Electronic device comprising thermal interface material

Abstract

According to various embodiments, an electronic device comprises: a housing; a printed circuit board disposed in the housing; a plurality of electrical elements disposed on the printed circuit board; and a first thermal interface material which is cured through molding so as to have a specific shape, and which covers at least some of the plurality of electrical elements, wherein the first thermal interface material includes at least two regions divided to cover some of the plurality of electrical elements, and the at least two regions can be determined through at least one from among the height range, temperature range and density of at least some of the plurality of electrical elements. Various other embodiments of the electronic device are possible.

Description

Electronic device including a heat transfer member

[0001] The various embodiments disclosed in this document relate to electronic devices including heat transfer members.

[0002] While electronic devices are becoming increasingly smaller, their functions are becoming increasingly diverse. As electronic devices become smaller and slimmer, electrical components embedded within them may be positioned so that the gap between them and surrounding structures becomes increasingly narrow or concentrated, and they may generate high temperatures due to the performance of various functions. Such high temperatures can cause malfunctions in electronic devices and cause discomfort to users. Therefore, electronic devices may require a heat transfer structure capable of effectively transferring heat generated from electrical components to the surroundings.

[0003] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0004] The electronic device may include at least one substrate (e.g., a printed circuit board (PCB)) disposed in an internal space and a plurality of electrical components (e.g., an application processor) as a heat source disposed on the substrate. Heat generated from the plurality of electrical components may be transferred to a heat dissipation structure (e.g., a vapor chamber) through a thermal interface material (TIM) in contact with at least some of the plurality of electrical components, and may diffuse into the surroundings.

[0005] However, since the heat transfer member is positioned to make contact primarily with the electrical component that generates the most heat among multiple electrical components, heat generated from other surrounding electrical components may not be effectively diffused. Furthermore, if the heat transfer member is designed considering all electrical components placed on the substrate, it includes a complex structure corresponding to the respective positions and shapes of the multiple electrical components; consequently, the manufacturing cost of the heat transfer member increases, and the yield may decrease during mass production.

[0006] Various embodiments of the present disclosure may provide an electronic device comprising a heat transfer member having an improved heat dissipation structure.

[0007] According to various embodiments, an electronic device including a heat transfer member that can help improve the heat transfer performance of a plurality of electrical elements can be provided.

[0008] According to various embodiments, an electronic device including a heat transfer member that can help mitigate shocks applied to a plurality of electrical elements can be provided.

[0009] According to various embodiments, an electronic device including a heat transfer member can be provided, which increases yield and reduces manufacturing costs.

[0010] The technical tasks intended to be accomplished in this document are not limited to those mentioned above, and other technical tasks not mentioned will be clearly understood by those skilled in the art to which this document belongs from the description below.

[0011] An electronic device according to various embodiments of the present disclosure comprises a housing, a printed circuit board disposed in the housing, a plurality of electrical elements disposed on the printed circuit board, and a first heat transfer member that is cured to have a specific shape through a molding process and covers at least some of the plurality of electrical elements, wherein the first heat transfer member comprises at least two regions divided to cover some of the plurality of electrical elements, and the at least two regions may be determined through at least one of a height range, a temperature range, and a density of at least some of the plurality of electrical elements.

[0012] A method for manufacturing a heat transfer member according to various embodiments of the present disclosure may include a first step of heating a mold having a shape corresponding to the first heat transfer member, which is divided into at least two regions to cover at least some of the electrical elements among a plurality of electrical elements disposed on a printed circuit board; a second step of applying the heated mold to a base material of the first heat transfer member formed of a flexible material; and a third step of punching out the outer edge of the deformed first heat transfer member.

[0013] Since the electronic device according to exemplary embodiments of the present disclosure includes a first heat transfer member formed based on the height, heat generation level, and / or density of at least one electric element included in a plurality of electric elements, the heat transfer performance of the electronic device can be improved, the impact applied to the plurality of electric elements can be mitigated, the yield can be increased, and the manufacturing cost can be reduced.

[0014] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs from the description below.

[0015] In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0016] FIG. 1 is a front perspective view of an electronic device according to various embodiments of the present disclosure.

[0017] FIG. 2 is a rear perspective view of the electronic device of FIG. 1 according to various embodiments of the present disclosure.

[0018] FIG. 3 is an exploded perspective view of the electronic device of FIG. 2 according to various embodiments of the present disclosure.

[0019] FIG. 4a is a perspective view in which a shield can, a first heat transfer member, and a second heat transfer member are disposed on a printed circuit board according to various embodiments of the present disclosure.

[0020] FIG. 4b is a perspective view in which a shield can and a first heat transfer member are disposed on a printed circuit board according to various embodiments of the present disclosure.

[0021] FIG. 5 is an unfolded perspective view of FIG. 4a according to various embodiments of the present disclosure.

[0022] FIG. 6 is a front view of a shield can disposed on a printed circuit board according to various embodiments of the present disclosure.

[0023] FIG. 7a is a front perspective view of a printed circuit board according to various embodiments of the present disclosure, in which a shield can and a first heat transfer member are disposed.

[0024] FIG. 7b is a cross-sectional view of a printed circuit board viewed along line 7b-7b of FIG. 7a according to various embodiments of the present disclosure, in which a shield can and a first heat transfer member are arranged.

[0025] FIG. 8a is a rear view of a first heat transfer member according to various embodiments of the present disclosure.

[0026] FIG. 8b is a perspective view of a first heat transfer member according to various embodiments of the present disclosure.

[0027] FIG. 9 is a cross-sectional view of a printed circuit board viewed along line 9-9 of FIG. 7a according to various embodiments of the present disclosure, in which a shield can and a first heat transfer member are arranged.

[0028] FIG. 10 is a drawing illustrating the manufacturing process of a first heat transfer member according to various embodiments of the present disclosure.

[0029] FIG. 11 is a flowchart of the manufacturing process of a first heat transfer member according to various embodiments of the present disclosure.

[0030] Hereinafter, embodiments of the present disclosure are described in detail with reference to the drawings so that those skilled in the art can easily practice them. However, the present disclosure may be embodied in various different forms and is not limited to the embodiments described herein. In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and brevity.

[0031] FIG. 1 is a front perspective view of an electronic device according to various embodiments of the present disclosure. FIG. 2 is a rear perspective view of the electronic device of FIG. 1 according to various embodiments of the present disclosure.

[0032] Referring to FIGS. 1 and 2, the electronic device (200) may include a housing (210) comprising a first surface (or front) (210A), a second surface (or rear) (210B), and a side (210C) surrounding the space between the first surface (210A) and the second surface (210B). In other embodiments (not shown), the housing (210) may refer to a structure forming some of the first surface (210A), the second surface (210B), and the side (210C). According to one embodiment, the first surface (210A) may be formed by a front plate (202) (e.g., a glass plate or a polymer plate including various coating layers) in which at least a portion is substantially transparent. The second surface (210B) may be formed by a rear plate (211) that is substantially opaque. The rear plate (211) may be formed, for example, by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side (210C) may be formed by a side bezel structure (or "side member") (218) comprising metal and / or polymer, which is combined with the front plate (202) and the rear plate (211). In some embodiments, the rear plate (211) and the side bezel structure (218) may be formed integrally and may comprise the same material (e.g., a metallic material such as aluminum).

[0033] In the illustrated embodiment, the front plate (202) may include a first region (210D) that curves seamlessly from the first surface (210A) toward the rear plate at both ends of the long edge of the front plate. In the illustrated embodiment (see FIG. 2b), the rear plate (211) may include a second region (210E) that curves seamlessly from the second surface (210B) toward the front plate at both ends of the long edge. In some embodiments, the front plate (202) or the rear plate (211) may include only one of the first region (210D) or the second region (210E). In some embodiments, the front plate (202) and the rear plate (211) may not include the first region and the second region, but may include only a flat plane positioned parallel to the second surface (210B). In the above embodiments, when viewed from the side of the electronic device, the side bezel structure (218) may have a first thickness (or width) on the side that does not include the first region (210D) or the second region (210E) as above, and may have a second thickness that is thinner than the first thickness on the side that includes the first region or the second region.

[0034] According to one embodiment, the electronic device (200) may include at least one of a display (201), an input device (203), an audio output device (207, 214), a sensor module (204, 219), a camera module (205, 212, 213), a key input device (217), an indicator (not shown), and a connector (208). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., a key input device (217), or an indicator) or additionally include other components.

[0035] The display (201) may be exposed, for example, through a substantial portion of the front plate (202). In some embodiments, at least a portion of the display (201) may be exposed through the front plate (202) forming the first surface (210A) and the first area (210D) of the side (210C). The display (201) may be combined with or placed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer that detects a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor module (204, 219) and / or at least a portion of the key input device (217) may be placed in the first area (210D) and / or the second area (210E).

[0036] The input device (203) may include a microphone. In some embodiments, the input device (203) may include a plurality of microphones positioned to detect the direction of sound. The sound output device (207, 214) may include speakers. The speakers may include an external speaker (207) and a call receiver (214). In some embodiments, the microphone, speakers, and connector (208) may be positioned in the space of the electronic device (200) and may be exposed to the external environment through at least one hole formed in the housing (210). In some embodiments, the hole formed in the housing (210) may be used for both the microphone and the speakers. In some embodiments, the sound output device (207, 214) may include a speaker (e.g., a piezo speaker) that operates with the hole formed in the housing (210) excluded. In some embodiments, the electronic device (200) may include a tray member positioned through at least a portion of the side bezel structure (218).

[0037] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., proximity sensor) and / or a second sensor module (not shown) (e.g., fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) (e.g., HRM sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on the first surface (210A) of the housing (210). The fingerprint sensor (e.g., ultrasonic or optical fingerprint sensor) may be disposed below the display (201) on the first surface (210A). The electronic device (200) may further include at least one of an unillustrated sensor module, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor (204).

[0038] The camera modules (205, 212, 213) may include a first camera device (205) disposed on a first surface (210A) of the electronic device (200), a second camera device (212) disposed on a second surface (210B), and / or a flash (213). The camera modules (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light-emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide-angle and telephoto lenses) and image sensors may be disposed on one surface of the electronic device (200).

[0039] A key input device (217) may be placed on the side (210C) of the housing (210). In another embodiment, the electronic device (200) may not include some or all of the aforementioned key input devices (217), and the key input device (217) not included may be implemented in other forms, such as soft keys, on the display (201). In another embodiment, the key input device (217) may be implemented using a pressure sensor included in the display (201).

[0040] The indicator may be placed, for example, on a first surface (210A) of the housing (210). The indicator may, for example, provide status information of the electronic device (200) in the form of light. In another embodiment, the light-emitting element may, for example, provide a light source that is coupled with the operation of the camera module (205). The indicator may include, for example, an LED, an IR LED, and a xenon lamp.

[0041] The connector hole (208) may include a first connector hole (208) capable of accommodating a connector (e.g., a USB connector or an IF module (interface connector port module)) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (or earphone jack) capable of accommodating a connector for transmitting and receiving audio signals with an external electronic device.

[0042] Some of the camera modules (205, 212), some of the sensor modules (204, 219), or indicators may be positioned to be exposed through the display (201). For example, the camera module (205), sensor module (204), or indicator may be positioned to come into contact with the external environment through an opening or a transparent area perforated to the front plate (202) of the display (201) within the internal space of the electronic device (200). In one embodiment, the area where the display (201) and the camera module (205) face each other may be formed as a transparent area having a certain transmittance as part of the area for displaying content. In one embodiment, the transparent area may be formed to have a transmittance in the range of about 5% to about 20%. This transparent area may include an area that overlaps with the effective area (e.g., field of view area) of the camera module (205) through which light passes to form an image and generate an image by being formed by an image sensor. For example, the transparent area of ​​the display (201) may include an area with a lower pixel density than the surrounding area. For example, the transparent area may replace the opening. For example, the camera module (205) may include an under-display camera (UDC). In another embodiment, some sensor modules (204) may be positioned to perform their functions without being visually exposed through the front plate (202) within the internal space of the electronic device. For example, in this case, the perforated opening may be unnecessary for the area of ​​the display (201) facing the sensor modules.

[0043] FIG. 3 is an exploded perspective view of the electronic device of FIG. 2 according to various embodiments of the present disclosure.

[0044] Referring to FIG. 3, an electronic device (200) (e.g., a portable communication device) may include a side member (218) (e.g., a side bezel structure or a side frame), a support member (2181) (e.g., a bracket, an extension member, or a support structure) extending from the side member (218) into the internal space (2101) of the electronic device (200), a front cover (202) (e.g., a front plate, a first plate, or a first cover) coupled to one side of the side member (218), and a rear cover (211) (e.g., a rear plate, a second plate, a cover member, or a second cover) coupled to the other side of the side member (218) so as to face in the opposite direction to the front cover (202). In one embodiment, the electronic device (200) may include a housing (e.g., the housing (210) of FIG. 1) (e.g., a housing structure) formed by combining the side member (218), the front cover (202), and / or the rear cover (211). In one embodiment, the electronic device (200) comprises a display (201) disposed in an internal space (2101), a printed circuit board (240), a camera module (212) disposed on the printed circuit board (240), a battery (243), a sub-printed circuit board (241) disposed spaced apart from the printed circuit board (240) with the battery (243) in between, a module assembly (242) electrically connected to the printed circuit board (240) and / or the sub-printed circuit board (241) (e.g., a speaker assembly, a microphone assembly, or an interface connector assembly), a shield can (400) disposed on the printed circuit board (240), a first heat transfer member (500) disposed on the printed circuit board (240) through an opening (421) formed on the upper surface (420) (e.g., a surface facing the +z-axis) of the shield can (400), and a second support member (2181) disposed on the upper surface (420) of the shield can (400). It may include a second heat transfer member (600) in contact with at least a portion of the surface (2181b), and a vapor chamber (700) disposed on the support member (2181).The vapor chamber (700) may protrude to a second surface (2181b) of the support member (2181) or be at least partially embedded in the support member (2181). In this case, the corresponding area of ​​the support member (2181) that is coupled to the vapor chamber (700) may be formed of a metal material with excellent thermal conductivity (e.g., aluminum). In some embodiments, at least one of the above-described components may be omitted, or at least one other component may be additionally included.

[0045] According to various embodiments, the support member (2181) may be disposed inside the electronic device (200) and connected to the side member (218) or formed integrally with the side member (218). The side member (218) and / or the support member (2181) may be formed from, for example, a metal material and / or a non-metal (e.g., a polymer) material. The support member (2181) may have a display (201) and a vapor chamber (700) combined to receive support on a first surface (2181a), and a printed circuit board (240), a sub-printed circuit board (241), a module assembly (242), a battery (243), a shield can (400), a first heat transfer member (500), and a second heat transfer member (600) disposed to receive support on a second surface (2181b) facing in the opposite direction to the first surface (2181a).

[0046] According to various embodiments, the battery (243) is a device for supplying power to at least one component of the electronic device (120) and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (243) may be positioned side-by-side so as to be substantially coplanar with, for example, the printed circuit board (240) and / or the sub-printed circuit board (241). The battery (243) may be embedded inside the electronic device (200). In some embodiments, the battery (243) may be detachably positioned from the electronic device (200).

[0047] According to various embodiments, the electronic device (200) may include at least one electrical connection device (245) for electrically connecting a printed circuit board (240) and a sub-printed circuit board (241), and / or a printed circuit board (240) and a module assembly (242). In one embodiment, the at least one electrical connection device (245) may include a flexible printed circuit board (FPCB).

[0048] According to various embodiments, the electronic device (200) may include a waterproof structure comprising at least one waterproof member (481, 482) disposed between the display (201) and the support member (2181). In one embodiment, the electronic device (200) may include a waterproof space provided between the display (201) and the support member (2181) through at least one waterproof member (481, 482). In one embodiment, the at least one waterproof member (481, 482) may include a first waterproof member (481) in liquid form that is disposed between a molding member that at least partially covers an extension (COP, chip on plastic) of the display (201) and a first surface (2181a) of the support member (2181) and hardens after application, and a second waterproof member (482) in the form of a tape that is connected to the first waterproof member (481) and disposed between the back surface of the display (201) and the support member (2181).

[0049] According to various embodiments, the electronic device (200) may include a shield can (400) formed of a conductive material (e.g., metal) and arranged to at least partially surround a plurality of electrical components (e.g., a plurality of electrical components (300) of FIG. 5) disposed on a printed circuit board (240). The plurality of electrical components may include at least one processor and at least one SMD (surface mounting device) type chip performing a corresponding function. The shield can (400) may include a side (410) and a top surface (420) extending from the side (410). The plurality of electrical components may be shielded by the side (410) of the shield can (400). For example, the side (410) of the shield can (400) may be soldered to the printed circuit board (240) and electrically connected to the ground of the printed circuit board (240). In some embodiments, the side (410) of the shield can (400) may be electrically connected to the printed circuit board (240) by soldering it to a separate member (e.g., a metal frame) that is electrically connected to the ground of the printed circuit board (240). A plurality of electrical components may be exposed through an opening (421) formed through the top surface (420) of the shield can (400). The opening (421) of the shield can (400) may serve as a heat transfer passage through which heat generated from the plurality of electrical components is transferred to the outside.

[0050] According to various embodiments, the electronic device (200) may include a first heat transfer member (500) that contacts at least some of a plurality of electrical elements (e.g., a plurality of electrical elements (300) of FIG. 5) mounted on a printed circuit board (240) and transfers heat generated from the plurality of electrical elements to the outside. The first heat transfer member (500) may be placed on the printed circuit board (240) through the opening (421) of the shield can (400) after being cured to have a specific shape through a molding process. By being placed on the substrate (240) through the opening (421) of the shield can (400), the first heat transfer member (500) may come into contact with at least some of the plurality of electrical elements. The second heat transfer member (600) is disposed on the upper surface (420) of the shield can (400) and may be thermally connected (e.g., in contact or in proximity) to the first heat transfer member (500). In some embodiments, the second heat transfer member (600) may be omitted.

[0051] According to various embodiments, the electronic device (200) may include a vapor chamber (700) that dissipates heat generated from a plurality of electrical elements (e.g., a plurality of electrical elements (300) of FIG. 5) transferred through a first heat transfer member (500) and / or a second heat transfer member (600) to the outside. The vapor chamber (700) may be disposed on a support member (2181). The vapor chamber (700) may be disposed on a first surface (2181a) or a second surface (2181b) of the support member (2181). The vapor chamber (700) may be disposed in such a manner that it penetrates at least partially from the first surface (2181a) to the second surface (2181b). The vapor chamber (700) may be formed of a material of Cu (e.g., copper or copper alloy) having excellent thermal conductivity. In one embodiment, the vapor chamber (700) may include a wick structure disposed in a hollow internal space and a heat transfer fluid. For example, heat transferred to the vapor chamber (700) can rapidly diffuse into the surroundings through the capillary action of the wick structure disposed in the sealed internal space and the phase change (e.g., gas-to-liquid) of the heat transfer fluid (e.g., water).

[0052] According to various embodiments, heat generated from a plurality of electrical components (e.g., a plurality of electrical components (300) of FIG. 5) mounted on a printed circuit board (240) is transferred to a first heat transfer member (500), a second heat transfer member (600), and a metal material support member (2181) through the opening (421) of a shield can (400), and can be diffused to the surroundings through a vapor chamber (700). The first heat transfer member (500) may be formed based on the height, heat generation level, and / or density of at least one electrical component included in the plurality of electrical components. As a result, the heat transfer performance of the electronic device (200) may be improved, the impact applied to the plurality of electrical components may be mitigated, the yield may be increased, and the manufacturing cost may be reduced.

[0053] Hereinafter, the specific configuration of the first heat transfer member (500) will be described.

[0054] FIG. 4a is a perspective view in which a shield can, a first heat transfer member, and a second heat transfer member are disposed on a printed circuit board according to various embodiments of the present disclosure. FIG. 4b is a perspective view in which a shield can and a first heat transfer member are disposed on a printed circuit board according to various embodiments of the present disclosure. FIG. 5 is an unfolded perspective view of FIG. 4a according to various embodiments of the present disclosure.

[0055] Referring to FIGS. 4a, 4b, and 5, a plurality of electrical elements (300) disposed on a first substrate surface (2401) of a printed circuit board (240) may be at least partially sealed and / or shielded by a side (410) of a shield can (400), a first heat transfer member (500), and a second heat transfer member (600). In some embodiments, a separate shielding member may be further included, disposed on the top surface (420) of the shield can (400) of the electronic device (200) and sealing an opening (421). The side (410) of the shield can (400) may be disposed to surround the plurality of electrical elements (300). The first heat transfer member (500) may be formed to correspond to the opening (421) of the shield can (400) or smaller than the opening (421) of the shield can (400) and may be arranged to cover at least some of the electrical elements among the plurality of electrical elements (300). The second heat transfer member (600) may be formed to correspond to the upper surface (420) of the shield can (400) and may be arranged to cover the first heat transfer member (500) and the upper surface (420) of the shield can (400). In one embodiment, the first heat transfer member (500) may have a smaller size than the second heat transfer member (600). In some embodiments, the first heat transfer member (500) may be formed to match the opening (421) of the shield can (400) or smaller than the opening (421). In some embodiments, the second heat transfer member (600) may be formed to be larger than the opening (421) of the shield can (400) or to cover both the upper surface (420) and the opening (421).

[0056] FIG. 6 is a front view of a shield can disposed on a printed circuit board according to various embodiments of the present disclosure. FIG. 7a is a front perspective view of a shield can and a first heat transfer member disposed on a printed circuit board according to various embodiments of the present disclosure. FIG. 7b is a cross-sectional view of a shield can and a first heat transfer member disposed on a printed circuit board viewed along line 7b-7b of FIG. 7a according to various embodiments of the present disclosure. FIG. 8a is a rear view of a first heat transfer member according to various embodiments of the present disclosure. FIG. 8b is a perspective view of a first heat transfer member according to various embodiments of the present disclosure.

[0057] Referring to FIG. 6, a plurality of electric elements (300) disposed on a first substrate surface (2401) of a printed circuit board (240) may include first electric elements (310), second electric elements (320), third electric elements (330), fourth electric elements (340), and fifth electric elements (351, 352, 353, 354, 355, 356, 357, 358). In the drawing, some electric elements are designated by a single indicator line, but it is obvious that at least two electric elements may be designated.

[0058] According to various embodiments, the first electrical components (310) may include a processor (312) and a first memory (311). The processor (312) may include, for example, an application processor (AP), a central processing unit (CPU), a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP), or one or more thereof. The first memory (311) may include, for example, a dynamic random access memory (DRAM), a volatile memory that stores data processed while the processor (312) performs operations. The processor (312) and the first memory (311) may be arranged in a stacked structure with the first memory (311) on the processor (312). The second electrical components (320) may include a DC circuit (321) and a plurality of passive components (322). The DC circuit (321) may include a circuit that converts or regulates DC voltage, for example, as a DC power conversion integrated circuit (DC IC). In some embodiments, the DC circuit (321) may control the voltage and current of the battery (243) to prevent overcharging. The third electrical components (330) may include a third memory and a plurality of passive components. The third memory may include a non-volatile memory that stores high-speed processed data, for example, as a universal flash storage (UFS). The fourth electrical components (340) may include a power circuit and a plurality of passive components.The power circuit may include a circuit that supplies power to a plurality of electrical components (300), for example, as a power management integrated circuit (PMIC). In one embodiment, the plurality of passive components may be electrical components that operate without a power supply and may perform the role of regulating and converting electrical signals. For example, the plurality of passive components may include one or more of a resistor, a capacitor, an inductor, and a transformer.

[0059] Referring to FIGS. 6, FIGS. 7a, FIGS. 7b, FIGS. 8a, and FIGS. 8b, the first heat transfer member (500) may include a first region (510) covering first electric elements (310), a second region (520) covering second electric elements (320), a third region (530) covering third electric elements (330), a fourth region (540) covering fourth electric elements (340), and a plurality of fifth regions (551, 552, 553, 554, 555, 556, 557, 558) covering each of fifth electric elements (351, 352, 353, 354, 355, 356, 357, 358). The first region (510) may include a first-1 region (511) positioned to cover the stacked structure of the processor (312) and the first memory (311) when the first heat transfer member (500) is viewed from above (e.g., in the +z-axis direction), a first-2 region (512) positioned to cover the processor (312), and a first-3 region (513). The first-2 region (512) and the first-3 region (513) may be formed by extending from the first-1 region (511). A plurality of fifth regions may include a fifth-1 region (551) covering fifth-1 electric elements (351), a fifth-2 region (552) covering fifth-2 electric elements (352), a fifth-3 region (553) covering fifth-3 electric elements (353), a fifth-4 region (554) covering fifth-4 electric elements (354), a fifth-5 region (555) covering fifth-5 electric elements (355), a fifth-6 region (556) covering fifth-6 electric elements (356), a fifth-7 region (557) covering fifth-7 electric elements (357), and a fifth-8 region (558) covering fifth-8 electric elements (358).

[0060] According to various embodiments, the regions (510, 520, 530, 540, 551, 552, 553, 554, 555, 556, 557, 558) of the first heat transfer member (500) may be divided into a first region (510), a second region (520), a third region (530), a fourth region (540), and a plurality of fifth regions (551, 552, 553, 554, 555, 556, 557, 558) based on a specific height range of at least some of the electric elements among the plurality of electric elements (300). Each of the first region (510), the second region (520), the third region (530), the fourth region (540), and a plurality of fifth regions (551, 552, 553, 554, 555, 556, 557, 558) may be arranged to cover a plurality of electrical elements (300) having a specific height range. The regions (510, 520, 530, 540, 551, 552, 553, 554, 555, 556, 557, 558) of the first heat transfer member (500) may be separated to cover electrical elements having similar heights together. For example, the first electric elements (310) covered by the first region (510) may have a first height range (e.g., a first-1 height range (t1-1), a first-2 height range (not shown), and a first-3 height range (not shown)), and the second electric elements (320) covered by the second region (520) separated from the first region (510) may have a second height range (t2) different from the first height range. In one embodiment, the regions (510, 520, 530, 540, 551, 552, 553, 554, 555, 556, 557, 558) of the first heat transfer member (500) may be separated in such a way that they have different depths and / or heights from the outer surface of the first heat transfer member (500).For example, regions (510, 520, 530, 540, 551, 552, 553, 554, 555, 556, 557, 558) of the first heat transfer member (500) may be distinguished by recesses formed lower than the outer surface and / or protrusions formed higher than the outer surface.

[0061] According to various embodiments, a plurality of electrical elements (300) may be arranged to be covered by a first heat transfer member (500). For example, a plurality of electrical elements (300) mounted on a printed circuit board (240) may be arranged on a first heat transfer member (500) formed to correspond to the shape of the plurality of electrical elements (300). A first-1 region (511) among the first regions (510) may be arranged to be in contact with an electrical element having the highest height among the first electrical elements (310) (e.g., a stacked structure of the first memory (311) and the processor (312)). A first-2 region (512) and a first-3 region (513) among the first regions (510) may be arranged to be in contact with the processor (312). A portion of the second region (520) may be positioned to be in contact with the electrical element having the highest height among the second electrical elements (320) (e.g., DC circuit (321)). A portion of the third region (530) may be positioned to be in contact with the electrical element having the highest height among the third electrical elements (330) (e.g., third memory). A portion of the fourth region (540) may be positioned to be in contact with the electrical element having the highest height among the fourth electrical elements (340) (e.g., power circuit). For example, by dividing the regions (510, 520, 530, 540, 551, 552, 553, 554, 555, 556, 557, 558) based on a specific height range (e.g., a similar height range), the highest electrical element is in contact with the first heat transfer member (500), and the remaining surrounding electrical elements are positioned as close as possible even if they are not in contact with the first heat transfer member (500), so the heat transfer efficiency can be improved.

[0062] According to various embodiments, each of the second region (520), the third region (530), the fourth region (540), and a plurality of fifth regions (551, 552, 553, 554, 555, 556, 557, 558) may have a constant thickness. The thickness of each of the first-2 region (512) and the first-3 region (513) may be formed to be thicker than the thickness of the first-1 region (511) by the height of the first memory (311). In one embodiment, a fifth-6 region (556), which is one of the plurality of fifth regions, is arranged to cover a plurality of fifth-6 electrical elements (356) with a low height, and the thickness of the fifth-6 region (556) may be determined based on the highest electrical element among the plurality of fifth-6 electrical elements (356). In this case, the highest electric element among the plurality of 5-6 electric elements (356) may be in contact with the 5-6 region (556), but the remaining electric elements among the plurality of 5-6 electric elements (356) may not be in contact with the 5-6 region (556). In one embodiment, the first region (510) and the second region (520) may be distinguished based on the height of at least one electric element (e.g., first memory (311) and processor (312)) included in the first electric elements (310) and / or the height of at least one electric element (e.g., DC circuit (321)) included in the second electric elements (320). For example, the height of the stacked structure of the first memory (311) and processor (312) may be higher than that of the DC circuit (321). In this case, the thickness of the first region (510) may be formed thinner than the thickness of the second region (520).

[0063] According to various embodiments, the first region (510) may be formed to accommodate electrical components having a first height range (e.g., a first-1 height range (t1-1), a first-2 height range (not shown), and a first-3 height range (not shown)). The second region (520) may be formed to accommodate electrical components having a second height range (t2). The third region (530) may be formed to accommodate electrical components having a third height range (t3). The fourth region (540) may be formed to accommodate electrical components having a fourth height range (not shown). The fifth region (550) may be formed to accommodate electrical components having a fifth height range (not shown). In one embodiment, the first height range of the first electric elements (310) covered by the first area (510), the second height range (t2) of the second electric elements (320) covered by the second area (520), the third height range (t3) of the third electric elements (330) covered by the third area (530), the fourth height range (not shown) of the fourth electric elements (340) covered by the fourth area (540), and the fifth height range (not shown) of the fifth electric elements (351, 352, 353, 354, 355, 356, 357, 358) covered by a plurality of fifth areas (551, 552, 553, 554, 555, 556, 557, 558) covered by a plurality of fifth areas (551, 552, 553, 554, 355, 356, 357, 358) covered by a plurality of fifth areas (551, 552, 553, 554, 355, 356, 357, 358) may each be set differently. For example, the first height range from the first substrate surface (2401) of the printed circuit board (240) to the first region (510) of the first heat transfer member (500) may include 0.477 mm or more and 1.21 mm or less. For example, the first-1 height range (t1-1) from the first substrate surface (2401) of the printed circuit board (240) to the first-1 region (511) of the first heat transfer member (500) may include 0.99 mm or more and 1.21 mm or less. The first-2 height range (not shown) from the first substrate surface (2401) to the first-2 region (512) may include 0.477 mm or more and 0.583 mm or less.The first-third height range (not shown) from the first substrate surface (2401) to the first-third region (513) may include 0.477 mm or more and 0.583 mm or less. In some embodiments, the first-first height range (t1-1), the first-second height range, and the first-third height range may be formed as a single height range. The second height range (t2) from the first substrate surface (2401) to the second region (520) may include 0.576 mm or more and 0.704 mm or less. The third height range (t3) from the first substrate surface (2401) to the third region (530) may include 0.657 mm or more and 0.803 mm or less. The fourth height range from the first substrate surface (2401) to the fourth region (540) may include 0.495 mm or more and 0.605 mm or less. The 5-5 height range (not shown) from the 1st substrate surface (2401) to the 5-5 region (555) may include 0.45 mm or more and 0.55 mm or less. The 5-8 height range (not shown) from the 1st substrate surface (2401) to the 5-8 region (558) may include 0.63 mm or more and 0.77 mm or less.

[0064] According to various embodiments, regions (510, 520, 530, 540, 551, 552, 553, 554, 555, 556, 557, 558) of the first heat transfer member (500) may be divided into a first region (510), a second region (520), a third region (530), a fourth region (540), and a plurality of fifth regions (551, 552, 553, 554, 555, 556, 557, 558) based on a specific temperature range of at least some of the electric elements among the plurality of electric elements (300). Each of the first region (510), the second region (520), the third region (530), the fourth region (540), and a plurality of fifth regions (551, 552, 553, 554, 555, 556, 557, 558) may be arranged to cover each of a plurality of electric elements (300) having a specific temperature range. For example, regions (510, 520, 530, 540, 551, 552, 553, 554, 555, 556, 557, 558) of the first heat transfer member (500) may be arranged to cover each of the first electric elements (310), second electric elements (320), third electric elements (330), fourth electric elements (340), and fifth electric elements (351, 352, 353, 354, 355, 356, 357, 358) which have a relatively large amount of heat among the plurality of electric elements (300). In one embodiment, the first region (510) may be formed to accommodate electric elements having a first temperature range. The second region (520) may be formed to accommodate electric elements having a second temperature range. The third region (530) may be formed to accommodate electrical elements having a third temperature range. The fourth region (540) may be formed to accommodate electrical elements having a fourth temperature range. A plurality of fifth regions (551, 552, 553, 554, 555, 556, 557, 558) may be formed to accommodate electrical elements having a fifth temperature range.In one embodiment, the first temperature range of the first electric elements (310) covered by the first region (510), the second temperature range of the second electric elements (320) covered by the second region (520), the third temperature range of the third electric elements (330) covered by the third region (530), the fourth temperature range of the fourth electric elements (340) covered by the fourth region (540), and the fifth temperature range of the fifth electric elements (351, 352, 353, 354, 355, 356, 357, 358) covered by a plurality of fifth regions (551, 552, 553, 554, 555, 556, 557, 558) may each be set differently. For example, the first temperature range of the processor (312) and the first memory (311) covered by the first region (510) may be formed higher than the second temperature range of the DC circuit (321) and the plurality of passive components (322) covered by the second region (520). In one embodiment, the first region (510) and the second region (520) may be distinguished based on the degree of heat generation of at least one electrical component (e.g., processor (312)) included in the first electrical components (310) and / or the degree of heat generation of at least one electrical component (e.g., DC circuit (321)) included in the second electrical components (320). For example, the heat generated from at least one electrical component included in the first electrical components (310) may be greater than the heat generated from at least one electrical component included in the second electrical components (320).

[0065] According to various embodiments, regions (510, 520, 530, 540, 551, 552, 553, 554, 555, 556, 557, 558) of the first heat transfer member (500) may be divided into a first region (510), a second region (520), a third region (530), a fourth region (540), and a plurality of fifth regions (551, 552, 553, 554, 555, 556, 557, 558) based on a specific density of at least some of the electric elements among the plurality of electric elements (300). Each of the first region (510), the second region (520), the third region (530), the fourth region (540), and a plurality of fifth regions (551, 552, 553, 554, 555, 556, 557, 558) may be arranged to cover each of a plurality of electrical elements (300) having a specific density. In one embodiment, the first region (510) may be formed to accommodate electrical elements having a first density. The second region (520) may be formed to accommodate electrical elements having a second density. The third region (530) may be formed to accommodate electrical elements having a third density. The fourth region (540) may be formed to accommodate electrical elements having a fourth density. A plurality of fifth regions (551, 552, 553, 554, 555, 556, 557, 558) may be formed to accommodate electrical elements having a fifth density.In one embodiment, the first density of the first electric elements (310) covered by the first region (510), the second density of the second electric elements (320) covered by the second region (520), the third density of the third electric elements (330) covered by the third region (530), the fourth density of the fourth electric elements (340) covered by the fourth region (540), and the fifth density of the fifth electric elements (351, 352, 353, 354, 355, 356, 357, 358) covered by a plurality of fifth regions (551, 552, 553, 554, 555, 556, 557, 558) may each be set differently. For example, the first density of the processor (312) and the first memory (311) covered by the first region (510) may be formed lower than the second density of the DC circuit (321) and the plurality of passive components (322) covered by the second region (520). In one embodiment, the first region (510) and the second region (520) may be distinguished based on the density of the first electric components (310) and / or the density of the second electric components (320). For example, the first electric components (310) may be placed adjacent to the second electric components (320).

[0066] According to various embodiments, the first heat transfer member (500) is formed by taking into account the height, heat generation level, and / or density of at least one electric element included in the plurality of electric elements (300), thereby increasing the contact area between the first heat transfer member (500) and the plurality of electric elements (300). As a result, the heat transfer performance of the electronic device (200) can be improved, the impact applied to the plurality of electric elements (300) can be mitigated, the yield can be increased, and manufacturing costs can be reduced.

[0067] According to various embodiments, each of the first electric elements (310) positioned closest to the edges of the second region (520), the third region (530), the fifth-first region (551), the fifth-fourth region (554), and the fifth-fifth region (555) may be positioned spaced apart from the edges of the second region (520), the third region (530), the fifth-first region (551), the fifth-fourth region (554), and the fifth-fifth region (555) by at least a first length (L1). In one embodiment, the first length (L1) may mean at least 0.3 mm. For example, the first electric elements (310) may be positioned spaced apart from the edge of the second region (520) by at least a first length (L1). The first electric elements (310) may be positioned spaced apart from the edge of the third region (530) by at least a first length (L1). The first electric elements (310) may be spaced apart from the edge of the 5-1 region (551) by at least a first length (L1). The first electric elements (310) may be spaced apart from the edge of the 5-4 region (554) by at least a first length (L1). The first electric elements (310) may be spaced apart from the edge of the 5-5 region (555) by at least a first length (L1). In one embodiment, each of the second electric elements (320) positioned closest to the edges of the first region (510), the fourth region (540), the fifth-1 region (551), the fifth-2 region (552), and the fifth-3 region (553) may be positioned spaced apart from the edges of the first region (510), the fourth region (540), the fifth-1 region (551), the fifth-2 region (552), and the fifth-3 region (553) by at least a first length (L1). For example, the second electric elements (320) may be positioned spaced apart from the edge of the first region (510) by at least a first length (L1). The second electric elements (320) may be positioned spaced apart from the edge of the fourth region (540) by at least a first length (L1).The second electric elements (320) may be spaced apart from the edge of the 5-1 region (551) by at least a first length (L1). The second electric elements (320) may be spaced apart from the edge of the 5-2 region (552) by at least a first length (L1). The second electric elements (320) may be spaced apart from the edge of the 5-3 region (553) by at least a first length (L1). In one embodiment, each of the third electric elements (330) positioned closest to the edges of the first region (510), the fifth-fifth region (555), the fifth-seventh region (557), and the fifth-eighth region (558) may be positioned spaced apart from the edges of the first region (510), the fifth-fifth region (555), the fifth-seventh region (557), and the fifth-eighth region (558) by at least a first length (L1). For example, the third electric elements (330) may be positioned spaced apart from the edge of the first region (510) by at least a first length (L1). The third electric elements (330) may be positioned spaced apart from the edge of the fifth-fifth region (555) by at least a first length (L1). The third electric elements (330) may be spaced apart from the edge of the 5-7 region (557) by at least a first length (L1). The third electric elements (330) may be spaced apart from the edge of the 5-8 region (558) by at least a first length (L1). In one embodiment, each of the fourth electric elements (340) that is closest to the edge of the first region (510) and the second region (520) may be spaced apart from the edge of the first region (510) and the second region (520) by at least a first length (L1). For example, the fourth electric elements (340) may be spaced apart from the edge of the second region (520) by at least a first length (L1).In one embodiment, each of the fifth electric elements (351, 352, 353, 354, 355, 356, 357, 358) positioned closest to the edges of the first region (510), second region (520), third region (530), fourth region (540), fifth-1 region (551), fifth-2 region (552), fifth-3 region (553), fifth-4 region (554), and fifth-5 region (555) may be positioned spaced apart from the edges of the first region (510), second region (520), third region (530), fourth region (540), fifth-1 region (551), fifth-2 region (552), fifth-3 region (553), fifth-4 region (554), and fifth-5 region (555) by at least a first length (L1). For example, the 5-1 electric elements (351) may be spaced apart from the edge of the first region (510) by at least a first length (L1). The 5-1 electric elements (351) may be spaced apart from the edge of the second region (520) by at least a first length (L1). The 5-2 electric elements (352) may be spaced apart from the edge of the second region (520) by at least a first length (L1). The 5-2 electric elements (352) may be spaced apart from the edge of the 5-3 region (553) by at least a first length (L1). The 5-3 electric elements (353) may be spaced apart from the edge of the second region (520) by at least a first length (L1). The 5-3 electric elements (351) may be spaced apart from the edge of the 5-2 region (552) by at least a first length (L1). The 5-4 electric elements (354) may be spaced apart from the edge of the 1-2 region (512) by at least a first length (L1). The 5-5 electric elements (355) may be spaced apart from the edge of the 1 region (510) by at least a first length (L1). The 5-5 electric elements (355) may be spaced apart from the edge of the 3 region (530) by at least a first length (L1).The 5-5 electric elements (351) may be spaced apart from the edge of the 5-6 region (556) by at least a first length (L1). The 5-5 electric elements (355) may be spaced apart from the edge of the 5-7 region (557) by at least a first length (L1). The 5-5 electric elements (355) may be spaced apart from the edge of the 5-8 region (558) by at least a first length (L1). The 5-6 electric elements (356) may be spaced apart from the edge of the 5-5 region (555) by at least a first length (L1). The 5-6 electric elements (356) may be spaced apart from the edge of the 5-7 region (557) by at least a first length (L1). The 5-7 electric elements (357) may be spaced apart from the edge of the 3rd region (530) by at least a first length (L1). The 5-7 electric elements (357) may be spaced apart from the edge of the 5-5 region (555) by at least a first length (L1). The 5-7 electric elements (357) may be spaced apart from the edge of the 5-6 region (556) by at least a first length (L1). The 5-8 electric elements (358) may be spaced apart from the edge of the 3rd region (530) by at least a first length (L1). The 5-8 electric elements (358) may be spaced apart from the edge of the 5-5 region (555) by at least a first length (L1).

[0068] According to various embodiments, the first heat transfer member (500) may be positioned to cover 90% of the surface area of ​​a plurality of electrical elements (300) mounted on a printed circuit board (240). For example, the straight distance from the first substrate surface (2401) of the printed circuit board (240) to the first heat transfer member (500) closest to the first substrate surface (2401) of the printed circuit board (240) may be formed to be at most 0.4 mm. In some embodiments, the heat transfer member (300) and at least a portion of the printed circuit board (240) may be positioned to be in contact. For example, a partition may be formed between the first region (510) and the second region (520), and at least a portion of the partition may be positioned to be in contact with the printed circuit board (240).

[0069] According to various embodiments, the side (410) of the shield can (400) may be positioned to surround a plurality of electrical elements (300) and a first heat transfer member (500). The side (410) of the shield can (400) may be positioned to surround the edge (502) of the first heat transfer member (500). The edge (502) of the first heat transfer member (500) may be positioned spaced apart by at least a second length (L2) from the opening (421) of the shield can (400) when the first substrate surface (2401) of the printed circuit board (240) is viewed from above (e.g., in the +z-axis direction). For example, the edge of the first-second region (512) may be positioned spaced apart by at least a second length (L2) from the opening (421) of the shield can (400). The edge of the first-third region (513) may be spaced apart from the opening (421) of the shield can (400) by at least a second length (L2). The edge of the second region (520) may be spaced apart from the opening (421) of the shield can (400) by at least a second length (L2). The edge of the third region (530) may be spaced apart from the opening (421) of the shield can (400) by at least a second length (L2). The edge of the fourth region (540) may be spaced apart from the opening (421) of the shield can (400) by at least a second length (L2). The edge of the fifth-first region (551) may be spaced apart from the opening (421) of the shield can (400) by at least a second length (L2). The edge of the 5-4 region (554) may be positioned at least a second length (L2) away from the opening (421) of the shield can (400). The edge of the 5-5 region (555) may be positioned at least a second length (L2) away from the opening (421) of the shield can (400). The edge of the 5-8 region (558) may be positioned at least a second length (L2) away from the opening (421) of the shield can (400).As a result, the problem of the heat transfer member (300) not being placed in the opening (421) of the shield can (400) due to accumulated tolerance can be prevented. In one embodiment, the second length (L2) may mean at least 0.4 mm.

[0070] According to various embodiments, each of the first electric elements (310), the second electric elements (320), the third electric elements (330), the fourth electric elements (340), and the fifth electric elements (351, 352, 353, 354, 355, 356, 357, 358) may be spaced apart from the edges of the first region (510), the second region (520), the third region (530), the fourth region (540), and a plurality of fifth regions (551, 552, 553, 554, 555, 556, 557, 558) by at least a first length. As a result, the problem that each of the first region (510), second region (520), third region (530), fourth region (540), and multiple fifth regions (551, 552, 553, 554, 555, 556, 557, 558) cannot be arranged to cover each of the first electric elements (310), second electric elements (320), third electric elements (330), fourth electric elements (340), and fifth electric elements (351, 352, 353, 354, 355, 356, 357, 358) due to accumulated tolerance can be prevented.

[0071] According to various embodiments, each of the first region (510), the second region (520), the third region (530), the fourth region (540), and a plurality of fifth regions (551, 552, 553, 554, 555, 556, 557, 558) may be formed as a straight line. The first-1 region (511), the fourth region (540), the fifth-2 region (552), the fifth-3 region (553), the fifth-6 region (556), and the fifth-7 region (557) may be formed in a rectangular shape.

[0072] According to various embodiments, the first heat transfer member (500) may be formed of a flexible material. For example, the first heat transfer member (500) may include one or more of urethane, polyethylene (PE), polyethylene oxide (PEO), polycaprolactone (PCL), polyurea (PUA), or polypropylene (PP).

[0073] FIG. 9 is a cross-sectional view of a printed circuit board viewed along line 9-9 of FIG. 7a according to various embodiments of the present disclosure, in which a shield can and a first heat transfer member are arranged.

[0074] Referring to FIG. 9, the first heat transfer member (500) may include a rim portion (501) formed along at least a portion of the edge (502). Among the plurality of electrical elements (300), the first memory (311) positioned closest to the rim portion (501) may be positioned spaced apart from the rim portion (501) by at least a first length (L1). In one embodiment, the first length (L1) may mean at least 0.3 mm. For example, the first memory (311) may be positioned spaced apart from the rim portion (501) by at least the first length (L1). In one embodiment, the rim portion (501) may mean the edge of the first-2 region (512) and the edge of the first-3 region (513) of the first heat transfer member (500). In some embodiments, when the edge portion (501) of the first heat transfer member (500) comes into contact with the electrical element having the highest height among the plurality of electrical elements (300), the thickness of the edge portion (501) may be formed thin. In this case, at least a portion of the edge portion (501) may be formed in an open shape, thereby reducing the defect rate caused by the thin first heat transfer member (500) and increasing the yield of the first heat transfer member (500). In one embodiment, when the edge portion (501) comes into contact with at least a portion of the stacked structure of the processor (312) having the highest height among the first electrical elements (310) and the first memory (311), at least a portion of the edge portion (501) may be formed in an open shape.

[0075] FIG. 10 is a diagram illustrating the manufacturing process of a first heat transfer member according to various embodiments of the present disclosure. FIG. 11 is a flowchart illustrating the manufacturing sequence of a first heat transfer member according to various embodiments of the present disclosure.

[0076] Referring to FIGS. 10 and 11, the first heat transfer member (500) can be manufactured through a first step (901) of heating a mold (800) that includes a shape corresponding to the shape of the first heat transfer member (500), a second step (902) of pressing the heated mold against a base material (504) of the first heat transfer member formed of a flexible material, and a third step (903) of punching out the outer edge of the deformed first heat transfer member (505). The mold (800) can be heated to a temperature between 80 and 100 degrees.

[0077] According to various embodiments, an electronic device (e.g., the electronic device (300) of FIG. 3) comprises a housing (e.g., the housing (210) of FIG. 3), a printed circuit board disposed in the housing (e.g., the printed circuit board (240) of FIG. 3), a plurality of electrical elements disposed on the printed circuit board (e.g., the plurality of electrical elements (300) of FIG. 5), and a first heat transfer member (e.g., the first heat transfer member (500) of FIG. 5) which is cured to have a specific shape through a molding process and covers at least some of the plurality of electrical elements, and the first heat transfer member covers at least some of the plurality of electrical elements (e.g., the first electrical elements (310), second electrical elements (320), third electrical elements (330), fourth electrical elements (340), or fifth electrical elements (351, 352, 353, 354, 355, 356, of FIG. 6). It includes at least two regions divided to cover (e.g., the first region (510), the second region (520), the third region (530), the fourth region (540), and a plurality of fifth regions (551, 552, 553, 554, 555, 556, 557, 558)) of FIG. 7a, and the at least two regions can be determined through at least one of the height range, temperature range, and density of at least some of the plurality of electric elements.According to various embodiments, the at least two regions may include a first region (e.g., the first region (510) of FIG. 7a) covering first electric elements (e.g., the first electric elements (310) of FIG. 6) having a first height range (e.g., the first-1 height range (t1-1), the first-2 height range (not shown), and the first-3 height range (not shown) of FIG. 7b) among the plurality of electric elements, and a second region (e.g., the second electric elements (320) of FIG. 6) having a second height range (e.g., the second height range (t2) of FIG. 7b) among the plurality of electric elements that is at least partially different from the first height range (e.g., the second height range (t2) of FIG. 7b).

[0078] According to various embodiments, the first height range may include 0.477 mm or more and 1.21 mm or less.

[0079] According to various embodiments, the second height range may include 0.576 mm or more and 0.704 mm or less.

[0080] According to various embodiments, a portion of the first region may be positioned to be in contact with the electric element having the highest height among the first electric elements.

[0081] According to various embodiments, a portion of the second region may be positioned to be in contact with the electric element having the highest height among the second electric elements.

[0082] According to various embodiments, the first heat transfer member includes a rim portion (e.g., rim portion (501) of FIG. 9) formed along at least a portion of an edge (e.g., edge (502) of FIG. 9), and among the plurality of electric elements, the electric element closest to the rim portion may be spaced apart from the rim portion by at least a first length (e.g., first length (L1) of FIG. 9).

[0083] According to various embodiments, when the rim portion comes into contact with the electrical element having the highest height among the first electrical elements, at least a portion of the rim portion may be formed in an open shape.

[0084] According to various embodiments, among the second electric elements, the electric element positioned closest to the edge of the first region may be positioned so as to be spaced apart from the edge of the first region by at least a first length.

[0085] According to various embodiments, among the first electric elements, the electric element positioned closest to the edge of the second region may be positioned so as to be spaced apart from the edge of the second region by at least a first length.

[0086] According to various embodiments, the first region and / or the second region may be formed as straight lines.

[0087] According to various embodiments, the electronic device further comprises a shield can (e.g., a shield can (400) of FIG. 5) disposed on the printed circuit board and comprising a side (e.g., a side (410) of FIG. 5) and a top surface (e.g., a top surface (420) of FIG. 5) extending from the side, wherein the side may be disposed to surround the edge (e.g., an edge (502) of FIG. 5) of the heat transfer member and the plurality of electrical elements disposed in an opening (e.g., an opening (421) of FIG. 5) formed through the top surface.

[0088] According to various embodiments, the edge of the first heat transfer member may be spaced apart from the shield can by at least a second length (e.g., the second length (L2) of FIG. 9) when the surface of the printed circuit board is viewed from above.

[0089] According to various embodiments, the electronic device further includes a second heat transfer member (e.g., the second heat transfer member (600) of FIG. 3) disposed on the upper surface of the shield can and the first heat transfer member, and the heat of the plurality of electrical elements can be transferred from the first heat transfer member to the second heat transfer member through the opening.

[0090] According to various embodiments, the electronic device may further include a vapor chamber (e.g., the vapor chamber (700) of FIG. 3) for dissipating heat from the plurality of electrical elements transferred through the first heat transfer member.

[0091] According to various embodiments, the first heat transfer member may be formed of a flexible material.

[0092] According to various embodiments, the at least two regions may include a first region (e.g., the first region (510) of FIG. 7a) covering first electric elements having a first temperature range among the plurality of electric elements (e.g., the first electric elements (310) of FIG. 6), and a second region (e.g., the second region (520) of FIG. 7a) covering second electric elements having a second temperature range different from the first temperature range among the plurality of electric elements (e.g., the second electric elements (320) of FIG. 6).

[0093] According to various embodiments, the at least two regions may include a first region (e.g., the first region (510) of FIG. 7a) covering first electric elements having a first density among the plurality of electric elements (e.g., the first electric elements (310) of FIG. 6), and a second region (e.g., the second region (520) of FIG. 7a) covering second electric elements having a second density different from the first density among the plurality of electric elements (e.g., the second electric elements (320) of FIG. 6).

[0094] According to various embodiments, a method for manufacturing a first heat transfer member (e.g., the first heat transfer member (500) of FIG. 7a) comprises: a first step (e.g., the first step (901) of FIG. 10) of heating a mold (e.g., the mold (800) of FIG. 10) having a shape corresponding to the first heat transfer member divided into at least two regions to cover at least some of the plurality of electrical elements (e.g., the plurality of electrical elements (300) of FIG. 5) disposed on a printed circuit board (e.g., the printed circuit board (240) of FIG. 3); a second step (e.g., the second step (902) of FIG. 10) of pressing the heated mold onto a base material of the first heat transfer member formed of a flexible material (e.g., the base material (504) of FIG. 10) of the first heat transfer member; and a third step (e.g., the second step (902) of FIG. 10) of punching out the outer edge of a deformed first heat transfer member (e.g., the deformed first heat transfer member (505) of FIG. 10). It may include the third step (903) of 10.

[0095] According to various embodiments, the at least two regions may be determined through at least one of the height range, temperature range, or density of some of the plurality of elements.

[0096] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device (e.g., a laptop), a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0097] The embodiments of the present disclosure disclosed in this specification and drawings are merely specific examples provided to facilitate the explanation of the technical content according to the embodiments of the present disclosure and to aid in understanding the embodiments of the present disclosure, and are not intended to limit the scope of the embodiments of the present disclosure. Accordingly, the scope of the various embodiments of the present disclosure should be interpreted to include all modifications or variations derived based on the technical concept of the various embodiments of the present disclosure, in addition to the embodiments disclosed herein.

Claims

1. In an electronic device (200), Housing (210); A printed circuit board (240) placed in the above housing; A plurality of electrical elements (300) disposed on the printed circuit board above; and It includes a first heat transfer member (500) that is hardened to have a specific shape through a molding process and covers at least some of the plurality of electric elements, and The first heat transfer member comprises at least two regions divided to cover at least some of the plurality of electric elements, and The above at least two regions are an electronic device determined through at least one of the height range, temperature range, and density of at least some of the plurality of electric elements.

2. In Paragraph 1, The above at least two regions are, A first region (510) covering first electric elements (310) having a first height range among the plurality of electric elements, and An electronic device comprising a second region (520) covering second electric elements (320) having a second height range (t2) that is at least partially different from the first height range among the plurality of electric elements.

3. In Paragraph 2, The above first height range includes 0.477mm or more and 1.21mm or less, and The above second height range is an electronic device including 0.576 mm or more and 0.704 mm or less.

4. In Paragraph 2, A part of the above-mentioned first region is, It is arranged to be in contact with the electric element having the highest height among the first electric elements, and Part of the above second region is, An electronic device positioned to contact the electric element having the highest height among the second electric elements.

5. In Paragraph 1, The first heat transfer member includes a rim portion (501) formed along at least a portion of the edge (502), and Among the plurality of electric elements, the electric element positioned closest to the edge portion is an electronic device spaced apart from the edge portion by at least a first length (L1).

6. In Paragraph 5, When the above-mentioned edge portion comes into contact with the electric element having the highest height among the first electric elements, An electronic device in which at least a portion of the above-mentioned rim is formed in an open shape.

7. In Paragraph 2, Among the second electric elements, the electric element positioned closest to the edge of the first region is spaced apart from the edge of the first region by at least a first length, The electric element among the first electric elements positioned closest to the edge of the second region is an electronic device spaced apart from the edge of the second region by at least a first length.

8. In Paragraph 2, The electronic device in which the first region and / or the second region is formed as a straight line.

9. In Paragraph 1, The above electronic device is, The shield can (400) further comprises a side surface (410) disposed on the printed circuit board and having an upper surface (420) extending from the side surface, and The above aspect is, An electronic device positioned to surround the edge (502) of the heat transfer member and the plurality of electrical elements positioned in the opening (421) formed through the upper surface.

10. In Paragraph 9, The edge of the first heat transfer member is an electronic device positioned at least a second length (L2) away from the shield can when the surface of the printed circuit board is viewed from above.

11. In Paragraph 9, The above electronic device is, It further includes a second heat transfer member (600) disposed on the upper surface of the shield can and the first heat transfer member, and An electronic device in which heat from the plurality of electrical elements is transferred from the first heat transfer member to the second heat transfer member through the opening.

12. In Paragraph 1, The above electronic device is, An electronic device further comprising a vapor chamber (700) for dissipating heat from the plurality of electrical elements transferred through the first heat transfer member.

13. In Paragraph 1, The above at least two regions are, A first region (510) covering first electric elements (310) having a first temperature range or a first density among the plurality of electric elements, and An electronic device comprising a second region (520) covering second electric elements (320) having a second temperature range different from the first temperature range or a second density different from the first density among the plurality of electric elements.

14. In a method for manufacturing the first heat transfer member (500), A first step (901) of heating a mold (800) having a shape corresponding to the first heat transfer member, which is divided into at least two regions to cover at least some of the plurality of electrical elements (300) disposed on a printed circuit board (240); A second step (902) of applying the heated mold to the base material (504) of the first heat transfer member formed of a flexible material; and A method for manufacturing a heat transfer member comprising a third step (903) of punching out the outer edge of a deformed first heat transfer member (505).

15. In Paragraph 14, A method for manufacturing a heat transfer member in which at least two regions are determined through at least one of the height range, temperature range, or density of some of the plurality of elements.

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