Mounting device and control method

Abstract

This mounting device, which collects a component and mounts the component on the basis of a result of image processing, includes: a collection unit that includes a plurality of collection members for collecting components so as to be rotatable; an imaging unit that can image the components collected by the plurality of collection members from below; an image processing unit that executes the image processing for each of the components while targeting at a plurality of rectangular regions circumscribing each component in an image imaged by the imaging unit; and a control unit that controls the collection unit and the imaging unit so that the component is imaged while the collection member is at a predetermined angle at which the rectangular region in the image becomes a smaller region by executing a specific operation of rotating the collection member at a predetermined timing.

Description

Mounting Device and Control Method

[0001] This specification discloses a mounting device and a control method.

[0002] Conventionally, a mounting device has been proposed that performs image processing on an image of components captured from below and mounts the components based on the result. For example, Patent Document 1 describes a device that generates a super-resolution image with higher resolution than the captured image and performs image processing.

[0003] Japanese Patent Application No. 2023-166204

[0004] Here, the above-described image processing is performed on a rectangular region circumscribing the components within the image. This rectangular region is set along the vertical and horizontal directions of the pixel array of the image. Therefore, for example, even for a component with a rectangular bottom surface, if the vertical and horizontal sides of the component in the image are inclined with respect to the vertical and horizontal directions of the pixel array, the rectangular region becomes larger and the image processing time becomes longer.

[0005] The main object of the present disclosure is to perform image processing on a rectangular region circumscribing a component more efficiently.

[0006] The present disclosure has adopted the following means to achieve the above main object.

[0007] The mounting device of the present disclosure is a mounting device that picks up components and mounts them based on the result of image processing, and includes a picking-up unit that rotatably includes a plurality of picking-up members for picking up components, an imaging unit that can image a plurality of components picked up by the plurality of picking-up members from below, an image processing unit that performs the image processing for each component on a plurality of rectangular regions circumscribing each of the plurality of components within the image captured by the imaging unit, and a control unit that controls the picking-up unit and the imaging unit to perform a specific operation of rotating the picking-up member at a predetermined timing to a predetermined angle at which the rectangular region in the image becomes a smaller region, and imaging the component in the state of the predetermined angle of the picking-up member. The gist is to be provided with.

[0008] In the implementation device of this disclosure, a specific operation is performed at a predetermined timing to rotate the sampling member to a predetermined angle such that the rectangular area in the image becomes smaller, thereby controlling the sampling unit and the imaging unit so that the sampling member images the parts when it is at the predetermined angle. As a result, multiple rectangular areas circumscribing each of multiple parts in the image can be made smaller. Therefore, image processing targeting rectangular areas circumscribing parts can be performed more efficiently.

[0009] A schematic diagram showing the general configuration of the mounting device 10. A schematic diagram showing the general configuration of the mounting head 40. An explanatory diagram showing the electrical connection relationships of the mounting device 10. An explanatory diagram showing an example of the rotational positions A to L of the nozzle 44 and the orientation of the component P. A flowchart showing an example of the mounting process. A flowchart showing an example of the component suction process with specific operations. An explanatory diagram showing an example of the component suction process with specific operations. An explanatory diagram showing an example of the component suction process with specific operations. An explanatory diagram showing the state of each component P during image acquisition. A flowchart showing a modified mounting process. A flowchart showing an example of the image acquisition process with specific operations. An explanatory diagram showing an example of the first to third groups of nozzles 44. An explanatory diagram showing an example of the image acquisition process with specific operations.

[0010] Embodiments of this disclosure will be described with reference to the drawings. Figure 1 is a schematic diagram showing the configuration of the mounting device 10. Figure 2 is a schematic diagram showing the configuration of the mounting head 40. Figure 3 is an explanatory diagram showing the electrical connection relationships of the mounting device 10. Note that in Figure 1, the left-right direction is the X-axis direction, the front-back direction is the Y-axis direction, and the up-down direction is the Z-axis direction.

[0011] As shown in Figures 1 and 3, the mounting device 10 includes a component supply device 20, a substrate transport device 25, an XY robot 30, a mounting head 40, a parts camera 27, a mark camera 28, and a control device 80.

[0012] The component supply device 20 includes a plurality of tape feeders arranged horizontally in front of the mounting device 10. Each tape feeder is configured to pull out a tape 22 containing components P in cavities formed at predetermined pitches from a reel 21 and send it to the component supply position at the predetermined pitch. The components P in the cavities are protected by a film covering the surface of the tape 22, and the film is peeled off just before reaching the component supply position, exposing the components P.

[0013] The substrate transport device 25 is equipped with a pair of conveyor belts 26 (only one is shown in Figure 1) that are spaced apart front to back and spanned in the left to right direction. When the substrate S is transported by the conveyor belts 26 and reaches a predetermined position, it is supported by numerous support pins 24 erected on its back side.

[0014] The XY robot 30 includes a Y-axis guide rail 33 provided along the front-rear direction and a Y-axis slider 34 that moves along the Y-axis guide rail 33 by the drive of a Y-axis motor 38. The XY robot 30 also includes an X-axis guide rail 31 provided along the left-right direction in front of the Y-axis slider 34 and an X-axis slider 32 that moves along the X-axis guide rail 31 by the drive of an X-axis motor 36. A mounting head 40 and a mark camera 28 are attached to the X-axis slider 32. The mounting head 40 and the mark camera 28 move to any position on the XY plane by the drive of the XY robot 30.

[0015] As shown in Figure 2, the mounting head 40 comprises a head body 41 which is a disc-shaped rotating body, a cylindrical nozzle holder 42, and a nozzle (sampling member) 44. The mounting head 40 is configured as a rotary head, and multiple nozzle holders 42 are provided at predetermined intervals on the same circumference of the head body 41. The nozzles 44 are interchangeably attached to the tip of each nozzle holder 42 and collect parts P from the parts supply device 20. The nozzles 44 use the supplied negative pressure to attract (sample) (collect) the parts P to their tip (lower end) and hold them, and use the supplied positive pressure or atmospheric pressure to release the attraction of the parts P and attach them to the substrate S. In Figure 2, eight nozzle holders 42 and eight nozzles 44 are shown, but in this embodiment, the number of nozzle holders 42 and eight nozzles 44 is set to twelve. Note that the number of nozzles 44 is not limited to twelve, and may be eight, twenty, twenty-four, etc. Furthermore, the mounting head 40 includes an R-axis drive unit 50, a Q-axis drive unit 60, and a Z-axis drive unit 70. In Figure 2, the position where the Z-axis drive unit 70 engages, and the two nozzle holders 42 and nozzles 44 located symmetrically to that position are shown by solid lines, while the other nozzle holders 42 and nozzles 44 are shown by dashed lines.

[0016] The R-axis drive device 50 is a mechanism that rotates (revolves) multiple nozzles 44 by rotating the head body 41, and comprises an R-axis 51, an R-axis motor 54, and an R-axis position sensor 55 (see Figure 3) that detects the rotational position of the R-axis motor 54. The R-axis 51 extends in the vertical direction, and its lower end is attached to the central axis of the head body 41. The R-axis motor 54 rotates a gear 53 that meshes with an R-axis gear 52 provided at the upper end of the R-axis 51. The R-axis drive device 50 rotates the R-axis 51 by the R-axis motor 54 via the gear 53 and R-axis gear 52 in predetermined rotational angles (30° in this embodiment), thereby rotating the head body 41 in predetermined rotational angles in the direction of the arrow in Figure 4. As a result, the multiple nozzle holders 42 and the multiple nozzles 44 rotate in predetermined rotational angles in the circumferential direction.

[0017] The Q-axis drive unit 60 is a mechanism that synchronously rotates (rotates) multiple nozzles 44, and comprises upper and lower Q-axis gears 61 and 62, gears 63 and 64, a Q-axis motor 65, and a Q-axis position sensor 66 (see Figure 3) that detects the rotational position of the Q-axis motor 65. The Q-axis gears 61 and 62 are inserted coaxially and relative to the R-axis 51. Gear 63 is provided on the upper part of each nozzle holder 42 and meshes with the lower Q-axis gear 61 so as to be slidable in the vertical direction. The Q-axis motor 65 rotationally drives gear 64 which meshes with the upper Q-axis gear 62. The Q-axis drive unit 60 rotates gear 63 by rotationally driving the Q-axis gears 61 and 62 with the Q-axis motor 65, causing each nozzle holder 42 (nozzle 44) to rotate (rotate) around its central axis by the same amount of rotation (rotation angle) in the same rotational direction. Because gear 63 meshes with Q-axis gear 61, when each nozzle holder 42 (nozzle 44) rotates due to the drive of the R-axis drive device 50, each nozzle holder 42 rotates while rotating on its own axis.

[0018] Therefore, as shown in Figure 4, the orientation (rotation angle) of the part P differs depending on the rotational position A to L of the nozzle 44. Rotational positions A to L are defined as rotational position A being at the 3 o'clock position in Figure 4, and rotational positions B, C...K, and L being the order in which the nozzle 44 rotates from rotational position A. Rotational position A is the raising and lowering position of the nozzle 44 by the Z-axis drive device 70, and is the position where the nozzle 44 picks up or mounts the part P.

[0019] Here, as will be described later, each component P that is attracted (collected) by each nozzle 44 during the mounting process is imaged by the parts camera 27, and image processing is performed on a rectangular area that circumsects the component P with a predetermined margin within the captured image. In the enlarged view of Figure 4, the vertical direction of the pixel array in the image is shown as the Y direction, and the horizontal direction as the X direction. As shown in the figure, at rotation positions A, D, G, and J, the component P is not tilted in the image, and its vertical and horizontal sides are parallel to the Y direction and X direction of the pixel array, respectively. The orientation of the component P in this state is called the reference orientation (reference posture), and the rotation angle of the nozzle 44 with the component P as the reference orientation is called the predetermined angle (reference angle). Since the component P is not tilted, the rectangular area for image processing is the smallest rectangular area T0 obtained by adding a predetermined margin to the lower surface area of ​​the component P. Furthermore, at rotation position B, the component P rotates due to the rotation of the nozzle 44 accompanying the rotation from rotation position A (30° in this embodiment), resulting in the vertical and horizontal sides of component P being tilted with respect to the Y and X directions of the pixel array. In this embodiment, component P is tilted by an angle θ1 (30° in this embodiment), and the same state occurs at rotation positions E, H, and K. Therefore, the rectangular area for image processing becomes a rectangular area T1 that is larger than rectangular area T0. Moreover, at rotation position C, the component P rotates due to the rotation of the nozzle 44 accompanying the rotation from rotation position A (60° in this embodiment), resulting in the vertical and horizontal sides of component P being tilted even more with respect to the Y and X directions of the pixel array. In this embodiment, component P is tilted by an angle θ2 (60° in this embodiment), and the same state occurs at rotation positions F, I, and L. Therefore, the rectangular area for image processing becomes a rectangular area T2 that is larger than rectangular area T1.

[0020] The Z-axis drive unit 70 is installed at one location on the rotational (revolving) trajectory of the nozzle holder 42 and is configured to individually raise and lower the nozzle holder 42, for example, when it is at rotational position A (see Figure 4). Alternatively, multiple Z-axis drive units 70 may be installed to raise and lower the nozzle holder 42 (nozzle 44) at multiple lifting positions. The Z-axis drive unit 70 comprises a Z-axis slider 71, a Z-axis motor 73, and a Z-axis position sensor 74 (see Figure 3) for detecting the vertical position of the Z-axis slider 71. The Z-axis slider 71 is mounted on a ball screw 72 extending in the vertical direction so as to be movable up and down, and includes a clamping portion 71a that grips an engaging piece 42a extending laterally from the nozzle holder 42. The Z-axis motor 73 raises and lowers the Z-axis slider 71 by rotating the ball screw 72. Furthermore, the engaging piece 42a of the nozzle holder 42, which has been rotated to rotation position A, is gripped by the clamping portion 71a of the Z-axis slider 71. Therefore, the Z-axis drive device 70 drives the Z-axis motor 73 to raise and lower the Z-axis slider 71 along the ball screw 72, thereby enabling the nozzle 44, which has been rotated to rotation position A, to be raised and lowered.

[0021] The parts camera 27 is positioned between the parts supply device 20 and the substrate transport device 25, and captures images of the parts P held by each nozzle 44 from below. The mark camera 28 is positioned on the lower surface of the X-axis slider 32, and captures images of the parts P held on the tape 22 of the parts supply device 20 and marks attached to the substrate S from above.

[0022] The control device 80 has a CPU, ROM, RAM, etc., and controls the entire mounting device 10. The control device 80 outputs control signals to the component supply device 20, the substrate transport device 25, the XY robot 30, the mounting head 40 (R-axis motor 54, Q-axis motor 65, Z-axis motor 73), the parts camera 27, the mark camera 28, etc. The control device 80 also receives data from the component supply device 20, the substrate transport device 25, the XY robot 30, the mounting head 40 (R-axis position sensor 55, Q-axis position sensor 66, Z-axis position sensor 74), and images captured by the parts camera 27 and the mark camera 28. The control device 80 controls the mounting device 10 to mount components P according to the production program for the substrate S. The production program for the substrate S includes information on which components P should be mounted on the substrate S, in what order and at what location, and how many substrates S to produce. The production program also includes information on the size of the components P and whether or not super-resolution processing is required. Super-resolution processing is a process that generates a higher-quality super-resolution image from multiple captured images (multi-frame super-resolution processing). The multiple images are, for example, bottom-view images captured by the parts camera 27 with a pixel pitch that is not an integer (e.g., 0.5 pixels, 1.5 pixels, etc.). By superimposing these bottom-view images, a super-resolution image with increased inter-pixel information is generated.

[0023] The following describes the mounting process of the mounting device 10, particularly the mounting process of components P that require super-resolution processing. Figure 5 is a flowchart showing an example of the mounting process performed by the control device 80. In the mounting process, the control device 80 first controls the XY robot 30 to move the mounting head 40 above the component supply device 20, and then performs a component suction process (S100) in which the components P supplied to the component supply position are attracted to each nozzle 44. The component suction process with specific actions in S100 is performed with the mounting head 40 positioned above the component supply position, based on the flowchart in Figure 6. Figures 7 and 8 are explanatory diagrams showing an example of the component suction process with specific actions, and will be explained together.

[0024] In the part suction process involving a specific operation shown in Figure 6 (S100), the control device 80 first raises and lowers the nozzle 44, which is in the lifting position (swivel position A), to suction the part P (S200, Figure 7A). Next, in order to swivel the next nozzle 44, which is in the swivel position L, to the lifting position, the control device 80 controls the R-axis drive device 50 to rotate the head body 41 so that each nozzle 44 swivels at a predetermined swivel angle (30° in this embodiment) (S210, Figure 7B). As shown in Figure 7B, since each nozzle 44 rotates along with the swivel movement, the part P that has moved to the swivel position B is tilted by an angle θ1 (30° in this embodiment, see Figure 4).

[0025] Next, the control device 80 performs a specific operation to rotate the nozzle 44 at a rotation angle (30° in this embodiment) corresponding to a predetermined rotation angle (angle of rotation per turn) (S220, Figure 7C). This specific operation rotates the nozzle 44 in the opposite direction to the rotation accompanying the rotational movement, at a rotation angle corresponding to the tilt angle of the part P, in order to counteract the tilt of the part P caused by the rotation of the nozzle 44 accompanying the rotational movement in S210. As a result, as shown in Figure 7C, the part P that has moved to rotational position B returns to a reference orientation without tilt. After performing this specific operation, the control device 80 raises and lowers the nozzle 44 in the raised position to attract the part P (S230, Figure 8A). Because the specific operation returns the part P at rotational position B to a state without tilt before attracting the next part P to the nozzle 44, as shown in Figure 8A, each part P at rotational positions A and B returns to a reference orientation without tilt.

[0026] The control device 80 then determines whether each nozzle 44 has attracted the necessary parts P (S230). If it determines that the parts have not been attracted, it returns to S210 and repeats the process. Specifically, the control device 80 rotates the head body 41 so that each nozzle 44 rotates at a predetermined rotation angle (S210, Figure 8B). The control device 80 also performs a specific operation to rotate the nozzles 44 at a rotation angle corresponding to the predetermined rotation angle (S220, Figure 8C). Therefore, even if each part P is tilted due to rotational movement to rotational positions B and C (see Figure 8B), it can be returned to the reference orientation by the specific operation (see Figure 8C). In this state, the control device 80 raises and lowers the nozzle 44 in the raised position to attract the parts P (S230). Therefore, although not shown in the diagram, each part P at rotational positions A, B, and C is in the reference orientation. The control device 80 repeats these processes, and when it determines in S230 that it has attracted the necessary parts P to each nozzle 44, it terminates the parts attraction process involving specific operations.

[0027] In the mounting process shown in Figure 5, when the control device 80 performs a component suction process with a specific operation in S100, it controls the XY robot 30 to move the mounting head 40 above the part camera 27 and performs an image acquisition process in which the part camera 27 captures an image including each component P. Figure 9 is an explanatory diagram showing the state of each component P during image acquisition. By performing a component suction process with a specific operation, as shown in Figure 9, an image can be captured with all components P attached to each nozzle 44 in a reference orientation. In S110, multiple images are captured with shifted pixel pitches as described above for the generation of a super-resolution image.

[0028] Next, the control device 80 generates a super-resolution image targeting the rectangular region circumscribing each component P within the captured image, and performs image processing using the generated super-resolution image (S120). In this embodiment, since the image is captured with all components P oriented as the reference, the rectangular region of each component P can be made into the smallest rectangular region T0 (see Figure 4). Therefore, the target area for image processing can be made to the smallest size, and the processing time for image processing, including the generation of the super-resolution image, can be shortened. In the image processing of S120, the positional and angular displacement of component P relative to the center of the nozzle 44 is acquired for each component P.

[0029] When the control device 80 performs image processing in this manner, it corrects positional and angular misalignments based on the processing results and mounts each component P (S130), thus completing the mounting process. In S130, the control device 80 controls the XY robot 30 to move the mounting head 40 (rotation position A) to the corrected mounting position, controls the Q-axis drive unit 60 to correct the angular misalignment of the component P at the lifting position (rotation position A), and controls the Z-axis drive unit 70 to raise and lower the nozzle 44 to mount the component P onto the substrate S. The control device 80 then repeats this process until the mounting of all component P held by each nozzle 44 is completed.

[0030] Here, the correspondence between the components of this embodiment and the components of the present disclosure will be clarified. In this embodiment, the mounting head 40 corresponds to the sampling unit, the parts camera 27 corresponds to the imaging unit, the control device 80 that executes the mounting process S120 corresponds to the image processing unit, and the control device 80 that executes the component suction process with specific operation in S100 (Figure 6) and the image acquisition process in S110 corresponds to the control unit. Furthermore, by explaining the operation of the mounting device 10, an example of the control method of the present disclosure will also be clarified.

[0031] As described above, in the mounting apparatus 10 of this embodiment, a specific operation is performed at a predetermined timing to rotate the multiple nozzles 44 to a predetermined angle such that the rectangular areas of multiple parts P in the image captured by the parts camera 27 become smaller, thereby controlling the mounting head 40 and the parts camera 27 so that the parts P are imaged with the nozzles 44 at the predetermined angle. This makes it possible to make the multiple rectangular areas circumscribing each of the multiple parts P in the image smaller. Therefore, image processing targeting the rectangular areas circumscribing the parts P can be performed more efficiently.

[0032] Furthermore, the mounting device 10 causes the nozzle 44 to perform a specific operation by setting a predetermined rotation angle such that the vertical and horizontal edges of the component P in the image are parallel to the vertical and horizontal directions of the image's pixel array (Y direction and X direction in Figure 4). As a result, the rectangular area of ​​multiple components P can be made into the smallest rectangular area T0, allowing for even more efficient image processing.

[0033] Furthermore, in the mounting device 10, a predetermined timing is set before the components P are picked up (collected) by each nozzle 44, and the mounting head 40 is instructed to perform a specific operation. Therefore, since there is no need to perform a specific operation after the components P have been picked up, post-pickup processing of the components P can be carried out quickly.

[0034] Furthermore, the mounting head 40 is configured as a rotary head in which multiple nozzles 44 are arranged to rotate on the same circumference, and the nozzles 44 rotate on their own axis as the head rotates, and the nozzles 44 that have rotated to the rotation position A (lifting position) can be raised and lowered. The control device 80 controls the mounting head 40 so that each of the multiple nozzles 44 performs a specific operation to rotate the nozzles 44 at an angle corresponding to the rotation angle from rotation position L (the rotation position one step before the lifting position) to rotation position A, so that the nozzles 44 at rotation position A are at a predetermined angle, and then performs the process of picking up a part. As a result, even with a mounting head 40 in which the nozzles 44 rotate on their own axis as the head rotates, the rectangular area is reduced with the part P as the reference orientation, so that image processing can be performed more efficiently.

[0035] Furthermore, the mounting device 10 performs image processing with super-resolution processing, which generates super-resolution images with higher resolution than the images captured by the parts camera 27, targeting each rectangular region of the multiple components P. Since images generated by super-resolution processing require more processing time than normal images, there is significant value in applying this disclosure.

[0036] It goes without saying that this disclosure is not limited in any way to the embodiments described above, and can be implemented in various forms as long as they fall within the technical scope of this disclosure.

[0037] In the embodiment described above, the timing before the component P is picked up was set as the predetermined timing to execute the specific operation. However, any other timing may be set as the predetermined timing. For example, the timing before the image is captured may be set as the predetermined timing to execute the specific operation. Figure 10 is a flowchart showing the mounting process of a modified example. In the modified example, the control device 80 controls the mounting head 40 to perform a normal component pick-up process without the specific operation (S100b, see Figure 4). Also, unlike the embodiment, the control device 80 performs an image capture process with the specific operation (S110b), and then executes S120 and S130 as in the embodiment to complete the mounting process.

[0038] Figure 11 is a flowchart illustrating an example of image acquisition processing involving specific actions. The image acquisition processing involving specific actions is performed based on the flowchart in Figure 11, with the mounting head 40 positioned above the parts camera 27. Figure 12 is an explanatory diagram showing an example of the first to third groups of nozzles 44, and Figure 13 is an explanatory diagram showing an example of the image acquisition processing involving specific actions, which will be explained in conjunction with the flowchart.

[0039] In the image acquisition process involving a specific operation shown in Figure 11 (S110b), the control device 80 causes the parts camera 27 to capture images for the first group out of the first to third groups corresponding to the rotation position of each nozzle 44 (S300, Figure 13A). As shown in Figure 12, the first group consists of parts P at rotation positions A, D, G, and J, i.e., parts P at rotation positions that do not require a specific operation because they are in the reference orientation at the start of this process. Therefore, in S300, the control device 80 causes the parts camera 27 to capture images for the first group of each part P in its original orientation. Also, in Figure 13A, the parts P at rotation positions A, D, G, and J, i.e., the parts P from which a rectangular region is extracted from the captured image, are shown in color. The same applies to Figures 13B and 13C.

[0040] Next, the control device 80 performs a specific operation for the second group, which involves rotating each nozzle 44 at a predetermined rotation angle (30°) to align each component P of the second group with the reference orientation (S310). As shown in Figure 12, each component P of the second group (rotation positions B, E, H, K) is tilted at an angle θ1 (30°) with respect to the reference orientation. Therefore, in S310, the control device 80 corrects the tilt of each component P of the second group at an angle θ1 by rotating each nozzle 44 at a predetermined rotation angle (30°) to align them with the reference orientation. Once each component P of the second group is oriented with the reference orientation, the control device 80 causes the parts camera 27 to capture an image for the second group (S320, Figure 13B). As a result, the rectangular area of ​​each component P of the second group can be reduced to the smallest rectangular area T0 (see Figure 4).

[0041] Next, the control device 80 performs a specific operation for the third group, which involves rotating each nozzle 44 at a predetermined rotation angle (30°) to orient each component P of the third group towards the reference direction (S330). As shown in Figure 12, each component P of the third group (rotation positions C, F, I, L) is tilted at an angle θ2 (60°) relative to the reference direction. However, the tilt has already been corrected by 30° by the specific operation for the second group performed in S310. Therefore, in S330, the control device 80 corrects the remaining tilt (30°) of each component P of the third group by rotating each nozzle 44 at a predetermined rotation angle (30°) to orient them towards the reference direction. Once each component P of the third group is oriented towards the reference direction, the control device 80 causes the parts camera 27 to capture an image for the third group (S340, Figure 13C), and terminates the image acquisition process accompanied by the specific operation. Therefore, the rectangular region of each component P in the third group can be made the smallest rectangular region T0 (see Figure 4).

[0042] In this modified configuration, the control device 80 causes the mounting head 40 to perform a specific operation at a predetermined timing before the part camera 27 captures an image. That is, the specific operation is performed after the mounting head 40 picks up the component P, but before the part camera 27 captures an image. Therefore, the component picking process can be performed quickly, as the component picking can be carried out in the usual manner.

[0043] In another modified example, the control device 80 controls the mounting head 40 so that, during the component P suction process, the nozzle 44 picks up the component P while maintaining the rotation angle at which it was moved to the lifting position. Then, during the component P imaging process, the control device 80 performs a specific operation to rotate the nozzle 44 to a predetermined angle, and then has the part camera 27 capture an image, repeating this process until an image is captured with each nozzle 44 oriented with the component P as the reference. As a result, similar to the embodiment, even with a mounting head 40 where the nozzle 44 rotates with rotational movement, the rectangular area is reduced with the component P as the reference, allowing for more efficient image processing.

[0044] In this modification, the control device 80 executed a specific operation of rotating the nozzle 44 without turning it, but it is not limited to this. A specific operation of rotating the nozzle 44 while turning it by rotating the mounting head 40 may be executed. For example, each time the mounting head 40 is rotated at a predetermined turning angle, the process of causing the parts camera 27 to image the parts P of the nozzle 44 that has moved to the turning positions A, D, G, and J may be repeated. In such a case, the process of FIG. 11 is changed as follows. First, S310 and S330 are changed to a specific operation of rotating the mounting head 40 at a predetermined turning angle (and accordingly rotating the nozzle 44). Also, S320 is changed to imaging the image of the parts P (for the parts P of the second group at the start of the process of FIG. 11) that has moved to the turning positions A, D, G, and J by the specific operation of S310. Similarly, S340 is changed to imaging the image of the parts P (for the parts P of the third group at the start of the process of FIG. 11) that has moved to the turning positions A, D, G, and J by the specific operation of S330. Even in this way, the same effect can be obtained.

[0045] In the embodiment, a super-resolution image was generated from the image captured by the parts camera 27, but it is not limited to this, and it is not necessary to generate a super-resolution image. Even if image processing is executed for a rectangular region in the image without generating a super-resolution image, since image processing can be performed more efficiently for a small rectangular region, there is a significance in applying the present disclosure.

[0046] In the embodiment, a specific operation of rotating the nozzle 44 was executed so that the vertical and horizontal sides of the parts P in the image are respectively parallel to the vertical and horizontal directions of the pixel array, but it is not limited to this. At least, a specific operation of rotating the nozzle 44 may be executed so that the vertical and horizontal sides of the parts P in the image approach the vertical and horizontal directions of the pixel array respectively. By doing so, the rectangular region circumscribing the parts P can be made smaller than in the state where the specific operation is not executed, and thus image processing can be performed more efficiently. Also, the parts P are not limited to a rectangular shape, and may be an oval shape, a polygonal shape, etc., as long as they have a long side direction and a short side direction.

[0047] In the embodiment, the number of nozzles 44 provided in the mounting head 40 is 12, and the case where the predetermined angle (predetermined rotation angle) of the specific operation is 30° is illustrated. However, the present invention is not limited to this, and the predetermined angle of the specific operation may be appropriately determined according to the number of nozzles 44 (swing angle) and then executed. Further, in the embodiment, the mounting head 40 is a rotary head, but any mounting head may be used as long as it rotatably includes a plurality of nozzles 44 for picking up parts P. For example, a mounting head that rotatably includes a plurality of nozzles 44 (nozzle holders 42) arranged in parallel may be used.

[0048] In the embodiment, the present disclosure has been described in the form of the mounting apparatus 10, but it may also be in the form of a control method.

[0049] The present disclosure may be configured as follows. For example, the control method of the present disclosure includes a picking unit that rotatably includes a plurality of picking members for picking up parts, an imaging unit that can image a plurality of parts picked up by the plurality of picking members from below, and an image processing unit that executes image processing for each part on a plurality of rectangular regions circumscribing each of the plurality of parts in the image imaged by the imaging unit. The control method is for a mounting apparatus that picks up parts and mounts them based on the result of the image processing, and includes executing a specific operation of rotating the picking member at a predetermined timing to a predetermined angle at which the rectangular region in the image becomes a smaller region, so that the picking member images the parts in the state of the predetermined angle, and controlling the picking unit and the imaging unit. This is the gist.

[0050] In the control method of the present disclosure, image processing for a rectangular region circumscribing a part can be performed more efficiently. In this control method, steps for realizing each function of the mounting apparatus of the present disclosure may be added.

[0051] In this specification, the technical idea of changing "the mounting apparatus according to claim 1 or 2" in claim 7 at the time of filing to "the mounting apparatus according to any one of claims 1 to 6" is also disclosed.

[0052] The present disclosure is applicable to the technical field of picking up parts and mounting them based on the result of image processing.

[0053] 10 Mounting device, 20 Parts supply device, 21 Reel, 22 Tape, 24 Support pin, 25 Board transport device, 26 Conveyor belt, 27 Parts camera, 28 Mark camera, 30 XY robot, 31 X-axis guide rail, 32 X-axis slider, 33 Y-axis guide rail, 34 Y-axis slider, 36 X-axis motor, 38 Y-axis motor, 40 Mounting head, 41 Head body, 42 Nozzle holder, 44 Nozzle, 50 R-axis drive device, 51 R-axis, 52 R-axis gear, 53 Gear, 54 R-axis motor, 55 R-axis position sensor, 60 Q-axis drive device, 61 Q-axis gear, 62 Q-axis gear, 63, 64 Gear, 65 Q-axis motor, 66 Q-axis position sensor, 70 Z-axis drive device, 71 Z-axis slider, 71a Clamping part, 72 Ball screw, 73 Z-axis motor, 74 Z-axis position sensor, 80 Control device, P Component, S Circuit board, T0, T1, T2 Rectangular region.

Claims

1. A mounting apparatus for collecting parts and mounting them based on the results of image processing, comprising: a collection unit equipped with a plurality of collection members that can rotate to collect parts; an imaging unit capable of imaging a plurality of parts collected by the plurality of collection members from below; an image processing unit that performs the image processing for each part targeting a plurality of rectangular regions that circumscribing each of the plurality of parts in the image captured by the imaging unit; and a control unit that controls the collection unit and the imaging unit to perform a specific operation at a predetermined timing to rotate the collection member to a predetermined angle such that the rectangular region in the image becomes smaller, so that the collection member images the parts when it is at the predetermined angle.

2. The mounting apparatus according to claim 1, wherein the control unit causes the sampling unit to perform the specific operation, wherein the rotation angle at which the vertical and horizontal sides of the component in the image are parallel to the vertical and horizontal directions of the pixel arrangement of the image is set to the predetermined angle.

3. The mounting apparatus according to claim 1 or 2, wherein the control unit causes the sampling unit to perform the specific operation at a predetermined timing, with the timing before the sampling member takes a sample of the part being set as the predetermined timing.

4. The sampling unit is configured such that the plurality of sampling members are arranged to be rotatable on the same circumference, and the sampling members rotate on their own axis as they rotate, and the sampling members that have rotated to a predetermined lifting position can be raised and lowered, and the control unit controls the sampling unit so that, in the part sampling process, each of the plurality of sampling members performs the process of sampling a part after performing the specific operation of rotating the sampling member at an angle of rotation corresponding to the rotation angle until the sampling member rotates to the lifting position so that the sampling member that has rotated to the lifting position is at the predetermined angle.

5. The mounting apparatus according to claim 1 or 2, wherein the control unit causes the sampling unit to perform the specific operation at a predetermined timing, with the timing before the image is captured by the imaging unit being the predetermined timing.

6. The sampling unit is configured such that the plurality of sampling members are arranged to be rotatable on the same circumference, and the sampling members rotate on their own axis as they rotate, and the sampling members that have rotated to a predetermined lifting position can be raised and lowered, and the control unit controls the sampling unit to cause the sampling member that has rotated to the lifting position to sample the part in the part sampling process, and in the part imaging process, it performs the specific operation of rotating the sampling member to the predetermined angle, and then causes the imaging unit to capture an image, repeating this process for all of the plurality of sampling members until the part is captured in the predetermined angle state. The mounting apparatus according to claim 5.

7. The mounting apparatus according to claim 1 or 2, wherein the image processing unit performs the image processing with super-resolution processing to generate an image with a higher resolution than the image, targeting the rectangular region of each of the plurality of components.

8. A control method for a mounting apparatus that collects parts and mounts them based on the results of the image processing, comprising: a collection unit equipped with a plurality of collection members that can rotate to collect parts; an imaging unit capable of imaging a plurality of parts collected by the plurality of collection members from below; and an image processing unit that performs image processing on a plurality of rectangular regions that circumsect each of the plurality of parts in the image captured by the imaging unit, wherein the mounting apparatus collects parts and mounts them based on the results of the image processing, the control method comprising: executing a specific operation at a predetermined timing to rotate the collection member to a predetermined angle such that the rectangular region in the image becomes a smaller region, thereby controlling the collection unit and the imaging unit so that the collection member images the parts when it is at the predetermined angle.

Images