Electronic / electrical device, detection system, determination system, and determination method

Abstract

The present disclosure provides an electronic / electrical device, etc., with which it is possible to determine if abnormal heat generation is occurring in a heating element in the electronic / electrical device, with which it is possible to easily provide the electronic / electrical device with a configuration for this determination, and with which the degree of freedom in selecting the arrangement position of this configuration is high. An electronic / electrical device 5 comprises: a heating element 7; and a heat-sensitive member 1 to which heat generated by the heating element 7 is transmitted. The heat-sensitive member 1 contains ammonia borane.

Description

Electronic and electrical equipment, detection system, determination system, and determination method

[0001] The present disclosure generally relates to electronic and electrical equipment, detection systems, determination systems, and determination methods, and more particularly to electronic and electrical equipment including a heating element, a detection system including the electronic and electrical equipment, a determination system including the electronic and electrical equipment, and a determination method for the electronic and electrical equipment.

[0002] In Patent Document 1, at a position where there is a risk of overheating of electrical equipment, H

[0005] ,

[0004] ,

[0003] , , , generating means for generating ２ is installed, and H ２ from the generating means ２ for detecting ２ a sensor using a metal oxide semiconductor whose resistance value changes due to the adsorption of H ２ gas is provided, and from a sudden change in the output of this H ２ sensor, H ２ a detection circuit for detecting the generation of ２ is provided, and overheating is detected from the generation of H ２ accompanying the overheating of the electrical equipment. An overheating detection device for electrical equipment has been disclosed. H ２ As the generating means, sulfuric acid or the like is enclosed in an acid-resistant container, and this container is destroyed at a predetermined temperature and reacted with a metal such as zinc to generate H ２ has been disclosed.

[0003] Japanese Utility Model Publication No. 3-70334 ​​​​​​​​The problem addressed by this disclosure is to provide an electronic / electrical device, a detection system equipped with this electronic / electrical device, a determination system equipped with this electronic / electrical device, and a determination method relating to this electronic / electrical device, which can confirm whether or not abnormal heat generation occurs in a heating element in the electronic / electrical device, can easily be provided with a configuration for this purpose in the electronic / electrical device, and have a high degree of freedom in selecting the placement position of this configuration.

[0006] An electronic or electrical device according to one aspect of the present disclosure comprises a heating element and a heat-sensitive member to which the heat generated by the heating element is transferred. The heat-sensitive member contains ammonia borane.

[0007] A detection system according to one aspect of the present disclosure comprises the aforementioned electronic and electrical equipment and a gas detector equipped with a hydrogen-sensitive detection element.

[0008] A determination system according to one aspect of the present disclosure comprises the electronic / electrical equipment or the detection system, and a determination unit that determines whether or not abnormal heat generation has occurred in the heating element based on the detection result by the detection element.

[0009] A determination method according to one aspect of the present disclosure determines whether or not abnormal heat generation has occurred in the heating element of the electronic / electrical device based on the detection result of hydrogen around the heat-sensitive element of the electronic / electrical device.

[0010] Figure 1 is a schematic cross-sectional view of an example of a heating element and a heat-sensitive element in an electronic and electrical device according to an embodiment of the present disclosure. Figure 2 is a schematic cross-sectional view of another example of a heating element and a heat-sensitive element in an electronic and electrical device according to an embodiment of the present disclosure. Figure 3 is a schematic cross-sectional view of yet another example of a heating element and a heat-sensitive element in an electronic and electrical device according to an embodiment of the present disclosure. Figure 4 is a schematic configuration diagram of an electronic and electrical device and a determination system according to an embodiment of the present disclosure. Figure 5 is a schematic configuration diagram of a detection system and a determination system according to an embodiment of the present disclosure. Figure 6 is a block diagram of a determination system according to an embodiment of the present disclosure. Figure 7 is a schematic configuration diagram of a modified detection system and a determination system according to the present disclosure. Figure 8 is a graph showing the test results for Examples 1 to 3.

[0011] The embodiments and modifications of this disclosure will be described below with reference to the drawings. Note that the embodiments and modifications described below represent only a portion of the various embodiments of this disclosure. Furthermore, the embodiments described below can be modified in various ways depending on the design, etc., as long as the objectives of this disclosure are achieved. The figures referenced below are schematic diagrams, and the dimensional ratios of the components shown in the figures do not necessarily reflect the actual dimensional ratios.

[0012] 1. Overview Figures 1 to 3 show the heating element 7 and the heat-sensitive member 1 in the electronic / electrical device 5 of the embodiment, Figure 4 shows the electronic / electrical device 5 of the embodiment, Figure 5 shows the detection system of the embodiment, Figures 4 to 6 show the determination system of the embodiment, and Figure 7 shows the detection system of a modified example.

[0013] The electronic / electrical device 5 of the embodiment comprises a heating element 7 and a heat-sensitive member 1 to which the heat generated by the heating element 7 is transferred. The heat-sensitive member 1 contains ammonia borane.

[0014] According to the electronic / electrical device 5 of this embodiment, when the heating element 7 generates heat and the heat emitted by the heating element 7 is transferred, causing the temperature of the heat-sensitive member 1 to rise to around 80°C, the ammonia borane in the heat-sensitive member 1 decomposes and hydrogen is generated. Therefore, by detecting the hydrogen around the heat-sensitive member 1, it is possible to confirm whether or not abnormal heat generation has occurred in the heating element 7 of the electronic / electrical device 5.

[0015] For example, if the temperature of the heating element 7 is below 80°C when the electronic / electrical device 5 is operating normally, then if hydrogen is detected around the heating element 7, it can be determined that abnormal heat generation is occurring in the heating element 7 and the electronic / electrical device 5 is malfunctioning. Furthermore, by measuring the concentration of hydrogen around the heating element 7, it is also possible to determine the degree of abnormal heat generation in the heating element 7.

[0016] Furthermore, since the atmosphere contains almost no hydrogen, in this embodiment, even if only a small amount of hydrogen is emitted from the heating element 7, it is possible to accurately confirm whether or not abnormal heat generation is occurring in the heating element 7 based on the hydrogen detection results. In addition, hydrogen has the advantages of being non-corrosive, harmless to the human body, and not burdening the natural environment.

[0017] Furthermore, ammonia borane is solid and stable at room temperature. Also, ammonia borane decomposes on its own at approximately 80°C without reacting with other compounds, generating hydrogen. Therefore, ammonia borane is easy to handle, and the heat-sensitive element 1 containing ammonia borane can be easily placed in various positions within the electronic / electrical device 5. Thus, the heat-sensitive element 1 can be easily placed in the electronic / electrical device 5 at an appropriate position where heat generated from the heating element 7 is transferred. In other words, there is a high degree of freedom in selecting the placement position of the heat-sensitive element 1.

[0018] Therefore, according to this embodiment, there is an advantage that a heat-sensitive member 1, which is configured to detect abnormal heat generation in the heating element 7 of the electronic / electrical device 5, can be easily provided, and that there is a high degree of freedom in selecting the placement position of the heat-sensitive member 1.

[0019] The electronic / electrical device 5 may further include a hydrogen-sensitive detection element 21. In this case, the presence or absence of abnormal heat generation in the heating element 7 of the electronic / electrical device 5 can be confirmed based on the detection result by the detection element 21 in the electronic / electrical device 5.

[0020] The detection system of this embodiment comprises an electronic / electrical device 5 and a gas detector 2 equipped with a hydrogen-sensitive detection element 21.

[0021] According to the detection system of this embodiment, it is possible to confirm whether or not abnormal heat generation has occurred in the heating element 7 of the electronic / electrical equipment 5 based on the detection result by the detection element 21 of the gas detector 2.

[0022] The determination system of the embodiment comprises an electronic / electrical device 5 or a detection system, and a determination unit 32 that performs a determination based on the detection result by the detection element 21.

[0023] According to the determination system of this embodiment, the determination unit 32 can determine whether or not abnormal heat generation has occurred in the heating element 7 of the electronic / electrical equipment 5, based on the detection result from the detection element 21 of the gas detector 2.

[0024] The determination method of this embodiment determines whether or not abnormal heat generation has occurred in the electronic / electrical device 5 based on the detection result of detecting hydrogen emitted from the heat-sensitive element 1 in the electronic / electrical device 5.

[0025] 2. The heat-sensitive member 1 of the heat-sensitive member embodiment will be further described.

[0026] The structure of the heat-sensitive element 1 is shown in Figures 1 to 3. The heat-sensitive element 1 may have an appropriate structure as long as it contains ammonia borane.

[0027] The heat-sensitive member 1 contains, for example, a binder 14, in which ammonia borane is dispersed. For example, as shown in Figures 1 to 3, ammonia borane particles 15 are dispersed in the binder 14. In this case, the ammonia borane can be fixed to the heat-sensitive member 1 by the binder 14. The binder 14 is, for example, a resin material, more specifically, an acrylic resin or an epoxy resin cured product.

[0028] The heat-sensitive element 1 may contain a thermochromic material. For example, as shown in Figure 2, the thermochromic material 16 may be dispersed in the binder 14. In this case, it is possible to visually confirm that the temperature of the heat-sensitive element 1 has risen. Therefore, when hydrogen is detected, it is possible to confirm that the temperature of the heat-sensitive element 1 has risen by visually inspecting it. In addition, by checking the degree of discoloration of the heat-sensitive element 1, it is possible to confirm the degree of temperature rise and temperature distribution of the heat-sensitive element 1. This can provide clues to investigating the degree of abnormal heat generation, the source of the abnormal heat generation, and the cause of the abnormal heat generation in the electronic / electrical equipment 5. Note that discoloration here refers to a change in color, disappearance of color, or color development.

[0029] The heat-sensitive component 1 may be an irreversible thermochromic material that changes color due to a rise in temperature and maintains that color even when the temperature decreases. In this case, even after the temperature of the heat-sensitive component 1 decreases, the degree of temperature rise and temperature distribution of the heat-sensitive component 1 can be confirmed by checking the degree of discoloration of the heat-sensitive component 1.

[0030] As the heat-sensitive component 1, a suitable commercially available material can be used. For example, the irreversible thermochromic material may include at least one material selected from the group consisting of arylmethane pigments, azo dyes, acidic white pigments, phenol derivatives, and synthetic compounds such as methyl violet, as well as sulfides, oxides, nitrates, sulfates, and metal phosphates.

[0031] The ammonia borane content in the heat-sensitive element 1 is appropriately set according to the environment in which the heat-sensitive element 1 is used, such as the size of the space around the heat-sensitive element 1, the distance between the heat-sensitive element 1 and the detection element 21, and the sensitivity of the detection element 21, so that hydrogen emitted from the heat-sensitive element 1 when its temperature rises can be sufficiently detected. For example, the ammonia borane content is 0.4 parts by mass or more and 10 parts by mass or less per 100 parts by mass of the binder 14 in the heat-sensitive element 1. However, depending on the environment in which the heat-sensitive element 1 is used, the ammonia borane content may be outside the above range.

[0032] When the heat-sensitive member 1 contains a heat-discoloring material, the amount of the heat-discoloring material in the heat-sensitive member 1 is set appropriately, depending on the type of heat-discoloring material, etc., so that the discoloration of the heat-discoloring material caused by the rise in temperature of the heat-sensitive member 1 is clearly visible. For example, the amount of heat-discoloring material is 10 parts by mass or more and 50 parts by mass or less, based on the amount of binder 14 in the heat-sensitive member 1 (100 parts by mass).

[0033] There are no restrictions on the shape and dimensions of the heat-sensitive element 1. The heat-sensitive element 1 may have any suitable form, such as granular, lumpy, or film-like. In particular, if the heat-sensitive element 1 is film-like, it can be easily placed at various positions in the electronic / electrical device 5. In other words, the degree of freedom in selecting the position of the heat-sensitive element 1 can be increased.

[0034] The heat-sensitive member 1 is manufactured, for example, by molding a composition that is the material of the heat-sensitive member 1 (hereinafter referred to as the raw material composition). The raw material composition contains, for example, a binder 14 or the raw materials for the binder 14, and ammonia borane, and optionally further contains a thermochromic material. The raw material composition may further contain a solvent that can disperse or dissolve the binder 14 or the raw materials for the binder 14.

[0035] When the heat-sensitive member 1 is in a film form, that is, when the heat-sensitive member 1 is a film body 10 containing ammonia borane, it is preferable that the raw material composition can be formed into a film at a relatively low temperature, preferably at a temperature of 60 °C or lower. The raw material composition is, for example, a solvent-based composition that is formed into a film by volatilization of a solvent at a relatively low temperature. Further, the raw material composition may be a low-temperature curable composition that is formed into a film by thermosetting at a low temperature, preferably at a temperature of 60 °C or lower. Further, the raw material composition may be an active energy ray curable composition that is cured by irradiation with active energy rays such as ultraviolet rays.

[0036] For example, a solvent-based raw material composition is applied and formed into a film, and the solvent is volatilized from the raw material composition to produce the heat-sensitive member 1 (see FIGS. 1 and 2). In this case, the raw material composition contains, for example, a solvent-based acrylic resin, and the binder 14 in the heat-sensitive member 1 in this case is an acrylic resin. As a method of applying the raw material composition, an appropriate method such as a spray method, a bar coating method, or a screen printing method can be adopted. When volatilizing the solvent, in order to suppress the decomposition of ammonia borane, it is preferable to volatilize it by natural drying or to volatilize it by heating the raw material composition to a temperature sufficiently lower than the decomposition temperature of ammonia borane, preferably a temperature of 60 °C or lower.

[0037] Further, for example, a low-temperature curable raw material composition is applied and formed into a film, and the raw material composition is thermoset to produce the heat-sensitive member 1 (see FIGS. 1 and 2). In this case, the raw material composition contains, for example, a two-component epoxy resin, and the binder 14 in the heat-sensitive member 1 in this case is a cured epoxy resin. The method of applying the raw material composition is the same as in the case of the solvent-based raw material composition. The thermosetting of the raw material composition is preferably carried out at a temperature sufficiently lower than the decomposition temperature of ammonia borane, preferably at 60 °C or lower.

[0038] Further, for example, by applying an active energy ray-curable raw material composition to form a film and irradiating the raw material composition with active energy rays to cure it, the heat-sensitive member 1 can be produced (see FIGS. 1 and 2). In this case, the raw material composition contains a photoreactive compound such as an acrylic compound, and in this case, the binder 14 in the heat-sensitive member 1 is a cured product of the photoreactive compound.

[0039] When the heat-sensitive member 1 is in the form of a film, the thickness of the heat-sensitive member 1 is, for example, 0.5 μm or more and 100 μm or less, but is not limited thereto.

[0040] The heat-sensitive member 1 may include a film body 10 containing ammonia borane and a base material 11 that supports the film body 10 (see FIG. 3). In this case, the heat-sensitive member 1 can be easily fixed by fixing the base material 11 to a desired location in the electronic and electrical device 5 with an adhesive 13 or the like.

[0041] The base material 11 is, for example, in the form of a film and is a resin film such as a polyethylene terephthalate film. On the base material 11, a film body 10 containing ammonia borane can be produced by, for example, the same method as the method for producing the above-described film-shaped heat-sensitive member 1. The thickness of the film body 10 is, for example, 0.5 μm or more and 100 μm or less, but is not limited thereto.

[0042] 3. The electronic and electrical device 5 of the electronic and electrical device embodiment is shown in FIG. 4. The electronic and electrical device 5 is a device that operates using electric power as a power source or a device that is responsible for the transfer of electric power. There is no limitation on the type of the electronic and electrical device 5, but the electronic and electrical device 5 is, for example, a lighting device, a mobile terminal, an information device, a power supply and distribution facility (power supply and distribution facility), a power supply facility, or a substation facility. The power supply and distribution facility is a facility that supplies or distributes electric power, such as a distribution board. The power supply facility is a facility for supplying electric power to a device or equipment, such as a wiring plug connector such as a plug, a socket, or a table tap. The substation facility is, for example, a cubicle-type high-voltage power receiving facility.

[0043] The electronic and electrical device 5 includes a housing 6, and a heating element 7 is disposed inside the housing 6.

[0044] The heat-generating element 7 is a component or device that generates heat when power is supplied. The heat-generating element 7 may also include components or devices that do not generate heat when the electronic / electrical equipment 5 is operating normally, but may generate heat if the heat-generating element 7 deteriorates or malfunctions. The temperature of the heat-generating element 7 is preferably less than 80°C when the electronic / electrical equipment 5 is operating normally. The heat-generating element 7 is at least one selected from the group consisting of, for example, devices such as power supply units and motors, heat-generating components such as power semiconductors, conductors through which current flows such as conductive wiring and connection terminals, and electronic components such as resistors and capacitors.

[0045] The heat-sensitive member 1 is placed on top of the heating element 7 so as to be in contact with it. Therefore, the heat generated by the heating element 7 can be transferred to the heat-sensitive member 1. If the heat-sensitive member 1 is in the form of a film, that is, if the heat-sensitive member 1 is a film body 10 containing ammonia borane, the heat-sensitive member 1 is manufactured by, for example, forming a film on the surface of the heating element 7 (see Figures 1 and 2). Alternatively, if the heat-sensitive member 1 comprises a film body 10 containing ammonia borane and a base material 11 that supports the film body 10, the heat-sensitive member 1 is placed on top of the heating element 7 so as to be in contact with it by, for example, bonding the base material 11 to the heating element 7 with an adhesive 13 (see Figure 3).

[0046] The electronic / electrical device 5 includes a gas detection unit 20 having a detection element 21 that is sensitive to hydrogen. The detection element 21 is a sensor element that outputs a signal corresponding to exposure to hydrogen. The detection element 21 is, for example, a solid electrolyte type sensor element, a gas heat conduction type sensor element, a catalytic combustion type sensor element, or a hot-wire type semiconductor type sensor element. Of these, the hot-wire type semiconductor sensor element is easy to maintain, easy to handle, and can detect hydrogen with good sensitivity. The gas detection unit 20 may further include an output unit 22 that transmits the signal output by the detection element 21 to the control system 3 (see Figure 6). The output unit 22 may include, for example, a suitable interface for transmitting the signal to the control system 3 by wire. The output unit 22 may also include a transmitting antenna for wirelessly transmitting the signal to the control system 3. The output unit 22 may include an amplification circuit that amplifies the signal before outputting it, and may also include a converter that converts the signal format before transmitting the signal.

[0047] In this embodiment, the detection element 21 in the gas detection unit 20 is positioned above the heat-sensitive member 1 within the housing 6. Therefore, if hydrogen is generated from the heat-sensitive member 1 due to the heat generated by the heating element 7, the detection element 21 can detect the hydrogen.

[0048] According to the electronic / electrical device 5, when the heat-sensitive element 1 is heated and hydrogen is generated from the heat-sensitive element 1, the detection element 21 of the gas detection unit 20 detects the hydrogen, allowing the degree of heat generation of the heating element 7 to be confirmed. Based on this detection result, it is possible to determine whether or not abnormal heat generation has occurred in the heating element 7 of the electronic / electrical device 5, or to determine the degree of abnormal heat generation. The user can take appropriate action according to this determination result. For example, if the electronic / electrical device 5 is a power supply and distribution facility, and it is determined that abnormal heat generation has occurred, the use of the electronic / electrical device 5 can be stopped or its operation can be stopped, thereby suppressing ignition caused by abnormal heat generation and enhancing safety. Alternatively, if it is determined that abnormal heat generation has occurred due to the detection of hydrogen, the power supply and distribution to the electronic / electrical device 5 may be automatically shut off.

[0049] 4. The configuration of the detection system embodiment is shown in Figure 5. The detection system comprises an electronic / electrical device 5 and a gas detector 2 equipped with a hydrogen-sensitive detection element 21.

[0050] The electronic / electrical device 5 comprises a housing 6, a heating element 7, and a heat-sensitive member 1. The configuration of the housing 6, heating element 7, and heat-sensitive member 1 is the same as in the case of "3. Electronic / Electrical Devices" described above. However, the electronic / electrical device 5 in the detection system does not include the gas detection unit 20 in "3. Electronic / Electrical Devices".

[0051] The gas detector 2 is located outside the electronic / electrical equipment 5. The gas detector 2 is a separate device from the electronic / electrical equipment 5 and, as described above, has a hydrogen-sensitive detection element 21. The detection element 21 is a sensor element that outputs a signal when exposed to hydrogen. Details of the detection element 21 are the same as those of the detection element 21 described in "3. Electronic / Electrical Equipment" above. The gas detector 2 may further include an output unit 22 that transmits the signal output by the detection element 21 to the control system 3 (see Figure 6). The output unit 22 may include, for example, a suitable interface for transmitting the signal to the control system 3 via a wired connection. The output unit 22 may also include a transmitting antenna for wirelessly transmitting the signal to the control system 3. The output unit 22 may include an amplification circuit that amplifies the signal before outputting it, and may also include a converter that converts the signal format before transmitting it.

[0052] The gas detector 2 is positioned so that when hydrogen is generated from the heat-sensitive element 1 in the electronic / electrical device 5, this hydrogen can be detected by the detection element 21 in the gas detector 2. For example, the gas detector 2 is positioned above and near the electronic / electrical device 5. In this case, when hydrogen is generated from the heat-sensitive element 1, the hydrogen flows out of the housing 6 of the electronic / electrical device 5 through a gap in the housing 6, and this hydrogen can be detected by the detection element 21 in the gas detector 2. The gap in the housing 6 may be a gap formed for the purpose of allowing hydrogen to pass through, or it may be a gap formed to realize the function of the electronic / electrical device 5. For example, if the electronic / electrical device 5 is an electrical outlet, the gap may be the socket of the outlet.

[0053] According to the detection system, when the heat-sensitive element 1 is heated and hydrogen is generated from it, the detection element 21 of the gas detector 2 detects the hydrogen, allowing the degree of heat generation of the heating element 7 to be confirmed. Based on this detection result, it is possible to determine whether or not abnormal heat generation has occurred in the electronic / electrical equipment 5, or to determine the degree of abnormal heat generation. For example, if the electronic / electrical equipment 5 is a power supply and distribution facility, and it is determined that abnormal heat generation has occurred, the use of the electronic / electrical equipment 5 can be stopped or its operation can be halted, thereby suppressing ignition caused by abnormal heat generation and enhancing safety.

[0054] 5. The configuration of the determination system of the embodiment of the determination system and determination method is shown in Figures 4 to 6. The determination system comprises the electronic / electrical equipment 5 in "3. Electronic / electrical equipment" above, or the detection system in "4. Detection system" above, and a determination unit 32 that performs a determination based on the detection result by the detection element 21.

[0055] According to the determination system, when the heat-sensitive element 1 is heated, hydrogen is generated from the heat-sensitive element 1. When this hydrogen is detected by the detection element 21, the determination unit 32 can determine, based on the detection result, whether or not abnormal heat generation has occurred in the heating element 7 of the electronic / electrical equipment 5, or further determine the degree of abnormal heat generation. For example, if the electronic / electrical equipment 5 is a power supply and distribution facility, and it is determined that abnormal heat generation has occurred, the use of the electronic / electrical equipment 5 can be stopped or its operation can be halted, thereby suppressing ignition caused by abnormal heat generation and enhancing safety. Alternatively, if it is determined that abnormal heat generation has occurred due to the detection of hydrogen, the power supply and distribution to the electronic / electrical equipment 5 may be automatically shut off.

[0056] The judgment system may further include a notification unit 4 that notifies the result of the judgment made by the judgment unit 32. The notification unit 4 is a means of notifying information in a way that appeals to the five senses of humans. The notification unit 4 includes, for example, at least one selected from the group consisting of a display, lamps and indicator lights that visually display information, a speaker and buzzer that notifies information by sound, and a vibration motor that notifies information by vibration.

[0057] Let's explain in more detail an example of the configuration of the judgment system.

[0058] The determination system includes, for example, an electronic / electrical device 5, a gas detector 2 or a gas detection unit 20 within the electronic / electrical device 5, a detection element 21, a control system 3, and a notification unit 4.

[0059] The control system 3 comprises an acquisition unit 31 and a control unit 30. The acquisition unit 31 acquires a signal transmitted from the output unit 22 and sends it to the determination unit 32. The acquisition unit 31 includes an appropriate interface for receiving signals transmitted, for example, by wire. The acquisition unit 31 may also include a receiving antenna for receiving signals transmitted wirelessly. The acquisition unit 31 may include an amplification circuit for amplifying the signal before sending it to the determination unit 32, and may also include a converter for converting the signal format before sending it to the determination unit 32.

[0060] The control unit 30 comprises a determination unit 32 and a notification control unit 33. Note that the determination unit 32 and the notification control unit 33 do not necessarily represent actual physical configurations, but rather indicate functions realized by the control unit 30.

[0061] The control unit 30 includes, for example, a computer system. The computer system mainly consists of a processor and memory as hardware. The function of the control unit 30 is realized when the processor executes a program recorded in the computer system's memory. The program may be pre-recorded in the computer system's memory, provided via a telecommunications line, or provided on a non-temporary recording medium such as a memory card, optical disk, or hard disk drive that can be read by the computer system. The processor of the computer system is composed of one or more electronic circuits including semiconductor integrated circuits (ICs) or large-scale integrated circuits (LSIs). The integrated circuits such as ICs and LSIs referred to here are named differently depending on the degree of integration, and include integrated circuits called system LSIs, VLSIs (Very Large Scale Integrations), or ULSIs (Ultra Large Scale Integrations). Furthermore, FPGAs (Field-Programmable Gate Arrays) that are programmed after the LSI is manufactured, or logic devices that allow for the reconfiguration of junction relationships or circuit compartments within the LSI, can also be used as processors. Multiple electronic circuits may be integrated onto a single chip or distributed across multiple chips. Multiple chips may be integrated onto a single device or distributed across multiple devices. The computer system referred to here includes a microcontroller having one or more processors and one or more memories. Therefore, the microcontroller also consists of one or more electronic circuits, including semiconductor integrated circuits or large-scale integrated circuits.

[0062] The determination unit 32 makes a determination based on the signal sent from the acquisition unit 31. For example, if the detection element 21 detects hydrogen and outputs a corresponding signal, the determination unit 32 may determine, based on this signal, that abnormal heat generation has occurred in the heating element 7. The determination unit 32 may further determine the degree of abnormal heat generation in the heating element 7 based on the signal.

[0063] The notification control unit 33 controls the notification unit 4 to notify the external system of the determination result made by the determination unit 32. That is, the notification control unit 33 notifies the notification unit 4 of the determination result, such as whether abnormal heat generation has occurred in the heating element 7, or the degree of abnormal heat generation in the heating element 7.

[0064] The determination system may include multiple electronic / electrical devices 5. In this case, the determination unit 32 can also perform determinations for each of the multiple electronic / electrical devices 5 individually. That is, for example, it can be easily confirmed which of the multiple electronic / electrical devices 5 has experienced abnormal heat generation.

[0065] An example of the sequence of operations of the judgment system will be explained. When abnormal heat generation occurs in the heating element 7 of the electronic / electrical device 5, and as a result ammonia borane decomposes in the heat-sensitive element 1, generating hydrogen from the heat-sensitive element 1, the detection element 21 senses the hydrogen and outputs a signal. The output unit 22 sends this signal to the control system 3. In the control system 3, the acquisition unit 31 acquires the signal and sends it to the control unit 30. In the control unit 30, the judgment unit 32 determines, based on the signal, whether or not abnormal heat generation has occurred in the heating element 7 of the electronic / electrical device 5. When the judgment unit 32 sends this determination result to the notification control unit 33, the notification control unit 33 controls the notification unit 4 so that the notification unit 4 notifies the determination result.

[0066] 6. In the modified embodiment, the heating element 7 and the heat-sensitive member 1 are housed in the housing 6, but the heating element 7 and the heat-sensitive member 1 may not be housed in the housing 6 and may be exposed to the outside of the electronic / electrical equipment 5.

[0067] In this embodiment, the heat-sensitive member 1 is in contact with the heating element 7, but the position of the heat-sensitive member 1 is not limited to this embodiment, as long as the heat generated by the heating element 7 can be transferred to the heat-sensitive member 1. For example, the heat-sensitive member 1 may be positioned near the heating element 7. Heat may be interposed between the heat-sensitive member 1 and the heating element 7 so that the heat generated by the heat-sensitive member 1 is transferred to the heat-sensitive member 1 via a heat sink. Furthermore, a portion of the heating element 7 may be formed from the heat-sensitive member 1. Also, a portion or all of the housing 6 of the electronic / electrical device 5 may be formed from the heat-sensitive member 1.

[0068] In the electronic and electrical equipment 5 shown in section "3. Electronic and Electrical Equipment," the arrangement of the gas detection unit 20 and the detection element 21 is not limited to the embodiment, as long as it is possible to detect the hydrogen emitted by the heat-sensitive member 1. It is preferable that the detection element 21 is arranged near the heat-sensitive member 1. For example, the heat-generating element 7 may be mounted on a wiring board located inside the housing 6, and the detection element 21 may be mounted on the same wiring board, so that the heat-sensitive member 1 is arranged near the heat-generating element 7. In addition, the gas detection unit 20 and the detection element 21 may not be housed inside the housing 6 but may be exposed to the outside of the electronic and electrical equipment 5.

[0069] In the electronic / electrical device 5 shown in section 4. Detection System, the heat-sensitive member 1 may be positioned outside the housing 6 at a location where heat generated by the heating element 7 can be transmitted, as shown in the modified example in Figure 7. In this case, hydrogen emitted from the heat-sensitive member 1 can be quickly detected by the detection element 21 of the gas detector 2 located outside the electronic / electrical device 5. In the modified example shown in Figure 7, the heating element 7 is positioned on the ceiling surface inside the housing 6, and the heat-sensitive member 1 is positioned on the upper surface outside the housing 6. The heating element 7 and the heat-sensitive member 1 are overlapped with the housing 6 interposed between them. Therefore, heat generated by the heating element 7 can be transmitted to the heat-sensitive member 1 via the housing 6.

[0070] In the judgment system, it is not essential that the multiple functions of the control system 3 be integrated into a single enclosure; the components of the control system 3 may be distributed across multiple enclosures. Furthermore, at least some of the functions of each of the control systems 3 may be implemented by the cloud (cloud computing), etc.

[0071] Furthermore, for example, the notification unit 4 may be composed of a display or the like on an electronic information terminal such as a personal computer or smartphone. In this case, the determination unit 32 may be composed of a computer system on the aforementioned electronic information terminal, or it may be composed of a computer system on a device such as a server that is different from the aforementioned electronic information terminal.

[0072] At least some of the functions of the determination system may be integrated into a single housing. For example, at least some of the functions of the detection system and the control system 3 may be integrated into the housing of the electronic / electrical device 5, and furthermore, the functions of the notification unit 4 may also be integrated into the housing of the electronic / electrical device 5. That is, for example, the electronic / electrical device 5 may include a determination unit 32 in addition to the heat-sensitive element 1 and the gas detection unit 20, and may also include a notification unit 4.

[0073] The following describes an embodiment in which it was verified that the heat-sensitive member 1 of the embodiment can generate hydrogen in response to the heat generated by the heating element 7. Note that the configuration of the heat-sensitive member 1 is not limited to the embodiment described below.

[0074] 1. Example 1 Granular ammonia borane (product code 287717-1G, manufactured by SIGMA-ALDRICH), acrylic resin (product name Acrydic WAL578, manufactured by DIC Corporation), and toluene as a solvent were prepared.

[0075] A mixture was prepared by mixing acrylic resin and a solvent in a 1:1 mass ratio, and this mixture was stirred in a vortex mixer. Subsequently, 4 parts by mass of ammonia borane per 100 parts by mass of acrylic resin was added to the mixture, and the mixture was further stirred in a vortex mixer. This obtained the raw material composition.

[0076] A polyethylene terephthalate film was prepared as the base material 11. The raw material composition was dropped onto the base material 11, and the raw material composition was formed into a film on the base material 11 using a bar coater #50. The solvent was evaporated by air drying of this film of raw material composition. As a result, a film body 10 containing ammonia borane was created on the base material 11, and a heat-sensitive member 1 was obtained comprising a base material 11 with a thickness of 2 mm and a film body 10 with a thickness of 50 μm. This heat-sensitive member 1 was cut to dimensions of 50 mm x 50 mm in plan view.

[0077] The base material 11 of the heat-sensitive component 1 was bonded to an ABS resin substrate, which mimicked the heating element 7, using adhesive 13. This fixed the heat-sensitive component 1 to the substrate (see Figure 3).

[0078] 2. Example 2 A raw material composition with the same composition as in Example 1 was prepared.

[0079] The raw material composition was dropped onto an ABS resin substrate that mimicked the heating element 7, and the raw material composition was formed into a film on the substrate 11 using a bar coater #50. The solvent was evaporated by air drying of this raw material composition film. As a result, a 50 μm thick heat-sensitive component 1 containing ammonia borane was fabricated on a 2 mm thick substrate (see Figure 1).

[0080] 3. Example 3 In addition to the ammonia borane, acrylic resin, and solvent used in Example 1, a thermochromic material (product name ThermoLock 79, manufactured by Matsui Pigment Chemical Industry Co., Ltd.) was prepared.

[0081] A mixture was prepared by mixing acrylic resin and a solvent in a 1:1 mass ratio, and this mixture was stirred in a vortex mixer. Subsequently, 4 parts by mass of ammonia borane and 10 parts by mass of a thermochromic material per 100 parts by mass of acrylic resin were added to the mixture, and the mixture was further stirred in a vortex mixer. This obtained the raw material composition.

[0082] The raw material composition was dropped onto an ABS resin substrate that mimicked the heating element 7, and the raw material composition was formed into a film on the substrate 11 using a bar coater #50. The solvent was evaporated by air drying of this raw material composition film. As a result, a 50 μm thick heat-sensitive component 1 containing ammonia borane was fabricated on a 2 mm thick substrate (see Figure 2).

[0083] 4. A container with an internal space of 2L was prepared for evaluation. A hot plate was placed on the bottom of the internal space, and a substrate equipped with the heat-sensitive element 1 of each embodiment was placed on this hot plate. A SMART SENSOR AS8909 gas sensor manufactured by Wan Chuang Electronic Products Co., Ltd. was placed on the ceiling of the container. The hydrogen concentration inside the container was measured using the gas sensor while the temperature of the hot plate was raised from room temperature to 80°C. The results are shown in Figure 8. The right axis of the graph shows the temperature of the hot plate, and the left axis of the graph shows the hydrogen concentration measured for the heat-sensitive element 1 of each embodiment.

[0084] As shown in Figure 8, in each embodiment, hydrogen gas was not detected until the temperature reached 80°C, but once the temperature reached 80°C, the hydrogen gas concentration increased over time.

[0085] Furthermore, in Example 2, it was confirmed that although the heat-sensitive component 1 was red due to the heat-change material before the test, the color of the heat-sensitive component 1 disappeared over time once the temperature reached 80°C.

[0086] [Aspects] As shown in the embodiments, modifications and examples described above, this disclosure includes the following aspects.

[0087] The first embodiment of the electronic / electrical device (5) comprises a heating element (7) and a heat-sensitive member (1) to which the heat generated by the heating element (7) is transferred. The heat-sensitive member (1) contains ammonia borane.

[0088] According to this embodiment, the degree of heat generation of the heating element (7) in the electronic / electrical device (5) can be confirmed, the heat-sensitive member (1) which is configured for this purpose can be easily installed in the electronic / electrical device (5), and there is a high degree of freedom in selecting the placement position of the heat-sensitive member (1).

[0089] In the second embodiment, the heat-sensitive member (1) is in the form of a film, as in the first embodiment.

[0090] In a third embodiment, the heat-sensitive member (1) comprises a film body (10) containing ammonia borane and a substrate (11) supporting the film body (10).

[0091] In the fourth embodiment, in any one of the first to third embodiments, the heat-sensitive member (1) further contains a binder (14), in which ammonia borane is dispersed.

[0092] In the fifth embodiment, in any one of the first to fourth embodiments, the heat-sensitive member (1) further contains a heat-change material.

[0093] In the sixth embodiment, in any one of the first to fifth embodiments, the electronic / electrical equipment (5) is a power supply and distribution facility.

[0094] In the seventh embodiment, in any one of the first to sixth embodiments, the electronic / electrical device (5) further comprises a hydrogen-sensitive detection element (21).

[0095] The detection system according to the eighth embodiment comprises an electronic / electrical device (5) according to any one of the first to sixth embodiments, and a gas detector (2) equipped with a hydrogen-sensitive detection element (21).

[0096] The ninth embodiment of the determination system comprises an electronic / electrical device (5) according to the seventh embodiment or a detection system according to the eighth embodiment, and a determination unit (32) that determines whether or not abnormal heat generation has occurred in the heating element (7) based on the detection result by the detection element (21).

[0097] In the tenth embodiment, the determination system further comprises a notification unit (4) that notifies the result of the determination made by the determination unit (32), as in the ninth embodiment.

[0098] The method for determining the eleventh embodiment involves determining whether or not abnormal heat generation has occurred in the heating element (7) of the electronic / electrical equipment (5) based on the hydrogen detection result around the heat-sensitive element (1) in any one of the first to seventh embodiments.

[0099] 1 Heat-sensitive component 10 Film 11 Substrate 2 Gas detector 20 Gas detection unit 32 Judgment unit 4 Notification unit 5 Electronic / electrical equipment 7 Heating element

Claims

1. An electronic or electrical device comprising a heating element and a heat-sensitive member to which the heat generated by the heating element is transferred, wherein the heat-sensitive member contains ammonia borane.

2. The electronic / electrical device according to claim 1, wherein the heat-sensitive member is in the form of a film.

3. The electronic / electrical device according to claim 1, wherein the heat-sensitive member comprises a film containing the ammonia borane and a substrate supporting the film.

4. The electronic or electrical equipment according to any one of claims 1 to 3, wherein the heat-sensitive member further contains a binder, and the ammonia borane is dispersed in the binder.

5. The electronic or electrical device according to any one of claims 1 to 4, wherein the heat-sensitive member further contains a heat-change material.

6. An electronic or electrical device according to any one of claims 1 to 5, which is a power supply and distribution facility.

7. An electronic or electrical device according to any one of claims 1 to 6, further comprising a hydrogen-sensitive detection element.

8. A detection system comprising an electronic or electrical device as described in any one of claims 1 to 6, and a gas detector equipped with a hydrogen-sensitive detection element.

9. A determination system comprising: an electronic or electrical device as described in claim 7 or a detection system as described in claim 8; and a determination unit that determines whether or not abnormal heat generation has occurred in the heating element based on the detection result by the detection element.

10. The determination system according to claim 9, further comprising a notification unit for notifying the result of the determination made by the determination unit.

11. A determination method for determining whether or not abnormal heat generation has occurred in the heating element of an electronic or electrical device, based on the detection result of hydrogen around the heat-sensitive element in the electronic or electrical device according to any one of claims 1 to 7.

Images