Device for cooling at least one electrical component of a motor vehicle and method for the production thereof
The clamping device with a flexible hold-down mechanism and rigid support addresses the challenge of reliable heat dissipation from motor vehicle components by allowing limited movement and even pressure distribution, preventing damage and maintaining thermal contact.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- ROBERT BOSCH GMBH
- Filing Date
- 2025-12-23
- Publication Date
- 2026-07-23
AI Technical Summary
Existing technologies face challenges in ensuring reliable heat dissipation from electrical components in motor vehicles throughout their service life, particularly due to thermal expansion, water absorption, and vibrations, which can lead to damage and reduced thermal contact resistance.
A clamping device with a hold-down mechanism that allows limited relative movement of the printed circuit board (PCB) while maintaining minimal thermal contact resistance, using a flexible material for the hold-down device and a rigid support to limit deformation, ensuring precise positioning and even pressure distribution.
The solution ensures reliable heat dissipation by preventing damage to the PCB and maintaining consistent thermal contact, even under high assembly forces, thus ensuring effective cooling throughout the component's service life.
Smart Images
Figure EP2025088853_23072026_PF_FP_ABST
Abstract
Description
[0001] R. 416522
[0002] - 1 -
[0003] Description
[0004] title
[0005] Device for cooling at least one electrical component of a motor vehicle and method for its manufacture
[0006] The invention relates to a device for cooling at least one electrical component of a motor vehicle and a method for manufacturing it according to the preamble of the independent claims.
[0007] State of the art
[0008] From DE 102013206999 A1, a control unit for a motor vehicle with a thermally conductive housing wall is known. The control unit has a printed circuit board (PCB) which is arranged in a cavity enclosed by the housing. A power component arranged on the PCB is thermally connected to the thermally conductive housing wall via a surface area. The thermally conductive surface of the housing wall has an embossed pattern in an area opposite the power semiconductor, the embossing bringing the housing wall into close proximity with the power semiconductor.
[0009] The invention is based on the objective of achieving reliable heat dissipation from an electrical component of a motor vehicle throughout the entire service life of a control unit. This objective is achieved by the features of the independent claims.
[0010] Disclosure of the invention
[0011] By the fact that the support and the hold-down device are spaced apart from each other, at least in the area of the overhangs, with a gap between a receiving surface of the hold-down device and a counter-surface of the support, so-R. 416522
[0012] - 2 -
[0013] Because movement of the printed circuit board (PCB) relative to the substrate is limited, and the clamping device is designed to counteract movement of the PCB against the direction of the heat sink, reliable heat dissipation can be ensured throughout the PCB's service life. On the one hand, the gap allows for a certain degree of limited relative movement of the PCB, such as that caused by thermal expansion, water absorption by materials, or even vibrations. This prevents damage to the PCB. On the other hand, the clamping device counteracts any movement of the PCB against the direction of the heat sink. This presses the PCB against the heat sink, resulting in minimal thermal contact resistance. This ensures reliable heat dissipation from the components mounted on the PCB.A corresponding overpressure on the heat-conducting element or heat sink is maintained by the hold-down device, particularly through its elasticity. To limit the maximum pressure or force, a preferably rigid support can be used, which limits the maximum deflection of the hold-down device. The proposed design also has the advantage that, especially during assembly, when high forces or pressures can act on the circuit board, damage to the circuit board is effectively prevented due to the support limiting the maximum deformation of the hold-down device, thus minimizing the gap between the circuit board and the heat sink.
[0014] In a suitable further development, the support includes at least one cantilevered section with the opposing surface. This allows for precise limitation of the maximum deformations in the area of the hold-down's overhangs.
[0015] Particularly useful is the inclusion of a receptacle for the opposing surface of the beam's cantilever in the area of the overhang. This allows for precise positioning during installation. Furthermore, the proposed solution is characterized by its compact design.
[0016] In a suitable further development, it is stipulated that the hold-down device be made of a material with higher elasticity than the material of the support. R. 416522
[0017] - 3 -
[0018] This ensures that the hold-down device allows limited relative movement of the circuit board until the support acts as a stop, preventing any further relative movement. This prevents damage to the circuit board.
[0019] In a further advantageous embodiment, the support is designed to be movable relative to the clamping device, so that during assembly, a force can be applied to or absorbed by the clamping device, preferably on several projections of the clamping device. This allows the circuit board and the heat sink with the intervening heat-conducting element to move towards each other, with the receiving surface and the opposing surface in direct contact without a gap, and / or, after assembly, the receiving surface and the opposing surface are spaced apart by a gap. This limits the maximum pressure or force on the circuit board, such as that acting during assembly, while still allowing a certain degree of limited movement.
[0020] In a further development, it is provided that the support is made of a metal, in particular aluminum, and / or that the retainer is made of a plastic, in particular polybutylene terephthalate, and most preferably a fiber-reinforced plastic. This allows for a certain degree of flexibility while simultaneously applying a sufficiently large force to minimize the TIM gap between the printed circuit board and the heat sink.
[0021] In a suitable further development, it is provided that the carrier and / or the hold-down device includes or include projections and / or protruding webs, each forming the contact points. This allows, in particular, the fasteners that connect the printed circuit board to the carrier to be tightened until the hold-down device and carrier are in mechanical contact at the contact points.
[0022] In a suitable further development, the hold-down device covers at least part of the printed circuit board. This ensures that the contact points and / or pressure points are evenly distributed across the entire printed circuit board. R. 416522
[0023] - 4 -
[0024] They can be divided so that excessive forces are not exerted on individual pressure points or the circuit board. This further minimizes damage to the circuit board.
[0025] In a suitable further development, a large number of pressure points are provided that act on those areas of the printed circuit board on the opposite side from the heat-conducting element. This presses the printed circuit board evenly against the heat sink to support continuous thermal contact.
[0026] In a suitable further development, it is provided that the electrical component is arranged between the hold-down device and the circuit board.
[0027] Because the hold-down device has a sufficiently large distance to the circuit board outside the pressure points, the freedom regarding the assembly of the circuit board is not significantly impaired.
[0028] In a suitable further development, the printed circuit board includes at least one thermal via. This allows the electrical component located on one side of the circuit board to be reliably cooled via the heat sink that is in thermal contact with the opposite side of the circuit board.
[0029] In a suitable further development, it is provided that the electrical component includes at least one part of a filter for filtering at least one supplied high-voltage input, and / or at least one part of at least one DC-AC converter to which at least one output signal of the filter can be supplied, and / or at least one part of a transformer to which at least one output signal of the DC-AC converter can be supplied, and / or at least one part of at least one AC-DC converter to which at least one output signal of the transformer can be supplied, and / or at least one part of at least another filter to which at least one output signal of the AC-DC converter can be supplied, wherein the output signal of the further filter is available as a low-voltage output, and / or at least one inductor and / or at least one capacitor. Especially in the case of a DC-DC converter, particularly for an electric vehicle, the requirements of R. 416522 are relevant.
[0030] - 5 -
[0031] The electrical components that need to be cooled get very hot and must be heated reliably.
[0032] Furthermore, a method for manufacturing a device for cooling at least one electrical component of a motor vehicle according to the features of the independent claim is disclosed. This allows the various assembly steps to be carried out in such a way that, in particular, damage to the circuit board is avoided and good thermal cooling is possible throughout the entire service life of the device.
[0033] Further appropriate training courses result from other dependent requirements and from the description.
[0034] Brief description of the drawing
[0035] They show:
[0036] Figure 1 shows a schematic overview of a DC / DC converter comprising an electrical component to be cooled.
[0037] Figure 2 shows a section through a schematic representation of the device for cooling at least one electrical component of a motor vehicle,
[0038] Figure 3 shows a cross-section through a more detailed representation of the interaction between the support and the hold-down device, as well as
[0039] Figure 4 shows another representation of the device with heat sink.
[0040] embodiment of the invention
[0041] The invention is schematically illustrated using an exemplary embodiment and is described in detail below with reference to the drawing. R. 416522
[0042] - 6 -
[0043] Figure 1 shows the main architecture with the essential components of a DC-DC converter 30. The following components of the DC-DC converter 30, as possible electrical components 66 requiring heat dissipation (see Figure 2), can be reliably cooled, particularly preferably, by the device described in conjunction with Figures 2 ff. Input quantities 10, indicated by an arrow, such as current I or voltage U from the high-voltage range (for example, in the range between 60 V and 800 V and higher), originate, for example, from an energy storage device such as a high-voltage battery of a vehicle, especially an electric vehicle. The input quantity 10 first enters a high-voltage section 14, where it is initially filtered in a filter 12, in particular a current filter or so-called EMC filter.The filtered output signal passes from filter 12 to a DC-AC converter 18, which converts the supplied direct current into alternating current. The DC-AC converter 18 can incorporate suitable power semiconductors such as field-effect transistors (FETs) or other devices. The alternating signal travels from the DC-AC converter 18 to one or more transformers 20 via corresponding conductor tracks 16. The high-voltage (HV) alternating current signal is converted by the transformer 20 into a low-voltage (LV) alternating current signal. This signal then travels via corresponding conductor tracks 16 to a low-voltage section 24. First, the alternating signal, stepped down by the transformer 20, is converted into a direct current by an AC-DC converter 22. The direct current then travels from the AC-DC converter 22 via corresponding conductor tracks 16 to a low-voltage filter 26.The filtered low-voltage output signal is fed as output variable 28 to an output of the DC-DC converter 30 for further use outside the DC-DC converter 30. This allows corresponding low-voltage loads or consumers of the vehicle to be supplied with energy at the desired (low) voltage level (for example, 12 V).
[0044] Figure 2 shows the basic structure of the device for cooling an electrical component 66. At least one electrical component 66 to be cooled is arranged on a circuit board 32. In the exemplary embodiment, several electrical components 66 are shown. A hold-down device 63 comprises several pressure points 76, by means of which the hold-down device 63 is pressed against the upper surface. 416522
[0045] - 7 -
[0046] The pressure points 76 press against the surface of the printed circuit board 32. The pressure points 76 are preferably distributed such that, particularly during assembly, a uniform pressure or force can be exerted on or absorbed by the printed circuit board 32. The hold-down device 63 comprises several projections 64 that extend dome-like into the pressure points 76. The pressure points 76 are preferably designed as flat surfaces that run parallel to the surface of the printed circuit board 32. The various pressure points 76 are preferably connected to each other as a single component of the hold-down device 63. The connecting webs or surfaces of the hold-down device 63 (not specified in detail) extend at a certain distance from the printed circuit board 32, so that sufficient space remains for the electrical components 66 or other components with which the printed circuit board 32 is mounted.The hold-down device 63 serves to prevent or reduce deflection of the printed circuit board 32, indicated here by a deformed printed circuit board 76, as far as possible. The hold-down device 63 is made of a material that exhibits a certain degree of flexibility. In the exemplary embodiment, a plastic, in particular a glass fiber reinforced plastic such as polybutylene terephthalate (PBT), is used as the material for the hold-down device 63. This material exhibits a certain degree of flexibility to allow for some elastic deformation. In the exemplary embodiment according to Figure 2, the maximum possible deformation of the hold-down device 63 is indicated by the dashed line 65. On the other hand, the material of the hold-down device 63 is characterized by its ability to withstand high pressures or forces, particularly during the assembly process.The components can be incorporated to achieve compression of the printed circuit board 32 against a heat sink 70 with a thermally conductive element 68 preferably arranged between them. This results in a minimal gap between the underside of the printed circuit board 32 and the surface of the heat sink 70.
[0047] On the other hand, the hold-down device 63 interacts with a support 62, which limits the movement of the hold-down device 63 away from the circuit board 32. For this purpose, corresponding counter-surfaces 94 of the support 62 are provided, corresponding to the number of pressure points 76, which interact with the hold-down device 63 as limiters. As indicated in Figure 2, the maximum possible deformation 65 of the hold-down device 63 is limited by a stop formed by the support 62. R. 416522
[0048] - 8 -
[0049] The carrier 62 is designed, for example, as a housing and encloses at least the hold-down device 63 on the side facing away from the circuit board 32. The carrier 62 has contact points 98 through which the carrier 62 is in direct mechanical contact with the hold-down device 63. The contact points 98 can be formed, for example, by projections or protruding webs of the carrier 62, the surfaces of which, as contact points 98, are in contact with the surface of the hold-down device 63. The contact points 98 are selected such that, in the area of the pressure points 76, a certain distance or gap 80 exists between the hold-down device 63 and the carrier 62, as will be described in more detail later. The carrier 62 is connected to the circuit board 32, in particular to the side facing the hold-down device 63, by means of fastening elements 72. The material of the carrier 62 has a lower elasticity than the material of the hold-down device 63. For example, a metal or...Aluminum could be used. This would also allow for electromagnetic shielding of the electronic components arranged on the circuit board 32.
[0050] The printed circuit board 32 can be provided with vias 74. These vias allow thermal conductivity to be transferred from the top side, where the electrical components 66 to be cooled are located, to the opposite underside of the printed circuit board 32. In this way, the underside of the printed circuit board 32 is thermally connected to the heat sink 70. To improve heat transfer, a thermally conductive element 68, a so-called TIM (thermal interface material), is arranged between the printed circuit board 32 and the heat sink 70. This thermally conductive element 68 can be applied, for example, as a thermal paste or thermal adhesive in liquid or paste form between the printed circuit board 32 and the heat sink 70. The printed circuit board 32 and the heat sink 70 are then moved towards each other to create a minimal TIM gap.The heat-conducting element 68, which is applied in a caterpillar shape, can be pressed down, resulting in a flat application of the heat-conducting element 68.
[0051] The embodiment shown in Figure 3 illustrates in more detail how the hold-down device 63 interacts with the support 62. By way of example, the hold-down device 63 has the following features: zumin-R. 416522
[0052] - 9 -
[0053] The support 62 has a projection 84, which extends dome-like towards the printed circuit board 32. The projection 84 terminates in a preferably flat surface oriented parallel to the surface of the printed circuit board 32. By way of example, the projection 84 is provided with a recess 86, particularly for simplified manufacturing by injection molding to achieve uniform wall thicknesses. On the side opposite the pressure point 82, the projection 84 terminates in a recess 90 in the form of a cavity. The recess 90 serves to receive a projection 92 of the support 62. The projection 92 of the support 62 terminates in a counter surface 94, which is preferably oriented parallel to the surface of the printed circuit board 32 or a receiving surface 88 of the hold-down device 63. The gap 80 is provided between the receiving surface 88 of the hold-down device 63 and the counter surface 94 of the support 62.This gap 80 is dimensioned to allow a certain degree of deformation of the hold-down device 63 in the direction of the support 62. However, as soon as the deformation exceeds the gap 80, the movement of the hold-down device 63 relative to the support 62 is limited. This prevents movement originating from the circuit board 32, such as that caused by thermal stresses, from leading to an impermissible increase in the distance between the underside of the circuit board 32 and the heat sink 70 in the direction of the support 62. This ensures reliable heat transfer between the electrical component 66 to be cooled and the heat sink 70.
[0054] The embodiment shown in Figure 4 illustrates a more detailed possible configuration of the device. The numerous projections 64 of the hold-down device 63 are visible, which result in a preferably uniform distribution of the pressure points 76. In this embodiment, the projections 64 are cylindrical or slightly tapered conically. The various projections 64 are interconnected. Preferably, the hold-down device 63 is designed to cover the exposed top surface of the circuit board 32 and to form corresponding pressure points 76 across the entire exposed top surface of the circuit board 32. All projections 64 are designed as shown in Figure 3. To limit flexible movement, the corresponding counter-surfaces 94 of the projection 92 of the support 62 interact with the corresponding receiving surfaces 88 in the receptacles 90 of the hold-down device 63. 416522
[0055] - 10 -
[0056] Figure 4 shows an example of a contact point 98 through which the support 62 and the hold-down device 63 are in mechanical contact. A plurality of contact points 98 are provided through which the support 62 is in mechanical contact with the hold-down device 63 and which are simultaneously designed such that the gap 80 is formed between the receiving surfaces 88 and the associated mating surfaces 94.
[0057] The support 62 at least partially surrounds the side of the retainer 63 facing away from the circuit board 32. The support 62 is connected to the circuit board 32 via fastening means 72. The heat sink 70 is designed as a cooler in the form of a housing. In the exemplary embodiment, the cooler is a water cooler. Corresponding cooling channels 96 in the heat sink 70 are indicated. The cooling channels 96 preferably run adjacent to the surface of the heat sink 70 that is in direct thermal contact with the circuit board 32 via the heat-conducting element 68. Especially with high temperature fluctuations of the heat sink 70 or the circuit board 32, this can lead to forces being exerted on the circuit board 32, which could, for example, cause the circuit board 32 to bulge. The opposing surfaces 92 of the support 62 reliably prevent excessive movement of the circuit board 32.This prevents the distance between the underside of the circuit board 32 and the top of the heat sink 70 from being excessively increased, so that good heat transfer between the circuit board 32 and the heat sink 70 can be maintained.
[0058] The described device for cooling at least one electrical component 66 of a motor vehicle can be assembled as described below. First, the carrier 62 is provided. The carrier 62 can be positioned with the side facing the circuit board 32 in the assembled state facing upwards. Thus, the projections 92 of the carrier 62 with the corresponding mating surfaces 94, as well as the corresponding overhangs forming the contact surfaces 98, protrude upwards. Subsequently, or concurrently, the retainer 63 is positioned. The retainer 63 is oriented such that the side with the corresponding receptacles 90 for the respective projections 92 of the carrier 62 faces these projections 92. The retainer 63 is connected to the carrier 62 via contact R. 416522
[0059] - 11 -
[0060] The contact points 98 are initially loosely connected mechanically. A plurality of contact points 98 are provided for this purpose. The contact points 98 are formed, for example, by corresponding projections of the carrier 62 and / or the hold-down device 63. Preferably, the contact points 98 are arranged on the outer surfaces of the carrier 62 and the hold-down device 63, adjacent to the side edges of the printed circuit board 32. In this position, the gap 80 described in conjunction with Figure 3 is formed between the receiving surface 88 of the hold-down device 63 and the counter surface 94 of the carrier 63. The printed circuit board 32 is then placed onto the pressure points 76 of the hold-down device 63. In the unloaded state, the described gap 80 remains. In this unloaded state, the printed circuit board 32 is precisely connected to the carrier 62 by means of corresponding fastening means 72.This fixes the hold-down device 63 from the carrier 62 via the contact points 98 against the pressure points 76 on the surface of the circuit board 32 while maintaining the desired (non-zero) gap 80.
[0061] Subsequently or concurrently, the thermally conductive element 68 is applied to the circuit board 32 and / or the heat sink 70. The thermally conductive element 68 could be applied in a bead as a paste-like thermally conductive adhesive. To minimize the gap between the circuit board 32 and the surface of the heat sink 70, which is filled with the thermally conductive element 68, the circuit board 32 and the heat sink 70 are moved relative to each other. For this purpose, high pressures or forces, for example in the range of 1000 N, must be exerted on the circuit board 32. The circuit board 32 is pressed against the preferably stationary heat sink 70. The force is introduced via the support 62 and / or the heat sink 70. This allows the preferably liquid or pasty thermally conductive element 68 to distribute itself in this minimal gap for thermally optimal connection of the circuit board 32 to the heat sink 70. To apply the high pressures or...Forces are applied to the heat sink 70, which is preferably made of a metal or aluminum. This presses the circuit board 32 against the pressure points 76 of the retainer 63, which has a certain degree of flexibility, with high forces or pressures. Through the corresponding movement of the circuit board 32, the receiving surfaces 88 of the retainer 63 are pressed against the corresponding counter surfaces 94 of the support 62, so that the gap 80 closes to zero. 416522.
[0062] - 12 -
[0063] The contact surfaces 88 and the counter surfaces 94 are in direct mechanical contact. The large forces or pressures are then transferred or introduced into the higher-strength support 62, which is held in place accordingly. The connection via the contact points 98 between the support 62 and the hold-down device 63 allows a certain degree of relative movement between the two components. However, the connection via the contact points 98 is not designed to absorb high forces during the assembly process. Instead, the projections 92 with their associated counter surfaces 94, in conjunction with the respective contact surfaces 88 of the projections 64 of the hold-down device 63, are responsible for this. This brings the heat sink 70 and the circuit board 32 to a minimal distance from each other, which is then completely closed by the thermally conductive element 68 distributed in this way.
[0064] The thermally conductive element 68 then hardens. The circuit board 32 and / or the support 62 are connected to the heat sink 70 in this position. If necessary, the high pressures or forces are maintained for a specific period. After the desired time, the heat sink 70 is no longer subjected to the high pressures or forces. Due to a certain degree of flexibility, the hold-down device 63 aligns itself relative to the support 62 in such a way that the desired gap 80 is re-established between the receiving surface 88 of the hold-down device 63 and the opposing surface 94 of the support 62. The material of the support 62, on the other hand, is characterized by low flexibility and high strength, thus limiting the deformation of the hold-down device 63.
[0065] During assembly, when the heat source, such as the printed circuit board 32, is pressed against the thermally conductive element 68, the maximum deformation is limited by the support 62. This prevents excessive deformation of the printed circuit board 32. However, once assembly is complete and the expected pressure on the thermally conductive element 68 decreases (for example, due to spreading), the retainer 63 maintains the continuous force on the printed circuit board 32 and provides positive pressure on the thermally conductive element 68 or the heat sink 70 throughout its entire service life. R. 416522
[0066] - 13 -
[0067] In this way, only a slight bulging of the circuit board 32 towards the hold-down device 63 is permitted during subsequent operation. However, should this bulging of the circuit board 32 become larger than the gap 80, the support 62, which is rigidly fixed relative to the circuit board 32, exerts a limiting effect on the movement of the hold-down device 63 via the corresponding counter-surfaces 94 due to its lower flexibility compared to that of the hold-down device 63.
[0068] The described device is particularly suitable for cooling electrical components 66 of a DC-DC converter 30, since power semiconductors used for voltage conversion, especially in electric vehicles, can generate very high levels of heat that must be reliably dissipated to ensure proper functioning. However, its use is not limited to this application.
Claims
R. 416522 - 14 - Claims 1. Device for cooling at least one electrical component (66) of a motor vehicle, comprising at least one printed circuit board (32) on which at least one electrical component (66) to be cooled is arranged, comprising at least one heat sink (70), in particular a cooler or a housing, at least one thermally conductive element (68) which is arranged between the printed circuit board (32) and the heat sink (70), comprising at least one retainer (63) which rests on the printed circuit board (32) via several pressure points (76) formed by projections (64) of the retainer (63), comprising at least one support (62) which is in contact with the retainer (63) at several contact points (98) and wherein the support (62) is connected to the printed circuit board (32) via fastening means (72), characterized in thatthat the support (62) and the hold-down device (63) are spaced apart from each other, at least in the area of the projections (64), by a gap (80) between a receiving surface (88) of the hold-down device (63) and a counter-surface (94) of the support (62), so that movement of the printed circuit board (32) relative to the support (62) is restricted, and wherein the hold-down device (63) is designed to counteract movement of the printed circuit board (32) against the direction of the heat sink (70).
2. Device according to claim 1, characterized in that the support (62) comprises at least one projection (92) with the counter surface (94).
3. Device according to one of the preceding claims, characterized in that the hold-down device (63) in the area of the projection (64) comprises at least one receptacle (90) for the counter surface (94) of the cantilever (92) of the support (62). R. 416522 - 15 - 4. Device according to one of the preceding claims, characterized in that the hold-down device (63) is made of a material with a higher elasticity than that of a material of the support (62).
5. Device according to one of the preceding claims, characterized in that the carrier (62) is designed to be movable relative to the hold-down device (63), so that during assembly a force can be applied to or received via the hold-down device (63) on preferably several projections (64) of the hold-down device (63), so that the circuit board (32) and the heat sink (70) with the heat-conducting element (68) in between are moved towards each other by the receiving surface (88) and the counter surface (94) being in direct contact with each other without a gap and / or after assembly the receiving surface (88) and the counter surface (94) being arranged spaced apart with a gap (80).
6. Device according to one of the preceding claims, characterized in that the support (62) is made of a metal, in particular aluminium and / or that the hold-down device (63) is made of a plastic, in particular polybutylene terephthalate, particularly preferably a fiber-reinforced plastic.
7. Device according to one of the preceding claims, characterized in that the support (62) and / or the hold-down device (63) comprise projections and / or protruding webs, each forming the contact points (98).
8. Device according to one of the preceding claims, characterized in that the hold-down device (63) at least partially covers the printed circuit board (32) over its entire surface.
9. Device according to one of the preceding claims, characterized in that a plurality of pressure points (76) are provided which act on those areas of the circuit board (32) on the opposite side of which the heat-conducting element (68) is arranged. R. 416522 - 16 - 10. Device according to one of the preceding claims, characterized in that the electrical component (66) is arranged between the hold-down device (63) and the circuit board (32).
11. Device according to one of the preceding claims, characterized in that the circuit board (32) comprises at least one thermal via (74).
12. Device according to one of the preceding claims, wherein the component (66) comprises at least one part of a filter (12) for filtering at least one supplied high-voltage input quantity (10), and / or at least one part of at least one DC-AC converter (18) to which at least one output signal of the filter (12) can be supplied, and / or at least one part of a transformer (20) to which at least one output signal of the DC-AC converter (18) can be supplied, and / or at least one part of at least one AC-DC converter (22) to which at least one output signal of the transformer (20) can be supplied, and / or at least one part of at least one further filter (26) to which at least one output signal of the AC-DC converter (22) can be supplied, wherein the output signal of the further filter (26) is available as a low-voltage output quantity (28), and / or comprises at least one inductor and / or at least one capacitor.
13. Method for manufacturing a device for cooling at least one electrical component (66) of a motor vehicle, comprising at least a printed circuit board (32) on which at least one electrical component (66) to be cooled is arranged, providing at least one heat sink (70), in particular a cooler or a housing, applying at least one thermally conductive element (68) to the printed circuit board (32) and / or the heat sink (70), positioning at least one hold-down device (63) such that the hold-down device (63) rests on the printed circuit board (32) over pressure points (76) formed by several projections (64) of the hold-down device (63), wherein at least one support (62) which is in contact with the hold-down device (63) at several contact points (98) is connected to the printed circuit board (32) by means of fastening means (72), wherein the support (62) and the hold-down device (63) are at least R. 416522 - 17 - in the area of the overhangs (64) are arranged with a gap (80) between a receiving surface (88) of the retainer (63) and a counter surface (94) of the carrier (62) spaced apart from each other, so that movement of the printed circuit board (32) relative to the carrier (62) is restricted, and wherein the retainer (63) counteracts movement of the printed circuit board (32) against the direction of the heat sink (70).
14. Method according to the preceding method claim, characterized in that the carrier (62) is designed to be movable relative to the hold-down device (63), such that during assembly a force is applied to or absorbed via the hold-down device (63) on preferably several projections (64) of the hold-down device (63), so that the circuit board (32) and the heat sink (70) with the heat-conducting element (68) in between are moved towards each other by the receiving surface (88) and the counter surface (94) being in direct contact with each other without a gap and / or after assembly the receiving surface (88) and the counter surface (94) being spaced apart with a gap (80).
15. Method according to one of the preceding method claims, characterized in that the hold-down device (63) has a material which has an elasticity which counteracts a movement of the circuit board (32) against the direction towards the heat sink and / or that the support (62) has a material which has a lower elasticity than a material of the hold-down device (63), so that the support (62) limits a movement of the circuit board (32) against the direction towards the heat sink (70).