Wiring material and production method for wiring structure
The described wiring material addresses the challenge of uniform rigidity by creating distinct rigid and flexible sections, enabling flexible installation by varying adhesive or base material thickness, thus allowing selective deformation.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- NOK CORP
- Filing Date
- 2026-01-15
- Publication Date
- 2026-07-23
AI Technical Summary
Conventional wiring materials face challenges in maintaining rigidity in specific areas while allowing deformation in others, leading to installation difficulties due to uniform rigidity throughout.
A strip-shaped wiring material with distinct first and second portions having different rigidity levels, achieved through varying thicknesses of joint adhesive layers or base materials, allowing selective deformation of the less rigid portion while maintaining the rigidity of the more rigid portion.
Enables easy deformation of less rigid portions while preserving the rigidity of the more rigid portions, facilitating installation in environments with varying rigidity requirements.
Smart Images
Figure JP2026001037_23072026_PF_FP_ABST
Abstract
Description
Method for Manufacturing Wiring Material and Wiring Structure
[0001] This disclosure relates to a wiring material.
[0002] A strip-shaped wiring material in which a plurality of wirings are formed on a flexible base material has been conventionally proposed. For example, Patent Document 1 discloses a flexible printed circuit board including a flexible base material and a conductor layer formed on the surface of the base material.
[0003] Japanese Unexamined Patent Application Publication No. 2024-078078
[0004] The rigidity of a wiring material such as a wiring board is equivalent throughout the entire area in a plan view. Therefore, in a form where the overall rigidity of the wiring material is high, for example, it may be difficult to sufficiently deform a portion that needs to be deformed when installing the wiring material. Also, in a form where the overall rigidity of the wiring material is low, there is a problem that a portion that needs to maintain its shape when installing the wiring material is easily deformed. Considering the above circumstances, one aspect of this disclosure aims to provide a wiring material that can easily deform other parts while maintaining the rigidity of a specific part.
[0005] A wiring material according to one aspect of this disclosure is a strip-shaped wiring material in which a plurality of wirings are covered by an insulating covering portion, including a first portion and a second portion at different positions in a plan view, and the rigidity of the first portion exceeds the rigidity of the second portion. <B
[0006] A method for manufacturing a wiring structure according to one aspect of this disclosure is a method for manufacturing a wiring structure including a strip-shaped wiring material in which a plurality of wirings are covered by an insulating covering portion, including a first portion and a second portion at different positions in a plan view, and the rigidity of the first portion exceeds the rigidity of the second portion, and a support member for supporting the wiring material, including a holding step of holding the first portion of the wiring material, a conveying step of conveying the wiring material while holding it, and a joining step of joining the wiring material to the support member after the conveying.
[0007] This is a plan view of the wiring material in the first embodiment. This is a cross-sectional view taken along the line a-a in Figure 1. This is a cross-sectional view taken along the line b-b in Figure 1. This is a side view of the wiring structure. This is a process diagram of the manufacturing method of the wiring structure. This is a cross-sectional view of the first part of the wiring material in the second embodiment. This is a cross-sectional view of the second part of the wiring material in the second embodiment. This is a plan view of the wiring material in the third embodiment. This is a side view of the wiring structure in the third embodiment. This is a plan view of the wiring material in the fourth embodiment. This is a side view of the wiring structure in the fourth embodiment. This is a plan view of the wiring material in the fifth embodiment. This is a cross-sectional view taken along the line c-c in Figure 12. This is a cross-sectional view taken along the line d-d in Figure 12. This is a cross-sectional view of the wiring material in a modified example of the fifth embodiment. This is a cross-sectional view of the wiring material in a modified example of the fifth embodiment. This is an enlarged cross-sectional view of the vicinity of the boundary between the first and second parts of the wiring material. This is an enlarged cross-sectional view of the vicinity of the boundary between the first and second parts of the wiring material. This is an enlarged cross-sectional view of the vicinity of the boundary between the first and second parts of the wiring material. This is a cross-sectional view of the wiring material in a modified example. This is a plan view of the wiring material in a modified example. This is a plan view of the wiring material in a modified example. This is a plan view of the wiring material in a modified example. This is a plan view of the wiring material in a modified example.
[0008] The embodiments for implementing this disclosure will be described with reference to the drawings. Note that the dimensions and scale of the elements in each drawing may differ from those of the actual product. Furthermore, the embodiments described below are illustrative examples of embodiments that may be envisioned when implementing this disclosure. Therefore, the scope of this disclosure is not limited to the embodiments exemplified below.
[0009] A: Figure 1 of the first embodiment is a plan view of the wiring material 100 in the first embodiment. As illustrated in Figure 1, the wiring material 100 is a flexible, strip-shaped connecting cable (i.e., a flexible flat cable). That is, the wiring material 100 can be easily deformed into any shape (elastic deformation or plastic deformation) by the action of an external force.
[0010] In the following explanation, we assume three mutually orthogonal axes (X-axis, Y-axis, and Z-axis). The wiring material 100 is a flat connecting cable formed in a long length along the Y-axis. That is, the direction of the Y-axis corresponds to the longitudinal direction of the wiring material 100. The direction of the X-axis corresponds to the short direction (i.e., the width direction) of the wiring material 100. The direction of the Z-axis corresponds to the thickness direction of the wiring material 100. In the following explanation, observing the elements from a line of sight along the Z-axis will be referred to as "planar view".
[0011] The wiring material 100 is a flexible wiring board including a covering portion 10 and a plurality of wires 20. The covering portion 10 is a flexible insulator that is elongated in the direction of the Y axis. The covering portion 10 covers the plurality of wires 20. The covering portion 10 of the first embodiment includes a first base material 11 and a second base material 12 that face each other. The first base material 11 and the second base material 12 are layered or film-like coatings formed of insulating material. The plurality of wires 20 are installed between the first base material 11 and the second base material 12.
[0012] Examples of materials for the first substrate 11 and the second substrate 12 include insulating materials such as polyimide, polyethylene naphthalate (PEN), polyethylene terephthalate (PET), or polyvinyl chloride (PVC). However, specific examples of insulating materials are not limited to the above examples and may be changed as desired. Furthermore, the materials for the first substrate 11 and the second substrate 12 may be the same or different.
[0013] The multiple wirings 20 are linear conductors formed from a low-resistance conductive material. Examples of conductive materials used to form each wiring 20 include, for example, a single metal such as copper or aluminum, or an alloy containing a low-resistance metal (e.g., copper or aluminum). Each wiring 20 may be, for example, a thin-film conductive pattern formed by patterning a conductive film, or a flat conductor that can maintain its shape on its own.
[0014] Each wiring 20 extends linearly in the direction of the Y-axis. Multiple wirings 20 are installed in parallel with spacing between them in the direction of the X-axis. Both ends of each wiring 20 in the direction of the Y-axis are connection terminals 21 exposed from the first base material 11 on the second base material 12. Each connection terminal 21 is connected to an external mounting component. The mounting component is, for example, other wiring material such as a wire harness, or an external device such as electrical equipment. In addition, various devices connected to the wiring 20 may be mounted on the wiring material 100. Examples of devices mounted on the wiring material 100 include semiconductor chips or circuit elements (e.g., resistors, capacitors, or coils). Therefore, the wiring material 100 can also be expressed as a wiring board or circuit board.
[0015] As illustrated in Figure 1, the wiring material 100 of the first embodiment includes a plurality of first portions 31 (31a, 31b) and one second portion 32 located at different positions in a plan view. Each first portion 31 and second portion 32 in the first embodiment is arranged in the longitudinal direction of the wiring material 100 (i.e., in the direction of the Y axis). Specifically, the first portion 31a is located in the negative direction of the Y axis with respect to the second portion 32, and the first portion 31b is located in the positive direction of the Y axis with respect to the second portion 32. That is, the second portion 32 is located between the first portion 31a and the first portion 31b in the direction of the Y axis.
[0016] The first portion 31 and the second portion 32 are parts of the wiring material 100 that have different rigidity (for example, bending rigidity in the thickness direction). Specifically, the rigidity of the first portion 31 is greater than that of the second portion 32. The rigidity of the first portion 31 and the second portion 32 is the bending rigidity against external forces in the direction along the Z-axis. That is, the first portion 31 of the wiring material 100 is less likely to bend in the direction of the Z-axis compared to the second portion 32. As described above, in the first embodiment, since the rigidity of the first portion 31 of the wiring material 100 is greater than that of the second portion 32, it is possible to easily deform the second portion 32 while maintaining the rigidity of the first portion 31.
[0017] Figure 2 is a cross-sectional view taken along the line a-a in Figure 1. That is, the cross-section of the first portion 31 of the wiring material 100 is shown in Figure 2. Note that the cross-sectional structure of the first portion 31a and the cross-sectional structure of the first portion 31b are the same. Figure 3 is a cross-sectional view taken along the line b-b in Figure 1. That is, the cross-section of the second portion 32 of the wiring material 100 is shown in Figure 3.
[0018] As illustrated in Figures 2 and 3, a joint 13 is interposed between the first substrate 11 and the second substrate 12 of the covering portion 10. The joint 13 is an adhesive for joining the first substrate 11 and the second substrate 12 to each other. Various adhesives such as acrylic resin, epoxy resin, phenolic resin, silicone resin, or polyurethane resin are exemplified as materials for the joint 13.
[0019] As illustrated in Figures 2 and 3, the thickness Ta1 of the joint 13 in the first portion 31 exceeds the thickness Ta2 of the joint 13 in the second portion 32 (Ta1 > Ta2). As described above, in the first embodiment, by making the thickness (Ta1, Ta2) of the joint 13 between the first base material 11 and the second base material 12 different between the first portion 31 and the second portion 32, a configuration in which the rigidity of the first portion 31 exceeds the rigidity of the second portion 32 can be easily realized. In addition, as the thickness of the joint 13 in the second portion 32 is reduced compared to the first portion 31, there is also the advantage that the second portion 32 can be made lighter.
[0020] Specifically, the joint 13 in the first portion 31 of the wiring material 100 is formed by laminating multiple adhesive layers 14. On the other hand, the joint 13 in the second portion 32 is formed by a single adhesive layer 14. That is, the number of layers of adhesive layers 14 in the first portion 31 exceeds the number of layers of adhesive layers 14 in the second portion 32. The thickness and material of each adhesive layer 14 may be the same or different.
[0021] Each adhesive layer 14 is formed by applying and curing an adhesive. For example, coating techniques such as screen printing are used for applying the adhesive. The number of times the adhesive is applied in the first part 31 exceeds the number of times the adhesive is applied in the second part 32. Note that any of the multiple adhesive layers 14 constituting the joint 13 of the first part 31 (for example, the bottom adhesive layer 14) and the adhesive layer 14 constituting the joint 13 of the second part 32 are formed collectively by a common process. However, the joint 13 of the first part 31 and the joint 13 of the second part 32 may be formed independently by separate processes. Furthermore, the method of applying the adhesive constituting each adhesive layer 14 is arbitrary. For example, a method of forming each adhesive layer 14 by laminating and bonding multiple semi-cured adhesives formed in thin films, or a method of forming an adhesive layer 14 of a predetermined thickness using a coating device such as a die coater may be employed.
[0022] Figure 4 is a side view of the structure (hereinafter referred to as "wiring structure 200") on which the wiring material 100 described above is mounted. As illustrated in Figure 4, the wiring structure 200 is a structure in which the wiring material 100 is mounted on the support member 50. Note that in Figure 4, the illustration of the laminated structure of the wiring material 100 as illustrated in Figures 2 and 3 is omitted for convenience. The same applies to the following figures.
[0023] The support member 50 is a member to which the wiring material 100 is joined. The support member 50 supports the wiring material 100. For example, a sheet metal member that constitutes the body frame of a mobile body such as an electric vehicle, or the exterior of a mobile body, is exemplified as the support member 50. The support member 50 includes a mounting surface Fa and a mounting surface Fb. The mounting surface Fa and the mounting surface Fb are surfaces on which the wiring material 100 is mounted, and are flat surfaces parallel to the X-Y plane. The mounting surface Fa and the mounting surface Fb are located at different heights. Specifically, the mounting surface Fb is at a higher position than the mounting surface Fa.
[0024] The first portion 31a of the wiring material 100 is joined to the mounting surface Fa. Specifically, the first portion 31a is bonded to the mounting surface Fa, for example, with an adhesive. The first portion 31b of the wiring material 100 is joined to the mounting surface Fb. Specifically, the first portion 31b is bonded to the mounting surface Fb, for example, with an adhesive. The second portion 32 is maintained in a deformed state along the step difference between the mounting surface Fa and the mounting surface Fb so as to span both the mounting surface Fa and the mounting surface Fb. As illustrated above, in the first embodiment, the wiring material 100 can be easily installed in an environment where parts requiring high rigidity (mounting surface Fa, mounting surface Fb) and parts requiring low rigidity (between mounting surface Fa and mounting surface Fb) are arranged in the longitudinal direction of the wiring material 100.
[0025] Figure 5 is an explanatory diagram of the procedure for mounting the wiring material 100 onto the support member 50 (manufacturing method of the wiring structure 200). In the first holding step P1, the wiring material 100 is held by the holding device 60. For example, a suction device that holds the surface of the wiring material 100 by suction is used as the holding device 60. In the holding step P1, each first portion 31 of the wiring material 100 is held by the holding device 60. On the other hand, the second portion 32 of the wiring material 100 is not held in the holding step P1. In the above description, the form in which the holding device 60 holds the wiring material 100 has been illustrated, but the method of holding the wiring material 100 is not limited to the above illustration. For example, the wiring material 100 may be held by hand by an operator.
[0026] In the transport process P2 following the holding process P1, the wiring material 100 is transported while being held by the holding device 60. Specifically, the wiring material 100 is transported as the holding device 60, which is holding the wiring material 100, moves vertically downward. That is, the wiring material 100 is brought closer to the support member 50. Specifically, the first portion 31a of the wiring material 100 is placed on the mounting surface Fa of the support member 50, and the first portion 31b of the wiring material 100 is placed on the mounting surface Fb of the support member 50. As mentioned above, the mounting surface Fa and the mounting surface Fb are at different heights. Therefore, in the process of the transport process P2, the second portion 32 of the wiring material 100 deforms in accordance with the difference in height between the mounting surface Fa and the mounting surface Fb.
[0027] In the joining process P3 following the transport process P2, the wiring material 100 is joined to the support member 50. Specifically, the first portion 31a of the wiring material 100 is joined to the mounting surface Fa by adhesive applied to the mounting surface Fa, and the first portion 31b of the wiring material 100 is joined to the mounting surface Fb by adhesive applied to the mounting surface Fb. By joining the wiring material 100 to the support member 50 through the above procedure, the wiring structure 200 is manufactured.
[0028] As described above, in the first embodiment, the first portion 31 of the wiring material 100, which has higher rigidity than the second portion 32, is held in the holding step P1. Therefore, compared to the configuration in which the second portion 32 is held in the holding step P1, excessive deformation of the wiring material 100 in the transport step P2 and the joining step P3 can be suppressed.
[0029] B: Second Embodiment The second embodiment will now be described. In each of the embodiments exemplified below, elements whose function is the same as in the first embodiment will use the same reference numerals as in the description of the first embodiment, and detailed descriptions of each will be omitted as appropriate.
[0030] Figures 6 and 7 are cross-sectional views of the wiring material 100 in the second embodiment. Figure 6 shows the cross-section of the first portion 31 of the wiring material 100 (the cross-section of line a-a in Figure 1), and Figure 7 shows the cross-section of the second portion 32 of the wiring material 100 (the cross-section of line b-b in Figure 1). In the second embodiment, the cross-sectional structure of the first portion 31a and the cross-sectional structure of the first portion 31b are the same.
[0031] As illustrated in Figures 6 and 7, in the second embodiment, the thickness Tb1 of the first base material 11 in the first portion 31 exceeds the thickness Tb2 of the first base material 11 in the second portion 32 (Tb1 > Tb2). In other words, in the second embodiment, by making the thickness (Tb1, Tb2) of the first base material 11 different between the first portion 31 and the second portion 32, a configuration in which the rigidity of the first portion 31 exceeds the rigidity of the second portion 32 can be easily realized. Furthermore, as the thickness of the first base material 11 in the second portion 32 is reduced compared to the first portion 31, there is also the advantage of achieving a lighter weight for the second portion 32.
[0032] Specifically, the first base material 11 in the first portion 31 of the wiring material 100 is composed of a lamination of multiple insulating layers 15. On the other hand, the first base material 11 in the second portion 32 is composed of a single insulating layer 15. That is, the number of layers of insulating layers 15 in the first portion 31 exceeds the number of layers of insulating layers 15 in the second portion 32. Note that any of the multiple insulating layers 15 constituting the first base material 11 of the first portion 31 (for example, the bottom insulating layer 15) and the insulating layer 15 constituting the first base material 11 of the second portion 32 may form a continuous single layer. Furthermore, the thickness and material of each insulating layer 15 may be the same or different.
[0033] In the second embodiment, the wiring material 100 is manufactured by the same procedure as in the first embodiment described above, with reference to Figure 5. For example, in the holding step P1 of the second embodiment, as in the first embodiment, each first portion 31 of the wiring material 100 is held by the holding device 60, while the second portion 32 is not held. The same effects as in the first embodiment are achieved in the second embodiment as well.
[0034] C: Third Embodiment Figure 8 is a plan view of the wiring material 100 in the third embodiment. The wiring material 100 in the third embodiment is composed of a first portion 31 and a second portion 32. Similar to the first embodiment, the rigidity of the first portion 31 exceeds the rigidity of the second portion 32. For example, the first embodiment is configured such that the thickness Ta1 of the joint portion 13 in the first portion 31 exceeds the thickness Ta2 of the joint portion 13 in the second portion 32, or the second embodiment is configured such that the thickness Tb1 of the first base material 11 in the first portion 31 exceeds the thickness Tb2 of the first base material 11 in the second portion 32.
[0035] Each of the first portion 31 and the second portion 32 is a long, strip-shaped portion in the direction of the Y-axis. The first portion 31 and the second portion 32 are arranged in the direction of the short side of the wiring material 100 (i.e., the direction of the X-axis). Specifically, the second portion 32 is located in the negative direction of the X-axis relative to the first portion 31. The end Ea1 of the first portion 31 located in the negative direction of the Y-axis and the end Ea2 of the second portion 32 located in the negative direction of the Y-axis are connected to each other.
[0036] Figure 9 is a side view of the wiring structure 200 in the third embodiment. As illustrated in Figure 9, the support member 50 in the third embodiment includes mounting surfaces F0, F1, and F2. Mounting surface F0 is located higher than mounting surfaces F1 and F2. Mounting surface F1 is also located higher than mounting surface F2.
[0037] As illustrated in Figure 9, the ends (Ea1, Ea2) of the wiring material 100 located in the negative direction of the Y-axis are joined to the mounting surface F0, for example, by adhesive. That is, the end Ea1 of the first portion 31 and the end Ea2 of the second portion 32 are located at the same height.
[0038] The end portion Eb1 of the first part 31 of the wiring material 100, located in the positive direction of the Y-axis, is joined to the mounting surface F1, for example, by an adhesive. On the other hand, the end portion Eb2 of the second part 32 of the wiring material 100, also located in the positive direction of the Y-axis, is joined to the mounting surface F2, for example, by an adhesive. The end portion Eb2 of the second part 32 is located lower than the end portion Eb1 of the first part 31. That is, the amount of deformation of the second part 32 is greater than the amount of deformation of the first part 31.
[0039] The same effects as in the first embodiment are achieved in the third embodiment. In addition, in the third embodiment, the first portion 31 and the second portion 32 are arranged in the short direction of the wiring material 100. Therefore, the wiring material 100 can be easily installed in an environment where a portion requiring high rigidity and a portion requiring low rigidity are arranged in the short direction of the wiring material 100.
[0040] D: Figure 10 of the fourth embodiment is a plan view of the wiring material 100 in the fourth embodiment. The wiring material 100 of the fourth embodiment is composed of a first portion 31 and a second portion 32. Similar to the first embodiment, the rigidity of the first portion 31 exceeds the rigidity of the second portion 32. For example, a configuration is adopted in which the thickness Ta1 of the joint portion 13 in the first portion 31 exceeds the thickness Ta2 of the joint portion 13 in the second portion 32 (first embodiment), or a configuration is adopted in which the thickness Tb1 of the first base material 11 in the first portion 31 exceeds the thickness Tb2 of the first base material 11 in the second portion 32 (second embodiment).
[0041] The first part 31 includes an extending portion 311 and an overhanging portion 312 in a plan view. The extending portion 311 is a portion extending in the longitudinal direction of the wiring member 100 (i.e., the direction of the Y-axis). The overhanging portion 312 is a portion protruding from the side of the extending portion 311. Specifically, the overhanging portion 312 protrudes in the negative X-axis direction from the vicinity of the center of the extending portion 311 in the Y-axis direction.
[0042] The second part 32 includes a first extending portion 321 and a second extending portion 322 in a plan view. The first extending portion 321 is a portion extending in the negative Y-axis direction from the overhanging portion 312 of the first part 31. The second extending portion 322 is a portion extending in the positive Y-axis direction from the overhanging portion 312 of the first part 31. That is, the overhanging portion 312 is located between the first extending portion 321 and the second extending portion 322 in the Y-axis direction.
[0043] FIG. 11 is a side view of the wiring structure 200 in the fourth embodiment. As illustrated in FIG. 11, the support member 50 of the fourth embodiment includes a mounting surface F0, a mounting surface F1, and a mounting surface F2. The mounting surface F1 and the mounting surface F2 are located in the negative X-axis direction with respect to the mounting surface F0. Also, the mounting surface F0 is at a higher position than the mounting surface F1 and the mounting surface F2. The mounting surface F1 and the mounting surface F2 are spaced apart from each other in the Y-axis direction. The mounting surface F1 and the mounting surface F2 are located at the same height.
[0044] As illustrated in FIG. 11, the extending portion 311 of the first part 31 of the wiring member 100 is joined to the mounting surface F0 by, for example, an adhesive. On the other hand, the first extending portion 321 of the second part 32 of the wiring member 100 is joined to the mounting surface F1 by, for example, an adhesive, and the second extending portion 322 of the second part 32 is joined to the mounting surface F2 by, for example, an adhesive.
[0045] The overhanging portion 312 of the first part 31 of the wiring member 100 is located at the same height as the extending portion 311. On the other hand, the end portions of each of the first extending portion 321 and the second extending portion 322 are at a lower position than the first part 31. That is, the first extending portion 321 is in a deformed state so as to descend from the height of the overhanging portion 312 to the mounting surface F1. Similarly, the second extending portion 322 is in a deformed state so as to descend from the height of the overhanging portion 312 to the mounting surface F2.
[0046] In the fourth embodiment, the same effects as those in the first embodiment are achieved. Further, in the fourth embodiment, while maintaining the rigidity of the first portion 31 including the extending portion 311 and the protruding portion 312, it is possible to easily deform the first extending portion 321 and the second extending portion 322 of the second portion 32.
[0047] E: Fifth Embodiment FIG. 12 is a plan view of the wiring member 100 in the fifth embodiment. The wiring member 100 of the fifth embodiment is a flexible strip-shaped connection cable (that is, a flexible flat cable), similar to the first embodiment. Specifically, the wiring member 100 is a flexible wiring board including a covering portion 10 and a plurality of wirings 20. The connection terminals 21 located at both ends of each wiring 20 protrude from both end faces of the covering portion 10 in the Y-axis direction.
[0048] In each of the above-described embodiments, the covering portion 10 having a configuration in which the first base material 11 and the second base material 12 are joined by the joining portion 13 is illustrated. The covering portion 10 of the fifth embodiment is a covering material integrally formed of an insulating material and covering a plurality of wirings 20. Examples of the material of the covering portion 10 include resin materials such as liquid crystal polymer (LCP), polyamide (PA), or polyether ether ketone (PEEK). As described above, the wiring member 100 of the fifth embodiment does not include the first base material 11 and the second base material 12 in the first embodiment.
[0049] The wiring member 100 of the fifth embodiment includes a plurality of first portions 31 (31a, 31b) and one second portion 32, similar to the first embodiment. The rigidity of the first portion 31 is higher than the rigidity of the second portion 32.
[0050] FIG. 13 is a cross-sectional view taken along the line c-c in FIG. 12, and FIG. 14 is a cross-sectional view taken along the line d-d in FIG. 12. In FIG. 13, a cross-section of the first portion 31 of the wiring member 100 is illustrated, and in FIG. 14, a cross-section of the second portion 32 of the wiring member 100 is illustrated.
[0051] As illustrated in Figures 13 and 14, the covering portion 10 includes a first surface portion 16, a second surface portion 17, and an intermediate portion 18. The first surface portion 16 is a flat plate-shaped portion of the covering portion 10 located in the positive Z-axis direction relative to the plurality of wirings 20. The second surface portion 17 is a flat plate-shaped portion of the covering portion 10 located in the negative Z-axis direction relative to the plurality of wirings 20. That is, the plurality of wirings 20 are located between the first surface portion 16 and the second surface portion 17. The intermediate portion 18 is a portion filled in the gaps between each wiring 20 between the first surface portion 16 and the second surface portion 17. The first surface portion 16, the second surface portion 17, and the intermediate portion 18 are integrally formed from the same material.
[0052] As illustrated in Figures 13 and 14, the thickness T11 of the first surface portion 16 in the first portion 31 exceeds the thickness T21 of the first surface portion 16 in the second portion 32 (T11 > T21). Also, the thickness T12 of the second surface portion 17 in the first portion 31 exceeds the thickness T22 of the second surface portion 17 in the second portion 32 (T12 > T22). Therefore, the thickness of the covering portion 10 in the first portion 31 exceeds the thickness of the covering portion 10 in the second portion 32. As described above, in the fifth embodiment, by making the thickness of the covering portion 10 different between the first portion 31 and the second portion 32, a configuration is achieved in which the rigidity of the first portion 31 exceeds the rigidity of the second portion 32.
[0053] In Figures 13 and 14, an example is shown in which the thickness T11 of the first surface portion 16 and the thickness T12 of the second surface portion 17 are the same in the first portion 31. However, as illustrated in Figure 15, a configuration in which the thickness T11 of the first surface portion 16 exceeds the thickness T12 of the second surface portion 17 in the first portion 31 is also conceivable (T11 > T12). In the configuration of Figure 15, the thickness T12 of the second surface portion 17 in the first portion 31 is the same as, for example, the thickness T22 of the second surface portion 17 in the second portion 32 (or the thickness T21 of the first surface portion 16).
[0054] Furthermore, as illustrated in Figure 16, a configuration in the first portion 31 where the thickness T12 of the second surface portion 17 exceeds the thickness T11 of the first surface portion 16 is also conceivable (T12 > T11). In the configuration of Figure 16, the thickness T11 of the first surface portion 16 in the first portion 31 is the same as, for example, the thickness T21 of the first surface portion 16 (or the thickness T22 of the second surface portion 17) in the second portion 32.
[0055] As described above, in the fifth embodiment, the rigidity of the first portion 31 of the wiring material 100 exceeds the rigidity of the second portion 32. Therefore, similar to the first embodiment, it is possible to easily deform the second portion 32 while maintaining the rigidity of the first portion 31.
[0056] F: The following are examples of specific modifications that may be added to the embodiments exemplified above. Two or more embodiments may be arbitrarily selected from the following examples and merged as appropriate, provided they do not contradict each other.
[0057] (1) Figure 17 is an enlarged cross-sectional view of the vicinity of the boundary between the first portion 31 and the second portion 32 of the wiring material 100. A cross-section parallel to the Y-Z plane and passing through one wiring 20 is shown in Figure 17. In a configuration in which the rigidity of the first portion 31 and the rigidity of the second portion 32 are different according to the number of layers of adhesive layer 14 (for example, the first embodiment), as illustrated in Figure 17, a stepped surface 131 substantially perpendicular to the adhesive layer 14 is formed at the boundary between the first portion 31 and the second portion 32.
[0058] As illustrated in Figure 18, the stepped surface 131 of the adhesive layer 14 at the boundary between the first portion 31 and the second portion 32 may be an inclined surface that is inclined with respect to the in-plane direction of the wiring material 100 (a direction parallel to the X-Y plane). Also, as illustrated in Figure 19, at the boundary between the first portion 31 and the second portion 32, the stepped surface 131 of the adhesive layer 14 may be a curved surface that is continuous across the first portion 31 and the second portion 32.
[0059] In addition, while Figures 17 to 19 illustrate a configuration in which the covering portion 10 includes a first base material 11 and a second base material 12, the configurations in Figures 17 to 19 are similarly applicable to the configuration of the fifth embodiment in which the covering portion 10 does not include a first base material 11 and a second base material 12. That is, in the covering portion 10 of the fifth embodiment, the stepped surface corresponding to the boundary between the first portion 31 and the second portion 32 may be a plane (Figure 17) substantially perpendicular to the in-plane direction of the wiring material 100, an inclined surface (Figure 18) inclined with respect to the in-plane direction, or a curved surface (Figure 19) that extends across the first portion 31 and the second portion 32.
[0060] (2) As illustrated in Figure 20, a plurality of voids 19 may be formed in the covering portion 10. Each void 19 is a space formed inside the covering portion 10. The plurality of voids 19 may extend in the direction of the Y axis, for example, or they may be formed as points dispersed in the in-plane direction and arranged in a matrix, for example. The rigidity of the covering portion 10 can be ensured by a configuration in which the parts of the covering portion 10 other than the voids 19 are spaced apart from the neutral plane of the covering portion 10 in the direction of the Z axis.
[0061] (3) In the above-described embodiments, a configuration in which one second portion 32 extends in the direction of the Y axis in the wiring material 100 has been illustrated, but the total number and planar shape of the first portion 31 and the second portion 32 are not limited to the above examples and may be changed as desired. For example, as illustrated in Figure 21, the second portion 32 may extend in a direction inclined with respect to the Y axis in a plan view. Also, as illustrated in Figure 22, multiple second portions 32 may be formed at different positions in the direction of the Y axis. As illustrated in Figure 23, multiple second portions 32 may be formed that are inclined at different angles with respect to the Y axis.
[0062] (4) In the first embodiment, an example was given in which the rigidity of the first portion 31 and the rigidity of the second portion 32 are made different according to the thickness of the joint portion 13. In the second embodiment, an example was given in which the rigidity of the first portion 31 and the rigidity of the second portion 32 are made different according to the thickness of the first base material 11. The configuration for making the rigidity of the first portion 31 and the rigidity of the second portion 32 different is not limited to the above examples.
[0063] For example, the rigidity of the first part 31 and the rigidity of the second part 32 may be made different by using different materials for the first part 31 and the second part 32. Specifically, at least a portion of the first part 31 and at least a portion of the second part 32 may be formed from materials with different elastic properties (e.g., Young's modulus, stiffness coefficient). For example, the materials of the first base material 11 or the second base material 12 may be different for the first part 31 and the second part 32, and the materials of the joint 13 (e.g., type of adhesive) may be different for the first part 31 and the second part 32.
[0064] Furthermore, the rigidity of the first portion 31 and the rigidity of the second portion 32 may be made different depending on the presence or thickness of the reinforcing material that increases rigidity. For example, one configuration is envisioned in which a reinforcing material is installed in the first portion 31, but no reinforcing material is installed in the second portion 32.
[0065] Furthermore, in the second embodiment, a configuration in which the thickness of the first base material 11 is different between the first portion 31 and the second portion 32 was illustrated. However, in addition to the above configuration, or in combination with the above configuration, the thickness of the second base material 12 may also be different between the first portion 31 and the second portion 32.
[0066] (5) In the embodiments described above, the wiring material 100 is shown to include a first portion 31 and a second portion 32 having different rigidity. However, the wiring material 100 may further include one or more portions that have different rigidity from the first portion 31 and the second portion 32.
[0067] For example, as illustrated in Figure 24, the wiring material 100 may include a third portion 33 (33a, 33b) in addition to the first portion 31 and the second portion 32. The first portion 31, the second portion 32, and the third portion 33 are arranged in the longitudinal direction (i.e., the direction of the Y axis) of the wiring material 100. Specifically, in a plan view, the third portion 33a is located between the first portion 31a and the second portion 32, and the third portion 33b is located between the first portion 31b and the second portion 32. The positional relationship between the first portion 31, the second portion 32, and the third portion 33 may be arbitrarily changed.
[0068] The rigidity of the third portion 33 is intermediate between the rigidity of the first portion 31 and the rigidity of the second portion 32. That is, the rigidity of the third portion 33 is greater than the rigidity of the second portion 32 and less than the rigidity of the first portion 31. For example, the thickness of the joint 13 in the third portion 33 is intermediate between the thickness Ta1 of the joint 13 in the first portion 31 and the thickness Ta2 of the joint 13 in the second portion 32. Alternatively, the thickness of the first base material 11 in the third portion 33 is intermediate between the thickness Tb1 of the first base material 11 in the first portion 31 and the thickness Tb2 of the first base material 11 in the second portion 32.
[0069] In Figure 24, the third portion 33 is shown as an example in which it extends linearly in the short direction (i.e., the X-axis direction) of the wiring material 100, but the planar shape of the third portion 33 can be arbitrarily changed. For example, the third portion 33 may be formed in a shape that curves in the X-Y plane when viewed from above. That is, the position of each part of the third portion 33 may change in the direction of the X-axis or Y-axis.
[0070] (6) In the embodiments described above, each wiring 20 is shown as being covered by the covering portion 10 around its entire circumference, but only a part of each wiring 20 may be covered by the covering portion 10. For example, one of the first base material 11 and the second base material 12 in the embodiments described above may be omitted.
[0071] (7) In the embodiments described above, the wiring material 100 is shown to include a first base material 11 and a second base material 12, but members that realize specific functions may be added to the wiring material 100. For example, members having various functions such as seismic resistance, heat resistance, heat dissipation, flame retardancy, abrasion resistance, or magnetic resistance may be laminated on the covering portion 10 (first base material 11 or second base material 12).
[0072] (8) In each of the embodiments described above, the wiring material 100 is shown as having a single layer of wiring 20, but this disclosure also applies to multilayer wiring material 100 in which the wiring 20 is composed of multiple layers.
[0073] (9) The notation "nth" (where n is a natural number) in this application is used solely as a formal and convenient label to distinguish each element in notation and has no substantive meaning whatsoever. Therefore, there is no room for restrictive interpretation of the position or manufacturing order of each element based on the notation "nth".
[0074] G: From the forms exemplified above, the following configurations can be understood, for example.
[0075] A wiring material according to one aspect of the present disclosure (Aspect 1) is a strip-shaped wiring material in which a plurality of wires are covered with an insulating coating, and includes a first portion and a second portion located at different positions in a plan view, wherein the rigidity of the first portion exceeds that of the second portion. In this aspect, since the rigidity of the first portion of the wiring material exceeds that of the second portion, it is possible to easily deform the second portion while maintaining the rigidity of the first portion.
[0076] In a specific example of Embodiment 1 (Embodiment 2), the covering portion includes a first base material and a second base material joined to each other via a joint, the plurality of wirings are located between the first base material and the second base material, and the thickness of the joint in the first portion exceeds the thickness of the joint in the second portion. In the above embodiment, by making the thickness of the joint between the first base material and the second base material different in the first portion and the second portion, a configuration in which the rigidity of the first portion exceeds the rigidity of the second portion can be easily realized.
[0077] In a specific example of Embodiment 1 or Embodiment 2 (Embodiment 3), the covering portion includes a first substrate and a second substrate, the plurality of wirings are located between the first substrate and the second substrate, and the thickness of the first substrate in the first portion exceeds the thickness of the first substrate in the second portion. In the above embodiments, by making the thickness of the first substrate different between the first portion and the second portion, a configuration in which the rigidity of the first portion exceeds the rigidity of the second portion can be easily realized.
[0078] In any specific example of Embodiments 1 to 3 (Embodiment 4), the first portion and the second portion are arranged in the longitudinal direction of the wiring material. In the above embodiments, the wiring material can be easily installed in an environment in which a portion requiring high rigidity and a portion requiring low rigidity are arranged in the longitudinal direction of the wiring material.
[0079] In any specific example of Embodiments 1 to 4 (Embodiment 5), the first portion and the second portion are arranged in the short-side direction of the wiring material. In the above embodiments, the wiring material can be easily installed in an environment where a portion requiring high rigidity and a portion requiring low rigidity are arranged in the short-side direction of the wiring material.
[0080] In any specific example of Embodiments 1 to 5 (Embodiment 6), the first portion includes an extended portion extending in the longitudinal direction of the wiring material and a protruding portion projecting from the side of the extended portion, and the second portion includes a first extended portion extending from the protruding portion to one side in the longitudinal direction and a second extended portion extending from the protruding portion to the other side in the longitudinal direction. In the above embodiments, it is possible to easily deform the first extended portion and the second extended portion of the second portion while maintaining rigidity in the first portion including the extended portion and the protruding portion.
[0081] A method for manufacturing a wiring structure according to one aspect of the present disclosure (Aspect 7) is a method for manufacturing a wiring structure comprising a strip-shaped wiring material in which a plurality of wires are covered with an insulating coating, the wiring material including a first portion and a second portion located at different positions in a plan view, wherein the rigidity of the first portion exceeds that of the second portion, and a support member for supporting the wiring material, the method comprising a holding step of holding the first portion of the wiring material, a transport step of transporting the wiring material while it is being held, and a joining step of joining the wiring material to the support member after the transport. In the above aspect, the first portion of the wiring material, which has higher rigidity than the second portion, is held. Therefore, compared to a configuration in which the second portion is held in the holding step, excessive deformation of the wiring material in the transport step and the joining step can be suppressed.
[0082] 100… Wiring material, 200… Wiring structure, 10… Covered portion, 11… First substrate, 12… Second substrate, 13… Joint portion, 14… Adhesive layer, 15… Insulation layer, 20… Wiring, 21… Connecting terminal, 31, 31a, 31b… First part, 311… Extended portion, 312… Extended portion, 32… Second part, 321… First extended portion, 322… Second extended portion, 33… Third part, 50… Supporting material, 60… Holding device.
Claims
1. A strip-shaped wiring material in which multiple wires are covered by an insulating coating, comprising a first portion and a second portion located at different positions in a plan view, wherein the rigidity of the first portion exceeds that of the second portion.
2. The wiring material according to claim 1, wherein the covering portion includes a first base material and a second base material joined to each other via a joint, the plurality of wirings are located between the first base material and the second base material, and the thickness of the joint in the first portion exceeds the thickness of the joint in the second portion.
3. The wiring material according to claim 1, wherein the covering portion includes a first substrate and a second substrate, the plurality of wirings are located between the first substrate and the second substrate, and the thickness of the first substrate in the first portion exceeds the thickness of the first substrate in the second portion.
4. The wiring material according to claim 1, wherein the first part and the second part are arranged in the longitudinal direction of the wiring material.
5. The wiring material according to claim 1, wherein the first portion and the second portion are arranged in the short direction of the wiring material.
6. The wiring material according to claim 1, wherein the first portion includes an extended portion extending in the longitudinal direction of the wiring material and an overhang portion projecting from the side of the extended portion, and the second portion includes a first extended portion extending from the overhang portion to one side in the longitudinal direction and a second extended portion extending from the overhang portion to the other side in the longitudinal direction.
7. A method for manufacturing a wiring structure comprising: a strip-shaped wiring material having multiple wires covered by an insulating coating, including a first portion and a second portion located at different positions in a plan view, wherein the rigidity of the first portion exceeds that of the second portion; and a support member for supporting the wiring material, the method comprising: a holding step of holding the first portion of the wiring material; a transport step of transporting the wiring material while it is being held; and a joining step of joining the wiring material to the support member after the transport.