Electronic device comprising antenna

Abstract

According to various embodiments, an electronic device may comprise a connection substrate configured to electrically connect a substrate and a conductive portion used as a radiator, and including a first area including a ground plane and a second area configured to be fixed to a conductive member, wherein the connection substrate comprises: a loop-shaped first wire branched from a first point of the ground plane and connected to a second point of the ground plane through the second area; at least one connection pad electrically connected to the first wire and exposed on a first substrate surface of the connection substrate; and at least one conductive washer fixed to be in contact with the at least one connection pad, and a wireless communication circuit is configured to transmit and / or receive a wireless signal through the conductive portion and the at least one conductive washer.

Description

Electronic device including an antenna

[0001] The embodiments of the present disclosure relate to an electronic device comprising an antenna.

[0002] An electronic device may be configured to communicate with an external electronic device using wireless communication technology. For example, wireless communication technology may include at least one of LTE (long term evolution) communication, 5G communication (or NR (new radio) communication), 6G communication, ultra-wideband (UWB) communication, Wi-Fi (wireless fidelity) communication, satellite communication, or Bluetooth communication. The electronic device may include at least one antenna for using the aforementioned wireless communication technologies. The antenna needs to be placed in the electronic device through an efficient design.

[0003] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0004] The electronic device may include at least one antenna (e.g., an antenna structure or an antenna module). The at least one antenna may include a legacy antenna operating in a frequency band of about 600 MHz to 6000 MHz, a satellite antenna operating in a frequency band of about 1.5 GHz to 2.2 GHz, an ultra-wide band (UWB) antenna operating in a frequency band of about 6 GHz to 8.5 GHz, a 6G antenna operating in a frequency band of about 7 GHz to 8 GHz or about 14 GHz to 15 GHz, or a mmWave antenna operating in a frequency band of about 3 GHz to 300 GHz.

[0005] At least one antenna used in an electronic device may be implemented using at least a portion of a conductive side member (e.g., a metal frame or a metal bezel). The conductive side member may be used as an antenna radiator by being electrically connected to a substrate (e.g., a main board) placed inside the electronic device via a connecting substrate (e.g., an FRC, flexible RF cable).

[0006] However, antennas provided using conductive side members of electronic devices are difficult to cover increasingly diverse frequency bands, and in electronic devices that are becoming slimmer and smaller, it is difficult to secure an effective ground area for the antenna due to the reduction of the connection board, and the radiation performance of the antenna may deteriorate.

[0007] Various embodiments of the present disclosure may provide an electronic device including an antenna that can help improve radiation performance by expanding the effective ground area of ​​the connection substrate.

[0008] Various embodiments can provide an electronic device including an antenna that can facilitate easy frequency transition of the antenna through an improved connection structure of a connection board.

[0009] Various embodiments may provide an electronic device including an antenna that is provided with a connection structure that can help secure broadband performance.

[0010] According to various embodiments, an antenna that can help improve radiation performance through a stable ground connection structure and an electronic device including the same can be provided.

[0011] However, the problems intended to be solved in this disclosure are not limited to those mentioned above, and may be expanded in various ways without departing from the spirit and scope of this disclosure.

[0012] According to various embodiments, the electronic device may include a housing comprising a conductive member connected to ground and a conductive portion spaced apart from the conductive member, a substrate disposed in the housing and comprising a wireless communication circuit, and a connecting substrate electrically connecting the substrate and the conductive portion, comprising a first region including a ground plane and a second region for being fixed to the conductive member. The connecting substrate may include a loop-shaped first wiring branched from a first point of the ground plane and connected to a second point of the ground plane through the second region, at least one connection pad electrically connected to the first wiring and exposed on a first substrate surface of the connecting substrate in the second region, and at least one conductive washer fixed to contact the at least one connection pad in the second region, and the wireless communication circuit may be configured to transmit and / or receive a wireless signal in at least one frequency band through the conductive portion and the at least one conductive washer.

[0013] An electronic device according to exemplary embodiments of the present disclosure comprises a structure of at least one conductive washer interposed to connect a conductive member, which is disposed in a fixed area (e.g., a second area) of a connecting substrate and connected to the ground of the electronic device, and the ground plane of the connecting substrate. This structure of placement can help improve the radiation performance of an antenna (increase gain and / or increase bandwidth) by providing an extended effective ground area for the antenna. Additionally, the operating frequency band of the antenna can be easily shifted by changing the arrangement of at least one conductive washer (e.g., size, shape, or number).

[0014] In addition, various effects that can be identified directly or indirectly through this document may be provided.

[0015] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs from the description below.

[0016] In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0017] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

[0018] FIG. 2a is a front perspective view of an electronic device according to various embodiments of the present disclosure.

[0019] FIG. 2b is a perspective view of the rear of the electronic device of FIG. 1 according to various embodiments of the present disclosure.

[0020] FIG. 3 is an exploded perspective view of the electronic device of FIG. 2b according to various embodiments of the present disclosure.

[0021] FIG. 4a is a diagram showing the configuration of a connecting substrate according to various embodiments of the present disclosure.

[0022] FIG. 4b is a configuration diagram of a speaker assembly according to various embodiments of the present disclosure.

[0023] FIG. 4c is a drawing illustrating a state in which a connecting board is placed on a part of a speaker assembly according to various embodiments of the present disclosure.

[0024] FIG. 4d is a drawing showing the back of a speaker assembly according to various embodiments of the present disclosure.

[0025] FIG. 5a is a partial configuration diagram of a side member in an electronic device according to various embodiments of the present disclosure.

[0026] FIG. 5b is a partial configuration diagram of a side member having a connecting substrate arranged thereon according to various embodiments of the present disclosure.

[0027] FIG. 5c is a partial configuration diagram of a side member in which a speaker assembly is positioned with a connecting substrate in between, according to various embodiments of the present disclosure.

[0028] FIG. 6a is a diagram showing the configuration of a connecting substrate according to various embodiments of the present disclosure.

[0029] FIG. 6b is an enlarged view of the 6b area of ​​FIG. 6a according to various embodiments of the present disclosure.

[0030] FIGS. 7a and 7b are partial configuration diagrams of layers of a connecting substrate according to various embodiments of the present disclosure.

[0031] FIGS. 8a and 8b are configuration diagrams of flexible substrates including an extended ground plane according to various embodiments of the present disclosure.

[0032] FIGS. 9a and 9b are configuration diagrams of a flexible substrate illustrating the arrangement structure of a conductive washer according to various embodiments of the present disclosure.

[0033] FIG. 10 is a graph comparing the radiation performance of an antenna according to the presence or absence and arrangement of a conductive washer according to various embodiments of the present disclosure.

[0034] FIG. 11 is a graph comparing the radiation performance of an antenna according to the presence or absence and length change of a second wiring according to various embodiments of the present disclosure.

[0035] FIG. 12a is a perspective view of an electronic device in an unfolded state according to various embodiments of the present disclosure.

[0036] FIG. 12b is a diagram of an electronic device in a folded state according to various embodiments of the present disclosure.

[0037] FIG. 13 is a partial configuration diagram of a connection board applied to the electronic device of FIG. 12a according to various embodiments of the present disclosure.

[0038] Hereinafter, embodiments of the present disclosure are described in detail with reference to the drawings so that those skilled in the art can easily practice them. However, the present disclosure may be embodied in various different forms and is not limited to the embodiments described herein. In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and brevity.

[0039] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

[0040] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0041] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), for example, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0042] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0043] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0044] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0045] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0046] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0047] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0048] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) acquires sound through the input module (150), or through the sound output module (155), or through the electronic device (101) and 450

[0049] Sound can be output through an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly.

[0050] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0051] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0052] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0053] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0054] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0055] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0056] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0057] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0058] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0059] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0060] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0061] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0062] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0063] FIG. 2a is a front perspective view of an electronic device according to various embodiments of the present disclosure. FIG. 2b is a rear perspective view of the electronic device of FIG. 1 according to various embodiments of the present disclosure.

[0064] The electronic device (200) of FIGS. 2a and 2b may be at least partially similar to the electronic device (101) of FIG. 1, or may include other embodiments of the electronic device.

[0065] Referring to FIG. 2a and FIG. 2b, an electronic device (200) according to one embodiment may include a housing (210) comprising a first surface (or front) (210A), a second surface (or rear) (210B), and a side (210C) surrounding the space between the first surface (210A) and the second surface (210B). In other embodiments (not shown), the housing (210) may refer to a structure forming some of the first surface (210A), the second surface (210B), and the side (210C). According to one embodiment, the first surface (210A) may be formed by a front plate (202) (e.g., a glass plate or a polymer plate including various coating layers) in which at least a portion is substantially transparent. The second surface (210B) may be formed by a rear plate (211) that is substantially opaque. The rear plate (211) may be formed, for example, by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side (210C) may be formed by a side bezel structure (or "side member") (218) comprising metal and / or polymer, which is combined with the front plate (202) and the rear plate (211). In some embodiments, the rear plate (211) and the side bezel structure (218) may be formed integrally and may comprise the same material (e.g., a metallic material such as aluminum).

[0066] In the illustrated embodiment, the front plate (202) may include a first region (210D) that curves seamlessly from the first surface (210A) toward the rear plate at both ends of the long edge of the front plate. In the illustrated embodiment (see FIG. 2b), the rear plate (211) may include a second region (210E) that curves seamlessly from the second surface (210B) toward the front plate at both ends of the long edge. In some embodiments, the front plate (202) or the rear plate (211) may include only one of the first region (210D) or the second region (210E). In some embodiments, the front plate (202) and the rear plate (211) may not include the first region (210D) and the second region (210E), and may only include a flat plane arranged parallel to the second surface (210B). In the embodiments, when viewed from the side of the electronic device, the side bezel structure (218) may have a first thickness (or width) on the side that does not include the first region (210D) or the second region (210E), and a second thickness that is thinner than the first thickness on the side that includes the first region (210D) or the second region (210E).

[0067] According to one embodiment, the electronic device (200) may include at least one of a display (201), an input device (203), an audio output device (207, 214), a sensor module (204, 219), a camera module (205, 212, 213), a key input device (217), an indicator (not shown), and a connector (208). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., a key input device (217), or an indicator) or additionally include other components.

[0068] The display (201) may be exposed, for example, through a substantial portion of the front plate (202). In some embodiments, at least a portion of the display (201) may be exposed through the front plate (202) forming the first surface (210A) and the first area (210D) of the side (210C). The display (201) may be combined with or placed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer that detects a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor module (204, 219) and / or at least a portion of the key input device (217) may be placed in the first area (210D) and / or the second area (210E).

[0069] The input device (203) may include a microphone. In some embodiments, the input device (203) may include a plurality of microphones positioned to detect the direction of sound. The sound output device (207, 214) may include speakers. The speakers may include an external speaker (207) and a call receiver (214). In some embodiments, the microphone, speakers, and connector (208) may be positioned in the space of the electronic device (200) and may be exposed to the external environment through at least one hole formed in the housing (210). In some embodiments, the hole formed in the housing (210) may be used for both the microphone and the speakers. In some embodiments, the sound output device (207, 214) may include a speaker (e.g., a piezo speaker) that operates with the hole formed in the housing (210) excluded. In some embodiments, the electronic device (200) may include a tray member positioned through at least a portion of the side bezel structure (218).

[0070] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., proximity sensor) and / or a second sensor module (not shown) (e.g., fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) (e.g., HRM sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on the first surface (210A) of the housing (210). The fingerprint sensor (e.g., ultrasonic or optical fingerprint sensor) may be disposed below the display (201) on the first surface (210A). The electronic device (200) may further include at least one of an unillustrated sensor module, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor (204).

[0071] The camera modules (205, 212, 213) may include a first camera device (205) disposed on a first surface (210A) of the electronic device (200), a second camera device (212) disposed on a second surface (210B), and / or a flash (213). The camera modules (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light-emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide-angle and telephoto lenses) and image sensors may be disposed on one surface of the electronic device (200).

[0072] A key input device (217) may be placed on the side (210C) of the housing (210). In another embodiment, the electronic device (200) may not include some or all of the aforementioned key input devices (217), and the key input device (217) not included may be implemented in other forms, such as soft keys, on the display (201). In another embodiment, the key input device (217) may be implemented using a pressure sensor included in the display (201).

[0073] The indicator may be placed, for example, on a first surface (210A) of the housing (210). The indicator may, for example, provide status information of the electronic device (200) in the form of light. In another embodiment, the light-emitting element may, for example, provide a light source that is coupled with the operation of the camera module (205). The indicator may include, for example, an LED, an IR LED, and a xenon lamp.

[0074] The connector hole (208) may include a first connector hole (208) capable of accommodating a connector (e.g., a USB connector or an IF module (interface connector port module)) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (or earphone jack) capable of accommodating a connector for transmitting and receiving audio signals with an external electronic device.

[0075] Some of the camera modules (205, 212), some of the sensor modules (204, 219), or indicators may be positioned to be exposed through the display (201). For example, the camera module (205), sensor module (204), or indicator may be positioned to come into contact with the external environment through an opening or a transparent area perforated to the front plate (202) of the display (201) within the internal space of the electronic device (200). In one embodiment, the area where the display (201) and the camera module (205) face each other may be formed as a transparent area having a certain transmittance as part of the area for displaying content. In one embodiment, the transparent area may be formed to have a transmittance in the range of about 5% to about 20%. This transparent area may include an area that overlaps with the effective area (e.g., field of view area) of the camera module (205) through which light passes to form an image and generate an image by being formed by an image sensor. For example, the transparent area of ​​the display (201) may include an area with a lower pixel density than the surrounding area. For example, the transparent area may replace the opening. For example, the camera module (205) may include an under-display camera (UDC). In another embodiment, some sensor modules (204) may be positioned to perform their functions without being visually exposed through the front plate (202) within the internal space of the electronic device. For example, in this case, the perforated opening may be unnecessary for the area of ​​the display (201) facing the sensor modules.

[0076] According to various embodiments, the electronic device (200) may include side surfaces (or lateral surfaces) (218-1, 218-2, 218-3, 218-4) (e.g., sides) that are disposed through a side member (218) and exposed to the outside of the electronic device (200). In one embodiment, the side member (218) may be formed at least partially from a conductive member (e.g., the conductive member (218a) of FIG. 5a) (e.g., metal). In one embodiment, the sides (218-1, 218-2, 218-3, 218-4) comprise a first side surface (218-1) having a first length (e.g., a first side), a second side surface (218-2) having a second length longer than the first length and extending perpendicularly from the first side surface (218-1) (e.g., a second side), a third side surface (218-3) having a first length and extending parallel to the first side surface (218-1) from the second side surface (218-2), and a fourth side surface (a fourth side) having a second length parallel to the second side surface (218-2) extending from the third side surface (218-3) to the first side surface (218-1) and extending parallel to the second side surface (218-2). It may include a surface (218-4) (e.g., a fourth side). In one embodiment, the side member (218) may include a conductive portion (231) that is electromagnetically segmented from a conductive member through a pair of spaced-apart non-conductive portions (232, 233) (e.g., segments, gaps, spaces, or non-conductive members). In one embodiment, the conductive portion (231) may be formed through a first non-conductive portion (232) located on the first side (218-1) and a second non-conductive portion (233) located on the second side (218-2).However, it is not limited thereto, and the conductive portion (231) may be formed through a pair of spaced non-conductive portions in the first side (218-1) or through a pair of spaced non-conductive portions in the second side (218-2). In one embodiment, the conductive portion (231) may be used as an antenna (A) (e.g., a radiator) by being electrically connected to a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) disposed on a substrate of the electronic device (200) (e.g., a substrate (240) of FIG. 3). In one embodiment, the wireless communication circuit may be configured to transmit and / or receive a wireless signal in at least one frequency band through the conductive portion (231). In one embodiment, at least one frequency band may include a frequency band in the range of about 600 MHz to 6000 MHz (e.g., legacy band), a frequency band in the range of about 1.5 GHz to 2.2 GHz (e.g., satellite communication band), a frequency band in the range of about 6 GHz to 8.5 GHz (e.g., UWB band), or a frequency band in the range of about 7 GHz to 8 GHz or about 14 GHz to 15 GHz (e.g., 6G band).

[0077] FIG. 3 is an exploded perspective view of the electronic device of FIG. 2b according to various embodiments of the present disclosure.

[0078] Referring to FIG. 3, the electronic device (200) may include a side member (218) (e.g., a side bezel structure or a side frame), a support member (2181) (e.g., a bracket, a support member, or a support structure) extending from the side member (218) into the internal space (2101) of the electronic device (200), a front cover (202) (e.g., a front plate, a first plate, or a first cover) coupled to one side of the side member (218), and a rear cover (211) (e.g., a rear plate, a second plate, a cover member, or a second cover) coupled to the other side of the side member (218) so as to face in the opposite direction to the front cover (202). In one embodiment, the electronic device (200) may include a housing (e.g., the housing (210) of FIG. 2a) (e.g., a housing structure) formed by combining the side member (218), the front cover (202), and / or the rear cover (211). In one embodiment, the electronic device (200) may include a display (201) disposed in the internal space (2101) of a housing, a substrate (240), a camera module (212) disposed near the substrate (240), a battery (243), a sub-substrate (241) disposed spaced apart from the substrate (240) with the battery (243) in between, and a module assembly (242) (e.g., a speaker assembly, a microphone assembly, or an interface connector assembly) electrically connected to the substrate (240) and / or the sub-substrate (241). In some embodiments, at least one of the above-described components may be omitted, or at least one other component may be additionally included.

[0079] According to various embodiments, the support member (2181) may be disposed inside the electronic device (200) and may be combined with the side member (218) or extend integrally from the side member (218). In one embodiment, the side member (218) and / or the support member (2181) may be formed of, for example, a conductive member (e.g., the conductive member (218a) of FIG. 5a) (e.g., metal) and / or a non-conductive member (e.g., the non-conductive member of FIG. 5) (e.g., polymer). In one embodiment, the conductive member (218a) may be electrically connected to the ground of the substrate (240). In one embodiment, the support member (2181) may include a first surface (2181a) facing the front cover (202) and a second surface (2181b) facing the rear cover (211). In one embodiment, the display (201) is positioned to be supported at least partially by the first surface (2181a) and may be visually exposed so as to be visible from the outside of the electronic device (200) through the front cover (202). In one embodiment, the substrate (240), sub-substrate (241), module assembly (242), and battery (243) may be positioned to be supported at least partially by the second surface (2181b). In one embodiment, the electronic device (200) may include a processor, memory, and / or interfaces disposed on the substrate (240). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0080] Memory may include, for example, volatile memory or non-volatile memory.

[0081] The interface may include, for example, an HDMI (high definition multimedia interface), a USB (universal serial bus) interface, an SD card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device (200) to an external electronic device and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0082] The battery (243) is a device for supplying power to at least one component of the electronic device (120) and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (243) may be positioned side-by-side so as to be substantially coplanar with, for example, the substrate (240) and / or the sub-substrate (241). The battery (243) may be embedded inside the electronic device (200). In some embodiments, the battery (243) may be detachably positioned from the electronic device (200).

[0083] According to various embodiments, the electronic device (200) may include at least one electrical connection device (245) for electrically connecting a substrate (240) and a sub-substrate (241), and / or a substrate (240) and a module assembly (242). In one embodiment, the at least one electrical connection device (245) may include a flexible printed circuit board (FPCB).

[0084] According to various embodiments, the electronic device (200) may include a connecting board (300) for electrically connecting a conductive portion (e.g., conductive portion (231) of FIG. 2a) of a side member (218) used as an antenna (e.g., antenna (A) of FIG. 2a) and a substrate (240). In one embodiment, the connecting board (300) may include a flexible printed circuit board (FPCB) or a rigid PCB disposed in an internal space (2101). In one embodiment, at least a portion of the connecting board (300) may be disposed to be supported by a structure disposed in the internal space (2101) of the electronic device (200). In one embodiment, the structure may include a speaker assembly (250) comprising a speaker coupled with a bracket. In some embodiments, the connecting board (300) may be disposed alone. In some embodiments, the speaker assembly (250) may be replaced with a bracket (e.g., a rear bracket) or a shield can placed in the internal space (2101).

[0085] According to various embodiments, the connecting substrate (300) may include a first region (e.g., the first region (300a) of FIG. 6a) comprising a ground plane (e.g., the ground plane (320) of FIG. 6a) which is an effective ground area for the antenna (A), and a second region (e.g., the second region (300b) of FIG. 6a) which extends from the first region (300a) and is fixed to at least a portion of a conductive member (e.g., the conductive member (218a) of FIG. 5a) through a fastening member (e.g., a screw). In one embodiment, the volume of the connecting substrate (300) is inevitably reduced according to the slimming policy of the electronic device (200), and the ground plane (320) is also reduced, thereby degrading the radiation performance of the antenna through the reduction of the effective ground area for the antenna (A).

[0086] An electronic device (200) according to an exemplary embodiment of the present disclosure may include at least one conductive washer (e.g., a conductive washer (350) of FIG. 6a) disposed between a second region (300b) of a connecting substrate (300) and a conductive member (218a). In one embodiment, the at least one conductive washer (350) may be electrically connected to a wiring structure (e.g., a first wiring (330) of FIG. 6a) extending from a ground plane (320) and in contact with the conductive member (218a) to provide an extended ground area for the antenna (A). In one embodiment, the ground extension structure through the at least one conductive washer (350) may help improve the radiation performance (e.g., bandwidth and / or gain) of the antenna (A). In one embodiment, the operating frequency band of the antenna (A) is determined by the size, shape, or number of at least one conductive washer (350), thereby helping to facilitate easy frequency transition, setting the operating frequency range of the antenna (A), or controlling the degree of increase in radiation performance. In some embodiments, the operating frequency band of the antenna (A) is determined by the length and / or width of the wiring structure (330), thereby helping to facilitate easy frequency transition. In one embodiment, the ground extension structure through at least one conductive washer (350) can help to slim down the electronic device (200) because it utilizes an existing fixed area (e.g., a second area) without increasing the size of the connection board (300).

[0087] FIG. 4a is a diagram showing the configuration of a connecting substrate according to various embodiments of the present disclosure.

[0088] Referring to FIG. 4a, the connecting substrate (300) may include a dielectric substrate (310) comprising a plurality of layers (e.g., insulating layers), a first substrate surface (3101) facing a support member (e.g., support member (2181) of FIG. 6a) formed of at least partially a conductive member (e.g., conductive member (218a) of FIG. 5a), and a second substrate surface (3102) facing in the opposite direction to the first substrate surface (3101). In one embodiment, the connecting substrate (300) is illustrated in a 'C' shape as shown, but is not limited thereto. For example, the shape of the connecting substrate (300) can be modified into various shapes depending on the arrangement of surrounding electrical components and / or structures in the internal space (e.g., internal space (2101) of FIG. 3) of an electronic device (e.g., electronic device (200) of FIG. 3). In one embodiment, the connecting substrate (300) may include a plurality of conductive contacts (e.g., C-clips) (C1, C2, C3, C4, C5, C6, C7) disposed on the first substrate surface (3101). In one embodiment, some of the conductive contacts (C1, C2, C3, C4, C5, C6, C7), such as the conductive contact (C1), may be used for power supply by being electrically connected to a signal wiring for an antenna (e.g., signal wiring (3111) of FIG. 6a) and electrically connected to a conductive portion (e.g., conductive portion (231) of FIG. 5a) of a side member (e.g., side member (218) of FIG. 5a). In one embodiment, some of the conductive contacts (C1, C2, C3, C4, C5, C6, C7), including some conductive contacts (C2), are electrically connected to a ground plane (e.g., ground plane (320) in FIG. 6a) disposed on at least one of the plurality of layers of the dielectric substrate (310) at a position spaced apart from the feed conductive contact (C1), and are electrically connected to a conductive portion (231) of the side member (320), so as to be used for grounding to determine an operating frequency band for an antenna (e.g., antenna (A) in FIG. 5a).In one embodiment, some of the conductive contacts (C1, C2, C3, C4, C5, C6, C7) are electrically connected to the ground plane (320) of the connecting board (300) and may be used for grounding to contact a support member (2181) electrically connected to ground placed in the internal space (2101) of the electronic device (200). In one embodiment, the connecting board (300) may include a connector (315) for electrically connecting to a receptacle placed on the substrate of the electronic device (200) (e.g., the substrate (240) of FIG. 3).

[0089] According to various embodiments, the connecting substrate (300) may include a fastening hole (3103) disposed in at least a portion of an area to be fastened to the supporting member (2181) through a fastening member. In one embodiment, the connecting substrate (300) may be fixed to the supporting member (2181) in such a way that the first substrate surface (3101) faces the supporting member (2181) through a fastening member, such as a screw, which penetrates the fastening hole (3103) and is fastened to the supporting member (2181). In one embodiment, the connecting substrate (300) may include a conductive washer (350) disposed around the fastening hole (3103). In one embodiment, the conductive washer (350) may be formed of metal (e.g., stainless steel (SUS)). In one embodiment, the conductive washer (350) is exposed to the first substrate surface (3101) and may be soldered to at least one connection pad (e.g., connection pads (331, 332, 333, 334, 335) of FIG. 6b) that is electrically connected to the ground plane (320) through wiring (e.g., the first wiring (330) of FIG. 6a). In one embodiment, the conductive washer (350) is electrically connected to the ground plane (320) to provide an extended effective ground area for the antenna (A) and may help improve radiation performance, such as increasing the bandwidth and / or improving the gain of the antenna (A). In one embodiment, the conductive washer (350) may include at least one protrusion (3501) that protrudes from the outer surface and contacts the support member (2181). In one embodiment, these protrusions (3501) can help maintain stable radiation performance of the antenna (A) by maintaining a constant contact area between the support member (2181) and the conductive washer (350). In some embodiments, the fastening hole (3103) is omitted, and at least a portion of the connecting substrate (3000) may be fixed to the support member (2181) through bonding or fusion.

[0090] FIG. 4b is a configuration diagram of a speaker assembly according to various embodiments of the present disclosure. FIG. 4c is a diagram showing a state in which a connecting board is placed on a part of a speaker assembly according to various embodiments of the present disclosure. FIG. 4d is a diagram showing the back side of a speaker assembly according to various embodiments of the present disclosure.

[0091] Referring to FIGS. 4b through 4d, an electronic device (e.g., the electronic device (200) of FIG. 3) may include a speaker module (250) disposed in an internal space (e.g., the internal space (2101) of FIG. 3). In one embodiment, the speaker module (250) may include a bracket (251) (e.g., a rear bracket), a module housing (252) disposed to be supported by at least a portion of the bracket (251), and a speaker (253) disposed to be supported by the module housing (252). In one embodiment, at least a portion of a connecting board (300) may be disposed to be supported by the speaker module (250). In one embodiment, at least a portion of the connecting board (300) may be disposed to be supported by at least a portion of the module housing (252) and / or a portion of the bracket (251). In one embodiment, the connecting board (300) may be fixed to the speaker module (250) by taping, bonding, or welding. In one embodiment, the speaker module (250) may be fixed to the support member (2181) by at least one fastening member (e.g., a screw). In one embodiment, the connecting board (300) may be fixed to the support member (2181) together with the speaker module (250) by at least one fastening member for fastening from the back surface (2501) of the speaker module (250) toward the support member (e.g., the support member (2181) of FIG. 5A). In one embodiment, when the speaker module (250) is placed on the support member (2181), the connecting board (300) may be positioned between the speaker module (250) and the support member (2181). Accordingly, the conductive contacts (C1, C2, C3, C4, C5, C6, C7) and the conductive washer (350) of the connecting substrate (300) can be physically contacted with the conductive portion of the side member (218) (e.g., the conductive portion (231) of FIG. 5a) and the supporting member (2181).

[0092] FIG. 5a is a partial configuration diagram of a side member in an electronic device according to various embodiments of the present disclosure. FIG. 5b is a partial configuration diagram of a side member in which a connecting board is disposed according to various embodiments of the present disclosure. FIG. 5c is a partial configuration diagram of a side member in which a speaker assembly is disposed with the connecting board in between according to various embodiments of the present disclosure.

[0093] Referring to FIGS. 5a through 5c, the electronic device (200) may include a side member (218) forming part of a side exposed to the outside (e.g., side (210C) of FIG. 2a) and a support member (2181) extending from the side member (218) into an internal space (2101). In some embodiments, the support member (2181) may be part of the side member (218). In one embodiment, the side member (218) and / or the support member (2181) may include a conductive member (218a) (e.g., metal) and a non-conductive member (218b) (e.g., polymer) coupled to the conductive member (218a) through injection or structural bonding. In one embodiment, the conductive member (218a) may be electrically connected to the ground of the electronic device (200) (e.g., substrate (240)).

[0094] According to various embodiments, the electronic device (200) may include a conductive portion (231) that is electromagnetically segmented from a conductive member (218a) through a pair of spaced-apart non-conductive portions (232, 233) in part of a side member (218). In one embodiment, the conductive portion (231) may operate as a radiator for an antenna (A) for the electronic device (200). In one embodiment, the pair of non-conductive portions (232, 233) may be part of a non-conductive member (218b) coupled with the conductive member (218a). In some embodiments, the pair of non-conductive portions (232, 233) may be formed of a material different from that of the non-conductive member (218b). In one embodiment, the conductive portion (231) can be used as an antenna (A) by being electrically connected to a wireless communication circuit (e.g., wireless communication module (192) of FIG. 1) of a substrate (240) placed in the internal space (2101) of the electronic device (200). In one embodiment, the conductive portion (231) extends from a portion of the first side (218-1) of the electronic device (200) to a portion of the second side (218-2), but is not limited thereto. For example, the conductive portion (231) may be placed on the first side (218-1) or on the second side (218-2). In some embodiments, the conductive portion may be placed on at least a portion of the third side (e.g., the third side (218-3) of FIG. 2a) and / or at least a portion of the fourth side (218-4).

[0095] According to various embodiments, the electronic device (200) may include connecting pieces (2311, 2312) that extend from at least a portion of the conductive portion (231) and are exposed from at least a portion of the non-conductive member (218b) in the internal space (2101). In one embodiment, the connecting pieces (2311, 2312) may include a first connecting piece (2311) that is in physical contact with a first conductive contact (e.g., the first conductive contact (C1) of FIG. 4a) disposed on a connecting substrate (300) and a second connecting piece (2312) that is in physical contact with a second conductive contact (e.g., the second conductive contact (C2) of FIG. 4a). In one embodiment, a wireless communication circuit (192) disposed on a substrate (240) may be electrically connected to a conductive portion (231) through a first conductive contact (C1) and a first connecting piece (C2). In one embodiment, the ground of the substrate (240) may be electrically connected to a conductive portion (231) through a second conductive contact (C2) and a second connecting piece (2312).

[0096] According to various embodiments, the electronic device (200) may include a speaker module (250) disposed in an internal space (2101). In this case, the connecting board (300) is interposed between the speaker module (250) and the support member (2181), so that the connecting board (300) can be electrically connected to the conductive portion (231) by simply the process of mounting the speaker module (250) to the electronic device (200). Accordingly, the connecting board (300) interposed between the speaker module (300) and the support member (2181) can be positioned to electrically connect the conductive portion (231) of the side member (218) and the board (240) disposed in the internal space (2101).

[0097] According to various embodiments, due to the slimming of the electronic device (200) and the complexity of the design, the area of ​​the substrate (240) and / or the connecting substrate (300) is reduced, and the effective ground area for the antenna (A) is reduced, which may result in degraded radiation performance or difficulties in the placement design.

[0098] According to various embodiments of the present disclosure, the electronic device (200) can help improve the radiation performance (e.g., bandwidth and gain) of the antenna (A) by extending the effective ground area for the antenna (A) through a wiring structure and / or a ground plane that extends to at least a portion of the fixed area of ​​the connection substrate (300) that is fixed to the support member (2181), and at least one conductive washer (e.g., conductive washer (350) of FIG. 4a) having a specific size, shape, or number disposed between the conductive member (218a) and the connection substrate (300) and electrically connected to the extended ground plane.

[0099] FIG. 6a is a configuration diagram of a connecting substrate according to various embodiments of the present disclosure. FIG. 6b is an enlarged view of the 6b area of ​​FIG. 6a according to various embodiments of the present disclosure.

[0100] Referring to FIGS. 6a and 6b, the connecting substrate (300) may include a dielectric substrate (310) comprising a plurality of layers (e.g., insulating layers) and a first substrate surface (3101) and a second substrate surface (3102) facing in a direction opposite to the first substrate surface (3102). In one embodiment, the dielectric substrate (310) may include a first region (300a) comprising a ground plane (320) in at least one of the plurality of layers (e.g., a first layer) and a second region (300b) extending from the first region (300a) and fixed to a conductive member (e.g., a conductive member (218a) of FIG. 5a) of a support member (e.g., a support member (2181) of FIG. 5a) of an electronic device (e.g., an electronic device (200) of FIG. 5a). In one embodiment, the conductive member (218a) may be electrically connected to the ground of the electronic device (200). In one embodiment, the ground plane (320) may be electrically connected in such a way that when the connecting substrate (300) is placed on at least a part of the supporting member (2181), at least one conductive contact (e.g., the conductive contacts (C2, C4, C5) of FIG. 4a) placed on the first substrate surface (3101) contacts the conductive member (218a) of the supporting member (2181). In one embodiment, the connecting substrate (300) may include a fastening hole (3103) formed from the first substrate surface (3101) to the second substrate surface (3102) in the second region (300b). In one embodiment, the connecting substrate (300) can be fixed through a fastening member (e.g., a screw) that penetrates the fastening hole (3103) and is fastened to the conductive member (218a) of the supporting member (2181).

[0101] According to various embodiments, the connection substrate (300) may include a signal wiring (3111) connected from a feed point (F) in any one of the layers of the dielectric substrate (310) through the connection substrate (300) to a substrate (e.g., substrate (240) of FIG. 5c). In one embodiment, the signal wiring (3111) may be placed on the same layer or a different layer as the layer on which the ground plane (320) of the dielectric substrate (310) is placed, and may be configured to remain electrically disconnected from the ground plane (320). In one embodiment, the signal wiring (3111) may be electrically connected to a feed pad (311) exposed on the first substrate surface (3101). In one embodiment, the signal wiring (3111) may be electrically connected by physically contacting a conductive portion (e.g., a conductive portion (231) in FIG. 5a) through a conductive contact (e.g., a first conductive contact (C1) in FIG. 4a) fixed (e.g., soldered) to the feed pad (311). In one embodiment, the connection board (300) may include a ground wiring (3112) that is spaced apart from the feed point (F) and electrically connected to a ground plane (320). In one embodiment, the ground wiring (3112) may be electrically connected to a ground pad (312) exposed on the first board surface (3101). In one embodiment, the ground wiring (3112) may be electrically connected by physically contacting the conductive portion (231) through a conductive contact (e.g., the second conductive contact (C2) in FIG. 4a) that is fixed (e.g., soldered) to the ground pad (312). In one embodiment, the conductive portion (231) may be operated as an antenna (e.g., antenna (A) in FIG. 5c) configured to transmit and / or receive a wireless signal in at least one frequency band through a feed point (F) connected from the substrate (240) to the conductive portion (231) via the signal wiring (3111) and a ground point (G) spaced apart from the feed point (F) by a certain distance.

[0102] According to various embodiments, the connecting substrate (300) may include a first wiring (330) that is disposed in a second region (300b), branches off from a first point (L1) of the ground plane (320), and is connected to a second point (L2) of the ground plane (320) that is spaced apart from the first point (L1). In one embodiment, the first wiring (330) may be formed in a loop shape (e.g., closed loop). In one embodiment, the first wiring (330) may be disposed to surround a fastening hole (3103). For example, the fastening hole (3103) may be located within the loop of the first wiring (330). In some embodiments, the first wiring (330) may be disposed in such a way that the fastening hole (3103) is not located within the loop but is disposed near the fastening hole (3103).

[0103] According to various embodiments, the connection substrate (300) may include at least one connection pad (331, 332, 333, 334, 335) disposed to overlap with at least a portion of the first wiring (330) and be exposed to the first substrate surface (3101) when the first substrate surface (3101) is viewed from above in the first region (300a). In one embodiment, when the at least one connection pad (331, 332, 333, 334, 335) is composed of a plurality of them, they may be disposed to be spaced apart at a specific interval along the first wiring (330) when the first substrate surface (3101) is viewed from above. In one embodiment, at least one connection pad (331, 332, 333, 334, 335) may include a first connection pad (331), a second connection pad (332), a third connection pad (333), a fourth connection pad (334), and a fifth connection pad (335) arranged at specific intervals to be electrically connected to the first wiring (330) along the first wiring (330) from a first point (L1). In some embodiments, at least one connection pad (331, 332, 333, 334, 335) may include one connection pad having a specific length and width along the first wiring (330).

[0104] According to various embodiments, the electronic device (200) may include a conductive washer (350) fixed to a first substrate surface (3101) of a connection board (300). In one embodiment, the conductive washer (350) may be fixed to at least one connection pad (331, 332, 333, 334, 335) by soldering or fusion. In one embodiment, at least one conductive washer (350) may be defined as a part component of the connection board (300). In one embodiment, when the connection board (300) is placed on the electronic device (200), at least a portion of the conductive washer (350) may be electrically connected to the ground of the electronic device (200) by contacting the conductive member (218a) of the support member (2181). For example, such an electrical connection structure can induce an extension of an effective ground area for the antenna (A) by extending the ground plane (320) through a second area (300b), which is a fixed area of ​​the connection substrate (300), and through at least one conductive washer (350). In one embodiment, the conductive washer (350) may include at least one protrusion (3501) protruding in the direction toward which the first substrate surface (3101) faces. In one embodiment, when the connection substrate (300) is placed in an electronic device (200), only at least one protrusion (3501) contacts (e.g., point contact) the conductive member (218a), thereby inducing uniform contact between the conductive washer (350) and the conductive member (218a), which can help improve the performance of the antenna (A). For example, the antenna (A) is in at least partial surface contact with the conductive washer (350), and if the contact area is changed due to external impact or the fastening process, the pre-designed frequency band of the antenna (A) may be shifted to an unintended band.

[0105] According to various embodiments, the operating frequency band of the antenna (A) may have its radiation performance improved (e.g., bandwidth expansion and gain increase) through a first wiring (330) extending from the ground plane (320) to a second region (300b) and / or a conductive washer (350) electrically connected to the first wiring (330). In one embodiment, the operating frequency band of the antenna (A) may be determined by the length (L) of the first wiring (330) from a first point (L1) on the ground plane (320) to the nearest first connection pad (331). In one embodiment, the operating frequency band of the antenna (A) may be determined by the width (W) in a direction perpendicular to the length direction of the first wiring (330). In one embodiment, the operating frequency band of the antenna (A) may be determined by the size, shape, or number of conductive washers (350) electrically connected to at least one connection pad (331, 332, 333, 334, 335). In one embodiment, the operating frequency band of the antenna (A) may be determined by the number of protrusions (3501) that protrude from the conductive washer (350) and contact the conductive member (218a).

[0106] According to various embodiments, the connecting substrate (300) may include a loop-shaped second wiring (340) that branches off from a third point (L3) of the first wiring (330) and extends to a fourth point (L4) of the first wiring (330) spaced apart from the third point (L3). In one embodiment, the antenna (A1) may help improve radiation performance, such as adjusting the operating frequency band or expanding the bandwidth and / or increasing the gain, through the second wiring (340). In one embodiment, the connecting substrate (300) may include a conductive via (341) placed at a fifth point (L5) of the second wiring (340). In one embodiment, the conductive via (341) may be electrically connected to a conductive layer (e.g., an additional ground plane or ground layer) placed on a different layer from the layer on which the ground plane (320) of the dielectric substrate (310) is placed. In one embodiment, the second wiring (340) may be positioned so as not to overlap with the conductive washer (350) when the first substrate surface (3101) is viewed from above. In one embodiment, the operating frequency band of the antenna (A) may be determined by the length (L') of the second wiring (340) from the third point (L3) to the fifth point. In some embodiments, the second wiring (340) may be positioned so as not to overlap with the conductive washer (350) at least partially when the first substrate surface (3101) is viewed from above. In some embodiments, the second wiring (340) may be omitted from the connecting substrate (300). In some embodiments, the first wiring (330) may be formed in the form of an open loop without the second point (L2). In some embodiments, the second wiring structure may be omitted.

[0107] FIGS. 7a and 7b are partial configuration diagrams of layers of a connecting substrate according to various embodiments of the present disclosure.

[0108] Referring to FIG. 7a, the connecting substrate (300) may include a second ground plane (320-1) disposed on another layer (310-1) (e.g., a second layer) among a plurality of layers of the dielectric substrate (310). In one embodiment, the second ground plane (320-1) may be disposed to overlap at least partially with the ground plane (320) when the first substrate surface (3101) is viewed from above. In one embodiment, the connecting substrate (300) may include a signal wiring (3111) that is electrically disconnected from the second ground plane (320-1) and disposed to cross the second ground plane (320-1). In one embodiment, the arrangement structure of the signal wiring (3111) passing between the second ground planes (320-1) may help shield noise generated from the signal wiring (3111). In one embodiment, the second ground plane (320-1) may be electrically connected to the ground plane (320) through a plurality of conductive vias (3201).

[0109] In various embodiments, the connecting substrate (300) may include a third wiring (330-1) positioned to overlap at least a portion of the first wiring (330) when the first substrate surface (3101) is viewed from above on another layer (310-1) of the dielectric substrate (310), and a fourth wiring (340-1) extending from the third wiring (330-1) and positioned to overlap at least a portion of the second wiring (340). In one embodiment, the fourth wiring (340-1) may be electrically connected to the second wiring (340) through a conductive via (341).

[0110] Referring to FIG. 7b, the connecting substrate (300) may include a third ground plane (320-2) disposed on another layer (310-2) (e.g., a third layer) among a plurality of layers of the dielectric substrate (310). In one embodiment, the third ground plane (320-2) may be disposed to overlap at least partially with the ground plane (320) and / or the second ground plane (320-1) when the first substrate surface (3101) is viewed from above. In one embodiment, the third ground plane (320-2) may be electrically connected to the ground plane (320) and / or the second ground plane (320-1) through a plurality of conductive vias (3201).

[0111] In various embodiments, the connecting substrate (300) may include a fifth wiring (330-2) positioned to overlap at least a portion of the first wiring (330) when the first substrate surface (3101) is viewed from above on another layer (310-2) of the dielectric substrate (310), and a sixth wiring (340-2) extending from the fifth wiring (330-2) and positioned to overlap at least a portion of the second wiring (340). In one embodiment, the sixth wiring (340-2) may be electrically connected to the second wiring (340) and / or the fourth wiring (340-1) through a conductive via (341).

[0112] FIGS. 8a and 8b are configuration diagrams of flexible substrates including an extended ground plane according to various embodiments of the present disclosure.

[0113] In describing the connecting substrate (300) of FIGS. 8a and 8b, the same reference numerals have been used for components that are substantially identical to those of the connecting substrate (300) of FIGS. 6a and 6b, and a detailed description thereof may be omitted.

[0114] Referring to FIGS. 8a and 8b, the connecting board (300) may include an additional ground plane (320-3, 320-4) extending from a ground plane (320) disposed in a first area (e.g., the first area (300a) of FIG. 6a) to a second area (e.g., the second area (300b) of FIG. 6a) without a first wiring (e.g., the first wiring (330) of FIG. 6a) and a second wiring (e.g., the second wiring (340) of FIG. 6a). In one embodiment, the additional ground plane (320-3, 320-4) may be disposed in various shapes to surround at least a portion of the fastening hole. In one embodiment, a plurality of connection pads (331, 332, 333, 334, 335) may be electrically connected to an additional ground plane (320-3, 320-4) and exposed to a first substrate surface (3101) of a dielectric substrate (310). In one embodiment, a plurality of connection pads (331, 332, 333, 334, 335) may be electrically connected to a conductive washer (e.g., a conductive washer (350) of FIG. 6a) fixed to the first substrate surface (3101).

[0115] FIGS. 9a and 9b are configuration diagrams of a flexible substrate illustrating the arrangement structure of a conductive washer according to various embodiments of the present disclosure.

[0116] In describing the connecting substrate (300) of FIGS. 9a and 9b, the same reference numerals have been used for components that are substantially identical to those of the connecting substrate (300) of FIGS. 6a and 6b, and a detailed description thereof may be omitted.

[0117] Referring to FIG. 9a, the connecting substrate (300) may include a first conductive washer (351) positioned to partially surround a fastening hole (3103) on a first substrate surface (3101) of a dielectric substrate (310), and a second conductive washer (352) spaced apart from the first conductive washer (351). In one embodiment, each of the first conductive washer (351) and the second conductive washer (352) includes a pair of protrusions (3501), but is not limited thereto, and the protrusions (3501) may be formed as one or three or more. In this case, the first wiring extending from the first region (300a) to the second region (300b) may extend from the ground plane (e.g., the ground plane (320) of FIG. 6a) through the first conductive washer (351) to the second conductive washer (352). In some embodiments, the connecting board (300) may be configured so that each of the pair of wirings extending from the ground plane (320) is electrically connected to the first conductive washer (351) and the second conductive washer (352), respectively.

[0118] Referring to FIG. 9b, the connecting substrate (330) may include only one conductive washer (353) positioned to partially surround the fastening hole (3103) (e.g., to surround only half of the fastening hole) on the first substrate surface (3101) of the dielectric substrate (310).

[0119] FIG. 10 is a graph comparing the radiation performance of an antenna according to the presence or absence and arrangement of a conductive washer according to various embodiments of the present disclosure.

[0120] When an antenna (A) according to an exemplary embodiment of the present disclosure is set to operate in a relatively high frequency band (e.g., a frequency band in the range of about 3.3 GHz to 5 GHz), it may be significantly affected by surrounding conductive structures due to relatively short wavelengths. For example, by utilizing this phenomenon, a first wire (330) extending from the ground plane (320) and a conductive washer (350) electrically connected to the first wire (330) can be used, or a second wire (340) (e.g., a conductive stub) extending from the first wire (330) can be used, thereby easily shifting the operating frequency band of the antenna (A) or helping to improve radiation performance (e.g., bandwidth expansion and / or gain increase).

[0121] Referring to FIG. 10, the antenna (e.g., antenna (A) of FIG. 5c) exhibits rapid deterioration in radiation performance in an operating frequency band of approximately 4.7 GHz or higher (e.g., n79 band) (e.g., frequency band in the range of approximately 4.4 GHz to 5 GHz) when the first wiring (330) and conductive washer (350) are not present (e.g., graph 1001), but a first wiring (e.g., the first wiring (330) of FIG. 6b) with a width (W) set to 0.2 mm and a length (e.g., length (L) of FIG. 6b) from a first point (e.g., the first point (L1) of FIG. 6b) to a first connection pad (e.g., the first connection pad (331) of FIG. 6b)) set to 1.28 mm, and a second wiring (e.g., the second wiring (340) of FIG. 6b) extending from the first wiring (330) are applied, and one as shown in FIG. 4a When a conductive washer (350) is applied (e.g., graph 1002), it can be seen that the gain is relatively improved in the corresponding frequency band. Furthermore, even if the second wiring (340) is not applied, when the first wiring (330) under the same conditions and two conductive washers applied thereto (e.g., the conductive washers (351, 352) of FIG. 9a) are applied (e.g., graph 1003), it can be seen that the gain is relatively improved.

[0122] This may mean that the radiation performance of the antenna (A) can be effectively improved through the application of a first wiring (330), a second wiring (340) and / or at least one conductive washer (e.g., the conductive washer (350) of FIG. 4a or the conductive washers (351, 352) of FIG. 9a) extending from a first area (e.g., the first area (300a) of FIG. 6a) to which a ground plane (e.g., the ground plane (320) of FIG. 6a) is applied to a second area (e.g., the second area (300b) of FIG. 6a) for fixing a connecting substrate (e.g., the connecting substrate (300) of FIG. 6a).

[0123] In some embodiments, the operating frequency band of the antenna (A) using the conductive portion (231) may be determined by the shape, number, or size of at least one connection pad (e.g., connection pads (331, 332, 333, 334, 335) of FIG. 6b) connected to the ground plane (320) through the first wiring (330) of the connection board (300) and / or the shape or length of the second wiring (340) branched from the first wiring (330), which is designed to be in direct contact with the conductive member (218a) of the housing (210) without a conductive washer (350).

[0124] FIG. 11 is a graph comparing the radiation performance of an antenna according to the presence or absence and length change of a second wiring according to various embodiments of the present disclosure.

[0125] Referring to FIG. 11, the operating frequency band of the antenna (e.g., antenna (A) in FIG. 5c) can be adjusted depending on the presence or absence and length change of the second wiring (e.g., second wiring (340) in FIG. 6b). For example, in an operating frequency band in the range of approximately 3 GHz to 3.5 GHz, compared to the case where only a first wire (e.g., the first wire (330) in Fig. 6b) and a conductive washer (e.g., the conductive washer (350) in Fig. 4a) exist, with a width (W) set to 0.2 mm and a length (e.g., length (L) in Fig. 6b) from a first point (e.g., the first point (L1) in Fig. 6b) to a first connection pad (e.g., the first connection pad (331) in Fig. 6b)) set to 1.28 mm (e.g., graph 1101), under the same conditions, the distance from a third point (e.g., the third point (L3) in Fig. 6b) of the first wire (330) to a fifth point (e.g., the fifth point (L5) in Fig. 6b) where a conductive via (e.g., the conductive via (341) in Fig. 6b) is disposed (e.g., of Fig. 6b When the distance (L') is set to 0.64 mm (e.g., graph 1102), it can be seen that the operating frequency band is low-shifted. Furthermore, when the distance (L') from the third point (L3) to the fifth point (L5) is set to 0.84 mm, which is relatively long (e.g., graph 1103), it can be seen that the low-shifted state is then high-shifted to some extent. For example, compared to the first state where the second wiring (340) is not present, the operating frequency band of the antenna (A) is relatively low-shifted in the second state where the second wiring (340) is present, and this may mean that the operating frequency band of the antenna (A) is more finely controlled by setting the length of the second wiring (340) in the second state. This may mean that the operating frequency band of the antenna (A) can be easily set by adjusting the presence or absence and length of the second wiring (340).

[0126] FIG. 12a is a perspective view of an electronic device in an unfolded state according to various embodiments of the present disclosure. FIG. 12b is a perspective view of an electronic device in a folded state according to various embodiments of the present disclosure.

[0127] The electronic device (400) of FIG. 12a and FIG. 12b may be at least partially similar to the electronic device (101) of FIG. 1, or may include other embodiments of the electronic device.

[0128] Referring to FIG. 12a and FIG. 12b, the electronic device (400) may include a first housing (410), a second housing (420) rotatably connected to the first housing (410) through a hinge device (440) (e.g., a hinge module or a hinge), and a flexible display (430) (e.g., a foldable display) positioned to be supported by the first housing (410) and the second housing (420). In one embodiment, the flexible display (430) may be positioned in such a way that it is received in at least a portion of the first housing (410) and the second housing (420). In one embodiment, the first housing (410) and the second housing (420) may be foldable housings (e.g., foldable housing structures) capable of being deformed into an unfolded state and a folded state. In one embodiment, the first housing (410) may form part of the side of the electronic device (400) and may include a first side member (411) formed at least partially from a conductive member. In one embodiment, the second housing (420) may form part of the side of the electronic device (400) and may include a second side member (421) formed at least partially from a conductive member.

[0129] According to various embodiments, the electronic device (400) may include a conductive portion (412) that is positioned through a portion of the first side member (411) of the first housing (410) and acts as an antenna (A1). In one embodiment, the conductive portion (412) may be formed through a first non-conductive portion (4121) and a second non-conductive portion (4122) that are positioned and spaced apart from a portion of the conductive side member (411). In one embodiment, the conductive portion (412) may include a connecting substrate (e.g., a connecting substrate (300-1) of FIG. 13) for electrically connecting to a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) of a substrate (e.g., a substrate (240) of FIG. 5c)) positioned in the internal space of the first housing (410). In some embodiments, the conductive portion (412) may be positioned in the second housing (420).

[0130] FIG. 13 is a partial configuration diagram of a connection board applied to the electronic device of FIG. 12a according to various embodiments of the present disclosure.

[0131] In describing the connecting substrate (300-1) of FIG. 13, the same reference numerals have been assigned to components that are substantially identical to the connecting substrate (300) of FIG. 6b, and a detailed description thereof may be omitted.

[0132] A connection board (300-1) according to an exemplary embodiment of the present disclosure can help improve the radiation performance of an antenna (A1) by providing an effective ground area of ​​an antenna (A1) extended through a first wiring (330), a second wiring (340), and a conductive washer (e.g., a conductive washer (350) of FIG. 4a) extending from a first area (300a) where a ground plane (320) is placed to a second area (300b), which is a fixed area where the connection board (300-1) is fixed to a first housing (410).

[0133] However, in the electronic device (400) of FIG. 12a and 12b, when the electronic device (400) is in a folded state (e.g., the state of FIG. 12b), the extended ground area may degrade the radiation performance of the antenna (A1) by causing unintended coupling with an overlapping conductive structure (e.g., a conductive second side member (421) and / or a flexible display (240)).

[0134] Referring to FIG. 13, the connection board (300-1) may be placed in the first wiring (330) and may include at least one variable circuit (T1, T2) controlled by a processor of the electronic device (400) (e.g., processor (120) of FIG. 1) to help improve the radiation performance of the antenna (A1). In one embodiment, the at least one variable circuit (T1, T2) may include a first variable circuit (T1) placed in the first wiring (330) between a first point (L1) and a first connection pad (331), and a second variable circuit (T2) placed in the first wiring (330) between a second point (L2) and a fifth connection pad (335). In one embodiment, the first and second variable circuits (T1, T2) may include a switch that is switched according to the state information of the electronic device (400). In some embodiments, the first and second variable circuits (T1, T2) may include a tunable IC comprising a plurality of passive components (e.g., capacitors and / or inductors) having different component values ​​that are selectively switched according to state information of the electronic device (400).

[0135] According to various embodiments, when the processor (120) of the electronic device (400) detects the folded state of the electronic device (400), it controls the first and second variable circuits (T1, T2) to electrically disconnect the first wiring (330), the second wiring (340), and the conductive washer (350) from the ground plane (320), thereby preventing unintended coupling with the surrounding conductive structure and reducing the degradation of the radiation performance of the antenna (A1). In one embodiment, when the processor (120) of the electronic device (400) detects the unfolded state of the electronic device (400), it controls the first and second variable circuits (T1, T2) to set the first wiring (330), the second wiring (340), and the conductive washer (350) to operate as an extended effective ground area for the ground plane (320), thereby helping to improve the radiation performance of the antenna (A1).

[0136] In some embodiments, if one end of the first wiring (330) is formed in an open loop shape that is not connected to the ground plane (320), the first variable circuit (T1) or the second variable circuit (T2) may be unnecessary. In some embodiments, the variable circuit may be additionally placed in the second wiring (340) or placed only in the second wiring (340).

[0137] According to various embodiments, the electronic device comprises a housing (e.g., 210 in FIG. 2a) including a conductive member connected to ground (e.g., a conductive member (218a) in FIG. 5c) and a conductive portion spaced apart from the conductive member (218a) (e.g., a conductive portion (231) in FIG. 2a); a substrate (e.g., a substrate (240) in FIG. 5c) disposed in the housing (210) and including a wireless communication circuit (e.g., a wireless communication module (192) in FIG. 1); a first region (e.g., a first region (300a) in FIG. 6b) electrically connecting the substrate (240) and the conductive portion (231) and including a ground plane (e.g., a ground plane (320) in FIG. 6b); and a second region (e.g., a second region (300b) in FIG. 6b) for being fixed to the conductive member (218a). It may include a connecting substrate (e.g., the connecting substrate (300) of FIG. 6b). The above-mentioned connection board (300) is branched from a first point of the ground plane (320) (e.g., first point (L1) in FIG. 6b)) and, through the second region (300b), has a loop-shaped first wiring (e.g., first wiring (330) in FIG. 6b) connected to a second point of the ground plane (320) (e.g., second point (L2) in FIG. 6b), and at least one connection pad (e.g., connection pads (331, 332, 333, 334, 335) in FIG. 6b) that is electrically connected to the first wiring (330) and exposed on a first substrate surface (e.g., first substrate surface (3101) in FIG. 6a) of the connection board (300) in the second region (300b), and at least one connection pad (331, The wireless communication circuit (192) may be configured to transmit and / or receive a wireless signal in at least one frequency band through the conductive portion (231) and the at least one conductive washer (350) of FIG. 6a, and includes at least one conductive washer (e.g., the conductive washer (350) of FIG. 6a) fixed to contact 332, 333, 334, 335).

[0138] According to various embodiments, when the first substrate surface (3101) is viewed from above, the at least one connection pad (331, 332, 333, 334, 335) may be arranged to overlap at least partially with the at least one conductive washer (350).

[0139] According to various embodiments, the connecting substrate (300) may be positioned such that the first substrate surface (3101) faces the conductive member (218a), and at least a portion of the second region (300b) may be positioned to face the conductive member (218a).

[0140] According to various embodiments, the at least one conductive washer (350) includes at least one protrusion (e.g., the protrusion (3501) of FIG. 6a) protruding in the direction toward the first substrate surface (3101), and when the connecting substrate (300) is placed in the housing (210), the at least one protrusion (3501) may be positioned to contact the conductive member (218a).

[0141] According to various embodiments, the connecting substrate (300) includes a fastening hole (e.g., the fastening hole (3103) of FIG. 6b) disposed within a loop of the first wiring (330) in the second region (300b), and the at least one conductive washer (350) may be disposed around the fastening hole (3103).

[0142] According to various embodiments, the connecting substrate (300) is fixed through a fastening member that penetrates the fastening hole (3103) and is fastened to the conductive member (218a), and the at least one conductive washer (350) may be placed at least partially between the connecting substrate (300) and the conductive member (218a).

[0143] According to various embodiments, the conductive portion (231) includes a power supply point (e.g., power supply point (F) in FIG. 6a) connected to the connecting substrate (300) and a ground point (e.g., ground point (G) in FIG. 6a) located between the power supply point (F) and the first point (L1), and the ground point (G) may be electrically connected to the ground plane (320) of the connecting substrate (300).

[0144] According to various embodiments, the at least one conductive washer (350) comprises at least two conductive washers (e.g., conductive washers (351, 352) of FIG. 9a) that are spaced apart at specific intervals along the first wiring (330) and are in contact with at least two connection pads, and the at least one frequency band may be determined according to the number of the at least two washers (351, 352).

[0145] According to various embodiments, the at least one frequency band can be determined through the width of the first wiring (330) (e.g., width (W) in FIG. 6b).

[0146] According to various embodiments, the at least one frequency band can be determined by the length of the first wiring (330) between the first point (L1) and the nearest connection pad (331) among the at least one connection pads from the first point (L1) (e.g., length (L) in FIG. 6b).

[0147] According to various embodiments, the connecting substrate (300) may further include a loop-shaped second wiring (e.g., the second wiring (340) in FIG. 6b) that branches off from a third point of the first wiring (330) (e.g., the third point (L3) in FIG. 6b) and connects to a fourth point of the first wiring (330) (e.g., the fourth point (L4) in FIG. 6b).

[0148] According to various embodiments, the second wiring (340) may not overlap with the at least one conductive washer (350) when the first substrate surface (3101) is viewed from above.

[0149] According to various embodiments, the second wiring (340) includes a conductive via (341) placed at a fifth point (e.g., the fifth point (L5) in FIG. 6b), and the at least one frequency band can be determined by the length of the second wiring (340) from the third point (L3) to the fifth point (L5) (e.g., the length (L') in FIG. 6b).

[0150] According to various embodiments, the conductive via (341) may be electrically connected to at least one conductive layer disposed in a layer different from the layer where the first wiring (330) is disposed among the plurality of layers of the connecting substrate (300) (e.g., layers (310-1, 310-2) of FIG. 7a and FIG. 7b).

[0151] According to various embodiments, the structure (e.g., speaker module (250) of FIG. 5c) that is disposed or formed in the housing (210) is further included, and the connecting substrate (300) may be disposed at least partially between the structure (250) and the conductive member (218a).

[0152] According to various embodiments, the connecting substrate (300) includes a second substrate surface (e.g., the second substrate surface (3102) of FIG. 6a) facing in the opposite direction to the first substrate surface (3101), and at least a portion of the second substrate surface (3102) may be fixed to the structure (250).

[0153] According to various embodiments, the connecting substrate (300) may be fixed to the structure (250) through bonding, fusion, or taping, at least a portion of the second substrate surface (3102).

[0154] According to various embodiments, the housing (210) includes a side (e.g., the side (210C) of FIG. 2a) and a support member (e.g., the support member (2181) of FIG. 5c) extending from the side (210C) into an internal space (2101), and at least a portion of the side (210C) and the support member (2181) is formed of the conductive member (218a), and the conductive portion (231) may be a part of the conductive member (218a).

[0155] According to various embodiments, the conductive portion (231) is part of a side (210C) exposed to the outside of the electronic device, and the conductive portion (231) may be electromagnetically disconnected from the conductive member (218a) through at least one non-conductive portion (e.g., non-conductive portions (232, 233) of FIG. 5c).

[0156] According to various embodiments, the connection substrate (300) may include a flexible substrate (FPCB (flexible printed circuit board) or a rigid substrate (rigid PCB).

[0157] Furthermore, the embodiments of the present disclosure disclosed in this specification and drawings are merely specific examples provided to facilitate the explanation of the technical content according to the embodiments of the present disclosure and to aid in understanding the embodiments of the present disclosure, and are not intended to limit the scope of the embodiments of the present disclosure. Accordingly, the scope of the various embodiments of the present disclosure should be interpreted to include all modifications or variations derived based on the technical concept of the various embodiments of the present disclosure, in addition to the embodiments disclosed herein.

Claims

1. In an electronic device, A housing (210) comprising a conductive member (218a) connected to ground and a conductive portion (231) spaced apart from the conductive member (218a); A substrate (240) disposed in the above housing (210) and including a wireless communication circuit (192); and The connecting substrate (300) includes a first region (300a) comprising a ground plane (320) and a second region (300b) for fixing to the conductive member (218a), electrically connecting the substrate (240) and the conductive portion (231). The above connecting board (300) is, A loop-shaped first wiring (330) branching from a first point (L1) of the ground plane (320) and connected to a second point (L2) of the ground plane (320) through the second area (300b); In the second region (300b), at least one connection pad (331, 332, 333, 334, 335) electrically connected to the first wiring (330) and exposed on the first substrate surface (3101) of the connection substrate (300); and In the second region (300b), at least one conductive washer (350) is fixed to contact the at least one connection pad (331, 332, 333, 334, 335), and The above wireless communication circuit (192) is an electronic device configured to transmit and / or receive a wireless signal in at least one frequency band through the conductive part (231) and the at least one conductive washer (350).

2. In Paragraph 1, When the first substrate surface (3101) is viewed from above, the at least one connection pad (331, 332, 333, 334, 335) is arranged to overlap at least partially with the at least one conductive washer (350) of the electronic device.

3. In Paragraph 1, The above connecting substrate (300) is arranged such that the first substrate surface (3101) faces the conductive member (218a), and An electronic device in which at least a portion of the second region (300b) is positioned to face the conductive member (218a).

4. In Paragraph 3, The above at least one conductive washer (350) includes at least one protrusion (3501) protruding in the direction toward the first substrate surface (3101), and An electronic device in which, when the above-mentioned connecting substrate (300) is placed in the housing (210), the at least one protrusion (3501) is positioned to contact the conductive member (218a).

5. In Paragraph 1, The above connecting board (300) includes a fastening hole (3103) disposed within a loop of the first wiring (330) in the second region (300b), and The above at least one conductive washer (350) is an electronic device placed around the fastening hole (3103).

6. In Paragraph 5, The above connecting substrate (300) penetrates the above fastening hole (3103) and is fixed through a fastening member that is fastened to the conductive member (218a), and The above at least one conductive washer (350) is an electronic device disposed at least partially between the connecting substrate (300) and the conductive member (218a).

7. In Paragraph 1, The conductive portion (231) includes a power supply point (F) connected to the connecting substrate (300) and a ground point (G) located between the power supply point (F) and the first point (L1). The above ground point (G) is an electronic device electrically connected to the ground plane (320) of the connection board (300).

8. In Paragraph 1, The above-mentioned at least one conductive washer (350) comprises at least two conductive washers (351, 352) that are spaced apart at specific intervals along the first wiring (330) and are in contact with at least two connection pads, respectively. An electronic device in which the above at least one frequency band is determined according to the number of the above at least two washers (351, 352).

9. In Paragraph 1, The above at least one frequency band is an electronic device determined by the width (W) of the first wiring (330).

10. In Paragraph 1, The above at least one frequency band is an electronic device determined by the length (L) of the first wiring (330) between the first point (L1) and the nearest connection pad (331) among the at least one connection pads from the first point (L1).

11. In Paragraph 1, The above connecting board (300) is, An electronic device further comprising a loop-shaped second wire (340) that branches off from a third point (L3) of the first wire (330) and connects to a fourth point (L4) of the first wire (330).

12. In Paragraph 11, The above second wiring (340) is an electronic device that does not overlap with the at least one conductive washer (350) when the first substrate surface (3101) is viewed from above.

13. In Paragraph 11, It includes a conductive via (341) disposed at the fifth point (L5) of the second wiring (340), and The electronic device in which at least one frequency band is determined by the length (L') of the second wiring (340) from the third point (L3) to the fifth point (L5).

14. In Paragraph 13, The above conductive via (341) is an electronic device electrically connected to at least one conductive layer disposed in at least one layer (310-1, 310-2) different from the layer on which the first wiring (330) is disposed among the plurality of layers of the connection substrate (300).

15. In Paragraph 1, It further includes a structure (250) disposed in or formed in the above housing (210), and The above connecting substrate (300) is an electronic device disposed at least partially between the structure (250) and the conductive member (218a).

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