Electronic device including waterproof and dustproof structure for speaker

Abstract

This electronic device may comprise: a housing including a sidewall defining a speaker hole; a speaker module disposed in the housing and including a sound port acoustically coupled to the speaker hole of the sidewall; and a sealing assembly disposed between the sound port of the speaker module and the speaker hole of the sidewall. The sealing assembly may comprise: a bracket defining an opening aligned with the speaker hole of the sidewall and including a side facing the inner side of the sidewall; a mesh plate attached to a first portion of the side of the bracket surrounding the opening; and a waterproof member interposed between a second portion of the side of the bracket surrounding the first portion of the side of the bracket and a portion of the inner side of the sidewall surrounding the speaker hole, thereby providing sealing between the bracket and the sidewall. The mesh plate may be attached only to the bracket and may not be attached to the inner side of the sidewall.

Description

Electronic device including a waterproof and dustproof structure for a speaker

[0001] The present disclosure relates to an electronic device including a waterproof and dustproof structure for a speaker.

[0002] An electronic device, such as a smartphone, may include a speaker for outputting sound. The sound output from the speaker may be transmitted to the outside through a speaker hole of the electronic device.

[0003] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art in relation to the present disclosure.

[0004] According to one embodiment, an electronic device may include: a housing comprising a side wall defining a speaker hole; a speaker module disposed within the housing and comprising an acoustic port acoustically coupled to the speaker hole of the side wall; and a sealing assembly disposed between the acoustic port of the speaker module and the speaker hole of the side wall. The sealing assembly may include: a bracket defining an opening aligned with the speaker hole of the side wall and comprising a side facing the inner side of the side wall; a mesh plate attached to a first portion of the side of the bracket surrounding the opening; and a waterproof member interposed between a second portion of the side of the bracket surrounding the first portion of the side of the bracket and a portion of the inner side of the side wall surrounding the speaker hole, thereby providing a seal between the bracket and the side wall. The mesh plate may be attached only to the bracket and not to the inner side of the side wall.

[0005] According to one embodiment, an electronic device may include: a housing comprising a side wall defining a speaker hole; a speaker module disposed within the housing and comprising an acoustic port acoustically coupled to the speaker hole of the side wall; and a sealing assembly disposed between the acoustic port of the speaker module and the speaker hole of the side wall. The sealing assembly may include a bracket, a mesh plate, and a waterproof member. The bracket may define an opening aligned with the speaker hole of the side wall. The bracket may include a first side facing the inner side of the side wall and a second side opposite to the first side and facing the speaker module. The mesh plate may be attached to the second side of the bracket to cover the opening of the bracket. The waterproof member may provide sealing between the bracket and the side wall by being interposed between the portion of the first side of the bracket surrounding the opening of the bracket and the portion of the inner side of the side wall surrounding the speaker hole. The above mesh plate may be attached only to the bracket and not to the speaker module.

[0006] According to one embodiment, an electronic device may include: a housing comprising a wall having a speaker hole; a speaker module disposed within the housing and comprising an acoustic port; and a sealing assembly configured to seal a gap between the speaker module and the wall so that the acoustic port of the speaker module is connected to the speaker hole of the wall. The sealing assembly may include: a bracket disposed between the speaker module and the wall and having an opening aligned with the speaker hole of the wall; a waterproof member attached to the bracket and pressed by the speaker module or the wall to seal at least a portion of the gap; and a mesh attached to the bracket to cover the opening of the bracket. The mesh may be spaced apart and separated from the waterproof member.

[0007] According to one embodiment, an electronic device may include: a housing comprising a wall having a speaker hole visible from the outside of the electronic device; a speaker module disposed within the housing and comprising an acoustic port; and a sealing assembly configured to seal a gap between the speaker module and the wall so that the acoustic port is connected to the speaker hole. The sealing assembly may include: a bracket disposed between the speaker module and the wall and having an opening aligned with the speaker hole; a waterproof member disposed between the bracket and the wall and pressed by the wall to seal at least a portion of the gap; and a mesh attached to the bracket to cover the opening of the bracket. The mesh may be spaced apart from and separated from the waterproof member.

[0008] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0009] FIG. 2a is a drawing showing an exemplary electronic device according to one embodiment.

[0010] FIG. 2b is an exploded perspective view of an exemplary electronic device according to one embodiment.

[0011] FIGS. 3a, FIGS. 3b, and FIGS. 3c are drawings showing an electronic device according to a comparative example.

[0012] FIGS. 4a and FIGS. 4b are exploded perspective views of an exemplary electronic device.

[0013] Figure 5 is a cross-sectional view of an exemplary electronic device showing the waterproof and dustproof structure of a speaker module.

[0014] FIG. 6a is a cross-sectional view of a sealing assembly.

[0015] FIG. 6b is an exploded perspective view of the sealing assembly.

[0016] Fig. 6c is a plan view of a sealing assembly.

[0017] Figures 7a and 7b show examples of speaker holes in the sidewalls.

[0018] Figure 8 is an exploded view of the sealing assembly.

[0019] FIG. 9 is a cross-sectional view of an electronic device showing a sealing assembly.

[0020] FIG. 10 is a cross-sectional view of an exemplary electronic device showing a waterproof and dustproof structure of a speaker module.

[0021] Identical or similar components in the drawings may be assigned the same reference numerals. Descriptions of components having the same reference numeral may be applied identically or in a corresponding manner when referring to different drawings, unless otherwise noted. Duplicate descriptions of components having the same reference numeral may not be repeated. In the following descriptions referring to specific drawings, reference numerals from other drawings may be referenced.

[0022] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to various embodiments.

[0023] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0024] The processor (120) can control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., a program (140)), and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0025] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0026] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0027] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0028] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0029] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0030] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0031] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0032] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0033] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0034] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0035] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0036] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0037] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0038] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0039] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, Wi-Fi (wireless fidelity) direct or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0040] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0041] The antenna module (197) can transmit a signal or power to an external source (e.g., an external electronic device) or receive it from an external source. According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). The signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0042] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0043] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0044] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0045] FIG. 2a is a drawing illustrating an exemplary electronic device according to one embodiment. Referring to FIG. 2a, the electronic device (200) according to one embodiment may include a housing (210) that forms at least partially the exterior of the electronic device (200). For example, the housing (210) may include a first surface (or front) (200A), a second surface (or rear) (200B), and a third surface (or side) (200C) that surrounds the space between the first surface (200A) and the second surface (200B). In one embodiment, the housing (210) may refer to a structure that forms at least some of the first surface (200A), the second surface (200B), and / or the third surface (200C).

[0046] An electronic device (200) according to one embodiment may include a substantially transparent front plate (202). In one embodiment, the front plate (202) may form at least a portion of the first surface (200A). In one embodiment, the front plate (202) may include, for example, a glass plate or a polymer plate including various coating layers, but is not limited thereto.

[0047] An electronic device (200) according to one embodiment may include a substantially opaque back plate (211). In one embodiment, the back plate (211) may form at least a portion of a second surface (200B). In one embodiment, the back plate (211) may be formed by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel, or magnesium), or a combination of at least two of the materials.

[0048] An electronic device (200) according to one embodiment may include a side bezel structure (e.g., a side member) (218). In one embodiment, the side bezel structure (218) may be combined with a front plate (202) and / or a rear plate (211) to form at least a portion of a third surface (200C) of the electronic device (200). For example, the side bezel structure (218) may form the entire third surface (200C) of the electronic device (200). According to one embodiment, the side bezel structure (218) may form the third surface (200C) of the electronic device (200) together with the front plate (202) and / or the rear plate (211).

[0049] In one embodiment, the side bezel structure (218) may comprise a metal and / or a polymer. In one embodiment, the rear plate (211) and the side bezel structure (218) may be formed integrally and may comprise the same material (e.g., a metallic material such as aluminum), but are not limited thereto. For example, the rear plate (211) and the side bezel structure (218) may be formed as separate components and / or may comprise different materials.

[0050] In one embodiment, the electronic device (200) may include a display (201) (e.g., display module (160) of FIG. 1), an audio module (203, 204, 207) (e.g., audio module (170) of FIG. 1), a sensor module (e.g., sensor module (176) of FIG. 1), a camera module (205, 212, 213) (e.g., camera module (180) of FIG. 1), a key input device (217) (e.g., input module (150) of FIG. 1), a light-emitting element (not shown), and a connector hole (208). In one embodiment, the electronic device (200) may omit at least one of the components (e.g., key input device (217) or light-emitting element (not shown)) or additionally include other components.

[0051] In one embodiment, the display (201) may be visually exposed through a significant portion of the front plate (202). For example, at least a portion of the display (201) may be visible through the front plate (202) forming the first surface (200A). The display (201) may be positioned on the back surface of the front plate (202).

[0052] In one embodiment, the display (201) (or the first surface (200A) of the electronic device (200)) may include a screen display area (201A). In one embodiment, the display (201) may provide visual information to the user through the screen display area (201A). In the illustrated embodiment, when the first surface (200A) is viewed from the front, the screen display area (201A) is shown to be located on the inner side of the first surface (200A) and spaced apart from the outer edge of the first surface (200A), but is not limited thereto. For example, when the first surface (200A) is viewed from the front, at least a portion of the edge of the screen display area (201A) may substantially coincide with the edge of the first surface (200A) (or the front plate (202)).

[0053] In one embodiment, the screen display area (201A) may include a sensing area (201B) configured to acquire the user's biometric information. Here, the meaning of "the screen display area (201A) includes the sensing area (201B)" can be understood as at least a portion of the sensing area (201B) being overlapped with the screen display area (201A). For example, the sensing area (201B) may refer to an area that can display visual information by the display (201) just like other areas of the screen display area (201A), and additionally acquire the user's biometric information (e.g., fingerprint). Although the sensing area (201B) is depicted as being formed within the screen display area (201A), it is not limited thereto. For example, the sensing area (201B) may be formed in the key input device (217).

[0054] In one embodiment, the display (201) may include an area where a first camera module (205) is located. For example, an opening may be formed in the area of ​​the display (201), and the first camera module (205) (e.g., a punch-hole camera) may be placed at least partially within the opening so as to face the first surface (200A). In this case, the screen display area (201A) may surround at least a portion of the edge of the opening. In one embodiment, the first camera module (205) (e.g., an under-display camera (UDC)) may be placed below the display (201) so as to overlap with the area of ​​the display (201). In this case, the display (201) may provide visual information to the user through the area, and additionally, the first camera module (205) may acquire an image corresponding to the direction toward the first surface (200A) through the area of ​​the display (201).

[0055] In one embodiment, the display (201) may be combined with or placed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer that detects a magnetic field type stylus pen.

[0056] In one embodiment, the audio module (203, 204, 207) may include a microphone hole (203, 204) and a speaker hole (207).

[0057] In one embodiment, the microphone holes (203, 204) may include a first microphone hole (203) formed in a part of the third surface (200C) and a second microphone hole (204) formed in a part of the second surface (200B). A microphone for acquiring external sound may be placed inside the microphone holes (203, 204). The microphone may include a plurality of microphones to detect the direction of the sound, but is not limited thereto.

[0058] In one embodiment, a second microphone hole (204) formed in a portion of the second surface (200B) may be positioned adjacent to the camera module (205, 212, 213). For example, the second microphone hole (204) may acquire sound according to the operation of the camera module (205, 212, 213). However, it is not limited thereto.

[0059] In one embodiment, the speaker hole (207) may include an external speaker hole (207) and a call receiver hole (not shown). The external speaker hole (207) may be formed in a part of the third surface (200C) of the electronic device (200). In one embodiment, the external speaker hole (207) is integrated into the microphone hole (203), and the speaker hole (207) and the microphone hole (203) may be implemented as a single hole. Although not shown, the call receiver hole (not shown) may be formed in another part of the third surface (200C). For example, the call receiver hole may be formed on the opposite side of the external speaker hole (207) on the third surface (200C). For example, based on the illustration in FIG. 2a, the external speaker hole (207) may be formed on the third surface (200C) corresponding to the lower part of the electronic device (200), and the call receiver hole may be formed on the third surface (200C) corresponding to the upper part of the electronic device (200). However, this is not limited thereto, and in one embodiment, the call receiver hole may be formed at a location other than the third surface (200C). For example, the call receiver hole may be formed by the spaced-apart space between the front plate (202) (or display (201)) and the side bezel structure (218).

[0060] In one embodiment, the electronic device (200) may include at least one speaker (not shown) (e.g., the acoustic output module (155) of FIG. 1) configured to output sound to the outside of the housing (210) through an external speaker hole (207) and / or a receiver hole for calls (not shown).

[0061] In one embodiment, a sensor module (not shown) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0062] In one embodiment, the camera module (205, 212, 213) may include a first camera module (205) positioned to face a first surface (200A) of the electronic device (200), a second camera module (212) positioned to face a second surface (200B), and a flash (213).

[0063] In one embodiment, the second camera module (212) may include a plurality of cameras (e.g., a dual camera, a triple camera, or a quad camera). However, the second camera module (212) is not necessarily limited to including a plurality of cameras and may include a single camera.

[0064] In one embodiment, the first camera module (205) and the second camera module (212) may include one or more lenses, an image sensor, and / or an image signal processor.

[0065] In one embodiment, the flash (213) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and an image sensor may be disposed on one side of the electronic device (200).

[0066] In one embodiment, the key input device (217) may be placed on a third side (200C) of the electronic device (200). In one embodiment, the electronic device (200) may not include some or all of the key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (201).

[0067] In one embodiment, a connector hole (208) may be formed on a third surface (200C) of the electronic device (200) so as to accommodate a connector of an external device. A connection terminal (e.g., connection terminal (178) of FIG. 1) that is electrically connected to the connector of the external device may be disposed within the connector hole (208). The electronic device (200) according to one embodiment may include an interface module (e.g., interface (177) of FIG. 1) for processing electrical signals transmitted and received through the connection terminal.

[0068] In one embodiment, the electronic device (200) may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be placed on a first surface (200A) of the housing (210). The light-emitting element (not shown) may provide state information of the electronic device (200) in the form of light. In one embodiment, the light-emitting element (not shown) may provide a light source that is linked to the operation of the first camera module (205). For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0069] FIG. 2b is an exploded perspective view of an exemplary electronic device.

[0070] Referring to FIG. 2b, an electronic device (200) according to one embodiment may include a frame structure (240) (e.g., a side bezel structure (218) of FIG. 2a), a first printed circuit board (250), a second printed circuit board (252), a battery (270) (e.g., a battery (189) of FIG. 1), and an antenna module (280).

[0071] In one embodiment, the frame structure (or frame) (240) may be positioned between the display (201) and the rear plate (211). In one embodiment, the frame structure (240) may support or accommodate components included in the electronic device (200). For example, the display (201) may be placed on one side of the frame structure (240) facing in one direction (e.g., +Z direction). For example, the frame structure (240) may support the front plate (202) to which the display (201) is attached. On the other side of the frame structure (240) facing in the opposite direction (e.g., -Z direction) to the one direction, the first printed circuit board (250), the second printed circuit board (252), the battery (270), and the second camera module (212) may be placed. The first printed circuit board (250), the second printed circuit board (252), the battery (270), and the second camera module (212) can be placed within a recess formed in the frame structure (240).

[0072] In one embodiment, the frame structure (240) may include a first part (241) and a second part (243). The periphery of the second part (243) may be surrounded by the first part (241). The first part (241) may surround the space between the rear plate (211) and the front plate (202) (and / or the display (201)). The first part (241) surrounding the space may at least partially form a side of the electronic device (200) (e.g., the third side (200C) in FIG. 2a), and the second part (243) located within the space may extend inward from the first part (241). The second part (243) may be located below the display (201) (e.g., in the -Z direction). In one embodiment, the first part (241) and / or the second part (243) may be formed of a metal and / or a polymer.

[0073] The frame structure (240) (or the first part (241) of the frame structure (240)) may be referred to as a lateral member or lateral structure in that it forms the side of the electronic device (200). The frame structure (240) (or the second part (243) of the frame structure (240)) may be referred to as a support member, support structure, or bracket in that it supports various parts of the electronic device (200).

[0074] In one embodiment, the first printed circuit board (250), the second printed circuit board (252), and the battery (270) may be respectively coupled to the frame structure (240). For example, the first printed circuit board (250) and the second printed circuit board (252) may be fixedly positioned on the frame structure (240) through a coupling member such as a screw. For example, the battery (270) may be fixedly positioned on the frame structure (240) through an adhesive member (e.g., double-sided tape). However, it is not limited to the examples described above.

[0075] In one embodiment, the display (201) may be positioned between the frame structure (240) and the front plate (202). For example, the front plate (202) may be positioned on one side (e.g., +Z direction) of the display (201), and the frame structure (240) may be positioned on the other side (e.g., -Z direction).

[0076] In one embodiment, the front plate (202) may be combined with the display (201). For example, the display (201) may be attached to the back surface of the front plate (202) via an optical adhesive member (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)).

[0077] In one embodiment, the front plate (202) may be combined with a frame structure (240). For example, the front plate (202) may include an outer portion extending outward from the display (201) when viewed in the z-axis direction. The outer portion of the front plate (202) may be attached to the frame structure (240) (e.g., the first part (241)).

[0078] In one embodiment, a processor (e.g., processor (120) of FIG. 1), memory (e.g., memory (130) of FIG. 1), and / or an interface (e.g., interface (177) of FIG. 1) may be disposed on the first printed circuit board (250) and / or the second printed circuit board (252). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (200) to an external electronic device and may include a USB connector, an SD card / MMC connector, or an audio connector. In one embodiment, the first printed circuit board (250) and the second printed circuit board (252) may be operatively or electrically connected to each other through a connecting member (e.g., a flexible printed circuit board).

[0079] In one embodiment, the battery (270) can supply power to at least one component of the electronic device (200). For example, the battery (270) may include a rechargeable secondary battery or a fuel cell.

[0080] In one embodiment, the first camera module (205) (e.g., front camera) may be placed in at least a part (e.g., second part (243)) of the frame structure (240) so that the lens can receive external light through a part area (e.g., camera area (237)) of the front plate (202) (e.g., front (200A) of FIG. 2a).

[0081] In one embodiment, a second camera module (212) (e.g., rear camera) may be positioned between the frame structure (240) and the rear plate (211). In one embodiment, the second camera module (212) may be electrically connected to the first printed circuit board (250) through a connecting member (e.g., connector). In one embodiment, the second camera module (212) may be positioned so that the lens can receive external light through the camera area (284) of the rear plate (211) of the electronic device (200).

[0082] In one embodiment, the camera area (284) may be formed on the surface of the rear plate (211) (e.g., the rear (200B) of FIG. 2A). In one embodiment, the camera area (284) may be formed at least partially transparent so that external light can be incident on the lens of the second camera module (212). In one embodiment, at least a portion of the camera area (284) may protrude a certain height from the surface of the rear plate (211). However, it is not limited thereto, and in one example, the camera area (284) may form a plane substantially identical to the surface of the rear plate (211).

[0083] In one embodiment, the housing (210) of the electronic device (200) may mean a configuration or structure that forms at least a part of the exterior of the electronic device (200). For example, the housing (210) may include at least a part of a front plate (202), a frame structure (240), and / or a rear plate (211) that form the exterior of the electronic device (200).

[0084] In one embodiment, the antenna module (280) may be placed under the rear plate (211) (e.g., in the +Z direction). For example, part of the antenna module (280) may be placed between the rear plate (211) and the first printed circuit board (250), and another part of the antenna module (280) may be placed between the rear plate (211) and the battery (270).

[0085] In one embodiment, the antenna module (280) may include one or more antennas. For example, the antenna module (280) may include one or more coils forming the one or more antennas. For example, the antenna module (280) may include a coil for NFC and / or a coil for wireless charging. For example, the antenna module (280) may be a flexible printed circuit board, and the one or more coils may be formed by conductive patterns of the flexible printed circuit board.

[0086] In FIG. 2a and FIG. 2b, a bar-type electronic device (200) is illustrated, but the shape or form factor of the electronic device (200) is not limited by the illustrated example.

[0087] For example, the housing of the electronic device (200) may be configured to be deformable. For example, the electronic device (200) may further include a second housing that is movably coupled to the housing (210) (e.g., the first housing (210)). For example, the second housing may be configured to be rotatable relative to the first housing (210) via a hinge mechanism (or hinge structure). By the rotational movement of the second housing relative to the first housing (210), the first housing (210) and the second housing may be folded or unfolded. In this case, the display (201) of the electronic device (200) may be positioned across the housing (210) and the other housing. Additionally, the display (201) of the electronic device (200) may include a flexible display configured to be deformable according to the folding movement of the housing (210) and the other housing.

[0088] Additionally, the electronic device (200) may further include a third housing movably coupled to the first housing (210) or the second housing. For example, the third housing may be rotatably coupled to the first housing (210) (e.g., on the opposite side of the second housing) via a hinge mechanism (or hinge structure). According to one embodiment, the third housing may be rotatably coupled to the second housing via a hinge mechanism (or hinge structure). As described above, the electronic device (200) comprising a plurality of mutually movably coupled housings may be referred to as a foldable electronic device or a multi-foldable electronic device.

[0089] FIGS. 3a, FIGS. 3b, and FIGS. 3c are drawings showing an electronic device according to a comparative example.

[0090] Referring to FIG. 3a, an electronic device (301) according to a comparative example may include a housing (310), a speaker module (320) disposed within the housing (310), and a sealing assembly (302) disposed between the speaker module (320) and the side wall (311) of the housing (310). The speaker module (320) and the housing (310) may output sound through a hole (315) formed in the side wall (311) of the housing (310).

[0091] Referring to FIG. 3b, a sealing assembly (302) may be interposed between a speaker module (320) and a side wall (311) of a housing (310). The sealing assembly (302) may include a rubber (380) in contact with the speaker module (320), a first waterproof tape (340) placed on the rubber (380), a mesh plate (350) placed on the first waterproof tape (340), and a second waterproof tape (360) interposed between the mesh plate (350) and the side wall (311) of the housing (310). The rubber (380), the first waterproof tape (340), and the second waterproof tape (360) may fill the gap between the speaker module (320) and the side wall (311) of the housing (310). Accordingly, moisture introduced through the hole (315) of the housing (310) can be reduced and / or blocked from entering the electronic device (301) through the gap between the speaker module (320) and the side wall (311) of the housing (310). A mesh plate (350) placed between the first waterproof tape (340) and the second waterproof tape (360) can reduce and / or block the inflow of dust (e.g., foreign substances such as iron powder, sand) through the hole (315) of the housing (310).

[0092] Waterproof tapes (340 and 360) and rubber (380) can be compressed between the side wall (311) of the speaker module (320) and the housing (310) for waterproofing. However, since a mesh plate (350) for dustproofing is placed between the waterproof tapes (340 and 360), the mesh plate (350) may be damaged by the force transmitted through the waterproof tapes (340 and 360). For example, referring to FIG. 3c, the speaker module (320) may be fastened to the housing (310) through a first screw (381) and a second screw (382). When the screws (381 and 382) are fastened, force may be applied to the sealing assembly (302), and the mesh plate (350) may be damaged accordingly. Additionally, because the distance between the sealing assembly (302) and the first screw (381) and the distance between the sealing assembly (302) and the second screw (382) are different, an uneven force may be applied to the sealing assembly (302). For example, since the sealing assembly (302) is farther from the second screw (382) than from the first screw (381), a smaller force may be applied to the sealing assembly (302) as it moves from the first screw (381) to the second screw (382) (e.g., as it moves in the direction (D1). Accordingly, damage may occur in which the shape of the mesh plate (350) is twisted. Also, the force applied to the sealing assembly (302) may vary depending on the fastening tolerance of the screws (381 and 382). Accordingly, the degree of damage or the twisted shape of the mesh plate (350) may vary from product to product.

[0093] Referring again to FIG. 3b, since the mesh plate (350) can be seen from the outside of the electronic device (301) through the hole (315) of the housing (310), the appearance quality may be degraded due to distortion of the mesh plate (350). In addition, the dustproof performance of the sealing assembly (302) may be degraded due to damage to the mesh plate (350). Furthermore, since distortion of the mesh plate (350) may also affect the waterproof tape (340 and 360) in contact with the mesh plate (350), the waterproof performance of the sealing assembly (302) may also be degraded due to damage to the mesh plate (350).

[0094] FIGS. 4a and FIGS. 4b are exploded perspective views of an exemplary electronic device.

[0095] Referring to FIGS. 4a and 4b, an electronic device (401) (e.g., electronic device (200) of FIG. 2b) may include a housing (410) (e.g., frame structure (240) of FIG. 2b), a front plate (406) (e.g., front plate (202) of FIG. 2b), a rear plate (408) (e.g., rear plate (211) of FIG. 2b), and a sealing assembly (402). The housing (410) may include a side wall (411) (e.g., first part (241) of FIG. 2b). The front plate (406) may define at least a portion of the front of the electronic device (401), and the rear plate (408) may define at least a portion of the rear of the electronic device (401). The side wall (411) of the housing (410) may define at least a portion of the side of the electronic device (401) extending from the front edge of the electronic device (401) to the rear edge of the electronic device (401). The front plate (406) and / or rear plate (408) may be described as being included in the housing (410) of the electronic device (401) (e.g., the housing (210) of FIG. 2a).

[0096] The sealing assembly (402) may include a bracket (430), a first adhesive member (440), a first mesh plate (450), a second adhesive member (460), a second mesh plate (470), and a waterproof member (480) (e.g., a first waterproof member).

[0097] Referring to FIG. 4b, the speaker module (420) can output sound through an acoustic port (425) (or acoustic outlet (425)). The sound output from the speaker module (420) can be transmitted to the outside of the electronic device (401) through a speaker hole (415) (e.g., speaker hole (207) in FIG. 2a) formed in the side wall (411) of the housing (410).

[0098] FIG. 5 is a cross-sectional view of an exemplary electronic device showing a waterproof and dustproof structure of a speaker module. FIG. 5 may be a cross-section taken along line A-A' of FIG. 2a.

[0099] Referring to FIG. 5, the side wall (411) of the housing (410) may include an outer surface (411B) (or outer side (411B)) defining at least a portion of the side of the electronic device (401) (e.g., side (200C) in FIG. 2a) and an inner surface (411A) (or inner side (411A)) opposite to the outer surface (411B). A speaker hole (415) may extend through the side wall (411) from the outer surface (411B) of the side wall (411) to the inner surface (411A). The housing (410) may include a support portion (413) (e.g., second part (243) in FIG. 2b) extending inward from the side wall (411). A speaker module (420) may be seated on the support portion (413) of the housing (410).

[0100] The speaker module (420) may include a speaker (422) and an enclosure (424) that accommodates at least a portion of the speaker (422). The enclosure (424) may define an acoustic port (425). The acoustic port (425) may be connected to a speaker hole (415) in the side wall (411). Sound generated by the speaker (422) may be transmitted to the outside of the electronic device (401) through the acoustic port (425) and the speaker hole (415).

[0101] The sealing assembly (402) may be placed between the speaker module (420) and the side wall (411) of the housing (410). For example, the sealing assembly (402) may be placed between the enclosure (424) of the speaker module (420) and the inner surface (411A) of the side wall (411). For example, the sealing assembly (402) may seal the gap between the speaker module (420) and the side wall (411) so that the acoustic port (425) of the speaker module (420) is connected to the speaker hole (415) of the side wall (411).

[0102] A bracket (430) may be placed on a speaker module (420) to surround an acoustic port (425) of a speaker module (420). For example, the bracket (430) may include an opening (435) aligned with the acoustic port (425) of the speaker module (420). For example, the opening (435) of the bracket (430) may be connected to the acoustic port (425) of the speaker module (420).

[0103] The bracket (430) can be attached to the speaker module (420). For example, the bracket (430) may include a first surface facing the side wall (411) of the housing (410) (e.g., the first surface (430A) in FIG. 6a)) and a second surface opposite to the first surface and facing the speaker module (420) (e.g., the second surface (430B) in FIG. 6a). A portion of the second surface of the bracket (430) may be attached to the enclosure (424) of the speaker module (420). For example, the bracket (430) may be attached to the speaker module (420) via an adhesive material (490). The adhesive material (490) may include, for example, adhesive tape, waterproof tape, and / or bonding material, but is not limited to. Alternatively, the bracket (430) may be formed integrally with the enclosure (424) of the speaker module (420). In this case, the electronic device (401) It may not include an adhesive material (490) that seals between the bracket (430) and the speaker module (420). The adhesive material (490) may be referred to as a waterproof member (e.g., a second waterproof member) in that it provides sealing between the speaker module (420) and the bracket (430).

[0104] For example, the waterproof member (480) may be positioned between the bracket (430) and the side wall (411) of the housing (410). For example, the waterproof member (480) may be compressed by being interposed between the bracket (430) and the side wall (411) of the housing (410). Accordingly, the gap between the bracket (430) and the side wall (411) may be sealed. The waterproof member (480) may include an opening (e.g., the opening (485) of FIG. 6c) aligned with the speaker hole (415) of the side wall (411). The opening of the waterproof member (480) may be connected to, for example, the speaker hole (415) of the side wall (411). The waterproof member (480) may be attached to the bracket (430) among the bracket (430) and the side wall (411), but is not limited thereto (e.g., may be attached only to the side wall (411)).

[0105] The adhesive material (490), bracket (430), and waterproof member (480) can fill the gap between a part of the speaker module (420) (e.g., the area surrounding the acoustic port (425)) and a part of the inner surface (411A) of the side wall (411) (e.g., the area surrounding the speaker hole (415). Accordingly, moisture entering the speaker hole (415) can be reduced and / or prevented from entering the interior of the electronic device (401) through the gap between the speaker module (420) and the side wall (411). The bracket (430) and waterproof member (480) can reduce and / or prevent sound leakage through the gap between the speaker module (420) and the side wall (411) while allowing sound transmission from the acoustic port (425) of the speaker module (420) to the speaker hole (415).

[0106] The first mesh plate (450) may be positioned between the bracket (430) and the side wall (411). For example, the first mesh plate (450) may be placed on the bracket (430). For example, the first mesh plate (450) may be placed on the first surface of the bracket (430) to cover the opening (435) of the bracket (430). For example, the first mesh plate (450) may be attached to the first surface of the bracket (430). The first mesh plate (450) may be configured to allow sound to pass through while blocking foreign substances such as dust. For example, the first mesh plate (450) may include a mesh. For example, the mesh of the first mesh plate (450) may be formed of metal, plastic, or fabric, but is not limited thereto. The first mesh plate (450) can reduce and / or block dust entering the speaker hole (415) of the side wall (411) from entering the opening (435) of the bracket (430) and the acoustic port (425) of the speaker module (420). The mesh plate of the present disclosure may be referred to as a screen, a screen plate, or a screen member.

[0107] A first adhesive member (440) disposed between a bracket (430) and a first mesh plate (450) can attach the first mesh plate (450) to the bracket (430). The first adhesive member (440) may include an opening aligned with an opening (435) of the bracket (430). The opening of the first adhesive member (440) may be connected to the opening (435) of the bracket (430). The first mesh plate (450) attached to the first adhesive member (440) may cover the opening of the first adhesive member (440).

[0108] The second mesh plate (470) may be positioned between the first mesh plate (450) and the side wall (411). For example, the second mesh plate (470) may be placed on the first mesh plate (450). For example, the second mesh plate (470) may be placed on the first mesh plate (450) so as to overlap the opening (435) of the bracket (430) (e.g., placed on the face of the first mesh plate (450) facing the side wall (411). For example, the second mesh plate (470) may be attached to the first mesh plate (450) (e.g., attached on the face of the first mesh plate (450) facing the side wall (411). The second mesh plate (470) may be configured to allow sound to pass through and block foreign substances such as dust. For example, the second mesh plate (470) may include a mesh. For example, the mesh of the second mesh plate (470) may be formed of metal, plastic, or fabric, without limitation. For example, the mesh of the second mesh plate (470) may be formed of stainless steel. The second mesh plate (470) can reduce and / or block dust entering the speaker hole (415) of the side wall (411) from entering the first mesh plate (450), the opening (435) of the bracket (430), and the acoustic port (425) of the speaker module (420).

[0109] When the first mesh plate (450) and the second mesh plate (470) include the mesh, the density of the mesh in the first mesh plate (450) may differ from the density of the mesh in the second mesh plate (470). For example, the density of the mesh in the first mesh plate (450) may be higher than the density of the mesh in the second mesh plate (470). When the first mesh plate (450) and the second mesh plate (470) include the mesh, the thickness of the strands of the mesh in the first mesh plate (450) may differ from the thickness of the strands of the mesh in the second mesh plate (470). For example, the thickness of the strands of the mesh in the first mesh plate (450) may be thinner than the thickness of the strands of the mesh in the second mesh plate (470). When the first mesh plate (450) and the second mesh plate (470) include the mesh, the opening ratio of the mesh of the first mesh plate (450) may be different from the opening ratio of the mesh of the second mesh plate (470). For example, the opening ratio of the mesh of the first mesh plate (450) may be lower than the opening ratio of the mesh of the second mesh plate (470).

[0110] A second adhesive member (460) disposed between the first mesh plate (450) and the second mesh plate (470) can mutually attach the first mesh plate (450) and the second mesh plate (470). The second adhesive member (460) may include an opening aligned with the opening (435) of the bracket (430). The opening of the second adhesive member (460) may be connected to the opening (435) of the bracket (430) (e.g., through the openings of the first mesh plate (450) and the first adhesive member (440). The second mesh plate (460) attached to the second adhesive member (460) may cover the opening of the second adhesive member (460). The opening of the second adhesive member (460) may be connected to the speaker hole (415) of the side wall (411) (e.g., through the opening of the second mesh plate (470) and the waterproof member (480). The second mesh plate (470) may be placed at least partially within the opening of the waterproof member (480), but is not limited thereto.

[0111] In one embodiment, the first mesh plate (450) may be attached only to the bracket (430). The first mesh plate (450) may not be attached to the inner surface (411A) of the side wall (411). The first mesh plate (450) may be attached to the bracket (430) and not attached to the inner surface (411A) of the side wall (411). Accordingly, when the sealing assembly (402) and the speaker module (420) are assembled to the housing (410), the waterproof member (480) is pressed between the speaker module (420) and the side wall (411) of the housing (410), but the first mesh plate (450) may not be pressed. Accordingly, damage to the first mesh plate (450) caused by the force applied to the sealing assembly (402) may be reduced and / or prevented.

[0112] In one embodiment, the second mesh plate (470) may be attached only to the bracket (430). The second mesh plate (470) may not be attached to the inner surface (411A) of the side wall (411). The second mesh plate (470) may be attached to the bracket (430) and not attached to the inner surface (411A) of the side wall (411). Accordingly, when the sealing assembly (402) and the speaker module (420) are assembled to the housing (410), the waterproof member (480) is pressed between the speaker module (420) and the side wall (411) of the housing (410), but the second mesh plate (470) may not be pressed. Accordingly, damage to the second mesh plate (470) caused by the force applied to the sealing assembly (402) may be reduced and / or prevented.

[0113] In one embodiment, the first mesh plate (450) may be attached only to the bracket (430). The first mesh plate (450) may not be attached to the waterproof member (480). The first mesh plate (450) may be attached to the bracket (430) and not attached to the waterproof member (480). When the sealing assembly (402) and the speaker module (420) are assembled to the housing (410), the waterproof member (480) may be pressed between the speaker module (420) and the side wall (411) of the housing (410), and the force applied to the waterproof member (480) may not be transmitted to the first mesh plate (450). Accordingly, damage to the first mesh plate (450) caused by the force applied to the sealing assembly (402) may be reduced and / or prevented.

[0114] In one embodiment, the second mesh plate (470) may be attached only to the bracket (430). The second mesh plate (470) may not be attached to the waterproof member (480). The second mesh plate (470) may be attached to the bracket (430) and not attached to the waterproof member (480). When the sealing assembly (402) and the speaker module (420) are assembled to the housing (410), the waterproof member (480) may be pressed between the speaker module (420) and the side wall (411) of the housing (410), and the force applied to the waterproof member (480) may not be transmitted to the second mesh plate (470). Accordingly, damage to the second mesh plate (470) caused by the force applied to the sealing assembly (402) may be reduced and / or prevented.

[0115] In one embodiment, the first mesh plate (450) may be detached from the housing (410). For example, the first mesh plate (450) may be detached from the side wall (411) of the housing (410). Additionally, the first mesh plate (450) may be detached from the speaker module (420). For example, the first mesh plate (450) may be detached from the enclosure (424) of the speaker module (420). When the sealing assembly (402) and the speaker module (420) are assembled to the housing (410), the waterproof member (480) is pressed between the speaker module (420) and the side wall (411) of the housing (410), but the first mesh plate (450) may not be pressed. Accordingly, damage to the first mesh plate (450) caused by the force applied to the sealing assembly (402) can be reduced and / or prevented.

[0116] In one embodiment, the first mesh plate (450) may be spaced apart and separated from the waterproof member (480). For example, the first mesh plate (450) may be physically separated from the waterproof structure of the sealing assembly (402) provided by the waterproof member (480). Accordingly, when the waterproof member (480) is compressed between the speaker module (420) and the side wall (411) of the housing (410) for assembling the sealing assembly (402) and the speaker module (420) to the housing (410), the force applied to the waterproof member (480) may not be transmitted to the first mesh plate (450). Accordingly, damage to the first mesh plate (450) caused by the force applied to the sealing assembly (402) may be reduced and / or prevented.

[0117] In one embodiment, the second mesh plate (470) may be spaced apart and separated from the housing (410). For example, the second mesh plate (470) may be spaced apart and separated from the side wall (411) of the housing (410). Additionally, the second mesh plate (470) may be spaced apart and separated from the speaker module (420). For example, the second mesh plate (470) may be spaced apart and separated from the enclosure (424) of the speaker module (420). When the sealing assembly (402) and the speaker module (420) are assembled to the housing (410), the waterproof member (480) is pressed between the speaker module (420) and the side wall (411) of the housing (410), but the second mesh plate (470) may not be pressed. Accordingly, damage to the second mesh plate (470) caused by the force applied to the sealing assembly (402) can be reduced and / or prevented.

[0118] In one embodiment, the second mesh plate (470) may be spaced apart and separated from the waterproof member (480). For example, the second mesh plate (470) may be physically separated from the waterproof structure of the sealing assembly (402) provided by the waterproof member (480). Accordingly, when the waterproof member (480) is compressed between the speaker module (420) and the side wall (411) of the housing (410) for assembling the sealing assembly (402) and the speaker module (420) to the housing (410), the force applied to the waterproof member (480) may not be transmitted to the second mesh plate (470). Accordingly, damage to the second mesh plate (470) caused by the force applied to the sealing assembly (402) may be reduced and / or prevented.

[0119] Alternatively, the sealing assembly (402) may not include a second mesh plate (470) and a second adhesive member (460) for attaching the second mesh plate (470) to the first mesh plate (450).

[0120] Alternatively, the first mesh plate (450) and / or the second mesh plate (470) may not be attached to the bracket (430). In this case, the first mesh plate (450) and / or the second mesh plate (470) may be attached to the inner surface (411A) of the side wall (411). The first mesh plate (450) and / or the second mesh plate (470), attached to the inner surface (411A) of the side wall (411), may be spaced apart and separated from the bracket (430) and the waterproof member (480), and may also cover the speaker hole (415) of the side wall (411). Accordingly, when the sealing assembly (402) and speaker module (420) are assembled to the housing (410), the force applied to the bracket (430) and the waterproof member (480) may not be transmitted to the first mesh plate (450) and the second mesh plate (470). Accordingly, damage to the first mesh plate (450) and the second mesh plate (470) caused by the force applied to the sealing assembly (402) may be reduced and / or prevented.

[0121] FIG. 6a is a cross-sectional view of a sealing assembly. FIG. 6b is an exploded perspective view of a sealing assembly. FIG. 6c is a plan view of a sealing assembly.

[0122] Referring to FIGS. 6A, 6B, and 6C, the bracket (430) may include a first surface (430A) and a second surface (430B) (or second side (430B)) opposite to the first surface (430A) (or first side (430A)). The first surface (430A) of the bracket (430) may be a surface of the bracket (430) facing the side wall (411) of FIG. 5, and the second surface (430B) of the bracket (430) may be a surface of the bracket (430) facing the speaker module (420) of FIG. 5. An opening (435) of the bracket (430) may extend from a portion of the first surface (430A) of the bracket (430) to a portion of the second surface (430B).

[0123] The first mesh plate (450) may be placed on the first surface (430A) of the bracket (430). For example, the first mesh plate (450) may be placed on the first part (431) of the bracket (430) to cover the opening (435) of the bracket (430). For example, the first mesh plate (450) may be placed on the first area (R1) of the first surface (430A) corresponding to the first part (431) of the bracket (430) to cover the opening (435) of the bracket (430).

[0124] The waterproof member (480) may be placed on the first surface (430A) of the bracket (430). For example, the waterproof member (480) may be placed on the second part (432) of the bracket (430). For example, the waterproof member (480) may be placed on the second area (R2) of the first surface (430A) corresponding to the second part (432) of the bracket (430).

[0125] The bracket (430) may include a first portion (431) defining an opening (435) and a second portion (432) covering the outer edge of the first portion (431). A first region (R1) of the first surface (430A) of the bracket (430) may be recessed from a second region (R2) of the first surface (430A) of the bracket (430), but is not limited thereto. For example, the first region (R1) of the first surface (430A) of the bracket (430) and the second region (R2) of the first surface (430A) of the bracket (430) may be connected without a substantial step.

[0126] The waterproof member (480) may include, for example, rubber. For example, the waterproof member (480) may include LSR (liquid silicon rubber). For example, the waterproof member (480) may be formed by injecting after inserting the bracket (430) into a mold, but is not limited thereto. For example, the waterproof member (480) may be attached to the bracket (430) through waterproof tape, waterproof adhesive, or waterproof bonding material.

[0127] Referring to FIGS. 6b and 6c, the waterproof member (480) may extend along the outer edge of the first part (431) of the bracket (430) so that the opening (485) of the waterproof member (480) is defined.

[0128] Referring to FIG. 6c, in the sealing assembly (402), a waterproof area outside the waterproof member (480) and a non-waterproof area inside the waterproof member (480) may be defined. The non-waterproof area of ​​the sealing assembly (402) may correspond to an opening (485) of the waterproof member (480). As illustrated in FIG. 6c, when viewed from above, the bracket (430) may be positioned within the opening (485) (or the non-waterproof area) of the waterproof member (480). When viewed from above, the bracket (430) may be positioned within the opening (485) (or the non-waterproof area) of the waterproof member (480). When viewed from above, the bracket (430) may be positioned within the opening (485) (or the non-waterproof area) of the waterproof member (480). When viewed from above, the bracket (430) may have substantially the same area as the first mesh plate (450). When viewed from above, the second mesh plate (470) can overlap the opening (435) of the bracket (430).

[0129] Figures 7a and 7b show examples of speaker holes in the sidewalls.

[0130] Referring to FIG. 7a and FIG. 7b, the speaker hole (415) of the side wall (411) may include one or more holes penetrating the side wall (411). For example, referring to FIG. 7a, the speaker hole (415) may be one oblong hole or one slot. According to one embodiment, referring to FIG. 7b, the speaker hole (415) may be a plurality of holes arranged in one direction.

[0131] Referring to FIGS. 7a and 7b, the first mesh plate (450) and / or the second mesh plate (470) may be visible from outside the electronic device (401) through the speaker hole (415). As described above, since the first mesh plate (450) and the second mesh plate (470) are not pressed from the side wall (411) of the housing (410) during the assembly of the sealing assembly (402), damage to the screen members (450 and 470) visible from the outside can be reduced and / or prevented. Additionally, the deterioration of the appearance quality of the electronic device (401), the waterproof performance of the speaker hole (415), and the dustproof performance of the speaker hole (415) due to damage to the screen members (450 and 470) can be reduced and / or prevented.

[0132] Figure 8 is an exploded view of the sealing assembly.

[0133] The first mesh plate (450), the second mesh plate (470), and the waterproof member (480) of the sealing assembly (402) are positioned on one side of the bracket (430), but are not limited thereto. For example, referring to FIG. 8, the waterproof member (480) of the sealing assembly (402) may be positioned on one side of the bracket (430), and the first mesh plate (450) and the second mesh plate (470) may be positioned on the opposite side of the bracket (430). Such a structure is described in detail with reference to FIG. 9.

[0134] FIG. 9 is a cross-sectional view of an electronic device showing a sealing assembly.

[0135] Referring to FIG. 9, the electronic device (401) may include a sealing assembly (902) (e.g., sealing assembly (402)).

[0136] The sealing assembly (902) may include a bracket (930) (e.g., bracket (430)), a first adhesive member (940) (e.g., first adhesive member (440)), a first mesh plate (950) (e.g., first mesh plate (450)), and a waterproof member (980) (e.g., waterproof member (480)). The sealing assembly (902) may further include a second adhesive member (960) (e.g., second adhesive member (460)) and a second mesh plate (970) (e.g., second mesh plate (470)).

[0137] The bracket (930) may be placed on the speaker module (420). For example, the bracket (930) may be attached to the speaker module (420). For example, a portion of the second surface (930B) of the bracket (930) (e.g., the outer edge area of ​​the second surface (930B)) may be attached to the enclosure (424) of the speaker module (420). For example, the bracket (930) may be attached to the speaker module (420) via an adhesive material (e.g., adhesive material (490)). The adhesive material may seal the gap between the bracket (930) and the speaker module (420). Alternatively, the bracket (930) may be formed integrally with the enclosure (424) of the speaker module (420).

[0138] For example, a waterproof member (980) may be placed on the first surface (930A) of the bracket (930). The waterproof member (980) may seal the gap between the bracket (930) and the side wall (e.g., side wall (411)) of the housing of the electronic device (401) by being interposed between the bracket (930) and the side wall.

[0139] The first mesh plate (950) may be positioned between the bracket (930) and the speaker module (420). For example, the first mesh plate (950) may be placed or attached on the second surface (930B) of the bracket (930) to cover the opening (935) (e.g., opening (435)) of the bracket (930). For example, the first mesh plate (950) may be attached to the bracket (930) through a first adhesive member (940) between the bracket (930) and the first mesh plate (950). The first mesh plate (950) may reduce and / or block dust entering from the outside through the opening (935) of the bracket (930) from entering the acoustic port (425) of the speaker module (420).

[0140] The second mesh plate (970) may be positioned between the first mesh plate (950) and the speaker module (420). For example, the second mesh plate (970) may be placed on the first mesh plate (950). For example, the second mesh plate (970) may be placed or attached on the first mesh plate (950) so as to overlap the opening (935) of the bracket (930) (e.g., placed or attached on the surface of the first mesh plate (950) facing the speaker module (420). For example, the second mesh plate (970) may be attached to the first mesh plate (950) through a second adhesive member (960) between the first mesh plate (950) and the second mesh plate (970).

[0141] The second mesh plate (970) can reduce and / or block dust entering from the outside through the opening (935) of the bracket (930) and the first mesh plate (950) from entering the acoustic port (425) of the speaker module (420).

[0142] In one embodiment, the first mesh plate (950) may be separated and spaced apart from the speaker module (420) and the housing of the electronic device (401) so that the speaker module (420) is not pressed when assembled to the housing of the electronic device (401). Additionally, the first mesh plate (950) may be separated and spaced apart from the waterproof member (980) so that the force applied to the waterproof member (980) is not transmitted when the speaker module (420) is assembled to the housing of the electronic device (401).

[0143] In one embodiment, the second mesh plate (970) may be separated and spaced apart from the speaker module (420) and the housing of the electronic device (401) so that the speaker module (420) is not pressed when assembled to the housing of the electronic device (401). Additionally, the second mesh plate (970) may be separated and spaced apart from the waterproof member (980) so that the force applied to the waterproof member (980) is not transmitted when the speaker module (420) is assembled to the housing of the electronic device (401).

[0144] In one embodiment, the first mesh plate (950) may be attached only to the bracket (930). The first mesh plate (950) may not be attached to the speaker module (420). The first mesh plate (950) may be attached to the bracket (930) and not attached to the speaker module (420) (e.g., enclosure (424)). Accordingly, when the sealing assembly (402) and the speaker module (420) are assembled to the housing (410), the waterproof member (480) is pressed between the speaker module (420) and the side wall (411) of the housing (410), but the first mesh plate (950) may not be pressed. Accordingly, damage to the first mesh plate (950) caused by the force applied to the sealing assembly (402) may be reduced and / or prevented.

[0145] In one embodiment, the second mesh plate (970) may be attached only to the bracket (930). The second mesh plate (970) may not be attached to the speaker module (420). The second mesh plate (970) may be attached to the bracket (930) and not attached to the speaker module (420) (e.g., enclosure (424)). Accordingly, when the sealing assembly (402) and the speaker module (420) are assembled to the housing (410), the waterproof member (480) is pressed between the speaker module (420) and the side wall (411) of the housing (410), but the second mesh plate (970) may not be pressed. Accordingly, damage to the second mesh plate (970) caused by the force applied to the sealing assembly (402) may be reduced and / or prevented.

[0146] With reference to the previous drawings, it was previously described that a bracket (430 or 930) of a sealing assembly (402 or 902) is attached to a speaker module (420) and a waterproof member (480 or 980) is interposed between the bracket (430 or 930) and the side wall (411), but is not limited thereto. A description of a sealing assembly having a structure different from the aforementioned sealing assemblies (402 and 902) is provided with reference to FIG. 10.

[0147] FIG. 10 is a cross-sectional view of an exemplary electronic device showing a waterproof and dustproof structure of a speaker module.

[0148] Referring to FIG. 10, the electronic device (401) may include a sealing assembly (1002) (e.g., a sealing assembly (402 or 902)).

[0149] The sealing assembly (1002) may include a bracket (1030) (e.g., a bracket (430 or 930)), a first adhesive member (1040) (e.g., a first adhesive member (440 or 940)), a first mesh plate (1050) (e.g., a first mesh plate (450 or 950)), and a waterproof member (1080) (e.g., a waterproof member (480 or 980)). The sealing assembly (1002) may further include a second adhesive member (1060) (e.g., a second adhesive member (460 or 960)) and a second mesh plate (1070) (e.g., a second mesh plate (470 or 970)).

[0150] A bracket (1030) may be placed or attached to a side wall (411) of a housing (410). For example, a bracket (1030) may be placed or attached to an inner surface (411A) of a side wall (411) of a housing (410). For example, a bracket (1030) may be attached to a side wall (411) of a housing (410) through an adhesive material (1090) (e.g., adhesive material (490)). The adhesive material (1090) may seal the gap between the bracket (1030) and the side wall (411) of the housing (410). Alternatively, the bracket (1030) may be formed integrally with the side wall (411) and / or support portion (413) of the housing (410). In this case, the electronic device (401) may not include an adhesive material (1090) that seals between the bracket (1030) and the side wall (411).

[0151] For example, the waterproof member (1080) may be placed between the bracket (1030) and the speaker module (420). For example, the waterproof member (1080) may seal the gap between the bracket (1030) and the speaker module (420) by being interposed between the bracket (1030) and the speaker module (420). The waterproof member (1080) may be attached to the bracket (1030) among the bracket (1030) and the speaker module (420), but is not limited thereto (e.g., may be attached to the speaker module (420)).

[0152] The first mesh plate (1050) may be positioned between the bracket (1030) and the speaker module (420). For example, the first mesh plate (1050) may be placed or attached on the bracket (1030) to cover the opening (1035) (e.g., opening (435 or 935)) of the bracket (1030). For example, the first mesh plate (1050) may be attached to the bracket (1030) through a first adhesive member (1040) between the bracket (1030) and the first mesh plate (1050). The first mesh plate (1050) may reduce and / or block dust entering from the outside through the opening (1035) of the bracket (1030) from entering the acoustic port (425) of the speaker module (420).

[0153] The second mesh plate (1070) may be positioned between the first mesh plate (1050) and the speaker module (420). For example, the second mesh plate (1070) may be placed on the first mesh plate (1050). For example, the second mesh plate (1070) may be placed or attached on the first mesh plate (1050) so as to overlap the opening (1035) of the bracket (1030) (e.g., placed or attached on the surface of the first mesh plate (1050) facing the speaker module (420). For example, the second mesh plate (1070) may be attached to the first mesh plate (1050) through a second adhesive member (1060) between the first mesh plate (1050) and the second mesh plate (1070).

[0154] The second mesh plate (1070) can reduce and / or block dust entering from the outside through the opening (1035) of the bracket (1030) and the first mesh plate (1050) from entering the acoustic port (425) of the speaker module (420).

[0155] In one embodiment, the first mesh plate (1050) may be separated and spaced apart from the side wall (411) of the speaker module (420) and the housing (410) so as not to be pressed when the speaker module (420) is assembled to the housing (410) of the electronic device (401). Additionally, the first mesh plate (1050) may be separated and spaced apart from the waterproof member (1080) so as not to transmit the force applied to the waterproof member (1080) when the speaker module (420) is assembled to the housing (410) of the electronic device (401).

[0156] In one embodiment, the second mesh plate (1070) may be separated and spaced apart from the side wall (411) of the speaker module (420) and the housing (410) so as not to be pressed when the speaker module (420) is assembled to the housing (410) of the electronic device (401). Additionally, the second mesh plate (1070) may be separated and spaced apart from the waterproof member (1080) so as not to transmit the force applied to the waterproof member (1080) when the speaker module (420) is assembled to the housing (410) of the electronic device (401).

[0157] In one embodiment, the first mesh plate (1050) may be attached only to the bracket (1030). The first mesh plate (1050) may not be attached to the speaker module (420). The first mesh plate (1050) may be attached to the bracket (1030) and not attached to the speaker module (420) (e.g., enclosure (424)). Accordingly, when the sealing assembly (402) and the speaker module (420) are assembled to the housing (410), the waterproof member (1080) is pressed between the speaker module (420) and the side wall (411) of the housing (410), but the first mesh plate (1050) may not be pressed. Accordingly, damage to the first mesh plate (1050) caused by the force applied to the sealing assembly (402) may be reduced and / or prevented.

[0158] In one embodiment, the second mesh plate (1070) may be attached only to the bracket (1030). The second mesh plate (1070) may not be attached to the speaker module (420). The second mesh plate (1070) may be attached to the bracket (1030) and not attached to the speaker module (420) (e.g., enclosure (424)). Accordingly, when the sealing assembly (402) and the speaker module (420) are assembled to the housing (410), the waterproof member (1080) is pressed between the speaker module (420) and the side wall (411) of the housing (410), but the second mesh plate (1070) may not be pressed. Accordingly, damage to the second mesh plate (1070) caused by the force applied to the sealing assembly (402) may be reduced and / or prevented.

[0159] The technical problems to be solved in this disclosure are not limited to those mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art to which this disclosure pertains.

[0160] According to one embodiment, an electronic device (401) may include: a housing (410) comprising a side wall (411) having a speaker hole (415); a speaker module (420) disposed within the housing (410) and comprising an acoustic port (425); and a sealing assembly (402; 902; 1002) configured to seal a gap between the speaker module (420) and the side wall (411) so that the acoustic port (425) of the speaker module (420) is connected to the speaker hole (415) of the side wall (411). The sealing assembly (402; 902; 1002) comprises: a bracket (430; 930; 1030) disposed between the speaker module (420) and the side wall (411) and having an opening (435; 935; 1035) aligned with the speaker hole (415) of the side wall (411); and a waterproof member (480; 980; 1080) attached to the bracket (430; 930; 1030) and pressed by the speaker module (420) or the side wall (411) to seal at least a portion of the gap. and may include a mesh plate (450; 950; 1050) attached to the bracket (430; 930; 1030) to cover the opening (435; 935; 1035) of the bracket (430; 930; 1030). The mesh plate (450; 950; 1050) may be spaced apart and separated from the waterproof member (480; 980; 1080).

[0161] In one embodiment, the bracket (430; 930; 1030) may include a first surface (430A; 930A) facing the side wall (411) of the housing (410) and a second surface (430B; 930B) opposite to the first surface (430A; 930A). The mesh plate (450; 950; 1050) may be attached to the first surface (430A; 930A) of the bracket (430; 930; 1030).

[0162] In one embodiment, the bracket (430; 930; 1030) may include a first part (431) defining the opening (435; 935; 1035) of the bracket (430; 930; 1030) and a second part (432) covering the outer edge of the first part (431). The mesh plate (450; 950; 1050) may be attached to the first part (431) of the bracket (430; 930; 1030). The waterproof member (480; 980; 1080) may be disposed between the second part (432) of the bracket (430; 930; 1030) and the side wall (411) of the housing (410).

[0163] In one embodiment, the waterproof member (480; 980; 1080) may define an opening (485) connected to the speaker hole (415) by extending along the outer edge of the first part (431) of the bracket (430; 930; 1030).

[0164] In one embodiment, at least a portion of the mesh plate (450; 950; 1050) may be located within the opening (485) of the waterproof member (480; 980; 1080).

[0165] In one embodiment, a first area of ​​the first surface (430A; 930A) of the bracket (430; 930; 1030) corresponding to the first part (431) of the bracket (430; 930; 1030) may be recessed relative to a second area of ​​the first surface (430A; 930A) of the bracket (430; 930; 1030) corresponding to the second part (432) of the bracket (430; 930; 1030).

[0166] In one embodiment, the bracket (430; 930; 1030) may be attached to the speaker module (420).

[0167] In one embodiment, the bracket (430; 930; 1030) may include a first surface (430A; 930A) facing the side wall (411) of the housing (410) and a second surface (430B; 930B) opposite to the first surface (430A; 930A). The mesh plate (450; 950; 1050) may be attached to the second surface (430B; 930B).

[0168] In one embodiment, the bracket (430; 930; 1030) may include a first part (431) defining the opening (435; 935; 1035) of the bracket (430; 930; 1030) and a second part (432) covering the outer edge of the first part (431). The mesh plate (450; 950; 1050) may be attached to the first part (431) of the bracket (430; 930; 1030). The waterproof member (480; 980; 1080) may be disposed between the second part (432) of the bracket (430; 930; 1030) and the speaker module (420).

[0169] In one embodiment, the waterproof member (480; 980; 1080) may define an opening (485) connected to the acoustic port (425) by extending along the outer edge of the first part (431) of the bracket (430; 930; 1030).

[0170] In one embodiment, at least a portion of the mesh plate (450; 950; 1050) may be located within the opening (485) of the waterproof member (480; 980; 1080).

[0171] In one embodiment, a first area of ​​the second surface (430B; 930B) of the bracket (430; 930; 1030) corresponding to the first part (431) of the bracket (430; 930; 1030) may be recessed relative to a second area of ​​the second surface (430B; 930B) of the bracket (430; 930; 1030) corresponding to the second part (432) of the bracket (430; 930; 1030).

[0172] In one embodiment, the bracket (430; 930; 1030) may be attached to the side wall (411) of the housing (410).

[0173] In one embodiment, the waterproof member (480; 980; 1080) may be disposed between the first surface (430A; 930A) of the bracket (430; 930; 1030) and the side wall (411) of the housing (410).

[0174] In one embodiment, the mesh plate (450; 950; 1050) may be spaced apart and separated from the side wall (411) of the housing (410).

[0175] In one embodiment, the mesh plate (450; 950; 1050) can be spaced apart and separated from the speaker module (420).

[0176] In one embodiment, the speaker module (420) may include a speaker (422) configured to output sound and an enclosure (424) that accommodates the speaker. The bracket (430; 930; 1030) may be formed integrally with the enclosure (424) of the speaker module (420).

[0177] In one embodiment, another mesh plate (470; 970; 1070) attached to the mesh plate (450; 950; 1050) may be included. The mesh plate (450; 950; 1050) may be positioned between the bracket (430; 930; 1030) and the other mesh plate (470; 970; 1070).

[0178] In one embodiment, the density of the mesh plate (450; 950; 1050) may be higher than the density of the other mesh plate (470; 970; 1070).

[0179] According to one embodiment, an electronic device (401) may include: a housing (410) comprising a side wall (411) having a speaker hole (415) visible from the outside of the electronic device (401); a speaker module (420) disposed within the housing (410) and comprising an acoustic port (425); and a sealing assembly (402; 902; 1002) configured to seal a gap between the speaker module (420) and the side wall (411) so that the acoustic port (425) is connected to the speaker hole (415). The sealing assembly (402; 902; 1002) may include a bracket (430; 930; 1030) disposed between the speaker module (420) and the side wall (411) and having an opening (435; 935; 1035) aligned with the speaker hole (415). It may include a waterproof member (480; 980; 1080) disposed between the bracket (430; 930; 1030) and the side wall (411) and pressed by the side wall (411) to seal at least a portion of the gap; and a mesh plate (450; 950; 1050) attached to the bracket (430; 930; 1030) to cover the opening (435; 935; 1035) of the bracket (430; 930; 1030). The mesh plate (450; 950; 1050) may be spaced apart and separated from the waterproof member (480; 980; 1080).

[0180] According to one embodiment, an electronic device (401) may include: a housing (410) comprising a side wall (411) defining a speaker hole (415); a speaker module (420) disposed within the housing (410) and comprising an acoustic port (425) acoustically coupled to the speaker hole (415) of the side wall (411); and a sealing assembly (402; 902; 1002) disposed between the acoustic port (425) of the speaker module (420) and the speaker hole (415) of the side wall (411). The sealing assembly (402; 902; 1002) comprises: a bracket (430; 930; 1030) including a side (430A; 930A) facing the inner side (411A) of the side wall (411) and defining an opening (435; 935; 1035) aligned with the speaker hole (415) of the side wall (411); and a mesh plate (450; 950; 1050) attached to a first portion (431) of the side (430A; 930A) of the bracket (430; 930; 1030) surrounding the opening (435; 935; 1035). It may include a waterproof member (480; 980; 1080; 1090) that provides sealing between the bracket (430; 930; 1030) and the side wall (411) by being interposed between the second part (432) of the side (430A; 930A) of the bracket (430; 930; 1030) that surrounds the first part (431) of the side (430A; 930A) of the bracket (430; 930; 1030) and the inner side (411A) of the side wall (411) that surrounds the speaker hole (415). The mesh plate (450; 950; 1050) may be attached only to the bracket (430; 930; 1030) and may not be attached to the inner side (411A) of the side wall (411).

[0181] In one embodiment, the mesh plate (450; 950; 1050) may be spaced apart from the side wall (411) of the housing (410) by a gap.

[0182] In one embodiment, the side wall (411) can support the bracket (430; 930; 1030) through the waterproof member (480; 980; 1080; 1090) among the waterproof member (480; 980; 1080; 1090) and the mesh plate (450; 950; 1050).

[0183] In one embodiment, the mesh plate (450; 950; 1050) may be attached to the first part (431) of the side (430A; 930A) of the bracket (430; 930; 1030) so as to be spaced apart from the waterproof member (480; 980; 1080; 1090).

[0184] In one embodiment, the mesh plate (450; 950; 1050) may be spaced apart from the waterproof member (480; 980; 1080; 1090) as it is placed on the first part (431) of the side (430A; 930A) of the bracket (430; 930; 1030), which is recessed from the second part (432) of the side (430A; 930A) of the bracket (430; 930; 1030).

[0185] In one embodiment, the waterproof member (480; 980; 1080; 1090) may define an opening (485) aligned with the speaker hole (415). The mesh plate (450; 950; 1050) may be located within the opening (485) of the waterproof member (480; 980; 1080; 1090) when the sealing assembly (402; 902; 1002) is viewed in a direction substantially perpendicular to the mesh plate (450; 950; 1050).

[0186] In one embodiment, the bracket (430; 930; 1030) may include another side (430B; 930B) opposite to the side (430A; 930A) and facing the speaker module (420). The electronic device (401) may include another waterproof member (490; 1080) that provides sealing between the bracket (430; 930; 1030) and the speaker module by being interposed between the portion of the other side (430B; 930B) of the bracket (430; 930; 1030) surrounding the opening (435) and the portion of the speaker module (420) surrounding the acoustic port (425).

[0187] In one embodiment, the waterproof member (480; 980; 1080; 1090) may include rubber or a waterproof adhesive material. The other waterproof member (490; 1080) may include rubber or a waterproof adhesive material.

[0188] In one embodiment, the speaker module (420) may include a speaker (422) configured to output sound and an enclosure (424) that accommodates the speaker. The bracket (430; 930; 1030) may be formed integrally with the enclosure (424) of the speaker module (420).

[0189] In one embodiment, the electronic device (401) may include another mesh plate (470; 970; 1070) disposed on the mesh plate (450; 950; 1050). The other mesh plate (470; 970; 1070) may be attached only to the mesh plate (450; 950; 1050) and not to the inner side (411A) of the side wall (411).

[0190] In one embodiment, the density of the mesh plate (450; 950; 1050) may be higher than the density of the other mesh plate (470; 970; 1070).

[0191] In one embodiment, the acoustic port (425) of the speaker module (420), the openings of the sealing assembly (402; 902; 1002), and the speaker hole (415) of the side wall (411) can form a connected sound radiation path.

[0192] According to one embodiment, an electronic device (401) may include: a housing (410) comprising a side wall (411) defining a speaker hole (415); a speaker module (420) disposed within the housing (410) and comprising an acoustic port (425) acoustically coupled to the speaker hole (415) of the side wall (411); and a sealing assembly (402; 902; 1002) disposed between the acoustic port (425) of the speaker module (420) and the speaker hole (415) of the side wall (411). The sealing assembly (402; 902; 1002) may include a bracket (430; 930; 1030), a mesh plate (450; 950; 1050), and a waterproof member (480; 980; 1080; 1090). The bracket (430; 930; 1030) may define an opening (435; 935; 1035) aligned with the speaker hole (415) of the side wall (411). The bracket (430; 930; 1030) may include a first side (430A; 930A) facing the inner side (411A) of the side wall (411) and a second side (430B; 930B) opposite to the first side (430A; 930A) and facing the speaker module (420). The mesh plate (450; 950; 1050) may be attached to the second side (430B; 930B) of the bracket (430; 930; 1030) to cover the opening (435; 935; 1035) of the bracket (430; 930; 1030). The above waterproof member (480; 980; 1080; 1090) can provide sealing between the bracket (430; 930; 1030) and the side wall (411) by being interposed between the portion of the first side (430A; 930A) of the bracket (430; 930; 1030) that surrounds the opening (435) of the bracket (430; 930; 1030) and the portion of the inner side (411A) of the side wall (411) that surrounds the speaker hole (415).The mesh plate (450; 950; 1050) may be attached only to the bracket (430; 930; 1030) and not to the speaker module (420).

[0193] In one embodiment, the mesh plate (450; 950; 1050) may be spaced apart from the speaker module (420) by a gap.

[0194] In one embodiment, the side wall (411) can support the bracket (430; 930; 1030) through the waterproof member (480; 980; 1080; 1090) among the waterproof member (480; 980; 1080; 1090) and the mesh plate (450; 950; 1050).

[0195] In one embodiment, the second side (430B; 930B) of the bracket (430; 930; 1030) may include a first portion covering the opening (435) of the bracket (430; 930; 1030) and a second portion covering the first portion of the second side (430B; 930B). The mesh plate (450; 950; 1050) may be spaced apart from the speaker module (420) by being placed on the first portion of the second side (430B; 930B) of the bracket (430; 930; 1030), which is recessed from the second portion of the second side (430B; 930B) of the bracket (430; 930; 1030).

[0196] In one embodiment, the second portion of the second side (430; 930B) of the bracket (430; 930; 1030) may be attached to the speaker module (420).

[0197] In one embodiment, the waterproof member (480; 980; 1080; 1090) may include rubber or a waterproof adhesive material.

[0198] In one embodiment, the electronic device (401) may include another mesh plate (470; 970; 1070) disposed on the mesh plate (450; 950; 1050). The other mesh plate (470; 970; 1070) may be attached only to the mesh plate (450; 950; 1050) and not to the speaker module (420).

[0199] In one embodiment, the density of the mesh plate (450; 950; 1050) may be higher than the density of the other mesh plate (470; 970; 1070).

[0200] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs.

[0201] The electronic device according to the various embodiments disclosed in this document may be a device of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0202] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, each of phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish a component from another component and do not limit the components in any other aspect (e.g., importance or order). Where any component (e.g., the first) is referred to as "coupled" or "connected" to another component (e.g., the second), with or without the terms "functionally" or "communicationally," it means that said component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0203] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0204] Various embodiments of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0205] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0206] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations among the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device, Housing including side walls defining speaker holes; A speaker module comprising an acoustic port disposed within the housing and acoustically coupled to the speaker hole of the side wall; and It includes a sealing assembly disposed between the acoustic port of the speaker module and the speaker hole of the side wall, and The above sealing assembly is: A bracket that defines an opening aligned with the speaker hole of the side wall and includes a side facing the inner side of the side wall; A mesh plate attached to a first portion of the side of the bracket surrounding the opening; and A waterproof member is included, which provides sealing between the bracket and the side wall by being interposed between the second portion of the side of the bracket that surrounds the first portion of the side of the bracket and the inner side portion of the side wall that surrounds the speaker hole. The above mesh plate is attached only to the bracket and not to the inner side of the side wall, Electronic device.

2. In Claim 1, The mesh plate is spaced apart from the side wall of the housing by a gap. Electronic device.

3. In claim 1, the side wall supports the bracket through the waterproof member among the waterproof member and the mesh plate, Electronic device.

4. In any one of claims 1 to 3, The above mesh plate is, Attached to the first portion of the side of the bracket so as to be spaced apart from the waterproof member, Electronic device.

5. In any one of claims 1 to 4, The above mesh plate is, Spaced apart from the waterproof member, by being disposed on the first portion of the side of the bracket, which is recessed from the second portion of the side of the bracket. Electronic device.

6. In any one of claims 1 to 5, The above waterproof member defines an opening aligned with the speaker hole, and The mesh plate is located within the opening of the waterproof member when the sealing assembly is viewed in a direction substantially perpendicular to the mesh plate. Electronic device.

7. In any one of claims 1 to 6, The above bracket includes another side opposite to the above side and facing the speaker module, and The electronic device comprises another waterproof member that provides sealing between the bracket and the speaker module by being interposed between the portion of the other side of the bracket surrounding the opening and the portion of the speaker module surrounding the acoustic port. Electronic device.

8. In Claim 6, The above waterproof member comprises rubber or a waterproof adhesive material, and The other waterproof member mentioned above comprises rubber or a waterproof adhesive material, Electronic device.

9. In any one of claims 1 to 6, The above speaker module includes a speaker configured to output sound and an enclosure that accommodates the speaker. The above bracket is formed integrally with the enclosure of the above speaker module. Electronic device.

10. In any one of claims 1 to 9, It includes another mesh plate disposed on the above mesh plate, and The other mesh plate mentioned above is attached only to the mesh plate and not to the inner side of the side wall. Electronic device.

11. In Claim 10, The density of the above mesh plate is higher than the density of the other mesh plate, Electronic device.

12. In any one of claims 1 to 11, The acoustic port of the speaker module, the openings of the sealing assembly, and the speaker hole of the side wall form a connected sound radiation path. Electronic device.

13. In electronic devices, Housing including side walls defining speaker holes; A speaker module comprising an acoustic port disposed within the housing and acoustically coupled to the speaker hole of the side wall; and It includes a sealing assembly disposed between the acoustic port of the speaker module and the speaker hole of the side wall, and The above sealing assembly is: A bracket defining an opening aligned with the speaker hole of the side wall, wherein the bracket comprises a first side facing the inner side of the side wall and a second side opposite to the first side and facing the speaker module; A mesh plate attached to the second side of the bracket to cover the opening of the bracket; and A waterproof member is included, which provides sealing between the bracket and the side wall by being interposed between the portion of the first side of the bracket surrounding the opening of the bracket and the portion of the inner side of the side wall surrounding the speaker hole. The above mesh plate is attached only to the bracket and not to the speaker module. Electronic device.

14. In Claim 13, The mesh plate is spaced apart from the speaker module by a gap, Electronic device.

15. In Claim 13, The above side wall supports the bracket through the waterproof member among the waterproof member and the mesh plate, Electronic device.

Images