Electronic device comprising printed circuit board for transmitting radio frequency signal

Abstract

The electronic device comprises: a battery; a first printed circuit board on which a wireless communication circuit is disposed; a second printed circuit board; and a third printed circuit board extending across the battery to a 1-2 printed circuit board and electrically connecting the 1-2 printed circuit board. The third printed circuit board comprises: a first section overlapping the battery and having a first flexibility; and a second section extending from the first section across the edge of the battery toward the second printed circuit board and having a second flexibility higher than the first flexibility. The third printed circuit board comprises a layer including at least one conductive path for an RF signal, and a ground area extending along a first portion of the conductive path in the first section and interrupted along a second portion of the conductive path in the second section.

Description

Electronic device including a printed circuit board for transmitting radio frequency signals

[0001] The present disclosure relates to an electronic device comprising a printed circuit board for transmitting a radio frequency signal.

[0002] An electronic device, such as a smartphone, may include a plurality of printed circuit boards for mounting electronic components or transmitting electrical signals. For example, the electronic device may include a first printed circuit board, a second printed circuit board, and a third printed circuit board that electrically connects the first printed circuit board and the second printed circuit board.

[0003] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art in relation to the present disclosure.

[0004] According to one embodiment, an electronic device may include at least one antenna radiator; a battery; a wireless communication circuit; a first printed circuit board on which the wireless communication circuit is disposed; a second printed circuit board; and a third printed circuit board extending from the first printed circuit board to the second printed circuit board across the battery and electrically connecting the first printed circuit board and the second printed circuit board. The wireless communication circuit may be configured to transmit an RF (radio frequency) signal to the at least one antenna radiator through the third printed circuit board. The third printed circuit board may include: a first section overlapping the battery and having a first flexibility; and a second section extending from the first section across the edge of the battery toward the second printed circuit board and having a second flexibility higher than the first flexibility. The third printed circuit board may include a layer comprising at least one conductive path for the RF signal and a ground region that extends along a first portion of the at least one conductive path within the first section but is interrupted along a second portion of the at least one conductive path within the second section.

[0005] According to one embodiment, an electronic device may include: a first printed circuit board; a second printed circuit board; a battery disposed around the first printed circuit board and the second printed circuit board; and a third printed circuit board extending from the first printed circuit board across the battery to the second printed circuit board and electrically connecting the first printed circuit board to the second printed circuit board. The third printed circuit board may include: a first section having a first flexibility and including an end disposed over the battery; and a second section extending from the end of the first section across the edge of the battery toward the second printed circuit board and having a second flexibility higher than the first flexibility of the first section. The third printed circuit board includes a layer, the layer comprising: at least one conductive line for transmitting an RF (radio frequency) signal; and may include a ground region that extends along a first portion of the at least one conductive line within the first section, but is interrupted along a second portion of the at least one conductive line within the second section.

[0006] An electronic device is disclosed. The electronic device may include a first printed circuit board, a wireless communication circuit disposed on the first printed circuit board, a second printed circuit board, an antenna radiator disposed adjacent to the second printed circuit board, a battery disposed between the first printed circuit board and the second printed circuit board and having a surface facing the rear cover of the electronic device, and a third printed circuit board extending across the surface of the battery from the first printed circuit board to the second printed circuit board and electrically connecting the first printed circuit board and the second printed circuit board to transmit a radio frequency (RF) signal between the wireless communication circuit and the antenna radiator. The surface of the battery may include a first edge adjacent to the first printed circuit board, a second edge opposite to the first edge and adjacent to the second printed circuit board, a third edge connecting one end of the first edge and one end of the second edge, and a fourth edge connecting the other end of the first edge and the other end of the second edge. The third printed circuit board may include an end portion comprising a connector coupled to the second printed circuit board, a flexible portion extending from the end portion across the second edge of the battery to an inner region of the surface of the battery and having a first flexibility, and a rigid portion extending from the end of the flexible portion toward the first edge of the battery and having a second flexibility smaller than the first flexibility. The flexible portion may include a V-shaped section, and the apex of the V-shaped section may face the third edge or the fourth edge of the battery.

[0007] An electronic device is disclosed. The electronic device may include a first printed circuit board, a second printed circuit board, a battery disposed between the first printed circuit board and the second printed circuit board, and a third printed circuit board extending across the battery from the first printed circuit board to the second printed circuit board, electrically connecting the first printed circuit board and the second printed circuit board, and configured to transmit a radio frequency (RF) signal. The battery may include a first edge facing the first printed circuit board, a second edge facing the second printed circuit board, a third edge connecting one end of the first edge and one end of the second edge, and a fourth edge connecting the other end of the first edge and the other end of the second edge. The third printed circuit board may include a rigid section comprising a first end positioned on the battery and facing the direction of the first edge of the battery, and a second end positioned on the battery and facing the direction of the second edge of the battery, and a flexible section extending from the second end of the rigid section across the second edge of the battery to the second printed circuit board. The flexible section may include a V-shaped section, and the apex of the V-shaped section may face the third edge or the fourth edge of the battery.

[0008] An electronic device is disclosed. The electronic device may include a first printed circuit board, a wireless communication circuit disposed on the first printed circuit board, a second printed circuit board having a plurality of antennas formed thereon, a battery having a surface facing the rear cover of the electronic device, and a third printed circuit board extending across the surface of the battery from the first printed circuit board to the second printed circuit board and electrically connecting the first printed circuit board and the second printed circuit board to transmit a radio frequency (RF) signal between the wireless communication circuit and the plurality of antennas. The surface of the battery may include a first edge adjacent to the first printed circuit board, a second edge opposite to the first edge, and a third edge connecting the end of the first edge and the end of the second edge and adjacent to the second printed circuit board. The third printed circuit board may include an end portion comprising a connector coupled to the second printed circuit board, a flexible portion extending from the end portion across the third edge of the battery to an inner region of the surface of the battery and having a first flexibility, and a rigid portion extending from the end of the flexible portion toward the first printed circuit board and having a second flexibility smaller than the first flexibility. The flexible portion may include a V-shaped section, and the apex of the V-shaped section may face the first edge or the second edge of the battery.

[0009] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0010] FIG. 2a is a drawing showing an exemplary electronic device according to one embodiment.

[0011] FIG. 2b is an exploded perspective view of an exemplary electronic device according to one embodiment.

[0012] FIG. 3a is a cross-sectional view of an electronic device according to one embodiment.

[0013] FIG. 3b is a plan view of an electronic device according to one embodiment.

[0014] Figure 4 shows an electronic device according to a comparative example.

[0015] FIG. 5a shows a third printed circuit board deformed by the flow of a battery according to a comparative example.

[0016] FIG. 5b shows a third printed circuit board deformed by the flow of a battery according to one embodiment.

[0017] FIGS. 6a and 6b are drawings showing the behavior of a third printed circuit board during a drop test according to one embodiment.

[0018] FIG. 6c shows an electronic device according to one embodiment.

[0019] FIG. 7 is a stacking diagram of a third printed circuit board according to one embodiment.

[0020] FIG. 8a shows a first layer of a third printed circuit board according to one embodiment.

[0021] FIG. 8b shows a second layer of a third printed circuit board according to one embodiment.

[0022] FIG. 8c shows a third layer of a third printed circuit board according to one embodiment.

[0023] FIG. 8d shows the second layer and the third layer of the third printed circuit board according to one embodiment.

[0024] FIG. 8e is a cross-sectional view of a third printed circuit board according to one embodiment.

[0025] FIG. 8f is a graph showing the RF characteristics of a third printed circuit board according to one embodiment.

[0026] FIG. 9a shows a third printed circuit board according to a comparative example.

[0027] Figure 9b is a graph showing the insertion loss of the third printed circuit board of Figure 9a.

[0028] FIG. 10a shows a third printed circuit board according to a comparative example.

[0029] Figure 10b is a graph showing the insertion loss of the third printed circuit board of Figure 10a.

[0030] FIG. 11a shows a third printed circuit board according to a comparative example.

[0031] Figure 11b is a graph showing the insertion loss of the third printed circuit board of Figure 11a.

[0032] FIGS. 12a, FIGS. 12b, FIGS. 12c, FIGS. 12d, FIGS. 12e, FIGS. 12f, and FIGS. 12g show examples of a second conductive layer of a first flexible portion according to one embodiment.

[0033] FIG. 13 shows an electronic device according to one embodiment.

[0034] FIG. 14 shows an electronic device according to one embodiment.

[0035] FIG. 15 shows an electronic device according to one embodiment.

[0036] FIG. 16 shows a foldable device according to one embodiment.

[0037] FIG. 17 shows an electronic device according to one embodiment.

[0038] Identical or similar components in the drawings may be assigned the same reference numerals. Descriptions of components having the same reference numeral may be applied identically or in a corresponding manner when referring to different drawings, unless otherwise noted, and redundant descriptions of components having the same reference numeral may not be repeated. In the following descriptions referring to specific drawings, reference numerals from other drawings may be referenced.

[0039] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to various embodiments.

[0040] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0041] The processor (120) can control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., a program (140)), and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0042] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0043] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0044] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0045] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0046] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0047] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0048] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0049] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0050] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0051] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0052] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0053] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0054] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0055] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0056] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, Wi-Fi (wireless fidelity) direct or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0057] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0058] The antenna module (197) can transmit a signal or power to an external source (e.g., an external electronic device) or receive it from an external source. According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). The signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0059] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0060] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0061] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0062] FIG. 2a is a drawing illustrating an exemplary electronic device according to one embodiment. Referring to FIG. 2a, the electronic device (200) according to one embodiment may include a housing (210) that forms at least partially the exterior of the electronic device (200). For example, the housing (210) may include a first surface (or front) (200A), a second surface (or rear) (200B), and a third surface (or side) (200C) that surrounds the space between the first surface (200A) and the second surface (200B). In one embodiment, the housing (210) may refer to a structure that forms at least some of the first surface (200A), the second surface (200B), and / or the third surface (200C).

[0063] An electronic device (200) according to one embodiment may include a substantially transparent front plate (202). In one embodiment, the front plate (202) may form at least a portion of the first surface (200A). In one embodiment, the front plate (202) may include, for example, a glass plate or a polymer plate including various coating layers, but is not limited thereto.

[0064] An electronic device (200) according to one embodiment may include a substantially opaque back plate (211). In one embodiment, the back plate (211) may form at least a portion of a second surface (200B). In one embodiment, the back plate (211) may be formed by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel, or magnesium), or a combination of at least two of the materials.

[0065] An electronic device (200) according to one embodiment may include a side bezel structure (e.g., a side member) (218). In one embodiment, the side bezel structure (218) may be combined with a front plate (202) and / or a rear plate (211) to form at least a portion of a third surface (200C) of the electronic device (200). For example, the side bezel structure (218) may form the entire third surface (200C) of the electronic device (200), or, for another example, the side bezel structure (218) may form the third surface (200C) of the electronic device (200) together with the front plate (202) and / or the rear plate (211).

[0066] In one embodiment, the side bezel structure (218) may comprise a metal and / or a polymer. In one embodiment, the rear plate (211) and the side bezel structure (218) may be formed integrally and may comprise the same material (e.g., a metallic material such as aluminum), but are not limited thereto. For example, the rear plate (211) and the side bezel structure (218) may be formed as separate components and / or may comprise different materials.

[0067] In one embodiment, the electronic device (200) may include a display (201) (e.g., display module (160) of FIG. 1), an audio module (203, 204, 207) (e.g., audio module (170) of FIG. 1), a sensor module (e.g., sensor module (176) of FIG. 1), a camera module (205, 212, 213) (e.g., camera module (180) of FIG. 1), a key input device (217) (e.g., input module (150) of FIG. 1), a light-emitting element (not shown), and a connector hole (208). In one embodiment, the electronic device (200) may omit at least one of the components (e.g., key input device (217) or light-emitting element (not shown)) or additionally include other components.

[0068] In one embodiment, the display (201) may be visually exposed through a significant portion of the front plate (202). For example, at least a portion of the display (201) may be visible through the front plate (202) forming the first surface (200A). The display (201) may be positioned on the back surface of the front plate (202).

[0069] In one embodiment, the display (201) (or the first surface (200A) of the electronic device (200)) may include a screen display area (201A). In one embodiment, the display (201) may provide visual information to the user through the screen display area (201A). In the illustrated embodiment, when the first surface (200A) is viewed from the front, the screen display area (201A) is shown to be located on the inner side of the first surface (200A) and spaced apart from the outer edge of the first surface (200A), but is not limited thereto. For example, when the first surface (200A) is viewed from the front, at least a portion of the edge of the screen display area (201A) may substantially coincide with the edge of the first surface (200A) (or the front plate (202)).

[0070] In one embodiment, the screen display area (201A) may include a sensing area (201B) configured to acquire the user's biometric information. Here, the meaning of "the screen display area (201A) includes the sensing area (201B)" can be understood as at least a portion of the sensing area (201B) being overlapped with the screen display area (201A). For example, the sensing area (201B) may refer to an area that can display visual information by the display (201) just like other areas of the screen display area (201A), and additionally acquire the user's biometric information (e.g., fingerprint). Although the sensing area (201B) is depicted as being formed within the screen display area (201A), it is not limited thereto. For example, the sensing area (201B) may be formed in the key input device (217).

[0071] In one embodiment, the display (201) may include an area where a first camera module (205) is located. For example, an opening may be formed in the area of ​​the display (201), and the first camera module (205) (e.g., a punch-hole camera) may be placed at least partially within the opening so as to face the first surface (200A). In this case, the screen display area (201A) may surround at least a portion of the edge of the opening. In one embodiment, the first camera module (205) (e.g., an under-display camera (UDC)) may be placed below the display (201) so as to overlap with the area of ​​the display (201). In this case, the display (201) may provide visual information to the user through the area, and additionally, the first camera module (205) may acquire an image corresponding to the direction toward the first surface (200A) through the area of ​​the display (201).

[0072] In one embodiment, the display (201) may be combined with or placed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer that detects a magnetic field type stylus pen.

[0073] In one embodiment, the audio module (203, 204, 207) may include a microphone hole (203, 204) and a speaker hole (207).

[0074] In one embodiment, the microphone holes (203, 204) may include a first microphone hole (203) formed in a part of the third surface (200C) and a second microphone hole (204) formed in a part of the second surface (200B). A microphone for acquiring external sound may be placed inside the microphone holes (203, 204). The microphone may include a plurality of microphones to detect the direction of the sound, but is not limited thereto.

[0075] In one embodiment, a second microphone hole (204) formed in a portion of the second surface (200B) may be positioned adjacent to the camera module (205, 212, 213). For example, the second microphone hole (204) may acquire sound according to the operation of the camera module (205, 212, 213). However, it is not limited thereto.

[0076] In one embodiment, the speaker hole (207) may include an external speaker hole (207) and a call receiver hole (not shown). The external speaker hole (207) may be formed in a part of the third surface (200C) of the electronic device (200). In one embodiment, the external speaker hole (207) is integrated into the microphone hole (203), and the speaker hole (207) and the microphone hole (203) may be implemented as a single hole. Although not shown, the call receiver hole (not shown) may be formed in another part of the third surface (200C). For example, the call receiver hole may be formed on the opposite side of the external speaker hole (207) on the third surface (200C). For example, based on the illustration in FIG. 2a, the external speaker hole (207) may be formed on the third surface (200C) corresponding to the lower part of the electronic device (200), and the call receiver hole may be formed on the third surface (200C) corresponding to the upper part of the electronic device (200). However, this is not limited thereto, and in other embodiments, the call receiver hole may be formed at a location other than the third surface (200C). For example, the call receiver hole may be formed by the spaced-apart space between the front plate (202) (or display (201)) and the side bezel structure (218).

[0077] In one embodiment, the electronic device (200) may include at least one speaker (not shown) (e.g., the acoustic output module (155) of FIG. 1) configured to output sound to the outside of the housing (210) through an external speaker hole (207) and / or a receiver hole for calls (not shown).

[0078] In one embodiment, a sensor module (not shown) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0079] In one embodiment, the camera module (205, 212, 213) may include a first camera module (205) positioned to face a first surface (200A) of the electronic device (200), a second camera module (212) positioned to face a second surface (200B), and a flash (213).

[0080] In one embodiment, the second camera module (212) may include a plurality of cameras (e.g., a dual camera, a triple camera, or a quad camera). However, the second camera module (212) is not necessarily limited to including a plurality of cameras and may include a single camera.

[0081] In one embodiment, the first camera module (205) and the second camera module (212) may include one or more lenses, an image sensor, and / or an image signal processor.

[0082] In one embodiment, the flash (213) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and an image sensor may be disposed on one side of the electronic device (200).

[0083] In one embodiment, the key input device (217) may be placed on a third side (200C) of the electronic device (200). In one embodiment, the electronic device (200) may not include some or all of the key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (201).

[0084] In one embodiment, a connector hole (208) may be formed on a third surface (200C) of the electronic device (200) so as to accommodate a connector of an external device. A connection terminal (e.g., connection terminal (178) of FIG. 1) that is electrically connected to the connector of the external device may be disposed within the connector hole (208). The electronic device (200) according to one embodiment may include an interface module (e.g., interface (177) of FIG. 1) for processing electrical signals transmitted and received through the connection terminal.

[0085] In one embodiment, the electronic device (200) may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be placed on a first surface (200A) of the housing (210). The light-emitting element (not shown) may provide state information of the electronic device (200) in the form of light. In one embodiment, the light-emitting element (not shown) may provide a light source that is linked to the operation of the first camera module (205). For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0086] FIG. 2b is an exploded perspective view of an exemplary electronic device according to one embodiment.

[0087] Referring to FIG. 2b, an electronic device (200) according to one embodiment may include a frame structure (240) (e.g., a side bezel structure (218) of FIG. 2a), a first printed circuit board (250), a second printed circuit board (252), a battery (270) (e.g., a battery (189) of FIG. 1), and an antenna module (280).

[0088] In one embodiment, the frame structure (or frame) (240) may be positioned between the display (201) and the rear plate (211). In one embodiment, the frame structure (240) may support or accommodate components included in the electronic device (200). For example, the display (201) may be placed on one side of the frame structure (240) facing in one direction (e.g., +Z direction). For example, the frame structure (240) may support the front plate (202) to which the display (201) is attached. On the other side of the frame structure (240) facing in the opposite direction (e.g., -Z direction) to the one direction, the first printed circuit board (250), the second printed circuit board (252), the battery (270), and the second camera module (212) may be placed. The first printed circuit board (250), the second printed circuit board (252), the battery (270), and the second camera module (212) can be placed within a recess formed in the frame structure (240).

[0089] In one embodiment, the frame structure (240) may include a first part (241) and a second part (243). The periphery of the second part (243) may be surrounded by the first part (241). The first part (241) may surround the space between the rear plate (211) and the front plate (202) (and / or the display (201)). The first part (241) surrounding the space may at least partially form a side of the electronic device (200) (e.g., the third side (200C) in FIG. 2a), and the second part (243) located within the space may extend inward from the first part (241). The second part (243) may be located below the display (201) (e.g., in the -Z direction). In one embodiment, the first part (241) and / or the second part (243) may be formed of a metal and / or a polymer.

[0090] The frame structure (240) (or the first part (241) of the frame structure (240)) may be referred to as a side wall, a side wall, a side member, or a lateral structure in that it forms the side of the electronic device (200). The frame structure (240) (or the second part (243) of the frame structure (240)) may be referred to as a support member, a support structure, a support part, or a bracket in that it supports various parts of the electronic device (200).

[0091] In one embodiment, the first printed circuit board (250), the second printed circuit board (252), and the battery (270) may each be coupled to the frame structure (240). For example, the first printed circuit board (250) and the second printed circuit board (252) may be fixedly positioned to the frame structure (240) through a coupling member such as a screw. For example, the battery (270) may be fixedly positioned to the frame structure (240) through an adhesive member (e.g., tape). However, it is not limited to the examples described above.

[0092] In one embodiment, the display (201) may be positioned between the frame structure (240) and the front plate (202). For example, the front plate (202) may be positioned on one side (e.g., +Z direction) of the display (201), and the frame structure (240) may be positioned on the other side (e.g., -Z direction).

[0093] In one embodiment, the front plate (202) may be combined with the display (201). For example, the display (201) may be attached to the back surface of the front plate (202) via an optical adhesive member (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)).

[0094] In one embodiment, the front plate (202) may be combined with a frame structure (240). For example, the front plate (202) may include an outer portion extending outward from the display (201) when viewed in the z-axis direction. The outer portion of the front plate (202) may be attached to the frame structure (240) (e.g., the first part (241)).

[0095] In one embodiment, a processor (e.g., processor (120) of FIG. 1), memory (e.g., memory (130) of FIG. 1), and / or an interface (e.g., interface (177) of FIG. 1) may be disposed on the first printed circuit board (250) and / or the second printed circuit board (252). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (200) to an external electronic device and may include a USB connector, an SD card / MMC connector, or an audio connector. In one embodiment, the first printed circuit board (250) and the second printed circuit board (252) may be operatively or electrically connected to each other through a connecting member (e.g., a flexible printed circuit board).

[0096] In one embodiment, the battery (270) can supply power to at least one component of the electronic device (200). For example, the battery (270) may include a rechargeable secondary battery or a fuel cell.

[0097] In one embodiment, the battery (270) may include a side (270A) facing the rear plate (211) (e.g., -Z direction) and an opposite side (270B) facing the frame structure (240) (e.g., +Z direction) and / or resting on a second part (243) of the frame structure (240).

[0098] In one embodiment, the surface (270A) of the battery (270) may include a plurality of edges. For example, the surface (270A) of the battery (270) may include a first edge (A1), a second edge (A2) opposite to the first edge (A1), a third edge (A3) extending from one end of the first edge (A1) to the other end of the second edge (A2), and a fourth edge (A4) opposite to the third edge (A3) and extending from the other end of the first edge (A1) to the other end of the second edge (A2).

[0099] For example, the first edge (A1) may be adjacent to the first printed circuit board (250). For example, the first edge (A1) (and / or the first side of the battery (270) extending from the first edge (A1) to the opposite side (270B)) may be oriented toward the direction of the first printed circuit board (250) (e.g., +Y direction).

[0100] For example, the second edge (A2) may be adjacent to the second printed circuit board (252). For example, the second edge (A2) (and / or the second side of the battery (270) extending from the second edge (A2) to the opposite side (270B)) may be oriented toward the direction of the second printed circuit board (252) (e.g., the -Y direction). For example, but not limited to, the second edge (A2) may be substantially parallel to the first edge (A1). For example, but not limited to, the first edge (A1) and the second edge (A2) may be parallel to the X-axis.

[0101] For example, the third edge (A3) may be substantially perpendicular to the first edge (A1) and / or the second edge (A2). For example, the fourth edge (A4) may be substantially perpendicular to the first edge (A1) and / or the second edge (A2). For example, but not limited to, the fourth edge (A4) may be substantially parallel to the third edge (A3). For example, but not limited to, the third edge (A3) and the fourth edge (A4) may be parallel to the Y-axis.

[0102] In one embodiment, the first camera module (205) (e.g., front camera) may be placed in at least a part (e.g., second part (243)) of the frame structure (240) so that the lens can receive external light through a part area (e.g., camera area (237)) of the front plate (202) (e.g., front (200A) of FIG. 2a).

[0103] In one embodiment, a second camera module (212) (e.g., rear camera) may be positioned between the frame structure (240) and the rear plate (211). In one embodiment, the second camera module (212) may be electrically connected to the first printed circuit board (250) through a connecting member (e.g., connector). In one embodiment, the second camera module (212) may be positioned so that the lens can receive external light through the camera area (284) of the rear plate (211) of the electronic device (200).

[0104] In one embodiment, the camera area (284) may be formed on the surface of the rear plate (211) (e.g., the rear (200B) of FIG. 2A). In one embodiment, the camera area (284) may be formed at least partially transparent so that external light can be incident on the lens of the second camera module (212). In one embodiment, at least a portion of the camera area (284) may protrude a certain height from the surface of the rear plate (211). However, it is not limited thereto, and in another embodiment, the camera area (284) may form a plane substantially identical to the surface of the rear plate (211).

[0105] In one embodiment, the housing (210) of the electronic device (200) may mean a configuration or structure that forms at least a part of the exterior of the electronic device (200). In other words, the housing (210) may include at least a part of a front plate (202), a frame structure (240), and / or a rear plate (211) that form the exterior of the electronic device (200).

[0106] In one embodiment, the antenna module (280) may be placed under the rear plate (211) (e.g., in the +Z direction). For example, part of the antenna module (280) may be placed between the rear plate (211) and the first printed circuit board (250), and another part of the antenna module (280) may be placed between the rear plate (211) and the battery (270).

[0107] In one embodiment, the antenna module (280) may include one or more antennas. For example, the antenna module (280) may include one or more coils forming the one or more antennas. For example, the antenna module (280) may include a coil for NFC and / or a coil for wireless charging. For example, the antenna module (280) may be a flexible printed circuit board, and the one or more coils may be formed by conductive patterns of the flexible printed circuit board. In this respect, the antenna module (280) may be referred to as a flexible printed circuit board (e.g., including the one or more coil antennas).

[0108] FIG. 3a is a cross-sectional view of an electronic device according to one embodiment. FIG. 3b is a top view of an electronic device according to one embodiment.

[0109] Referring to FIG. 3a, according to one embodiment, an electronic device (300) (e.g., the electronic device (101) of FIG. 1 and / or the electronic device (200) of FIG. 2b) may include a first printed circuit board (310) (e.g., the first printed circuit board (250) of FIG. 2b), a second printed circuit board (320) (e.g., the second printed circuit board (252) of FIG. 2b), and a third printed circuit board (330). In one embodiment, the first printed circuit board (310) and / or the second printed circuit board (320) may include a rigid PCB (RPCB) and / or a rigid-flexible PCB (RFPCB). In one embodiment, the third printed circuit board (330) may include an RFPCB. For example, the third printed circuit board (330) may include one or more rigid portions and one or more flexible portions.

[0110] In one embodiment, various components of an electronic device (300) may be disposed on the first printed circuit board (310) and the second printed circuit board (320). For example, a wireless communication circuit of the electronic device (300) (e.g., the wireless communication module (192) of FIG. 1) may be disposed on the first printed circuit board (310). For example, the electronic device (300) may include a connector (312) disposed on the first printed circuit board (310) and a connector (322) disposed on the second printed circuit board (320).

[0111] In one embodiment, the frame structure (240) may include a first rib (246) and a second rib (247). The first rib (246) and the second rib (247) may be disposed on the second part (243) (e.g., each). For example, the first rib (246) and the second rib (247) may protrude from the second part (243) (e.g., each). For example, the first rib (246) and the second rib (247) may protrude from the second part (243) in the -Z direction. For example, the first rib (246) may be disposed between the first printed circuit board (310) and the battery (270) (e.g., in the Y-axis direction). For example, the second rib (247) can be placed between the battery (270) and the second printed circuit board (320) (e.g., in the Y-axis direction).

[0112] In one embodiment, the battery (270) may be placed on a second part (243) of the frame structure (240). For example, the battery (270) may be seated within a receiving space provided at least partially by the second part (243), a first rib (246) protruding from the second part (243) (e.g., in the -Z direction), and a second rib (247) protruding from the second part (243). In one embodiment, the battery (270) may be positioned between the first printed circuit board (310) and the second printed circuit board (320).

[0113] In one embodiment, the battery (270) may include a case (272) forming at least a portion of the exterior of the battery (270), a cell (271) housed within the case (272), a substrate (273) on which a circuit electrically connected to the cell (271) is formed, and a protective film (274) (e.g., a non-conductive film) that wraps the substrate (273) to protect the circuit of the substrate (273). The circuit formed on the substrate (273) may include, for example, a battery protection circuit. The substrate (273) may be referred to as a protection circuit module (PCM). For example, but not limited to, at least a portion of the protective film (274) may be formed integrally with the case (272).

[0114] In one embodiment, the height and / or thickness (e.g., height and / or thickness in the -Z direction) of the substrate (273) (and / or protective film (274)) may be lower than the height and / or thickness (e.g., height and / or thickness in the -Z direction) of the cell (271) (and / or case (272)). Accordingly, the battery (270) may include a stepped portion formed between the cell (271) and the substrate (273).

[0115] In one embodiment, the surface (270A) of the battery (270) may be defined by a case (272). Alternatively, the surface (270A) of the battery (270) may be defined by a case (272) and a protective film (274). In this case, the first edge (A1) of the battery (70) may be defined by the protective film (274), as with the first edge (A1').

[0116] In one embodiment, the third printed circuit board (330) may extend from the first printed circuit board (310) to the second printed circuit board (320). For example, the third printed circuit board (330) may extend from the first printed circuit board (310) across the battery (270) to the second printed circuit board (320). For example, the third printed circuit board (330) may extend from the first printed circuit board (310) across the surface (270A) of the battery (270) to the second printed circuit board (320). The third printed circuit board (330) may be placed between the battery (270) and the rear cover (e.g., 211 in FIG. 2b)) of the electronic device (300).

[0117] In one embodiment, the third printed circuit board (330) can electrically connect the first printed circuit board (310) and the second printed circuit board (320). For example, the third printed circuit board (330) may be configured to transmit an electrical signal (e.g., a radio frequency (RF) signal) between the first printed circuit board (310) and the second printed circuit board (320).

[0118] For example, the third printed circuit board (330) may include a first end (331) coupled to a connector (312) of the first printed circuit board (310), a second end (332) coupled to a connector (322) of the second printed circuit board (320), and a connecting portion (333) extending from the first end (331) to the second end (332). The connecting portion (333) may include one or more flexible portions (e.g., flexible portions (340 and 360) of FIG. 3b) and one or more rigid portions (e.g., rigid portion (350) of FIG. 3b).

[0119] For example, the third printed circuit board (330) may include a first connector (371) disposed at the first end (331) and coupled to the connector (312) of the first printed circuit board (310). For example, the connector (312) of the first printed circuit board (310) may include a receptacle or a socket, and the first connector (371) of the first end (331) may include a plug. Alternatively, the first end (331) of the third printed circuit board (330) and the first printed circuit board (310) may be coupled in a manner other than a connector-to-connector method (e.g., a connection between the conductive pads of the first end (331) and the conductive pads of the first printed circuit board (310).

[0120] For example, the third printed circuit board (330) may include a second connector (372) disposed at the second end (332) and coupled to the connector (322) of the second printed circuit board (320). For example, the connector (322) of the second printed circuit board (320) may include a receptacle or a socket, and the second connector (372) of the second end (332) may include a plug. Alternatively, the second end (332) of the third printed circuit board (330) and the second printed circuit board (320) may be coupled in a manner other than a connector-to-connector manner (e.g., a connection between the conductive pads of the second end (332) and the conductive pads of the second printed circuit board (320).

[0121] When an external impact is applied to the electronic device (300), momentary bending may occur in the electronic device (300). Due to this momentary bending of the electronic device (300), tensile force may be generated in the third printed circuit board (330). Due to the tensile force generated in the third printed circuit board (330), the connectors (371 and 372) of the first end (331) and the second end (332) may be pulled. When the connectors (371 and 372) of the first end (331) and the second end (332) are coupled to the connector (312) of the first printed circuit board (310) and the connector (322) of the second printed circuit board (320), if the first end (331) and the second end (332) are pulled, not only the connectors (371 and 372) of the first end (331) and the second end (332), but also the connectors (312 and 322) may be damaged. To reduce and / or prevent this problem, the third printed circuit board (330) may be designed to have a spare length. For example, the third printed circuit board (330) may have a length longer than the straight distance between the connector (312) of the first printed circuit board (310) and the connector (322) of the second printed circuit board (320). Due to the extra length of the third printed circuit board (330), when an external impact occurs, the third printed circuit board (330) may be deformed in a direction different from the direction in which the connectors (371 and 372) are pulled (e.g., Z-axis direction), and accordingly, damage caused by the pulling of the connectors (371 and 372) of the third printed circuit board (330) may be reduced and / or prevented. However, if the length of the third printed circuit board (330) is made too long, the rear cover (e.g., rear cover (211) in FIG. 2b) of the electronic device (300) placed on the third printed circuit board (330) (e.g., -Z direction) may lift or become loose. This may have a negative effect on the appearance and tactile feel of the electronic device (300).

[0122] To compensate for the aforementioned side effects (e.g., lifting of the rear cover and occurrence of seams) caused by simple length extension, the third printed circuit board (330) may include a pre-bending section (381). The pre-bending section (381) can compensate for excess length. The pre-bending section (381) may be placed on the substrate (273) of the battery (270). For example, the pre-bending section (381) may have a shape corresponding to the shape of the step portion between the substrate (273) of the battery (270) and the cell (271). As the pre-bending section (381) maintains a bent shape under normal conditions, the aforementioned side effects may be reduced and / or prevented. When an external shock is applied to the electronic device (300), the pre-bent section (381) can be instantly unfolded, and accordingly, the amount of shock that can be transmitted to the connector (371) of the third printed circuit board (330) can be reduced.

[0123] However, in accordance with the demand for high performance of the electronic device (300), the area occupied by internal components such as the battery (270) is increasing, and the gap between the electrical components and the mechanical components is gradually decreasing for ultra-high density mounting. At the same time, the thickness and volume of the electronic device (300) are decreasing in order to improve design aesthetics and usability. As a result, there may be insufficient space to provide a pre-bent section of the third printed circuit board (330). For example, a Z-axis clearance may be provided due to the difference in height between the cell (271) of the battery (270) and the board (273), and the first pre-bent section (381) of the third printed circuit board (330) may be located in this clearance. In contrast, the lower part of the battery (270) opposite the substrate (273) (e.g., the second edge (A2)) is such that the second rib (247) and the second printed circuit board (320) are in close proximity, and the step difference in the Z-axis direction between the second rib (247) and the second printed circuit board (320) is small, so it may be difficult to form a pre-bending section in that area. For example, if a pre-bending section is formed in the area of ​​the connection part (333) close to the second end (332), interference may occur due to the second rib (247) and / or the second printed circuit board (320), such as in the second pre-bending section (382). If the connection part (333) is not sufficiently formed near the second end (332) coupled to the connector (322) of the second printed circuit board (320), it cannot provide a cushioning effect in situations where an external force, such as a drop impact, acts on the electronic device (300), and stress may be concentrated on the connector (372) of the second end (332), which may cause damage.

[0124] Meanwhile, in order to comply with global repair regulations, easy disassembly of the battery (270) is required so that the consumer can self-repair the electronic device (300), whereas a design that securely fixes the battery (270) in the event of an external impact may be required. To this end, although not illustrated, the electronic device (300) may include a battery tape attached to the battery (270) to at least partially wrap the battery (270). The battery tape may attach the battery (270) to the frame structure (240). The battery tape may protect the battery (270). For example, the battery tape may protect the battery (270) from external impact or unintended short circuits by fixing the battery (270) to the frame structure (240). Additionally, the battery tape may facilitate the attachment and detachment of the battery (270) (e.g., since the battery (270) can be disassembled by pulling only the battery tape). To make the attachment and detachment of the battery (270) easier and to reduce the gaps that occur when the battery tape detaches from the battery (270), the adhesive area between the battery tape and the battery (270) is reduced. For example, the battery tape may cover the surface (270B) of the battery (270), the side of the battery (270) (e.g., extending from the edge of the surface (270A) to the edge of the surface (270B), and the edge area of ​​the surface (270A) of the battery (270). The battery tape may not be attached to the surface (270B) of the battery (270) and the side of the battery (270), and may be attached only to the edge area of ​​the surface (270A) of the battery (270). Since the battery tape can be removed only from a portion of the surface (270A) of the battery (270) to which the battery tape is attached, and the battery (270) can be easily removed from the battery tape, the battery tape can make it easier to disassemble the battery (270).However, the above battery tape has a weak fixing force with the battery (270), so significant movement of the battery (270) may occur upon external impact. Due to the movement of the battery (270), force may also be transmitted to the third printed circuit board (330) that crosses the battery (270). The force transmitted to the third printed circuit board (330) may act on the connectors (371 and 372) of the third printed circuit board (330) and may cause damage to the connectors (371 and 372) of the third printed circuit board (330) and the connectors (312 and 322) coupled thereto.

[0125] Additionally, to minimize RF signal loss transmitted through the third printed circuit board (330), the connection (333) may include one or more rigid portions. Since the rigid portion of the connection (333) is relatively harder and thicker than other portions of the connection (333) (e.g., flexible portions), the third printed circuit board (330) including such rigid portions may be more susceptible to connector breakage compared to other printed circuit boards (e.g., flexible printed circuit boards).

[0126] As the weight of the electronic device (300) increases, the drop impact increases, so the problem of connector breakage of the aforementioned third printed circuit board (330) may be exacerbated in high-performance models that are relatively heavy.

[0127] Accordingly, a structure may be required that can protect the third printed circuit board (330) from external shocks while ensuring the signal transmission and reception performance of the third printed circuit board (330).

[0128] Referring to FIG. 3b, according to one embodiment, the electronic device (300) may include one or more antenna radiators disposed adjacent to a second printed circuit board (320). For example, at least a portion of the first part (241) of the frame structure (240), such as one or more portions of the first part (241) adjacent to the second printed circuit board (320), may operate as the one or more antenna radiators.

[0129] In one embodiment, the third printed circuit board (330) can electrically connect the first printed circuit board (310) and the second printed circuit board (320) to transmit an RF signal between the wireless communication circuit mounted on the first printed circuit board (310) and the one or more antenna radiators adjacent to the second printed circuit board (320). For example, the third printed circuit board (330) can provide part of the RF transmission line between the wireless communication circuit and the one or more antenna radiators.

[0130] The second printed circuit board (320) may include an electrical path forming an RF transmission line between the second connector (372) of the second end (332) of the third printed circuit board (330) and the one or more antenna radiators. For example, the second printed circuit board (320) may include the one or more conductive traces extending toward the one or more antenna radiators from a connector (322) to which the second connector (372) is coupled, and the electronic device (300) may include one or more contact structures electrically connecting the one or more antenna radiators. For example, the contact structure may include a conductive elastic connector (e.g., a C-clip) disposed on the second printed circuit board (320).

[0131] In one embodiment, the third printed circuit board (330) (or connection part (333)) may include a first flexible part (or flexible section) (340), a rigid part (or rigid section) (350), and a second flexible part (360).

[0132] For example, the first flexible portion (340) may extend from the second end (332) across the second edge (A2) of the battery (270) to an inner region of the surface (270A) of the battery (270). In FIG. 3b, the portion of the second edge (A2) that intersects (or is obscured) by the first flexible portion (340) is shown as a dashed line. For example, the first flexible portion (340) may include an end (340a) opposite to the second end (332), and the end (340a) of the first flexible portion (340) may be located on or above the surface (270A) of the battery (270). The first flexible portion (340) may have a first flexibility.

[0133] For example, the rigid portion (350) may extend from the end (340a) of the first flexible portion (340) toward the first edge (A1) of the battery (270). For example, the rigid portion (350) may include the first end (350a) and a second end (350b) connected to the end (340a) of the first flexible portion (340). The first end (350a) of the rigid portion (350) may face the direction (e.g., +Y direction) of the first edge (A1) of the battery (270) and may be located on or above the surface (270A) of the battery (270). For example, the rigid portion (350) may extend from the first flexible portion (340) to the second flexible portion (360). The rigid portion (350) may have a second flexibility that is smaller than the first flexibility of the first flexible portion (340).

[0134] For example, the second flexible portion (360) may extend from the rigid portion (350) across the first edge (A1) of the battery (270) to the first end (331). In FIG. 3b, the portion of the first edge (A1) that intersects (or is obscured) by the second flexible portion (360) is shown as a dashed line. For example, the second flexible portion (360) may include a first end (360a) connected to the first end (331) and a second end (360b) connected to the first end (350a) of the rigid portion (350). The second end (360b) of the second flexible portion (360) may be located on or above the surface (270A) of the battery (270). The second flexible portion (360) may have a third degree of flexibility. For example, the third flexibility of the second flexible portion (360) may be greater than the second flexibility of the rigid portion (350). For example, the third flexibility of the second flexible portion (360) may be substantially the same as or smaller than the first flexibility of the first flexible portion (340).

[0135] In one embodiment, the first end (331) of the third printed circuit board (330) may be formed substantially rigidly. In one embodiment, the second end (332) of the third printed circuit board (330) may be formed substantially rigidly.

[0136] The third printed circuit board (330) may be referred to as a flexible printed circuit board or a rigid-flexible printed circuit board in that it includes a flexible portion and a rigid portion.

[0137] In one embodiment, the first flexible portion (340) may include a V-shaped section (342). For example, the apex (342a) of the V-shaped section (342) (e.g., a pointed or rounded V-shaped apex) may face the fourth edge (A4) of the battery (270) (e.g., -X direction). In another example, unlike the illustration, the apex (342a) of the V-shaped section (342) may face the third edge (A3) of the battery (270) (e.g., +X direction). In one embodiment, the V-shaped section (342) of the first flexible portion (340) may be located on or above the surface (270A) of the battery (270).

[0138] For example, the V-shaped section (342) may include a first diagonal section and a second diagonal section. For example, the first diagonal section may extend from the second end (350b) of the rigid section (350) in a diagonal direction (e.g., diagonal direction between the -Y direction and the -X direction) in the extension direction (e.g., -Y direction) of the first section (354) of the rigid section (350). For example, an imaginary line segment may be defined extending from the second end (350b) of the rigid section (350) parallel to the first section (354) of the rigid section (350). The first diagonal section may be extended such that the distance from the second end (350b) of the rigid section (350) to the imaginary line segment increases. The second diagonal section may extend from the first diagonal section. The point where the first diagonal section and the second diagonal section meet may be the vertex (342a) of the V-shaped section (342). For example, the second diagonal section may be extended from the first diagonal section to form the vertex (342a) of the V. For example, the second diagonal section may be extended in a diagonal direction (e.g., diagonal direction between the -Y direction and the +X direction) in the extension direction of the first diagonal section (e.g., diagonal direction between the -Y direction and the -X direction). For example, the second diagonal section may be extended from the first diagonal section so that the distance to the imaginary line segment becomes shorter.

[0139] In one embodiment, the first flexible portion (340) may include a section (344) extending from the second end (332) across the second edge (A2) of the battery (270) to a V-shaped section (342). For example, the section (344) of the first flexible portion (340) may extend in a direction substantially perpendicular to the second edge (A2) of the battery (270) (e.g., +Y direction).

[0140] For example, the second end (350b) of the rigid part (350), which is connected to the first flexible part (340), may be directed toward the second end (332) (or the connector (322) of the second printed circuit board (320)).

[0141] In one embodiment, the rigid portion (350) may include a first section (354) extending from the end (340a) of the first flexible portion (340) toward the first end (350a) of the rigid portion (350), and a second section extending from the first section (354) to the second end (360b) of the second flexible portion (360). For example, the first section (354) of the rigid portion (350) may extend in a direction different from the second section of the rigid portion (350). For example, the first section (354) of the rigid part (350) may be extended from the end (340a) of the first flexible part (340) in a direction parallel to the section (344) of the first flexible part (340), for example, in a direction perpendicular to the second edge (A2) of the battery (270) (e.g., +Y direction).

[0142] In one embodiment, the second connector (372) of the second end (332) may include a long side (372a) and a short side (372b) substantially perpendicular to the long side (372a). In one embodiment, the second connector (372) may be positioned such that the short side (372b) faces the direction of the first printed circuit board (310) (e.g., the +Y direction). For example, the short side (372b) of the second connector (372) may be substantially parallel to the second edge (A2).

[0143] In one embodiment, the width of the section (e.g., section (344)) drawn out from the second end (332) may be reduced compared to the width of the section drawn out from the second end (332) when the second connector (372) is rotated 90 degrees relative to the illustrated example. Since the section drawn out from the second end (332) is located on the second printed circuit board (320), it may be difficult to mount components in the area below it. That is, by making the short side (372b) of the second connector (372) face the direction of the first printed circuit board (310), the loss of mounting area of ​​the second printed circuit board (320) caused by the section drawn out from the second end (332) can be reduced.

[0144] Alternatively, unlike the illustrated example, the second connector (372) may be positioned such that its long side (372a) faces the direction of the first printed circuit board (310) (e.g., +Y direction). For example, the long side (372a) of the second connector (372) may be substantially parallel to the second edge (A2). In this case, the width of the section (e.g., section (344)) drawn from the second end (332) may be increased compared to the width of the section drawn from the second end (332) in the illustrated example. As the width of the section drawn from the second end (332) is relatively increased, the stress acting on the second connector (372) due to the pulling of the second end (332) may be reduced (or the force may be distributed).

[0145] The description of the second connector (372) described above may also be applied substantially in the same, similarly, or in a corresponding manner to the connector (322) of the second printed circuit board (320), which has a size and / or shape corresponding to the second connector (372) so as to be coupled with the second connector (372).

[0146] In one embodiment, the first flexible portion (340), particularly the V-shaped section (342) of the first flexible portion (340), can reduce and / or prevent damage to the second connector (372) caused by the third printed circuit board (330) being pulled. This is explained with reference to FIGS. 4, 5a, and 5b.

[0147] FIG. 4 shows an electronic device according to a comparative example. FIG. 5a shows a third printed circuit board deformed by the flow of a battery according to a comparative example. FIG. 5b shows a third printed circuit board deformed by the flow of a battery according to one embodiment.

[0148] Referring to FIG. 4, the electronic device (402) according to the comparative example may include a third printed circuit board (430) connected to a first printed circuit board (310) and a second printed circuit board (320). The third printed circuit board (430) of the comparative example may extend from the first printed circuit board (310) across the battery (270) to the second printed circuit board (320).

[0149] The third printed circuit board (430) of the comparative example may include a first end (431) coupled to the first printed circuit board (310) and a second end (432) coupled to the second printed circuit board (320). The second end (432) may include a second connector (472) coupled to the connector of the second printed circuit board (320).

[0150] The third printed circuit board (430) of the comparative example may include a first flexible portion (440) extending from the second end (432), a rigid portion (450) extending from the first flexible portion (440), and a second flexible portion (460) extending from the rigid portion (450) to the first end (431).

[0151] Referring to FIG. 3b and FIG. 4, the length of the rigid portion (450) of the comparative example may be longer than the length of the rigid portion (350) of the first embodiment. The length of the first flexible portion (440) of the comparative example may be shorter than the length of the first flexible portion (340) of the first embodiment. The first flexible portion (440) of the comparative example may not include a section that extends by bypassing (i.e., by a length longer than a straight path) from the rigid portion (350) toward the second end (332), such as the V-shaped section (342) of the first flexible portion (340) of the first embodiment. For example, the first flexible portion (440) of the comparative example may extend substantially straight from the rigid portion (450) to the second end (432).

[0152] Referring to FIG. 5a, a specified external force may be applied to the battery (270) of the electronic device (402) according to the comparative example. Accordingly, the battery (270) of the comparative example may be lifted upward by a first distance (L1) (e.g., in the -Z direction). The first distance (L1) may be the magnitude of the displacement of the second edge (A2) of the battery (270) from the reference plane (R1) (e.g., a plane parallel to the second end (432) or the second printed circuit board (320)) due to the specified external force applied to the battery (270). As the second edge (A2) of the battery (270) moves by the first distance (L1) from the reference plane (R1), the first flexible part (440) may also be lifted upward by the first distance (L1). As the first flexible part (440) is lifted upward by the first distance (L1), a force (F1) in the direction in which the second end (432) is pulled can be applied to the second end (432) (or second connector (472)).

[0153] Referring to FIG. 5b, the specified external force may be applied to the battery (270) of the electronic device (300) according to one embodiment (e.g., an external force of the same magnitude and direction as the external force applied to the battery (270) of FIG. 5a). Accordingly, the battery (270) according to one embodiment may be lifted upward by a second distance (L2) (e.g., in the -Z direction). The second distance (L2) may be the magnitude of the displacement of the second edge (A2) of the battery (270) from the reference plane (R2) (e.g., a plane parallel to the second end (332) or the second printed circuit board (320)) due to the specified external force applied to the battery (270). As the second edge (A2) of the battery (270) moves by the second distance (L2) from the reference plane (R2), the first flexible part (340) may also be lifted upward by the second distance (L2). As the first flexible part (340) is lifted upward by a second distance (L2), a force (F2) in the direction in which the second end (332) is pulled may be applied to the second end (332) (or second connector (372)).

[0154] Referring to FIG. 5a and FIG. 5b, the second distance (L2) of one embodiment may be greater than the first distance (L1) of a comparative example. Accordingly, the degree to which the first flexible part (340) is lifted upward (e.g., the second distance (L2)) may be greater than the degree to which the first flexible part (440) is lifted upward (e.g., the first distance (L1)). This may be because the first flexible part (340) is longer than the first flexible part (440). Additionally, this may be because the first flexible part (340) includes a path that detours for a length longer than the straight distance through the V-shaped section (342), whereas the first flexible part (440) extends substantially straight. Additionally, this may be because the first flexible portion (340) undergoes twisting deformation in the Z-axis direction as well as in the X-axis and / or Y-axis direction through the V-shaped section (342). Additionally, this may be because the length of the rigid portion (350) is shorter than the length of the rigid portion (450).

[0155] Accordingly, the magnitude of the force (F2) acting on the second end (332) may be smaller than the magnitude of the force (F1) acting on the second end (432). This may be because the force acting in the first direction (e.g., the direction of the force (F2)) that causes the first flexible part (340) to pull the second end (332) is distributed into a deformation in a second direction different from the first direction (e.g., a direction corresponding to the second distance (L2)). That is, since the degree to which the force acting in the first direction is distributed through the first flexible part (340) is greater than the degree to which the force acting in the first direction is distributed through the first flexible part (440), the magnitude of the force (F2) may be smaller than the magnitude of the force (F1). Additionally, this may be because the first flexible part (340) is provided with sufficient clearance length while undergoing twisting deformation in the X-axis and / or Y-axis directions as well as in the Z-axis direction through the V-shaped section (342). Additionally, the magnitude of the force (F1) being greater than the magnitude of the force (F2) may be because the first flexible part (440) is lifted by a first distance (L1) in the +Z direction and the clearance length is completely exhausted, resulting in a greater tensile force than that of the first flexible part (340).

[0156] Accordingly, damage to the connector (372) can be reduced and / or prevented due to the lifting of the third printed circuit board (330).

[0157] FIGS. 6a and 6b are drawings showing the behavior of a third printed circuit board during a drop test according to one embodiment. FIG. 6c shows an electronic device according to one embodiment.

[0158] Referring to 601 in FIG. 6a, a test may be performed in which the electronic device (600) is dropped onto the ground (608). Accordingly, a primary impact may be applied to the electronic device (600). The electronic device (600) may be dropped at an angle of approximately 45 degrees so that the top corner (605) of the electronic device (600) collides with the ground (608). This may be a condition in which maximum tensile stress occurs on the second connector (672) of the third printed circuit board (630).

[0159] Referring to 602 in FIG. 6a, when a first shock is applied to the electronic device (600), there may be no special behavior in the battery (270) and the third printed circuit board (630).

[0160] Referring to 603 in FIG. 6b, due to the repulsive force from the first impact, the lower part (607) of the electronic device (600) collides with the ground (608), thereby applying a second impact to the electronic device (600).

[0161] Referring to 604 in FIG. 6b, the battery (270) may be lifted due to a secondary impact. Due to the phenomenon of the battery (270) being lifted, the third printed circuit board (630) may be pulled. As a result, the second connector (672) may be subjected to pulling stress.

[0162] In a test such as FIG. 6a and FIG. 6b, the stress received by the second connector (372) of the third printed circuit board (330) according to one embodiment may be about 106 MPa. In a test such as FIG. 6a and FIG. 6b, the stress received by the second connector (472) of the third printed circuit board (430) according to a comparative example may be about 165 MPa. By including the first flexible portion (340) and the V-shaped section (342) of the first flexible portion (340) in the third printed circuit board (330) according to one embodiment, the stress applied to the second connector (372) may be reduced by about 36% compared to the case of the comparative example.

[0163] Referring to FIG. 6c, in one embodiment, when viewed from above, the surface (270A) of the battery (270) may include three divided regions (10, 20, and 30). For example, the regions (10, 20, and 30) may be defined by dividing the surface (270A) of the battery (270) along the vertical direction (e.g., the direction perpendicular to the first edge (A1) and / or the second edge (A2)) (e.g., the Y-axis direction) so that it is divided along the horizontal direction (e.g., the direction parallel to the first edge (A1) and / or the second edge (A2)) (e.g., the X-axis direction).

[0164] For example, the first region (10) may extend from the first edge (A1) (e.g., the whole) toward the second edge (A2). For example, the third region (30) may extend from the second edge (A2) (e.g., the whole) toward the first edge (A1). The second region (20) may be located between the first region (10) and the third region (30). The areas of the first region (10), the second region (20), and the third region (30) may be substantially the same as each other.

[0165] For example, the surface (270A) of the battery (270) may include regions (11, 12, 13, 21, 22, 22, 23, 31, 32, and 33) arranged in a 3x3 matrix form so as to have substantially the same area when the battery (270) is viewed from above.

[0166] For example, the first region (10) may include three sub-regions (or partial regions) (11, 12, and 13) when viewed from above the battery (270). For example, the sub-regions (11, 12, and 13) may be defined by dividing the first region (10) in a vertical direction (e.g., a direction perpendicular to the first edge (A1) and / or the second edge (A2)) (e.g., Y-axis direction) and dividing it in a horizontal direction (e.g., a direction parallel to the first edge (A1) and / or the second edge (A2)) (e.g., X-axis direction).

[0167] For example, the second region (20) may include three sub-regions (or partial regions) (21, 22, and 23) when viewed from above the battery (270). For example, the sub-regions (21, 22, and 23) may be defined by dividing the second region (20) in a horizontal direction (e.g., a direction parallel to the first edge (A1) and / or the second edge (A2)) (e.g., X-axis direction) so that the second region (20) is divided in a vertical direction (e.g., a direction perpendicular to the first edge (A1) and / or the second edge (A2)) (e.g., Y-axis direction).

[0168] For example, the third region (30) may include three sub-regions (or partial regions) (31, 32, and 33) that are divided when the battery (270) is viewed from above. For example, the sub-regions (31, 32, and 33) may be defined by dividing the third region (30) in a horizontal direction (e.g., a direction parallel to the first edge (A1) and / or the second edge (A2)) (e.g., the X-axis direction) so that the third region (30) is divided in a vertical direction (e.g., a direction perpendicular to the first edge (A1) and / or the second edge (A2)) (e.g., the Y-axis direction).

[0169] For example, the first sub-region (11) of the first region (10) may be adjacent to the third edge (A3) of the battery (270). The third sub-region (13) of the first region (10) may be adjacent to the fourth edge (A4) of the battery (270). The second sub-region (12) of the first region (10) may be located between the first sub-region (11) and the third sub-region (13).

[0170] For example, the first sub-region (21) of the second region (20) may be adjacent to the third edge (A3) of the battery (270). The third sub-region (23) of the second region (20) may be adjacent to the fourth edge (A4) of the battery (270). The second sub-region (22) of the second region (20) may be located between the first sub-region (21) and the third sub-region (23).

[0171] For example, the first sub-region (31) of the third region (30) may be adjacent to the third edge (A3) of the battery (270). The third sub-region (33) of the third region (30) may be adjacent to the fourth edge (A4) of the battery (270). The second sub-region (32) of the third region (30) may be located between the first sub-region (31) and the third sub-region (33).

[0172] In one embodiment, the first flexible portion (340) may be positioned within the third area (30) among the first area (10), the second area (20), and the third area (30). For example, the V-shaped section (342) of the first flexible portion (340) may be positioned within the third area (30) among the first area (10), the second area (20), and the third area (30). Even if it is difficult to form a pre-bending section to provide a clearance length around the second edge (A2), by positioning the V-shaped section (342) of the third printed circuit board (330) within the third area (30) adjacent to the second edge (A2), a clearance length that relieves the pulling of the connector (372) can be provided.

[0173] In one embodiment, the first flexible portion (340) may be positioned within the first sub-region (31) or the third sub-region (33) among the sub-regions (31, 32, and 33) of the third region (30). For example, the V-shaped section (342) of the first flexible portion (340) may be positioned within the first sub-region (31) or the third sub-region (33) among the sub-regions (31, 32, and 33) of the third region (30). This is because the flow of the battery (270) occurring in the first sub-region (31) and the third sub-region (33) is greater than the flow of the battery (270) occurring in the second sub-region (32), so by placing the V-shaped section (342) of the third printed circuit board (330) within the first sub-region (31) or the third sub-region (33), the effect of reducing the stress acting on the connector (372) can be maximized. For example, when the V-shaped section (342) is located within the first sub-region (31) or the third sub-region (33), the stress acting on the connector (372) of the third printed circuit board (330) due to the lifting of the battery (270) may be smaller than the stress acting on the connector (372) of the third printed circuit board (330) due to the lifting of the battery (270) when the V-shaped section (342) is located within the second sub-region (32).

[0174] FIG. 7 is a stacking diagram of a third printed circuit board according to one embodiment.

[0175] The third printed circuit board (330) may include a plurality of layers. For example, the plurality of layers of the third printed circuit board (330) may include one or more conductive layers and one or more non-conductive layers. The one or more conductive layers may be alternately laminated on the one or more non-conductive layers, but are not limited thereto. For example, the plurality of non-conductive layers may include a first non-conductive layer and a second non-conductive layer. The second non-conductive layer may be laminated on the first non-conductive layer without the interposition of a conductive layer. The conductive layer may be formed of an electrically conductive material (e.g., copper). The non-conductive layer may be formed of an electrically non-conductive material (e.g., resin).

[0176] In FIG. 7, exemplary layer structures of the first end (331), second flexible portion (360), rigid portion (350), first flexible portion (340), and second end (332) of the third printed circuit board (330) are illustrated, but are not limited to the illustrated examples and various design variations may be possible.

[0177] Referring to FIG. 7, according to one embodiment, a third printed circuit board (330) may include a first non-conductive layer (713), a first conductive layer (711) formed on a first surface of the first non-conductive layer (713), and a second conductive layer (712) formed on a second surface of the first non-conductive layer (713).

[0178] In one embodiment, the first conductive layer (711), the second conductive layer (712), and the first non-conductive layer (713) may extend across the first end (331), the second flexible portion (360), the rigid portion (350), the first flexible portion (340), and the second end (332). That is, the first end (331), the second flexible portion (360), the rigid portion (350), the first flexible portion (340), and the second end (332) may include the first conductive layer (711), the second conductive layer (712), and the first non-conductive layer (713). The first conductive layer (711) and the second conductive layer (712) may be formed of an electrically conductive material (e.g., copper). The first non-conductive layer (713) can be formed of an electrically non-conductive material (e.g., polyimide).

[0179] In one embodiment, the third printed circuit board (330) may include one or more non-conductive layers (720). The one or more non-conductive layers (720) may be included in the first end (331), the rigid portion (350), and the second end (332), and may not be included in the first flexible portion (340) and the second flexible portion (360).

[0180] One or more non-conductive layers (720) may include, for example, non-conductive layers (721, 722, and 723). For example, the non-conductive layer (721) may include a bonding sheet. The non-conductive layer (721) may be placed on the first conductive layer (711). For example, the non-conductive layer (722) may be formed of a non-conductive material (e.g., polyimide). For example, the non-conductive layer (722) may be placed on the non-conductive layer (721). For example, the non-conductive layer (723) may include an adhesive layer. For example, the non-conductive layer (723) may be placed on the non-conductive layer (722).

[0181] According to one embodiment, the third printed circuit board (330) may include a third conductive layer (714). The third conductive layer (714) may be formed of an electrically conductive material (e.g., copper). The third conductive layer (714) may be disposed on one or more non-conductive layers (720). For example, the third conductive layer (714) may be disposed on a non-conductive layer (723). In one embodiment, the third conductive layer (714) may be included in the first end (331), the rigid portion (350), and the second end (332), and may not be included in the first flexible portion (340) and the second flexible portion (360).

[0182] According to one embodiment, the third printed circuit board (330) may include a second non-conductive layer (741) and a third non-conductive layer (742). The second non-conductive layer (741) and the third non-conductive layer (742) may include, for example, a photo solder resist (PSR). The second non-conductive layer (741) and the third non-conductive layer (742) may be included in the first end (331), the rigid portion (350), and the second end (332), and may not be included in the first flexible portion (340) and the second flexible portion (360).

[0183] In one embodiment, the second non-conductive layer (741) may be formed on the second conductive layer (712) included in the first end (331), the rigid portion (350), and the second end (332). The second non-conductive layer (741) may protect the second conductive layer (712) from the external environment by at least partially covering the second conductive layer (712) included in the first end (331), the rigid portion (350), and the second end (332).

[0184] In one embodiment, the third non-conductive layer (742) may be formed on the third conductive layer (714) included in the first end (331), the rigid portion (350), and the second end (332). The third non-conductive layer (742) may protect the third conductive layer (714) from the external environment by at least partially covering the third conductive layer (714) included in the first end (331), the rigid portion (350), and the second end (332).

[0185] In one embodiment, the third printed circuit board (330) may include a first protective layer (751) and a second protective layer (752). The first protective layer (751) and the second protective layer (752) may be formed of a non-conductive material. The first protective layer (751) and the second protective layer (752) may include a coverlay film.

[0186] In one embodiment, the first protective layer (751) and the second protective layer (752) may be included in the first flexible portion (340) and the second flexible portion (360), but may not be included in the first end (331), the rigid portion (350), and the second end (332).

[0187] In one embodiment, the first protective layer (751) may be disposed on the second conductive layer (712) to cover the second conductive layer (712) included in the first flexible portion (340) and the second flexible portion (360) (e.g., attached). The first protective layer (751) may be formed flexibly.

[0188] In one embodiment, the second protective layer (752) may be disposed on the first conductive layer (711) to cover the first conductive layer (711) included in the first flexible portion (340) and the second flexible portion (360) (e.g., attached). The second protective layer (752) may be formed flexibly.

[0189] In one embodiment, the first flexible portion (340) and the second flexible portion (360) may have improved flexibility by not including the second non-conductive layer (741) and the third non-conductive layer (742). As flexibility is improved, the first flexible portion (340) and the second flexible portion (360) may stretch and / or bend better. Accordingly, the damage to the connectors (371 and 372) of the third printed circuit board (330) due to external forces acting on the third printed circuit board (330) may be reduced and / or prevented.

[0190] In one embodiment, the first flexible portion (340) and the second flexible portion (360) may have improved flexibility by not including a third conductive layer (714) corresponding to a rigid material. As flexibility is improved, the first flexible portion (340) and the second flexible portion (360) may stretch and / or bend better. Accordingly, the damage to the connectors (371 and 372) of the third printed circuit board (330) due to external forces acting on the third printed circuit board (330) may be reduced and / or prevented.

[0191] Although not illustrated, each of the first end (331), the rigid portion (350), and the second end (332) may include one or more conductive vias for vertically routing between the conductive layers (711, 712, 714). Through the one or more conductive vias, the interlayer ground may be coupled. Accordingly, the performance of the third printed circuit board (330) may be improved. For example, the RF circuit stability of the third printed circuit board (330) may be enhanced. For example, the noise of the RF signal transmitted through the third printed circuit board (330) may be reduced.

[0192] FIG. 8a shows a first layer of a third printed circuit board according to one embodiment. FIG. 8b shows a second layer of a third printed circuit board according to one embodiment. FIG. 8c shows a third layer of a third printed circuit board according to one embodiment. FIG. 8d shows the second layer and the third layer of a third printed circuit board according to one embodiment. FIG. 8e is a cross-sectional view of a third printed circuit board according to one embodiment. FIG. 8f is a graph showing the RF characteristics of a third printed circuit board according to one embodiment. FIG. 8e may be a cross-sectional view along line 8E-8E' of FIG. 8d. The graphs of FIG. 8f are graphs showing the insertion loss of the third printed circuit board (330) under various conditions.

[0193] Referring to FIG. 8a, according to one embodiment, a third non-conductive layer (742) of a third printed circuit board (330) may be included in the second end (332) and the rigid portion (350), but may not be included in the first flexible portion (340). For example, the first flexible portion (340) may include a second protective layer (752) instead of the third non-conductive layer (742). Although not illustrated, a second non-conductive layer (741) of the third printed circuit board (330) may be included in the second end (332) and the rigid portion (350), but may not be included in the first flexible portion (340). For example, the first flexible portion (340) may include a first protective layer (751) instead of the second non-conductive layer (741). Accordingly, the flexibility of the first flexible portion (340) can be improved. As the flexibility of the first flexible portion (340) is improved, the first flexible portion (340) can be stretched and / or bent more easily. Accordingly, damage to the second connector (372) of the third printed circuit board (330) due to external forces acting on the third printed circuit board (330) can be reduced and / or prevented.

[0194] Referring to FIG. 8b, according to one embodiment, a third printed circuit board (330) (or the second layer of the third printed circuit board (330)) may include at least one conductive path (or signal line) (or conductive line) (or conductive trace) (e.g., one or more of a plurality of signal lines (810)) for transmitting an RF signal. For example, the at least one conductive path of the third printed circuit board (330) may include a first portion within a rigid portion (350) of the third printed circuit board (330) and a second portion within a first flexible portion (340) of the third printed circuit board (330). The second portion of the at least one conductive path may extend from the first portion of the at least one conductive path. Additionally, the third printed circuit board (330) (or the second layer of the third printed circuit board (330)) may include a ground region (884) that extends along the first portion of the at least one conductive path and is disconnected along the second portion of the at least one conductive path.

[0195] According to one embodiment, the first flexible portion (340) may include a first non-conductive layer (713) and a plurality of signal lines (810) (e.g., a first conductive layer (711)) formed on a first surface of the first non-conductive layer (713).

[0196] In one embodiment, a plurality of signal lines (810) may be separated from each other by non-conductive regions (713A) defined by a first non-conductive layer (713). The non-conductive regions (713A) may separate the second portion of the conductive path (e.g., a plurality of signal lines (810)) from the ground region (884). The non-conductive regions (713A) may be fill-cut regions of the first conductive layer (711). The non-conductive regions (713A) may be ground fill-cut regions of the first conductive layer (711). The non-conductive regions (713A) may be regions from which the conductive material of the first conductive layer (711) has been removed.

[0197] In one embodiment, the first surface of the first non-conductive layer (713) of the first flexible portion (340) may include a region where a plurality of signal lines (810) are formed and a remaining region defining non-conductive regions (713A). For example, the first conductive layer (711) formed on the first surface of the first non-conductive layer (713) may include only the plurality of signal lines (810). For example, the first conductive layer (711) formed on the first surface of the first non-conductive layer (713) may be entirely removed except for the plurality of signal lines (810). Accordingly, the flexibility of the first flexible portion (340) may be improved.

[0198] In one embodiment, a plurality of signal lines (810) may include a first group of signal lines (811) and a second group of signal lines (812). The first group of signal lines (811) may be positioned adjacent to a first side (340A) of the first flexible part (340). The second group of signal lines (812) may be positioned adjacent to a second side (340B) of the first flexible part (340), opposite to the first side (340A). For example, the first group of signal lines (811) may be positioned between the first side (340A) of the first flexible part (340) and the second group of signal lines (812).

[0199] Referring to FIG. 8c, according to one embodiment, the first flexible portion (340) of the third printed circuit board (330) (or the third layer of the third printed circuit board (330)) may include a second conductive layer (712) (or ground layer (712)) formed on a second surface of the first non-conductive layer (713). In one embodiment, the second conductive layer (712) may include a plurality of holes (801) arranged along a first side (340A) of the first flexible portion (340).

[0200] In one embodiment, the second conductive layer (712) may include one or more slits (802) extending along the longitudinal direction of the first flexible portion (340). The one or more slits (802) may be areas within the second conductive layer (712) from which the conductive material has been removed. The one or more slits (802) may be positioned closer to the second side (340B) than to the first side (340A) of the first flexible portion (340).

[0201] Referring to FIG. 8c together with FIG. 8b, one or more slits (802) may be aligned with one or more signal lines of the second group of signal lines (812). For example, one or more slits (802) may extend along one or more signal lines of the second group of signal lines (812) (e.g., each). For example, one or more slits (802) may include a plurality of slits. Each of the plurality of slits may extend along corresponding signal lines of the second group of signal lines (812).

[0202] Referring to FIG. 8b, in one embodiment, the wireless communication circuit may be configured to transmit and / or receive RF signals for SISO (single input single output) operation or MIMO (multiple input multiple output) through a first group of signal lines (811). In one embodiment, the wireless communication circuit may be configured to transmit and / or receive RF signals for MIMO operation among SISO operation and MIMO operation through a second group of signal lines (812). For example, the first group of signal lines (811) may be used for main antenna(s), and the second group of signal lines (812) may be used for sub-antenna(s). For example, the first group of signal lines (811) may be electrically connected to the main antenna (or first antenna group), and the second group of signal lines (812) may be electrically connected to the sub-antenna (or second antenna group).

[0203] Referring to FIG. 8d and FIG. 8e, in one embodiment, a first group of signal lines (811) may include a first signal line (811a), a second signal line (811b), a third signal line (811c), and a fourth signal line (811d). The first group of signal lines (811) may further include a fifth signal line (811e). A second group of signal lines (812) may include a first signal line (812a), a second signal line (812b), a third signal line (812c), and a fourth signal line (812d). The first signal line (812a), the second signal line (812b), and the third signal line (812c) may be positioned between the fourth signal line (811d) and the fifth signal line (811e). One or more slits (802) may include a first slit (802a), a second slit (802b), and a third slit (802c).

[0204] When viewed from above, the third printed circuit board (330) may have a plurality of holes (801) extending along the first signal line (811a). For example, the plurality of holes (801) may overlap with the first signal line (811a).

[0205] The first slit (802a) may be aligned with the first signal line (812a) and / or the second signal line (812b). For example, the first slit (802a) may extend along the first signal line (812a) and / or the second signal line (812b). For example, when viewed from above, the first slit (802a) may be positioned between the first signal line (812a) and the second signal line (812b).

[0206] The second slit (802b) may be aligned with the second signal line (812b) and / or the third signal line (812c). For example, the second slit (802b) may extend along the second signal line (812b) and / or the third signal line (812c). For example, when viewed from above, the second slit (802b) may be positioned between the second signal line (812b) and the third signal line (812c).

[0207] The third slit (802c) may be aligned with the third signal line (812c) and / or the fourth signal line (812d). For example, the third slit (802c) may extend along the third signal line (812c) and / or the fourth signal line (812d). For example, when viewed from above, the third slit (802c) may be positioned between the third signal line (812c) and the fourth signal line (812d).

[0208] The flexibility of the first flexible portion (340) can be improved by including a plurality of holes (801) and one or more slits (802) in the first flexible portion (340). In addition, the impedance characteristics of the RF signal transmitted from the third printed circuit board (330) can be improved through the plurality of holes (801) and one or more slits (802) of the first flexible portion (340). For example, referring to FIG. 8f, the insertion loss characteristics of the third printed circuit board (330) can be gradually reduced with frequency, and a sudden loss change (dip) may not occur in a specific frequency band. That is, the third printed circuit board (330) can stably transmit the RF signal.

[0209] FIG. 9a shows a third printed circuit board according to a comparative example. FIG. 9b is a graph showing the insertion loss of the third printed circuit board of FIG. 9a.

[0210] Referring to FIG. 9a, according to a comparative example, the first layer of the first flexible portion (940) of the third printed circuit board (930) may include a second protective layer (952) (e.g., the second protective layer (752) of FIG. 7). The length of the first flexible portion (940) may be smaller than the length of the first flexible portion (340) according to one embodiment.

[0211] According to a comparative example, the second layer of the first flexible portion (940) of the third printed circuit board (930) may include a first conductive layer (911) (e.g., the first conductive layer (711) of FIG. 7). The first conductive layer (911) may include a plurality of signal lines (910) and a ground fill area disposed between the plurality of signal lines (910).

[0212] According to a comparative example, the third layer of the first flexible portion (940) of the third printed circuit board (930) may include a second conductive layer (912) (e.g., the second conductive layer (712) of FIG. 7). The second conductive layer (912) may not include a plurality of holes (801) and one or more slits (802) of the second conductive layer (712) according to one embodiment.

[0213] Due to the differences described above, the RF performance of the third printed circuit board (930) of the comparative example may be degraded compared to the RF performance of the third printed circuit board (330) according to one embodiment. For example, referring to FIG. 9b, a null phenomenon in which the insertion loss of a specific RF signal degrades in a specific frequency band can be observed.

[0214] FIG. 10a shows a third printed circuit board according to a comparative example. FIG. 10b is a graph showing the insertion loss of the third printed circuit board of FIG. 10a.

[0215] Referring to FIG. 10a, according to a comparative example, the first layer of the first flexible portion (1040) of the third printed circuit board (1030) may include a second protective layer (1052) (e.g., the second protective layer (752) of FIG. 7). The length of the first flexible portion (1040) may be shorter than the length of the first flexible portion (340) according to one embodiment. However, the length of the first flexible portion (1040) may be longer than the length of the first flexible portion (940) of FIG. 9a.

[0216] According to a comparative example, the second layer of the first flexible portion (1040) of the third printed circuit board (1030) may include a first conductive layer (1011) (e.g., the first conductive layer (711) of FIG. 7). The first conductive layer (1011) may include only a plurality of signal lines (1010).

[0217] According to a comparative example, the third layer of the first flexible portion (1040) of the third printed circuit board (1030) may include a second conductive layer (1012) (e.g., the second conductive layer (712) of FIG. 7). The second conductive layer (1012) may not include a plurality of holes (801) and one or more slits (802) of the second conductive layer (712) according to one embodiment.

[0218] Due to the differences described above, as illustrated in FIG. 10b, the RF performance of the third printed circuit board (1030) according to the comparative example may be improved compared to the RF performance of the third printed circuit board (930), but may be degraded compared to the RF performance of the third printed circuit board (330) according to one embodiment.

[0219] FIG. 11a shows a third printed circuit board according to a comparative example. FIG. 11b is a graph showing the insertion loss of the third printed circuit board of FIG. 11a.

[0220] Referring to FIG. 11a, according to a comparative example, the first flexible portion (1140) of the third printed circuit board (1130) may include a V-shaped section (1152) (e.g., a V-shaped section (342)).

[0221] According to a comparative example, the first layer of the first flexible portion (1140) of the third printed circuit board (1130) may include a second protective layer (1152) (e.g., the second protective layer (752) of FIG. 7). The length of the first flexible portion (1140) may be shorter than the length of the first flexible portion (340) according to one embodiment. However, the length of the first flexible portion (1140) may be longer than the length of the first flexible portion (940) of FIG. 9a and the length of the first flexible portion (1040) of FIG. 10a.

[0222] According to a comparative example, the second layer of the first flexible portion (1140) of the third printed circuit board (1130) may include a first conductive layer (1111) (e.g., the first conductive layer (711) of FIG. 7). The first conductive layer (1111) may include only a plurality of signal lines (1110).

[0223] According to a comparative example, the third layer of the first flexible portion (1140) of the third printed circuit board (1130) may include a second conductive layer (1112) (e.g., the second conductive layer (712) of FIG. 7). The second conductive layer (1112) may include a plurality of holes (1101) (e.g., a plurality of holes (801)), but may not include one or more slits (802) according to one embodiment.

[0224] Due to the differences described above, as illustrated in FIG. 11b, the RF performance of the third printed circuit board (1130) according to the comparative example may be degraded compared to the RF performance of the third printed circuit board (330) according to one embodiment. However, the performance of some RF signals is degraded compared to the third printed circuit board (930) and / or the third printed circuit board (1030), which may be because the vertical length of the first flexible portion (1140) and the overall length due to the V-shaped section (1152) are increased, while the length of the rigid portion (1150) is shortened.

[0225] FIGS. 12a, FIGS. 12b, FIGS. 12c, FIGS. 12d, FIGS. 12e, FIGS. 12f, and FIGS. 12g show examples of a second conductive layer of a first flexible portion according to one embodiment.

[0226] Referring to FIG. 12a, the second conductive layer (712) of the first flexible portion (340) may include a plurality of holes (801) arranged along the first side (340A) of the first flexible portion (340). The shape of each of the plurality of holes (801) may be circular, but is not limited thereto. For example, referring to FIG. 12b, the shape of each of the plurality of holes (801B) may be triangular. The plurality of holes (801B) may include first holes having a first triangular shape and second holes having a second triangular shape arranged alternately with the first holes and symmetrical to the first triangular shape. As another example, referring to FIG. 12c, each of the plurality of holes (801C) may have a square shape. The plurality of holes (801C) may be arranged so that the vertices of the square shape face each other.

[0227] Referring to FIG. 12d, the second conductive layer (712) of the first flexible portion (340) may further include a plurality of holes (1201) arranged along the second side (340B) of the first flexible portion (340).

[0228] Referring to FIG. 12e, the second conductive layer (712) of the first flexible portion (340) may further include one or more first slits (1201E) that extend along the longitudinal direction of the first flexible portion (340) and are disposed between a plurality of holes (801) and a plurality of holes (1201), and one or more second slits (1202E) that extend along the longitudinal direction of the first flexible portion (340) and are disposed between one or more first slits (1201E) and a plurality of holes (1201).

[0229] One or more first slits (1201E) and one or more second slits (1202E) are depicted as extending straight without interruption in the second conductive layer (712), but are not limited thereto. For example, referring to FIG. 12f, the second conductive layer (712) of the first flexible portion (340) may include a plurality of first slits (1201F) and a plurality of second slits (1202F). Each of the plurality of first slits (1201F) may include a plurality of sub-slits separated from one another. Each of the plurality of second slits (1202F) may include a plurality of second sub-slits separated from one another. A plurality of first sub-slits included in each of a plurality of first slits (1201F) may be arranged so as to be offset from adjacent first sub-slits, and a plurality of second sub-slits included in each of a plurality of second slits (1202F) may be arranged so as to be offset from adjacent second sub-slits, but are not limited thereto. For example, referring to FIG. 12g, a plurality of first sub-slits included in each of a plurality of first slits (1201G) may be aligned with adjacent first sub-slits, and a plurality of second sub-slits included in each of a plurality of second slits (1202G) may be aligned with adjacent second sub-slits.

[0230] FIG. 13 shows an electronic device according to one embodiment.

[0231] According to one embodiment, the electronic device (300) may include a fourth printed circuit board (1330) and an antenna module (1370). The antenna module (1370) may include a substrate (1375) comprising a plurality of antennas. In one embodiment, the antenna module (1370) (or printed circuit board (1375)) may be positioned adjacent to the third edge (A3) of the battery (270). The plurality of antennas may operate as an array antenna. The antenna module (1370) may include a mmWave antenna module.

[0232] In one embodiment, the fourth printed circuit board (1330) may extend across the surface (270A) of the battery (270) from the first printed circuit board (e.g., the first printed circuit board (310)) to the printed circuit board (1375) of the antenna module (1370). The fourth printed circuit board (1330) may electrically connect the first printed circuit board and the printed circuit board (1375) of the antenna module (1370) to transmit a radio frequency (RF) signal between the wireless communication circuit and the plurality of antennas of the antenna module (1370).

[0233] In one embodiment, the fourth printed circuit board (1330) may include a second end (1332) comprising a connector coupled to the printed circuit board (1375) of the antenna module (1370), a flexible portion (1340) (e.g., a first flexible portion (340)) extending from the second end (1332) across the third edge (A3) of the battery (270) to an inner region of the surface (270A) of the battery (270), and a rigid portion (1350) (e.g., a rigid portion (350)) extending from the end of the flexible portion (1340) toward the first printed circuit board. In one embodiment, the first flexible portion (1340) may include a V-shaped section (e.g., a V-shaped section (342)). The vertex of the V-shaped section of the first flexible part (1340) may face the first edge (A1) or the second edge (A2) of the battery (270).

[0234] FIG. 14 shows an electronic device according to one embodiment.

[0235] In the above description, the third printed circuit board (330) was described as including one V-shaped section (342), but is not limited thereto. For example, referring to FIG. 14, the first flexible portion (1440) of the third printed circuit board (1430) may further include a V-shaped section (1442) oriented in the same direction as the V-shaped section (342).

[0236] FIG. 15 shows an electronic device according to one embodiment.

[0237] In the foregoing description, the section drawn from the second connector (372) of the third printed circuit board (330) was described as crossing the edge of the second printed circuit board (320) that faces the battery (270), but is not limited thereto. For example, the second printed circuit board (320) may include a first edge facing the battery (270) and a second edge (320A) that extends in a direction different from the first edge (e.g., perpendicularly). The first flexible portion (340) may be extended from the second connector (372) to cross the second edge (320A) of the second printed circuit board (320). At this time, the long side of the second connector (372) (e.g., the long side (372a) in FIG. 3b) may be substantially parallel to the second edge (320A) of the second printed circuit board (320).

[0238] FIG. 16 shows a foldable device according to one embodiment. FIG. 17 shows an electronic device according to one embodiment.

[0239] In the drawings above, bar-type electronic devices are illustrated, but the shape or form factor of the electronic device (300) is not limited to the illustrated examples.

[0240] For example, referring to FIG. 16, the housing of the electronic device (1600) may be configured to be deformable. For example, the electronic device (1600) may include a first housing (1610) and a second housing (1620) (e.g., housing (210)) rotatably coupled to the first housing (1610). For example, the second housing (1620) may be configured to be rotatably coupled to the first housing (1610) via a hinge mechanism (or hinge structure) (1630). By the rotational movement of the second housing (1620) relative to the first housing (1610), the first housing (1610) and the second housing (1620) may be folded or unfolded relative to each other. In this case, the display (e.g., display (201)) of the electronic device (1600) may be positioned across the first housing (1610) and the second housing (1620). Additionally, the display (201) of the electronic device (1600) may include a flexible display comprising a portion configured to deform according to the folding motion of the first housing (1610) and the second housing (1620).

[0241] In one embodiment, the first printed circuit board (310), the second printed circuit board (320), the third printed circuit board (330), and the battery (270) may be placed within the second housing part (1620).

[0242] For another example, referring to FIG. 17, the electronic device (1700) may be a tablet device. A first printed circuit board (310), a second printed circuit board (320), a third printed circuit board (330), and a battery (270) may be placed within the housing of the tablet device.

[0243] The technical problems to be solved in this disclosure are not limited to those mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art to which this disclosure pertains.

[0244] An electronic device (300) is disclosed. The electronic device (300) may include a first printed circuit board (310), a wireless communication circuit (192) disposed on the first printed circuit board (310), a second printed circuit board (320), an antenna radiator disposed adjacent to the second printed circuit board (320), a battery (270) disposed between the first printed circuit board (310) and the second printed circuit board (320) and having a surface facing the rear cover (211) of the electronic device (300), and a third printed circuit board (330) extending across the surface (270A) of the battery (270) from the first printed circuit board (310) to the second printed circuit board (320) and electrically connecting the first printed circuit board (310) and the second printed circuit board (320) to transmit a radio frequency (RF) signal between the wireless communication circuit (192) and the antenna radiator. The surface (270A) of the battery (270) may include a first edge (A1) adjacent to the first printed circuit board (310), a second edge (A2) opposite to the first edge (A1) and adjacent to the second printed circuit board (320), a third edge (A3) connecting the end of the first edge (A1) and the end of the second edge (A2), and a fourth edge (A4) connecting the other end of the first edge (A1) and the other end of the second edge (A2).The third printed circuit board (330) may include an end (332) comprising a connector (372) coupled to the second printed circuit board (320), a flexible portion (340) extending from the end (332) across the second edge (A2) of the battery (270) to an inner region of the surface (270A) of the battery (270) and having a first flexibility, and a rigid portion (350) extending from the end (340a) of the flexible portion (340) toward the first edge (A1) of the battery (270) and having a second flexibility smaller than the first flexibility. The flexible portion (340) includes a V-shaped section (342), and the apex (342a) of the V-shaped section (342) may face the third edge (A3) or the fourth edge (A4) of the battery (270).

[0245] According to one embodiment, the V-shaped section (342) of the flexible portion (340) may be located on the surface (270A) of the battery (270).

[0246] According to one embodiment, the flexible portion (340) may include a portion extending from the end (332) across the second edge (A2) of the battery (270) to the V-shaped portion (342).

[0247] According to one embodiment, the section of the flexible portion (340) may extend in a first direction substantially perpendicular to the second edge (A2) of the battery (270).

[0248] According to one embodiment, the end (350b) of the rigid portion (350) connected to the flexible portion (340) may face the connector (372).

[0249] According to one embodiment, the rigid portion (350) may include a section extending in the first direction from the end (340a) of the flexible portion (340).

[0250] According to one embodiment, the connector (372) may include a long side (372a) and a short side (372b). The long side (372a) of the connector (372) may be substantially perpendicular to the second edge (A2) of the battery (270).

[0251] According to one embodiment, the connector (372) may include a long side (372a) and a short side (372b). The long side (372a) of the connector (372) may be substantially parallel to the second edge (A2) of the battery (270).

[0252] According to one embodiment, the flexible portion (340) may include a non-conductive layer (713) and a plurality of signal lines (810) formed on a first surface of the non-conductive layer (713). The plurality of signal lines (810) may be spaced apart from each other by non-conductive regions (713A) defined by the non-conductive layer (713).

[0253] According to one embodiment, the first surface of the non-conductive layer (713) of the flexible portion (340) may include a region where the plurality of signal lines (810) are formed and a remaining region defining the non-conductive regions (713A).

[0254] According to one embodiment, the flexible portion (340) may include a conductive layer (712) formed on a second surface of the non-conductive layer (713). The conductive layer (712) may include a plurality of holes (801) arranged along a first side (340A) of the flexible portion (340).

[0255] According to one embodiment, the plurality of signal lines (810) may include a first group of signal lines (811) and a second group of signal lines (812). The wireless communication circuit (192) may be configured to receive an RF signal for SISO (single input single output) operation or MIMO (multiple input multiple output) through the first group of signal lines (811), and to receive an RF signal for MIMO operation among SISO operation and MIMO operation through the second group of signal lines (812). The conductive layer (712) may include one or more slits (802) extending along the longitudinal direction of the flexible portion (340). The one or more slits (802) may be aligned with one or more of the second group of signal lines (812).

[0256] According to one embodiment, the one or more slits (802) may include a plurality of slits. The plurality of slits may each be aligned with the second group of signal lines (812).

[0257] According to one embodiment, the flexible portion (340) may include a second side (340B) opposite to the first side (340A). The one or more slits (802) may be positioned closer to the second side (340B) than to the first side (340A).

[0258] According to one embodiment, the signal lines (811) of the first group may be positioned between the first side (340A) of the flexible part (340) and the signal lines (812) of the second group.

[0259] According to one embodiment, the one or more slits (802) may include a first slit. The first slit may include a plurality of sub-slits separated from each other.

[0260] According to one embodiment, the plurality of holes (801) may include at least one of a circular hole, a triangular hole, and a square hole.

[0261] According to one embodiment, the battery (270) may include a case (272) and a cell (271) housed within the case (272). The surface (270A) of the battery (270) may be defined by the case (272).

[0262] An electronic device (300) is disclosed. The electronic device (300) may include a first printed circuit board (310), a second printed circuit board (320), a battery (270) disposed between the first printed circuit board (310) and the second printed circuit board (320), and a third printed circuit board (330) that extends across the battery (270) from the first printed circuit board (310) to the second printed circuit board (320), electrically connects the first printed circuit board (310) and the second printed circuit board (320), and is configured to transmit an RF (radio frequency) signal. The battery (270) may include a first edge (A1) facing the first printed circuit board (310), a second edge (A2) facing the second printed circuit board (320), a third edge (A3) connecting the end of the first edge (A1) and the end of the second edge (A2), and a fourth edge (A4) connecting the other end of the first edge (A1) and the other end of the second edge (A2). The third printed circuit board (330) may include a rigid section (350) positioned on the battery (270) and comprising a first end facing the direction of the first edge (A1) of the battery (270) and a second end positioned on the battery (270) and facing the direction of the second edge (A2) of the battery (270), and a flexible section (340) extending from the second end of the rigid section (350) across the second edge (A2) of the battery (270) to the second printed circuit board (320). The flexible section (340) may include a V-shaped section (342), and the apex (342a) of the V-shaped section (342) may face the third edge (A3) or the fourth edge (A4) of the battery (270).

[0263] An electronic device (300) is disclosed. The electronic device (300) may include a first printed circuit board (310), a wireless communication circuit (192) disposed on the first printed circuit board (310), a second printed circuit board (320) having a plurality of antennas formed thereon, a battery (270) having a surface facing the rear cover (211) of the electronic device (300), and a third printed circuit board (330) extending across the surface (270A) of the battery (270) from the first printed circuit board (310) to the second printed circuit board (320) and electrically connecting the first printed circuit board (310) and the second printed circuit board (320) to transmit an RF (radio frequency) signal between the wireless communication circuit (192) and the plurality of antennas. The surface (270A) of the battery (270) may include a first edge (A1) adjacent to the first printed circuit board (310), a second edge (A2) opposite to the first edge (A1), and a third edge (A3) connecting the end of the first edge (A1) and the end of the second edge (A2) and adjacent to the second printed circuit board (320). The third printed circuit board (330) may include an end (332) comprising a connector (372) coupled to the second printed circuit board (320), a flexible portion (340) extending from the end (332) across the third edge (A3) of the battery (270) to an inner region of the surface (270A) of the battery (270) and having a first flexibility, and a rigid portion (350) extending from the end (340a) of the flexible portion (340) toward the first printed circuit board (310) and having a second flexibility smaller than the first flexibility.The flexible portion (340) includes a V-shaped section (342), and the apex (342a) of the V-shaped section (342) may face the first edge (A1) or the second edge (A2) of the battery (270).

[0264] According to one embodiment, the electronic device (300) may include at least one antenna radiator; a battery (270); a wireless communication circuit (192); a first printed circuit board (310) on which the wireless communication circuit (192) is disposed; a second printed circuit board (320); and a third printed circuit board (330) extending from the first printed circuit board (310) to the second printed circuit board (320) across the battery (270) and electrically connecting the first printed circuit board (310) and the second printed circuit board (320). The wireless communication circuit (192) may be configured to transmit an RF (radio frequency) signal to the at least one antenna radiator through the third printed circuit board (330). The third printed circuit board (330) comprises: a first section (350) that overlaps the battery (270) and has a first flexibility; and may include a second section (340) extending from the first section (350) across the edge (A2) of the battery (270) toward the second printed circuit board (320) and having a second flexibility higher than the first flexibility. The third printed circuit board (330) may include a layer comprising at least one conductive path for the RF signal and a ground region (884) extending along a first portion of the at least one conductive path within the first section (350) but interrupted along a second portion of the at least one conductive path within the second section (340).

[0265] In one embodiment, the layer of the third printed circuit board (330) may include a non-conductive region (713A) within the second section (340) that separates the second portion of the conductive path within the second section (340) from the ground region (884).

[0266] In one embodiment, the layer of the second section (340) of the third printed circuit board (330) may include: a portion formed by the second portion of the at least one conductive path; and a remainder formed of a non-conductive material.

[0267] In one embodiment, the layer of the third printed circuit board (330) may be a first layer. The third printed circuit board (330) may include a second layer disposed below the first layer and including a ground layer (712). The ground layer (712) may include at least one slit (802) extending along the second portion of the at least one conductive path of the first layer.

[0268] In one embodiment, the second portion of the at least one conductive path may include: at least one first conductive path (811); and at least one second conductive path (812). The at least one slit (802) of the ground layer (712) may be aligned with the at least one second conductive path (812) among the at least one first conductive path (811) and the at least one second conductive path (812).

[0269] In one embodiment, the at least one antenna radiator may include a first antenna group and a second antenna group. The first antenna group may be configured to be used individually for SISO (single input single output) operation of the wireless communication circuit (192). The first antenna group and the second antenna group may be configured to be used collectively for MIMO (multiple input multiple output) operation of the wireless communication circuit (192). The at least one first conductive path (811) may be electrically connected to the first antenna group. The at least one second conductive path (812) may be electrically connected to the second antenna group.

[0270] In one embodiment, the ground layer (712) of the third printed circuit board (330) may include a plurality of openings (801) arranged along the edge of the ground layer (712) within the second section (340).

[0271] In one embodiment, the at least one first conductive path (811) may be positioned between the plurality of openings (801) and the at least one slit (802) when the second section (340) of the third printed circuit board (330) is viewed from above.

[0272] In one embodiment, the third printed circuit board (330) may include a third section (332) extending from the second section (340) and toward the second printed circuit board (320). The electronic device (300) may include: a first connector (372) disposed on the third section (332) of the third printed circuit board (330); and a second connector (322) disposed on the second printed circuit board (320), coupled to the first connector (372), and having a long side and a short side. The long side of the second connector (322) may be substantially parallel to the edge (A2) of the battery (270).

[0273] In one embodiment, the third printed circuit board (330) may include a third section (332) extending from the second section (340) and toward the second printed circuit board (320). The electronic device (300) may include: a first connector (372) disposed on the third section (332) of the third printed circuit board (330); and a second connector (322) disposed on the second printed circuit board (320), coupled to the first connector (372), and having a long side and a short side. The short side of the second connector (322) may be substantially parallel to the edge (A2) of the battery (270).

[0274] In one embodiment, the second section (340) of the third printed circuit board (330) may be configured to relieve stress applied to the second connector (322) through the first connector (372) as the third printed circuit board (330) is lifted by the movement of the battery (270).

[0275] In one embodiment, the second section (340) of the third printed circuit board (330) may include a V-shaped section (342).

[0276] In one embodiment, the V-shaped section (342) may overlap with the battery (270). The second section (340) of the third printed circuit board (330) may include another part (344) extending from the V-shaped section (342) across the edge (A2) of the battery (270) to the third section (332) of the third printed circuit board (330).

[0277] In one embodiment, the first section (350) of the third printed circuit board (330) may include a solder resist layer (741; 742). The second section (340) of the third printed circuit board (330) may not include a solder resist layer (741; 742).

[0278] In one embodiment, the layer of the third printed circuit board (330) may be a first layer. The second portion of the at least one conductive path of the first layer may include a first conductive path. The third printed circuit board (330) may include a second layer disposed below the first layer and including a ground layer (712). The ground layer (712) may include a plurality of slits (1201F; 1202F) disposed within the second section (340) of the third printed circuit board (330) and arranged parallel to the first conductive path along the longitudinal direction of the first conductive path.

[0279] In one embodiment, the number of layers included in the first section (350) of the third printed circuit board (330) may be greater than the number of layers included in the second section (340) of the third printed circuit board (330).

[0280] According to one embodiment, the electronic device (300) may include: a first printed circuit board (310); a second printed circuit board (320); a battery (270) disposed around the first printed circuit board (310) and the second printed circuit board (320); and a third printed circuit board (330) extending from the first printed circuit board (310) across the battery (270) to the second printed circuit board (320) and electrically connecting the first printed circuit board (310) to the second printed circuit board (320). The third printed circuit board (330) may include: a first section (350) having a first flexibility and including an end disposed on the battery (270); and may include a second section (340) extending from the end of the first section (350) across the edge (A2) of the battery (270) toward the second printed circuit board (320) and having a second flexibility higher than the first flexibility of the first section (350). The third printed circuit board (330) may include a layer, the layer comprising: at least one conductive line for transmitting an RF (radio frequency) signal; and a ground area (884) extending along a first portion of the at least one conductive line within the first section (350) but interrupted along a second portion of the at least one conductive line within the second section (340).

[0281] In one embodiment, the layer of the third printed circuit board (330) may be a first layer. The third printed circuit board (330) may include a second layer that overlaps the first layer and includes a ground layer (712). The ground layer (712) may include at least one slit (802) disposed within the second section (340) of the third printed circuit board (330) and extending along the second portion of the at least one conductive line of the first layer.

[0282] In one embodiment, the ground layer (712) of the third printed circuit board (330) may include a plurality of openings (801) arranged along the edge of the ground layer (712) of the second section (340) of the third printed circuit board (330).

[0283] In one embodiment, the second section (340) of the third printed circuit board (330) may include a V-shaped section (342).

[0284] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs.

[0285] The electronic device according to the various embodiments disclosed in this document may be a device of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0286] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, each of phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish a component from another component and do not limit the components in any other aspect (e.g., importance or order). Where any component (e.g., the first) is referred to as "coupled" or "connected" to another component (e.g., the second), with or without the terms "functionally" or "communicationally," it means that said component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0287] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0288] Various embodiments of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0289] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0290] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations among the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

In electronic devices, At least one antenna radiator; battery; Wireless communication circuit; A first printed circuit board on which the above-mentioned wireless communication circuit is arranged; A second printed circuit board; and A third printed circuit board is included, which extends from the first printed circuit board to the second printed circuit board across the battery and electrically connects the first printed circuit board and the second printed circuit board, and the wireless communication circuit is configured to transmit an RF (radio frequency) signal to the at least one antenna radiator through the third printed circuit board. The above third printed circuit board is: A first section superimposed on the battery and having a first flexibility; and It includes a second section extending from the first section across the edge of the battery toward the second printed circuit board and having a second flexibility higher than the first flexibility, The above third printed circuit board is, A layer comprising at least one conductive path for the RF signal and a ground region extending along a first portion of the at least one conductive path within the first section but interrupted along a second portion of the at least one conductive path within the second section. Electronic device. In claim 1, The layer of the third printed circuit board comprises a non-conductive region within the second section that separates the second portion of the conductive path within the second section from the ground region. Electronic device. In claim 1 or claim 2, The layer of the second section of the third printed circuit board is: A portion formed by the second portion of the at least one conductive path; and including the remaining portion formed of a non-conductive material, Electronic device. In any one of claims 1 to 3, The layer of the above-mentioned third printed circuit board is the first layer, and The third printed circuit board comprises a second layer disposed below the first layer and including a ground layer, and The ground layer comprises at least one slit extending along the second portion of the at least one conductive path of the first layer. Electronic device. In claim 4, The second part of the above-mentioned at least one conductive path is: At least one first conductive path; and It includes at least one second conductive path, and The at least one slit of the ground layer is aligned with the at least one second conductive path among the at least one first conductive path and the at least one second conductive path, Electronic device. In claim 5, The above-mentioned at least one antenna radiator includes a first antenna group and a second antenna group, and The first antenna group is configured to be used individually for the SISO (single input single output) operation of the wireless communication circuit, and The first antenna group and the second antenna group are configured to be used collectively for MIMO (multiple input multiple output) operation of the wireless communication circuit, and The above at least one first conductive path is electrically connected to the first antenna group, and The above at least one second conductive path is electrically connected to the second antenna group, Electronic device. In claim 6, The ground layer of the third printed circuit board comprises a plurality of openings arranged along the edge of the ground layer within the second section, Electronic device. In claim 7, The above at least one first conductive path is disposed between the plurality of openings and the at least one slit when the second section of the third printed circuit board is viewed from above. Electronic device. In any one of claims 1 to 8, The third printed circuit board includes a third section that extends from the second section and faces the second printed circuit board, and The above electronic device is: A first connector disposed on the third section of the third printed circuit board; and It includes a second connector disposed on the second printed circuit board and coupled to the first connector, having a long side and a short side, The longer side of the second connector is substantially parallel to the edge of the battery. Electronic device. In claim 8, The third printed circuit board includes a third section that extends from the second section and faces the second printed circuit board, and The above electronic device is: A first connector disposed on the third section of the third printed circuit board; and It includes a second connector disposed on the second printed circuit board and coupled to the first connector, having a long side and a short side, The short side of the second connector is substantially parallel to the edge of the battery. Electronic device. In claim 9 or claim 10, The second section of the third printed circuit board is configured to relieve stress applied to the second connector through the first connector as the third printed circuit board is lifted by the movement of the battery. Electronic device. In any one of claims 9 to 11, The second section of the third printed circuit board includes a V-shaped section, Electronic device. In claim 12, The above V-shaped section overlaps the battery, and The second section of the third printed circuit board includes another part extending from the V-shaped section across the edge of the battery to the third section of the third printed circuit board. Electronic device. In any one of claims 1 to 13, The first section of the third printed circuit board includes a solder resist layer, The second section of the third printed circuit board above does not include a solder resist layer, Electronic device. In claim 1, The layer of the above-mentioned third printed circuit board is the first layer, and The second portion of the at least one conductive path of the first layer comprises the first conductive path, The third printed circuit board comprises a second layer disposed below the first layer and including a ground layer, and The ground layer comprises a plurality of slits disposed within the second section of the third printed circuit board and arranged parallel to the first conductive path along the longitudinal direction of the first conductive path. Electronic device.

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