Conveyance device

Abstract

This conveyance device for conveying an object includes: a holding part for holding the object; a support part for supporting the holding part; a first table provided to the support part; a linear motor for moving the first table; a second table for supporting the linear motor; and a drive motor for moving the second table using a drive method different from that of the linear motor.

Description

Carrier device

[0001] The present disclosure relates to a carrier device for carrying an object.

[0002] Patent Document 1 discloses a transfer robot provided with a plurality of moving means. The second moving means moves a rail that is arranged in parallel with the opening of the ring frame sandwiched therebetween and supports both side surfaces of the ring frame forward or backward in the X-axis direction. The third moving means moves the ring frame on the rail in the X-axis direction. These second moving means and third moving means move the object using a ball screw.

[0003] Japanese Patent Application Laid-Open No. 2020-194901

[0004] The technology according to the present disclosure miniaturizes a carrier device for carrying an object.

[0005] One aspect of the present disclosure is a carrier device for carrying an object, including a holding portion that holds the object, a support portion that supports the holding portion, a first table provided on the support portion, a linear motor that moves the first table, a second table that supports the linear motor, and a drive motor that moves the second table in a drive format different from that of the linear motor.

[0006] According to the present disclosure, a carrier device for carrying an object can be miniaturized.

[0007] This is a plan view showing the general configuration of the processing system. This is a perspective view showing the general configuration of the transport device. This is a perspective view showing the general configuration of the transport device. This is a perspective view showing the general configuration of the transport mechanism. This is a perspective view showing the general configuration of the transport mechanism. This is a perspective view showing the general configuration of the internal configuration of the transport mechanism. This is a perspective view showing the general configuration of the transport mechanism. This is a side view showing the general configuration of the first transport unit. This is a perspective view showing the general configuration of a part of the transport mechanism. This is an explanatory diagram showing the general configuration of the suction line, exhaust line, and cable. This is an explanatory diagram showing the general configuration of the suction line, exhaust line, and cable. This is an explanatory diagram showing the accessible range of the transport mechanism. This is an explanatory diagram showing the driving direction of the first transport unit. This is an explanatory diagram showing the accessible range of the transport mechanism in the processing system. This is an explanatory diagram showing the configuration of the fork and the driving direction of the first transport unit. This is an explanatory diagram showing how the fork moves according to the shape of the object. This is an explanatory diagram showing the arrangement of position sensors provided on the fork. This is an explanatory diagram showing how the center position of the wafer relative to the fork is corrected.

[0008] The configuration of the processing system equipped with the transport device according to this embodiment will be described below with reference to the drawings. In this specification and the drawings, elements having substantially the same functional configuration are denoted by the same reference numerals, and redundant explanations will be omitted.

[0009] First, the processing system according to this embodiment will be described. As shown in Figure 1, the processing system 1 performs the desired processing on the wafer W, which is the substrate, which is the target object.

[0010] The processing system 1 has a configuration in which an loading / unloading station 2 and a processing station 3 are integrally connected. At the loading / unloading station 2, for example, a hoop F capable of accommodating multiple wafers W is loaded and unloaded to and from the outside. The processing station 3 is equipped with a processing device that performs desired processing on the wafers W.

[0011] The loading / unloading station 2 is equipped with a hoop mounting platform 10, a conveying device 20, a moving mechanism 30, and a transition stage 40. The conveying device 20 and the moving mechanism 30 are positioned on the positive X-axis side of the hoop mounting platform 10. The transition stage 40 is positioned on the positive X-axis side of the conveying device 20 and the moving mechanism 30.

[0012] Multiple hoops, for example, four hoops F, are placed on the hoop mounting base 10 in a line along the Y-axis. The number and arrangement of hoops F placed on the hoop mounting base 10 are not limited to this embodiment and can be determined arbitrarily.

[0013] The transport device 20 is provided with a moving mechanism 30, which is attached to a transport path 31 extending in the Y-axis direction. The moving mechanism 30 has a rotary drive motor that rotates the transport device 20. The transport path 31 is provided with a drive mechanism, such as a drive motor or a linear motor, that moves the moving mechanism 30 along the transport path 31. The transport device 20 rotates around the vertical axis (Z-axis) by the moving mechanism 30 and moves along the transport path 31 while being held by the moving mechanism 30. The transport device 20 is configured to transport wafers W between the hoop F of the hoop mounting table 10 and the transition stage 40. Details of the configuration of the transport device 20 will be described later.

[0014] The transition stage 40 temporarily stores the wafer W for transfer to and from the processing station 3.

[0015] The processing station 3 is equipped with a transport device 50, a moving mechanism 60, and a processing device 70. The transport device 50 and the moving mechanism 60 are positioned on the positive X-axis side of the transition stage 40. For example, two processing devices 70 are positioned on the positive Y-axis side of the transport device 50 and the moving mechanism 60, and two are positioned on the negative Y-axis side of the transport device 50 and the moving mechanism 60. Note that the number and arrangement of the processing devices 70 are not limited to this embodiment and can be determined arbitrarily.

[0016] The transport device 50 is equipped with a moving mechanism 60, which is attached to a transport path 61 extending in the X-axis direction. The moving mechanism 60 has a rotary drive motor that rotates the transport device 50. The transport path 61 is equipped with a drive mechanism, such as a drive motor or a linear motor, that moves the moving mechanism 60 along the transport path 61. The transport device 50 rotates around the vertical axis (Z-axis) by the moving mechanism 60 and moves along the transport path 61 while being held by the moving mechanism 60. The transport device 50 is configured to transport wafers W between the transition stage 40 and the processing device 70. Details of the configuration of the transport device 50 will be described later.

[0017] The processing apparatus 70 has a stage 71 for holding a wafer W, and performs a desired process on the wafer W held on the stage 71. The processing performed by the processing apparatus 70 is arbitrary. For example, the processing apparatus 70 may be a laser irradiation device that irradiates the wafer W with laser light. Alternatively, the processing apparatus 70 may be an etching device that etches the surface of the wafer W, or a cleaning device that cleans the surface of the wafer W.

[0018] The processing system 1 described above is provided with at least one control unit, which is a control device 80. The control device 80 processes computer-executable instructions that cause the processing system 1 to perform the various processes described herein. The control device 80 may be configured to control each element of the processing system 1 to perform the various processes described herein. In one embodiment, some or all of the control device 80 may be included in the processing system 1. The control device 80 may include a processing unit, a storage unit, and a communication interface. The control device 80 is implemented, for example, by a computer. The processing unit may be configured to read a program from the storage unit that provides logic or routines that enable various control operations, and to perform various control operations by executing the read program. This program may be stored in the storage unit in advance, or it may be obtained via a medium when needed. The obtained program is stored in the storage unit and read from the storage unit and executed by the processing unit. The medium may be various storage media read by a computer, or it may be a communication line connected to a communication interface. The storage medium may be temporary or non-temporary. The processing unit may be a CPU (Central Processing Unit) and may consist of one or more circuits. The storage unit may include RAM (Random Access Memory), ROM (Read Only Memory), HDD (Hard Disk Drive), SSD (Solid State Drive), or a combination thereof. The communication interface may communicate with the processing system 1 via a communication line such as a LAN (Local Area Network).

[0019] Next, we will describe the wafer processing performed using the processing system 1 configured as described above.

[0020] First, a hoop F containing multiple wafers W is placed on the hoop mounting table 10 of the loading / unloading station 2. Next, the wafers W inside the hoop F are removed by the transport device 20 and transported to the transition stage 40.

[0021] Next, the wafer W is transported to the processing apparatus 70 by the transport device 50. In the processing apparatus 70, the wafer W is transferred from the transport device 50 to the stage 71 and held there. Then, the desired processing is performed on the wafer W held on the stage 71.

[0022] Next, the wafer W, which has undergone the desired processing, is transported to the transition stage 40 by the transport device 50, and then further transported to the hoop F of the hoop mounting table 10 by the transport device 20. In this way, the series of wafer processing in the processing system 1 is completed.

[0023] Next, the configurations of the conveying devices 20 and 50 described above will be explained. Since the configurations of conveying devices 20 and 50 are identical, the configuration of conveying device 50 will be explained below.

[0024] As shown in Figures 2 and 3, the transport device 50 has a configuration in which two upper and lower transport mechanisms 200 and 300 are supported on a base 100. The base 100 is attached to the moving mechanism 60 shown in Figure 1. The base 100 rotates (swivels) around the vertical axis (Z axis) by the moving mechanism 60 and moves along the transport path 61 while being held by the moving mechanism 60. The upper transport mechanism 200 and the lower transport mechanism 300 each hold the wafer W and transport it along the base 100 in the first direction in which the base 100 extends. Note that the number of transport mechanisms (number of forks, which will be described later) is not limited to this embodiment and may be one stage or three or more stages.

[0025] A cover 101 is detachably provided on the side of the longitudinal end (first negative direction side) of the base 100. The base 100 has a hollow structure, and an internal space 102 is formed.

[0026] As shown in Figures 4 to 7, the transport mechanism 200 includes a fork 210 as a holding part, a plate 220 as a support part, a first transport part 230, and a second transport part 240. The fork 210 moves in a first direction via the plate 220 and the first transport part 230, and also moves in a first direction via the second transport part 240. That is, the fork 210 moves in a first direction in two stages. The first transport part 230 is housed in the storage space 248 of the second table 241 of the second transport part 240. The second transport part 240 is provided on the base 100.

[0027] The fork 210 has a fork shape that branches from a base end to two tip ends. Three retaining pads 211 are provided on the upper surface of the fork 210, at the base end and at each of the two tip ends. The fork 210 holds the wafer W by using these three retaining pads 211 to suck the back surface of the wafer W.

[0028] The plate 220 is provided on the upper surface of the base end of the fork 210. The plate 220 extends to the storage space 248 of the second table 241 of the second conveying section 240 and is supported by the first table 231 of the first conveying section 230. The plate 220 also has a connecting portion 221 for connecting the suction line 250, which will be described later.

[0029] A support plate 222 is provided on the lower surface of the base end of the fork 210. The base end of the fork 210 is supported by being sandwiched between the plate 220 and the support plate 222.

[0030] As shown in Figure 8, the first transport unit 230 is a small actuator and has a first table 231 and a linear motor 232. The height H of the first transport unit 230, that is, the height H of the first table 231 and the linear motor 232, is sufficiently small. Therefore, the first table 231 and the linear motor 232 can be housed in the accommodation space 248 of the second table 241 of the second transport unit 240.

[0031] The first table 231 supports the lower surface of the base end of the plate 220. The first table 231 is supported by the linear motor 232.

[0032] The linear motor 232 includes a rail 233, a coil 234, and a permanent magnet 235. The rail 233 extends in a first direction. The coil 234 is provided on the upper surface of the rail 233. The permanent magnet 235 is provided on the lower surface of the first table 231. By passing an electric current through the coil 234, the coil 234 and the permanent magnet 235 repel each other, causing the permanent magnet 235 and the first table 231 to move in a first direction. At this time, the direction of the current flowing through the coil 234 is controlled to control whether the first table 231 moves in the positive direction of the first direction or in the negative direction of the first direction.

[0033] The first transport unit 230 moves the first table 231 in a first direction using a linear motor 232, thereby moving the fork 210 in a first direction via the plate 220.

[0034] As shown in Figures 2 to 7, the second transport unit 240 includes a second table 241, a support member 242, a drive motor 243, and a belt drive mechanism 244.

[0035] The second table 241 is provided above the base 100. Inside the second table 241, a storage space 248 is formed to accommodate the first transport unit 230. A cover 249 is provided on the upper surface of the second table 241 to cover the storage space 248. As shown in Figure 9, an opening 248a is formed on the side of the second table 241 on the fork 210 side, through which the storage space 248 is opened. The plate 220 extends through this opening 248a.

[0036] The support members 242, 242 support both ends of the second table 241. The support members 242, 242 are provided in pairs at both ends of the second table 241 in a second direction perpendicular to the first direction, and are attached to the side surface of the base 100.

[0037] The drive motor 243 and the belt drive mechanism 244 are provided in the internal space 102 of the base 100. The belt drive mechanism 244 includes a belt 245, a pulley 246, and a movable plate 247. The belt 245 is attached to the drive motor 243 and wound around the pulley 246. The movable plate 247 is attached to the belt 245 and also to the support member 242. The drive motor 243 drives the belt drive mechanism 244 to move the support member 242 along the base 100.

[0038] The drive motor 243 is not particularly limited as long as it is a motor of a different drive type than a linear motor. In this embodiment, the drive motor 243 is a belt drive motor, but it may also be, for example, a ball screw drive motor.

[0039] The second transport unit 240 moves the support member 242 and the second table 241 in the first direction using a drive motor 243, thereby moving the fork 210 in the first direction via the plate 220.

[0040] As shown in Figures 10 and 11, the transport device 50 has a suction line 250, an exhaust line 260, and a cable 270.

[0041] The suction line 250 is a line for sucking and holding the wafer W from the holding pad 211 of the fork 210. The suction line 250 has a configuration in which lines 250a to 250e are connected in sequence. Each connection point in lines 250a to 250e is provided with, for example, an O-ring (not shown).

[0042] Line 250a is connected to the holding pad 211 and provided inside the fork 210. Line 250b is connected to line 250a and provided inside the plate 220. Line 250c is connected to line 250b at the connection portion 221 of the plate 220 and provided in the accommodation space 248. Line 250c is, for example, a tube as a movable part and moves as the plate 220 moves in the first direction. Line 250d is connected to line 250c and provided inside the second table 241. Line 250e is connected to line 250d and provided inside the support member 242. Line 250e is connected to a suction port. The suction port may be an ejector provided in the internal space 102 of the base 100, or a connection port connected to a suction source (for example, a vacuum pump) outside the base 100.

[0043] The transfer device 50 sucks and holds the wafer W from the holding pad 211 via lines 250a to 250e.

[0044] The exhaust line 260 is a line for exhausting the atmosphere in the accommodation space 248 of the second table 241. The exhaust line 260 has a configuration in which a line 260a and a line 260b are connected. An O-ring (not shown) is provided, for example, at the connection portion between the line 260a and the line 260b.

[0045] Line 260a is connected to the accommodation space 248 and provided inside the second table 241. Line 260b is connected to line 260a and provided inside the support member 242. Line 260b is connected to an exhaust port for sucking the atmosphere in the accommodation space 248 via the internal space 102 of the base 100.

[0046] The transfer device 50 exhausts the atmosphere in the accommodation space 248 from the opening 248a via the line 260a and the line 260b. At this time, particles generated in the accommodation space 248 due to dust generated from the linear motor 232 are also exhausted from the exhaust line 260.

[0047] The cable 270 is a wiring cable connected to the linear motor 232. The cable 270 has a configuration in which cables 270a to 270c are continuous.

[0048] Cable 270a is connected to the linear motor 232 and provided inside the accommodation space 248. Cable 270b is continuous with cable 270a and provided inside the second table 241. Cable 270c is continuous with cable 270b and provided on the outer surface of the support member 242. Cable 270c is connected to a power source (not shown) for supplying current to the linear motor 232 through a cable bear (registered trademark) (not shown) provided in the internal space 102 of the base 100.

[0049] As shown in FIGS. 4 to 7, the lower transfer mechanism 300 has the same configuration as the upper transfer mechanism 200. That is, each component member of the transfer mechanism 300 has the same configuration as the corresponding component member of the transfer mechanism 200.

[0050] The transfer mechanism 300 includes a fork 310 as a holding part, a plate 320 as a support part, a first transfer part 330, and a second transfer part 340. The fork 310 is moved in the first direction by the first transfer part 330 and the second transfer part 340 via the plate 320. The first transfer part 330 is accommodated in the accommodation space 348 of the second table 341 of the second transfer part 340. The second transfer part 340 is provided on the base 100.

[0051] The fork 310 has three holding pads 311 for sucking and holding the wafer W. The plate 320 is provided on the upper surface of the base end portion of the fork 310 and extends to the accommodation space 348 of the second table 341 of the second transfer part 340. The plate 320 has a connection part 321 for connecting the suction line 350. The base end portion of the fork 310 is sandwiched and supported by the plate 320 and the support plate 322.

[0052] As shown in FIG. 8, the first transfer part 330 includes a first table 331 and a linear motor 332. The linear motor 332 includes a rail 333, a coil �34, and a permanent magnet . The first transfer part 330 moves the first table 331 in the first direction by the linear motor 332, thereby moving the fork 310 in the first direction via the plate

[0051] .

[0053] As shown in Figures 2 to 7, the second transport unit 340 includes a second table 341, a support member 342, a drive motor 343, and a belt drive mechanism 344. The second table 341 is provided between the base 100 and the second table 241 of the second transport unit 240. The support member 342 supports the second table 341 and is attached to the side of the base 100. The drive motor 343 drives the belt drive mechanism 344 to move the support member 242 along the base 100. The belt drive mechanism 344 includes a belt 345, a pulley 346, and a moving plate 347. The second transport unit 340 moves the support member 342 and the second table 341 in a first direction by the drive motor 343, thereby moving the fork 310 in a first direction via the plate 320. Although the drive motor 343, belt drive mechanism 344, belt 345, pulley 346, and movable plate 347 are separate components from the drive motor 243, belt drive mechanism 244, belt 245, pulley 246, and movable plate 247, they are shown in parentheses in Figure 3.

[0054] A storage space 348 for accommodating the first transport unit 330 is formed inside the second table 341. A cover 349 covering the storage space 348 is provided on the upper surface of the second table 241. An opening 348a, into which the storage space 348 is opened, is formed on the side of the second table 341 on the fork 310 side.

[0055] As shown in Figures 10 to 11, the transport device 50 has a suction line 350, an exhaust line 360, and a cable 370.

[0056] The suction line 250 is a line for sucking and holding the wafer W from the holding pad 311 of the fork 310. The suction line 350 has a configuration in which lines 350a to 350e are connected in sequence.

[0057] The exhaust line 360 ​​is a line for discharging the atmosphere from the accommodation space 348 of the second table 341. The exhaust line 360 ​​has a configuration in which line 360a and line 360b are connected.

[0058] Cable 370 is a wiring cable connected to the linear motor 332. Cable 370 has a continuous configuration of cables 370a to 370c. Cable 370c extends vertically downward from cable 370b and is connected to a power supply (not shown) via a cable carrier (not shown) provided in the internal space 102 of the base 100.

[0059] Conventionally, when moving an object, such as a wafer, in one direction using two-tiered moving mechanisms, such as the transport robot disclosed in Patent Document 1, ball screw drives were used for these moving mechanisms. In such cases, the height of the two-tiered moving mechanisms is required, necessitating vertical space for installing the transport robot. Furthermore, the weight of the transport robot increases due to the presence of two-tiered moving mechanisms.

[0060] In this respect, according to this embodiment, in the conveying mechanism 200, the first conveying section 230 moves the fork 210 in a first direction by a linear motor 232, and the second conveying section 240 moves the fork 210 in a first direction by a drive motor 243. Furthermore, by using the linear motor 232, the height H of the first conveying section 230 can be reduced. Therefore, the conveying mechanism 200 can be made smaller by keeping the vertical space required for installing the conveying mechanism 200 small. In addition, because the conveying mechanism 200 can be made smaller, its weight can also be kept small.

[0061] Furthermore, since the first transport unit 230 is housed in the storage space 248 of the second table 241, the height H of the first transport unit 230 can be further reduced. As a result, the transport mechanism 200 can be made even smaller.

[0062] Here, we will describe a case where the transport mechanism 200 is not provided with the first transport section 230 of this embodiment, and the fork 210 is moved in the first direction by the second transport section 240 alone. In this case, as shown by the dotted line in Figure 12, the access distance of the transport mechanism 200 to the stage 71 of the processing apparatus 70 is the stroke S of the fork 210 in the first direction by the second transport section 240. The offset R in the figure indicates the distance between the pivot center C of the transport mechanism 200 and the center of the wafer W held by the fork 210.

[0063] In contrast, according to this embodiment, the transport mechanism 200 is provided with a first transport section 230, which allows for a larger stroke of the fork 210 in the first direction. In this case, as shown by the solid line in Figure 12, the access distance of the transport mechanism 200 to the processing device 70 is the sum of the stroke S of the fork 210 in the first direction by the second transport section 240 and the stroke T of the fork 210 in the first direction by the first transport section 230. Therefore, the access distance of the transport mechanism 200 can be increased, and the accessible range of the transport mechanism 200 is expanded, thus reducing the space required for the transport mechanism 200. As a result, the footprint (occupied area) of the processing system 1 can be kept small. Furthermore, the degree of freedom in the layout of the processing system 1 can also be improved. Note that the offset R and strokes S and T in the figure are conceptual and do not correspond to actual lengths.

[0064] Furthermore, in order to further increase the stroke T of the fork 210 in the first direction by the first conveying unit 230, multiple first conveying units 230 may be arranged in a line in the first direction.

[0065] As described above, according to this embodiment, the stroke of the fork 210 in the first direction by the conveying mechanism 200 can be increased while the conveying mechanism 200 can be made smaller. In addition, since the linear motor 232 used in the first conveying section 230 has high conveying accuracy, the conveying accuracy of the conveying mechanism 200 can be improved.

[0066] Furthermore, in the conventional transport robot disclosed in Patent Document 1, the internal space of the two-stage moving mechanism becomes larger, meaning that the space for exhausting the internal space becomes larger. Also, a gap is formed between the two-stage moving mechanism. As a result, exhaust loss occurs, making it difficult to secure an exhaust route for exhausting the internal space of the two-stage moving mechanism.

[0067] In this regard, according to this embodiment, the second table 241 of the first transport unit 230 is provided with a cover 249 that covers the containment space 248, and the containment space 248 is provided with an exhaust line 260. Therefore, the inside of the containment space 248 can be properly exhausted by the exhaust line 260. In addition, since the containment space 248 is covered with the cover 249, it is possible to suppress the scattering of particles to the outside of the containment space 248, and the particles can be discharged from the exhaust line 260.

[0068] Furthermore, the suction line 250 of the wafer W is connected to the suction port from inside the fork 210, through inside the plate 220, the storage space 248, the second table 241, and the support member 242. This allows for adequate installation space for the suction line 250, contributing to space saving. In addition, since the line 250c is configured to be movable in the storage space 248, it does not obstruct the movement of the plate 220 in the first direction.

[0069] Furthermore, the exhaust line 260 of the storage space 248 is connected from the storage space 248 to the internal space 102 of the base 100 via the inside of the second table 241 and the inside of the support member 242. This ensures that the installation space for the exhaust line 260 is adequately secured, contributing to space saving.

[0070] Furthermore, the cable 270 of the linear motor 232 is connected to the power supply in the internal space 102 of the base 100 via the inside of the housing space 248, the inside of the second table 241, and the outer surface of the support member 242. This ensures that adequate space is available for the cable 270, contributing to space saving.

[0071] Although the effects of the upper transport mechanism 200 in this embodiment have been described above, the lower transport mechanism 300 can also enjoy similar effects.

[0072] Next, other embodiments will be described. The upper transport mechanism 200 will be described below, but the same applies to the lower transport mechanism 300.

[0073] In the above embodiment, the wafer W is held on the upper surface by the fork 210 in the transport mechanism 200, but instead of the fork 210 as the holding part, a hand (not shown) that holds the wafer W on the lower surface may be used. In this case, the cover 249 is also provided on the lower surface of the second table 241.

[0074] In the above embodiment, the second table 241 is moved in the first direction by the drive motor 243 in the second transport unit 240, and the first table 231 is moved in the first direction by the linear motor 232 as shown in Figure 13(a). However, the direction of movement of the first table 231 is not limited to this. For example, as shown in Figure 13(b), the first table 231 may move in a second direction perpendicular to the first direction. In this case, the rail 233 extends in the second direction, causing the first table 231 to move in the second direction. Alternatively, for example, as shown in Figure 13(c), the transport mechanism 200 may have two first transport units 230a and 230b, with the first table 231a moving in the first direction and the first table 231b moving in the second direction.

[0075] As shown in Figures 13(b) and 13(c), when the first table 231 is moved in the second direction, the transport device 50 transports the wafer W in the first direction by the second transport unit 240 and also transports the wafer W in the second direction by the first transport unit 230, as shown in Figure 14 (arrows in Figure 14). This expands the accessible range of the transport mechanism 200 to the stage 71 of the processing device 70 in the second direction, improving the degree of freedom of access for the transport mechanism 200.

[0076] Furthermore, as shown in Figure 13(c), when the first table 231a is moved in the first direction and the first table 231b is moved in the second direction, the fork 210 moves in two stages in the first direction by the first transport unit 230a and the second transport unit 240, and also moves in the second direction by the first transport unit 230b. This expands the range of access for the transport mechanism 200 to the stage 71 of the processing device 70, thus reducing the space required for the transport mechanism 200. As a result, the footprint of the processing system 1 can be kept small.

[0077] In the processing system 1 of the above embodiment, the transport device 50 transported a wafer W, but the object to be transported is not limited to wafer W. For example, the object may be a known tape frame. A tape frame has a frame and a tape. The frame has an annular shape. The tape is fixed to the back surface of the frame and holds a plurality of dies D or wafer W. Since this tape frame is different in size from the wafer W, it is difficult to hold it with the fork 210 described above. Also, the shape of the wafer W is not limited to a circle and may be rectangular, and in such cases it is also difficult to hold it with the fork 210 described above.

[0078] Therefore, as shown in Figure 15, the fork 210 may have a divided configuration. The fork 210 as a holding part includes a fork 210a as a first holding part and a fork 210b as a second holding part, which are divided in a second direction. Two holding pads 211a and 211b are provided on the upper surfaces of the forks 210a and 210b, respectively, and the fork 210 holds the wafer W by sucking it with these four holding pads 211a and 211b.

[0079] Plate 220 also includes plates 220a and 220b, which are divided in the second direction. Plates 220a and 220b are provided on the upper surfaces of the base ends of forks 210a and 210b, respectively. These forks 210a and 210b move relative to each other in the second direction.

[0080] For example, as shown in Figure 15(a), the first transport unit 230 may have two first tables 231a, 231b and two linear motors 232a, 232b. The first tables 231a, 231b each support the lower surfaces of the base ends of plates 220a, 220b. Linear motor 232a, as the first linear motor, moves the fork 210a in a second direction via the first table 231a and plate 220a. Linear motor 232b, as the second linear motor, moves the fork 210b in a second direction via the first table 231b and plate 220b.

[0081] Alternatively, as shown in Figure 15(b), the first transport unit 230 may have one first table 231 and one linear motor 232. The first table 231 supports, for example, the lower surface of the base end of the plate 220b. The linear motor 232 moves the fork 210b in a second direction via the first table 231 and the plate 220. The first transport unit 230 may also move the fork 210a in a second direction.

[0082] In such cases, for example, when the fork 210 holds a tape frame as shown in Figure 16(a), the linear motor 232 is controlled to widen the distance between the forks 210a and 210b. Also, when the fork 210 holds a wafer W as shown in Figure 16(b), the linear motor 232 is controlled to narrow the distance between the forks 210a and 210b. In this way, by moving the forks 210a and 210 relatively in a second direction according to the shape of the object held by the fork 210, the shape of the fork 210 can be optimized.

[0083] Furthermore, since only one suction line is needed between the tape frame and the wafer W on the fork 210, the device configuration does not become complicated.

[0084] Furthermore, since the transport device 50 has two forks 210, it can load and unload two tape frames at once, and can also load and unload two wafers W at once. This makes it possible to suppress a decrease in processing throughput in the processing system 1.

[0085] The transport device 50 of the above embodiment may have a position sensor 400 as a position detection unit that detects the position of the wafer W held by the fork 210, as shown in Figure 17. For example, a linear image sensor (LIS) is used for the position sensor 400. The position sensors 400 are provided at four locations above the fork 210. Below each position sensor 400, a light-emitting unit (not shown) is provided that emits light, such as LED light, toward the position sensor 400. The pair of position sensors 400 and light-emitting units are arranged so that the optical axis of the LED light passes through the periphery of the wafer W.

[0086] Furthermore, in the transport device 50 in which the position sensor 400 is provided, as shown in Figure 15, the fork 210 is divided into forks 210a and 210b, and these forks 210a and 210b move relative to each other in a second direction. In this embodiment, as shown in Figure 15(b), the first transport unit 230 has a linear motor 232 that moves the fork 210b in a second direction.

[0087] In this case, with the wafer W held by the fork 210, LED light is emitted from each light-emitting unit toward the position sensor 400. Each position sensor 400 detects whether or not it has received the LED light. The detection result of each position sensor 400 is output to, for example, the control device 80.

[0088] The control device 80 detects the position of the wafer W relative to the fork 210 based on the detection results of the four position sensors 400 and calculates the center position of the wafer W. The control device 80 also calculates the amount of deviation of the center position of the wafer W relative to the center position of the stage 71 of the processing device 70. Then, based on the amount of deviation of the center position of the wafer W, the control device 80 controls the linear motor 232 to correct the center position of the wafer W relative to the center position of the stage 71 and moves the fork 210b in the second direction.

[0089] Specifically, as shown in Figure 18(a), when moving the center position of the wafer W relative to the fork 210 in a second direction (the positive direction in the illustrated example), the suction of the retaining pad 211a of the fork 210a is turned off, and the suction of the retaining pad 211b of the fork 210b is turned on, and the fork 210b is moved to the positive direction of the second direction. As a result, the wafer W moves to the positive direction of the second direction along with the fork 210b, and the center position of the wafer W relative to the fork 210 moves to the positive direction of the second direction.

[0090] In such cases, even if the center position of the wafer W is misaligned with the fork 210, the center position of the wafer W with respect to the fork 210 can be corrected, and the center position of the wafer W can be aligned with the center position of the stage 71 of the processing apparatus 70. Furthermore, if the amount of misalignment of the center position of the wafer W exceeds a threshold, there is a possibility that the wafer W may interfere with the frame of the chamber's loading / unloading port or the walls that make up the chamber, but interference between the wafer W and the frame of the chamber's loading / unloading port or the walls that make up the chamber during wafer transport can be prevented.

[0091] Furthermore, as shown in Figure 18(b), when moving the position of the fork 210 relative to the wafer W in the second direction (negative direction in the illustrated example), the suction of the holding pad 211a of the fork 210a is turned on, and the suction of the holding pad 211b of the fork 210b is turned off, and the fork 210b is moved to the negative direction of the second direction. In this case, the wafer W held by the fork 210a does not move, so the position of the fork 210 relative to the wafer W moves to the negative direction of the second direction.

[0092] Here, if the center position of the wafer W placed on the stage 71 of the processing apparatus 70 is misaligned with the center position of the stage 71, or if the center position of the wafer W is misaligned with the fork 210, correcting the access position of the fork 210 to the stage 71 based on the amount of misalignment of the center position of the wafer W results in a state where the fork 210, its center position, and the center position of the stage 71 are misaligned.

[0093] If the amount of deviation in the center position of the wafer W exceeds a threshold, the fork 210 may interfere with the frame of the chamber's input / output or the walls that make up the chamber when the fork 210 is loading or unloading the wafer W into or out of the chamber of the processing device 70.

[0094] In this respect, according to this embodiment, by moving the forks 210a and 210b relative to each other in the second direction, the center position of the forks 210 with respect to the center position of the stage 71 can be corrected, so that the forks 210 do not interfere with the frame of the loading / unloading port of the chamber of the processing device 70 or the walls that make up the chamber.

[0095] In the above embodiment, as shown in Figure 15(b), the first transport unit 230 has a linear motor 232 that moves the fork 210b in the second direction. However, the first transport unit 230 shown in Figure 15(a) may also be used. That is, the first transport unit 230 may have linear motors 232a and 232b that move the forks 210a and 210b individually in the second direction.

[0096] The embodiments disclosed herein should be considered in all respects as illustrative and not restrictive. The embodiments described above may be omitted, replaced, or modified in various ways without departing from the scope and spirit of the appended claims. For example, the constituent elements of the embodiments described above can be combined in any way. Such any combination will naturally yield the functions and effects of each constituent element in the combination, as well as other functions and effects that will be apparent to those skilled in the art from the description herein.

[0097] Furthermore, the effects described herein are merely descriptive or illustrative and not limiting. In other words, the technology relating to this disclosure may produce other effects that will be apparent to those skilled in the art from the description herein, in addition to or in lieu of the effects described herein.

[0098] 20, 50 Conveyor device 210, 310 Fork 220, 320 Plate 231, 331 First table 232, 332 Linear motor 241, 341 Second table 243, 343 Drive motor W Wafer

Claims

1. A conveying device for transporting an object, comprising: a holding section for holding the object; a support section for supporting the holding section; a first table provided on the support section; a linear motor for moving the first table; a second table for supporting the linear motor; and a drive motor for moving the second table using a different drive mode than the linear motor.

2. The conveying device according to claim 1, wherein the linear motor is provided in a storage space formed inside the second table.

3. The transport device according to claim 2, wherein the second table is provided with a cover that covers the storage space.

4. The conveying device according to claim 3, wherein the holding portion is provided on the upper or lower surface of the second table via the support portion, the first table, and the linear motor, and the cover is provided on the upper or lower surface of the second table.

5. The conveying device according to claim 2, wherein the holding portion has a suction line for sucking and holding the object, and the suction line is provided inside the holding portion, inside the support portion, inside the storage space and inside the second table.

6. The conveying device according to claim 5, wherein the suction line has a movable part in the containment space.

7. The conveying device according to claim 2, further comprising an exhaust line for discharging the atmosphere of the containment space, wherein the exhaust line is provided inside the second table.

8. The conveying device according to claim 2, further comprising a cable connected to the linear motor, wherein the cable is provided inside the storage space and the second table.

9. The conveying device according to claim 1, comprising a base on which the drive motor is mounted, wherein the drive motor moves the second table horizontally in a first direction relative to the base, and the linear motor moves the holding portion horizontally in the first direction.

10. The conveying device according to claim 1, comprising a base on which the drive motor is mounted, wherein the drive motor moves the second table horizontally in a first direction relative to the base, and the linear motor moves the holding portion horizontally in a second direction perpendicular to the first direction.

11. The conveying device according to claim 10, wherein the holding portion includes a first holding portion and a second holding portion divided in the second direction, and the linear motor moves at least one of the first holding portion and the second holding portion horizontally in the second direction.

12. The conveying device according to claim 11, wherein the linear motor includes a first linear motor for moving the first holding portion in the second direction and a second linear motor for moving the second holding portion in the second direction.

13. The conveying device according to claim 11, further comprising a control unit that controls the linear motor to move at least one of the first holding unit and the second holding unit horizontally in the second direction according to the shape of the object.

14. The conveying device according to claim 11, comprising: a position detection unit for detecting the position of the object held in the holding unit; and a control unit that controls the linear motor based on the detection result of the position detection unit to move at least one of the first holding unit and the second holding unit horizontally in the second direction.

15. The conveying device according to claim 14, wherein the control unit horizontally moves at least one of the first holding unit and the second holding unit in the second direction while the object is being held by either the first holding unit or the second holding unit.

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