Electronic device comprising shield can

Abstract

The electronic device according to various embodiments may comprise a first printed circuit board. The electronic device may comprise a first electronic component disposed at one side of the first printed circuit board. The electronic device may comprise a first shield can disposed at one side of the first printed circuit board. The first shield can may at least partially surround the first electronic component. The electronic device may comprise a second electronic component disposed at the side opposite to the one side of the first printed circuit board. The electronic device may comprise a second shield can at least partially surrounding the second electronic component. The thermal conductivity of the first shield can may be different from the thermal conductivity of the second shield can.

Description

Electronic device including a shield can

[0001] The present disclosure relates to an electronic device comprising a shield can.

[0002] An electronic device may include various electronic components to perform various functions. For example, electronic elements or circuit lines may be placed on a printed circuit board (PCB). Electromagnetic waves generated from these electronic components can adversely affect the operation of the electronic device. For example, electromagnetic interference (EMI) phenomena may occur due to electromagnetic waves. EMI generated by electronic components can be harmful to the human body and can act as noise for devices susceptible to such effects. The electronic device may include a shield can capable of shielding the EMI generated by the electronic components.

[0003] Electronic components embedded in electronic devices can generate high temperatures due to the various functions they perform. High temperatures can cause malfunctions in electronic devices and cause discomfort to users. Electronic devices may include a heat dissipation structure capable of effectively diffusing heat generated from electronic components to the surroundings or transferring it to other areas.

[0004] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art in relation to the present disclosure.

[0005] An electronic device according to one embodiment may include a first printed circuit board. The electronic device may include a first electronic component disposed on one side of the first printed circuit board. The electronic device may include a first shield can disposed on one side of the first printed circuit board. The first shield can may at least partially surround the first electronic component. The electronic device may include a second electronic component disposed on the opposite side of the first printed circuit board. The electronic device may include a second shield can that at least partially surrounds the second electronic component. The thermal conductivity of the first shield can may be different from the thermal conductivity of the second shield can.

[0006] A printed circuit board assembly according to one embodiment may include a first printed circuit board. The printed circuit board assembly may include a first electronic component disposed on one side of the first printed circuit board. The first printed circuit board assembly may include a first shield can disposed on one side of the first printed circuit board. The first shield can may at least partially surround the first electronic component. The printed circuit board assembly may include a second electronic component disposed on the opposite side of the first printed circuit board. The printed circuit board assembly may include a second shield can that at least partially surrounds the second electronic component. The thermal conductivity of the first shield can may differ from the thermal conductivity of the second shield can.

[0007] FIG. 1 is a front perspective view of an electronic device according to one embodiment.

[0008] FIG. 2 is a rear perspective view of an electronic device according to one embodiment.

[0009] FIG. 3 is an exploded perspective view of an electronic device according to one embodiment.

[0010] FIG. 4 is a cross-sectional view of a printed circuit board assembly including a first shield can and a second shield can according to one embodiment.

[0011] FIG. 5 is a cross-sectional view of a printed circuit board assembly according to one embodiment, in which the thermal conductivity of the first shield can is higher than the thermal conductivity of the second shield can.

[0012] FIG. 6 is a cross-sectional view of a printed circuit board assembly according to one embodiment, in which the thermal conductivity of the first shield can is lower than the thermal conductivity of the second shield can.

[0013] FIG. 7 is a cross-sectional view of a printed circuit board assembly including a first shield can, a second shield can, and a third shield can according to one embodiment.

[0014] FIG. 8 is a cross-sectional view of a printed circuit board assembly according to one embodiment, in which the thermal conductivity of the first shield can is higher than the thermal conductivity of the second shield can and the thermal conductivity of the third shield can.

[0015] FIG. 9 is a cross-sectional view of a printed circuit board assembly according to one embodiment, in which the thermal conductivity of the second shield can is lower than the thermal conductivity of the first shield can and the thermal conductivity of the third shield can.

[0016] FIG. 10 is a cross-sectional view of a printed circuit board assembly according to one embodiment, in which the thermal conductivity of the first shield can is lower than the thermal conductivity of the second shield can and the thermal conductivity of the third shield can.

[0017] FIG. 11 is a cross-sectional view of a printed circuit board assembly according to one embodiment, in which the thermal conductivity of the second shield can is higher than the thermal conductivity of the first shield can and the thermal conductivity of the third shield can.

[0018] FIG. 12 is a cross-sectional view of a printed circuit board assembly according to one embodiment, in which the thermal conductivity of the third shield can is lower than the thermal conductivity of the first shield can and the thermal conductivity of the second shield can.

[0019] FIG. 13 is a cross-sectional view of a printed circuit board assembly according to one embodiment, which does not include a second thermal interface material (TIM) and has a thermal conductivity of the first shield can higher than that of the second shield can.

[0020] FIG. 14 is a cross-sectional view of a printed circuit board assembly according to one embodiment, which does not include a second heat transfer material and has a thermal conductivity of the second shield can higher than that of the first shield can.

[0021] FIG. 15 is a cross-sectional view of a printed circuit board assembly according to one embodiment, in which the thermal conductivity of the first heat transfer material and the thermal conductivity of the second heat transfer material are different.

[0022] FIG. 16 is a front view of an electronic device according to one embodiment.

[0023] FIG. 17 is a plan view of the rear direction of an electronic device according to one embodiment.

[0024] FIG. 18 is a partially exploded perspective view of the electronic device of FIG. 1 and FIG. 2 including a hinge device according to one embodiment.

[0025] FIG. 19 is a partial cross-sectional view of an electronic device including a printed circuit board assembly according to one embodiment.

[0026] Embodiments of the present disclosure are described below in detail with reference to the attached drawings so that those skilled in the art can easily implement them. However, the present disclosure may be embodied in various different forms and is not limited to the embodiments described herein. Furthermore, in order to clearly explain the present disclosure in the drawings, parts unrelated to the explanation have been omitted, and similar parts throughout the specification are denoted by similar reference numerals.

[0027] The terms used in this disclosure are described in their current, general form considering the functions mentioned herein; however, they may refer to various other terms depending on the intent of those skilled in the art, case law, or the emergence of new technologies. Accordingly, the terms used in this disclosure should not be interpreted solely by their names, but should be interpreted based on the meaning of the terms and the overall content of this disclosure.

[0028] An electronic device according to various embodiments of this document may include, for example, at least one of a smartphone, a tablet personal computer, a mobile phone, a video phone, an e-book reader, a desktop personal computer, a laptop personal computer, a netbook computer, a workstation, a server, a personal digital assistant (PDA), a portable multimedia player (PMP), an MP3 player, a mobile medical device, a camera, or a wearable device. According to various embodiments, the wearable device may include at least one of an accessory type (e.g., a watch, a ring, a bracelet, an anklet, a necklace, glasses, a contact lens, or a head-mounted device (HMD)), a fabric or clothing integrated type (e.g., electronic clothing), a body-attached type (e.g., a skin pad or a tattoo), or a bio-implantable type (e.g., an implantable circuit).

[0029] In one embodiment, the electronic device may be a home appliance. The home appliance may include, for example, at least one of a television, a DVD (digital video disk) player, audio, a refrigerator, an air conditioner, a vacuum cleaner, an oven, a microwave oven, a washing machine, an air purifier, a set-top box, a home automation control panel, a security control panel, a TV box, a game console, an electronic dictionary, an electronic key, a camcorder, or a digital photo frame.

[0030] In one embodiment, the electronic device comprises various medical devices (e.g., various portable medical measuring devices (blood glucose meters, heart rate monitors, blood pressure monitors, or body temperature monitors), MRA (magnetic resonance angiography), MRI (magnetic resonance imaging), CT (computer tomography), imaging devices, or ultrasound devices), navigation devices, global navigation satellite systems (GNSS (global navigation satellite system)), event data recorders (EDR), flight data recorders (FDR), automotive infotainment devices, marine electronic equipment (e.g., marine navigation devices, or gyrocompasses), avionics, security devices, vehicle head units, industrial or domestic robots, ATMs (automatic teller's machines) of financial institutions, POS (point of sales) of stores, or Internet of Things devices (e.g., light bulbs, various sensors, electric or gas meters, sprinkler systems, fire alarms, thermostats, streetlights, It may include at least one of a toaster, exercise equipment, hot water tank, heater, or boiler.

[0031] According to one embodiment, the electronic device may include at least one of furniture or part of a building / structure, an electronic board, an electronic signature receiving device, a projector, or various measuring instruments (e.g., water, electricity, gas, or radio wave measuring instruments). In various embodiments, the electronic device may be a combination of one or more of the various devices described above. The electronic device according to one embodiment may be a flexible electronic device. Furthermore, the electronic device according to the embodiments of this document is not limited to the devices described above and may include new electronic devices resulting from technological advancements.

[0032] Additionally, terms such as "first," "second," etc., may be used to describe various components, but the components should not be limited by these terms. These terms are used for the purpose of distinguishing one component from another.

[0033] Throughout the specification, when a configuration is described as being "connected" to another configuration, this includes not only cases where they are "directly connected," but also cases where they are connected with another configuration in between. Furthermore, when a part is described as "including" a component, this means that, unless specifically stated otherwise, it does not exclude other components but may include additional components.

[0034] Phrases such as "according to one embodiment" and "in one embodiment" appearing in various places in this disclosure do not necessarily refer to the same embodiment. Furthermore, phrases such as "according to one embodiment" and "in one embodiment" appearing in various places in this disclosure do not necessarily refer to different embodiments. For example, each embodiment may be combined with one another.

[0035] FIG. 1 is a front perspective view of an electronic device according to one embodiment.

[0036] FIG. 2 is a rear perspective view of an electronic device according to one embodiment.

[0037] Referring to FIGS. 1 and 2, an electronic device (100) according to one embodiment may include a housing (110) comprising a first surface (or front) (110A), a second surface (or rear) (110B), and a side (or side wall) (110C) surrounding the space between the first surface (110A) and the second surface (110B). In one embodiment, the housing (110) may refer to a structure forming part of the first surface (110A), the second surface (110B), and the side (110C).

[0038] According to one embodiment, the first surface (110A) may be formed by a front plate (121) (e.g., a glass plate or a polymer plate having various coating layers) in which at least one portion is substantially transparent. In one example, the front plate (121) may include a curved portion that extends seamlessly from the first surface (110A) toward the rear plate (111) at at least one side edge portion.

[0039] In one embodiment, the second surface (110B) may be formed by a substantially opaque back plate (111). In one example, the back plate (111) may be formed by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the materials. In one example, the back plate (111) may include a curved portion that extends seamlessly from the second surface (110B) toward the front plate (121) at at least one end. In the present disclosure, the back plate may be referred to as a back cover.

[0040] In one embodiment, the side (110C) may be formed by a side member (131) (or a side bezel structure or side wall) comprising metal and / or a polymer, combined with the front plate (121) and the rear plate (111). In one example, the side (110C) is located on the right side of the electronic device (100) (e.g., the +x direction in FIG. 1) and comprises a first side (1111) extending along a first direction (e.g., the +y direction in FIG. 1), a second side (1112) parallel to the first side (1111) and extending along the first direction, a third side (1113) extending along a second direction perpendicular to the first direction (e.g., the +x direction in FIG. 1) and connecting one end of the first side (1111) (e.g., one end in the +y direction in FIG. 1) and one end of the second side (1112) (e.g., one end in the +y direction in FIG. 1), and / or a fourth side (1113) parallel to the third side (1113) and connecting the other end of the first side (1111) (e.g., one end in the -y direction in FIG. 1) and the other end of the second side (1112) (e.g., one end in the -y direction in FIG. 1). It may include a side (1114).

[0041] According to one embodiment, the electronic device (100) may include at least one of a display (120), a first optical sensor (e.g., a sensor module and / or a camera module) (103), a connector hole (104), an audio module (105), or a key input device (107). In one example, the electronic device (100) may omit at least one or additionally include other components. For example, the electronic device (100) may further include a sensor module not illustrated. The electronic device (100) may omit the key input device (107).

[0042] In one embodiment, a sensor such as a proximity sensor, an ambient light sensor, an image sensor, or an iris sensor may be integrated into the display (120) or positioned adjacent to the display (120) within the area provided by the front plate (121).

[0043] In one embodiment, the display (120) may be visually exposed through a significant portion of the front plate (121). In one example, the display (120) may be combined with or placed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer that detects a magnetic field-type stylus pen. In one example, the corners of the display (120) may be formed to be largely identical to the adjacent outer shape (e.g., a curved surface) of the front plate (121).

[0044] In one embodiment, the connector hole (104) may accommodate an external electronic device (e.g., a connector for transmitting and receiving power and / or data with the electronic device, and / or a connector for transmitting and receiving audio signals with the external electronic device). For example, the connector hole (104) may include a USB connector or an earphone jack (not shown) (or, "earphone interface"). In one embodiment, the USB connector and the earphone jack may be implemented as a single hole, and in one embodiment, the electronic device (100) may transmit and receive power and / or data or transmit and receive audio signals with the external device without a separate connector hole.

[0045] In one embodiment, the audio module (105) may include a microphone hole and a speaker hole. A microphone may be placed inside the microphone hole to acquire external sound, and a plurality of microphones may be placed inside to detect the direction of sound. In one example, the speaker hole and the microphone hole may be implemented as a single hole, or a speaker (e.g., a piezo speaker) may be included without a speaker hole. The speaker hole may include an external speaker hole and a receiver hole for calls.

[0046] In one embodiment, the key input device (107) may be positioned on the side (110C) of the housing (110). In one embodiment, the electronic device (100) may not include some or all of the aforementioned key input devices (107), and the key input devices (107) that are not included may be implemented in other forms, such as soft keys, on the display (120). In one example, the key input device (107) may include at least a portion of a fingerprint sensor positioned on the second side (110B) of the housing (110).

[0047] In one embodiment, the second optical sensor (130) and the third optical sensor (106) may be placed on the second side (110B) of the electronic device (100). The second optical sensor (130) may include a plurality of cameras. In one example, the third optical sensor (106) may include a flash. In one example, the first optical sensor (103), the second optical sensor (130), and the third optical sensor (106) may include one or more lenses, an image sensor, and / or an image processor. The third optical sensor (106) may include a light-emitting diode or a xenon lamp. In one example, two or more lenses (e.g., an infrared camera, a wide-angle and / or telephoto lens) and image sensors may be placed on one side of the electronic device (100).

[0048] In one embodiment, the electronic device (100) may generate an electronic signal or data value corresponding to an internal operating state or an external environmental state by including a sensor module not illustrated. The electronic device (100) may further include at least one of a sensor module not illustrated, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a temperature sensor, or a humidity sensor.

[0049] FIG. 3 is an exploded perspective view of an electronic device according to one embodiment.

[0050] The configuration of FIG. 3 may be referenced by the configuration of other drawings to the extent that they are not mutually disposed. The same terms and / or the same reference numerals have been used for configurations that are identical or substantially identical to the configuration of other drawings.

[0051] Referring to FIG. 3, an electronic device (100) according to one embodiment may include a display (120), a support member (140) supporting the display (120), a rear cover (111), and a printed circuit board assembly. However, the configuration of the electronic device (100) is not limited thereto. For example, the electronic device (100) may omit at least one of the configurations described above or may include at least one additional configuration. For example, the electronic device (100) may further include at least one heat dissipation member that transfers, diffuses, or releases heat generated from the printed circuit board assembly. For example, the electronic device (100) may further include at least one of a first heat dissipation member (151), a second heat dissipation member (152), or a heat diffusion member (160).

[0052] According to one embodiment, the display (120) may be positioned to be supported by a support member (140). For example, the display (120) may be positioned on one side of the support member (140). For example, the display (120) may be positioned to face the direction in which the front of the electronic device (100) faces (e.g., the +z direction).

[0053] According to one embodiment, the rear cover (111) may be positioned to be supported by a support member (140). For example, the rear cover (111) may be positioned on the other side of the support member (140). For example, the rear cover (111) may be positioned on the opposite side of the display (120). The rear cover (111) may be positioned to face the direction in which the rear of the electronic device (100) faces (e.g., the -z direction). For example, the rear cover (111) may face in the opposite direction to the display (120).

[0054] According to one embodiment, the support member (140) may be included in at least a part of the housing (e.g., the housing (110) of FIG. 1) or may include at least a part of the housing. For example, when referred to together with FIG. 1 and FIG. 2, the support member (140) may include a side (or side wall) (110C) that surrounds the space between the first surface (110A) and the second surface (110B).

[0055] According to one embodiment, various electronic components may be disposed on the support member (140). For example, a printed circuit board assembly may be disposed on the support member (140). The printed circuit board assembly may include a first printed circuit board (200), a first shield can (210), and a second shield can (220). However, the configuration of the printed circuit board assembly is not limited thereto. For example, the printed circuit board assembly may omit at least one of the configurations described above or may include at least one additional configuration. For example, the printed circuit board assembly may further include a shielding member (230).

[0056] According to one embodiment, at least one heat dissipation member configured to absorb heat generated from a printed circuit board assembly and transfer, diffuse, or release it to other areas of the electronic device (100) may be disposed in the support member (140). For example, a first heat dissipation member (151) may be disposed between the display (120) and the support member (140). A second heat dissipation member (152) may be disposed between the rear cover (111) and the support member (140). However, it is not limited thereto. For example, the electronic device (100) may omit at least one of the first heat dissipation member (151) or the second heat dissipation member (152), or may include at least one additional heat dissipation member. For example, the electronic device (100) may include at least one heat diffusion member (160). The heat diffusion member (160) may be disposed between the display (120) and the support member (140). The heat diffusion member (160) may be configured to absorb heat generated from the printed circuit board assembly and transfer, diffuse, or release it to other areas of the electronic device (100).

[0057] According to one embodiment, the heat dissipation member (e.g., the first heat dissipation member (151) and / or the second heat dissipation member (152)) may include a graphite sheet. However, it is not limited thereto. The heat diffusion member (160) may include at least one of a vapor chamber or a heat pipe. However, it is not limited thereto. In order to utilize the heat conduction and heat dissipation functions of the heat diffusion member (160), such as a vapor chamber or a heat pipe, more efficiently, the heat transfer and release efficiency can be increased by arranging the shield can or heat transfer material such that the heat conductivity of the shield can or heat transfer material closer to the heat diffusion member (160) is higher than the heat conductivity of the shield can or heat transfer material not closer thereto.

[0058] According to one embodiment, the first shield can (210) may be positioned closer to the front of the electronic device (100) (e.g., the first surface (110A) of FIG. 1) than the second shield can (220). The first shield can (210) may be positioned closer to the display (120) than the second shield can (220). The first shield can (210) may be positioned closer to the first heat dissipation member (151) than the second shield can (220). The first shield can (210) may be positioned closer to the heat diffusion member (160) than the second shield can (220).

[0059] According to one embodiment, the second shield can (220) may be positioned closer to the rear of the electronic device (100) (e.g., the second surface (110B) of FIG. 2) than the first shield can (210). The second shield can (220) may be positioned closer to the rear cover (111) than the first shield can (210). The second shield can (220) may be positioned closer to the second heat dissipation member (152) than the first shield can (210).

[0060] According to one embodiment, the display (120) may be positioned so as to face in a direction (e.g., +z direction) from the second shield can (220) toward the first shield can (210). The rear cover (111) may be positioned so as to face in a direction (e.g., -z direction) from the first shield can (210) toward the second shield can (220).

[0061] FIG. 4 is a cross-sectional view of a printed board assembly including a first shield can and a second shield can according to one embodiment.

[0062] The configuration of the printed circuit board assembly (20) of FIG. 4 may be referenced by the configuration of another drawing within the scope that they are not arranged with each other. The same terms and / or the same reference numerals have been used for configurations that are identical or substantially identical to the configuration of another drawing.

[0063] According to one embodiment, one side (or one surface) of the first printed circuit board (200) may include a side (or surface) facing the +z direction from the first printed circuit board (200). The other side (or other surface) of the first printed circuit board (200) may include a side (or surface) facing the -z direction from the first printed circuit board (200). In the present disclosure, one side of the first printed circuit board (200) is named at least one of a surface, an upper surface, a first side, or a first surface, and the other side of the first printed circuit board (200) may be named at least one of a second surface, a back surface, a second side, or a second surface.

[0064] According to one embodiment, at least one first electronic component (260, 270) may be disposed on one side of the first printed circuit board (200). The first electronic component (260, 270) may include a heat-generating component that generates heat during the operation of the electronic device. For example, the first electronic component (260, 270) may include at least one of an application processor (AP), a random-access memory, or a charging integrated circuit that generates heat during the operation of the electronic device. For example, the memory may include a dynamic random-access memory (DRAM). However, it is not limited thereto.

[0065] According to one embodiment, at least one electronic element may be disposed on one side of the first printed circuit board (200). The electronic element may include at least one of a resistor, a capacitor, or an inductor disposed on the first printed circuit board (200). However, it is not limited thereto.

[0066] According to one embodiment, the first shield can (210) may be placed on one side of the first printed circuit board (200). The first shield can (210) may be placed to shield electromagnetic waves and / or noise generated from the first electronic component (260, 270). For example, the first shield can (210) may at least partially surround the first electronic component (260, 270). For example, the first shield can (210) may overlap at least partially with the first electronic component (260, 270). For example, at least a portion of at least one of the top (212) or side (213) of the first shield can (210) may be placed to at least partially cover the first electronic component (260, 270). For example, the first electronic component (260, 270) may be placed within the space formed by the first shield can (210) and the first printed circuit board (200). For example, the first electronic component (260, 270) may be placed within the space enclosed by one side of the first shield can (210) and the first printed circuit board (200).

[0067] According to one embodiment, the first shield can (210) may be positioned so as to be spaced apart from the first electronic component (260, 270) by a predetermined distance. For example, at least one of the top (212) or side (213) of the first shield can (210) may be spaced apart from the first electronic component (260, 270) by a predetermined distance. However, it is not limited thereto.

[0068] According to one embodiment, the first shield can (210) may include an opening (211) formed at a position corresponding to the first electronic component (260, 270). For example, the first shield can (210) may include an opening (211) formed at a position overlapping with the first electronic component (260, 270).

[0069] According to one embodiment, at least one second electronic component (280) may be disposed on the opposite side of one side of the first printed circuit board (200). For example, at least one second electronic component (280) may be disposed on the other side of the first printed circuit board (200). For example, the first printed circuit board (200) may be disposed between at least one first electronic component (260, 270) and at least one second electronic component (280).

[0070] According to one embodiment, the second shield can (220) may be positioned on the opposite side of the first shield can (210). For example, the second shield can (220) may be positioned on the opposite side of one side of the first printed circuit board (200). For example, the second shield can (220) may be positioned on the other side of the first printed circuit board (200). The second shield can (220) may be positioned to shield electromagnetic waves and / or noise generated from the second electronic component (280). For example, the second shield can (220) may at least partially surround the second electronic component (280). For example, the second shield can (220) may at least partially overlap the second electronic component (280). For example, at least a portion of the top or side of the second shield can (220) may be positioned to at least partially cover the second electronic component (280). For example, the second electronic component (280) may be placed within the space formed by the second shield can (220) and the first printed circuit board (200). For example, the second electronic component (280) may be placed within the space enclosed by one side of the second shield can (220) and the first printed circuit board (200).

[0071] According to one embodiment, the second shield can (220) may be positioned to face in the opposite direction to the first shield can (210). For example, the first shield can (210) may face the front of the electronic device (e.g., the first side (110A) of FIG. 1), and the second shield can (220) may face the rear of the electronic device (e.g., the second side (110B) of FIG. 2). For example, the first shield can (210) may be positioned to face the direction in which the front of the electronic device faces, and the second shield can (220) may be positioned to face the direction in which the rear of the electronic device faces. For example, with reference to FIG. 3, the first shield can (210) may be positioned to face the direction in which the display (120) faces (e.g., the +z direction), and the second shield can (220) may be positioned to face the direction in which the rear cover (111) faces (e.g., the -z direction). For example, the upper part (212) of the first shield can (210) may be positioned to face the direction in which the display (120) faces, and the upper part of the second shield can (220) may be positioned to face the direction in which the rear cover (111) faces.

[0072] According to one embodiment, the first shield can (210) may be positioned closer to the front of the electronic device (e.g., display (120)) than the second shield can (220). The second shield can (220) may be positioned closer to the rear of the electronic device (e.g., rear cover (111)) than the first shield can (210). However, it is not limited thereto.

[0073] According to one embodiment, at least a portion of a shielding member (230) and a housing (e.g., the housing (110) of FIG. 1) may be disposed in a first shield can (210). For example, the shielding member (230) may be disposed on one side of the first shield can (210). At least a portion of the housing may be disposed on one side of the shielding member (230). For example, a support member (e.g., the support member (140) of FIG. 3) may be disposed on one side of the shielding member (230). In the present disclosure, the shielding member (230) may be named a shielding sheet or a shielding layer, but is not limited thereto.

[0074] According to one embodiment, the shielding member (230) may be positioned to shield electromagnetic waves and / or noise generated from the first electronic components (260, 270). For example, the shielding member (230) may be positioned to cover at least a portion of the opening (211) of the first shield can (210). For example, the shielding member (230) may be positioned to cover at least a portion of the first shield can (210) at a position overlapping with the first electronic components (260, 270).

[0075] According to one embodiment, the shielding member (230) may be placed on the first shield can (210). For example, the shielding member (230) may be placed on the upper part (212) of the first shield can (210). The shielding member (230) may be joined to the first shield can (210) through an adhesive member (250). For example, the adhesive member (250) may be placed between the shielding member (230) and the first shield can (210).

[0076] According to one embodiment, a coating layer (240) may be disposed between a support member (140) and a first shield can (210). The coating layer (240) may include a heat transfer material. In the present disclosure, the coating layer (240) may be named a coating member, a heat diffusion layer, or a heat transfer layer, provided, but not limited thereto.

[0077] According to one embodiment, the shielding member (230) may include a heat transfer material. Heat transferred to the shielding member (230) may be transferred to the outside of the first shield can (210) through the heat transfer material included in the shielding member (230). For example, heat transferred to the shielding member (230) may be transferred to the support member (140).

[0078] According to one embodiment, the first heat transfer material (290) may be disposed inside the first shield can (210). For example, the first heat transfer material (290) may be disposed within the space formed by the first shield can (210), the shielding member (230), and the first printed circuit board (200). For example, the first heat transfer material (290) may be disposed within the space surrounded by the first shield can (210), the shielding member (230), and the first printed circuit board (200).

[0079] According to one embodiment, at least a portion of the first heat transfer material (290) may be in contact with the first electronic component (260, 270). For example, the first heat transfer material (290) may cover the first electronic component (260, 270). For example, the first heat transfer material (290) may be applied to the first electronic component (260, 270).

[0080] According to one embodiment, at least a portion of the first heat transfer material (290) may be in contact with the shielding member (230). For example, the first heat transfer material (290) may be positioned between the shielding member (230) and the first electronic component (260, 270) while in contact with the shielding member (230) and the first electronic component (260, 270). The arrangement of the first heat transfer material (290) shown in FIG. 4 is exemplary and is not limited thereto. In the present disclosure, the first heat transfer material may be named a first heat diffusion material or a first heat transfer member, but is not limited thereto.

[0081] According to one embodiment, heat generated from at least one of the first electronic component (260, 270) or the first printed circuit board (200) can be transferred to the support member (140) via the first heat transfer material (290). For example, the generated heat can be transferred to the support member (140) via the first heat transfer material (290), the shielding member (230), and the coating layer (240). However, it is not limited thereto. For example, the generated heat can be transferred to the support member (140) via the first shield can (210), the shielding member (230), and the coating layer (240). The heat transferred to the support member (140) can be transferred to a heat dissipation member (e.g., the first heat dissipation member (151) and / or the heat diffusion member (160) of FIG. 3).

[0082] According to one embodiment, heat generated from at least one of the first electronic component (260, 270) or the first printed circuit board (200) can be transferred to a rear cover (e.g., rear cover (111) of FIG. 3) through a second shield can (220). Heat generated from at least one of the first electronic component (260, 270) or the first printed circuit board (200) can be transferred to a heat dissipation member (e.g., second heat dissipation member (152) of FIG. 3).

[0083] According to one embodiment, the first shield can (210) may be formed from a material different from that of the second shield can (220). For example, the physical properties of the first shield can (210) may differ from the physical properties of the second shield can (220). For example, the first shield can (210) may be formed from a material having properties different from those of the material forming the second shield can (220). For example, the thermal conductivity of the first shield can (210) may differ from the thermal conductivity of the second shield can (220). For example, the first shield can (210) may be formed from a material having a thermal conductivity different from that of the material forming the second shield can (220). However, it is not limited thereto. For example, at least one of the thermal conductivity, heat capacity, electric conductivity, elongation, or hardness of the first shield can (210) may differ from at least one of the thermal conductivity, heat capacity, electric conductivity, elongation, or hardness of the second shield can (220). In the present disclosure, thermal conductivity may include the ability of a member to transfer heat. Heat capacity may include the ability of a heat dissipation member to absorb heat.

[0084] According to one embodiment, when the thermal conductivity of the first shield can (210) is different from the thermal conductivity of the second shield can (220), the amount of heat generated through at least one of the first printed circuit board (200) or the first electronic component (260, 270) transferred in the direction toward the first shield can (210) (e.g., +z direction) and the amount transferred in the direction toward the second shield can (220) (e.g., -z direction) may be different.

[0085] According to one embodiment, in order to increase the amount of heat generated through at least one of the first printed circuit board (200) or the first electronic component (260, 270) transferred in one direction, the thermal conductivity of the first shield can (210) and the thermal conductivity of the second shield can (220) may be different from each other.

[0086] According to one embodiment, when referring to FIG. 3, the electronic device may include a heat diffusion member (160) and / or a heat dissipation member (151) to improve the heat treatment capability of one side of the electronic device. For example, if the number of heat dissipation members (e.g., the first heat dissipation member (151) of FIG. 3) positioned closer to the first shield can (210) than the second shield can (220) is greater than the number of heat dissipation members (e.g., the second heat dissipation member (152) of FIG. 3) positioned closer to the second shield can (220) than the first shield can (210), the heat treatment capability may be better on one side of the electronic device (e.g., the front of the electronic device) that is closer to the first shield can (210) than the second shield can (220). However, it is not limited thereto. In the present disclosure, the heat treatment capability may include the ability to reduce temperature through rapid heat diffusion.

[0087] According to one embodiment, the thermal capacity of a heat dissipation member (e.g., the first heat dissipation member (151) of FIG. 3) positioned closer to the first shield can (210) than to the second shield can (220) may be greater than the thermal capacity of a heat dissipation member (e.g., the second heat dissipation member (152) of FIG. 3) positioned closer to the second shield can (220) than to the first shield can (210). In this case, the thermal conductivity of the first shield can (210) may be higher than the thermal conductivity of the second shield can (220). However, it is not limited thereto.

[0088] According to one embodiment, the size of a heat dissipation member (e.g., the first heat dissipation member (151) of FIG. 3) positioned closer to the first shield can (210) than to the second shield can (220) may be larger than the size of a heat dissipation member (e.g., the second heat dissipation member (152) of FIG. 3) positioned closer to the second shield can (220) than to the first shield can (210). In this case, the thermal conductivity of the first shield can (210) may be higher than the thermal conductivity of the second shield can (220). However, it is not limited thereto.

[0089] The present disclosure may provide an electronic device that allows heat to be transferred further in a desired direction by configuring the thermal conductivity of the first shield can (210) and the thermal conductivity of the second shield can (220) differently from each other.

[0090] The present disclosure can provide an electronic device that can improve the performance of an electronic component by rapidly transferring heat from the electronic component (e.g., the first electronic component (360, 370)) by configuring the thermal conductivity of the first shield can (210) and the thermal conductivity of the second shield can (220) differently from each other.

[0091] Hereinafter, with reference to FIG. 4, various embodiments in which the thermal conductivity of the first shield can and the thermal conductivity of the second shield can are different will be described in FIG. 5 and FIG. 6. In one example, the size of the arrow drawn with a dotted line in FIG. 5 and FIG. 6 may be proportional to the amount of heat transferred in the area where the arrow is drawn. However, it is not limited thereto.

[0092] FIG. 5 is a cross-sectional view of a printed circuit board assembly according to one embodiment, in which the thermal conductivity of the first shield can is higher than the thermal conductivity of the second shield can.

[0093] The configuration of the printed circuit board assembly (20a) of FIG. 5 may be referenced by configurations of other drawings to the extent that they are not arranged with each other. The same terms and / or the same reference numerals have been used for configurations that are identical or substantially identical to configurations of other drawings.

[0094] According to one embodiment, the thermal conductivity of the first shield can (210a) may be higher than the thermal conductivity of the second shield can (220a). For example, the first shield can (210a) may include a material having a relatively higher thermal conductivity compared to the second shield can (220a). For example, the first shield can (210a) may be formed from a material having a relatively higher thermal conductivity compared to the material forming the second shield can (220a). For example, the first shield can (210a) may be formed from a first metal or a first conductive polymer, and the second shield can (220a) may be formed from a second metal or a second conductive polymer having a lower thermal conductivity than the first metal or the first conductive polymer. In one example, the first metal may include chrome copper, and the second metal may include nickel silver. However, it is not limited thereto.

[0095] According to one embodiment, at least one of the thermal conductivity, thermal capacity, electrical conductivity, elongation, or hardness of the first shield can (210a) may be greater than at least one of the thermal conductivity, thermal capacity, electrical conductivity, elongation, or hardness of the second shield can (220a). For example, the thermal capacity of the first shield can (210a) may be greater than the thermal capacity of the second shield can (220a). The electrical conductivity of the first shield can (210a) may be greater than the electrical conductivity of the second shield can (220a). The elongation of the first shield can (210a) may be greater than the elongation of the second shield can (220a). The hardness of the first shield can (210a) may be greater than the hardness of the second shield can (220a). However, it is not limited thereto.

[0096] According to one embodiment, if the thermal conductivity of the first shield can (210a) is higher than the thermal conductivity of the second shield can (220a), the amount of heat transferred to the first shield can (210a) and / or the amount of heat transferred by the first shield can (210a) may be greater than the amount of heat transferred to the second shield can (220a) and / or the amount of heat transferred to the second shield can (220a). Accordingly, the amount of heat transferred in the direction in which the first shield can (210a) faces (e.g., +z direction) may be greater than the amount of heat transferred in the direction in which the second shield can (220a) faces (e.g., -z direction). For example, when referring to FIG. 3, the amount of heat transferred to the front of the electronic device (e.g., display (120)) may be greater than the amount of heat transferred to the rear of the electronic device (e.g., rear cover (111)).

[0097] According to one embodiment, when the thermal conductivity of the first shield can (210a) and the thermal conductivity of the second shield can (220a) are substantially the same (e.g., when the first shield can (210a) and the second shield can (220a) are formed of the same material), if the thermal conductivity of the first shield can (210a) is higher than the thermal conductivity of the second shield can (220a), the amount of heat transferred in the direction toward which the first shield can (210a) faces (e.g., the +z direction) may increase. For example, the amount of heat transferred to the first shield can (210a) may increase. For example, the amount of heat transferred by the first shield can (210a) may increase. Accordingly, when referring together with FIG. 3, the amount of heat transferred to the front of the electronic device (e.g., the display (120)) may increase. However, it is not limited thereto.

[0098] According to one embodiment, when the thermal conductivity of the first shield can (210a) and the thermal conductivity of the second shield can (220a) are substantially the same (e.g., when the first shield can (210a) and the second shield can (220a) are formed of the same material), if the thermal conductivity of the first shield can (210a) is higher than the thermal conductivity of the second shield can (220a), the amount of heat transferred in the direction toward which the second shield can (220a) faces (e.g., the -z direction) may be reduced. For example, the amount of heat transferred to the second shield can (220a) may be reduced. For example, the amount of heat transferred by the second shield can (220a) may be reduced. Accordingly, when referring to FIG. 3, the amount of heat transferred to the rear of the electronic device (e.g., the rear cover (111)) may be reduced. However, it is not limited thereto.

[0099] According to one embodiment, the number of heat dissipation members disposed in a position adjacent to the front of the electronic device may be greater than the number disposed in a position adjacent to the rear of the electronic device. Accordingly, when the amount of heat transferred to the front of the electronic device is greater than the amount of heat transferred to the rear of the electronic device, heat can be effectively transferred or released.

[0100] According to one embodiment, the size of the heat dissipation member placed at a position adjacent to the front of the electronic device may be larger than that placed at a position adjacent to the rear of the electronic device. Therefore, when the amount of heat transferred to the front of the electronic device is greater than the amount of heat transferred to the rear of the electronic device, heat can be effectively transferred or released.

[0101] According to one embodiment, the heat capacity of a heat dissipation member (e.g., the first heat dissipation member (151) or heat diffusion member (160)) positioned adjacent to the front of an electronic device may be greater than that of a heat dissipation member (e.g., the second heat dissipation member (152) of FIG. 3) positioned adjacent to the rear of an electronic device. Thus, when the amount of heat transferred to the front of the electronic device is greater than the amount of heat transferred to the rear of the electronic device, heat can be effectively transferred or released.

[0102] According to one embodiment, the electronic device can control the heat generated by the electronic device through a heat control algorithm. When a user uses the electronic device, the user's body (e.g., hand) may come into contact more with the rear of the electronic device than with the front. Therefore, the heat value at which the heat control algorithm operates may be greater at the rear of the electronic device than at the front of the electronic device. Thus, when the amount of heat transferred to the front of the electronic device is greater than the amount of heat transferred to the rear of the electronic device, the heat control algorithm can operate effectively.

[0103] FIG. 6 is a cross-sectional view of a printed circuit board assembly according to one embodiment, in which the thermal conductivity of the first shield can is lower than the thermal conductivity of the second shield can.

[0104] The configuration of the printed circuit board assembly (20b) of FIG. 6 may be referenced by configurations of other drawings to the extent that they are not arranged with each other. The same terms and / or the same reference numerals have been used for configurations that are identical or substantially identical to configurations of other drawings.

[0105] According to one embodiment, the thermal conductivity of the first shield can (210b) may be lower than the thermal conductivity of the second shield can (220b). For example, the first shield can (210b) may include a material having a relatively lower thermal conductivity compared to the second shield can (220b). For example, the first shield can (210b) may be formed from a material having a relatively lower thermal conductivity compared to the material forming the second shield can (220b). For example, the first shield can (210b) may be formed from a second metal or a second conductive polymer, and the second shield can (220b) may be formed from a first metal or a first conductive polymer having a higher thermal conductivity than the second metal or the second conductive polymer. In one example, the first metal may include chromium copper, and the second metal may include nickel silver. However, it is not limited thereto.

[0106] According to one embodiment, at least one of the thermal conductivity, thermal capacity, electrical conductivity, elongation, or hardness of the first shield can (210b) may be smaller than at least one of the thermal conductivity, thermal capacity, electrical conductivity, elongation, or hardness of the second shield can (220b). For example, the thermal capacity of the first shield can (210b) may be smaller than the thermal capacity of the second shield can (220b). For example, the electrical conductivity of the first shield can (210b) may be smaller than the electrical conductivity of the second shield can (220b). For example, the elongation of the first shield can (210b) may be smaller than the elongation of the second shield can (220b). For example, the hardness of the first shield can (210b) may be smaller than the hardness of the second shield can (220b). However, it is not limited thereto.

[0107] According to one embodiment, when the thermal conductivity of the first shield can (210b) is lower than the thermal conductivity of the second shield can (220b) than when the thermal conductivity of the first shield can (210b) is substantially the same as the thermal conductivity of the second shield can (220b) (e.g., when the first shield can (210a) and the second shield can (220a) are formed of the same material), the amount of heat transferred in the direction toward which the second shield can (220b) faces (e.g., the -z direction) may increase. For example, the amount of heat transferred to the second shield can (220b) may increase. For example, the amount of heat transferred by the second shield can (220b) may increase. Accordingly, when referring together with FIG. 3, the amount of heat transferred to the rear of the electronic device (e.g., the rear cover (111)) may increase. However, it is not limited thereto.

[0108] According to one embodiment, when the thermal conductivity of the first shield can (210b) is lower than the thermal conductivity of the second shield can (220b) than when the thermal conductivity of the first shield can (210b) is substantially the same as the thermal conductivity of the second shield can (220b) (e.g., when the first shield can (210a) and the second shield can (220a) are formed of the same material), the amount of heat transferred in the direction toward which the first shield can (210b) faces (e.g., the -z direction) may be reduced. For example, the amount of heat transferred to the first shield can (210b) may be reduced. For example, the amount of heat transferred by the first shield can (210b) may be reduced. Accordingly, when referring to FIG. 3, the amount of heat transferred to the front of the electronic device (e.g., the display (120)) may be reduced. However, it is not limited thereto.

[0109] According to one embodiment, compared to the printed circuit board assembly (20a) of FIG. 5, the amount of heat transferred to the front of the electronic device (e.g., the display (120) of FIG. 3) in the printed circuit board assembly (20b) of FIG. 6 may be less.

[0110] According to one embodiment, compared to the printed circuit board assembly (20a) of FIG. 5, the amount of heat transferred to the rear of the electronic device (e.g., the rear cover (111) of FIG. 3) in the printed circuit board assembly (20b) of FIG. 6 may be greater.

[0111] FIG. 7 is a cross-sectional view of a printed circuit board assembly including a first shield can, a second shield can, and a third shield can according to one embodiment.

[0112] The configuration of the printed circuit board assembly (30) of FIG. 7 may be referenced by the configuration of another drawing to the extent that they are not arranged with each other. The same terms and / or the same reference numerals have been used for configurations that are identical or substantially identical to the configuration of another drawing.

[0113] According to one embodiment, one side (or one surface) of the first printed circuit board (300) may include a side (or surface) facing the +z direction from the first printed circuit board (300). The other side (or other surface) of the first printed circuit board (300) may include a side (or surface) facing the -z direction from the first printed circuit board (200). In the present disclosure, one side of the first printed circuit board (300) may be named at least one of a surface, an upper surface, a first side, or a first surface. The other side of the first printed circuit board (300) may be named at least one of a second surface, a back surface, a second side, or a second surface.

[0114] According to one embodiment, one side (or one surface) of the second printed circuit board (400) may include a side (or surface) facing the -z direction on the second printed circuit board (400). The other side (or other surface) of the second printed circuit board (400) may include a side (or surface) facing the +z direction on the second printed circuit board (400). In the present disclosure, one side of the second printed circuit board (400) may be named at least one of a surface, a top surface, a first side, or a first surface. The other side of the second printed circuit board (400) may be named at least one of a second surface, a back surface, a second side, or a second surface.

[0115] According to one embodiment, at least one first electronic component (360, 370) may be disposed on one side of the first printed circuit board (300). The first electronic component (360, 370) may include a heat-generating component that generates heat during the operation of the electronic device. For example, the first electronic component (360, 370) may include at least one of an application processor (AP), a random-access memory, or a charging integrated circuit that generates heat during the operation of the electronic device. For example, the memory may include a dynamic random-access memory (DRAM). However, it is not limited thereto.

[0116] According to one embodiment, at least one electronic element may be disposed on one side of the first printed circuit board (300). The electronic element may include at least one of a resistor, a capacitor, or an inductor disposed on the first printed circuit board (300). However, it is not limited thereto.

[0117] According to one embodiment, the first shield can (310) may be placed on one side of the first printed circuit board (300). The first shield can (310) may be placed to shield electromagnetic waves and / or noise generated from the first electronic component (360, 370). For example, the first shield can (310) may at least partially surround the first electronic component (360, 370). For example, the first shield can (310) may overlap at least partially with the first electronic component (360, 370). For example, at least a portion of at least one of the top (312) or side (313) of the first shield can (310) may be placed to at least partially cover the first electronic component (360, 370). For example, the first electronic component (360, 370) may be placed within the space formed by the first shield can (310) and the first printed circuit board (300). For example, the first electronic component (360, 370) may be placed within the space enclosed by one side of the first shield can (310) and the first printed circuit board (300).

[0118] According to one embodiment, the first shield can (310) may be positioned so as to be spaced apart from the first electronic component (360, 370) by a predetermined distance. For example, at least one of the top (312) or side (313) of the first shield can (310) may be spaced apart from the first electronic component (360, 370) by a predetermined distance. However, it is not limited thereto.

[0119] According to one embodiment, the first shield can (310) may include an opening (311) formed at a position corresponding to the first electronic component (360, 370). For example, the first shield can (310) may include an opening (311) formed at a position overlapping with the first electronic component (360, 370).

[0120] According to one embodiment, the second printed circuit board (400) may be positioned to overlap with the first printed circuit board (300). For example, the second printed circuit board (400) may be positioned below the first printed circuit board (300) (e.g., in the -z direction) at a position overlapping with the first printed circuit board (300). For example, the first printed circuit board (300) may be stacked on top of the second printed circuit board (400) (e.g., in the +z direction).

[0121] According to one embodiment, the second printed circuit board (400) may be connected to the first printed circuit board (300). For example, the second printed circuit board (400) may be electrically and / or operationally connected to the first printed circuit board (300). In one example, the second printed circuit board (400) may be connected to the first printed circuit board (300) through an interposer (410).

[0122] According to one embodiment, the second printed circuit board (400) may be positioned parallel to the first printed circuit board (300). For example, the second printed circuit board (400) may be positioned substantially parallel to the first printed circuit board (300) (e.g., parallel with respect to the x-axis). The second printed circuit board (400) may be positioned at a location spaced apart from the first printed circuit board (300) by a predetermined distance. For example, the second printed circuit board (400) may be spaced apart from the first printed circuit board (300) by a predetermined distance by an interposer (410).

[0123] According to one embodiment, at least one second electronic component (380) may be disposed on the opposite side of one side of the first printed circuit board (300). For example, at least one second electronic component (380) may be disposed on the second printed circuit board (400). For example, at least one second electronic component (380) may be disposed on one side of the second printed circuit board (400). One side of the first printed circuit board (300) on which at least one first electronic component (360, 370) is disposed may face in the opposite direction to one side of the second printed circuit board (400) on which at least one second electronic component (380) is disposed. For example, with reference to FIG. 3, one side of the first printed circuit board (300) may face the direction in which the display (e.g., the display (120) of FIG. 3) faces (e.g., the +z direction), and one side of the second printed circuit board (400) may face the direction in which the rear cover (e.g., the rear cover (111) of FIG. 3) faces (e.g., the -z direction). However, it is not limited thereto.

[0124] According to one embodiment, the second shield can (320) may be positioned on the opposite side of the first shield can (310). For example, the second shield can (320) may be positioned on the opposite side of one side of the first printed circuit board (300). For example, the second shield can (320) may be positioned on one side of the second printed circuit board (400). The second shield can (320) may be positioned to shield electromagnetic waves and / or noise generated from at least one second electronic component (380). For example, the second shield can (320) may overlap at least partially with at least one second electronic component (380). For example, at least one part of the top or side of the second shield can (320) may be positioned to cover at least partially the at least one second electronic component (380). For example, at least one second electronic component (380) may be placed within the space formed by the second shield can (320) and the second printed circuit board (400). For example, at least one second electronic component (380) may be placed within the space enclosed by one side of the second shield can (220) and the second printed circuit board (400).

[0125] According to one embodiment, the second shield can (320) may be positioned to face in the opposite direction to the first shield can (310). For example, the first shield can (310) may face the front of the electronic device (e.g., the first side (110A) of FIG. 1), and the second shield can (320) may face the rear of the electronic device (e.g., the second side (110B) of FIG. 2). For example, the first shield can (310) may be positioned to face the direction in which the front of the electronic device faces, and the second shield can (320) may be positioned to face the direction in which the rear of the electronic device faces. For example, with reference to FIG. 3, the first shield can (310) may be positioned to face the direction in which the display (120) faces (e.g., the +z direction), and the second shield can (320) may be positioned to face the direction in which the rear cover (111) faces (e.g., the -z direction). For example, the upper part (312) of the first shield can (310) may be positioned to face the direction in which the display (120) faces, and the upper part of the second shield can (320) may be positioned to face the direction in which the rear cover (111) faces.

[0126] According to one embodiment, at least one third electronic component (440) may be disposed on the opposite side of one side of the first printed circuit board (300). For example, at least one third electronic component (440) may be disposed on the second printed circuit board (400). For example, at least one third electronic component (440) may be disposed on the opposite side of one side of the second printed circuit board (400). For example, at least one third electronic component (440) may be disposed on the other side of the second printed circuit board (400). One side of the second printed circuit board (400) on which at least one second electronic component (380) is disposed may face in the opposite direction to the other side of the second printed circuit board (400) on which at least one third electronic component (440) is disposed. For example, with reference to FIG. 3, the other side of the second printed circuit board (400) may face the direction in which the display (e.g., the display (120) of FIG. 3) faces (e.g., the +z direction), and one side of the second printed circuit board (400) may face the direction in which the rear cover (e.g., the rear cover (111) of FIG. 3) faces (e.g., the -z direction). However, it is not limited thereto.

[0127] According to one embodiment, the third shield can (430) may be positioned on the opposite side of the first shield can (310). For example, the third shield can (430) may be positioned on the opposite side of one side of the first printed circuit board (300). For example, the third shield can (430) may be positioned on the other side of the second printed circuit board (400). The third shield can (430) may be positioned to shield electromagnetic waves and / or noise generated from at least one third electronic component (440). For example, the third shield can (430) may overlap at least partially with at least one third electronic component (440). For example, at least one part of the top or side of the third shield can (430) may be positioned to cover at least partially the at least one third electronic component (440). For example, at least one third electronic component (440) may be placed within the space formed by the third shield can (430) and the second printed circuit board (400). For example, at least one third electronic component (440) may be placed within the space enclosed by the other side of the third shield can (430) and the second printed circuit board (400).

[0128] According to one embodiment, the third shield can (430) may be positioned to face in the opposite direction to the second shield can (320). For example, the third shield can (430) may face the front of the electronic device (e.g., the first side (110A) of FIG. 1), and the second shield can (320) may face the rear of the electronic device (e.g., the second side (110B) of FIG. 2). For example, the third shield can (430) may be positioned to face the direction in which the front of the electronic device faces, and the second shield can (320) may be positioned to face the direction in which the rear of the electronic device faces. For example, with reference to FIG. 3, the third shield can (430) may be positioned to face the direction in which the display (120) faces (e.g., the +z direction), and the second shield can (320) may be positioned to face the direction in which the rear cover (111) faces (e.g., the -z direction). For example, the upper part of the third shield can (430) may be positioned to face the direction in which the display (120) faces, and the upper part of the second shield can (320) may be positioned to face the direction in which the rear cover (111) faces.

[0129] According to one embodiment, at least one third electronic component (440) and a third shield can (430) may be disposed between the first printed circuit board (300) and the second printed circuit board (400). For example, at least one third electronic component (440) and a third shield can (430) may be disposed within the space formed by the first printed circuit board (300), the second printed circuit board (400), and the interposer (410). For example, at least one third electronic component (440) and a third shield can (430) may be disposed within the space surrounded by the first printed circuit board (300), the second printed circuit board (400), and the interposer (410).

[0130] According to one embodiment, at least one fourth component (420) may be positioned on the opposite side of one side of the first printed circuit board (200). For example, at least one fourth component (420) may be positioned on the other side of the first printed circuit board (200). At least one fourth component (420) may face at least one third electronic component (440) and a third shield can (430).

[0131] According to one embodiment, at least one fourth component (420) may be disposed between the first printed circuit board (300) and the second printed circuit board (400). For example, at least one fourth component (420) may be disposed within the space formed by the first printed circuit board (300), the second printed circuit board (400), and the interposer (410). For example, at least one fourth component (420) may be disposed within the space surrounded by the first printed circuit board (300), the second printed circuit board (400), and the interposer (410).

[0132] According to one embodiment, the second electronic component (380) may include an RF element. However, it is not limited thereto.

[0133] According to one embodiment, the third electronic component (440) may include a WiFi chip. However, it is not limited thereto.

[0134] According to one embodiment, the fourth electronic component (420) may include at least one electrical element. The electronic element may include at least one of a resistor, a capacitor, or an inductor disposed on the first printed circuit board (200). However, it is not limited thereto.

[0135] According to one embodiment, the fourth electronic component (420) may include a fourth shield can (not shown) positioned on the opposite side of one side of the first printed circuit board (300). The fourth shield can (not shown) may at least partially surround the fourth electronic component (420). The thermal conductivity of the fourth shield can may differ from at least one of the thermal conductivity of the first shield can (310), the thermal conductivity of the second shield can (320), or the thermal conductivity of the third shield can (430).

[0136] According to one embodiment, the thermal conductivity of the fourth shield can may be higher than at least one of the thermal conductivity of the second shield can (320) or the thermal conductivity of the third shield can (430).

[0137] According to one embodiment, at least a portion of a shielding member (330) and a housing (e.g., the housing (110) of FIG. 1) may be disposed in the first shield can (310). For example, the shielding member (330) may be disposed on one side of the first shield can (310). At least a portion of the housing may be disposed on one side of the shielding member (330). For example, a support member (e.g., the support member (140) of FIG. 3) may be disposed on one side of the shielding member (330). In the present disclosure, the shielding member (330) may be named a shielding sheet or a shielding layer, but is not limited thereto.

[0138] According to one embodiment, the shielding member (330) may be positioned to shield electromagnetic waves and / or noise generated from the first electronic components (360, 370). For example, the shielding member (330) may be positioned to cover at least a portion of the opening (311) of the first shield can (310). For example, the shielding member (330) may be positioned to cover at least a portion of the first shield can (310) at a position overlapping with the first electronic components (360, 370).

[0139] According to one embodiment, the shielding member (330) may be placed on the first shield can (310). For example, the shielding member (330) may be placed on the upper part (312) of the first shield can (310). The shielding member (330) may be joined to the first shield can (310) through an adhesive member (350). For example, the adhesive member (350) may be placed between the shielding member (330) and the first shield can (310).

[0140] According to one embodiment, a coating layer (340) may be disposed between the support member (140) and the first shield can (310). The coating layer (340) may include a heat transfer material. In the present disclosure, the coating layer (340) may be named a coating member, a heat diffusion layer, or a heat transfer layer, provided, but not limited thereto.

[0141] According to one embodiment, the shielding member (330) may include a heat transfer material. Heat transferred to the shielding member (330) may be transferred to the outside of the first shield can (310) through the heat transfer material included in the shielding member (330). For example, heat transferred to the shielding member (330) may be transferred to the support member (140).

[0142] According to one embodiment, the first heat transfer material (390) may be disposed inside the first shield can (310). For example, the first heat transfer material (390) may be disposed within the space formed by the first shield can (310), the shielding member (330), and the first printed circuit board (300). For example, the first heat transfer material (390) may be disposed within the space surrounded by the first shield can (310), the shielding member (330), and the first printed circuit board (300).

[0143] According to one embodiment, at least a portion of the first heat transfer material (390) may be in contact with the first electronic component (360, 370). For example, at least a portion of the first heat transfer material (390) may cover the first electronic component (360, 370). For example, the first heat transfer material (390) may be applied to the first electronic component (360, 370).

[0144] According to one embodiment, at least a portion of the first heat transfer material (390) may be in contact with the shielding member (330). For example, the first heat transfer material (390) may be positioned between the shielding member (330) and the first electronic component (360, 370) while in contact with the shielding member (330) and the first electronic component (360, 370). The arrangement of the first heat transfer material (390) shown in FIG. 7 is exemplary and is not limited thereto. In the present disclosure, the first heat transfer material may be named a first heat diffusion material or a first heat transfer member, but is not limited thereto.

[0145] According to one embodiment, the second heat transfer material (450) may be disposed between the first printed circuit board (300) and the second printed circuit board (400). For example, the second heat transfer material (450) may be disposed within the space formed by the first printed circuit board (300), the second printed circuit board (400), and the interposer (410). For example, the second heat transfer material (450) may be disposed within the space surrounded by the first printed circuit board (300), the second printed circuit board (400), and the interposer (410).

[0146] According to one embodiment, the second heat transfer material (450) may be disposed between the first printed circuit board (300) and the third shield can (430). At least a portion of the second heat transfer material (450) may cover the third shield can (430). For example, the second heat transfer material (450) may be applied to the third shield can (430). For example, the second heat transfer material (450) may be disposed within the space formed by the first printed circuit board (300), the second printed circuit board (400), the third shield can (430), and the interposer (410). For example, the second heat transfer material (450) may be disposed within the space enclosed by the other side of the first printed circuit board (300), the other side of the second printed circuit board (400), the third shield can (430), and the interposer (410).

[0147] According to one embodiment, the interposer (410) may include at least one of a circuit that electrically connects the first printed circuit board (300) and the second printed circuit board (400), or a fifth shield can that surrounds at least a portion of the space formed between the first printed circuit board (300) and the second printed circuit board (400). For example, at least one of the circuit or the fifth shield can may be formed as at least a part of the interposer (410). In one example, the interposer (410) may be replaced by at least one of the circuit or the fifth shield can.

[0148] According to one embodiment, at least a portion of the second heat transfer material (450) may be in contact with the first printed circuit board (300). At least a portion of the second heat transfer material (450) may be in contact with the second printed circuit board (400). At least a portion of the second heat transfer material (450) may be in contact with the third shield can (430). The second heat transfer material (450) may be in contact with at least one fourth electronic component (420). The arrangement of the second heat transfer material (450) shown in FIG. 7 is exemplary and is not limited thereto. In the present disclosure, the second heat transfer material (450) may be named a second heat diffusion material or a second heat transfer member, but is not limited thereto.

[0149] According to one embodiment, heat generated from at least one of the first electronic component (360, 370) or the first printed circuit board (300) can be transferred to the support member (140) via the first heat transfer material (390). For example, the generated heat can be transferred to the support member (140) via the first heat transfer material (390), the shielding member (330), and the coating layer (340). However, it is not limited thereto. For example, the generated heat can be transferred to the support member (140) via the first shield can (310), the shielding member (330), and the coating layer (340). The heat transferred to the support member (140) can be transferred to a heat dissipation member (e.g., the first heat dissipation member (151) and / or the heat diffusion member (160) of FIG. 3).

[0150] According to one embodiment, heat generated from at least one of the first electronic component (360, 370) or the first printed circuit board (300) can be transferred to the second shield can (320) via the second heat transfer material (450). For example, the generated heat can be transferred to the third shield can (430) via the second heat transfer material (450). The heat transferred to the third shield can (430) can be transferred to the second shield can (320).

[0151] According to one embodiment, the first shield can (310) may be formed from a material different from at least one of the second shield can (320) or the third shield can (430). For example, the physical properties of the first shield can (310) may differ from at least one of the physical properties of the second shield can (320) or the physical properties of the third shield can (430). For example, the first shield can (310) may be formed from a material having properties different from at least one of the properties of the material forming the second shield can (320) or the properties of the material forming the third shield can (430). For example, the thermal conductivity of the first shield can (310) may differ from at least one of the thermal conductivity of the second shield can (320) or the thermal conductivity of the third shield can (430). For example, the first shield can (310) may be formed of a material having a thermal conductivity different from at least one of the thermal conductivity of the material forming the second shield can (320) or the thermal conductivity of the material forming the third shield can (430). However, it is not limited thereto. For example, at least one of the thermal conductivity, thermal capacity, electric conductivity, elongation, or hardness of the first shield can (310) may be different from at least one of the thermal conductivity, thermal capacity, electric conductivity, elongation, or hardness of the second shield can (320) and / or at least one of the thermal conductivity, thermal capacity, electric conductivity, elongation, or hardness of the third shield can (430).

[0152] According to one embodiment, the third shield can (430) may be formed from a material different from that of the second shield can (320). For example, the physical properties of the third shield can (430) may differ from those of the second shield can (320). For example, the third shield can (430) may be formed from a material having properties different from those of the material forming the second shield can (320). For example, the thermal conductivity of the third shield can (430) may differ from that of the second shield can (320). For example, the third shield can (430) may be formed from a material having a thermal conductivity different from that of the material forming the second shield can (320). However, it is not limited thereto. For example, at least one of the thermal conductivity, thermal capacity, electric conductivity, elongation, or hardness of the third shield can (430) may be different from at least one of the thermal conductivity, thermal capacity, electric conductivity, elongation, or hardness of the second shield can (320).

[0153] However, it is not limited thereto. For example, the third shield can (430) may be formed from the same material as the second shield can (320).

[0154] According to one embodiment, when at least one of the thermal conductivity of the first shield can (310), the thermal conductivity of the second shield can (320), or the thermal conductivity of the third shield can (430) is different from each other, the amount of heat generated through at least one of the first printed circuit board (300) or the first electronic component (360, 370) transferred in the direction facing the first shield can (310) (e.g., +z direction) and the amount transferred in the direction facing the second shield can (320) (e.g., -z direction) may be different.

[0155] According to one embodiment, at least one of the first shield can (310), the second shield can (320), or the third shield can (430) may be formed of at least one of a metal or a conductive polymer. For example, at least one of the first shield can (310), the second shield can (320), or the third shield can (430) may be formed of at least one of chrome copper or nickel silver. However, it is not limited thereto. For example, at least one of the first shield can (310), the second shield can (320), or the third shield can (430) may be formed of titanium.

[0156] According to one embodiment, when the thermal conductivity of the first shield can (310), the thermal conductivity of the second shield can (320), and the thermal conductivity of the third shield can (430) are the same, but when at least two of the thermal conductivity of the first shield can (310), the thermal conductivity of the second shield can (320), or the thermal conductivity of the third shield can (430) are different, the amount of heat generated through at least one of the first printed circuit board (300) or the first electronic components (360, 370) transferred in one direction may be increased.

[0157] The present disclosure can provide an electronic device with improved shielding performance and heat transfer performance by configuring at least two of the thermal conductivity of the first shield can (310), the thermal conductivity of the second shield can (320), or the thermal conductivity of the third shield can (430) differently from each other.

[0158] The present disclosure may provide an electronic device that allows heat to be transferred further in a desired direction by configuring at least two of the thermal conductivity of the first shield can (310), the thermal conductivity of the second shield can (320), or the thermal conductivity of the third shield can (430) differently from each other.

[0159] The present disclosure can provide an electronic device that can improve the performance of an electronic component by rapidly transferring heat from the electronic component (e.g., the first electronic component (360, 370)) by configuring at least two of the thermal conductivity of the first shield can (310), the thermal conductivity of the second shield can (320), or the thermal conductivity of the third shield can (430) differently from each other.

[0160] Hereinafter, with reference to FIG. 7, various embodiments will be described in FIG. 8, 9, 10, 11, and 12, in which at least two of the thermal conductivity of the first shield can, the thermal conductivity of the second shield can, or the thermal conductivity of the third shield can are different. In one example, the size of the arrow drawn with a dotted line in FIG. 8, 9, 10, 11, and 12 may be proportional to the amount of heat transferred in the area where the arrow is drawn. However, it is not limited thereto.

[0161] FIG. 8 is a cross-sectional view of a printed circuit board assembly according to one embodiment, in which the thermal conductivity of the first shield can is higher than the thermal conductivity of the second shield can and the thermal conductivity of the third shield can.

[0162] The configuration of the printed circuit board assembly (30a) of FIG. 8 may be referenced by configurations of other drawings to the extent that they are not arranged with each other. The same terms and / or the same reference numerals have been used for configurations that are identical or substantially identical to configurations of other drawings.

[0163] According to one embodiment, the thermal conductivity of the first shield can (310a) may be higher than the thermal conductivity of the second shield can (320a) and the thermal conductivity of the third shield can (430a). For example, the first shield can (310a) may include a material having a relatively higher thermal conductivity compared to the second shield can (320a) and the third shield can (430a). For example, the first shield can (310a) may be formed from a material having a relatively higher thermal conductivity compared to the material forming the second shield can (320a) and the material forming the third shield can (430a). For example, the first shield can (310a) may be formed of a first metal or a first conductive polymer, and the second shield can (320a) and the third shield can (430a) may be formed of a second metal or a second conductive polymer having lower thermal conductivity than the first metal or the first conductive polymer. In one example, the first metal may include chromium copper, and the second metal may include nickel silver. However, it is not limited thereto.

[0164] According to one embodiment, the thermal capacity of the first metal may be greater than the thermal capacity of the second metal. The electrical conductivity of the first metal may be greater than the electrical conductivity of the second metal. The elongation of the first metal may be greater than the elongation of the second metal. The hardness of the first metal may be greater than the hardness of the second metal. However, it is not limited thereto.

[0165] According to one embodiment, the thermal capacity of the first shield can (310a) may be greater than the thermal capacity of the second shield can (320a) and the thermal capacity of the third shield can (430a). The electrical conductivity of the first shield can (310a) may be greater than the electrical conductivity of the second shield can (320a) and the electrical conductivity of the third shield can (430a). The elongation of the first shield can (310a) may be greater than the elongation of the second shield can (320a) and the elongation of the third shield can (430a). The hardness of the first shield can (310a) may be greater than the hardness of the second shield can (320a) and the hardness of the third shield can (430a). However, it is not limited thereto.

[0166] According to one embodiment, if the thermal conductivity of the first shield can (310a) is higher than the thermal conductivity of the second shield can (320a) and the thermal conductivity of the third shield can (430a), the amount of heat transferred to the first shield can (310a) and / or the amount of heat transferred by the first shield can (310a) may be greater than the amount of heat transferred to the second shield can (320a) and / or the amount of heat transferred by the second shield can (320a). If the thermal conductivity of the first shield can (310a) is higher than the thermal conductivity of the second shield can (320a) and the thermal conductivity of the third shield can (430a), the amount of heat transferred to the first shield can (310a) and / or the amount of heat transferred by the first shield can (310a) may be greater than the amount of heat transferred to the third shield can (430a) and / or the amount of heat transferred by the third shield can (430a). If the thermal conductivity of the first shield can (310a) is higher than the thermal conductivity of the second shield can (320a) and the thermal conductivity of the third shield can (430a), the amount of heat transferred to the first shield can (310a) and / or the amount of heat transferred by the first shield can (310a) may be greater than the sum of the amount of heat transferred to the second shield can (320a) and / or the amount of heat transferred by the second shield can (320a) and the amount of heat transferred to the third shield can (430a) and / or the amount of heat transferred by the third shield can (430a).

[0167] Accordingly, the amount of heat generated from at least one of the first printed circuit board (300) or the first electronic component (360, 370) transferred in the direction facing the first shield can (310a) (e.g., +z direction) may be greater than the amount of heat transferred in the direction facing the second shield can (320a) (e.g., -z direction). For example, when referring to FIG. 3, the amount of heat transferred to the front of the electronic device (e.g., display (120)) may be greater than the amount of heat transferred to the rear of the electronic device (e.g., rear cover (111)).

[0168] According to one embodiment, when the thermal conductivity of the first shield can (310a), the thermal conductivity of the second shield can (320a), and the thermal conductivity of the third shield can (430a) are substantially the same (e.g., when the first shield can (310a), the second shield can (320a), and the third shield can (430a) are formed of the same material), the thermal conductivity of the first shield can (310a) is higher than the thermal conductivity of the second shield can (320a) and the thermal conductivity of the third shield can (430a), the amount of heat transferred in the direction toward which the first shield can (310a) faces (e.g., the +z direction) may be increased. For example, when referring to FIG. 3, the amount of heat transferred to the front of the electronic device (e.g., the display (120)) may be increased. For example, the amount of heat transferred to the support member (140) may be increased.

[0169] According to one embodiment, the thermal conductivity of the third shield can (430a) may be higher than or equal to the thermal conductivity of the second shield can (320a). For example, the third shield can (430a) may include a material having a thermal conductivity that is relatively higher than or equal to that of the second shield can (320a). For example, the third shield can (430a) may be formed from a material having a thermal conductivity that is relatively higher than or equal to that of the material forming the second shield can (320a). For example, the third shield can (430a) may be formed from a second metal or a second conductive polymer, and the second shield can (320a) may be formed from a third metal or a third conductive polymer. The second metal may have a thermal conductivity that is higher than or equal to that of the third metal and lower than that of the first metal. The second conductive polymer may have a thermal conductivity higher than or equal to that of the third conductive polymer and a thermal conductivity lower than that of the first conductive polymer. In one example, the first metal may include chromium copper, the second metal may include nickel silver, and the third metal may include titanium. However, it is not limited thereto.

[0170] According to one embodiment, the number of heat dissipation members disposed in a position adjacent to the front of the electronic device may be greater than the number disposed in a position adjacent to the rear of the electronic device. Accordingly, when the amount of heat transferred to the front of the electronic device is greater than the amount of heat transferred to the rear of the electronic device, heat can be effectively transferred or released.

[0171] According to one embodiment, the size of the heat dissipation member placed at a position adjacent to the front of the electronic device may be larger than that placed at a position adjacent to the rear of the electronic device. Therefore, when the amount of heat transferred to the front of the electronic device is greater than the amount of heat transferred to the rear of the electronic device, heat can be effectively transferred or released.

[0172] According to one embodiment, the heat capacity of a heat dissipation member (e.g., the first heat dissipation member (151) or heat diffusion member (160)) positioned adjacent to the front of an electronic device may be greater than that of a heat dissipation member (e.g., the second heat dissipation member (152) of FIG. 3) positioned adjacent to the rear of an electronic device. Thus, when the amount of heat transferred to the front of the electronic device is greater than the amount of heat transferred to the rear of the electronic device, heat can be effectively transferred or released.

[0173] According to one embodiment, the electronic device can control the heat generated by the electronic device through a heat control algorithm. When a user uses the electronic device, the user's body (e.g., hand) may come into contact more with the rear of the electronic device than with the front. Therefore, the heat value at which the heat control algorithm operates may be greater at the rear of the electronic device than at the front of the electronic device. Thus, when the amount of heat transferred to the front of the electronic device is greater than the amount of heat transferred to the rear of the electronic device, the heat control algorithm can operate effectively.

[0174] FIG. 9 is a cross-sectional view of a printed circuit board assembly according to one embodiment, in which the thermal conductivity of the second shield can is lower than the thermal conductivity of the first shield can and the thermal conductivity of the third shield can.

[0175] The configuration of the printed circuit board assembly (30b) of FIG. 9 may be referenced by configurations of other drawings to the extent that they are not arranged with each other. The same terms and / or the same reference numerals have been used for configurations that are identical or substantially identical to configurations of other drawings.

[0176] According to one embodiment, the thermal conductivity of the second shield can (320b) may be lower than the thermal conductivity of the first shield can (310b) and the thermal conductivity of the third shield can (430b). For example, the second shield can (320b) may include a material having a relatively lower thermal conductivity compared to the first shield can (310b) and the third shield can (430b). For example, the second shield can (320b) may be formed from a material having a relatively lower thermal conductivity compared to the material forming the first shield can (310b) and the material forming the third shield can (430b). For example, the first shield can (310b) and the third shield can (430b) may be formed of a first metal or a first conductive polymer, and the second shield can (320b) may be formed of a second metal having lower thermal conductivity than the first metal or a second conductive polymer having lower thermal conductivity than the first conductive polymer. In one example, the first metal may include chromium copper, and the second metal may include nickel silver. However, it is not limited thereto.

[0177] According to one embodiment, the thermal capacity of the second shield can (320b) may be smaller than the thermal capacity of the first shield can (310b) and the thermal capacity of the third shield can (430b). The electrical conductivity of the second shield can (320b) may be smaller than the electrical conductivity of the first shield can (310b) and the electrical conductivity of the third shield can (430b). The elongation of the second shield can (320b) may be smaller than the elongation of the first shield can (310b) and the elongation of the third shield can (430b). The hardness of the second shield can (320b) may be smaller than the hardness of the first shield can (310b) and the hardness of the third shield can (430b). However, it is not limited thereto.

[0178] According to one embodiment, compared to the printed circuit board assembly (30a) of FIG. 8, in the printed circuit board assembly (30b) of FIG. 9, the amount of heat generated from at least one of the first printed circuit board (300) or the first electronic component (360, 370) transferred to the rear of the electronic device (e.g., rear cover (111)) may be greater. For example, compared to the printed circuit board assembly (30a) of FIG. 8, in the printed circuit board assembly (30b) of FIG. 9, the amount of heat transferred to the third shield can (430b) and / or the amount of heat transferred by the third shield can (430b) may be greater. However, it is not limited thereto.

[0179] FIG. 10 is a cross-sectional view of a printed circuit board assembly according to one embodiment, in which the thermal conductivity of the first shield can is lower than the thermal conductivity of the second shield can and the thermal conductivity of the third shield can.

[0180] The configuration of the printed circuit board assembly (30c) of FIG. 10 may be referenced by configurations of other drawings to the extent that they are not arranged with each other. The same terms and / or the same reference numerals have been used for configurations that are identical or substantially identical to configurations of other drawings.

[0181] According to one embodiment, the thermal conductivity of the first shield can (310c) may be lower than the thermal conductivity of the second shield can (320c) and the thermal conductivity of the third shield can (430c). For example, the first shield can (310c) may include a material having a relatively lower thermal conductivity compared to the second shield can (320c) and the third shield can (430c). For example, the first shield can (310c) may be formed from a material having a relatively lower thermal conductivity compared to the material forming the second shield can (320c) and the material forming the third shield can (430c). For example, the first shield can (310c) may be formed of a second metal or a second conductive polymer, and the second shield can (320c) and the third shield can (430c) may be formed of a first metal having a higher thermal conductivity than the second metal or a first conductive polymer having a higher thermal conductivity than the second conductive polymer. In one example, the first metal may include chromium copper, and the second metal may include nickel silver. However, it is not limited thereto.

[0182] According to one embodiment, the thermal capacity of the first shield can (310c) may be smaller than the thermal capacity of the second shield can (320c) and the thermal capacity of the third shield can (430c). The electrical conductivity of the first shield can (310c) may be smaller than the electrical conductivity of the second shield can (320c) and the electrical conductivity of the third shield can (430c). The elongation of the first shield can (310c) may be smaller than the elongation of the second shield can (320c) and the elongation of the third shield can (430c). The hardness of the first shield can (310c) may be smaller than the hardness of the second shield can (320c) and the hardness of the third shield can (430c). However, it is not limited thereto.

[0183] According to one embodiment, compared to the printed circuit board assembly (30b) of FIG. 9, in the printed circuit board assembly (30c) of FIG. 10, the amount of heat generated from at least one of the first printed circuit board (300) or the first electronic component (360, 370) transferred to the rear of the electronic device (e.g., rear cover (111)) may be greater. For example, compared to the printed circuit board assembly (30b) of FIG. 9, in the printed circuit board assembly (30c) of FIG. 10, the amount of heat transferred to the second shield can (320c) and / or the amount of heat transferred by the second shield can (320c) may be greater. However, it is not limited thereto.

[0184] According to one embodiment, compared to the printed circuit board assembly (30b) of FIG. 9, in the printed circuit board assembly (30c) of FIG. 10, the amount of heat generated from at least one of the first printed circuit board (300) or the first electronic component (360, 370) transferred to the front of the electronic device (e.g., display (120)) may be less. For example, compared to the printed circuit board assembly (30b) of FIG. 9, in the printed circuit board assembly (30c) of FIG. 10, the amount of heat transferred to the first shield can (310c) and / or the amount of heat transferred by the first shield can (310c) may be less. However, it is not limited thereto.

[0185] FIG. 11 is a cross-sectional view of a printed circuit board assembly according to one embodiment, in which the thermal conductivity of the second shield can is higher than the thermal conductivity of the first shield can and the thermal conductivity of the third shield can.

[0186] The configuration of FIG. 11 may be referenced by configurations of other drawings to the extent that they are not conflicting with each other. The same terms and / or the same reference numerals have been used for configurations that are identical or substantially identical to configurations of other drawings.

[0187] According to one embodiment, the thermal conductivity of the second shield can (320d) may be higher than the thermal conductivity of the first shield can (310d) and the thermal conductivity of the third shield can (430d). For example, the second shield can (320d) may include a material having a relatively higher thermal conductivity compared to the first shield can (310d) and the third shield can (430d). For example, the second shield can (320d) may be formed from a material having a relatively higher thermal conductivity compared to the material forming the first shield can (310d) and the material forming the third shield can (430d). For example, the second shield can (320d) may be formed of a first metal or a first conductive polymer, and the first shield can (310d) and the third shield can (430d) may be formed of a second metal having lower thermal conductivity than the first metal or a second conductive polymer having lower thermal conductivity than the first conductive polymer. In one example, the first metal may include chromium copper, and the second metal may include nickel silver. However, it is not limited thereto.

[0188] According to one embodiment, the thermal capacity of the second shield can (320d) may be greater than the thermal capacity of the first shield can (310d) and the thermal capacity of the third shield can (430d). The electrical conductivity of the second shield can (320d) may be greater than the electrical conductivity of the first shield can (310d) and the electrical conductivity of the third shield can (430d). The elongation of the second shield can (320d) may be greater than the elongation of the first shield can (310d) and the elongation of the third shield can (430d). The hardness of the second shield can (320d) may be greater than the hardness of the first shield can (310d) and the hardness of the third shield can (430d). However, it is not limited thereto.

[0189] According to one embodiment, compared to the printed circuit board assembly (30c) of FIG. 10, in the printed circuit board assembly (30d) of FIG. 11, the amount of heat generated from at least one of the first printed circuit board (300) or the first electronic component (360, 370) transferred to the rear of the electronic device (e.g., rear cover (111)) may be less. For example, compared to the printed circuit board assembly (30c) of FIG. 10, in the printed circuit board assembly (30d) of FIG. 11, the amount of heat transferred to the third shield can (430d) and / or the amount of heat transferred by the third shield can (430d) may be less. However, it is not limited thereto.

[0190] FIG. 12 is a cross-sectional view of a printed circuit board assembly according to one embodiment, in which the thermal conductivity of the third shield can is lower than the thermal conductivity of the first shield can and the thermal conductivity of the second shield can.

[0191] The configuration of the printed circuit board assembly (30e) of FIG. 12 may be referenced by configurations of other drawings to the extent that they are not arranged with each other. The same terms and / or the same reference numerals have been used for configurations that are identical or substantially identical to configurations of other drawings.

[0192] According to one embodiment, the thermal conductivity of the third shield can (430e) may be lower than the thermal conductivity of the first shield can (310e) and the thermal conductivity of the second shield can (320e). For example, the third shield can (430e) may include a material having a relatively lower thermal conductivity compared to the first shield can (310e) and the second shield can (320e). For example, the third shield can (430e) may be formed from a material having a relatively lower thermal conductivity compared to the material forming the first shield can (310e) and the material forming the second shield can (320e). For example, the first shield can (310e) and the second shield can (320e) may be formed of a first metal or a first conductive polymer, and the third shield can (430e) may be formed of a second metal having lower thermal conductivity than the first metal or a second conductive polymer having lower thermal conductivity than the first conductive polymer. In one example, the first metal may include chromium copper, and the second metal may include nickel silver. However, it is not limited thereto.

[0193] According to one embodiment, the thermal capacity of the third shield can (430e) may be smaller than the thermal capacity of the first shield can (310e) and the thermal capacity of the second shield can (320e). The electrical conductivity of the third shield can (430e) may be smaller than the electrical conductivity of the first shield can (310e) and the electrical conductivity of the second shield can (320e). The elongation of the third shield can (430e) may be smaller than the elongation of the first shield can (310e) and the elongation of the second shield can (320e). The strength of the third shield can (430e) may be smaller than the strength of the first shield can (310e) and the strength of the second shield can (320e). However, it is not limited thereto.

[0194] According to one embodiment, compared to the printed circuit board assembly (30d) of FIG. 11, in the printed circuit board assembly (30e) of FIG. 12, the amount of heat generated from at least one of the first printed circuit board (300) or the first electronic component (360, 370) transferred to the front of the electronic device (e.g., display (120)) may be greater. For example, compared to the printed circuit board assembly (30d) of FIG. 11, in the printed circuit board assembly (30e) of FIG. 12, the amount of heat transferred to the first shield can (310e) and / or the amount of heat transferred by the first shield can (310e) may be greater. However, it is not limited thereto.

[0195] According to one embodiment, at least one component may be omitted from the printed circuit board assembly (e.g., the printed circuit board assembly (20) of FIG. 4 and / or the printed circuit board assembly (30) of FIG. 7). For example, at least one of the third shield can or the second heat transfer material may be omitted from the printed circuit board assembly (e.g., the printed circuit board assembly (30) of FIG. 7, the printed circuit board assembly (30a) of FIG. 8, the printed circuit board assembly (30b) of FIG. 9, the printed circuit board assembly (30c) of FIG. 10, the printed circuit board assembly (30d) of FIG. 11 and / or the printed circuit board assembly (30e) of FIG. 12).

[0196] Hereinafter, in FIGS. 13 and 14, various embodiments of a printed circuit board assembly in which a second heat transfer material is omitted will be described.

[0197] FIG. 13 is a cross-sectional view of a printed circuit board assembly according to one embodiment, which does not include a second thermal interface material (TIM) and has a thermal conductivity of the first shield can higher than that of the second shield can.

[0198] The configuration of the printed circuit board assembly (30f) of FIG. 13 may be referenced by configurations of other drawings to the extent that they are not arranged with each other. The same terms and / or the same reference numerals have been used for configurations that are identical or substantially identical to configurations of other drawings.

[0199] Referring to FIG. 13, a printed circuit board assembly (30f) according to one embodiment may not include a second heat transfer material (e.g., the second heat transfer material (450) of FIG. 7). For example, the first printed circuit board (300) and the third shield can (430f) may be spaced apart from each other, and a void space (e.g., an air gap) may be formed between the first printed circuit board (300) and the third shield can (430f). For example, the first printed circuit board (300) and the second printed circuit board (400) may be spaced apart from each other, and a void space (e.g., an air gap) may be formed between the first printed circuit board (300) and the second printed circuit board (400).

[0200] According to one embodiment, if the printed circuit board assembly (30f) does not include a second heat transfer material, the transfer of heat generated from at least one of the first printed circuit board (300) or at least one of the first electronic components (360, 370) to at least one of the third shield can (430f) or the second shield can (320f) may be delayed. Accordingly, the transfer of the generated heat to the rear of the electronic device (e.g., the rear cover (111) of FIG. 3) may be delayed, or the amount of heat transferred to the rear of the electronic device may be reduced. In one example, the amount of heat transferred to the front of the electronic device (e.g., the display (120)) may be increased. For example, the amount of heat transferred to the support member (140) may be increased. However, it is not limited thereto.

[0201] According to one embodiment, the thermal conductivity of the third shield can (430f) may be lower than the thermal conductivity of the first shield can (310f) and the second shield can (320f). For example, the third shield can (430f) may include a material having a relatively lower thermal conductivity compared to the first shield can (310f) and the second shield can (320f). For example, the third shield can (430f) may be formed from a material having a relatively lower thermal conductivity compared to the material forming the first shield can (310f) and the material forming the second shield can (320f). For example, the first shield can (310f) and the second shield can (320f) may be formed of a first metal or a first conductive polymer, and the third shield can (430f) may be formed of a second metal having lower thermal conductivity than the first metal or a second conductive polymer having lower thermal conductivity than the first conductive polymer. In one example, the first metal may include chromium copper, and the second metal may include nickel silver. However, it is not limited thereto.

[0202] According to one embodiment, the thermal capacity of the third shield can (430f) may be smaller than the thermal capacity of the first shield can (310f) and the thermal capacity of the second shield can (320f). The electrical conductivity of the third shield can (430f) may be smaller than the electrical conductivity of the first shield can (310f) and the electrical conductivity of the second shield can (320f). The elongation of the third shield can (430f) may be smaller than the elongation of the first shield can (310f) and the elongation of the second shield can (320f). The strength of the third shield can (430f) may be smaller than the strength of the first shield can (310f) and the strength of the second shield can (320f). However, it is not limited thereto.

[0203] According to one embodiment, compared to the printed circuit board assembly (30e) of FIG. 12, in the printed circuit board assembly (30f) of FIG. 13, the amount of heat generated from at least one of the first printed circuit board (300) or the first electronic component (360, 370) transferred to the back of the electronic device (e.g., back cover (111)) may be less. For example, compared to the printed circuit board assembly (30e) of FIG. 12, in the printed circuit board assembly (30f) of FIG. 13, the amount of heat transferred to the second shield can (320f) and / or the amount of heat transferred by the second shield can (320f) may be less. For example, compared to the printed circuit board assembly (30e) of FIG. 12, the amount of heat transferred to the third shield can (430f) and / or the amount of heat transferred by the third shield can (430f) in the printed circuit board assembly (30f) of FIG. 13 may be less. However, it is not limited thereto.

[0204] FIG. 14 is a cross-sectional view of a printed circuit board assembly according to one embodiment, which does not include a second heat transfer material and has a thermal conductivity of the second shield can higher than that of the first shield can.

[0205] The configuration of the printed circuit board assembly (30g) of FIG. 14 may be referenced by configurations of other drawings to the extent that they are not arranged with each other. The same terms and / or the same reference numerals have been used for configurations that are identical or substantially identical to configurations of other drawings.

[0206] Referring to FIG. 13, a printed circuit board assembly (30g) according to one embodiment may not include a second heat transfer material (e.g., the second heat transfer material (450) of FIG. 7). For example, the first printed circuit board (300) and the third shield can (430g) may be spaced apart from each other, and a void space (e.g., an air gap) may be formed between the first printed circuit board (300) and the third shield can (430g). For example, the first printed circuit board (300) and the second printed circuit board (400) may be spaced apart from each other, and a void space (e.g., an air gap) may be formed between the first printed circuit board (300) and the second printed circuit board (400).

[0207] According to one embodiment, if the printed circuit board assembly (30g) does not include a second heat transfer material, the transfer of heat generated from at least one of the first printed circuit board (300) or at least one of the first electronic components (360, 370) to at least one of the third shield can (430g) or the second shield can (320g) may be delayed. Accordingly, the transfer of the generated heat to the rear of the electronic device (e.g., the rear cover (111) of FIG. 3) may be delayed, or the amount of heat transferred to the rear of the electronic device may be reduced. In one example, the amount of heat transferred to the front of the electronic device (e.g., the display (120)) may be increased. For example, the amount of heat transferred to the support member (140) may be increased. However, it is not limited thereto.

[0208] According to one embodiment, the thermal conductivity of the second shield can (320g) may be higher than the thermal conductivity of the first shield can (310g) and the thermal conductivity of the third shield can (430g). For example, the second shield can (320g) may include a material having a relatively higher thermal conductivity compared to the first shield can (310g) and the third shield can (430g). For example, the second shield can (320g) may be formed from a material having a relatively higher thermal conductivity compared to the material forming the first shield can (310g) and the material forming the third shield can (430g). For example, the second shield can (320g) may be formed of a first metal or a first conductive polymer, and the first shield can (310g) and the third shield can (430g) may be formed of a second metal having lower thermal conductivity than the first metal or a second conductive polymer having lower thermal conductivity than the first conductive polymer. In one example, the first metal may include chromium copper, and the second metal may include nickel silver. However, it is not limited thereto.

[0209] According to one embodiment, the thermal capacity of the second shield can (320g) may be greater than the thermal capacity of the first shield can (310g) and the thermal capacity of the third shield can (430g). The electrical conductivity of the second shield can (320g) may be greater than the electrical conductivity of the first shield can (310g) and the electrical conductivity of the third shield can (430g). The elongation of the second shield can (320g) may be greater than the elongation of the first shield can (310g) and the elongation of the third shield can (430g). The hardness of the second shield can (320g) may be greater than the hardness of the first shield can (310g) and the hardness of the third shield can (430g). However, it is not limited thereto.

[0210] According to one embodiment, compared to the printed circuit board assembly (30f) of FIG. 13, in the printed circuit board assembly (30g) of FIG. 14, the amount of heat generated from at least one of the first printed circuit board (300) or the first electronic component (360, 370) transferred to the rear of the electronic device (e.g., rear cover (111)) may be greater. For example, compared to the printed circuit board assembly (30f) of FIG. 13, in the printed circuit board assembly (30g) of FIG. 14, the amount of heat transferred to the second shield can (320g) and / or the amount of heat transferred by the second shield can (320g) may be greater. However, it is not limited thereto.

[0211] According to one embodiment, compared to the printed circuit board assembly (30f) of FIG. 13, the amount of heat generated from at least one of the first printed circuit board (300) or the first electronic component (360, 370) transferred to the front of the electronic device (e.g., display (120)) in the printed circuit board assembly (30g) of FIG. 14 may be less. For example, compared to the printed circuit board assembly (30f) of FIG. 13, the amount of heat transferred to the first shield can (310g) and / or the amount of heat transferred by the first shield can (310g) in the printed circuit board assembly (30g) of FIG. 14 may be less. However, it is not limited thereto.

[0212] FIG. 15 is a cross-sectional view of a printed circuit board assembly according to one embodiment, in which the thermal conductivity of the first heat transfer material and the thermal conductivity of the second heat transfer material are different.

[0213] The configuration of the printed circuit board assembly (30h) of FIG. 15 may be referenced by configurations of other drawings to the extent that they are not arranged with each other. The same terms and / or the same reference numerals have been used for configurations that are identical or substantially identical to configurations of other drawings.

[0214] According to one embodiment, the thermal conductivity of the first heat transfer material (390a) may be different from the thermal conductivity of the second heat transfer material (450a). The heat capacity of the first heat transfer material (390a) may be different from the heat capacity of the second heat transfer material (450a).

[0215] According to one embodiment, the thermal conductivity of the first heat transfer material (390a) may be higher than the thermal conductivity of the second heat transfer material (450a). When the thermal conductivity of the first heat transfer material (390a) is higher than the thermal conductivity of the second heat transfer material (450a), the amount of heat generated from at least one of the first printed circuit board or the first electronic component transferred to the front of the electronic device (e.g., the display (120) of FIG. 3) may increase. The amount of heat generated transferred to the rear of the electronic device (e.g., the rear cover (111) of FIG. 3) may decrease. However, it is not limited thereto.

[0216] According to one embodiment, the thermal conductivity of the first heat transfer material (390a) may be lower than the thermal conductivity of the second heat transfer material (450a). If the thermal conductivity of the first heat transfer material (390a) is lower than the thermal conductivity of the second heat transfer material (450a), the amount of heat generated from at least one of the first printed circuit board or the first electronic component transferred to the front of the electronic device (e.g., the display (120) in FIG. 3) may be reduced. The amount of heat generated transferred to the rear of the electronic device (e.g., the rear cover (111) in FIG. 3) may be increased. However, it is not limited thereto.

[0217] When referring to FIG. 3, according to one embodiment, a display (e.g., the display (120) of FIG. 3) may be positioned to face in a direction (e.g., +z direction) from the second heat transfer material (450a) toward the first heat transfer material (390a).

[0218] Hereinafter, a foldable electronic device according to an embodiment of the present disclosure will be described in FIG. 16, FIG. 17, and FIG. 18, and a foldable electronic device including a printed circuit board assembly according to an embodiment of the present disclosure will be described in FIG. 19.

[0219] FIG. 16 is a front view of an electronic device according to one embodiment.

[0220] FIG. 17 is a plan view of the rear direction of an electronic device according to one embodiment.

[0221] Referring to FIGS. 16 and 17, the electronic device (500) may include a first housing (510) (e.g., a first housing structure) comprising a first side member (513) (e.g., a side bezel) and a second housing (520) (e.g., a second housing structure) comprising a second side member (523) (e.g., a side bezel), which are foldably joined to each other with respect to a folding axis (F) through at least one hinge device (540, 540-1) (e.g., a hinge module or a hinge structure) with respect to a folding axis (F). For example, the first housing (510) and the second housing (520) may be configured as a foldable housing (e.g., a housing structure). For example, the electronic device (500) may include a first display (530) (e.g., a flexible display, a foldable display, or a main display) positioned to be supported by a first housing (510) and a second housing (520). For example, the first housing (510) may include a first surface (511) and a second surface (512) facing in the opposite direction (e.g., the -z axis direction) of the first surface (511). For example, the second housing (520) may include a third surface (521) and a fourth surface (522) facing in the opposite direction (e.g., the -z axis direction) of the third surface (521). For example, the first housing (510) may include a first rear cover (514) coupled with a first side member (513). For example, the second housing (520) may include a second rear cover (524) coupled with a second side member (523). For example, when the electronic device (500) is in a fully unfolded first state (e.g., unfolded state or unfolded state), the first surface (511) and the third surface (521) may be operated to face substantially the same direction (e.g., z-axis direction). For example, when the electronic device (500) is in a fully folded second state (e.g., folded state or folded state), the first surface (511) and the third surface (521) may be operated to face each other or face opposite directions.For example, the electronic device (500) may be operated to maintain a third state (e.g., an intermediate state) between the first state and the second state.

[0222] According to one embodiment, the electronic device (500) may include a first receiver (501) disposed on a first surface (511) of a first housing (510), at least one first sensor module (504) (e.g., an ambient light sensor) and / or at least one first camera module (505) (e.g., a UDC, under display camera). For example, the electronic device (500) may include at least one key (506) disposed on a first side member (513). For example, the electronic device (500) may include at least one second camera module (508) and / or a flash (509) disposed on a second surface (512) of the first housing (510) (e.g., a first rear cover (514)). For example, the electronic device (500) may include a second display (531) disposed on the fourth side (522) of the second housing (520), at least one third camera module (525) (e.g., UDC, under display camera), at least one second sensor module (526) and / or a second receiver (527). For example, the second display (531) may be disposed to be visible from the outside through at least a portion of the second rear cover (524). For example, the electronic device (500) may include a speaker (502) disposed on the second side member (523), a microphone (503) disposed on the first side member (513), and / or a connector port (507). At least some of the aforementioned components may be repositioned in the first housing (510) and / or the second housing (520).

[0223] According to one embodiment, the first display (530) (e.g., flexible display) may include a first region (530a) (e.g., first planar portion) corresponding to at least a portion of the first surface (511), a second region (530b) (e.g., second planar portion) corresponding to at least a portion of the third surface (521), and a third region (530c) (e.g., flexible portion) connecting the first region (530a) and the second region (530b), wherein the electronic device (500) is deformed in a second state (e.g., folding state) and / or a third state. For example, the third region (530c) may be positioned so as to overlap at least partially with at least one hinge device (540, 540-1) when the first display (530) is viewed from above (e.g., in the z-axis direction). For example, the first display (530) may be positioned so as not to be seen from the outside in the second state, with the first surface (511) and the third surface (521) facing each other (e.g., inward-fold type). For example, the first display (530) may be positioned so as to be seen from the outside in the second state, with the first surface (511) and the third surface (521) facing in opposite directions (e.g., outward-fold type).

[0224] FIG. 18 is a partially exploded perspective view of the electronic device of FIG. 1 and FIG. 2 including a hinge device according to one embodiment.

[0225] Referring to FIG. 18, the electronic device (500) may include at least one hinge device (540, 540-1) (e.g., hinge module or hinge structure) connecting the first housing (510) and the second housing (520) below the first display (530) (e.g., in the -z axis direction). For example, the at least one hinge device (540, 540-1) may include a first hinge device (540) and a second hinge device (540-1) spaced apart from the first hinge device (540) along a direction parallel to the folding axis (F) (e.g., in the ± y axis direction). For example, at least one hinge device (540, 540-1) may be supported by a first support member (5131) extending from a first side member (513) into a first space (5101) of a first housing (510) and a second support member (5231) extending from a second side member (523) into a second space (5201) of a second housing (520). For example, at least one hinge device (540, 540-1) may be positioned between the first housing (510) and the second housing (520) so as not to be seen from the outside through a hinge housing (550) (e.g., a hinge cover).

[0226] According to one embodiment, the first hinge device (540) may include a first rotation member (541) (e.g., a first arm or a first rotator) disposed on a first support member (5131) of a first housing (510), a second rotation member (542) (e.g., a second arm or a second rotator) disposed on a second support member (5231) of a second housing (520), and a gear assembly (543) connected to the first rotation member (541) and the second rotation member (542) so that the first housing (510) and the second housing (520) rotate symmetrically with respect to each other. For example, the gear assembly (543) may include a plurality of gears (e.g., spur gears and / or worm gears) that are geared to each other. For example, the gear assembly (543) may include a cam coupling structure for providing a free stop at various folding angles, which presses the first housing (510) and the second housing (520) with respect to each other in a direction intended to transition from a first state (e.g., unfolded state) to a second state (e.g., folded state) or from a second state to a first state, based on a certain angle. For example, the second hinge device (540-1) may have substantially the same configuration as the first hinge device (540).

[0227] According to one embodiment, the electronic device (500) may include a first hinge plate (561) connected to a first support member (5131) and / or a first rotating member (541). The electronic device (500) may include a second hinge plate (562) connected to a second support member (5231) and / or a second rotating member (542). For example, at least one hinge device (540, 540-1), a first rotating member (541), a second rotating member (542), a first hinge plate (561), and a second hinge plate (562) may form substantially the same plane as the first support member (5131) and the second support member (5231) when the electronic device (500) is in a first state. For example, the second hinge device (540-1) may be substantially symmetric to or have substantially the same configuration as the first hinge device (540).

[0228] FIG. 19 is a partial cross-sectional view of an electronic device including a printed circuit board assembly according to one embodiment.

[0229] The configuration of FIG. 19 may be referenced by configurations of other drawings to the extent that they are not mutually disposed. The same terms and / or the same reference numerals have been used for configurations that are identical or substantially identical to configurations of other drawings.

[0230] The electronic device of FIG. 19 (e.g., the electronic device (500) of FIG. 18) may include a foldable electronic device. For example, the electronic device of FIG. 19 may include a multi-foldable electronic device.

[0231] Referring to FIG. 19, a printed circuit board assembly (30) according to one embodiment may be disposed within a first housing (510). The electronic device may include at least one heat dissipation member that absorbs heat generated in the first housing (510) by the printed circuit board assembly (30) and transfers, diffuses, or releases it to another area. For example, the electronic device may include a third heat dissipation member (580).

[0232] According to one embodiment, the third heat dissipation member (580) may be configured to transfer heat generated in the printed circuit board assembly (30) (e.g., heat generated from the first printed circuit board (310) or at least one of the first electronic components (e.g., the first electronic components (260, 270) of FIG. 4)) to the second housing (520). For example, the third heat dissipation member (580) may be arranged to transfer the generated heat from the first housing (510) to the second housing (520). For example, the third heat dissipation member (580) may be in contact with the printed circuit board assembly (30). In one example, the third heat dissipation member (580) may be in contact with at least one of the first shield can (310), a shielding member (e.g., the shielding member (330) of FIG. 7), or a coating layer (e.g., the coating layer (340) of FIG. 7).

[0233] According to one embodiment, the third heat dissipation member (580) may extend from the first housing (510) through the hinge structure (540) (or, hinge structure (540-1)) to the second housing (520). In one example, the third heat dissipation member (580) may be at least partially bent. For example, the third heat dissipation member (580) may have a shape substantially corresponding to the shape of the flexible circuit board (570) arranged to pass through the hinge structure (540). However, it is not limited thereto.

[0234] According to one embodiment, one end of the third heat dissipation member (580) may be positioned closer to the first shield can (310) than to the second shield can (320). For example, the third heat dissipation member (580) may be positioned closer to the flexible display (530) than to the first rear cover (514). For example, the flexible display (530) may be positioned to face in a direction (e.g., +z direction) from the second shield can (320) toward the first shield can (310).

[0235] According to one embodiment, the thermal conductivity of the first shield can (310) may differ from the thermal conductivity of the second shield can (320). For example, the thermal conductivity of the first shield can (310) may be higher than the thermal conductivity of the second shield can (320). The difference between the thermal conductivity of the first shield can (310) and the thermal conductivity of the second shield can (320) may be referenced by the content of the other drawings described above. For example, the printed circuit board assembly (30) of FIG. 19 may be referenced by at least one of the printed circuit board assembly (20) of FIG. 4, the printed circuit board assembly (20a) of FIG. 5, the printed circuit board assembly (20b) of FIG. 6, the printed circuit board assembly (30) of FIG. 7, the printed circuit board assembly (30a) of FIG. 8, the printed circuit board assembly (30b) of FIG. 9, the printed circuit board assembly (30c) of FIG. 10, the printed circuit board assembly (30d) of FIG. 11, the printed circuit board assembly (30e) of FIG. 12, the printed circuit board assembly (30f) of FIG. 13, the printed circuit board assembly (30g) of FIG. 14, or the printed circuit board assembly (30h) of FIG. 15.

[0236] As described above, an electronic device according to one embodiment (e.g., the electronic device (100) of FIG. 1) may include a first printed circuit board (e.g., the first printed circuit board (200) of FIG. 4). The electronic device may include a first electronic component (e.g., the first electronic component (270) of FIG. 4) disposed on one side of the first printed circuit board. The electronic device may include a first shield can (e.g., the first shield can (210) of FIG. 4) disposed on the one side of the first printed circuit board. The first shield can may at least partially surround the first electronic component. The electronic device may include a second electronic component (e.g., the second electronic component (280) of FIG. 4) disposed on the opposite side of the one side of the first printed circuit board. The electronic device may include a second shield can (e.g., the second shield can (220) of FIG. 4) that at least partially surrounds the second electronic component. The thermal conductivity of the first shield can may be different from the thermal conductivity of the second shield can.

[0237] According to one embodiment, the second electronic component and the second shield can may be placed on the first printed circuit board. The thermal conductivity of the first shield can (e.g., the first shield can (210a) of FIG. 5) may be higher than the thermal conductivity of the second shield can (e.g., the second shield can (220a) of FIG. 5).

[0238] According to one embodiment, the electronic device may include a display (e.g., the display (1200) of FIG. 1). The electronic device may include a support member (e.g., the support member (140) of FIG. 3) that supports the display. The electronic device may include a rear cover (e.g., the rear cover (111) of FIG. 3) that is supported by the support member. The rear cover may be positioned opposite the display. The display may be positioned to face in a direction toward the first shield can from the second shield can. The thermal conductivity of the first shield can may be higher than the thermal conductivity of the second shield can.

[0239] According to one embodiment, the electronic device may include a heat dissipation member (e.g., the first heat dissipation member (151) and the second heat dissipation member (152) of FIG. 3) configured to absorb and transfer heat generated from at least one of the first electronic component or the first printed circuit board. The number of heat dissipation members positioned closer to the first shield can than the second shield can may be greater than the number of heat dissipation members positioned closer to the second shield can than the first shield can. The thermal conductivity of the first shield can may be higher than the thermal conductivity of the second shield can.

[0240] According to one embodiment, the electronic device may include a heat dissipation member configured to absorb and transfer heat generated from at least one of the first electronic component or the first printed circuit board. The heat dissipation member may include a first heat dissipation member (e.g., the first heat dissipation member (151) of FIG. 3) positioned closer to the first shield can than to the second shield can. The heat dissipation member may include a second heat dissipation member (e.g., the second heat dissipation member (152) of FIG. 3) positioned closer to the second shield can than to the first shield can. The heat capacity of the first heat dissipation member may be greater than the heat capacity of the second heat dissipation member. The thermal conductivity of the first shield can may be higher than the thermal conductivity of the second shield can.

[0241] According to one embodiment, the first shield can may be formed of a material having a thermal conductivity different from that of the material forming the second shield can.

[0242] According to one embodiment, the electronic device may include a second printed circuit board (e.g., the second printed circuit board (400) of FIG. 7). The second printed circuit board may be spaced apart from the first printed circuit board. The second printed circuit board may be positioned to face each other with the first printed circuit board. The second electronic component and the second shield can may be positioned on one side of the second printed circuit board. The one side of the second printed circuit board may face in the opposite direction to the one side of the first printed circuit board.

[0243] According to one embodiment, the electronic device may include a second printed circuit board (e.g., a second printed circuit board (400) of FIG. 7) positioned to overlap with the first printed circuit board (e.g., the first printed circuit board (300) of FIG. 7). The second printed circuit board may be connected to the first printed circuit board through an interposer (e.g., an interposer (410) of FIG. 7). The second electronic component (e.g., the second electronic component (380) of FIG. 7) and the second shield can (e.g., the second shield can (320) of FIG. 7) may be positioned on one side of the second printed circuit board. The one side of the second printed circuit board may face in the opposite direction to the one side of the first printed circuit board.

[0244] According to one embodiment, the electronic device may include a third electronic component (e.g., the third electronic component (440) of FIG. 7) disposed on the opposite side of the first side of the second printed circuit board. The electronic device may include a third shield can (e.g., the third shield can (430) of FIG. 7) disposed to at least partially surround the third electronic component. The third electronic component and the third shield can may be disposed on the second printed circuit board. The thermal conductivity of the third shield can may differ from at least one of the thermal conductivity of the first shield can (e.g., the first shield can (310) of FIG. 7) or the thermal conductivity of the second shield can (e.g., the second shield can (320) of FIG. 7).

[0245] According to one embodiment, the electronic device may include a fourth electronic component (e.g., the fourth electronic component (420) of FIG. 7) disposed on the opposite side of the first printed circuit board. The electronic device may include a fourth shield can (not shown) disposed to at least partially surround the fourth electronic component. The thermal conductivity of the fourth shield can may differ from at least one of the thermal conductivity of the first shield can or the thermal conductivity of the second shield can.

[0246] According to one embodiment, the thermal conductivity of at least one of the first shield can or the fourth shield can may be higher than the thermal conductivity of the second shield can and the thermal conductivity of the third shield can. The thermal conductivity of the third shield can may be higher than or equal to the thermal conductivity of the second shield can.

[0247] According to one embodiment, the second printed circuit board may be connected to the first printed circuit board through an interposer (e.g., the interposer (410) of FIG. 7). The interposer may include at least one of a circuit that electrically connects the first printed circuit board and the second printed circuit board (e.g., the interposer (410) of FIG. 7), or a fifth shield can (e.g., the interposer (410) of FIG. 7) that surrounds at least a portion of the space formed between the first printed circuit board and the second printed circuit board.

[0248] According to one embodiment, at least one of the first shield can, the second shield can, the third shield can, the fourth shield can, or the fifth shield can may include at least one of a metal or a conductive polymer.

[0249] According to one embodiment, the thermal conductivity of the first shield can may be higher than the thermal conductivity of the second shield can and the thermal conductivity of the third shield can. The thermal conductivity of the third shield can may be higher than or equal to the thermal conductivity of the second shield can.

[0250] According to one embodiment, the third shield can (e.g., the third shield can (430f) of FIG. 13) may be spaced apart from the first printed circuit board by a predetermined distance so that a space is formed between the third shield can and the first printed circuit board (e.g., the first printed circuit board (300) of FIG. 13).

[0251] According to one embodiment, the first shield can may include an opening formed at a position overlapping with the first electronic component (e.g., the opening (311) of FIG. 7). The electronic device may include a shielding member (e.g., the shielding member (330) of FIG. 7) covering the opening. The electronic device may include a first thermal interface material (TIM) (e.g., the first thermal interface material (390) of FIG. 7) in contact with the first electronic component and the shielding member. The first thermal interface material may be disposed within the space formed by the shielding member and the first shield can. The electronic device may include a second thermal interface material (e.g., the second thermal interface material (450) of FIG. 7) in contact with the first printed circuit board and the third shield can. The second thermal interface material may be disposed in the space formed between the first printed circuit board and the second printed circuit board. The thermal conductivity of the first heat transfer material may differ from the thermal conductivity of the second heat transfer material.

[0252] According to one embodiment, the electronic device may include a display. The electronic device may include a support member that supports the display. The electronic device may include a rear cover supported by the support member. The rear cover may be positioned opposite the display. The display may be positioned so as to face from the second heat transfer material toward the first heat transfer material. The thermal conductivity of the first heat transfer material (e.g., the first heat transfer material (390a) of FIG. 15) may be higher than the thermal conductivity of the second heat transfer material (e.g., the second heat transfer material (450a) of FIG. 15).

[0253] According to one embodiment, at least one of the first shield can, the second shield can, or the third shield can may comprise at least one of a metal or a conductive polymer.

[0254] According to one embodiment, the electronic device may include a first housing (e.g., the first housing (510) of FIG. 19) on which the first printed circuit board is placed. The electronic device may include a second housing (e.g., the second housing (520) of FIG. 19). The electronic device may include a hinge structure (e.g., the hinge device (540, 540-1) of FIG. 19) that rotatably connects the first housing and the second housing. The electronic device may include a third heat dissipation member (e.g., the third heat dissipation member (580) of FIG. 19) arranged to transfer heat generated from at least one of the first printed circuit board or the first electronic component from the first housing on which the first printed circuit board is placed to the second housing.

[0255] According to one embodiment, the electronic device may include a flexible display (e.g., the flexible display (530) of FIG. 19) supported by the first housing and the second housing. The flexible display may be positioned to face in a direction toward the first shield can from the second shield can. One end of the third heat dissipation member may be positioned closer to the first shield can than to the second shield can. The thermal conductivity of the first shield can may be higher than the thermal conductivity of the second shield can.

[0256] As described above, a printed circuit board assembly according to one embodiment (e.g., the printed circuit board assembly (20) of FIG. 4 and / or the printed circuit board assembly (30) of FIG. 7) may include a first printed circuit board. The printed circuit board assembly may include a first electronic component disposed on one side of the first printed circuit board. The first printed circuit board assembly may include a first shield can disposed on the one side of the first printed circuit board. The first shield can may at least partially surround the electronic component. The printed circuit board assembly may include a second electronic component disposed on the opposite side of the one side of the first printed circuit board. The printed circuit board assembly may include a second shield can that at least partially surrounds the second electronic component. The thermal conductivity of the first shield can may differ from the thermal conductivity of the second shield can.

[0257] According to one embodiment, the second electronic component and the second shield can may be disposed on the first printed circuit board. The thermal conductivity of the first shield can may be higher than the thermal conductivity of the second shield can.

[0258] According to one embodiment, the first shield can may be formed of a material having a thermal conductivity different from that of the material forming the second shield can.

[0259] According to one embodiment, the printed circuit board assembly may include a second printed circuit board positioned to overlap with the first printed circuit board. The second printed circuit board may be connected to the first printed circuit board through an interposer. The second electronic component and the second shield can may be positioned on one side of the second printed circuit board. The one side of the second printed circuit board may face in a direction opposite to the one side of the first printed circuit board.

[0260] According to one embodiment, the printed circuit board assembly may include a third electronic component disposed on the opposite side of the first side of the second printed circuit board. The printed circuit board assembly may include a third shield can disposed to at least partially surround the third electronic component. The third electronic component and the third shield can may be disposed on the second printed circuit board. The thermal conductivity of the third shield can may differ from at least one of the thermal conductivity of the first shield can or the thermal conductivity of the second shield can.

[0261] As described above, an electronic device according to one embodiment (e.g., the electronic device (100) of FIG. 1) may include a first printed circuit board. The electronic device may include a first shield can disposed on one side of the first printed circuit board. The electronic device may include a second shield can disposed on the opposite side of the first printed circuit board. The electronic device may include a thermal diffusion member. The thermal conductivity of either the first shield can and the second shield can disposed closer to the thermal diffusion member may be higher than the thermal conductivity of the other shield can.

[0262] According to one embodiment, the electronic device may include a second printed circuit board spaced apart from the first printed circuit board and positioned to face the first printed circuit board. The electronic device may include at least one of a second shield can positioned on one side of the second printed circuit board, a third shield can positioned on the other side opposite the one side of the second printed circuit board, or a fourth shield can positioned on the other side opposite the one side of the first printed circuit board. The thermal conductivity of any one of the first shield can and the fourth shield can positioned closer to the heat diffusion member may be higher than the thermal conductivity of the other shield can that is not positioned closer.

[0263] According to one embodiment, the thermal conductivity of any one shield can among the first shield can, the second shield can, the third shield can, and the fourth shield can that is positioned closer to the heat diffusion member may be higher than the thermal conductivity of any one of the shield cans that are not positioned closer.

[0264] According to one embodiment, the first shield can may include an opening. The electronic device may include a shielding member covering the opening. The electronic device may include a first heat transfer material in contact with the shielding member. The first heat transfer material may be disposed within the space formed by the shielding member and the first shield can. The electronic device may include a second heat transfer material disposed in the space formed between the first printed circuit board and the second printed circuit board, in contact with the first printed circuit board and the second printed circuit board. Among the first heat transfer material and the second heat transfer material, the thermal conductivity of the heat transfer material disposed closer to the heat diffusion member may be higher than the thermal conductivity of the other heat transfer material not disposed closer.

[0265] According to one embodiment, the heat diffusion member may include at least one of a vapor chamber or a heat pipe.

[0266] As described above, a printed circuit board assembly according to one embodiment (e.g., the printed circuit board assembly (20) of FIG. 4 and / or the printed circuit board assembly (30) of FIG. 7) may include a first printed circuit board. The printed circuit board assembly may include a second printed circuit board spaced apart from the first printed circuit board. The second printed circuit board may be positioned to face each other with the first printed circuit board. The printed circuit board assembly may include a first shield can positioned on one side of the first printed circuit board. The printed circuit board assembly may include at least one of a second shield can positioned on one side of the second printed circuit board, a third shield can positioned on the other side opposite to the one side of the second printed circuit board, or a fourth shield can positioned on the other side opposite to the one side of the first printed circuit board. The printed circuit board assembly may include a heat diffusion member. The thermal conductivity of one of the first shield can and the fourth shield can that is positioned closer to the heat diffusion member may be higher than the thermal conductivity of the other shield can that is not.

[0267] According to one embodiment, the thermal conductivity of any one shield can among the first shield can, the second shield can, the third shield can, and the fourth shield can that is positioned closer to the heat diffusion member may be higher than the thermal conductivity of any one of the shield cans that are not positioned closer.

[0268] In the specific embodiments of the present disclosure described above, the components included in the disclosure are expressed in a singular or plural form according to the specific embodiments presented. However, the singular or plural expression is selected to suit the situation presented for convenience of explanation, and the present disclosure is not limited to singular or plural components; even if a component is expressed in the plural form, it may be composed of a singular form, and even if a component is expressed in the singular form, it may be composed of a plural form.

[0269] The specific embodiments described in this disclosure are merely examples and do not limit the scope of this disclosure in any way. For the sake of brevity, descriptions of prior electronic configurations, control systems, software, and other functional aspects of said systems may be omitted.

[0270] Additionally, in the present disclosure, "comprising at least one of a, b, or c" may mean "comprising only a, comprising only b, comprising only c, or comprising a combination of two or more (comprising a and b, comprising b and c, comprising a and c, or comprising all of a, b, and c)."

[0271] Meanwhile, although specific embodiments have been described in the detailed description of the present disclosure, it is understood that various modifications are possible within the scope of the present disclosure. Therefore, the scope of the present disclosure should not be limited to the described embodiments, but should be defined by the claims set forth below as well as equivalents thereof.

Claims

1. In an electronic device, First printed circuit board; A first electronic component disposed on one side of the first printed circuit board; A first shield can disposed on one side of the first printed circuit board and at least partially surrounding the first electronic component; A second electronic component disposed on the opposite side of the first printed circuit board; and A second shield can that at least partially surrounds the second electronic component; comprising, The thermal conductivity of the first shield can is different from the thermal conductivity of the second shield can. Electronic device.

2. In Claim 1, The above electronic device further includes a display, The second electronic component and the second shield can are placed on the first printed circuit board, and The above display is positioned to face in a direction from the second shield can toward the first shield can, and The thermal conductivity of the first shield can is higher than the thermal conductivity of the second shield can. Electronic device.

3. In Claim 1, The electronic device further includes a heat dissipation member configured to absorb and transfer heat generated from at least one of the first electronic component or the first printed circuit board, and The heat dissipation member comprises a first heat dissipation member positioned closer to the first shield can than to the second shield can, and a second heat dissipation member positioned closer to the second shield can than to the first shield can. The heat capacity of the first heat dissipation member is greater than the heat capacity of the second heat dissipation member, and The thermal conductivity of the first shield can is higher than the thermal conductivity of the second shield can. Electronic device.

4. In Claim 1, The first shield can is formed of a material having a thermal conductivity different from that of the material forming the second shield can. Electronic device.

5. In Claim 1, The above electronic device further includes a second printed circuit board, and The second printed circuit board is spaced apart from the first printed circuit board and is positioned to face the first printed circuit board. The second electronic component and the second shield can are disposed on one side of the second printed circuit board, and One side of the second printed circuit board faces in a direction opposite to the one side of the first printed circuit board. Electronic device.

6. In Claim 5, The above electronic device is: A third electronic component disposed on the opposite side of the one side of the second printed circuit board; and A third shield can disposed to at least partially surround the third electronic component; further comprising The thermal conductivity of the third shield can is different from at least one of the thermal conductivity of the first shield can or the thermal conductivity of the second shield can. Electronic device.

7. In Claim 6, A fourth electronic component disposed on the opposite side of the one side of the first printed circuit board; and Further comprising a fourth shield can arranged to at least partially surround the fourth electronic component, The thermal conductivity of the fourth shield can is different from at least one of the thermal conductivity of the first shield can or the thermal conductivity of the second shield can. Electronic device.

8. In Claim 7, The thermal conductivity of at least one of the first shield can or the fourth shield can is higher than the thermal conductivity of the second shield can and the thermal conductivity of the third shield can, and The thermal conductivity of the third shield can is higher than or equal to the thermal conductivity of the second shield can. Electronic device.

9. In Claim 5, The second printed circuit board is connected to the first printed circuit board through an interposer, and The above interposer comprises at least one of a circuit that electrically connects the first printed circuit board and the second printed circuit board, or a fifth shield can that surrounds at least a portion of the space formed between the first printed circuit board and the second printed circuit board. Electronic device.

10. In claim 7 or claim 9, At least one of the first shield can, the second shield can, the third shield can, the fourth shield can, or the fifth shield can comprises at least one of a metal or a conductive polymer. Electronic device.

11. In Claim 5, The first shield can includes an opening formed at a position overlapping with the first electronic component, and The above electronic device is: A shielding member covering the above opening; A first thermal interface material comprising a first electronic component and a shielding member in contact with the first electronic component and the shielding member, and disposed within a space formed by the shielding member and the first shield can. Electronic device.

12. In Claim 11, A second heat transfer material in contact with the first printed circuit board and the second printed circuit board, and disposed in the space formed between the first printed circuit board and the second printed circuit board; further comprising The thermal conductivity of the first heat transfer material is different from the thermal conductivity of the second heat transfer material. Electronic device.

13. In Claim 1, The above electronic device is: A first housing on which the above-mentioned first printed circuit board is placed; Second housing; A hinge structure rotatably connecting the first housing and the second housing; and A third heat dissipation member arranged to transfer heat generated from at least one of the first printed circuit board or the first electronic component from the first housing in which the first printed circuit board is placed to the second housing; further comprising Electronic device.

14. In Claim 13, The electronic device further includes a flexible display supported by the first housing and the second housing, and The flexible display is positioned to face in a direction from the second shield can toward the first shield can, and One end of the third heat dissipation member is positioned closer to the first shield can than to the second shield can, and The thermal conductivity of the first shield can is higher than the thermal conductivity of the second shield can. Electronic device.

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