Information processing method, computer program, information processing device, and information processing system

Abstract

Provided are an information processing method, a computer program, an information processing device, and an information processing system capable of assisting a user who analyzes log data related to substrate processing.　In an information processing method according to an embodiment of the present invention, an information processing device: acquires analysis target data from a database in which log data related to substrate processing performed by a substrate processing device is stored; receives selection of an analysis program to be used for analysis from among a plurality of analysis programs; and outputs an analysis result obtained by analyzing the acquired data by using the analysis program, the selection of which has been received.

Description

Information Processing Method, Computer Program, Information Processing Apparatus, and Information Processing System

[0001] The present disclosure relates to an information processing method, a computer program, an information processing apparatus, and an information processing system.

[0002] In Patent Document 1, a display device that displays information related to processing in a substrate processing apparatus that executes predetermined substrate processing on a plurality of substrates on a display screen has been proposed. This display device can display, on the display screen, an image based on first imaging data obtained by imaging in the substrate processing apparatus in the past for a substrate to be displayed among a plurality of substrates in response to an instruction from a user, and can also display, on the display screen, an image based on second imaging data obtained by imaging in the substrate processing apparatus in the past for the substrate to be displayed in response to an instruction from the user. The display control unit is provided. The first imaging data is data obtained by imaging at a timing different from that of the second imaging data, or data obtained by imaging an imaging range different from that of the second imaging data.

[0003] Japanese Unexamined Patent Application Publication No. 2022-97180 [[ID=IO]]

[0004] The present disclosure provides an information processing method, a computer program, an information processing apparatus, and an information processing system that can be expected to assist a user in analyzing log data related to substrate processing.

[0005] An information processing method according to an embodiment includes an information processing apparatus obtaining analysis target data from a database that stores log data related to substrate processing performed by a substrate processing apparatus, receiving a selection of an analysis program to be used for analysis from a plurality of analysis programs, and outputting an analysis result obtained by performing analysis on the obtained data using the selected analysis program.

[0006] According to the present disclosure, it can be expected to assist a user in analyzing log data related to substrate processing.

[0007] This is a schematic diagram showing an example configuration of the information processing system according to this embodiment. This is a schematic diagram for explaining an example of log data obtained from the substrate processing apparatus. This is a block diagram showing an example configuration of the first analysis server device according to this embodiment. This is a block diagram showing an example configuration of the second analysis server device according to this embodiment. This is a block diagram showing an example configuration of the terminal device according to this embodiment. This is a flowchart showing an example of the procedure for analysis processing performed by the first analysis server device according to this embodiment. This is a schematic diagram showing an example of the selection screen for the analysis program. This is a schematic diagram showing an example of the display of the coating unevenness analysis results. This is a schematic diagram showing an example of the film thickness analysis results. This is a schematic diagram showing an example of the film thickness analysis results. This is a schematic diagram showing an example of the defect factor analysis results. This is a schematic plan view showing an example configuration of the substrate processing apparatus according to Embodiment 2. This is a schematic diagram for explaining the overview of substrate transport performed by the substrate processing apparatus according to Embodiment 2. This is a schematic diagram showing an example of the setting screen for the atmosphere influence adjustment function displayed by the substrate processing apparatus according to Embodiment 2. This is a schematic diagram showing an example of the setting screen for the marking function displayed by the substrate processing apparatus according to Embodiment 2. This is a schematic diagram showing an example of the information display screen for MAC control by the information processing system according to Embodiment 2.

[0008] Specific examples of information processing systems according to the embodiments of this disclosure will be described below with reference to the drawings. However, this disclosure is not limited to these examples and is intended to include all changes within the meaning and scope of the claims as indicated by the claims.

[0009] <System Overview> Figure 1 is a schematic diagram showing an example configuration of an information processing system according to this embodiment. The information processing system according to this embodiment is composed of a first analysis server device 1, a second analysis server device 2, a plurality of substrate processing devices 3, a manufacturing management server device 4, a terminal device 5, a log DB (database) 7, an analysis DB 8, and a manufacturing management DB 9, etc. Of these, the first analysis server device 1, the plurality of substrate processing devices 3, the manufacturing management server device 4, the log DB 7, and the manufacturing management DB 9, etc. are installed in a substrate processing plant 101. The second analysis server device 2 and the analysis DB 8, etc. are installed in a facility 102 different from the substrate processing plant 101, for example, a company that manufactures, sells, and maintains the substrate processing devices 3. The substrate processing plant 101 and facility 102 may be located in geographically distant locations, but the first analysis server device 1 and the second analysis server device 2 are connected so as to be able to communicate via a network such as the Internet.

[0010] Multiple substrate processing devices 3 are installed in the substrate processing plant 101. These devices perform various substrate processing operations on semiconductor substrates (wafers), such as CVD (Chemical Vapor Deposition), sputtering, or etching. The multiple substrate processing devices 3 are connected to the first analysis server device 1 via a wired or wireless network, such as a LAN (Local Area Network). Each substrate processing device 3 is equipped with various sensors to measure temperature, pressure, gas flow rate, etc., associated with the substrate processing. Each substrate processing device 3 repeatedly performs measurements using these sensors while performing substrate processing and transmits the resulting time-series sensor measurement data to the first analysis server device 1.

[0011] The first analysis server device 1 stores sensor measurement data obtained from multiple substrate processing devices 3 installed in the substrate processing plant 101 as log data in the log DB 7, along with information such as the identification information of the substrate processing device 3, the identification information of the substrate that was processed, and the date and time the substrate processing was performed. Furthermore, the first analysis server device 1 according to this embodiment provides an environment for the user to perform analysis of the substrate processing using the log data stored in the log DB 7.

[0012] The manufacturing management server device 4 acquires information related to substrate processing performed by the substrate processing device 3 that cannot be measured by sensors or other devices mounted on the substrate processing device 3, and stores it in the manufacturing management DB 9. The information that the manufacturing management server device 4 stores in the manufacturing management DB 9 may include information on the characteristics of the substrate processed by the substrate processing device 3, measured by measuring devices other than the substrate processing device 3. This information may include, for example, measured values ​​of the coating film thickness of the substrate, measured values ​​of the development line width, the results of defect inspection, or the results of judgment on whether or not there are coating irregularities.

[0013] Furthermore, in this embodiment, the information stored in the manufacturing management DB 9 by the manufacturing management server device 4 may include various types of information in addition to measurement results from measuring devices, etc., such as information created by users, such as the administrator of the substrate processing plant 101, or information obtained from outside the substrate processing plant 101 via the Internet. The information stored in the manufacturing management DB 9 may include, for example, information related to events that occurred at the substrate processing plant 101 (construction, power outage, or action taken on equipment, etc.), information related to chemicals used in the substrate processing device 3 (chemical name, viscosity, and manufacturing date, etc.), large amounts of data obtained by the user from the substrate processing device 3 via a recording medium, etc., because it is difficult to transmit to the first analysis server device 1, the name of the person who performs the operation or inspection of the substrate processing device 3, or various types of data such as weather information such as temperature and atmospheric pressure provided by public organizations such as the Japan Meteorological Agency.

[0014] The manufacturing management server device 4 is connected to the first analysis server device 1 via a wired or wireless network such as a LAN. When performing analysis processing related to substrate processing, the first analysis server device 1 can perform analysis processing by acquiring information stored in the manufacturing management DB 9 via the manufacturing management server device 4, and by combining log data stored in the log DB 7 with various data stored in the manufacturing management DB 9.

[0015] The terminal device 5 is a device that serves as an interface between the information processing system according to this embodiment and the user, and can be a portable general-purpose computer such as a notebook (laptop) personal computer, a smartphone, or a tablet terminal device. However, the terminal device 5 is not limited to portable devices and may be a stationary computer. Users such as the administrator of the circuit board processing plant 101 or employees of the manufacturer and seller of the circuit board processing device 3 can access the first analysis server device 1 via a wired or wireless network using the terminal device 5, and can perform circuit board processing analysis using log data stored in the log DB 7, etc., by utilizing the circuit board processing analysis environment provided by the first analysis server device 1.

[0016] The second analysis server device 2, located in facility 102 separate from the substrate processing plant 101, can communicate with the first analysis server device 1 located in the substrate processing plant 101 via a network such as the Internet. The second analysis server device 2 acquires log data stored in log DB 7 and various data stored in manufacturing management DB 9 through communication with the first analysis server device 1, and stores them in its own analysis DB 8. The second analysis server device 2 communicates with the first analysis server device 1 at predetermined intervals, such as once an hour or once a day, and acquires data stored in log DB 7 and manufacturing management DB 9 since the previous communication and stores it in analysis DB 8. However, the data that the second analysis server device 2 can acquire from the first analysis server device 1 may be limited to data that the substrate processing plant 101 has permitted to be taken outside based on its confidentiality.

[0017] Furthermore, the second analysis server device 2 according to this embodiment, like the first analysis server device 1, provides an environment for users to perform analysis of substrate processing using data stored in the analysis DB 8. At facility 102, users can access the second analysis server device 2 using a terminal device 5, and use the same analysis environment provided by the second analysis server device 2 as that of the first analysis server device 1 to perform analysis of substrate processing using data stored in the analysis DB 8. This allows users to, for example, use a portable terminal device 5 to access the first analysis server device 1 at the substrate processing plant 101 to perform analysis of substrate processing, and to access the second analysis server device 2 at facility 102, which is different from the substrate processing plant 101, to perform similar analysis.

[0018] Figure 2 is a schematic diagram illustrating an example of log data obtained from the substrate processing apparatus 3. The substrate processing apparatus 3 according to this embodiment performs substrate processing that includes multiple steps, such as a loading step, a coating step, a heating step before exposure, an exposure step, a heating step after exposure, and a developing step. These multiple steps may be performed by one substrate processing apparatus 3, or they may be divided and performed by multiple substrate processing apparatuses 3.

[0019] Before the loading process, in which the substrate to be processed is loaded into the liquid processing chamber of the substrate processing apparatus 3, the substrate processing apparatus 3 performs a hardware health check, and the data of this check is stored as log data in the log DB 7. The hardware health check checks the position of components in the liquid processing chamber, for example, the correct position of the liquid receiving cups placed around the substrate. For the health check of the liquid receiving cups, for example, a measuring jig is used in which an optical sensor for the liquid receiving cups is placed on a base material with the same shape as the substrate, and the substrate processing apparatus 3 determines whether the position of the liquid receiving cups measured by the optical sensor is correct or incorrect. As a result of the health check, the log DB 7 stores information such as the measured position of the liquid receiving cups or whether the position is correct or incorrect, associated with the identification information of the substrate processing apparatus 3, as log data.

[0020] In the loading process, after the target substrate is loaded into the liquid processing space, a camera or the like installed in the substrate processing apparatus 3 takes an image of the substrate's surface before processing. The captured image of the substrate can be used, for example, to detect foreign matter or defects on the substrate surface, or to estimate the substrate's film thickness or line width. The log DB 7 stores the image data of the substrate captured by the camera or the like as log data, for example, associated with identification information attached to the substrate to be processed.

[0021] During the coating process, foreign matter is detected in the liquid supply pipe of the substrate processing apparatus 3, and the data of this foreign matter detection is stored as log data in log DB 7. For example, foreign matter detection is performed using an optical foreign matter detection unit in the liquid supply pipe, such as the upstream side of the resist nozzle in the liquid processing apparatus of the substrate processing apparatus 3, and the upstream side of the supply system for solvent or water. Log DB 7 stores time-series data as log data, which is arranged chronologically and corresponds to, for example, identification information attached to the substrate to be processed, and contains information on the detection results such as the number and size of detected foreign matter.

[0022] Furthermore, during the coating process, the nozzle discharge state of the substrate processing apparatus 3 and the state on the substrate are monitored, and the data from these monitoring results are stored as log data in the log DB 7. For example, these monitoring operations are performed using a camera that images the nozzle inside the liquid processing apparatus from the side and a camera that images the processing area from an oblique angle above. In the log DB 7, images (moving images) of the nozzle tip and inside, and images (moving images) of the liquid processing state on the substrate, captured by these cameras, are stored as log data, for example, associated with identification information attached to the substrate to be processed.

[0023] Furthermore, based on the processing conditions of the coating and heating processes, a film thickness prediction is performed based on a pre-generated prediction model, and the data of this prediction result is stored as log data in log DB7. Various models can be used for the prediction model, such as physical models or machine learning models. The prediction model can be created in advance using training data that associates the processing conditions of the coating and heating processes with the measured film thickness of the substrate obtained by processing the substrate under these conditions, for example, for substrate processing performed in the past. In log DB7, data such as the processing conditions of the coating and heating processes and the predicted film thickness value by the prediction model are stored as log data, for example, associated with the identification information attached to the substrate to be processed.

[0024] Between the heating process and the exposure process, a camera or the like installed in the substrate processing apparatus 3 takes an image of the substrate after the coating and heating processes have been completed. This post-coating surface imaging can be performed using the same camera as the pre-processing surface imaging described above. The log DB 7 stores image data of the substrate captured by the camera or the like as log data, for example, associated with identification information attached to the substrate to be processed.

[0025] During the developing process, the nozzle discharge state of the substrate processing apparatus 3 and the state on the substrate are monitored, and the data from these monitoring results are stored as log data in the log DB 7. These monitoring can be performed using the same cameras as those used in the coating process described above. The log DB 7 stores, for example, images (moving images) of the nozzle tip and interior, and images (moving images) of the liquid processing state on the substrate, captured by these cameras, as log data, corresponding to identification information attached to the substrate to be processed.

[0026] After the development process is completed, the developed surface of the substrate is imaged using a camera or the like provided in the substrate processing apparatus 3. This post-development surface imaging can be performed using the same camera as the pre-processing surface imaging and post-coating surface imaging described above. The log DB 7 stores image data of the substrate captured by the camera or the like as log data, for example, associated with identification information attached to the substrate to be processed.

[0027] Furthermore, after the development process is complete, a defect inspection is performed on the developed substrate at multiple fixed points, and the data from this inspection is stored as log data in log DB7. In this defect inspection, instead of imaging the entire surface of the substrate using a camera or the like, the presence or absence of defects is inspected at several representative points on the substrate surface using probe operations. Log DB7 stores, for example, the locations of the multiple representative points that were inspected, the presence or absence of defects at each representative point, and information such as film thickness, as log data, corresponding to the identification information attached to the substrate being processed.

[0028] Furthermore, when transporting substrates to be processed between processes, the substrate processing apparatus 3 performs abnormality detection and prediction of the transport drive unit for each transport area. For example, based on time-series data of repeatedly measured position or torque of a linear motion mechanism or a rotary drive unit such as a motor, abnormality detection of the transport drive unit can be performed based on the difference between the measured value and a reference value, or the way in which the measured value changes. Alternatively, for example, a pre-generated prediction model can be used to predict whether an abnormality has occurred or when it will occur, based on the time-series data of the measured position or torque. The log DB 7 stores, for example, time-series data of the position or torque of the transport drive unit, and information on the results of abnormality detection or prediction based on this time-series data, as log data, associated with identification information attached to the substrate to be processed.

[0029] Note that the log data shown in Figure 2 is just an example and is not limited to this. Log DB7 does not need to store all of the information shown in Figure 2; it may store various other types of information different from that shown in Figure 2.

[0030] <Device Configuration> Figure 3 is a block diagram showing an example configuration of the first analysis server device 1 according to this embodiment. The first analysis server device 1 according to this embodiment can be realized, for example, by installing a predetermined application program on an information processing device such as a general-purpose server computer. The first analysis server device 1 according to this embodiment is configured to include a processing unit 11, a storage unit 12, a communication unit 13, etc.

[0031] The processing unit 11 is composed of a CPU (Central Processing Unit), MPU (Micro-Processing Unit), GPU (Graphics Processing Unit), or quantum processor, as well as ROM (Read Only Memory) and RAM (Random Access Memory). The processing unit 11 reads and executes the program 12a stored in the storage unit 12, thereby performing various processes such as acquiring log data from the substrate processing device 3 and storing it in the log DB 7, and analyzing the substrate processing based on the log data.

[0032] The storage unit 12 is configured using a large-capacity storage device such as a hard disk or an SSD (Solid State Drive). The storage unit 12 stores various programs executed by the processing unit 11, and various data necessary for the processing of the processing unit 11. In this embodiment, the storage unit 12 stores the program 12a executed by the processing unit 11. The storage unit 12 is also provided with an analysis program storage unit 12b that stores an analysis program for performing analysis processing based on log data, and the log DB 7 described above that stores log data.

[0033] In this embodiment, the program (computer program, program product) 12a is provided in a form recorded on a recording medium 99 such as a memory card or optical disc, and the first analysis server device 1 reads the program 12a from the recording medium 99 and stores it in the storage unit 12. However, the program 12a may be written to the storage unit 12, for example, during the manufacturing stage of the first analysis server device 1. Alternatively, the program 12a may be obtained by the first analysis server device 1 via communication from a remote server device or the like that distributes it. For example, the program 12a may be read from the recording medium 99 by a writing device and written to the storage unit 12 of the first analysis server device 1. The program 12a may be provided in a form distributed via a network, or it may be provided in a form recorded on the recording medium 99.

[0034] The analysis program storage unit 12b stores analysis programs for performing various analysis processes using log data stored in the log DB 7. The analysis programs stored in the analysis program storage unit 12b may include, for example, analysis programs pre-prepared by this system and analysis programs created by the user. In the information processing system according to this embodiment, for example, the user can create their own analysis program by programming on the terminal device 5. By sending the analysis program created by the user on the terminal device 5 to the first analysis server device 1 and storing it in the analysis program storage unit 12b, the first analysis server device 1 can execute the user's own analysis program and perform analysis processing based on the log data stored in the log DB 7.

[0035] Log DB 7 is a database that stores and accumulates multiple log data acquired from multiple substrate processing devices 3 connected to the first analysis server device 1. The first analysis server device 1 acquires log data from substrate processing devices 3 that perform or have performed substrate processing, and stores the acquired log data in Log DB 7, adding information such as the identification information of the source substrate processing device 3 and the date and time the log data was acquired, as needed.

[0036] The communication unit 13 exchanges data with other devices via a wired or wireless network N. In this embodiment, the communication unit 13 communicates with a second analysis server device 2 located in a facility 102 different from the substrate processing plant 101, via a network N such as the Internet. The communication unit 13 also communicates with multiple substrate processing devices 3, a manufacturing management server device 4, and terminal devices 5, etc., via a network N such as a LAN located within the substrate processing plant 101. The communication unit 13 transmits data received from the processing unit to other devices and provides data received from other devices to the processing unit 11.

[0037] The storage unit 12 may be an external storage device connected to the first analysis server device 1. The first analysis server device 1 may be a multicomputer comprising multiple computers, or it may be a virtual machine virtually constructed by software. Furthermore, the first analysis server device 1 is not limited to the above configuration and may include, for example, a reading unit that reads information stored in a portable storage medium, an input unit that accepts operation input, or a display unit that displays images.

[0038] Furthermore, in the first analysis server device 1 according to this embodiment, the processing unit 11 reads and executes the program 12a stored in the storage unit 12, thereby realizing the data acquisition unit 11a, program selection unit 11b, analysis processing unit 11c, and analysis result output unit 11d, etc., as software-based functional units in the processing unit 11. In this figure, the functional units of the processing unit 11 that perform processing related to the analysis of substrate processing performed by the substrate processing device 3 are shown, and functional units related to other processing are omitted from the illustration.

[0039] The data acquisition unit 11a performs the process of acquiring log data from one or more substrate processing devices 3 connected via a network N such as a LAN provided in the substrate processing plant 101 and storing it in the log DB 7 by communicating with them via the communication unit 13. In this embodiment, the substrate processing device 3 transmits various measurement data measured by its own sensors, etc., as log data to the first analysis server device 1 while performing substrate processing, and the data acquisition unit 11a of the first analysis server device 1 acquires the log data by receiving the data transmitted from the substrate processing device 3 that is performing substrate processing. However, for example, the substrate processing device 3 may store the log data in its own storage unit without transmitting the log data while performing substrate processing, and the first analysis server device 1 may acquire the log data from the substrate processing device 3 at an appropriate timing, such as after the completion of substrate processing.

[0040] Furthermore, the data acquisition unit 11a receives user operations via a terminal device 5 connected through the network N, and extracts data necessary for analysis from the log data stored in the log DB 7. In this embodiment, a portion of the storage area of ​​the storage unit 12 of the first analysis server device 1 is allocated to the user as an area (folder or directory, etc.) for storing data related to the analysis process. In the following description, this storage area allocated to each user will be referred to as the analysis work folder. For example, the data acquisition unit 11a receives input of conditions such as the identification information of the substrate processing device 3 or the date and time (period) when the substrate processing was performed for the log data to be analyzed, displays a list of log data that matches these conditions on the terminal device 5, and accepts the user's selection of one or more log data from the displayed log data. The data acquisition unit 11a stores (copyes) the analysis data extracted from the log DB 7 in response to the user's operation into the user's analysis work folder. Note that each user's analysis work folder may be provided in the storage unit of the terminal device 5 used by each user, rather than in the storage unit 12 of the first analysis server device 1.

[0041] Furthermore, in the analysis process performed in this embodiment, not only log data stored in log DB 7 but also data stored in manufacturing management DB 9 of the manufacturing management server device 4 can be used. Based on user operations via terminal device 5, the data acquisition unit 11a communicates with the manufacturing management server device 4 via communication unit 13 to extract and acquire data necessary for the analysis process from manufacturing management DB 9, and stores the acquired data in the user's analysis work folder.

[0042] The program selection unit 11b accepts user input via a terminal device 5 connected through the network N, and performs the process of accepting the selection of an analysis program to be used for the analysis process. In this embodiment, for example, a user can register an analysis program they have created by creating an analysis program in advance on the terminal device 5 and storing it in a predetermined storage area of ​​the storage unit 12 of the first analysis server device 1, for example, in an analysis work folder assigned to each user. The program selection unit 11b transmits information about the analysis programs stored in the predetermined storage area to the terminal device 5, causing the display unit of the terminal device 5 to display a list of information about the analysis programs, and accepts the selection of an analysis program to be used from the list of analysis programs via the terminal device 5. Note that the storage area for storing the analysis programs is not limited to the analysis work folder, but may be another folder. Furthermore, the program selection unit 11b may accept selections from the user not only from analysis programs created by the user, but also from default analysis programs prepared in advance for this system.

[0043] The analysis processing unit 11c performs analysis processing of the substrate based on the data stored in the analysis work folder by the data acquisition unit 11a by executing the analysis program selected by the program selection unit 11b. The content of the analysis processing performed by the analysis processing unit 11c depends on what kind of analysis program the user creates. The analysis processing unit 11c stores the data obtained as a result of the analysis processing as a file in a predetermined format in the analysis work folder where the analysis program and the data used for the analysis processing were stored. However, the analysis result data may be stored in a storage location different from the analysis work folder, and if the analysis program and the data used for the analysis processing are stored in different folders, the data may be stored in either folder. Note that the analysis program may include not only a program that performs the analysis itself, but also programs that perform, for example, pre-processing of the data for analysis or post-processing of the analysis result data.

[0044] In this embodiment, the analysis processing unit 11c can create data of the analysis result in two types of formats. The first format is for displaying the analysis result as a graph or the like. By the first analysis server device 1 transmitting the data in the display format to the terminal device 5, a graph or the like of the analysis result can be displayed on the display unit of the terminal device 5. The second format is for downloading, and is a format such as CSV (Comma Separated Values) or TSV (Tab Separated Values) in which the numerical values of the analysis result are arranged according to a predetermined rule. The data in this format can be downloaded, for example, from the first analysis server device 1 to the storage unit of the terminal device 5, and the user can use the downloaded data for various purposes. Also, the user can perform further analysis processing on the first analysis server device 1 using the downloaded data.

[0045] The analysis result output unit 11d performs a process of outputting the result of the analysis process performed by the analysis processing unit 11c. The analysis result output unit 11d generates an image such as a graph showing the analysis result based on, for example, the display data of the analysis result generated by the execution of the analysis program, and transmits it to the terminal device 5, thereby displaying (outputting) the analysis result on the display unit of the terminal device 5. Also, the analysis result output unit 11d transmits (outputs) the download data of the analysis result generated by, for example, the execution of the analysis program to the terminal device 5.

[0046] FIG. 4 is a block diagram showing a configuration example of the second analysis server device 2 according to this embodiment. The second analysis server device 2 according to this embodiment can be realized by installing a predetermined application program or the like in an information processing device such as a general-purpose server computer. The second analysis server device 2 according to this embodiment includes a processing unit 21, a storage unit 22, a communication unit 23, etc., and since these have the same configuration as the processing unit 11, the storage unit 12, the communication unit 13, etc. of the first analysis server device 1, detailed description thereof is omitted.

[0047] In the storage unit 22 of the second analysis server device 2, a program 22a is stored, and an analysis program storage unit 22b and an analysis DB 8 are provided. Since the program 22a and the analysis program storage unit 22b in the storage unit 22 of the second analysis server device 2 are the same as the program 12a and the analysis program storage unit 12b in the storage unit 12 of the first analysis server device 1, detailed descriptions thereof are omitted. A log DB 7 is provided in the storage unit 12 of the first analysis server device 1, while an analysis DB 8 is provided in the storage unit 22 of the second analysis server device 2 instead of this log DB 7. In the analysis DB 8 of the second analysis server device 2, the log data of the log DB 7 acquired from the first analysis server device 1 and the data of the production management DB 9 acquired from the production management server device 4 via the first analysis server device 1 are stored. However, it is not necessary for the analysis DB 8 to store all of the log data of the log DB 7 and the data of the production management DB 9, and it is sufficient if a part thereof is stored.

[0048] Further, in the processing unit 21 of the second analysis server device 2, by the processing unit 21 reading and executing the program 22a stored in the storage unit 22, a data acquisition unit 21a, a program selection unit 21b, an analysis processing unit 21c, an analysis result output unit 21d, etc. are realized in the processing unit 21 as software-based functional units. In this figure, as functional units of the processing unit 21, functional units for performing processing related to the analysis of substrate processing are illustrated, and functional units related to other processing are not illustrated. Also, the program selection unit 21b, the analysis processing unit 21c, and the analysis result output unit 21d of the second analysis server device 2 are substantially the same as the analysis program storage unit 12b, the analysis processing unit 11c, and the analysis result output unit 21d of the first analysis server device 1, and thus detailed descriptions thereof are omitted.

[0049] The data acquisition unit 21a of the second analysis server device 2 communicates with the first analysis server device 1 via a network N such as the Internet using the communication unit 13, thereby acquiring log data stored in the log DB 7 of the first analysis server device 1 and data stored in the manufacturing management DB 9 of the manufacturing management server device 4, and storing them in the analysis DB 8. The data acquisition unit 21a communicates with the first analysis server device 1 at predetermined intervals, such as once an hour or once a day, and sends a predetermined data transmission request to the first analysis server device 1. In response to this request, the first analysis server device 1 reads the log data stored in its own log DB 7 and, if necessary, acquires data stored in the manufacturing management DB 9 from the manufacturing management server device 4 and transmits it to the requesting second analysis server device 2. The data acquisition unit 21a of the second analysis server device 2 receives the data transmitted from the first analysis server device 1 using the communication unit 13 and stores the received data in the analysis DB 8. At this time, the data acquisition unit 21a stores the data acquired from the first analysis server device 1 in the analysis DB 8, along with the identification information of the first analysis server device 1, which is the data source, and the date and time the data was acquired.

[0050] In this embodiment, although the second analysis server device 2 acquires data used for analysis processing from a different source than the first analysis server device 1, the analysis processing of the acquired data is the same as that performed by the first analysis server device 1. As a result, the information processing system according to this embodiment is expected to provide the user with substantially the same working environment whether the analysis processing is performed at the circuit board processing plant 101 or at a different facility 102.

[0051] Figure 5 is a block diagram showing an example configuration of a terminal device 5 according to this embodiment. The terminal device 5 according to this embodiment can be realized by installing a predetermined application program on a general-purpose information processing device such as a personal computer, smartphone, or tablet terminal device. The terminal device 5 according to this embodiment is configured to include a processing unit 51, a storage unit 52, a communication unit 53, a display unit 54, and an operation unit 55, etc. The terminal device 5 may be portable or stationary, but in this embodiment it is assumed to be a portable device.

[0052] The processing unit 51 is composed of a arithmetic processing unit such as a CPU or MPU, ROM, etc. The processing unit 51 reads and executes a program 52a stored in the storage unit 52, and performs various processes such as accepting the user's selection of data or an analysis program, displaying the results of the analysis process, and creating an analysis program.

[0053] The storage unit 52 is configured using a large-capacity storage device such as a hard disk or SSD. The storage unit 52 stores the program 52a executed by the processing unit 51 and is also provided with an analysis program storage unit 52b that stores analysis programs created by the user. In this embodiment, the program (computer program, program product) 52a is provided in the form of being recorded on a recording medium 99 such as a memory card or optical disc, and the terminal device 5 reads the program 52a from the recording medium 99 and stores it in the storage unit 52. However, the program 52a may also be provided in the form of being distributed via a network.

[0054] Furthermore, program 52a is not a program dedicated to the information processing system according to this embodiment, but may be a general-purpose program such as a web browser. In this embodiment, the user can perform analysis related to substrate processing by accessing the first analysis server device 1 or the second analysis server device 2 via a web browser executed on the terminal device 5. Also, the program for performing analysis processing on the terminal device 5 and the program for creating the analysis program may be separate programs.

[0055] The communication unit 53 communicates with various devices via a network N, which includes a mobile phone communication network, a wireless LAN, and the internet. In this embodiment, the communication unit 53 communicates with the first analysis server device 1 or the second analysis server device 2 via the network N. The communication unit 53 transmits data received from the processing unit 51 to other devices and provides data received from other devices to the processing unit 51.

[0056] The display unit 54 is configured using a liquid crystal display or the like, and displays various images and characters based on the processing of the processing unit 51. The operation unit 55 receives user operations and notifies the processing unit 51 of the received operations. For example, the operation unit 55 receives user operations via an input device such as a mechanical button or a touch panel provided on the surface of the display unit 54. Alternatively, the operation unit 55 may be an input device such as a mouse and a keyboard, and these input devices may be configured to be detachable from the terminal device 5.

[0057] Furthermore, in the terminal device 5 according to this embodiment, the processing unit 51 reads and executes the program 52a stored in the storage unit 52, thereby realizing the selection reception unit 51a, the analysis result output unit 51b, the analysis program creation unit 51c, etc., as software-based functional units in the processing unit 51.

[0058] The selection reception unit 51a processes the selection of data and analysis programs to be used for analysis related to substrate processing, which is received from the user via the operation unit 55. For example, the selection reception unit 51a obtains a list of data available for analysis from the first analysis server device 1 or the second analysis server device 2, displays it in the display unit 54, and accepts the selection of one or more data from the displayed data. The selection reception unit 51a notifies the first analysis server device 1 or the second analysis server device 2 of which data has been selected by the user, and in response, the first analysis server device 1 or the second analysis server device 2 extracts the selected data from the database and stores it in the analysis work folder.

[0059] For example, the selection reception unit 51a obtains a list of analysis programs available for analysis from the first analysis server device 1 or the second analysis server device 2, displays them in a list on the display unit 54, and accepts the selection of an analysis program to be executed from the displayed list. The selection reception unit 51a notifies the first analysis server device 1 or the second analysis server device 2 which analysis program has been selected by the user, and in response, the first analysis server device 1 or the second analysis server device 2 executes the selected analysis program and performs the analysis.

[0060] For example, the selection receiving unit 51a displays a list of analysis programs created by the user and stored in its own analysis program storage unit 52b on the display unit 54, and accepts the selection of an analysis program from the displayed list to be sent (uploaded) to the first analysis server device 1 or the second analysis server device 2. The selection receiving unit 51a reads the analysis program selected by the user from the analysis program storage unit 52b and sends it to the first analysis server device 1 or the second analysis server device 2. In response, the first analysis server device 1 or the second analysis server device 2 stores the analysis program sent from the terminal device 5 in its own storage unit 12 or 22, specifically in the analysis program storage unit 12b or 22b.

[0061] The analysis result output unit 51b performs the process of displaying (outputting) the results of the analysis process as a graph or the like on the display unit 54. The analysis result output unit 51b acquires data for displaying the analysis results from the first analysis server device 1 or the second analysis server device 2 that executed the analysis program, and displays a graph or the like based on the acquired data.

[0062] The analysis program creation unit 51c receives an operation from the user to create an analysis program and stores the created analysis program in the analysis program storage unit 52b. In this embodiment, the analysis program may be created using a text-based programming language or by so-called visual programming. The analysis program creation unit 51c provides the user with a development environment including an editor, debugger, compiler or interpreter, etc., necessary for the user to create these analysis programs.

[0063] <Analysis Processing> In the information processing system according to this embodiment, one or more substrate processing devices 3 perform substrate processing at the substrate processing plant 101, accumulating log data in the log DB 7 of the first analysis server device 1, and various data accumulating in the manufacturing management DB 9 of the manufacturing management server device 4. Users who perform analysis of substrate processing using this data create an analysis program in advance using the terminal device 5 and upload the created analysis program to a predetermined storage area (for example, an analysis work folder) in the storage unit 12 of the first analysis server device 1. However, if the user does not use a self-made analysis program for the analysis processing and uses the default analysis program provided by the information processing system, uploading the analysis program is not necessary. After that, the user can start the analysis of substrate processing by launching a program 52a such as a web browser on the terminal device 5 and accessing the first analysis server device 1.

[0064] Figure 6 is a flowchart showing an example of the procedure for analysis processing performed by the first analysis server device 1 according to this embodiment. The data acquisition unit 11a of the processing unit 11 of the first analysis server device 1 according to this embodiment acquires a list of log data stored in the log DB 7 and outputs (transmits) the acquired list of log data to the terminal device 5 (step S1). As a result, the terminal device 5 displays the list of log data received from the first analysis server device 1 on the display unit 54 and accepts the user's selection of log data based on operations on the operation unit 55. At this time, the data acquisition unit 11a may also accept conditions from the user via the terminal device 5 regarding the log data to be displayed in the list, such as the identification information of the substrate processing device 3, the identification information of the substrate, or the date and time (period) when the substrate processing was performed, and accept the user's selection by displaying only the log data that matches the conditions in the list. The terminal device 5 transmits information indicating which log data has been selected to the first analysis server device 1, and the data acquisition unit 11a accepts the selection of log data to be used for analysis by receiving the information from the terminal device 5 (step S2).

[0065] Next, the data acquisition unit 11a acquires a list of other data stored in the manufacturing management DB 9 from the manufacturing management server device 4 and outputs (transmits) the acquired list information to the terminal device 5 (step S3). As a result, the terminal device 5 displays the list of other data received from the first analysis server device 1 on the display unit 54 and accepts the user's selection of data based on the operation of the operation unit 55. The terminal device 5 transmits information indicating which data has been selected to the first analysis server device 1, and the data acquisition unit 11a accepts the selection of other data to be used for analysis by receiving the information from the terminal device 5 (step S4).

[0066] Next, the data acquisition unit 11a extracts the log data selected in step S2 from the log DB 7 and the other data selected in step S4 from the manufacturing management DB 9 (step S5), and stores the extracted data in the user's analysis work folder.

[0067] Next, the program selection unit 11b of the processing unit 11 acquires a list of default analysis programs and user-created analysis programs stored in a predetermined storage location in the storage unit 12, and outputs (transmits) the acquired list information to the terminal device 5 (step S6). As a result, the terminal device 5 displays the list of analysis programs received from the first analysis server device 1 on the display unit 54 and accepts the user's selection of an analysis program based on the operation of the operation unit 55. The terminal device 5 transmits information indicating which analysis program has been selected to the first analysis server device 1, and the data acquisition unit 11a accepts the selection of an analysis program to be used for analysis by receiving the information from the terminal device 5 (step S7).

[0068] Next, the analysis processing unit 11c of the processing unit 11 executes the analysis program selected in step S7 (step S8) and performs analysis of the substrate processing based on the data extracted in step S5. The analysis result output unit 11d of the processing unit 11 acquires the analysis result data output by the analysis program executed in step S8, outputs (transmits) the acquired analysis result data to the terminal device 5 (step S9), and terminates the process. The terminal device 5 can receive the analysis result data from the first analysis server device 1 to the first analysis server device 1 and perform processing such as displaying a graph of the analysis results based on the received data.

[0069] Although this flowchart describes the procedure when the first analysis server device 1 performs the analysis, it is not limited to this case; the same procedure is followed when the second analysis server device 2 performs the analysis. However, when the second analysis server device 2 performs the analysis, the database from which data is extracted in step S5 is the analysis DB 8, not the log DB 7 and the manufacturing management DB 9.

[0070] Figure 7 is a schematic diagram showing an example of an analysis program selection screen. The illustrated selection screen is the screen on which the terminal device 5 displays a list of analysis programs on the display unit 54 based on the list information transmitted by the first analysis server device 1 in steps S6 and S7 of the flowchart described above. In this example, the names of three analysis programs, "Cylinder Failure Prediction," "Dispense Aggregation Function," and "Transport Arm X-Axis Belt Failure Prediction," are displayed side by side in a list. These analysis programs may be either default analysis programs prepared in advance in the information processing system according to this embodiment, or analysis programs created by the user.

[0071] The selection screen shown in the diagram also includes an "Execute" button, an "Update" button, and a "Results Display Screen" button. The user can select the name of one of the analysis programs to be used for the analysis and execute it by using, for example, the mouse provided as the operation unit 55 of the terminal device 5 to select the name of one of the analysis programs and pressing the "Execute" button. The "Update" button is used to update the display on the selection screen. For example, if the user creates a new analysis program and stores it in the analysis work folder, pressing the "Update" button will update the list display on the selection screen to show the newly added analysis program. The "Results Display Screen" button is used to switch from the analysis program selection screen to a screen that displays the analysis results obtained by executing the analysis program.

[0072] <Analysis Example> (Analysis Example 1) The first analysis example is an example of performing coating unevenness analysis in substrate processing. Figure 8 is a schematic diagram showing an example of displaying the coating unevenness analysis results. In this example, the user extracts appropriate log data stored in log DB7, coating unevenness determination data and substrate processing apparatus 3 modification history data stored in manufacturing management DB9, stores them in an analysis work folder, and selects and executes the coating unevenness analysis program. This coating unevenness analysis program identifies the points in time when four types of modifications were made based on the modification history data of the substrate processing apparatus 3: nozzle / bath cleaning, PCS Vac pressure (internal pressure of the pump), nozzle replacement, and micro-pressure setting change. It calculates the number of coating unevenness occurrences and the occurrence rate before and after each modification based on the coating unevenness determination data, and calculates the degree of influence of each modification on the occurrence of coating unevenness.

[0073] Figure 8 shows an example of the display screen on the terminal device 5's display unit 54, which shows the analysis results based on the data from the coating unevenness analysis program. On this screen, histogram graphs comparing the number of coating unevenness occurrences before and after each modification are created for each of the four types of modifications and are displayed at the top of the screen in a 2x2 matrix arrangement. Each histogram is divided into upper and lower sections by color coding (however, in this figure, the color coding is represented by the difference in hatching type). The upper part of each divided histogram shows the number of items judged as NG (defective) due to coating unevenness, and the lower part shows the number of items judged as OK (good) due to coating unevenness.

[0074] The impact level calculated for each modification is displayed at the bottom of this screen. While a detailed explanation of how the impact level is calculated is omitted here, in this example, a smaller impact level indicates a greater impact on coating unevenness. From the values ​​shown, it can be seen that nozzle and bath cleaning has the greatest impact on coating unevenness.

[0075] Although not shown in Figure 8, the coating unevenness analysis program may also display a graph comparing the number of coating unevenness occurrences based on, for example, sensor measurements included in the log data. For example, the coating unevenness analysis program may display a graph of the number of coating unevenness occurrences divided into two categories based on whether or not the measurement value of a certain sensor exceeds a threshold.

[0076] (Analysis Example 2) The second analysis example is an example of analyzing the coating film thickness in substrate processing. Figures 9 and 10 are schematic diagrams showing an example of the film thickness analysis results. The second analysis example includes a first stage of processing to generate a learning model for predicting film thickness, and a second stage of processing to perform film thickness prediction using the generated learning model. In the first stage of film thickness analysis, the user extracts log data from the target device stored in log DB7 from one to three months prior and measurement data of the coating film thickness stored in manufacturing management DB9, stores them in an analysis work folder, and selects and executes a film thickness prediction model generation program to generate a learning model for predicting film thickness.

[0077] This film thickness prediction model generation program generates training data that associates measurements from multiple sensors included in log data with the measured film thickness of the substrate during the substrate processing in which these measurements were obtained. The program generates a film thickness prediction model by determining the internal parameters of a learning model that accepts measurements from multiple sensors as input and outputs a predicted value of the substrate film thickness, through appropriate machine learning processing using the generated training data. The program also uses the generated film thickness prediction model to calculate the predicted film thickness for the sensor measurements included in the training data. Furthermore, the program calculates the contribution of the multiple sensor measurements that serve as input to the generated film thickness prediction model to the film thickness prediction. For calculating the contribution, methods such as SHAP (SHapley Additive exPlanations) may be used, but any method may be employed.

[0078] The film thickness prediction model generation program outputs the internal parameter data of the generated film thickness prediction model as downloadable data. The program also outputs data for displaying the contribution of each sensor and data for displaying a graph comparing the predicted and measured film thickness values ​​from the film thickness prediction model as displayable data. The screen shown in Figure 9 is an example of a graph displayed on the display unit 54 by the terminal device 5 based on this displayable data. On the left side of the screen in this example, a graph is displayed comparing the predicted film thickness value from the generated film thickness prediction model with the measured film thickness value based on the data stored in the manufacturing management DB 9. This graph is a scatter plot with the measured film thickness on the horizontal axis and the predicted film thickness on the vertical axis. On the right side of the screen in this example, a graph is displayed showing the contribution of the values ​​measured by each sensor of the substrate processing device 3 to the film thickness.

[0079] In the second stage of film thickness analysis, film thickness prediction is performed using the film thickness prediction model generated in the first stage. In the second stage of film thickness analysis, the user stores, for example, the log data for the most recent month stored in log DB7 and the internal parameter data of the film thickness prediction model generated in the first stage in the analysis work folder, and runs the film thickness prediction program to predict the film thickness. The film thickness prediction program constructs a film thickness prediction model based on predetermined internal parameter data, inputs multiple sensor values ​​included in the log data into the film thickness prediction model, and obtains the predicted film thickness value output by the film thickness prediction model. The screen shown in Figure 10 is a graph of the film thickness prediction results. This graph is a line graph with the horizontal axis representing the position on the substrate and the vertical axis representing the predicted film thickness value.

[0080] (Analysis Example 3) The third analysis example is an example of analyzing the causes of defects that occur on the surface of a substrate after substrate processing. Figure 11 is a schematic diagram showing an example of the defect cause analysis results. In the third analysis example, for example, data of foreign matter detection results in the liquid supply pipe stored in log DB7 and image data of the substrate obtained by surface imaging after coating, and data of defect inspection results of the substrate surface after substrate processing stored in manufacturing management DB9 are extracted and stored in the analysis work folder, and the defect cause analysis program is selected and executed. The foreign matter detection result data includes information such as the identification information of the substrate to be processed, the time when the foreign matter was detected, the number of foreign matter detected, and the size of the foreign matter. The defect cause analysis program, for example, aggregates the number of foreign matter detected for each foreign matter size and generates and outputs data for displaying a histogram. The defect inspection result data includes information such as the identification information of the substrate to be processed, the location and size of the detected defects. The defect cause analysis program generates and outputs data for display, such as image data of the substrate surface with marks indicating the location of defects.

[0081] The data for display output by the defect cause analysis program is transmitted to the terminal device 5, and the terminal device 5 displays the screen shown in Figure 11 on the display unit 54 based on this data. On the left side of the screen in this example, a histogram is displayed with the size of the foreign matter on the horizontal axis and the number of detected foreign matters on the vertical axis. On the right side of the screen in this example, an image of the substrate surface is displayed with marks indicating the location of defects superimposed. Based on this display, the user can infer from the histogram on the left side of the screen whether or not a certain amount of foreign matter (e.g., bubbles) has been generated, and from the image of the substrate surface on the right side whether or not the cause of the detected defects is foreign matter.

[0082] Furthermore, the user can create, for example, an analysis program that receives data related to the detection results of foreign objects as input and generates a learning model that predicts the presence or absence of defects or their location, and an analysis program that uses the generated learning model to predict the occurrence of defects. The user can create these analysis programs on the terminal device 5 and store the created analysis programs in a predetermined storage location on the first analysis server device 1 or the second analysis server device 2 and execute them.

[0083] <Summary> In the information processing system according to this embodiment with the above configuration, the first analysis server device 1 (or the second analysis server device 2) acquires log data to be analyzed from the log DB 7 which stores log data related to board processing performed by the board processing device 3, accepts the selection of an analysis program to be used for analysis from a plurality of analysis programs, performs analysis on the acquired log data using the selected analysis program, transmits the analysis result data to the terminal device 5, and displays the analysis result on the display unit 54 of the terminal device 5. As a result, the information processing system according to this embodiment is expected to enable users to perform various analyses on various data and to support users who perform analysis of data related to board processing.

[0084] Furthermore, in the information processing system according to this embodiment, the first analysis server device 1 receives identification information of the substrate processing device 3 to be analyzed or the period to be analyzed from the user via the terminal device 5, and obtains data corresponding to the received identification information of the substrate processing device 3 or the period from the log DB 7. As a result, the information processing system according to this embodiment is expected to facilitate the user's selection of data to be analyzed from the log DB 7, which stores a large amount of data.

[0085] Furthermore, in the information processing system according to this embodiment, the first analysis server device 1 acquires data to be analyzed from multiple databases, including a log DB 7 that stores log data output by the substrate processing device 3, and a manufacturing management DB 9 that stores measurement result data from measuring devices other than the substrate processing device 3. The data stored in the manufacturing management DB 9 may include various data different from the data obtained from the substrate processing device 3 or measuring devices, such as information on events within the substrate processing plant 101, information on chemicals used in substrate processing, large amounts of data acquired by the user via a recording medium, the name of the person who performs the operation or inspection of the substrate processing device 3, or official temperature and atmospheric pressure information from the Japan Meteorological Agency, etc. As a result, the information processing according to this embodiment is expected to allow the user to perform analysis of substrate processing by combining various data, not just log data from the substrate processing device 3.

[0086] Furthermore, in the information processing system according to this embodiment, the first analysis server device 1 accepts the storage of analysis programs in a predetermined storage location (for example, an analysis work folder), displays a list of multiple analysis programs stored in the predetermined storage location on the terminal device 5, and accepts the selection of an analysis program to be used for analysis from the displayed list of analysis programs. As a result, the information processing system according to this embodiment is expected to support users who perform data analysis related to circuit board processing by enabling them to perform various analyses by storing their own analysis programs in a predetermined storage location.

[0087] Furthermore, in the information processing system according to this embodiment, the first analysis server device 1 stores the analysis result data from the analysis program in a predetermined storage location where the analysis program is stored. This data also includes, for example, first data such as a CSV file in which numerical values ​​of the analysis results are arranged according to a predetermined rule, or second data for displaying the analysis results on the display unit 54 of the terminal device 5. As a result, the information processing system according to this embodiment is expected to support users who perform analysis of data related to circuit board processing by allowing users to perform further analysis processing using the analysis result data or display the analysis results as appropriate.

[0088] Furthermore, in the information processing system according to this embodiment, a first analysis server device 1 is provided within a facility such as a substrate processing plant 101 where a substrate processing device 3 is installed, and a second analysis server device 2 is provided in a facility 102 other than the substrate processing plant 101. The second analysis server device 2 acquires data stored in the log DB 7 and the manufacturing management DB 9 through communication with the first analysis server device 1, stores it in the analysis DB 8, performs analysis on the data stored in the analysis DB 8 using an analysis program, transmits the analysis results to the terminal device 5, and displays them on the display unit 54. As a result, the information processing system according to this embodiment allows users to perform analysis not only within the facility where the substrate processing device 3 is installed, but also in other facilities 102, and is expected to support users who perform analysis of data related to substrate processing.

[0089] Furthermore, in the information processing system according to this embodiment, the analysis program executed by the first analysis server device 1 includes a program that generates a prediction model for predicting the results of substrate processing based on data acquired from the log DB 7, and a program that uses the generated prediction model to predict the results of substrate processing. As a result, the information processing system according to this embodiment is expected to accurately predict the results of substrate processing using log data accumulated in the log DB 7.

[0090] Furthermore, in the information processing system according to this embodiment, the analysis program executed by the first analysis server device 1 includes a program that displays the detection results of foreign matter and a program that displays the location of defects that have occurred on the substrate surface. The analysis program also includes a program that displays the changes in the results of substrate processing before and after events such as modifications that occur in the substrate processing device 3. As a result, the information processing system according to this embodiment is expected to realize various analyses related to substrate processing.

[0091] <Embodiment 2> The information processing system according to Embodiment 2 is a system that uses the above-mentioned information processing system, which displays various information related to substrate processing, to display information about the supply of inert gas in the substrate transport path of the substrate processing apparatus 3.

[0092] Figure 12 is a schematic plan view showing one example of the configuration of a substrate processing apparatus 3 according to Embodiment 2. In this example, the case in which the substrate processing apparatus 3 is a photolithography processing system that performs resist film formation processing and development processing on a wafer (substrate) W will be described. The substrate processing apparatus 3 according to Embodiment 2 has a cassette station 202 in which a cassette C containing a plurality of wafers W is loaded and unloaded, and a processing station 203 equipped with a plurality of various processing devices that perform predetermined processing on the wafers W.

[0093] Furthermore, the substrate processing apparatus 3 is configured by integrally connecting a cassette station 202, a processing station 203, and an interface station 204 that transfers wafers W between the processing station 203 and an adjacent exposure apparatus (not shown) on the opposite side. As shown in Figure 12, there are two processing stations 203 installed between the cassette station 202 and the interface station 204, but there may be only one, or three or more.

[0094] The cassette station 202 is equipped with multiple cassette trays 221, wafer transport devices 222 and 223, and a transfer device 224. In the cassette station 202, wafers are transported between the cassette C placed on the cassette tray 221 and the transfer device 224 by the wafer transport devices 222 and 223. The transfer device 224 is a tower-shaped device with multiple storage spaces for accommodating wafers formed in multiple levels vertically.

[0095] The processing station 203 includes, for example, a first block 231 and a second block 232 flanking the wafer transport area 235. In the illustrated substrate processing apparatus 3, two processing stations 203 are connected, and a transfer device 233 is provided between the two processing stations 203.

[0096] The first block 231 contains a plurality of liquid processing devices, such as a patterning film forming device or a developing device (both not shown). The patterning film forming device includes, for example, a resist film forming device or an anti-reflective film forming device. These patterning film forming devices or developing devices perform, for example, supplying a predetermined processing liquid or supplying a predetermined gas onto the wafer W. In this way, the patterning film forming device forms a resist film to be used as a mask when forming the pattern of the lower layer film, or forms an anti-reflective film or the like to efficiently perform a light irradiation process, such as an exposure process. The developing device removes a portion of the exposed resist film to form the uneven shape that serves as the mask.

[0097] The second block 232 is provided with a heat treatment unit for performing heat treatment such as heating or cooling of the wafer W. The second block 232 is also provided with a hydrophobic treatment device for performing hydrophobic treatment to improve the adhesion between the resist solution and the wafer W, and a peripheral exposure device for exposing the outer periphery of the wafer W. The number and arrangement of these heat treatment units, hydrophobic treatment device, peripheral exposure device, etc., provided in the second block 232 can be selected as appropriate.

[0098] A wafer transport device 236 having a transport arm is positioned in the wafer transport area 235. The wafer transport device 236 moves within the wafer transport area 235 and transports the wafer W between the first block 231 and the second block 232. The wafer transport device 236 also transports the wafer W between the cassette station 202, other adjacent processing stations 203 and the interface station 204 by transferring the wafer W with the wafer transfer devices 224, 233 and 243.

[0099] Interface station 204 is equipped with wafer transport devices 241 and 242 and a wafer W transfer device 243. Interface station 204 transports wafer W between the transfer device 243, where wafer W is transferred by the wafer transport device 236 of processing station 203, and an exposure machine (not shown), using wafer transport devices 241 and 242.

[0100] Figure 13 is a schematic diagram illustrating the overview of substrate transport performed by the substrate processing apparatus 3 according to Embodiment 2. For example, in the substrate processing apparatus 3, first a cassette C containing wafers W is brought into the cassette station 202 and placed on the cassette mounting table 221. Next, the substrate processing apparatus 3 uses wafer transport devices 222 and 223 to remove the wafers W from the cassette C and transport them to the transfer device 224. The substrate processing apparatus 3 then uses a wafer transport device 236 to transport the wafers W transported to the transfer device 224 to a hydrophobic treatment apparatus provided in the second block 232, where a hydrophobic treatment is performed. The substrate processing apparatus 3 then uses the wafer transport device 236 to transport the wafers W to a resist film forming apparatus, where a resist film is formed on the wafers W.

[0101] After film formation is complete, the substrate processing apparatus 3 transports the wafer W to the heat treatment unit for pre-baking, and then transports the wafer W to the transfer device 243. Note that, as shown in Figure 12, if the substrate processing apparatus 3 has multiple processing stations 203, the wafer W is transported via transfer devices 233 located between the multiple processing stations 203, and finally transported to the transfer device 243 of the interface station 204.

[0102] Next, the substrate processing apparatus 3 transports the wafer W, which has been delivered to the transfer device 243 of the interface station 204, to the exposure apparatus using wafer transfer devices 241 and 242, and performs exposure processing in a predetermined pattern. The substrate processing apparatus 3 then transports the exposed wafer W back to the transfer device 243 using wafer transfer devices 241 and 242.

[0103] Next, the substrate processing apparatus 3 transports the wafer W, which has been transferred to the transfer device 243, to the heat treatment unit via the wafer transfer device 236 for post-exposure heat treatment. The substrate processing apparatus 3 then transports the post-exposure heat-treated wafer W to the developing apparatus via the wafer transfer device 236 for development. After development is complete, the substrate processing apparatus 3 transports the wafer W to the heat treatment unit via the wafer transfer device 236 for post-bake treatment.

[0104] Subsequently, the substrate processing device 3 transports the wafer W to the transfer device 224 using the wafer transport device 236, and then transports it to the cassette C on the predetermined cassette mounting table 221 using the wafer transport devices 222 and 223 of the cassette station 202. In this way, the series of photolithography processes is completed.

[0105] In Embodiment 2, the period from film formation to the start of exposure processing included in the above process is called PCD (Post Coating Delay time). The period from exposure processing to the start of post-exposure heat treatment is called PED (Post Exposure Delay time). The period from post-exposure heat treatment to the start of development processing is called PPD (Post PED Delay time).

[0106] In the substrate processing apparatus 3 with the configuration shown in Figure 12, when the wafer W after film formation is left to wait in a normal atmospheric environment (air), the CD (Critical Dimension) may vary depending on the waiting time, and a good pattern on the wafer W may not be obtained. Therefore, the substrate processing apparatus 3 according to Embodiment 2 is equipped with an atmosphere influence adjustment function to suppress variations in CD.

[0107] In the substrate processing apparatus 3 according to Embodiment 2, the transfer devices 224, 233, and 243, which are located in the middle of the wafer W transport path, are provided with an atmosphere influence adjustment function. Each transfer device 224, 233, and 243 is provided with one or more storage spaces for placing and accommodating wafers W. Each transfer device 224, 233, and 243 can supply an inert gas such as nitrogen, low humidity gas, or low oxygen gas to these storage spaces. This allows the transfer devices 224, 233, and 243 to keep wafers W in a waiting environment where the concentration of the inert gas in the atmosphere is higher than that of air (i.e., the concentrations of oxygen and carbon dioxide are lower than those of air). The atmosphere influence adjustment function does not need to be provided in all of the transfer devices 224, 233, and 243; it is sufficient if it is provided in at least one of them. Furthermore, the atmosphere influence adjustment function may be provided in a location other than the transfer devices 224, 233, and 243.

[0108] The substrate processing apparatus 3 includes, for example, a display device such as a display and input devices such as a keyboard and mouse, and exchanges information with the user. Using these, the user can make settings related to the ambient influence adjustment function described above.

[0109] Figure 14 is a schematic diagram showing an example of the setting screen for the atmosphere influence adjustment function displayed by the substrate processing apparatus 3 according to Embodiment 2. In the illustrated setting screen, the string "MAC Control" is displayed as the title at the top. "MAC" is an abbreviation for Moisture and Atmosphere Controller, and in this example, it is used to indicate the atmosphere influence adjustment function or the hardware unit that implements this function.

[0110] The settings screen for the ambient effect adjustment function has setting items below the title string, such as "MAC control after COT," "MAC control after exposure / PEB," "Time required in exposure machine," and "Allowable waiting time after completion of pre-exposure treatment," with "OK" and "Cancel" buttons at the bottom. "COT" is an abbreviation for Coater, which means film formation treatment. The "MAC control after COT" setting item is for deciding whether or not to control the ambient effect adjustment function after the film formation treatment is completed (during the PCD period shown in Figure 13), and accepts selection of "Do (implement)" or "Do not (not implement)" via a pull-down menu, for example.

[0111] Furthermore, "PEB" is an abbreviation for Post Exposure Bake, meaning post-exposure heat treatment. The "Exposure / PEB Post-MAC Control" setting item is for determining whether or not to control the atmosphere influence adjustment function after exposure is complete (the PED period shown in Figure 13) and after post-exposure heat treatment is complete (the PPD period shown in Figure 13). For example, it accepts a selection of "Yes" or "No" via a pull-down menu.

[0112] The "Time Required in Exposure Machine" setting is used to set the time required for processing within the exposure machine, and accepts the number of seconds as a numerical input. The "Allowable Waiting Time After Completion of Pre-exposure Processing" setting is used to set the allowable waiting time between the completion of pre-exposure processing and the start of exposure processing, and accepts the number of seconds as a numerical input.

[0113] In this example, the settings screen accepts settings for the allowable waiting time after the completion of pre-exposure processing, but this is not the only option. For example, the settings may accept settings for various periods, such as the waiting time in the processing module within the PCD, PED, and PPD periods. Also, for example, if the substrate processing apparatus 3 is equipped with multiple units that have an atmosphere influence adjustment function, settings may be accepted for each unit.

[0114] Furthermore, the substrate processing apparatus 3 according to Embodiment 2 is equipped with a marking function that, when recording log data related to the transport of the wafer W, adds information to the log data indicating that conditions predetermined by the user have been met. Figure 15 is a schematic diagram showing an example of the setting screen for the marking function displayed by the substrate processing apparatus 3 according to Embodiment 2.

[0115] The marking function settings screen is divided into three main sections: upper, middle, and lower. The upper section of the settings screen accepts "MAC environment wafer marking settings," the middle section accepts "non-MAC environment wafer marking settings," and the lower section accepts "exposure / PEB post-MAC control exposure machine pre-dispatch suppression settings."

[0116] The "MAC Environment Wafer Marking Settings" area is further divided into two sections, left and right. The left section accepts the setting of "Allowable Dwelling Time," and the right section accepts the setting of "Exceeding Allowable Dwelling Time." In the "Allowable Dwelling Time" area, the substrate processing device 3 accepts the number of seconds of the allowable accumulating time for each of the "PCD," "PED," and "PPD" periods when MAC control is performed as a numerical input.

[0117] The "Exceeded Allowable Cumulative Time" setting configures the processing that the substrate processing device 3 will perform when the cumulative time exceeds the number of seconds set as the "Allowable Cumulative Time," and includes the settings for "Wafer Type" and "Alarm Issuance." The "Wafer Type" setting configures the type of information to be added as a marking to the log data, and one of the following options can be selected from a pull-down menu: for example, "Normal," "Processing Cancelled," and "Caution." For example, if "Caution" is set as the "Wafer Type," and the cumulative time exceeds the number of seconds set as the "Allowable Cumulative Time," the substrate processing device 3 will add information indicating "Caution" to the log data related to the wafer W being processed.

[0118] The "Alarm Activation" setting item is used to determine whether or not the substrate processing device 3 will activate an alarm when the number of seconds set as the "Allowable Cumulative Dwell Time" is exceeded. This setting can be selected from either "Activate" or "Disable" using a pull-down menu.

[0119] The "Non-MAC Environment Wafer Marking Settings" are the same as the "MAC Environment Wafer Marking Settings," so the explanation is omitted. When MAC control is performed, the settings made by the user in "MAC Environment Wafer Marking Settings" are used; when MAC control is not performed, the settings made by the user in "Non-MAC Environment Wafer Marking Settings" are used.

[0120] The "Exposure / PEB Post-MAC Control Exposure Machine Pre-Payout Suppression Setting" is used to set whether or not to perform "Exposure Machine Pre-Payout Suppression," which delays the "payout" of wafers W that have finished processing before exposure, toward the exposure machine when performing exposure / PEB post-MAC control. In this example, the three conditions for performing "Exposure Machine Pre-Payout Suppression" are "Pj with different exposure / PEB post-MAC control settings," "Pj with different cycle times after the exposure machine," and "Pj with different modules used after the exposure machine," and the user can select "Enable" or "Disable" for each of these conditions via a pull-down menu. Note that "Pj" means project, and in this embodiment, multiple substrates that perform the same process flow within the substrate processing apparatus 3 are called projects. If the wafer that was previously transported and the wafer to be transported next belong to different projects, and the wafer to be transported next is in a project that matches the condition set to "Enable" on this screen, the transport to the exposure machine will be delayed.

[0121] The substrate processing apparatus 3 according to Embodiment 2 performs substrate processing, including transport control and MAC control, according to the conditions set on the setting screens in Figures 14 and 15, and records various data obtained during this process as log data. This log data may include, for example, data such as the timing of transport and the waiting time for transport for each wafer W. The log data may also include data such as whether MAC control was performed and the start / end timing of MAC control.

[0122] The log data recorded by the substrate processing device 3 is stored in the log DB 7 of the first analysis server device 1 shown in Figure 1 and used for analysis processing by the first analysis server device 1. In the information processing system according to Embodiment 2, the user can access the first analysis server device 1 via the terminal device 5 and execute a program that performs analysis related to MAC control, thereby displaying information related to MAC control on the terminal device 5.

[0123] Figure 16 is a schematic diagram showing an example of an information display screen for MAC control by the information processing system according to Embodiment 2. The user can obtain information about MAC control performed on a substrate by, for example, inputting the identification number of a substrate processed by the substrate processing apparatus 3. The first analysis server device 1 extracts data related to transport and MAC control for the wafer W with the specified identification number from the log data stored in the log DB 7, aggregates the extracted data to generate display data for displaying the screen shown in the figure, and transmits it to the terminal device 5.

[0124] In this example's information display screen, information indicating whether or not MAC control was performed is displayed at the top. For example, if MAC control was performed, "MAC applied" is displayed, and if MAC control was not performed, "MAC not applied" is displayed. In the screen shown in Figure 16, only one piece of information regarding whether or not MAC control was performed is displayed, but this is not the only option. For example, information regarding whether or not MAC control was performed could be displayed for each period of PCD, PED, and PPD.

[0125] In addition, in the information display screen of this example, below the information on whether MAC control was performed, the time taken for each period of PCD, PED, and PPD, and information indicating whether this time exceeded a preset allowable time are displayed in association. The first analysis server device 1 can calculate the time taken for each period by obtaining information such as the start time and end time of each period based on the log data stored in the log DB 7.

[0126] In this example's information display screen, whether or not the allowable time has been exceeded is indicated by the string "Exceeded" if it has been exceeded, and the string "OK" if it has not been exceeded, displayed next to the duration of each period. The allowable time is set, for example, in the settings screen shown in Figure 15, and these settings are stored in the log data.

[0127] Furthermore, the information display illustrated in Figure 16 may not only be displayed on the terminal device 5 as an analysis result by the first analysis server device 1, but may also be displayed on the display unit of the substrate processing device 3, for example. In this case, the substrate processing device 3 is equipped with a program for displaying these from log data, and can perform similar displays by inputting log data related to a substrate into the program each time substrate processing is completed.

[0128] The information processing system according to Embodiment 2, configured as described above, displays whether or not inert gas is supplied to the substrate transport path in the substrate processing apparatus 3, using an analysis program. The information processing system may also divide the substrate processing period in which inert gas is supplied into multiple periods and display the time required for each period. These multiple periods may include, for example, PEC, PED, and PPD as shown in Figure 13. The information processing system may also display whether or not a preset allowable time has been exceeded for the time required for each displayed period. In this way, the information processing system according to Embodiment 2 can provide the user with information regarding MAC control performed in the substrate processing apparatus 3, and is expected to support the user in analyzing, for example, the influence of MAC control on the results of substrate processing.

[0129] Furthermore, in the information processing system according to Embodiment 2, the substrate processing device 3 displays a setting screen that accepts settings related to the supply of inert gas, and accepts settings from the user. As a result, the information processing system according to Embodiment 2 is expected to facilitate the setting of conditions related to MAC control by the user operating the substrate processing device 3. Note that the display of the setting screen and acceptance of settings may be performed not by the substrate processing device 3, but for example by a terminal device 5, in which case the accepted settings are transmitted from the terminal device 5 to the substrate processing device 3 via the first analysis server device 1.

[0130] Since the other components of the information processing system according to Embodiment 2 are the same as those of the information processing system according to Embodiment 1, the same reference numerals are used for the same components, and detailed explanations are omitted.

[0131] The embodiments disclosed herein should be considered in all respects to be illustrative and not restrictive. The scope of this disclosure is indicated by the claims, not in the sense described above, and all modifications within the meaning and scope equivalent to the claims are intended.

[0132] The matters described in each embodiment can be combined with each other. Furthermore, the independent and dependent claims described in the claims can be combined with each other in any combination, regardless of the form of reference. In addition, the claims use a form in which claims referencing two or more other claims (multi-claim form), but are not limited to this. A form in which multi-claims referencing at least one multi-claim (multi-multi-claim) may also be used.

[0133] 1 First analysis server device (information processing device, computer) 2 Second analysis server device (information processing device, second information processing device, computer) 3 Board processing device 4 Manufacturing management server device 5 Terminal device 7 Log DB (database) 8 Analysis DB (third database) 9 Manufacturing management DB (second database) 11 Processing unit 11a Data acquisition unit 11b Program selection unit 11c Analysis processing unit 11d Analysis result output unit 12 Storage unit 12a Program (computer program) 12b Analysis program storage unit 13 Communication unit 21 Processing unit 21a Data acquisition unit 21b Program selection unit 21c Analysis processing unit 21d Analysis result output unit 22 Storage unit 22a Program (computer program) 22b Analysis program storage unit 23 Communication unit 51 Processing unit 51a Selection reception unit 51b Analysis result output unit 51c Analysis program creation unit 52 Memory unit 52a Program 52b Analysis program memory unit 53 Communication unit 54 Display unit 55 Operation unit N Network

Claims

1. An information processing method comprising: an information processing device acquiring data to be analyzed from a database storing log data related to substrate processing performed by a substrate processing device; accepting the selection of an analysis program to be used for analysis from a plurality of analysis programs; and outputting the analysis results obtained by performing analysis on the acquired data using the selected analysis program.

2. The information processing method according to claim 1, comprising receiving input of a substrate processing apparatus or period to be analyzed, and obtaining data corresponding to the substrate processing apparatus or period that has been received from the database.

3. The information processing method according to claim 1, comprising acquiring data to be analyzed from a plurality of databases, including a first database for storing log data output by the substrate processing apparatus and a second database for storing measurement result data from a measuring device different from the substrate processing apparatus.

4. The information processing method according to claim 3, wherein the data stored in the second database includes data different from the data obtained from the substrate processing apparatus or the measuring apparatus.

5. The information processing method according to claim 1, comprising: accepting the storage of an analysis program in a predetermined storage location; displaying a list of multiple analysis programs stored in the predetermined storage location; and accepting the selection of an analysis program to be used for analysis from among the displayed analysis programs.

6. The information processing method according to claim 5, wherein the data of the analysis results by the analysis program is stored in the predetermined storage location.

7. The information processing method according to claim 5, wherein the data of the analysis results obtained by the analysis program includes first data obtained by arranging the numerical values ​​of the analysis results in a predetermined rule, or second data for displaying the analysis results.

8. The information processing method according to claim 1, wherein the information processing device is provided within the facility where the substrate processing device is provided, and a second information processing device provided outside the facility acquires data stored in the database by communicating with the information processing device, stores the acquired data in a third database, and outputs the analysis results obtained by performing analysis on the data stored in the third database using the analysis program.

9. The information processing method according to claim 1, wherein the analysis program includes a program that generates a predictive model for predicting the results of substrate processing based on data obtained from the database, and a program that predicts the results of substrate processing using the data obtained from the database and the generated predictive model.

10. The information processing method according to claim 1, wherein the analysis program includes a program for displaying the detection results of foreign matter and a program for displaying the location of defects occurring on the substrate surface.

11. The information processing method according to claim 1, wherein the analysis program includes a program that displays the change in the results of substrate processing before and after an event occurring in the substrate processing apparatus.

12. A computer program that retrieves data to be analyzed from a database storing log data related to substrate processing performed by a substrate processing apparatus, accepts the selection of an analysis program to be used for analysis from multiple analysis programs, and causes a computer to execute a process that performs analysis on the retrieved data using the selected analysis program and outputs the analysis results.

13. The information processing method according to claim 1, wherein the analysis program includes a program that indicates whether or not an inert gas is supplied to the substrate transport path in the substrate processing apparatus.

14. The information processing method according to claim 13, wherein the period of transporting the substrate supplied with the inert gas is divided into multiple periods, and the required time for each period is displayed.

15. The information processing method according to claim 14, wherein the plurality of periods include the period from after film formation until the start of exposure processing, the period from exposure processing until the start of post-exposure heat treatment, and the period from post-exposure heat treatment until the start of development processing.

16. The information processing method according to claim 14 or claim 15, which indicates whether the required time for a plurality of the aforementioned periods has exceeded a predetermined allowable time.

17. The information processing method according to claim 13, which displays a settings screen for accepting settings related to the supply of the inert gas.

18. An information processing device comprising a processing unit, wherein the processing unit acquires data to be analyzed from a database storing log data related to substrate processing performed by a substrate processing device, accepts the selection of an analysis program to be used for analysis from a plurality of analysis programs, and outputs the analysis results obtained by performing analysis on the acquired data using the selected analysis program.

19. An information processing system comprising: a first information processing device installed within a facility where a substrate processing device is installed, which acquires data to be analyzed from a database storing log data related to substrate processing performed by the substrate processing device, accepts the selection of an analysis program to be used for analysis from a plurality of analysis programs, and outputs the analysis results performed by the selected analysis program on the acquired data; and a second information processing device installed outside the facility, which acquires log data stored in the database by communicating with the first information processing device, stores the acquired log data in a third database, and outputs the analysis results performed by the analysis program on the log data stored in the third database.

20. The information processing system according to claim 19, comprising a terminal device that communicates with the first information processing device or the second information processing device, wherein the terminal device transmits the selection result of the analysis program to the first information processing device or the second information processing device, and displays the analysis result received from the first information processing device or the second information processing device.

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