Cooling element for a cooling device of an electronic computing device, cooling device as well as the electronic computing device

Abstract

The invention relates to a cooling element (5) for a cooling device (4) of an electronic computing device (2) for a motor vehicle (1), with at least one cooling plate (12, 13), wherein the cooling plate (12, 13) is formed for passage by a cooling fluid (7), and wherein the cooling plate (12, 13) is formed for cooling a circuit board (8, 9) of the electronic computing device (2), wherein a heat transport device (16) is arranged on a side of the cooling plate (12, 13), which does not adjoin to the circuit board (8, 9), wherein the heat transport device (16) is connected to a heat absorbing material (17). Further, the invention relates to a cooling device (4) as well as to an electronic computing device (2).

Description

[0001] 2024PF01123

[0002] 1

[0003] Cooling element for a cooling device of an electronic computing device, cooling device as well as the electronic computing device

[0004] The following invention relates to a cooling element for a cooling device of an electronic computing device for a motor vehicle, with at least one cooling plate, wherein the cooling plate is formed for passage by a cooling fluid, and wherein the cooling plate is formed for cooling a circuit board of the electronic computing device. Further, the invention relates to a corresponding cooling device as well as to an electronic computing device.

[0005] It is already known from the prior art that electronic computing devices, in particular electronic components of the electronic computing device, generate heat in the operation. Therein, the generated heat can result in damage or destruction of the electronic components or even of the entire electronic computing device. Therefore, it is of crucial importance to dissipate the corresponding heat. Furthermore, a reduced computing power or computing capacity can be observed upon heating of the electronic components.

[0006] Hereto, corresponding cooling devices are already known from the prior art, which perform cooling. Hereto, a cooling plate can for example be provided, which can be passed by a cooling fluid and thus absorbs the heat and leads it out of the electronic computing device. Furthermore, fans are for example known, which generate an airflow and can thus dissipate the warm air from the corresponding electronic components.

[0007] It is disadvantageous in the prior art that upon failure of the fan device or a pump for the cooling fluid, a cooling of the circuit board or of the electronic component is not observed. Thus, a destruction or impairment of the electronic computing device can occur in a corresponding case. Therefore, there is the need of an improved cooling of the electronic computing device.

[0008] CN 111 477993 provides an efficient heat management system for a power battery package. The system includes a battery pack heat dissipation flow channel device, an energy storage device, a heater and an electronic control unit, wherein an outlet of the battery pack heat dissipation flow channel device is connected to an inlet of the heater via a first pipeline, an outlet of the heater is connected to an inlet of the battery pack heat dissipation flow channel device via a second pipeline; an inlet of the energy storage2024PF01123

[0009] 2

[0010] device is connected to the first pipeline via a first branch pipe; an outlet of the energy storage device is connected to the first pipeline or the second pipeline via a second branch pipe; a first electromagnetic valve is arranged at the first branch line; a second electromagnetic valve is associated with the first pipeline on a side close to the heater; a third electromagnetic valve is arranged at the first pipeline between the first branch line and the second branch line; and a fourth electromagnetic valve is arranged on the side of the second branch line close to the second pipeline, and the electronic control unit is electrically connected to the first electromagnetic valve, the second electromagnetic valve, the third electromagnetic valve and the fourth electromagnetic valve.

[0011] CN 117 175059 A discloses a heat management system for batteries and a heat management method, wherein the heat management system for batteries includes a battery module, the battery module includes a plurality of batteries, which are arranged at intervals, a phase change material is arranged in a gap between the batteries and a liquid cooling line is arranged in the phase change material; the temperature sensor is arranged on the sidewall of the battery, the heat exchanger is connected to a liquid cooling line and the heat exchanger is connected to an air conditioning system and is used for exchanging heat for the liquid cooling line; the rotor pump is connected to a cooling water tank and for providing cooling liquid for the liquid cooling line; and the electronic control unit is electrically connected to the rotor pump and the temperature sensor and is used for receiving the temperature captured by the temperature sensor and for controlling the rotor pump.

[0012] It is the object of the present invention to provide a cooling element, a cooling device as well as an electronic computing device, by means of which an improved cooling of an electronic component on a circuit board of the electronic computing device can be realized.

[0013] This object is solved by a cooling element, a cooling device as well as an electronic computing device according to the independent claims. Advantageous forms of configuration are specified in the dependent claims.

[0014] A first aspect of the invention relates to a cooling element for a cooling device of an electronic computing device for a motor vehicle, with at least one cooling plate, wherein the cooling plate is formed for passage by a cooling fluid, and wherein the cooling plate is formed for cooling a circuit board of the electronic computing device.2024PF01123

[0015] 3

[0016] Therein, it is provided that a heat transport device is arranged on a side of the cooling plate, which does not adjoin to the circuit board, wherein the heat transport device is connected to a heat absorbing material.

[0017] Thereby, it is allowed that the heat transport device with the heat absorbing material is substantially provided as a secondary cooling. For example, if a cooling via the cooling fluid should fail due to a defect, thus, a heat transport from the cooling plate via the heat transport device towards the heat absorbing material can be realized. Thus, the heat absorbing material can be formed to absorb the corresponding heat, which has been transferred via the heat transport device. Thus, the heat absorbing material substantially serves as a secondary cooling. Therein, the heat absorbing material can in particular be formed such that it performs a corresponding heat absorption, for example based on a phase change, only from a certain temperature threshold value. In a normal operation of the cooling device, the preset temperature threshold value for example cannot be exceeded. A phase change of the heat absorbing material is provided only above this threshold value. Thus, only upon failure and thus upon exceeding the threshold value of the cooling fluid, a corresponding heat absorption can be performed.

[0018] Thus, a failure of electronic components or of the electronic computing device as well as a destruction of the corresponding constituents can in particular be prevented.

[0019] In particular, cooling plates according to the prior art are composed of channels, in which a coolant flows from an inlet opening to an outlet opening. A main cooling system malfunction, a coolant loss or lacking circulation can then result in overheating. Such malfunctions, in particular in highly autonomous systems, are very serious and can for example result in corresponding safety-critical situations in motor vehicles. According to the invention, an innovative cooling plate structure is now provided, in which at least one cooling plate and a thermotechnical channel of for example heat conducting elements is present, which are arranged between or on the cooling plate. In case of a main cooling system malfunction, the heat is transferred via the heat transport device into a separate chamber, where in particular the heat absorbing material can absorb the heat. Thanks to this solution, electronic control units have sufficient time to for example safely stop and switch off a motor vehicle before it overheats.

[0020] The cooling element, which is here described, in particular already functions similarly to cooling plates from the prior art. Therein, the cooling plate cools the corresponding circuit board. Electronic components, in particular high-performance components, which are2024PF01123

[0021] 4

[0022] formed on the electronic circuit board, can for example be thermally tied to the cooling plate. The principal difference and advantage of the cooling plate with respect to the prior art is in particular the heat transport device, which is formed on the cooling plate and thermally tied to it. The heat transport device dissipates excess energy, which would build up if the main cooling system for example fails. This thermal energy is then transferred to the heat absorbing material. This material can for example comprise a corresponding phase change material, with in particular a high thermal capacity.

[0023] Thereby, the cooling plate is in particular formed as a part of a cooling circuit with cooling fluid. Therein, a pump for the coolant circuit can be formed outside of the cooling element. A coolant, also called cooling fluid, is a liquid, which is employed in cooling systems to dissipate heat and thus to regulate the operating temperature. The coolant circulates through the cooling system and absorbs the heat of the appliance, before it is passed to a heat exchanger, where the heat is released to the environment. The most frequently used coolant in automobile cooling systems is a mixture of water and antifreeze agent, such as e.g. ethylene glycol or propylene glycol. This mixture has a lower freezing point than pure water and thus prevents the coolant from freezing at cold temperatures and damaging the cooling system. Moreover, the antifreeze agent increases the boiling point of the coolant, which contributes to avoiding overheating of the motor. Other types of cooling fluids are employed in various applications, such as e.g. in industrial processes, air conditioning systems or heating systems. These liquids can consist of a plurality of chemicals, including oils, esters, glycols and salt solutions.

[0024] Therein, a cooling circuit is a closed system of pipes, hoses, valves and components, which serves to dissipate heat from an appliance. The centerpiece of the cooling circuit is the cooler, in which the hot coolant is passed through a heat exchanger, where the heat is released to the environment. Therein, the cooling circuit is in particular formed from the following main components in the embodiment: In the electronic computing device, the coolant heats by the operation and releases the heat to a cooler. The cooler is a heat exchanger, in which the hot coolant is conducted through small pipes, while cold air from the outside flows through the cooler and absorbs the heat. Thereby, the coolant is cooled and can again flow back into the electronic computing device. The thermostat is a valve, which regulates the flow rate of the coolant through the cooler. For example, if the electronic computing device is cold, the thermostat closes and conducts the hot coolant directly back to the electronic computing device. As soon as the electronic computing device has reached a certain temperature, the thermostat opens and allows the coolant to circulate through the cooler. The pump is a pump, which pumps the coolant through the2024PF01123

[0025] 5

[0026] cooling circuit. It ensures that the coolant permanently circulates and thus dissipates the heat. The expansion vessel is a reservoir, in which excess coolant is stored when the electronic computing device cools down and the volume of the coolant decreases. When the electronic computing device becomes warm and the volume of the coolant increases, it flows out of the expansion vessel back into the cooling circuit.

[0027] The dissipated heat can for example also be used for heating an interior or other components, such as for example a battery.

[0028] According to an advantageous form of configuration, the heat absorbing material laterally adjoins to the cooling plate. Thus, the heat absorbing material is in particular arranged separately from the cooling plate and thermally connected to the cooling plate only via the heat transport device. Thereby, a heat absorbing material can be substantially provided without spatial delimitation of the cooling plate. In other words, much heat absorbing material can be laterally arranged on the cooling plate such that a correspondingly great heat input to the heat absorbing material can be given. This increases the safety, since the secondary cooling can absorb correspondingly much heat.

[0029] A further advantageous form of configuration provides that the heat absorbing material is formed in a reservoir. Therein, the reservoir can in particular be laterally arranged on the cooling plate. The reservoir in turn comprises the heat absorbing material, wherein in particular the heat transport device protrudes into this reservoir at least in certain areas. Thus, the corresponding heat can be released into the reservoir via the heat transport device. This allows efficient cooling of the circuit board.

[0030] It is further advantageous if the heat absorbing material is a phase change material. The phase change material, which can also be referred to as phase change material, is a material, which absorbs and can release energy in the form of heat, while it changes its aggregate state. Usually, the phase change material changes from the solid into the liquid state or vice versa from a certain temperature. In this phase change process, the phase change material absorbs a great amount of heat without severely heating, which makes it an efficient heat absorbing material. As soon as the temperature again decreases, the phase change material again releases the stored heat and changes back into the solid state. Thus, a secondary cooling of the circuit board can be most efficiently realized.

[0031] It is also advantageous if the heat transport device comprises at least one heat pipe. In particular, the heat pipe can also be referred to as heat pipe. The heat pipe is a2024PF01123

[0032] 6

[0033] component, which is employed for the heat transfer. It is a pipe, which is filled with a fluid, which evaporates and condenses at low temperature difference between two ends of the pipe. In this manner, the heat pipe can transport heat from a hot place to a cooler place, where the condensation heat can then be dissipated. Therein, the functionality of the heat pipe is based on the capillary action, which causes the fluid to circulate in the interior of the pipe. This makes a heat pipe into very efficient heat exchangers, since they dispense with moved parts compared to conventional heat sinks and allow a fast heat dissipation.

[0034] In a further advantageous form of configuration, it is provided that the cooling plate comprises at least one fluid conducting element. In particular, the fluid conducting element can be substantially formed as an elevation in an interior space of the cooling plate. Thus, the fluid can obtain a flow direction by the fluid conducting element. Thereby, it is allowed that a cooling of the cooling plate can be most efficiently realized.

[0035] It has further proven to be advantageous if the cooling plate comprises a cooling structure, which is meander-shaped formed within the cooling plate. In particular, the meandering shape allows being able to realize a corresponding flow of the fluid within the cooling plate. By the meander shape, a great amount of heat can be reliably absorbed via the cooling plate. Thus, the meander shape allows efficient cooling of the at least one circuit board of the electronic computing device.

[0036] It has further proven to be advantageous if the cooling plate comprises a fluid entry opening and a fluid exit opening. The fluid entry opening and the fluid exit opening can for example be connected to a pump of the cooling device. Therein, the pump can be located substantially in the vicinity of the cooling element or also be located dislocated from the cooling element. Alternatively, the pump can also be directly connected to the cooling element. By the fluid entry opening, a reliable flow across the cooling plate to the fluid exit opening can be realized. Thus, a fluid exchange can be realized, whereby the heat can be reliably transported from the cooling plate.

[0037] In a further advantageous form of configuration, it is provided that the cooling plate is formed two-part and the heat transport device is formed between a first part of the cooling plate and a second part of the cooling plate. Therein, the first part and the second part can in particular comprise corresponding receptacles for the heat transport device. By the receptacle, a larger contact surface between the heat transport device and the cooling plate parts can be realized such that a better heat dissipation can be performed. For example, corresponding recesses can be provided, in which at least one heat pipe or a2024PF01123

[0038] 7

[0039] plurality of heat pipes can be embedded. Thus, it is possible that a first circuit board can for example be arranged adjoining to the first part and a second circuit board can be arranged adjoining to the second part. Thus, two circuit boards can be correspondingly cooled.

[0040] It has further proven to be advantageous if the cooling plate is formed of a metallic material. For example, the cooling plate can be formed of copper. In particular the metallic material or copper has a very high thermal conduction coefficient such that it can reliably pass the heat from the electronic component to for example the cooling fluid and to the heat absorbing material. Thus, an efficient cooling of the at least one circuit board can be realized.

[0041] Therein, it has further proven to be advantageous if the first part and the second part are fluidically connected to each other, wherein the fluidic connection extends through the heat absorbing material. Thus, a fluid flow through the first part can be realized via the fluid connection to the second part. Thereby, it is only required that the first part for example comprises a fluid entry opening and the second part comprises a fluid exit opening and thus a simple cooling circuit can be formed. Thus, it is allowed that a fluid flow can be realized through the first part via the fluidic connection to the second part. Thus, cooling of the circuit board can be realized in simple manner and yet in highly efficient manner.

[0042] Therein, it has further proven to be advantageous if the first part and the second part each comprise at least one fluid conducting element. Alternatively or additionally, the first part and / or the second part can comprise a corresponding cooling structure, for example a meander-shaped cooling structure. Thus, an improved flow of the fluid across the first part and the second part can be realized, whereby a highly efficient heat absorption can be realized via the cooling plate.

[0043] In a further advantageous form of configuration, it is provided that the first part comprises a fluid entry opening and the second part a fluid exit opening. In particular, the first part and the second part are then fluidically connected to each other. Thus, both the first part and the second part can be fluidically cooled with only a single cooling circuit.

[0044] Further, it has proven to be advantageous if the first part is formed for arranging a first circuit board and the second part is arranged for arranging a second circuit board. In other words, the first circuit board can be arranged for example on the first part, in particular2024PF01123

[0045] 8

[0046] opposing the heat absorbing material. The second circuit board can then in turn also be arranged opposing the heat absorbing material on the second part. Thus, two circuit boards can be cooled via one cooling element.

[0047] A further aspect of the invention relates to a cooling device for an electronic computing device with at least one cooling element according to the preceding aspect and with a pump for conveying a cooling fluid, wherein the pump is fluidically connected to the cooling element.

[0048] Therein, it can in particular be provided that at least the pump of the cooling device is for example formed outside of a common housing of the electronic computing device.

[0049] In a further advantageous form of configuration, it is provided that at least the circuit board and the cooling element are arranged in a common housing. For example, only the fluid entry opening and the fluid exit opening as well as further plug elements for the circuit board can then protrude from the housing. The pump of the cooling device can again be formed externally to the housing.

[0050] Advantageous forms of configuration of the cooling element are to be regarded as advantageous forms of configuration of the cooling device as well as of the electronic computing device.

[0051] Furthermore, the invention also relates to a motor vehicle with at least one electronic computing device. The advantageous forms of configuration of the electronic computing device then analogously also apply to the form of configuration of the motor vehicle.

[0052] In the present disclosure, a computing unit / electronic computing device can for example be understood as a data processing apparatus with processing circuits. Thus, a computing unit can perform computing operations to process data. The computing operations can also include indexed accesses to a data structure, for example a look-up table, LUT.

[0053] In particular, a computing unit can include one or more computers, one or more microcontrollers and / or one or more integrated circuits, for example one or more application-specific integrated circuits, ASIC, one or more field-programmable gate arrays, FPGA, and / or one or more systems on a chip, SoC. The computing unit can also include one or more processors, for example one or more microprocessors, one or more central2024PF01123

[0054] 9

[0055] processing units, CPU, one or more graphics processing units, GPU, and / or one or more signal processors, in particular one or more digital signal processors, DSP. The computing unit can also include a physical or virtual cluster of computers or others of the mentioned units.

[0056] A computing unit can also include one or more hardware and / or software interfaces and / or one or more storage units. Therein, a storage unit can be designed as a volatile data memory, for example as a dynamic random access memory, DRAM, or static random access memory, SRAM, or as a non-volatile data memory, for example as a read-only memory, ROM, as a programmable read-only memory, PROM, as an erasable programmable read-only memory, EPROM, as an electrically erasable programmable read-only memory, EEPROM, as a flash memory or flash EEPROM, as a ferroelectric random access memory, FRAM, as a magnetoresistive random access memory, MRAM, or as a phase-change random access memory, PCRAM.

[0057] Further features of the invention are apparent from the claims, the figures and the description of figures. The features and feature combinations mentioned above in the description as well as the features and feature combinations mentioned below in the description of figures and / or shown in the figures alone are usable not only in the respectively specified combination, but also in other combinations without departing from the scope of the invention. Thus, implementations are also to be considered as encompassed and disclosed by the invention, which are not explicitly shown in the figures and explained, but arise from and can be generated by separated feature combinations from the explained implementations. Implementations and feature combinations are also to be considered as disclosed, which thus do not comprise all of the features of an originally formulated independent claim. Moreover, implementations and feature combinations are to be considered as disclosed, in particular by the implementations set out above, which extend beyond or deviate from the feature combinations set out in the relations of the claims.

[0058] There show:

[0059] Fig. 1 a schematic side view of an embodiment of a motor vehicle with an embodiment of an electronic computing device;

[0060] Fig. 2 a schematic exploded representation of an embodiment of the electronic computing device; and2024PF01123

[0061] 10

[0062] Fig. 3 a schematic sectional view of an embodiment of an electronic computing device.

[0063] In the figures, identical or functionally identical elements are provided with identical reference character.

[0064] Fig. 1 shows a schematic side view of an embodiment of a motor vehicle 1. Therein, the motor vehicle 1 can for example be at least partially automated or also fully automated. It is understood that the motor vehicle 1 can also be manually operated.

[0065] In the following embodiment, the motor vehicle 1 comprises at least one electronic computing device 2. The electronic computing device 2 comprises a plurality of electronic components 3 (Fig. 2), which generate heat in the operation. Hereto, it is in particular provided that the electronic computing device 2 comprises at least one cooling device 4. Hereto, the cooling device 4 in particular comprises at least one cooling element 5 as well as a pump 6. Therein, the pump 6 can transfer a cooling fluid 7 to the cooling element 5 and thus realize cooling of the electronic computing device 2, in particular of a circuit board 8, 9 (Fig. 2).

[0066] Therein, Fig. 1 in particular shows that the pump 6 can for example be arranged outside of a housing 10, 11 of the electronic computing device 2.

[0067] Fig. 2 shows a schematic exploded representation of an embodiment of the electronic computing device 2. In the following embodiment, a first housing part 10 and a second housing part 11 are shown. Further, a first circuit board 8 as well as a second circuit board 9 are shown.

[0068] Further, Fig. 2 shows a cooling plate 12, 13, which can in particular be formed of a first part 12 and a second part 13 in the following embodiment. The first part 12 can for example be closed via a first lid element 14 and the second part 13 can be closed via a second lid element 15. Furthermore, Fig. 2 shows a heat transport device 16. Further, a heat absorbing material 17 as well as a reservoir 18 are shown.2024PF01123

[0069] 11

[0070] Furthermore, Fig. 2 in particular shows a first installation space 19, presently for receiving for example the second circuit board 9, as well as a second installation space 20, presently in particular for receiving the reservoir 18.

[0071] Further, it is in particular shown that the electronic components 3 can for example be thermally tied to for example the second lid element 15 via a heat conducting adhesive 21. Furthermore, a third lid element 22 is also shown, which is in particular formed for sealing the reservoir 18.

[0072] Thus, Fig. 2 in particular shows the cooling element 5 with at least one cooling plate 12, 13, wherein the cooling plate 12, 13 is formed for passage by the cooling fluid 7. The cooling plate 12, 13 is formed for cooling a circuit board 8, 9 of the electronic computing device 2.

[0073] Therein, it is provided that a heat transport device 16 is arranged on a side of the cooling plate 12, 13, which does not adjoin to the circuit board 8, 9, wherein the heat transport device 16 is connected to the heat absorbing material 17.

[0074] In the present embodiment, the heat transport device 16 is in particular formed on a bottom side of the first part 12. Further, the heat transport device 16 is formed on a top side of the second part 13. Hereto, the second part 13 in particular shows corresponding receptacles 23 for receiving the heat transport device 16. Therein, the heat transport device 16 is in particular substantially formed of a plurality of heat pipes 24 in the following embodiment.

[0075] Therein, Fig. 2 further shows that the heat absorbing material 17 is in particular laterally formed on the cooling plate 12, 13. Therein, the heat absorbing material 17 can in particular be formed as a phase change material. Further, Fig. 2 shows that the cooling plate 12, 13 can comprise at least one fluid conducting element 25. Furthermore, a cooling structure 26, which is in particular formed meander-shaped within the cooling plate 12, 13, can in particular be provided in connection with the fluid conducting element 25.

[0076] Furthermore, Fig. 2 shows that the cooling plate 12, 13 can comprise a fluid entry opening 27 and a fluid exit opening 28. In the following embodiment, the first part 12 comprises the fluid entry opening 27 and the second part 13 comprises the fluid exit opening 28.2024PF01123

[0077] 12

[0078] Fig. 2 further shows that the cooling plate 12, 13 is formed two-part as already mentioned, and the heat transport device 16 is formed between the first part 12 and the second part 13.

[0079] Furthermore, it is in particular provided that the first part 12 and the second part 13 are fluidically connected to each other via a fluid connection 29.

[0080] In particular, it is further shown that at least the circuit board 8, 9 and the cooling element 5 are arranged in the common housing 10, 11.

[0081] Fig. 3 shows a schematic sectional view, an embodiment of the electronic computing device 2, in particular according to Fig. 2. In the present embodiment, a corresponding heat transfer 30 from the components 3 to the cooling element 5 is in particular shown.

[0082] Therein, Fig. 3 in particular shows that the first circuit board 8 and the second circuit board 9 with the high-performance components 3 are in thermal contact with the lid elements 14, 15. Therein, the cooling plate 12, 13 is configured for casting manufacture, and the production can be formed as follows: the first part 12 and the second part 13 are processed or cast with in particular internal fin or pin structures to maximize the heat dissipation. Cooling channels are correspondingly closed and sealed with the lid elements 14, 15, which are thermally tied to the electronic components 3. The heat transport device 16 in particular comprises five heat pipes 24 in the following embodiment, which cover the entire area between the two parts 12, 13.

[0083] The reservoir 18 next to the circuit boards 8, 9 and the cooling plate 12, 13 is filled with the heat absorbing material 17. This solution reduces the required space between the circuit boards 8, 9, which is important for circuit boards 8, 9 in high-frequency applications. A lower distance between the circuit boards 8, 9 minimizes the noise level induced by circuit board connectors.

[0084] The clearances between the electronic components 3 and the cooling plates 12, 13 and the lid elements 14, 15, respectively, are filled with thin layers of so-called TIM (thermal interface material) material, such as for example heat conducting paste, gel or thermal pads.

[0085] Therein, the arrows in particular form the heat dissipation 30 towards the heat transfer, wherein the heat flows from the hot electronic components 3 into the upper and lower2024PF01123

[0086] 13

[0087] parts 12, 13. In case of a defect of the main cooling system, the heat is transferred through the heat pipes 24 to the heat absorbing material 17, where it is correspondingly absorbed. Therein, phase change or else other heat absorbing materials can be used in this case of application.

[0088] In addition, the offset of the reservoir 18 towards the side allows that a larger volume of heat absorbing material 17 can be provided, which can be placed within the electronic computer device 2 to increase the distance between the circuit boards 8, 9 and the cooling plate 12, 13. A higher volume of heat absorbing material 17 increases the reliability of the electronic computer device 2 since more time can be provided to saturate this material.

[0089] Therein, Fig. 3 shows, as already mentioned, in particular a cross-section through the electronic computer device 2 with the cooling element 5 and the heat transport device 16. Therein, the arrows show the direction of the heat transfer. In particular, the heat transfer from the electronic components 3, which are located on the two circuit boards 8, 9, is shown. In the normal operation, the heat is dissipated by the cooling fluid 7, which flows through the channels of the parts 12, 13.

[0090] If the cooling power of the main system decreases for example due to a leakage or another failure, the heat is absorbed by the heat pipes 24, which are embedded in the two parts 12, 13. Subsequently, the thermal energy is transferred to the reservoir 18, which is filled with the heat absorbing material 17. The material for absorbing the heat has a great thermal capacity, this means that it can absorb much energy before the system overheats.

[0091] Upon reduction of the heat, since the main cooling system is for example again operative, the heat absorbing material can again perform a phase change back, such that it can again absorb heat in the future.

Claims

2024PF0112314Claims1. A cooling element (5) for a cooling device (4) of an electronic computing device (2) for a motor vehicle (1 ), with at least one cooling plate (12, 13), wherein the cooling plate (12, 13) is formed for passage by a cooling fluid (7), and wherein the cooling plate (12, 13) is formed for cooling a circuit board (8, 9) of the electronic computing device (2),characterized in thata heat transport device (16) is arranged on a side of the cooling plate (12, 13), which does not adjoin to the circuit board (8, 9), wherein the heat transport device (16) is connected to a heat absorbing material (17).

2. The cooling element (5) according to claim 1 ,characterized in thatthe heat absorbing material (17) laterally adjoins to the cooling plate (12, 13).

3. The cooling element (5) according to claim 1 or 2,characterized in thatthe heat absorbing material (17) is formed in a reservoir (18).

4. The cooling element (5) according to any one of the preceding claims, characterized in thatthe heat absorbing material (17) is a phase change material.

5. The cooling element (5) according to any one of the preceding claims, characterized in thatthe heat transport device (16) comprises at least one heat pipe (24).

6. The cooling element (5) according to any one of the preceding claims, characterized in thatthe cooling plate (12, 13) comprises at least one fluid conducting element (25).2024PF01123157. The cooling element (5) according to any one of the preceding claims, characterized in thatthe cooling plate (12, 13) comprises a cooling structure (26), which is formed meander-shaped within the cooling plate (12, 13).

8. The cooling element (5) according to any one of the preceding claims, characterized in thatthe cooling plate (12, 13) comprises a fluid entry opening (27) and a fluid exit opening (28).

9. The cooling element (5) according to any one of the preceding claims, characterized in thatthe cooling plate (12, 13) is formed two-part and the heat transport device (16) is formed between a first part (12) of the cooling plate (12, 13) and a second part (13) of the cooling plate (12, 13).

10. The cooling element (5) according to claim 9,characterized in thatthe first part (12) and the second part (13) are fluidically connected to each other.

11. The cooling element (5) according to claim 9 or 10,characterized in thatthe first part (13) comprises a fluid entry opening (27) and the second part (13) comprises a fluid exit opening (28).

12. The cooling element (5) according to any one of claims 9 to 11,characterized in thatthe first part (12) is formed for arranging a first circuit board (8) and the second part (13) is formed for arranging a second circuit board (9).

13. A cooling device (4) for an electronic computing device (2) with at least one cooling element (5) according to any one of claims 1 to 12 and with a pump (6) for conveying a cooling fluid (7), wherein the pump (6) is fluidically connected to the cooling element (5).2024PF011231614. An electronic computing device (2) with at least one cooling device (4) according to claim 13 and with at least one circuit board (8, 9), which is cooled by the cooling device (4).

15. The electronic computing device (2) according to claim 14,characterized in thatat least the circuit board (8, 9) and the cooling element (5) are arranged in a common housing (10 ,11).

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