Method and apparatus for providing haptic feedback indicative of thermal properties
The method and apparatus simulate entropy-driven thermal transfer in virtual environments to provide immersive and realistic thermal feedback, addressing the lack of dynamic thermal sensations in VR systems by accurately modeling object-to-object heat exchange and user interactions.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- NOKIA TECHNOLOGIES OY
- Filing Date
- 2026-01-07
- Publication Date
- 2026-07-23
AI Technical Summary
Existing virtual reality systems lack immersive thermal feedback that accurately simulates thermal properties and interactions, failing to provide realistic and dynamic thermal sensations based on entropy-driven thermal transfer and object-to-object heat exchange.
A method and apparatus that encode thermal conductivity attributes in a data stream to simulate entropy-driven thermal transfer within a virtual environment, updating the scene description to reflect temperature changes and user interactions, and render haptic feedback through devices like vibrotactile actuators and thermal systems, ensuring realistic thermal feedback based on object properties and user engagement.
Provides immersive and realistic thermal feedback by accurately modeling thermal conductivity, entropy, and heat transfer between objects, enhancing user interaction and perception of thermal properties in virtual environments.
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Figure EP2026050157_23072026_PF_FP_ABST
Abstract
Description
METHOD AND APPARATUS FOR PROVIDING HAPTIC FEEDBACK INDICATIVE OF THERMAL PROPERTIESCROSS REFERENCE TO RELATED APPLICATION
[0001] This application claims priority to U.S. Application No. 63 / 746,410, filed January 17, 2025, the entire contents of which are hereby incorporated by reference.TECHNOLOGICAL FIELD
[0002] Certain example embodiments of the present disclosure relates to virtual reality, and more particularly, to providing haptic feedback indicative of thermal properties in a virtual environment.BACKGROUND
[0003] Virtual reality (VR) systems have evolved significantly, offering highly immersive and realistic experiences for users. VR systems provide high-resolution displays, wide fields of view, 360-degree viewing, motion tracking, and the like for realistic visual effects. In the field of VR, there is increasing demand for even more immersive experiences, such as realistic touch sensations, advanced simulations in the virtual environment, natural human interactions within the environment, and the like. Some VR systems provide spatial audio, haptic feedback, and other effects to convey information to the user. The information can be rendered in ways that can be perceived by any of the human senses to provide realistic and immersive experiences. Some VR systems have integrated wearable devices that incorporate thermoelectric elements to simulate heat or cold sensations. Such systems can provide localized thermal feedback, such as experienced by a user touching a hot or cold object in the virtual environment, and simulate temperature changes in the environment.BRIEF SUMMARY
[0004] A method, apparatus, and computer program product are provided for providing haptic feedback indicative of thermal properties in a virtual environment, determined based on thermal entropy and entropy-driven thermal transfer.
[0005] An apparatus is provided, comprising at least one processor and at least one memory including computer program code, the at least one memory and the computer program codeconfigured to, with the at least one processor, cause the apparatus to at least encode one or more thermal conductivity attributes in a data stream configured to facilitate rendering of haptic feedback; and transmit the data stream to a haptics controller device, wherein the haptics controller device is configured to decode the data stream and cause rendering of, via a haptic feedback device, haptic feedback indicative of the one or more thermal conductivity attributes.
[0006] The at least one memory and the computer program code are further configured to, with the at least one processor, cause the apparatus to at least update a scene description representative of a virtual environment by simulating entropy-driven thermal transfer in the virtual environment, wherein the one or more thermal conductivity attributes is determined based on the updated scene description.
[0007] According to certain example embodiments, updating the scene description by simulating the entropy-driven thermal transfer comprises determining a temperature change of one or more objects in the virtual environment based at least on an initial temperature of one or more objects, and one or more physical properties of the one or more objects. The one or more physical properties of the one or more objects comprise one or more of an initial temperature, a thermal conductivity, a thermal emissivity, a thermal reflectivity, a thermal radiance, a thermal capacity, a mass, a density, or a surface area. Updating the scene description by simulating the entropy-driven thermal transfer comprises determining an ambient temperature change of the virtual environment based on at least an initial ambient temperature, and a temperature of one or more objects in the virtual environment. The one or more entropy-driven thermal transfers comprises one or more of thermal conduction, thermal emission, thermal convection, thermal reflection, or thermal radiation.
[0008] Updating the scene description by simulating the entropy-driven thermal transfer is based on one or more user interactions with the virtual environment, one or more interactions of one or more objects within the virtual environment, or one or more positions of one or more objects within the virtual environment. According to certain example embodiments, updating the scene description by simulating the entropy-driven thermal transfer comprises simulating nonlinear time progression based on one or more user interactions with the virtual environment.
[0009] An apparatus comprising at least one processor and at least one memory including computer program code, the at least one memory and the computer program code configured to, with the at least one processor, cause the apparatus to at least decode one or more thermalconductivity attributes from a data stream; and cause a haptic feedback device to render haptic feedback indicative of the one or more thermal conductivity attributes. The haptic feedback is rendered via at least one of a vibrotactile actuators, a thermal system, a pneumatic system, or a force feedback system.
[0010] The at least one memory and the computer program code are further configured to, with the at least one processor, cause the apparatus to at least calibrate the haptic feedback device based on at least one of a supported range of feedback, a device response time, or an energy consumption profile. The at least one memory and the computer program code are further configured to, with the at least one processor, causing the apparatus to at least generate the haptic feedback based on the one or more thermal conductivity attributes and one or more capabilities of the haptic feedback device.
[0011] A computer-implemented method is provided comprising encoding one or more thermal conductivity attributes in a data stream configured to facilitate rendering of haptic feedback, and transmitting the data stream to a haptics controller device, wherein the haptics controller device is configured to decode the data stream and cause rendering of, via a haptic feedback device, haptic feedback indicative of the one or more thermal conductivity attributes.
[0012] A computer-implemented method comprising decoding one or more thermal conductivity attributes from a data stream; and causing a haptic feedback device to render haptic feedback indicative of the one or more thermal conductivity attributes.
[0013] An apparatus is provided comprising means for encoding one or more thermal conductivity attributes in a data stream configured to facilitate rendering of haptic feedback and means for transmitting the data stream to a haptics controller device, wherein the haptics controller device is configured to decode the data stream and cause rendering of, via a haptic feedback device, haptic feedback indicative of the one or more thermal conductivity attributes. An apparatus is provided comprising means for decoding one or more thermal conductivity attributes from a data stream, and means for causing a haptic feedback device to render haptic feedback indicative of the one or more thermal conductivity attributes.
[0014] A computer program product is provided, comprising at least one non-transitory computer-readable storage medium having computer-executable program code instructions stored therein, the computer-executable program code instructions comprising program code instructions to encode one or more thermal conductivity attributes in a data stream configured tofacilitate rendering of haptic feedback, and transmit the data stream to a haptics controller device, wherein the haptics controller device is configured to decode the data stream and cause rendering of, via a haptic feedback device, haptic feedback indicative of the one or more thermal conductivity attributes.
[0015] A computer program product is provided, comprising at least one non-transitory computer-readable storage medium having computer-executable program code instructions stored therein, the computer-executable program code instructions comprising program code instructions to decode one or more thermal conductivity attributes from a data stream, and cause a haptic feedback device to render haptic feedback indicative of the one or more thermal conductivity attributes.
[0016] The above summary is provided merely for the purposes of summarizing certain example embodiments of the disclosure so as to provide a basic understanding of some aspects of the disclosure. Accordingly, it will be appreciated that the above-described example embodiments are merely examples and should not be construed to narrow the scope or spirit of the disclosure in any way. It will be appreciated that the scope of the disclosure encompasses many potential embodiments, some of which will be further described below, in addition to those here summarized.BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Having thus described certain example embodiments of the present disclosure in general terms, reference will hereinafter be made to the accompanying drawings which are not necessarily drawn to scale, and wherein:
[0018] Figure 1 is an overview of a system that can be used to practice certain example embodiments described herein;
[0019] Figure 2 is an exemplary schematic diagram of an apparatus in accordance with certain example embodiments; and
[0020] Figures 3-5 are flowcharts of operations that may be performed in accordance with certain example embodiments.DETAILED DESCRIPTION
[0021] Some embodiments of the present disclosure will now be described more fully hereinafter with reference to the accompanying drawings, in which some, but not all, embodiments of the disclosure are shown. Indeed, various embodiments of the disclosure may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will satisfy applicable legal requirements. Like reference numerals refer to like elements throughout. As used herein, the terms “data,” “content,” “information,” and similar terms may be used interchangeably to refer to data capable of being transmitted, received and / or stored in accordance with embodiments of the present disclosure. Thus, use of any such terms should not be taken to limit the spirit and scope of embodiments of the present disclosure.
[0022] Additionally, as used herein, the term ‘circuitry’ refers to (a) hardware-only circuit implementations (e.g., implementations in analog circuitry and / or digital circuitry); (b) combinations of circuits and computer program product(s) comprising software and / or firmware instructions stored on one or more computer readable memories that work together to cause an apparatus to perform one or more functions described herein; and (c) circuits, such as, for example, a microprocessor(s) or a portion of a microprocessor(s), that require software or firmware for operation even if the software or firmware is not physically present. This definition of ‘circuitry’ applies to all uses of this term herein, including in any claims. As a further example, as used herein, the term ‘circuitry’ also includes an implementation comprising one or more processors and / or portion(s) thereof and accompanying software and / or firmware. As another example, the term ‘circuitry’ as used herein also includes, for example, a baseband integrated circuit or applications processor integrated circuit for a mobile phone or a similar integrated circuit in a server, a cellular network device, other network device, field programmable gate array, and / or other computing device.
[0023] As defined herein, a “computer-readable storage medium,” which refers to a physical storage medium (e.g., volatile or non-volatile memory device), may be differentiated from a “computer-readable transmission medium,” which refers to an electromagnetic signal.
[0024] Entropy is central to the second law of thermodynamics, which states that the entropy of an isolated system left to spontaneous evolution cannot decrease with time. As a result, isolated systems evolve toward thermodynamic equilibrium, where the entropy is highest. A consequence of the second law of thermodynamics is that certain processes in the physical realmare irreversible. Thermal decay is the heat released as a result of radioactive decay. Thermal decay defused through conduction, convection (e.g., through air, water, etc.) and radiation especially as the energy radiance of the alpha, beta or gamma radiation is converted into the thermal movement of atoms.
[0025] Entropy and thermal decay are attributes of the physical world that if replicated in virtual environments can help achieve new and deeper forms of immersion. According to the concepts of entropy and thermal decay, temperature gradients flow from warmer objects to cooler objects through the passage of time. Within a closed system, if an object(s) radiates heat and experiences thermal decay, other object(s) or region within that system would absorb that heat, leading to a localized temperature increase. This process continues until thermal equilibrium is achieved, increasing the overall entropy of the closed system in accordance with the second law of thermodynamics.
[0026] Thermal transfer processes can be impacted by physical properties of objects, including but not limited to an initial temperature, a thermal conductivity, a thermal emissivity, a thermal reflectivity, a thermal radiance, a thermal capacity, a mass, a density, or a surface area. Proximity of an object with other objects, interactions with other users and / or objects can further impact an object’s entropy and related thermal transfer.
[0027] The concepts of entropy and thermal transfer therefore also apply to scenes where thermal information is encoded. Certain example embodiments disclosed herein encode and process properties of entropy to provide realistic thermal cues and a holistic view of thermal radiance. Certain example embodiments disclosed herein provide thermal feedback mediated through objects and user interaction, by modeling the conductivity of various objects or materials, and mapping out thermal sources, sinks and mediation mechanisms within the virtual environment. Certain example embodiments homogenize the encoding and rendering of thermal feedback as a holistic attribute to scene interaction, and provide for object-to-object heat exchange, which may occur even in the absence of direct user interaction. Certain example embodiments therefore account for thermal feedback changes over time, entropy, and how to model the virtual environment to radiate thermal energy between objects within the closed system. Entropy in useful to model changing temperatures of objects, such as a hot cup and ice cube, to reflect the changes with time. Certain example embodiments can also account for the Gibbs' paradox, which may involve a perceived unexpected and / or unexplained increase inentropy when mixing gases within a closed system. Certain example embodiments herein account for this paradox by using the Sackur-Tetrode equation which expresses the entropy S of a monatomic ideal gas in terms of its thermodynamic state — specifically, its volume V, and the number of particles, thereby ensuring entropy within a closed system does not decrease.
[0028] Certain virtual reality systems utilize thermal effects or thermal layers to supplement haptic user interfaces. Certain example embodiments disclosed herein provide a holistic approach to encoding, rendering and optimizing thermal feedback by conforming to the second law of thermodynamics and integrating the concept of entropy, providing a unified approach to model entropy within a virtual scene and therefore render realistic and immersive thermal feedback irrespective of the output device. By quantifying how thermal energy radiates over time within a complex scene, certain example embodiments provide a baseline of object-to-object interaction. Using this baseline, certain example embodiments yield realistic immersive output through existing thermal devices in response to user interaction with any object in a virtual environment, modeled as a closed system. Modelling conductivity and mediation of thermal output depending on object materials also provides perceptual variance creating a realistic output between objects of similar temperature but drastically different ability to conduct thermal energy. Similar to how a cake in the oven has a comparable temperature to the metal container in the oven but can feel drastically different to the sense of touch, mediating the thermal conductivity (as modelled according to certain example embodiments) creates realistic perceptual output within a complex virtual environment and between various objects and materials.
[0029] Certain example embodiments add effects of entropy and thermal decay to a virtual environment by modelling thermal conductivity between objects, heat sources, and heat sinks, and simulating heat dissipation dynamically within a virtual environment. Certain example embodiments therefore provide a realistic model of thermal equilibrium, individual object properties, and entropy behavior in a closed system, as entropy increases over time. Temperature conductivity can be incorporated into the scene description (model), and can be used to output an object’s various thermal states, heat transfer conditions and direct and indirect interaction within a closed system. Certain example embodiments recalculate each virtual object’s temperature in a given unit of time (calculated depending on computational resources allocated for modelling thermal interaction) based on the virtual object’s own properties to retain or conduct heat, its interaction with other objects, and the surrounding medium as well as average scene temperature.
[0030] Certain example embodiments recalculate each object’s temperature in a given unit of time (calculated depending on computational resources allocated for modelling thermal interaction) based on its own properties, interacting with other objects, and the median (scene) temperature, also referred to as ambient or background temperature. Certain example embodiments therefore allow for adaptation of entropy in any virtual scene containing a virtual object, a heat source and / or a heat sink. Updating object temperature within unit time “t” depends on the computational resources allocated to the rendering model as well as the frequency and resolution of the output (haptic) device, which is ascertained during device initialization.
[0031] For each object i in a scene, the energy exchange at each time step can be represented by the following example equation, that calculates the temperature of an object Ti at the next step based on heat transfer with other objects:
[0033] The equation provides an object-specific temperature Ti(t + 1) of an object i at the next time step t + 1. The calculation can be updated on a regular time interval, such as every second, to reflect changes in thermal energy exchange over time, and reflects changes in object temperatures based on interactions involving the object, which may include user interactions.
[0034] Ti(t) represents a temperature of object i at time t
[0035] kij represents an effective thermal conductivity between objects i and j, depending on the medium and any physical properties.
[0036] A represents a contact area between objects i and j that is an effective surface area for thermal transfer between i and j, influenced by the objects’ surface area and their orientation relative to each other.
[0037] — Tj(t) represents a temperature difference that drives a heat exchange between objects i and j. Heat flows from the warmer to the cooler object.
[0038] e~A'-'trepresents a decay factor that reflects entropy and thermal decay for each object.
[0039] A; represents a decay constant for each object / , representing energy dissipation over time, and how quickly an object approaches equilibrium. Certain example embodiments utilize adecay constant to simulate the gradual slowdown of energy transfer as the system moves toward thermal equilibrium, where entropy maximizes, and no net heat transfer occurs.
[0040] Cprepresents heat capacity of object / , and m, represents a mass of object i.
[0041] Cp, i • mi represents heat capacity and mass adjustment in the model, by scaling the heat change per time instant, ensuring that objects with larger heat capacities and mass take longer to heat up or cool down.
[0042] Based on the temperature calculation, certain example embodiments disclosed herein determine thermal entropy of objects within the scene based on initial conditions and user interactions.
[0043] Certain example embodiments provide temperature updates to the ambient temperature, also referred to as a scene temperature and / or background temperature, using a dynamic baseline. The ambient temperature evolves as objects exchange heat and is calculated based on a weighted average temperature of the scene as the system evolves dynamically. A scene of a virtual environment can be treated as a closed system, and certain example embodiments calculate the dynamic scene temperature Tscene, dynamic, (t) (the ambient scene temperate at time / ), as the weight average temperate of all the objects in the system:"Ti t) represents the temperature of each object i, mi represent the mass of each object, and Cp,i represents the heat capacity of each object. The equation for Ts cene, dynamic (t) therefore gives the overall thermal state of the scene, providing a baseline for energy propagation and feedback.
[0045] Thermal feedback Tfeedback, which is considered the temperature to convey to the user so that the user can perceive, feel and / or sense the thermal feedback in the virtual scene. The Tfeedback may model the feedback at the user’s point of contact. Tfeedback combining the object's current surface temperature with the influence of surrounding conditions (including the ambient temperature) and may be calculated as:
[0047] Tsurface represents the surface temperature of the object, such as at the contact point. TSurface may be considered a starting or reference temperature from which changes occur due to interactions with the environment.
[0048] A weighting coefficient a, also referred to as an attenuation coefficient, where (0 < a <1), scales the intensity of feedback. This factor can adjust the sensitivity or responsiveness of thermal feedback, depending on user preferences or system limits.
[0049] TScene, dynamic- -TSUrface represents the temperature difference between the dynamic temperature of the scene (ambient environment) and the object's surface temperature. Heat will flow from warmer to cooler regions, meaning if the scene is warmer than the object, it will heat up, and vice versa.k-A t
[0050] ecPmrepresents the exponential decay factor indicating how quickly the object's temperature changes over time. Thermal conductivity k represents the conductivity of the object's material, such as at the contact interface. Higher conductivity means faster heat transfer. Surface area, or contact area A, represents the area of an object in contact with the environment. A larger area increases the rate of heat exchange. Time t represents the time duration of an interaction, such as the contact. The feedback can therefore change progressively as time passes. Heat capacity Cprepresents the heat capacity of the object, indicating how much energy is needed to change its temperature. Mass m represents the mass of the object. A larger mass slows down temperature changes since more energy is required to heat or cool it. Tfeedbackcan therefore model the heat that is to be conveyed to the user for the user to perceive, such as via a contact point between a user and a position in the virtual environment. The thermal feedback can therefore be dynamically updated according to certain exampled embodiment, based on changes in entropy and user actions.
[0051] Using the formula Tscene dynamic(t) =certain example embodiments imi ■ p,icalculate the rate of temperature change based on the object's properties (surface temperature, heat capacity, conductivity, and mass) and the environment's influence (dynamic scene temperature). Over time, the exponential decay factor (with the terms k. A. t / Cp) causes the temperature difference effect to diminish, leading the object toward thermal equilibrium with its surroundings. When the scene temperature is higher than the object's surface, the object warms up, and Tfeedback increases. When the scene temperature is lower, the object cools down, and Tfeedback decreases. The feedback effect decreases over time, meaning the object gradually reaches a stable temperature close to the dynamic scene temperature.
[0052] Certain example embodiments modulate haptic feedback delivered to a user based on the thermal entropy state at the contact interface, and adapt feedback intensity dynamically based on user interactions, contact duration, and the properties of the user device. Additionally, or alternatively, modulation of feedback intensity can account for material-specific thermal conductivity (K) and temperature differential (AT). According to certain embodiments, the entropy-driven haptic feedback is rendered in a device or apparatus alongside a vibrotactile actuator, operating at a resonance frequency fres, and the feedback is optimized to provide a combination of different type haptic actuators, such as, vibrotactile and thermal output conforming to the parameters specified in the modelled entropy.
[0053] According to certain example embodiments, thermal feedback can be rendered using a thermal feedback device, such as using a Peltier device, that calculates heat transfer as:
[0055] where K is the thermal conductivity, T is the difference between the current and the target, Acontact is the contact area, and Tjthmnal is the efficiency factor of the device.
[0056] According to certain example embodiments, thermal feedback signals are converted into alternative haptic outputs when thermal feedback devices are unavailable. Thermal signals may be mapped to vibrotactile signals proportional to the thermal intensity. Conversion parameters can include scaling factors based on user interaction and environmental entropy changes. According to certain example embodiments, such a fallback mechanism can be dynamically adjusted based on the capabilities of the connected haptic devices.
[0057] According to certain example embodiments, the virtual system's entropy state dynamically based on user interactions over time. Certain example embodiments simulate a nonlinear time progression for entropy stabilization based on:
[0058] AS = y-
[0059] where A Q is the heat transfer and T is the absolute temperature.
[0060] Although the simulated process increasing entropy can occur in the background even without the user carrying out any interaction within the virtual environment, a simulated process can be slowed to ensure time is provided to the user to engage with the objects’ thermal decay. As another example, if the user starts engaging with the scene, the environment or object within, the process of entropy (heat transfer between objects) starts to occur faster. According to certainexample embodiments, the thermal entropy in the scene can be updated at a faster rate (perhaps hundreds of times per second) when the users are actively engaging with the environment or object(s), and the rate can slow down when the user is not engaging actively. The concept can be described as time dilation, meaning, time slows down when the user is inactive and speeds up when the user is active. The rate of flow of time can be directly proportional to entropy (rate by which thermal energy is dissipated between an object and the scene in general). This process can continue until maximum entropy is reached (meaning when average scene temperature and all object temperatures reach a thermal equilibrium). During this process the temperature of the objects within the scene are relayed to the user when they touch the object or come close to it. Depending on the object temperature, conductivity, and kcrit), and the background scene temperature (i.e., air, water, space etc.) thermal feedback can be created and relayed to the user through conduction, convection and radiation.
[0061] Although entropy and thermal entropy in the real physical world is irreversible, certain example embodiments enable the user the ability to go back in time to perceive the thermal energy of an object within the closed system, at time (t). Because the system and all the objects within it are modelled in a unit time which can be dictated by user’s active engagement, certain example embodiments enable the user to go back to a specific time within the timeline of the virtual environment, and the thermal energy and entropy is reset to the particular time (t). Accordingly, if the user would like to go back and interact with / experience interaction with another object instead of the one they already did at time (t), they can go back to time (t-1) and experience thermal feedback exactly as it would be at that time (or just before that original interaction), without the need for reinitializing the scene or re-rendering thermal properties of all the object within the scene. Furthermore, the entropy (loss of thermal energy that occurred from tan object due to user’s original interaction) could be reverted. In this regard, the model can simulate entropy from the new timeline starting from time (t-1) and users can move backwards within the time stream of the scene and its interactivity to experience a different interaction with the same or different object.
[0062] According to certain example embodiments, if the scene contains a hot cup of coffee, it may start losing its thermal energy to its surroundings (air, cup table etc.) even if the user doesn’t interact with the cup. But once the user comes close to it or touches the cup, the latest temperature of the cup and the coffee can be rendered via the user device. According to certainexample embodiments, heat is radiated once the user comes closer to the hot object. Similarly, heat from the user can move towards a cooler object (such as ice) once the user comes close to it or touches it directly. These values may be calculated and updated frequently, such as hundreds of times per second, and relayed to the user (via a thermal feedback device or other haptic feedback device) if the user is interacting with objects frequently or continuously. As another example, the updates may occur less frequently if the user is not actively interacting with the object or scene.
[0063] Certain example embodiments may therefore incorporate the concept of time dilation (rate of change of thermal decay slowing down). If the user is actively interacting with objects in the scene, then all the objects in the scene may lose and / or gain heat from their surrounding depending on how active the user is. Whereas, if the user disengages from the scene and virtual environment, the thermal decay (increase in entropy) may continue, but may become slower. According to certain embodiments, multiple rates and / or modes of thermal decay may be implemented, such as slow, medium and fast, based on an engagement level of a user falling into corresponding thresholds. According to certain embodiments, a rate of thermal decay can be dynamic and proportional to the user’s engagement level. In any event, certain example embodiments provide a non-linear time progression based on one or more user interactions with the virtual environment, a determined thermal energy transfer, and an absolute temperature. Heat propagation and therefore increased entropy within the environment may speed up or slow down depending on the engagement of the user. Entropy stabilization occurs once all objects (heat sources and sinks) reach average scene temperature.
[0064] According to certain embodiments, once the user comes close or in contact with an object and heat or feeling of coolness needs to be relayed, the original properties of the object (such as, conductivity, emissivity, radiance, mass, heat capacity, surface area, etc.) are utilized to render the thermal perception of the object to the user, optionally employing the attached device parameters. This means that two objects with the same temperature may create different perceptual output for the user. For example, while baking a cake, you may open an oven and touch the surface of the cake, without getting burnt, while if you touch the metal container in the same oven at the same temperature, a user can burn their hand, because of the properties of the object dictate how heat flows from it to the surroundings. Similarly, in the virtual environment, according to certain example embodiments, these properties are tracked and updated, so thatonce the uses engage with an object, the properties can be used to create a realistic and immersive thermal perception via a user device. Certain example embodiments normalize the thermal feedback across user devices, so that the experience is consistent irrespective of the device, its technology, its maximum and minimum temperature outputs, or the rate of change (time needed) to adjust the temperature within the device.
[0065] According to certain example embodiments, the thermal signature of object(s) that the user is close to or is actively interacting with, are rendered on the user’s device while the remaining objects in the scene are updated using the thermal entropy model but not necessarily rendered unless the user actively interacts with them (or comes close to them). In this regard, a temperature is updated as described herein, and once the user comes in contact or near the object the thermal feedback is rendered via the user device.
[0066] According to certain embodiments, various thermal states and corresponding heat transfer conditions can be considered. For example, certain example embodiments can distinguish between a conduction-only state with low conductivity, a radiative-conductive state (above threshold conductivity), and a state reflecting decay and entropy.
[0067] According to certain example embodiments, various thermal states and corresponding heat conditions are defined. For example, various states may include a conduction-only state with conductivity equal to or less than (or less than) a certain threshold or conductivity, and a radiative-conductive state in which an object has a conductivity equal to or greater than (or greater than) a certain threshold of conductivity. In this regard, states of conduction-only and a radiative conductance may be differentiated based on a predefined relationship of a conductivity with a conductivity threshold. A predefined relationship may include greater than, greater than or equal to, less than, or less than or equal to. States of decay and entropy are also modeled.
[0068] According to certain example embodiments, in a conduction-only state, with low conductivity, objects with conductivity less than, or less than or equal to (a first predefined relationship) a threshold (kcrit) exchange heat only upon direct interaction (i.e., mesh collision, compound collider, or the like) in the virtual scene. These objects will lose energy only by conduction to cooler objects they touch, aligning with International Organization for Standardization (ISO) Moving Picture Experts Group (MPEG)-I standards for physical scene interactions.
[0069] In a radiative-conductive state, (when objects have conductivity greater than, or greater than or equal to (e.g., a second predefined relationship) kcrit), they can transfer energy through both conduction and thermal radiation to their surroundings. Objects can radiate energy to others without direct contact if their energy state is high, and the energy state gradually reduces as they cool.
[0070] States of decay and entropy can also be modeled according to certain example embodiments. Entropy is represented by a gradual decay in energy state over time, modelled as an exponential decay rate, e~^ , where ( .) is a decay constant unique to each object, influenced by its properties (mass, conductivity). As objects cool, they gradually lose their radiative ability, providing conductive-only interactions.
[0071] Certain example embodiments disclosed herein form a cohesive framework for modelling thermal entropy in a closed virtual system, accounting for both localized and global heat transfer, as well as user feedback through wearable, mobile, surface-based, and other types of interaction devices.
[0072] According to certain embodiments, the model is initialized by setting initial temperatures for all objects and the ambient (scene) temperature. At each time instant defined by a given time interval, such as every second, the model can be updated, for each object i, calculate its new temperature Ti t + l)based on interactions with other objects, entropy, and decay. At each time instant, the scene temperature Tscenedynamic ( is updated as disclosed herein.
[0073] According to certain example embodiments, at each time instant, the temperature changes can be assessed, and once temperate changes per time instant (e.g., second) are within a negligible threshold, equilibrium is established in which no net heat transfer occurs, and the model can return or output an equilibrium temperature, which represents a state of maximum entropy for the system.
[0074] Figure 1 is an overview of a system that can be used to practice certain embodiments described herein, and should not be considered limiting. As illustrated in Figure 1, certain example embodiments may be implemented as or employed in a distributed system. The various depicted components may be configured to communicate over a network, such as the Internet, for example, or any other communication interface as described in further detail hereinafter. In general, a haptics controller device 32 may be configured to communicate with a server 40 andcommunicate with haptic feedback devices 30, configured to render a virtual environment and provide simulated virtual effects to a user.
[0075] A haptic feedback device 30 may include a wearable device such as but not limited to a head-worn display, a watch, a glove, a vest, and / or the like. According to certain embodiments, haptic feedback device 30 can include any device configured to provide haptic feedback. A haptic feedback device 30 may comprise or incorporate a thermal feedback device, such as but not limited to a Peltier device, an infrared source, a heating, ventilation and air conditioning (HVAC) system, and / or the like, configured to control thermal energy and enable a user to perceive thermal properties. In this regard, the thermal feedback device can provide thermal feedback that enables a user to perceive a temperature greater than or less than or equal to the ambient temperature. According to certain embodiments, haptic feedback device 30 may comprise or incorporate any number of vibrotactile actuators, pneumatic systems, and / or force feedback systems configured to provide haptic feedback. In this regard, according to certain embodiments, a virtual reality system may not necessarily include thermal systems, but other types of haptic actuators can be configured to provide haptic feedback representative of thermal properties.
[0076] The haptics controller device 32 may include a user device, such as a smart phone, gaming console, personal computer, workstation, tablet, laptop, other computing device, or the like. According to certain embodiments, the haptics controller device 32 may be configured in proximity to the haptic feedback device 30. For example, a haptics controller device 32 implemented as a gaming console may communicate over a local area network or via a near field communication protocol with the haptic feedback device 30. According to certain embodiments, although not depicted in Figure 1 as such, the haptic feedback device 30 and haptics controller device 32 can be implemented within the same device.
[0077] According to certain example embodiments, the haptics controller device 32 receives data from server 40, decodes and / or processes the data, and communicates data to the haptic feedback device 30, enabling the haptic feedback device to render haptic feedback.
[0078] Haptic feedback device 30 and / or haptics controller device 32 may further include any number of sensors, facilitating motion tracking, and / or detection of user interactions with a virtual environment. One or more sensors can also be included in the haptic feedback device 30 and / or haptics controller device 32 to sense a current ambient temperature. Haptic feedbackdevice 30 and / or haptics controller device 32 can include ambient sensors which may measure the thermal output of a haptic feedback device 30, the environment, and / or a type or duration of interaction. In this regard, the haptics controller device 32 can be configured to communicate user input data to the server 40.
[0079] According to certain example embodiments, any number of haptic controller devices 32 may be configured to communicate with server 40. Server 40 can be configured in proximity to the one or more devices 30, and / or remotely from the one or more devices 30. Server 40 may include any number of computing devices and may be configured to update a scene description representative of a virtual environment, and model properties of the virtual environment, including objects of the virtual environment.
[0080] The objects may be virtual objects representative of physical objects in a scene. According to certain embodiments, the server 40 is configured to communicate data to any number of haptics controller device 32 to further enable a haptics feedback device 30 to render the virtual environment. According to certain example embodiments, the server 40 and one or more devices 30 communicate in real-time or near real-time such that the server 40 updates the scene description in real-time or near real-time as user feedback and / or user input is received. Reference to near real-time is made to account for short delays in computer processing time and communication over a network, which may be nominal or not noticeable to a user.
[0081] According to certain example embodiments, the server 40 can be implemented within a same device as the haptics controller device 32. Configuration of the haptics controller device 32 and / or server 40 may be based on the use case, scalability, interoperability, performance targets, and / the like. For example, such as according to a single-user use case, the scene description can be updated at the haptics controller device 32. According to certain example embodiments, the scene description may be updated at the server 40 and may therefore facilitate multi-user use cases.
[0082] The system of Figure 1 described above is provided merely as an example implementation and it will be appreciated that certain example embodiments provided herein may be implemented as or employed by any number of system architectures. Accordingly, certain operations can be performed at the haptic feedback device 30, certain operations can be performed at the haptics controller device 32, and certain operations can be performed at the server 40.
[0083] Referring now to Figure 2, apparatus 200 is a computing device(s) configured to implement certain example embodiments disclosed herein, and to perform certain operations described herein. Apparatus 200 may at least partially or wholly embody haptic feedback device 30, haptics controller device 32, and / or server 40.
[0084] Apparatus 200 may include or otherwise be in communication with processing circuitry 220, user interface 222, communication interface 224, and memory device 226. The user interface 222 may be considered optional in apparatus 200, as indicated by the dashed line. For example, when apparatus 200 is embodied as server 40, user interface 222 may not be present.
[0085] According to certain embodiments, the processing circuitry 220 (and / or co-processors or any other processing circuitry assisting or otherwise associated with the processing circuitry 220) may be in communication with the memory device 226 via a bus for passing information among components of the apparatus 200. The memory device 226 may include, for example, one or more volatile and / or non-volatile memories. In other words, for example, the memory device 226 may be an electronic storage device (e.g., a computer readable storage medium) comprising gates configured to store data (e.g., bits) that may be retrievable by a machine (e.g., a computing device like the processing circuitry 220). The memory device 226 may be configured to store information, data, content, applications, instructions, or the like for enabling the apparatus to carry out various functions in accordance with certain example embodiments of the present disclosure. According to certain embodiments, memory device 226 is configured to store a scene description representative of a virtual environment, including thermal properties and / or other physical properties of the virtual environment including objects therein. The scene description can be updated as time progresses, as described according to certain example embodiments disclosed herein, and by instructions stored on memory device 226. The memory device 226 can be configured to buffer input data for processing by the processing circuitry 220. Additionally, or alternatively, the memory device 226 can be configured to store instructions for execution by the processing circuitry 220. For example, instructions stored on memory device 226 can be executed to perform encoding or decoding of a data stream, such as but not limited to a data stream configured to facilitate rendering of haptic feedback.
[0086] According to certain embodiments, the apparatus 200 may be embodied as a chip or chip set. In other words, the apparatus 200 may comprise one or more physical packages (e.g.,chips) including materials, components and / or wires on a structural assembly (e.g., a baseboard). The structural assembly may provide physical strength, conservation of size, and / or limitation of electrical interaction for component circuitry included thereon. The apparatus 200 may therefore, in some cases, be configured to implement an embodiment of the present disclosure on a single chip or as a single “system on a chip.” As such, in some cases, a chip or chipset may constitute means for performing one or more operations for providing the functionalities described herein.
[0087] The processing circuitry 220 may be embodied in a number of different ways. For example, the processing circuitry 220 may be embodied as one or more of various hardware processing means such as a coprocessor, a microprocessor, a controller, a digital signal processor (DSP), a processing element with or without an accompanying DSP, or various other processing circuitry including integrated circuits such as, for example, an ASIC (application specific integrated circuit), an FPGA (field programmable gate array), a microcontroller unit (MCU), a hardware accelerator, a special-purpose computer chip, or the like. As such, in some embodiments, the processing circuitry 220 may include one or more processing cores configured to perform independently. A multi-core processor may enable multiprocessing within a single physical package. Additionally, or alternatively, the processing circuitry 220 may include one or more processors configured in tandem via the bus to enable independent execution of instructions, pipelining and / or multithreading.
[0088] According to certain example embodiments, the processing circuitry 220 may be configured to execute instructions stored in the memory device 226 or otherwise accessible to the processing circuitry 220. Alternatively, or additionally, the processing circuitry 220 may be configured to execute hard coded functionality. As such, whether configured by hardware or software methods, or by a combination thereof, the processing circuitry 220 may represent an entity (e.g., physically embodied in circuitry) capable of performing operations according to an embodiment of the present disclosure while configured accordingly. Thus, for example, when the processing circuitry 220 is embodied as an ASIC, FPGA or the like, the processing circuitry 220 may be specifically configured hardware for conducting the operations described herein. Alternatively, as another example, when the processing circuitry 220 is embodied as an executor of software instructions, the instructions may specifically configure the processing circuitry 220 to perform the algorithms and / or operations described herein when the instructions are executed.For example, the processing circuitry 220 can be configured to update the scene description stored on memory device 226 to reflect thermal and other physical properties of a virtual environment including objects therein. According to certain example embodiments, the processing circuitry 220 is configured to encode and / or decode a data stream configured to facilitate rendering of haptic feedback. In some cases, the processing circuitry 220 may be a processor of a specific device (e.g., a mobile terminal or network entity) configured to employ an embodiment of the present disclosure by further configuration of the processing circuitry 220 by instructions for performing the algorithms and / or operations described herein. The processing circuitry 220 may include, among other things, a clock, an arithmetic logic unit (ALU) and logic gates configured to support operation of the processing circuitry 220.
[0089] The communication interface 224 may be any means such as a device or circuitry embodied in either hardware or a combination of hardware and software that is configured to receive and / or transmit data from / to a network and / or any other device or module in communication with the apparatus 200. In this regard, the communication interface 224 may include, for example, an antenna (or multiple antennas) and supporting hardware and / or software for enabling communications with a wireless communication network. Additionally, or alternatively, the communication interface 224 may include the circuitry for interacting with the antenna(s) to cause transmission of signals via the antenna(s) or to handle receipt of signals received via the antenna(s). In some environments, the communication interface 224 may alternatively or also support wired communication. As such, for example, the communication interface 224 may include a communication modem and / or other hardware / software for supporting communication via cable, digital subscriber line (DSL), universal serial bus (USB) or other mechanisms. Communication interface 224 may include a network (e.g., network 10), such as any wired or wireless communication network including a local area network (LAN), personal area network (PAN), wide area network (WAN), the Internet, an intranet, or the like, as well as any attendant hardware, software and / or firmware required to implement said networks (e.g. network routers and network switches). The communication interface 224 may be configured to facilitate communication between apparatus 200 and other devices. For example, communication interface 224 may enable communication of input data from haptics controller device 32 to the server 40, and a data stream from server 40 to haptics controller device 32, among other data communication.
[0090] According to certain embodiments, such as when apparatus 200 is embodied as haptic feedback device 30 and / or haptics controller device 32, a user interface 222 may be present. The user interface 222 may be configured to cause provision of any audible, visual, haptic or other output to the user. As such, the user interface 222 may include a display, such as one configured for displaying an image or video. Example displays which may be included in user interface 222 include a computer monitor, tablet screen, television monitor, head-worn display, other wearable display, a display or plurality of displays providing a virtual reality environment, and / or the like. User interface 222 of a haptic feedback device 30 may include thermal feedback devices that provided localized feedback, such as heat pads or cooling strips, and may be incorporated into one or more wearable devices, for example. User interface 222 of a haptic feedback device 30 may include room-scale temperate controllers, such as HVAC systems, and / or the like. User interface 222 of a haptic feedback device 30 may include vibrotactile actuators, pneumatic actuators, force feedback systems, infrared sources, and other haptic feedback mechanisms. According to certain embodiments, user interface 222 may include additional output mechanisms.
[0091] The user interface 222 may include a means for user input, such as a keyboard, buttons, mouse, joystick, touch screen, touch areas, scroller ball, soft keys, a microphone, or other input mechanisms. In some examples, the user interface 222 may include or may be communicatively connected to any number of sensors, such as a motion sensor, accelerometer, and / or the like, configured to detect movement of a wearable device, handheld device, or other device, such that the user can provide inputs based on such movements. For example, a user may turn their head while wearing a head-worn device comprising a display to view other areas of displayed content and experience corresponding feedback pertaining to a particular area of a virtual environment. User interface 222 may include eye-tracking sensors to determine which portions of content are viewed by a user. The input mechanisms are provided as examples, and according to certain embodiments, user interface 222 may include additional input mechanisms.
[0092] According to certain example embodiments, the processing circuitry 220 may comprise user interface circuitry configured to control at least some functions of one or more user interface elements. The processing circuitry 220 and / or user interface circuitry comprising the processing circuitry 220 may be configured to control one or more functions of one or more user interface elements through computer program instructions (e.g., software and / or firmware)stored on a memory accessible to the processing circuitry 220 (e.g., memory device 226, and / or the like). According to certain example embodiments, user interface 222 may be embodied by a user device that is remote from or external to apparatus 200.
[0093] Figure 3 is a flowchart of operations performed by apparatus 200, such as server 40, according to certain example embodiments. As shown by operation 300, apparatus 200 may include means, such as the processing circuitry 220, memory device 226, or the like, for updating a scene description representative of a virtual environment by simulating entropy-driven thermal transfer in the virtual environment. Operations for updating the scene description are provided in Figure 4, and may be performed by apparatus 200, such as server 40.
[0094] At operation 400, apparatus 200 may include means, such as the processing circuitry 220, communication interface 224, memory device 226, or the like, for determining a temperature change of one or more objects in the virtual environment based at least on an initial temperature of one or more objects, and one or more physical properties of the one or more objects. The one or more physical properties of the one or more objects comprise one or more of an initial temperature, a thermal conductivity, a thermal emissivity, a thermal reflectivity, a thermal radiance, a thermal capacity, a mass, a density, or a surface area. The temperature update can be calculated as described herein, such as based onand can further reflect the objects interactions with other objects, and entropy decay.
[0095] At operation 402, apparatus 200 may include means, such as processing circuitry 220, memory device 226, or the like, for determining an ambient temperature change of the virtual environment based on at least an initial ambient temperature, and a temperature of one or more objects in the virtual environment. For example, the ambient temperature change can be calculated based onand can reflect a weighted average of temperatures of the objects.
[0096] Operations 400 and 402 can be repeated on a continual basis to update the scene description. For example, the scene description can be updated every second or on a more frequent time interval and can be updated based on user interactions with the virtualenvironment. Periodic updates within the scene’s metadata, as objects interact with heat sources and each other. The entropy calculations will adjust the temperature of each object over time, reflecting the scene's changing thermal dynamics. Certain example embodiments may be integrated with ISO standards for scene descriptions and allow for objects' thermal states to change dynamically based on their interactions with the scene.
[0097] Returning to operation 302 of Figure 3, apparatus 200 may include means, such as processing circuitry 220, memory device 226, or the like, for encoding one or more thermal conductivity attributes in a data stream configured to facilitate rendering of haptic feedback. According to certain example embodiments, the thermal conductivity can be encoded into a MPEG-I Haptics (MIHS) data stream. The attribute of thermal conductivity can therefore extend spatial units within MIHS streams and interact dynamically with tactile and visual feedback. The thermal conductivity represents how efficiently an object conducts heat and can be measured in watts per millimeter-kelvin (W / mmK). The attributes indicate the rate at which heat is transferred between objects and environments. Two objects at the same temperature may feel different due to variations in thermal conductivity, enhancing the realism of object interaction.
[0098] As shown in operation 304, apparatus 200 may include means, such as processing circuitry 220, communication interface 224, memory device 226, or the like, for transmitting the data stream to a haptics controller device 30. As described in further detail herein, the haptics controller device is configured to decode the data stream and cause rendering of, via a haptic feedback device, haptic feedback indicative of the one or more thermal conductivity attributes. For example, in VR environments, users interacting with objects like a hot metal surface and a cooler wooden table will perceive the difference in heat conduction. This attribute on thermal conductivity allows for the simulation of complex thermal interactions, where the rate of heat transfer becomes a key aspect of the user's sensory experience.
[0099] Figure 5 illustrates operations that may be performed by apparatus 200, such as haptics controller device 132. At operation 500, apparatus 200 may include means, such as processing circuitry 220, communication interface 224, memory device 226, or the like, for decoding one or more thermal conductivity attributes from a data stream, such as the data stream communicated according to operation 304.
[0100] At operation 502, apparatus 200 may include means, such as processing circuitry 220, communication interface 224, memory device 226, or the like, for calibrating haptic feedbackdevice 30 based on at least one of a supported range of feedback of the haptic feedback device, a device response time of the haptic feedback device 30, or an energy consumption profile. Haptic feedback devices 30 are calibrated to account for specific efficiency factors, including thermal lag and device-specific intensity limits. Calibration parameters can include maximum supported temperature ranges, device response time for temperature modulation, and / or energy consumption profiles for sustained feedback. The calibration dynamically adjusts during runtime based on real-time feedback from the connected devices, such as haptic feedback device 30.
[0101] Not all devices have the same output mechanism, so certain example embodiments normalize the output feedback. A haptic feedback device may not be able to output a target temperature, so calibrating the output can enable the temperature changes to still be perceived in the virtual environment. The perceptual output can be mapped to the delta (change) of temperature in the virtual environment. This means that even if the output thermal device only works for a certain temperature range, but initializing and calibrating, certain example embodiments can simulate both ice and boiling water, using Pulse Width Modulation (PWM).
[0102] Additionally, or alternatively, certain example embodiments rate the ability / efficiency of the haptic feedback device 30. As an example, the larger the spectrum of thermal effects the haptic feedback device can generate (within the output energy signature) the higher the thermal volume of the haptic feedback device. Certain example embodiments may classify devices and their outputs accordingly.
[0103] At operation 504, apparatus 200 may include means, such as processing circuitry 220, communication interface 224, memory device 226, or the like, for generating haptic feedback based on the one or more thermal conductivity attributes and one or more capabilities of the haptic feedback device. According to certain example embodiments, if thermal feedback mechanisms are not available in the haptic feedback device 30, thermal signals can be mapped to other types of haptic signals, such as vibrotactile signals, proportional to the thermal intensity. Conversion parameters may include include scaling factors based on user interaction and environmental entropy changes. A fallback mechanism can dynamically adjust based on the capabilities of the connected haptic devices. According to certain example embodiments, an intensity of the haptic feedback is adapted or modulated based on at least one of user interactions, a contact duration, or one or more properties of the haptic feedback device 30. Haptic feedback can comprise a combination of vibrotactile feedback and thermal feedback,wherein the combination of the vibrotactile feedback and the thermal feedback is indicative of the thermal properties.
[0104] At operation 506, apparatus 200 may include means, such as processing circuitry 220, communication interface 224, memory device 226, or the like, for causing haptic feedback device 30 to render haptic feedback indicative of the one or more thermal conductivity attributes. The haptic feedback can therefore be provided by vibrotactile actuators, a thermal system, a pneumatic system, or a force feedback system.
[0105] Modeling entropy in the scene description provides for dynamic regulation of temperature across a scene. Over time, objects near heat sources gain heat and radiate it to surrounding objects, while distant objects retain cooler temperatures. The system continuously updates these changes, simulating a realistic thermal environment. For example, in a VR scene including a fire, nearby objects dynamically heat up based on their thermal conductivity, while distant objects remain cooler. Over time, as the heat dissipates, the overall temperature of the scene adjusts, providing a realistic thermal interaction.
[0106] Thermal conductivity and entropy attributes can be configured to work with thermal and tactile feedback systems and can be tested using conformance software using platform devices such as WEART Thimble devices, enabling seamless integration with hardware currently used in EE1.1 (ISO / LEC JTC 1 / SC 29 / WG 7 N990). Certain example embodiments can further provide compatibility with existing vibrotactile-only systems.
[0107] A system is therefore provided according to certain example embodiments for calculating and propagating thermal entropy within a virtual environment and rendering haptic feedback. Certain example embodiments model a virtual environment defined as a closed system, wherein thermal energy transformations are conserved and dynamically updated. A mathematical framework is provided for calculating object-specific temperature changes based on thermal interactions, dynamic scene temperatures, and thermal feedback, which can be rendered via a haptic feedback system, including but not limited to vibrotactile actuators, thermal systems, force feedback systems and / or pneumatic systems. Certain example embodiments provide entropy-driven haptic feedback based on user interaction to provide improved realistic and immersive experiences to users of virtual reality systems.
[0108] Certain example embodiments disclosed herein may be used in a variety of applications. For example, virtual environments used for training individuals in tasks orenvironments including temperature-sensitive feedback and interactions can be improved and made more realistic according to certain example embodiments provided herein. Certain example embodiments can be used in virtual reality systems configured for entertainment, storytelling, and gaming, training simulations such as relating to firefighting, industrial applications, rehabilitation, and / or the like.
[0109] A system can utilize certain example embodiments disclosed here to implement, test, and / or optimize a framework’s ability to calculate and propagate thermal entropy, within a closed virtual system. Certain example embodiments can develop, optimize, and / or integrate haptic feedback devices, covering multiple technologies (thermal, vibrotactile, pneumatic) using entropy within a scene where object or environment changes thermal properties with the passage of time or through direct or indirect user interaction, ensuring that any localized thermal decay in one object is matched by a corresponding thermal increase in other object(s) within the closed system. Certain example embodiments therefore highlight the procedural aspects of dynamic entropy by calculating feedback, modulation, or thermal energy conservation in a virtual environment, and defines or includes real-time updates to a virtual scene, object or interaction in a virtual environment as time progresses with or without user interaction-dependent adjustments, therefore simulating thermal decay. Output and / or renderings can be tailored to specific haptic technologies, such as a Peltier or other thermal feedback devices. The output and / or renderings can utilize the concept of entropy, and thermal decay in a closed or open virtual environment with accurate modeling of heat transfer and redistribution within a closed system to ensure modelling and delivery of realistic thermal interactions.
[0110] As described above, Figures 3-5 illustrate flowcharts of an apparatus 200, method, and computer program product according to certain example embodiments of the disclosure. It will be understood that each block of the flowchart, and combinations of blocks in the flowchart, may be implemented by various means, such as hardware, firmware, processor, circuitry, and / or other devices associated with execution of software including one or more computer program instructions. For example, one or more of the procedures described above may be embodied by computer program instructions. In this regard, the computer program instructions which embody the procedures described above may be stored by a memory device 226 of an apparatus 200 employing an embodiment of the present disclosure and executed by a processing circuitry 220 of the apparatus 200. As will be appreciated, any such computer program instructions may beloaded onto a computer or other programmable apparatus (e.g., hardware) to produce a machine, such that the resulting computer or other programmable apparatus implements the functions specified in the flowchart blocks. These computer program instructions may also be stored in a computer-readable memory that may direct a computer or other programmable apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture, the execution of which implements the function specified in the flowchart blocks. The computer program instructions may also be loaded onto a computer or other programmable apparatus to cause a series of operations to be performed on the computer or other programmable apparatus to produce a computer-implemented process such that the instructions which execute on the computer or other programmable apparatus provide operations for implementing the functions specified in the flowchart blocks.
[0111] Accordingly, blocks of the flowchart support combinations of means for performing the specified functions and combinations of operations for performing the specified functions for performing the specified functions. It will also be understood that one or more blocks of the flowchart, and combinations of blocks in the flowchart, may be implemented by special purpose hardware-based computer systems which perform the specified functions, or combinations of special purpose hardware and computer instructions.
[0112] In some embodiments, certain ones of the operations above may be modified or further amplified. Furthermore, in some embodiments, additional optional operations may be included. Modifications, additions, or amplifications to the operations above may be performed in any order and in any combination.
[0113] Many modifications and other embodiments of the disclosures set forth herein will come to mind to one skilled in the art to which these disclosures pertain to having the benefit of the teachings presented in the foregoing descriptions and the associated drawings. Therefore, it is to be understood that the disclosures are not to be limited to the specific embodiments disclosed and that modifications and other embodiments are intended to be included within the scope of the appended claims. Moreover, although the foregoing descriptions and the associated drawings describe certain example embodiments in the context of certain example combinations of elements and / or functions, it should be appreciated that different combinations of elements and / or functions may be provided by alternative embodiments without departing from the scope of the appended claims. In this regard, for example, different combinations of elements and / orfunctions than those explicitly described above are also contemplated as may be set forth in some of the appended claims. Although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation.
Claims
29CLAIMS1. An apparatus comprising at least one processor and at least one memory including computer program code, the at least one memory and the computer program code configured to, with the at least one processor, cause the apparatus to at least:encode one or more thermal conductivity attributes in a data stream configured to facilitate rendering of haptic feedback; andtransmit the data stream to a haptics controller device, wherein the haptics controller device is configured to decode the data stream and cause rendering of, via a haptic feedback device, haptic feedback indicative of the one or more thermal conductivity attributes.
2. The apparatus according to claim 1, wherein the at least one memory and the computer program code are further configured to, with the at least one processor, cause the apparatus to at least:update a scene description representative of a virtual environment by simulating entropy-driven thermal transfer in the virtual environment, wherein the one or more thermal conductivity attributes is determined based on the updated scene description.
3. The apparatus according to claim 2, wherein updating the scene description by simulating the entropy- driven thermal transfer comprises:determining a temperature change of one or more objects in the virtual environment based at least on an initial temperature of one or more objects, and one or more physical properties of the one or more objects.
4. The apparatus according to claim 3, wherein the one or more physical properties of the one or more objects comprise one or more of an initial temperature, a thermal conductivity, a thermal emissivity, a thermal reflectivity, a thermal radiance, a thermal capacity, a mass, a density, or a surface area.
5. The apparatus according to claims 3 or 4, wherein updating the scene description by simulating the entropy- driven thermal transfer comprises:determining an ambient temperature change of the virtual environment based on at leastan initial ambient temperature, and a temperature of one or more objects in the virtual environment.
6. The apparatus according to any of claims 2 to 5, wherein the one or more entropy-driven thermal transfers comprises one or more of thermal conduction, thermal emission, thermal convection, thermal reflection, or thermal radiation.
7. The apparatus according to any of claims 2 to 6, wherein updating the scene description by simulating the entropy- driven thermal transfer is based on one or more user interactions with the virtual environment, one or more interactions of one or more objects within the virtual environment, or one or more positions of one or more objects within the virtual environment.
8. The apparatus according to any of claims 2 to 7, wherein updating the scene description by simulating the entropy- driven thermal transfer comprises simulating non-linear time progression based on one or more user interactions with the virtual environment.
9. An apparatus comprising at least one processor and at least one memory including computer program code, the at least one memory and the computer program code configured to, with the at least one processor, cause the apparatus to at least:decode one or more thermal conductivity attributes from a data stream; andcause a haptic feedback device to render haptic feedback indicative of the one or more thermal conductivity attributes.
10. The apparatus according to claim 9, wherein the haptic feedback is rendered via at least one of a vibrotactile actuators, a thermal system, a pneumatic system, or a force feedback system.
11. The apparatus according to any of claims 9 or 10, wherein the at least one memory and the computer program code are further configured to, with the at least one processor, cause the apparatus to at least:calibrate the haptic feedback device based on at least one of a supported range of feedback, a device response time, or an energy consumption profile.
12. The apparatus according to any of claims 9 to 11, wherein the at least one memory and the computer program code are further configured to, with the at least one processor, cause the apparatus to at least:generate the haptic feedback based on the one or more thermal conductivity attributes and one or more capabilities of the haptic feedback device.
13. A method comprising:encoding one or more thermal conductivity attributes in a data stream configured to facilitate rendering of haptic feedback; andtransmitting the data stream to a haptics controller device, wherein the haptics controller device is configured to decode the data stream and cause rendering of, via a haptic feedback device, haptic feedback indicative of the one or more thermal conductivity attributes.
14. The method according to claim 13, further comprising:updating a scene description representative of a virtual environment by simulating entropy-driven thermal transfer in the virtual environment, wherein the one or more thermal conductivity attributes is determined based on the updated scene description.
15. The method according to claim 14, wherein updating the scene description by simulating the entropy- driven thermal transfer comprises:determining a temperature change of one or more objects in the virtual environment based at least on an initial temperature of one or more objects, and one or more physical properties of the one or more objects.
16. The method to claim 15, wherein the one or more physical properties of the one or more objects comprise one or more of an initial temperature, a thermal conductivity, a thermal emissivity, a thermal reflectivity, a thermal radiance, a thermal capacity, a mass, a density, or a surface area.
17. The method according to claims 15 or 16, wherein updating the scene description by simulating the entropy- driven thermal transfer comprises:determining an ambient temperature change of the virtual environment based on at least an initial ambient temperature, and a temperature of one or more objects in the virtual environment.
18. The method according to any of claims 14 to 17, wherein the one or more entropy- driven thermal transfers comprises one or more of thermal conduction, thermal emission, thermal convection, thermal reflection, or thermal radiation.
19. The method according to any of claims 14 to 18, wherein updating the scene description by simulating the entropy- driven thermal transfer is based on one or more user interactions with the virtual environment, one or more interactions of one or more objects within the virtual environment, or one or more positions of one or more objects within the virtual environment.
20. The method according to any of claims 14 to 19, wherein updating the scene description by simulating the entropy- driven thermal transfer comprises simulating non-linear time progression based on one or more user interactions with the virtual environment.
21. A method comprising:decoding one or more thermal conductivity attributes from a data stream; and causing a haptic feedback device to render haptic feedback indicative of the one or more thermal conductivity attributes.
22. The method according to claim 21 , wherein the haptic feedback is rendered via at least one of a vibrotactile actuators, a thermal system, a pneumatic system, or a force feedback system.
23. The method according to any of claims 21 or 22, further comprising:calibrating the haptic feedback device based on at least one of a supported range of feedback, a device response time, or an energy consumption profile.
24. The method according to any of claims 21 to 23, further comprising:generating the haptic feedback based on the one or more thermal conductivity attributes and one or more capabilities of the haptic feedback device.
25. A computer program comprising instructions, which, when executed by an apparatus, cause the apparatus to perform the method of any of claims 13 to 20.
26. A computer program comprising instructions, which, when executed by an apparatus, cause the apparatus to perform the method of any of claims 21 to 24.