Three-dimensional surface processing method and apparatus, and device, system and storage medium

Abstract

Disclosed in the present application are a three-dimensional surface processing method and apparatus, and a device, a system and a storage medium. The three-dimensional surface processing method comprises the following steps: acquiring a three-dimensional model of an object to be processed and a first processing pattern, and rendering the first processing pattern onto the three-dimensional model to obtain a second processing pattern; layering the second processing pattern to obtain a plurality of processing layers arranged along a Z-axis direction and acquire processing sub-patterns distributed on each processing layer; and on the basis of the processing sub-patterns distributed on each processing layer, determining a processing path for each processing layer to obtain a processing path for the second processing pattern, in order to perform layered processing on said object on the basis of the processing path for the second processing pattern.

Description

Three-dimensional surface processing methods, apparatus, equipment, systems and storage media

[0001] Related applications

[0002] This application claims priority to Chinese patent application No. 202510070715.2, filed on January 16, 2025, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of CNC machining technology, and in particular to a method, apparatus, equipment, system and storage medium for machining three-dimensional surfaces. Background Technology

[0004] Currently, most existing laser processing technologies are based on planar processing and lack three-dimensional processing. Because it is impossible to design the processing path in combination with the processing graphic and the changes of the three-dimensional surface when processing three-dimensional surfaces, the three-dimensional surface can easily affect the graphic processing during processing. The processed graphic may be distorted and deformed due to the changes of the three-dimensional surface, which affects the processing effect.

[0005] In addition, because the Z-axis load of the processing head of the existing processing equipment is large, when the processing thickness is too large, the movement speed and acceleration of the processing head in the Z-axis direction are significantly different from those in the X-axis and Y-axis directions, which makes it impossible to achieve three-axis linkage well and affects processing efficiency.

[0006] Therefore, how to avoid the impact of three-dimensional changes on graphic processing while realizing three-dimensional surface processing, and how to optimize processing effect and improve processing efficiency, has become a technical problem that needs to be solved. Summary of the Invention

[0007] The main objective of this application is to provide a method, apparatus, equipment, system, and storage medium for processing three-dimensional surfaces, aiming to solve the technical problems of how to realize three-dimensional surface processing, and how to avoid graphic distortion and improve processing efficiency while realizing three-dimensional surface processing.

[0008] To achieve the above objectives, this application proposes a method for processing a three-dimensional surface, comprising the following steps:

[0009] Obtain a 3D model of the object to be processed and a first processing graphic; render the first processing graphic onto the 3D model to obtain a second processing graphic.

[0010] The second processing pattern is layered to obtain multiple processing layers arranged along the Z-axis and processing sub-patterns distributed on each processing layer;

[0011] Based on the processing sub-graphics on each processing layer, the processing path of each processing layer is determined, and the processing path of the second processing graphic is obtained, so as to perform layered processing on the object to be processed based on the processing path of the second processing graphic.

[0012] In one embodiment, the step of layering the second processed pattern to obtain multiple processed layers arranged along the Z-axis specifically includes:

[0013] Get floor height settings;

[0014] The second processing graphic is layered according to the layer height setting information to obtain a multi-layer processing layer arranged along the Z-axis.

[0015] In one embodiment, the step of layering the second processed graphic specifically includes:

[0016] The second processing graphic is pre-layered with a first preset number of layers to obtain multiple pre-layers; if the middle processing layer in the multiple pre-layers does not correspond to the midpoint position of the second processing graphic, the height of each pre-layer and / or the first preset number of layers is adjusted so that the middle processing layer corresponds to the midpoint position of the second processing graphic.

[0017] Alternatively, the intermediate reference layer of the second processed graphic can be determined based on the midpoint position of the second processed graphic, and the second processed graphic can be pre-layered based on the intermediate reference layer.

[0018] In one embodiment, along the Z-axis from top to bottom, the processing surface of the next processing layer is not smaller than the processing surface of the previous processing layer.

[0019] In one embodiment, after performing the steps of obtaining multiple processing layers arranged along the Z-axis and obtaining processing sub-patterns distributed on each of the processing layers, the three-dimensional surface processing method further includes the following steps:

[0020] The interactive interface of the terminal previews the effect of the processing sub-graphics on each processing layer on the 3D model.

[0021] In one embodiment, the step of determining the processing path of each processing layer based on the processing sub-graphics on each processing layer specifically includes:

[0022] Based on the processing sub-graphics on each processing layer, determine the layer processing start point and layer processing end point for each processing layer, and determine the processing path based on the layer processing start point and layer processing end point.

[0023] In one embodiment, the step of determining the start and end points of each processing layer based on the processing sub-graphics on each processing layer, and determining the processing path based on the start and end points of the processing layers, specifically includes:

[0024] If there is an inter-layer intersection point between adjacent processing layers, the processing end point of the upper processing layer and the processing start point of the lower processing layer are determined according to the inter-layer intersection point, so as to minimize the distance between the processing start point of the lower processing layer and the processing end point of the upper processing layer.

[0025] If there is no inter-layer intersection between adjacent processing layers, the processing endpoint of the upper processing layer and the processing start point of the lower processing layer are determined based on the two closest graphic points along the Z-axis in the adjacent processing layers, so as to minimize the distance between the processing start point of the lower processing layer and the processing endpoint of the upper processing layer.

[0026] In one embodiment, obtaining the processing sub-patterns distributed on each of the processing layers includes the following steps:

[0027] Obtain the intersection points of the second processing pattern and each of the processing layers;

[0028] Based on the intersection of the second processing graphic and each of the processing layers, the second processing graphic is segmented to obtain processing sub-graphics distributed on each of the processing layers.

[0029] In one embodiment, the method is used to control a processing device to process, the processing device including a processing head, and the step of performing layered processing on the object to be processed based on the processing path of the second processing pattern includes:

[0030] The processing head is controlled to process the processing sub-pattern of the current processing layer on the object to be processed;

[0031] If the processing sub-graphic of the current processing layer is completed, move the processing head along the Z-axis or adjust the focal length of the processing head so that the focal point of the processing head moves to the next processing layer;

[0032] The object to be processed is processed based on the processing sub-graphics on the next processing layer.

[0033] Furthermore, to achieve the above objectives, this application also proposes a three-dimensional surface processing apparatus, comprising:

[0034] The image acquisition module is used to acquire a 3D model of the object to be processed and a first processing image, and to render the first processing image onto the 3D model to obtain a second processing image.

[0035] The layering module is used to layer the second processing graphic to obtain multiple processing layers arranged along the Z-axis and to obtain processing sub-graphics distributed on each processing layer.

[0036] The path determination module is used to determine the processing path of each processing layer based on the processing sub-graphics on each processing layer, obtain the processing path of the second processing graphic, and perform layered processing on the object to be processed based on the processing path of the second processing graphic.

[0037] In addition, to achieve the above objectives, this application also proposes a processing apparatus, comprising:

[0038] Processing head;

[0039] A communication component, the communication component being used to receive processing instructions obtained according to the steps of the three-dimensional surface processing method described above;

[0040] A controller, based on processing instructions, controls the processing head to perform layered processing on the object to be processed.

[0041] In one embodiment, the controller is used to:

[0042] The processing head is controlled to process the processing sub-pattern of the current processing layer on the object to be processed;

[0043] If the processing sub-graphic of the current processing layer is completed, move the processing head along the Z-axis or adjust the focal length of the processing head so that the focal point of the processing head moves to the next processing layer;

[0044] The object to be processed is processed based on the processing sub-graphics on the next processing layer.

[0045] Furthermore, to achieve the above objectives, this application also proposes a processing system, comprising:

[0046] The processing equipment includes a base plate and a processing head. The base plate includes a processing area for placing an object to be processed, and the processing head is used to process the object located within the processing area.

[0047] A terminal device that communicates with the processing equipment, the terminal device being used to execute the processing instructions generated by the three-dimensional surface processing method described above, and to send the processing instructions to the processing equipment.

[0048] In addition, to achieve the above objectives, this application also proposes an electronic device, including a memory, a processor, and a three-dimensional surface processing program stored in the memory, wherein the processor executes the three-dimensional surface processing program to implement the steps of the three-dimensional surface processing method as described above.

[0049] In addition, to achieve the above objectives, this application also proposes a computer-readable storage medium storing a three-dimensional surface machining program thereon, which, when executed by a processor, implements the steps of the three-dimensional surface machining method as described above.

[0050] In addition, to achieve the above objectives, this application also proposes a computer program product, including a three-dimensional surface machining program, which, when executed by a processor, implements the steps of the three-dimensional surface machining method as described above.

[0051] One or more technical solutions proposed in this application have at least the following technical effects:

[0052] After obtaining multiple processing layers, the processing sub-graphics on each layer can be intuitively displayed, and the processing path of each layer can be determined. This enables the processing of the first processing graphic on the 3D model of the object to be processed, avoiding distortion and deformation of the processed graphic due to the influence of the 3D surface, thus effectively optimizing the processing effect. It also facilitates processing control, avoiding the need to adjust the processing head position multiple times due to unclear processing path planning, which affects the processing effect and progress. Layered processing can also reduce the processing layer thickness, increase the processing head speed, realize three-axis linkage, reduce processing time, and improve processing accuracy and efficiency. Attached Figure Description

[0053] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0054] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, those skilled in the art can obtain other drawings based on these drawings without creative effort.

[0055] Figure 1 is a schematic flowchart of an embodiment of the three-dimensional surface processing method of this application;

[0056] Figure 2a is a schematic diagram of an embodiment of the three-dimensional model of the three-dimensional surface processing method of this application;

[0057] Figure 2b is a schematic diagram of an embodiment of the first processed pattern of the three-dimensional surface processing method of this application;

[0058] Figure 2c is a schematic diagram of an embodiment of the second processed pattern of the three-dimensional surface processing method of this application;

[0059] Figure 3 is a schematic diagram of another embodiment of the second processed pattern of the three-dimensional surface processing method of this application;

[0060] Figure 4 is a schematic diagram showing the interlayer intersection points between adjacent processing layers in the three-dimensional surface processing method of this application;

[0061] Figure 5 is a detailed flowchart of step S200 of an embodiment of the three-dimensional surface processing method of this application;

[0062] Figure 6 is a schematic diagram of the specific process of step S200 of another embodiment of the three-dimensional surface processing method of this application;

[0063] Figure 7 is a schematic diagram showing an embodiment of the three-dimensional surface processing method of this application, displaying multiple processing layers;

[0064] Figure 8 is a detailed flowchart of step S200 of another embodiment of the three-dimensional surface processing method of this application;

[0065] Figure 9 is a schematic diagram of the specific process of step S100 of an embodiment of the three-dimensional surface processing method of this application;

[0066] Figure 10 is a schematic diagram of the calibration process of one embodiment of the three-dimensional surface processing method of this application;

[0067] Figure 11 is a second schematic diagram of the calibration process of an embodiment of the three-dimensional surface processing method of this application;

[0068] Figure 12 is a schematic diagram of the measurement process of one embodiment of the three-dimensional surface processing method of this application;

[0069] Figure 13 is a second schematic diagram of the measurement process of an embodiment of the three-dimensional surface processing method of this application;

[0070] Figure 14 is a schematic diagram of one embodiment of the three-dimensional surface processing method of this application, illustrating the construction of a three-dimensional surface;

[0071] Figure 15 is a second schematic diagram of an embodiment of the three-dimensional surface processing method of this application, illustrating the construction of a three-dimensional surface.

[0072] Figure 16 is a schematic diagram of the third embodiment of the three-dimensional surface processing method of this application, illustrating the construction of a three-dimensional surface;

[0073] Figure 17 is a schematic diagram of the fourth embodiment of the three-dimensional surface processing method of this application, illustrating the construction of a three-dimensional surface;

[0074] Figures 18(a) to 18(e) are the fifth of an embodiment of the three-dimensional surface processing method of this application, illustrating the generation of a three-dimensional model.

[0075] Figure 19 is a schematic diagram of an embodiment of the three-dimensional surface machining method of this application, showing an embodiment of the generation of machining instructions;

[0076] Figure 20 is a schematic diagram of the structure of an embodiment of the three-dimensional surface processing apparatus of this application;

[0077] Figure 21 is a schematic diagram of the structure of an embodiment of the processing equipment of this application;

[0078] Figure 22 is a schematic diagram of an embodiment of the processing system of this application.

[0079] The following are the definitions of the reference numerals: 10, Laser processing equipment; 110, Processing components; 120, Lifting structure; 130, Base plate; 20, Terminal equipment; 301, Graphic acquisition module; 302, Layering module; 303, Path determination module.

[0080] The purpose, features, and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0081] It should be understood that the specific embodiments described herein are merely illustrative of the technical solutions of this application and are not intended to limit this application.

[0082] To better understand the technical solution of this application, a detailed description will be provided below in conjunction with the accompanying drawings and specific implementation methods.

[0083] In related technologies, laser processing technology is mostly based on planar processing and lacks the ability to process three-dimensional surfaces. These three-dimensional surfaces include, but are not limited to, curved surfaces, inclined surfaces, and stepped surfaces, which will not be listed here. Because it is impossible to design the processing path in conjunction with the processing graphic and the changes in the three-dimensional surface when processing three-dimensional surfaces, the processing graphic is easily affected by the three-dimensional surface. The processed graphic may be distorted and deformed due to the changes in the three-dimensional surface, which affects the processing effect.

[0084] In addition, the machining head of the processing equipment in the related technology has a large load in the Z-axis direction. When the machining thickness is too large, the movement speed and acceleration of the machining head in the Z-axis direction are significantly different from those in the X-axis and Y-axis directions, making it impossible to achieve good three-axis linkage and seriously affecting the processing efficiency.

[0085] The main solution of this application is to optimize the processing effect while realizing the processing of three-dimensional surfaces, and to avoid the technical problem of graphic distortion and deformation caused by changes in the three-dimensional surfaces. This application provides users with a method, device, equipment, system and storage medium for processing three-dimensional surfaces. Referring to Figures 1 to 22, the graphic to be processed is first deformed according to the outline of the object to be processed, and then the deformed graphic is layered according to the height, and then processed layer by layer; after the layers are separated, the hardware such as the processing head is controlled to realize the layered processing of the three-dimensional surface by controlling the lifting of the processing head and controlling the operation of the galvanometer or XY drive mechanism, so as to optimize the processing effect and processing efficiency while realizing the processing of three-dimensional surfaces.

[0086] The three-dimensional surface processing method provided in this application can be applied to processing equipment (such as laser processing equipment) or implemented through control devices such as electronic devices storing three-dimensional surface processing programs. The laser processing equipment can be, but is not limited to, laser cutting equipment. The laser processing equipment includes a processing head, a communication component, and a controller. The processing head can be, but is not limited to, a laser head, a cutting head, a pen tip, or a drill bit. The laser processing equipment also includes a Z-axis lifting structure. Taking a laser head as an example, the laser head can scan and process the object to be processed along the X and Y axes. The Z-axis lifting structure drives the laser head to move up and down to adjust the distance between the laser head and the object to be processed; or the laser head can be zoomable, changing the focal position of the laser head in the Z-axis direction by adjusting the focal length. The communication component can be used to receive processing instructions obtained according to the steps of the three-dimensional surface processing method according to the following embodiments. Based on the processing instructions, the controller controls the processing head to perform layered processing on the object to be processed.

[0087] The processing equipment may include a control module (such as a central processing unit, graphics processing unit, etc.), which can perform various appropriate actions and processes based on programs stored in read-only memory (ROM) or programs loaded from storage devices into random access memory (RAM). RAM also stores various programs and data required for the operation of the processing equipment. The control module and storage modules such as ROM and RAM are interconnected via a bus; storage modules may also include storage devices such as magnetic tape and hard disks. Input / output (I / O) interfaces are also connected to the bus. Typically, the following systems can be connected to the I / O interface: input devices such as touchscreens, touchpads, keyboards, mice, image sensors, microphones, accelerometers, gyroscopes, etc., as input modules; output devices such as liquid crystal displays (LCDs), speakers, vibrators, etc., as output modules; and communication devices. Communication devices allow the processing equipment to communicate wirelessly or wiredly with other devices to exchange data.

[0088] Referring to Figures 1, 2(a) to 2(c), and 3, this application provides a method for processing a three-dimensional surface, comprising the following steps:

[0089] Step S100: Obtain the 3D model of the object to be processed and the first processing graphic, and render the first processing graphic onto the 3D model to obtain the second processing graphic. The obtained 3D model of the object to be processed mainly refers to the 3D model of the processing surface of the object.

[0090] Specifically, after importing the 3D model of the object to be processed (as shown in Figure 2(a)), the 3D model can be preprocessed. Preprocessing includes denoising to eliminate redundant data on the surface of the 3D model, and smoothing to make the surface of the 3D model more continuous and smooth. The first processing graphic (as shown in Figure 2(b)) is analyzed to determine if its clarity and accuracy meet the requirements. The first processing graphic can be adjusted by scaling, rotating, or even moderate deformation to match the shape and size of the 3D model. The precise position and orientation of the first processing graphic in 3D space are calculated to ensure that the first processing graphic can accurately fit the surface of the 3D model. Finally, after this series of steps, the rendered 3D model and the second processing graphic (i.e., the second processing graphic as shown in Figure 2(c) and Figure 3) are obtained. The processing effect is reflected through the obtained second processing graphic, thus visually showing the distribution and graphic information of the first processing graphic on the object to be processed. In some embodiments, the first processing graphic can also be processed based on the depth information of the 3D model in the Z-axis direction to obtain the second processing graphic, which is adapted to the surface contour of the 3D model.

[0091] Step S200: Layer the second processing graphic to obtain multiple processing layers arranged along the Z-axis and processing sub-graphics distributed on each processing layer. Specifically, the second processing graphic obtained after rendering is layered along the Z-axis to obtain multiple processing layers arranged along the Z-axis and processing sub-graphics located on each processing layer.

[0092] Step S300: Determine the processing path of each processing layer based on the processing sub-graphics on each processing layer, obtain the processing path of the second processing graphic, and perform layered processing on the object to be processed based on the processing path of the second processing graphic.

[0093] In this way, the first processing graphic can be processed on the three-dimensional model of the object to be processed, avoiding the situation where the processed graphic is distorted or deformed due to changes in the three-dimensional surface, and does not meet the actual requirements, thus effectively optimizing the processing effect.

[0094] In this application, the machining path of each machining layer is determined based on the machining sub-graphics located on each machining layer. Machining the object to be processed based on the machining path of multiple machining layers facilitates machining control and avoids the need for multiple adjustments to the machining head position due to unclear machining path planning, which affects the machining effect and progress. Layered machining also reduces the machining layer thickness, increases the Z-axis machining speed of machining components such as the machining head, and achieves three-axis linkage. This reduces machining time and improves machining accuracy and efficiency.

[0095] It should be noted that when determining the processing path of each processing layer shown in this application, the processing sub-graphics to be processed in each processing layer, the layer processing start point of the processing sub-graphics to be processed, and the layer processing end point are determined. In this application, adjacent processing layers can be processing layers processed sequentially along the Z-axis direction and spatially adjacent, or processing layers processed sequentially along the Z-axis direction in a specified order.

[0096] Taking layer-by-layer machining along the Z-axis as an example, the movement path of the machining head between adjacent machining layers is determined by the end point of the machining of the previous machining layer and the start point of the machining of the next machining layer. Determining the machining path of each machining layer also determines the movement path of the machining head between adjacent machining layers (as shown by line S in Figure 4). Taking layer-by-layer machining in a specified order as an example, the movement path of the machining head between adjacent machining layers is determined by the end point of the machining of the previous machining layer and the start point of the machining of the next machining layer. Determining the machining path of each machining layer in the specified order also determines the movement path of the machining head between adjacent machining layers.

[0097] Understandably, in this application, when performing step S200 to layer the second processing graphic to obtain multiple processing layers arranged along the Z-axis and to obtain the processing sub-graphics distributed on each processing layer, the layering direction can be determined according to the Z-axis direction, and the layering can be performed according to the set layering rules, layering setting information (such as layer height setting information, etc.) by specifying the layer height of each processing layer, the number of layers, the processing surfaces of the upper and lower processing layers, the layer processing path, etc., or by any other method or multiple other methods according to the actual processing needs, such as custom layering method or processing sub-graphics assigned to each processing layer of the first processing graphic; the specific settings can be determined according to the actual situation, and are not limited here.

[0098] In this application, the processing direction is determined by the Z-axis, and the height direction of the second processed graphic is set parallel to the processing direction. The three-dimensional surface processing method shown in this application allows for layering of the second processed graphic according to the selected or adjusted viewpoint, provided that the viewpoint of the custom model or the viewpoint of the second processed graphic is adjustable. Since the second processed graphic shown in this application is a processing model obtained by rendering the first processed graphic onto the three-dimensional model of the object to be processed, in order to optimize the processing effect while achieving three-dimensional surface processing, and to avoid affecting the processing due to the inability to adjust the viewpoint when processing features such as hollowing, suspension, mesh, and arcs appear, the three-dimensional surface processing method shown in this application is mainly illustrated by the example of layering the three-dimensional surface towards the Z-axis direction.

[0099] Referring to Figure 5, in one embodiment, the step S200 of layering the second processing pattern to obtain multiple processing layers arranged along the Z-axis specifically includes:

[0100] Step S211: Obtain floor height setting information;

[0101] Step S212: Divide the second processing graphic into layers according to the layer height setting information to obtain a multi-layer processing layer arranged along the Z-axis.

[0102] Specifically, the layer height setting information can be determined based on the received layer height setting instruction. The layer height setting information can be, but is not limited to, specifying the layer height of all processing layers (divided into multiple layers), specifying the number of layers (with the layer height evenly distributed according to the specified number of layers), specifying the layer height of multiple layers (the layer height of different processing layers can be different), specifying the position of the processing layer (such as specifying the coordinate position of any one or more processing layers in the Z-axis direction), specifying the processing sub-graphics on each processing layer, specifying the surface undulation of the 3D model in the processing layer, or other three-dimensional surface changes; it is used to perform layering based on any one of the processing parameters such as the specified layer height, the number of layers, the distribution of the first processing graphic, the degree of undulation of the 3D model, and the Z-axis processing speed of the processing head and other processing components, or other methods.

[0103] Specifically, the correspondence between the second processing graphic and the object to be processed can be determined by the ratio of the actual data of the object to be processed (such as the actual height) to the modeling data of the 3D model (such as the model height). The second processing graphic is layered according to the layer height setting information, the height of the object to be processed, and the correspondence between the second processing graphic and the object to be processed. This is used to automatically obtain the actual layering situation on the object to be processed by means of proportional conversion, etc., while layering the second processing graphic obtained after rendering.

[0104] In this way, different requirements in the processing can be combined. After the second processing graphic is layered by setting the layer height information, the processing head of the processing equipment is controlled to process each processing layer according to the layering result (the processing sub-graphics on each processing layer) in order to further optimize the processing effect.

[0105] As an embodiment of this application, at least one layering scheme can be preset, each layering scheme including at least one or more of the aforementioned layer height setting information, to select a desired layering scheme from the preset at least one layering scheme, and automatically generate layer height setting information after selecting the layering scheme. Specifically, the user can select the desired layering scheme through multiple scheme options, and the processing equipment can automatically generate multiple corresponding processing layers after obtaining the layering scheme selected by the user; or the processing equipment (control device such as an electronic device storing a three-dimensional surface processing program) can determine the layering setting information after receiving the layering instruction input by the user, automatically select the layering scheme according to the model information of the second processing graphic, and automatically generate multiple processing layers; the specific settings can be adjusted according to actual conditions, and are not limited here.

[0106] To achieve three-axis linkage and avoid significant differences in the movement speed and acceleration of the machining head in the Z-axis direction compared to the X and Y-axis directions due to a large load in the Z-axis direction, which would affect the actual machining speed, this application reduces layer thickness through layered processing, thereby increasing the machining speed of the machining head and other machining components. Furthermore, processing efficiency is further optimized by limiting the layer height. In performing steps S211 and S212 above, specifying the layer height or a range of layer heights is used as a further embodiment.

[0107] As an example, specifically, the layer height setting information is obtained, and the layer height of each processing layer is determined based on the layer height setting information; the second processing graphic is then divided into layers based on the layer height of each processing layer. The determined layer height of each processing layer is specifically the layer thickness of each processing layer, or it can be the determined coordinate position of each processing layer along the Z-axis.

[0108] As another example, specifically, the layer height setting information is obtained, and the layer height range of each processing layer is determined based on the layer height setting information; the second processing graphic is then divided into layers according to the layer height range of each processing layer, so that the layer height of each processing layer is within the set layer height range. Specifically, the determined layer height range of each processing layer is either the layer thickness range of each processing layer or the determined coordinate position range of each processing layer along the Z-axis.

[0109] As another example, specifically, the layer height setting information is obtained, and the number of layers (or the range of the number of layers) and the layer height range of each processing layer are determined based on the layer height setting information; the second processing graphic is layered according to the number of layers (or the range of the number of layers) and the layer height range of each processing layer, so that the number of layers and the layer height of each processing layer are within the set number of layers (or the range of the number of layers) and layer height range. Specifically, the determined layer height range of each processing layer is the layer thickness range of each processing layer, or it can be the determined coordinate position range of each processing layer along the Z-axis direction.

[0110] By specifying the layer height or layer height range, the Z-axis machining speed of machining components such as machining heads can be increased, saving machining time and energy consumption, and improving machining efficiency.

[0111] In a further embodiment of this application, the layer height and layer height range can be determined using any data from 0.1mm to 10.0mm (such as any value of 0.1mm, 0.5mm, 0.8mm, 1.0mm, 3.0mm, 5.0mm, 8.0mm, or 10.0mm), or using a range of 0.1mm to 10.0mm and other arbitrary values ​​(such as any value range of 0.3mm to 3.0mm, 3.0mm to 5.0mm, or 5.0mm to 11.5mm). This is to avoid excessively small layer heights or too many layers, which would result in more breakpoints between layers and affect the processing effect. It can also avoid excessively large layer heights causing defocusing, resulting in thicker lines or discontinuous breakpoints.

[0112] Because the determined layer height setting information is a specific value (such as layer height or number of layers), when performing step S200 to layer the second processing graphic to obtain multiple processing layers arranged along the Z-axis, uneven layering may result in multiple processing layers failing to achieve the expected results. To solve this problem, this application proposes the following example:

[0113] Referring to Figure 6, in one example, step S200, the step of layering the second processing graphic, specifically includes:

[0114] Step S221: Pre-layer the second processing graphic with a first preset number of layers to obtain multi-layer pre-layers;

[0115] Step S222: If the intermediate processing layer in the multi-layer pre-layer does not correspond to the midpoint of the second processing graphic, adjust the height of each pre-layer and / or the first preset number of layers to make the intermediate processing layer correspond to the midpoint of the second processing graphic.

[0116] Understandably, the layer height setting information includes a first preset number of layers. After pre-layering based on the first preset number of layers, the middle processing layer in the multi-layer pre-layering is adjusted to the midpoint of the second processing graphic. This ensures that the graphic of the first processing graphic is distributed as evenly as possible across multiple processing layers or as close to the middle processing layer as possible. Pre-layering can reduce potential processing errors during processing and can also proactively avoid problems such as graphic distortion after processing, ensuring a more aesthetically pleasing overall processing effect, thus further optimizing the processing results.

[0117] The intermediate processing layer refers to a processing layer with a layer number equal to (the first preset layer number divided by 2) (for example, using 10 as the first preset layer number, the second processing graphic is pre-layered with 10 layers to obtain 10 pre-layers, and the intermediate processing layers in the 10 pre-layers are layers 5 and 6; using 9 as the first preset layer number, the second processing graphic is pre-layered with 9 layers to obtain 9 pre-layers, and the intermediate processing layer in the 9 pre-layers is layer 5). The midpoint position of the second processing graphic refers to half the height of the second processing graphic in the Z-axis direction. For example, if the height of the second processing graphic in the Z-axis direction is 300mm, the midpoint position of the second processing graphic is 150mm.

[0118] If the middle processing layer in the multi-layer pre-layer obtained after pre-splitting the second processing graphic with the first preset layer number corresponds exactly to the midpoint of the second processing graphic, then the multi-layer pre-layer obtained through pre-splitting is used as a processing layer (taking 9 as the first preset layer number as an example, if the height of the 5th layer in the Z-axis direction corresponds to the midpoint of the second processing graphic, or if the midpoint of the second processing graphic is located exactly in the 5th layer, then the multi-layer pre-layer obtained through pre-splitting is used as a processing layer). If the middle processing layer in the multi-layer pre-layer obtained after pre-splitting the second processing graphic with the first preset layer number does not correspond to the midpoint of the second processing graphic, then the height of each pre-layer is further adjusted based on the divided multi-layer pre-layer, that is, the layer height of each pre-layer is specified and / or the first preset layer number is re-specified and updated, and the specified layer height of each pre-layer and / or the re-specified and updated first preset layer number is used as the new layer height setting information to re-implement the pre-splitting of the second processing graphic, until the middle processing layer in the multi-layer pre-layer corresponds to the midpoint of the second processing graphic.

[0119] It should be noted that the second processing graphic is pre-layered again based on the specified layer height of each pre-layer. Specifically, this can be, but is not limited to, specifying the layer height of all pre-layers, specifying the layer height of the intermediate processing layer among all pre-layers, or specifying the layer height of at least the multiple pre-layers close to the intermediate processing layer. The second processing graphic is pre-layered again based on the updated first preset layer number. Specifically, this can be, but is not limited to, pre-layering the second processing graphic according to the reset first preset layer number. The second processing graphic is pre-layered again based on the specified layer height of each pre-layer and the updated first preset layer number. Specifically, this can be, but is not limited to, specifying the layer height of the intermediate processing layer among all pre-layers, or specifying the layer height of at least the multiple pre-layers close to the intermediate processing layer, and then pre-layering the second processing graphic according to the reset first preset layer number.

[0120] In addition, taking a specified processing layer height as an example, the layer height can also be specified according to the first preset layer height, that is, the first preset number of layers in the previous example is replaced with the first preset layer height, so as to realize the pre-layering of the second processing graphic. Specifically:

[0121] The second processing graphic is pre-layered using a first preset layer height to obtain multiple pre-layered layers;

[0122] When the midpoint of the intermediate processing layer in the multi-layer pre-layer does not correspond to the midpoint of the second processing graphic, adjust the height of each pre-layer and / or the first preset layer height until the midpoint of the intermediate processing layer corresponds to the midpoint of the second processing graphic.

[0123] As another example, step S200, the step of layering the second processed graphic, specifically includes:

[0124] The intermediate reference layer of the second processing graphic is determined based on the midpoint position of the second processing graphic, and the second processing graphic is pre-layered based on the intermediate reference layer.

[0125] Understandably, in this example, the position of the processing layer as a reference is first determined based on the midpoint position of the second processing graphic, and this processing layer as a reference is determined as the intermediate reference layer. Specifically, the Z-axis coordinate position of the intermediate reference layer can be specified based on the midpoint position of the second processing graphic, and the second processing graphic can be pre-layered from both sides of the intermediate reference layer according to the set layer height, number of layers and other layer height settings.

[0126] In this application, the three-dimensional surface processing method is not limited to determining the processing layer position by the midpoint of the second processing graphic. Step S200, which involves layering the second processing graphic to obtain multiple processing layers arranged along the Z-axis, may specifically include:

[0127] The position of the specified processing layer of the second processing graphic is determined according to the specified position of the second processing graphic, and the second processing graphic is pre-layered according to the specified layer height, specified number of layers, etc., based on the specified processing layer.

[0128] In one embodiment, along the Z-axis from top to bottom, the processing surface of the next processing layer is not smaller than the processing surface of the previous processing layer.

[0129] In layered machining, if the surface area of ​​the next machining layer is smaller than that of the previous machining layer, the surface of the previous machining layer may cover the next machining layer, leading to errors such as machining overlap. Therefore, when layering, it is necessary to proceed layer by layer from top to bottom along the Z-axis. Before machining each machining layer, it is necessary to calculate and compare the projected surface of each machining layer to ensure that the projected surface of the previous machining layer is not larger than that of the next machining layer, in order to avoid overlap and errors. When the surface area of ​​the next machining layer is smaller than that of the previous machining layer, the user can be prompted by, but is not limited to, displaying machining sub-graphics distributed on each machining layer; directly displaying prompts; prompting the user to modify according to preset layer height modification information including recommended layer height; or automatically adjusting the layer height or number of layers. In this way, when problems such as overlapping machining sub-graphics occur on different machining layers, timely adjustments can be made by re-acquiring layer height setting information. To intuitively demonstrate and verify the layering effect, the machining relationships between each machining layer are simulated using drawing tools, layering design software, or machining simulation programs. These tools, when used for simulation, clearly display the multiple processing layers arranged along the Z-axis, as well as the processing sub-graphics on each layer, thus helping to verify the accuracy and rationality of the layering. In this way, it is also possible to implement the aforementioned scheme of processing layer by layer along the Z-axis, or processing layer by layer in a specified order, thereby expanding the applicability of processing equipment and meeting different processing needs.

[0130] In one embodiment, step S300, determining the processing path of each processing layer based on the processing sub-graphics on each processing layer, specifically includes:

[0131] Based on the processing sub-graphics on each processing layer, determine the start and end points of each processing layer, and then determine the processing path based on the start and end points of the processing layer.

[0132] Understandably, the content to be processed in each layer can be determined based on the processing sub-graphics on each processing layer. Determining the start and end points of each processing layer can not only be used to determine the processing path of each processing layer, but also to determine the movement path of the processing head between adjacent processing layers.

[0133] Referring to Figure 7, in some embodiments, after performing step S200 of obtaining multiple processing layers arranged along the Z-axis and obtaining processing sub-patterns distributed on each processing layer, the three-dimensional surface processing method further includes the following steps:

[0134] The interactive interface of the terminal displays the effect of the processing sub-graphics on each processing layer on the 3D model.

[0135] This tool is used to visually display the sub-graphics of each processing layer through a preview on the display interface and other display devices. This helps users to see the processing path of multiple processing layers intuitively and facilitates timely adjustments when problems such as overlapping sub-graphics on different processing layers occur. This is achieved by re-acquiring layer height settings, making the entire processing control process more intuitive, thereby increasing user participation and improving processing yield.

[0136] In this application, step S212 of the aforementioned embodiment involves layering the second processing graphic according to the layer height setting information to obtain multiple processing layers arranged along the Z-axis direction. Specifically, the layer height setting information can be, but is not limited to, specifying the layer height of all processing layers (dividing them into multiple layers), specifying the number of layers (dividing the layer heights according to the specified number of layers), specifying the layer heights of multiple layers (the layer heights of different processing layers can be different), specifying the position of the processing layer (such as specifying the coordinate position of any one or more processing layers in the Z-axis direction), specifying the processing sub-graphics on each processing layer, specifying the surface undulation of the three-dimensional model in the processing layer, or other three-dimensional surface changes.

[0137] Taking a specified number of layers as an example, referring to Figure 7, the second processing graphic can be layered according to the specified number of layers, the height of the object to be processed, and the correspondence between the second processing graphic and the object to be processed. When the specified number of layers is 6, 6 processing layers are obtained along the Z-axis, and the 6 processing layers and the processing sub-graphics on each processing layer are displayed through a display interface or other means. Specifically, the layering can be performed according to the actual layer height settings, and the corresponding layering situation will be displayed, which will not be elaborated here.

[0138] In this application, when rendering the first processing graphic to the three-dimensional model in step S100 to obtain the second processing graphic, it is necessary to align the first processing graphic with the three-dimensional model of the object to be processed in order to adjust the position of the first processing graphic in the three-dimensional model of the object to be processed so that the processing effect meets the user requirements.

[0139] In one embodiment of this application, after determining the processing path, the preview display includes, but is not limited to, the processing sub-graphics on each processing layer, the current processing layer, and processing parameters. After rendering the first processing graphic onto the 3D model of the object to be processed, a second processing graphic is obtained as shown in Figures 2(c) and 3. Through the aforementioned steps of layering the second processing graphic, multiple processing sub-graphics of processing layers are obtained as shown in Figure 7. Displaying the processing sub-graphics of each processing layer demonstrates the distribution of the first processing graphic on each processing layer. After determining the processing path, the preview display of the processing sub-graphics of each processing layer facilitates viewing the determined processing path for each layer, further optimizing the processing effect and preventing problems such as distortion and deformation of the processed graphics.

[0140] In addition, in this application, the preview display can also be used to show the three-dimensional surface processing process, so that the processing performed by the processing equipment is the screen displayed in the preview display, so as to intuitively control the processing process.

[0141] The three-dimensional surface processing method disclosed in this application allows for adjusting the position of the first processed graphic during step S100, which involves rendering the first processed graphic to a three-dimensional model to obtain the second processed graphic. It also allows for pre-layering of the second processed graphic during step S200, followed by returning to step S100 to optimize the processing effect by readjusting the position of the first processed graphic, or by readjusting the layer height, number of layers, and the position of each processing layer. The preview display of multiple processing layers not only previews the processing effect in advance, but also serves to verify the processing results and assist in perfecting the processing when the position and layer height settings of the first processed graphic are allowed to be modified and adjusted.

[0142] This application allows for receiving user-defined modification information after obtaining previews of multiple processing layers. The modification information may include, but is not limited to, layer height settings and other layer configuration information, as well as position settings for adjusting the position of the first processing graphic. This allows for adjusting and updating the layering and preview display based on the obtained previews before controlling processing execution, until the layering meets the required processing requirements. In this way, the processed product can meet the user's requirements.

[0143] In the field of CNC machining, when processing complex graphics, problems often arise due to the inability of the laser processing head and other processing components to move in the correct position or to accurately align, which affects processing accuracy and efficiency. Repeatedly adjusting the moving processing components not only increases processing time and affects processing efficiency, but also causes equipment wear, affects processing accuracy, and increases processing costs.

[0144] To reduce the movement path of processing components such as laser processing heads, save processing time and costs, and improve processing quality, referring to Figure 4, in one embodiment, the following conditions are met between two adjacent processing paths:

[0145] The distance between the starting point of the next processing layer and the ending point of the previous processing layer is the smallest.

[0146] Specifically, the two points closest to each other along the Z-axis of two processing layers can be used as the starting point of the next processing layer and the ending point of the previous processing layer; or the intersection points between layers (the points or lines where the processing sub-graphics of two adjacent processing layers intersect in the Z-axis direction) can be used as the ending point of the previous processing layer and the starting point of the next processing layer to ensure that the distance between the ending point of the previous processing layer and the starting point of the next processing layer is minimized.

[0147] In some implementations, interlayer intersection points refer to points or lines where the first processed pattern distributed across two processed layers intersect in the spatial Z-axis direction. The processing path for the current processed layer is determined by these interlayer intersection points.

[0148] Understandably, after dividing the processing layers according to the processing sequence, it is necessary to determine the processing sub-graphics on each processing layer, and then determine the processing path based on the processing sub-graphics on each processing layer. The processing sub-graphics between the inter-layer intersection points are then used to determine the pattern to be processed in the current processing layer. Taking n1, n2, and n3 as three adjacent processing layers as an example, there is at least one inter-layer intersection point between n1 and n2, and between n2 and n3. The inter-layer intersection point between n1 and n2 is determined as the first inter-layer intersection point d1, and the inter-layer intersection point between n2 and n3 is determined as the second inter-layer intersection point d2. The processing sub-graphic of n2 located between d1 and d2 is used to determine the processing path of n2. During processing, after processing the sub-pattern of n1 is completed, the laser processing head is controlled to move down from layer n1 to layer n2. After processing the sub-pattern of layer n2 located between the first inter-layer intersection point d1 and the second inter-layer intersection point d2 (i.e., after processing the sub-pattern of layer n2 is completed), the laser processing head is controlled to move down from layer n2 to layer n3 to further complete the processing of layer n3.

[0149] During controlled processing, the laser processing head can move up and down between different processing layers, and perform processing on each processing layer according to the determined processing path segment of each processing layer. In this way, the problem of needing to adjust the position of the laser processing head and other processing components multiple times may occur if the individual processing of each processing layer is completed directly along the Z-axis, which can effectively improve processing efficiency and processing accuracy.

[0150] Referring to Figure 4, in one embodiment, the steps of determining the start and end points of each processing layer based on the processing sub-graphics on each processing layer, and determining the processing path based on the start and end points of the processing layer, specifically include:

[0151] The presence of interlayer intersection points is determined based on the processing sub-graphics on each processing layer. Interlayer intersection points refer to points or lines where the first processing graphic distributed across two processing layers intersect in the Z-axis direction of space.

[0152] If there are inter-layer intersections between adjacent processing layers, determine the processing end point of the upper processing layer and the processing start point of the lower processing layer based on the inter-layer intersections, so as to minimize the distance between the processing start point of the lower processing layer and the processing end point of the upper processing layer.

[0153] If there is no intersection point between adjacent processing layers, the processing endpoint of the upper processing layer and the processing start point of the lower processing layer are determined based on the two closest graphic points along the Z-axis in the adjacent processing layers, so as to minimize the distance between the processing start point of the lower processing layer and the processing endpoint of the upper processing layer.

[0154] This ensures that the movement path of the processing head between adjacent processing layers is minimized, which in turn ensures that the movement path of processing components such as the laser processing head is minimized during the processing process, thereby reducing problems such as wear and processing errors that may occur due to the movement of the processing head.

[0155] Specifically, referring to Figure 19, when performing step S300, which involves determining the processing path of each processing layer based on the processing sub-graphics on each processing layer and obtaining the processing path of the second processing graphic, the processing path of each processing layer can be generated first. By associating the processing paths of multiple processing layers, the processing path of the second processing graphic can be generated. Based on the generated processing path of the second processing graphic, a gcode file (or gcode processing instructions) or a processing file in other formats containing processing instructions can be generated to control the processing equipment to perform layer-by-layer processing on the object to be processed based on the processing path of the second processing graphic.

[0156] In addition, when the processing path that associates the processing paths of the aforementioned multi-layer processing layers and generates the processing path of the second processing graphic is a single processing path, the processing path is determined as the processing path of the second processing graphic.

[0157] When there are multiple working paths determined after associating multiple processing layers, the working path with the most inter-layer intersection points is determined as the processing path of the second processing graphic.

[0158] Referring to Figures 4 and 8, in one embodiment, obtaining the processing sub-patterns distributed on each processing layer in step S200 includes the following steps:

[0159] Step S231: Obtain the intersection points of the second processing graphic and each processing layer;

[0160] Step S232: Based on the intersection of the second processing graphic and each processing layer, the second processing graphic is segmented to obtain the processing sub-graphics distributed on each processing layer.

[0161] By employing layered processing and intersection point calculation, the specific position and shape of the second machining graphic on each machining layer can be accurately determined. Based on the intersection points between the second machining graphic and each machining layer, independent and complete machining sub-graphics located on each machining layer are obtained. The second machining graphic is segmented along the Z-axis; this graphic segmentation ensures that the machining path on each machining layer is clearly defined, contributing to improved machining accuracy, efficiency, and precision. Furthermore, because it is applicable to complex 3D model machining, it effectively expands the application scenarios of three-dimensional surface machining methods, making the entire machining process more stable and reliable.

[0162] Please refer to Figure 4. Assume that S is the second processing graphic or part of the second processing graphic, layer n1 is the highest layer, and the intersection point of layer n1 and S is d1. Then, the graphics above point d1 are all processing sub-graphics distributed on layer n1. The intersection point of layer n2 and S is d2. Then, the image of S between d2 and d1 is the processing sub-graphics distributed on layer n1. And so on, to obtain the second processing graphic and the processing sub-graphics distributed on each processing layer.

[0163] Referring to Figures 9 to 18, in one embodiment, step S100, obtaining the three-dimensional model of the object to be processed, includes:

[0164] Step S110: Obtain multiple feature point data of the object to be processed, and perform segmented fitting on the multiple feature point data to obtain a multi-segment line fitting line;

[0165] Step S120: Smooth the multiple fitted lines to construct a three-dimensional model.

[0166] The 3D model is generated using methods such as Moving Least Squares (MLS). Then, piecewise fitting and smoothing are performed on single or discretely distributed feature points to obtain the 3D model. The least squares fitting line mentioned here refers to fitting a line that best fits the object to be processed between adjacent feature points in the vertical or horizontal direction. The least squares method calculates the line function parameters that minimize the error between data points based on the coordinates of each feature point, and uses these line function parameters to achieve the best line fitting effect. After line fitting, the least squares method is used again to fit lines using corresponding points on two parallel lines, thus forming numerous fitted lines between two parallel lines, thereby establishing the 3D model. These lines include, but are not limited to, curves and straight lines. The obtained feature point data is then fitted into lines or surfaces, and the object formed by these lines or surfaces is the 3D model corresponding to the surface to be processed.

[0167] The specific implementation process is as follows:

[0168] Figures 10 and 11 illustrate the calibration process. The processing equipment is calibrated at the factory. For each height, a set of parameters is obtained from the captured image: the pixel position (CX) of the illumination point and its spatial position (X, Y, Z). This set of parameters is then regrouped. For example, when performing the calibration process for a certain height, the obtained pixel position (Cx) and spatial position (X, Y, Z) of the illumination point form one set. This set is then regrouped pairwise by the pixel position and coordinate values ​​to obtain three sets of parameters: (CX, Z), (X, Z), and (Y, Z). This process is repeated for each height, with each set of parameters obtained through regrouping. For all heights, the same set of parameters are grouped together, for example, all (CX, Z) are grouped together, and linear fitting is performed, such as performing linear fitting on (CX0, Z0), (CX3, Z3), (CX6, Z6), (CX9, Z9), (CX12, Z12), and (CX15, Z15), adapting to the regrouping, and obtaining the mapping from the spatial position of the illumination point to the coordinate values ​​through the linear fitting. This mapping specifically includes the mapping from the spatial position to the Z-axis coordinate value, the mapping from the X-axis coordinate value to the Z-axis coordinate value, and the mapping from the Y-axis coordinate value to the Z-axis coordinate value, and so on, to obtain the mapping from the pixel position of the illumination point to the spatial position of the illumination point.

[0169] The mapping from the pixel position of the illumination point to its spatial position indicates the coordinates of the pixel position and the spatial position, as well as the relationship between these coordinates. This relationship can be characterized by a linear function and its coefficients. Therefore, by linear fitting, the coordinates of the pixel position and the spatial position of the illumination point, along with the coefficients of the corresponding linear function, can be obtained. From these coefficients, the corresponding linear function can be determined, thus revealing the relationship between the pixel position and the spatial position of the illumination point.

[0170] The linear function obtained by linearly fitting the pixel position CX of the illumination point and a coordinate value, namely the Z-axis coordinate value, is Z = a*CX + b; the linear function obtained by linearly fitting the X-axis coordinate value and the Z-axis coordinate value is X = c*Z + d; and the linear function obtained by linearly fitting the Y-axis coordinate value and the Z-axis coordinate value is Y = e*Z + f. Here, a, b, c, d, and c are coefficients read from the calibration file obtained during the calibration process. Therefore, the coefficients obtained from the linear fitting are extracted to form the calibration file. Correspondingly, in the measurement point measurement, only the calibration file needs to be called to obtain the calibration relationship between the pixel position and the spatial position of the illumination point, because the illumination point is located above the measurement point in the CNC machine coordinate system, so the spatial position of the illumination point is the same as the spatial position of the measurement point. Therefore, in the measurement point measurement performed in this embodiment, only the pixel position of the illumination point needs to be substituted into the above calibration relationship to obtain the spatial position of the measurement point.

[0171] Figures 12 and 13 show schematic diagrams of the measurement process. When performing specific calculations, the coefficients are first read from the calibration file, and the formulas are constructed from the read coefficients. That is, the spatial position of the measurement point and a coordinate value Z = a*CX + b are constructed, as well as the linear functions X = c*Z + d and Y = e*Z + f between the coordinate values.

[0172] The spatial position CX' of the red dot obtained from the photograph is determined by image recognition. Then, Z', Y', and x' are calculated sequentially using a constructed linear function. Z', Y', and x' constitute the spatial position of the measurement point. For obtaining the pixel position of the illumination point from the captured image, since the captured image describes the illumination point formed by the light beam captured by the camera inside the CNC machine, and the captured illumination point is represented by pixels in the captured image, image recognition can be performed to obtain the pixel where the illumination point is located. Finally, the pixel position of the illumination point is obtained through the pixel position of the captured illumination point. This is how the pixel position of one illumination point is obtained. Similarly, the pixel positions of multiple measurement points corresponding to a multi-point array are obtained through this process from the captured images. By measuring the point array, the processing of the workpiece is carried out, achieving the measurement of several measurement points and more accurately determining the spatial position of the area where the measurement points are located.

[0173] Figures 14 to 18 illustrate the specific process from constructing a solid surface (such as a curved surface or curve) to generating a 3D model: specifically, feature point data corresponding to the surface to be processed is acquired. This feature point data indicates the position of the arrayed feature points on the surface to be processed. The feature point data is obtained by measuring the surface to be processed using data acquisition devices such as infrared or structured light. The feature point data includes the position data of multiple feature points, which are arrayed on the surface to be processed.

[0174] Based on the feature point data, virtual feature point data in a specified direction is calculated. Then, based on the virtual feature point data in the specified direction, a 3D model corresponding to the surface to be processed is fitted. The specified direction includes the row and column directions of the feature point array. The virtual feature point data includes first virtual feature point data corresponding to the rows and second virtual feature point data corresponding to the columns in the feature point data. Combining these two types of virtual feature point data constitutes the 3D model corresponding to the surface to be processed.

[0175] Specifically, the virtual point creation function is obtained; the feature point data is divided into rows and columns, and each row and column in the feature point data is grouped based on a preset interval division unit; the feature point data of each group is substituted into the virtual point creation function to calculate the first virtual feature point data corresponding to the row in the feature point data and the second virtual feature point data corresponding to the column in the feature point data.

[0176] The virtual point creation function can be calculated based on the following 2D fitting:

[0177] In the formula, tension is a constant between 0 and 1 (e.g., 0.5), and its specific value can be adjusted according to the actual application scenario, without specific limitation here. If s0, s1, s2, and s3 are the feature point data of each group corresponding to the row, then by substituting the feature point data of each group corresponding to the row into the virtual point creation function above, c0, c1, c2, and c3 are calculated, thereby obtaining multiple sets of c0, c1, c2, and c3 corresponding to each row in the feature point data, thus obtaining the first virtual feature point data; if s0, s1, s2, and s3 are the feature point data of each group corresponding to the column, then by substituting the feature point data of each group corresponding to the column into the virtual point creation function, the corresponding c0, c1, c2, and c3 are calculated, thereby obtaining multiple sets of c0, c1, c2, and c3 corresponding to each column in the feature point data, thus obtaining the second virtual feature point data.

[0178] For example, the feature points of each group corresponding to a row or column are PT1, PT2, PT3 and PT4, where s0 = PT1, s1 = PT2, s2 = PT3 and s3 = PT4;

[0179] In each row and column, the first feature point is reused among the four feature points in the group containing the first feature point; in each row and column, the last feature point is reused among the four feature points in the group containing the last feature point.

[0180] For example, the four feature points in the group containing the first feature point of each row are PT1, PT1, PT2, and PT3, where s0 = PT1, s1 = PT1, s2 = PT2, and s3 = PT3; the four feature points in the group containing the last feature point of each row are PT2, PT3, PT4, and PT4, where s0 = PT2, s1 = PT3, s2 = PT4, and s3 = PT4.

[0181] Obtaining a three-dimensional model by fitting virtual feature point data in a specified direction refers to obtaining a three-dimensional model corresponding to the surface to be processed by fitting the first virtual feature point data and the second virtual feature point data. Specifically, the first virtual feature point data and the second virtual point control data are substituted into the following formula to obtain the three-dimensional model corresponding to the surface to be processed: f(t)=B0(t)*c0+B1(t)*c1+B2(t)*c2+B3(t)*c3 (2)

[0182] In the formula, Where t ranges from 0 to 1, and the specific value is determined according to the actual application scenario. No specific limit is made here. f(t) is the fitted row two-dimensional curve or column two-dimensional curve. A three-dimensional model can be obtained by combining multiple row two-dimensional curves and multiple column two-dimensional curves.

[0183] The preset range for the fitting coefficients is [0,1]. For example, when the subdivision parameter is 5, the values ​​of multiple fitting coefficients t can be: 0.0, 0.2, 0.4, 0.6, 0.8, 1.0; when the subdivision parameter is 10, the values ​​of multiple fitting coefficients t can be: 0.0, 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, 1.0; and so on.

[0184] Figures 16 and 17 show schematic diagrams of different tensions (with subdivision uniformly set to infinity) and different subdivisions (with tension uniformly set to 0.5). Taking surface machining as an example, as shown in the attached figures, under the condition that other factors remain unchanged, increasing the tension makes the 3D model smoother, that is, the curvature decreases.

[0185] The specific steps for generating a three-dimensional model from a two-dimensional curve are as follows:

[0186] Step 1: As shown in Figure 18(a), fit the X-axis column by column to generate the src_x[] array;

[0187] Step 2: As shown in Figure 18(b), perform quantitative sampling in the Y direction according to the subdivision number (Y direction subdivision);

[0188] Step 3: As shown in Figure 18(c), fit the Y-axis row by row to generate the src_y[] array;

[0189] Step 4: As shown in Figure 18(d), perform quantitative sampling in the X direction based on the subdivision number (X-direction subdivision);

[0190] Step 5: As shown in Figure 18(e), connect all the subdivision points row by row and column by column to form the fitted 3D mesh;

[0191] The specific 3D model of this application can be obtained further according to the actual settings and the specific scheme for creating 3D models in related technologies, and is not limited here.

[0192] Referring to FIG20, FIG20 illustrates a three-dimensional surface processing apparatus according to an embodiment of the present application. The three-dimensional surface processing apparatus includes a graphic acquisition module 301, a layering module 302, and a path determination module 303, wherein:

[0193] The graphic acquisition module 301 is used to acquire the three-dimensional model of the object to be processed and the first processing graphic, and to render the first processing graphic onto the three-dimensional model to obtain the second processing graphic.

[0194] The layering module 302 is used to layer the second processing graphic to obtain multiple processing layers arranged along the Z-axis and to obtain the processing sub-graphics distributed on each processing layer.

[0195] The path determination module 303 is used to determine the processing path of each processing layer based on the processing sub-graphics on each processing layer, obtain the processing path of the second processing graphic, and perform layered processing on the object to be processed based on the processing path of the second processing graphic.

[0196] The beneficial effects of the three-dimensional surface processing apparatus provided in this application are the same as those of the three-dimensional surface processing method provided in the above embodiments, and other technical features of the three-dimensional surface processing apparatus are the same as those disclosed in the methods of the above embodiments, and will not be repeated here.

[0197] Furthermore, to achieve the above objectives, referring to Figure 21, this application also provides a processing device, which is a laser processing device 10. The laser processing device 10 can be, but is not limited to, a laser cutting device, a laser engraving device, a laser engraving and cutting all-in-one device, a laser welding device, etc. The laser processing device includes processing components 110 such as a processing head, communication components, and a controller. The processing head can be, but is not limited to, a laser head, a cutting head, a pen tip, or a drill bit.

[0198] The laser processing equipment also includes a lifting structure 120, such as a Z-axis lifting structure. Taking a laser head as an example, the laser head can scan and process the object to be processed along the X and Y axes. The Z-axis lifting structure drives the laser head to move up and down to adjust the distance between the laser head and the object to be processed. Alternatively, in some embodiments, the laser head can be zoomable, and the focal position of the laser head in the Z-axis direction can be changed by adjusting the focal length.

[0199] Specifically, when the laser head can be raised and lowered via a lifting structure, the Z-axis lifting structure moves the laser head upwards or downwards to adjust the distance between the laser head and the object to be processed. This allows the laser head to move from one processing layer to the next. Besides using a lifting structure, the focal length can also be changed or adjusted by increasing or decreasing it, thereby altering the focal position of the laser head along the Z-axis. Increasing the focal length further adjusts the distance between the laser head and the object to be processed, allowing the laser head's focus to move from one processing layer to the next.

[0200] The communication component can be used to receive machining instructions obtained according to the steps of the three-dimensional surface machining method described in the above embodiments.

[0201] Machining commands can be, but are not limited to, Gcode commands. These commands include machining paths. For example, to execute the G0 Z command when the machining head needs to be moved to process each machining layer, machining commands can be presented in the following ways or in other ways:

[0202] "G0 Z100 / / Code for machining the first machining layer (highest layer)"

[0203] G0 XY

[0204] G1 XY

[0205] G1 XY

[0206] …

[0207] G0 Z95 / / Code for processing the second processing layer

[0208] G0 XY

[0209] G1 XY

[0210] G1 XY

[0211] …

[0212] G0 Z90 / / Code for processing the third processing layer

[0213] G0 XY

[0214] G1 XY

[0215] G1 XY

[0216] "

[0217] …

[0218] Based on the aforementioned processing instructions, the controller controls the processing head to perform layered processing on the object to be processed.

[0219] In one embodiment, the processing method described above further includes the following steps:

[0220] The processing head of the processing equipment is controlled to process the processing sub-pattern of the current processing layer on the object to be processed;

[0221] If the processing sub-graphic of the current processing layer is completed, move the processing head along the Z-axis or adjust the focal length of the processing head so that the focal point of the processing head moves to the next processing layer;

[0222] The object to be processed is processed based on the processing sub-graphics on the next processing layer.

[0223] In one embodiment, the controller is used to:

[0224] Control the machining head to process the machining sub-graphics of the current machining layer on the object to be processed;

[0225] If the current processing layer's sub-graphics are completed, move the processing head along the Z-axis or adjust the focal length of the processing head so that the focus of the processing head moves to the next processing layer;

[0226] Based on the processing sub-graphics of the next processing layer, the object to be processed is processed.

[0227] In one embodiment, the laser processing equipment further includes a galvanometer system. The galvanometer system, a key component for achieving precise movement of the laser head in the X and Y axes, includes, but is not limited to, an X-mirror, a Y-mirror (both X-mirrors are reflectors), and motors driving the X-mirrors and Y-mirrors to swing. The driving devices, based on control commands received from the controller, cause the reflectors to swing at a certain angle, thereby changing the propagation direction of the laser beam. By precisely controlling the swing angles of the two motors, arbitrary positioning and scanning of the laser beam can be achieved in the XY plane. The galvanometer system enables positioning and scanning of the current processing layer. After positioning to the layer's processing start point, the controller controls the laser head to begin processing the current processing layer's sub-pattern on the object to be processed, following the corresponding processing path from the layer's processing start point to its processing end point, until the processing of the current processing layer's sub-pattern is completed.

[0228] When it is necessary to move to the next processing layer, the processing head is moved along the Z-axis or its focal length is adjusted so that the focus of the processing head moves from the previous processing layer to the next processing layer. Based on the processing sub-pattern on each processing layer, each processing layer is processed. This method is used to move to the next layer after processing the first processing layer by lowering the processing head (such as a laser head) or lowering the focus of the processing head (such as a laser head), until all processing layers are processed.

[0229] The processing equipment provided in this application employs the three-dimensional surface processing method described in the above embodiments to solve the technical problems of how to achieve three-dimensional surface processing and how to avoid graphic distortion and improve processing efficiency while achieving three-dimensional surface processing. Compared with related technologies, the beneficial effects of the processing equipment provided in this application are the same as those of the three-dimensional surface processing method provided in the above embodiments, and other technical features of the processing equipment are the same as those disclosed in the methods of the above embodiments, and will not be repeated here.

[0230] Referring to Figure 22, this application also provides a processing system, which includes processing equipment (such as laser processing equipment 10) and a terminal device 20 communicating with the processing equipment. The terminal device 20 is communicatively connected to the processing equipment via a connection channel. The processing equipment includes processing components such as a base plate 130 and a processing head. The base plate 130 includes a processing area for placing the object to be processed, and the processing head is used to process the object located within the processing area. The terminal device is used to execute the above-described three-dimensional surface processing method to generate processing instructions and to send the processing instructions to the processing equipment.

[0231] The machining head is moved along the Z-axis or its focal length is adjusted to move the focal point from the previous machining layer to the next. Each machining layer is then processed based on its sub-pattern. After machining the first machining layer, the laser head is moved to the next layer by lowering its focal point, until all machining layers are processed. Compared to related technologies, the machining system provided in this application has the same beneficial effects as the three-dimensional surface machining method provided in the above embodiments, and other technical features of the machining system are the same as those disclosed in the methods of the above embodiments, and will not be repeated here.

[0232] This application also provides an electronic device, which includes: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores a three-dimensional surface machining program that can be executed by the at least one processor, and the three-dimensional surface machining program is executed by the at least one processor to enable the at least one processor to perform the three-dimensional surface machining method in the above embodiments.

[0233] The electronic device shown in this application is merely an example and should not be construed as limiting the functionality and scope of use of the embodiments of this application.

[0234] Electronic devices may include control components such as processing units (e.g., central processing unit, graphics processing unit, etc.), which can perform various appropriate actions and processes based on programs stored in read-only memory (ROM) or loaded from storage devices into random access memory (RAM). RAM also stores various programs and data required for the operation of the electronic device. The processing unit, ROM, and RAM are interconnected via a bus. Input / output (I / O) interfaces are also connected to the bus. Typically, the following systems can be connected to the I / O interface: input devices including, for example, touchscreens, touchpads, keyboards, mice, image sensors, microphones, accelerometers, gyroscopes, etc.; output devices including, for example, liquid crystal displays (LCDs), speakers, vibrators, etc.; storage devices including, for example, magnetic tape, hard disks, etc.; and communication devices. Communication devices allow electronic devices to communicate wirelessly or wiredly with other devices to exchange data.

[0235] Specifically, according to the embodiments disclosed in this application, the processes described above with reference to the flowcharts can be implemented as computer software programs. For example, embodiments disclosed in this application include a computer program product comprising a computer program carried on a computer-readable medium, the computer program containing program code for performing the methods shown in the flowcharts. In such embodiments, the computer program can be downloaded and installed from a network via a communication device, or installed from a storage device, or installed from a ROM. When the computer program is executed by a processing device, it performs the functions defined in the methods of the embodiments disclosed in this application.

[0236] The electronic device provided in this application employs the three-dimensional surface processing method described in the above embodiments, solving the technical problems of how to achieve three-dimensional surface processing and how to avoid graphic distortion and improve processing efficiency while achieving three-dimensional surface processing. Compared with related technologies, the beneficial effects of the electronic device provided in this application are the same as those of the three-dimensional surface processing method provided in the above embodiments, and other technical features of this electronic device are the same as those disclosed in the method of the previous embodiment, and will not be repeated here.

[0237] It should be understood that the various parts disclosed in this application can be implemented using hardware, software, firmware, or a combination thereof. In the description of the above embodiments, specific features, structures, materials, or characteristics can be combined in any suitable manner in one or more embodiments or examples.

[0238] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

[0239] This application provides a computer-readable storage medium having computer-readable program instructions (i.e., a computer program) stored thereon, the computer-readable program instructions being used to execute the three-dimensional surface processing method in the above embodiments.

[0240] The computer-readable storage medium provided in this application may be, for example, a USB flash drive, but is not limited to, electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices, or any combination thereof. More specific examples of computer-readable storage media may include, but are not limited to: electrical connections with one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof. In this embodiment, the computer-readable storage medium may be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, system, or device. The program code contained on the computer-readable storage medium may be transmitted using any suitable medium, including but not limited to: wires, optical cables, RF (Radio Frequency), etc., or any suitable combination thereof.

[0241] The aforementioned computer-readable storage medium may be included in an electronic device or may exist independently without being assembled into an electronic device.

[0242] The aforementioned computer-readable storage medium carries one or more programs. When the aforementioned one or more programs are executed by an electronic device, the electronic device causes the electronic device to: acquire a three-dimensional model of the object to be processed and a first processing graphic; render the first processing graphic onto the three-dimensional model of the object to be processed to obtain a second processing graphic; layer the second processing graphic to obtain multiple processing layers arranged along the Z-axis and processing sub-graphics located on each processing layer; determine the processing path of each processing layer based on the processing sub-graphics on each processing layer to obtain the processing path of the multiple processing layers, and perform layer-by-layer processing on the object to be processed based on the processing path of the multiple processing layers.

[0243] Computer program code for performing the operations of this application can be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, and C++, and conventional procedural programming languages ​​such as the "C" language or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving remote computers, the remote computer can be connected to the user's computer via any type of network—including a Local Area Network (LAN) or a Wide Area Network (WAN)—or can be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0244] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0245] The modules involved in the embodiments of this application can be implemented in software or hardware. The name of the module does not, in some cases, constitute a limitation on the unit itself.

[0246] The readable storage medium provided in this application is a computer-readable storage medium that stores computer-readable program instructions (i.e., a computer program) for executing the above-described three-dimensional surface processing method. This solves the technical problems of how to achieve three-dimensional surface processing, and how to avoid graphic distortion and improve processing efficiency while performing the processing. Compared with related technologies, the beneficial effects of the computer-readable storage medium provided in this application are the same as those of the three-dimensional surface processing method provided in the above embodiments, and will not be elaborated upon here.

[0247] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the steps of the three-dimensional surface processing method described above.

[0248] The computer program product provided in this application can solve the technical problems of how to realize three-dimensional surface processing, and how to avoid graphic distortion and deformation while realizing three-dimensional surface processing and improving processing efficiency. Compared with related technologies, the beneficial effects of the computer program product provided in the embodiments of this application are the same as the beneficial effects of the three-dimensional surface processing method provided in the above embodiments, and will not be repeated here.

[0249] The above description is only a part of the embodiments of this application and does not limit the patent scope of this application. All equivalent structural transformations made under the technical concept of this application and using the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included in the patent protection scope of this application.

Claims

1. A method for processing a three-dimensional surface, wherein, The three-dimensional surface processing method includes the following steps: Obtain a 3D model of the object to be processed and a first processing graphic; render the first processing graphic onto the 3D model to obtain a second processing graphic. The second processing pattern is layered to obtain multiple processing layers arranged along the Z-axis and processing sub-patterns distributed on each processing layer; Based on the processing sub-graphics on each processing layer, the processing path of each processing layer is determined, and the processing path of the second processing graphic is obtained, so as to perform layered processing on the object to be processed based on the processing path of the second processing graphic.

2. The three-dimensional surface processing method as described in claim 1, wherein, The step of layering the second processed pattern to obtain multiple processed layers arranged along the Z-axis specifically includes: Get floor height settings; The second processing graphic is layered according to the layer height setting information to obtain a multi-layer processing layer arranged along the Z-axis.

3. The three-dimensional surface processing method as described in claim 1, wherein, The step of layering the second processed graphic specifically includes: The second processing graphic is pre-layered with a first preset number of layers to obtain multiple pre-layers; if the middle processing layer in the multiple pre-layers does not correspond to the midpoint position of the second processing graphic, the height of each pre-layer and / or the first preset number of layers is adjusted so that the middle processing layer corresponds to the midpoint position of the second processing graphic. Alternatively, the second processing graphic can be pre-layered with a first preset layer height to obtain multiple pre-layers; if the middle processing layer in the multiple pre-layers does not correspond to the midpoint of the second processing graphic, the height of each pre-layer and / or the first preset layer height can be adjusted until the middle processing layer corresponds to the midpoint of the second processing graphic. Alternatively, the intermediate reference layer of the second processed graphic can be determined based on the midpoint position of the second processed graphic, and the second processed graphic can be pre-layered based on the intermediate reference layer; Alternatively, the position of a specified processing layer of the second processing graphic can be determined based on the specified position of the second processing graphic, and the second processing graphic can be pre-layered according to the specified layer height, specified number of layers, etc., based on the specified processing layer.

4. The method for processing a three-dimensional surface as described in any one of claims 1 to 3, wherein, Along the Z-axis from top to bottom, the machining surface of the next machining layer is not smaller than the machining surface of the previous machining layer.

5. The method for processing a three-dimensional surface as described in any one of claims 1 to 3, wherein, After performing the steps of obtaining multiple processing layers arranged along the Z-axis and acquiring the processing sub-patterns distributed on each processing layer, the three-dimensional surface processing method further includes the following steps: The interactive interface of the terminal previews the effect of the processing sub-graphics on each processing layer on the 3D model.

6. The method for processing a three-dimensional surface as described in any one of claims 1 to 3, wherein, After determining the processing path of each processing layer based on the processing sub-graphics on each processing layer, and obtaining the processing path of the second processing graphic, the three-dimensional surface processing method further includes: Preview the 3D surface processing process on the terminal's interactive interface.

7. The method for processing a three-dimensional surface as described in any one of claims 1 to 3, wherein, The step of determining the processing path of each processing layer based on the processing sub-graphics on each processing layer specifically includes: Based on the processing sub-graphics on each processing layer, determine the layer processing start point and layer processing end point for each processing layer, and determine the processing path based on the layer processing start point and layer processing end point.

8. The three-dimensional surface processing method as described in claim 7, wherein, The steps of determining the start and end points of each processing layer based on the processing sub-graphics on each processing layer, and determining the processing path based on the start and end points of the processing layers, specifically include: If there is an inter-layer intersection point between adjacent processing layers, the processing end point of the upper processing layer and the processing start point of the lower processing layer are determined according to the inter-layer intersection point, so as to minimize the distance between the processing start point of the lower processing layer and the processing end point of the upper processing layer. If there is no inter-layer intersection between adjacent processing layers, the processing endpoint of the upper processing layer and the processing start point of the lower processing layer are determined based on the two closest graphic points along the Z-axis in the adjacent processing layers, so as to minimize the distance between the processing start point of the lower processing layer and the processing endpoint of the upper processing layer.

9. The method for processing a three-dimensional surface as described in any one of claims 1 to 5, wherein, The process of obtaining the processing sub-patterns distributed on each of the processing layers includes the following steps: Obtain the intersection points of the second processing pattern and each of the processing layers; Based on the intersection of the second processing graphic and each of the processing layers, the second processing graphic is segmented to obtain processing sub-graphics distributed on each of the processing layers.

10. The method for processing a three-dimensional surface as described in any one of claims 1 to 9, wherein, The step of performing layered processing on the object to be processed based on the processing path of the second processing graphic includes: The processing head of the processing equipment is controlled to process the processing sub-pattern of the current processing layer on the object to be processed; If the processing sub-graphic of the current processing layer is completed, move the processing head along the Z-axis or adjust the focal length of the processing head so that the focal point of the processing head moves to the next processing layer; The object to be processed is processed based on the processing sub-graphics on the next processing layer.

11. The method for processing a three-dimensional surface as described in any one of claims 1 to 10, wherein, The three-dimensional surface processing method is used in laser processing equipment.

12. The method for processing a three-dimensional surface as described in any one of claims 1 to 3, wherein, The steps to obtain a 3D model of the object to be processed include: Obtain multiple feature point data of the object to be processed, and perform segmented fitting on the multiple feature point data to obtain a multi-segment line fitting line; The fitted lines are smoothed to construct the three-dimensional model.

13. The method for processing a three-dimensional surface as described in any one of claims 1 to 12, wherein, The step of determining the processing path of each processing layer based on the processing sub-graphics on each processing layer, and obtaining the processing path of the second processing graphic, includes: The processing paths of the multiple processing layers are associated to generate the processing path of the second processing graphic.

14. The three-dimensional surface processing method as described in claim 13, wherein, The processing path for generating the second processing graphic is generated by associating the processing paths of the multiple processing layers, including: If the processing path determined after associating the processing paths of multiple processing layers is a single path, the associated processing path is determined as the processing path of the second processing graphic. When there are multiple working paths determined after associating multiple processing layers, the path with the most inter-layer intersection points is determined as the processing path of the second processing graphic.

15. The method for processing a three-dimensional surface as described in any one of claims 1 to 14, wherein, The three-dimensional surface processing method further includes: Processing instructions are generated based on the processing path of the second processing graphic, and the processing instructions are sent to the processing equipment to control the processing equipment to perform layer-by-layer processing on the object to be processed.

16. A three-dimensional surface processing apparatus, wherein, The three-dimensional surface processing device includes: The image acquisition module is used to acquire a 3D model of the object to be processed and a first processing image, and to render the first processing image onto the 3D model to obtain a second processing image. The layering module is used to layer the second processing graphic to obtain multiple processing layers arranged along the Z-axis and to obtain processing sub-graphics distributed on each processing layer. The path determination module is used to determine the processing path of each processing layer based on the processing sub-graphics on each processing layer, obtain the processing path of the second processing graphic, and perform layered processing on the object to be processed based on the processing path of the second processing graphic.

17. A processing device, wherein, The processing equipment includes: Processing head; A communication component, the communication component being configured to receive machining instructions obtained from the steps of the three-dimensional surface machining method according to any one of claims 1 to 15; A controller, based on processing instructions, controls the processing head to perform layered processing on the object to be processed.

18. The processing equipment as described in claim 17, wherein, The controller is used for: The processing head is controlled to process the processing sub-pattern of the current processing layer on the object to be processed; If the processing sub-graphic of the current processing layer is completed, move the processing head along the Z-axis or adjust the focal length of the processing head so that the focal point of the processing head moves to the next processing layer; The object to be processed is processed based on the processing sub-graphics on the next processing layer.

19. The processing equipment as described in claim 17 or 18, wherein, The processing equipment is a laser processing equipment, and the processing head is a laser head.

20. The processing equipment according to any one of claims 17 to 19, wherein, The processing equipment also includes a Z-axis lifting structure, which is used to move the processing head up and down to adjust the distance between the processing head and the object to be processed; or, The processing head is zoomable, and by adjusting the focal length of the processing head, the focal point of the processing head can be moved from the previous processing layer to the next processing layer.

21. A processing system, wherein, The processing system includes: The processing equipment includes a base plate and a processing head. The base plate includes a processing area for placing an object to be processed, and the processing head is used to process the object located within the processing area. A terminal device that communicates with the processing equipment, the terminal device being used to execute the processing instructions generated by the three-dimensional surface processing method according to any one of claims 1 to 15, and to send the processing instructions to the processing equipment.

22. An electronic device, comprising a memory, a processor, and a three-dimensional surface machining program stored in the memory, wherein, The processor executes the three-dimensional surface machining program to implement the steps of the three-dimensional surface machining method according to any one of claims 1 to 15.

23. A computer-readable storage medium storing a three-dimensional surface machining program thereon, wherein, When the three-dimensional surface machining program is executed by the processor, it implements the steps of the three-dimensional surface machining method according to any one of claims 1 to 15.

Images