Component mounting machine and component picking and mounting method

Abstract

This component mounting machine comprises: a tape feeder that feeds a base tape having cavities formed at a predetermined pitch with components accommodated in the cavities and a cover tape covering the cavities peeled off, and that supplies the components at a supply position; a mounting head that has a component mounting tool for performing a picking and mounting operation for picking the components from the cavities and mounting the components on a substrate, and that moves between the tape feeder and the substrate; a camera that moves integrally with the mounting head and captures images of the components accommodated in the cavities at an imaging position; and a control device that stops the base tape and causes the camera to perform imaging when the tape feeder feeds the base tape and a leading cavity accommodating a component advances beyond the supply position to the imaging position, obtains positions of a plurality of components between the supply position and the imaging position in consideration of the predetermined pitch, and controls an initial operation in which the component mounting tool performs the picking and mounting operation for the plurality of components between the supply position and the imaging position.

Description

Component Mounting Machine and Component Pick-and-Place Method

[0001] This specification relates to a component mounting machine equipped with a tape feeder and a component pick-and-place method using the component mounting machine.

[0002] Technologies for mass-producing substrate products by performing substrate work on a substrate on which a circuit pattern is formed have become widespread. Furthermore, it has become common to arrange a plurality of types of substrate working machines side by side to form a production line for substrate products. As a representative example of a substrate working machine, there is a component mounting machine that performs a component mounting operation with a tape feeder that supplies components using a carrier tape. The tape feeder peels off a cover tape that covers cavities from a base tape having a plurality of cavities for accommodating components, enabling the picking of components at a supply position. In order to stabilize the component picking operation, in addition to controlling the tape feed amount, the components at the supply position are imaged to detect their actual positions. One technical example of imaging the supply position of a tape feeder to detect the position of components is disclosed in Patent Document 1.

[0003] Patent Document 1 discloses a component mounting method in which an opening (supply position) for component suction is imaged with a substrate recognition camera, and when two components on the carrier tape are exposed, the exposed components are made into one by adjusting the tape feed position and the component is suctioned (see paragraphs 0039, 0042, and FIG. 7). According to this, it is said that the dropping of the component next to the component to be suctioned can be prevented. Furthermore, it is described that when two components are exposed, one component may be suctioned as it is, reducing the tact loss while leaving the possibility that another component may pop out (drop off) (see paragraph 0047).

[0004] Japanese Unexamined Patent Application Publication No. 2017 - 157653

[0005] Incidentally, in the technical example of Patent Document 1, the actual position of the component is confirmed by a substrate recognition camera, which is preferable because it allows for stable suction (pickup) operation. However, in some models of component mounting machines, the substrate recognition camera is not able to move to the supply position of the tape feeder, and it is assumed that imaging is performed at a position within the movable range of the substrate recognition camera that has moved downstream from the supply position. In this configuration, problems arising from the distance between the supply position and the imaging position are a concern. For example, it is troublesome to return the tape from the imaging position to the supply position after imaging, and if the tape is not returned, the positions of multiple components from the supply position to the imaging position may become unknown, and furthermore, there is a risk that components may scatter.

[0006] Therefore, the problem to be solved in this specification is to provide a component mounting machine and a component picking and mounting method that can stabilize the component picking operation while mitigating problems caused by the distance between the tape feeder supply position and the imaging position.

[0007] This specification discloses a component mounting machine comprising: a tape feeder that feeds a base tape from which a cover tape covering the cavity has been peeled off and which houses components in cavities formed at a predetermined pitch, and supplies the components at a supply position; a mounting head that moves between the tape feeder and the substrate and has a component mounting device that performs a picking and mounting operation to pick up components from the cavity and mount them on a substrate; a camera that moves integrally with the mounting head and images the components housed in the cavity at an imaging position; and a control device that stops the base tape when the tape feeder has fed the base tape and the first cavity housing the components has advanced beyond the supply position to the imaging position, performs imaging with the camera, determines the positions of a plurality of components from the supply position to the imaging position taking into account the predetermined pitch, and controls the initial operation of the component mounting device to perform the picking and mounting operation of a plurality of components from the supply position to the imaging position.

[0008] Furthermore, this specification discloses a component picking and mounting method using a component mounting machine comprising: a tape feeder that feeds a base tape from which a cover tape covering a cavity has been peeled off and which houses components in cavities formed at a predetermined pitch, and supplies components at a supply position; a mounting head that moves between the tape feeder and the substrate and has a component mounting device that performs a picking and mounting operation to pick up components from the cavities and mount them on a substrate; and a camera that moves integrally with the mounting head and images the components housed in the cavities at an imaging position, the method comprising: a component imaging step in which the tape feeder stops the base tape and performs imaging with the camera when the first cavity in which the component is housed, which has been fed by the base tape, has advanced beyond the supply position to the imaging position; a position identification step in which, following the component imaging step, the positions of a plurality of components located from the supply position to the imaging position are determined considering the predetermined pitch; and a picking and mounting step in which, following the position identification step, the component mounting device performs the picking and mounting operation on a plurality of components located from the supply position to the imaging position.

[0009] Furthermore, this specification discloses the technical idea of ​​changing "the parts mounting machine described in claim 3" to "the parts mounting machine described in claim 3 or 4" in claim 5 of the original application, and the technical idea of ​​changing "the parts mounting machine described in any one of claims 1-6" to "the parts mounting machine described in any one of claims 1-8" in claim 9 of the original application.

[0010] In the disclosed component mounting machine and component picking and mounting method, the camera images the components housed in the cavity of the base tape at an imaging position advanced beyond the supply position, and the control device determines the positions of all multiple components between the supply position and the imaging position, thereby stabilizing the component picking operation by the component mounting device. In addition, since the base tape is not returned after imaging by the camera, problems caused by the distance between the tape feeder's supply position and imaging position can be mitigated.

[0011] This is a schematic plan view showing an example of the overall configuration of the component mounting machine of the embodiment. This is a partial perspective view of the tape feeder illustrating the initial operation performed when the carrier tape or tape feeder is put into use. This is a partial perspective view of the tape feeder illustrating the normal operation performed after the initial operation is completed. This is a plan view illustrating the imaging position where the camera images the components of the tape feeder, and the method for determining the number of components between the supply position and the imaging position. This is a front cross-sectional view showing the operation of the suction nozzle during normal operation. This is a front cross-sectional view showing the operation of the suction nozzle during initial operation. This is a diagram illustrating the operation of the component mounting machine of the embodiment and the component picking and mounting method of the embodiment.

[0012] 1. Example of the overall configuration of the component mounting machine 1 First, an example of the overall configuration of the component mounting machine 1 of this embodiment will be explained with reference to Figure 1. The component mounting machine 1 produces circuit board products by performing the mounting work of mounting components onto a circuit board K. As shown by the arrow in the upper left of Figure 1, the horizontal direction from the left side to the right side of the paper is the X-axis direction for transporting the circuit board K, the horizontal direction from the bottom (front) side of the paper to the top (rear) side of the paper is the Y-axis direction, and the vertical direction is the Z-axis direction. The component mounting machine 1 is configured by assembling a circuit board transport device 2, a component supply device 3, a component transfer device 4, and a control device 5, etc., on a base 10.

[0013] The substrate transport device 2 has a pair of guide rails 21 that serve as the transport path for the substrate K. The substrate transport device 2 transports the substrate K, which has been brought into the loading end (left end in Figure 1) of the guide rails 21 by the substrate loading device or external transport device, along the guide rails 21 to a predetermined work position. The substrate transport device 2 has a positioning mechanism 22 that pushes up the substrate K at the work position and clamps it between itself and the guide rails 21. The component transfer device 4 then performs the component mounting operation on the positioned substrate K. After the mounting operation is completed, the substrate transport device 2 releases the substrate K and transports it to the discharge end (right end in Figure 1) and out of the machine.

[0014] The parts supply device 3 is positioned at the front of the upper surface of the base 10 in the Y-axis direction. The parts supply device 3 consists of a plurality of tape feeders 31 arranged in the X-axis direction. Each of the plurality of tape feeders 31 supplies parts using a reel on which a carrier tape CT (see Figure 2) is wound. The reel is held inside the body of the tape feeder 31 or held in a reel holding device located separately outside the tape feeder 31. The tape feeders 31 are detachably mounted on the parts supply device 3, and when the carrier tape CT is used up (when parts run out), the entire tape feeder 31 is replaced and the carrier tape CT (parts) is replenished. Alternatively, the tape feeders 31 are permanently installed on the parts supply device 3, and when the carrier tape CT is used up, the reel is replaced and the carrier tape CT (parts) is replenished.

[0015] The component transfer device 4 consists of a Y-axis moving body 41, an X-axis moving body 42, a mounting head 43, a nozzle holder 44, a suction nozzle 60, a mark camera 46, and a component camera 47. The Y-axis moving body 41 is formed from a member that is long in the X-axis direction and moves in the Y-axis direction when driven by a Y-axis drive mechanism (not shown). The X-axis moving body 42 is mounted on the Y-axis moving body 41 and moves in the X-axis direction when driven by an X-axis drive mechanism (not shown). The mounting head 43 is provided on the front of the X-axis moving body 42. The mounting head 43 is driven horizontally in two directions together with the X-axis moving body 42 and moves between the tape feeder 31 of the component supply device 3 and the substrate K.

[0016] A nozzle holder 44 with an axisymmetric shape is rotatably mounted on the underside of the mounting head 43. The nozzle holder 44 rotates around a vertical central axis, driven by an R-axis drive mechanism (not shown). The nozzle holder 44 holds a plurality of suction nozzles 60 on its underside and moves integrally with the mounting head 43. In the example shown in Figure 1, the nozzle holder 44 has four suction nozzles 60 that are equidistant from the vertical central axis and arranged at 90° intervals in the circumferential direction.

[0017] The suction nozzle 60 moves up and down driven by a lifting drive mechanism (not shown) and rotates around a vertical axis driven by a Q-axis drive mechanism (not shown). The suction nozzle 60 is further selectively supplied with negative pressure air and positive pressure air from an air supply mechanism (not shown). As a result, the suction nozzle 60 performs a suction operation (collection operation) to pick up components from the tape feeder 31, and a mounting operation to mount the picked-up components to the mounting position on the substrate K. The suction operation (collection operation) and the mounting operation are collectively referred to as the suction mounting operation (collection mounting operation).

[0018] The suction nozzle 60 is a component mounting device that performs a picking and mounting operation, picking up a component from the cavity CA of the base tape BT (see Figure 2) and mounting it to the substrate K. The detailed configuration of the suction nozzle 60 will be described later. The mounting head 43 may have multiple suction nozzles 60 arranged in a line or in a grid pattern, with the nozzle holder 44 omitted. Alternatively, a chuck for gripping and picking up a component may be provided on the mounting head 43 instead of the nozzle holder 44 and the suction nozzles 60.

[0019] The mark camera 46 is mounted on the X-axis moving body 42 and moves integrally with the mounting head 43. The mark camera 46 is positioned farther away from the tape feeder 31 than the mounting head 43. The mark camera 46 has an optical axis 461 that extends downward and captures images of the position marks on the substrate K from above. The image data acquired through imaging is processed to determine the actual work position where the substrate K is stopped.

[0020] The component camera 47 is mounted facing upward on the base 10 between the substrate transport device 2 and the component supply device 3. The component camera 47 captures images of the components held by the suction nozzle 60 from below as the mounting head 43 moves from the component supply device 3 to the substrate K. The image data acquired by the imaging is processed to determine whether the component is correct or incorrect, and furthermore, the position and orientation of the component relative to the suction nozzle 60 are detected and reflected in the mounting operation. Examples of mark cameras 46 and component cameras 47 include digital imaging devices having image sensors such as CCD (Charge Coupled Device) and CMOS (Complementary Metal Oxide Semiconductor).

[0021] The control device 5 is mounted on the base 10 and its position is not limited. The control device 5 is composed of a computer device with a CPU that operates using software. The control device 5 stores mounting job data received from a higher-level management device (not shown in the figure). Mounting job data is created for each type of substrate K (substrate product). The mounting job data includes shape data related to the shape of the substrate K and components, as well as coordinate data indicating the supply position and mounting position of the components. Furthermore, the mounting job data includes data related to the type and arrangement position of the tape feeder 31 and suction nozzle 60 to be used, as well as detailed procedure data for the mounting work. Based on the mounting job data, the control device 5 controls the substrate transport device 2, component supply device 3, and component transfer device 4 to repeatedly perform suction mounting operations of the components and advance the mounting work.

[0022] 2. Detailed Configuration of Tape Feeder 31 Next, the detailed configuration of the tape feeder 31 will be explained with reference to Figures 2-4. In Figures 2-4, the cover tape VT is shown with diagonal hatching for convenience, and the components P are shown with grid hatching for convenience. The carrier tape CT is formed including the base tape BT and the cover tape VT. The base tape BT houses the components P in cavities CA formed at a predetermined pitch PT. The cover tape VT is peelably attached to the base tape BT by two adhesive strips and covers the cavities CA. In new carrier tape CT, it is common for several cavities CA near the tip to be empty cavities that do not initially house components P. Also, in used carrier tape CT, it is common for several empty cavities to remain.

[0023] The tape feeder 31 peels the cover tape VT from the base tape BT so that the cavity CA is opened at a predetermined supply position 32. There are two methods for peeling the cover tape VT: a full peeling method that peels off two adhesive sections, and a partial peeling method that peels off one adhesive section to make the cover tape VT stand upright. Figure 2 shows an example of a tape feeder 31 using the full peeling method. This tape feeder 31 has a carrier tape feeding mechanism 34, a cover tape folding section 37, and a cover tape winding mechanism (not shown).

[0024] The carrier tape feeding mechanism 34 feeds the carrier tape CT and the base tape BT, from which the cover tape VT has been completely removed, in a predetermined feeding direction. In Figures 2 and 3, the lower right is the upstream side in the feeding direction, and the upper left is the downstream side in the feeding direction. The base tape BT is fed downstream in a generally horizontal direction through the supply position 32, and then fed in a gradually downward curving manner, and discharged below the tape feeder 31. The imaging position 33, which will be described later, is determined sometime downstream from the supply position 32, from which the base tape BT is fed horizontally.

[0025] The carrier tape feeding mechanism 34 consists of, for example, a sprocket 35 having teeth that engage with feed holes HS arranged in a row along the side edge of the base tape BT, and a feed motor that rotates the sprocket 35. The feed motor performs a continuous feeding operation to continuously feed the carrier tape CT and the base tape BT, and a pitch feeding operation to feed them in predetermined pitch PT increments. The carrier tape feeding mechanism 34 can also reverse the carrier tape CT and the base tape BT as needed.

[0026] The cover tape folding section 37 is positioned upstream of the supply position 32. The cover tape folding section 37 folds the fully peeled cover tape VT in the opposite direction to the feed direction. The cover tape winding mechanism winds up and collects the folded cover tape VT. The cover tape winding mechanism consists of, for example, a winding shaft that locks the leading edge of the cover tape VT, and a winding motor that rotates the winding shaft. The winding motor operates in synchronization with the feed motor of the carrier tape feed mechanism 34. As a result, the cover tape VT is wound up in synchronization with the feed of the base tape BT.

[0027] The cover tape winding mechanism is configured such that the winding motor rotates beyond the amount of winding necessary to prevent the cover tape VT from slackening, allowing slippage to occur between the winding motor and the winding shaft. Alternatively, the cover tape winding mechanism may be configured to transmit the rotation of the feed motor of the carrier tape feeding mechanism 34 to the winding shaft at a variable speed, and may also use a transmission mechanism that allows slippage to occur.

[0028] In the parts supply device 3, when the tape feeder 31 runs out of carrier tape CT, the reel or the tape feeder 31 is replaced. In the case of replacing the reel, the old reel is removed from the tape feeder 31 or reel holding device and a new reel is installed, and the carrier tape CT is pulled out from the new reel and loaded into the carrier tape feeding mechanism 34 and the cover tape winding mechanism. In the case of replacing the tape feeder 31, a tape feeder 31 with a new reel installed is prepared in advance and replaced with the tape feeder 31 that has run out of carrier tape CT.

[0029] 3. Imaging of component P at imaging position 33 by mark camera 46 Here, in order to stabilize the suction operation of the suction nozzle 60, it is preferable to image the component P at the supply position 32 to detect its actual position. However, adding a dedicated camera to the mounting head 43 to image the component P at the supply position 32 is not feasible due to space constraints and a significant cost increase. Instead, in this embodiment, a mark camera 46 is used. In other words, the mark camera 46 also serves as a camera to image the component P on the tape feeder 31.

[0030] The movable range MA of the mark camera 46 is determined by the movable ranges of the Y-axis movable body 41 and the X-axis movable body 42, and since the substrate K is the subject, it extends to almost the entire area of ​​the substrate transport device 2. However, although the suction nozzle 60 can move to the supply position 32, the mark camera 46 cannot move to the supply position 32. In other words, as shown in Figure 2, the supply position 32 is located outside the movable range MA of the mark camera 46. Furthermore, since the mark camera 46 is used for imaging position marks whose approximate positions are known, a general-purpose product (without wide-angle or fisheye lenses) with an imaging range limited to the vicinity of the optical axis 461 is used to reduce costs. Consequently, the mark camera 46 cannot image the component P at the supply position 32.

[0031] As a countermeasure, the control device 5 determines the imaging position 33 within the movable range MA of the mark camera 46, which has moved downstream from the supply position 32. More specifically, the control device 5 assumes the state shown in Figure 4. In Figure 4, the base tape BT has been fed and one cavity CA is located at the supply position 32. Meanwhile, the mark camera 46 has moved to the boundary of the movable range MA and is closest to the supply position 32. The minimum separation distance between the optical axis 461 of the mark camera 46 and the supply position 32 is LS. The minimum separation distance LS is automatically determined from the configuration of the component transfer device 4. The control device 5 determines the imaging position 33 based on the minimum separation distance LS and a predetermined pitch PT.

[0032] Specifically, the control device 5 finds a natural number n that satisfies the following inequality (1): (n-1)・PT < LS ≤ n・PT --- (1) Next, the control device 5 multiplies the found n by a predetermined pitch PT to obtain the separation distance LA between the supply position 32 and the imaging position 33. The separation distance LA points to the imaging position 33 and cavity CA located downstream of the supply position 32. Naturally, the imaging position 33 is located within the movable range MA of the mark camera 46. The control device 5 further adds 1 to the found n to determine the quantity NA of parts P (cavity CA) located between the supply position 32 and the imaging position 33.

[0033] In the example shown in Figure 4, n is 3. Therefore, the separation distance LA = (3・PT), and the number of parts P NA is four. Note that the predetermined pitch PT of the cavity CA varies depending on the size of the parts P to be housed. Therefore, depending on the carrier tape CT and the type of parts P, the imaging position 33 may move, and the number of parts P NA may increase or decrease.

[0034] With the suction nozzle 60 stopped, the tape feeder 31 performs a continuous feeding operation of the base tape BT. After this, the mark camera 46 can capture an image of the component P in the cavity CA at the imaging position 33 and acquire image data. The control device 5 can process the image data acquired by the mark camera 46 to determine the actual position of the component P at the imaging position 33. Furthermore, the control device 5 can determine the positions of multiple (four in Figures 2 and 4) component P located from the supply position 32 to the imaging position 33, taking into account a predetermined pitch PT, and stabilize the suction operation of the suction nozzle 60. When considering actual operation, two methods are conceivable: a first method in which the cavity CA at the imaging position 33 is returned to the supply position 32 by returning the base tape BT, and the suction operation of the component P is performed at the supply position 32; and a second method in which the suction operation of multiple component P located from the supply position 32 to the imaging position 33 is performed without returning the base tape BT.

[0035] In the first method, when the carrier tape feeding mechanism 34 returns the base tape BT, the cover tape winding mechanism operates in sync. At this time, the winding motor reverses direction and returns the cover tape VT beyond the required amount, which may cause the cover tape VT to slacken and bulge upward, potentially interfering with the suction nozzle 60, etc. To eliminate this risk, the cover tape VT can be manually returned before the start of production, but this increases the workload for the operator, delays the start of production, and increases the risk of forgetting to return the cover tape VT.

[0036] On the other hand, when using the second method to perform the suction operation of multiple components P without returning the base tape BT, there is a risk that components P exposed from multiple open cavities CA may scatter. For example, in Figure 2, when the suction nozzle 60 first picks up a component P from the cavity CA at the imaging position 33, it applies a shock to the base tape BT via the component P. This shock causes the base tape BT to swing vertically, and there is a risk that the three components P other than the object to be picked up may scatter from the cavity CA. In this embodiment, the second method is adopted after comprehensively considering the advantages and disadvantages, and measures are taken to reduce the shock that the suction nozzle 60 applies to the base tape BT (details will be described later).

[0037] 4. Initial Operation and Continuous Operation Next, the initial operation controlled by the control device 5 will be explained with reference to Figure 2, and the continuous operation following the initial operation will be explained with reference to Figure 3. The control device 5 controls the execution of the initial operation based on the second method described above when the tape feeder 31 loaded with the reel and carrier tape CT is equipped on the parts supply device 3 and put into use. Alternatively, the control device 5 controls the execution of the initial operation when the reel is attached to the tape feeder 31 equipped on the parts supply device 3, and the carrier tape CT is loaded and put into use. In other words, the control device 5 controls the tape feeder 31, the parts transfer device 4, etc., to perform the initial operation including the parts imaging step, the position identification step, and the collection and mounting step (see steps S2-S4 in Figure 7) which will be explained later.

[0038] In the component imaging step, the tape feeder 31 continuously feeds the base tape BT and stops it when the leading cavity CA containing the component P has advanced beyond the supply position 32 to the imaging position 33. This results in the state shown in Figure 2. Next, the component transfer device 4 moves the mark camera 46 to the imaging position 33. The mark camera 46 captures the component P inside the open cavity CA located at the imaging position 33 and acquires image data. This completes the component imaging step.

[0039] In the next positioning step, the control device 5 determines the positions of the multiple parts P located from the supply position 32 to the imaging position 33 by processing the image data described above and considering a predetermined pitch PT. This completes the positioning step. In the next sampling and mounting step, the parts transfer device 4 uses the suction nozzle 60 to perform a suction and mounting operation (sampling and mounting operation) of the multiple parts P located from the supply position 32 to the imaging position 33.

[0040] To describe the suction mounting operation in detail, the component transfer device 4 first moves the mounting head 43 above the cavity CA that is the target of the suction operation. The suction nozzles 60 perform a suction operation to pick up the component P from the cavity CA. The tape feeder 31 on which the four suction nozzles 60 perform the suction operation may be the same or different. Next, the component transfer device 4 moves the mounting head 43 above the component camera 47. Subsequently, the component camera 47 images the component P that is being held by the multiple suction nozzles 60.

[0041] The component transfer device 4 then moves the mounting head 43 to the substrate K. The suction nozzle 60 mounts the suctioned component P onto the substrate K. This completes one suction mounting operation. The component transfer device 4 then moves the mounting head 43 back to the tape feeder 31 and repeats the suction mounting operation for the remaining component P. This completes the picking and mounting step and the initial operation. If there is only one tape feeder 31 that is the target of the initial operation, the initial operation is completed in one suction mounting operation in which the four suction nozzles 60 pick up four component P.

[0042] The control device 5 controls the execution of continuous operation after controlling the initial operation. In continuous operation, pitch feeding operation and suction mounting operation (collection and mounting operation) are performed alternately. At the start of the pitch feeding operation, the suction mounting operation of multiple components P located from the supply position 32 to the imaging position 33 is completed. In the pitch feeding operation, the tape feeder 31 feeds the base tape BT by a predetermined pitch PT. As a result, the empty cavity CA at the supply position 32 moves downstream, and the next cavity CA containing the component P moves to the supply position 32. This results in the state shown in Figure 3.

[0043] Next, the component transfer device 4 performs a suction and mounting operation similar to the initial operation except that the position of the component P is different. While the mounting head 43 is moving to the component camera 47 and the substrate K, the tape feeder 31 performs the above-described pitch feeding operation. That is, the pitch feeding operation and the suction and mounting operation are performed alternately. This normal operation is repeated until the tape feeder 31 is removed from the component supply device 3 or the reel is removed from the tape feeder 31, except for exceptions. The control device 5 controls the lifting and lowering operation of the suction nozzle 60 and reduces the initial shock applied in the initial operation as compared with the normal shock applied to the base tape BT during normal operation by the suction nozzle 60.

[0044] 5. Detailed Configuration of Suction Nozzle 60 and Shock Reduction Function The detailed configuration of the suction nozzle 60 and the above-described shock reduction function will be described with reference to FIGS. 5 and 6. As shown in the figure, the suction nozzle 60 includes a nozzle body 61, a nozzle tip 67, a biasing spring 6D, and the like. The nozzle body 61 has a cylindrical shape extending in the vertical direction in the use state. The nozzle body 61 is supported by the mounting head 43 (nozzle holder 44) and moves up and down. Two latching pins 62 are provided at height positions near the upper end of the nozzle body 61 and at positions 180° apart in the circumferential direction. Each of the latching pins 62 extends radially outward from the outer peripheral surface of the nozzle body 61 and projects radially inward from the inner peripheral surface of the nozzle body 61. The radially outward extending portion of the latching pin 62 is supported by the nozzle holder 44.

[0045] The flange portion 64 is formed of an annular plate-like member and is fixed to the lower side of the nozzle body 61. The flange portion 64 projects outward and inward in the circumferential direction from the nozzle body 61. An identification code 65 and a color mark 66 are attached to the upper surface of the flange portion 64. The identification code 65 includes various information and at least includes the individual identification information of the suction nozzle 60. As the identification code 65, for example, a barcode or a QR code (registered trademark) can be used. The circular color mark 66 has a different color defined for each type of the suction nozzle 60. The color mark 66 facilitates visual confirmation of the type of the suction nozzle 60.

[0046] The nozzle tip 67 has a standing cylindrical shape with a smaller diameter than the nozzle body 61 and is longer than the nozzle body 61. The nozzle tip 67 is disposed inside the nozzle body 61 and the flange portion 64 and protrudes downward from the flange portion 64. The upper surface of the nozzle tip 67 serves as the base end 68 of the suction nozzle 60, and the lower surface of the nozzle tip 67 serves as the tip 69 of the suction nozzle 60. Also, the inside of the nozzle tip 67 forms an air flow path 6A. The air flow path 6A communicates from the base end 68 to the tip 69. As an example of the opening shape of the tip 69, an oval shape (the shape of a track for land-based sports) can be cited. Without being limited to this, the opening shape of the tip 69 may be circular, elliptical, ladle-shaped, or the like.

[0047] As shown in the figure, a flange portion 6C that protrudes radially outward is provided at approximately the middle height position on the outer peripheral surface of the nozzle tip 67. A coil-shaped biasing spring 6D is inserted in a compressed state into the annular space between the nozzle tip 67 and the nozzle body 61. The biasing spring 6D is disposed between a latching pin 62 that protrudes radially inward in the vertical direction and the flange portion 6C of the nozzle tip 67. The biasing spring 6D biases the nozzle tip 67 downward with respect to the nozzle body 61. According to this configuration, the nozzle tip 67 can elastically expand and contract downward from the nozzle body 61. Also, the nozzle tip 67 is in an extended state (see FIG. 6) where the flange portion 6C contacts the flange portion 64 during normal times.

[0048] The suction nozzle 60 reduces the initial lifting and lowering speed during the initial operation as compared to the constant lifting and lowering speed that constantly moves up and down toward the component P during operation. According to this, since there is a difference in the speed when the nozzle tip 67 contacts the component P, the initial shock can be reduced as compared to the constant shock.

[0049] Furthermore, the suction nozzle 60 can have a higher initial downward position HF (see Figure 6) when it descends during initial operation compared to the normal downward position HN (see Figure 5) of the lower end of the nozzle body 61 when it descends toward the part P during normal operation. As a result, in the configuration in which the nozzle tip 67 of the suction nozzle 60 contacts the part P, there is a difference in the amount of compression of the biasing spring 6D. In other words, there is a difference in the pressing force acting from the nozzle tip 67 to the base tape BT via the part P, so the suction nozzle 60 can reduce the initial shock compared to the normal shock.

[0050] Furthermore, in the example of normal operation shown in Figure 5, when the suction nozzle 60 has descended to the normal lowering position HN, the nozzle tip 67 is pressed against the part P and elastically compressed. On the other hand, in the example of initial operation shown in Figure 6, when the suction nozzle 60 has descended to the initial lowering position HF, the nozzle tip 67 does not contact the part P, and the part P is sucked up by negative pressure. Because the nozzle tip 67 of the suction nozzle 60 does not contact the part P during initial operation, the initial shock can be significantly reduced compared to the normal shock. In order to stabilize the suction operation, it is preferable to set the suction distance LU for sucking up the part P to a predetermined distance or less. The predetermined distance depends on the structure and performance of the suction nozzle 60, as well as the size and mass of the part P, but is set to an appropriate distance of, for example, 1 mm or less.

[0051] As explained above, the initial shock reduction effect reduces the risk of parts P other than the object to be adsorbed scattering from the open cavity CA during initial operation. On the other hand, during normal operation, since parts P other than the object to be adsorbed are not exposed, there is no problem even if the adsorption nozzle 60 performs the adsorption operation according to the control of the conventional technology.

[0052] 6. Operation of Component Mounting Machine 1 Next, the overall operation of component mounting machine 1 will be explained with reference to Figure 7. The operation flow shown in Figure 7 is mainly carried out by control from the control device 5. Figure 7 also serves to explain the component picking and mounting method of the embodiment. In step S1 of Figure 1, setup work is performed on at least one tape feeder 31 in the component supply device 3. Specifically, setup work is performed to equip the component supply device 3 with a tape feeder 31 loaded with a reel and carrier tape CT, or to set a reel in the tape feeder 31 equipped in the component supply device 3 and load the carrier tape CT. After the setup work is completed, component mounting machine 1 starts the component mounting work (production of circuit board products). Component mounting machine 1 may use both the tape feeder 31 that was previously equipped in the component supply device 3 and the tape feeder 31 that has undergone setup work.

[0053] In the next step S2, the control device 5 controls the tape feeder 31, which has undergone setup, and performs the control of the component imaging step described above. In the next step S3, the control device 5 performs the control of the position identification step described above. In the next step S4, the control device 5 performs the control of the sampling and mounting step described above.

[0054] In the next step S5, the control device 5 controls all tape feeders 31 used and performs the pitch feeding operation described above. In the next step S6, the control device 5 performs the suction mounting operation (collection and mounting operation) described above. After this, the control device 5 repeats steps S5 and S6 alternately. Steps S5 and S6 correspond to the continuous operation steps in the component collection and mounting method of the embodiment.

[0055] Steps S2 and S3, which apply to the tape feeder 31 that has undergone setup, must be completed before the start of step S5. On the other hand, step S4, which applies to the tape feeder 31 that has undergone setup, may be held in abeyance until the execution timing of step S6. In other words, step S4 for the tape feeder 31 that has undergone setup may be executed together with step S6 for the tape feeder 31 that was previously installed.

[0056] In the component mounting machine 1 and component picking and mounting method of this embodiment, the mark camera 46 images the component P housed in the cavity CA of the base tape BT at the imaging position 33, which is further than the supply position 32, and the control device 5 determines the positions of all the multiple component P located between the supply position 32 and the imaging position 33, thereby stabilizing the component picking operation (sampling operation) by the suction nozzle 60. In addition, since the base tape BT is not returned after imaging by the mark camera 46, problems caused by the distance between the supply position 32 and the imaging position 33 of the tape feeder 31 can be mitigated.

[0057] To explain in detail how the problems have been mitigated, interference between the cover tape VT and the suction nozzle 60, etc., which can occur when the base tape BT is automatically returned from the imaging position 33 to the supply position 32, cannot occur in this embodiment. In addition, the labor required of the operator, the delay in the start of production, and the risk of forgetting to return the cover tape VT, which can occur when the cover tape VT is returned manually, cannot occur in this embodiment. Furthermore, by having the control device 5 perform control that reduces the initial shock compared to the constant shock, the risk of parts P other than the object to be suctioned scattering from the cavity CA during the initial operation can be reduced.

[0058] 7. Application and Modification of the Embodiment Note that in some cases, only a portion of the multiple tape feeders 31 equipped on the parts supply device 3 are subject to initial operation, and the initial operation is completed for the remaining tape feeders 31. In this case, the control device 5 can control the parts imaging step and position identification step for some of the tape feeders 31, and then simultaneously control the picking and mounting step for some of the tape feeders 31 and the continuous operation for the remaining tape feeders 31. In other words, the four suction nozzles 60 of the parts transfer device 4 can pick up parts P from cavities CA other than the supply position 32 of some of the tape feeders 31 in a single suction and mounting operation, and pick up parts P from the cavity CA at the supply position 32 of the remaining tape feeders 31. Furthermore, the parts mounting machine 1 of the embodiment can be adapted to a configuration in which a semi-peelable tape feeder is detachably equipped or permanently installed. In addition, the embodiment can be adapted and modified in various ways.

[0059] 1: Component mounting machine 2: Substrate transport device 3: Component supply device 31: Tape feeder 32: Supply position 33: Imaging position 4: Component transfer device 43: Mounting head 46: Mark camera 5: Control device 60: Suction nozzle 61: Nozzle body 67: Nozzle tip K: Substrate P: Component CT: Carrier tape BT: Base tape VT: Cover tape CA: Cavity PT: Predetermined pitch MA: Movable range LS: Minimum separation distance HN: Normal lowering position HF: Initial lowering position

Claims

1. A component mounting machine comprising: a tape feeder that feeds a base tape from which a cover tape covering the cavity has been peeled off and which houses components in cavities formed at a predetermined pitch, and supplies the components at a supply position; a mounting head that moves between the tape feeder and the substrate and has a component mounting device that performs a picking and mounting operation to pick up components from the cavity and mount them on a substrate; a camera that moves integrally with the mounting head and images the components housed in the cavity at an imaging position; and a control device that stops the base tape when the tape feeder has fed the base tape and the first cavity housing the components has advanced beyond the supply position to the imaging position, performs imaging with the camera, determines the positions of a plurality of components from the supply position to the imaging position taking into account the predetermined pitch, and controls the initial operation of the component mounting device to perform the picking and mounting operation of a plurality of components from the supply position to the imaging position.

2. The component mounting machine according to claim 1, wherein the control device controls, following the control of the initial operation, a continuous operation in which the tape feeder alternately performs a pitch feeding operation in which the tape feeder feeds the base tape by a predetermined pitch, and the component mounting operation in which the component mounting device picks up and mounts the component at the supply position.

3. The component mounting device according to claim 2, wherein the component mounting device reduces the initial shock applied during the initial operation compared to the continuous shock applied to the base tape during the continuous operation.

4. The component mounting machine according to claim 3, wherein the component mounting device has a lower initial lifting speed during the initial operation compared to the normal lifting speed during the normal operation when it moves up and down toward the component.

5. The component mounting device is a suction nozzle that uses negative pressure to attract the component, comprising a nozzle body supported by the mounting head and moving up and down, and a nozzle tip portion elastically extendable downward from the nozzle body, wherein the initial downward position when the nozzle moves down in the initial operation is higher than the normal downward position when the nozzle moves down toward the component in the normal operation.

6. The component mounting machine according to claim 5, wherein the suction nozzle, in the continuous operation, has its nozzle tip in contact with the component and is elastically compressed, and in the initial operation, the nozzle tip does not contact the component and sucks up the component by negative pressure.

7. The component mounting machine according to any one of claims 1 to 6, wherein the supply position is located outside the movable range of the camera.

8. The component mounting machine according to claim 7, wherein the control device determines the imaging position and the number of components located from the supply position to the imaging position based on the minimum distance between the camera and the supply position when the camera is closest to the supply position, and the predetermined pitch which varies depending on the size of the component.

9. The component mounting machine according to any one of claims 1 to 6, wherein the camera also functions as a mark camera for capturing position marks attached to the substrate.

10. A component picking and mounting method using a component mounting machine comprising: a tape feeder that feeds a base tape from which a cover tape covering a cavity has been peeled off and which houses components in cavities formed at a predetermined pitch, and supplies components at a supply position; a mounting head that moves between the tape feeder and the substrate and has a component mounting device that performs a picking and mounting operation to pick up components from the cavities and mount them on a substrate; and a camera that moves integrally with the mounting head and images the components housed in the cavities at an imaging position, the method comprising: a component imaging step in which the tape feeder has fed the base tape and the leading cavity housing the components has advanced beyond the supply position to the imaging position, and the base tape is stopped and imaging is performed by the camera; a position identification step in which, following the component imaging step, the positions of a plurality of components located from the supply position to the imaging position are determined considering the predetermined pitch; and a picking and mounting step in which, following the position identification step, the component mounting device performs the picking and mounting operation on a plurality of components located from the supply position to the imaging position.

11. The component picking and mounting method according to claim 10, further comprising a continuous operation step in which, following the picking and mounting step, the tape feeder alternately performs a pitch feeding operation in which it feeds the base tape by the predetermined pitch, and the component mounting device alternately performs the picking and mounting operation of the component at the supply position.

Images