device includes a first conductive component, which includes a first conductive element and a second conductive element. For example, as shown in Figures 1 and 2, the first conductive element 411 and the second conductive element 412 can extend along a second direction Y, respectively, and are electrically connected to the power supply terminal group of the power supply device and the power receiving terminal group 230 of the computing board 200 of at least one computing module 20, thereby enabling power supply to at least one computing module 20.

[0116] In one embodiment, the length of the first conductive element 411 may be greater than that of the second conductive element 412.

[0117] For example, as shown in Figures 2 and 5, the first connecting plate 4113 of the first conductive element 411 and the second connecting plate 4123 of the second conductive element 412 can extend along the second direction Y, and the length of the first connecting plate 4113 can be greater than that of the second connecting plate 4123. A first clearance area can be defined between the first conductive plate 4111 and the second conductive plate 4112 of the first conductive element 411, providing space for the installation and arrangement of the second conductive element 412, which helps to optimize space utilization and ensure electrical isolation between the conductive elements.

[0118] In one embodiment, at least one of the first conductive element 411 and the second conductive element 412 is L-shaped.

[0119] For example, as shown in FIG4, the computing device 1 may include two computing modules 20, and each computing module 20 may include two computing boards 200. The second conductive element 412 may be a planar structure and may be "L"-shaped. The second conductive element 412 may pass through the two computing modules 20 and form an electrical connection with one computing board 200 in each computing module 20 to supply power to all computing boards 200 in the computing module 20.

[0120] For example, the external shape of the chassis 11 can be designed as a cuboid, cube, or cylinder, etc. It should be noted that the above examples of the external shape of the chassis 11 are merely illustrative and should not be construed as limiting this application. The external shape of the chassis 11 can be flexibly set according to the actual situation.

[0121] In one embodiment, the power connection device 400 includes a third conductive component 430 disposed on the computing board 200.

[0122] Understandably, in a scenario where computing device 1 includes multiple computing modules 20, and each computing module 20 includes multiple computing boards 200, the third conductive component 430 can work in conjunction with the first conductive component 410 and the second conductive component 420 to power the computing boards 200. During power supply, the current generated by the power module 500 can form a loop between the multiple computing boards 200 within the computing module 20 through the first conductive component 410, the second conductive component 420, and the third conductive component 430, thereby enabling simultaneous power supply to the multiple computing modules 20 and the multiple computing boards 200 and improving power supply efficiency.

[0123] In one embodiment, the third conductive component 430 may include a first conductive base 431 and a second conductive base 432.

[0124] For example, in a power supply application scenario, the current can flow through the first conductive base 431 to the positive terminal of at least one computing board 200 in at least one computing module 20, and after passing through the computing board 200, it flows from the negative terminal of the computing board 200 back to the negative power supply terminal of the power module 500 through the second conductive base 432, completing the current loop and realizing the power supply to at least one computing module 20 in the computing device 1.

[0125] In one embodiment, a first slide plate 63 may be provided inside the chassis 11. The first slide plate 63 can divide the receiving cavity into two sub-cavities, in which the power module 500 and the computing module 20 are respectively housed.

[0126] For example, as shown in Figures 1, 2 and 4, the first slide plate 63 divides the receiving cavity into two sub-cavities, thereby isolating the computing module 20 and the power module 500, while also making the internal structure of the computing device 1 compact and improving the space utilization of the chassis 11.

[0127] In one embodiment, the first slide plate 63 and / or the power connection device 400 may be provided with a clearance structure, which may be configured to prevent interference between the first slide plate 63 and the power connection device 400.

[0128] In one implementation, the avoidance structure may be arranged along a first direction X.

[0129] In this embodiment, interference refers to at least a portion of the structure of the first slide plate 63 and the power connection device 400 being in spatial contact or overlapping. By providing a clearance structure on the first slide plate 63 and / or the power connection device 400, the two can avoid each other, thereby preventing the first slide plate 63 from affecting the installation of the power connection device 400 and improving the installation convenience and structural compactness of the power connection device 400 in the computing device 1.

[0130] In some examples, the clearance structure may be located at the end of the first slide plate 63 adjacent to the power connection device 400. Specifically, the clearance structure may be a clearance notch that penetrates the first slide plate 63 to connect the two sub-cavities. Part of the structure of the power connection device 400 may pass through the clearance notch so that the power connection device 400 can be electrically connected to the power supply terminal group of the power module 500 and the power connection terminal group of the computing module 20 in the two sub-cavities, respectively.

[0131] In other examples, a clearance structure may be provided on the power connection device 400. Specifically, the clearance structure may be a bent structure, wherein the power connection device 400 is configured as a bent structure at a position corresponding to the first slide plate 63, so that the power connection device 400 can clearance with the end of the power connection device 400 adjacent to the first slide plate 63 through the bent structure.

[0132] It should be noted that in other examples of this application, avoidance structures can also be provided on the first slide plate 63 and the power connection device 400 respectively. For example, an avoidance notch can be provided on the first slide plate 63 and a bending structure can be provided on the power connection device 400 at the same time to avoid contact between the first slide plate 63 and the power connection device 400.

[0133] For example, as shown in Figures 6A and 6B, a first clearance notch 632 may be provided on the first slide plate 63, connecting the two opposite sides of the first slide plate 63 in the second direction. A first conductive member 411 passes through the first clearance notch 632, so that the first conductive member 411 can be electrically connected to a first power supply terminal and a first power receiving terminal located on opposite sides of the first slide plate 63 in the second direction, respectively. A second conductive member 412 is provided with a bending structure 412a, which is formed by multiple bending of the second conductive member 412 at a position corresponding to the first slide plate 63 in a direction away from the first slide plate 63. Thus, the bending structure 412a can bypass the front end of the first slide plate 63, thereby creating clearance for the front end of the first slide plate 63.

[0134] It should be noted that in other examples of this application, the first conductive element 411 may be provided with a bending structure to avoid the first slide plate 63. Alternatively, the first slide plate 63 may also be provided with a second avoidance notch, which is used for the second conductive element 412 to pass through, thereby avoiding the second conductive element 412.

[0135] In one embodiment, the power connection device 400 includes a second conductive component 420, which includes a first electrical connector 421 and a second electrical connector 422.

[0136] For example, the first electrical connector 421 and the second electrical connector 422 can be installed in the same computing module 20. The first electrical connector 421 can form an electrical connection with the first power terminal 231 of each computing board 200 in the computing module 20, and the second electrical connector 422 can form an electrical connection with the second power terminal 232 of each computing board 200 in the computing module 20. During power supply, the power module 500 can form an electrical connection with the first power terminal 231 of multiple computing boards 200 through the first conductive member 411 and the first electrical connector 421, and form an electrical connection with the second power terminal 232 of multiple computing boards 200 through the second conductive member 412 and the second electrical connector 422. The current can form a loop among multiple computing boards 200 in the computing module 20, realizing simultaneous power supply to multiple computing boards 200 in the same computing module 20, thereby improving power supply efficiency.

[0137] In one embodiment, the length of the first electrical connector 421 may be less than the length of the second electrical connector 422.

[0138] For example, as shown in Figures 2 and 5, the second fold 4212 and the fourth fold 4222 can extend in the same direction along the second direction Y. The length of the fourth fold 4222 can be greater than that of the second fold 4212. A second clearance area can be defined between the two second electrical connection plates 42211 of the third fold 4221 of the second electrical connector 422, providing space for the installation and arrangement of the first electrical connector 421. This arrangement can ensure electrical isolation between the conductive components, help optimize space utilization, and meet the requirements of the compact computing device 1.

[0139] In one embodiment, the power connection device 400 may have a bent structure for mating with the chassis 11.

[0140] In one embodiment, the bent structure is parallel to the bottom wall of the chassis 11.

[0141] For example, as shown in Figures 6A and 6B, the second conductive element 412 of the first conductive component 410 may be provided with a bending structure 412a. The bending structure 412a is formed by multiple bending of the second conductive element 412 at the position corresponding to the first slide plate 63 in a direction away from the first slide plate 63. Thus, the bending structure 412a can bypass the front end of the first slide plate 63, thereby avoiding the front end of the first slide plate 63.

[0142] In one embodiment, the power connection device 400 may also have a non-bent structure, with the width of the bent structure being the same as that of the non-bent structure.

[0143] For example, as shown in Figures 6A and 6B, a first clearance notch 632 is provided on the first slide plate 63. The second conductive member 412 of the first conductive component 410 may be provided with a bent structure 412a, which can bypass the front end of the first slide plate 63, thereby creating clearance for the front end of the first slide plate 63. The first conductive member 411 may be provided with a corresponding non-bent structure, which can pass through the first clearance notch 632, so that the power connection device 400 can be electrically connected to the power supply terminal group of the power module 500 and the power receiving terminal group of the computing module 20 in the two sub-cavities, respectively. In one example, the projection width of the non-bent structure of the first conductive member 411 and the bent structure 412a of the second conductive member 412 along the third direction Z may be the same.

[0144] In other examples of this application, the first conductive member 411 may also be provided with a bending structure to avoid the first slide plate 63. Alternatively, the first slide plate 63 may also be provided with a second avoidance notch, and the second conductive member 412 may be provided with a non-bending structure. The second avoidance notch is used for the second conductive member 412 to pass through, thereby avoiding the second conductive member 412.

[0145] It should be noted that the above examples of the non-bent and bent structures of the power connection device 400 are merely illustrative and should not be construed as limiting this application. The non-bent and bent structures of the power connection device 400 can be flexibly configured according to actual circumstances. For example, the power connection device 400 may include a first conductive component 410. At least a portion of the first conductive component 410 is parallel to the plane containing at least a portion of the computing board 200.

[0146] For example, the plane containing the computing board 200 is parallel to the first direction X and the second direction Y, respectively, that is, the plane containing the computing board 200 is perpendicular to the third direction Z. The first conductive component 410 may include at least one metal busbar, with two ends of the metal busbar extending to a power supply terminal group and a power receiving terminal group, respectively, so that the two ends of the metal busbar are electrically connected to the power supply terminal group and the power receiving terminal group, respectively. The portion of the metal busbar located between the two ends may be parallel to the plane containing the computing board 200.

[0147] It should be noted that the multiple computing boards 200 included in the computing module 20 are spaced apart in the third direction Z. Therefore, the space occupied by the computing module 20 in the first direction X and the second direction Y is greater than the space occupied in the third direction Z. By arranging a portion of the first conductive component 410 parallel to the plane containing the computing board 200, the space occupied by the first conductive component 410 in the third direction Z can be reduced, thereby improving the space utilization of the computing device 1 and reducing its size in the third direction. In one embodiment, the power module 500 has a power supply terminal group, the computing board 200 has a power receiving terminal group, and the power connection device 400 is connected between the power supply terminal group and the power receiving terminal group.

[0148] In one embodiment, the power module 500 may have a power supply terminal group, the computing board 200 may have a power receiving terminal group, and the power connection device 400 may be electrically connected between the power supply terminal group and the power receiving terminal group. The power supply terminal of the power module 500 may be electrically connected to the power receiving terminal of at least one computing board 200 within at least one computing module 20, so as to realize the power supply of at least one computing board 200 and improve the power supply efficiency of the computing device.

[0149] In one embodiment, there are multiple computing modules 20, and the first conductive component 410 connects at least two computing modules 20.

[0150] In one embodiment, there are two computing modules 20, and the first conductive component 410 connects the two computing modules 20.

[0151] In one embodiment, the first conductive element 411 and the second conductive element 412 are respectively connected to two computing modules 20.

[0152] In some examples, the power supply terminal of the power module 500 can be electrically connected to the power connection terminal of each computing board 200 in the multiple computing modules 20 to supply power to all computing boards 200 in the computing device 1 and ensure the computing power of the computing device 1.

[0153] In other examples, the power supply terminal of the power module 500 can be electrically connected to the power connection terminal of a portion of the computing boards 200 within a portion of the computing modules 20, to supply power to the computing boards 200 within the computing device 1 to meet the specific computing power requirements of the computing boards 200. For example, as shown in Figures 1 and 2, the computing device 1 may include a power module 500 and two computing modules 20. Each computing module 20 may include two computing boards 200, which are electrically connected to each other. The power module 500 can be electrically connected to any one of the computing boards 200 in each computing module 20, thereby enabling simultaneous power supply to the four computing boards 200 included in the two computing modules 20 within the computing device 1.

[0154] It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art will understand that the computing power requirements of the computing device 1 can be configured with a corresponding number of computing modules 20 and computing boards 200 according to specific application scenarios.

[0155] In one embodiment, the power supply terminal group includes a first power supply terminal 511 and a second power supply terminal 512, and the power connection terminal group includes a first power connection terminal 231 and a second power connection terminal 232. The first conductive component 410 includes a first conductive element 411 and a second conductive element 412. The first conductive element 411 is electrically connected to the first power supply terminal 511 and the first power connection terminal 231 of the computing board 200 of at least one computing module 20, and the second conductive element 412 is electrically connected to the second power supply terminal 512 and the second power connection terminal 232 of the computing board 200 of at least one computing module 20.

[0156] In this embodiment, the power module 500 can be electrically connected to at least one computing module 20 via a first conductive component 410 to supply power to the at least one computing module 20. The first conductive component 410 may include a first conductive element 411 and a second conductive element 412. The first conductive element 411 can be electrically connected to a first power supply terminal 511 of the power supply device and a first power connection terminal 231 of the computing board 200 of the at least one computing module 20, and the second conductive element 412 can be electrically connected to a second power supply terminal 512 of the power supply device and a second power connection terminal 232 of the computing board 200 of the at least one computing module 20.

[0157] For example, the first power supply terminal 511 and the second power supply terminal 512 of the power module 500 can provide positive and negative power supplies respectively to ensure the correct flow of current and achieve stable power supply. In some examples, as shown in Figures 1, 2 and 4, the first power supply terminal 511 of the power module 500 can be the positive power supply terminal of the power module 500, and the second power supply terminal 512 can be the negative power supply terminal of the power module 500. The first connection terminal 231 of the computing board 200 can be the positive connection terminal of the computing board 200, and the second connection terminal 232 can be the negative connection terminal of the computing board 200. The first conductive element 411 can be electrically connected to the positive power supply terminal of the power module 500 and the positive connection terminal of the computing board 200, and the second conductive element 412 can be correspondingly electrically connected to the negative power supply terminal of the power module 500 and the negative connection terminal of the computing board 200. In the power supply application scenario, the current can flow from the positive power supply terminal of the power module 500 to the positive power connection terminal of at least one computing board 200 in at least one computing module 20. After passing through the computing board 200, the current flows back from the negative power connection terminal of the computing board 200 to the negative power supply terminal of the power module 500, completing the current loop and realizing the power supply to at least one computing module 20 in the computing device 1.

[0158] In other examples, the positive and negative terminals of the first power supply terminal 511 and the second power supply terminal 512, as well as the positive and negative terminals of the first power connection terminal 231 and the second power connection terminal 232, can be reversed compared to the examples described above. In this case, the first conductive element 411 can be electrically connected to the negative power supply terminal of the power module 500 and the negative power connection terminal of the computing board 200, and the second conductive element 412 can be electrically connected to the positive power supply terminal of the power module 500 and the positive power connection terminal of the computing board 200, so as to provide power to at least one computing module 20 in the computing device 1. The specific current flow direction will not be described in detail.

[0159] It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art can flexibly configure the power supply and connection terminals according to specific application scenarios.

[0160] In this embodiment, the first conductive element 411 and the second conductive element 412 can form a stable electrical connection with the power module 500 and the computing module 20. The power module 500 can effectively transmit power to at least one computing module 20, simplifying the complexity of the power connection and ensuring the stable operation of the computing module 20.

[0161] For example, the first conductive element 411 and the second conductive element 412 can be electrically connected to the power module 500 and the computing module 20 through contact connection or intermediate medium connection.

[0162] In some examples, the first conductive element 411 is electrically connected to the power module 500 and the computing module 20 respectively through direct connection, and the second conductive element 412 is electrically connected to the power module 500 and the computing module 20 respectively through direct connection. The first conductive element 411 and the second conductive element 412 can be electrically connected between the power module 500 and the computing module 20 by methods such as welding, crimping or bolting, which increases the conductivity efficiency while ensuring the strength and reliability of the connection.

[0163] In other examples, the first conductive element 411 is electrically connected to the power module 500 and the computing module 20 indirectly, respectively. Similarly, the second conductive element 412 is electrically connected to both the power module 500 and the computing module 20 indirectly. The first conductive element 411 and the second conductive element 412 can form indirect electrical connections with the power module 500 and the computing module 20 through intermediate connecting components, such as terminals, plugs, sockets, or connectors, increasing connection flexibility and facilitating subsequent maintenance and replacement of the computing device 1.

[0164] In other examples, the connection between the first conductive element 411, the second conductive element 412 and the power receiving terminal and the power supply terminal can be designed as a plug-in connection, which facilitates quick installation and disassembly and improves the maintainability of the computing device 1.

[0165] It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. The connection methods between the first conductive element 411, the second conductive element 412 and the power receiving terminal and the power supply terminal are not limited to the aforementioned examples. Those skilled in the art can flexibly set the aforementioned connection methods according to specific application scenarios.

[0166] For example, the shapes of the first conductive element 411 and the second conductive element 412 can be set according to the specific spatial layout inside the computing device 1.

[0167] It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. The embodiments of this application do not impose specific limitations on the geometric properties such as the shape and size of the first conductive component 410.

[0168] For example, the contact area between the first conductive component 410 and the power supply terminal and the power receiving terminal of the computing module 20 can be selected according to the current load requirements to ensure connection stability and power supply efficiency. The thickness and width of the first conductive component 410 can also be selected according to the specific requirements of the current load to ensure that the conductive component can withstand the operating current without causing severe overheating or damage. This application embodiment does not impose specific limitations on the thickness, width, contact area with the power supply terminal and the power receiving terminal, or other attributes of the first conductive component 410.

[0169] For example, the surface of the first conductive component 410 may be plated with gold, silver or other coatings to improve conductivity and oxidation resistance and extend service life.

[0170] In some examples, the surface of the first conductive component 410 may be gold-plated to reduce contact resistance, making it suitable for applications with high requirements for conductivity and corrosion resistance.

[0171] In other examples, the surface of the first conductive component 410 can be silver-plated or nickel-plated to achieve good conductivity and corrosion resistance at low cost, making it suitable for applications where cost control is a high priority. It should be noted that the above are merely illustrative examples and do not constitute a limitation of this application.

[0172] In this way, the power connection device 400 for computing device 1 provided in this embodiment of the application has conductive components electrically connected to the power supply terminal of the power module 500 and the power receiving terminal of the computing board 200, which simplifies the internal wiring of computing device 1 and facilitates the internal space management of computing device 1. The conductive components are electrically connected to the power supply terminal of the power module 500 and the power receiving terminal of the computing board 200 of at least one computing module 20, which can realize the power supply of multiple computing modules 20, improve the power supply efficiency of computing device 1, and simplify the modification of power connection when it is necessary to add or replace computing modules 20, thereby improving the scalability of the system.

[0173] In one embodiment, the first conductive element 411 may include a first conductive plate 4111 and a second conductive plate 4112 spaced apart in the second direction Y. The first conductive plate 4111 may be electrically connected to the first power supply terminal 511, and the second conductive plate 4112 may be electrically connected to the first power receiving terminal 231.

[0174] For example, the planes containing the first conductive plate 4111 and the second conductive plate 4112 are perpendicular to the first direction X, and are also perpendicular to the planes containing the power supply terminal and the power receiving terminal, respectively. Thus, the first conductive plate 4111 is correspondingly disposed in surface contact with the first power supply terminal 511, and the second conductive plate 4112 is correspondingly disposed in surface contact with the first power receiving terminal 231, thereby improving the reliability of the electrical connection between the first conductive member 411 and the first power supply terminal 511 and the first power receiving terminal 231.

[0175] In one embodiment, a first avoidance area is defined between the first conductive plate 4111 and the second conductive plate 4112 in a second direction Y, and the second conductive member 412 may be located in the first avoidance area.

[0176] For example, as shown in FIG4, the first conductive plate 4111 and the second conductive plate 4112 can extend in the same direction along a third direction Z, and the first connecting plate 4113 can be connected between the first conductive plate 4111 and the second conductive plate 4112 and extend along a second direction Y. A first clearance area can be defined between the first conductive plate 4111 and the second conductive plate 4112 to provide space for the installation and arrangement of the second conductive component 412, which helps to optimize space utilization and ensure electrical isolation between the conductive components.

[0177] In one embodiment, the first conductive element 411 may further include a first connecting plate 4113 connected between the first conductive plate 4111 and the second conductive plate 4112; wherein the planes on which the first conductive plate 4111 and the second conductive plate 4112 are located are arranged in parallel, and the plane on which the first connecting plate 4113 is located is arranged perpendicular to the plane on which the first conductive plate 4111 is located.

[0178] For example, in a power supply application scenario, the current supplied by the power module 500 can be conducted through the first conductive plate 4111, the second conductive plate 4112, and the first connecting plate 4113 between the first conductive plate 4111 and the second conductive plate 4112 to power at least one computing module 20. As shown in Figures 1 and 2, the first conductive element 411 may include the first conductive plate 4111, the second conductive plate 4112, and the first connecting plate 4113 connected between the first conductive plate 4111 and the second conductive plate 4112. The planes containing the first conductive plate 4111 and the second conductive plate 4112 may be arranged parallel to each other, and the plane containing the first connecting plate 4113 may be arranged perpendicular to the plane containing the first conductive plate 4111.

[0179] For example, the computing device 1 may include multiple computing modules 20, which are arranged at intervals along a third direction Z. Each computing module 20 may include multiple computing boards 200, which are also arranged at intervals along a third direction Z and electrically connected to each other. A first conductive plate 4111 extends along a third direction Z and forms an electrical connection with a first power supply terminal 511 of the power supply device. The direction and range of the extension of the first conductive plate 4111 can be set according to the installation position of the power supply terminal group relative to the bottom wall of the chassis 11, and this embodiment does not impose specific limitations. A second conductive plate 4112 extends along a third direction Z and forms an electrical connection with at least one computing module 20 it passes through. Specifically, the second conductive plate 4112 can form an electrical connection with the first power receiving terminal 231 of at least one computing board 200 in the computing module 20 it passes through, so as to supply power to all computing boards 200 within that computing module 20. The direction and range of the first conductive plate 4111 can be set according to the number of computing modules 20 and computing boards 200, and the position of the power connection terminal group 230 of computing boards 200. This application embodiment does not impose specific limitations. The first connecting plate 4113 can be connected between the first conductive plate 4111 and the second conductive plate 4112, and extends along the second direction Y.

[0180] In some examples, the first conductive element 411 can be a one-piece stepped three-dimensional structure. Specifically, the first conductive element 411 can be formed by bending a one-piece part or by casting. Specifically, the first conductive plate 4111 can be bent at the junction of the first conductive plate 4111 and the first connecting plate 4113, so that the plane of the first conductive plate 4111 is perpendicular to the plane of the first connecting plate 4113. Correspondingly, the second conductive plate 4112 can be bent at the junction of the second conductive plate 4112 and the first connecting plate 4113, so that the plane of the second conductive plate 4112 is perpendicular to the plane of the first connecting plate 4113. Using a one-piece molding process can simplify the manufacturing process, reduce production costs, and provide stable mechanical support and high electrical connection efficiency for the first conductive element 411. In specific application scenarios, the bending position and bending direction of the first conductive plate 4111 and the second conductive plate 4112 in the first conductive component 411 can be adjusted according to the actual installation space. This application embodiment does not impose specific limitations.

[0181] In other examples, the first conductive element 411 can be formed in separate parts and then assembled to form a stepped three-dimensional structure. Specifically, the first conductive element 411 can be formed by combining the first conductive plate 4111, the second conductive plate 4112, and the first connecting plate 4113 through plugging, bolting, or other methods, increasing the flexibility and scalability of the first conductive element 411.

[0182] It should be noted that the above are merely illustrative examples. The application examples provided in this application embodiment are for ease of understanding. This application embodiment does not specifically limit the formation method of the first conductive element 411.

[0183] For example, the first conductive plate 4111 and the second conductive plate 4112 may be located on the same plane perpendicular to the first direction X, or the first conductive plate 4111 and the second conductive plate 4112 may be located on different planes perpendicular to the first direction X and parallel to each other, so as to match the specific position distribution of the power supply terminal group and the power receiving terminal group 230 in the computing device 1 in the first direction X, thereby forming a stable electrical connection between the power supply terminal group and the power receiving terminal group 230.

[0184] As shown in Figure 4, the first connecting plate 4113 can cooperate with the chassis 60 of the computing device 1 to support the first conductive component 411 for power supply. Specifically, the first connecting plate 4113 can be mechanically fixed to other structures of the chassis 11, such as screws or clips, to ensure its stability and reliability during use.

[0185] This design, through the bending design of the first conductive component 411, allows for more efficient use of the internal space of the computing device 1 to install conductive components, resulting in a compact internal layout of the computing device 1 and a more rational power supply for the computing module 20. The bending structure of the first conductive component 411 can be used to fix and support it, ensuring the stability of the electrical connection.

[0186] In one embodiment, the second conductive element 412 may include a third conductive plate 4121 and a fourth conductive plate 4122 disposed at intervals along the second direction Y. The third conductive plate 4121 may be electrically connected to the second power supply terminal 512, and the fourth conductive plate 4122 may be electrically connected to the second power receiving terminal 232.

[0187] In one embodiment, the second conductive element 412 may further include a second connecting plate connected between the third conductive plate 4121 and the fourth conductive plate 4122; wherein the planes on which the second connecting plate, the third conductive plate 4121 and the fourth conductive plate 4122 are located may be arranged in parallel.

[0188] For example, the third conductive plate 4121 can be electrically connected to the second power supply terminal 512, and the fourth conductive plate 4122 can be electrically connected to the second power receiving terminal 232. In power supply application scenarios, the current supplied by the power module 500 can be conducted through the third conductive plate 4121, the second connecting plate, and the fourth conductive plate 4122 to power at least one computing module 20. As shown in Figures 1 and 2, the second conductive element 412 may include the third conductive plate 4121, the fourth conductive plate 4122, and the second connecting plate connected between the third conductive plate 4121 and the fourth conductive plate 4122.

[0189] For example, the planes containing the second connecting plate 4123, the third conductive plate 4121, and the fourth conductive plate 4122 of the second conductive member 412 can be arranged in parallel. The third conductive plate 4121 and the fourth conductive plate 4122 can be located on the same plane perpendicular to the first direction X, or the third conductive plate 4121 and the fourth conductive plate 4122 can be located on different planes perpendicular to the first direction X and parallel to each other, so as to match the specific position distribution of the power supply terminal group and the power receiving terminal group 230 in the computing device 1 in the first direction X, so that a stable electrical connection is formed between the power supply terminal group and the power receiving terminal group 230.

[0190] For example, the computing module 20 may include multiple computing boards 200, which are spaced apart along a third direction Z and electrically connected to each other. A third conductive plate 4121 extends along a third direction Z and forms an electrical connection with the second power supply terminal 512 of the power supply device. The direction and range of the extension of the third conductive plate 4121 can be set according to the installation position of the power supply terminal group on the power module 500 relative to the bottom wall of the chassis 11; this embodiment does not impose specific limitations. A fourth conductive plate 4122 extends along a third direction Z and forms an electrical connection with at least one computing module 20 it passes through. Specifically, the fourth conductive plate 4122 can form an electrical connection with the second power connection terminal 232 of at least one computing board 200 in the passing computing module 20 to supply power to all computing boards 200 within the computing module 20. The direction and range of the extension of the fourth conductive plate 4122 can be set according to the number of computing modules 20 and computing boards 200, and the position of the power connection terminal group 230 of the computing boards 200; this embodiment does not impose specific limitations. The second connecting plate can connect the first conductive plate 4111 and the second conductive plate 4112, and extends along the second direction Y.

[0191] For example, as shown in FIG4, the computing device 1 may include two computing modules 20, each computing module 20 may include two computing boards 200, and the computing boards 200 are electrically connected to each other. The second conductive member 412 may be a planar structure, and the second connecting plate 4123, the third conductive plate 4121 and the fourth conductive plate 4122 may be located on the same plane perpendicular to the first direction X. The second conductive member 412 may be L-shaped, and the fourth conductive plate 4122 may pass through the two computing modules 20 to form an electrical connection with one computing board 200 in each computing module 20, so as to supply power to all computing boards 200 in the computing module 20.

[0192] In some examples, the second conductive element 412 can be a single-piece molded part, which can simplify the manufacturing process, reduce production costs, and improve electrical connection efficiency.

[0193] In other examples, the second conductive element 412 can be formed separately and then assembled. Specifically, the second conductive element 412 can be formed by combining the third conductive plate 4121, the fourth conductive plate 4122, and the second connecting plate through plugging, bolting, or other means, increasing the flexibility and scalability of the second conductive element 412.

[0194] It should be noted that the above are merely illustrative examples. The application examples provided in this application embodiment are for ease of understanding. This application embodiment does not specifically limit the formation method of the second conductive element 412.

[0195] In one embodiment, the material of the first conductive component 410 may include at least one of copper, aluminum, and silver. In some examples, the material of the first conductive component 410 may be a single piece of copper, a single piece of silver, or a single piece of aluminum, ensuring that the first conductive component 410 has good conductivity and corrosion resistance. In other examples, the first conductive component 410 may be modularly formed, assembled from dissimilar modular components such as copper and aluminum parts, to fully utilize the advantages of multiple materials and optimize conductivity and mechanical properties.

[0196] It should be noted that the above are merely illustrative examples. The application examples provided in this application embodiment are for ease of understanding. This application embodiment does not specifically limit the material of the first conductive component 410.

[0197] In one embodiment, the length of the first conductive element 411 is 15 to 19 mm, the width of the first conductive element 411 is 2 to 3 mm, and the thickness of the first conductive element 411 is 0.2 to 0.4 mm; the length of the second conductive element 412 is 6 to 8 mm, the width of the second conductive element 412 is 2 to 3 mm, and the thickness of the second conductive element 412 is 0.2 to 0.4 mm.

[0198] For example, the length of the first conductive element 411 refers to its dimension in the second direction Y, the width of the first conductive element 411 refers to its dimension in the third direction Z, and the thickness of the first conductive element 411 refers to its dimension in the first direction X. Similarly, the length of the second conductive element 412 refers to its dimension in the second direction Y, the width of the second conductive element 412 refers to its dimension in the first direction X, and the thickness of the second conductive element 412 refers to its dimension in the third direction Z.

[0199] In a specific example, the first conductive element 411 has a length of 17 mm, a width of 2.5 mm, and a thickness of 0.3 mm. The second conductive element 412 has a length of 7 mm, a width of 2.5 mm, and a thickness of 0.3 mm.

[0200] It should be noted that the product of the width and thickness of the first conductive element 411 and the second conductive element 412 is the cross-sectional area. The size of the cross-sectional area is negatively correlated with the resistance of the first conductive element 411 and the second conductive element 412. In other words, the larger the cross-sectional area of ​​the conductive element, the lower its resistance, and the smaller the cross-sectional area, the higher its resistance. By setting the width and thickness of the first conductive element 411 and the second conductive element 412 to 2 to 3 mm and 0.2 to 0.4 mm, respectively, the first conductive element 411 and the second conductive element 412 can have a larger cross-sectional area, thereby reducing the resistance of the first conductive element 411 and the second conductive element 412, thus reducing the loss of the first conductive component 410 during power transmission, and also reducing the heat generated by the first conductive component 410 during power transmission.

[0201] It is understood that the above is only an exemplary description. The specific dimensions of the first conductive element 411 and the second conductive element 412 can be flexibly set according to the distance between the power supply terminal group and the power receiving terminal group, the internal space dimensions of the housing 11, and the impedance of the conductive element itself. This application embodiment does not make specific limitations in this regard.

[0202] In one embodiment, the power connection device 400 for the computing device 1 may further include: at least one second conductive component 420, which is disposed corresponding to at least one computing module 20, and the first conductive component 410 can be electrically connected to the computing board 200 of at least one computing module 20 through at least one second conductive component 420.

[0203] In this embodiment, the computing device 1 may include at least one computing module 20, and each computing module 20 may include at least one computing board 200. The power connection device 400 may include at least one second conductive component 420 corresponding to each computing module 20. Exemplarily, the second conductive component 420 may be configured one-to-one with each computing module 20. The second conductive component 420 may be electrically connected to the first conductive component 410 and simultaneously electrically connected to the power terminal group 230 of at least one computing board 200 within the same computing module 20. It is understood that in scenarios where the computing device 1 includes multiple computing modules 20 and each computing module 20 includes multiple computing boards 200, the second conductive component 420 can enable electrical connections between the multiple computing boards 200 within the same computing module 20. During power supply, the current generated by the power module 500 can form a loop between the multiple computing boards 200 within the computing module 20 through the first conductive component 410 and the second conductive component 420, thereby achieving simultaneous power supply to multiple computing modules 20 and multiple computing boards 200 and improving power supply efficiency.

[0204] In one embodiment, the power connection device 400 may include a second conductive component 420. At least a portion of the second conductive component 420 is parallel to the plane containing at least a portion of the computing board 200.

[0205] For example, the plane containing the computing board 200 is parallel to the first direction X and the second direction Y, respectively, that is, the plane containing the computing board 200 is perpendicular to the third direction Z. The second conductive component 420 may include at least one metal busbar, with two ends of the metal busbar extending to the first conductive component 410 and the power connection terminal group, respectively, so that the two ends of the metal busbar are electrically connected to the first conductive component 410 and the power connection terminal group, respectively. The portion of the metal busbar located between the two ends may be parallel to the plane containing the computing board 200.

[0206] It should be noted that the multiple computing boards 200 included in the computing module 20 are spaced apart in the third direction Z. Therefore, the space occupied by the computing module 20 in the first direction X and the second direction Y is greater than the space occupied in the third direction Z. By arranging a portion of the second conductive component 4210 parallel to the plane where the computing board 200 is located, the space occupied by the second conductive component 420 in the third direction Z can be reduced, thereby improving the space utilization of the computing device 1 and reducing the size of the computing device 1 in the third direction Z.

[0207] In one embodiment, there are two second conductive components 420, and each second conductive component 420 corresponds to one computing module 20.

[0208] In one embodiment, each computing module 20 includes at least one computing board 200, and each second conductive component 420 connects to all computing boards 200 in a computing module 20.

[0209] In one embodiment, each computing module 20 includes two computing boards 200, and each second conductive component 420 is connected to the two computing boards 200 in a computing module 20.

[0210] In this embodiment, the second conductive component 420 may include multiple electrical connection plates extending in a third direction Z. The electrical connection plates of the second conductive component 420 may be configured to correspond to all or part of the computing boards 200 integrated within the same computing module 20. For example, the number of computing boards 200 included in the same computing module 20 may be one, two, three, four, etc., and the number of electrical connection plates corresponding to the second conductive component 420 may also be one, two, three, four, etc. This embodiment does not impose specific limitations. The direction and range of the extension of the electrical connection plates in the second conductive component 420 may be set according to the installation position of the computing board 200 relative to the computing device 1; this embodiment does not impose specific limitations. It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application.

[0211] For example, in a scenario where the same computing module 20 includes multiple computing boards 200, the electrical connection plate of the first electrical connector 421 can correspond one-to-one with the multiple computing boards 200 in the same computing module 20 and can be electrically connected to the first power terminal 231 of the multiple computing boards 200. Correspondingly, the electrical connection plate of the second electrical connector 422 can correspond one-to-one with the multiple computing boards 200 in the same computing module 20 and can be electrically connected to the second power terminal 232 of the multiple computing boards 200, so that an electrical connection is formed between the multiple computing boards 200 in the same computing module 20. During power supply, the power module 500 can form an electrical connection with the first power terminal 231 of multiple computing boards 200 through the first conductive element 411 and the first electrical connector 421, and form an electrical connection with the second power terminal 232 of multiple computing boards 200 through the second conductive element 412 and the second electrical connector 422. The current can form a loop among the multiple computing boards 200 in the computing module 20, so as to realize the simultaneous power supply of multiple computing boards 200 in the same computing module 20 and improve the power supply efficiency.

[0212] In one embodiment, the second conductive component 420 may include a first electrical connector 421 and a second electrical connector 422, wherein the first electrical connector 421 is connected to at least one computing board 200 and the second electrical connector 422 is connected to at least one computing board 200.

[0213] For example, the first conductive element 411 can be electrically connected to the first power terminal 231 of the computing board 200 via the first electrical connector 421, and the second conductive element 412 can be electrically connected to the second power terminal 232 of the computing board 200 via the second electrical connector 422. The first electrical connector 421 and the second electrical connector 422 can be installed in the same computing module 20. The first electrical connector 421 can form an electrical connection with the first power terminal 231 of each computing board 200 in the computing module 20, and the second electrical connector 422 can form an electrical connection with the second power terminal 232 of each computing board 200 in the computing module 20. Specifically, the first electrical connector 421 can be provided with a folded edge structure, which can include at least one electrical connection plate. The at least one electrical connection plate can be provided one-to-one with at least one computing board 200 in the computing module 20 and can be electrically connected to the first power terminal 231 of at least one computing board 200. Correspondingly, the second electrical connector 422 can be provided with at least one folded edge. At least one folded edge of the second electrical connector 422 can be configured to correspond one-to-one with at least one computing board 200 in the computing module 20, and can be electrically connected to the second power terminal 232 of at least one computing board 200.

[0214] It should be noted that the above are merely illustrative examples. The application examples provided in this application embodiment are for ease of understanding. This application embodiment does not specifically limit the connection structure of the second conductive component 420.

[0215] In one embodiment, a first electrical connector 410 connects two computing boards 200, and a second electrical connector 420 connects two computing boards 200.

[0216] For example, the first power supply terminal 511 and the second power supply terminal 512 of the power module 500 can provide positive and negative power respectively to ensure power supply.

[0217] In some examples, as shown in Figures 1, 2, and 4, the first power supply terminal 511 of the power module 500 can be the positive terminal of the power module 500, and the second power supply terminal 512 can be the negative terminal of the power module 500. The first electrical connection terminal 231 of the computing board 200 can be the positive terminal of the computing board 200, and the second electrical connection terminal 232 can be the negative terminal of the computing board 200. The first electrical connector 421 can be electrically connected to the positive terminal of the computing board 200 and the first conductive plate 4111, and the second electrical connector 422 can be correspondingly electrically connected to the negative terminal of the computing board 200 and the second conductive plate 4112. In the power supply application scenario, current can flow from the positive terminal of the power module 500 to the positive terminal of at least one computing board 200 in at least one computing module 20, and after passing through the computing board 200, it flows back from the negative terminal of the computing board 200 to the negative terminal of the power module 500, completing the current loop and realizing the power supply to at least one computing module 20 in the computing device 1.

[0218] In other examples, the positive and negative terminals of the first power supply terminal 511 and the second power supply terminal 512, as well as the positive and negative terminals of the first power connection terminal 231 and the second power connection terminal 232, can be reversed compared to the examples described above. In this case, the first electrical connector 421 can be electrically connected to the negative terminal of the computing board 200 and the first conductive plate 4111, and the second electrical connector 422 can be electrically connected to the positive terminal of the computing board 200 and the second conductive plate 4112, so as to provide power to at least one computing module 20 in the computing device 1. The specific current flow direction will not be described in detail.

[0219] It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art can flexibly configure the power supply and connection terminals according to specific application scenarios.

[0220] In this embodiment, the first electrical connector 421 and the second electrical connector 422 enable a stable electrical connection between multiple computing boards 200 within the same computing module 20. This facilitates the power module 500 to effectively transmit power to the multiple computing boards 200 of the computing module 20, thereby improving the power supply efficiency of the computing device 1. When it is necessary to add or replace computing boards 200, the modification of the power connection is simple, thus improving the scalability of the system.

[0221] In one embodiment, the first conductive element 410 is connected to the first power terminal 231 of the computing board 200 via the first electrical connector 411, and the second conductive element 420 is connected to the second power terminal 232 of the computing board via the second electrical connector 412.

[0222] For example, the power module 500 can be electrically connected to at least one computing module 20 via a first conductive component 410 to supply power to the at least one computing module 20. The first conductive component 410 may include a first conductive element 411 and a second conductive element 412. The first conductive element 411 may be electrically connected to a first power supply terminal 511 of the power supply device and a first power connection terminal 231 of the computing board 200 of at least one computing module 20, and the second conductive element 412 may be electrically connected to a second power supply terminal 512 of the power supply device and a second power connection terminal 232 of the computing board 200 of at least one computing module 20. In one embodiment, the first electrical connector 421 may include opposing first electrical contact surfaces 421a and 421a. The first electrical contact surface 421a can be used for electrical contact with the first conductive element 411, and the second electrical contact surface can be used for electrical connection with the first power connection terminal 231 of the computing board 200.

[0223] In one embodiment, the second electrical connector 422 may include a third electrical contact surface 422a and a fourth electrical contact surface disposed opposite to each other. The third electrical contact surface 422a may be used to make electrical contact with the second conductive element 412, and the fourth electrical contact surface may be used to make electrical connection with the second power terminal 232 of the computing board 200.

[0224] For example, as shown in Figures 4 and 5, the first electrical connector 421 and the second electrical connector 422 can be double-sided electrical contact devices. The first electrical connector 421 may include opposing first electrical contact surfaces 421a and second electrical contact surfaces (not shown in the figures), and the second electrical connector 422 may include opposing third electrical contact surfaces 422a and fourth electrical contact surfaces (not shown in the figures). The contact area between the second conductive component 420 and the first conductive component 410 and the power connection terminal group 230 of the computing board 200 can be selected according to the current load requirements to ensure the stability of the connection and the power supply efficiency. This application embodiment does not impose specific limitations on this.

[0225] For example, each computing module 20 may include two computing boards 200. Taking the installation scenario of the power connection device 400 as an example, the first electrical connector 421 may be first installed on the first power-connecting terminal 231 of the two computing boards 200 in the computing module 20, and the second electrical connector 422 may be installed on the second power-connecting terminal 232 of the two computing boards 200 in the computing module 20. The second electrical contact surface of the first electrical connector 421 may form an electrical connection with the first power-connecting terminal 231 of the computing board 200, and the fourth electrical contact surface of the second electrical connector 422 may be used to form an electrical connection with the second power-connecting terminal 232 of the computing board 200. The first conductive plate 4111 of the first conductive member 411 may be installed on the power supply terminal group of the power module 500, and the second conductive plate 4112 may be installed on the first folded edge 4211 of the first electrical connector 421, wherein the second conductive plate 4112 may form an electrical contact with the first electrical contact surface 421a of the first electrical connector 421. The third conductive plate 4121 of the second conductive component 412 can be installed on the power supply terminal group of the power module 500, and the fourth conductive plate 4122 can be installed on the third folded edge 4221 of the second electrical connector 422. The fourth conductive plate 4122 can form electrical contact with the third electrical contact surface 422a of the second electrical connector 422. During power supply, the current generated by the power module 500 can form a loop between multiple computing boards 200 within the computing module 20 through the first conductive component 410 and the second conductive component 420, thereby enabling simultaneous power supply to multiple computing modules 20 and multiple computing boards 200 and improving power supply efficiency.

[0226] In one embodiment, the first electrical connector 421 may include a first folded edge 4211 and a second folded edge 4212 connected to each other. The first folded edge 4211 may be arranged perpendicularly to the plane where the second folded edge 4212 is located. The two opposite side surfaces of the first folded edge 4211 may respectively form a first electrical contact surface and a second electrical contact surface. The second folded edge 4212 may be attached to the computing board 200.

[0227] In one embodiment, the second electrical connector 422 may include a third folded edge 4221 and a fourth folded edge 4222 connected to each other. The third folded edge 4221 may be arranged perpendicularly to the plane where the fourth folded edge 4222 is located. The two opposite side surfaces of the third folded edge 4221 may respectively form a third electrical contact surface and a fourth electrical contact surface. The fourth folded edge 4222 may be attached to the computing board 200.

[0228] For example, the first conductive component 410 can be electrically connected to the power terminal group 230 of the computing board 200 through the folded edge structure of the second conductive component 420. As shown in Figures 2, 3, and 4, two computing boards 200, namely the first computing board 201 and the second computing board 202, can be integrated within the computing module 20. The first electrical connector 421 can be correspondingly provided with a first folded edge 4211 extending along the third direction Z, and the second electrical connector 422 can be correspondingly provided with a third folded edge 4221 extending along the third direction Z. Among them, the two side surfaces of the first folded edge 4211 opposite to each other along the first direction X can respectively form a first electrical contact surface 421a and a second electrical contact surface, and the two side surfaces of the third folded edge 4221 opposite to each other along the first direction X can respectively form a third electrical contact surface 422a and a fourth electrical contact surface. The first folded edge 4211 of the first electrical connector 421 can form an electrical connection with the second conductive plate 4112 through the first electrical contact surface 421a, and can simultaneously form an electrical connection with the first power terminal 231 of the first computing board 201 and the first power terminal 231 of the second computing board 202 through the second electrical contact surface. Correspondingly, the third folded edge 4221 of the second electrical connector 422 can form an electrical connection with the fourth conductive plate 4122 through the third electrical contact surface 422a, and can simultaneously form an electrical connection with the second power terminal 232 of the first computing board 201 and the second power terminal 232 of the second computing board 202 through the fourth electrical contact surface. The first folded edge 4211 may include two first electrical connection plates 42111 corresponding to the first computing board 201 and the second computing board 202, and the third folded edge 4221 may include two second electrical connection plates 42211 corresponding to the first computing board 201 and the second computing board 202. The first electrical connector 421 can be electrically connected to the first power terminal 231 of the first computing board 201 and the second computing board 202 via the two electrical connection plates of the first folded edge 4211. The second electrical connector 422 can be electrically connected to the second power terminal 232 of the first computing board 201 and the second computing board 202 via the electrical connection plate of the third folded edge 4221, so that the first computing board 201 and the second computing board 202 within the same computing module 20 are electrically connected. During the power supply process, the power module 500 can be electrically connected to the power terminals of multiple computing boards 200 via the first conductive component 410 and the second electrical connector 422. The current can form a loop among the multiple computing boards 200 within the computing module 20, realizing simultaneous power supply to multiple computing boards 200 in the same computing module 20, thereby improving power supply efficiency.

[0229] It should be noted that the above are merely illustrative examples. The application examples provided in this application embodiment are for ease of understanding. This application embodiment does not specifically limit the connection structure of the second conductive component 420.

[0230] In this way, multiple computing boards 200 within the same computing module 20 can be electrically connected through the second conductive component 420. During power supply, all computing boards 200 within the computing module 20 can receive power, improving the power supply efficiency of the computing device 1. It should be noted that the above is merely a specific example and does not constitute a limitation on this application.

[0231] In this embodiment, the first folded edge 4211 may be perpendicular to the plane where the second folded edge 4212 is located, and the third folded edge 4221 may be perpendicular to the plane where the fourth folded edge 4222 is located.

[0232] In some examples, the second conductive component 420 can be a one-piece stepped three-dimensional structure. Specifically, the second conductive component 420 can be formed by bending a one-piece molded part, or it can be formed by casting. Taking the first electrical connector 421 as an example, multiple first folds 4211 can be bent at the junction of multiple first folds 4211 and second folds 4212, so that the plane where the first folds 4211 are located is perpendicular to the plane where the second folds 4212 are located, thus forming the first electrical connector 421. This configuration simplifies the manufacturing process, reduces production costs, and provides stable mechanical support and high electrical connection efficiency for the second conductive component 420. In specific application scenarios, the bending position and bending direction of the first folds 4211 in the first electrical connector 421 can be adjusted according to the actual installation space, and this application embodiment does not impose specific limitations.

[0233] In other examples, the second conductive component 420 can be a stepped three-dimensional structure formed by separate molding and assembly. Specifically, the second conductive component 420 can be formed by combining the first folded edge 4211 and the second folded edge 4212 through methods such as plugging and bolting, increasing the flexibility and scalability of the second conductive component 420.

[0234] It should be noted that the above are merely illustrative examples. The application examples provided in this application embodiment are for ease of understanding. This application embodiment does not specifically limit the formation method of the second conductive component 420.

[0235] As shown in Figure 4, the second folded edge 4212 and the fourth folded edge 4222 can be fitted together with the computing board 200 to support the second conductive component 420 for power supply. Specifically, the second folded edge 4212 and the fourth folded edge 4222 can be mechanically fixed to the computing board 200, such as by screws or clips, to ensure the stability and reliability of the second conductive component 420 during use.

[0236] This design, through the bending design of the second conductive component 420, allows for more efficient use of the internal space of the computing device 1 to install the conductive components, resulting in a compact and rational internal layout of the computing device 1 and enabling power supply to the computing module 20. The bent edge structure of the second conductive component 420 can be used to fix and support the first conductive component 411, ensuring the stability of the electrical connection. The bent edge structure of the second conductive component 420 is scalable, allowing for flexible addition or removal of the computing board 200 to adapt to different computing power requirements.

[0237] In one embodiment, the first folded edge 4211 and the second conductive plate 4112 of the first conductive element 411 can be fixedly connected by fasteners 440.

[0238] In one embodiment, the third folded edge 4221 and the fourth conductive plate 4122 of the second conductive member 412 can be fixedly connected by a fastener 440. Exemplarily, as shown in Figures 2, 3, and 4, the first conductive component 410, the second conductive component 420, and the third conductive component 430 at the power connection terminal group 230 of the computing board 200 can each be provided with a plurality of connection holes arranged side-by-side along the second direction Y. The first conductive component 410, the second conductive component 420, and the third conductive component 430 at the power connection terminal group 230 of the computing board 200 can be fixedly connected by a fastener 440. The fastener 440 can be a conductive element, can be a screw structure, and can be made of at least one of copper, aluminum, and silver.

[0239] In some examples, fastener 440 can be made of silver, which is suitable for scenarios where high resistance to corrosion and conductivity are required.

[0240] In other examples, fastener 440 can be made of aluminum, which is suitable for scenarios where weight control is a critical requirement.

[0241] It should be noted that the above are merely illustrative examples. The application examples provided in this application embodiment are for ease of understanding. This application embodiment does not specifically limit the material and shape of the fastener 440.

[0242] As shown in Figures 2 and 4, during the installation of the power connection device 400, the fastener 440 can pass through the connection holes of the first conductive component 410, the second conductive component 420, and the third conductive component 430 at the power connection terminal group 230 of the computing board 200 in sequence, so that the first conductive component 410, the second conductive component 420, and the third conductive component 430 fit tightly together, thereby achieving a stable electrical connection between the first conductive component 410, the second conductive component 420, and the third conductive component 430 and the computing board 200.

[0243] Figure 5 shows a schematic diagram of the structure of the second conductive component in an embodiment of this application. Exemplarily, as shown in Figures 1 to 5, the computing device 1 may include two computing modules 20, and each computing module 20 may include two computing boards 200. Taking the process of installing the first conductive board 4111 onto the first electrical connector 421 as an example, the first folded edge 4211 of the first electrical connector 421 may be provided with a plurality of connecting holes arranged side-by-side along the second direction Y, including a first connecting hole 4211a and a second connecting hole 4211b. The first connecting hole 4211a can be used for a fastener 440 to pass through the first electrical connector 421, the first conductive component 411, and the third conductive component 430 installed on the first computing board 201, so that the first electrical connector 421, the first conductive component 411, and the third conductive component 430 form a tight electrical connection. The second connection hole 4211b can be used for the fastener 440 to pass through the first electrical connector 421 and the third conductive component 430 mounted on the second computing board 202, so that the first electrical connector 421 and the third conductive component 430 form a tight electrical connection. The number of the first connection hole 4211a and the second connection hole 4211b can be at least one, and the specific number of the first connection hole 4211a and the second connection hole 4211b is not specifically limited in this embodiment. This arrangement ensures that the power connection device 400 will not loosen or shift due to vibration or other external forces during the operation of the computing device 1, while also improving the conduction efficiency of the electrical connection.

[0244] In some examples, the inner peripheral walls of multiple connection holes can be threaded to accommodate fasteners 440, allowing the fasteners 440 to pass through and be tightened, ensuring the stability of the connection between conductive components.

[0245] In other examples, the connection between conductive components can be completed by using nuts and fasteners 440, which increases the tightness of the fit between conductive components and reduces the processing cost of conductive components.

[0246] It should be noted that the above are merely illustrative examples. The application examples provided in this application embodiment are for ease of understanding. This application embodiment does not limit the specific method by which the fastener 440 passes through the connection hole to fasten multiple conductive components.

[0247] In one embodiment, as shown in Figures 2 to 4, the computing module 20 may include two computing boards 200 spaced apart; the first folded edge 4211 of the first electrical connector 421 may include two first electrical connection plates 42111 spaced apart along the second direction Y, and the two first electrical connection plates 42111 may be electrically connected to the first power terminals 231 of the two computing boards 200 respectively; the third folded edge 4221 of the second electrical connector 422 may include two second electrical connection plates 42211 spaced apart along the second direction Y, and the two second electrical connection plates 42211 may be electrically connected to the second power terminals 232 of the two computing boards 200 respectively.

[0248] For example, as shown in Figures 2 and 4, during the installation of the power connection device 400, the fastener 440 can pass through the connection holes of the first conductive component 410, the second conductive component 420, and the third conductive component 430 at the power connection terminal group 230 of the computing board 200 in sequence, so that the first conductive component 410, the second conductive component 420, and the third conductive component 430 fit tightly together, thereby achieving a stable electrical connection between the first conductive component 410, the second conductive component 420, and the computing board 200.

[0249] In one embodiment, the first folded edge 4211 and the third folded edge 4221 may be located between the two computing boards 200, respectively.

[0250] For example, as shown in FIG4, the power connection terminal group 230 of the first computing board 201 and the second computing board 202 can be arranged opposite each other along the third direction Z. The first folded edge 4211 and the third folded edge 4221 are installed between the two computing boards 200 along the third direction Z, making the power connection path more direct and simple, and optimizing the wiring of the power connection structure.

[0251] In one embodiment, the third folded edge 4221 may have a second clearance area, and two second electrical connection plates 42211 may be located on opposite sides of the second clearance area in the second direction Y, while two first electrical connection plates 42111 are located in the second clearance area.

[0252] For example, as shown in FIG4, the first folded edge 4211 and the third folded edge 4221 can extend in the same direction along the third direction Z, and the fourth folded edge 4222 can be connected between the two second electrical connection plates 42211 of the third folded edge 4221 and extend along the second direction Y. A second clearance area can be defined between the two second electrical connection plates 42211 of the third folded edge 4221, providing space for the installation and arrangement of the first electrical connector 421. This arrangement can ensure electrical isolation between the conductive components, help optimize space utilization, and meet the requirements of the compact computing device 1.

[0253] In one embodiment, the material of the second conductive component 420 may include at least one of copper, aluminum, and silver.

[0254] In some examples, the material of the second conductive component 420 may be a copper integral component, a silver integral component, or an aluminum integral component, to ensure that the second conductive component 420 has good conductivity and corrosion resistance.

[0255] In other examples, the second conductive component 420 may be modularly formed, assembled from dissimilar components such as copper and aluminum parts, to fully utilize the advantages of multiple materials and optimize conductivity and mechanical properties.

[0256] It should be noted that the above are merely illustrative examples. The application examples provided in this application embodiment are for ease of understanding. This application embodiment does not specifically limit the material of the second conductive component 420.

[0257] In one embodiment, the length of the first electrical connector is 14 to 16 mm, the width of the first electrical connector is 2 to 3 mm, and the thickness of the first electrical connector is 0.2 to 0.4 mm; the length of the second electrical connector is 17 to 21 mm, the width of the second electrical connector is 2 to 3 mm, and the thickness of the second electrical connector is 0.2 to 0.4 mm.

[0258] For example, the length of the first electrical connector 421 refers to its dimension in the second direction Y, the width of the first electrical connector 421 refers to its dimension in the third direction Z, and the thickness of the first electrical connector 421 refers to its dimension in the first direction X. Similarly, the length of the second electrical connector 422 refers to its dimension in the second direction Y, the width of the second electrical connector 422 refers to its dimension in the third direction Z, and the thickness of the second electrical connector 422 refers to its dimension in the first direction X.

[0259] In a specific example, the first electrical connector 421 has a length of 15 mm, a width of 2.5 mm, and a thickness of 0.3 mm. The second electrical connector 422 has a length of 19 mm, a width of 2.5 mm, and a thickness of 0.3 mm.

[0260] It should be noted that the product of the width and thickness of the first electrical connector 421 and the second electrical connector 422 is the cross-sectional area. The size of the cross-sectional area is negatively correlated with the resistance of the first electrical connector 421 and the second electrical connector 422. In other words, the larger the cross-sectional area of ​​the conductive component, the lower its resistance; conversely, the smaller the cross-sectional area of ​​the conductive component, the higher its resistance. By setting the width and thickness of the first electrical connector 421 and the second electrical connector 422 to 2 to 3 mm and 0.2 to 0.4 mm, respectively, the first electrical connector 421 and the second electrical connector 422 can have a larger cross-sectional area. This reduces the resistance of the first electrical connector 421 and the second electrical connector 422, thereby reducing the loss of the second conductive component 420 during power transmission and also reducing the heat generated by the second conductive component 420 during power transmission.

[0261] It is understood that the above is only an exemplary description. The specific dimensions of the first electrical connector 421 and the second electrical connector 422 can be flexibly set according to the distance between the power supply terminal group and the power receiving terminal group, the size of the second conductive component 420, the internal space size of the housing 11, and the impedance of the electrical connector itself. This application embodiment does not make specific limitations in this regard.

[0262] In one embodiment, the power connection device 400 for the computing device 1 may further include at least one third conductive component 430. The at least one third conductive component 430 is correspondingly disposed with at least one computing board 200 of the computing module 20, and a second conductive component 420 is electrically connected to the corresponding computing board 200 of the computing module 20 via the at least one third conductive component 430. At least a portion of the third conductive component 430 is parallel to the plane containing at least a portion of the computing board 200.

[0263] For example, the portion of the third conductive component 430 that is electrically connected to the terminal on the computing board 200 is arranged parallel to the plane on which the computing board 200 is located. The third conductive component 430 and the computing board 200 can be fixedly connected by means of snap-fit ​​connection, fastener connection, welding connection, etc.

[0264] By arranging a portion of the third conductive component 430 parallel to the plane where the computing board 200 is located, the size of the third conductive component 430 in the third direction Z can be reduced, thereby saving space occupied by the computing device 1 in the third direction Z. On the other hand, it is also beneficial to improve the stability and reliability of the connection between the third conductive component 430 and the power connection terminal of the computing board 200.

[0265] In this embodiment, the computing device 1 may include at least one computing module 20, and the computing module 20 may include at least one computing board 200. The power connection device 400 may include at least one third conductive component 430 corresponding to the at least one computing board 200. For example, as shown in FIG3, the third conductive component 430 may be configured in a one-to-one correspondence with the computing board 200. The third conductive component 430 may be electrically connected to the power receiving terminal group 230 of the computing board 200, and may also be electrically connected to the second conductive component 420.

[0266] Understandably, in a scenario where computing device 1 includes multiple computing modules 20, and each computing module 20 includes multiple computing boards 200, the third conductive component 430 can work in conjunction with the first conductive component 410 and the second conductive component 420 to power the computing boards 200. During power supply, the current generated by the power module 500 can form a loop between the multiple computing boards 200 within the computing module 20 through the first conductive component 410, the second conductive component 420, and the third conductive component 430, thereby enabling simultaneous power supply to the multiple computing modules 20 and the multiple computing boards 200 and improving power supply efficiency.

[0267] In one embodiment, the third conductive component 430 may include a first conductive base 431 and a second conductive base 432. The first electrical connector 421 of the second conductive component 420 may be electrically connected to the first power terminal 231 of the computing board 200 through the first conductive base 431, and the second electrical connector 422 of the second conductive component 420 may be electrically connected to the second power terminal 232 of the computing board 200 through the second conductive base 432.

[0268] For example, the first power supply terminal 511 and the second power supply terminal 512 of the power module 500 can provide positive and negative power respectively. The first power connection terminal 231 of the computing board 200 can be the positive power connection terminal of the computing board 200, and the second power connection terminal 232 can be the negative power connection terminal of the computing board 200. The first conductive base 431 can be electrically connected to the positive power supply terminal of the computing board 200, and the second conductive base 432 can be correspondingly electrically connected to the negative power connection terminal of the computing board 200. In the power supply application scenario, the current can flow through the first conductive base 431 to the positive power connection terminal of at least one computing board 200 in at least one computing module 20. After passing through the computing board 200, the current flows back from the negative power connection terminal of the computing board 200 to the negative power supply terminal of the power module 500 through the second conductive base 432, completing the current loop and realizing the power supply of at least one computing module 20 in the computing device 1.

[0269] In other examples, the positive and negative terminals of the first power supply terminal 511 and the second power supply terminal 512, as well as the positive and negative terminals of the first power connection terminal 231 and the second power connection terminal 232, can be reversed compared to the examples described above. In this case, the first conductive base 431 can be electrically connected to the negative power connection terminal of the computing board 200, and the second conductive base 432 can be electrically connected to the positive power connection terminal of the computing board 200, so as to provide power to at least one computing module 20 in the computing device 1. The specific current flow direction will not be described in detail.

[0270] It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art can flexibly configure the power supply and connection terminals according to specific application scenarios. In one embodiment, the computing module 20 may include two computing boards 200 spaced apart. Each computing board 200 may be provided with a third conductive component 430. The first electrical connector 421 of the second conductive component 420 is electrically connected to two corresponding first conductive seats 431 of the two computing boards 200, and the second electrical connector 422 of the second conductive component 420 is electrically connected to two corresponding second conductive seats 432 of the two computing boards 200.

[0271] For example, as shown in Figures 4 and 5, each computing module 20 may include two computing boards 200 spaced apart. Taking the installation scenario of the power connection device 400 as an example, the first conductive base 431 may be first installed on the first power connection terminal 231 of the two computing boards 200 in the computing module 20, and the second conductive base 432 may be installed on the second power connection terminal 232 of the two computing boards 200 in the computing module 20. The first electrical connector 421 may simultaneously form an electrical connection with the first conductive base 431 installed on the two computing boards 200, and the second electrical connector 422 may simultaneously form an electrical connection with the second conductive base 432 installed on the two computing boards 200. During power supply, the current generated by the power module 500 can form a loop between the multiple computing boards 200 in the computing module 20 through the first conductive component 410, the second conductive component 420, and the third conductive component 430, thereby realizing simultaneous power supply to multiple computing modules 20 and multiple computing boards 200 and improving power supply efficiency.

[0272] In one embodiment, the first conductive base 431 may include a fifth folded edge 4311 and a sixth folded edge 4312 connected to each other. The planes on which the fifth folded edge 4311 and the sixth folded edge 4312 are located are perpendicular to each other. The fifth folded edge 4311 is used to make electrical contact with the first folded edge 4211 of the first electrical connector 421, and the sixth folded edge 4312 is used to make electrical contact with the first power terminal 231 of the computing board 200.

[0273] In one embodiment, the second conductive base 432 includes a seventh folded edge 4321 and an eighth folded edge 4322 connected to each other. The planes on which the seventh folded edge 4321 and the eighth folded edge 4322 are located are perpendicular to each other. The seventh folded edge 4321 is used to make electrical contact with the third folded edge 4221 of the second electrical connector 422, and the eighth folded edge 4322 is used to make electrical contact with the second power terminal 232 of the computing board 200.

[0274] In some examples, the third conductive component 430 can be a one-piece stepped three-dimensional structure. Specifically, the third conductive component 430 can be formed by bending a one-piece molded part, or it can be formed by casting. Taking the first conductive base 431 as an example, the fifth fold 4311 can be bent at the junction of the fifth fold 4311 and the sixth fold 4312, so that the plane where the fifth fold 4311 is located is perpendicular to the plane where the sixth fold 4312 is located, forming the first electrical connector 421. This setting can simplify the manufacturing process, reduce production costs, and provide stable mechanical support and high electrical connection efficiency for the third conductive component 430. In specific application scenarios, the bending position and bending direction of the fifth fold 4311 in the first conductive base 431 can be adjusted according to the actual installation space, and this application embodiment does not impose specific limitations.

[0275] In other examples, the third conductive component 430 can be a stepped three-dimensional structure formed by separate molding and assembly. Specifically, the third conductive component 430 can be formed by combining the fifth fold 4311 and the sixth fold 4312 through methods such as plugging and bolt fixing, increasing the flexibility and scalability of the third conductive component 430.

[0276] It should be noted that the above are merely illustrative examples. The application examples provided in this application embodiment are for ease of understanding. This application embodiment does not specifically limit the formation method of the third conductive component 430.

[0277] As shown in Figure 4, the sixth fold 4312 and the eighth fold 4322 can be fitted together with the computing board 200 to support the conductive base for power supply. Specifically, the sixth fold 4312 and the eighth fold 4322 can be mechanically fixed to the computing board 200 by means of screws, clips, etc., to form a firm electrical connection to ensure the stability and reliability of the third conductive component 430 during use.

[0278] This design, through the bending design of the third conductive component 430, allows for more efficient use of the internal space of the computing device 1 to install the conductive components, resulting in a compact and rational internal layout of the computing device 1 and enabling power supply to the computing module 20. The folded edge structure of the third conductive component 430 can be used to fix and support the conductive base, ensuring the stability of the electrical connection.

[0279] In one embodiment, the fifth folded edge 4311 and the first folded edge 4211 can be fixedly connected by fastener 440. The sixth folded edge 4312 and the computing board 200 can be fixedly connected by fastener 440. The seventh folded edge 4321 and the third folded edge 4221 can be fixedly connected by fastener 440. The eighth folded edge 4322 and the computing board 200 can be fixedly connected by fastener 440.

[0280] For example, as shown in Figures 1 to 4, taking the process of installing the first electrical connector 421 onto the first conductive base 431 as an example, the sixth folded edge 4312 of the first conductive base 431 and the eighth folded edge 4322 of the second conductive base 432 can be installed on the computing board 200, forming a stable electrical connection with the computing board 200 respectively. The fifth folded edge 4311 and the seventh folded edge 4321 of the third conductive component 430 can be provided with multiple third connecting holes 430a and fourth connecting holes 430b arranged side-by-side along the second direction Y. The first conductive component 410 and the second conductive component 420 can be provided with corresponding connecting through holes with reference to the third connecting holes 430a and fourth connecting holes 430b. In some examples, the third connecting hole 430a can be used for fasteners 440 to pass through the first conductive component 410, the second conductive component 420, and the third conductive component 430, so that the first conductive component 410, the second conductive component 420, and the third conductive component 430 form a tight electrical connection. The fourth connection hole 430b can be used for the fastener 440 to pass through the second conductive component 420 and the third conductive component 430, thereby forming a secure electrical connection between the second conductive component 420 and the third conductive component 430. In other examples, the third connection hole 430a can be used for the fastener 440 to pass through the second conductive component 420 and the third conductive component 430, thereby forming a secure electrical connection between the second conductive component 420 and the third conductive component 430. The fourth connection hole 430b can be used for the fastener 440 to pass through the first conductive component 410, the second conductive component 420, and the third conductive component 430, thereby forming a secure electrical connection between the first conductive component 410, the second conductive component 420, and the third conductive component 430. It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art can flexibly configure the power connection group 230 of the computing board 200 according to specific application scenarios.

[0281] For example, the number of the third connecting hole 430a and the fourth connecting hole 430b can be at least one. The specific number of the third connecting hole 430a and the fourth connecting hole 430b is not specifically limited in the embodiments of this application.

[0282] This configuration ensures that the power connection device 400 will not loosen or shift due to vibration or other external forces during the operation of the computing device 1, while also improving the conduction efficiency of the electrical connection.

[0283] In one embodiment, the two first conductive bases 431 and the two second conductive bases 432 corresponding to the computing module 20 may be located between the two computing boards 200.

[0284] For example, two first conductive bases 431 and two second conductive bases 432 can be arranged opposite each other in the third direction Z between the two computing boards 200 of the computing module 20, making the power connection path more direct and simple, and optimizing the wiring of the power connection structure.

[0285] In one embodiment, the two first conductive seats 431 and the two second conductive seats 432 corresponding to the calculation module 20 can be arranged at intervals along the second direction Y, with the two first conductive seats 431 located between the two second conductive seats 432 in the second direction Y.

[0286] For example, as shown in FIG2, the computing module 20 may include two computing boards 200 spaced apart. The two first conductive seats 431 and two second conductive seats 432 corresponding to the two computing boards 200 may be spaced apart along the second direction Y. The two first conductive seats 431 are located between the two second conductive seats 432 in the second direction Y. This arrangement can ensure electrical isolation between the conductive components, help optimize space utilization, and meet the requirements of the compact computing device 1.

[0287] In one embodiment, the material of the third conductive component 430 may include at least one of copper, aluminum, and silver.

[0288] In some examples, the third conductive component 430 may be made of a single piece of copper, silver, or aluminum to ensure that the second conductive component 420 has good conductivity and corrosion resistance.

[0289] In other examples, the third conductive component 430 can be modularly formed, assembled from dissimilar components such as copper and aluminum parts, to fully utilize the advantages of multiple materials and optimize conductivity and mechanical properties.

[0290] It should be noted that the above are merely illustrative examples. The application examples provided in this application embodiment are for ease of understanding. This application embodiment does not specifically limit the material of the third conductive component 430.

[0291] In one embodiment, multiple computing modules 20 may be spaced apart along a third direction Z; wherein, the second conductive plate 4112 of the first conductive member 411 may extend along a third direction Z, having multiple first conductive regions 4112a arranged along a third direction Z, and the multiple first conductive regions 4112a are electrically connected to the multiple computing modules 20 one by one; the fourth conductive plate 4122 of the second conductive member 412 extends along a third direction Z, having multiple second conductive regions 4122a arranged along a third direction Z, and the multiple second conductive regions 4122a are electrically connected to the multiple computing modules 20 one by one.

[0292] For example, as shown in Figures 1 to 4, the computing device 1 may include two computing modules 20, namely, a first computing module 21 and a second computing module 22 arranged at intervals along a third direction Z. A power module 500 can be electrically connected to the first computing module 21 and the second computing module 22 via a first conductive component 410 to simultaneously power both computing modules 20. The second conductive plate 4112 extends along a third direction Z and has two first conductive regions 4112a arranged along the third direction Z. The two first conductive regions 4112a can be electrically connected to the first terminals 231 of the first computing module 21 and the second computing module 22, respectively. Correspondingly, the fourth conductive plate 4122 of the second conductive component 412 extends along a third direction Z and has two second conductive regions 4122a arranged along the third direction Z. The two second conductive regions 4122a can be electrically connected to the second terminals 232 of the first computing module 21 and the second computing module 22, respectively. Specifically, the first conductive region 4112a and the second conductive region 4122a may each be provided with a plurality of connecting holes arranged side by side along the second direction Y. The first conductive region 4112a and the second conductive region 4122a may be electrically connected to the first calculation module 21 and the second calculation module 22 through which they pass by via fasteners 440.

[0293] It should be noted that the above are merely illustrative examples. The application examples provided in this application embodiment are for ease of understanding. This application embodiment does not specifically limit the electrical connection structure of the first conductive component 410.

[0294] In this embodiment, the number of computing modules 20 can be set to one or more, such as one, two, three, or four. The number of computing boards 200 integrated within the same computing module 20 can also be set to one or more, such as one, two, three, or four, to meet the corresponding computing power requirements. The direction and range of the first conductive region 4112a and the second conductive region 4122a, as well as the number and position of the connecting holes, can be set according to the number of computing modules 20 and computing boards 200, and the position of the power connection terminal group 230 of the computing boards 200. This embodiment does not impose specific limitations. With this setting, multiple computing modules 20 and multiple computing boards 200 can be powered simultaneously, improving power supply efficiency. It also allows for flexible addition or removal of computing modules 20 in the computing device 1, as well as flexible adjustment of computing boards 200 within the computing modules 20, increasing the scalability of the computing device 1.

[0295] As shown in Figures 1 and 2, as another aspect of the embodiments of this application, the embodiments of this application provide a power module 40 for a computing device 1, including: a power module 500; and a power connection device 400 for a computing device 1 according to any of the above embodiments.

[0296] In one embodiment, the power supply terminal group is disposed on one side of the power module 500 in the first direction X, and the power connection terminal group is disposed on one side of the computing board 200 in the first direction X. The power module 500 and the computing module 20 can be arranged side by side along the second direction Y, which is perpendicular to the first direction X.

[0297] As shown in Figures 1 and 2, the power supply module 500 and the computing module 20 can be housed within the chassis 11 of the computing device 1, with the chassis 11 providing the mounting base and external protection. The power supply module 500 and the computing module 20 can be located on the same side of the chassis 11 in the first direction X, and arranged at intervals along the second direction Y. The power supply terminal group 510 of the power supply module 500 and the power connection terminal group 230 of the computing module 20 can be integrated on the same side of the chassis 11 in the first direction X, and arranged at corresponding intervals along the second direction Y. This allows for a more concentrated layout of the power supply components of the computing device 1, contributing to the efficient power supply of the computing module 20.

[0298] In one embodiment, the power supply terminal group and the power connection terminal group are arranged flush in the first direction X.

[0299] For example, the power supply terminal group of the power module 500 and the power receiving terminal group of the computing board 200 can be arranged flush in the first direction X, that is, the power supply terminal group and the power receiving terminal group are arranged coplanarly in the second direction Y. The power connection device 400 can adopt a planar structure, that is, all parts of the first conductive component 410 included in the power connection device 400 can be located on the same plane to realize a simple point-to-point connection between the power supply terminal group and the power receiving terminal group 230.

[0300] In another embodiment, the power supply terminal group and the power connection terminal group are not flush in the first direction X.

[0301] For example, the power supply terminal group of the power module 500 and the power receiving terminal group of the computing board 200 can be non-aligned in the first direction X, that is, the power supply terminal group and the power receiving terminal group are not coplanar along the second direction Y. The first conductive member 411 can be partially bent into a stepped structure, and the bent part can be perpendicular to the other part to bypass the components that form obstacles, and cooperate with other structures of the computing device 1 to achieve its own installation, saving the compact space inside the computing device 1, while increasing the installation's robustness. In one embodiment, the power module 40 for the computing device 1 further includes: a housing 530, in which the power module 500 is disposed, and a cooling pipe is disposed within the housing 530. The cooling pipe is used to supply a cooling medium for cooling, and the cooling medium is used to cool the power module 500 during the flow.

[0302] Figure 7 shows a structural schematic diagram of the power module 500 from one side view in an embodiment of this application. Figure 8 shows a structural schematic diagram of the power module 500 from another side view in an embodiment of this application. Figure 10 shows a structural schematic diagram of the cooling device of the computing device in an embodiment of this application. Exemplarily, as shown in Figures 7 to 10, the power module 40 for the computing device 1 may further include a housing 530. The power module 500 may be disposed within the housing 530, which provides the mounting base and external protection. Specifically, the cooling medium can flow within the cooling pipes, continuously absorbing and carrying away the heat generated by the power module 500 during operation, thereby continuously providing cooling for the power module 500. This allows the power module 500 to maintain a low temperature during high-load operation, reducing the possibility of performance degradation or damage due to overheating.

[0303] In one embodiment, the power module 500 may have a power supply terminal group 510, which may include a first power supply terminal 511 and a second power supply terminal 512. The cooling pipe may have a medium inlet 100a and a medium outlet 100b. The power supply terminal group may be disposed on one side of the housing 530 in the first direction X, and the medium inlet 100a and the medium outlet 100b may be disposed on the other side of the housing 530 in the first direction X.

[0304] For example, as shown in Figures 7 and 8, the power supply terminal group 510 can be disposed on one side of the housing 530 in the first direction X, and the medium inlet 100a and the medium outlet 100b can be disposed on the other side of the housing 530 in the first direction X. Separating the power supply terminal group from the cooling medium can avoid the adverse effects of the inflow and outflow of the cooling medium on the electrical connection, ensure the stable operation of the computing device 1, and make the piping layout of the liquid cooling module 100 more centralized, which helps to simplify the installation and maintenance of the liquid cooling module 100.

[0305] Figure 9 shows an exploded view of the liquid cooling module in an embodiment of this application. As shown in Figure 9, the computing module 20 may include multiple computing boards 200, which can be integrated and installed in the liquid cooling module 100. The liquid cooling module 100 may include a liquid cooling plate 110 and two cover plates 120. The interior of the liquid cooling plate 110 may be provided with cooling channels for the flow of cooling medium. Two opposing surfaces of the liquid cooling plate 110 respectively form liquid cooling surfaces 112. The two cover plates 120 respectively attach and fix two computing boards 200 to the two liquid cooling surfaces 112. Multiple computing units 210 may be provided on the computing boards 200.

[0306] Figure 6A shows a structural schematic diagram of another power connection device in an embodiment of this application, and Figure 6B shows an exploded schematic diagram of another power connection device in an embodiment of this application.

[0307] In some examples, the side of the power module 500 corresponding to the power connection device 400 and the side of the computing board 200 corresponding to the power connection device 400 may not be flush, that is, the side of the power module 500 corresponding to the power connection device 400 and the side of the computing board 200 corresponding to the power connection device 400 may be located on different sides.

[0308] As shown in Figures 6A and 6B, in one embodiment, the first computing module may include two computing boards 200, and the second computing module may include one computing board 200. The power connection device may include a first conductive component, a second conductive component, and a third conductive component. The first conductive component includes a first conductive element 411 and a second conductive element 412; the second conductive component includes a first electrical connector 421 and a second electrical connector 422; and the third conductive component includes a first conductive base 431 and a second conductive base 432. The first conductive component is electrically connected to the power supply terminal group of the power module, the first conductive element 411 is electrically connected to the first power supply terminal, and the second conductive element is electrically connected to the second power supply terminal. The third conductive component is electrically connected to the corresponding power connection terminal groups of each computing board. The first power connection terminal 231 of each computing board is electrically connected to the first conductive base 431, and the second power connection terminal 232 of each computing board is electrically connected to the second conductive base 432. The first conductive component is electrically connected to the corresponding third conductive component of each computing board through the second conductive component.

[0309] Referring again to Figure 6B, the first conductive element 411 includes a first conductive plate 4111 and a second conductive plate 4112. The first conductive plate 4111 is electrically connected to the first power supply terminal 511. The first electrical connector 421 is electrically connected to the corresponding first conductive bases 431 on the three computing boards, and the second conductive plate 4112 is electrically connected to the first electrical connector 421. Thus, the first power supply terminal 511 is electrically connected to the first power terminals 231 of the three computing boards. The second conductive element 412 includes a third conductive plate 4121 and a fourth conductive plate 4122. The third conductive plate 4121 is electrically connected to the second power supply terminal 512. The second electrical connector 422 is electrically connected to the second conductive base 432 corresponding to the two computing boards of the first computing module. The fourth conductive plate 4122 includes two interconnected electrical contact areas. One electrical contact area is electrically connected to the second electrical connector 422, and the other electrical contact area is electrically connected to the second conductive base 432 corresponding to one computing board of the second computing module. Thus, the second power supply terminal 512 is electrically connected to the second electrical contact terminals 232 of the three computing boards respectively.

[0310] It is understandable that the first power supply terminal 511 and the second power supply terminal 512 can be the positive power supply terminal and the negative power supply terminal, respectively, and the first power connection terminal 231 and the second power connection terminal 232 can be the positive power connection terminal and the negative power connection terminal, respectively. Alternatively, the first power supply terminal 511 and the second power supply terminal 512 can be the negative power supply terminal and the positive power supply terminal, respectively, and the first power connection terminal 231 and the second power connection terminal 232 can be the negative power connection terminal and the positive power connection terminal, respectively.

[0311] For example, the first slide plate 63 is provided with a first clearance notch 632 for avoiding the first conductive member 411. The first conductive member 411 passes through the first clearance notch 632 and is electrically connected to the first power supply terminal 511 and the first power receiving terminal 231, respectively. The second conductive member 412 is provided with a bending structure 412a. The bending structure 412a bypasses the end of the first slide plate 63 and is electrically connected to the second power supply terminal 512 and the second power receiving terminal 232, respectively.

[0312] In one embodiment, the power module 500 may also have a power input terminal 520, which may be spaced apart from the power supply terminal group on the same side of the housing 530.

[0313] For example, as shown in Figures 7 and 8, the power input terminal 520 and the power supply terminal group are integrated on the same side of the housing 530 in the second direction Y. This configuration makes the wiring of the power module 500 simpler and more organized, reducing wiring complexity. All connection points of the power module 500 are concentrated on one side of the housing 530, facilitating wiring and maintenance.

[0314] In one embodiment, the power input terminal 520 may include a three-phase AC input terminal. Exemplarily, the power input terminal 520 may include a three-phase AC input terminal, such as an aviation terminal block, a power electrode connector, etc.

[0315] In one embodiment, the medium input port 100a may be provided with a liquid inlet connector 310, and the medium output port 100b may be provided with a liquid outlet connector 320; wherein, the liquid outlet connector 320 may be connected to the liquid inlet end of the cooling channel 111 of the cooling module of the computing device 1 via a connecting pipe.

[0316] For example, as shown in FIG10, the liquid outlet connector 320 can be connected to the liquid inlet end of the cooling channel 111 of the cooling module of the computing device 1 via a connecting pipe, which facilitates the installation and subsequent maintenance of the liquid cooling module 100.

[0317] As another aspect of the present application, as shown in FIG7, the present application also provides a computing device 1, including: a power supply module 40 for computing device 1 according to any of the above embodiments.

[0318] The power connection device 400, power module 40 and other components of the computing device 1 in the above embodiments can adopt various technical solutions that are now and will be known to those skilled in the art, and will not be described in detail here.

[0319] In the description of this specification, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0320] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0321] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0322] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0323] It should be noted that although the steps of the method in this application are described in a specific order in the accompanying drawings, this does not require or imply that these steps must be performed in that specific order, or that all the steps shown must be performed to achieve the desired result. Additional or alternative steps may be omitted, multiple steps may be combined into one step, and / or one step may be broken down into multiple steps. The above drawings are merely illustrative of the processes included in the method according to exemplary embodiments of this application and are not intended to be limiting. It is readily understood that the processes shown in the above drawings do not indicate or limit the temporal order of these processes. Furthermore, it is readily understood that these processes may be performed synchronously or asynchronously in multiple modules, for example.

[0324] The foregoing disclosure provides many different implementations or examples for carrying out different structures of this application. To simplify the disclosure, specific examples of components and arrangements are described above. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.

[0325] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this application, and these should all be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A computing device, characterized in that, include: Power module; At least one computing module, each computing module including a computing board; The chassis has a defined cavity in which the power module and the computing module are arranged side by side.

2. The computing device according to claim 1, characterized in that, Also includes: A power connection device is electrically connected between the power module and the computing module.

3. The computing device according to claim 2, characterized in that, The power connection device has a positive connection part and a negative connection part.

4. The computing device according to claim 2, characterized in that, The power connection device includes a first conductive component, which includes a first conductive element and a second conductive element.

5. The computing device according to claim 4, characterized in that, At least one of the first conductive element and the second conductive element is L-shaped.

6. The computing device according to claim 4, characterized in that, The length of the first conductive element is greater than that of the second conductive element.

7. The computing device according to claim 2, characterized in that, The power connection device includes a third conductive component, which is disposed on the computing board.

8. The computing device according to claim 7, characterized in that, The third conductive component includes a first conductive base and a second conductive base.

9. The computing device according to claim 2, characterized in that, The chassis is provided with a first slide plate, which divides the receiving cavity into two sub-cavities, and the power module and the computing module are respectively housed in the two sub-cavities.

10. The computing device according to claim 9, characterized in that, The first slide plate and / or the power connection device are provided with a clearance structure, which is configured to prevent interference between the first slide plate and the power connection device.

11. The computing device according to claim 10, characterized in that, The avoidance structure is arranged along the first direction.

12. The computing device according to claim 2, characterized in that, The power connection device includes a second conductive component, which includes a first electrical connector and a second electrical connector.

13. The computing device according to claim 12, characterized in that, The length of the first electrical connector is less than the length of the second electrical connector.

14. The computing device according to claim 2, characterized in that, The power connection device has a bending structure for fitting with the chassis.

15. The computing device according to claim 14, characterized in that, The bending structure is parallel to the bottom wall of the chassis.

16. The computing device according to claim 14, characterized in that, The power connection device also has a non-bending structure, and the width of the bending structure is the same as that of the non-bending structure.

17. The computing device according to claim 4, characterized in that, The power module has a power supply terminal group, the computing board has a power receiving terminal group, and the power connection device is connected between the power supply terminal group and the power receiving terminal group.

18. The computing device according to claim 17, characterized in that, The number of computing modules is multiple, and the first conductive component connects to at least two of the computing modules.

19. The computing device according to claim 17, characterized in that, The number of computing modules is two, and the first conductive component connects the two computing modules.

20. The computing device according to claim 19, characterized in that, The first conductive element and the second conductive element are respectively connected to the two computing modules.

21. The computing device according to claim 20, characterized in that, The power supply terminal group includes a first power supply terminal and a second power supply terminal, and the power receiving terminal group includes a first power receiving terminal and a second power receiving terminal; The first conductive element is electrically connected to the first power supply terminal and the first power terminal of the computing board of at least one of the computing modules, and the second conductive element is electrically connected to the second power supply terminal and the second power terminal of the computing board of at least one of the computing modules.

22. The computing device according to claim 21, characterized in that, The first conductive element includes a first conductive plate and a second conductive plate spaced apart in a second direction. The first conductive plate is electrically connected to the first power supply terminal, and the second conductive plate is electrically connected to the first power receiving terminal.

23. The computing device according to claim 22, characterized in that, A first clearance area is defined between the first conductive plate and the second conductive plate, and the second conductive element is located in the first clearance area.

24. The computing device according to claim 22, characterized in that, The first conductive element further includes a first connecting plate connected between the first conductive plate and the second conductive plate; wherein the planes on which the first conductive plate and the second conductive plate are located are arranged parallel to each other, and the plane on which the first connecting plate is located is arranged perpendicular to the plane on which the first conductive plate is located.

25. The computing device according to claim 21, characterized in that, The second conductive element includes a third conductive plate and a fourth conductive plate spaced apart along a second direction. The third conductive plate is electrically connected to the second power supply terminal, and the fourth conductive plate is electrically connected to the second power receiving terminal.

26. The computing device according to claim 25, characterized in that, The second conductive element further includes a second connecting plate connected between the third conductive plate and the fourth conductive plate; wherein the planes containing the second connecting plate, the third conductive plate, and the fourth conductive plate are arranged in parallel.

27. The computing device according to claim 4, characterized in that, The first conductive component is made of at least one of copper, aluminum, and silver.

28. The computing device according to claim 4, characterized in that, The first conductive element has a length of 15 to 19 mm, a width of 2 to 3 mm, and a thickness of 0.2 to 0.4 mm; the second conductive element has a length of 6 to 8 mm, a width of 2 to 3 mm, and a thickness of 0.2 to 0.4 mm.

29. The computing device according to any one of claims 4 to 6, 17 to 28, characterized in that, Also includes: At least one second conductive component is provided corresponding to the at least one computing module, and the first conductive component is electrically connected to the computing board of the at least one computing module through the at least one second conductive component.

30. The computing device according to claim 29, characterized in that, The number of the second conductive components is two, and each second conductive component corresponds to one computing module.

31. The computing device according to claim 29, characterized in that, Each computing module contains at least one computing board, and each of the second conductive components is connected to all the computing boards in a computing module.

32. The computing device according to claim 29, characterized in that, Each computing module contains two computing boards, and each of the second conductive components is connected to the two computing boards in one computing module.

33. The computing device according to claim 29, characterized in that, The second conductive component includes a first electrical connector and a second electrical connector, wherein the first electrical connector is connected to at least one of the computing boards, and the second electrical connector is connected to at least one of the computing boards.

34. The computing device according to claim 33, characterized in that, The first electrical connector connects to two computing boards, and the second electrical connector connects to two computing boards.

35. The computing device according to claim 33, characterized in that, The first conductive element is electrically connected to the first power terminal of the computing board through the first electrical connector, and the second conductive element is electrically connected to the second power terminal of the computing board through the second electrical connector.

36. The computing device according to claim 33, characterized in that, The first electrical connector includes a first electrical contact surface and a second electrical contact surface opposite to each other. The first electrical contact surface is used to make electrical contact with the first conductive element, and the second electrical contact surface is used to make electrical connection with the first power terminal of the computing board.

37. The computing device according to claim 36, characterized in that, The first electrical connector includes a first folded edge and a second folded edge connected to each other. The first folded edge and the plane containing the second folded edge are arranged perpendicularly. The two opposite side surfaces of the first folded edge form the first electrical contact surface and the second electrical contact surface, respectively. The second folded edge is attached to the computing board.

38. The computing device according to claim 37, characterized in that, The first folded edge is fixedly connected to the second conductive plate of the first conductive element by fasteners.

39. The computing device according to claim 33, characterized in that, The second electrical connector includes a third electrical contact surface and a fourth electrical contact surface disposed opposite to each other. The third electrical contact surface is used to make electrical contact with the second conductive component, and the fourth electrical contact surface is used to make electrical connection with the second power terminal of the computing board.

40. The computing device according to claim 39, characterized in that, The second electrical connector includes a third fold and a fourth fold connected to each other. The plane in which the third fold and the fourth fold are located is perpendicular to each other. The two opposite side surfaces of the third fold form the third electrical contact surface and the fourth electrical contact surface, respectively. The fourth fold is fitted to the computing board.

41. The computing device according to claim 40, characterized in that, The third folded edge is fixedly connected to the fourth conductive plate of the second conductive element by fasteners.

42. The computing device according to claim 33, characterized in that, The computing module includes two computing boards spaced apart; the first fold of the first electrical connector includes two first electrical connection plates spaced apart along a second direction, and the two first electrical connection plates are electrically connected to the first terminals of the two computing boards respectively; the third fold of the second electrical connector includes two second electrical connection plates spaced apart along the second direction, and the two second electrical connection plates are electrically connected to the second terminals of the two computing boards respectively.

43. The computing device according to claim 42, characterized in that, The first folded edge and the third folded edge are respectively located between the two computing boards.

44. The computing device according to claim 43, characterized in that, The third folded edge has a second clearance area, and the two second electrical connection plates are located on opposite sides of the second clearance area in the second direction, while the two first electrical connection plates are located in the second clearance area.

45. The computing device according to claim 29, characterized in that, The material of the second conductive component includes at least one of copper, aluminum and silver.

46. ​​The computing device according to claim 33, characterized in that, The length of the first electrical connector is 14 to 16 mm, the width of the first electrical connector is 2 to 3 mm, and the thickness of the first electrical connector is 0.2 to 0.4 mm; or, the length of the second electrical connector is 17 to 21 mm, the width of the second electrical connector is 2 to 3 mm, and the thickness of the second electrical connector is 0.2 to 0.4 mm.

47. The computing device according to claim 29, characterized in that, Also includes: At least one third conductive component is provided corresponding to at least one computing board of the computing module, and the second conductive component is electrically connected to at least one computing board of the corresponding computing module through at least one third conductive component.

48. The computing device according to claim 47, characterized in that, The third conductive component includes a first conductive base and a second conductive base. The first electrical connector of the second conductive component is electrically connected to the first power terminal of the computing board through the first conductive base, and the second electrical connector of the second conductive component is electrically connected to the second power terminal of the computing board through the second conductive base.

49. The computing device according to claim 48, characterized in that, The computing module includes two computing boards spaced apart, and the computing module is correspondingly provided with two third conductive components, with each of the two third conductive components corresponding to one of the two computing boards; the first electrical connector of the second conductive component is electrically connected to the two first conductive bases corresponding to the two computing boards, and the second electrical connector of the second conductive component is electrically connected to the two second conductive bases corresponding to the two computing boards.

50. The computing device according to claim 49, characterized in that, The first conductive base includes a fifth folded edge and a sixth folded edge connected to each other. The fifth folded edge is arranged perpendicularly to the plane where the sixth folded edge is located. The fifth folded edge is used to make electrical contact with the first folded edge of the first electrical connector, and the sixth folded edge makes electrical contact with the first electrical terminal of the computing board.

51. The computing device according to claim 50, characterized in that, The fifth folded edge is fixedly connected to the first folded edge by fasteners.

52. The computing device according to claim 50, characterized in that, The sixth fold is fixedly connected to the computing board by fasteners.

53. The computing device according to claim 49, characterized in that, The second conductive base includes a seventh fold and an eighth fold connected to each other. The plane in which the seventh fold and the eighth fold are located are arranged perpendicularly. The seventh fold is used to make electrical contact with the third fold of the second electrical connector, and the eighth fold is used to make electrical contact with the second electrical terminal of the computing board.

54. The computing device according to claim 53, characterized in that, The seventh fold is fixedly connected to the third fold by fasteners.

55. The computing device according to claim 53, characterized in that, The eighth fold is fixedly connected to the computing board by fasteners.

56. The computing device according to claim 49, characterized in that, The two first conductive bases and two second conductive bases corresponding to the computing module are located between the two computing boards.

57. The computing device according to claim 56, characterized in that, The two first conductive seats and two second conductive seats corresponding to the calculation module are arranged at intervals along the second direction, and the two first conductive seats are located between the two second conductive seats in the second direction.

58. The computing device according to claim 47, characterized in that, The material of the third conductive component includes at least one of copper, aluminum, and silver.

59. The computing device according to any one of claims 4 to 6, 17 to 28, characterized in that, The plurality of computing modules are spaced apart along a third direction; Wherein, the second conductive plate of the first conductive element extends along the third direction and has a plurality of first conductive regions arranged along the third direction, and the plurality of first conductive regions are electrically connected to the plurality of computing modules one by one; the fourth conductive plate of the second conductive element extends along the third direction and has a plurality of second conductive regions arranged along the third direction, and the plurality of second conductive regions are electrically connected to the plurality of computing modules one by one.

60. The computing device according to claim 17, characterized in that, The power supply terminal group is disposed on one side of the power module in the first direction, the power connection terminal group is disposed on one side of the computing board in the first direction, and the power module and the computing module are disposed side by side along the second direction, which is perpendicular to the first direction.

61. The computing device according to claim 60, characterized in that, The power supply terminal group and the power receiving terminal group are arranged flush in the first direction.

62. The computing device according to any one of claims 1 to 28, 60 and 61, characterized in that, Also includes: A power module, comprising a power module and a housing, wherein the power module is disposed within the housing and cooling pipes are disposed within the housing.

63. The computing device according to claim 62, characterized in that, The power module has a power supply terminal group, which includes a first power supply terminal and a second power supply terminal; the cooling pipeline has a medium inlet and a medium outlet; wherein, the power supply terminal group is disposed on one side of the housing in a first direction, and the medium inlet and the medium outlet are disposed on the other side of the housing in the first direction.

64. The computing device according to claim 63, characterized in that, The power module also has a power input terminal, which is arranged on the same side of the housing at intervals with the power supply terminal group.

65. The computing device according to claim 64, characterized in that, The power input terminal includes a three-phase AC input terminal.

66. The computing device according to claim 63, characterized in that, The medium input port is provided with a liquid inlet connector, and the medium output port is provided with a liquid outlet connector; wherein, the liquid outlet connector is connected to the liquid inlet end of the cooling channel of the cooling module of the computing device through a connecting pipe.

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