Electronic device comprising antenna

Abstract

This electronic device may comprise: a wireless communication circuit; a frame including a side surface, which forms an outer surface of the electronic device, and a support structure, which is disposed inward from the side surface structure, the side surface structure including a conductive portion on an upper side surface of the electronic device; a circuit board, which has at least one insulating layer and at least one ground layer and in which a feeding portion connected to the wireless communication circuit is formed an overlapping region and a radiation line portion extending from the feeding portion and connected to the conductive portion is formed in an region in which only the at least one insulating layer overlaps among the at least one insulating layer and the at least one ground layer; and a metal structure which is disposed on the support structure of the frame. The conductive portion and the radiation line portion connected to the conductive portion can function as radiators. The metal structure can function as a reflector for signals from the radiation line portion.

Description

Electronic device including an antenna

[0001] The present disclosure relates to an electronic device comprising an antenna.

[0002] An electronic device may transmit a signal through an antenna or receive a signal through an antenna. For example, the electronic device may include a conductive part. The conductive part may function as a radiator of an antenna for transmitting and / or receiving a signal.

[0003] The above information is for background purposes only to aid in understanding the present disclosure. No determination or claim has yet been made as to whether the above information can be applied as prior art in relation to the present disclosure.

[0004] The aspects of the present disclosure are intended to solve at least the problems and / or disadvantages mentioned above and to provide at least the advantages described below. Accordingly, the aspects of the present disclosure provide an electronic device comprising an antenna.

[0005] Additional aspects will be presented in part in the following description, and in part may become apparent from the description or be learned by practicing the presented embodiments.

[0006] According to an aspect of the present disclosure, an electronic device is provided. The electronic device may include: a wireless communication circuit; a frame comprising a side forming an outer surface of the electronic device and a support structure disposed inwardly from the side structure, wherein the side structure comprises a conductive portion at the top side of the electronic device; a circuit board having at least one insulating layer and at least one ground layer, wherein a feed portion connected to the wireless communication circuit is formed in an area overlapping with the at least one insulating layer and the at least one ground layer, and a radiation line portion extending from the feed portion and connected to the conductive portion is formed in an area overlapping only with the at least one insulating layer among the at least one insulating layer and the at least one ground layer; and a metal structure disposed on the support structure of the frame. The conductive portion and the radiation line portion connected to the conductive portion may be configured to function as a radiator. The metal structure may be configured to function as a reflector for signals from the radiation line portion. The radiation line portion may include a conductive line having a longitudinal direction corresponding to the longitudinal direction of the conductive portion between the metal structure and the conductive portion.

[0007] According to an aspect of the present disclosure, an electronic device is provided. The electronic device may include: a wireless communication circuit; a frame comprising a side forming an outer surface of the electronic device and a support structure disposed inwardly from the side structure, wherein the side structure comprises a conductive portion at the top side of the electronic device; a circuit board comprising a feed portion connected to the wireless communication circuit and a radiation line portion extending from the feed portion and connected to the conductive portion; and a metal structure configured to function as a reflector for signals in the radiation line portion. The radiation line portion may include a conductive line having a longitudinal direction corresponding to the longitudinal direction of the conductive portion between the metal structure and the conductive portion. The conductive line of the radiation line portion may be spaced substantially apart from the metal structure by a distance of at least 0.5 m (millimeter) and less than 1 mm.

[0008] According to an aspect of the present disclosure, an electronic device is provided. The electronic device may include a wireless communication circuit; a metal frame comprising a conductive portion; and a circuit board having a ground area for the wireless communication circuit and a fill-cut area formed between the ground area and the conductive portion. The circuit board may include a feed portion connected to the wireless communication circuit in the ground area and a radiation line portion extending from the feed portion in the fill-cut area and connected to the conductive portion. The electronic device may include a metal structure configured to function as a reflector in response to signals in the radiation line portion. The radiation line portion may include a conductive line having a longitudinal direction corresponding to the longitudinal direction of the conductive portion between the metal structure and the conductive portion.

[0009] According to an aspect of the present disclosure, an electronic device is provided. The electronic device may include a wireless communication circuit; a metal frame comprising a conductive portion; a circuit board comprising a feed portion connected to the wireless communication circuit and a radiation line portion extending from the feed portion and connected to the conductive portion; and a metal structure configured to function as a reflector in response to signals in the radiation line portion. The radiation line portion may include a conductive line having a longitudinal direction corresponding to the longitudinal direction of the conductive portion between the metal structure and the conductive portion. The radiation line portion may be spaced substantially apart from the metal structure by a distance of at least 0.5 m (millimeter) and less than 1 mm.

[0010] Other aspects, advantages, and important features of the present disclosure will become apparent to those skilled in the art from the following detailed description disclosing various embodiments of the present disclosure together with the accompanying drawings.

[0011] The above and other aspects, features, and advantages of specific embodiments of the present disclosure will become more apparent from the following description together with the accompanying drawings.

[0012] Figure 1 is a block diagram of an electronic device in a network environment.

[0013] Figure 2a shows an example of an electronic device including a reflector.

[0014] Figure 2b shows an example of an electronic device including an antenna.

[0015] Figure 3a shows an example of an electronic device including a metal frame and a metal structure.

[0016] Figure 3b shows an example of a circuit board.

[0017] Figure 4 shows an example of a circuit board and a conductive part.

[0018] Figures 5a and 5b show examples of radiation patterns according to the distance between the radiation line portion of the circuit board and the metal structure.

[0019] Figure 6 shows an example of total efficiency according to the length of the metal structure.

[0020] Figure 7 shows an example of a radiation pattern according to the length of a metal structure.

[0021] Figure 8 shows an example of a radiation pattern of an antenna including a radiation line portion adjacent to a metal structure.

[0022] The same reference number may be used to represent the same element throughout the drawing.

[0023] With reference to the accompanying drawings, the following description is provided to facilitate a comprehensive understanding of the various embodiments of the present disclosure as defined by the claims and their equivalents. While this description includes various specific details to aid such understanding, they should be considered merely illustrative. Accordingly, those skilled in the art will recognize that various changes and modifications may be made to the various embodiments described herein without departing from the scope and spirit of the present disclosure. Additionally, for clarity and brevity, descriptions of well-known functions and configurations may be omitted.

[0024] The terms and words used in the following description and claims are not limited to their bibliographic meanings and are intended merely to enable the inventor to understand the present disclosure clearly and consistently. Accordingly, it will be apparent to those skilled in the art that the following description of various embodiments of the present disclosure is provided for illustrative purposes only and is not intended to limit the present disclosure as defined by the appended claims and their equivalents.

[0025] The singular forms "a," "an," and "the" should be understood to include the plural form unless the context clearly indicates otherwise. Thus, for example, a reference to "component surfaces" includes references to one or more such surfaces.

[0026] Terms used herein, including technical or scientific terms, may have the same meaning as generally understood by those skilled in the art described in this disclosure. Terms used in this disclosure that are defined in general dictionaries may be interpreted as having the same or similar meaning as they have in the context of the relevant technology, and are not to be interpreted in an ideal or overly formal sense unless explicitly defined in this disclosure. In some cases, even terms defined in this disclosure are not to be interpreted to exclude the embodiments of this disclosure.

[0027] In the various embodiments of the present disclosure described below, a hardware-based approach is described as an example. However, since the various embodiments of the present disclosure include techniques using both hardware and software, the various embodiments of the present disclosure do not exclude a software-based approach.

[0028] Terms referring to components of an electronic device used in the following description (e.g., substrate, PCB (printed circuit board), FPCB (flexible PCB), PBA (printed board assembly), module, antenna element, circuit, processor, chip, component, or device), terms referring to components of an antenna (e.g., antenna radiator, radiator, conductive part, conductive line pattern, coil, conductive member, radiating member, radiating material, radiating component, antenna structure, antenna structure, feed part, feed member, RF (radio frequency) line, connecting member, connecting part, or contact member), terms referring to the location of a component (e.g., part, location, region, or point), terms referring to the shape of a component (e.g., structure, structure, support, contact, or flange, or protrusion), terms referring to connections between structures (e.g., connection, connecting part, contact, contact part, support, support part, connecting structure, support structure, contact structure, conductive member, conductive pad, conductive pattern, or assembly), and terms referring to an open structure Terms (e.g., slot, slit, or opening), terms referring to circuits (e.g., PCB, FPCB, signal line, ground line, feeding line, data line, RF signal line, antenna line, RF path, RF module, RF circuit, splitter, divider, coupler, or combiner), etc. are examples provided for convenience of explanation. Accordingly, the present disclosure is not limited to the terms described below, and other terms having equivalent technical meanings may be used. Additionally, terms such as '...part', '...device', '...object', or '...body' used below may refer to at least one shape structure or a unit that processes a function.

[0029] Additionally, in this disclosure, expressions such as "greater than" or "less than" may be used to determine whether a specific condition is satisfied or fulfilled; however, this is merely for the purpose of expressing an example and does not exclude descriptions such as "greater than" or "less than." Conditions described as "greater than" may be replaced with "greater than," conditions described as "less than" may be replaced with "less than," and conditions described as "greater than and less than" may be replaced with "greater than and less than." Furthermore, "A" to "B" below refer to at least one of the elements from A (including A) to B (including B). Below, "C" and / or "D" refers to at least one of "C" or "D," i.e., including {"C," "D," and "C" and "D"}. Furthermore, below, the meaning of "approximately E" may be substituted with a value within an error range of ±5% or ±10% based on E.

[0030] It should be understood that the blocks of each flowchart and combinations of flowcharts can be executed by one or more computer programs containing computer-executable instructions. One or more computer programs as a whole may be stored in a single memory device, or one or more computer programs may be divided into multiple parts and stored in multiple memory devices.

[0031] The functions or operations described in this disclosure may be processed by a single processor or a combination of processors. A single processor or a combination of processors is a circuit that performs processing and includes circuits such as an application processor (AP, e.g., a central processing unit (CPU)), a communication processor (CP, e.g., a modem), a graphical processing unit (GPU), a neutral processing unit (NPU) (e.g., an artificial intelligence (AI) chip), a wireless-fidelity (Wi-Fi) chip, a Bluetooth™ chip, a global positioning system (GPS) chip, a near field communication (NFC) chip, a connectivity chip, a sensor controller, a touch controller, a fingerprint sensor controller, a display drive integrated circuit (IC), an audio codec chip, a universal serial bus (USB) controller, a camera controller, an image processing IC, a microprocessor unit (MPU), a system on chip (SoC), an IC, etc.

[0032] Figure 1 is a block diagram of an electronic device in a network environment.

[0033] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an external electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an external electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment of the present disclosure, the electronic device (101) may communicate with an external electronic device (104) through a server (108). According to one embodiment of the present disclosure, an electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments of the present disclosure, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments of the present disclosure, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0034] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), for example, and can perform various data processing or operations. According to one embodiment of the present disclosure, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment of the present disclosure, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0035] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment of the present disclosure, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment of the present disclosure, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0036] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, software (e.g., program (140)) and input or output data for related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0037] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0038] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0039] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment of the present disclosure, the receiver may be implemented separately from the speaker or as part thereof.

[0040] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment of the present disclosure, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0041] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment of the present disclosure, the audio module (170) can acquire sound through an input module (150) or output sound through an audio output module (155) or an external electronic device (e.g., external electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0042] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment of the present disclosure, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0043] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., external electronic device (102)). According to one embodiment of the present disclosure, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0044] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., external electronic device (102)). According to one embodiment of the present disclosure, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0045] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that can be perceived by the user through tactile or kinesthetic senses. According to one embodiment of the present disclosure, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0046] The camera module (180) can capture still images and video. According to one embodiment of the present disclosure, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0047] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment of the present disclosure, the power management module (188) may be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0048] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment of the present disclosure, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0049] A communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., external electronic device (102), external electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of a processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment of the present disclosure, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0050] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., external electronic device (104)), or network system (e.g., second network (199)). According to one embodiment of the present disclosure, a wireless communication module (192) may support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0051] An antenna module (197) can transmit a signal or power to an external source (e.g., an external electronic device) or receive it from an external source. According to one embodiment of the present disclosure, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment of the present disclosure, the antenna module (197) may include a plurality of antennas (e.g., array antennas). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiment of the present disclosure, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0052] According to various embodiments of the present disclosure, the antenna module (197) may form a mmWave antenna module. According to one embodiment of the present disclosure, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0053] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0054] According to one embodiment of the present disclosure, commands or data may be transmitted or received between an electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or different type of device as the electronic device (101). According to one embodiment of the present disclosure, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment of the present disclosure, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks.According to one embodiment of the present disclosure, an external electronic device (104) or server (108) may be included within the second network (199). The electronic device (101) may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0055] FIG. 2a shows an example of an electronic device (e.g., electronic device (101)) including a reflector.

[0056] Referring to Fig. 2a, the electronic device (101) can use an antenna. For a specific service (e.g., satellite service), satisfaction of specific indicators (e.g., TRP (Total Radiated Power) / TIS (Total Isotropic Sensitivity), EIRP (Effective Isotropic Radiated Power or Equivalent Isotropic Radiated Power) / EIS (Effective Isotropic Sensitivity) at a specific angle, UHRP (Upper Hemispheric Radiated Power) and / or UHIS (Upper Hemispheric Isotropic Sensitivity) for upper hemisphere performance) may be required. For example, an electronic device (101) may perform satellite communication. To ensure the required upper hemisphere radiation performance (e.g., upper hemisphere directivity), the electronic device (101) may utilize an antenna (201) positioned on top of the electronic device (101). The antenna (201) may support frequency bands for satellite communication. As an example, but not limited to, the radiator of the antenna (201) may function as an antenna radiator for multiple bands. For example, at least a portion of the antenna (201) may be used for both frequency bands for satellite communication and frequency bands for cellular communication (e.g., mid band (MB) (e.g., frequency band from about 1 GHz (gigahertz) to less than 2.3 GHz), high band (HB) (e.g., frequency band from about 2.3 GHz), and / or other NR frequency bands).

[0057] The electronic device (101) may include an electric object that provides ground. The antenna (201) radiates a signal, and the electric object may function as ground. An electric object close to the antenna (201) may affect the radiation performance of the antenna (201). To reduce the influence of the electric object, methods such as applying a ground contact to the antenna or placing a ground wall between the antenna and the electric object may be used. However, these methods may make it difficult to design a structure to control radiation performance in the upper hemisphere (e.g., upper hemisphere directivity). To reduce this problem, the electronic device (101) according to embodiments of the present disclosure may include a metal structure (202) spaced apart from the antenna (201) by a certain distance. Isolation can be achieved through the antenna (201) spaced apart from the metal structure (202) by a certain distance. The metal structure (202) can correspond to an electrical object that provides ground (e.g., SUS (steel use stainless) of a speaker module (e.g., acoustic output module (155)), camera bracket, enclosure). Meanwhile, certain services (e.g., satellite services) require high radiation performance in the upper hemisphere (e.g., upper hemisphere directivity). To increase upper hemisphere directivity, the metal structure (202) can function as a reflector for the antenna (201). In this disclosure, a technique for increasing the antenna directivity (e.g., upper hemisphere directivity) required for certain services (e.g., satellite services) is described based on the distance between a part of the antenna (201) and the metal structure (202).

[0058] FIG. 2b illustrates an example of an electronic device (e.g., electronic device (101)) including an antenna (e.g., antenna (201)). In FIG. 2b, the structure of the antenna (201) corresponding to a metal structure (202) that functions as a reflector is described. The same reference numerals may be used for the same descriptions.

[0059] Referring to FIG. 2b, the electronic device (101) may include a conductive portion (212). For example, the conductive portion (212) may be part of a side structure (e.g., a side structure (310) in FIG. 3a and FIG. 3b) that forms an outer side of the electronic device (101) among a metal frame (e.g., a metal frame (301) in FIG. 3a and FIG. 3b). According to one embodiment of the present disclosure, the conductive portion (212) may be used as a radiator for an antenna. The electronic device (101) may transmit or receive a signal through the conductive portion (212). The electronic device (101) may include a wireless communication circuit (220). According to one embodiment of the present disclosure, the wireless communication circuit (220) may be configured to transmit signals in the frequency band of satellite communication. For example, the frequency band may be an S-band (transmission: 1.98 GHz to 2.01 GHz, reception: 2.17 GHz to 2.20 GHz). The S-band may be used for mobile satellite service (MSS). In order to use the conductive part (212) as a radiator for signals of the wireless communication circuit (220), a structure for feeding RF signals (hereinafter, feeding structure) may be placed between the conductive part (212) and the wireless communication circuit (220).

[0060] The electronic device (101) may include a circuit board (250). The circuit board (250) may include a plurality of layers. For example, the circuit board (250) may be a rigid printed circuit board (PCB) or a flexible printed circuit board (FPCB). As an example, the circuit board (250) may be a flexible RF cable (FRC) corresponding to the FPCB. The circuit board (250) may include a ground region (251). When the circuit board (250) is viewed in one direction (e.g., the (-)z-axis direction), the ground region (251) may represent an area formed with a conductive portion (e.g., a copper portion) to transmit ground to one or more electronic components (e.g., a wireless communication circuit (220)) of the electronic device (101). For example, the conductive portion may be configured to be connected to the wireless communication circuit (220) to provide ground. In other words, the ground region (251) may represent an area on the circuit board (250) having a ground plane above or below. For example, in the ground region (251), at least some of the multiple layers of the circuit board (250) may include a copper layer for providing ground and / or transmitting signals. An insulating layer (e.g., PPG (pre-impregnated)) may be placed between the copper layers. In the ground region (251), the copper layer and the insulating layer may be laminated together. A circuit corresponding to the copper portion may be formed in the ground region (251) of the circuit board (250). For example, a chip, device, and / or component for the electronic device (101) may be placed on the ground region (251). For example, a wireless communication circuit (220) (e.g., a communication module (190)) may be placed on the ground region (251). At least a portion of the wireless communication circuit (220) may be placed in the ground area (251) of the circuit board (250).The wireless communication circuit (220) may include, for example, an RF transceiver and / or a radio frequency front end (RFFE) module. A part of the wireless communication circuit (220) may be referred to as a feed circuit in that it provides antenna feed. For example, the feed circuit may be referred to as a feed section as a source for antenna feed. For example, the wireless communication circuit (220) may include an RF switching circuit connected to the RFFE module. For example, the output port of the RF switching circuit may be referred to as a feed section as a source of an RF signal. The feed section may provide a signal to the conductive part (203) through a feed structure.

[0061] The circuit board (250) may include a signal region (253). When the circuit board (250) is viewed in one direction (e.g., the (-)z-axis direction), the signal region (253) may not overlap with the ground region (251). For example, the signal region (253) may be located outside the ground region (251) that overlaps with the at least one insulating layer and the at least one ground layer. According to one embodiment of the present disclosure, the signal region (253) may be a region used to transmit a signal to a metal frame (200) (e.g., a conductive portion (203)). The circuit board (250) may include a plurality of layers. The circuit board (250) may include at least one insulating layer and at least one conductive layer (e.g., a copper layer). The at least one conductive layer may include a layer used for transmitting a signal (hereinafter, a signal transmission layer) and a layer on which a ground plane is formed (hereinafter, a ground layer). The above-mentioned at least one conductive layer may include one or more signal transmission layers and / or one or more ground layers. In the circuit board (250), the ground region (251) may represent a portion of the signal transmission layer that overlaps with the at least one insulating layer and the at least one ground layer. In other words, when the circuit board (250) is viewed in one direction (e.g., the (-)z-axis direction), the ground region (251) may represent a region formed with a conductive portion (e.g., a copper portion) for transmitting the ground of one or more electronic components (e.g., a wireless communication circuit (220)) of the electronic device (101). On the other hand, the signal region (253) in the circuit board (250) may represent a region that overlaps only with the at least one insulating layer among the at least one insulating layer and the at least one ground layer. The signal region (253) may be referred to by various terms.The signal area (253) may be referred to by technical terms such as non-copper area, non-ground area, clearance area, ground clearance area, ground keep-out area, ground void area, RF clearance area, ground relief area, and / or equivalent, in that it overlaps only with the insulating layer. The signal area (253) may represent an area between the metal frame (200) (e.g., conductive portion (203)) and the ground area (251) of the circuit board (250) where the conductive portion of the ground area (251) (e.g., copper portion for providing ground) is removed. In terms of being removed, the signal area (253) may be referred to by technical terms such as peel-cut area, copper removal area, keep-out area, cut-out area, and / or equivalent. However, the use of these terms is not to be interpreted as limiting the manufacturing process or implementation method of the circuit board (250). For example, the signal area (253) may not include a copper portion for ground. In the signal region (253), the circuit board (250) may include insulating layers (e.g., dielectric layers) without the copper portions. In other words, the ground region (251) may represent a region of the circuit board (250) where there is no ground plane above or below.

[0062] A circuit board (250) may have a power supply structure between a wireless communication circuit (220) and a conductive portion (212). The circuit board (250) may include a power supply portion (261) in a ground area (251) and a radiation line portion (263) in a signal area (253). The power supply portion (261) may include a signal line including a ground around it. The radiation line portion (263) may include a conductive line disposed on some of the plurality of insulating layers, wherein a plurality of insulating layers are laminated for signal transmission in the signal area (253). The radiation line portion (263) may be electrically connected to a conductive member (e.g., C-clip, conductive pattern). The conductive member may be disposed on one side of the circuit board (250). The conductive member may be disposed to contact a protrusion (231) of the conductive portion (212) or a component connected to the protrusion (231). Due to the above contact, an RF signal from the wireless communication circuit (220) and the feed portion (261) can be provided to the conductive portion (212). The conductive portion (212) can be configured to radiate the RF signal.

[0063] According to embodiments of the present disclosure, to increase the hemisphere directivity, an electric object (e.g., a metal structure (202)) may be used as a reflector. A radiator may be required to be placed adjacent to the electric object (e.g., a metal structure (202)). According to one embodiment of the present disclosure, a radiating line portion (263) may function as a radiator for an RF signal of a wireless communication circuit (220). Since there is no ground around the radiating line portion (263) to shield the signal or reduce noise, the radiating line portion (263) may be configured to radiate as well as feed the signal. In other words, the radiating line portion (263) may function as a radiator. Both the radiating line portion (263) and the conductive portion (212) may be used as radiators. For example, the conductive portion (212) may be used for multiple frequency bands. The conductive part (212) may be positioned so as to be sufficiently spaced apart from the electric object (e.g., metal structure (202)) so that signals of the conductive part (212) are not affected by the electric object in a frequency band (e.g., S-band for satellite communication) different from the communication frequency band (e.g., S-band for satellite communication) provided through the wireless communication circuit (220). To use the metal structure (202) as a reflector, a radiation line part (263), different from the conductive part (212), may be used as a radiator for the communication frequency band (e.g., S-band for satellite communication).

[0064] According to one embodiment of the present disclosure, the radiating line portion (263) may include a conductive line having a longitudinal direction corresponding to the longitudinal direction of the conductive portion (212). For example, the conductive portion (212) may be positioned to face one direction (e.g., the top direction of the electronic device (101)). Signals radiated from the conductive line may be reflected through a reflector. To ensure that the direction of reflection corresponds to the one direction, the longitudinal direction of the conductive line may correspond to the longitudinal direction of the conductive portion (212). As an example not limited to examples, the longitudinal direction of the conductive line may be substantially parallel to the longitudinal direction of the conductive portion (212). Referring to both FIG. 2a and FIG. 2b, the radiating line portion (263) may be positioned between the conductive portion (212) and an electrical object (e.g., a metal structure (202)). According to one embodiment of the present disclosure, a radiating line portion (263) may be formed spaced apart from the metal structure (202) along one side of the metal structure (202) facing the top of the electronic device (101). For example, the conductive line may be spaced apart from one side of the metal structure (202) for a certain range (e.g., about 5 mm or more and about 10 mm or less).

[0065] In FIG. 2b, the power supply portion (261) and the radiation line portion (263) are shown as continuous wires on a single layer, but embodiments of the present disclosure are not limited thereto. For example, the power supply portion (261) and the radiation line portion (263) may be placed on different layers within the circuit board (250). For example, the end of the power supply portion (261) may be electrically connected to the end of the radiation line portion (263) through a conductive via.

[0066] In FIG. 2b, a conductive portion (212) of a metal frame is described as an example of a radiator of the antenna (201), but embodiments of the present disclosure are not limited thereto. The conductive portion (212) may be a different type of radiator. For example, a patch radiator connected to the radiation line portion (263) may be understood as one type of conductive portion (203). As another example, a coil radiator connected to the radiation line portion (263) may be understood as one type of conductive portion (212).

[0067] In FIG. 2b, when the circuit board (250) is viewed in one direction (e.g., the (-)z-axis direction), an example is shown in which there is no ground layer in the signal area (253) of the circuit board (250), but is not limited to examples in which the ground layer of the circuit board (250) may be positioned sufficiently spaced apart from the radiation line portion (263).

[0068] FIG. 3a illustrates an example of an electronic device (e.g., electronic device (101)) comprising a metal frame (e.g., a metal frame including a conductive part (212)) and a metal structure (e.g., a metal structure (202)). The same reference numerals may be used for the same description.

[0069] Referring to FIG. 3a, the electronic device (101) may include a metal frame (301). The metal frame may include a side structure (310) and a support structure (343) connected to the side structure (310). For example, the support structure (343) may be formed by extending inward from the side structure (310). The side structure (310) may include a plurality of conductive portions. For example, the side structure (310) may include a first conductive portion (311), a second conductive portion (312), and a third conductive portion (313). The side structure (310) may be connected to the support structure (343) through a plurality of connecting portions. For example, the plurality of connecting portions may include a first connecting portion (341) and a second connecting portion (342). The first conductive portion (311) may be connected to the support structure (343) through the first connecting portion (341). The second conductive portion (312) may be connected to the support structure (343) through the second connecting portion (342). The support structure (343) may be positioned to support a component (e.g., a display) within the electronic device (101). The support structure (343) may be used to provide ground. For example, the support structure (343) may include a protruding portion (333) connected to ground.

[0070] Non-conductive portions may be disposed between the conductive portions of the side structure (310). For example, a first non-conductive portion (321) may be disposed between the first conductive portion (311) and the second conductive portion (312). A second non-conductive portion (322) may be disposed between the second conductive portion (312) and the third conductive portion (313). The non-conductive portions may be located on the outer edge of the electronic device (101). As an example, but not limited to, the non-conductive portions may be visible externally. The non-conductive portions may be referred to as segments. The side structure (310) and the support structure (343) of the metal frame (301) may form a space. For example, the metal frame (301) may have a slit (325) (or referred to as an open-ended slot). A dielectric material may be filled inside the electronic device (101), excluding the metal frame (301). A portion of the dielectric material may occupy the space of the slit (325). A portion of the dielectric material filled in the slit (325) may correspond to the first non-conductive portion (321).

[0071] According to one embodiment of the present disclosure, the second conductive portion (312) may be used as a radiator for communication (e.g., satellite communication and / or cellular communication). For example, the second conductive portion (312) may be referred to as the radiator of the antenna (201) of FIG. 2a and the conductive portion (212) of FIG. 2b. The second conductive portion (312) may have a shape for a feed structure of a circuit board (e.g., circuit board (250)). The second conductive portion (312) may have one or more protrusions. For example, the second conductive portion (312) may have a first protrusion (331) and a second protrusion (332). The first protrusion (331) may be electrically connected to the feed structure of the circuit board (250). The first protrusion (331) may be referred to as the protrusion (231) of FIG. 2b. According to one embodiment of the present disclosure, the second conductive portion (312) may be used as a radiator for a plurality of frequency bands. The plurality of frequency bands may include frequency bands for satellite communication and frequency bands for cellular communication (e.g., LTE, NR). For example, the frequency band for satellite communication may include an S-band (transmission: 1.98 GHz to 2.01 GHz, reception: 2.17 to 2.20 GHz) and / or an L1-band (about 1563.42 MHz (megahertz) or more and less than about 1587.42 MHz, center frequency: about 1575.42 MHz). For example, the frequency band for cellular communication may include a mid-band (MB) frequency band from about 1 GHz to less than 2.3 GHz and / or a high-band (HB) frequency band from about 2.3 GHz or more. For example, the first protrusion (331) may be electrically connected to a feed structure for a frequency band for the satellite communication. The second protrusion (332) may be electrically connected to a feed structure for a frequency band for the cellular communication.

[0072] An electronic device (101) according to embodiments of the present disclosure may include a feed structure for increasing antenna directivity. For example, the electronic device (101) may use a reflector to increase directivity in one direction (e.g., (+)y-axis direction). A reflector refers to a metallic structure used to concentrate electromagnetic waves in a specific direction. The reflector may be used to improve the radiation pattern or increase directivity. According to one embodiment of the present disclosure, the electronic device (101) may use a SUS (345) of a speaker module (e.g., an acoustic output module (155)) as a reflector. The metal structure (202) of FIG. 2a may be referenced for the SUS (345). Meanwhile, since the SUS (345) can function as a ground, it may be required that the SUS (345) be spaced apart from the radiator by a certain distance or more. For example, the SUS (345) may be required to be spaced apart from the second conductive portion (312) by a certain distance. To use the SUS (345) as a reflector, a radiator may be placed between the second conductive portion (312) and the SUS (345). According to one embodiment of the present disclosure, a part of the power supply structure of a circuit board (e.g., circuit board (250)) (e.g., the radiating line portion (263) of FIG. 2b) may be used as the radiator.

[0073] The electronic device (101) can perform a predefined service (e.g., satellite communication service). The predefined service may require high up-axis directivity. To increase up-axis directivity, a second conductive part (312) and a SUS (345) having a radiation direction in the upward direction (e.g., (+)y-axis direction) may be used. For example, signals from the radiation line part (263) of the circuit board (250) can be reflected by the SUS (345) so that signals can be propagated in the upward direction (e.g., (+)y-axis direction). The electronic device (101) can provide the predefined service through the signals of the second conductive part (312), the signals of the radiation line part (263), and / or the signals reflected by the SUS (345). An example of a feed structure of the circuit board (250) for using the SUS (345) as a reflector is described in detail through FIG. 3b.

[0074] To explain the effect of the metal frame (301) due to the SUS (345), an antenna structure area (351) and a ground structure area (352) may be defined. According to one embodiment of the present disclosure, the antenna structure area (351) may be defined based on signals radiated through a part of the metal frame (301) (e.g., a second conductive part (312)). For example, the antenna structure area (351) may correspond to a conductive area surrounding the slit (325). An area containing a metal structure (e.g., SUS (345)) that acts as a reflector may be defined as the ground structure area (352). Let us assume that the antenna structure configured to radiate signals and the ground structure for providing ground each have a longitudinal direction in the same direction (e.g., the x-axis direction). If the area of ​​the ground structure is insufficient, it may be difficult to form the intended radiation pattern using the antenna structure. According to one embodiment of the present disclosure, with respect to one direction (e.g., the x-axis direction), the difference between the length of the antenna structure area (351) and the length of the ground structure area (352) may be less than a critical distance (e.g., about 2 mm). For example, the length of the antenna structure area (351) may be about 22.4 mm. The length of the ground structure area (352) may be about 23.8 mm. Examples of the critical distance are described in detail through FIGS. 6 and 7.

[0075] FIG. 3b shows an example of a circuit board (e.g., circuit board (250)). The same reference numbers may be used for the same description.

[0076] Referring to FIG. 3b, the electronic device (101) may include a circuit board (250). The circuit board (250) may include a feed portion (261) in a ground area (251) and a radiation line portion (263) in a signal area (253). For each of the ground area (251) and the signal area (253), the descriptions of FIG. 2b may be referenced. The feed portion (261) may include a signal line including a ground around it. The radiation line portion (263) may include a conductive line disposed on some of the plurality of insulating layers (e.g., a top insulating layer) where a plurality of insulating layers are stacked for signal transmission in the signal area (253).

[0077] According to embodiments of the present disclosure, the radiating line portion (263) may function as a radiator for an RF signal of a wireless communication circuit (220). According to one embodiment of the present disclosure, the radiating line portion (263) may include a conductive line (360) and a conductive line (362). The electronic device (101) may include a feed structure for transmitting an RF signal from the wireless communication circuit (220) to a second conductive portion (312). The circuit board (250) may include a conductive line (360), a first matching portion (391), a conductive line (362), and a first contact portion (371). The first matching portion (391) may include one or more passive elements (or concentrated elements) (e.g., an inductor, a capacitor). The one or more elements may be used for impedance matching. The first matching portion (391) may be connected to the ground portion (381) of the circuit board (250). The ground portion (381) of the circuit board (250) may be connected to a structure for grounding within the electronic device (101) (e.g., a support structure (343)). A conductive line (362) may connect the first matching portion (391) and the first contact portion (371). A conductive member (e.g., a C-clip, a conductive pattern, a conductive structure) electrically connected to the second conductive portion (312) may be placed on the first contact portion (371). Through contact between the conductive member and a part of the second conductive portion (312) (e.g., the first protruding portion (331)), an RF signal from the wireless communication circuit (220) may be provided to the second conductive portion (312). The contact point may be referred to as a feed point.

[0078] According to one embodiment of the present disclosure, the second conductive portion (312) may be used as a radiator for a frequency band other than the frequency band supported by the wireless communication circuit (220) (e.g., S-band for satellite communication) (hereinafter, first frequency band) (e.g., L1 band, MB frequency band, HB frequency band, and / or other NR frequency bands) (hereinafter, second frequency band). The electronic device (101) may include a feed structure for transmitting an RF signal from the second frequency band to the second conductive portion (312). The circuit board (250) may include a second contact portion (372) and a second matching portion (392). The second matching portion (392) may include one or more passive elements (or lumped elements) (e.g., inductors, capacitors). The one or more elements may be used for impedance matching. The second matching portion (392) may be connected to the ground portion (381) of the circuit board (250). A conductive member (e.g., C-lip, conductive pattern, conductive structure) electrically connected to the second conductive portion (312) may be disposed at the second contact portion (372). Through contact between the conductive member and a part of the second conductive portion (312) (e.g., second protrusion (332)), an RF signal of the second frequency band may be provided to the second conductive portion (312). The contact point may be referred to as a feed point.

[0079] According to embodiments of the present disclosure, the radiation line portion (263) can function as a radiator for a predefined service (e.g., satellite communication service). SUS (345) may be used to increase up-hemispheric directivity. Signals from the radiating line portion (263) of the circuit board (250) can be propagated in an upward direction (e.g., in the (+)y-axis direction) by being reflected by the SUS (345). According to embodiments of the present disclosure, the radiating line portion (263) may include a conductive line (360) having a longitudinal direction in one direction (e.g., in the x-axis direction) between a metal structure (e.g., SUS (345)) and a conductive portion (e.g., a second conductive portion (312)). According to one embodiment of the present disclosure, the conductive portion (212) may be positioned to face in one direction (e.g., the upward direction of the electronic device (101). Signals radiated from the conductive line (360) may be reflected through the metal structure (e.g., SUS (345)). In order for the reflected direction to correspond to the one direction (e.g., the upward direction of the electronic device (101)), the longitudinal direction of the conductive line (360) of the conductive portion (212) It may correspond to the longitudinal direction. According to one embodiment of the present disclosure, the radiating line portion (263) may be formed spaced apart from the SUS (345) along one side of the SUS (345) facing the top of the electronic device (101) (e.g., one or more planes corresponding to the xz plane). The conductive line (360) may be formed along one side of the SUS (345) located in a region opposite to the region on the side where the conductive portion (212) is located. As an example, but not limited to, the longitudinal direction of the conductive line (360) may be substantially parallel to one side of the SUS (345).

[0080] The radiation line portion (263) may be part of a feed structure for transmitting an RF signal of the wireless communication circuit (220) (i.e., an RF signal of the first frequency band (e.g., S-band for satellite communication)) to the second conductive portion (312). The conductive line (360) of the radiation line portion (263) may correspond to the conductive portion closest to the SUS (345) among the conductive portions (e.g., copper portions) within the signal area (253) of the circuit board (250). As a non-limiting example, a separate structure providing ground may not be placed between the radiation line portion (263) containing the conductive line (360) and the SUS (345). The conductive line (360) may correspond to a radiation source, and the SUS (345) may correspond to a reflector. As the distance between the radiation source and the reflector increases, the amount of signals reflected through the reflector may decrease. Conversely, the closer the distance between the radiation source and the reflector, the greater the amount of signals reflected through the reflector. However, if the distance between the radiation source and the reflector is less than a critical distance, the signal from the radiation source may be transmitted to ground, thereby reducing the amount of reflected signals. Based on these characteristics of the distance between the radiation source and the reflector, the distance between the SUS (345) and the conductive line (360) can be determined. According to one embodiment of the present disclosure, the distance between the conductive line (360) and the SUS (345) may be approximately 0.5 mm or more and less than approximately 1.0 mm. The radiation performance according to the distance between the conductive line (360) and the SUS (345) is described in detail through FIGS. 5a and 5b.

[0081] FIG. 4 illustrates examples of a circuit board (e.g., circuit board (250)) and a conductive part (e.g., conductive part (212), second conductive part (312)). The same reference numbers may be used for the same description.

[0082] Referring to FIG. 4, the electronic device (101) may include a circuit board (250). The circuit board (250) may include a first region (420) connected to a wireless communication circuit (220), a second region (430) extending from the first region (420) and including a signal line for transmitting an RF signal from the wireless communication circuit (220), and a third region (440) extending from the second region (430) and having a feeding structure for a radiator. The first region (420) may be referred to as a component region, a signal source region, and / or equivalent technical or structural terms. The second region (430) may be referred to as a connection region, a cable region, and / or equivalent technical or structural terms. The third region (440) may be referred to as a feeding region, an antenna region, a radiation region, and / or equivalent technical or structural terms.

[0083] According to embodiments of the present disclosure, the radiating line portion (263) of the third region (440) may function as a radiator for an RF signal of the wireless communication circuit (220). In other words, the radiating line portion (263) may be part of a feeding structure for transmitting an RF signal of the wireless communication circuit (220) (in other words, an RF signal of the first frequency band (e.g., S-band for satellite communication)) to the second conductive portion (312). According to one embodiment of the present disclosure, the radiating line portion (263) may include a conductive line (360) and a conductive line (362). The conductive line (360) may have a longitudinal direction in one direction (e.g., x-axis direction) between a metal structure (e.g., SUS (345)) and a conductive portion (e.g., the second conductive portion (312)).

[0084] The circuit board (250) may include components for using the second conductive portion (312) as a radiator in addition to the radiating line portion (263). The second conductive portion (312) may be used as a radiator for a plurality of frequency bands. The plurality of frequency bands may include frequency bands for satellite communication and frequency bands for cellular communication (e.g., LTE, NR). The circuit board (250) may include a first contact portion (371) and a first matching portion (391) for a first frequency band (e.g., S-band for satellite communication) among the plurality of frequency bands. According to one embodiment of the present disclosure, the first contact portion (371) may be connected to a first protruding portion (331) of the second conductive portion (312). For example, a conductive member disposed on the first contact portion (371) of the circuit board (250) may come into contact with the first protruding portion (331). The circuit board (250) may include a second contact portion (372) and a second matching portion (392) for a second frequency band (e.g., a frequency band for cellular communication) among the plurality of frequency bands. According to one embodiment of the present disclosure, the second contact portion (372) may be connected to a second protruding portion (332) of a second conductive portion (312). For example, a conductive member disposed on the second contact portion (372) of the circuit board (250) may come into contact with the second protruding portion (332). The ground portion (381) of the circuit board (250) may be connected to a protruding portion (333) of a support structure (343). For example, a conductive member disposed on the ground portion (381) of the circuit board (250) may come into contact with the protruding portion (333).

[0085] In FIG. 4, an example is illustrated in which a wireless communication circuit (220) is disposed on a circuit board (250), but the embodiments of the present disclosure are not limited thereto. It can also be understood that the embodiments of the present disclosure are applicable in a circuit in which a wireless communication circuit (220) is disposed on a PCB separately and the PCB and the circuit board (250) are electrically connected.

[0086] FIGS. 5A and 5B illustrate examples of radiation patterns according to the distance between a radiation line portion (e.g., radiation line portion (263), conductive line (360)) of a circuit board (e.g., circuit board (250)) and a metal structure (e.g., metal structure (202), metal structure (345)). The same reference numerals may be used for the same description.

[0087] Referring to FIG. 5a, example (500a) shows a radiation pattern according to the distance between a radiator (e.g., radiation line portion (263), conductive line (360)) and a reflector (e.g., metal structure (202), SUS (345)). 0 degrees represents the front direction of the electronic device (101), and 180 degrees represents the rear direction of the electronic device (101). 90 degrees to the left represents the top of the electronic device (101), and 90 degrees to the right represents the bottom of the electronic device (101). The first line (501) shows a radiation pattern when the distance between the conductive line (360) and the SUS (345) is approximately 0.1 mm. The second line (502) shows a radiation pattern when the distance between the conductive line (360) and the SUS (345) is approximately 0.3 mm. The third line (503) exhibits a radiation pattern when the distance between the conductive line (360) and the SUS (345) is approximately 0.5 mm. The fourth line (504) exhibits a radiation pattern when the distance between the conductive line (360) and the SUS (345) is approximately 1.0 mm. When comparing the first line (501), the second line (502), the third line (503), and the fourth line (504), it can be confirmed that as the distance between the radiator and the reflector approaches approximately 0.1 mm to approximately 1.0 mm, the gain in the upper direction of the radiation pattern of the electronic device (101) (hereinafter referred to as boresight gain) decreases.

[0088] The example (500b) of FIG. 5b shows a radiation pattern according to the distance between a radiator (e.g., radiation line portion (263), conductive line (360)) and a reflector (e.g., metal structure (202), SUS (345)). 0 degrees represents the front direction of the electronic device (101), and 180 degrees represents the rear direction of the electronic device (101). 90 degrees to the left represents the top of the electronic device (101), and 90 degrees to the right represents the bottom of the electronic device (101). The first line (551) shows a radiation pattern when the distance between the conductive line (360) and the SUS (345) is approximately 1.0 mm. The second line (552) shows a radiation pattern when the distance between the conductive line (360) and the SUS (345) is approximately 1.5 mm. The third line (553) exhibits a radiation pattern when the distance between the conductive line (360) and the SUS (345) is approximately 2.0 mm. By comparing the first line (551), the second line (552), the third line (553), and the fourth line (504), it can be confirmed that as the distance between the radiator and the reflector increases beyond approximately 1.0 mm, the gain in the upward direction of the radiation pattern of the electronic device (101) (hereinafter, aiming direction gain) decreases. For example, when the distance between the radiator and the reflector is approximately 2.0 mm, the aiming direction gain of the radiation pattern is approximately -0.3 dB lower than the aiming direction gain of the radiation pattern when the distance between the radiator and the reflector is approximately 1.0 mm. It can be confirmed that as the distance between the radiator and the reflector increases, the role of the reflector decreases.

[0089] FIG. 6 shows an example of total efficiency according to the length of a metal structure (e.g., metal structure (202), SUS (345)). The same reference numbers may be used for the same description.

[0090] Referring to FIG. 6, the graph (600) represents the overall efficiency according to the length of a metal structure (e.g., metal structure (202), SUS (345)). The horizontal axis of the graph (600) represents frequency (unit: GHz), and the vertical axis of the graph (600) represents the overall efficiency (unit: decibel, dB). The metal structure may correspond to a ground structure for an antenna (or radiator). The length of the metal structure represents the length of the metal structure in one direction (e.g., the x-axis direction in FIG. 3a and FIG. 3b). For example, the one direction may correspond to the length direction of a conductive part (e.g., conductive part (212), second conductive part (312)). For example, the one direction may correspond to the length direction of a conductive line (e.g., conductive line (360)) that is positioned closest to the metal structure among the radiating line parts (e.g., radiating line part (263)). Based on the above one direction, the length of the area including the metal structure (e.g., ground structure area (352)) can be defined relative to the length of the area including the conductive area surrounding the slit (325) where the conductive line (360) is located (e.g., antenna structure area (351)).

[0091] The first line (601) represents the overall efficiency of an antenna using a metal structure as a reflector that has a length approximately 1 mm shorter than the length of the antenna structure region (351). The second line (602) represents the overall efficiency of an antenna using a metal structure as a reflector that has a length approximately 2 mm shorter than the length of the antenna structure region (351). The third line (603) represents the overall efficiency of an antenna using a metal structure as a reflector that has a length approximately 5 mm shorter than the length of the antenna structure region (351). The fourth line (604) represents the overall efficiency of an antenna using a metal structure as a reflector that has a length approximately 8 mm shorter than the length of the antenna structure region (351). The fifth line (605) represents the overall efficiency of an antenna using a metal structure as a reflector that has a length corresponding to the length of the antenna structure region (351).

[0092] Referring to graph (600), it can be confirmed that at a frequency of about 2 GHz, the difference between the total efficiency values ​​between the lines is within a critical range. For example, at a frequency of about 2 GHz, the difference between the largest total efficiency value and the smallest total efficiency value may be within about 0.1 dB. However, at a frequency of about 3.5 GHz, it can be confirmed that the difference between the total efficiency values ​​between the lines is outside the critical range. For example, at a frequency of about 3.5 GHz, the difference between the total efficiency values ​​between the lines may be greater than the difference between the total efficiency values ​​between the lines at a frequency of about 2 GHz. Through these results, it can be confirmed that the length of the metal structure does not have a significant effect on directivity. Additionally, through these results, it can be confirmed that the length of the metal structure may affect the performance of a radiator supporting multiple bands (e.g., the second conductive part (312)) in a specific band (e.g., a frequency band other than the S-band for satellite communication). The metal structure may be required to provide sufficient ground for the antenna. According to one embodiment of the present disclosure, with respect to one direction (e.g., x-axis direction), the difference between the length of the antenna structure area (351) and the length of the ground structure area (352) may be less than a critical distance (e.g., about 2 mm).

[0093] FIG. 7 shows an example of a radiation pattern along the length of a metal structure (e.g., metal structure (202), SUS (345)). The same reference numbers may be used for the same description.

[0094] Referring to FIG. 7, Example (700) shows a radiation pattern according to the difference in length between the antenna structure area (351) and the ground structure area (352). 0 degrees indicates the front direction of the electronic device (101), and 180 degrees indicates the rear direction of the electronic device (101). 90 degrees to the left indicates the top of the electronic device (101), and 90 degrees to the right indicates the bottom of the electronic device (101). The first line (701) shows a radiation pattern when the difference in length between the antenna structure area (351) and the ground structure area (352) is about 1 mm. The second line (702) shows a radiation pattern when the difference in length between the antenna structure area (351) and the ground structure area (352) is about 5 mm. The third line (703) shows a radiation pattern when the difference between the length of the antenna structure area (351) and the length of the ground structure area (352) is about 8 mm. The fourth line (704) shows a radiation pattern when the difference between the length of the antenna structure area (351) and the length of the ground structure area (352) is about 0 mm. By comparing the first line (701), the second line (702), the third line (703), and the fourth line (704), it can be confirmed that there is a negligible change in the gain of the radiation pattern of the electronic device (101) in the upper direction.

[0095] FIG. 8 shows an example of a radiation pattern of an antenna including a radiation line portion (e.g., radiation line portion (263)) adjacent to a metal structure (e.g., metal structure (202), SUS (345)).

[0096] Referring to FIG. 8, example (800) shows a radiation pattern depending on the presence or absence of the conductive line (360) of the radiation line portion (263) of FIG. 3b adjacent to the SUS (345). 0 degrees indicates the front direction of the electronic device (101), and 180 degrees indicates the rear direction of the electronic device (101). 90 degrees to the left indicates the top of the electronic device (101), and 90 degrees to the right indicates the bottom of the electronic device (101). The first line (801) shows a radiation pattern in a structure where the radiation line portion (263) (or conductive line (360)) is spaced from the SUS (345) by a distance within a predefined range (e.g., about 0.5 mm or more and within 1.0 mm). The second line (802) represents a radiation pattern in a feed structure that does not include a radiation line portion (263) (or conductive line (360)) located within the above-defined range from the SUS (345).

[0097] The gain in the upward direction of the radiation pattern of the electronic device (101) of the first line (801) may be about 36.0 dBm (decibel milliwatt). The gain in the upward direction of the radiation pattern of the electronic device (101) of the second line (802) may be about 34.8 dBm. When comparing the first line (801) and the second line (802), it can be confirmed that the gain in the upward direction of the radiation pattern of the electronic device (101) increases through a structure in which the radiation line portion (263) (or conductive line (360)) is spaced from the SUS (345) by a distance within a predefined range (e.g., about 0.5 mm or more and within 1.0 mm).

[0098] Embodiments of the present disclosure relate to a reflector antenna utilizing an antenna (e.g., antenna (201)) and an electric object (e.g., metal structure (202)). The reflector may be used to improve the performance of the antenna by reflecting electromagnetic waves in a specific direction. A portion of the antenna (201) (e.g., a conductive line (360) of a radiation line portion (263)) may be positioned adjacent to the electric object, and the electric object may function as a reflector for signals radiated from the portion. Through this, the up-hemidirectionality of the electronic device (101) may be increased.

[0099] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs from the description below.

[0100] In embodiments of the present disclosure, an electronic device (101) is provided. The electronic device (101) may include a wireless communication circuit (220); a metal frame including a conductive portion (212; 312); and a circuit board (250) having a ground area (251) for the wireless communication circuit (220) and a fill-cut area (253) formed between the ground area (251) and the conductive portion (212; 312). The circuit board (250) may include a feed portion (261) connected to the wireless communication circuit (220) in the ground area (251) and a radiation line portion (263) extending from the feed portion (261) in the fill-cut area (253) and connected to the conductive portion (212; 312). The electronic device (101) may include a metal structure (202; 345) configured to function as a reflector in response to signals in the radiating line portion (263). The radiating line portion (263) may include a conductive line having a longitudinal direction corresponding to the longitudinal direction of the conductive portion (212; 312) between the metal structure (202; 345) and the conductive portion (212; 312).

[0101] For example, the radiation line portion (263) may be spaced substantially less than 1 mm (millimeter) away from the metal structure (202; 345).

[0102] For example, the radiation line portion (263) may be spaced substantially 0.5 mm or more apart from the metal structure (202; 345).

[0103] For example, at least a portion of the conductive portion (212; 312) may be positioned at the top among the top, bottom, left, and right sides of the electronic device (101). The conductive line of the radiating line portion (263) may be formed spaced apart from the metal structure (202; 345) along one side of the metal structure (202; 345) toward the top of the electronic device (101).

[0104] For example, the metal frame may include a side structure forming the outer side of the electronic device (101) and a support structure connected inwardly from the side structure. The side structure may include the conductive portion (212; 312). The conductive portion (212; 312) and the radiating line portion (263) connected to the conductive portion (212; 312) may be used as a radiator for a frequency band for satellite communication.

[0105] For example, the side structure may include a second conductive portion (212; 312) adjacent to a non-conductive portion (212; 312) adjacent to the conductive portion (212; 312). The side structure and the support structure may be connected through a plurality of connecting portions. The plurality of connecting portions may include a first connecting portion for the conductive portion (212; 312) and a second connecting portion for the second conductive portion (212; 312). The metal frame may have a slit formed between the first connecting portion, the second connecting portion, the conductive portion (212; 312), the second conductive portion (212; 312), and the support structure. Based on the longitudinal direction of the conductive portion (212; 312), the difference between the length of the conductive region surrounding the slit and the length of the metal structure (202; 345) may be substantially less than 2 mm (millimeter).

[0106] For example, the conductive portion (212; 312) may include a first protruding portion and a second protruding portion facing inward. The first protruding portion may be connected to a first signal path including the feed portion (261) and the radiation line portion (263). The second protruding portion may be connected to a second signal path different from the first signal path. The first signal path may be used to transmit or receive signals in a frequency band for satellite communication through the conductive portion (212; 312). The second signal path may be used to transmit or receive signals in a frequency band for cellular communication through the conductive portion (212; 312).

[0107] For example, the support structure may include a third protrusion formed to face the side structure. The third protrusion may be positioned between the first protrusion and the second protrusion. The third protrusion may be electrically connected to the ground portion of the circuit board (250).

[0108] For example, the circuit board (250) may include a first contact portion in which a first conductive member connected to the first protrusion is disposed, and one or more passive elements, and may include a first matching portion disposed between the first contact portion and the radiation line portion (263). The first matching portion may be connected to the ground portion of the circuit board (250).

[0109] For example, the circuit board (250) may include a second feed portion (261) connected to a second wireless communication circuit (220) for cellular communication in the ground area (251), a second contact portion connected to the second feed portion (261) and having a second conductive member connected to the second protruding portion disposed therein, and a second matching portion including one or more passive elements. The second matching portion may be connected to the ground portion of the circuit board (250).

[0110] For example, the ground region (251) may represent an area on the circuit board (250) having a ground plane above or below. The fill-cut region (253) may represent an area on the circuit board (250) that does not have the ground plane above or below.

[0111] For example, the metal structure (202; 345) may include SUS (Steel Use Stainless) for the speaker module of the electronic device (101).

[0112] For example, the metal structure (202; 345) may include a camera bracket of the electronic device (101).

[0113] For example, within the electronic device (101), a ground structure may not be placed between the radiation line portion (263) and the metal structure (202; 345).

[0114] For example, at least a portion of the radiation line portion (263) may be closest to the metal structure (202; 345) among the copper portions within the fill-cut area (253) of the circuit board (250).

[0115] In embodiments of the present disclosure, an electronic device (101) is provided. The electronic device (101) may include a wireless communication circuit (220); a metal frame comprising a conductive portion (212; 312); a circuit board (250) comprising a feed portion (261) connected to the wireless communication circuit (220) and a radiation line portion (263) extending from the feed portion (261) and connected to the conductive portion (212; 312); and a metal structure (202; 345) configured to function as a reflector in response to signals in the radiation line portion (263). The radiation line portion (263) may include a conductive line having a longitudinal direction corresponding to the longitudinal direction of the conductive portion (212; 312) between the metal structure (202; 345) and the conductive portion (212; 312). The above radiation line portion (263) may be spaced substantially apart from the metal structure (202; 345) by a distance of more than 0.5 m (millimeter) and less than 1 mm.

[0116] For example, at least a portion of the conductive portion (212; 312) may be positioned at the top among the top, bottom, left, and right sides of the electronic device (101). The conductive line of the radiating line portion (263) may be formed spaced apart from the metal structure (202; 345) along one side of the metal structure (202; 345) toward the top of the electronic device (101).

[0117] For example, the metal frame may include a side structure forming the outer side of the electronic device (101) and a support structure connected inwardly from the side structure. The side structure may include the conductive portion (212; 312). The conductive portion (212; 312) and the radiating line portion (263) connected to the conductive portion (212; 312) may be used as a radiator for a frequency band for satellite communication.

[0118] For example, the side structure may include a second conductive portion (212; 312) adjacent to a non-conductive portion (212; 312) adjacent to the conductive portion (212; 312). The side structure and the support structure may be connected through a plurality of connecting portions. The plurality of connecting portions may include a first connecting portion for the conductive portion (212; 312) and a second connecting portion for the second conductive portion (212; 312). The metal frame may have a slit formed between the first connecting portion, the second connecting portion, the conductive portion (212; 312), the second conductive portion (212; 312), and the support structure. Based on the longitudinal direction of the conductive portion (212; 312), the difference between the length of the conductive region surrounding the slit and the length of the metal structure (202; 345) may be substantially less than 2 mm.

[0119] For example, the metal structure (202; 345) may include SUS (Steel Use Stainless) for the speaker module.

[0120] In embodiments of the present disclosure, an electronic device is provided. The electronic device may include: a wireless communication circuit; a frame comprising a side forming an outer surface of the electronic device and a support structure disposed inwardly in the side structure, wherein the side structure comprises a conductive portion at the top side of the electronic device; a circuit board having at least one insulating layer and at least one ground layer, wherein a feed portion connected to the wireless communication circuit is formed in an area (251) overlapping with the at least one insulating layer and the at least one ground layer, and a radiation line portion extending from the feed portion and connected to the conductive portion is formed in an area (253) overlapping only the at least one insulating layer among the at least one insulating layer and the at least one ground layer; and a metal structure disposed on the support structure of the frame. The conductive portion and the radiation line portion connected to the conductive portion may be configured to function as a radiator. The metal structure may be configured to function as a reflector for signals from the radiation line portion. The above-mentioned radiation line portion may include a conductive line having a longitudinal direction corresponding to the longitudinal direction of the conductive portion between the metal structure and the conductive portion.

[0121] For example, the conductive line of the radiation line portion may be formed along one side of the metal structure that is spaced apart from the metal structure and faces the upper side of the electronic device.

[0122] For example, the conductive line of the radiation line portion may be spaced apart from the metal structure by a distance substantially less than 1 mm (millimeter).

[0123] For example, the conductive line of the radiation line portion may be spaced apart from the metal structure by a distance of substantially 0.5 mm or more.

[0124] For example, the conductive part and the radiation line part connected to the conductive part may be configured to transmit a signal on a frequency band for satellite communication.

[0125] For example, the side structure may include a second conductive portion adjacent to a non-conductive portion adjacent to the conductive portion. A plurality of connecting portions may be disposed between the side structure and the support structure. The plurality of connecting portions may include a first connecting portion for the conductive portion and a second connecting portion for the second conductive portion. The frame may have a slit formed between the first connecting portion, the second connecting portion, the conductive portion, the second conductive portion, and the support structure. With respect to the longitudinal direction of the conductive portion, the difference between the length of the conductive region surrounding the slit and the length of the metal structure may be substantially less than 2 mm (millimeter).

[0126] For example, the wireless communication circuit may be used for satellite communication. The circuit board may include a second feed portion connected to a second wireless communication circuit for cellular communication, a second contact portion connected to the second feed portion and having a second conductive member connected to the second protrusion portion disposed therein, and a second matching portion including one or more passive elements. The second matching portion may be connected to a ground portion of the circuit board.

[0127] For example, the region (251) overlapping with the at least one insulating layer and the at least one ground layer may represent a region on the circuit board having a ground plane above or below. The region (253) overlapping with only the at least one insulating layer among the at least one insulating layer and the at least one ground layer may represent a region on the circuit board without a ground plane above or below.

[0128] For example, at least a portion of the radiation line portion may be closest to the metal structure among the copper portions within the region (253) where only the at least one insulating layer overlaps with the at least one ground layer of the circuit board.

[0129] For example, the region (253) in which only the at least one insulating layer among the at least one insulating layer and the at least one ground layer overlaps may be located outside the region (251) in which the at least one insulating layer and the at least one ground layer overlap.

[0130] In embodiments of the present disclosure, an electronic device is provided. The electronic device may include: a wireless communication circuit; a frame comprising a side forming an outer surface of the electronic device and a support structure disposed inwardly from the side structure, wherein the side structure comprises a conductive portion at the top side of the electronic device; a circuit board comprising a feed portion connected to the wireless communication circuit and a radiation line portion extending from the feed portion and connected to the conductive portion; and a metal structure configured to function as a reflector for signals in the radiation line portion. The radiation line portion may include a conductive line having a longitudinal direction corresponding to the longitudinal direction of the conductive portion between the metal structure and the conductive portion. The conductive line of the radiation line portion may be spaced substantially apart from the metal structure by a distance of at least 0.5 m (millimeter) and less than 1 mm.

[0131] For example, the conductive portion and the radiation line portion connected to the conductive portion can be used as a radiator for a frequency band for satellite communication.

[0132] For example, the metal structure (202) may include a camera bracket of the electronic device (101).

[0133] For example, within the electronic device (101), a ground structure may not be placed between the radiation line portion (263) and the metal structure (202) or SUS (345).

[0134] For example, at least a portion of the radiation line portion (263) may be closest to the metal structure (202) among the copper portions within the fill-cut area (253) of the circuit board (250).

[0135] For one or more embodiments, at least one of the components described in one or more of the prior art drawings may be configured to perform one or more operations, techniques, processes and / or methods as described in the present disclosure. For example, a processor (e.g., a baseband processor) described in the present disclosure in relation to one or more of the prior art drawings may be configured to operate according to one or more examples described in the present disclosure. As another example, circuits associated with user equipment (UE), a base station, a network element, etc., as described above in relation to one or more of the prior art drawings may be configured to operate according to one or more examples described herein.

[0136] Any of the embodiments described above may be combined with any other embodiment (or combination of embodiments) unless otherwise explicitly stated. The foregoing description of one or more embodiments is for illustrative and explanatory purposes only, and is not intended to limit or exhaust the scope of the embodiments in the exact form disclosed. Modifications and variations are possible in light of the foregoing teachings or may be obtained from the practice of various embodiments.

[0137] The electronic devices according to the various embodiments disclosed in this document may be of various forms. The electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or consumer electronics. The electronic devices according to the embodiments of this document are not limited to the devices described above.

[0138] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as "coupled" or "connected" to another (e.g., 2nd) component, with or without the terms "functionally" or "communicationly," it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0139] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment of the present disclosure, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0140] Various embodiments of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0141] According to one embodiment of the present disclosure, the method according to the various embodiments disclosed herein may be provided as included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created in a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0142] According to various embodiments of the present disclosure, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments of the present disclosure, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the components of the multiple components in the same or similar manner as those performed by the corresponding components among the multiple components prior to the integration. According to various embodiments of the present disclosure, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0143] It will be understood that various embodiments of the present disclosure according to the claims and descriptions set forth in the present disclosure may be realized in the form of hardware, software, or a combination of hardware and software.

[0144] Such software may be stored on a non-transient computer-readable storage medium. A non-transient computer-readable storage medium stores one or more computer programs (software modules), and the one or more computer programs include computer-executable instructions that cause the electronic device to perform the method of the present disclosure when executed by one or more processors of the electronic device.

[0145] Such software may be stored in volatile or non-volatile storage in the form of a storage device, for example, read-only memory (ROM), and the ROM may be eraseable, rewritable, or non-erasable. Or it may be stored in the form of memory, for example, random access memory (RAM), memory chips, devices, or integrated circuits, or on an optically or magnetically readable medium, for example, a compact disc (CD), a digital multi-purpose disc (DVD), a magnetic disc, or a magnetic tape. It should be understood that such storage devices and storage media are various embodiments of non-transitory machine-readable storage suitable for storing computer programs containing instructions that implement various embodiments of the present disclosure when executed. Accordingly, various embodiments provide a program containing code for implementing an apparatus or method according to any one of the claims of this specification, and a non-transitory machine-readable storage for storing such a program.

[0146] Although the contents of this disclosure have been illustrated and described with reference to various embodiments, those skilled in the art will understand that various changes in form and details are possible without departing from the spirit and scope of this disclosure as defined by the appended claims and their equivalents.

Claims

1. In an electronic device, Wireless communication circuit; A frame comprising a side forming the outer surface of the electronic device and a support structure disposed inwardly in the side structure, - the side structure comprising a conductive portion on the upper side of the electronic device -; A circuit board having at least one insulating layer and at least one ground layer, - a feed portion connected to the wireless communication circuit is formed in an area overlapping with the at least one insulating layer and the at least one ground layer, and a radiation line portion extending from the feed portion and connected to the conductive portion is formed in an area where only the at least one insulating layer among the at least one insulating layer and the at least one ground layer overlaps -; and It includes a metal structure disposed on the support structure of the above frame, and The conductive portion and the radiation line portion connected to the conductive portion are configured to function as a radiator, and The metal structure is configured to function as a reflector for signals from the radiation line portion, and The above-mentioned radiating line portion includes a conductive line having a longitudinal direction corresponding to the longitudinal direction of the conductive portion between the metal structure and the conductive portion, Electronic device.

2. In Claim 1, The conductive line of the above radiation line portion is, A portion formed along one side of the metal structure that is spaced apart from the metal structure and faces the upper side of the electronic device, Electronic device.

3. In Claim 1, The conductive line of the above-mentioned radiation line portion is spaced substantially less than 1 mm (millimeter) from the metal structure, Electronic device.

4. In Claim 3, The conductive line of the above-mentioned radiation line portion is spaced apart from the metal structure by a distance of substantially 0.5 mm or more. Electronic device.

5. In Claim 1, The conductive portion and the radiation line portion connected to the conductive portion are configured to transmit a signal in a frequency band for satellite communication. Electronic device.

6. In Claim 1, The above-described side structure further includes a second conductive portion adjacent to a non-conductive portion adjacent to the conductive portion, and A plurality of connecting parts are arranged between the above-mentioned side structure and the above-mentioned support structure, and The plurality of connecting parts include a first connecting part for the conductive part and a second connecting part for the second conductive part, and The above frame has a slit formed between the first connecting portion, the second connecting portion, the conductive portion, the second conductive portion, and the support structure, With respect to the longitudinal direction of the conductive portion, the difference between the length of the conductive region surrounding the slit and the length of the metal structure is substantially less than 2 mm (millimeter). Electronic device.

7. In Claim 1, The above conductive portion includes a first protruding portion and a second protruding portion facing inward, and The first protruding portion is connected to a first signal path including the power supply portion and the radiation line portion, and The second protruding part is connected to a second signal path different from the first signal path, and The first signal path is used to transmit or receive signals in a frequency band for satellite communication through the conductive part, and The second signal path is used to transmit or receive signals in a frequency band for cellular communication through the conductive portion. Electronic device.

8. In Claim 7, The above support structure includes a third protruding portion formed to face the above side structure, and The third protrusion is positioned between the first protrusion and the second protrusion, and The third protruding portion is electrically connected to the ground portion of the circuit board, Electronic device.

9. In Claim 7, The above circuit board is: A first contact portion in which a first conductive member connected to the first protrusion is disposed, and It includes one or more passive elements, and includes a first matching portion disposed between the first contact portion and the radiation line portion, The first matching portion above is connected to the ground portion of the circuit board, Electronic device.

10. In Claim 9, The above wireless communication circuit is used for satellite communication, and The above circuit board is: A second feed portion connected to a second wireless communication circuit for the above cellular communication, A second contact portion in which a second conductive member connected to the second power supply portion and connected to the second protrusion portion is disposed, and It includes a second matching portion comprising one or more passive elements, and The second matching portion above is connected to the ground portion of the circuit board, Electronic device.

11. In Claim 1, The region overlapping with the at least one insulating layer and the at least one ground layer represents a region having a ground plane above or below on the circuit board, The region in which only the at least one insulating layer among the at least one insulating layer and the at least one ground layer overlaps represents a region on the circuit board where there is no ground plane above or below. Electronic device.

12. In Claim 1, The above metal structure comprises SUS (Steel Use Stainless) for the speaker module of the electronic device, Electronic device.

13. In Claim 1, The above metal structure includes a camera bracket of the electronic device, Electronic device.

14. In Claim 1, In the above electronic device, between the radiation line portion and the metal structure, a ground structure is not disposed, Electronic device.

15. In Claim 1, At least a portion of the above-mentioned radiation line portion is the copper portion closest to the metal structure among the copper portions within the region where only the at least one insulating layer among the at least one insulating layer and the at least one ground layer of the circuit board overlaps. Electronic device.

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