Electronic apparatus comprising speaker

Abstract

An electronic apparatus according to an embodiment of the present disclosure may comprise: a display; a housing assembly including a side wall that forms an outer surface of the electronic apparatus and an internal instrument that is formed integrally with the side wall and configured to support the display; and a rear-side plate disposed on a side opposite to the display. The housing assembly may include a hole that is formed to pass through a portion of the internal instrument and a portion of the side wall. The hole may include a first duct formed to extend from the outside of the side wall and a second duct formed to extend from the inside of the housing assembly and communicate with the first duct. The internal instrument may include a rib extending from an end portion of the first duct toward the second duct. The rib may be formed such that at least some of internal components are not identified from the outside of the side wall.

Description

Electronic device including a speaker

[0001] Various embodiments of the present disclosure relate to an electronic device including a speaker.

[0002] Driven by remarkable advancements in information and communication technology and semiconductor technology, the distribution and use of various electronic devices are increasing rapidly. Recent electronic devices are being developed to enable portable communication.

[0003] The term "electronic device" may refer to a device that performs specific functions according to an installed program, ranging from home appliances to electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, video / audio devices, desktop / laptop computers, and vehicle navigation systems.

[0004] For example, these electronic devices can output stored information as sound or video. As the integration density of electronic devices increases and ultra-high-speed, high-capacity wireless communication becomes commonplace, various functions can now be integrated into a single electronic device, such as a mobile communication terminal. For instance, not only communication functions but also entertainment functions like games, multimedia functions like music and video playback, communication and security functions for mobile banking, or functions such as schedule management and electronic wallets are being integrated into a single electronic device. These electronic devices are being miniaturized so that users can carry them conveniently.

[0005] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0006] An electronic device according to one embodiment of the present disclosure may include a display, a housing assembly comprising a side wall forming an outer surface of the electronic device and an internal mechanism formed integrally with the side wall and configured to support the display, and a rear plate disposed on the opposite side of the display. The housing assembly may include a hole formed to penetrate a part of the internal mechanism and a part of the side wall. The hole may include a first channel formed to extend from the outside of the side wall and a second channel formed to extend from the inside of the housing assembly and communicate with the first channel. The internal mechanism may include a rib extending from the end of the first channel toward the second channel. The rib may be formed such that at least a part of the internal component is not identifiable from the outside of the side wall.

[0007] The effects obtainable from the exemplary embodiments of the present disclosure are not limited to those mentioned above, and other unmentioned effects can be clearly derived and understood by those skilled in the art to which the exemplary embodiments of the present disclosure belong from the description below. That is, unintended effects resulting from the implementation of the exemplary embodiments of the present disclosure can also be derived by those skilled in the art from the exemplary embodiments of the present disclosure.

[0008] FIG. 1 is a block diagram of an electronic device in a network environment according to one embodiment of the present document.

[0009] FIG. 2 is a perspective view looking toward the front of an electronic device according to one embodiment.

[0010] FIG. 3 is a perspective view looking toward the rear of an electronic device according to one embodiment.

[0011] FIG. 4 is an exploded perspective view looking toward the front of an electronic device according to one embodiment.

[0012] FIG. 5 is an exploded perspective view looking toward the rear of an electronic device according to one embodiment.

[0013] FIG. 6 is a perspective view showing the state before assembling a substrate on which a speaker is placed in an electronic device according to one embodiment to a housing assembly.

[0014] FIG. 7 is a plan view showing the state in which a substrate on which a speaker is placed is assembled to a housing assembly in an electronic device according to one embodiment.

[0015] Figure 8 is a perspective view cut along line AA of Figure 7.

[0016] Figure 9 is a cross-sectional view taken along line AA of Figure 7.

[0017] FIG. 10 is a drawing of a housing assembly of an electronic device according to one embodiment as viewed from below.

[0018] FIGS. 11 to 13 are enlarged cross-sectional views of a portion of a hole of a housing assembly according to various embodiments.

[0019] FIGS. 14a and FIGS. 14b are exemplary drawings for explaining the process of manufacturing a hole of a housing assembly according to one embodiment.

[0020] FIG. 15 is an exemplary drawing for explaining the effect of the hole structure of a housing assembly according to one embodiment.

[0021] FIG. 16 is an experimental example showing the speaker output performance of a hole structure of a housing assembly according to one embodiment.

[0022] FIG. 17 is a cross-sectional view of a hole structure of a housing assembly according to one embodiment.

[0023] In the following description, the attached drawings are referenced, and specific examples of implementation are illustrated within the drawings. Additionally, other examples may be used and structural modifications may be made without departing from the scope of the various examples.

[0024] The various embodiments used to illustrate the principles of the present disclosure in FIGS. 1 through 17 disclosed below and in this patent document are for illustrative purposes only and should not be construed as limiting the scope of the present disclosure in any way. Those skilled in the art will understand that the principles of the present disclosure may be implemented in any system or device appropriately arranged.

[0025] Hereinafter, embodiments of the present disclosure are described in detail with reference to the drawings so that those skilled in the art can easily practice them. However, the present disclosure may be embodied in various different forms and is not limited to the embodiments described herein. In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and brevity.

[0026] FIG. 1 is a block diagram of an electronic device in a network environment according to one embodiment of the present document.

[0027] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In one embodiment, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In one embodiment, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0028] The processor (120) can control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., a program (140)), and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0029] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence is performed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0030] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0031] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0032] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0033] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0034] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0035] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0036] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0037] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0038] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0039] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that can be perceived by the user through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0040] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0041] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0042] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0043] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0044] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) may support a Peak data rate (e.g., 20 Gbps or more) for eMBB realization, loss coverage (e.g., 164 dB or less) for mMTC realization, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for URLLC realization.

[0045] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to one embodiment, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0046] According to one embodiment, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0047] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0048] According to one embodiment, commands or data may be transmitted or received between an electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0049] FIG. 2 is a perspective view looking toward the front of an electronic device according to one embodiment.

[0050] FIG. 3 is a perspective view looking toward the rear of an electronic device according to one embodiment.

[0051] All features, components, and / or arrangement relationships between components illustrated in FIGS. 2 and 3 may be included, either alone or in combination with, the features, components, and arrangement relationships between components described in other figures of this specification. Likewise, all features, components, and / or arrangement relationships between components described in relation to FIGS. 1 and FIGS. 4 through 17 may be included, either alone or in combination with, the features, components, and arrangement relationships between components described in FIGS. 2 and 3.

[0052] The components of the electronic device (101) of FIGS. 2 and 3 may be some or all identical to the components of the electronic device (101) of FIG. 1.

[0053] Referring to FIGS. 2 and FIGS. 3, an electronic device (101) according to one embodiment (e.g., the electronic device (101) of FIG. 1) may include a housing (110) comprising a first surface (or front) (110A), a second surface (or rear) (110B), and a side (110C) surrounding the space between the first surface (110A) and the second surface (110B). In one embodiment, the housing (110) may refer to a structure forming some of the first surface (110A) of FIG. 2, the second surface (110B) of FIG. 3, and the side (110C).

[0054] According to one embodiment, the first surface (110A) may be formed by a front plate (102) in which at least a portion is substantially transparent (e.g., a glass plate containing various coating layers, or a polymer plate). The second surface (110B) may be formed by a rear plate (111) that is substantially opaque. The rear plate (111) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side surface (110C) may be formed by a side structure (or "side bezel structure") (118) that combines with the front plate (102) and the rear plate (111) and comprises metal and / or polymer. In one embodiment, the rear plate (111) and the side structure (118) may be formed integrally and may comprise the same material (e.g., a metallic material such as aluminum).

[0055] According to one embodiment, the front plate (102) may include region(s) that are curved and seamlessly extended toward the rear plate (111) at least a portion of the edge. For example, the front plate (102) (or rear plate (111)) may include only one of the regions that are curved and extended toward the rear plate (111) (or front plate (102)) at one edge of the first surface (110A). According to one embodiment, the front plate (102) or the rear plate (111) may be substantially flat, in which case it may not include the curved and extended region. If the front plate (102) or the rear plate (111) includes the curved and extended region, the thickness of the electronic device (101) in the portion including the curved and extended region may be smaller than the thickness of the other portion.

[0056] According to one embodiment, the electronic device (101) may include at least one of a display (115), an audio module (e.g., a microphone hole (103), an external speaker hole (107), a call receiver hole (114)), a sensor module (e.g., a first sensor module (104), a second sensor module (not shown), a third sensor module (119)), a camera module (e.g., a first camera device (105), a second camera device (112), a flash (113)), a key input device (117), a light-emitting element (106), and a connector hole (e.g., a first connector hole (108), a second connector hole (109)). In one embodiment, the electronic device (101) may omit at least one of the components (e.g., a key input device (117), or a light-emitting element (106)) or additionally include other components.

[0057] The display (115) may output a screen or be visually exposed through a significant portion of, for example, the first surface (110A) (e.g., the front plate (102)). In one embodiment, at least a portion of the display (115) may be visually exposed through the front plate (102) forming the first surface (110A) or through a portion of the side (110C) (e.g., the edge display). In one embodiment, the corners of the display (115) may be formed to be generally the same as the adjacent outer shape of the front plate (102). In one embodiment (not shown), to expand the area where the display (115) is visually exposed, the gap between the outer edge of the display (115) and the outer edge of the front plate (102) may be formed to be generally the same.

[0058] According to one embodiment, a recess or opening is formed in a part of the screen display area of ​​the display (115), and the electronic device (101) may include at least one of an audio module (e.g., a call receiver hole (114)), a sensor module (e.g., a first sensor module (104)), a camera module (e.g., a first camera device (105)), and a light-emitting element (106) that are aligned with the recess or the opening. According to one embodiment, at least one of an audio module (e.g., a call receiver hole (114)), a sensor module (e.g., a first sensor module (104)), a camera module (e.g., a first camera device (105)), a fingerprint sensor (not shown), and a light-emitting element (106) may be disposed on the back surface of the screen display area of ​​the display (115). According to one embodiment, the display (115) may be combined with or placed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer capable of detecting a magnetic field type stylus pen.

[0059] According to one embodiment, the audio module (107, 114) may include a microphone hole (103) and a speaker hole (e.g., an external speaker hole (107), a call receiver hole (114)). A microphone for acquiring external sound may be placed inside the microphone hole (103), and in one embodiment, a plurality of microphones may be placed to detect (or determine) the direction of the sound. The speaker hole may include an external speaker hole (107) and a call receiver hole (114). In one embodiment, the speaker hole (e.g., an external speaker hole (107), a call receiver hole (114)) and the microphone hole (103) may be implemented (or arranged) as a single hole, or a speaker may be included without a speaker hole (e.g., an external speaker hole (107), a call receiver hole (114)) (e.g., a piezo speaker).

[0060] According to one embodiment, the sensor module may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module may include, for example, a first sensor module (104) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (110A) of the housing (110), and / or a third sensor module (119) disposed on a second surface (110B) of the housing (110). The second sensor module (not shown) (e.g., a fingerprint sensor) may be disposed on the second surface (110B) or side (110C) as well as on the first surface (110A) (e.g., a display (115)) of the housing (110). The electronic device (101) may further include at least one of, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor (104).

[0061] According to one embodiment, the camera module may include a first camera device (105) disposed on a first surface (110A) of the electronic device (101), a second camera device (112) disposed on a second surface (110B), and / or a flash (113). The camera devices (e.g., the first camera device (105), the second camera device (112)) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (113) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, one or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one surface of the electronic device (101). In one embodiment, the flash (113) may emit infrared light, and the infrared light emitted by the flash (113) and reflected by the subject may be received through a third sensor module (119). The electronic device (101) or the processor of the electronic device (101) (e.g., the processor (120) of FIG. 1) can detect depth information of the subject based on the time when infrared light is received from the third sensor module (119).

[0062] According to one embodiment, a key input device (117) may be disposed on a side (110C) of the housing (110). In one embodiment, the electronic device (101) may not include some or all of the aforementioned key input devices (117), and the key input devices (117) that are not included may be implemented in other forms, such as soft keys, on the display (115). In one embodiment, the key input device may include a sensor module disposed on a second side (110B) of the housing (110).

[0063] According to one embodiment, the light-emitting element (106) may be disposed, for example, on a first surface (110A) of a housing (110). The light-emitting element (106) may, for example, provide state information of an electronic device (101) in the form of light. In one embodiment, the light-emitting element (106) may, for example, provide a light source that is coupled with the operation of a camera module (e.g., a first camera device (105)). The light-emitting element (106) may include, for example, an LED, an IR LED, and a xenon lamp.

[0064] According to one embodiment, the connector hole (e.g., first connector hole (108), second connector hole (109)) may include a first connector hole (108) capable of receiving a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device (e.g., the electronic device (102) of FIG. 1), and a second connector hole (109) (e.g., a SIM tray hole) for mounting a module related to communication functions.

[0065] FIG. 4 is an exploded perspective view looking toward the front of an electronic device according to one embodiment.

[0066] FIG. 5 is an exploded perspective view looking toward the rear of an electronic device according to one embodiment.

[0067] All features, components, and / or arrangement relationships between components illustrated in FIGS. 4 and 5 may be included, either alone or in combination with, the features, components, and arrangement relationships between components described in other figures of this specification. Likewise, all features, components, and / or arrangement relationships between components described in relation to FIGS. 1 through 3 and FIGS. 6 through 17 may be included, either alone or in combination with, the features, components, and arrangement relationships between components described in FIGS. 4 and 5.

[0068] The components of the electronic device (101) of FIGS. 4 and 5 may be partially or entirely identical to the components of the electronic device (101) of FIGS. 1 to 3.

[0069] Referring to FIGS. 4 and 5, an electronic device (101) (e.g., electronic device (101) of FIGS. 1, 2 or 3) may include a housing (210) (e.g., housing (110) of FIGS. 2), a first support member (211) (e.g., bracket), a front plate (220) (e.g., front plate (102) of FIGS. 2), a display (230) (e.g., display (115) of FIGS. 2 and 3), a printed circuit board (or board assembly) (240), a battery (250), a second support member (260) (e.g., rear case), an antenna, a camera assembly (207), and a rear plate (280) (e.g., rear plate (111) of FIGS. 3).

[0070] According to one embodiment, the electronic device (101) may omit at least one of the components (e.g., a first support member (211), or a second support member (260)) or additionally include other components. At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 2 or FIG. 3, and redundant descriptions are omitted below.

[0071] According to one embodiment, the first support member (211) may be disposed inside the electronic device (101) and connected to the housing (210), or may be formed integrally with the housing (210). The first support member (211) may be formed, for example, from a metal material and / or a non-metal (e.g., polymer) material. When formed at least partially from a metal material, a portion of the housing (210) or the first support member (211) may function as an antenna. The first support member (211) may have a display (230) attached to one side and a printed circuit board (240) attached to the other side. The printed circuit board (240) may be equipped with a processor (e.g., processor (120) of FIG. 1), a memory (e.g., memory (130) of FIG. 1), and / or an interface (e.g., interface (177) of FIG. 1). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0072] According to one embodiment, the first support member (211) and the housing (210) may be combined and referred to as a front case or housing (210). According to one embodiment, the housing (210) may be understood as a structure for generally accommodating, protecting, or housing a printed circuit board (240) or a battery (250). In one embodiment, the housing (210) may be understood to include a structure that a user can visually or tactilely perceive from the exterior of the electronic device (101), such as a housing (210), a front plate (220), and / or a rear plate (280). In one embodiment, the term 'front or rear' of the housing (210) may mean the first surface (110A) of FIG. 2 or the second surface (110B) of FIG. 3. In one embodiment, the first support member (211) is positioned between the front plate (220) (e.g., the first surface (110A) of FIG. 2) and the rear plate (280) (e.g., the second surface (110B) of FIG. 3) and can function as a structure for positioning electrical / electronic components such as a printed circuit board (240) or a camera assembly (207).

[0073] According to one embodiment, the display (230) may include a display panel (231) and a flexible printed circuit board (233) extending from the display panel (231). The flexible printed circuit board (233) may be understood as being electrically connected to the display panel (231), for example, while being positioned at least partially on the rear side of the display panel (231). In one embodiment, reference numeral '231' may be understood as a protective sheet positioned on the rear side of the display panel. For example, unless otherwise distinguished in the following detailed description, the protective sheet may be understood as being part of the display panel (231). In one embodiment, the protective sheet may function as a cushioning structure that absorbs external forces (e.g., a low-density elastomer such as a sponge) or an electromagnetic shielding structure (e.g., a copper sheet (CU sheet)). According to one embodiment, the display (230) may be disposed on the inner surface of the front plate (220) and may output an image through at least a portion of the first surface (110A) of FIG. 2 or the front plate (220) by including a light-emitting layer. As previously mentioned, the display (230) may substantially output an image through the entire surface of the first surface (110A) of FIG. 2 or the front plate (220).

[0074] According to one embodiment, the memory may include, for example, volatile memory or non-volatile memory.

[0075] According to one embodiment, the interface may include, for example, an HDMI (high definition multimedia interface), a USB (universal serial bus) interface, an SD card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device (101) to an external electronic device and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0076] According to one embodiment, the second support member (260) may include, for example, an upper support member (260a) and a lower support member (260b). In one embodiment, the upper support member (260a) may be positioned to surround the printed circuit board (240) together with a part of the first support member (211). A circuit device (e.g., a processor, a communication module, or a memory) implemented in the form of an integrated circuit chip or various electrical / electronic components may be placed on the printed circuit board (240), and according to an embodiment, the printed circuit board (240) may be provided with an electromagnetic shielding environment from the upper support member (260a). In one embodiment, the lower support member (260b) may be utilized as a structure capable of placing electrical / electronic components such as a speaker module or an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector). In one embodiment, electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be placed on an additional printed circuit board not illustrated. In this case, the lower support member (260b) may be placed to wrap around the additional printed circuit board together with another part of the first support member (211). The speaker module or interface placed on the additional printed circuit board not illustrated or on the lower support member (260b) may be placed corresponding to the audio module (e.g., microphone hole (103)) or speaker hole (e.g., external speaker hole (107), or call receiver hole (114))) or connector hole (e.g., first connector hole (108), or second connector hole (109)) of FIG. 2.

[0077] According to one embodiment, it may be placed correspondingly in an audio module (170) or a connector hole (108, 109).

[0078] According to one embodiment, the battery (250) is a device for supplying power to at least one component of the electronic device (101) and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (250) may be disposed substantially coplanar with, for example, the printed circuit board (240). The battery (250) may be disposed integrally inside the electronic device (101) or may be disposed detachably from the electronic device (101).

[0079] According to one embodiment, the electronic device (101) may further include a separate sub-circuit board (290) spaced apart from the printed circuit board (240) within the first support member (211). The sub-circuit board (290) may be electrically connected to the printed circuit board (240) through a connecting member such as a connecting flexible board or a cable. The sub-circuit board (290) may be electrically connected to electrical components placed in the end region of the electronic device (101), such as a battery (250) or a speaker, a USB connector, an antenna connector and / or a SIM socket, to transmit signals and power.

[0080] Although not illustrated, the antenna may include a conductive pattern implemented on the surface of the second support member (260) through, for example, a laser direct structuring method. In one embodiment, the antenna may include a printed circuit pattern formed on the surface of a thin film, and the antenna in the form of a thin film may be placed between the rear plate (280) and the battery (250). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, communicate near-field with an external device or wirelessly transmit and receive power required for charging. In one embodiment, other antenna structures may be formed by a part or combination thereof of the housing (210) and / or the first support member (211).

[0081] According to one embodiment, the camera assembly (207) may include at least one camera module. Inside the electronic device (101), the camera assembly (207) may receive at least a portion of light incident through an optical hole or camera window (212, 213, 219). In one embodiment, the camera assembly (207) may be placed on a first support member (211) at a location adjacent to a printed circuit board (240). In one embodiment, the camera module(s) of the camera assembly (207) may be largely aligned with any one of the camera windows (212, 213, 219) and may be wrapped at least partially in a second support member (260) (e.g., an upper support member (260a)).

[0082] FIG. 6 is a perspective view showing the state before assembling a substrate on which a speaker is placed in an electronic device according to one embodiment to a housing assembly.

[0083] FIG. 7 is a plan view showing the state in which a substrate on which a speaker is placed is assembled to a housing assembly in an electronic device according to one embodiment.

[0084] Figure 8 is a perspective view cut along line AA of Figure 7.

[0085] Figure 9 is a cross-sectional view taken along line AA of Figure 7.

[0086] FIG. 10 is a drawing of a housing assembly of an electronic device according to one embodiment as viewed from below.

[0087] All features, components, and / or arrangement relationships between components illustrated in FIGS. 6 through 10 may be included, either alone or in combination with, the features, components, and arrangement relationships between components described in other figures of this specification. Likewise, all features, components, and / or arrangement relationships between components described in relation to FIGS. 1 through 5 and FIGS. 11 through 17 may be included, either alone or in combination with, the features, components, and arrangement relationships between components described in FIGS. 6 through 10.

[0088] Referring to FIGS. 6 through 10, an electronic device according to one embodiment (e.g., electronic device (101) of FIG. 1, electronic device (101) of FIG. 2) may include at least one of a housing assembly (610), a first support member (620) (e.g., first support member (211) of FIG. 4), a display (e.g., display (230) of FIG. 4), a rear plate (e.g., rear plate (280) of FIG. 4), a speaker enclosure (630), a speaker (640), a first hole (650) (e.g., external speaker hole (107) of FIG. 3), a connector hole (661, 662) (e.g., first connector hole (108), second connector hole (109) of FIG. 3), a microphone hole (663) (e.g., microphone hole (103) of FIG. 3), a sealing member (670), or a mesh member (680). The rear plate (280) may be placed on the opposite side of the display (230). For example, if the display (230) forms the front of the electronic device (101), the rear plate (280) may form the rear of the electronic device (101).

[0089] According to one embodiment, a housing assembly (610) (e.g., housing (210) of FIG. 4) may include a side wall (611) and an internal structure (612). The housing assembly (610) may form the exterior of an electronic device (101). The housing assembly (610) may be configured to protect electronic components mounted inside. The housing assembly (610) may provide a space for mounting internal components. The rear plate (280) and the display (230) may be spaced apart with the side wall (611) in between.

[0090] According to one embodiment, the side wall (611) may constitute the side exterior of the electronic device (101). The side wall (611) may be formed from various materials such as plastic, metal, alloy, glass, and ceramic. For example, the side wall (611) may be made of aluminum or stainless steel alloy. For example, the side wall (611) may be made of polycarbonate or ABS resin. The side wall (611) may be formed integrally by injection molding, press forming, or welding and joining multiple parts as a single part.

[0091] According to one embodiment, an internal structure (612) may be placed within a side wall (611). The internal structure (612) may be placed to wrap around or reinforce the inner surface of the side wall (611) to ensure the durability of the electronic device (101). The internal structure (612) may be formed to fix and position internal components. The internal structure (612) may be formed from a material such as resin, plastic, or a curable material. For example, the internal structure (612) may be formed by an injection molding or thermoforming process. The internal structure (612) may support a display (e.g., the display (115) of FIG. 2).

[0092] According to one embodiment, the housing assembly (610) may have a structure in which the side wall (611) and the internal mechanism (612) are integrally formed by directly forming the internal mechanism (612) inside the side wall (611) by injection molding. Alternatively, the housing assembly (610) may have a structure in which the internal mechanism (612) is fixed to the inner wall surface of the side wall (611) through a connecting member such as an adhesive or a mechanical connecting member.

[0093] According to one embodiment, the speaker (640) may be placed in the speaker enclosure (630). The electronic device (101) may include a plurality of speakers, but for convenience of explanation, only one speaker (640) is shown in the drawing.

[0094] According to one embodiment, the speaker (640) may be positioned adjacent to the first hole (650). The speaker (640) may be positioned adjacent to the second conduit (652). Sound output from the speaker (640) may be transmitted to the outside through the first hole (650).

[0095] According to one embodiment, the speaker (640) may be supported and / or fixed by an internal mechanism (612). For example, the assembly position of the speaker (640) may be guided by the shape of the internal mechanism (612).

[0096] According to one embodiment, the sealing member (670) may be positioned between the speaker (640) and the first hole (650). The sealing member (670) may be positioned between the speaker (640) and the second conduit (652). The sealing member (670) may be coupled to the speaker enclosure (630). The sealing member (670) may perform the function of sealing and blocking foreign matter or moisture from entering the electronic device (101) through the first hole (650).

[0097] According to one embodiment, the mesh member (680) may be coupled to the sealing member (670). The mesh member (680) can prevent foreign substances or liquids entering through the first hole (650) from directly penetrating into the speaker (640). The mesh member (680) may be composed of a material that has a foreign substance blocking effect while maintaining breathability and sound transparency.

[0098] According to one embodiment, the first hole (650) may be formed to penetrate the side of the housing assembly (610). The first hole (650) may be formed to penetrate the side wall (611) and the internal mechanism (612). The first hole (650) may be formed to penetrate the lower (e.g., -y direction) side of the housing assembly (610), but the location of the first hole (650) is not limited thereto.

[0099] According to one embodiment, the first hole (650) may be a passage for transmitting sound output from the speaker (640) to the outside. However, it is not limited thereto, and various holes penetrating the housing assembly (610), such as a connector hole, an air vent, or a microphone hole, may have a structure similar to the first hole (650).

[0100] According to one embodiment, the first hole (650) may include a first conduit (651) and a second conduit (652). The first conduit (651) and the second conduit (652) may be formed using a CNC method, but are not limited thereto.

[0101] According to one embodiment, the first conduit (651) is formed to extend from the outside of the housing assembly (610). The first conduit (651) may be formed to extend from the outside of the side wall (611). The first conduit (651) may be a passage that starts from an adjacent portion on the side outside of the housing assembly (610) and extends inward. For example, the first conduit (651) may be formed to penetrate the side wall (611) and a portion of the internal mechanism (612). The first conduit (651) may be a passage that starts from an adjacent portion on the side outside of the housing assembly (610) and extends inward, and this portion may define the outer end of the first conduit (651) and extend to the inner end of the first conduit (651).

[0102] According to one embodiment, the second conduit (652) may be formed to extend from the inside of the housing assembly (610). The second conduit (652) may be formed to extend from the inside of the internal mechanism (612). The second conduit (652) may be a passage that starts from an adjacent portion on the side inner side of the housing assembly (610) and extends outward. For example, the second conduit (652) may be formed to penetrate a portion of the internal mechanism (612).

[0103] According to one embodiment, the first conduit (651) and the second conduit (652) may be formed to be connected to each other and penetrate the housing assembly (610). The first conduit (651) and the second conduit (652) may be connected to each other by overlapping a portion of the plane perpendicular to the extension direction (e.g., y-axis direction) of the first conduit (651) (e.g., xz plane) with a portion of the plane perpendicular to the extension direction (e.g., y-axis direction) of the second conduit (652) (e.g., xz plane).

[0104] According to one embodiment, the first conduit (651) may extend in a horizontal direction (e.g., in the y-axis direction). The first conduit (651) may form a first horizontal path. For example, the first conduit (651) may extend in a direction perpendicular to the side wall (611). For example, the first conduit (651) may extend in a direction parallel to the display (230). For example, the first conduit (651) may extend in a direction parallel to the rear plate (280).

[0105] According to one embodiment, the second conduit (652) may extend in a horizontal direction (e.g., in the y-axis direction). The second conduit (652) may form a second horizontal path. For example, the second conduit (652) may extend in a direction perpendicular to the side of the side wall (611). For example, the second conduit (652) may extend in a direction parallel to the display (230). For example, the second conduit (652) may extend in a direction parallel to the rear plate (280). For example, the second conduit (652) may be located between the rib (6121) and the rear plate (280).

[0106] According to one embodiment, the first horizontal path of the first conduit (651) may be located at a lower height than the second horizontal path of the second conduit (652) when viewed from the display (230).

[0107] According to one embodiment, the first conduit (651) and the second conduit (652) may be arranged staggered so that only a portion overlaps. The first conduit (651) and the second conduit (652) may extend in directions parallel to each other. For example, the horizontal position of the first conduit (651) and the horizontal position of the second conduit (652) may be different. For example, the first conduit (651) may be positioned closer to the display (230) than the second conduit (652).

[0108] In a specific embodiment, the staggered relationship between the first conduit (651) and the second conduit (652) can be more precisely defined by their respective central axes. The first conduit (651) extends along the first central axis and the second conduit (652) extends along the second central axis. The central axis of the first conduit (651) is offset while parallel to the central axis of the second conduit (652), thereby creating a staggered configuration.

[0109] According to one embodiment, the first hole (650) may include a connecting pipe (653). The connecting pipe (653) may be a space connecting the first pipe (651) and the second pipe (652). The connecting pipe (653) may be located between the first pipe (651) and the second pipe (652). A portion of the connecting pipe (653) may be defined by the inclined surface (6121a) of the rib (6121) described later. The bottom surface of the connecting pipe (653) may be the inclined surface (6121a) of the rib (6121). The connecting pipe (653) may connect the first pipe (651) and the second pipe (652) at different heights.

[0110] According to one embodiment, the connecting conduit (653) may be a space formed to communicate the overlapping portion of the first conduit (651) and the second conduit (652) when viewed from outside the first hole (650). The connecting conduit (653) may be referred to, for example, as an inclined path.

[0111] According to one embodiment, the housing assembly (610) includes a rib (6121). The internal mechanism (612) may include the rib (6121). The rib (6121) may be formed on the inner side of the first hole (651). The rib (6121) may be formed to protrude inwardly toward the first hole (651).

[0112] According to one embodiment, the rib (6121) is formed to extend from the end of the first conduit (651) toward the second conduit (652). The rib (6121) may be formed to protrude from the lower surface (e.g., the +z direction surface) of the first conduit (651).

[0113] According to one embodiment, the rib (6121) may include an inclined surface (6121a). The inclined surface (6121a) may be formed to be inclined toward the second conduit (652) side from the end of the first conduit (651). For example, the angle of inclination of the inclined surface (6121a) may be 30 to 60 degrees. The angle of inclination of the inclined surface (6121a) is selected to effectively divert light entering the first conduit (651) from the direct line of sight of an external observer. The effective range of this angle is between 20 and 80 degrees. A preferred range is between 30 and 60 degrees, which provides an excellent balance between deflecting light and maintaining the structural integrity of the rib (6121). In a particularly effective embodiment, the angle is between 40 and 50 degrees. It was found that when a reflection-reducing feature such as an anti-reflective layer (1210) or a textured surface (6121a-1) is used, geometric constraints on the angle are less important, and angles up to 80 degrees can achieve the desired effect of preventing misleading visual artifacts.

[0114] According to one embodiment, a first horizontal path of a first conduit (651) may be configured to communicate with a second horizontal path of a second conduit (652) through at least a partially inclined path (e.g., a connecting conduit (653)) formed by the inclined surface (6121a) of the rib (6121). As used in this document and claims, two elements (e.g., conduits or paths) are 'communicated' with each other, meaning that they are connected through an intermediate structure (e.g., a connecting conduit (653)) to form a single continuous passage. For example, the first conduit (651) and the corresponding first path communicate with the second conduit (652) and the corresponding second path through at least a partially inclined path (e.g., a connecting conduit (653)) formed by the inclined surface (6121a) of the rib (6121).

[0115] If the rib (6121) protruding from the lower surface of the first conduit (651) is visible from the outside due to light reflection, the user may mistake the rib (6121) itself for a foreign substance. To make it difficult for the user to visually identify the rib (6121) as shown in FIG. 10, an inclined surface (6121a) may be formed on the rib (6121). The inclined surface (6121a) can minimize the degree of visual identification from the outside by preventing light entering from the outside from being directly reflected in the direction of the user's eyes (vision).

[0116] According to one embodiment, the first effective cross-sectional area (H1) of the first conduit (651) may be smaller than or equal to the second effective cross-sectional area (H2) of the portion where the first conduit (651) and the second conduit (652) overlap or are connected. Here, the first effective cross-sectional area (H1) may refer to the effective cross-sectional area of ​​the open end of the first conduit (651). Here, the first effective cross-sectional area (H1) may refer to the effective cross-sectional area of ​​the portion penetrating the side wall (611) in the first conduit (651). Here, the second effective cross-sectional area (H2) may refer to the effective cross-sectional area between the corner portion of the step formed by the positional difference between the first conduit (651) and the second conduit (652) and the inclined surface (6121a) of the rib (6121). Here, the second effective cross-sectional area (H2) may refer to the effective cross-sectional area of ​​the connecting conduit (653).

[0117] According to one embodiment, the first effective cross-sectional area (H1) of the first conduit (651) may be smaller than or equal to the third effective cross-sectional area (H3) of the second conduit (652). Here, the third effective cross-sectional area (H3) may refer to the effective cross-sectional area of ​​the open end of the second conduit (652). Here, the third effective cross-sectional area (H3) may refer to the effective cross-sectional area between the end of the rib (6121) and the top of the second conduit (652).

[0118] According to one embodiment, the second effective cross-sectional area (H2) and the third effective cross-sectional area (H3) may be greater than or equal to the first effective cross-sectional area (H1). Even if the rib (6121) is formed, by designing the second effective cross-sectional area (H2) and the third effective cross-sectional area (H3) to be larger than the first effective cross-sectional area (H1), the speaker acoustic output performance can be maintained so as not to be significantly different from the existing one.

[0119] According to one embodiment, as illustrated in FIG. 9, at least a portion of the sealing member (670) may be positioned so that it is covered by a rib (6121) when viewed from one side of the side wall (611) toward the first hole (650). This prevents the sealing member (670) from being visually exposed from the outside and improves the aesthetic appearance. In the past, problems occurred where users could identify the sealing member when looking inside through the speaker hole and mistake it for foreign matter or a defect. An electronic device (101) according to one embodiment of the present disclosure can solve the above problems by providing a rib (6121) structure to block the sealing member (670) from being visually visible from the outside. The rib (6121) serves to cover internal components, such as the sealing member (670) and the mesh member (680), from the external view.

[0120] According to one embodiment, the mesh member (680) can be joined to the sealing member (670) by an adhesive (681). When the speaker enclosure (630) is mounted on the first support member (620) and the internal mechanism (612), a portion of the adhesive (681) may be compressed during the process in which the sealing member (670) is pressed. Conventionally, when the adhesive (681) is compressed, the adhesive (681) flows toward the central part of the mesh member (680), and as a result, the adhesive (681) is visible from the outside through the first hole (650), causing a problem of being mistaken for a foreign substance. In the present disclosure, by forming a rib (6121), the adhesive (681) is not visible from the outside, thereby reducing the situation in which the user mistakes it for a foreign substance. For example, at least a portion of the adhesive (681) may be positioned so that it is obscured by the rib (6121) when viewed from one side of the side wall (611) toward the first hole (650).

[0121] According to one embodiment, the height (e.g., length in the z-axis direction) of the first conduit (651) may be 1.2 mm or more. According to one embodiment, the height (H4) of the rib (6121) may be 0.6 mm or more. According to one embodiment, the difference between the height (H4) of the rib (6121) and the height of the first conduit (651) may be less than 0.8 mm. The height (H4) of the rib (6121) is a parameter for sufficiently blocking the view into the device. Generally, the height (H4) of the rib (6121) may be 0.4 mm or more. A preferred height is 0.6 mm or more, which provides a significant degree of visual blockage for most internal components. In certain embodiments, the height of the rib may be in the range of 0.6 mm to 1.0 mm.

[0122] FIGS. 11 to 13 are enlarged cross-sectional views of a portion of a hole of a housing assembly according to various embodiments.

[0123] All features, components, and / or arrangement relationships between components illustrated in FIGS. 11 through 13 may be included, either alone or in combination with, the features, components, and arrangement relationships between components described in other figures of this specification. Likewise, all features, components, and / or arrangement relationships between components described in relation to FIGS. 1 through 10 and FIGS. 14a through 17 may be included, either alone or in combination with, the features, components, and arrangement relationships between components described in FIGS. 11 through 13.

[0124] FIGS. 12 and FIGS. 13 are drawings showing embodiments in which some configurations are added or modified compared to the embodiment shown in FIGS. 11.

[0125] Referring to FIG. 11, an electronic device according to one embodiment (e.g., the electronic device (101) of FIG. 1 or the electronic device (101) of FIG. 2) may include a rib (6121) (e.g., the rib (6121) of FIG. 9).

[0126] According to one embodiment, the rib (6121) may include an inclined surface (6121a), a first surface (6121b), a first chamfered surface (6121c), a second surface (6121d), a second chamfered surface (6121e), and a third surface (6121f). Here, the first chamfered surface (6121c) and the second chamfered surface (6121e) may each refer to a chamfered surface. For example, the edge portion of the rib (6121) facing the second conduit (e.g., the second conduit (652) in FIG. 9) may be chamfered. For example, the edge portion of the end surface of the rib (6121) facing the second conduit (652) may be chamfered.

[0127] According to one embodiment, the inclined surface (6121a) may be formed by extending from the lower surface of the first conduit (e.g., the first conduit (651) of FIG. 9). The inclined surface (6121a) may be formed at an angle so that light irradiated from the outside through the first hole (650) is not reflected back outward. The angle of inclination of the inclined surface (6121a) may be 30 to 60 degrees, but is not limited thereto.

[0128] According to one embodiment, the first surface (6121b) may extend from the inclined surface (6121a). The first surface (6121b) may extend substantially perpendicular to the bottom surface of the first conduit (651), but is not limited thereto.

[0129] According to one embodiment, the second surface (6121d) may form the end surface (or top surface) of the rib (6121). The second surface (6121d) may be perpendicular to the first surface (6121b), but is not limited thereto.

[0130] According to one embodiment, the third surface (6121f) may be formed to face in the opposite direction of the inclined surface (6121a). The third surface (6121f) may be a surface facing the mesh member (680). The third surface (6121f) may be a surface facing the sealing member (670). The third surface (6121f) may be a surface closer to the speaker (640) than the inclined surface (6121a). The third surface (6121f) may be formed parallel to the mesh member (680).

[0131] According to one embodiment, the first chamfered surface (6121c) may be formed by chamfering the corner where the first surface (6121b) and the second surface (6121d) meet. According to one embodiment, the second chamfered surface (6121e) may be formed by chamfering the corner where the second surface (6121d) and the third surface (6121f) meet. If the corner where the second surface (6121d) and the third surface (6121f) meet is not chamfered, the mesh member (680) may be damaged by being struck at the corner due to external impact or the like during use. To prevent damage to the mesh member (680), the second chamfered surface (6121e) may be formed by chamfering the corner where the second surface (6121d) and the third surface (6121f) meet.

[0132] In the process of forming the first conduit (651) and the second conduit (652) (e.g., CNC process), fine cutting chips (or machining chips) generated when penetrating the hole can accumulate in large quantities, mainly at the corners. If cutting chips remain at the corners in this state, there is a possibility that they may enter the electronic device and damage electronic components such as batteries. In the present disclosure, to prevent such problems, the corners may be chamfered to form a first chamfered surface (6121c) and a second chamfered surface (6121e).

[0133] Referring to FIG. 12, an electronic device according to one embodiment (e.g., the electronic device (101) of FIG. 1, the electronic device (101) of FIG. 2) may include an anti-reflection layer (1210). The anti-reflection layer (1210) may be configured to reduce the reflectivity of light incident from an external light source.

[0134] According to one embodiment, the anti-reflection layer (1210) may be disposed on an inclined surface (6121a). For example, a portion of the anti-reflection layer (1210) may be disposed on a first surface (6121b).

[0135] By placing an anti-reflection layer (1210) on the inclined surface (6121a), the amount of light source reflected to the outside of the side wall (611) can be reduced. As a result, even if a user looks into the first hole (e.g., the first hole (650) in FIG. 9) from the outside, the rib (6121) may not be identifiable from the outside due to the anti-reflection layer (1210).

[0136] As illustrated in FIG. 12, when the electronic device (101) includes an anti-reflective layer (1210) disposed on the inclined surface (6121a) of the rib (6121), the angle of inclination of the inclined surface (6121a) may exceed 60 degrees.

[0137] Referring to FIG. 13, a rib (6121) according to one embodiment may include an inclined surface (6121a-1). The inclined surface (6121a-1) may be textured. The inclined surface (6121a-1) of the rib (6121) may have a rough surface. The rough surface of the inclined surface (6121a-1) may induce scattering of light, thereby reducing the amount of light source reflected to the outside of the side wall (611). As a result, even if a user looks into the first hole (650), the light is scattered by the texture of the inclined surface (6121a-1), so the rib (6121) may not be identifiable from the outside.

[0138] As illustrated in FIG. 13, if the electronic device (101) includes a rib (6121) having an inclined surface (6121a-1) with an uneven (or rough) surface, the angle of inclination of the inclined surface (6121a-1) may exceed 60 degrees.

[0139] FIGS. 14a and FIGS. 14b are exemplary drawings for explaining the process of manufacturing a hole of a housing assembly according to one embodiment.

[0140] All features, components, and / or arrangement relationships between components illustrated in FIGS. 14a and 14b may be included, either alone or in combination with, the features, components, and arrangement relationships between components described in other figures of this specification. Likewise, all features, components, and / or arrangement relationships between components described in relation to FIGS. 1 through 13 and FIGS. 15 through 17 may be included, either alone or in combination with, the features, components, and arrangement relationships between components described in FIGS. 14a and 14b.

[0141] FIGS. 14a and 14b are exemplary drawings for explaining the process of manufacturing a first hole (e.g., the first hole (650) of FIG. 9) according to one embodiment, and the scope of the present invention is not limited by the manufacturing method illustrated. FIGS. 14a and 14b illustrate a CNC method, which is a method of precisely cutting and machining a workpiece by controlling a machine tool through computer programming, but the first hole (650) and rib (6121) structure of the present disclosure may also be implemented using an injection mold such as a slide core or a molten core in addition to the CNC method.

[0142] Referring to FIGS. 14a and 14b, an electronic device according to one embodiment (e.g., electronic device (101) of FIG. 1, electronic device (101) of FIG. 2) may include a housing assembly (610).

[0143] According to one embodiment, the process of manufacturing the first hole (650) may include a process of cutting the side of the housing assembly (610) using a first cutting tool (1410). In this process, the first cutting tool (1410) may machine the inner surface of the housing assembly (610). Through the first cutting tool (1410), a conduit (e.g., the second conduit (652) of FIG. 9) may be formed in the internal mechanism (612) of the housing assembly (610).

[0144] Referring to FIG. 14b, the process of manufacturing the first hole (650) may include a process of cutting the side of the housing assembly (610) using a second cutting tool (1420). In this process, the second cutting tool (1420) may machine the outer surface of the housing assembly (610). Through the second cutting tool (1420), a conduit (e.g., the first conduit (651) of FIG. 9) may be formed in the side wall (611) and internal mechanism (612) of the housing assembly (610).

[0145] According to one embodiment, the end of the second cutting tool (1420) (e.g., cutting edge or tool tip) may have a surface or edge corresponding to the inclined surface (6121a) of the rib (6121). Due to the shape of the end of the second cutting tool (1420), the inclined surface (6121a) of the rib (6121) may also be formed during the process of forming the first conduit (651). The angle of inclination of the inclined surface (6121a) may be adjusted by changing the shape of the end of the second cutting tool (1420).

[0146] As illustrated in FIGS. 14a and 14b, the first hole (650) can be formed through two horizontal cutting processes. If the first hole (650) is to be formed at an angle to the side of the housing assembly (610) when machining, a separate manufacturing device and process for drilling the angled structure may be added, which may increase manufacturing costs. In the present disclosure, the process is simplified by machining the first hole (650) by cutting only in the horizontal direction, and as a result, manufacturing costs and time can be reduced.

[0147] FIGS. 14a and 14b illustrate, exemplarily, a part of the process of manufacturing the first hole (650) and the rib (6121) according to one embodiment. In this case, the process illustrated in FIGS. 14a and 14b does not necessarily have to be performed sequentially.

[0148] FIG. 15 is an exemplary drawing for explaining the effect of the hole structure of a housing assembly according to one embodiment.

[0149] All features, components, and / or arrangement relationships between components illustrated in FIGS. 1 through 14b may be included, either alone or in combination with, features, components, and arrangement relationships between components described in other figures of this specification. Likewise, all features, components, and / or arrangement relationships between components described in relation to FIGS. 1 through 14b, and FIGS. 16 and 17 may be included, either alone or in combination with, features, components, and arrangement relationships between components described in FIG. 15.

[0150] FIG. 15 illustrates a case where the SIM pin (1510) is incorrectly inserted into the first hole (650) during the process of the user extracting the SIM tray using the SIM pin (1510).

[0151] As illustrated in FIG. 15, in the past, there was a problem where the mesh member (680) or sealing member (670) was damaged by the SIM pin (1510) when the user incorrectly inserted the SIM pin (1510) into the first hole (650) (or speaker hole). In the present disclosure, the rib (6121) prevents the entry of the SIM pin (1510), thereby preventing damage to the mesh member (680) or sealing member (670) from the user's incorrect insertion.

[0152] According to one embodiment, the vertical length (H5) between the top of the first conduit (651) and the end of the rib (6121) may be smaller than the thickness of the SIM pin (1510). For example, if the thickness of the SIM pin (1510) is 0.8 mm, the vertical length (H5) may be less than 0.8 mm. For example, the vertical length (H5) may be 0.6 mm or less. As the vertical length (H5) becomes smaller, the mesh member (680) and the sealing member (670) can be protected from tools inserted from the outside, such as the SIM pin (1510). The rib (6121) may act as a stopper to prevent the SIM pin (1510) from entering the interior through the first hole (650). The rib (6121) can be formed to prevent the SIM pin (1510) from accessing the mesh member (680) or the sealing member (670).

[0153] FIG. 16 is an experimental example showing the speaker output performance of a hole structure of a housing assembly according to one embodiment.

[0154] FIG. 16 shows a graph of sound pressure levels (dB) measured at frequency (Hz) for each speaker. The first acoustic characteristic curve (1610) represents the sound pressure levels (dB) at frequency (Hz) measured in the structure of the speaker (e.g., speaker (640) of FIG. 6) and the first hole (e.g., first hole (650) of FIG. 9) shown in FIG. 6. The second acoustic characteristic curve (1620) represents the sound pressure levels (dB) at frequency (Hz) measured in the speaker (640) and the general hole structure. To provide a technical effect of physically blocking the insertion of a standard tool, such as a SIM pin (1510) which generally has a thickness of about 0.8 mm, the vertical length (H5) between the top of the first tube (651) and the end of the rib (6121) is important. This vertical length (H5) must be smaller than the thickness of the tool to be blocked. Thus, the vertical length (H5) is less than 0.8 mm. To provide a safety margin, the preferred maximum length of H5 is 0.7 mm. In particular, in a rigid embodiment, the vertical length (H5) is 0.6 mm or less.

[0155] As shown in FIG. 16, it can be experimentally confirmed that even if the structure of the first hole (650) of the present disclosure is processed as a speaker hole, the acoustic characteristics are substantially the same as those of a general speaker hole.

[0156] FIG. 17 is a cross-sectional view of a hole structure of a housing assembly according to one embodiment.

[0157] All features, components, and / or arrangement relationships between components illustrated in FIG. 17 may be included, either alone or in combination with, the features, components, and arrangement relationships between components described in other figures of this specification. Likewise, all features, components, and / or arrangement relationships between components described in relation to FIG. 1 through 16 may be included, either alone or in combination with, the features, components, and arrangement relationships between components described in FIG. 17.

[0158] Referring to FIG. 17, an electronic device according to one embodiment (e.g., the electronic device (101) of FIG. 1, the electronic device (101) of FIG. 2) may include a housing assembly (1710) and a first hole (1720). The housing assembly (1710) is an embodiment that modifies some of the configuration of the housing assembly of FIG. 9 (e.g., the housing assembly (610) of FIG. 9). The first hole (1720) is an embodiment that modifies some of the configuration of the first hole of FIG. 9 (e.g., the first hole (650) of FIG. 9).

[0159] According to one embodiment, the housing assembly (1710) may include a side wall (1711) and an internal structure (1712). The internal structure (1712) may include a rib (1712a). The rib (1712a) may have substantially the same shape as the rib of FIG. 9 (e.g., rib (6121) of FIG. 9).

[0160] According to one embodiment, the first hole (1720) may include a first conduit (1721) and a second conduit (1722). The first conduit (1721) may be formed to be inclined with respect to the side of the side wall (1711). The second conduit (1722) may be formed to be inclined with respect to the side of the side wall (1711). The first conduit (1721) and the second conduit (1722) may be formed using a CNC method, but are not limited thereto.

[0161] According to one embodiment, the first conduit (1721) may be formed to extend from the outside of the housing assembly (1710). The first conduit (1721) may be a passage extending inward starting from an adjacent portion on the side outside of the housing assembly (610). For example, the first conduit (1721) may be formed to penetrate the side wall (1711) and a portion of the internal mechanism (1712).

[0162] According to one embodiment, the second conduit (1722) may be formed to extend from the inside of the housing assembly (1710). The second conduit (1722) may be a passage that starts from an adjacent portion on the side inside of the housing assembly (1710) and extends outward. For example, the second conduit (1722) may be formed to penetrate a portion of the internal mechanism (1712).

[0163] According to one embodiment, the first conduit (1721) and the second conduit (1722) may be arranged staggered so that only a portion overlaps. The first conduit (1721) and the second conduit (1722) may extend in directions parallel to each other. For example, the horizontal position of the first conduit (1721) and the horizontal position of the second conduit (1722) may be different. For example, the first conduit (1721) may be positioned closer to the display (115) than the second conduit (1722).

[0164] An electronic device according to one embodiment of the present disclosure (e.g., the electronic device (101) of FIG. 1, the electronic device (101) of FIG. 2) can prevent a user from mistaking the sealing member (670) for a foreign substance by forming a first hole (e.g., the first hole (650) of FIG. 9 or the first hole (1720) of FIG. 17) and a rib (e.g., the rib (6121) of FIG. 9 or the rib (1712a) of FIG. 17)) so that the internal sealing member (e.g., the sealing member (670) of FIG. 9) is not identifiable when viewed from the outside.

[0165] An electronic device (101) according to one embodiment of the present disclosure can prevent a user from damaging a sealing member (670) or a mesh member (e.g., a mesh member (680) of FIG. 9) by incorrectly inserting a SIM pin (e.g., a SIM pin (1510) of FIG. 15) by configuring a first hole (650, 1720) and a rib (6121, 1712a).

[0166] An electronic device (101) according to one embodiment may include a display (230), a housing assembly (610) comprising a side wall (611) forming an outer surface of the electronic device and an internal mechanism (612) formed integrally with the side wall (611) and configured to support the display (230), and a rear plate (280) disposed on the opposite side of the display (230). The housing assembly (610) may include a hole (650) formed to penetrate a part of the internal mechanism (612) and a part of the side wall (611). The hole (650) may include a first conduit (651) formed to extend from the outside of the side wall (611) and a second conduit (652) formed to extend from the inside of the housing assembly (610) and to communicate with the first conduit (651). The internal structure (612) may include a rib (6121) extending from the end of the first conduit (651) toward the second conduit (652). The rib (6121) may be formed so that at least a portion of the internal components are not visible from the outside of the side wall (611).

[0167] According to one embodiment, the first horizontal path of the first conduit (651) may be located at a lower height than the second horizontal path of the second conduit (652) relative to the display (230). The first horizontal path of the first conduit (651) may be connected to the second horizontal path of the second conduit (652) through at least a portion of the inclined path formed by the inclined surface (6121a) of the rib (6121). This staggered arrangement provides a structural arrangement that allows the rib to block the line of sight, and the inclined path minimizes acoustic degradation and maintains audio quality by providing a smooth and gradual transition to sound waves.

[0168] According to one embodiment, the rib (6121) may have a chamfered edge portion facing the second conduit (652). The chamfered edge of the rib increases the durability of the device by preventing sharp edges from damaging the internal mesh member when the internal mesh member is pressed against the rib due to external impact. Secondly, it facilitates the removal of fine cutting chips that may accumulate on the edge during CNC manufacturing, thereby preventing these chips from contaminating and potentially damaging internal electronic components.

[0169] According to one embodiment, the second conduit (652) may be located between the rib (6121) and the rear plate (280). This feature makes the overall structural arrangement of the acoustic channel more robust. This ensures that the acoustic path from the internally mounted speaker is properly guided into the second conduit and then guided through the rib toward the external opening, thereby securing a functional acoustic path.

[0170] According to one embodiment, it may include a speaker (640) positioned adjacent to the second conduit (652) and supported by the internal mechanism (612).

[0171] According to one embodiment, a sealing member (670) disposed between the speaker (640) and the second conduit (652) may be further included.

[0172] According to one embodiment, at least a portion of the sealing member (670) may be positioned so as to be obscured by the rib (6121) when the hole (650) is viewed from one side of the side wall (611). This feature prevents a user from mistaking a functional internal component for a defect. By physically obscuring the sealing member, the rib provides clear and unambiguous visual information to a user inspecting the hole, ensuring that a normal part of the device is not mistaken for a manufacturing defect or foreign matter. This provides the user with reliable visual feedback regarding the status of the device.

[0173] According to one embodiment, the electronic device (101) may further include a mesh member (680) coupled to the sealing member (670) and configured to prevent foreign matter or liquid entering from the hole (650) from entering the speaker (640). This feature provides a protective function. It acts as a physical barrier to prevent the intrusion of liquid as well as foreign matter such as dust and pocket lint. By directly protecting the sensitive internal speaker from physical damage and short circuits, this increases the overall durability, reliability, and lifespan of the electronic device.

[0174] According to one embodiment, the first conduit (651) and the second conduit (652) may each extend in a direction perpendicular to the side of the side wall (611). This arrangement allows the hole to be formed using a simple linear cutting process (e.g., CNC drilling) and eliminates the need for more complex and costly bevel machining operations. This simplifies the manufacturing process, reducing both production time and cost.

[0175] According to one embodiment, the first channel (651) and the second channel (652) may each extend in a direction parallel to the display (115). This structural arrangement is suitable for thin and planar electronic devices. It aligns the acoustic channels with the main front and rear surfaces of the device, ensuring that sound is emitted from the sides in a predictable and efficient manner. This configuration allows effective acoustic channels to be incorporated within the spatial constraints of a thin device profile.

[0176] According to one embodiment, the first conduit (651) and the second conduit (652) may extend in directions parallel to each other. This parallel arrangement is one aspect of the design that allows the interposed rib to effectively block direct view while maintaining a simple geometric structure that is easy to manufacture.

[0177] According to one embodiment, the first conduit (651) may be positioned closer to the display (115) than the second conduit (652). This particular arrangement ensures that the rib extending upward from the bottom surface of the first conduit path is optimally positioned to obstruct the view of the deeper second conduit and the internal components located behind it.

[0178] According to one embodiment, the first conduit (651) and the second conduit (652) can be formed through a CNC method.

[0179] According to one embodiment, the first conduit (651) and the second conduit (652) may each be formed to be inclined with respect to the side of the side wall (611).

[0180] According to one embodiment, the effective cross-sectional area of ​​the first conduit (651) may be smaller than or equal to the effective cross-sectional area of ​​the second conduit (652). This ensures that the acoustic path does not narrow as it extends deeper into the device. This maintains the intended sound quality and volume by preventing the creation of acoustic bottlenecks that could restrict airflow and degrade speaker performance.

[0181] According to one embodiment, the effective cross-sectional area of ​​the first conduit (651) may be smaller than or equal to the effective cross-sectional area of ​​the portion where the first conduit (651) and the second conduit (652) overlap or are connected. This feature ensures that the transition space connecting the two conduits does not restrict the acoustic path. By maintaining a sufficiently large cross-sectional area at this joint, the design prevents acoustic impedance mismatch and pressure drop that could negatively affect sound quality, thereby ensuring the smooth and efficient passage of sound waves.

[0182] According to one embodiment, the height of the rib (6121) may be 0.6 mm or more.

[0183] To further prevent visual artifacts that may cause misunderstanding due to light reflected from the rib (6121), a reflection reduction feature may be provided on the surface of the rib, particularly on the inclined surface (6121a). This feature is configured to mitigate specular reflection of incident light entering through the first conduit (651). This can be achieved, for example, by absorbing or scattering a portion of the incident light. In one embodiment, the reflection reduction feature includes an anti-reflective layer (1210) coated on the surface. In another embodiment, the reflection reduction feature includes an uneven surface (6121a-1) formed on the rib to induce diffuse reflection.

[0184] According to one embodiment, the electronic device (101) may further include an anti-reflective layer (1210) coated on the surface of the rib (6121). This feature physically reduces specular reflection of incident light. By absorbing a portion of the light, this layer minimizes glare and reflections that may appear to a user looking into the hole. This resolves the problem of misleading visual artifacts, ensuring that the user is not confused by reflections that may be mistaken for foreign matter or moisture within the device.

[0185] According to one embodiment, at least a portion of the surface of the rib (6121) may be textured to induce scattering of light. This feature scatters incident light by inducing diffuse reflection. This physical mechanism prevents specular reflection, where light is reflected directly to the observer. The advantage is that it solves a technical problem by eliminating potentially confusing visual artifacts, such as flashes of light, thereby providing clear and non-misleading visual feedback to a user inspecting the opening.

[0186] According to one embodiment, when viewed from the outside of the hole (650), a part of the plane perpendicular to the extension direction of the first conduit (651) may overlap with a part of the plane perpendicular to the extension direction of the second conduit (652).

[0187] The embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" each may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as “coupled” or “connected” to another (e.g., 2nd) component, with or without the terms “functionally” or “communicationly,” it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0188] The term “module” as used in the embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0189] One embodiment of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0190] According to one embodiment, the method according to the embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0191] According to one embodiment, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to one embodiment, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to one embodiment, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device (101), Display (230); A housing assembly (610) comprising a side wall (611) forming the outer surface of the electronic device and an internal mechanism (612) formed integrally with or fixed to the side wall (611) and configured to support the display (230); and It includes a rear plate (280) positioned on the opposite side of the above display (230), and The housing assembly (610) includes a hole (650) formed to penetrate a part of the internal mechanism (612) and a part of the side wall (611), and The above hole (650) is, A first conduit (651) formed to extend from the outside of the above side wall (611); and It includes a second conduit (652) that extends from the inside of the housing assembly (610) and is formed to communicate with the first conduit (651), and The above internal structure (612) includes a rib (6121) extending from the inner end of the first conduit (651) toward the second conduit (652), and The above rib (6121) is positioned to block a direct view through the hole (650) from the outside of the side wall (611), Electronic device.

2. In Paragraph 1, The first horizontal path of the first conduit (651) is located at a lower height than the second horizontal path of the second conduit (652) when viewed from the perspective of the display (230), and The first horizontal path of the first conduit (651) is connected to the second horizontal path of the second conduit (652) through at least a portion of the inclined path formed by the inclined surface (6121a) of the rib (6121). Electronic device.

3. In Paragraph 1 or 2, The above rib (6121) is, The corner portion facing the second conduit (652) is chamfered. Electronic device.

4. In any one of paragraphs 1 through 3, The second conduit (652) is located between the rib (6121) and the rear plate (280). Electronic device.

5. In any one of paragraphs 1 through 4, A speaker (640) positioned adjacent to the second conduit (652) and supported by the internal mechanism (612); and It further includes a sealing member (670) disposed between the speaker (640) and the second conduit (652), and At least a portion of the sealing member (670) is positioned so as to be covered by the rib (6121) when looking at the hole (650) from the outer side of the side wall (611). Electronic device.

6. In Paragraph 5, Further including a mesh member (680) coupled to the sealing member (670) and configured to prevent foreign substances or liquids entering from the hole (650) from entering the speaker (640). Electronic device.

7. In any one of paragraphs 1 through 6, The first conduit (651) and the second conduit (652) each extend in a direction perpendicular to the side of the side wall (611). Electronic device.

8. In any one of paragraphs 1 through 7, The first conduit (651) and the second conduit (652) each extend in a direction parallel to the display (230). Electronic device.

9. In any one of paragraphs 1 through 8, The first conduit (651) and the second conduit (652) are extended in directions parallel to each other. Electronic device.

10. In any one of paragraphs 1 through 9, The first conduit (651) is positioned closer to the display (230) than the second conduit (652), Electronic device.

11. In any one of paragraphs 1 through 10, The effective cross-sectional area of ​​the first conduit (651) is smaller than or equal to the effective cross-sectional area of ​​the second conduit (652). Electronic device.

12. In any one of paragraphs 1 through 13, The effective cross-sectional area of ​​the first conduit (651) is smaller than or equal to the effective cross-sectional area of ​​the portion where the first conduit (651) and the second conduit (652) overlap or are connected. Electronic device.

13. In any one of paragraphs 1 through 12, A further comprising an anti-reflective layer (1210) coated on the surface of the above rib (6121), Electronic device.

14. In any one of paragraphs 1 through 13, At least a portion of the surface of the rib (6121) is textured to induce light scattering, Electronic device.

15. In any one of paragraphs 1 through 14, When viewed from the outside of the hole (650), a part of the plane perpendicular to the extension direction of the first conduit (651) overlaps with a part of the plane perpendicular to the extension direction of the second conduit (652). Electronic device.

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