Housing element for a housing of an electronic computing device, arrangement, housing arrangement as well as electronic computing device

Abstract

The invention relates to a housing element (7) for a housing (6) of an electronic computing device (2), wherein an inner side of the housing element (7) is associated with at least one electronic component (4, 5) of the electronic computing device (2), which generates heat in the operation, and with an outer side (10), which comprises a first cooling structure (16) with at least one first air guiding element (18) at least in certain areas, wherein the outer side (10) additionally comprises a cooler receiving area (13) for receiving a cooling device (11), and wherein the cooler receiving area (13) adjoins to the first cooling structure (16) and the at least one first air guiding element (18) is in operative connection with the cooler receiving area (13), wherein the housing element (7) comprises a second cooling structure (19) at least in certain areas, which is fluidically in operative connection with the first cooling structure (16) independently of the cooler receiving area (13). Further, the invention relates to an arrangement (15), to a housing (6), to a housing arrangement (14) as well to an electronic computing device (2).

Description

[0001] 2024PF01066

[0002] 1

[0003] Housing element for a housing of an electronic computing device, arrangement, housing arrangement as well as electronic computing device

[0004] The following invention relates to a housing element for a housing of an electronic computing device, wherein an inner side of the housing element is associated with at least one electronic component, which generates heat in the operation, and with an outer side, which comprises a first cooling structure with at least one first air guiding element at least in certain areas, wherein the outer side additionally comprises a cooler receiving area for receiving a cooling device, and wherein the cooler receiving area adjoins to the cooling structure and the at least one first air guiding element is in operative connection with the cooler receiving area. Further, the invention relates to an arrangement for a housing, to a housing with at least one housing element, to a housing arrangement for an electronic computing device as well as to an electronic computing device.

[0005] In a design of a circuit board, on which electronic components can in particular be arranged, which generate heat in the operation, it is possibly not possible for a corresponding planning team due to the PIN configuration to transfer all of the components with high current consumption into a corresponding cooling zone of the housing. Some components with high current consumption can remain in the corners of the circuit board. In conventional fin cooling constructions according to the prior art, it is not possible to reach these corners via the cooling and thus to perform a heat dissipation.

[0006] In the prior art, the problems are solved in that a plurality of coolers, in particular in the form of cooling fans, is for example employed and more powerful cooling devices are used, respectively.

[0007] US 2019335621 A1 describes a heat dissipation device with a generally rectangular cooling plate of metal, wherein the metal plate comprises first fixing means for fixing a first printed circuit board on its top side, which are provided to bring at least one heat generating zone of the first printed circuit board into contact with the top side of the plate, and wherein the metal plate comprises second fixing means for fixing the second printed circuit board on its bottom side, which are provided to bring at least one heat generating zone of the second printed circuit board into contact with the bottom side of the plate.2024PF01066

[0008] 2

[0009] It is the object of the present invention to provide a housing element, an arrangement, a housing, a housing arrangement as well as an electronic computing device, by means of which an improved operation of the electronic computing device is allowed.

[0010] This object is solved by a housing element, an arrangement, a housing, a housing arrangement as well as an electronic computing device according to the independent claims. Advantageous forms of configuration are specified in the dependent claims.

[0011] An aspect of the invention relates to a housing element for a housing of an electronic computing device, wherein an inner side of the housing element is associated with at least one electronic component of the electronic computing device, which generates heat in the operation, and with an outer side, which comprises a first cooling structure with at least one first air guiding element at least in certain areas, wherein the outer side additionally comprises a cooler receiving area for receiving a cooling device, and wherein the cooling receiving area adjoins to the cooling structure and the at least one first air guiding element is in operative connection with the cooler receiving area.

[0012] Therein, it is provided that the housing element comprises a second cooling structure at least in certain areas, which is fluidically in operative connection with the first cooling structure independently of the cooler receiving area.

[0013] Thus, the housing element is in particular provided such that it comprises the first cooling structure, which is directly in operative connection with a cooler, in particular in the form of a fan, capable of being arranged on the cooler receiving area. The second cooling structure is arranged on the top side / outer side of the housing element such that it can only be indirectly also cooled, in particular based on a Venturi effect formed by the first cooling structure and the second cooling structure. Based on the arrangement of the first cooling structure in operative connection with the second cooling structure, a negative pressure is in particular generated in an effective range, which sucks air via the second cooling structure, such that the second cooling structure is also correspondingly aircooled.

[0014] Therein, it is in particular provided that the cooling structures are open towards the top and thus allow a heat dissipation. The air guiding element is substantially channel-shaped and laterally delimited by two cooling fins.2024PF01066

[0015] 3

[0016] The electronic component can for example be computing elements of the electronic computing device, which can perform corresponding computing tasks. They generate heat in the operation, which has to be dissipated, since an impairment of the computing power or even destruction of the electronic component can otherwise occur. By the proposed construction of the housing element, a first area can for example now be provided, in which a first electronic component is arranged, and which can be correspondingly cooled via the first cooling structure. By the second cooling structure, it is now allowed that a further electronic component can also be arranged below this cooling structure, which generates heat in the operation, and thus the second electronic component can also be correspondingly cooled.

[0017] Therein, the Venturi effect formed by the first cooling structure and the second cooling structure describes a physical phenomenon, which is applied in the fluid mechanics and aerodynamics. The Venturi effect occurs if a fluid, in particular for example air, flows through a narrow channel or a nozzle, which is constricted at a location. At the constriction, the flow velocity of the fluid increases, while the pressure decreases at the same time. This is due to the fact that the fluid is pressed through the narrower channel or the nozzle, which results in an acceleration of the fluid. According to the Bernoulli's principle, which describes the relation between the velocity and pressure in a fluid, the increase of the flow velocity results in a decrease of the pressure.

[0018] According to an advantageous form of configuration, the housing element substantially has a rectangular surface, wherein the second cooling structure is formed on at least one corner of the surface. Thus, the second cooling structure can in particular be arranged in an area, where a cooling can only be very difficultly implemented according to the prior art. By the generated Venturi effect, the corner of the substantially rectangular housing element can now also be reliably cooled such that corresponding electronic components of the electronic computing device for example on the circuit board can be arranged in this area too. Thus, the reliable operation of the electronic computing device can be realized.

[0019] A further advantageous form of configuration provides that the second cooling structure comprises at least one second air guiding element, which is in operative connection with the first air guiding element. Thus, the second air guiding element is in particular in operative connection with the first air guiding element, such that air can be correspondingly guided from the second air guiding element to the first air guiding element via the Venturi effect, whereby a corresponding cooling can be realized on the second cooling structure.2024PF01066

[0020] 4

[0021] It has further proven to be advantageous if at least the second air guiding element is channel-like formed. In particular, the second air guiding element is formed substantially U-shaped and for example opened on a top side and delimited by cooling fins. By the channel-like structure of the second air guiding element, the air can thus be reliably guided over the surface of the housing element and in particular be brought into operative connection with the first air guiding element of the first cooling structure. Thus, a cooling of the second electronic component and thus an improvement of the electronic computing device can be realized in simple manner.

[0022] It has further proven to be advantageous if an angle of less than 90 degrees is formed between the first air guiding element and the second air guiding element. In particular, the angle is to be considered substantially to the flow direction of the air, which is generated by the cooler device. For example, an angle of one degree to 89 degrees can be formed. Thereby, it is allowed that the Venturi effect can be reliably generated.

[0023] It has further proven to be advantageous if an angle of 45 degrees is formed between the first air guiding element and the second air guiding element. In particular, the angle of 45 degrees allows a large area for the second cooling structure, in which a cooling can be performed. Further, the Venturi effect can also be correspondingly advantageously generated with the angle of 45 degrees. Thus, the Venturi effect can be generated and a large surface can be additionally cooled via the second cooling structure at the same time.

[0024] Further, it has proven to be advantageous if the second cooling structure tapers towards the first cooling structure. Thus, the channel of the second cooling structure can in particular taper in the area of the transition between the first cooling structure to the second cooling structure, whereby the flow velocity can be correspondingly increased in the transition area. Thus, the Venturi effect can be very advantageously generated.

[0025] In a further advantageous form of configuration, it is provided that the first cooling structure tapers in an area, in which the second cooling structure is in operative connection, at least in certain areas viewed in an air guiding direction from the cooler receiving area. Thus, a corresponding fluid velocity of the air can also be increased in the first cooling structure, whereby a corresponding negative pressure is generated in the transition area such that air can be advantageously sucked via the second cooling structure, whereby an improved cooling can occur in the area of the second cooling structure.2024PF01066

[0026] 5

[0027] According to a further advantageous form of configuration, it is provided that the housing element is formed for generating a Venturi effect in the area of the operative connection between the first cooling structure and the second cooling structure. In particular, the generation of the Venturi effect, as already mentioned, is effected by a generation of a negative pressure in the area of the transition from the first cooling structure to the second cooling structure, which can also be referred to as effective range. Thus, the Venturi effect can be generated in the effective range such that air can be correspondingly sucked via the second cooling structure, which results in a cooling in the corresponding area of the second cooling structure.

[0028] It has further proven to be advantageous if the first cooling structure is associated with at least one first electronic component, which generates heat in the operation, and the second cooling structure is associated with at least one second electronic component, which generates heat in the operation. Namely, the housing element in particular comprises at least the first electronic component on the inner side, which is opposing the first cooling structure. It is understood that multiple electronic components can also be arranged here. On the inner side, which is in particular formed opposing the second cooling structure, a second electronic component can in particular be arranged, which also generates heat in the operation. Thus, it is allowed that an electronic component, which generates heat, is reliably accommodated also in the area of the second cooling structure, in particular in a corner of the housing element, wherein the heat can be reliably correspondingly removed via the second cooling structure. Therein, the electronic components can be operated depending on or independently of each other.

[0029] In a further advantageous form of configuration, it is provided that the first cooling structure comprises a plurality of air guiding elements, which extend substantially parallel viewed in an air guiding direction from the cooler receiving area. By the air guiding elements extending parallel, in particular delimited by parallel cooling fins, it is thus allowed that the heat can be reliably absorbed from the underlying electronic components in that the surface is increased. Furthermore, a corresponding air guiding direction can be generated, which allows a reliable discharge of the heated air. Thus, a reliable first cooling structure is provided, which allows an improved operation of the electronic computing device.

[0030] A further aspect of the invention relates to an arrangement for a housing with at least one housing element according to the preceding aspect and with a cooling device, wherein the2024PF01066

[0031] 6

[0032] cooling device is arranged on the cooler receiving area. Therein, the cooling device can in particular be formed in the form of a fan. Therein, the cooling device is arranged such that it generates an airflow across the housing element, whereby a corresponding heat dissipation of the underlying electronic components can be realized.

[0033] A still further aspect of the invention relates to a housing with at least a first housing element according to the preceding aspect and with a second housing element, wherein a receiving space for receiving at least one electronic component, which generates heat in the operation, is formed by the first housing element and the second housing element in the assembled state of the housing elements. Therein, the at least one electronic component can preferably be arranged on a circuit board. In other words, the housing forms an interior space, in which the circuit board with the electronic component can be formed.

[0034] Further, the invention also relates to a housing arrangement for an electronic computing device with at least a housing according to the preceding aspect and with a cooling device, wherein the cooling device is arranged on the cooler receiving area.

[0035] A still further aspect of the invention relates to an electronic computing device with at least a housing according to the preceding aspect or with a housing arrangement according to the preceding aspect and with at least one electronic component, which generates heat in the operation.

[0036] Therein, the electronic computing device can be preferably formed for a motor vehicle. In other words, the electronic computing device can be formed in a motor vehicle and for example comprise corresponding computing units for an at least partially assisted operation or fully assisted operation.

[0037] Therein, a still further aspect relates to a motor vehicle with an electronic computing device according to the preceding aspect.

[0038] Advantageous forms of configuration of the housing element are to be regarded as advantageous forms of configuration of the arrangement, of the housing, of the housing arrangement, of the electronic computing device as well as of the motor vehicle.

[0039] In the present disclosure, a computing unit / electronic computing device can for example be understood as a data processing apparatus with processing circuits as the electronic2024PF01066

[0040] 7

[0041] component. Thus, a computing unit can perform computing operations to process data. The computing operations can also include indexed accesses to a data structure, for example a look-up table, LUT.

[0042] In particular, a computing unit can include one or more computers, one or more microcontrollers and / or one or more integrated circuits, for example one or more application-specific integrated circuits, ASIC, one or more field-programmable gate arrays, FPGA, and / or one or more systems on a chip, SoC. The computing unit can also include one or more processors, for example one or more microprocessors, one or more central processing units, CPU, one or more graphics processing units, GPU, and / or one or more signal processors, in particular one or more digital signal processors, DSP. The computing unit can also include a physical or virtual cluster of computers or others of the mentioned units.

[0043] A computing unit can also include one or more hardware and / or software interfaces and / or one or more storage units. Therein, a storage unit can be designed as a volatile data memory, for example as a dynamic random access memory, DRAM, or static random access memory, SRAM, or as a non-volatile data memory, for example as a read-only memory, ROM, as a programmable read-only memory, PROM, as an erasable programmable read-only memory, EPROM, as an electrically erasable programmable read-only memory, EEPROM, as a flash memory or flash EEPROM, as a ferroelectric random access memory, FRAM, as a magnetoresistive random access memory, MRAM, or as a phase-change random access memory, PCRAM.

[0044] Further features of the invention are apparent from the claims, the figures and the description of figures. The features and feature combinations mentioned above in the description as well as the features and feature combinations mentioned below in the description of figures and / or shown in the figures alone are usable not only in the respectively specified combination, but also in other combinations without departing from the scope of the invention. Thus, implementations are also to be considered as encompassed and disclosed by the invention, which are not explicitly shown in the figures and explained, but arise from and can be generated by separated feature combinations from the explained implementations. Implementations and feature combinations are also to be considered as disclosed, which thus do not comprise all of the features of an originally formulated independent claim. Moreover, implementations and feature combinations are to be considered as disclosed, in particular by the implementations set2024PF01066

[0045] 8

[0046] out above, which extend beyond or deviate from the feature combinations set out in the relations of the claims.

[0047] There show:

[0048] Fig. 1 a schematic side view of an embodiment of a motor vehicle with an embodiment of an electronic computing device;

[0049] Fig. 2 a schematic sectional view of an embodiment of an electronic computing device;

[0050] Fig. 3 a schematic top view to an embodiment of a housing element; and

[0051] Fig. 4 an enlarged view according to Fig. 3 to the housing element.

[0052] In the figures, identical or functionally identical elements are provided with identical reference characters.

[0053] Fig. 1 shows a schematic side view of an embodiment of a motor vehicle 1. Therein, the motor vehicle 1 can be formed at least partially assisted. Further, the motor vehicle 1 can also be at least partially electrically operated. The motor vehicle 1 comprises at least one electronic computing device 2. The electronic computing device 2 can be formed for different computing tasks within the motor vehicle 1. For example, the electronic computing device 2 can be formed for an assisted driving operation. Alternatively or additionally, the electronic computing device 2 can for example be formed for corresponding sensor evaluations or the like.

[0054] Fig. 2 shows a schematic side view of an embodiment of the electronic computing device 2. In the present embodiment, the electronic computing device 2 comprises at least one circuit board 3, on which a first electronic component 4 as well as a second electronic component 5 are arranged in the present embodiment. The electronic components 4, 5 in particular generate heat in the operation. It can be understood that further electronic components 4, 5 are also arranged on the circuit board 3, which in particular generate heat in the operation.2024PF01066

[0055] 9

[0056] Further, the electronic computing device 2 comprises at least one housing 6. The housing 6 can in turn be formed of a first housing element 7 and a second housing element 8. In the present embodiment, the first housing element 7 can for example be regarded as a housing top part and the second housing element 8 can be regarded as a housing bottom part. In the assembled state of the housing elements 7, 8, a receiving space 9 at least for the electronic component 4, 5 and the circuit board 3 is in particular formed.

[0057] Further, it is in particular shown that at least one cooling device 11 is formed on a top side of the first housing element 7, which is in particular formed in the form of a fan. Therein, air 12 can in particular be correspondingly sucked via the cooling device 11 and be distributed across the top side of the first housing element 7. The cooling device 11 is in turn arranged on a cooling receiving area 13 of the first housing element 7. In particular, it can be provided that a housing arrangement 14 is formed of the housing 6 and the cooling device 11. Further, it can be provided that an arrangement 15 is for example formed of the first housing element 7 and the cooling device 11.

[0058] Furthermore, Fig. 2 in particular shows that a first cooling structure 16 is formed on the first housing element 7 and in particular can be associated at least with the first electronic component 4.

[0059] Fig. 3 shows a schematic top view to the first housing element 7. Therein, Fig. 3 in particular shows that the first housing element 7 substantially has a rectangular surface. The housing element 7 can comprise a plug receiving area 17, in which a plug for the connection of further elements can for example be arranged. Further, Fig. 3 schematically shows the electronic components 4, 5 arranged below the housing element 7.

[0060] Therein, Fig. 3 in particular shows the top side, which can also be referred to as outer side 10, in a top view. On the top side, a first cooling structure 16 is in particular formed. The first cooling structure 16 comprises at least one first air guiding element 18, in the present embodiment at least four air guiding elements 18, wherein the outer side in turn comprises the cooler receiving area 13 for receiving the cooling device 11. The cooling receiving area 13 in turn adjoins to the first cooling structure 16, and the at least one first air guiding element 18 therein is in operative connection with the cooler receiving area 13.

[0061] Therein, it is provided that the housing element 7, in particular on the outer side 10, comprises a second cooling structure 19 at least in certain areas, which is fluidically in operative connection with the first cooling structure 16 independently of the cooler2024PF01066

[0062] 10

[0063] receiving area 13. Herein, an effective range 20 can in particular be defined, in which the operative connection is substantially formed and shown. In particular via the so-called Venturi effect, a corner 21 of the first housing element 7 can thus also be reliably cooled such that a heat dissipation of the second electronic component 5 in the corner 21 can be realized.

[0064] Therein, it is in particular provided that the second cooling structure 19 comprises at least one second air guiding element 22, which is in operative connection with the first air guiding element 18. Therein, the second air guiding element 22 is in particular channellike formed.

[0065] Fig. 3 further shows that the first cooling structure 16 comprises a plurality of the air guiding elements 18, which extend substantially parallel to each other viewed in an air guiding direction from the cooler receiving area 13.

[0066] Fig. 4 in turn shows an enlargement of the effective range 20. Fig. 4 in particular shows that an angle a of less than 90 degrees is formed between the first air guiding element 18 and the second air guiding element 22. In particular, Fig. 4 shows that an angle a of 45 degrees is formed between the first air guiding element 18 and the second air guiding element 22.

[0067] Furthermore, Fig. 4 shows that the second cooling structure 19 tapers towards the first cooling structure 16. Hereto, a first inlet area 23 of the second cooling structure 19 can be formed larger than a first outlet area 24 of the second cooling structure 19. Furthermore, Fig. 4 shows that the first cooling structure 16 also tapers in an area, in which the second cooling structure 19 is in operative connection, at least in certain areas viewed in the air guiding direction from the cooler receiving area 13. Hereto, a second inlet area 25 of the first cooling structure 16 can be formed larger than a second outlet area 26 of the first cooling device 16.

[0068] Thus, it is in particular provided that the airflow of the cooler device 11 generates a corresponding negative pressure in the effective range 20. The atmospheric pressure overcomes the reduced negative pressure zone in the area of the second electronic component 5 and generates an airflow through the second cooling structure 19, which is in particular referred to as Venturi effect. By this airflow, a passively cooled area above the second electronic component 5 weakly becomes an air-cooled area.

Claims

2024PF0106611Claims1. A housing element (7) for a housing (6) of an electronic computing device (2), wherein an inner side of the housing element (7) is associated with at least one electronic component (4, 5) of the electronic computing device (2), which generates heat in the operation, and with an outer side (10), which comprises a first cooling structure (16) with at least one first air guiding element (18) at least in certain areas, wherein the outer side (10) additionally comprises a cooler receiving area (13) for receiving a cooling device (11), and wherein the cooler receiving area (13) adjoins to the first cooling structure (16) and the at least one first air guiding element (18) is in operative connection with the cooler receiving area (13),characterized in thatthe housing element (7) comprises a second cooling structure (19) at least in certain areas, which is fluidically in operative connection with the first cooling structure (16) independently of the cooler receiving area (13).

2. The housing element (7) according to claim 1 ,characterized in thatthe housing element (7) substantially has a rectangular surface, wherein the second cooling structure (19) is formed on at least one corner (21) of the surface.

3. The housing element (7) according to claim 1 or 2,characterized in thatthe second cooling structure (19) comprises at least one second air guiding element (22), which is in operative connection with the first air guiding element (18).

4. The housing element (7) according to claim 3,characterized in thatat least the second air guiding element (22) is channel-like formed.

5. The housing element (7) according to claim 3 or 4,2024PF0106612characterized in thatan angle (a) of less than 90° is formed between the first air guiding element (18) and the second air guiding element (22).

6. The housing element (7) according to claim 5,characterized in thatan angle (a) of 45° is formed between the first air guiding element (18) and the second air guiding element (22).

7. The housing element (7) according to any one of the preceding claims, characterized in thatthe second cooling structure (19) tapers towards the first cooling structure (16).

8. The housing element (7) according to any one of the preceding claims, characterized in thatthe first cooling structure (16) tapers in an area, in which the second cooling structure (19) is in operative connection, at least in certain areas viewed in an air guiding direction from the cooler receiving area (13).

9. The housing element (7) according to any one of the preceding claims, characterized in thatthe housing element (7) is formed for generating a Venturi effect in the area of the operative connection between the first cooling structure (16) and the second cooling structure (21).

10. The housing element (7) according to any one of the preceding claims, characterized in thatthe first cooling structure (16) is associated with at least one first electronic component (4), which generates heat in the operation, and the second cooling structure (19) is associated with at least one second electronic component (5), which generates heat in the operation.

11. The housing element (7) according to any one of the preceding claims, characterized in that2024PF0106613the first cooling structure (16) comprises a plurality of air guiding elements (18), which extend substantially parallel viewed in an air guiding direction from the cooler receiving area (13).

12. An arrangement (15) for a housing (6) with at least one housing element (7) according to any one of claims 1 to 11 , and with a cooling device (11 ), wherein the cooling device (11) is arranged on the cooling receiving area (13).

13. A housing (6) with at least a first housing element (7) according to any one of claims 1 to 11 and with a second housing element (8), wherein a receiving space (9) for receiving at least one electronic component (4, 5), which generates heat in the operation, is formed by the first housing element (7) and the second housing element (8) in the assembled state of the housing elements (7, 8).

14. A housing arrangement (14) for an electronic computing device (2) with at least a housing (6) according to claim 13 and with a cooling device (11), wherein the cooling device (11) is arranged on the cooling receiving area (13).

15. An electronic computing device (2) with at least a housing (6) according to claim 13 or with a housing arrangement (14) according to claim 14 and with at least one electronic component (4, 5), which generates heat in the operation.

Images