Printing control parameter determining device and printing control parameter determining method

Abstract

This printing control parameter determining device comprises a first printing unit, an acquiring unit, a second printing unit, and a determining unit. The first printing unit uses a printing machine to print, onto a substrate, a trial amount of solder which is less than a target amount of solder to be printed onto the substrate. The acquiring unit conveys the printed substrate, which is the substrate onto which the solder has been printed by the first printing unit, from the printing machine to a printing inspection machine, and acquires a shortage amount of solder printed on the printed substrate with respect to the target amount of solder. The second printing unit conveys the printed substrate from the print inspection machine to the printing machine, and prints the shortage amount of solder, acquired by the acquiring unit, onto the printed substrate. The determining unit determines a production-time control parameter, which is a control parameter for the printing machine for use when the target amount of solder is to be printed onto a substrate onto which solder has not been printed, on the basis of an adjustment-time control parameter, which is the control parameter when solder was printed by the first printing unit and the second printing unit.

Description

Printing Control Parameter Determination Device and Printing Control Parameter Determination Method

[0001] This specification discloses a technology related to a printing control parameter determination device and a printing control parameter determination method.

[0002] The mounting device described in Patent Document 1 returns the first printed circuit board determined to be defective to the mounting position by using a buffer device that stores the printed circuit board at the downstream standby position of the substrate transfer device. Further, the mounting device described in Patent Document 1 can return the printed circuit board determined to have a printing defect to the printing position and perform work for repair.

[0003] The return conveyor described in Patent Document 2 returns a printed substrate that can eliminate a printing defect by the printer printing solder again among the printed substrates determined to have a printing defect by the printing inspection machine to the printer. Further, when the printer described in Patent Document 2 receives an identification signal from the return conveyor, it determines that the loaded substrate is a printed substrate and sets printing parameters suitable for printing the printed substrate.

[0004] In the printing inspection device described in Patent Document 3, when a non-conforming substrate occurs, the non-conforming substrate is discharged from the loading section of the printing inspection device, the turntable is rotationally driven, and the non-conforming substrate is stored in the substrate storage shelf of the substrate stocker.

[0005] Japanese Patent Application Laid-Open No. 2008-098386 International Publication No. 2020 / 261380 Japanese Patent Application Laid-Open No. 2012-038755

[0006] To improve print quality, it is necessary to adjust the control parameters for printing solder. For example, it is conceivable to adjust the control parameters by changing them based on the solder printing status on a substrate, and then repeatedly performing test prints on other substrates using the changed control parameters. In this case, the more times the control parameters are adjusted, the more test prints are required, and the number of substrates needed for adjustment may increase. Also, if a worker has to remove a substrate whose solder printing status has been judged by the printing inspection machine and transport it to the printing machine during control parameter adjustment, the worker's work becomes complicated. Therefore, there is a need to automate the transport of substrates during control parameter adjustment.

[0007] In view of these circumstances, this specification discloses a printing control parameter determination apparatus and a printing control parameter determination method that can reduce the number of substrates required for adjusting the control parameters for printing solder, and automate the transport of substrates during the adjustment of control parameters.

[0008] This specification discloses a printing control parameter determination device comprising a first printing unit, an acquisition unit, a second printing unit, and a determination unit. The first printing unit prints a trial amount of solder, less than the target amount of solder to be printed on the substrate, onto the substrate using a printing press. The acquisition unit transports the printed substrate, which is the substrate on which the solder has been printed by the first printing unit, from the printing press to a printing inspection machine and acquires the amount of solder that is insufficient relative to the target amount printed on the printed substrate. The second printing unit transports the printed substrate from the printing inspection machine to the printing press and prints the insufficient amount of solder acquired by the acquisition unit onto the printed substrate. The determination unit determines the production control parameters, which are the control parameters for printing the target amount of solder on a substrate that does not have solder printed on it, based on the adjustment control parameters, which are the control parameters of the printing press when the solder is printed by the first printing unit and the second printing unit.

[0009] This specification also discloses a printing control parameter determination device comprising a first printing unit, an acquisition unit, a second printing unit, and a determination unit. The first printing unit prints a trial amount of solder equal to the target amount of solder to be printed on the substrate using a printing press. The acquisition unit transports the printed substrate, which is the substrate on which the solder has been printed by the first printing unit, from the printing press to a printing inspection machine and acquires the amount of solder that is insufficient compared to the target amount printed on the printed substrate. The second printing unit transports the printed substrate from the printing inspection machine to the printing press and prints the insufficient amount of solder acquired by the acquisition unit onto the printed substrate. The determination unit determines the production control parameters, which are the control parameters for printing the target amount of solder on a substrate on which the solder has not been printed, based on the adjustment control parameters, which are the control parameters of the printing press when the solder is printed by the first printing unit and the second printing unit.

[0010] Furthermore, this specification discloses a method for determining printing control parameters, comprising a first printing step, an acquisition step, a second printing step, and a determination step. The first printing step involves printing a trial amount of solder, less than a target amount of solder to be printed on the substrate, onto the substrate using a printing press. The acquisition step involves transporting the printed substrate, which is the substrate on which the solder has been printed by the first printing step, from the printing press to a printing inspection machine, and obtaining the amount of solder that is insufficient relative to the target amount printed on the printed substrate. The second printing step involves transporting the printed substrate from the printing inspection machine to the printing press, and printing the insufficient amount of solder obtained by the acquisition step onto the printed substrate. The determination step determines the production control parameters, which are the control parameters for printing the target amount of solder on a substrate on which the solder has not been printed, based on the adjustment control parameters, which are the control parameters of the printing press when the solder is printed by the first printing step and the second printing step.

[0011] Furthermore, this specification discloses a technical concept in which, in claim 4 of the claims initially attached to the application (hereinafter referred to as the "original claims"), "the print control parameter determination device described in claim 1" is changed to "the print control parameter determination device described in any one of claims 1 to 3". Also, this specification discloses a technical concept in which, in claim 5 of the original claims, "the print control parameter determination device described in claim 1" is changed to "the print control parameter determination device described in any one of claims 1 to 4". Furthermore, this specification discloses a technical concept in which, in claim 10 of the original claims, "the print control parameter determination device described in claim 1" is changed to "the print control parameter determination device described in any one of claims 1 to 9".

[0012] According to the above-described printing control parameter determination device, the process begins with printing a trial amount of solder that is less than the target amount of solder to be printed on the substrate, or with printing a trial amount of solder that is the same as the target amount of solder to be printed on the substrate. The production control parameters are then determined while transporting the substrate between the printing press and the printing inspection machine. Therefore, the production control parameters can be determined using as few as one substrate, reducing the number of substrates required for adjusting the control parameters, and automating the transport of substrates during the adjustment of control parameters. The same can be said for the printing control parameter determination method as well as the printing control parameter determination device.

[0013] This is a diagram showing an example of the configuration of a substrate work line. This is a partial cross-sectional view showing an example of the configuration of a printing press. This is a block diagram showing an example of a control block of a printing control parameter determination device. This is a flowchart showing an example of a control procedure during the derivation of production control parameters by the printing control parameter determination device. This is a flowchart showing an example of a control procedure during the production of product substrates by the printing control parameter determination device. This is a perspective view showing an example of a printing press and a print inspection machine when acquiring the amount of solder shortage. This is a perspective view showing an example of a printing press and a print inspection machine when temporarily storing the first substrate in the storage area. This is a perspective view showing an example of a printing press and a print inspection machine after the first substrate, which has been temporarily stored in the storage area, has been moved to the printing area. This is a block diagram showing an example of a substrate movement path during the production of product substrates.

[0014] 1. Embodiment 1-1. Example of the configuration of the substrate processing line WML In the substrate processing line WML, a substrate processing machine WM0 performs predetermined substrate processing on a substrate 90 to produce a product substrate 900. The substrate processing line WML of this embodiment only needs to be equipped with a printing machine WM1 and a printing inspection machine WM2, and the type and number of substrate processing machines WM0 that constitute the substrate processing line WML are not limited. As shown in Figure 1, the substrate processing line WML of this embodiment is equipped with a plurality (five) of substrate processing machines WM0, consisting of a printing machine WM1, a printing inspection machine WM2, a component mounting machine WM3, a reflow oven WM4, and an appearance inspection machine WM5, and the substrate 90 is transported in this order by a substrate transport device.

[0015] The printing press WM1 prints solder 80 onto the mounting positions of multiple components on the circuit board 90. The printing inspection machine WM2 inspects the printing condition of the solder 80 printed by the printing press WM1. The component mounting machine WM3 mounts multiple components onto the circuit board 90 on which the solder 80 has been printed by the printing press WM1. There may be one component mounting machine WM3 or multiple component mounting machines. If multiple component mounting machines WM3 are provided, the multiple component mounting machines WM3 can share the task of mounting multiple components.

[0016] The reflow oven WM4 heats the substrate 90 on which multiple components have been mounted by the component mounting machine WM3, melts the solder 80, and performs soldering. The visual inspection machine WM5 inspects the mounting condition of the multiple components mounted by the component mounting machine WM3. In this way, the substrate processing line WML can produce product substrates 90 by sequentially transporting the substrate 90 using multiple (five) substrate processing machines WM0 and performing production processes including inspection. The substrate processing line WML can also be equipped with substrate processing machines WM0 as needed, such as a functional inspection machine, buffer device, substrate supply device, substrate inversion device, shield mounting device, adhesive coating device, and ultraviolet irradiation device.

[0017] Multiple (five) board-to-board work machines WM0 and management device WMC, which constitute the board-to-board work line WML, are connected to each other via a communication unit LC0. The communication unit LC0 may communicate via wired or wireless means. Various communication methods are possible. In this embodiment, the multiple (five) board-to-board work machines WM0 and management device WMC constitute a local area network (LAN). As a result, the multiple (five) board-to-board work machines WM0 can communicate with each other via the communication unit LC0. Furthermore, the multiple (five) board-to-board work machines WM0 can communicate with the management device WMC via the communication unit LC0.

[0018] The WMC control unit controls the five board-to-board work machines (WM0) that make up the WML board-to-board work line and monitors the operating status of the WML board-to-board work line. The WMC control unit stores various control data for controlling the five board-to-board work machines (WM0). The WMC control unit transmits control data to each of the five board-to-board work machines (WM0). In addition, each of the five board-to-board work machines (WM0) transmits its operating status and production status to the WMC control unit.

[0019] The WMC management device can be equipped with a DSV data server. The DSV data server can store, for example, data acquired by the WM0 board handling machine regarding board handling operations. For example, various image data captured by the WM0 board handling machine are included in the acquired data. Records of operating status (log data) acquired by the WM0 board handling machine are also included in the acquired data.

[0020] Furthermore, the data server DSV can also store various production information related to the production of the circuit board 90. For example, component data such as information on the shape of each type of component, information on electrical characteristics, and information on how to handle components are included in the production information. In addition, inspection results from inspection machines such as the printing inspection machine WM2 and the visual inspection machine WM5 are included in the acquired data as well as the production information.

[0021] 1-2. Configuration Example of Printing Press WM1 In the embodiment, the printing press WM1 prints solder 80 onto the substrate 90 through the opening 71 of the mask 70 by sliding a squeegee 34 over the mask 70. As shown in Figure 2, the printing press WM1 of the embodiment includes a substrate transport device 10, a mask support device 20, a squeegee moving device 30, a control device 40, and a display device 41. In this specification, the transport direction of the substrate 90 (the direction perpendicular to the plane of the paper in Figure 2) is defined as the X-axis direction. The direction perpendicular to the X-axis direction in the horizontal plane (XY plane) (the front-to-back direction of the printing press WM1, and the left-to-right direction of the plane of the paper in Figure 2) is defined as the Y-axis direction. Furthermore, the vertical direction perpendicular to the X-axis direction and the Y-axis direction (the up-and-down direction of the plane of the paper in Figure 2) is defined as the Z-axis direction.

[0022] The substrate transport device 10 transports the substrate 90 to be printed. The substrate 90 is a circuit board on which various circuits such as electronic circuits, electrical circuits, and magnetic circuits are formed. The substrate transport device 10 is installed on the base BS1 of the printing press WM1. The substrate transport device 10 transports the substrate 90 by, for example, a belt conveyor extending in the X-axis direction.

[0023] The substrate transport device 10 includes a substrate holding unit 11 for holding the substrate 90 that has been loaded into the printing press WM1. The substrate holding unit 11 is located below the mask 70 and is configured to be able to move up and down in the Z-axis direction by a linear motion mechanism, such as a lead screw mechanism. Specifically, the substrate holding unit 11 is lowered when the substrate 90 is being transported, and when the substrate 90 is transported to a predetermined position, it rises together with the substrate 90 and holds the substrate 90 in close contact with the lower surface of the mask 70.

[0024] The mask support device 20 is located above the substrate transport device 10. The mask support device 20 supports the mask 70 with a pair of support bases. The pair of support bases are located on the left side (the far side of the page in Figure 2, which is shown) and the right side (the near side of the page in Figure 2, which is not shown) of the printing press WM1 when viewed from the front, and are formed to extend along the Y-axis.

[0025] Figure 2 is a partial cross-sectional view of the printing press WM1 cut along the Y-axis, schematically showing the interior of the printing press WM1 in a side view, as well as cross-sections of the mask 70 and substrate 90. The mask 70 has openings 71 that penetrate at predetermined positions on the wiring pattern of the substrate 90. The mask 70 is supported by a mask support device 20, for example, via a frame member provided on its outer edge.

[0026] The squeegee moving device 30 raises and lowers the squeegee 34 in a direction perpendicular to the mask 70 (Z-axis direction), and also moves the squeegee 34 in the Y-axis direction on the upper surface of the mask 70. The squeegee moving device 30 comprises a head drive device 31, a squeegee head 32, a pair of lifting devices 33, 33, and a pair of squeegees 34, 34. The head drive device 31 is located on the upper side of the printing press WM1. The head drive device 31 can move the squeegee head 32 in the Y-axis direction by a linear motion mechanism such as a feed screw mechanism.

[0027] The squeegee head 32 is clamped and fixed to the moving body that constitutes the linear motion mechanism of the head drive unit 31. The squeegee head 32 holds a pair of lifting devices 33, 33. Each of the pair of lifting devices 33, 33 holds a squeegee 34 and can be driven independently of each other. Each of the pair of lifting devices 33, 33 drives an actuator, such as an air cylinder, to raise or lower the squeegee 34 it holds.

[0028] The squeegee 34 slides along the upper surface of the mask 70, moving the solder 80 supplied to the upper surface of the mask 70 along the mask 70. Solder 80 can be solder paste. The solder 80 is pressed into the substrate 90 through the opening 71 of the mask 70, printing the solder 80 onto the substrate 90 positioned on the lower side of the mask 70. In this embodiment, each of the pair of squeegees 34, 34 is a plate-shaped member formed to extend along the width direction (X-axis direction) perpendicular to the printing direction (Y-axis direction) in the horizontal plane (XY plane).

[0029] The front squeegee 34 of the pair of squeegees 34, 34 (left side of the paper in Figure 2) is used in a printing process that moves solder 80 from front to back, with the direction of travel being from front to back of the printing press WM1. The rear squeegee 34 of the pair of squeegees 34, 34 (right side of the paper in Figure 2) is used in a printing process that moves solder 80 from back to front, with the direction of travel being from back to front of the printing press WM1. In addition, for both squeegees 34, the direction opposite to the direction of travel is the direction of reversal.

[0030] Each of the pair of squeegees 34, 34 is held in the lifting device 33 at an angle such that its front end, located in the direction of travel, faces downward. In other words, each of the pair of squeegees 34, 34 is held in the lifting device 33 at an angle such that its rear end, located in the direction of reversal, faces upward. The inclination angle of each of the pair of squeegees 34, 34 can also be adjusted, for example, by an adjustment mechanism provided at the bottom of the lifting device 33.

[0031] The control device 40 is equipped with a known arithmetic unit and memory device, and a control circuit is configured. The control device 40 is connected to the management device WMC via the communication unit LC0 shown in Figure 1, and can send and receive various data. The control device 40 can drive and control the substrate transport device 10, the mask support device 20, the squeegee moving device 30, and the display device 41 based on the production program, the detection results of various sensors, etc.

[0032] Furthermore, the control device 40 is equipped with a storage device. The storage device can be, for example, a magnetic storage device such as a hard disk drive, or a storage device using semiconductor elements such as flash memory. The storage device stores production programs for driving the WM1 printer. The control device 40 acquires various information stored in the storage device and detection results from various sensors provided on the WM1 printer.

[0033] The control device 40, for example, drives and controls the squeegee moving device 30. Based on the various information and detection results described above, the control device 40 sends control signals to the squeegee moving device 30. This controls the Y-axis position, Z-axis position (height), and moving speed of the pair of squeegees 34, 34 held by the squeegee head 32. As previously described, the pair of squeegees 34, 34 are driven and controlled to print solder 80 onto the substrate 90 located on the lower side of the mask 70.

[0034] As shown in Figure 2, the control device 40 is equipped with a display device 41. The display device 41 can display the operating status of the printing press WM1. The display device 41 is also configured as a touch panel and functions as an input device that accepts various operations from the operator. The operator can learn the operating status of the printing press WM1 via the display device 41. In addition, the operator can configure the printing press WM1 and give instructions to the printing press WM1 via the display device 41.

[0035] 1-3. Example Configuration of Print Control Parameter Determination Device 50 In order to improve print quality, it is necessary to adjust the control parameters for printing solder 80. For example, it is assumed that the control parameters for printing solder 80 are changed based on the printing state of solder 80 printed on a substrate 90, and the control parameters are adjusted by repeatedly performing test prints on other substrates 90 using the changed control parameters. In this case, the more the control parameters are adjusted, the more test prints are performed, and the more substrates 90 required for adjustment of the control parameters may increase. Also, when adjusting the control parameters, if an operator removes the substrate 90 whose solder 80 printing state has been determined by the printing inspection machine WM2 and transports it to the printing machine WM1, the operator's work becomes complicated. Therefore, there is a need to automate the transport of substrates 90 when adjusting the control parameters.

[0036] Therefore, the substrate work line WML of this embodiment is equipped with a print control parameter determination device 50. According to the print control parameter determination device 50, the process starts with printing a trial amount of solder 80 that is less than the target amount of solder 80 to be printed on the substrate 90, or printing a trial amount of solder 80 that is the same as the target amount of solder 80 to be printed on the substrate 90, and the production control parameters are determined while transporting the substrate 90 between the printing machine WM1 and the print inspection machine WM2. Thus, the production control parameters can be determined using as few as one substrate 90, reducing the number of substrates 90 required for adjusting the control parameters, and automating the transport of the substrates 90 during the adjustment of the control parameters.

[0037] Specifically, the print control parameter determination device 50, when considered as a control block, comprises a first printing unit 51, an acquisition unit 52, a second printing unit 53, and a determination unit 54. The print control parameter determination device 50 may also include a storage unit 55. The print control parameter determination device 50 may also include a movement unit 56. The print control parameter determination device 50 may also include a reprinting unit 57. As shown in Figure 3, the print control parameter determination device 50 of the embodiment comprises a first printing unit 51, an acquisition unit 52, a second printing unit 53, a determination unit 54, a storage unit 55, a movement unit 56, and a reprinting unit 57.

[0038] The first printing unit 51, acquisition unit 52, second printing unit 53, determination unit 54, storage unit 55, movement unit 56, and reprinting unit 57 can be provided in various control devices such as the control device for the substrate work machine WM0, and various management devices such as the management device WMC. For example, at least one of the first printing unit 51, acquisition unit 52, second printing unit 53, determination unit 54, storage unit 55, movement unit 56, and reprinting unit 57 can be provided in the printing machine WM1. At least one of the first printing unit 51, acquisition unit 52, second printing unit 53, determination unit 54, storage unit 55, movement unit 56, and reprinting unit 57 can also be provided in the management device WMC.

[0039] At least one of the first printing unit 51, acquisition unit 52, second printing unit 53, determination unit 54, storage unit 55, movement unit 56, and reprinting unit 57 can also be formed on the cloud. The first printing unit 51, acquisition unit 52, second printing unit 53, determination unit 54, storage unit 55, movement unit 56, and reprinting unit 57 can also be distributed across various control devices, various management devices, the cloud, etc. As shown in Figure 3, in the print control parameter determination device 50 of this embodiment, the first printing unit 51, second printing unit 53, determination unit 54, and reprinting unit 57 are provided on the printing press WM1. The acquisition unit 52 and storage unit 55 are provided on the print inspection machine WM2. The movement unit 56 is provided on the management device WMC.

[0040] Furthermore, the print control parameter determination device 50 can perform control according to the flowcharts shown in Figures 4 and 5. The first printing unit 51 performs the process shown in step S11. The acquisition unit 52 performs the process shown in step S12. The second printing unit 53 performs the process shown in step S13. The determination unit 54 performs the process shown in step S14. The storage unit 55 performs the judgment and processing shown in steps S21 and S22, and steps S25 to S27. The movement unit 56 performs the process shown in step S23. The reprinting unit 57 performs the process shown in step S24.

[0041] Furthermore, the process shown in step S11 by the first printing unit 51 and the process shown in step S13 by the second printing unit 53 are performed in a common printing area AR1. However, if the printing press WM1 is provided with multiple printing areas AR1, the process shown in step S11 by the first printing unit 51 and the process shown in step S13 by the second printing unit 53 may be performed in different printing areas AR1. The matters described in this specification can be selected and applied as appropriate. Furthermore, the matters described in this specification can be combined as appropriate. In addition, the matters described in this specification can be modified as appropriate.

[0042] 1-3-1. First printing unit 51, acquisition unit 52, second printing unit 53, and determination unit 54 If an attempt is made to print more solder 80 on the substrate 90 than the target amount of solder 80 to be printed on the substrate 90, the amount of solder 80 printed on the substrate 90 is more likely to exceed the allowable range compared to when an attempt is made to print less solder 80 than the target amount or the same amount of solder 80 as the target amount. Since it is difficult to automatically correct a substrate 90 in which the amount of solder 80 printed exceeds the allowable range, the number of substrates 90 required for adjusting the control parameters may increase.

[0043] Therefore, in the first embodiment, the first printing unit 51 prints a trial amount of solder 80, which is less than the target amount of solder 80 to be printed on the substrate 90, on the substrate 90 by the printing machine WM1 (step S11 shown in FIG. 4). The target amount of solder 80 is the amount of solder 80 to be printed on the target land and can be arbitrarily set. Also, the trial amount only needs to be less than the target amount and can be arbitrarily set.

[0044] The target amount and the trial amount of solder 80 can be set using, for example, the allowable range (upper allowable value and lower allowable value) of inspection by the printing inspection machine WM2. Specifically, the target amount of solder 80 can be set within the allowable range of inspection by the printing inspection machine WM2 (for example, the median value (average value) between the upper allowable value and the lower allowable value). Also, the trial amount of solder 80 can be set within the allowable range of inspection by the printing inspection machine WM2 (for example, less than the median value (average value) between the upper allowable value and the lower allowable value), or can be set outside the allowable range of inspection (less than the lower allowable value).

[0045] Note that the target amount of solder 80 can also be set using, for example, a recommended value from the manufacturer of the printing machine WM1 or the like. In this case, the trial amount of solder 80 can be set to be less than the recommended value. Also, the target amount of solder 80 can be estimated by simulation, pre-verification with an actual machine, etc. based on physical information regarding the substrate 90, the mask 70, and the squeegee 34 (for example, dimension, material information), characteristic information regarding the characteristics of the solder 80 (for example, viscosity, thixotropy ratio information), etc. In this case, the trial amount of solder 80 can be set to be less than the estimated value.

[0046] The acquisition unit 52 conveys the printed substrate 90p, which is the substrate 90 on which the solder 80 has been printed by the first printing unit 51, from the printing machine WM1 to the printing inspection machine WM2, and acquires the shortage amount of the solder 80 printed on the printed substrate 90p with respect to the target amount (step S12). As described above, the acquisition unit 52 only needs to be able to acquire the shortage amount of the solder 80 with respect to the target amount, and can take various forms. For example, the acquisition unit 52 can acquire the shortage amount for at least one of the volume, area, and height of the solder 80 printed on the printed substrate 90p.

[0047] As shown in FIG. 6, the printing inspection machine WM2 includes an imaging unit 60. The imaging unit 60 can acquire the printing amount of the solder 80 three-dimensionally. The acquisition unit 52 can use the imaging unit 60 of the printing inspection machine WM2 to measure at least one of the volume, area, and height of the solder 80 printed on the printed substrate 90p, and acquire the shortage amount with respect to the target amount respectively. Note that FIG. 6 is a perspective view of the printing machine WM1 and the printing inspection machine WM2. The conveyance path 100 through which the printed substrate 90p is conveyed and the imaging unit 60 of the printing inspection machine WM2 are schematically shown using a rectangular parallelepiped. Also, what has been described above about the illustration method of FIG. 6 can be said in the same way for FIGS. 7 to 9 to be described later.

[0048] The second printing unit 53 conveys the printed substrate 90p from the printing inspection machine WM2 to the printing machine WM1, and prints the shortage amount of the solder 80 acquired by the acquisition unit 52 on the printed substrate 90p (step S13). For example, assume that the volume of the solder 80 with the target amount is the first volume value, and the measurement result of the volume of the trial amount of the solder 80 measured by the imaging unit 60 is the second volume value. In this case, the acquisition unit 52 acquires, as the shortage amount of the volume of the solder 80, a third volume value (a subtraction value obtained by subtracting the second volume value from the first volume value). Then, as shown in FIG. 7, the second printing unit 53 conveys the printed substrate 90p from the printing inspection machine WM2 to the printing machine WM1, and prints the solder 80 corresponding to the third volume value on the printed substrate 90p. What has been described above about the volume of the solder 80 can be said in the same way for the area and height of the solder 80.

[0049] The determination unit 54 determines the production control parameters based on the adjustment control parameters (step S14). The adjustment control parameters refer to the control parameters of the printing press WM1 when the solder 80 is printed by the first printing unit 51 and the second printing unit 53. The production control parameters refer to the control parameters when printing a target amount of solder 80 onto a substrate 90 that does not have solder 80 printed on it. The determination unit 54 only needs to be able to determine the production control parameters based on the adjustment control parameters, and can take various forms.

[0050] Similarly, the control parameters can be any control parameters used to drive the printing press WM1, and are not limited to those parameters. For example, as shown in Figure 2, the printing press WM1 of the embodiment prints solder 80 onto the substrate 90 through the opening 71 of the mask 70 by sliding a squeegee 34 over the mask 70. In this case, for example, the control parameters can be at least one of the printing pressure of the printing press WM1, the printing speed, the plate release speed, and the angle of the squeegee 34 relative to the mask 70.

[0051] Furthermore, the determination unit 54 can determine the production control parameters by calculating the adjustment control parameters when the solder 80 is printed by the first printing unit 51 and the adjustment control parameters when the solder 80 is printed by the second printing unit 53. For example, it is assumed that the printing pressure of the first adjustment control parameter, which is the adjustment control parameter when the solder 80 is printed by the first printing unit 51, is the first pressure value, and that a trial amount of solder printing equivalent to 80% of the target amount has been performed. Also, it is assumed that the printing pressure of the second adjustment control parameter, which is the adjustment control parameter when the solder 80 is printed by the second printing unit 53, is the second pressure value, and that a shortage amount of solder printing equivalent to 20% of the target amount has been performed.

[0052] If the printing pressure becomes too high, the solder 80 may be scraped off, potentially reducing the amount of solder 80 printed. Therefore, the second pressure value is set to the same pressure value as the first pressure value, or slightly lower, to increase the printing amount. In this case, the determination unit 54 can select a second adjustment control parameter (second pressure value) that is the same as the first adjustment control parameter (first pressure value) and determine the second pressure value as the production control parameter. Alternatively, the determination unit 54 can subtract a predetermined amount from the second adjustment control parameter (second pressure value) that is the same as the first adjustment control parameter (first pressure value) to determine a value slightly lower than the second pressure value as the production control parameter.

[0053] Slowing down the printing speed increases the amount of solder 80 printed. Similarly, slowing down the plate release speed increases the amount of solder 80 printed. Also, reducing the angle of the squeegee 34 relative to the mask 70 increases the amount of solder 80 printed. Therefore, in these cases, the determination unit 54 can determine the production control parameters by subtracting a predetermined amount based on the second adjustment control parameter from the first adjustment control parameter. In this way, the determination unit 54 can determine the production control parameters by calculating the adjustment control parameters when the solder 80 is printed by the first printing unit 51 and the adjustment control parameters when the solder 80 is printed by the second printing unit 53.

[0054] 1-3-2. Storage Unit 55, Moving Unit 56, and Reprinting Unit 57 Once the production control parameters are determined by the determination unit 54, the printing press WM1 can use the production control parameters to print a target amount of solder 80 onto the substrate 90 that does not have solder 80 printed on it, thereby producing the product substrate 900. However, during the production of the product substrate 900, the amount of solder 80 printed may be insufficient compared to the target amount. Furthermore, the substrates 90 on which solder 80 has been printed by the printing press WM1 are sequentially transported to the printing inspection machine WM2, and if the printing inspection machine WM2 detects the shortage, it may be difficult to immediately transport the substrates 90 to the printing press WM1 to print the insufficient amount of solder 80.

[0055] Therefore, the printing control parameter determination device 50 is preferably equipped with a storage unit 55, a moving unit 56, and a reprinting unit 57. Assume that during the production of the product substrate 900 described above, the printing inspection machine WM2 determines that the amount of solder 80 printed on the first substrate 90a is insufficient compared to the target amount, and that the insufficiency exceeds the allowable range (when the answer is Yes in step S21 shown in Figure 5). The first substrate 90a refers to a substrate 90 on which solder 80 has been printed by the printing machine WM1 before the substrate 90 in the production of the product substrate 900, during the production of the product substrate 900 in which the printing machine WM1 prints the target amount of solder 80 on a substrate 90 on which solder 80 has not been printed, using the production control parameters determined by the determination unit 54.

[0056] In the above case, the storage unit 55 temporarily stores the first substrate 90a in the storage area AR3 provided in the printing inspection machine WM2 until the second substrate 90b arrives at the printing inspection machine WM2 and the first substrate 90a can be moved from the printing inspection machine WM2 to the printing area AR1 of the printing machine WM1 (step S22). The second substrate 90b refers to the substrate 90 being printed in the printing machine WM1. The storage unit 55 only needs to be able to temporarily store the first substrate 90a, and the storage area AR3 can take various forms. For example, as shown in Figure 8, the storage area AR3 can be provided below the transport path 100. Furthermore, it is preferable that the storage area AR3 is partitioned by partition members or the like so that multiple first substrates 90a can each be accommodated.

[0057] As shown in Figures 9 and 10, the moving unit 56 moves the first substrate 90a along the inspection area AR2 of the printing inspection machine WM2, the storage area AR3, and the printing area AR1 of the printing machine WM1. Figure 9 shows the state after the second substrate 90b, which was placed in the printing area AR1 as shown in Figure 8, has been transported to the inspection area AR2, and the first substrate 90a, shown by the dashed line, which was temporarily stored in the storage area AR3, has been moved to the printing area AR1. The first substrate 90a after the move is shown by the solid line. Note that the printing area AR1 refers to the area where the substrate 90 is placed in a state where solder 80 can be printed (the state shown in Figure 2). Also, the inspection area AR2 refers to the area where the substrate 90 is placed in a state where the printed state of solder 80 can be inspected (the state shown in Figure 9).

[0058] The moving unit 56 only needs to be able to move the first substrate 90a along the above-described path and can take various forms. For example, as shown in Figure 10, the moving unit 56 can move the first substrate 90a from the inspection area AR2 to the storage area AR3 using a robot arm 56a. The robot arm 56a can be a known robot arm such as a multi-joint robot. For example, the robot arm 56a grasps the first substrate 90a in the inspection area AR2, moves to a predetermined storage area in the storage area AR3, and releases the grip on the first substrate 90a. As a result, the storage area AR3 can temporarily store the first substrate 90a in the predetermined storage area.

[0059] As shown in Figure 10, the moving unit 56 can also move the first substrate 90a from the inspection area AR2 to the storage area AR3 using a lifting device 56b. The lifting device 56b can be a known lifting device that raises and lowers the substrate 90 using a linear motion mechanism such as a lead screw mechanism. For example, the lifting device 56b lowers the first substrate 90a from the inspection area AR2 to a predetermined storage area in the storage area AR3. This allows the storage area AR3 to temporarily store the first substrate 90a in a predetermined storage area.

[0060] Furthermore, when the second substrate 90b arrives at the printing inspection machine WM2 and the first substrate 90a can be moved from the printing inspection machine WM2 to the printing area AR1 of the printing machine WM1, the moving unit 56 can move the first substrate 90a from the storage area AR3 to the printing area AR1 of the printing machine WM1 (step S23). For example, the robot arm 56a can move the first substrate 90a to the printing area AR1 by grasping the first substrate 90a temporarily stored in the storage area AR3, moving to the printing area AR1, and then releasing the grip on the first substrate 90a. The lifting device 56b can also raise the first substrate 90a temporarily stored in the storage area AR3 to the transport path 100. The moving unit 56 can then move the first substrate 90a to the printing area AR1 using the transport path 100.

[0061] In either case, the reprinting unit 57 prints the missing solder 80 onto the first substrate 90a, which has been moved by the moving unit 56 from the storage area AR3 of the printing inspection machine WM2 to the printing area AR1 of the printing machine WM1 (step S24). The reprinting unit 57 can print the missing solder 80 onto the first substrate 90a in the same manner as when the second printing unit 53 prints the missing amount of solder 80 acquired by the acquisition unit 52 onto the already printed substrate 90p. Then, the control by the printing control parameter determination device 50 is temporarily terminated. Note that the process of printing solder 80 onto substrates 90 that do not have solder 80 printed on them, and the process of printing the missing solder 80 by the reprinting unit 57, are performed in a common printing area AR1. However, if the printer WM1 is provided with multiple printing areas AR1, the process of printing solder 80 on the substrate 90 where solder 80 has not been printed and the process of printing the missing solder 80 by the reprinting unit 57 may be performed in different printing areas AR1.

[0062] Furthermore, during the production of the product substrate 900, the amount of solder 80 printed may exceed the target amount. Therefore, we consider the case where, during the production of the product substrate 900, the printing inspection machine WM2 determines that the amount of solder 80 printed on the first substrate 90a exceeds the target amount, and this excess exceeds the permissible range (when the answer is No in step S21 and Yes in step S25). It is difficult to automatically correct the first substrate 90a where the amount of solder 80 printed exceeds the target amount and exceeds the permissible range.

[0063] Therefore, in the above case, the storage unit 55 temporarily stores the first substrate 90a in the storage area AR3 provided in the printing inspection machine WM2 (step S26). The storage unit 55 should then temporarily store the first substrate 90a so that it can be removed from the storage area AR3 regardless of whether or not there is a substrate 90 being inspected in the printing inspection machine WM2. In this case as well, as previously described, for example, the storage area AR3 can be provided below the transport path 100. Furthermore, the storage area AR3 should be partitioned by partition members or the like so that multiple first substrates 90a can each be accommodated. In addition, the first substrate 90a can be moved from the inspection area AR2 to the storage area AR3 using various moving mechanisms (for example, the robot arm 56a, lifting device 56b, etc., as previously described).

[0064] The storage unit 55 allows the first substrate 90a to be temporarily stored in the storage area AR3 so that it can be removed by at least one of the worker and the unloading device 58. For example, a worker can unload the first substrate 90a temporarily stored in the storage area AR3 through an opening provided in the storage area AR3. The unloading device 58 can be a known unloading device such as an automated guided vehicle (AGV) or an autonomous mobile robot (AMR). In either case, the unloading device 58 can be connected to an opening provided in the storage area AR3 and can unload and transport the first substrate 90a temporarily stored in the storage area AR3.

[0065] Furthermore, if the first substrates 90a removed by the worker and the first substrates 90a removed by the removal device 58 are mixed in the storage area AR3, it is difficult for the worker to recognize which first substrates 90a are being removed from the storage area AR3. Therefore, the storage unit 55 should guide the first substrates 90a being removed by the worker when the first substrates 90a being removed by the worker and the first substrates 90a being removed by the removal device 58 are mixed in the storage area AR3 (step S27). The storage unit 55 only needs to be able to guide the first substrates 90a being removed by the worker from the storage area AR3, and can take various forms.

[0066] For example, the printing inspection machine WM2 is equipped with a display device similar to the display device 41 of the printing machine WM1, and can display various information such as the working status of the printing inspection machine WM2. The storage unit 55 can provide information about the first substrate 90a, such as the storage location and number of substrates to be removed by the operator from the storage area AR3, on the display device of the printing inspection machine WM2. The storage unit 55 can also provide information about the first substrate 90a on a portable terminal carried by the operator. Furthermore, the storage unit 55 can provide voice guidance about the first substrate 90a on various devices.

[0067] When the first substrate 90a is guided out of storage area AR3 by the worker, the control by the print control parameter determination device 50 is temporarily terminated. Also, if the amount of solder 80 printed on the first substrate 90a is the same as the target amount, there is no problem with the first substrate 90a. Similarly, if the print inspection machine WM2 determines that the amount of solder 80 printed on the first substrate 90a is excessive or insufficient compared to the target amount, and the excess or insufficient is within the acceptable range (in both cases, the result is No in step S25), there is no problem with the first substrate 90a. Therefore, in these cases, the control by the print control parameter determination device 50 is temporarily terminated.

[0068] 1-3-3. Other Embodiments In the embodiments described above, the first printing unit 51 prints a trial amount of solder 80 on the substrate 90 using the printing press WM1, which is less than the target amount of solder 80 to be printed on the substrate 90 (step S11 shown in Figure 4). However, the amount of solder 80 printed on the substrate 90 may be insufficient compared to the target amount due to various factors. Therefore, the first printing unit 51 can also print a trial amount of solder 80 equal to the target amount of solder 80 to be printed on the substrate 90 using the printing press WM1.

[0069] In this configuration, the acquisition unit 52 acquires the amount of solder 80 that is insufficient relative to the target amount for a printed substrate 90p printed using adjustment control parameters intended to print a trial amount of solder 80 equal to the target amount (step S12). When the acquisition unit 52 acquires the amount of solder 80 that is insufficient relative to the target amount, the second printing unit 53 and the determination unit 54 can then proceed with the processing from step S13 onward in the same manner as for a printed substrate 90p printed using adjustment control parameters intended to print a trial amount of solder 80 less than the target amount.

[0070] In other words, even in this configuration, the print control parameter determination device 50 can include the same acquisition unit 52, second printing unit 53, and determination unit 54 as in the previously described configuration. Furthermore, in this configuration, the print control parameter determination device 50 can also include a storage unit 55. Additionally, the print control parameter determination device 50 can include a moving unit 56. Moreover, the print control parameter determination device 50 can include a reprinting unit 57. Note that redundant explanations have been omitted in this specification.

[0071] 2. Print Control Parameter Determination Method The same can be said for the print control parameter determination method as for the print control parameter determination device 50. Specifically, the print control parameter determination method comprises a first printing step, an acquisition step, a second printing step, and a determination step. The first printing step corresponds to the control performed by the first printing unit 51. The acquisition step corresponds to the control performed by the acquisition unit 52. The second printing step corresponds to the control performed by the second printing unit 53. The determination step corresponds to the control performed by the determination unit 54.

[0072] The print control parameter determination method may also include a storage step. The print control parameter determination method may also include a movement step. The print control parameter determination method may also include a reprint step. The storage step corresponds to the control performed by the storage unit 55. The movement step corresponds to the control performed by the movement unit 56. The reprint step corresponds to the control performed by the reprint unit 57. Note that redundant explanations have been omitted in this specification.

[0073] 3. An Example of the Effects of the Embodiment According to the print control parameter determination device 50, the process starts with printing a trial amount of solder 80 that is less than the target amount of solder 80 to be printed on the substrate 90, or printing a trial amount of solder 80 that is the same as the target amount of solder 80 to be printed on the substrate 90, and the production control parameters are determined while transporting the substrate 90 between the printing machine WM1 and the print inspection machine WM2. Therefore, the production control parameters can be determined using as few as one substrate 90, reducing the number of substrates 90 required for adjusting the control parameters, and automating the transport of the substrates 90 during adjustment of the control parameters. The same applies to the print control parameter determination method as described above for the print control parameter determination device 50.

[0074] 34: Squeegee, 50: Printing control parameter determination device, 51: First printing unit, 52: Acquisition unit, 53: Second printing unit, 54: Determination unit, 55: Storage unit, 56: Moving unit, 56a: Robot arm, 56b: Lifting device, 57: Reprinting unit, 58: Unloading device, 70: Mask, 71: Opening, 80: Solder, 90: Substrate, 90p: Printed substrate, 90a: First substrate, 90b: Second substrate, 900: Product substrate, AR1: Printing area, AR2: Inspection area, AR3: Storage area, WM1: Printing machine, WM2: Printing inspection machine.

Claims

1. A printing control parameter determination device comprising: a first printing unit that prints a trial amount of solder, less than a target amount of solder to be printed on the substrate, onto the substrate using a printing machine; an acquisition unit that transports the printed substrate, which is the substrate on which the solder has been printed by the first printing unit, from the printing machine to a printing inspection machine and acquires the amount of solder that is insufficient relative to the target amount printed on the printed substrate; a second printing unit that transports the printed substrate from the printing inspection machine to the printing machine and prints the insufficient amount of solder acquired by the acquisition unit onto the printed substrate; and a determination unit that determines a production control parameter, which is the control parameter for printing the target amount of solder on a substrate on which the solder has not been printed, based on the adjustment control parameter, which is the control parameter of the printing machine when the solder is printed by the first printing unit and the second printing unit.

2. The printing control parameter determination device according to claim 1, wherein the acquisition unit acquires the deficiency amount for at least one of the volume, area, and height of the solder printed on the printed substrate.

3. The printing control parameter determination device according to claim 1 or 2, wherein the determination unit calculates the adjustment control parameter when the solder is printed by the first printing unit and the adjustment control parameter when the solder is printed by the second printing unit to determine the production control parameter.

4. The printing control parameter determination device according to claim 1, wherein the control parameter is at least one of the printing pressure, printing speed, stencil release speed, and angle of the squeegee relative to the mask of the printing press that slides the squeegee over the mask to print the solder onto the substrate through the openings in the mask.

5. The printing control parameter determination device according to claim 1, wherein, during the production of a product substrate, the printing machine uses the production control parameters determined by the determination unit to print a target amount of solder onto a substrate that has not yet been printed with solder, and the printing inspection machine determines that the amount of solder printed on a first substrate, which is a substrate that has been printed with solder by the printing machine before the substrate in question, is insufficient compared to the target amount, and the deficiency exceeds an acceptable range, the device further comprises a storage unit that temporarily stores the first substrate in a storage area provided in the printing inspection machine until the second substrate, which is a substrate being printed by the printing machine, arrives at the printing inspection machine and the first substrate can be moved from the printing inspection machine to the printing area of ​​the printing machine.

6. The printing control parameter determination device according to claim 5, further comprising a moving unit for moving the first substrate along a path consisting of the inspection area of ​​the printing inspection machine, the storage area, and the printing area of ​​the printing machine.

7. The printing control parameter determination device according to claim 6, wherein the moving unit uses a robot arm to move the first substrate from the inspection area to the storage area.

8. The printing control parameter determination device according to claim 6, wherein the moving unit moves the first substrate from the inspection area to the storage area using a lifting device.

9. A printing control parameter determination device according to any one of claims 6 to 8, further comprising a reprinting unit for printing the insufficient amount of solder on the first substrate which has been moved by the moving unit from the storage area of ​​the printing inspection machine to the printing area of ​​the printing machine.

10. The printing control parameter determination device according to claim 1, wherein, during the production of product substrates, the printing machine uses the production control parameters determined by the determination unit to print a target amount of solder onto substrates that have not yet been printed with solder, and the printing inspection machine determines that the amount of solder printed on a first substrate, which is a substrate that has been printed with solder by the printing machine before the substrate in question, exceeds the target amount, and if the excess exceeds an acceptable range, the device further comprises a storage unit that temporarily stores the first substrate in a storage area provided in the printing inspection machine.

11. The printing control parameter determination device according to claim 10, wherein the storage unit temporarily stores the first substrate so that it can be removed from the storage area, regardless of whether or not the substrate is being inspected by the printing inspection machine.

12. The printing control parameter determination device according to claim 10 or 11, wherein the storage unit temporarily stores the first substrate so that it can be removed from the storage area by at least one of an operator and a removal device.

13. The printing control parameter determination device according to claim 12, wherein the storage unit guides the first substrate being removed by the worker and the first substrate being removed by the removal device when they are mixed in the storage area.

14. A printing control parameter determination device comprising: a first printing unit that prints a trial amount of the same amount of solder as the target amount of solder to be printed on the substrate using a printing machine; an acquisition unit that transports the printed substrate, which is the substrate on which the solder has been printed by the first printing unit, from the printing machine to a printing inspection machine and acquires the amount of solder that is insufficient compared to the target amount printed on the printed substrate; a second printing unit that transports the printed substrate from the printing inspection machine to the printing machine and prints the amount of solder that is insufficient, acquired by the acquisition unit, onto the printed substrate; and a determination unit that determines the production control parameters, which are the control parameters for printing the target amount of solder on a substrate on which the solder has not been printed, based on the adjustment control parameters, which are the control parameters of the printing machine when the solder is printed by the first printing unit and the second printing unit.

15. A method for determining printing control parameters, comprising: a first printing step of printing a trial amount of solder, less than a target amount of solder to be printed on the substrate, onto the substrate using a printing machine; an acquisition step of transporting the printed substrate, which is the substrate on which the solder has been printed in the first printing step, from the printing machine to a printing inspection machine to obtain the amount of solder that is insufficient relative to the target amount printed on the printed substrate; a second printing step of transporting the printed substrate from the printing inspection machine to the printing machine to print the amount of solder that is insufficient, which was obtained in the acquisition step, onto the printed substrate; and a determination step of determining a production control parameter, which is the control parameter for printing the target amount of solder on a substrate on which the solder has not been printed, based on the adjustment control parameter, which is the control parameter of the printing machine when the solder is printed in the first printing step and the second printing step.

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