Cleaning sheet lamination device for probe card for semiconductor

Abstract

This cleaning sheet lamination device for a semiconductor probe card comprises: a first stage capable of vacuum-holding a second surface of a cleaning sheet for a flexible semiconductor probe card which is opposite an adhesive first surface thereof; a second stage capable of vacuum-holding a fourth surface of an adhesion target member which is opposite a third surface thereof; a drive mechanism for relatively moving the first and second stages; a suction mechanism capable of switching each of the first and second stages between a suction state and a suction-release state; and a control device for controlling the drive mechanism and the suction mechanism. The control device controls the drive mechanism and the suction mechanism so as to sequentially transition to a facing state in which the first surface and the third surface face each other while the first and second stages are in the suction state, an adhesion state in which the first surface is adhered to the third surface, and a withdrawal state in which the first stage is withdrawn from the cleaning sheet while the first stage is in the suction-release state.　

Description

Cleaning Sheet Laminating Apparatus for Semiconductor Probe Cards

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[0001] The present invention relates to a cleaning sheet laminating apparatus for semiconductor probe cards.

[0002] Conventionally, a cleaning sheet for semiconductor probe cards that is attached to an adherent member and used as a cleaning member has been known (see, for example, Patent Document 1).

[0003] Japanese Patent Application Laid-Open No. 2010-210349

[0004] Such a cleaning sheet is attached to the adherent member manually. However, since the cleaning sheet has flexibility, when the skill level of the operator is low, the cleaning sheet may not be properly attached to the adherent member, and there is a risk of variation in cleaning performance.

[0005] Therefore, an object of the present invention is to provide a cleaning sheet laminating apparatus for semiconductor probe cards that suppresses variations in cleaning performance.

[0006] The above object is achieved by a cleaning sheet laminating apparatus for semiconductor probe cards, comprising: a first stage capable of vacuum-sucking a second surface opposite to a first surface, which is an adhesive surface of a cleaning sheet for semiconductor probe cards having flexibility; a second stage capable of vacuum-sucking a fourth surface opposite to a third surface of the adherent member; a drive mechanism for relatively moving the first and second stages; a suction mechanism capable of switching each of the first and second stages between a suction state and a suction release state; and a control device for controlling the drive mechanism and the suction mechanism, wherein the control device controls the drive mechanism and the suction mechanism so as to sequentially shift to an opposed state in which the first and second stages are in the suction state and the first surface and the third surface face each other, an attachment state in which the first surface is attached to the third surface, and a retracted state in which the first stage retreats from the cleaning sheet in the suction release state.

[0007] According to the present invention, it is possible to provide a cleaning sheet laminating apparatus for semiconductor probe cards that suppresses variations in cleaning performance.

[0008] Figure 1A is a schematic diagram of the drive mechanism of the laminating device, and Figure 1B is a schematic diagram of the suction mechanism of the laminating device. Figures 2A to 2C are explanatory diagrams of the manufacturing procedure of cleaning components using the laminating device. Figures 3A to 3C are explanatory diagrams of the manufacturing procedure of cleaning components using the laminating device. Figures 4A and 4B are explanatory diagrams of the manufacturing procedure of cleaning components using the laminating device.

[0009] [Schematic Configuration of Cleaning Sheet Laminating Apparatus for Semiconductor Probe Cards] Figure 1A is a schematic diagram of the drive mechanism of a cleaning sheet laminating apparatus (hereinafter referred to as the laminating apparatus) 1 for semiconductor probe cards. Figure 1A shows the X, Y, and Z directions, which are orthogonal to each other. The X and Y directions are horizontal. The Z direction is vertical. The laminating apparatus 1 manufactures the cleaning material described later. The X and Z directions are parallel to the plane of Figure 1A. The Y direction is perpendicular to the plane of Figure 1A.

[0010] The laminating apparatus 1 includes a base 5, stages 10 and 30, support members 20 and 40, cameras 51 and 52, and a controller 90. Stages 10 and 30 each have vacuum-adsorbable suction surfaces 11 and 31. Specifically, stages 10 and 30 are provided with a plurality of suction holes opening into the suction surfaces 11 and 31, respectively. By driving the vacuum pump 60, which will be described later, it is possible to adsorb materials placed on the suction surfaces 11 and 31, respectively, through these suction holes. In their initial state, stages 10 and 30 are located far apart from each other in the X direction, as will be described in more detail later.

[0011] A pressure roller 14 is rotatably supported at the end of the stage 10 on the stage 30 side. The stage 10 is supported by a support member 20. The support member 20 is slidably supported on the base 5 in the X direction. The support member 20 also incorporates an actuator group 24 consisting of multiple actuators. The actuator group 24 allows the support member 20 to move in the X, Y, and Z directions relative to the base 5.

[0012] Stage 30 is supported by a support member 40. Stage 30 has a rotation axis 34 that extends parallel to the Y direction. The support member 40 has an actuator group 44 consisting of multiple actuators. The actuator group 44 allows stage 30 to rotate around the rotation axis 34. The actuator group 44 also allows stage 30 to move along the rotation axis 34 in the Y direction. Support members 20 and 40 are an example of a drive mechanism for moving stages 10 and 30 relative to each other. Stage 10 is an example of a first stage. Stage 30 is an example of a second stage.

[0013] Stages 10 and 30 are initially positioned apart from each other in the X direction and are both supported horizontally. Cameras 51 and 52 are initially positioned vertically above stages 10 and 30, respectively.

[0014] The controller 90 is a computer equipped with an arithmetic processing circuit that performs various calculations related to the control of the laminating device 1, and a memory that stores control programs and data. The controller 90 controls the actuator groups 24 and 44 and the cameras 51 and 52.

[0015] Figure 1B is a schematic diagram of the suction mechanism of the laminating apparatus 1. The laminating apparatus 1 includes a vacuum pump 60, a suction pipe 70, and solenoid valves 82 and 83. The suction pipe 70 has a junction 71 and branching sections 72 and 73. The junction 71 is connected to the vacuum pump 60. The branching sections 72 and 73 branch off from the junction 71 and are connected to the suction holes of stages 10 and 30, respectively. The solenoid valves 82 and 83 open and close the branching sections 72 and 73, respectively.

[0016] The vacuum pump 60 and solenoid valves 82 and 83 are controlled by the controller 90. For example, by opening both solenoid valves 82 and 83 while the vacuum pump 60 is running, both stages 10 and 30 enter an adsorption state where they have attracted an object. Also, by closing solenoid valve 82 and opening solenoid valve 83 while the vacuum pump 60 is running, stage 10 enters a release state and stage 30 enters an adsorption state. Similarly, by opening solenoid valve 82 and closing solenoid valve 83 while the vacuum pump 60 is running, stage 10 enters an adsorption state and stage 30 enters a release state. The vacuum pump 60, suction pipe 70, and solenoid valves 82 and 83 are an example of a suction mechanism that can switch stages 10 and 30, respectively, between an adsorption state and a release state.

[0017] [Manufacturing Procedure for Cleaning Materials] The manufacturing procedure for cleaning materials using the laminating apparatus 1 will be explained below. Figures 2A to 4B are explanatory diagrams of the manufacturing procedure for cleaning materials using the laminating apparatus 1. As shown in Figure 2A, the operator places the cleaning sheet 100 for semiconductor probe cards on the stage 10 so that the surface 101 of the cleaning sheet 100 faces upward and the surface 102 of the cleaning sheet 100 is in contact with the suction surface 11 of the stage 10. Similarly, the operator places the material to be attached 200 on the stage 30 so that the surface 201 of the material to be attached 200 faces upward and the surface 202 of the material to be attached 200 is in contact with the suction surface 31 of the stage 30. In this state, the controller 90 drives the vacuum pump 60 and opens the solenoid valves 82 and 83. As a result, the cleaning sheet 100 is vacuum-adhered to the suction surface 11 of the stage 10, and the material to be attached 200 is vacuum-adhered to the suction surface 31 of the stage 30. Figure 2A shows the initial state. Faces 102, 201, and 202 correspond to the second, third, and fourth faces, respectively.

[0018] In this embodiment, the member to be attached 200 is a silicon wafer. The silicon wafer is a transport member that is transported within the semiconductor manufacturing equipment. As will be described in more detail later, as shown in Figure 4B, the cleaning member 300 is manufactured by attaching the cleaning sheet 100a to the member to be attached 200. The cleaning member 300 is transported within the semiconductor manufacturing equipment, and the cleaning sheet 100a removes foreign matter adhering to the needles of probe cards, which are inspection devices within the semiconductor manufacturing equipment. Therefore, both the cleaning sheet 100 and the member to be attached 200 are thin and circular in shape, with the member to be attached 200 being slightly larger than the cleaning sheet 100. Furthermore, the cleaning sheet 100 is flexible, while the member to be attached 200, being a silicon wafer, has higher rigidity than the cleaning sheet 100.

[0019] Next, as shown in Figure 2B, the worker peels off the release film 130 from the cleaning sheet 100. Here, the cleaning sheet 100 has a cleaning layer 110, an adhesive layer 120 laminated on the cleaning layer 110, and a release film 130 laminated on the adhesive layer 120. The cleaning layer 110 is, for example, a silicone gel containing abrasive particles. The adhesive layer 120 is, for example, an acrylic adhesive. Since the cleaning sheet 100 is vacuum-adsorbed to the stage 10, the worker can easily peel off the release film 130 without causing wrinkles in the cleaning sheet 100. The cleaning sheet 100 with the release film 130 removed is referred to as the cleaning sheet 100a. The outer surface of the adhesive layer 120 of the cleaning sheet 100a is referred to as surface 101a. Therefore, surface 101a corresponds to the first surface, which is the adhesive surface.

[0020] Next, the controller 90 analyzes the images captured by cameras 51 and 52 to calculate the X and Y coordinate positions of the reference positions of the cleaning sheet 100a and the member to be attached 200. Here, the reference position is, for example, the center position of the cleaning sheet 100a and the member to be attached 200. This is because, as mentioned above, the cleaning sheet 100 and the member to be attached 200 are circular in shape. The controller 90 stores the calculated X and Y coordinate positions in memory.

[0021] Next, as shown in Figure 2C, with the member to be attached 200 vacuum-adhered to the suction surface 31 of the stage 30, the controller 90 drives the actuator group 44 described above to rotate the stage 30 by 180°. As a result, the member to be attached 200 inverts and faces vertically downward. This allows dust adhering to the surface 201 of the member to be attached 200, for example, in the state shown in Figure 2A, to fall off the surface 201. Furthermore, the X-coordinate of the reference position of the member to be attached 200 described above is the coordinate value when the member to be attached 200 is facing vertically upward. Therefore, after the stage 30 is inverted, the controller 90 recalculates the X-coordinate position symmetric to the axis of the rotation axis 34. The recalculated X-coordinate position becomes the X-coordinate position of the member to be attached 200 after the stage 30 is inverted. The controller 90 updates the memory with the recalculated X-coordinate position of the member to be attached 200.

[0022] Next, as shown in Figure 3A, the controller 90 drives actuator groups 24 and 44 so that the reference position of the member to be attached 200 and the reference position of the cleaning sheet 100a coincide. Specifically, the controller 90 drives actuator group 24 to slide the support member 20 in the X direction, so that the X coordinate position of the reference position of the cleaning sheet 100a coincides with the X coordinate position of the reference position of the member to be attached 200. The controller 90 also drives actuator groups 44 and 24 to coincide the Y coordinate positions of the above reference positions. As a result, the cleaning sheet 100a and the member to be attached 200 face each other with their reference positions aligned. Figure 3A shows the facing state.

[0023] Next, as shown in Figure 3B, the controller 90 moves the stage 10 in the Z direction and attaches the surface 101a of the cleaning sheet 100a to the surface 201 of the member to be attached 200. By aligning the reference positions of the cleaning sheet 100a and the member to be attached 200 in this way, the attachment position of the cleaning sheet 100a to the member to be attached 200 can be controlled with high precision. Figure 3B shows the attached state.

[0024] Next, the controller 90 closes the solenoid valve 82 to switch the stage 10 to a release state, and moves the stage 10 away from the cleaning sheet 100a attached to the member 200 in the -Z direction, as shown in Figure 3C. In this way, the cleaning sheet 100a is vacuum-adsorbed to the stage 10 until it is attached to the member 200. Therefore, it is maintained in a state conforming to the suction surface 11 of the stage 10, and wrinkles are prevented from forming on the cleaning sheet 100a when it is attached to the member 200.

[0025] Next, as shown in Figure 4A, the controller 90 retracts the stage 10 in the -X direction. At this time, the pressing roller 14 rotates while pressing the cleaning sheet 100a toward the member to be attached 200. This makes the cleaning sheet 100a adhere tightly to the member to be attached 200. Figure 4A shows the transition from the attached state to the retracted state.

[0026] After the stage 10 separates from the stage 30, the controller 90 reverses the stage 30 again, as shown in Figure 4B. Subsequently, the controller 90 closes the solenoid valve 83 or stops the vacuum pump 60 to release the suction from the stage 30. This allows the operator to remove the cleaning member 300, with the cleaning sheet 100a attached to the member 200, from the stage 30. Figure 4B shows the retracted state. As described above, the cleaning sheet 100a can be properly attached to the member 200, thus avoiding variations in the cleaning performance of the manufactured cleaning member 300.

[0027] In the above embodiment, the amount of movement of the stage 30 in the X direction is less than the amount of movement of the stage 10 in the X direction. This is because, since the stage 30 is rotatable by the rotation axis 34, employing a mechanism that allows the stage 30 to move significantly in the X direction would likely complicate the structure.

[0028] In the above embodiment, both support members 20 and 40 are movable in the X and Y directions, but only one of the support members 20 or 40 may be movable in the X and Y directions. Also, while support member 20 is movable in the Z direction, support member 40 may also be movable in the Z direction.

[0029] In the above embodiment, the stage 30 that has adsorbed the member to be attached 200 is inverted, but the stage 10 that has adsorbed the cleaning sheet 100a may also be inverted. In this case, the stage 10 is moved in the Z direction so that it is higher than the stage 30, and at least one of the stages 10 and 30 is moved in the X direction.

[0030] In the above embodiment, columnar support members 20 and 40 were shown as an example of a drive mechanism for moving stages 10 and 30 relative to each other. However, the drive mechanism is not limited to these, as long as it is possible to move stages 10 and 30 relative to each other.

[0031] The cleaning member 300 may be manufactured as follows from the opposing state shown in Figure 3A. From the opposing state shown in Figure 3A, the stage 10 is tilted diagonally so that the pressing roller 14 side is positioned on the upper side, and the end of the surface 101a of the cleaning sheet 100 on the pressing roller 14 side is attached to the end of the surface 201 of the member to be attached 200. Next, the vacuum suction of the stage 10 is released in that state, and the stage 10 is moved in the -X direction while remaining tilted diagonally. At this time, as the stage 10 moves in the -X direction while the pressing roller 14 presses the cleaning sheet 100 toward the member to be attached 200, the cleaning sheet 100 is pulled away from the stage 10 and attached to the member to be attached 200. In this case, the support member 20 needs to be able to maintain the stage 10 at a predetermined tilt angle.

[0032] In the above embodiment, the cleaning sheet 100 has a cleaning layer 110, an adhesive layer 120, and a release film 130, but the cleaning sheet is not limited to such an embodiment. For example, a base layer made of heat-resistant resin may be provided between the cleaning layer 110 and the adhesive layer 120.

[0033] In the above embodiment, the member to be attached 200 is a silicon wafer, but it is not limited to this. For example, it may be a jig. The jig is a plate-shaped member made of stainless steel or aluminum. A member to which the cleaning sheet 100 is attached can also remove foreign matter adhering to the needle of a probe card. The member to be attached 200 is preferably a plate-shaped member that can be vacuum-adsorbed. The shape of the cleaning sheet 100 and the member to be attached 200 is not limited to a circular shape, but may be, for example, triangular, rectangular, other polygonal, or elliptical. Also, the reference position is not limited to the center position. The reference position may be, for example, the edge, corner, or center of a side of the shape.

[0034] Although embodiments of the present invention have been described in detail above, the present invention is not limited to these specific embodiments, and various modifications and changes are possible within the scope of the gist of the present invention as described in the claims.

Claims

1. A cleaning sheet laminating apparatus for semiconductor probe cards, comprising: a first stage capable of vacuum adsorption of a second surface opposite to the first surface, which is the adhesive surface of a flexible cleaning sheet for semiconductor probe cards; a second stage capable of vacuum adsorption of a fourth surface opposite to the third surface of the member to be attached; a drive mechanism for moving the first and second stages relative to each other; a suction mechanism capable of switching the first and second stages between an adsorption state and a release state; and a control device for controlling the drive mechanism and the suction mechanism, wherein the control device controls the drive mechanism and the suction mechanism so that the first and second stages sequentially transition to an opposing state where the first surface and the third surface face each other in the adsorption state, an attached state where the first surface is attached to the third surface, and a retracted state where the first stage is retracted from the cleaning sheet in the release state.

2. The control device controls the drive mechanism so that when transitioning from the attached state to the retracted state, one of the first and second stages slides parallel to the other of the first and second stages, the first stage has a rotatably supported pressing roller, and when transitioning from the attached state to the retracted state, the pressing roller rotates on the second surface and presses the cleaning sheet toward the member to be attached, the cleaning sheet laminating apparatus for semiconductor probe cards according to claim 1.

3. The control device controls the drive mechanism to sequentially transition from an initial state in which the first and second surfaces face upward, to an inverted state in which the other surface is inverted upside down, and to the opposing state in which one surface is slid. This is the cleaning sheet laminating apparatus for semiconductor probe cards according to claim 2.

4. The cleaning sheet laminating apparatus for semiconductor probe cards according to claim 3, wherein one of the elements is the first stage and the other is the second stage.

5. A cleaning sheet laminating apparatus for semiconductor probe cards according to claim 4, comprising: a first imaging device for imaging the cleaning sheet vacuum-adsorbed on the first stage; and a second imaging device for imaging the member to be attached vacuum-adsorbed on the second stage, wherein the control device detects a first reference position of the cleaning sheet and a second reference position of the member to be attached based on images captured by the first and second imaging devices in the initial state, and controls the drive mechanism so that the first reference position and the second reference position coincide in the opposing state.

6. The member to be laminated is a silicon wafer or a jig, a cleaning sheet laminating apparatus for semiconductor probe cards according to any one of claims 1 to 5.

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