4d millimeter wave radar system

Abstract

A 4D millimeter wave radar system (100) comprising: radio frequency, RF, circuitry (12) configured to generate millimeter wave electromagnetic signals, cause transmission thereof towards a target (110), and receive reflected signals; digital circuitry (14) configured to control the signal generation and process the received signals to obtain positional data of said target (110); a single printed circuit board assembly, PCBA (10), the single PCBA (10) accommodating the RF circuitry (12) and the digital circuitry (14); a multi-layer waveguide, MLW, antenna board (20) being operatively coupled to the RF circuitry (12) and configured to radiate said signals towards the target (110) via transmit antenna elements (24), and capture received signals via receive antenna elements (22); a radome (26); and a chassis (50) comprising a heat dissipation component (52) and adapted to house the single PCBA (10), the MLW antenna board (20), and the radome (26).

Description

[0001] 4D MILLIMETER WAVE RADAR SYSTEM TECHNICAL FIELD

[0002] The present invention generally relates to radar technology. More particularly, the present invention relates to a 4D millimeter wave radar system. The present invention also relates to an associated platform, digital circuitry, computer-implemented method, computer program product, and computer-readable storage medium.

[0003] BACKGROUND

[0004] 4D Millimeter wave radar systems have become integral to modem technological applications, particularly in fields requiring precise object detection and environmental mapping, such as transportation systems, robotized vehicles, manned rotorcrafts, and other systems. These radar systems employ millimeter wave electromagnetic signals to detect objects and determine positional data including e.g. their range, velocity, and angular position. The evolution from traditional radar to 4D millimeter wave radar represents an advancement that enables the capture of more detailed spatial information by incorporating elevation data alongside the conventional azimuth, range, and velocity measurements.

[0005] However, contemporary 4D radar systems face limitations, such as insufficient detection range and challenges in accurately measuring angular elevation due to for example a limited number of antenna elements or radar integrated circuits in vertical dimensions. Moreover, limitations in the dynamic range (mainlobe-to-sidelobe ratio) are present due to a limited number of radar integrated circuits. These limitations can lead to issues involving false detections, missed objects, and difficulties in distinguishing between different targets, particularly in dynamic or cluttered environments.

[0006] It is in light of the observations above and others that the present inventors are herein suggesting one or more improvements to the prior art.

[0007] SUMMARY

[0008] The present inventors have made valuable technical insights to solve or at least mitigate one or more of the challenges referred to in the background section. These insights will be presented as inventive aspects in the detailed description section and the drawings. The list of inventive aspects is not to be seen as exhaustive but rather a summary of particularly beneficial inventive aspects. Generally, all terms used herein

[0009] W195490001are to be interpreted according to their ordinary meaning in the technical field, unless explicitly defined otherwise herein.

[0010] In a first aspect of this disclosure there is provided a 4D millimeter wave radar system comprising: radio frequency, RF, circuitry configured to generate millimeter wave electromagnetic signals, cause transmission of said signals towards a target, and receive said signals in response to a reflection of said signals by the target; digital circuitry configured to control the signal generation of the RF circuitry, and process the received signals to obtain positional data pertaining to said target; a single printed circuit board assembly, PCB A, the single PCBA accommodating the RF circuitry and the digital circuitry; a multi-layer waveguide, MLW, antenna board comprising a plurality of receive antenna elements and transmit antenna elements, the MLW antenna board being operatively coupled to the RF circuitry, wherein the MLW antenna board is configured to radiate said signals towards the target via the transmit antenna elements, and capture said received signals via the receive antenna elements; a radome, wherein the MLW antenna board faces an inner surface of the radome; and a chassis comprising a heat dissipation component, wherein the chassis is adapted to house the single PCBA, the MLW antenna board, and the radome.

[0011] The first aspect of the disclosure may address limitations of prior art 4D millimeter wave radar systems by integrating both RF and digital circuitry onto a single PCBA. A technical benefit may include reduced physical footprint and simplified manufacturing, enhancing signal integrity by eliminating inter-board signal transmission, while enabling precise control and coordination of RF signal generation and digital processing for near-real-time data processing and improved target detection accuracy. This approach can enhance the ability to differentiate between target types, reducing false positives and ensuring critical detections, particularly in safety-related applications like autonomous driving, thereby streamlining architecture, reducing failure points, and enhancing system reliability and performance.

[0012] In some examples, the RF circuitry and the digital circuitry are physically affixed to the single PCBA. A technical benefit may include enhanced structural integrity and reduced signal loss.

[0013] In some examples, the RF circuitry is affixed to a front side of the single PCBA facing the MLW antenna board, and the digital circuitry is affixed to a rear side of the single PCBA, opposite the front side. A technical benefit may include improved spatial arrangement for efficient signal flow and processing.

[0014] W195490001In some examples, the MLW antenna board is a dual routing layer antenna board. A technical benefit may include improved signal routing and reduced electromagnetic interference, leading to higher transmit power and improved signal reception.

[0015] In some examples, the MLW antenna board is made of copper or dielectric plastic. A technical benefit may include superior conductivity for heat management or reduced signal attenuation.

[0016] In some examples, the radome is made of a thermoplastic and has a substantially rectangular shape. A technical benefit may include lightweight design and durability.

[0017] In some examples, the 4D millimeter wave radar system further comprises a spacer element arranged between the single PCBA and the MLW antenna board, the spacer element comprising a plurality of pins arranged in a predefined pattern. A technical benefit may include improved signal matching, mechanical stability and thermal management.

[0018] In some examples, the 4D millimeter wave radar system further comprises a first damper element arranged between a rear side of the MLW antenna board and a front side of the single PCBA. A technical benefit may include vibration reduction and enhanced component lifespan.

[0019] In some examples, the 4D millimeter wave radar system further comprises a second damper element arranged between a rear portion of the chassis and the single PCBA. A technical benefit may include vibration reduction and enhanced component lifespan.

[0020] In some examples, the heat dissipation component is arranged on a rear side of a rear portion of the chassis. A technical benefit may include effective thermal management and prevention of overheating.

[0021] In some examples, the chassis further comprises a mount adapted to mount the 4D millimeter wave radar system onto a target surface. A technical benefit may include easy installation and secure attachment.

[0022] In some examples, the target surface is a surface of a platform, the system being mounted to said platform via the mount. A technical benefit may include versatile integration into various platforms.

[0023] In some examples, the positional data pertaining to the target includes distance data, angular azimuth data, angular elevation data, velocity data, and signal intensity

[0024] W195490001data. A technical benefit may include comprehensive situational awareness and precise target tracking.

[0025] In a second aspect of this disclosure there is provided a platform comprising the 4D millimeter wave radar system of the first aspect.

[0026] In a third aspect of this disclosure there is provided digital circuitry accommodated with RF circuitry at a single PCBA of the 4D millimeter wave radar system of the first aspect, the digital circuitry being configured to control the RF circuitry to generate millimeter wave electromagnetic signals; and process said signals received at the RF circuitry to obtain positional data pertaining to a target.

[0027] In a fourth aspect of this disclosure there is provided a computer-implemented method for controlling the 4D millimeter wave radar system of the first aspect, comprising: controlling the RF circuitry to generate millimeter wave electromagnetic signals; and processing said signals received at the RF circuitry to obtain positional data pertaining to said target. The fourth aspect of the disclosure may seek to solve problems related to signal integrity and system integration by reducing the physical footprint and complexity of radar systems. A technical benefit may include enhanced signal processing and reliability, providing improved accuracy and efficiency over the prior art.

[0028] In a fifth aspect of this disclosure there is provided a computer program product comprising program code for performing, when executed by digital circuitry, the computer-implemented method of the fourth aspect.

[0029] In a sixth aspect of this disclosure there is provided a non-transitory computer-readable storage medium comprising instructions, which when executed by digital circuitry, cause the digital circuitry to perform the computer-implemented method of the fourth aspect.

[0030] The second to sixth aspects may address a similar problem as the first aspect, and may provide similar advantages. Moreover, the fifth and sixth aspects of the disclosure may seek to enable new 4D millimeter wave radar systems and / or legacy 4D millimeter wave radar systems to be conveniently configured, by software installation / update, to solve problems addressed by the first aspect and provide similar advantages.

[0031] Other aspects, objectives, features and advantages of the inventive aspects will appear from the following detailed disclosure as well as from the claims and the drawings. Generally, all terms used herein are to be interpreted according to their ordinary meaning in the technical field, unless explicitly defined otherwise herein.

[0032] W195490001It should be emphasized that the term “comprises / comprising” when used in this specification is taken to specify the presence of stated features, integers, steps, or components, but does not preclude the presence or addition of one or more other features, integers, steps, components, or groups thereof. All terms used in the claims are to be interpreted according to their ordinary meaning in the technical field, unless explicitly defined otherwise herein. All references to "a / an / the [element, device, component, means, step, etc.]" are to be interpreted openly as referring to at least one instance of the element, device, component, means, step, etc., unless explicitly stated otherwise. The steps of any method disclosed herein do not have to be performed in the exact order disclosed, unless explicitly stated.

[0033] Expressions like “[something] is configured for... [performing activity]” or “[something] is configured to ... [perform activity]” will include typical cases where a computerized “something” (having one or more controllers, processing units, programmable circuitry, etc.) executes software or firmware installed in the computerized “something”, wherein the execution occurs in order to perform the activity in question.

[0034] BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The foregoing will be apparent from the following more particular description of the example embodiments, as illustrated in the accompanying drawings. The drawings are not necessarily to scale, emphasis instead being placed upon illustrating the example embodiments.

[0036] FIG. 1 shows an exemplary schematic block diagram of components included in a 4D millimeter wave radar system according to an example.

[0037] FIG. 2A shows an exemplary azimuth clearance of a 4D millimeter wave radar system according to an example.

[0038] FIG. 2B shows an exemplary elevation clearance of a 4D millimeter wave radar system according to an example.

[0039] FIG. 3 shows an exemplary exploded view of a 4D millimeter wave radar system according to an example.

[0040] FIG. 4 shows an exemplary exploded view of a 4D millimeter wave radar system according to an example.

[0041] FIG. 5 A shows an exemplary rear side of an MLW antenna board according to an example.

[0042] W195490001FIG. 5B shows an exemplary front side of an MLW antenna board according to an example.

[0043] FIG. 6A shows an exemplary rear side of a rear portion of a chassis and a heat dissipation component according to an example.

[0044] FIG. 6B shows an exemplary front side of a rear portion of a chassis and a heat dissipation component according to an example.

[0045] FIG. 7A shows an exemplary front side of a front portion of a chassis and a front side of a radome according to an example.

[0046] FIG. 7B shows an exemplary rear side of a front portion of a chassis and a rear side of a radome according to an example.

[0047] FIG. 8 shows an exemplary schematic block diagram of components included in digital circuitry and radio-frequency circuitry of a single printed circuit board assembly according to an example.

[0048] FIG. 9 is a flowchart diagram of exemplary functional steps performable by a 4D millimeter wave radar system according to an example.

[0049] FIG. 10 is an exemplary computer-implemented method for controlling a 4D millimeter wave radar system according to an example.

[0050] FIG. 11 is an exemplary non-transitory computer-readable storage medium according to an example.

[0051] DETAILED DESCRIPTION OF EMBODIMENTS

[0052] Inventive aspects and embodiments of the invention will now be described with reference to the accompanying drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. The terminology used in the detailed description of the particular embodiments illustrated in the accompanying drawings is not intended to be limiting of the invention. In the drawings, like reference signs refer to like elements.

[0053] The present disclosure introduces a 4D millimeter wave radar system that integrates both radio frequency (RF) and digital circuitry onto a single printed circuit board assembly (PCBA), addressing limitations of prior art systems. This integration reduces the system’s physical footprint, simplifying manufacturing and enhancing signal integrity by eliminating the need for inter-board signal transmission. The single PCBA design enables precise control and coordination of RF signal generation and

[0054] W195490001digital processing, ensuring at least near-real-time data processing and improving target detection accuracy. The integrated approach also enhances the ability to differentiate between target types, reducing false positives and ensuring detections, which can be important for applications like autonomous driving and ADAS. Overall, this design may streamline architecture, reduce failure points, and enhance system reliability.

[0055] With reference to FIG. 1, a schematic block diagram of a 4D millimeter wave radar system 100 (or just “system 100” in short) is shown. The system 100 is an advanced detection and tracking technology that operates by emitting millimeter wave electromagnetic signals. Here, “4D” refers to the capability of the system 100 to capture spatial data in four dimensions: range, velocity, azimuth, and elevation. This enables precise determination of positions and movements of objects in a three-dimensional space with the added dimension of time. The term “millimeter” pertains to the wavelength of the electromagnetic signals used by the system 100, typically within the 30-300 GHz frequency range. These shorter wavelengths allow for high-resolution detection, and is used for distinguishing fine details in complex environments. Radar technology is an acronym for technology that is based on Radio Detection and Ranging, and uses transmitted and reflected radio waves to detect and locate objects. The radar system transmits signals that bounce off objects and return to the source, providing data about distance, speed, and direction. In contexts herein, the 4D millimeter wave radar system 100 is therefore a set of interconnected components working together to carry out spatial detection.

[0056] The system 100 can be integrated into, or mounted to via a mount 54, any suitable platform 120, typically at a target surface 125 thereof. The platform 120 can be movable, such as vehicles or aircraft, or stationary, like infrastructure installations. The platform 120 can be manned or unmanned. Examples of platforms and applications include transportation platforms (e.g., autonomous vehicles and advanced driverassistance systems), Intelligent Transport Systems (ITS), rotorcrafts, watercrafts, constructional equipment (e.g., excavators, power equipment, gantries), and security systems (e.g., for intruder detection or safety monitoring). Many other suitable application areas can be envisaged by the skilled person where spatial detection can be useful.

[0057] The system 100 comprises radio frequency (RF) circuitry 12. The term “circuitry” as used herein refers to a network of interconnected electronic components designed to perform specific functions by controlling the flow of electrical signals. The RF circuitry 12 is responsible for generating, transmitting, and receiving millimeter

[0058] W195490001wave electromagnetic signals. The RF circuitry 12 is configured to convert electrical signals into high-frequency radio waves, and vice versa. The RF circuitry 12 ensures that signals are transmitted accurately towards a target and can effectively receive the reflected waves.

[0059] Further included in the system 100 is digital circuitry 14, tasked with controlling the RF signal generation and processing the received signals. It translates the analog signals from the RF circuitry 12 into digital data that can be analyzed to extract positional and movement information of a target. This processing enables real-time detection and tracking, which is used for precise spatial awareness and deci si on -making.

[0060] The RF circuitry 12 and the digital circuitry 14 are in the system 100 housed in a single printed circuit board assembly (PCB A). By integrating these components onto a single assembly (rather than for example having two board assemblies with communication mechanisms therebetween), the system 100 may benefit from reduced size and complexity, which simplifies manufacturing and assembly processes. This integration can also enhance signal integrity by minimizing losses that occur with interboard connections, leading to improved performance and reliability. The single PCBA design is advantageous as it streamlines the architecture, reduces potential failure points, and ensures precise synchronization between RF and digital operations.

[0061] The system 100 includes a multi-layer waveguide (MLW) antenna board 20, designed to guide electromagnetic waves through multiple layers to radiating elements or slits where the waves leave the system 100. This board comprises multiple receive and transmit antenna elements and is operatively coupled with the RF circuitry 12 to radiate signals towards the target and capture the reflected signals. The operative connection between the RF circuitry 12 and the MLW antenna board 20 is for signal transmission and reception. This connection is typically achieved through wired methods, specifically using dual microstrip lines. These microstrip lines provide a reliable and efficient pathway for RF signal propagation, ensuring low loss and a maintained signal integrity. The use of dual microstrip lines can allow for precise control over signal direction and quality, improving the performance of the system 100 by facilitating seamless communication between the RF circuitry and the antenna elements. Other connection methods could potentially be envisaged, using wired or wireless techniques.

[0062] Preferably, the MLW antenna board 20 comprises a dual-layer routing design, where the wave routing occurs in two separate layers that are not in contact with each other. This dual-layer routing configuration may accommodate antenna elements, as a

[0063] W195490001single-layer design would be insufficient. While three-layer designs could be considered, they would increase costs and the layers would not be laser-weldable. The dual-layer routing approach thus allows for compact and integrated design, preferably including laser-welded antenna sheets to enhance structural integrity. The welded approach also avoids the use of screws that may untighten during operation after time, and instead provides a secure fit regardless of aging, temperature, vibrations, etc., occurring during operation.

[0064] The dual-layer routing design may be welded together, or in some optional examples affixed to the single PCBA using screws or other fasteners.

[0065] Each layer of the MLW antenna board 20 serves specific functions such as signal transmission, reception, routing, and isolation, which improves signal integrity and reduces interference. The transmit elements focus on radiating signals, ensuring a strong and directed wavefront, while the receive elements are optimized to capture reflected signals with high sensitivity and accuracy. This separation and organization within the layers enable efficient processing of high-frequency signals with minimal loss.

[0066] The system 100 further comprises a radome 26. The radome 26 is a protective enclosure housing the MLW antenna board 20. The radome 26 is designed to shield the sensitive receive / transmit antenna elements from environmental factors such as weather and debris while allowing the transmission and reception of radio signals. The radome 26 can ensure that the system 100 remains operational and effective in various conditions without compromising signal quality.

[0067] The radome 26 may be positioned at a predetermined distance from the MLW antenna board 20 to maintain signal integrity, the distance typically ranging from a few millimeters to several centimeters. The radome 26 can be of a specific thickness suited to the operational frequency, ensuring reduced signal loss. The design of the radome 26 may include a support structure in a middle section to enhance stability. Additionally, the radome 26 can snap into place, providing secure attachment without the need for screws. Additionally, using a plastic material with low electrical conduction and low electrical loss for the radome 26, such as PTFE (polytetrafluoroethylene), assists in preserving signal quality.

[0068] The radome 26 further includes a set of pins arranged generally in a middle or center area. These pins are structural elements used to enhance the rigidity of the radome and minimize vibrations that could affect the performance of the system 100. The arrangement at the central area may assist in distributing structural integrity

[0069] W195490001evenly, reducing the likelihood of flexing or bending during operation. The number of pins can vary depending on the design requirements. For example, plastic pins could be used to avoid interference with the radar signals while still providing the necessary support. These pins serve as internal braces that help maintain the shape of the radome 26, ensuring that it remains stable and secure even under mechanical stress or environmental conditions.

[0070] As a structural framework supporting the components of the system 100, e.g., the single PCBA 10, the MLW antenna board 20, and the radome 26, a chassis 50 is provided. The chassis 50 includes a heat dissipation component 52 to manage thermal loads and alleviate overheating. The chassis 50 provides durability and protection, maintaining the integrity and reliability of the system across different applications and environments.

[0071] While not explicitly shown, the system 100 may further comprise an at least semi-permeable membrane, for example in Gore-Tex® material. This membrane allows moisture vapor to escape while preventing liquid water from entering the system 100. By doing so, it helps maintain a dry internal environment such that condensation is prevented from accumulating inside the radar system 100. This may be important because excess moisture can lead to corrosion, electrical shorts, and degradation of electronic components.

[0072] Together, the components of the system 100 of FIG. 1 are capable of delivering high-precision detection and tracking in diverse scenarios. The integration on a single PCBA 10 for the RF circuitry 12 and digital circuitry 14 is particularly advantageous as it can offer a compact and robust solution that enhances overall system performance.

[0073] FIG. 2A illustrates an azimuth clearance of the system 100. The azimuth clearance corresponds to the range of horizontal angles — known as azimuth angles — within which the system 100 can effectively detect and track targets. These angles, denoted as ai and 012, represent the system’s 100 field of view in the horizontal plane. The azimuth clearance defines the area that the system 100 can monitor, influencing its ability to detect objects over a wide area. The indicated azimuth angle is preferably around 50 degrees, allowing the system 100 to reduce angular errors and increase the detection range.

[0074] FIG. 2B illustrates the elevation clearance of system 100, depicting the vertical angles, denoted as a.3 and ou, within which the system 100 can effectively detect and track targets. These angles a.3, ou determine the system’s 100 field of view in the vertical plane, enabling accurate measurement of the height or altitude of objects. The elevation

[0075] W195490001angle is approximately 30 degrees, although it may be reduced by some degrees. This allows the system 100 to reduce angular errors and increase the detection range. Some reduction in the field of view may be beneficial due to the presence of grating lobes (aliasing) just outside the field of view.

[0076] FIG. 3 is an exploded view of the system 100, illustrating the assembly and arrangement of its components from a mount 54, at a rear portion 50-2 of the chassis 50, to a front portion 50-1 of the chassis 50. In this view, the sides herein referred to as “front” are visualized, where it should be understood that the sides herein referred to as “rear” are the opposite of those shown here.

[0077] The chassis 50 includes two portions, the rear 50-2 and front 50-1 portions, connectable to one another such that the other components of the system 100 are sandwiched between the portions 50-1, 50-2. Each portion 50-1, 50-2 of the chassis 50 includes a respective rear and front side. The rear side of the rear portion 50-2 faces the mount 54, the front side of the rear portion 50-2 faces the rear side of the single PCBA 10, the rear side of the front portion 50-1 faces the front side of the MLW antenna board 20, and the front side of the front portion 50-1 is the front of the system 100 through which millimeter waves are transferred via the radome 26.

[0078] Starting from the rear portion 50-2, a connector 55 is shown. The connector 55 is a hybrid type Amphenol Netbridge+ with additional 6 power / signal pins. It facilitates multiple connections, providing CAN1 / CAN-FD and CAN2 / CAN-FD for Controller Area Network (CAN) communication, as well as Ethernet / Automotive Single Pair Ethernet 1000BASE-T1 for high-speed data transfer. The connector supports a power supply range of 9-32V with a maximum of 25W. The pin configuration includes Pinl / MDI_P and Pin2 / MDI_N for automotive Ethernet connections, Pin2 / CAN1_N and Pin4 / CAN1_P for CAN1 communication, Pin5 / CAN0_N and Pin6 / CAN0_P for CANO communication, and Pin7 / GND and Pin8 / VIN for power supply. This versatile connector ensures reliable power and data connectivity.

[0079] The contactor 55 may be rigidly screwed to the chassis 50, unlike currently known connector setups, such that any permissible dimensional or alignment variations such as mechanical details can be directed upward towards the MLW antenna board 20. Hence, physical adjustments, flexibility or gaps may be managed elsewhere than at the connector 55. This reduces the bending impact on the single PCBA 10 and the MLW antenna board 20, which can enhance performance across varying temperatures.

[0080] Next, the heat dissipation component 52 is mounted on the rear side of the rear potion 50-2 of the chassis 50.

[0081] W195490001Next, the digital circuitry 14 is accommodated at the rear side of the single PCBA 10. On the front side 10-1 of the single PCBA 10, the RF circuitry 12 is accommodated. Following the RF circuitry 12, the MLW antenna board 20 is positioned, featuring antenna elements 22, 24 on its front side. Covering the MLW antenna board 20 is the radome 26, with its inner surface 26-1 facing the front side 20-1 of the MLW antenna board 20. Finally, the system 100 is enclosed by the front portion 50-1 of the chassis 50, completing the protective and structural framework of the system 100.

[0082] The accommodation of the RF circuitry 12 and the digital circuitry 14 may be a physical affixation of the circuitries 12, 14 to the single PCBA 10. Here, “physically affix” means securing these circuitries 12, 14 to the single PCBA 10 using an affixation method, such as soldering, adhesive bonding, or mechanical fastening. This could include using affixation means such as solder paste / wire, screws, clips, conductive adhesives, epoxy, or the like. This ensures a stable and reliable connection, allowing for efficient electrical communication between the components. The importance of physically affixing the circuitries 12, 14 lies in maintaining signal integrity and reducing potential failures. A secure attachment can reduce the risk of disconnections or damage caused by vibrations, thermal expansion, or mechanical stress, enhancing the overall durability and performance of the system 100.

[0083] The system 100 may comprise a spacer element 40. The spacer element 40 may be arranged between the front side 10-1 of the single PCBA 10 and the rear side of the MLW antenna board 20. This spacer element 40 is a component used to maintain a specific distance between two elements, ensuring proper alignment and mechanical stability. It may also cause RF matching between the components of the MLW antenna board 20 and aid in the thermal conductivity for heat management. Specifically, these two elements are the single PCBA 10 and the MLW antenna board 20.

[0084] The spacer element 40 may be an integral part of the MLW antenna board 20, meaning it is a built-in component of the antenna assembly, secured by screws or other fasteners. The spacer element 40 may include a plurality of pins. These pins may fixate the spacer element 40 in place. The pins may also serve as conduits for electrical or thermal connections, enhancing the mechanical and thermal integration between the single PCBA 10 and the MLW antenna board 20.

[0085] The pins are arranged to prevent placement over ground coplanar waveguide (GCPW) traces on the PCB 12. This careful arrangement may form a specific pattern known as an Electromagnetic Band Gap (EBG). EBGs are designed to suppress leakage

[0086] W195490001to neighboring ports and coplanar waveguide (CPW) lines, ensuring that electromagnetic interference is minimized and signal integrity is maintained. The particular pattern of EBGs involves strategic placement of pins to create gaps that disrupt unwanted signal propagation paths. The pattern could be a square lattice, hexagonal lattice, or concentric circular arrangement, designed to effectively suppress specific electromagnetic frequencies by disrupting wave propagation paths. While this pattern is effective, other variants can be conceived to adapt to different design requirements or constraints. The flexibility in EBG design allows for customization to address specific electromagnetic compatibility challenges, making it a versatile solution in achieving desired signal performance.

[0087] The spacer element 40 may be used for RF matching, referring to the process of optimizing impedance between RF components to reduce signal reflection and loss, thus enabling efficient signal transfer between the single PCBA 10 and the MLW antenna board 20. The single PCBA 10 may include one or more launcher elements. These are transitional structures that facilitate the movement of RF signals from the single PCBA 10 to the MLW antenna board 20, to complement the RF matching. The launchers may ensure smooth signal transition between different mediums.

[0088] In addition, the spacer element 40 may include a thermal heat dispenser element. The thermal heat dispenser element can manage heat by distributing it away from components such as electronic circuitry. This can prevent overheating and ensure stable operation. The thermal heat dispenser element may include an inlay. The inlay is an embedded material within the spacer element 40, such as copper or another material that achieves a desirable thermal conduction, which can enhance its ability to conduct and disperse heat effectively.

[0089] The spacer element 40 may be made of plastic for ensuring low or no thermal conductivity.

[0090] Overall, the spacer element 40 could serve multiple purposes: it can act as an RF matching interface to optimize signal transfer, function as a thermal management component to dissipate heat, and provide mechanical stability, for example through its pins, thereby improving performance and reliability of the system 100.

[0091] The system 100 may comprise a first damper element 30. The first damper element 30 may be positioned between the rear side of the MLW antenna board 20 and the front side 10-1 of the single PCBA 10, i.e., generally together with the spacer element 40 explained above. However, the spacer element 40 and the first damper element 30 may operate independently of one another. The first damper element 30 may

[0092] W195490001be arranged at edge portions of the MLW antenna board 20. The first damper element 30 may be a single interconnected element, be composed of a plurality of separate damper element parts, or combinations thereof.

[0093] The first damper element 30 may be made of materials like rubber, silicone, or foam, chosen for their ability to absorb and dissipate vibrational energy. These materials may cushion the components, specifically the single PCBA 10 and / or the MLW antenna board 20, reducing the transmission of vibrations that could negatively impact the performance and longevity of the system 100.

[0094] The MLW antenna board 20 may be designed to circumvent the spacer element 40, meaning it can be arranged to surround or go around the spacer element 40 without interference. This placement may assist the first damper element 30 to perform its function of minimizing vibrations while accommodating the presence and arrangement of the MLW antenna board 20.

[0095] Additionally, the system 100 can optionally include a second damper element 60 arranged between the rear portion 50-2 of the chassis 50 and the single PCBA 10. This second damper 60 can further enhance vibration control of the system 100, providing additional stability and protection for the internal components, specifically the single PCBA 10. The second damper element 60 may include similar components and functionalities as the first damper element 30.

[0096] The system 100 may also include a set of gap pads. These are thin, squared and heat-dissipating foam pads. The gap pads can be arranged in between heat-conductive parts such as the spacer element 40 and integrated circuits on the single PCBA 10. Additionally or alternatively, the gap pads can be arranged between the chassis 50 and the digital circuitry 14.

[0097] FIG. 4 is an exploded view of the system 100 from an opposite perspective of the illustration of FIG. 5. Here, the sides herein referred to as “rear” are visualized, where it should be understood that the sides herein referred to as “front” are the opposite of those shown here. Hence, FIG. 4 shows the rear side 26-2 of the radome 26, the rear side 20-2 of the MLW antenna board 20, and the rear side 10-2 of the single PCBA 10. Like in FIG. 3, these are sandwiched between a rear 50-2 and front 50-1 portion of the chassis 50.

[0098] FIG. 5 A shows the MLW antenna board 20 from a rear side 20-2, and FIG. 5B the MLW antenna board 20 from a front side 20-1. As seen in FIG. 5B, the antenna elements 22, 24 may be many and varied and distributed according to a squared pattern on the surface of the front side 20-1 of the MLW antenna board 20.

[0099] W195490001The antenna elements 22, 24 may be arranged in a 48x48 channel configuration. This dense array can allow for high-resolution signal transmission and reception, enabling high detectability and tracking of targets. The 48x48 channel setup increases the surface area used for the antenna elements 22, 24, enhancing the system’s 100 ability to process detailed spatial information. This setup is also effective in creating a large virtual MIMO (multiple input, multiple output) array. In addition, such an arrangement can allow for multiple transmitting elements to be operated simultaneously in a way that increases the likelihood of detection.

[0100] The antenna elements 22, 24 may be horizontally and vertically arranged on the surface of the MLW antenna board 20. This configuration can provide high spatial detection capabilities. Such an arrangement can support the system’s 100 ability to capture data in four dimensions, including range, velocity, azimuth, and elevation.

[0101] The MLW antenna board 20 may be made of copper or a dielectric plastic. Dielectric plastic is chosen for its low-loss properties, which can enhance the efficiency of signal transmission and reception. The use of dielectric plastic may also assist in reducing signal attenuation and improving the overall performance of antenna elements by providing a stable medium for electromagnetic wave propagation. Copper is chosen for its electrical conductivity, which can enhance the efficiency of signal transmission and reception. The use of copper may also assist in reducing signal loss and improving the overall performance of the antenna elements 22, 24 by providing a stable and reliable medium for electromagnetic wave propagation. In comparison with for example aluminum, copper can be laser-welded whereas aluminum cannot that easily, and is efficient for purposes of thermal conduction of the induced heat during signal transportation.

[0102] FIGs. 6A-B shows the heat dissipation component 52 from rear (FIG. 6A) and front (FIG. 6B) views, mounted to the rear portion 50-2 of the chassis 50. The heat dissipation component 52 may be a heatsink. The heat dissipation component 52 is designed to dissipate heat generated by the electronic components of the system 100. The heat dissipation component 52 can be made of materials with high thermal conductivity, like aluminum or copper, and may include fins or other structures to increase surface area and enhance heat dispersion. Other examples of heat dissipation components include thermal pads or fans, which may further aid in maintaining desirable operating temperatures and preventing overheating.

[0103] W195490001As further seen in FIGs. 6A-B, the chassis 50 may include an aperture 53 designed to receive the mount (not shown). The heat dissipation component 52 may also be arranged such as to accommodate for the aperture 53, as seen in the figure.

[0104] FIGs. 7A-B illustrate the front and rear sides of the front portion 50-1 of the chassis 50, respectively. The millimeter waves discussed herein are designed to be transferred via the radome 26 shown in the center of the front chassis portion 50-1. The radome 26 serves as the last component the signals encounter before leaving or entering the chassis 50. The radome 26 is designed to protect the antenna elements while allowing electromagnetic signals to pass through with low power loss and reflection, ensuring efficient transmission and reception.

[0105] The radome 26 may be made of a thermoplastic material, preferably Avient Preperm RB260 plastic, known for its desirable RF properties as well as its environmental and mechanical durability. The use of thermoplastic allows for flexibility in design and manufacturing, and it may be used entirely for the radome or in combination with other materials for specific parts that require enhanced properties.

[0106] The radome 26 may have a substantially rectangular shape. Here, “substantially” indicates that while the radome 26 is primarily rectangular, it might have slight variations or modifications to its edges or comers to fit specific design or functional requirements. In different examples, the radome could be shaped as a dome, ellipsoid, or even a polygon, depending on the application, structural mounting properties, and / or aesthetic considerations.

[0107] Advantageously, the radome 26 can be attached to the chassis without screws, using alternative methods like snap-fitting, which could involve clips or tabs that hold the radome 26 securely in place. The radome 26 might also be pressed into position using interlocking edges or grooves, or attached with adhesive strips for a seamless finish. These methods not only simplify assembly but may also eliminate visible fasteners, creating more room in the installation.

[0108] FIG. 8 shows a schematic diagram of exemplary components included in the digital circuitry 14 and in the RF circuitry 12, detailing how various units interact to process radar signals.

[0109] The digital circuitry 14 includes a safety processor 702, for example a lockstep dual core EM4. The safety processor 702 operates alongside an application processor 703, for example a dual core EM6 processor. These processors 702, 703 manage communication with external systems via e.g. CAN 704 and Ethernet 705 interfaces, and are configured to perform booting 702-1, configuration 703-1 as well as control

[0110] W195490001703-2 operations. The digital circuitry 14 includes two digital signal processors (DSPs) 706 configured to perform digital signal processing tasks, receiving input from an analog-to-digital converter (ADC) 710, which converts analog radar signals into digital data. A double data rate (DDR) memory 707 supports these processes by providing data storage and retrieval. A real-time processing unit (RPU) hardware core 708 manages real-time processing, coordinating with the DSPs and ADC for efficient data handling. A hardware scheduler (H / W) 711 ensures that tasks are executed in a timely manner, aided by a control interface 711-1, for example serial peripheral interface+ (SPI+), for coordinated operation across hardware components. The digital circuitry 14 interfaces the RF circuitry via the control interface 711-1 of the H / W scheduler 711 and the ADC 710.

[0111] The RF circuitry 12 includes a passive distribution unit 714, specifically 10 GHz line out (LO), and Tx and Rx integrated circuits 712, 713. The Tx / Rx integrated circuits 712, 713 correspond to the transmit (Tx) and receive (Rx) antenna elements 22, 24 discussed herein. The distribution unit 714 manages frequency generation, while the Tx and Rx integrated circuits 712, 713 handle the transmission and reception of radar signals, which are then processed by the digital circuitry 14. Together, these components form a cohesive system for effective radar signal processing. In this particular example the RF circuitry 12 includes two modules 712-1, 712-2, each involving 24 Tx integrated circuits 712 (i.e., 48 in total), and four modules 713-1, 713-2, 713-3, 714-4, each involving 12 Rx integrated circuits 713 (i.e., 48 in total).

[0112] Together, the RF circuitry 12 includes 48x48 receive / transmit integrated circuits, consistent with the example discussed above. However, it shall be understood that variations may apply, including any suitable number of modules with any suitable number of integrated circuits.

[0113] In addition to the integrated circuits 712, 713, the RF circuitry 12 may include one or more oscillators, mixers, amplifiers, filters, or the like. These components may be integrated into a single chip to handle specific RF tasks like signal generation, conversion, amplification, and filtering.

[0114] As indicated above, the digital circuitry 14 includes circuitry both for controlling RF and processing signals. In addition to the components discussed above, the digital circuitry 14 may include one or more microprocessor, digital signal processors (DSPs), memories, ADCs / DACs, communication interfaces. Moreover, one or more power management circuits could be coupled to the digital circuitry 14 for power supply. These can be internal to the single PCBA 10 or external circuits.

[0115] W195490001In FIG. 9, the functional steps carried out by the 4D millimeter wave radar system 100 are shown. The purpose of the operation is to obtain positioning data for a target 110. When discussing each of the steps involved in the process of obtaining positioning data, a specific example could be envisaged where the system 100 is mounted to an unmanned road vehicle, and the detection and analysis is done with respect to another road vehicle being the target 110.

[0116] The process begins with the digital circuitry 14 at step 210, where control of signal generation occurs. This can be done at predetermined frequencies, either automatically or in response to a trigger event, such as an activation of the system 100.

[0117] At step 211, the RF circuitry 12 generates millimeter wave signals based on control signals from the digital circuitry 14 received from step 210. For instance, the vehicle’s onboard system might employ a frequency band around 76-77 GHz, common for automotive radar due to its balance of range and resolution.

[0118] In step 212, the RF circuitry 12 transmits these signals, directing them toward the target 110. This can involve using directional antennas to focus the signal beam, ensuring it covers the road ahead effectively.

[0119] At step 213, the MLW antenna board 20, via its transmit elements 24 (Tx elements), radiates the signals into the environment. The layout of the elements may be desired in such a way to enable a rather substantial MIMO layout, including up to 2304 virtual channels. This can enable high resolution and dynamic range, and the possibility to perform TX beamforming. The wavefront can thus be shaped with minimal gain fluctuations over the elements, maintaining linear phase over frequency. It has a wide enough beamwidth to illuminate the region of interest effectively while providing sufficient gain, ensuring reliable detection in various conditions.

[0120] Once the signals reach the target 110, they are reflected back at step 214. The reflection occurs off the target’s 110 surfaces, such as the bumper or body panels, influenced by their shape and material, providing information on its distance and speed.

[0121] At step 215, the receive elements 22 (Rx integrated circuits) on the MLW antenna board 20 capture the reflected signals. This involves using sensitive receivers capable of picking up the weak return signals that indicate the presence and position of the target 110.

[0122] The RF circuitry 12 receives these captured signals at step 216, and at 217 the digital circuitry 14 converts them into a digital form suitable for processing using an ADC.

[0123] W195490001At 220, the processing is done, which may involve employing one or more algorithms to calculate the distance to the other object, its speed, and its angular position relative to the system 100. The processing at step 220 yields positioning data, which can include distance data, angular azimuth data, elevation data, velocity data, and signal intensity data. Hence, this processing allows the system 100 to make informed driving decisions, like maintaining a safe distance to the target 110 or adjusting speed to avoid collisions.

[0124] The distance data can be calculated as the time delay between signal transmission and reception. This may be done to determine how far away the target 110 is on the road. The angular azimuth data can be derived from the horizontal angle at which the reflected signals are received. This helps determine the lateral position of the target 110 relative to the unmanned vehicle where the system 100 is arranged, used for lane-keeping or avoiding side collisions. The angular elevation data is calculated from the vertical angle of the received signals, providing information on the height of the target 110. This is useful for recognizing vehicles on inclines or detecting overhead obstacles. The velocity data is obtained through the Doppler shift of the returned signals, measuring how fast the target 110 is moving. This can be important for any vehicle control or actuation module / algorithm, allowing the unmanned vehicle to adjust speed in response to traffic conditions. The signal intensity data reflects the strength of the returned signal, indicating the size or material of the target 110. This helps differentiate between various objects, such as distinguishing between a car and a pedestrian, thus enhancing decision-making capabilities.

[0125] FIG. 10 illustrates a computer-implemented method 200 detailing functional steps executed by the digital circuitry 14 discussed herein in controlling the 4D millimeter wave radar system 100. The method 200 includes two primary steps. At 210, the RF circuitry 12 is controlled into generating millimeter wave electromagnetic signals. The digital circuitry 14 sends control signals to ensure that the RF circuitry 12 operates at the correct frequency and timing, improving signal generation for accurate detection. The second step 220 is carried out after signal transmission and reception. This step 220 involves processing 220 the signals received at the RF circuitry 12 to extract positional data about the target 110. The digital circuitry 14 analyzes the returned signals to determine various data types, such as distance, azimuth, elevation, and velocity. The digital circuitry 14 also monitors processes of the system 100 and integrated circuits.

[0126] W195490001FIG. 11 is a schematic illustration of a (non-transitory) computer-readable (storage) medium 300 according to one exemplary embodiment. The computer-readable medium 300 may be associated with or connected to the 4D millimeter wave radar system 100 as described herein, and is capable of storing a computer program product 310. The computer-readable medium 300 in the disclosed embodiment is a memory stick, such as a Universal Serial Bus (USB) stick. The USB stick 300 comprises a housing 330 having an interface, such as a connector 340, and a memory chip 320. In the disclosed embodiment, the memory chip 320 is a flash memory, i.e., a non-volatile data storage that can be electrically erased and re-programmed. The memory chip 320 stores the computer program product 310 which is programmed with computer program code (instructions) that when loaded into a processor, will perform a method, for instance the method 200 explained with reference to FIG. 10. The USB stick 300 is arranged to be connected to and read by a reading device for loading the instructions into the processor. It should be noted that a computer-readable medium can also be other mediums such as compact discs, digital video discs, hard drives or other memory technologies commonly used. The computer program code (instructions) can also be downloaded from the computer-readable medium via a wireless interface to be loaded into the processing device.

[0127] The invention has mainly been described above with reference to a few embodiments. However, as is readily appreciated by a person skilled in the art, other embodiments than the ones disclosed above are equally possible within the scope of the invention, as defined by the appended patent claims.

[0128] W195490001

Claims

CLAIMS1. A 4D millimeter wave radar system (100) comprising:radio frequency, RF, circuitry (12) configured to generate millimeter wave electromagnetic signals, cause transmission of said signals towards a target (110), and receive said signals in response to a reflection of said signals by the target (110);digital circuitry (14) configured to control the signal generation of the RF circuitry (12), and process the received signals to obtain positional data pertaining to said target (110);a single printed circuit board assembly, PCBA (10), the single PCBA (10) accommodating the RF circuitry (12) and the digital circuitry (14);a multi-layer waveguide, MLW, antenna board (20) comprising a plurality of receive antenna elements (22) and transmit antenna elements (24), the MLW antenna board (20) being operatively coupled to the RF circuitry (12), wherein the MLW antenna board (20) is configured to radiate said signals towards the target (110) via the transmit antenna elements (24), and capture said received signals via the receive antenna elements (22);a radome (26), wherein the MLW antenna board (20) faces an inner surface (26-1) of the radome (26); anda chassis (50) comprising a heat dissipation component (52), wherein the chassis (50) is adapted to house the single PCBA (10), the MLW antenna board (20), and the radome (26).

2. The 4D millimeter wave radar system (100) of claim 1, wherein the RF circuitry (12) and the digital circuitry (14) are physically affixed to the single PCBA (10).

3. The 4D millimeter wave radar system (100) of claim 2, wherein:the RF circuitry (12) is affixed to a front side (10-1) of the single PCBA (10) facing MLW antenna board (20), andthe digital circuitry (14) is affixed to a rear side (10-2) of the single PCBA (10), opposite the front side (10-1).

4. The 4D millimeter wave radar system (100) of any preceding claim, wherein the MLW antenna board (20) is a dual routing layer antenna board.W1954900015. The 4D millimeter wave radar system (100) of any preceding claim, wherein the MLW antenna board (20) is made of copper or dielectric plastic.

6. The 4D millimeter wave radar system (100) of any preceding claim, wherein the radome (26) is made of a thermoplastic and has a substantially rectangular shape.

7. The 4D millimeter wave radar system (100) of any preceding claim, further comprising a spacer element (40) arranged between the single PCBA (10) and the MLW antenna board (20), the spacer element (40) comprising a plurality of pins (42) arranged in a predefined pattern.

8. The 4D millimeter wave radar system (100) of any preceding claim, further comprising a first damper element (30) arranged between a rear side (20-2) of the MLW antenna board (20) and a front side (10-1) of the single PCBA (10).

9. The 4D millimeter wave radar system (100) of any preceding claim, further comprising a second damper element (60) arranged between a rear portion (50-2) of the chassis (50) and the single PCBA (10).

10. The 4D millimeter wave radar system (100) of any preceding claim, wherein the heat dissipation component (52) is arranged on a rear side of a rear portion (50-2) of the chassis (50).

11. The 4D millimeter wave radar system (100) of any preceding claim, wherein the chassis (50) further comprises a mount (54) adapted to mount the 4D millimeter wave radar system (100) onto a target surface (125).

12. The 4D millimeter wave radar system (100) of claim 11, wherein the target surface (125) is a surface of a platform (120), the system (100) being mounted to said platform (120) via the mount (54).

13. The 4D millimeter wave radar system (100) of any preceding claim, wherein the positional data pertaining to the target (110) includes of distance data, angular azimuth data, angular elevation data, velocity data, and signal intensity data.W19549000114. A platform (120) comprising the 4D millimeter wave radar system (100) of any of claims 1-13.

15. Digital circuitry (14) accommodated with RF circuitry (12) at a single PCBA (10) of the 4D millimeter wave radar system (100) according to any of claims 1-13, the digital circuitry (14) being configured to:control the RF circuitry (12) to generate millimeter wave electromagnetic signals; andprocess said signals received at the RF circuitry (12) to obtain positional data pertaining to a target (110).

16. A computer-implemented method (200) for controlling the 4D millimeter wave radar system (100) of any of claims 1-13, comprising:controlling (210) the RF circuitry (12) to generate millimeter wave electromagnetic signals; andprocessing (220) said signals received at the RF circuitry (12) to obtain positional data pertaining to said target (110).

17. A computer program product comprising program code for performing, when executed by digital circuitry (14), the computer-implemented method (200) of claim 16.

18. A non-transitory computer-readable storage medium comprising instructions, which when executed by digital circuitry (14), cause the digital circuitry (14) to perform the computer-implemented method (200) of claim 16.W195490001

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