Holding device
The holding device uses balanced gas suction and ejection forces within and outside the holding region to maintain semiconductor chip orientation, addressing the issue of contact and orientation fluctuations in transfer devices.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- TORAY ENG CO LTD
- Filing Date
- 2025-12-12
- Publication Date
- 2026-07-23
AI Technical Summary
Existing semiconductor chip transfer devices struggle to maintain the orientation of chips without contact, leading to potential contact with the holding surface and fluctuations in orientation due to gas pressure fluctuations.
A holding device with a chuck that uses suction and ejection portions within and outside the holding region to balance forces, maintaining the semiconductor chip's orientation by adjusting gas suction and ejection to prevent contact with the holding surface.
The device effectively maintains the semiconductor chip's orientation and prevents contact with the holding surface, ensuring stable transfer and positioning.
Smart Images
Figure JP2025043596_23072026_PF_FP_ABST
Abstract
Description
Holding device
[0001] The present invention relates to a holding device for holding a semiconductor chip.
[0002] A transfer device for transferring a semiconductor chip is known. The transfer device holds, for example, a semiconductor chip attached to an adhesive sheet by a pickup collet and transfers it to a predetermined position. The transfer device transfers the semiconductor chip while holding it from the bonding surface (active surface) side in order for the mounting device on the downstream side to grip the mold surface of the semiconductor chip. The semiconductor chip transferred by the transfer device is gripped by the pickup head of the mounting device at the mold surface, and the bonding surface is bonded to a substrate.
[0003] In such a semiconductor chip transferred by a transfer device, with the miniaturization of circuits, a semiconductor chip and a bonding method in which connection terminals on a bonding surface are directly bonded to connection terminals on a substrate without using bumps or the like are known. The semiconductor chip to be directly bonded is subjected to a surface treatment such as a surface activation treatment on the bonding surface. In order to maintain the active state of the bonding surface and suppress the generation of particles, a semiconductor chip subjected to such a treatment needs to suppress contact with the bonding surface of a pickup collet or the like during transfer.
[0004] Therefore, a pickup device that holds the bonding surface side of a semiconductor chip without contacting a pickup collet or the like with the activated bonding surface is known. The pickup device described in Patent Document 1 transfers the semiconductor chip by a pickup collet having an air supply hole for blowing a positive-pressure gas against the semiconductor chip and a suction hole for sucking the semiconductor chip by a negative pressure.
[0005] The pickup collet blows positive-pressure gas from the air intake hole toward the semiconductor chip. The pressure of the blown gas pushes the semiconductor chip away from the pickup collet and forms a layer of gas between the pickup collet and the semiconductor chip. Furthermore, the pickup collet draws gas in from the air intake hole. The suction force of the gas attracts the semiconductor chip toward the pickup collet. Thus, the semiconductor chip is held in a position where the upward force of the blown gas and the attractive force of the drawn gas are balanced.
[0006] Japanese Patent Publication No. 2022-157318
[0007] In the pickup device described in Patent Document 1, the semiconductor chip is held in a non-contact state with respect to the pickup collet, making it easy for the semiconductor chip to move relative to the pickup collet. Furthermore, in the pickup device, movement of the holding position of the semiconductor chip causes fluctuations in the positive or negative pressure of the gas and fluctuations in the gas flow rate, which in turn causes fluctuations in the orientation of the semiconductor chip relative to the pickup collet. Moreover, if the semiconductor chip tilts relative to the pickup collet due to fluctuations in its orientation, there is a possibility that the semiconductor chip will come into contact with the pickup collet.
[0008] The object of the present invention is to provide a holding device that can maintain the orientation of a semiconductor chip held without contact with a holding surface and suppress contact with the holding surface.
[0009] The inventors investigated a holding device that can maintain the orientation of a semiconductor chip held non-contact with a holding surface and suppress contact with the holding surface. After diligent investigation, the inventors arrived at the following configuration.
[0010] An embodiment of the present invention provides a holding device that holds a semiconductor chip non-contact with a holding surface, wherein the holding surface has a holding region that overlaps with the semiconductor chip when viewed in a direction perpendicular to the holding surface, and the semiconductor chip is held in the holding region. The chuck has a suction portion provided within the holding region for drawing in gas, and an in-holding-region ejection portion provided within the holding region for ejecting gas. An out-of-holding-region ejection portion for ejecting gas is further provided outside the holding region.
[0011] The chuck simultaneously generates a force that attracts the semiconductor chip to the holding surface by the suction of gas by the suction part, and a force that pushes the semiconductor chip away from the holding surface by the ejection of gas by the ejection part within the holding area. The chuck can hold the semiconductor chip without contact by adjusting the amount of gas ejected and the amount of suction so that the attracting force and the pushing force applied to the semiconductor chip at a predetermined distance from the holding surface are balanced. The suction part and the ejection part within the holding area overlap the semiconductor chip when viewed in a direction perpendicular to the holding surface.
[0012] When the chuck of the holding device is moved, a portion of the semiconductor chip that is held non-contact within the holding area moves outside the holding area due to acceleration. As the semiconductor chip located within the holding area moves in one direction, the area that overlapped with the other end of the semiconductor chip at the suction part decreases (increase in effective suction area) when viewed in a direction perpendicular to the holding surface, and the force that attracts the other end of the semiconductor chip to the holding surface (hereinafter simply referred to as "attraction force") decreases. The other end of the semiconductor chip is separated from the holding surface by the force that pushes the semiconductor chip away from the holding surface by the ejection part within the holding area (hereinafter simply referred to as "upward force"). As a result, the inclination angle of the semiconductor chip with respect to the holding surface increases. Therefore, the one end of the semiconductor chip moves closer to the holding surface.
[0013] On the other hand, as the semiconductor chip located within the holding area moves in one direction, if the area overlapping with the one-directional end of the semiconductor chip at the ejection portion outside the holding area increases when viewed in a direction perpendicular to the holding surface, the upward force exerted by the ejection portion outside the holding area increases. The one-directional end of the semiconductor chip is pushed up by this upward force. As a result, the inclination angle of the semiconductor chip with respect to the holding surface decreases. Therefore, the one-directional end of the semiconductor chip moves away from the holding surface.
[0014] Furthermore, due to the movement of the semiconductor chip in one direction, the other side of the gas-suctioning region of the suction unit does not overlap with the semiconductor chip. The gas flow in the region not overlapping with the semiconductor chip slows down as the size of the region not overlapping with the semiconductor chip increases. On the other hand, the one-way side of the gas-suctioning region of the suction unit overlaps with the semiconductor chip. The gas flow in the region overlapping with the semiconductor chip is faster than the gas flow in the region not overlapping with the semiconductor chip. In other words, in the gas-suctioning region, when viewed in a direction perpendicular to the holding surface, a region with a fast gas flow in one direction and a region with a slow gas flow in the other direction are created depending on the amount of movement of the semiconductor chip in one direction. Fast-flowing gas has more energy than slow-flowing gas. Therefore, the semiconductor chip is subjected to a force that pulls it in the other direction by the gas flowing in the one-way region of the gas-flowing region of the suction unit. The semiconductor chip, which was moving in one direction, is moved in the other direction. As a result, the amount of movement of the semiconductor chip relative to the holding region decreases. Therefore, the orientation of the semiconductor chip relative to the holding area is maintained.
[0015] Furthermore, the area of the suction portion that does not overlap with the semiconductor chip overlaps with the semiconductor chip that has been moved in the other direction. Also, the attraction force of the suction portion increases as the effective suction area of the suction portion decreases. The other end of the semiconductor chip that was separated from the holding surface moves closer to the holding surface due to the attraction force. As a result, the inclination angle of the semiconductor chip with respect to the holding surface decreases. Therefore, the one end of the semiconductor chip moves away from the holding surface.
[0016] In this way, the orientation of the semiconductor chip, which is held without contact with the holding surface, can be maintained, and contact with the holding surface can be suppressed.
[0017] From another perspective, the holding device of the present invention may include the following configuration: The suction portion is formed at a position where, when viewed in a direction perpendicular to the holding surface, the outer edge of the suction portion and the outer edge of the holding area are in contact.
[0018] In the above configuration, the outer edge of the gas-suctioning region in the suction section is in contact with the outer edge of the holding region. When the other end of the semiconductor chip moves in one direction, which is in the direction inward of the holding region, a region that does not overlap with the semiconductor chip is created in the suction section, as viewed in a direction perpendicular to the holding surface, depending on the amount of movement. In the gas-suctioning region, a region with a fast gas flow and a region with a slow gas flow are created depending on the amount of movement of the semiconductor chip in one direction. The fast-flowing gas acts on the semiconductor chip, pulling it in the other direction. In other words, as the semiconductor chip moves in one direction from the outer edge of the holding region, the attractive force is generated that pulls the semiconductor chip in the other direction. The semiconductor chip is pulled back into the holding region by the attractive force. This maintains the posture of the semiconductor chip, which is held without contact with the holding surface, and suppresses contact with the holding surface.
[0019] From another perspective, the holding device of the present invention may include the following configuration: The ejection portion outside the holding area is formed at a position in contact with the outer edge of the holding area.
[0020] In the above configuration, the outer edge of the gas ejection area in the retaining area ejection section is in contact with the outer edge of the retaining area. When one end of the semiconductor chip moves in one direction from the outer edge of the retaining area to the outside of the retaining area, an area overlapping with the semiconductor chip is created in the retaining area ejection section, as viewed in a direction perpendicular to the retaining surface, depending on the amount of movement of the semiconductor chip. Therefore, at the one end of the semiconductor chip, a force is generated that pushes the semiconductor chip away from the retaining surface at the same time that the semiconductor chip moves in one direction from the outer edge of the retaining area. This suppresses contact between the semiconductor chip, which is held non-contact with the retaining surface, and the retaining surface, and maintains the orientation of the semiconductor chip.
[0021] From another perspective, the holding device of the present invention may include the following configuration: The ejection portion outside the holding area and the ejection portion inside the holding area are made of a porous material that allows gas to pass through, and constitute at least a part of the holding surface.
[0022] In the above configuration, the ejection part outside the holding area and the ejection part inside the holding area eject the gas from their entire regions. Therefore, the ejection part outside the holding area and the ejection part inside the holding area apply the upward force uniformly to the semiconductor chip across their entire regions. In addition, the ejection part outside the holding area and the ejection part inside the holding area apply a pulling force to any region that matches the shape and rigidity of the semiconductor chip. This suppresses contact between the semiconductor chip, which is held non-contact with the holding surface, and the holding surface, and maintains the orientation of the semiconductor chip.
[0023] From another perspective, the holding device of the present invention may include the following configuration: The external ejection unit ejects gas while the semiconductor chip is held within the holding area.
[0024] In the above configuration, when the chuck holds the semiconductor chip, it holds the semiconductor chip within the holding area by sucking gas in through the suction part within the holding area and ejecting gas through the ejection part within the holding area. Furthermore, when the chuck holds the semiconductor chip within the holding area, it ejects gas from the ejection part outside the holding area. In other words, when the chuck holds the semiconductor chip, it also ejects gas from the ejection part outside the holding area, which is located outside the holding area where the semiconductor chip is not located. Therefore, when the semiconductor chip held in the holding area moves outside the holding area, the chuck applies an upward force to the semiconductor chip by blowing gas onto the semiconductor chip. The semiconductor chip is difficult to approach the holding surface outside the holding area. As a result, the semiconductor chip can be transported to a predetermined position while being held from the bonding surface side, while suppressing changes in the state of the bonding surface.
[0025] An embodiment of the present invention provides a holding device that holds a semiconductor chip non-contact with a holding surface, wherein the holding surface has a holding region that, when viewed in a direction perpendicular to the holding surface, has the same shape and size as the semiconductor chip, and the holding device holds the semiconductor chip in the holding region. The chuck has a suction portion provided within the holding region for sucking in gas, and a holding region ejection portion provided within the holding region for ejecting gas. The suction portion is formed at a position where, when viewed in a direction perpendicular to the holding surface, the outer edge of the suction portion and the outer edge of the holding region are in contact.
[0026] In the above configuration, the outer edge of the gas-suctioning region in the suction section is in contact with the outer edge of the holding region. When the semiconductor chip moves in one direction from the outer edge of the holding region to the inside of the holding region, a region that does not overlap with the semiconductor chip is created in the gas-suctioning region, when viewed in a direction perpendicular to the holding surface, depending on the amount of movement of the semiconductor chip. Therefore, in the gas-suctioning region, when viewed in a direction perpendicular to the holding surface, a region on one side where the gas flow is fast and a region on the other side where the gas flow is slow are created, depending on the amount of movement of the semiconductor chip in one direction. The semiconductor chip is subjected to a force that pulls it in the other direction by the fast-flowing gas. Therefore, as the semiconductor chip moves in one direction from the outer edge of the holding region, the attractive force that pulls the semiconductor chip in the other direction is generated. As a result, the semiconductor chip is pulled back into the holding region.
[0027] Furthermore, the area of the suction portion that does not overlap with the semiconductor chip overlaps with the semiconductor chip as the semiconductor chip moves in another direction. Also, the pulling force of the suction portion increases as the effective suction area of the suction portion decreases. The other end of the semiconductor chip, which was separated from the holding surface, moves closer to the holding surface due to the pulling force. As a result, the inclination angle of the semiconductor chip with respect to the holding surface decreases. Therefore, one end of the semiconductor chip moves away from the holding surface. This suppresses contact between the semiconductor chip, which is held non-contact with the holding surface, and the holding surface, and maintains the orientation of the semiconductor chip.
[0028] The technical terms used herein are used solely to define specific embodiments and are not intended to limit the invention.
[0029] In this specification, the use of “including,” “comprising,” or “having,” and variations thereof, identifies the presence of described features, processes, operations, elements, components, and / or equivalents thereof, but may include one or more of the steps, operations, elements, components, and / or groups thereof.
[0030] In this specification, “attached,” “connected,” “joined,” and / or their equivalents are used in a broad sense and include both “direct and indirect” attachments, connections, and combinations. Furthermore, “connected” and “joined” are not limited to physical or mechanical connections or combinations, but may include direct or indirect electrical connections or combinations.
[0031] Furthermore, in the following explanation, the terms “fixing,” “connecting,” “joining,” and “attaching” (hereinafter referred to as “fixing, etc.”) include not only cases where components are directly fixed to each other, but also cases where they are fixed to each other via other components. In other words, in the following explanation, the terms “fixing, etc.” include both direct and indirect fixing of components to each other.
[0032] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meanings as those generally understood by those skilled in the art to which this invention pertains.
[0033] [Semiconductor Chip] In this specification, a semiconductor chip means an integrated circuit made of a semiconductor such as silicon, molded with an insulator. The semiconductor chip is, for example, a flip-chip bonding chip mounted with the bonding surface (active surface) facing the substrate. The bonding surface of the semiconductor chip is polished. Furthermore, the semiconductor chip is subjected to high-cleanliness cleaning, plasma treatment, surface activation treatment, etc., on the bonding surface in order to activate bonding at least one of the insulator (e.g., SiO2) or connection terminal of the bonding surface to the corresponding insulator (e.g., SiO2) or connection terminal of the substrate. This enables activation bonding by functional groups on the bonding surface.
[0034] According to one embodiment of the present invention, contact between the semiconductor chip, which is held non-contact with the holding surface, and the holding surface can be suppressed, and the orientation of the semiconductor chip can be maintained.
[0035] Figure 1 is a schematic side view showing the overall configuration of the holding device in Embodiment 1 of the present invention. Figure 2 is a plan view of the chuck in the holding device in Embodiment 1 of the present invention. Figure 3 is a plan view showing the overlap between the semiconductor chip and the ejection and suction parts when a part of the semiconductor chip moves outside the holding area of the chuck in the holding device in Embodiment 1 of the present invention. Figure 4 is a schematic diagram showing the gas flow when a part of the semiconductor chip moves outside the holding area of the chuck in the holding device in Embodiment 1 of the present invention. Figure 5 is a schematic diagram showing the gas flow when a semiconductor chip in an inclined position returns to its original position in the holding device in Embodiment 1 of the present invention. Figure 6 is a schematic diagram showing the gas flow when a semiconductor chip located outside the holding area returns to the holding area in the holding device in Embodiment 1 of the present invention. Figure 7 is a plan view of the chuck in the holding device in Modification 1 of Embodiment 1 of the present invention. Figure 8 is a plan view of the chuck in the holding device in Modification 2 of Embodiment 1 of the present invention. Figure 9 is a plan view of the chuck in the holding device in Modification 3 of Embodiment 1 of the present invention. Figure 10 is a plan view of the chuck in the holding device according to Embodiment 2 of the present invention.
[0036] The holding device according to the present invention will be described below with reference to the drawings. In each figure, the same parts are denoted by the same reference numerals, and the description of the same parts will not be repeated. The dimensions of the components in each figure do not faithfully represent the dimensions of the actual components or the dimensional ratios of each component. In the following description of embodiments of the present invention, the X direction and the Y direction are assumed to be directions on the horizontal plane. The Y direction is perpendicular to the X direction. The Z direction is perpendicular to both the X and Y directions. In this embodiment, the Z direction is defined as the vertical direction. However, this definition of direction is not intended to limit the orientation of the positioning device when used in each embodiment.
[0037] <Embodiment 1> <Configuration of the Holding Device> The holding device 1, which is Embodiment 1 of the holding device according to the present invention, will be described with reference to Figures 1 and 2. Figure 1 is a schematic side view showing the overall configuration of the holding device 1 in the embodiment of the present invention. Figure 2 is a plan view of the chuck 10 in the holding device 1.
[0038] As shown in Figure 1, the holding device 1 transports the semiconductor chip β. The holding device 1 is located upstream of a mounting device (not shown). The holding device 1 includes a chuck 10, a compressed air source 21, and a suction pump 22. The holding device 1 is supported, for example, by a moving device 100.
[0039] As shown in Figures 1 and 2, the chuck 10 holds the semiconductor chip β. The chuck 10 is supported by the moving device 100 via a holding member 10a. The chuck 10 is constructed as a rectangular parallelepiped block. In this embodiment, the chuck 10 is made of an aluminum alloy, ceramics, or the like. The chuck 10 has a holding surface 11 which is a flat surface that holds the semiconductor chip β in a non-contact manner. The chuck 10 also has a holding area 12, an ejection part 13 inside the holding area, an ejection part 14 outside the holding area, and a suction part 15.
[0040] The holding region 12 is the region on the holding surface 11 that holds the semiconductor chip β. The holding region 12 is the region that overlaps with the semiconductor chip β when viewed in a direction perpendicular to the holding surface 11. In this embodiment, the holding region 12 is the same shape and size as the semiconductor chip β when viewed in a direction perpendicular to the holding surface 11. The outer edge of the holding region 12 overlaps with the outer edge of the semiconductor chip β when viewed in a direction perpendicular to the holding surface 11. In this embodiment, the holding region 12 is configured in a rectangular shape when viewed in a direction perpendicular to the holding surface 11. The holding region 12 indicates the holding position of the semiconductor chip β that is held non-contact on the holding surface 11.
[0041] The retaining area ejection section 13 is a part that ejects air, which is a gas. The retaining area ejection section 13 generates an upward force F2 that pushes the semiconductor chip β up from the retaining surface 11 by ejecting air. The retaining area ejection section 13 is provided within the retaining area 12. In this embodiment, the retaining area ejection section 13 is configured as a plurality of through holes that penetrate the chuck 10. The retaining area ejection section 13 is formed on the retaining surface 11 at regular equal intervals. The area from which air is ejected from the retaining area ejection section 13 is a plurality of circular areas when viewed in a direction perpendicular to the retaining surface 11. A compressed air source 21 is connected to the retaining area ejection section 13 via piping. The compressed air source 21 ejects air from the retaining area ejection section 13 onto the semiconductor chip β.
[0042] The retaining area ejection section 14 ejects air. By ejecting air, the retaining area ejection section 14 generates an upward force F2 that pushes the semiconductor chip β away from the retaining surface 11. The retaining area ejection section 14 is located outside the retaining area 12 on the retaining surface 11. In this embodiment, the retaining area ejection section 14 is configured as a plurality of through holes that penetrate the chuck 10. The retaining area ejection section 14 is formed at regular equal intervals around the retaining area 12 on the retaining surface 11. The air ejection area of the retaining area ejection section 14 is a plurality of circular areas when viewed in a direction perpendicular to the retaining surface 11. A compressed air source 21 is connected to the retaining area ejection section 14 via piping. The compressed air source 21 ejects air from the retaining area ejection section 14 onto the semiconductor chip β.
[0043] The suction portion 15 sucks air. By sucking air, the suction portion 15 generates an attracting force F1 that attracts the semiconductor chip β to the holding surface 11. The suction portion 15 is provided within the holding region 12 on the holding surface 11. In the present embodiment, the suction portion 15 is configured as four circular through-holes that penetrate the chuck 10. The suction portion 15 is formed near the four corner portions of the holding region 12 on the holding surface 11. The regions for sucking air in the suction portion 15 are four circular regions when viewed in the direction perpendicular to the holding surface 11. A suction pump 22 is connected to the other opening of the suction portion 15 via a pipe. The suction pump 22 sucks the air between the bonding surface of the semiconductor chip β and the holding surface 11 from the suction portion 15.
[0044] The holding device 1 is supported by the moving device 100 so as to be movable in the X direction, Y direction, and Z direction. The moving device 100 moves the holding device 1 by an X-direction driving device, a Y-direction driving device, and a Z-direction moving device (not shown). The holding device 1 is moved by the moving device 10 on to a holding position for holding the semiconductor chip β on the chuck 10 and a supply position for supplying the semiconductor chip β to a mounting device (not shown).
[0045] <Regarding prevention of contact between the semiconductor chip and the chuck and posture holding> Using FIGS. 3 to 6, the movement of the semiconductor chip β in a state where one-direction end portion of the semiconductor chip β held within the holding region 12 has moved outside the holding region 12 due to the movement of the chuck 10 or the like will be described. FIG. 3 is a plan view showing the overlapping state of the semiconductor chip β, the outer ejection portion 14 outside the holding region, and the suction portion 15 when a part of the semiconductor chip β has moved outside the holding region 12 of the chuck 10 in the holding device 1. FIG. 4 is a schematic diagram showing the gas flow when a part of the semiconductor chip β has moved outside the holding region 12 of the chuck 10 in the holding device 1. FIG. 5 is a schematic diagram showing the gas flow when the semiconductor chip β in an inclined posture returns to its original posture in the holding device 1. FIG. 6 is a schematic diagram showing the gas flow when the semiconductor chip β located outside the holding region 12 returns into the holding region 12 in the holding device 1.
[0046] As shown in Figures 3 and 4, when viewed perpendicular to the holding surface 11, if the area (region) of the air-suction portion of the suction portion 15 that overlapped with the other end of the semiconductor chip β decreases as the semiconductor chip β moves in the unidirectional +Y direction, the pulling force F1 applied by the suction portion 15 to the other end of the semiconductor chip β, the -Y direction end, decreases. As a result, the upward force F2 applied to the -Y direction end of the semiconductor chip β by the ejection portion 13 within the holding region increases relative to the pulling force F1 applied to the -Y direction end of the semiconductor chip β. The -Y direction end of the semiconductor chip β is pulled away from the holding surface 11 by the upward force F2 until the pulling force F1 and the upward force F2 are in equilibrium. As a result, the posture of the semiconductor chip β becomes an inclined posture in which the +Y direction end, which is one direction end of the semiconductor chip β, approaches the holding surface 11, and the -Y direction end moves away from the holding surface 11.
[0047] As shown in Figures 3 and 5, when the semiconductor chip β moves in the +Y direction, the area (region) of the portion of the air ejection part of the outside-holding-area ejection part 14 located outside the holding area 12 that overlaps with the +Y direction end of the semiconductor chip β increases, and the upward force F2 applied to the +Y direction end of the semiconductor chip β by the outside-holding-area ejection part 14 increases. As a result, the attraction force F1 applied to the +Y direction end of the semiconductor chip β by the suction part 15 decreases relative to the upward force F2 applied to the +Y direction end of the semiconductor chip β. The +Y direction end of the semiconductor chip β is pulled away from the holding surface 11 by the upward force F2 until the attraction force F1 and the upward force F2 are in equilibrium. As a result, the orientation of the semiconductor chip β is adjusted so that the +Y direction end is away from the holding surface 11 and parallel to the holding surface 11.
[0048] As shown in FIGS. 3 and 6, when the semiconductor chip β moves in the +Y direction, in the region that sucks the air of the suction portion 15 which overlapped with the -Y direction end portion of the semiconductor chip β, when viewed in the direction perpendicular to the holding surface 11, a +Y direction side region A1 that overlaps with the semiconductor chip β and a -Y direction side region A2 that does not overlap with the semiconductor chip β are formed (see FIG. 3). The flow of the gas flowing into the +Y direction side region A1 that overlaps with the semiconductor chip β in the suction portion 15 is faster than the flow of the gas flowing into the -Y direction side region A2 that does not overlap with the semiconductor chip β in the suction portion 15. Therefore, based on Bernoulli's theorem, a suction force F3 that attracts the semiconductor chip β in the -Y direction is applied to the semiconductor chip β due to the difference between the pressure generated by the gas flowing into the region A1 in the suction portion 15 and the pressure generated by the air flowing into the region A2 in the suction portion 15.
[0049] The semiconductor chip β that has partially moved outside the +Y direction of the holding region 12 is moved in the -Y direction by the suction force F3. The semiconductor chip β is moved in the -Y direction until it overlaps with the -Y direction side portion in the suction portion 15 that does not overlap with the semiconductor chip β when viewed in the direction perpendicular to the holding surface 11. Thereby, the semiconductor chip β is held in a posture located within the holding region 12 in a state parallel to the holding surface 11.
[0050] The holding device 1 configured as described above corrects the inclined posture of the semiconductor chip β by the holding region outer ejection portion 14 located outside the holding region 12 even if a part of the semiconductor chip β held non - contact within the holding region 12 approaches the holding surface 11 outside the holding region 12 in an inclined posture due to an external force applied during the movement of the chuck 10, the flow of the air current, disturbance, etc. Further, the holding device 1 utilizes the change in the air flow of the suction portion 15 accompanying the movement of the semiconductor chip β to pull back the semiconductor chip β into the holding region 12. Thereby, it is possible to suppress the contact between the semiconductor chip β held non - contact with the holding surface 11 and the holding surface 11 and maintain the posture of the semiconductor chip β within the holding region 12.
[0051] <Modification 1 of Embodiment> Using Figure 7, a modification 1 of the holding device 1, namely the holding device 1A, will be described. Figure 7 is a plan view of the chuck in the holding device 1A in modification 1 of Embodiment 1 of the present invention. The holding device 1A has a chuck 10A that includes a suction part 15A, the position of which is different from that of the chuck 10.
[0052] As shown in Figure 7, the chuck 10A has a holding surface 11 which is a flat surface that holds the semiconductor chip β in a non-contact manner. The chuck 10A also has a holding area 12, an ejection part 13 inside the holding area, an ejection part 14 outside the holding area, and a suction part 15A.
[0053] The suction portion 15A is provided within the holding area 12 on the holding surface 11. In this embodiment, the suction portion 15A is configured as four circular through-holes that penetrate the chuck 10. The air-suction area of the suction portion 15A is four circular areas when viewed in a direction perpendicular to the holding surface 11. The suction portion 15A is formed near the four corners of the holding area 12 on the holding surface 11. Preferably, the outer edge of the suction portion 15A is in contact with the outer edges of the two sides that constitute the corners of the holding area 12 when viewed in a direction perpendicular to the holding surface 11. The outer edge of the suction portion 15A is the outer edge of the through-hole when viewed in a direction perpendicular to the holding surface 11.
[0054] In the above configuration, when the -Y direction end of the semiconductor chip β moves in the +Y direction, which is the other end of the semiconductor chip β, an area that does not overlap with the semiconductor chip β is created in the gas-suctioning area of the suction section 15A, when viewed in a direction perpendicular to the holding surface 11, depending on the amount of movement of the semiconductor chip β (see Figure 3). Based on Bernoulli's theorem, an attractive force F3 is applied to the semiconductor chip β, which is pulled in the -Y direction due to the difference in air velocity. In other words, the attractive force F3 is generated on the semiconductor chip β at the same time that the semiconductor chip β moves in the +Y direction from the outer edge of the holding region 12.
[0055] In other words, by positioning the suction portion 15A so that it coincides with the outer edge of the semiconductor chip β when viewed perpendicular to the holding surface 11, any movement of the semiconductor chip β in the +Y direction creates a region in the suction portion 15A that does not overlap with the semiconductor chip β. As a result, an attractive force F3 is generated on the semiconductor chip β in conjunction with the movement of the semiconductor chip β, with a magnitude corresponding to the amount of movement of the holding region 12 in the +Y direction (see Figure 6). This returns the semiconductor chip β, which has moved outside the holding region 12, to its original position.
[0056] As described above, the attracting force F3 instantly pulls the semiconductor chip β back in the -Y direction, thus further suppressing the movement of the semiconductor chip β. Furthermore, the change in posture due to the movement of the semiconductor chip β is reduced, making it less likely to come into contact with the chuck 10A. This suppresses contact between the semiconductor chip β, which is held non-contact with the holding surface 11, and the holding surface 11, while maintaining the posture of the semiconductor chip β.
[0057] The position of the suction portion 15A relative to the holding area 12 may vary slightly depending on the machining accuracy of the suction portion 15A, but in that case, it is preferable for the suction portion 15A to be located inside the holding area 12. This suppresses contact between the semiconductor chip β, which is held non-contact with the holding surface 11, and the holding surface 11, even if the suction portion 15A is separated from the outer edge of the holding area 12 within the range of machining accuracy, and also has the effect of maintaining the orientation of the semiconductor chip β.
[0058] <Modification 2 of the Embodiment> Using Figure 8, a modification 2 of the holding device 1, the holding device 1B, will be described. Figure 8 is a plan view of the chuck in the holding device 1B in modification 2 of Embodiment 1 of the present invention. The holding device 1B has a chuck 10B that includes an external ejection part 14B and a suction part 15A, in which the positions of the external ejection part 14 and suction part 15 are different from those of the chuck 10.
[0059] As shown in Figure 8, the chuck 10B has a holding surface 11 which is a flat surface that holds the semiconductor chip β in a non-contact manner. The chuck 10B also has a holding area 12, an ejection part 13 inside the holding area, an ejection part 14B outside the holding area, and a suction part 15A.
[0060] The suction portion 15A is formed to contact the four corners of the holding area 12 on the holding surface 11. Since the suction portion 15A is the same as the suction portion 15A included in the chuck 10A of the holding device 1A, its description is omitted.
[0061] The retaining area ejection section 14B is provided on the outside of the retaining area 12 on the retaining surface 11. In this embodiment, the retaining area ejection section 14B is configured as a plurality of through holes that penetrate the chuck 10. The area from which air is ejected from the retaining area ejection section 14B is a plurality of circular areas when viewed in a direction perpendicular to the retaining surface 11. The retaining area ejection section 14B is formed at regular equal intervals around the retaining area 12 on the retaining surface 11. The outer edges of the retaining area ejection section 14B are in contact with the outer edges of the retaining area 12 when viewed in a direction perpendicular to the retaining surface 11. The outer edges of the retaining area ejection section 14B are the outer edges of the through holes when viewed in a direction perpendicular to the retaining surface 11.
[0062] In the above configuration, when the +Y direction end, which is one end of the semiconductor chip β, moves in the +Y direction outside the holding region 12, a region A3 overlapping with the +Y direction end of the semiconductor chip β is created in the air ejection region 14B of the outside-holding region, when viewed in a direction perpendicular to the holding surface 11, depending on the amount of movement of the semiconductor chip β (see Figure 3). At the +Y direction end of the semiconductor chip β, an upward force F2 is generated simultaneously with the semiconductor chip β moving outside the outer edge of the holding region 12 (see Figure 5). An upward force F2 is also generated on the semiconductor chip β, with a magnitude corresponding to the amount of movement of the holding region 12 in one direction. Simultaneously with the movement of the semiconductor chip β, the chuck 10B generates a pulling force F3 by the suction portion 15A and an upward force F2 by the outside-holding region ejection portion 14B, depending on the amount of movement of the semiconductor chip β (see Figure 6).
[0063] In other words, by positioning the ejection portion 14B outside the holding area to coincide with the outer edge of the semiconductor chip β when viewed perpendicular to the holding surface 11, any movement of the semiconductor chip β in the +Y direction creates an overlapping area between the semiconductor chip β and the ejection portion 14B outside the holding area. As a result, an upward force F2 is generated on the semiconductor chip β in conjunction with the movement of the semiconductor chip β, with a magnitude corresponding to the amount of movement of the holding area 12 in the +Y direction (see Figure 6). The +Y direction end of the semiconductor chip β is pulled away from the holding surface 11 by the upward force F2 until the pulling force F1 and the upward force F2 are in equilibrium. This allows the chuck 10B to return the tilted semiconductor chip β to its original position and also return the semiconductor chip β that has moved outside the holding area 12 to its original position.
[0064] As described above, the upward force F2 corrects the tilted position of the semiconductor chip β so that it becomes parallel, thereby further suppressing the movement of the semiconductor chip β. Furthermore, even if movement of the semiconductor chip β occurs, it becomes easier to maintain its position and less likely to come into contact with the chuck 10A. This suppresses contact between the semiconductor chip β, which is held non-contact with the holding surface 11, and the holding surface 11, while also maintaining the position of the semiconductor chip β.
[0065] <Modification 3 of Embodiment> Using Figure 9, a modification 3 of the holding device 1, the holding device 1C, will be described. Figure 9 is a plan view of the chuck 10C in the holding device 1C in modification 3 of Embodiment 1 of the present invention. The holding device 1C has a chuck 10C that includes a holding area ejection part 13C and an outer holding area ejection part 14C, which have different configurations compared to the chuck 10, and a suction part 15A, which has a different position of the suction part 15.
[0066] As shown in Figure 9, the chuck 10C has a holding surface 11 which is a flat surface that holds the semiconductor chip β in a non-contact manner. The chuck 10C also has a holding area 12, an ejection part 13C inside the holding area, an ejection part 14C outside the holding area, and a suction part 15A.
[0067] In this embodiment, the chuck 10C is made of a porous material that is permeable to air, which is a gas. The porous material is made of, for example, alumina, silicon carbide, porous ceramics, etc. It has a holding surface 11 which is a flat surface that holds the semiconductor chip β in a non-contact manner. The sides of the chuck 10C other than the holding surface 11 are covered with an air-impermeable cover material 10Ca. Therefore, the chuck 10C is configured to be able to suck in and discharge air from the holding surface 11.
[0068] The retaining area ejection section 13C is provided within the retaining area 12. In this embodiment, the retaining area ejection section 13C is made of a porous material that allows air to pass through. That is, the retaining area ejection section 13C is made of a porous material located within the retaining area 12 of the chuck 10C. The retaining area ejection section 13C is configured to eject air from at least a portion of the retaining surface 11 within the retaining area 12 via the porous material located within the retaining area 12 when viewed in a direction perpendicular to the retaining surface 11. The area from which the retaining area ejection section 13C ejects air is the area inside the retaining area 12 when viewed in a direction perpendicular to the retaining surface 11. Therefore, the outer edge of the retaining area ejection section 13C is made of the outer edge of the retaining area 12 when viewed in a direction perpendicular to the retaining surface 11. That is, the outer edge of the retaining area ejection section 13C is in contact with the outer edge of the retaining area 12 when viewed in a direction perpendicular to the retaining surface 11.
[0069] The retaining area ejection section 14C is provided on the outside of the retaining area 12 on the retaining surface 11. The retaining area ejection section 14C is made of a porous material that allows air to pass through. In other words, the retaining area ejection section 14C is made of a porous material located on the outside of the retaining area 12 of the chuck 10C. The retaining area ejection section 14C is configured to eject air from at least a portion of the retaining surface 11 outside the retaining area 12 via a porous material located on the outside of the retaining area 12 when viewed in a direction perpendicular to the retaining surface 11. The region from which the retaining area ejection section 14C ejects air is the region outside the retaining area 12 when viewed in a direction perpendicular to the retaining surface 11. Therefore, the outer edge of the retaining area ejection section 14C is made up of the outer edge of the chuck 10C and the outer edge of the retaining area 12 when viewed in a direction perpendicular to the retaining surface 11. In other words, the outer edge of the ejection portion 14C outside the holding area on the holding area 12 side is in contact with the outer edge of the holding area 12 when viewed in a direction perpendicular to the holding surface 11.
[0070] The suction portion 15A is formed to contact the four corners of the holding area 12 on the holding surface 11. The suction portion 15A is configured as a through-hole that penetrates the chuck 10C, which is a porous material. The side surface of the through-hole is configured so that air does not permeate it. The suction portion 15A is the same as the suction portion 15A included in the chuck 10A of the holding device 1A, so its description is omitted.
[0071] In the above configuration, as the semiconductor chip β moves in the +Y direction, which is outside the holding area 12, a pulling force F3 from the suction part 15A and an upward force F2 from the ejection part 14C outside the holding area are generated in proportion to the amount of movement of the semiconductor chip β (see Figure 8). The chuck 10C returns the tilted semiconductor chip β to its original position (see Figure 7) and also returns the semiconductor chip β that has moved outside the holding area 12 to its original position (see Figure 8). Furthermore, by configuring the ejection part 13C inside the holding area and the ejection part 14C outside the holding area with porous material, the area from which air is ejected can be configured to any position, shape, and size according to the size of the semiconductor chip β. In addition, since a uniform air layer is formed between the semiconductor chip β and the chuck 10C by ejecting air from the porous material, the position of the semiconductor chip β becomes more stable. This suppresses contact between the semiconductor chip β, which is held non-contact with the holding surface 11, and the holding surface 11, and maintains the position of the semiconductor chip β.
[0072] <Embodiment 2> <Configuration of the Holding Device> The holding device 1D, which is Embodiment 2 of the holding device according to the present invention, will be described with reference to Figure 10. Figure 10 is a plan view of the chuck 10D in the holding device 1D in Embodiment 2 of the present invention. The holding device 1D has a chuck 10D that does not include an ejection part outside the holding area.
[0073] As shown in Figure 10, in this embodiment, the chuck 10D is made of a porous material that is permeable to air, which is a gas. The chuck 10D has a holding surface 11 which is a plane that holds the semiconductor chip β in a non-contact manner. The sides of the chuck 10D other than the holding surface 11 are covered with an air-impermeable cover material 10Da. Therefore, the chuck 10D is configured to be able to suck in and discharge air from the holding surface 11. The chuck 10D also has a holding region 12, an air ejection portion 13C within the holding region, and a suction portion 15A.
[0074] The retaining area ejection section 13C is provided within the retaining area 12. In this embodiment, the retaining area ejection section 13C is made of a porous material that allows air to pass through. The retaining area ejection section 13C is identical to the suction section 15A included in the chuck 10A of the retaining device 1A, so its description is omitted. The outer edge of the retaining area ejection section 13C is formed by the outer edge of the retaining area 12 when viewed in a direction perpendicular to the retaining surface 11. In other words, the outer edge of the retaining area ejection section 13C is in contact with the cover material 10Da when viewed in a direction perpendicular to the retaining surface 11.
[0075] The suction portion 15A is formed to contact the four corners of the holding area 12 on the holding surface 11. The suction portion 15A is identical to the suction portion 15A included in the chuck 10A of the holding device 1A, so its description is omitted. The outer edge of the suction portion 15A is in contact with the cover material 10Da located on the outer edge of the holding area 12 when viewed in a direction perpendicular to the holding surface 11.
[0076] In the above configuration, as the semiconductor chip β moves in the +Y direction, which is outside the holding region 12, an attractive force F3 (see Figure 6) is generated at the suction portion 15A located on the -Y side, corresponding to the amount of movement of the semiconductor chip β. Therefore, as the semiconductor chip β moves in the +Y direction from the outer edge of the holding region 12, it is simultaneously moved in the -Y direction by the attractive force F3.
[0077] Furthermore, the attractive force F1 applied to the semiconductor chip β by the suction portion 15A located on the -Y direction side increases as the suction portion 15A is covered by the -Y direction end of the semiconductor chip β due to the movement of the semiconductor chip β in the -Y direction. The -Y direction end of the semiconductor chip β approaches the holding surface 11 due to the attractive force F1, and the +Y direction end of the semiconductor chip β moves away from the holding surface 11. In addition, the inclination angle of the semiconductor chip β with respect to the holding surface 11 decreases. This suppresses contact between the semiconductor chip β, which is held non-contact with the holding surface 11, and the holding surface 11, while maintaining the orientation of the semiconductor chip β.
[0078] <Other Embodiments> In Embodiment 1, Modifications 1 to 3 of Embodiment 1, and Embodiment 2 described above, the suction sections 15 and 15A have four through holes located at the four corners of the holding area 12, respectively. However, the suction section may also be configured to have at least one through hole located at any position within the holding area.
[0079] In Embodiment 1, Modifications 1 to 3 of Embodiment 1, and Embodiment 2 described above, the suction sections 15 and 15A are composed of a plurality of circular through-holes. However, the suction sections may be composed of through-holes of any shape, such as rectangular, polygonal, or elliptical.
[0080] In Embodiment 1, Modifications 1 to 3 of Embodiment 1, and Embodiment 2 described above, the external ejection sections 14 and 14B have through holes arranged at equal intervals in the area outside the holding area 12. However, the external ejection sections may be composed of any number of through holes and arranged at any position.
[0081] In the modified example 3 of Embodiment 1 described above, the chuck 10C has an internal ejection section 13C and an external ejection section 14C made of a porous material. However, the chuck may have either the internal or external ejection section made of a porous material, and the other made of metal, ceramics, or the like.
[0082] In the above-described embodiment 2, the chuck 10D has a retaining area ejection portion 13C made of a porous material. However, the retaining area ejection portion may also be made of a through hole.
[0083] In Embodiment 1, Modifications 1 to 3 of Embodiment 1, and Embodiment 2 described above, the holding devices 1, 1A, 1B, 1C, and 1D move the chucks 10A, 10B, 10C, and 10D in the X, Y, and Z directions using a Z-direction linear motor 51, an X-direction linear motor 52, and a Y-direction linear motor 53. However, the chucks may also be moved by other actuators such as servo motors.
[0084] In Embodiment 1, Modifications 1 to 3 of Embodiment 1, and Embodiment 2 described above, the holding devices 1, 1A, 1B, 1C, and 1D move the chucks 10A, 10B, 10C, and 10D in the X, Y, and Z directions based on the position information of the encoders of the Z-direction linear motor 51, X-direction linear motor 52, and Y-direction linear motor 53. However, the holding device may also be configured to detect the position of the stage in the X, Y, and Z directions using a scale such as a linear scale.
[0085] Although embodiments of the present invention have been described above, the embodiments described above are merely examples for carrying out the present invention. Therefore, the invention is not limited to the embodiments described above, and it is possible to carry out the invention by appropriately modifying the embodiments described above without departing from the spirit of the invention.
[0086] 1, 1A, 1B, 1C, 1D Holding device 10, 10A, 10B, 10C, 10D Chuck 10Ca, 10D Cover material 11 Holding surface 12 Holding area 13, 13C Inner ejection part of holding area 14, 14B, 14C Outer ejection part outside holding area 15, 15A Suction part 100 Moving device β Semiconductor chip F1, F3 Attracting force F2 Pushing force A1 Area on the +Y direction side overlapping with the semiconductor chip of the suction part A2 Area on the -Y direction side not overlapping with the semiconductor chip of the suction part A3 Area overlapping with the +Y direction end of the semiconductor chip of the outer ejection part of the holding area
Claims
1. A holding device comprising a chuck for non-contact holding of a semiconductor chip by a holding surface, wherein the holding surface has a holding region that overlaps with the semiconductor chip when viewed in a direction perpendicular to the holding surface, and the semiconductor chip is held in the holding region, wherein the chuck has a suction portion provided within the holding region for drawing in gas, and an in-holding-region ejection portion provided within the holding region for ejecting gas, and an out-of-holding-region ejection portion for ejecting gas is further provided outside the holding region.
2. A holding device according to claim 1, wherein the suction portion is formed at a position where, when viewed in a direction perpendicular to the holding surface, the outer edge of the suction portion and the outer edge of the holding area are in contact.
3. A holding device according to claim 1, wherein the ejection portion outside the holding area is formed at a position in contact with the outer edge of the holding area.
4. A holding device according to claim 1, wherein the ejection part outside the holding area and the ejection part inside the holding area are made of a porous material that allows gas to pass through and constitute at least a part of the holding surface.
5. A holding device according to claim 1, wherein the holding area ejection part ejects gas while holding a semiconductor chip within the holding area.
6. A holding device comprising a chuck for non-contact holding of a semiconductor chip by a holding surface, wherein the holding surface has a holding region that is the same shape and size as the semiconductor chip when viewed in a direction perpendicular to the holding surface, and the semiconductor chip is held in the holding region, wherein the chuck has a suction part provided within the holding region for sucking in gas, and a holding region ejection part provided within the holding region for ejecting gas, wherein the suction part is formed at a position where the outer edge of the suction part and the outer edge of the holding region are in contact when viewed in a direction perpendicular to the holding surface.