Mounting head

Abstract

This mounting head comprises: a holder that holds a lead component; an insertion abnormality detection mechanism that detects whether or not an abnormality is occurring when a lead of the lead component held by the holder is inserted into an insertion hole formed in a substrate; and a press-fitting abnormality detection mechanism that detects whether or not an abnormality is occurring when the lead of the lead component held by the holder is press-fitted into the insertion hole.

Description

Mounting head

[0001] The present invention relates to a mounting head that inserts the leads of lead components held by a holder into insertion holes formed in a substrate.

[0002] The following patent document describes a technique for inserting the leads of lead components held by a holder into insertion holes formed in a substrate.

[0003] Japanese Patent Application Laid-Open No. 2020-113568

[0004] An object is to appropriately insert the leads of lead components held by a holder into insertion holes formed in a substrate.

[0005] To solve the above problems, this specification discloses a mounting head including a holder that holds lead components, an insertion abnormality detection mechanism that detects the presence or absence of an abnormality when inserting the leads of the lead components held by the holder into insertion holes formed in a substrate, and a press-fitting abnormality detection mechanism that detects the presence or absence of an abnormality when press-fitting the leads of the lead components held by the holder into the insertion holes.

[0006] According to the present disclosure, it is possible to detect the presence or absence of an abnormality when inserting the leads of lead components held by a holder into insertion holes formed in a substrate, and to detect the presence or absence of an abnormality when press-fitting the leads of lead components held by the holder into insertion holes formed in the substrate. Thereby, the leads of the lead components held by the holder can be appropriately inserted into the insertion holes formed in the substrate.

[0007] Perspective view showing a component mounting machine. Perspective view showing a component mounting device. Perspective view showing a mounting head. Block diagram showing a control device. Diagram showing an insertion lead component when mounted on a circuit substrate. Diagram showing a press-fitting lead component when mounted on a circuit substrate. Perspective view showing a mounting head. Cross-sectional view showing a mounting head. Cross-sectional view showing a mounting head.

[0008] Hereinafter, as an embodiment for implementing the present invention, embodiments of the present invention will be described in detail with reference to the drawings.

[0009] Figure 1 shows a component mounting machine 10. The component mounting machine 10 is a device for mounting components onto a circuit board (see Figure 5) 12. The component mounting machine 10 comprises a main unit 20, a substrate transport and holding device 22, a component mounting device 24, a mark camera 26, a parts camera 28, a pair of component supply devices 30, and a control device (see Figure 4) 36. The circuit board 12 can be a circuit board, a three-dimensional structured substrate, etc., and the circuit board can be a printed wiring board, a printed circuit board, etc.

[0010] The main body of the device 20 consists of a frame 40 and a cover (not shown) that covers the frame 40. The substrate transport and holding device 22 is disposed on the upper surface of the frame 40 and has a transport device 50 and a clamp device 52. The transport device 50 is a device for transporting the circuit substrate 12, and the clamp device 52 is a device for holding the circuit substrate 12. As a result, the substrate transport and holding device 22 transports the circuit substrate 12 and holds the circuit substrate 12 fixedly in a predetermined position. In the following description, the transport direction of the circuit substrate 12 will be referred to as the X direction, the horizontal direction perpendicular to that direction will be referred to as the Y direction, and the vertical direction will be referred to as the Z direction.

[0011] The component mounting device 24 includes a mounting head 60 and an articulated robot 62. The articulated robot 62 is composed of a base 66, a first arm 68, and a second arm 70. A table 72 is arranged on the upper surface of the frame 40 so as to straddle the substrate transport and holding device 22, and the base 66 is fixed to the upper surface of the table 72. As shown in Figure 2, the first arm 68 is connected to the base 66 at one end so as to be able to swing around an axis 76 extending in the Z direction, and swings in a controllable manner by the operation of an electromagnetic motor (see Figure 4) 78. The second arm 70 is connected to the other end of the first arm 68 opposite to the end connected to the base 66, so as to be able to swing around an axis 80 extending in the Z direction at one end, and swings in a controllable manner by the operation of an electromagnetic motor (see Figure 4) 82. Furthermore, the other end of the second arm 70 opposite to the end connected to the first arm 68 is held in a position where the axis 86 extends in the Z direction. The shaft 86 is held by the second arm 70 so that it can rotate around its axis and slide in the Z direction. The shaft 86 rotates in a controllable manner by the operation of an electromagnetic motor (see Figure 4) 88 and slides in the Z direction in a controllable manner by the operation of an electromagnetic motor (see Figure 4) 90.

[0012] Furthermore, a mounting head 60 is positioned at the lower end of the shaft 86. As a result, the mounting head 60 moves to any position in the X and Y directions above the frame 40 by the operation of electromagnetic motors 78 and 82. The mounting head 60 also rotates by the operation of electromagnetic motor 88 and moves to any position in the vertical direction by the operation of electromagnetic motor 90.

[0013] As shown in Figure 3, the mounting head 60 has a chuck 100, which consists of a pair of gripping claws 102 and a stopper 104. The pair of gripping claws 102 are held by the mounting head 60 so as to be able to move closer together and further apart, and grip a part by moving closer together and further apart in a controllable manner by the operation of an air cylinder (see Figure 4) 106, and release the gripped part. The stopper 104 is positioned between the pair of gripping claws 102 and positions the part gripped by the pair of gripping claws 102 by contacting the upper surface of the part gripped by the pair of gripping claws 102.

[0014] Furthermore, as shown in Figure 2, the mark camera 26 is mounted on the end of the second arm 70 that holds the shaft 86 via a bracket 107, facing downwards, and moves in the X and Y directions together with the mounting head 60. As a result, the mark camera 26 captures images of any position on the frame 40. Also, as shown in Figure 1, the part camera 28 is positioned on the frame 40 next to the substrate transport and holding device 22, facing upwards. As a result, the part camera 28 captures images of the parts held by the chuck 100 of the mounting head 60.

[0015] A pair of parts supply devices 30 are arranged at both ends of the frame 40 in the Y direction. Each of the pair of parts supply devices 30 has a loose parts supply device 108 and a tray-type parts supply device 110. The loose parts supply device 108 is a device that aligns multiple parts that are scattered loosely and supplies the parts in an aligned state. The tray-type parts supply device 110 is a device that supplies parts that are placed on a tray (not shown).

[0016] As shown in Figure 4, the control device 36 comprises a controller 120, a plurality of drive circuits 122, and an image processing device 124. The plurality of drive circuits 122 are connected to the transport device 50, the clamping device 52, electromagnetic motors 78, 82, 88, 90, air cylinder 106, loose parts supply device 108, and tray-type parts supply device 110. The controller 120 is a computer-based system equipped with a CPU, ROM, RAM, etc., and is connected to the plurality of drive circuits 122. As a result, the operation of the substrate transport and holding device 22, the parts mounting device 24, etc., is controlled by the controller 120. The controller 120 is also connected to the image processing device 124. The image processing device 124 processes image data obtained by the mark camera 26 and the parts camera 28, and the controller 120 acquires various information from the image data. The controller 120 stores a production program 128, and the controller 120 controls the operation of the substrate transport and holding device 22, the component mounting device 24, etc., according to the production program 128, thereby performing the operation of mounting components onto the circuit board 12. The component mounting machine 10 can mount various components onto the circuit board 12, but the case of mounting leaded components (see Figure 5) 130 onto the circuit board 12 will be described below.

[0017] Specifically, in accordance with the production program 128, the controller 120 commands the transport device 50 to transport the circuit board 12 to the work position, where the clamp device 52 holds the circuit board 12 in place. Next, in accordance with the production program 128, the controller 120 commands the mark camera 26 to move above the circuit board 12 and image the circuit board 12. This allows the controller 120 to acquire information regarding the position of a pair of through holes (see Figure 5) 132 formed in the circuit board 12. The through holes 132 are circular holes with a circular cross-sectional shape, and the inner diameter of the through holes 132 is a predetermined dimension larger than the outer diameter of the lead (see Figure 5) 136 of the lead component 130.

[0018] Furthermore, in accordance with the production program 128, the controller 120 commands the loose parts supply device 108 or the tray-type parts supply device 110 to supply the leaded parts 130 at a predetermined supply position. As shown in Figure 5, the leaded parts 130 generally include a block-shaped part body 138 and two leads 136 extending from the bottom surface of the part body 138. Then, in accordance with the production program 128, the controller 120 commands the mounting head 60 to move above the supply position of the parts, and the chuck 100 grips the part body 138 of the leaded parts 130 with a pair of gripping claws 102. At this time, the chuck 100 grips the part body 138 with the pair of gripping claws 102 while the backing plate 104 is in contact with the upper surface of the part body 138 of the leaded parts 130.

[0019] Next, in accordance with the production program 128, the controller 120 commands the mounting head 60 to move above the parts camera 28, and the parts camera 28 images the leaded component 130 held in the chuck 100. As a result, the controller 120 obtains information regarding the tip positions of the pair of leads 136. Subsequently, in accordance with the production program 128, the controller 120 commands the mounting head 60 to move above the circuit board 12, and adjusts the holding posture of the held component based on information regarding the positions of the pair of through holes 132 in the circuit board 12 and the tip positions of the pair of leads 136 of the leaded component 130 held in the chuck 100. At this time, the movement and holding posture of the mounting head 60 are adjusted so that the positions of the pair of through holes 132 in the circuit board 12 and the tip positions of the pair of leads 136 of the leaded component 130 held in the chuck 100 coincide in the vertical direction.

[0020] Then, as the mounting head 60 moves so that the positions of the pair of through holes 132 and the tip positions of the pair of leads 136 coincide in the vertical direction, the mounting head 60 descends. As a result, as shown in Figure 5, the tips of the pair of leads 136 of the lead component 130 are inserted into the pair of through holes 132 of the circuit board 12. The mounting head 60 then descends until the lower surface of the component body 138 of the lead component 130 contacts the upper surface of the circuit board 12, and the pair of gripping claws 102 separate, releasing the gripped lead component 130. In other words, the mounting head 60 descends until the leads 136 of the lead component 130 are inserted into the through holes 132 at their base, and the pair of gripping claws 102 separate, releasing the gripped lead component 130. In this way, the leaded component 130 is mounted on the circuit board 12 by inserting the leads 136 of the leaded component 130 into the through holes 132 of the circuit board 12.

[0021] Furthermore, the lead 136a of the lead component 130a shown in Figure 5 extends in a straight shape, and as described above, the inner diameter of the through hole 132 is larger by a predetermined dimension than the outer diameter of the lead 136a. Therefore, when the tip of the lead 136a is inserted into the through hole 132 and then inserted all the way to the base, the lead 136a can be inserted into the through hole 132 without pressing down on the lead component 130a. On the other hand, as shown in Figure 6, the lead 136b of the lead component 130b is kinked, and a bent portion 140 is formed in the center of the lead 136b. When inserting the lead 136 with the bent portion 140 into the through hole 132 all the way to the base, the bent portion 140 catches on the outer edge of the through hole 132, so it is necessary to press down on the lead component 130b. In other words, when the tip of the lead 136b is inserted into the through hole 132 and then inserted all the way to the base, the lead component 130b is pressed against it, allowing the lead 136b to be press-fitted into the through hole 132. When the lead 136b is press-fitted into the through hole 132, the main body 138b of the lead component 130b is pressed against it by the backing plate 104. Thus, the lead component 130 includes a lead component 130b that is installed by press-fitting the lead 136b into the through hole 132 (hereinafter referred to as the "press-fit lead component") 130b, and a lead component 130a that is installed by inserting the lead 136a into the through hole 132 without press-fitting it (hereinafter referred to as the "inserted lead component").

[0022] Furthermore, during the installation of the lead component 130, where the leads 136 of the lead component 130 are inserted into the through-holes 132 of the circuit board 12, insertion errors may occur. In such cases, it is necessary to detect the insertion error and stop the operation of the component mounting machine 10. An insertion error occurs when the leads 136 of the lead component 130 cannot be inserted all the way into the through-holes 132, resulting in the component body 138 being lifted away from the circuit board 12. For example, an insertion error can occur if the tip of the lead 136 cannot be inserted into the through-hole 132. Also, if an insertion error occurs during the installation of the press-fit lead component 130b, and the lead component 130b is pressed even though the tip of the lead 136 is not inserted into the through-hole 132, the reaction force of the force pressing the lead component 130b will be applied to the mounting head 60 and the articulated robot 62. For this reason, it is necessary to prevent excessive reaction forces from being applied to the mounting head 60 and the articulated robot 62 during the installation of the press-fit lead component 130b.

[0023] In view of the above, the mounting head 60 is equipped with a press-fitting abnormality detection mechanism 150 that detects whether or not an abnormality occurs when inserting the lead 136b of the press-fitting lead component 130b into the through hole 132, and an insertion abnormality detection mechanism 152 that detects whether or not an abnormality occurs when inserting the lead 136a of the insertion lead component 130a into the through hole 132, as shown in Figures 3, 7 to 9. Specifically, the mounting head 60 comprises a head body 160, a lower block 162, an intermediate block 164, and an upper block 166. The lower block 162 is held by the head body 160 so as to be slidable in the vertical direction, and a chuck 100 is provided on the lower surface of the lower block 162. The upper block 166 is fixedly held by the head body 160 above the lower block 162, and the upper block 166 is fixed to the lower end of the axis 86 of the articulated robot 62. Furthermore, the intermediate block 164 is held in place by the head body 160 so as to be slidable in the vertical direction between the lower block 162 and the upper block 166. The lower block 162 and the intermediate block 164 are connected by an insertion abnormality detection mechanism 152, and the intermediate block 164 and the upper block 166 are connected by a press-fitting abnormality detection mechanism 150.

[0024] The insertion abnormality detection mechanism 152 includes two rods 170, two sleeves 172, two coil springs 174, a detection pin 176, and a detection sensor 178. Each of the two rods 170 is fixedly erected on the upper surface of the lower block 162. Each of the two sleeves 172 is generally cylindrical in shape and is fixedly fitted into a through hole 180 formed in the intermediate block 164. Each of the two sleeves 172 extends downward from the lower surface of the intermediate block 164. Each of the two sleeves 172 has a flange portion 182 at its upper end, and is fixed to the upper surface of the intermediate block 164 at the flange portion 182. The inner diameter of the sleeve 172 is slightly larger than the outer diameter of the rod 170, and the rod 170 is inserted into the sleeve 172. The sleeve 172 is shorter than the rod 170, and the portion of the rod 170 except for the lower end is inserted into the sleeve 172, but the lower end of the rod 170 is not inserted into the sleeve 172 and is exposed. A coil spring 174 is placed on the outer surface of the exposed lower end of the rod 170 in a state of compression between the lower end of the sleeve 172 and the upper surface of the lower block 162. As a result, the lower block 162 is connected to the intermediate block 164, and the lower block 162 slides upward, that is, toward the intermediate block 164, against the elastic force of the coil spring 174.

[0025] Furthermore, a detection pin 176 is fixedly erected on the upper end of one of the two rods 170, and the upper end of the detection pin 176 extends upward from the upper end of the sleeve 172. The detection sensor 178 is a photomicrosensor and consists of a light-emitting unit 190 and a light-receiving unit 192. The light-emitting unit 190 and the light-receiving unit 192 are arranged facing each other, and the light-receiving unit 192 receives the light emitted from the light-emitting unit 190. The distance between the light-emitting unit 190 and the light-receiving unit 192, which are arranged facing each other, is longer than the outer diameter of the detection pin 176, and the detection sensor 178 is positioned so that the upper end of the detection pin 176 can enter between the light-emitting unit 190 and the light-receiving unit 192.

[0026] When the lower block 162 is in a position where it is not sliding upward against the elastic force of the coil spring 174 (hereinafter referred to as the "first reference position"), the upper end of the detection pin 176 is located slightly below the optical axis of the light emitted from the light-emitting unit 190. Therefore, when the lower block 162 is in the first reference position, the light-receiving unit 192 receives the light emitted from the light-emitting unit 190. Then, when the lower block 162 slides upward against the elastic force of the coil spring 174 from the first reference position, the upper end of the detection pin 176 moves above the optical axis of the light emitted from the light-emitting unit 190. Therefore, when the lower block 162 slides upward from the first reference position, the detection pin 176 blocks the light emitted from the light-emitting unit 190, and the light-receiving unit 192 does not receive the light emitted from the light-emitting unit 190. This allows the detection sensor 178 to detect whether the lower block 162 is in the first reference position or has slid upward from the first reference position. Note that the lower block 162 is restricted from sliding downward from the first reference position by a stopper (not shown).

[0027] Furthermore, a stopper 196 is erected between two rods 170 on the upper surface of the lower block 162. The length of the stopper 196 is shorter than the length of the rods 170, so that when the lower block 162 is in the first reference position, the upper end of the stopper 196 is below the lower surface of the intermediate block 164. On the other hand, when the lower block 162 slides upward by a predetermined distance from the first reference position, the upper end of the stopper 196 comes into contact with the lower surface of the intermediate block 164. As a result, when the lower block 162 slides upward by a predetermined distance from the first reference position, the stopper 196 restricts the lower block 162 from approaching the intermediate block 164.

[0028] The press-fit abnormality detection mechanism 150 also includes a sleeve 200, a coil spring 202, a detection pin 204, and a detection sensor 206. The sleeve 200 is generally cylindrical in shape. However, the outer diameter of the upper end of the sleeve 200 is smaller than the outer diameter of the lower end, and an annular stepped surface 208 is formed on the outer circumferential surface of the sleeve 200. The sleeve 200 is fixedly erected on the upper surface of the intermediate block 164 at its lower end and is connected to the upper block 166. More specifically, the upper block 166 is integrally formed from a disc-shaped block body 210 and a rod 212 extending downward from the center of the lower surface of the block body 210. The outer diameter of the rod 212 of the upper block 166 is slightly smaller than the inner diameter of the sleeve 200, and the rod 212 is inserted into the sleeve 200 from its lower end. Furthermore, a coil spring 202 is positioned on the outer circumferential surface of the sleeve 200 above the stepped surface 208, compressed between the stepped surface 208 of the sleeve 200 and the lower surface of the block body 210 of the upper block 166. As a result, the intermediate block 164 is connected to the upper block 166, and the intermediate block 164 slides upward, that is, toward the upper block 166, against the elastic force of the coil spring 202.

[0029] Furthermore, the detection pin 204 is fixed to the lower surface of the block body 210 of the upper block 166 in a position where it extends downward. The detection sensor 206, like the detection sensor 178, is a photomicrosensor and consists of a light-emitting unit 220 and a light-receiving unit 222. The light-emitting unit 220 and the light-receiving unit 222 are arranged facing each other, and the light-receiving unit 222 receives the light emitted from the light-emitting unit 220. The distance between the light-emitting unit 220 and the light-receiving unit 222, which are arranged facing each other, is longer than the outer diameter of the detection pin 204, and the detection sensor 206 is arranged in the intermediate block 164 at a position where the lower end of the detection pin 204 can enter between the light-emitting unit 220 and the light-receiving unit 222.

[0030] When the intermediate block 164 is in a position where it is not sliding upward against the elastic force of the coil spring 202 (hereinafter referred to as the "second reference position"), the lower end of the detection pin 204 is located slightly above the optical axis of the light emitted from the light-emitting unit 220. Therefore, when the intermediate block 164 is in the second reference position, the light-receiving unit 222 receives the light emitted from the light-emitting unit 220. Then, when the intermediate block 164 slides upward against the elastic force of the coil spring 202 from the second reference position, the lower end of the detection pin 204 moves below the optical axis of the light emitted from the light-emitting unit 220. Therefore, when the intermediate block 164 slides upward from the second reference position, the detection pin 204 blocks the light emitted from the light-emitting unit 220, and the light-receiving unit 222 does not receive the light emitted from the light-emitting unit 220. This allows the detection sensor 206 to detect whether the intermediate block 164 is located at the second reference position or has slid above the second reference position. Note that the sliding of the intermediate block 164 below the second reference position is restricted by a stopper (not shown).

[0031] Furthermore, the elastic modulus of the coil spring 202 of the press-fitting abnormality detection mechanism 150 is greater than that of the coil spring 174 of the insertion abnormality detection mechanism 152. In other words, the elastic modulus of the coil spring 174 is smaller than that of the coil spring 202. Therefore, when the lower block 162 slides upward, a force acts on the intermediate block 164 to slide the lower block 162 upward, but because the elastic modulus of the coil spring 174 is smaller than that of the coil spring 202, the coil spring 174 is compressed before the coil spring 202. In other words, when the lower block 162 slides upward, only the lower block 162 slides upward first, and the intermediate block 164 does not slide upward. When the lower block 162 slides upward, the detection sensor 178 detects that the lower block 162 has slid above the first reference position.

[0032] Then, as the lower block 162 slides further upward, the upper end of the stopper 196 comes into contact with the lower surface of the intermediate block 164. As a result, the intermediate block 164 is pushed up by the stopper 196 as the lower block 162 rises. At this time, the intermediate block 164 slides upward against the elastic force of the coil spring 202. When the intermediate block 164 slides upward, the detection sensor 206 detects that the intermediate block 164 has slid above the second reference position.

[0033] With this structure, the mounting head 60 detects whether or not an abnormality occurs when inserting the lead 136a of the insertion lead component 130a into the through hole 132 using the insertion abnormality detection mechanism 152. Specifically, as shown in Figure 5, the lead 136a of the insertion lead component 130a extends in a straight shape, and the inner diameter of the through hole 132 is larger than the outer diameter of the lead 136a by a predetermined dimension. Therefore, when inserting the lead 136a of the insertion lead component 130a into the through hole 132 to its base, the lead component 130a is not pressed, and no reaction force due to pressing is applied to the chuck 100. In other words, when inserting the lead 136a of the insertion lead component 130a into the through hole 132 to its base, no reaction force due to pressing is applied to the lower block 162 on which the chuck 100 is located, and therefore the lower block 162 does not slide upward against the elastic force of the coil spring 174. Furthermore, when the lead 136a of the insertion lead component 130a is inserted into the through hole 132 to its base, the downward movement of the mounting head 60 stops. Therefore, when the lead 136a of the insertion lead component 130a is inserted into the through hole 132 to its base, the detection sensor 178 detects that the lower block 162 is in the first reference position. In this way, when the detection sensor 178 detects that the lower block 162 is in the first reference position during the mounting of the insertion lead component 130a, the controller 120 determines that the lead 136a of the insertion lead component 130a has been inserted into the through hole 132 to its base. In other words, the controller 120 determines that no abnormality occurred during the mounting of the insertion lead component 130a and that the insertion lead component 130a has been properly mounted on the circuit board 12.

[0034] On the other hand, when inserting the lead 136a of the insertion lead component 130a, an insertion error may occur if the tip of the lead 136a is not inserted into the through hole 132. Also, while the lead 136a of the insertion lead component 130a is normally straight, in an abnormal insertion lead component 130a, the lead 136a may be deformed from its straight shape. In such cases, even if the tip of the lead 136a is inserted into the through hole 132 when inserting the lead 136a of the insertion lead component 130a, the deformed portion of the lead 136a, such as a bent or curved portion, may catch on the outer edge of the through hole 132, resulting in an insertion error. When such an insertion error occurs, the insertion lead component 130a is pressed by the chuck 100, even though it is an insertion lead component 130a. As a result of the insertion lead component 130a being pressed by the chuck 100, a reaction force due to the pressing is applied to the chuck 100. Therefore, a reaction force due to the pressing is applied to the lower block 162 on which the chuck 100 is located, causing the lower block 162 to slide upward against the elastic force of the coil spring 174. At this time, the detection sensor 178 detects that the lower block 162 is above the first reference position. Therefore, when the detection sensor 178 detects that the lower block 162 is above the first reference position during the installation of the insertion lead component 130a, the controller 120 determines that the lead 136a of the insertion lead component 130a has not been inserted all the way into the through hole 132. In other words, the controller 120 determines that an abnormality occurred during the installation of the insertion lead component 130a and that the insertion lead component 130a has not been properly installed on the circuit board 12. In this way, when an abnormality is detected during the installation of the insertion lead component 130a, the operation of the component mounting machine 10 stops and an error notification is issued. This makes it possible to appropriately detect insertion errors of the insertion lead component 130a.

[0035] Furthermore, the mounting head 60 detects whether or not an abnormality occurs when inserting the lead 136b of the press-fit lead component 130b into the through hole 132 using the press-fit abnormality detection mechanism 150. Specifically, as shown in Figure 6, the lead 136b of the press-fit lead component 130b has a bent portion 140 formed on it, and when inserting the lead 136b of the press-fit lead component 130b into the through hole 132 to its base, the bent portion 140 of the lead 136b catches on the outer edge of the through hole 132. As a result, the press-fit lead component 130b is pressed by the chuck 100, and a reaction force due to the pressing is applied to the chuck 100. In other words, when inserting the lead 136b of the press-fit lead component 130b into the through hole 132 to its base, a reaction force due to the pressing is also applied to the lower block 162 on which the chuck 100 is located, causing the lower block 162 to slide upward against the elastic force of the coil spring 174. At this point, the detection sensor 178 detects that the lower block 162 is above the first reference position. However, when the lead 136b of the press-fit lead component 130b is inserted into the through hole 132 to its base, the bent portion 140 of the lead 136b catches on the outer edge of the through hole 132, and the press-fit lead component 130b is naturally pressed by the chuck 100. As a result, the lower block 162 slides upward against the elastic force of the coil spring 174 due to the reaction force of the pressing, and even though the detection sensor 178 detects that the lower block 162 is above the first reference position, the controller 120 determines that no abnormality occurred during the installation of the press-fit lead component 130b. In other words, the controller 120 issues an error alert when the detection sensor 178 detects that the lower block 162 is above the first reference position during the installation of the insertion lead component 130a, but does not issue an error alert when the detection sensor 178 detects that the lower block 162 is above the first reference position during the installation of the press-fit lead component 130b. When the lead 136b of the press-fit lead component 130b is inserted all the way into the through hole 132, the descent of the installation head 60 stops.Thus, when the detection sensor 178 detects that the lower block 162 is above the first reference position during the installation of the press-fit lead component 130b, the controller 120 determines that the lead 136b of the press-fit lead component 130b has been inserted into the through hole 132 to its base. In other words, the controller 120 determines that no abnormality occurred during the installation of the press-fit lead component 130b and that the press-fit lead component 130b has been properly installed on the circuit board 12.

[0036] On the other hand, when inserting the lead 136b of the press-fit lead component 130b, an insertion error may occur if the tip of the lead 136b is not inserted into the through hole 132. Also, the bent portion 140 formed on the lead 136b of the press-fit lead component 130b may be excessively bent. In such cases, even if the tip of the lead 136b is inserted into the through hole 132 when inserting the lead 136b of the press-fit lead component 130b, an insertion error may occur if the excessively bent portion 140 cannot enter the through hole 132. When an insertion error of the press-fit lead component 130b occurs in this way, the press-fit lead component 130b is pressed by the chuck 100, and a reaction force due to the pressing is applied to the chuck 100. Therefore, as described above, a reaction force due to the pressing is also applied to the lower block 162 on which the chuck 100 is located, and the lower block 162 slides upward against the elastic force of the coil spring 174. In this case, the detection sensor 178 detects that the lower block 162 is above the first reference position, but even if the detection sensor 178 detects that the lower block 162 is above the first reference position during the installation of the press-fit lead component 130b, no error notification is issued.

[0037] Furthermore, if an insertion error occurs, the lead 136b will not be inserted all the way into the through hole 132, and the descent of the mounting head 60 will not stop. As a result, when the mounting head 60 descends with an insertion error in the press-fit lead part 130b, the lower block 162 slides further upward against the elastic force of the coil spring 174, and the upper end of the stopper 196 contacts the lower surface of the intermediate block 164. As a result, the intermediate block 164 is pushed up by the stopper 196 as the lower block 162 rises. At this time, the intermediate block 164 slides upward against the elastic force of the coil spring 202. The detection sensor 206 then detects that the intermediate block 164 is above the second reference position. Therefore, when the intermediate block 164 is detected by the detection sensor 206 to be above the second reference position during the installation of the press-fit lead component 130b, the controller 120 determines that the lead 136b of the press-fit lead component 130b has not been inserted all the way into the through hole 132. In other words, the controller 120 determines that an abnormality occurred during the installation of the press-fit lead component 130b and that the press-fit lead component 130b has not been properly installed on the circuit board 12. When an abnormality is detected during the installation of the press-fit lead component 130b in this way, the operation of the component mounting machine 10 stops and an error notification is issued. This makes it possible to properly detect insertion errors of the press-fit lead component 130b.

[0038] As mentioned above, the elastic modulus of the coil spring 202 of the press-fitting abnormality detection mechanism 150 is set to be greater than that of the coil spring 174 of the insertion abnormality detection mechanism 152, but it is set to be within a range of load that will not damage the articulated robot 62, etc. In other words, the elastic modulus of the coil spring 202 of the press-fitting abnormality detection mechanism 150 is set to a value at which it will elastically deform when a load that could potentially damage the articulated robot 62, etc. is applied to the chuck 100. By setting the elastic modulus of the coil spring 202 of the press-fitting abnormality detection mechanism 150 in this way, it is possible to prevent damage to the articulated robot 62, etc., in the event of an insertion error of the press-fitted lead part 130b.

[0039] Furthermore, the production program 128 for mounting parts is programmed to determine whether the lead part to be mounted is an insertable lead part 130a or a press-fit lead part 130b, and the controller 120 detects insertion errors according to the programmed type of lead part. In other words, when the lead part to be mounted is an insertable lead part 130a, the controller 120 detects insertion errors according to the detection result of the detection sensor 178, and when the lead part to be mounted is a press-fit lead part 130b, the controller 120 detects insertion errors according to the detection result of the detection sensor 206. This makes it possible to appropriately detect insertion errors for both insertable lead parts 130a and press-fit lead parts 130b.

[0040] Furthermore, the press-fitting abnormality detection mechanism 150 and the insertion abnormality detection mechanism 152 utilize detection sensors 178 and 206 to detect insertion errors, thereby suppressing cost increases. Specifically, in articulated robots, force sensors are often used to monitor the operation of the articulated robot. Force sensors detect forces, torques, etc., applied from various directions and are expensive. On the other hand, detection sensors 178 and 206 are micro-photosensors and are inexpensive. Therefore, by using detection sensors 178 and 206 to detect insertion errors, it is possible to suppress cost increases.

[0041] Furthermore, the press-fitting abnormality detection mechanism 150 and the insertion abnormality detection mechanism 152 detect insertion errors according to the amount of upward sliding of the lower block 162 and the intermediate block 164. In other words, insertion errors are detected according to the amount of movement of the lower block 162 and the intermediate block 164 in the Z direction. Thus, in order to detect insertion errors according to the amount of movement in one direction, using force sensors capable of detecting forces, torques, etc. applied from various directions is functionally inefficient and also complicates control. Considering these factors, the practicality of the press-fitting abnormality detection mechanism 150 and the insertion abnormality detection mechanism 152 is improved by using detection sensors 178 and 206 to detect insertion errors.

[0042] Note that the circuit substrate 12 is an example of a substrate. The mounting head 60 is an example of a mounting head. The chuck 100 is an example of a holding tool. The lead component 130 is an example of a lead component. The through hole 132 is an example of an insertion hole. The lead 136 is an example of a lead. The press-fitting abnormality detection mechanism 150 is an example of a press-fitting abnormality detection mechanism. The insertion abnormality detection mechanism 152 is an example of an insertion abnormality detection mechanism. The coil spring 174 is an example of a first elastic body. The coil spring 202 is an example of a second elastic body.

[0043] As described above, the above-described embodiments have the following effects.

[0044] The mounting head 60 includes a chuck 100 that holds the lead component 130, a press-fitting abnormality detection mechanism 150, and an insertion abnormality detection mechanism 152. The press-fitting abnormality detection mechanism 150 detects the occurrence of an abnormality when the lead 136 of the lead component 130 held by the chuck 100 is press-fitted into the through hole 132. Further, the insertion abnormality detection mechanism 152 detects the occurrence of an abnormality when the lead 136 of the lead component 130 held by the chuck 100 is inserted into the through hole 132. Thereby, it is possible to appropriately detect an insertion error both when the lead 136 of the lead component 130 is press-fitted into the through hole 132 and when the lead 136 of the lead component 130 is inserted into the through hole 132.

[0045] Furthermore, the chuck 100 is held so as to be slidable vertically by the head body 160 of the mounting head 60. The insertion abnormality detection mechanism 152 detects whether an abnormality has occurred based on whether the lower block 162 on which the chuck 100 is located has slid upward from the first reference position. The press-fit abnormality detection mechanism 150 detects whether an abnormality has occurred based on whether the intermediate block 164 has slid upward from the second reference position, as the stopper 196 comes into contact with the intermediate block 164 as the lower block 162 on which the chuck 100 is located rises. In other words, the insertion abnormality detection mechanism 152 and the press-fit abnormality detection mechanism 150 detect whether an abnormality has occurred based on the amount of upward sliding of the chuck 100. This makes it possible to appropriately detect insertion errors with a simple mechanism in both cases: when press-fitting the lead 136 of the lead component 130 into the through hole 132 and when inserting the lead 136 of the lead component 130 into the through hole 132.

[0046] Furthermore, the insertion abnormality detection mechanism 152 includes a coil spring 174 that exerts elastic force when the chuck 100 slides upward, and detects whether an abnormality has occurred based on the amount of slide when the chuck 100 slides upward against the elastic force of the coil spring 174. Similarly, the press-fitting abnormality detection mechanism 150 includes a coil spring 202 that exerts elastic force when the chuck 100 slides upward, and detects whether an abnormality has occurred based on the amount of slide when the chuck 100 slides upward against the elastic force of the coil spring 202. This makes it possible to appropriately detect insertion errors with a simple mechanism in both cases: when press-fitting the lead 136 of the lead component 130 into the through hole 132, and when inserting the lead 136 of the lead component 130 into the through hole 132.

[0047] Furthermore, the elastic modulus of the coil spring 202 of the press-fitting abnormality detection mechanism 150 is greater than that of the coil spring 174 of the insertion abnormality detection mechanism 152. This allows for the detection of insertion errors of the insertion lead component 130a when a relatively small reaction force is applied to the chuck 100, and for the detection of insertion errors of the press-fitting lead component 130b when a relatively large reaction force is applied to the chuck 100.

[0048] Also, the insertion error of the insertion lead component 130a is detected by the insertion abnormality detection mechanism 152, and the insertion error of the press-fit lead component 130b is detected by the press-fit abnormality detection mechanism 150. That is, whether to detect the presence or absence of an abnormality using either the insertion abnormality detection mechanism 152 or the press-fit abnormality detection mechanism 150 is set for each component to be mounted. Thereby, it becomes possible to appropriately detect an insertion error in either the insertion lead component 130a or the press-fit lead component 130b.

[0049] Further, the present invention is not limited to the above-described embodiments, and can be implemented in various modes in which various changes and improvements are made based on the knowledge of those skilled in the art. For example, in the above embodiment, the coil springs 174 and 202 are employed as the elastic bodies that exhibit an elastic force when the lower block 162 and the intermediate block 164 slide upward, but various elastic bodies such as torsion springs, air springs, and rubber can be employed. Also, it is possible to employ an oil damper, a viscous damper, etc. that absorb energy, and when they are employed, the amount of energy absorption can be changed by adjusting the viscosity.

[0050] Also, in the above embodiment, the presence or absence of an abnormality during insertion and press-fitting is detected based on the slide amounts of the lower block 162 and the intermediate block 164, that is, the slide amount of the chuck 100, but the presence or absence of an abnormality during insertion and press-fitting may be detected using a load sensor or the like.

[0051] Also, in the above embodiment, the articulated robot 62 is employed as the device for moving the mounting head 60, but a moving device that moves the mounting head 60 in each of the X direction, the Y direction, and the Z direction may be employed. Also, in the above embodiment, the mounting head 60 moves to an arbitrary position, but the circuit base material 12 may move to an arbitrary position.

[0052] Also, in the above embodiment, the chuck 100 is employed as the holder for holding the lead component 130, but a suction nozzle or the like may be employed.

[0053] Furthermore, in the above embodiment, a through hole 132 is used as the insertion hole into which the lead is inserted, but various types of insertion holes can be used as long as they have an inner wall surface, such as a bottomed hole or a recess.

[0054] 12: Circuit board (substrate) 60: Mounting head 100: Chuck (holding device) 130: Lead component 132: Through hole (insertion hole) 136: Lead 150: Press-fitting abnormality detection mechanism 152: Insertion abnormality detection mechanism 174: Coil spring (first elastic body) 202: Coil spring (second elastic body)

Claims

1. A mounting head comprising: a holder for holding lead components; an insertion abnormality detection mechanism for detecting whether an abnormality occurs when inserting the leads of the lead components held by the holder into an insertion hole formed in a substrate; and a press-fitting abnormality detection mechanism for detecting whether an abnormality occurs when press-fitting the leads of the lead components held by the holder into the insertion hole.

2. The mounting head according to claim 1, wherein the holder is held by the mounting head so as to be slidable in the vertical direction, and the insertion abnormality detection mechanism and the press-fit abnormality detection mechanism detect whether or not an abnormality has occurred based on the amount of vertical sliding of the holder.

3. The mounting head according to claim 2, wherein the insertion abnormality detection mechanism comprises a first elastic body that exerts elastic force when the holder slides upward, and detects whether or not an abnormality has occurred based on the amount of slide when the holder slides upward against the elastic force of the first elastic body, and the press-fit abnormality detection mechanism comprises a second elastic body that exerts elastic force when the holder slides upward, and detects whether or not an abnormality has occurred based on the amount of slide when the holder slides upward against the elastic force of the second elastic body.

4. The mounting head according to claim 3, wherein the elastic modulus of the second elastic body is greater than the elastic modulus of the first elastic body.

5. The mounting head according to any one of claims 1 to 4, wherein the method of detecting whether or not an abnormality has occurred is set for each component to be mounted, using either the insertion abnormality detection mechanism or the press-fitting abnormality detection mechanism.

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