Measurement result acquisition device and jig

Abstract

This measurement result acquisition device comprises a reception unit and an acquisition unit. The reception unit receives measurement results obtained by using each measurement device of a plurality of measurement devices to measure the same object to be measured, the plurality of measurement devices being capable of measuring an object to be measured that is solder printed on a substrate or a simulation member simulating the shape of the solder printed on the substrate. The acquisition unit acquires, on the basis of the measurement results by the plurality of measurement devices and received by the reception unit, a representative value of the measurement results.

Description

Measuring result acquisition device and jig

[0001] This specification discloses technologies related to a measuring result acquisition device and a jig.

[0002] The substrate processing line described in Patent Document 1 includes a printing machine and a printing inspection machine. The printing inspection machine inspects the printing state of the solder printed by the printing machine.

[0003] Japanese Patent Application Laid-Open No. 2024-069552

[0004] For example, the printing inspection machine includes a measuring device capable of measuring a measurement object such as solder printed on a substrate. If the manufacturer of the measuring device or the settings of the measuring device are different, even when measuring the same measurement object, the measurement results may be different depending on the measuring device. Therefore, there is a demand to obtain the same measurement result regardless of which measuring device is used.

[0005] In view of such circumstances, this specification discloses a measuring result acquisition device that can obtain the same measurement result regardless of which measuring device is used when measuring the same measurement object using a plurality of measuring devices, and a jig that can be used for the measuring result acquisition device.

[0006] This specification discloses a measuring result acquisition device including a receiving unit and an acquisition unit. The receiving unit receives measurement results obtained by respectively measuring the same measurement object by a plurality of measuring devices capable of measuring a measurement object that is solder printed on a substrate or a simulation member simulating the shape of the solder to be printed on the substrate. The acquisition unit obtains a representative value of the measurement results based on the measurement results by the plurality of measuring devices received by the receiving unit.

[0007] Further, this specification discloses a jig including a simulation member simulating the shape of solder to be printed on a substrate, and the simulation member is arranged so that a plurality of measuring devices can respectively measure it.

[0008] Furthermore, this specification discloses a technical concept in which, in claim 6 of the claims initially attached to the application (hereinafter referred to as the "initial claims"), "the device for obtaining measurement results described in claim 2" is changed to "the device for obtaining measurement results described in any one of claims 2 to 5". Also, this specification discloses a technical concept in which, in claim 7 of the initial claims, "the device for obtaining measurement results described in claim 2" is changed to "the device for obtaining measurement results described in any one of claims 2 to 6". Furthermore, this specification discloses a technical concept in which, in claim 11 of the initial claims, "the device for obtaining measurement results described in claim 1" is changed to "the device for obtaining measurement results described in any one of claims 1 to 10".

[0009] The above-described measurement result acquisition device can obtain representative values ​​of the measurement results. Therefore, when measuring the same object using multiple measuring devices, the measurement result acquisition device can obtain the same measurement results regardless of which measuring device is used. Furthermore, the jig can be used with the above-described measurement result acquisition device.

[0010] This is a configuration diagram showing an example of the configuration of a substrate work line. This is a partial cross-sectional view showing an example of the configuration of a printing press. This is a block diagram showing an example of a control block for a measurement result acquisition device. This is a flowchart showing an example of a control procedure by a measurement result acquisition device. This is a perspective view showing an example of a jig. This is a perspective view showing an example of a simulated member. This is a perspective view showing another example of a simulated member. This is a perspective view showing another example of a simulated member. This is a perspective view showing another example of a simulated member. This is a schematic diagram showing an example of a correspondence. This is a side view showing an example of an object to be measured. This is an explanatory diagram showing an example of a process performed on the object to be measured in Figure 12. This is an explanatory diagram showing another example of a process performed on the object to be measured in Figure 12.

[0011] 1. Embodiment 1-1. Example of the configuration of the substrate processing line WML In the substrate processing line WML, a substrate processing machine WM0 performs predetermined substrate processing on a substrate 90 to produce a product substrate 900. The type and number of substrate processing machines WM0 that constitute the substrate processing line WML are not limited. As shown in Figure 1, the substrate processing line WML of this embodiment is equipped with a plurality (five) of substrate processing machines WM0, including a printing machine WM1, a printing inspection machine WM2, a component mounting machine WM3, a reflow oven WM4, and a visual inspection machine WM5, and the substrate 90 is transported in this order by a substrate transport device.

[0012] The printing press WM1 prints solder 80 onto the mounting positions of multiple components on the circuit board 90. The printing inspection machine WM2 inspects the solder 80 printed on the circuit board 90 by the printing press WM1. The component mounting machine WM3 mounts multiple components onto the circuit board 90 on which the solder 80 has been printed by the printing press WM1. There may be one component mounting machine WM3 or multiple component mounting machines. If multiple component mounting machines WM3 are provided, the multiple component mounting machines WM3 can share the task of mounting multiple components.

[0013] The reflow oven WM4 heats the substrate 90 on which multiple components have been mounted by the component mounting machine WM3, melts the solder 80, and performs soldering. The visual inspection machine WM5 inspects the mounting condition of the multiple components mounted by the component mounting machine WM3. In this way, the substrate processing line WML can produce product substrates 90 by sequentially transporting the substrate 90 using multiple (five) substrate processing machines WM0 and performing production processes including inspection. The substrate processing line WML can also be equipped with substrate processing machines WM0 as needed, such as a functional inspection machine, buffer device, substrate supply device, substrate inversion device, shield mounting device, adhesive coating device, and ultraviolet irradiation device.

[0014] Multiple (five) board-to-board work machines WM0 and management device WMC, which constitute the board-to-board work line WML, are connected to each other via a communication unit LC0. The communication unit LC0 may communicate via wired or wireless means. Various communication methods are possible. In this embodiment, the multiple (five) board-to-board work machines WM0 and management device WMC constitute a local area network (LAN). As a result, the multiple (five) board-to-board work machines WM0 can communicate with each other via the communication unit LC0. Furthermore, the multiple (five) board-to-board work machines WM0 can communicate with the management device WMC via the communication unit LC0.

[0015] The WMC control unit controls the five board-to-board work machines (WM0) that make up the WML board-to-board work line and monitors the operating status of the WML board-to-board work line. The WMC control unit stores various control data for controlling the five board-to-board work machines (WM0). The WMC control unit transmits control data to each of the five board-to-board work machines (WM0). In addition, each of the five board-to-board work machines (WM0) transmits its operating status and production status to the WMC control unit.

[0016] The management device WMC can be equipped with a data server DSV. The data server DSV can store, for example, acquired data obtained by the board handling machine WM0 regarding board handling operations. For example, various image data captured by the board handling machine WM0 are included in the acquired data. Records of operating status (log data) acquired by the board handling machine WM0 are also included in the acquired data.

[0017] Furthermore, the data server DSV can also store various production information related to the production of the circuit board 90. For example, component data such as information on the shape of each type of component, information on electrical characteristics, and information on how to handle components are included in the production information. In addition, inspection results from inspection machines such as the printing inspection machine WM2 and the visual inspection machine WM5 are included in the acquired data and also in the production information.

[0018] 1-2. Configuration Example of Printing Press WM1 In the embodiment of the printing press WM1, a squeegee 34 slides over a mask 70 to print solder 80 onto a substrate 90 through an opening 71 in the mask 70. As shown in Figure 2, the printing press WM1 of the embodiment includes a substrate transport device 10, a mask support device 20, a squeegee moving device 30, a control device 40, and a display device 41. In this specification, the transport direction of the substrate 90 (the direction perpendicular to the plane of the paper in Figure 2) is defined as the X-axis direction. The direction perpendicular to the X-axis direction in the horizontal plane (XY plane) (the front-to-back direction of the printing press WM1, and the left-to-right direction of the plane of the paper in Figure 2) is defined as the Y-axis direction. Furthermore, the vertical direction perpendicular to the X-axis direction and the Y-axis direction (the up-and-down direction of the plane of the paper in Figure 2) is defined as the Z-axis direction.

[0019] The substrate transport device 10 transports the substrate 90 to be printed. The substrate 90 is a circuit board on which various circuits such as electronic circuits, electrical circuits, and magnetic circuits are formed. The substrate transport device 10 is installed on the base BS1 of the printing press WM1. The substrate transport device 10 transports the substrate 90 by, for example, a belt conveyor extending in the X-axis direction.

[0020] The substrate transport device 10 includes a substrate holding unit 11 for holding the substrate 90 that has been loaded into the printing press WM1. The substrate holding unit 11 is located below the mask 70 and is configured to be able to move up and down in the Z-axis direction by a linear motion mechanism, such as a lead screw mechanism. Specifically, the substrate holding unit 11 is lowered when the substrate 90 is being transported, and when the substrate 90 is transported to a predetermined position, it rises together with the substrate 90 and holds the substrate 90 in close contact with the lower surface of the mask 70.

[0021] The mask support device 20 is located above the substrate transport device 10. The mask support device 20 supports the mask 70 with a pair of support bases. The pair of support bases are located on the left side (the far side of the page in Figure 2, which is shown) and the right side (the near side of the page in Figure 2, which is not shown) of the printing press WM1 when viewed from the front, and are formed to extend along the Y-axis.

[0022] Figure 2 is a partial cross-sectional view of the printing press WM1 cut along the Y-axis, schematically showing the interior of the printing press WM1 in a side view, as well as cross-sections of the mask 70 and substrate 90. The mask 70 has openings 71 that penetrate at predetermined positions on the wiring pattern of the substrate 90. The mask 70 is supported by a mask support device 20, for example, via a frame member provided on its outer edge.

[0023] The squeegee moving device 30 raises and lowers the squeegee 34 in a direction perpendicular to the mask 70 (Z-axis direction), and also moves the squeegee 34 in the Y-axis direction on the upper surface of the mask 70. The squeegee moving device 30 comprises a head drive device 31, a squeegee head 32, a pair of lifting devices 33, 33, and a pair of squeegees 34, 34. The head drive device 31 is located on the upper side of the printing press WM1. The head drive device 31 can move the squeegee head 32 in the Y-axis direction by a linear motion mechanism such as a feed screw mechanism.

[0024] The squeegee head 32 is clamped and fixed to the moving body that constitutes the linear motion mechanism of the head drive unit 31. The squeegee head 32 holds a pair of lifting devices 33, 33. Each of the pair of lifting devices 33, 33 holds a squeegee 34 and can be driven independently of each other. Each of the pair of lifting devices 33, 33 drives an actuator, such as an air cylinder, to raise or lower the squeegee 34 it holds.

[0025] The squeegee 34 slides along the upper surface of the mask 70, moving the solder 80 supplied to the upper surface of the mask 70 along the mask 70. Solder 80 can be solder paste. The solder 80 is pressed into the substrate 90 through the opening 71 of the mask 70, printing the solder 80 onto the substrate 90 positioned on the lower side of the mask 70. In this embodiment, each of the pair of squeegees 34, 34 is a plate-shaped member formed to extend along the width direction (X-axis direction) perpendicular to the printing direction (Y-axis direction) in the horizontal plane (XY plane).

[0026] The front squeegee 34 of the pair of squeegees 34, 34 (left side of the paper in Figure 2) is used in a printing process that moves solder 80 from front to back, with the direction of travel being from front to back of the printing press WM1. The rear squeegee 34 of the pair of squeegees 34, 34 (right side of the paper in Figure 2) is used in a printing process that moves solder 80 from back to front, with the direction of travel being from back to front of the printing press WM1. In addition, for both squeegees 34, the direction opposite to the direction of travel is the direction of reversal.

[0027] Each of the pair of squeegees 34, 34 is held in the lifting device 33 at an angle such that the front portion facing the direction of travel is tilted downwards. In other words, each of the pair of squeegees 34, 34 is held in the lifting device 33 at an angle such that the rear portion facing the direction of reversal is tilted upwards. The tilt angle of each of the pair of squeegees 34, 34 can also be adjusted by an adjustment mechanism provided at the bottom of the lifting device 33.

[0028] The control device 40 is equipped with a known arithmetic unit and memory device, and a control circuit is configured. The control device 40 is connected to the management device WMC via the communication unit LC0 shown in Figure 1, and can send and receive various data. The control device 40 can drive and control the substrate transport device 10, the mask support device 20, the squeegee moving device 30, and the display device 41 based on the production program, the detection results of various sensors, etc.

[0029] Furthermore, the control device 40 is equipped with a storage device. The storage device can be, for example, a magnetic storage device such as a hard disk drive, or a storage device using semiconductor elements such as flash memory. The storage device stores production programs for driving the WM1 printer. The control device 40 acquires various information stored in the storage device and detection results from various sensors provided on the WM1 printer.

[0030] The control device 40, for example, drives and controls the squeegee moving device 30. Based on the various information and detection results described above, the control device 40 sends control signals to the squeegee moving device 30. This controls the Y-axis position, Z-axis position (height), and moving speed of the pair of squeegees 34, 34 held by the squeegee head 32. As previously described, the pair of squeegees 34, 34 are driven and controlled to print solder 80 onto the substrate 90 located on the lower side of the mask 70.

[0031] As shown in Figure 2, the control device 40 is equipped with a display device 41. The display device 41 can display the operating status of the printing press WM1. The display device 41 is also configured as a touch panel and functions as an input device that accepts various operations from the operator. The operator can learn the operating status of the printing press WM1 via the display device 41. Furthermore, the operator can configure the printing press WM1 and give instructions to the printing press WM1 via the display device 41.

[0032] 1-3. Example Configuration of Measurement Result Acquisition Device 50 For example, the printing inspection machine WM2 is equipped with a measuring device FC0 capable of measuring objects 82 such as solder 80 printed on a substrate 90. If the manufacturer of the measuring device FC0 or the settings of the measuring device FC0 are different, the measurement results may differ depending on the measuring device FC0, even when measuring the same object 82. Therefore, there is a need to obtain the same measurement results regardless of which measuring device FC0 is used.

[0033] Therefore, the substrate work line WML of the embodiment is provided with a measurement result acquisition device 50. The measurement result acquisition device 50 can acquire a representative value VL0 of the measurement result. Thus, when measuring the same object 82 using multiple measuring devices FC0, the measurement result acquisition device 50 can acquire the same measurement result regardless of which measuring device FC0 is used. Specifically, as shown in Figure 3, the measurement result acquisition device 50, when considered as a control block, comprises a receiving unit 51 and an acquisition unit 52.

[0034] The receiving unit 51 and the acquisition unit 52 can be installed in various control devices such as the control device for the substrate work machine WM0, and various management devices such as the management device WMC. For example, at least one of the receiving unit 51 and the acquisition unit 52 can be installed in the control device 40 of the printing machine WM1. At least one of the receiving unit 51 and the acquisition unit 52 can also be installed in the printing inspection machine WM2. At least one of the receiving unit 51 and the acquisition unit 52 can also be installed in the management device WMC. At least one of the receiving unit 51 and the acquisition unit 52 can also be formed on the cloud. The receiving unit 51 and the acquisition unit 52 can also be distributed across various control devices, various management devices, the cloud, etc.

[0035] As shown in Figure 3, in the measurement result acquisition device 50 of this embodiment, the receiving unit 51 and the acquisition unit 52 are provided in the management device WMC. Furthermore, the measurement result acquisition device 50 can perform control according to the flowchart shown in Figure 4. The receiving unit 51 performs the process shown in step S11. The acquisition unit 52 performs the process shown in step S12. Note that the matters described herein can be selected and applied as appropriate. Furthermore, the matters described herein can be combined as appropriate. In addition, the matters described herein can be modified as appropriate.

[0036] 1-3-1. Receiving unit 51, acquisition unit 52, and jig 100 The receiving unit 51 receives the measurement results of multiple measuring devices FC0 capable of measuring the same object 82, each having measured the same object 82 (step S11 shown in Figure 4). The object 82 refers to solder 80 printed on the substrate 90, or a simulated member 81 that mimics the shape of solder 80 to be printed on the substrate 90.

[0037] For example, the jig 100 shown in Figure 5 includes simulated members 81 that mimic the shape of solder 80 printed on a substrate 90, and the simulated members 81 are arranged so that multiple measuring devices FC0 can each measure them. Specifically, the jig 100 shown in Figure 5 includes a base member 100a formed in the shape of a plate, and a group of simulated members 81g formed on the surface of the base member 100a. The group of simulated members 81g refers to a collection of multiple simulated members 81. The shape, number, and arrangement of the simulated members 81g differ depending on the type of component to be placed on the solder 80.

[0038] For example, in the jig 100 shown in Figure 5, multiple groups of simulated members 81g enclosed by dashed lines are arranged in a straight line at a fixed distance apart. Therefore, the measuring device FC0 can measure each of the simulated member groups 81g in the device provided. Furthermore, multiple groups of simulated members 81g are provided for each type of simulated member 81, and the physical quantity of the simulated member 81 (for example, at least one of volume, area, and height) can be increased or decreased for each group of simulated members 81g. Therefore, the measuring device FC0 can also measure multiple types of simulated members 81. The simulated member 81 only needs to mimic the shape of the solder 80 printed on the substrate 90, and can take on various shapes.

[0039] As shown in Figure 6, for example, the simulated member 81a can be formed in the shape of a thin plate. The simulated member 81a shown in Figure 6 simulates a rectangular solder 80 that is printed in the area where a substantially rectangular parallelepiped chip component is mounted. The length of one side of the rectangular solder 80 is indicated by dimension L1. The distance between adjacent chip components is indicated by gap G1.

[0040] As shown in Figure 7, for example, the simulated member 81b can also be formed in a cylindrical shape. The simulated member 81b shown in Figure 7 simulates solder 80 printed in the area where bump components such as semiconductor packages (e.g., BGA: Ball Grid Array) are mounted. The bump diameter is indicated by dimension L2. The distance between adjacent bumps is indicated by gap G2.

[0041] As shown in Figure 8, for example, the simulated member 81c can also be formed in the shape of a rectangular parallelepiped. The simulated member 81c shown in Figure 8 simulates solder 80 printed in the area where leaded components (e.g., QFP: Quad Flat Package) are attached. The lead width is indicated by dimension L3. The distance between adjacent leads is indicated by gap G3.

[0042] The simulated member 81 can also be formed as an elliptical prism with an elliptical cross-section perpendicular to the axial direction. Alternatively, the simulated member 81 can be formed as a square prism with a square cross-section perpendicular to the axial direction. Furthermore, the upper part of the simulated member 81 can take on various shapes. As shown in Figure 9, for example, the upper part of the simulated member 81d is formed as a triangular prism from the rectangular parallelepiped-shaped simulated member 81c. Also, as shown in Figure 10, for example, the upper part of the simulated member 81e is formed as a semi-cylindrical shape (a cylinder divided in half along the axial direction) from the rectangular parallelepiped-shaped simulated member 81c. Similarly, the upper part of the simulated member 81 may be formed as a cone from the cylindrical simulated member 81b shown in Figure 7. Alternatively, the upper part of the simulated member 81 may be formed as a hemisphere from the cylindrical simulated member 81b shown in Figure 7.

[0043] Similarly, the shape of the solder 80 printed on the substrate 90 is not limited and can take various shapes. For example, solder 80 having a shape similar to the simulated member 81 described above is included in the object to be measured 82. The measuring device FC0 only needs to be able to measure any physical quantity of the object to be measured 82, and known measuring devices can be used. For example, the measuring device FC0 can measure at least one of the volume, area, and height of the object to be measured 82. In this case, the receiving unit 51 can receive the measurement result of at least one of the volume, area, and height of the object to be measured 82 from the measuring device FC0.

[0044] When the receiving part 51 receives the volume of the measurement object 82, the measuring device FC0 needs to measure the volume of the measurement object 82. In this case, the measuring device FC0 can use, for example, a three-dimensional sensor. The three-dimensional sensor may be any sensor that can recognize the shape of the measurement object 82 in three dimensions, and known sensors can be used. For example, the three-dimensional sensor can irradiate the measurement object 82 with a laser beam to measure the volume of the measurement object 82. In this way, the receiving part 51 can receive the measurement result of the volume of the measurement object 82 measured by the three-dimensional sensor.

[0045] Also, a plurality of measuring devices FC0 can be provided in various devices such as a printing machine WM1 and a printing inspection machine WM2. For example, one of the plurality of measuring devices FC0 can be provided in a printing machine WM1 that prints solder 80 on a substrate 90. As shown in FIG. 2, the measuring device FC0 is provided below the mask 70 and can move in the X-axis direction and the Y-axis direction by, for example, an XY table to measure the measurement object 82.

[0046] Specifically, the receiving part 51 can move the measuring device FC0 linearly in a state where the jig 100 or the substrate 90 is located below in the vertical direction (Z-axis direction), and measure the measurement object 82 from above the jig 100 or the substrate 90 by the measuring device FC0. Also, for example, another one of the plurality of measuring devices FC0 can be provided in a printing inspection machine WM2 that inspects the solder 80 printed on the substrate 90. The printing inspection machine WM2 has the same movement mechanism as the printing machine WM1, and the receiving part 51 can measure the measurement object 82 from above the jig 100 or the substrate 90 by the printing inspection machine WM2 in the same manner as the printing machine WM1.

[0047] For example, when introducing the printing machine WM1 or the printing inspection machine WM2, the receiving unit 51 can cause a plurality of measuring devices FC0 to measure the same measurement object 82 respectively. Further, the receiving unit 51 can also cause the plurality of measuring devices FC0 to measure the same measurement object 82 respectively every time a certain period elapses after the introduction of the printing machine WM1. Furthermore, the receiving unit 51 can also cause the plurality of measuring devices FC0 to measure the same measurement object 82 respectively at the timing when the type of the product substrate 900 produced on the substrate working line WML is switched.

[0048] The acquisition unit 52 acquires a representative value VL0 of the measurement results (step S12 shown in FIG. 4) based on the measurement results by the plurality of measuring devices FC0 received by the receiving unit 51. The representative value VL0 only needs to represent the measurement results when the plurality of measuring devices FC0 measure the same measurement object 82 respectively, and is not limited. For example, the forms of acquiring the representative value VL0 include the first form to the third form shown below.

[0049] 1-3-2. First form For example, one of the plurality of measuring devices FC0 is set as the first measuring device FC1. Also, a measuring device FC0 different from the first measuring device FC1 is set as the second measuring device FC2. In this case, the receiving unit 51 receives a first measurement value VL1 which is the measurement result of the measurement object 82 by the first measuring device FC1 and a second measurement value VL2 which is the measurement result of the measurement object 82 by the second measuring device FC2.

[0050] In the above form, the acquisition unit 52 can acquire the correspondence relationship CR0 between the first measurement value VL1 and the second measurement value VL2, and acquire the representative value VL0 based on the acquired correspondence relationship CR0. The correspondence relationship CR0 only needs to show the relationship between the first measurement value VL1 and the second measurement value VL2, and can take various forms. As shown in FIG. 11, for example, the correspondence relationship CR0 preferably shows the relationship between the first measurement value VL1, a predicted value PV0 obtained by performing a predetermined process on the first measurement value VL1 to predict the second measurement value VL2 from the first measurement value VL1, and the second measurement value VL2.

[0051] In the example shown in Figure 11, the predicted value PV0 comprises four predicted values ​​A, B, C, and D, each with a different processing. For example, the measuring device FC0 may measure the object to be measured 82 under the assumption that solder 80 is present without any defects from the pad surface of the substrate 90 up to a predetermined height of less than one solder particle, which is the low-cut line LT1. Figures 12 to 14 schematically show the object to be measured 82, which is solder 80 printed on the substrate 90. Figure 12 shows the actual state of the object to be measured 82, and Figure 13 shows the state of the object to be measured 82 when the low-cut line LT1 is set.

[0052] As shown in Figure 13, the measuring device FC0 may measure the object to be measured 82 under the assumption that the solder 80 exists in a columnar shape below the low-cut line LT1. For example, if the actual volume of the object to be measured 82 differs from the assumed volume below the low-cut line LT1, the measurement result of the object to be measured 82 by the measuring device FC0 will differ from the actual volume of the object to be measured 82. In addition, the measurement result of the object to be measured 82 by the measuring device FC0 may vary depending on the set height of the low-cut line LT1. In the predicted values ​​A and B shown in Figure 11, the set height of the low-cut line LT1 is different.

[0053] Furthermore, when measuring the object 82, the measuring device FC0 may perform an approximation process to approximate the outer shape of the object 82 in order to reduce the irregularities of the object 82. Figure 14 shows the state of the object 82 when the approximation curve LT2 is set. As shown in the figure, if the above approximation process is performed when there are recesses in the outer shape of the object 82, the measurement result of the object 82 by the measuring device FC0 will be larger than the actual volume of the object 82.

[0054] Conversely, if the approximation process described above is performed when there is a protrusion on the outer shape of the object to be measured 82, the measurement result of the object to be measured 82 by the measuring device FC0 will be smaller than the actual volume of the object to be measured 82. Also, the measurement result of the object to be measured 82 by the measuring device FC0 may vary depending on the type of approximation process. In the predicted values ​​C and D shown in Figure 11, the types of approximation processes are different. The approximation process is not limited. For example, the measuring device FC0 can linearly approximate the outer shape of the object to be measured 82 when measuring it. The measuring device FC0 can polynomially approximate the outer shape of the object to be measured 82 when measuring it.

[0055] The acquisition unit 52 prefers to acquire the predicted value PV0 with the highest agreement rate with the second measured value VL2 as the representative value VL0. This allows the acquisition unit 52 to predict the second measured value VL2 from the first measured value VL1 and acquire the representative value VL0. The agreement rate shown in Figure 11 represents the agreement rate between the predicted value B and the second measured value VL2. The predicted value B has the highest agreement rate compared to the other predicted values ​​PV0 (the division value obtained by dividing the second measured value VL2 by the predicted value PV0 is close to 1.0), and the figure shows that the predicted value B is acquired as the representative value VL0.

[0056] The receiving unit 51 can receive measurement results obtained for a jig 100 or substrate 90 for which the measurement results of the object to be measured 82 are known. In this case, the first measurement value VL1 and the second measurement value VL2 can be expressed as a percentage of the known measurement result. For example, the first measurement value VL1 and the second measurement value VL2 shown in Figure 11 are expressed as a percentage (%) when the known measurement result is set to 100. Similarly, the predicted value PV0 shown in Figure 11 is expressed as a percentage (%) when the known measurement result is set to 100.

[0057] Furthermore, as previously described, the jig 100 may include a simulated member 81. The simulated member 81 has a defined shape, making it easy to recognize in advance the physical quantities of the object to be measured 82 (for example, at least one of volume, area, and height). If the object to be measured 82 is solder 80 printed on a substrate 90, the physical quantities of the object to be measured 82 can be measured in advance using other measuring devices.

[0058] The acquisition unit 52 can also acquire the type of processing performed on the predicted value PV0 acquired as the representative value VL0. In the example shown in Figure 11, the predicted value B is acquired as the representative value VL0. The predicted value B has a low-cut line LT1 set relative to the first measured value VL1. Therefore, in the example shown in Figure 11, the acquisition unit 52 can acquire the setting of the low-cut line LT1 as the type of processing. The acquisition unit 52 can also acquire the set height of the low-cut line LT1.

[0059] As shown in Figure 11, the correspondence relationship CR0 can also indicate the previously described relationship for each type of component placed on the solder 80 printed on the substrate 90. For example, component types P11 and P12 shown in Figure 11 correspond to the previously described chip components. Component types P11 and P12 differ in at least one of the previously described dimensions L1 and gap G1.

[0060] Similarly, part types P21 and P22 shown in Figure 11 correspond to the bump parts described above. Part types P21 and P22 differ from at least one of the previously described dimensions L2 and gap G2. Also, part types P31 and P32 shown in Figure 11 correspond to the lead parts described above. Part types P31 and P32 differ from at least one of the previously described dimensions L3 and gap G3.

[0061] The acquisition unit 52 can acquire as the representative value VL0 the predicted value PV0 that has a high agreement rate with the second measured value VL2 for a given part type. The acquisition unit 52 can also acquire as the representative value VL0 the predicted value PV0 that has a high agreement rate with the second measured value VL2 for multiple types of part types. Furthermore, the acquisition unit 52 can also weight part types that are difficult to print more heavily, and acquire as the representative value VL0 the predicted value PV0 that has a high agreement rate with the second measured value VL2.

[0062] For example, the acquisition unit 52 can weight bump components more heavily than chip components. In this case, the predicted value PV0 of a bump component that has a high agreement rate with the second measured value VL2 is more likely to be acquired as the representative value VL0 compared to the predicted value PV0 of a chip component. Similarly, the acquisition unit 52 can weight lead components more heavily than chip components. In this case, the predicted value PV0 of a lead component that has a high agreement rate with the second measured value VL2 is more likely to be acquired as the representative value VL0 compared to the predicted value PV0 of a chip component.

[0063] As previously described, the multiple measuring devices FC0 can be installed in various devices such as a printing machine WM1 that prints solder 80 onto a substrate 90, and a printing inspection machine WM2 that inspects the solder 80 printed on the substrate 90. For example, the first measuring device FC1 can be installed in the printing machine WM1, and the second measuring device FC2 can be installed in the printing inspection machine WM2. In this case, the receiving unit 51 can receive measurement results from the first measuring device FC1 installed in the printing machine WM1 and the second measuring device FC2 installed in the printing inspection machine WM2, respectively. As a result, the acquisition unit 52 can predict the second measurement value VL2, which is the measurement result of the second measuring device FC2 installed in the printing inspection machine WM2, from the first measurement value VL1, which is the measurement result of the first measuring device FC1 installed in the printing machine WM1, and acquire a representative value VL0.

[0064] 1-3-3. The second acquisition unit 52 can also perform calculation processing on the measurement results from multiple measuring devices FC0 received by the receiving unit 51 to obtain a representative value VL0. The method of calculation processing is not limited. For example, the acquisition unit 52 can calculate the average value of the measurement results from multiple measuring devices FC0 and obtain the calculated average value as the representative value VL0. Alternatively, the acquisition unit 52 can calculate the median value of the measurement results from multiple measuring devices FC0 and obtain the calculated median value as the representative value VL0.

[0065] For example, let's assume that the receiving unit 51 has received a first measurement value VL1, which is the measurement result of the object 82 measured by the first measuring device FC1, and a second measurement value VL2, which is the measurement result of the object 82 measured by the second measuring device FC2. In this case, the acquisition unit 52 can acquire the average value of the first measurement value VL1 and the second measurement value VL2 as the representative value VL0. Alternatively, the acquisition unit 52 can also acquire the median value of the first measurement value VL1 and the second measurement value VL2 as the representative value VL0.

[0066] 1-3-4. The third acquisition unit 52 can also acquire one of the multiple measurement results from the multiple measuring devices FC0 received by the receiving unit 51 as a representative value VL0. For example, suppose the receiving unit 51 has received a first measurement value VL1, which is the measurement result of the object to be measured 82 by the first measuring device FC1, and a second measurement value VL2, which is the measurement result of the object to be measured 82 by the second measuring device FC2. In this case, the acquisition unit 52 can acquire either the first measurement value VL1 or the second measurement value VL2 as a representative value VL0.

[0067] Furthermore, the receiving unit 51 can also receive measurement results obtained from a jig 100 or substrate 90 for which the measurement results of the object to be measured 82 are known. In this case, the acquisition unit 52 can acquire the known measurement result (true measurement result) as a representative value VL0. Therefore, the measurement result acquisition device 50 can also perform calibration in the substrate production line WML where the actual product substrate 900 is produced.

[0068] Furthermore, known measurement results (true measurement results) can also be included in the correspondence relationship CR0. In this case, the correspondence relationship CR0 shows the relationship between the first measurement value VL1, the known measurement result (true measurement result), and the second measurement value VL2. Based on the correspondence relationship CR0, the acquisition unit 52 can acquire the known measurement result (true measurement result) as the representative value VL0.

[0069] 2. Measurement Result Acquisition Method The same applies to the measurement result acquisition method as described above for the measurement result acquisition device 50. Specifically, the measurement result acquisition method comprises a receiving step and an acquisition step. The receiving step corresponds to the control performed by the receiving unit 51. The acquisition step corresponds to the control performed by the acquisition unit 52. The jig 100 described above can also be used in the measurement result acquisition method. Furthermore, redundant explanations have been omitted in this specification.

[0070] 3. An example of the effects of the embodiment: The measurement result acquisition device 50 can acquire a representative value VL0 of the measurement result. Therefore, when measuring the same object 82 using multiple measuring devices FC0, the measurement result acquisition device 50 can acquire the same measurement result regardless of which measuring device FC0 is used. In addition, the jig 100 can be used with the measurement result acquisition device 50.

[0071] 50: Measurement result acquisition device, 51: Receiving unit, 52: Acquisition unit, 80: Solder, 81: Simulated component, 82: Object to be measured, 90: Substrate, 100: Jig, FC0: Measurement device, FC1: First measurement device, FC2: Second measurement device, VL0: Representative value, VL1: First measurement value, VL2: Second measurement value, PV0: Predicted value, CR0: Correspondence relationship, WM1: Printing machine, WM2: Printing inspection machine.

Claims

1. A measurement result acquisition device comprising: a receiving unit that receives measurement results from multiple measuring devices that measure the same object, which is solder printed on a circuit board or a simulated member that mimics the shape of the solder printed on the circuit board; and an acquisition unit that acquires a representative value of the measurement results based on the measurement results from the multiple measuring devices received by the receiving unit.

2. The measurement result acquisition device according to claim 1, wherein the receiving unit receives a first measurement value, which is the measurement result of the object to be measured by a first measuring device, which is one measuring device, and a second measurement value, which is the measurement result of the object to be measured by a second measuring device, which is a measuring device different from the first measuring device, and the acquisition unit acquires the correspondence between the first measurement value and the second measurement value, and acquires the representative value based on the acquired correspondence.

3. The correspondence relationship shows the relationship between the first measurement value, a predicted value obtained by performing a predetermined process on the first measurement value to predict the second measurement value from the first measurement value, and the second measurement value, wherein the acquisition unit acquires the predicted value with a high agreement rate with the second measurement value as the representative value, according to claim 2.

4. The measurement result acquisition device according to claim 3, wherein the acquisition unit acquires the type of processing performed on the predicted value acquired as the representative value.

5. The measurement result acquisition device according to any one of claims 2 to 4, wherein the correspondence is shown for each type of component placed on the solder printed on the substrate.

6. The measurement result acquisition device according to claim 2, wherein the receiving unit receives the measurement results from the first measuring device provided in a printing machine for printing the solder onto the substrate and the second measuring device provided in a printing inspection machine for inspecting the solder printed on the substrate.

7. The receiving unit receives the measurement results measured on a jig or substrate for which the measurement results of the object to be measured are known, and the first measurement value and the second measurement value are indicated as a percentage of the known measurement results, as described in claim 2.

8. The measurement result acquisition device according to claim 7, wherein the jig comprises the simulated member.

9. The measurement result acquisition device according to claim 1, wherein the acquisition unit performs calculation processing on the measurement results from the plurality of measuring devices received by the receiving unit to acquire the representative value.

10. The measurement result acquisition device according to claim 9, wherein the acquisition unit calculates the average value of the measurement results from the plurality of measuring devices and acquires the calculated average value as the representative value.

11. The measurement result acquisition device according to claim 1, wherein the receiving unit receives at least one of the measurement results of the volume, area, and height of the object to be measured.

12. The measurement result acquisition device according to claim 11, wherein the receiving unit receives the measurement result obtained by measuring the volume of the object to be measured using a three-dimensional sensor.

13. A jig comprising a simulated component that mimics the shape of solder printed on a circuit board, wherein multiple measuring devices are arranged on the simulated component so that each can perform measurements.

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