A method for cooling of a space and cooling arrangement

Abstract

The invention relates to an cooling arrangement for cooling of a cooling space (CS) within an object (VP), comprising a thermosiphon loop (20, 4, 30, 5) having a cooling fluid in operational connection with an evaporator (2) and a condenser (3), wherein a cooling media (31), in cooling tank (32) of said condenser (3) is arranged to absorb heat from said cooling media, which cooling media in turn absorbs heat from air (G1) flowing through said evaporator (2) to provide a cooled air flow (G2) by means of a fan (6) out from said evaporator (2) in said cooling space (CS), wherein said cooling media (31) at least partly includes ice and that said cooling media (31) is arranged to drive said thermosiphon loop (20, 4, 30, 5) and wherein said condenser (3) is also connected to a cooling producing circuit (7) comprising a low pressure part (72) arranged within said cooling tank (32) to produce cooling energy to said cooling media (31), said cooling producing circuit (7) also comprising a high pressure part (71) and a compressor (74) arranged outside of said cooling space (CS).

Description

[0001] A METHOD FOR COOLING OF A SPACE AND COOLING ARRANGEMENT

[0002] TECHNICAL FIELD

[0003] The present invention relates to a method and a cooling arrangement for cooling of a space, comprising the steps of providing an arrangement including a cooling media producing heat exchanger loop having a low pressure tubing in operational connection with a cooling media, which cooling media includes phase shifting, i.e. being used to make a phase shift from ice to fluid, preferably including water.

[0004] BACKGROUND ART

[0005] Many kinds of cooling arrangements are known, but most require large equipment / space and / or large amount of energy supply, making conventional methods generally costly and / or inefficient.

[0006] The above problem may be minimized by the use of a cooling media, that may be created before performing cooling, e.g. ice. The principle of thermal storage using ice, is well known since long, e.g. US433316 from 1890, disclosing a large cooling space where ice is used to cause self-draught and cool a storage space. Further there are known personal air conditioning system that may be used, for example, to cool a tent, as shown by US2005150251, wherein there is used a cooling lid that fits over a typical insulated cooler containing ice, wherein the cooling lid includes a heat transfer tower configured to transfer heat from the ice to a heat sink within the cooling lid and a fan draws air into the cooling lid, across the heat sink. This kind of air conditioners do have issues regarding handling.

[0007] Also internal melt ice-on-coil technology is widely known in industry or commercial buildings for redistributing and shaving cooling loads. In particular, ice is formed in a tank with the aid of a refrigeration system during off peak hours. Thermal energy is transferred to and from the ice by circulating brine in pipes which directly contact the ice or with water which directly contacts and melts the ice to generate cold water. In each of these applications, a pump is required to circulate fluid flow in and out of the storage zone and towards the area to be cooled. It is also known to use this principle in movable air conditioning arrangements, e.g. as disclosed in US2006225453.

[0008] From US2008104971 and US5005368 there are known air conditioning arrangements useful in first producing and storing thermal energy in the form of ice and subsequentlyusing that thermal energy for cooling, which disclose installations that are complex and therefore costly.

[0009] From W02021 / 150154 there is known an arrangement wherein some of the above problems may be solved, but which still may need improvements to actually meet market demands.

[0010] DISCLOSURE OF THE INVENTION

[0011] The object of the present invention is to eliminate or at least to minimize the problems described above. This is achieved by a cooling arrangement according to the appended claim 1.

[0012] Thanks to the invention there is provided a novel concept of a cooling arrangement where the advantages of a thermosiphon, in a very efficient manner, may be used to improve cooling of a space, by means of using a phase shifting cooling media, preferably water / ice as the basic cooling media. The novel concept may be used for various applications such as cooling spaces for foodstuff, freezing spaces for foodstuff air-conditioning and the like.

[0013] Thanks to the invention there may be many advantages. For instance, by optimizing the amount of cooling media 31 in relation to the space CS to be cooled it is feasible to keep the space CS cool at a desired temperature (e.g. 4°C) for many days, which is a special advantage if according to a preferred embodiment cooling energy is supplied by means of solar energy. Accordingly, it is possible to safely keep the cooling space at a desired temperature for many days despite not having access to sunlight.

[0014] A great advantage with the use of a thermosiphon as part of the cooling arrangement is that it is feasible to extract many times more cooling energy compared to when using a traditional heat exchanging process wherein the cooling is directly transmitted via the compressor circuit. Hence, thanks to the use of a thermosiphon and a long lasting storage of cooling energy (preferably use of ice as cooling media) a much higher efficiency may be achieved providing the advantage that it is feasible to design the total arrangement from an aspect of average need of cooling effect instead of a need to adapt to maximum power need, as if use of a traditional heat exchanging process.Further advantages of the invention will be readily understood by the person skilled in the art in view of the detailed description below.

[0015] BRIEF DESCRIPTION OF THE FIGURES

[0016] In the following the invention will be described more in detail with reference to the enclosed figures where;

[0017] Fig.1 shows a schematic view of a cooling arrangement according to a first embodiment of the invention,

[0018] Fig.2 schematically shows a side view of a second embodiment a of a condenser according to the invention,

[0019] Fig.3 shows a view from behind of the embodiment in Fig. 2,

[0020] Fig.4 shows a simplified view of the thermosiphon part, i.e. condenser and evaporator, having both a condenser and an evaporator designed according to the principles shown in Figs. 2 and 3,

[0021] Fig. 5 shows a preferred design of the cooling arrangement presenting an L-form, and Fig. 6 shows an example of a cooling storage vessel equipped with a cooling arrangement as shown in Fig. 5.

[0022] DETAILED DESCRIPTION

[0023] It is evident that for the skilled person the basic principle as described in connection with Fig. 1 may be used together with a variety of applications, wherein the size may vary depending on different needs. Of course, the larger it is made the more cooling media it may contain and consequently produce more cold air.

[0024] In Fig 1 the cooling arrangement 1 is schematically shown to be positioned within a vessel / product VP enclosing a cooling space CS. The cooling arrangement 1 includes a thermosiphon comprising an evaporator 2 and a condenser 3 connected in a heat exchange loop 20, 4, 30, 5, with a tubing containing a heat exchange fluid, e.g. water / air mixture (at under pressure) or a refrigerant such as R290 (Propane, CsHs). The tubing of the thermosiphon forms a closed loop inside the cooling arrangement 1 and a fan 6 is preferably used to force inlet air G1 (or possibly any other gas) through the evaporator 2 to thereby deliver cooled outlet air G2. The design of the thermosiphon is such that selfcirculation is achieved, which includes positioning the condenser 3 at a higher level than the evaporator 2.

[0025] The evaporator 2 includes a flange package 8A to increase cooling efficiency within the evaporator 2. The boiling point tb of the fluid used has to be lower than temperature t2of the incoming air Gl, e.g. around 15 to 30°C lower than t2. The air will then evaporate the fluid in the evaporator 2 and thereby give off heat, which cools the air and provides cooled outlet air G2 at lower temperature t3 leaving the evaporator 2. Within the tubing 20 of the evaporator 2 the incoming fluid has a temperature t3 of about the boiling point tb, e.g. -30 to +20°C that provides it in at least partly liquid state. In the evaporator 2 the fluid will be heated by the flowing air, such that the fluid in the tubing 4 after the evaporator 2 will have a temperature tl that is about 2-20 °C higher than t3, e.g. 15°C.

[0026] From the evaporator 2 the tubing 4 leads into the condenser 3. Here within the condenser 3 the tubing 30 gets in contact with a cold media 31 and a flange package 8B to increase cooling efficiency within the evaporator 3. The cold media 31 is cooled by a cooling producing circuit 7 of a conventional kind, delivering cooling to the cooling media 31, i.e. having a closed loop tubing containing a refrigerant, such as R290, a low-pressure part 72 and a high-pressure part 71, i.e. having a boiling point of the refrigerant well below 0°C. The high-pressure part 71 is preferably positioned outside of the cooling space CS, i.e. at (or adjacent) an outside of the vessel / product VP and includes a heat exchanger device a fan 75 (forcing air through the heat exchanger) and a compressor 74, e.g. providing a temperature increase of about + 80-120°C. In the heat exchanger the refrigerant will give away energy to the air flowing therethrough, and thereby be cooled (e.g. to + 40-50°C) and condense, at least partly and thereafter passed through an expansion device 73, (e.g. expansion valve or a capillary tube), whereupon the temperature of the liquid in the low-pressure part 72 will drastically drop and thereby produce ice in the cooling media 31.

[0027] The cooling media 31, may be ice or very cold water (e.g. mixed with an alcohol) or another phase changing fluid, or a mixture thereof, having a temperature t4 of about -25-20 °C. As a consequence, the fluid within the condenser 3 of the thermosiphon will condense and cause circulation within the loop 20,4, 30, 5. The circulation is achieved by the design of the thermosiphon, e.g. positioning the evaporator 2 at a lower level than the condenser 3. As long as temperature t4 of the cooling media is sufficiently low, the process will continue by itself by self-circulation in the loop 20,4, 30, 5. and provide cooling of the flow of air Gl- G2, through the evaporator 2. In some applications the design of the fan 6 and the flange package 8B is such that flow of air Gl- G2, through the evaporator 2 may exceed 200 m3 / h up to about 700m3 / h.It is a great advantage to have a cooling tank 32 that may allow expansion of the cooling media 31. Preferably this is achieved by having an expansion space ES2 and ventilation at the top of the cooling tank 32 such that the cooling media 31 is not hindered from expanding upwardly, e.g. due to compression (which would be the case with a closed tank). Furthermore, it is an advantage to have a further expansion space ESI between the side walls of the cooling tank and the flange package 8A by arranging a distance X between the side walls of the cooling tank and the flange package 8A, preferably at least 5 % of the width W (more preferred in the range 8 to 15% of W) of the cooling tank 32, in order to allow the cooling media 31 to expand within the intermediate space ESI between the cooling package and the side walls. Preferably the flange package 8A is provided in the center of the cooling tank 31. The suitable dimensions of the cooling tank is such that it has a basically rectangular cross-section, preferably having curved corners, preferably having a width W of a first side walls that is larger than the height H of the tank 32 and a width (not shown) of a second side walls that is smaller than the height H, which may facilitate a compact design.

[0028] According to a preferred embodiment of the invention the upper flange package 8A of the thermosiphon is provided as a common package, as exemplified in Fig.l, i.e. the upper flange package 8A is connected to the tubing of the low-pressure part 72 of the cooling producing circuit 7 and also the tubing 30 of the condenser 3 of the thermosiphon. To achieve a desired effect of self-circulation in the thermosiphon loop, the tubing 30 through the condenser and also the tubing 4, 40 leading away from the condenser into the evaporator preferably shall be inclined downwardly in relation to the horizontal H, i.e. extend at an angle y, a providing downward sloping, e.g. within the range of 2-90°. It is to be noted that the latter design of the thermosiphon is also desired if separate flange packages (not shown) are used for the condenser part 3 of the thermosiphon and the cooling producing circuit 7.

[0029] Furthermore, as shown there are preferably arranged a plurality of downwardly directed tubes 30 A, 30B, etc. (also preferred if separate flange packages are used) extending through the first flange package part 8 A in the condenser 3, and that these downwardly directed tubes 30 A, 30B preferably are arranged with their flow mouths ending in a lower condenser distributor tube 40, that extends at an angle a (providing a downward flow therethrough) in relation to a horizonal plane H. Hence, the flow mouths of the tubing 30A, 30B will end at diverse levels into said lower condenser distributor tube 40. The lower condenser distributor tube 40 connects to the inlet end of the to-be-cooled tubing 4, leading to the evaporator. Preferably the plurality of heat transfer plates of thefirst flange package part 8A extend in a vertical plane, preferably parallelly, and most preferred such that each downwardly directed tube 30A, 30B is in contact with at least one (preferably two, i.e. one on each side) heat transfer plate along its extension through the condenser 3. The heat transfer plates may preferably be thin, e.g. having a thickness in the range of 0,05-2 mm and the flange packages 8A, 8B preferably may have width that is larger than the height, e.g. 1,5 x width < height < 3 x width.

[0030] As shown the lower condenser distributor tube 40 preferably extends at angle a in the range of 2-20°. However, the tubing 30 A, 30B within the condenser may extend with a larger angle y in relation to the horizontal H, suitably 90°(or within +-5 degrees thereof) which may facilitate more cost-effective production. Furthermore, it is shown that also an upper condenser distributor pipe 41, i.e. on top of the condenser 3, may be provided to extend at an angle P, such that a downward flow is obtained therein and such that the inlet openings of the plurality of tubing 30 A, 30B will also be positioned at different levels in relation to the horizontal H. Preferably, the downwardly directed tubes 30A, 30B, have a smaller cross-section than the condenser distributor pipes 40, 41, e.g. a cross-sectional width within 0,5-0, 8 of the cross-sectional width of the condenser distributor pipes 40, 41.

[0031] Moreover Fig. 1 shows that it may be preferred that the evaporator 2 of the thermosiphon is arranged with a plurality of upwardly extending evaporator tubes 20A, 20B (preferably vertically) extending through the second flange package part 8B wherein their inlets emanate from a lower evaporator distributor tube 51, that preferably extends at an angle a (providing an upward flow therethrough, preferably having about the same angle a as for the lower condenser distributor tube 40, i.e. in the range of 2-20° ) in relation to a horizonal plane H. It is shown that also an upper evaporator distributor pipe 50, i.e. on top of the evaporator 2, may be provided to extend at an angle A, such that an upward flow is obtained also therein and such that the outlet openings of the plurality of evaporator tubes 20A, 20B will also be positioned at different levels in relation to the horizontal H. The upper evaporator distributor pipe 50 connects to the inlet end of the deliver-cooling tubing 5, leading into the condenser 3.

[0032] The arrangement according to the invention may be optimized to fit certain cooling conditions, e.g. for storage of food products at a temperature of about 4° and to be able to maintain that temperature for many days, preferably a week, without need of addition of further cooling power (i.e. without operating the cooling producing circuit 7) before all ice is melted of the cooling media 31 during those days, to provide safety buffer (e.g.due to power failure and / or cloudy weather if solar operated). Preferably therefore the volume VC of cooling media 31 within the cooling tank 32 relates to the volume VV of the cooling space CS such that 15 VC < VV < 40VC.

[0033] The basic principle of use for a cooling vessel VP of the cooling arrangement 1 in a cooling space CS, e.g. storage room, according to the invention is that cooling media 31 is first transformed from fluid to ice during a needed time period, e.g. for 8 - 24 hours when used in a cooling space CS of 6- 10 cubic meters having a cooling tank 32 with a volume VC of cooling media 31 of more than 200-300 litres and a compressor of 700-1000 W, providing a cooling energy of about 20 -30 kWh, such that the cooling space CS may be kept at a cooling temperature, e.g. in the range of 2-6 degrees for at least two days.

[0034] Thanks to the preferred embodiment wherein the cooling package 8A is combined to have a common cooling flange package for the compressor circuit 7 and the condenser 3 of the thermosiphon circuit it is obtained a more efficient transfer of energy and especially in combination with having the compressor circuit 7 running. Hence, the added cooling energy may be used to cool the cooling space simultaneously, i.a. also when the cooling circuit 7 is running. Finally, it provides a less costly alternative thanks to using one and the same cooling package 8 A for the compressor circuit 7 and the condenser 3 of the thermosiphon circuit.

[0035] It is evident that it is feasible to increase or to lower the desired cooling temperature t3, e.g. to have the cooling space CS used as a freezer (e.g. -15 to -20 °C) by means of adding low temperature media with lower freezing temperature, e.g. alcohol such that the freezing point is moved to the range of -20 to -30°C.

[0036] According to an alternative embodiment shown in Figs. 2-4 the tubes 30 of the thermosiphon in the condenser 3 / cooling circuit will be extending in a zig-zag pattern (y smaller than 90 degrees) wherein there is an inclination y downwards at every part of the zig-zag formation and the inclination y preferably is the about in the same range as the inclination a of the lower condenser distributor tube 40 of the condenser 3. Further, the design of the condenser 3 may be such that there is no inclination of the upper distributor tube 41, similarly as the design of the tubes in the low pressure part 72 of the compressor circuit 7, which feeds the refrigeration media by means of the compressor, i.e. causing pressure that creates a flow.In Fig. 5 there is shown a preferred design of the cooling arrangement 1 of the invention, wherein it is in the form of an L, that is turned up-side down, which provides improved flexibility thanks to reduced height compared to an embodiment merely extending in the vertical. The evaporator 2 and the condenser 3 are arranged in an inner housing H23 that is positioned, at least substantially, vertically extending and the compressor circuit 7 is arranged in an outer housing H7 that at the top of the inner housing H23 protrudes laterally (substantially horizontally). Preferably the two housings H23, H7 form a unit, providing the cooling arrangement 1, which may facilitate easy installation and exchange of the cooling arrangement 1 in a cooling vessel VP. Further, there is a hindering, preferably insulating, layer / wall (not shown) arranged within the cooling arrangement 1 between the inner housing H23 and the outer housing H7, that hinders heat from the compressor circuit 7 to enter into the inner housing H23.

[0037] Moreover, there is an insulating member arranged between the outer housing H7 and the wall of attachment of the cooling storage vessel VP.

[0038] In Fig. 6 there is shown an example of a cooling storage vessel VP equipped with cooling arrangement 1 as shown in Fig. 5. It is shown that thanks to the L-form the outer housing H7 including the compressor circuit 7 may be mounted outside of the cooling vessel VP, i.e. not within the cooling space CS. Preferably, the L-formed cooling arrangement 1 is positioned adjacent a side wall VPS of the cooling storage vessel VP such that the housing H7 including the compressor circuit 7 protrudes laterally out from said side wall VPS. By arranging a passage VPSP in said side wall that has a shape that corresponds to the shape of the outer housing H7 a beneficial sealed attachment of the cooling arrangement 1 may be achieved. Preferably, the outer housing H7 is rectangular, such that a rectangular passage VPSP may be used for mounting of the cooling arrangement 1 by means of having the outer housing H7 protruding through the passage VPSP. Further, it is shown that preferably a solar panel arrangement 9 is mounted on top of the cooling vessel VP, which may provide power to the cooling arrangement 1. Moreover, it is shown that preferably a movable cooling vessel VP is arranged with a bottom part VPB that is provided with fittings 90 adapted for easy lifting and moving of the cooling vessel VP by means of lifting forks.

[0039] An alternative use, of the cooling arrangement is to use it as an air conditioning arrangement wherein charging of cooling power may be operated during night, (preferably via stored solar energy collected during day time, and / or possibly by means of grid connection, e.g. at least partly) when the user space is not actively used by persons and that cooled cooling media 31 is used for cooling air of a user space US during activetime, normally day-time, such that noise from the compressor may not disturb during day time. In such an alternative the volume VU of the user space US may be dimensioned to be larger than if used for a cooling space CS, and therefore in such an alternative the volume VC of cooling media 31 within the cooling tank 32 may then preferably relate to the volume VU of the user space US such that 50VC < VU < 150VC. A typical place for use of the air conditioning arrangement 1 according to the invention would be an office where the air conditioning arrangement 1 would produce cooling media, e.g. in the form of ice, during night-time and where during daytime the ice is allowed to melt for production of cool air to the user space US. Also, the opposite may be applied, e.g. for homes, where the air conditioning arrangement 1 may be (at least mainly) used for producing cool air during night-time and production of cooling media 31 would occur during daytime, preferably by use of solar power. Thanks to the preferred use of a combined flange package 8A the advantage is provided that an efficient addition of cooling power via the cooling producing circuit 7 may also be supplied during active use of the thermosiphon.

[0040] The invention is not limited by the above description, but the skilled person understands that there exist various obvious modifications within the scope of the appended claims. For instance, the skilled person understands that there may exist applications wherein there is no need of a fan in the cooling space. Moreover, the skilled person understands that the thermosiphon may be used to cool other media than air (with or without a fan), e.g. water or some other liquid cooling medium, preferably then in a further closed loop with a pump and a plate heat exchanger, which in turn may cool air by means of contains cooling elements connected thereto, for example an office space. Further, it is foreseen that one or more divisional applications may be filed, e.g. providing protection for specific solutions that independent of connection to claim 1.

Claims

CLAIMS1. Cooling arrangement for cooling of a cooling space (CS) within an object (VP), comprising a thermosiphon loop (20, 4, 30, 5) having a cooling fluid in operational connection with an evaporator (2) and a condenser (3), wherein a cooling media (31), preferably having a temperature in the range of -30 +25 °C, in cooling tank (32) of said condenser (3) is arranged to absorb heat from said cooling media (31), which cooling media (31) in turn absorbs heat from air (Gl) flowing through said evaporator (2) to provide a cooled flow of fluid, preferably air flow (G2), by means of a propelling device (6), preferably a fan (6) out from said evaporator (2) directly or indirectly in said cooling space (CS), wherein said cooling media (31) (31) at least partly includes ice and that said cooling media (31) is arranged to drive said thermosiphon loop (20, 4, 30, 5) and wherein said condenser (3) is also connected to a cooling producing circuit (7) comprising a low pressure part (72) arranged within said cooling tank (32) to produce cooling energy to said cooling media (31), said cooling producing circuit (7) also comprising a high pressure part (71) and a compressor (74) arranged outside of said cooling space (CS), characterized in that said condenser (3) includes at least one flange package (8A) positioned within said cooling tank (32) and that said cooling tank (32) is arranged with expansion space (ESI, ES2).

2. Cooling arrangement according to claim 1, wherein said expansion space includes a side expansion space (ESI) arranged between outer side walls of said flange package (8A) and inner sidewalls of said cooling tank (32), preferably also a top expansion space (ES2) arranged between an upper top wall of said flange package (8A) and a ventilated top of said cooling tank (32.

3. Cooling arrangement according to claim 1 or 2, wherein said condenser (3) includes a plurality of tubes (30 A, 30B) that are inclined downwardly in relation to the horizontal (H) at an angle (y) within a range of 2-90°.

4. Cooling arrangement according to claim 3, wherein said angle (y) is within a range of 85-90°, and preferably said tubes (30A, 30B) extend along a straight line.

5. Cooling arrangement according to claim 3, wherein said angle (y) is within a range of 5-20°, and preferably said tubes (30A, 30B) extend along a non-straight line, more preferred along a zig-zag line.

6. Cooling arrangement according to any of claim 3-5, wherein said plurality of tubes (30 A, 3 OB) have their outflow end connected to a lower condenser distributor tube (40) and that said lower condenser distributor tube (40) is inclined downwardly in relation to the horizontal (H) at an angle (a) within a range of 2-20°, more preferred 5-15°, wherein preferably also said plurality of tubes (30 A, 30B) have their inflow end connected to an upper condenser distributor tube (41) and that said upper condenser distributor tube (40) is also inclined downwardly in relation to the horizontal (H) at an angle (P) within a range of 2-20°, more preferred 5-15°.

7. Cooling arrangement according to any of claims 2-6, wherein said side expansion space (ESI) is provided by having a distance (X) between the outer side walls of said flange package (8 A) and the inner sidewalls of said cooling tank (32) that is in the range 0,05W< X< 0,15W.

8. Cooling arrangement according to any preceding claims, wherein said flange package (8A) is common for both said condenser (3) and said low pressure part (72).

9. Cooling arrangement according to any preceding claims, wherein said cooling producing circuit (7) is arranged within a outer housing (H7) attached to an inner housing (H23) including at least said condenser (3) and wherein said object (VP) has a wall (VPS) arranged with a passage (VPSP) adapted to the shape of said outer housing (H7), wherein preferably said outer housing (H7) extends laterally in relation to the extension of said inner housing (H23).

10. A method for cooling of a cooling space (CS) by means of a cooling arrangement according to claim 1, comprising the steps of:Supplying cooling power to said cooling media (31) by means of said cooling producing circuit (7), until a desired amount of said cooling media (31) is in the form of ice,Starting cooling of said cooling space (CS) by means of starting circulation of said thermosiphon loop (20, 4, 30, 5) and starting said fan (6),- Wherein during formation of ice said expansion space (ESI, ES2) enables expansion of ice within said cooling tank (32) without exposing said flange package (8A) or said cooling tank (32) to forces exceeding plastic deformation.

11. A method according to claim 10, wherein at least a major part of said cooling power is provided by means of solar energy and that the stored cooling energy of said cooling media (31) when at least 50% has transformed to ice includes sufficient cooling energy to keep said thermosiphon loop (20, 4, 30, 5) operating for at least 4 hours, preferably for at least 1 day, more preferred for at least 2 days.

12. A method according to claim 10 or 11, wherein said cooling power is supplied to said cooling media (31) by means of a flange package (8A) that is common for both said condenser (3) and said low pressure part (72).

13. A method according to any of claims 10-12, wherein the fluid being cooled in said evaporator (2) is a gas (Gl, G2), preferably air.

14. A method according to any of claims 10-12, wherein the fluid being cooled in said evaporator (2) is a liquid, preferably water, more preferred by means of a plate heat exchanger.

15. A method according to claim 10 or 11, wherein said cooling power is supplied by means of a cooling arrangement (1) having an inner housing (H23) and an outer housing (H7) presenting an L-form, wherein said outer housing (H7) protrudes from a side wall (VPS) of said object (VP) and preferably a solar panel (9) is provided on top of said object (VP).

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