Thermoelectric device

Abstract

A thermoelectric device according to one embodiment of the present invention comprises: a fluid flow unit configured to allow a first fluid to pass in a first direction; a first thermoelectric module disposed on a first surface of the fluid flow unit; and a first shield member disposed on the first thermoelectric module. The first thermoelectric module includes a thermoelectric element disposed on the first surface of the fluid flow unit and a heatsink disposed on the thermoelectric element. The first shield member is disposed to be in direct contact with the heatsink, and a second fluid having a higher temperature than the first fluid is configured to pass between the first shield member and the heatsink in a second direction perpendicular to the first direction.

Description

thermoelectric device

[0001] The present invention relates to a thermoelectric device, and more specifically, to a thermoelectric device that utilizes the temperature difference between a low-temperature part and a high-temperature part of a thermoelectric element.

[0002] Thermoelectricity is a phenomenon caused by the movement of electrons and holes within a material, referring to the direct energy conversion between heat and electricity.

[0003] Thermoelectric devices are a general term for devices that utilize the thermoelectric phenomenon, and they have a structure in which a PN junction pair is formed by joining a P-type thermoelectric material and an N-type thermoelectric material between metal electrodes.

[0004] Thermoelectric devices can be classified into devices that utilize the temperature change of electrical resistance, devices that utilize the Seebeck effect, a phenomenon in which an electromotive force is generated by a temperature difference, and devices that utilize the Peltier effect, a phenomenon in which endothermic or exothermic reactions occur due to an electric current.

[0005] Thermoelectric devices are being applied in a wide variety of fields, including home appliances, electronic components, and communication parts. For instance, thermoelectric devices can be used in cooling devices, heating devices, and power generation devices. Consequently, the demand for the thermoelectric performance of thermoelectric devices is steadily increasing.

[0006] Recently, there is a need to generate electricity using high-temperature thermoelectric elements in automobiles, ships, etc. At this time, a cooling jacket through which a first fluid passes is placed on the low-temperature side of the thermoelectric element, and a heatsink is placed on the high-temperature side of the thermoelectric element, and a second fluid that is hotter than the first fluid can pass through the heatsink. Accordingly, electricity can be generated by the temperature difference between the low-temperature side and the high-temperature side of the thermoelectric element.

[0007] The technical problem that the present invention aims to solve is to provide a thermoelectric device that utilizes the temperature difference between the low-temperature and high-temperature parts of a thermoelectric element.

[0008] A thermoelectric device according to one embodiment of the present invention comprises a fluid flow section configured to allow a first fluid to pass through in a first direction, a first thermoelectric module disposed on a first surface of the fluid flow section, and a first shield member disposed on the first thermoelectric module, wherein the first thermoelectric module comprises a thermoelectric element disposed on the first surface of the fluid flow section and a heat sink disposed on the thermoelectric element, wherein the first shield member is disposed to be in direct contact with the heat sink, and a second fluid having a higher temperature than the first fluid is configured to pass between the first shield member and the heat sink in a second direction perpendicular to the first direction.

[0009] The above fluid flow unit and the first thermoelectric module can be fixed by the first shield member.

[0010] The above fluid flow unit and the first thermoelectric module may not be directly connected by a fastening member.

[0011] The first shield member comprises a first plate covering the entire heat sink, a second plate arranged to extend toward the first surface of the fluid flow portion from one side along the first direction of the first plate, and a third plate arranged to extend toward the first surface of the fluid flow portion from the other side along the first direction of the first plate, wherein the fluid flow portion, the first thermoelectric module, and the first plate of the first shield member are sequentially arranged in a third direction perpendicular to the first direction and the second direction, and the second plate and one side of the first thermoelectric module are spaced apart in the first direction, and the third plate and the other side of the first thermoelectric module are spaced apart in the first direction.

[0012] The first shield member and the fluid flow member may be fastened by a first fastening member disposed from the first plate of the first shield member to the first surface of the fluid flow member adjacent to the second plate of the first shield member, and a second fastening member disposed from the first plate of the first shield member to the first surface of the fluid flow member adjacent to the third plate of the first shield member.

[0013] The head of the first fastening member and the head of the second fastening member may be disposed on the upper surface of the first plate of the first shield member.

[0014] The first fastening member and the second fastening member may not penetrate the first thermoelectric module.

[0015] The first surface of the fluid flow section and the thermoelectric element can be joined by thermal grease.

[0016] The first shield member may further include a fourth plate disposed at an angle with respect to the first plate in a direction away from the first surface of the fluid flow portion on one side according to the second direction of the first plate, and a fifth plate disposed at an angle with respect to the first plate in a direction away from the first surface of the fluid flow portion on the other side according to the second direction of the first plate.

[0017] The second fluid may be configured to flow between the first surface of the fluid flow section and the fourth plate of the first shield member, pass between the heat sink and the first plate of the first shield member, and be discharged between the first surface of the fluid flow section and the fifth plate of the first shield member.

[0018] The first plate of the first shield member is in direct contact with the heat sink of the first thermoelectric module, and the second plate and the third plate of the first shield member may not be in direct contact with the first thermoelectric module.

[0019] A first elastic member may be disposed between the second plate of the first shield member and the first surface of the fluid flow portion, and a second elastic member may be disposed between the third plate of the first shield member and the first surface of the fluid flow portion.

[0020] A first groove is formed in the second direction on one side of the first surface of the fluid flow portion in the first direction, and a second groove is formed in the second direction on the other side of the first surface of the fluid flow portion in the first direction, and the first elastic member can be received in the first groove, and the second elastic member can be received in the second groove.

[0021] It may further include a second thermoelectric module disposed on a second surface opposite to the first surface of the fluid flow portion, and a second shield member disposed on the second thermoelectric module.

[0022] The first shield member and the second shield member may be symmetrical with respect to the fluid flow portion.

[0023] The first shield member may include a thermally conductive material.

[0024] The first shield member may be made of aluminum.

[0025] The thickness of the first shield member may be 0.7 mm to 2 mm.

[0026] According to an embodiment of the present invention, a thermoelectric device with a simple structure and easy assembly can be obtained.

[0027] According to an embodiment of the present invention, a thermoelectric device with high thermoelectric performance can be obtained by increasing the temperature difference between the high-temperature part and the low-temperature part.

[0028] The thermoelectric device according to an embodiment of the present invention can be applied to a power generation device that generates electricity using the temperature difference between a high-temperature part and a low-temperature part.

[0029] The thermoelectric device according to an embodiment of the present invention can be applied to a Peltier device that cools or heats a specific object, such as a fluid.

[0030] FIG. 1 is a perspective view of a thermoelectric device according to one embodiment of the present invention.

[0031] FIG. 2 is an exploded perspective view of a thermoelectric device according to one embodiment of the present invention.

[0032] FIG. 3 is a cross-sectional view of a thermoelectric element according to an embodiment of the present invention.

[0033] FIG. 4 is a perspective view of a thermoelectric element according to an embodiment of the present invention.

[0034] FIG. 5 is a perspective view of a fluid flow section included in a thermoelectric device according to one embodiment of the present invention.

[0035] FIG. 6 is a perspective view of a thermoelectric module included in a thermoelectric device according to one embodiment of the present invention.

[0036] FIG. 7 is a perspective view of a shield member included in a thermoelectric device according to one embodiment of the present invention.

[0037] FIG. 8 is a cross-sectional view according to a first direction of a thermoelectric device according to one embodiment of the present invention.

[0038] FIG. 9 is a cross-sectional view according to a second direction of a thermoelectric device according to one embodiment of the present invention.

[0039] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

[0040] However, the technical concept of the present invention is not limited to some of the described embodiments but can be implemented in various different forms, and within the scope of the technical concept of the present invention, one or more of the components among the embodiments may be selectively combined or substituted.

[0041] In addition, terms used in the embodiments of the present invention (including technical and scientific terms) may be interpreted in a sense that is generally understood by those skilled in the art to which the present invention belongs, unless explicitly and specifically defined otherwise. Terms that are commonly used, such as terms defined in advance, may be interpreted in consideration of their meaning in the context of the relevant technology.

[0042] Furthermore, the terms used in the embodiments of the present invention are for the purpose of describing the embodiments and are not intended to limit the present invention.

[0043] In this specification, the singular form may include the plural form unless specifically stated otherwise in the text, and when described as "at least one of A and B and C (or more than one)," it may include one or more of all combinations that can be formed from A, B, and C.

[0044] In addition, terms such as first, second, A, B, (a), (b), etc. may be used when describing the components of the embodiments of the present invention.

[0045] These terms are intended merely to distinguish a component from other components and are not limited by the nature, order, sequence, etc., of the said component.

[0046] And, where it is stated that a component is 'connected', 'combined', or 'joined' to another component, this may include not only cases where the component is directly connected, combined, or joined to the other component, but also cases where it is 'connected', 'combined', or 'joined' due to another component located between the component and the other component.

[0047] Furthermore, when described as being formed or placed "above or below" each component, "above" or "below" includes not only cases where two components are in direct contact with each other, but also cases where one or more other components are formed or placed between the two components. Additionally, when expressed as "above or below," it may include the meaning of a downward direction as well as an upward direction relative to a single component.

[0048] FIG. 1 is a perspective view of a thermoelectric device according to one embodiment of the present invention, and FIG. 2 is an exploded perspective view of a thermoelectric device according to one embodiment of the present invention.

[0049] Referring to FIGS. 1 and 2, the thermoelectric device (1000) includes a fluid flow section (1100) and a thermoelectric module (1200) disposed on the surface of the fluid flow section (1100).

[0050] A thermoelectric device (1000) according to an embodiment of the present invention can generate power by utilizing the temperature difference between a first fluid flowing through the interior of a fluid flow section (1100) and a second fluid passing through the exterior of the fluid flow section (1100). Although not illustrated, a plurality of thermoelectric devices (1000) may be arranged in parallel at a predetermined interval to form a thermoelectric system. Accordingly, thermoelectric performance or power generation performance per unit area can be maximized. A thermoelectric device may be referred to as a power generation device, and a thermoelectric system may be referred to as a power generation system.

[0051] The first fluid flowing into the fluid flow section (1100) may be water, but is not limited thereto, and may be various types of fluids having cooling performance. The temperature of the first fluid flowing into the fluid flow section (1100) may be less than 100°C, preferably less than 50°C, more preferably less than 40°C, but is not limited thereto, and may be a fluid having a lower temperature than the second fluid. The temperature of the first fluid discharged after passing through the fluid flow section (1100) may be higher than the temperature of the first fluid flowing into the fluid flow section (1100).

[0052] According to an embodiment of the present invention, a thermoelectric module (1200) may be disposed on a first surface (1110) of a fluid flow section (1100) and a second surface (1120) facing the first surface (1110). A first fluid may flow from a first direction side between the first surface (1110) and the second surface (1120) toward a first direction other side between the first surface (1110) and the second surface (1120) facing the first direction side. To this end, a fluid inlet may be disposed on one side, and a fluid outlet (510) may be disposed on the other side. A second fluid may flow from a fourth surface (1140), which is an upper surface between the first surface (1110) and the second surface (1120), toward a third surface (1130), which is a lower surface between the first surface (1110) and the second surface (1120). For convenience of explanation, the direction in which the first fluid passes is referred to as the first direction in this specification, and the direction in which the second fluid passes is referred to as the second direction. A direction perpendicular to the first direction and the second direction, that is, a direction toward the first surface (1110) from the second surface (1120), may be referred to as the third direction, but is not limited thereto.

[0053] Meanwhile, the second fluid passes through the outside of the fluid flow section (1100), for example, the heat sink (1220) of the thermoelectric module (1200) disposed outside the fluid flow section (1100). The second fluid may be exhaust heat or intake heat from an automobile, a ship, etc., but is not limited thereto. For example, the temperature of the second fluid may be 100°C or higher, preferably 200°C or higher, more preferably 220°C to 250°C, but is not limited thereto, and may be a fluid having a temperature higher than that of the first fluid.

[0054] In this specification, the temperature of the first fluid flowing through the interior of the fluid flow section (1100) is described as being lower than the temperature of the second fluid passing through the heat sink (1220) of the thermoelectric module (1200) disposed outside the fluid flow section (1100). Accordingly, in this specification, the fluid flow section (1100) may be referred to as a duct, a cooling section, or a cooling water passage member. However, embodiments of the present invention are not limited thereto, and the temperature of the first fluid flowing through the interior of the fluid flow section (1100) may be higher than the temperature of the second fluid passing through the heat sink (1220) of the thermoelectric module (1200) disposed outside the fluid flow section (1100).

[0055] According to an embodiment of the present invention, the thermoelectric module (1200) includes a thermoelectric element (1210) and a heat sink (1220) disposed on the thermoelectric element (1210). The thermoelectric element (1210) according to an embodiment of the present invention may have a structure illustrated in FIGS. 3 and 4.

[0056] Referring to FIGS. 3 and 4, the thermoelectric element (1210) includes a first substrate (110), a first electrode part (120), a P-type semiconductor element (130), an N-type semiconductor element (140), a second electrode part (150), and a second substrate (160).

[0057] A first electrode portion (120) is disposed between the first substrate (110) and the lower bottom surface of the P-type semiconductor device (130) and the N-type semiconductor device (140), and a second electrode portion (150) is disposed between the second substrate (160) and the upper bottom surface of the P-type semiconductor device (130) and the N-type semiconductor device (140). Accordingly, a plurality of P-type semiconductor devices (130) and a plurality of N-type semiconductor devices (140) are electrically connected by the first electrode portion (120) and the second electrode portion (150). A pair of P-type semiconductor devices (130) and N-type semiconductor devices (140) disposed between the first electrode portion (120) and the second electrode portion (150) and electrically connected can form a unit cell.

[0058] For example, when voltage is applied to the first electrode part (120) and the second electrode part (150) through the lead wires (181, 182), the substrate through which current flows from the P-type semiconductor device (130) to the N-type semiconductor device (140) absorbs heat and acts as a cooling part due to the Peltier effect, and the substrate through which current flows from the N-type semiconductor device (140) to the P-type semiconductor device (130) heats up and acts as a heating part. Alternatively, if a temperature difference is applied between the first electrode part (120) and the second electrode part (150), charges within the P-type semiconductor device (130) and the N-type semiconductor device (140) move due to the Seebeck effect, and electricity may be generated.

[0059] Here, the P-type semiconductor device (130) and the N-type semiconductor device (140) may be bismuth telluride (Bi-Te) semiconductor devices comprising bismuth (Bi) and tellurium (Te) as main raw materials. The P-type semiconductor device (130) may be a bismuth telluride (Bi-Te) thermoelectric leg comprising at least one of antimony (Sb), nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), gallium (Ga), tellurium (Te), bismuth (Bi), and indium (In). For example, the P-type semiconductor device (130) may contain 99 to 99.999 wt% of Bi-Sb-Te, which is the main raw material, based on 100 wt% of the total weight, and may contain at least one of nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), gallium (Ga), and indium (In) in an amount of 0.001 to 1 wt%. The N-type semiconductor device (140) may be a bismuth telluride (Bi-Te) thermoelectric leg containing at least one of selenium (Se), nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), gallium (Ga), tellurium (Te), bismuth (Bi), and indium (In). For example, the N-type semiconductor device (140) may contain 99 to 99.999 wt% of Bi-Se-Te, which is a main raw material, based on 100 wt% of total weight, and may contain at least one of nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), gallium (Ga) and indium (In) in an amount of 0.001 to 1 wt%.

[0060] The P-type semiconductor device (130) and the N-type semiconductor device (140) can be formed in a bulk or stacked form. Generally, the bulk P-type semiconductor device (130) or the bulk N-type semiconductor device (140) can be obtained by a process of heat-treating a thermoelectric material to produce an ingot, crushing and sieving the ingot to obtain powder for thermoelectric legs, sintering the powder, and cutting the sintered body. At this time, the P-type semiconductor device (130) and the N-type semiconductor device (140) may be polycrystalline thermoelectric legs. In this way, when the P-type semiconductor device (130) and the N-type semiconductor device (140) are polycrystalline thermoelectric legs, the strength of the P-type semiconductor device (130) and the N-type semiconductor device (140) can be increased. A stacked P-type semiconductor device (130) or a stacked N-type semiconductor device (140) can be obtained by forming unit members by applying a paste containing a thermoelectric material onto a sheet-shaped substrate, and then stacking and cutting the unit members.

[0061] At this time, a pair of P-type semiconductor devices (130) and N-type semiconductor devices (140) may have the same shape and volume, or different shapes and volumes. For example, since the electrical conductivity characteristics of the P-type semiconductor device (130) and the N-type semiconductor device (140) are different, the height or cross-sectional area of ​​the N-type semiconductor device (140) may be formed differently from the height or cross-sectional area of ​​the P-type semiconductor device (130).

[0062] At this time, the P-type semiconductor device (130) or the N-type semiconductor device (140) may have a cylindrical shape, a polygonal column shape, an elliptical column shape, etc.

[0063] In this specification, the semiconductor device may be referred to as a thermoelectric leg, a thermoelectric structure, a semiconductor structure, etc. A plurality of P-type semiconductor devices (130) or a plurality of N-type semiconductor devices (140) disposed between the first electrode portion (120) and the second electrode portion (150) may be collectively referred to as a semiconductor structure portion.

[0064] The performance of a thermoelectric element according to one embodiment of the present invention can be expressed as a figure of merit (ZT). The figure of merit (ZT) can be expressed as Equation 1.

[0065]

[0066] Here, α is the Seebeck coefficient [V / K], σ is the electric conductivity [S / m], and α 2 σ is the power factor (Power Factor, [W / mK 2 ...is. And, T is temperature, and k is thermal conductivity [W / mK]. k can be expressed as a·cp·ρ, and a is thermal diffusivity [cm² 2 / S], cp is specific heat [J / gK], and ρ is density [g / cm³]. 3 ]am.

[0067] To obtain the thermoelectric performance index of a thermoelectric element, the Z value (V / K) is measured using a Z meter, and the thermoelectric performance index (ZT) can be calculated using the measured Z value.

[0068] Here, the first electrode portion (120) disposed between the first substrate (110) and the P-type semiconductor device (130) and the N-type semiconductor device (140), and the second electrode portion (150) disposed between the second substrate (160) and the P-type semiconductor device (130) and the N-type semiconductor device (140) comprise at least one of copper (Cu), silver (Ag), aluminum (Al), and nickel (Ni), and may have a thickness of 0.01 mm to 0.3 mm. If the thickness of the first electrode portion (120) or the second electrode portion (150) is less than 0.01 mm, the function as an electrode is reduced and the electrical conductivity performance may be lowered, and if it exceeds 0.3 mm, the conductivity efficiency may be lowered due to an increase in resistance. The first electrode portion (120) includes a plurality of first electrodes arranged spaced apart from each other, and the second electrode portion (150) may include a plurality of second electrodes arranged spaced apart from each other.

[0069] Additionally, the mutually facing first substrate (110) and second substrate (160) may be metal substrates, and their thickness may be 0.1 mm to 1.5 mm. If the thickness of the metal substrate is less than 0.1 mm or exceeds 1.5 mm, the heat dissipation characteristics or thermal conductivity may become excessively high, which may reduce the reliability of the thermoelectric element. Furthermore, when the first substrate (110) and the second substrate (160) are metal substrates, an insulating layer (170) may be further formed between the first substrate (110) and the first electrode portion (120) and between the second substrate (160) and the second electrode portion (150), respectively. The insulating layer (170) may include a material having a thermal conductivity of 1 to 20 W / mK. At this time, the insulating layer (170) may be a resin composition comprising at least one of epoxy resin and silicone resin and an inorganic material, a layer made of a silicone composite comprising silicone and an inorganic material, or an aluminum oxide layer. Here, the inorganic material may be at least one of oxides, nitrides, and carbides of aluminum, boron, silicon, etc.

[0070] Each insulating layer (170) may be a single insulating layer or multiple insulating layers of different compositions. At least a portion of at least one side of the first electrode portion (120) and the second electrode portion (150) is embedded in the insulating layer (170), and the upper surface of the insulating layer (170) disposed between the multiple electrodes included in each electrode portion may have a concave shape toward each substrate. When each insulating layer (170) is a multiple insulating layer, at least a portion of at least one side of the first electrode portion (120) and the second electrode portion (150) is embedded in the insulating layer (170) disposed at the top relative to each substrate, and the upper surface of the insulating layer (170) disposed between the multiple electrodes included in each electrode portion may have a concave shape toward each substrate.

[0071] At this time, the sizes of the first substrate (110) and the second substrate (160) may be formed differently. That is, the volume, thickness, or area of ​​one of the first substrate (110) and the second substrate (160) may be formed to be larger than the volume, thickness, or area of ​​the other. Here, the thickness may be the thickness in the direction from the first substrate (110) toward the second substrate (160), and the area may be the area in the direction perpendicular to the direction from the first substrate (110) toward the second substrate (160). Accordingly, the heat absorption performance or heat dissipation performance of the thermoelectric element can be increased. Preferably, the volume, thickness, or area of ​​the first substrate (110) may be formed to be larger than at least one of the volume, thickness, or area of ​​the second substrate (160). At this time, when the first substrate (110) is placed in a high-temperature region for the Seebeck effect, when applied as a heat-generating region for the Peltier effect, or when a sealing member for protection from the external environment of the thermoelectric element is placed on the first substrate (110), at least one of the volume, thickness, or area can be made larger than that of the second substrate (160). At this time, the area of ​​the first substrate (110) can be formed in a range of 1.2 to 5 times the area of ​​the second substrate (160). If the area of ​​the first substrate (110) is formed to be less than 1.2 times that of the second substrate (160), the effect on improving heat transfer efficiency is not high, and if it exceeds 5 times, the heat transfer efficiency is significantly reduced, and it may be difficult to maintain the basic shape of the thermoelectric module.

[0072] Additionally, a heat dissipation pattern, such as an uneven pattern, may be formed on at least one surface of the first substrate (110) and the second substrate (160). Accordingly, the heat dissipation performance of the thermoelectric element can be improved. When the uneven pattern is formed on the surface in contact with the P-type semiconductor element (130) or the N-type semiconductor element (140), the bonding characteristics between the semiconductor element and the substrate can also be improved.

[0073] Although not illustrated, a sealing member may be further disposed between the first substrate (110) and the second substrate (160). The sealing member may be disposed on the side of the first electrode portion (120), the P-type semiconductor device (130), the N-type semiconductor device (140), and the second electrode portion (150) between the first substrate (110) and the second substrate (160). Accordingly, the first electrode portion (120), the P-type semiconductor device (130), the N-type semiconductor device (140), and the second electrode portion (150) can be sealed from external moisture, heat, contamination, etc.

[0074] Referring again to FIGS. 1 and 2, a thermoelectric module (1200) may be disposed on each of the first surface (1110) and the second surface (1120) of the fluid flow section (1100).

[0075] As described above, each thermoelectric element (1210) comprises a first substrate (110) disposed on the surface of a fluid flow section (1100), a first electrode section (120) disposed on the first substrate (110), a plurality of semiconductor elements (130, 140) disposed on the first electrode section (120), a second electrode section (150) disposed on the plurality of semiconductor elements (130, 140), and a second substrate (160) disposed on the second electrode section (150), and a heat sink (1220) disposed on the second substrate (160). At this time, the first substrate (110) of the thermoelectric element disposed on the fluid flow section (1100) may be a metal substrate, and the metal substrate may be bonded to the surface of the fluid flow section (1100) by a thermal interface material (TIM, not shown). Since the metal substrate has excellent heat transfer performance, heat transfer between the thermoelectric element (1210) and the fluid flow section (1100) is facilitated. Additionally, if the metal substrate and the fluid flow section (1100) are bonded by a thermal interface material (TIM), heat transfer between the metal substrate and the fluid flow section (1100) may not be hindered. Here, the metal substrate may be one of a copper substrate, an aluminum substrate, and a copper-aluminum substrate, but is not limited thereto.

[0076] The thermoelectric module (1200) may include a connector part (1230) for applying electricity to extract the generated electricity to the outside or to use it as a Peltier. The connector part (1230) may be connected to the lead wires (181, 182) of the thermoelectric element (1210) described above. The connector part (1230) may include a connector to which the lead wires (181, 182) of the thermoelectric element (1210) are connected, wiring connected to the connector and drawn out to the outside, and an insulating member covering the connector. Meanwhile, in order for the first fluid to flow in the first direction, a fluid inlet may be disposed on one side of the first direction of the fluid flow part (1100), and a fluid outlet (510) may be disposed on the other side of the first direction. A thermoelectric device (1000) according to an embodiment of the present invention further includes a first wiring guide cover (900) disposed on one side of the first direction of the fluid flow section (1100) and on the fluid inlet, and a second wiring guide cover (910) disposed on the other side of the first direction of the fluid flow section (1100) and on the fluid outlet (520), and wiring connected to a connector can be guided along the first wiring guide cover (900) or the second wiring guide cover (910) and pulled out to the outside through a hole (900S, 910S).

[0077] When the second fluid flows in the second direction, a cover member (600) and a gas guide member (700) are respectively disposed on the third surface (1130) and the fourth surface (1140) of the fluid flow section (1100), and the fluid flow section (1100), the cover member (600), and the gas guide member (700) can be fastened together by a fastening member (800).

[0078] The cover member (600) is positioned in a "U" shape on the third surface (1130) and the fourth surface (1140) of the fluid flow section (1100), respectively, to prevent direct contact between the second fluid and the third surface (1130) and the fourth surface (1140) of the fluid flow section (1100), and to protect the third surface (1130) and the fourth surface (1140) of the fluid flow section (1100) from the second fluid at a high temperature. The cover member (600) may be positioned to cover not only the third surface (1130) and the fourth surface (1140) of the fluid flow section (1100), but also the space between the first substrate (110) and the second substrate (160) of the thermoelectric element (1210). For example, the cover member (600) includes a first cover surface (610) disposed on the third surface (1130) and the fourth surface (1140) of the fluid flow section (1100), a second cover surface (620) extended in a second direction from the first cover surface (610) so as to be parallel to the first surface (1110) of the fluid flow section (1100), and a third cover surface (630) extended in a second direction from the first cover surface (610) so as to be parallel to the second surface (1120) of the fluid flow section (1100), and the second cover surface (620) and the third cover surface (630) may be disposed on the second substrate (160) of the thermoelectric element (1210) to cover between the first substrate (110) and the second substrate (160) of the thermoelectric element (1210). According to this, since the second fluid cannot penetrate between the first substrate (110) and the second substrate (160) of the thermoelectric element (1210), a high temperature difference can be maintained between the first substrate (110) and the second substrate (160) of the thermoelectric element (1210).

[0079] The gas guide member (700) can branch the second fluid flowing in the second direction to the first surface (1110) and the second surface (1120) of the fluid flow section (1100).

[0080] According to an embodiment of the present invention, a shield member (1500) may be further disposed to prevent moisture or contaminants from penetrating into the thermoelectric module (1200).

[0081] FIG. 5 is a perspective view of a fluid flow section included in a thermoelectric device according to one embodiment of the present invention, FIG. 6 is a perspective view of a thermoelectric module included in a thermoelectric device according to one embodiment of the present invention, FIG. 7 is a perspective view of a shield member included in a thermoelectric device according to one embodiment of the present invention, FIG. 8 is a cross-sectional view according to a first direction of a thermoelectric device according to one embodiment of the present invention, and FIG. 9 is a cross-sectional view according to a second direction of a thermoelectric device according to one embodiment of the present invention.

[0082] Referring to FIG. 5, a fluid inlet (500) may be disposed on one side of the first direction of the fluid flow section (1100), and a fluid outlet (510) may be disposed on the other side of the first direction of the fluid flow section (1100). The first fluid may pass through the fluid inlet (500), the fluid flow section (1100), and the fluid outlet (510) in the first direction. The thickness of the third direction of the fluid flow section (1100) may be different from the thickness of the third direction of the fluid inlet (500) and the thickness of the third direction of the fluid outlet (510). For example, the thickness of the third direction of the fluid flow section (1100) may be thinner than the thickness of the third direction of the fluid inlet (500) and the fluid outlet (510). The fluid inlet (500) and the fluid outlet (510) may be manufactured integrally with the fluid flow section (1100) or joined to the fluid flow section (1100) by welding or the like.

[0083] Referring to FIG. 6, the thermoelectric module (1200) includes a thermoelectric element (1210) and a heat sink (1220) disposed on the thermoelectric element (1210). As illustrated, the thermoelectric module (1200) includes a plurality of thermoelectric elements (1210) disposed along a first direction and a heat sink (1220) disposed on each thermoelectric element (1210). Each thermoelectric element (1210) includes a first substrate disposed on the surface of a fluid flow portion (1100), a first electrode portion disposed on the first substrate, a semiconductor structure portion disposed on the first electrode portion, a second electrode portion disposed on the semiconductor structure portion, and a second substrate disposed on the second electrode portion, and a detailed description regarding the first substrate, the first electrode portion, the semiconductor structure portion, the second electrode portion, and the second substrate can be referenced through FIG. 3 and FIG. 4. A heat sink (1220) is placed on the second substrate of each thermoelectric element (1210).

[0084] As described, each thermoelectric element (1210) may be a four-part thermoelectric element. That is, each thermoelectric element (1210) has a shape in which a first electrode portion, a semiconductor structure portion, a second electrode portion, and a second substrate portion are arranged in four parts on a first substrate, and a four-part heat sink (1220) may be arranged on the four-part second substrate portion. According to this, even if a second fluid at a high temperature passes through the four-part heat sink (1220), deformation due to thermal stress can be minimized. However, this is exemplary, and each thermoelectric element (1210) may be a two-part thermoelectric element, a two or more-part thermoelectric element, or not a thermoelectric element.

[0085] Although not illustrated, the space between the first substrate and the second substrate of each thermoelectric element (1210) may be sealed by a sealing member. As illustrated, if each thermoelectric element (1210) is a four-part thermoelectric element, the sealing member may be further disposed between the four-part second substrate sections. According to this, the problem of external contaminants or a second fluid penetrating between the first substrate and the second substrate can be prevented.

[0086] According to an embodiment of the present invention, a pair of thermoelectric modules (1200) may be symmetrically arranged with a fluid flow section (1100) in between. That is, a first thermoelectric module (1200) may be arranged on a first surface (1110) of the fluid flow section (1100), and a second thermoelectric module (1200) may be arranged on a second surface (1120) of the fluid flow section (1100). Each of the first thermoelectric module (1200) and the second thermoelectric module (1200) may have the structure of the thermoelectric module (1200) illustrated in FIG. 6.

[0087] Referring to FIG. 7, the shield member (1500) comprises a first plate (1510), a second plate (1520) arranged to extend toward the first surface (1110) of the fluid flow section (1100) from one side according to the first direction of the first plate (1510), and a third plate (1530) arranged to extend toward the first surface (1100) of the fluid flow section (1100) from the other side according to the first direction of the first plate (1510); a fourth plate (1540) arranged to be inclined with respect to the first plate (1510) in a direction away from the first surface (1110) of the fluid flow section (1100) from the first surface (1110) of the fluid flow section (1100) on one side according to the second direction of the first plate (1510); and a fourth plate (1540) arranged to be inclined with respect to the first plate (1510) in a direction away from the first surface (1110) of the fluid flow section (1100) from the other side according to the second direction of the first plate (1510). It may further include a fifth plate (1550) positioned to be inclined with respect to the first plate (1510) in a direction away from it.

[0088] According to an embodiment of the present invention, a pair of shield members (1500) may be symmetrically arranged with the fluid flow section (1100) in between. That is, a first shield member (1500) may be arranged on the first surface (1110) side of the fluid flow section (1100), and a second shield member (1500) may be arranged on the second surface (1120) side of the fluid flow section (1100). Each of the first shield member (1500) and the second shield member (1500) may have the structure of the shield member (1500) illustrated in FIG. 7.

[0089] Hereinafter, for convenience of explanation, the first thermoelectric module (1200) disposed on the first surface (1110) of the fluid flow section (1100) and the first shield member (1500) disposed on the first thermoelectric module (1200) are described in detail, but the same structure may also be applied to the second thermoelectric module (1200) disposed on the second surface (1120) of the fluid flow section (1100) and the second shield member (1500) disposed on the second thermoelectric module (1200).

[0090] Referring to FIGS. 1 to 2 and FIGS. 5 to 9, a first thermoelectric module (1200) is disposed on a first surface (1110) of a fluid flow section (1100), and a first shield member (1500) is disposed on the first thermoelectric module (1200). The cross-sectional view of FIGS. 8 to 9 is a schematic diagram for explaining the relationship between the fluid flow section (1100), the shield member (1500), and the thermoelectric module (1200), which are the main features of an embodiment of the present invention, and a plurality of electrodes and semiconductor structures within the thermoelectric module (1200) are illustrated in a simplified manner.

[0091] As described above, the first thermoelectric module (1200) includes a first substrate (110) disposed on a first surface (1110) of a fluid flow portion (1100), a first electrode portion (120) disposed on the first substrate (110), a semiconductor structure portion (130, 140) disposed on the first electrode portion (120), a second electrode portion (150) disposed on the semiconductor structure portion (130, 140), a second substrate (160) disposed on the second electrode portion (150), and a heat sink (1220) disposed on the second substrate (160).

[0092] As illustrated in FIG. 8, the heat sink (1220) may be implemented by a flat substrate that is in surface contact with a second fluid passing through the heat sink (1220) along a second direction. The heat sink (1220) may have a structure that folds the substrate to form a repeating pattern having a predetermined pitch and height, i.e., a foldable structure. For example, the heat sink (1220) may have a shape in which a predetermined pattern is regularly repeated and connected, and each pattern may include a first surface (1221) disposed on the second substrate (160), a second surface (1222) extended upward from one end of the first surface (1221), a third surface (1223) extended from the second surface (1222) to face the second substrate (160), and a fourth surface (1224) extended upward from the other end opposite to one end of the first surface (1221). At this time, the distance between the third surface (1223) and the second substrate (160) may be greater than the distance between the first surface (1221) and the second substrate (160). The first surface (1221), the second surface (1222), the third surface (1223), and the fourth surface (1224) may be a single flat plate having a structure that folds sequentially. Additionally, the first surface (1221) may be parallel to the second substrate (160), and the third surface (1223) may be parallel to the second substrate (160). In this embodiment, the meaning of parallelism may be defined as the interior angle formed between the upper surface of the second substrate (160) and the first surface (1221) or the third surface (1223) being within 2°. Here, the upper part may mean a direction away from the second substrate (160) on the second substrate (160), and the lower part may mean a direction closer to the second substrate (160) on the second substrate (160). A flow path through which the second fluid passes may be formed by each pattern.

[0093] According to an embodiment of the present invention, a first shield member (1500) is positioned to be in direct contact with a heat sink (1220), and a second fluid passes between the first shield member (1500) and the heat sink (1220) in a second direction. When a second fluid, which is hotter than the first fluid, passes between the first shield member (1500) and the heat sink (1220), the temperature of the second fluid can be transferred to a second substrate (160) through the heat sink (1220).

[0094] According to an embodiment of the present invention, when the first shield member (1500) and the heat sink (1220) are in direct contact, not only the heat absorbed from the second fluid through the surface of the first shield member (1500) positioned toward the heat sink (1220), but also the heat absorbed from the second fluid through the surface of the first shield member (1500) positioned toward the heat sink (1220) is transferred to the heat sink (1220), so the thermoelectric performance of the thermoelectric element (1210) can be further improved.

[0095] To this end, the first shield member (1500) may be positioned to be in direct contact with the third surface (1223) of the heat sink (1220). Accordingly, since the heat exchange area between the first shield member (1500) and the heat sink (1220) is large, the amount of heat transferred from the first shield member (1500) to the heat sink (1220) is large, so the thermoelectric performance of the thermoelectric element (1210) can be further improved.

[0096] In order to increase the heat exchange efficiency between the first shield member (1500) and the heat sink (1220), the first shield member (1500) may include a heat-conducting material. For example, the first shield member (1500) may be made of aluminum. Accordingly, since the heat exchange efficiency between the first shield member (1500) and the heat sink (1220) is high, the thermoelectric performance of the thermoelectric element (1210) can be further improved.

[0097] According to an embodiment of the present invention, the fluid flow section (1100) and the first thermoelectric module (1200) can be fixed by the first shield member (1500). When the first plate (1510) of the first shield member (1500) is positioned to press against the heat sink (1220) of the first thermoelectric module (1200) placed on the first surface (1110) of the fluid flow section (1100), the fluid flow section (1100) and the first thermoelectric module (1200) can be fixed by the first shield member (1500). Accordingly, the fluid flow section (1100) and the first thermoelectric module (1200) may not be directly connected by a fastening member.

[0098] When the fluid flow section (1100) and the first thermoelectric module (1200) are not directly connected by a fastening member, there is no need to form a through hole for passing through the fastening member in the effective area of ​​the first thermoelectric module (1200) where the electrode and semiconductor structure are placed, so the thermoelectric performance and withstand voltage performance of the first thermoelectric module (1200) can be further increased. In addition, when the first plate (1510) of the first shield member (1500) is positioned to press the heat sink (1220) of the first thermoelectric module (1200) placed on the first surface (1110) of the fluid flow section (1100), the first surface (1110) of the fluid flow section (1100) and the first substrate (110) of the first thermoelectric module (1200) come into close contact, thereby increasing the quality of the contact surface between the first surface (1110) of the fluid flow section (1100) and the first substrate (110) of the first thermoelectric module (1200), so that the thermoelectric performance of the thermoelectric element (1210) can be further improved.

[0099] As described above, and as illustrated in FIG. 8, the first shield member (1500) may include a first plate (1510), a second plate (1520) arranged to extend toward the first surface (1110) of the fluid flow section (1100) from one side according to the first direction of the first plate (1510), and a third plate (1530) arranged to extend toward the first surface (1100) of the fluid flow section (1100) from the other side according to the first direction of the first plate (1510). The first surface (1110) of the fluid flow section (1100), the first thermoelectric module (1200), and the first plate (1510) of the first shield member (1500) are arranged sequentially in a third direction, and the second plate (1520) and one side of the first thermoelectric module (1200) may be spaced apart in a first direction, and the third plate (1530) and the other side of the first thermoelectric module (1200) may be spaced apart in a first direction. The first plate (1510) may be in direct contact with the heat sink (1220) of the first thermoelectric module (1200), and the second plate (1520) and the third plate (1530) may not be in direct contact with the first thermoelectric module (1200). According to this, the heat of the second fluid is transferred to the heat sink (1220) through the first plate (1510), but is not transferred to the first substrate (110) of the first thermoelectric module (1200) through the second plate (1520) or the third plate (1530), so the temperature difference between the low-temperature and high-temperature parts of the first thermoelectric module (1200) can be maintained.

[0100] Meanwhile, according to an embodiment of the present invention, the first shield member (1500) and the fluid flow member (1100) may be connected by a fastening member. For example, the first fastening member (1600) and the second fastening member (1610) may pass through the first plate (1510) of the first shield member (1500) and be positioned up to the first surface (1110) of the fluid flow member (1100). At this time, the heads (1600H, 1610H) of the first fastening member (1600) and the second fastening member (1610) may be positioned on the upper surface of the first plate (1510) of the first shield member (1500). According to this, the first shield member (1500) can pressurize the first thermoelectric module (1200) and fix the first thermoelectric module (1200) and the fluid flow section (1100). At this time, according to an embodiment of the present invention, the thickness of the first shield member (1500) may be 0.7 mm to 2 mm. If the thickness of the first shield member (1500) satisfies this numerical range, the first plate (1510), the first thermoelectric module (1200), and the fluid flow section (1100) can be effectively pressed and fixed due to the load using the first fastening member (1600) and the second fastening member (1610).

[0101] Here, the first fastening member (1600) may be positioned adjacent to the second plate (1520), and the second fastening member (1610) may be positioned adjacent to the third plate (1530). For example, the first fastening member (1600) may be positioned between the second plate (1520) and one side of the first direction of the first thermoelectric module (1200), and the second fastening member (1620) may be positioned between the third plate (1530) and the other side of the first direction of the first thermoelectric module (1200). Accordingly, the first shield member (1500) can press the first thermoelectric module (1200) with a uniform force and fix the first thermoelectric module (1200) and the fluid flow part (1100).

[0102] According to this, since the first fastening member (1600) and the second fastening member (1610) do not penetrate the first thermoelectric module (1200), the area of ​​the effective region of the first thermoelectric module (1200) is not reduced, so the first thermoelectric module (1200) and the fluid flow section (1100) can be fixed while maintaining the thermoelectric performance of the first thermoelectric module (1200).

[0103] According to an embodiment of the present invention, a first elastic member (1700) may be disposed between the second plate (1520) of the first shield member (1500) and the first surface (1110) of the fluid flow section (1100), and a second elastic member (1710) may be disposed between the third plate (1530) of the first shield member (1500) and the first surface (1110) of the fluid flow section (1100). Accordingly, the first shield member (1500) can pressurize the first thermoelectric module (1200) with high pressure and fix the first thermoelectric module (1200) and the fluid flow section (1100), and prevent foreign substances from entering the spaced-apart space between the second plate (1520) and the third plate (1530) and the first surface (1110) of the fluid flow section (1100). In addition, the first elastic member (1700) and the second elastic member (1710) may include an insulating material. Accordingly, heat transfer from the second plate (1520) and the third plate (1530) to the first surface (1110) of the fluid flow section (1100) is prevented, thereby further improving the thermoelectric performance of the first thermoelectric module (1200).

[0104] To this end, according to an embodiment of the present invention, a first groove (1100G1) is formed in a second direction on one side of the first direction of the first surface (1110) of the fluid flow portion (1100), and a second groove (1100G2) is formed in a second direction on the other side of the first direction of the first surface (1110) of the fluid flow portion (1100), and a first elastic member (1700) can be received in the first groove (1100G1), and a second elastic member (1710) can be received in the second groove (1100G2). According to this, the first elastic member (1700) and the second elastic member (1710) are fixed to the first groove (1100G1) and the second groove (1100G2) of the first surface (1110) of the fluid flow portion (1100), and the second plate (1520) and the third plate (1530) of the first shield member (1500) can come into closer contact with the first elastic member (1700) and the second elastic member (1710).

[0105] Meanwhile, as described above and as illustrated in FIG. 9, the first shield member (1500) may further include a fourth plate (1540) positioned so as to be inclined with respect to the first plate (1510) in a direction away from the first surface (1110) of the fluid flow section (1100) on one side according to the second direction of the first plate (1510), and a fifth plate (1550) positioned so as to be inclined with respect to the first plate (1510) in a direction away from the first surface (1110) of the fluid flow section (1100) on the other side according to the second direction of the first plate (1510). According to this, the second fluid flows between the first surface (1110) of the fluid flow section (1100) and the fourth plate (1540) of the first shield member (1500), passes between the heat sink (1220) and the first plate (1510) of the first shield member (1500), and can be easily discharged between the first surface (1110) of the fluid flow section (1100) and the fifth plate (1550) of the first shield member (1500).

[0106] Thus, according to an embodiment of the present invention, a shield member (1500) covers the front surface of a heat sink (1220) and is positioned to be in contact with the heat sink (1220), and a second fluid passes between the second substrate (160) of the thermoelectric element (1210), the heat sink (1220), and the shield member (1500). Accordingly, the fluid flow section (1100) and the thermoelectric module (1200) can be fixed by the shield member (1500) without a separate fastening member, and since heat conducted from the second fluid to the shield member (1500) is transferred to the heat sink (1220), the thermoelectric performance of the thermoelectric module (1200) can be improved.

[0107] The power generation system can generate electricity using heat sources generated from ships, automobiles, power plants, geothermal sources, etc., and multiple power generation devices can be arranged to efficiently converge the heat sources. In this case, each power generation device can improve the cooling performance of the low-temperature portion of the thermoelectric element by improving the bonding strength between the thermoelectric module and the cooling jacket. Consequently, the efficiency and reliability of the power generation device can be improved, thereby improving the fuel efficiency of transportation devices such as ships or vehicles. Therefore, in the shipping and transportation industries, this can reduce transportation costs and create an eco-friendly industrial environment, and when applied to manufacturing industries such as steel mills, it can reduce material costs.

[0108] Although the present invention has been described above with reference to preferred embodiments, those skilled in the art will understand that various modifications and changes can be made to the invention without departing from the spirit and scope of the invention as described in the following claims.

Claims

1. A fluid flow section configured to allow a first fluid to pass in a first direction, A first thermoelectric module disposed on the first surface of the fluid flow section, and It includes a first shield member disposed on the first thermoelectric module, and The first thermoelectric module comprises a thermoelectric element disposed on the first surface of the fluid flow portion and a heat sink disposed on the thermoelectric element. The first shield member is positioned to be in direct contact with the heat sink, and A thermoelectric device configured such that a second fluid, which is hotter than the first fluid, passes between the first shield member and the heat sink in a second direction perpendicular to the first direction.

2. In Paragraph 1, The above fluid flow section and the above first thermoelectric module are a thermoelectric device fixed by the above first shield member.

3. In Paragraph 2, A thermoelectric device in which the above fluid flow section and the above first thermoelectric module are not directly connected by a fastening member.

4. In Paragraph 2, The first shield member comprises a first plate covering the entire heat sink, a second plate arranged to extend toward the first surface of the fluid flow portion from one side along the first direction of the first plate, and a third plate arranged to extend toward the first surface of the fluid flow portion from the other side along the first direction of the first plate. The fluid flow portion, the first thermoelectric module, and the first plate of the first shield member are sequentially arranged in a third direction perpendicular to the first direction and the second direction, and A thermoelectric device arranged such that one side of the second plate and the first thermoelectric module is spaced apart in the first direction, and the other side of the third plate and the first thermoelectric module is spaced apart in the first direction.

5. In Paragraph 4, A thermoelectric device in which the first shield member and the fluid flow member are connected by a first fastening member disposed from the first plate of the first shield member to the first surface of the fluid flow member so as to be adjacent to the second plate of the first shield member, and a second fastening member disposed from the first plate of the first shield member to the first surface of the fluid flow member so as to be adjacent to the third plate of the first shield member.

6. In Paragraph 5, The head of the first fastening member and the head of the second fastening member are a thermoelectric device disposed on the upper surface of the first plate of the first shield member.

7. In Paragraph 5, The above first fastening member and the above second fastening member are a thermoelectric device that does not penetrate the above first thermoelectric module.

8. In Paragraph 7, A thermoelectric device in which the first surface of the fluid flow section and the thermoelectric element are joined by thermal grease.

9. In Paragraph 4, The thermoelectric device further comprises a first shield member, a fourth plate positioned at an angle to the first plate in a direction away from the first surface of the fluid flow portion on one side according to the second direction of the first plate, and a fifth plate positioned at an angle to the first plate in a direction away from the first surface of the fluid flow portion on the other side according to the second direction of the first plate.

10. In Paragraph 9, A thermoelectric device configured such that the second fluid flows between the first surface of the fluid flow section and the fourth plate of the first shield member, passes between the heat sink and the first plate of the first shield member, and is discharged between the first surface of the fluid flow section and the fifth plate of the first shield member.

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