Camera module and electronic device including camera module

Abstract

According to an embodiment disclosed herein, a camera module may include a lens assembly that includes at least one lens aligned along an optical axis. The camera module may include a carrier that accommodates the lens assembly. The camera module may include a camera housing that accommodates the carrier. The camera module may include a first magnet disposed on the carrier. The camera module may include a first coil facing the first magnet providing a driving force to the carrier via an electromagnetic force acting between the first coil and the first magnet. The camera module may include a flexible circuit board that is disposed in the camera housing, connected to the first coil, and includes a plurality of first conductive pads. The camera module may include a magnetic plate that covers the plurality of first conductive pads, is coupled to the first conductive pads via solder applied to the plurality of first conductive pads, and faces the first magnet. The plurality of first conductive pads may each be located in a different corner region of the magnetic plate. Various other embodiments are also possible.

Description

Camera module and electronic device including the camera module

[0001] The various embodiments disclosed in this document relate to a camera module and an electronic device including a camera module.

[0002] Various electronic devices such as smartphones, tablet PCs, portable multimedia players (PMPs), personal digital assistants (PDAs), laptop personal computers, wristwatches, and wearable devices like head-mounted displays (HMDs) include cameras and can take images using the cameras.

[0003] As the number of users taking photos or videos using electronic devices increases, the performance of cameras included in these devices is also improving. For example, when capturing images using a camera included in an electronic device, it may be necessary to adjust the focus of the subject or correct for shaking (e.g., hand shake) that may occur during shooting in order to obtain a sharp image.

[0004] A camera module used in an electronic device may include an autofocus (AF) function that automatically adjusts the lens focus on a subject and / or an optical image stabilizer (OIS) function that corrects shake occurring in the camera module when shooting a subject. The AF function and the optical image stabilizer function of the camera module may be driven based on electromagnetic force using magnets and coils.

[0005] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0006] The camera module can perform an autofocus (AF) function that automatically adjusts the focus of the lens on a subject and / or an optical image stabilizer (OIS) function that corrects shake occurring in the camera module when shooting a subject. The camera module can perform the AF and OIS functions by moving the lens assembly and the carrier through an electromagnetic force acting between a magnet placed in a carrier that accommodates the lens assembly and a coil facing the magnet.

[0007] As the number of users taking photos or videos using electronic devices increases, the performance of cameras included in these devices is improving. As large-aperture lenses are required to enhance the performance of camera modules in electronic devices, the size and weight of the lens assembly may increase. Consequently, the size and weight of the carrier housing the lens assembly may also increase.

[0008] In such cases, the driving force required to move the lens assembly and carrier may increase when performing AF and / or optical image stabilizer (OIS) functions. For example, the current consumption of the coil required to drive the lens assembly and carrier may increase. Furthermore, there may be limits to increasing the driving force because limited power and component placement space must be considered within miniaturized electronic devices. Therefore, the camera module can provide additional driving force required to drive the lens assembly and carrier through a magnetic plate that is magnetized by an surrounding magnetic material. For example, the magnetic plate may be placed on a flexible substrate connected to the coil so as to face the magnet at a location adjacent to the coil. The lens assembly and carrier can move through the electromagnetic force acting between the magnet and the coil, and the electromagnetic force acting between the magnetic plate and the magnet.

[0009] Meanwhile, the magnetic plate can be fixed to a conductive pad formed on a flexible substrate through a soldering process. After the magnetic plate is placed on the solder paste applied to the conductive pad, it can be joined to the conductive pad via solder through a soldering process (e.g., a reflow process). However, the magnetic plate may tilt relative to the flexible substrate during the soldering process. In particular, if the curved portion of the magnetic plate is soldered to the conductive pad of the flexible substrate, the frequency of tilting relative to the flexible substrate during the soldering process may be high. The strength of the magnetic force acting between the magnetic plate and the magnet may change, which may affect the driving of the carrier.

[0010] In addition, the production cost of the electronic device may increase as separate inspection equipment is used to verify whether the plane of the magnetic plate is placed on the flexible substrate.

[0011] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0012] According to one embodiment of the present disclosure, a camera module may include a lens assembly comprising at least one lens aligned along an optical axis. The camera module may include a carrier that accommodates the lens assembly. The camera module may include a camera housing that accommodates the carrier. The camera module may include a first magnet disposed on the carrier. The camera module may include a first coil facing the first magnet and providing a driving force to the carrier through an electromagnetic force acting with the first magnet. The camera module may include a flexible substrate disposed on the camera housing and connected to the first coil, comprising a plurality of first conductive pads. The camera module may include a magnetic plate that covers the plurality of first conductive pads, is coupled to the first conductive pads through solder applied to the plurality of first conductive pads, and faces the first magnet. The plurality of first conductive pads may each be located at different corner regions of the magnetic plate.

[0013] According to one embodiment of the present disclosure, a camera module may include a lens assembly comprising at least one lens aligned along an optical axis. The camera module may include a carrier that accommodates the lens assembly. The camera module may include a camera housing that accommodates the carrier. The camera module may include a first magnet disposed on the carrier. The camera module may include a first coil facing the first magnet and providing a driving force to the carrier through an electromagnetic force acting with the first magnet. The camera module may include a flexible substrate disposed on the camera housing and connected to the first coil, comprising a plurality of first conductive pads. The camera module may include a magnetic plate that covers the plurality of first conductive pads, is coupled to the first conductive pads through solder applied to the plurality of first conductive pads, and faces the first magnet. The plurality of first conductive pads may be disposed in different corner regions of the magnetic plate between adjacent corner regions of the magnetic plate.

[0014] According to one embodiment of the present disclosure, a camera module may include a lens assembly comprising at least one lens aligned along an optical axis. The camera module may include a carrier that accommodates the lens assembly. The camera module may include a camera housing that accommodates the carrier. The camera module may include a first magnet disposed on the carrier. The camera module may include a first coil facing the first magnet and providing a driving force to the carrier through an electromagnetic force acting with the first magnet. The camera module may include a flexible substrate disposed on the camera housing and connected to the first coil, comprising a plurality of first conductive pads. The camera module may include a magnetic plate that covers the plurality of first conductive pads, is coupled to the first conductive pads through solder applied to the plurality of first conductive pads, and faces the first magnet. The plurality of first conductive pads may be disposed along the perimeter of the magnetic plate in the corner region of the magnetic plate.

[0015] According to various embodiments disclosed in this document, a structure of conductive pads can be proposed to prevent the magnetic plate from tilting relative to the flexible substrate during the process in which the planar or curved surface of the magnetic plate is soldered to the conductive pads of the flexible substrate. For example, the conductive pads may be located at different corner regions of a rectangular magnetic plate or at different corners of the magnetic plate when the magnetic plate is placed on the flexible substrate. Thus, tilting relative to the flexible substrate can be prevented or avoided as the magnetic plate is supported relative to the flexible substrate at least four points through the solder applied to the conductive pads.

[0016] In addition, since tilting of the magnetic plate is prevented even when the magnetic plate is placed on a flexible substrate regardless of whether it is flat or curved, additional inspection to verify whether the flat surface of the magnetic plate is placed on the flexible substrate may not be required. Therefore, the production cost of the electronic device may be reduced.

[0017] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs from the description below.

[0018] In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0019] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

[0020] FIG. 2a is a front perspective view of an electronic device according to one embodiment of the present disclosure.

[0021] FIG. 2b is a perspective view of the rear side of the electronic device of FIG. 2a according to one embodiment of the present disclosure.

[0022] FIG. 3 is a perspective view of a camera module according to one embodiment of the present disclosure.

[0023] FIG. 4a is an assembly diagram of a camera module according to one embodiment of the present disclosure.

[0024] FIG. 4b is an assembly diagram of a camera housing, carrier, magnet, and coil of the present disclosure.

[0025] FIG. 5 is a drawing of a coil of the present disclosure and a magnetic plate disposed inside the coil.

[0026] FIG. 6a is a drawing of a conductive pad joined to a magnetic plate and solder on a flexible substrate of the present disclosure.

[0027] Figure 6b is a drawing in which a magnetic plate is placed on the flexible substrate of Figure 6a.

[0028] FIG. 7 is a diagram illustrating the positional relationship of the magnetic plate, the first conductive pad, and the second conductive pad of the present disclosure.

[0029] FIG. 8a is a drawing in which a plane of a magnetic plate of the present disclosure is placed on a flexible substrate.

[0030] FIG. 8b is a drawing in which the curved surface of the magnetic plate of the present disclosure is placed on a flexible substrate.

[0031] FIG. 9a is a drawing of an embodiment in which a magnetic plate of the present disclosure is placed on a flexible substrate, and a conductive pad of the flexible substrate is located in a corner region of the magnetic plate.

[0032] FIG. 9b is a drawing of an embodiment in which a magnetic plate of the present disclosure is placed on a flexible substrate, and a conductive pad of the flexible substrate is positioned between adjacent corner regions of the magnetic plate.

[0033] FIG. 9c is a drawing of an embodiment in which a magnetic plate of the present disclosure is placed on a flexible substrate, and a conductive pad of the flexible substrate is located between the corner region of the magnetic plate and adjacent corner regions.

[0034] FIG. 9d is a drawing of an embodiment in which a magnetic plate of the present disclosure is placed on a flexible substrate, and a conductive pad of the flexible substrate is located at the corner of the magnetic plate along the perimeter of the magnetic plate.

[0035] FIG. 10a is a drawing of an embodiment in which a magnetic plate of the present disclosure is disposed between a plurality of coils.

[0036] FIG. 10b is a diagram illustrating the positional relationship between a conductive pad coupled to a magnetic plate of the present disclosure and a coil pad coupled to a coil.

[0037] FIG. 11 is a drawing of an embodiment in which a coil is disposed between a plurality of magnetic plates according to one embodiment of the present disclosure.

[0038] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to one embodiment. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0039] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), for example, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0040] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence is performed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0041] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0042] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0043] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0044] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0045] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0046] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0047] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0048] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0049] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0050] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0051] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0052] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0053] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0054] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0055] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0056] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0057] According to one embodiment, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0058] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0059] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0060] FIG. 2a is a front perspective view of an electronic device according to one embodiment of the present disclosure. FIG. 2b is a rear perspective view of the electronic device of FIG. 2a according to one embodiment of the present disclosure.

[0061] Referring to FIGS. 2a and 2b, an electronic device (200) according to one embodiment may include a housing (210) comprising a first surface (or front) (210A), a second surface (or rear) (210B), and a side (210C) surrounding the space between the first surface (210A) and the second surface (210B). In one embodiment (not shown), the housing may refer to a structure forming some of the first surface (210A), the second surface (210B), and the side (210C) of FIG. 2a. According to one embodiment, the first surface (210A) may be formed by a front plate (202) (e.g., a glass plate or a polymer plate having various coating layers) in which at least a portion is substantially transparent. The second surface (210B) may be formed by a rear plate (211) that is substantially opaque. The rear plate (211) may be formed, for example, by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side (210C) may be formed by a side bezel structure (218) (or "side member") comprising metal and / or polymer, which is combined with the front plate (202) and the rear plate (211). In some embodiments, the rear plate (211) and the side bezel structure (218) may be formed integrally and may comprise the same material (e.g., a metallic material such as aluminum).

[0062] In the illustrated embodiment, the front plate (202) may include a first region (210D) that curves seamlessly from the first surface (210A) toward the rear plate at both ends of the long edge of the front plate. In the illustrated embodiment (see FIG. 2b), the rear plate (211) may include a second region (210E) that curves seamlessly from the second surface (210B) toward the front plate at both ends of the long edge. In some embodiments, the front plate (202) or the rear plate (211) may include only one of the first region (210D) or the second region (210E). In some embodiments, the front plate (202) may not include the first region and the second region, but may include only a flat plane positioned parallel to the second surface (210B). In the above embodiments, when viewed from the side of the electronic device, the side bezel structure (218) may have a first thickness (or width) on the side that does not include the first region (210D) or the second region (210E) as above, and may have a second thickness that is thinner than the first thickness on the side that includes the first region (210D) or the second region (210E).

[0063] According to one embodiment, the electronic device (200) may include at least one of a display (201), an input device (203), an audio output device (207, 214), a sensor module (204, 219), a camera module (205, 212), a key input device (217), an indicator (not shown), and a connector (208). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., a key input device (217), or an indicator) or additionally include other components.

[0064] The display (201) may be visually exposed, for example, through a significant portion of the front plate (202). In some embodiments, at least a portion of the display (201) may be exposed through the front plate (202) forming the first surface (210A) and the first area (210D) of the side (210C). The display (201) may be combined with or placed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer that detects a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor module (204, 219) and / or at least a portion of the key input device (217) may be placed in the first area (210D) and / or the second area (210E).

[0065] The input device (203) may include a microphone (203). In some embodiments, the input device (203) may include a plurality of microphones (203) arranged to detect the direction of sound. The sound output device (207, 214) may include speakers (207, 214). The speakers (207, 214) may include an external speaker (207) and a call receiver (214). In some embodiments, the microphone (203), speakers (207, 214), and connector (208) may be placed in at least part of the internal space of the electronic device (200) and may be exposed to the external environment through at least one hole formed in the housing (210). In some embodiments, the hole formed in the housing (210) may be used in common for the microphone (203) and the speakers (207, 214). In some embodiments, the acoustic output device (207, 214) may include a speaker (e.g., a piezo speaker) that is operated with the hole formed in the housing (210) excluded.

[0066] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., proximity sensor) and / or a second sensor module (not shown) (e.g., fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) (e.g., HRM sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on the first surface (210A) of the housing (210) (e.g., home key button), a portion of the second surface (210B), and / or below the display (201). The electronic device (200) may further include at least one of the unillustrated sensor modules, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, a proximity sensor, or an illuminance sensor.

[0067] The camera module (205, 212) may include a first camera module (205) disposed on a first surface (210A) of the electronic device (200), a second camera module (212) disposed on a second surface (210B), and / or a flash (213). The camera modules (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light-emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide-angle lenses, ultra-wide-angle lenses, or telephoto lenses) and image sensors may be disposed on one surface of the electronic device (200).

[0068] A key input device (217) may be placed on the side (210C) of the housing (210). In one embodiment, the electronic device (200) may not include some or all of the aforementioned key input devices (217), and the key input device (217) that is not included may be implemented in other forms, such as soft keys, on the display (201). In one embodiment, the key input device (217) may be implemented using a pressure sensor included in the display (201).

[0069] An indicator may be disposed, for example, on a first surface (210A) of a housing (210). The indicator may provide status information of an electronic device (200), for example, in the form of light (e.g., a light-emitting element). In one embodiment, the light-emitting element may provide a light source that corresponds to the operation of a camera module (205), for example. The indicator may include, for example, an LED, an IR LED, and / or a xenon lamp.

[0070] The connector hole (208) may include a first connector hole (208) capable of receiving a connector (e.g., a USB (universal serial bus) connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (or earphone jack) (not shown) capable of receiving a connector for transmitting and receiving audio signals with an external electronic device.

[0071] Some camera modules (205) among the camera modules (205, 212), some sensor modules (204) among the sensor modules (204, 219), or an indicator may be positioned to be visually exposed through the display (201). For example, the camera module (205), sensor module (204), or indicator may be positioned to come into contact with the external environment through an opening or a transparent area perforated to the front plate (202) of the display (201) within the internal space of the electronic device (200). According to one embodiment, the area facing the display (201) and the camera module (205) may be formed as a transparent area having a certain transmittance as part of the area for displaying content. According to one embodiment, the transparent area may be formed to have a transmittance in the range of about 5% to about 20%. These transparent areas may include an area that overlaps with the effective area (e.g., field of view area) of the camera module (205) through which light passes to form an image with an image sensor to generate an image. For example, the transparent area of ​​the display (201) may include an area with a lower pixel density than the surrounding area. For example, the transparent area may replace the opening. For example, the camera module (205) may include an under-display camera (UDC). In one embodiment, some sensor modules (204) may be positioned to perform their functions without being visually exposed through the front plate (202) within the internal space of the electronic device. For example, in this case, the area of ​​the display (201) facing the sensor modules may not require a perforated opening.

[0072] According to one embodiment, the electronic device (200) has a bar-type or plate-type appearance, but the present invention is not limited thereto. For example, the illustrated electronic device (200) may be part of a foldable electronic device, a slideable electronic device, a stretchable electronic device, and / or a rollable electronic device. The terms "foldable electronic device," "slidable electronic device," "stretchable electronic device," and / or "rollable electronic device" may mean an electronic device in which the display is capable of bending deformation so that at least a portion can be folded, wound or rolled, at least a portion of the area can be expanded, and / or can be housed inside a housing (e.g., the housing (210) of FIG. 2a and FIG. 2b). Foldable electronic devices, slideable electronic devices, stretchable electronic devices and / or rollable electronic devices can be used by expanding the screen display area by unfolding the display or by exposing a larger area of ​​the display to the outside, depending on the user's needs.

[0073] According to one embodiment, the electronic device (200) may include a plurality of camera modules (212), each having different attributes (e.g., angle of view) or functions. In this case, for example, the plurality of camera modules (212) may include at least one of a wide-angle camera, a telephoto camera, or an IR camera (time of flight camera, structured light camera). For example, a plurality of camera modules may be configured, each including a lens having a different angle of view, and the electronic device may be controlled to change the angle of view by varying according to the user's selection. According to one embodiment, at least one of the plurality of camera modules (180) may be a front camera and at least another may be a rear camera.

[0074] FIG. 3 is a perspective view of a camera module according to one embodiment of the present disclosure. FIG. 4a is an assembly view of a camera module according to one embodiment of the present disclosure. FIG. 4b is an assembly view of a camera housing, a carrier, a magnet, and a coil according to the present disclosure.

[0075] The following camera module (300) (e.g., camera module (180) of FIG. 1, camera module (205, 212) of FIG. 2a) may be a camera that captures images and is included in various types of electronic devices (200) (e.g., electronic device (101) of FIG. 1). For example, the camera module (300) may be a camera module included in a portable communication device (e.g., smartphone, bar type, foldable type, rollable type), computer device, or tablet PC. In one embodiment, when the camera module (300) is included in a portable communication device, it may be a rear camera located opposite the display module of the portable communication device (e.g., display module (160) of FIG. 1).

[0076] According to one embodiment of the present disclosure, as illustrated in FIG. 3, FIG. 4a and FIG. 4b, a camera module (300) (e.g., camera module (180) of FIG. 2) may include a lens assembly (310), a shield can (320), a carrier (330), a camera housing (350), a substrate (370), an image sensor (371), an AF ball (b), a flexible substrate (400) connected to a coil (410), a magnet (M) facing the coil (410), and / or a magnetic plate (500) facing the magnet (M) (e.g., a plate, a magnetic member). At least one of the above configurations may be omitted or at least one configuration may be added.

[0077] According to one embodiment, as illustrated in FIGS. 3 and FIGS. 4a, the lens assembly (310) may include at least one lens (312) and a lens barrel (311) (e.g., a lens barrel) in which the lens (312) is placed. In one embodiment, the lens barrel (311) may be a housing that accommodates a plurality of lenses (312). In one embodiment, the plurality of lenses (312) may be arranged inside the lens barrel (311) along the optical axis (OA) of the lenses (e.g., the optical axis (OA) of FIG. 3). In one embodiment, the lens assembly (310) may be accommodated in a carrier (330) placed in a camera housing (350). In one embodiment, the carrier (330) may include an opening (331) for accommodating the lens assembly (310).

[0078] According to one embodiment, as illustrated in FIGS. 3, 4a and 4b, the shield can (320) may be located outside the camera housing (350) and may be coupled to or fitted into the camera housing (350). According to one embodiment, the shield can (320) may be located at the outermost edge of the camera module (300) and may wrap around the camera housing (350). In one embodiment, the shield can (320) may block or reduce electromagnetic waves generated from the outside, thereby reducing the occurrence of malfunctions of the camera module (300).

[0079] According to one embodiment, as illustrated in FIGS. 3 and FIGS. 4a, the carrier (330) can be accommodated inside the camera housing (350). In one embodiment, the camera housing (350) may have an open top surface to allow the carrier (330) to be inserted, thereby providing a space for the carrier (330) to be seated. In one embodiment, the camera housing (350) may prevent and protect the carrier (330) from being dislodged by movement.

[0080] According to one embodiment, as illustrated in FIG. 4b, the camera housing (350) may include a support portion (351) that supports the carrier (330) and a side portion (352) that extends in a direction substantially perpendicular to the support portion (351) (e.g., the +Z direction in FIG. 4b). As described below, in one embodiment, a flexible substrate (400) connected to a coil (410) may be disposed on the side portion (352) of the camera housing (350). In one embodiment, an opening (353) may be formed on the side portion (352) of the camera housing (350) that faces the magnet support portion (332) of the carrier (330) on which a magnet (M) is disposed. The coil (410) may face the magnet (M) disposed on the magnet support portion (332) of the carrier (330) through the opening (353) formed in the side portion (352).

[0081] In one embodiment, the flexible substrate (400) may be electrically connected to a main substrate on which the processor (120) of the substrate (370) and / or electronic device (200) is placed. Thus, the flexible substrate (400) can supply current to the coil (410) under the control of the processor (120).

[0082] According to one embodiment, the camera module (300) can adjust the focus by moving the carrier (330) under the control of the processor (120). In one embodiment, the carrier (330) can be moved in the direction of the optical axis (OA) of the lenses (312) relative to the camera housing (350) via an AF actuator (e.g., the Z-axis direction in FIG. 4a). In one embodiment, referring to FIG. 4b, the AF actuator may include a coil (410) and a magnet (M). In one embodiment, the magnet (M) may be placed on a magnet support (332) of the carrier (330) facing the side portion (352) of the camera housing (350). In one embodiment, a flexible substrate (400) may be placed on the side portion (352) of the camera housing (350) from the outside of the camera housing (350). In one embodiment, the coil (410) is placed on a flexible substrate (400) and can face a magnet (M) placed on a magnet support (332) of a carrier (330) through an opening (353) formed on a side portion (352). The carrier (330) can perform an auto focus (AF) function by moving in the direction of the optical axis (OA) with respect to the camera housing (350) and / or image sensor (371) through the electromagnetic force acting between the coil (410) and the magnet (M) to automatically adjust the focus of the lens (312) on the subject. For example, the processor (120) can control the current flowing through the coil (410) via a driving circuit (e.g., driver IC) (not shown) electrically connected to the flexible substrate (400) of the camera module (300) to induce an electromagnetic phenomenon between the magnet (M) and the coil (410) and move the carrier (330) in the direction of the optical axis (OA) relative to the camera housing (350) and the image sensor (371). Thus, the focus of the lenses (312) relative to the subject can be adjusted according to the movement of the lens assembly (310). The above description is based on the premise that the magnet (M) is placed on the carrier (330) and the coil (410) is placed on the camera housing (350), but it is not limited thereto.In one embodiment, the magnet (M) is placed on the side portion (352) of the camera housing (350), and the coil (410) is placed on the carrier (330) so as to face the magnet (M). For convenience of explanation, the following description will be based on the premise that the magnet (M) is placed on the carrier (330) and the coil (410) is placed on the camera housing (350).

[0083] According to one embodiment, as illustrated in FIG. 4a, the camera module (300) may include a substrate (370) on which an image sensor (371) is placed. In one embodiment, the image sensor (371) can acquire an image corresponding to the subject by detecting light emitted or reflected from the subject of the lens assembly (310) and transmitted through the lenses (312), and converting the light into an electrical signal.

[0084] In one embodiment, the substrate (370) connected to the image sensor (371) may be electrically connected to the main substrate on which the processor (120) is placed via a connector (3701). In one embodiment, the main substrate (not shown) may be a printed circuit board placed inside the electronic device (200).

[0085] The image signal processor can perform one or more image processing operations on an image acquired through an image sensor (371) or an image stored in memory (130). The above one or more image processing methods may include, for example, depth map generation, 3D modeling, panorama generation, feature point extraction, image synthesis, or image compensation (e.g., noise reduction, resolution adjustment, brightness adjustment, blurring, sharpening, or softing). Additionally or generally, the image signal processor may perform control (e.g., exposure time control, or readout timing control, etc.) over at least one of the components included in the camera module (300) (e.g., image sensor (371)). The image processed by the image signal processor may be stored back in memory (130) for further processing or provided to an external component of the camera module (300) (e.g., memory (130), display module (160, 201), electronic device (102), electronic device (104), or server (108)). According to one embodiment, the image signal processor may be composed of at least part of the processor (120) or independently of the processor (120). It may be configured as a separate processor that operates. If the image signal processor is configured as a separate processor from the processor (120), at least one image processed by the image signal processor may be displayed through the display module (160, 201) as is or after additional image processing by the processor (120).

[0086] In one embodiment, referring to FIG. 4b, the coil (410) and magnet (M) of the AF actuator may be positioned between the first AF yoke (361) (e.g., the first yoke) and the second AF yoke (362) (e.g., the second yoke). For example, the first AF yoke (361), magnet (M), coil (410), and second AF yoke (362) may be positioned sequentially. In one embodiment, the first AF yoke (361) may be positioned on the magnet support (332) of the carrier (330). The magnet (M) may be positioned on the first AF yoke (361) on the magnet support (332). In one embodiment, the second AF yoke (362) may be disposed on the side portion (332) of the camera housing (350) and / or on the flexible substrate (400) to cover an area corresponding to the portion where the coil (410) is disposed on the flexible substrate (400).

[0087] In one embodiment, the first AF yoke (361) and the second AF yoke (362) can prevent magnetic flux of the magnet (M) from leaking. In one embodiment, the first AF yoke (361) and the second AF yoke (362) include a metal material and can allow the carrier (330) to maintain its position in the camera housing (350) through the magnet (M) and magnetic force. For example, as the magnet (M) and the coil (410) are placed between the first AF yoke (361) and the second AF yoke (362), electromagnetic force can be concentrated between the magnet (M) and the coil (410).

[0088] In one embodiment, the camera module (300) may include an AF position detection sensor (390) that detects the displacement and position of the carrier (330). In one embodiment, the AF position detection sensor (390) described later may be a Hall sensor. In one embodiment, referring to FIG. 5 described later, the AF position detection sensor (390) may be placed inside the coil (410) (e.g., a hole, an opening (411), or a center) and connected to a flexible substrate (400). The processor (120) may control the coil (410) based on the position information of the carrier (330) detected through the AF position detection sensor (390). For example, the processor (120) may control the strength of the electromagnetic force generated in the coil (410) by controlling the amount of current flowing through the coil (410). Thus, the relative position between the magnet (M) and the coil (410) may be controlled.

[0089] In one embodiment, referring to FIG. 4b, at least one AF ball (b) may be disposed between the carrier (330) and the camera housing (350). In one embodiment, the AF ball (b) may guide the movement of the carrier (330) when the carrier (330) is moved relative to the camera housing (350) through the electromagnetic force between the magnet (M) and the coil (410). For example, the AF ball (b) may guide the movement of the carrier (330) relative to the camera housing (350) in the direction of the optical axis (OA). In one embodiment, referring to FIG. 4b, the AF ball (b) may be disposed in a guide groove (not shown) formed by substantially extending in the direction of the optical axis (OA) from at least one of the camera housing (350) and the carrier (330). In one embodiment, the guide grooves formed in the camera housing (350) and the carrier (330), respectively, may be formed on both sides of the magnet support (332) with respect to the magnet (M).

[0090] According to one embodiment, as illustrated in FIGS. 3, 4a, and 4b, a camera module (300) can be fixed within an electronic device (200) through adhesive members (P1, P2). For example, a lens assembly (310) of the camera module (300) can be fixed inside a housing (210) of the electronic device (200) through a first adhesive member (P1). In one embodiment, a flexible substrate (400) can be fixed inside a housing (210) through a second adhesive member (P2).

[0091] FIG. 5 is a drawing of a coil of the present disclosure and a magnetic plate disposed inside the coil.

[0092] According to one embodiment, a coil (410) disposed on a flexible substrate (400) may be wound so as to form an opening (411) in the center. In one embodiment, a magnetic plate (500) may be disposed in the opening (411) of the coil (410). In one embodiment, the magnetic plate (500) may be disposed facing a magnet (M) disposed on a carrier (330). In one embodiment, the magnetic plate (500) may provide a driving force to the carrier (330) on which the magnet (M) is disposed through a magnetic force acting with the magnet (M). In one embodiment, the magnetic plate (500) may be formed of a material that is magnetized through a surrounding magnetic body (e.g., magnet (M), coil (410)) so that a magnetic force can act with the magnet (M).

[0093] In one embodiment, as the size of the lens assembly (310) increases and / or the size of the carrier (330) that accommodates the lens assembly (310) increases, the strength of the driving force for driving the carrier (330) may increase. In this case, if the carrier (330) is driven in the direction of the optical axis (OA) (e.g., optical axis (OA) in FIG. 3) solely by the electromagnetic force acting between the magnet (M) and the coil (410), the power consumption generated in the camera module (300) may increase. Accordingly, as the camera module (300) includes a magnetic plate (500), the carrier (330) can move in the direction of the optical axis (OA) (e.g., optical axis (OA) in FIG. 3) with respect to the camera housing (350) and / or image sensor (371) through the electromagnetic force acting between the coil (410) and the magnet (M) and the magnetic force acting between the magnet (M) and the magnetic plate (500). In some embodiments, the magnetic plate (500) can limit the movement of the carrier (330) on which the magnet (M) is placed through a magnetic force acting with the magnet (M). For example, the magnetic plate (500) can limit the movement of the carrier (330) through a magnetic force acting with the magnet (M) so that the carrier (330) moves within a designed range when the carrier (330) is driven by the electromagnetic force between the coil (410) and the magnet (M).

[0094] In one embodiment, the magnetic plate (500) may include iron, nickel, and cobalt. In addition, the magnetic plate (500) may include a material having the property of being magnetized through a magnetic field formed by a surrounding magnetic material (e.g., magnet (M), coil (410)).

[0095] In a comparative example, the magnetic plate (500) can be bonded to conductive pads formed of a conductive material on a flexible substrate (400). For example, the magnetic plate (500) can be fixed to the flexible substrate (400) by soldering to solder applied to the conductive pads. The magnetic plate (500) can be soldered to solder (e.g., solder paste) applied to a plurality of conductive pads formed on the flexible substrate (400). In one embodiment, the solder can be solidified through a reflow process to bond the conductive pads and the magnetic plate (500) together. In one embodiment, the reflow process may be a process for pre-applying solder to the conductive pads of the flexible substrate (400) and applying an external heat source to solder the conductive pads and the magnetic plate (500). The soldering process is not limited to reflow soldering, and various methods such as flow soldering may be used in addition to reflow soldering. In a comparative embodiment, the magnetic plate (500) may be tilted relative to the flexible substrate (400) during the process of soldering the conductive pads of the magnetic plate (500) and the flexible substrate (400). For example, in the reflow process, one side of the magnetic plate (500) facing the flexible substrate (400) may be tilted relative to one side of the flexible substrate (400). In this case, the strength of the magnetic force acting between the magnetic plate (500) and the magnet (M) may change, which may affect the driving of the carrier (330). For example, the strength of the magnetic force acting between the magnetic plate (500) and the magnet (M) may decrease, thereby reducing the driving force applied to the carrier (330). In one embodiment, the strength of the magnetic force acting between the magnetic plate (500) and the magnet (M) is increased so that the driving force applied to the carrier (330) can be increased beyond what is necessary.In one embodiment, the strength of the electromagnetic force acting between the magnet (M) and the coil (410) and the magnetic force acting between the magnet (M) and the magnetic plate (500) become equal, so that the driving of the carrier (330) in the direction of the optical axis (OA) can be stopped.

[0096] In a manufacturing process (e.g., a press process), one side of the magnetic plate (500) may be formed as a flat surface (e.g., the flat surface (501) of FIG. 8a) and the opposite side of the flat surface may be formed as a curved surface (e.g., the curved surface (502) of FIG. 8a). In a comparative embodiment, when the curved surface (502) of the magnetic plate (500) is fixed to the conductive pad of the flexible substrate (400) via solder, the frequency of tilting relative to the flexible substrate (400) may be relatively higher than when the flat surface (501) of the magnetic plate (500) is fixed to the conductive pad of the flexible substrate (400) via solder. Therefore, the production cost of the camera module (300) and the electronic device (200) may increase as separate inspection equipment is required to verify whether the flat surface (501) of the magnetic plate (500) is placed on the flexible substrate (400).

[0097] According to one embodiment of the present disclosure, a structure of conductive pads can be proposed to prevent the magnetic plate (500) from tilting relative to the flexible substrate (400) during the process in which the flat surface (501) or curved surface (502) of the magnetic plate (500) is soldered to the conductive pads of the flexible substrate (400). For example, as shown in FIGS. 9a to 9d to be described later, the conductive pads (401, 403, 404) of the flexible substrate (400) may be located at different corner regions of the magnetic plate (500) or at different edges of the magnetic plate (500) when the magnetic plate (500) is placed on the flexible substrate (400). Accordingly, tilting of the flexible substrate (400) can be prevented or avoided as the magnetic plate (500) is supported at least four points (or four regions) with respect to the flexible substrate (400) through solder applied to the conductive pads (401, 403, 404).

[0098] Additionally, even if the magnetic plate (500) is placed on the flexible substrate (400) without distinction between a flat surface (501) and a curved surface (502), it is supported at least four points through conductive pads (e.g., the first conductive pads (401) in FIG. 7, the third conductive pads (403) in FIG. 9b) so that tilting of the flexible substrate (400) is prevented, so additional inspection to check whether the flat surface (501) of the magnetic plate (500) is placed on the flexible substrate (400) may not be required. Accordingly, the production cost of the camera module (300) and the electronic device (200) can be reduced.

[0099] FIG. 6a is a drawing of a conductive pad joined to a magnetic plate via solder on a flexible substrate of the present disclosure. FIG. 6b is a drawing of a magnetic plate disposed on the flexible substrate of FIG. 6a. FIG. 7 is a drawing illustrating the positional relationship between a magnetic plate, a first conductive pad, and a second conductive pad of the present disclosure.

[0100] According to one embodiment, as illustrated in FIGS. 6a, 6b and 7, a plurality of first conductive pads (401) and second conductive pads (402) of a flexible substrate (400) may be included. In one embodiment, the first conductive pads (401) may be disposed on the outside of the second conductive pads (402).

[0101] In one embodiment, referring to FIG. 6a, a plurality of first conductive pads (401) and a second conductive pad (402) may be located within a pad region (A) of a flexible substrate (400). In one embodiment, the pad region (A) may be a region of the flexible substrate (400) where a plurality of first conductive pads (401) and a second conductive pad (402) are placed, and where a magnetic plate (500) is placed. In one embodiment, the pad region (A), the first conductive pads (401), and the second conductive pad (402) may be located within an opening (411) of a coil (410). Accordingly, the magnetic plate (500) may be placed in the pad region (A) and located within an opening (411) of the coil (410).

[0102] According to one embodiment, a magnetic plate (500), first conductive pads (401), and a second conductive pad (402) may be disposed in the opening (411) of the coil (410). Referring to FIGS. 6A and 6B, a coil pad (406) connecting the coil (410) and the flexible substrate (400) may be disposed outside of the magnetic plate (500), the first conductive pads (401), and the second conductive pad (402). For example, the coil pad (406) may be disposed in the +Y direction of FIG. 6A with respect to the magnetic plate (500), the first conductive pads (401), and the second conductive pad (402).

[0103] In one embodiment, referring to FIGS. 6b and FIGS. 7, the magnetic plate (500) may be positioned in a pad area (A) on a flexible substrate (400) to cover a plurality of first conductive pads (401) and second conductive pads (402). In one embodiment, referring to FIGS. 6b and FIGS. 7, when viewed from a direction perpendicular to the magnetic plate (500) (e.g., the X-axis direction in FIG. 6b), the first conductive pads (401) and second conductive pads (402) may be covered by the magnetic plate (500) and not exposed to the outside. In a comparative embodiment, when viewed from a direction perpendicular to the magnetic plate (500) (e.g., the X-axis direction in FIG. 6b), the conductive pads of the flexible substrate (400) may be formed to be exposed to the outside of the magnetic plate (500). In this case, the soldering bonding area between the magnetic plate (500) and the conductive pads is increased, so that the magnetic plate (500) can be tilted relative to the flexible substrate (400). According to one embodiment of the present disclosure, the first conductive pads (401) and the second conductive pad (402) may be located inside the magnetic plate (500) so that the soldering bonding area between the magnetic plate (500) and the conductive pads (401, 402) can be limited to a certain area. Accordingly, tilting of the magnetic plate (500) relative to the flexible substrate (400) can be prevented or reduced during the soldering process.

[0104] In one embodiment, referring to FIGS. 6a, 6b, and 7, a plurality of first conductive pads (401) may be formed on a flexible substrate (400) such that they are each located in a corner region of a rectangular magnetic plate (500). The corner region of the magnetic plate (500) may be an area adjacent to a corner (e.g., a vertex) formed by the meeting of adjacent corners among the corners constituting the edge of the magnetic plate (500). For example, the rectangular magnetic plate (500) may include four corners constituting the edge and four corners formed through adjacent corners.

[0105] In one embodiment, referring to FIGS. 6a and 6b, a second conductive pad (402) may be formed on a flexible substrate (400) so as to be located at the center of a magnetic plate (500). In one embodiment, the magnetic plate (500) may be disposed on a flexible substrate (400) such that a corner area is located at the first conductive pads (401) and a center is located at the second conductive pad (402).

[0106] According to one embodiment, the first conductive pads (401) may be formed to be smaller in size than the second conductive pad (402) which is positioned at the center of the magnetic plate (500) so as to be located in the corner region of the magnetic plate (500) when the magnetic plate (500) is placed on the flexible substrate (400).

[0107] In one embodiment, referring to FIG. 6a, a plurality of first conductive pads (401) may include a first-1 conductive pad (4011), a first-2 conductive pad (4012), a first-3 conductive pad (4013), and a first-4 conductive pad (4014). In one embodiment, a magnetic plate (500) may be disposed in a pad area (A) of a flexible substrate (400) such that a corner area corresponds to the first conductive pad (4011), the first-2 conductive pad (4012), the first-3 conductive pad (4013), and the first-4 conductive pad (4014).

[0108] In one embodiment, referring to FIG. 6a, the first-2 conductive pad (4012) may be positioned in a first direction (e.g., -Y in FIG. 6a) relative to the first-1 conductive pad (4011). In one embodiment, the first-3 conductive pad (4013) may be positioned in a second direction (e.g., -Z direction in FIG. 6a) perpendicular to the first direction relative to the first-2 conductive pad (4012). In one embodiment, the first-4 conductive pad (4014) may be positioned in a third direction (e.g., +Y direction in FIG. 6a) opposite to the first direction relative to the first-3 conductive pad (4013).

[0109] In one embodiment, the gap between the first-1 conductive pad (4011) and the first-2 conductive pad (4012) and / or the gap between the first-3 conductive pad (4013) and the first-4 conductive pad (4014) may be formed as a first gap (e.g., the first gap (L1) in FIG. 7) that is shorter than the length direction of the magnetic plate (500) (e.g., the Y-axis direction in FIG. 6b). In one embodiment, the gap between the first-2 conductive pad (4012) and the first-3 conductive pad (4013) and / or the gap between the first-1 conductive pad (4011) and the first-4 conductive pad (4014) may be formed as a second gap (e.g., the second gap (L2) in FIG. 7) that is shorter than the width direction of the magnetic plate (500) (e.g., the Z-axis direction in FIG. 6b). Accordingly, when a magnetic plate (500) is placed in the pad area (A) of the flexible substrate (400), the plurality of first conductive pads (401) and second conductive pads (402) may be covered by the magnetic plate (500) and may not be exposed to the outside of the magnetic plate (500).

[0110] According to one embodiment of the present disclosure, as illustrated in FIGS. 6a, 6b and 7, a magnetic plate (500) may be disposed in a pad area (A) of a flexible substrate (400) such that first conductive pads (401) are located in a corner area and a second conductive pad (402) is located in a center. In one embodiment, solder applied to the first conductive pads (401) may be soldered to the corner area of ​​the magnetic plate (500). In this case, the solder may support the corner area of ​​the magnetic plate (500) during the soldering process through the solder applied to the first conductive pads (401) of the flexible substrate (400). During the soldering process, tilting of the magnetic plate (500) relative to the flexible substrate (400) may be prevented or mitigated as the corner area is supported by the solder.

[0111] According to one embodiment of the present disclosure, the solder applied to the second conductive pad (402) can be soldered to the center of the magnetic plate (500). The solder applied to the second conductive pad (402) can bind the position of the magnetic plate (500) with respect to the flexible substrate (400) in the Y-axis direction and / or Z-axis direction of FIG. 6b during the soldering process between the second conductive pad (402) and the magnetic plate (500).

[0112] FIG. 8a is a drawing in which a flat surface of a magnetic plate of the present disclosure is placed on a flexible substrate. FIG. 8b is a drawing in which a curved surface of a magnetic plate of the present disclosure is placed on a flexible substrate.

[0113] According to one embodiment, as illustrated in FIG. 8a, the magnetic plate (500) may have a flat surface (501) placed on the pad area (A) of the flexible substrate (400). In one embodiment, referring to FIG. 8b, the magnetic plate (500) may have a curved surface (502) placed on the pad area (A) of the flexible substrate (400). In a comparative embodiment, the conductive pad of the flexible substrate (400) may not be formed to be located in the corner area of ​​the magnetic plate (500). In this case, the magnetic plate (500) may be tilted relative to the flexible substrate (400) during the soldering process between the conductive pad and the magnetic plate (500) when the curved surface (502) is placed on the pad area (A) of the flexible substrate (400). According to one embodiment of the present disclosure, a magnetic plate (500) may be placed on a flexible substrate (400) such that first conductive pads (401) are positioned in a corner area. The corner area of ​​the magnetic plate (500) may be supported through solder applied to the first conductive pads (401). For example, the magnetic plate (500) may be supported against the flexible substrate (400) at least four points (or four areas) through solder. Tilting of the flexible substrate (400) may be prevented or mitigated as the corner area of ​​the magnetic plate (500) is supported through solder during the soldering process, not only when a flat surface (501) is placed in the pad area (A) of the flexible substrate (400), but also when a curved surface (502) is placed in the pad area (A) of the flexible substrate (400).

[0114] FIG. 9a is a drawing of an embodiment in which a magnetic plate of the present disclosure is placed on a flexible substrate, and a conductive pad of the flexible substrate is located in a corner region of the magnetic plate.

[0115] In the following description, the second conductive pad (402) in the flexible substrate (400) described through FIGS. 6a to 8b may be omitted. Descriptions that overlap with the first conductive pads (401) in the above description will be omitted.

[0116] According to one embodiment, the magnetic plate (500) may be placed in the pad area (A) of the flexible substrate (400) such that the first conductive pads (401) are located in the corner area. In one embodiment, when the magnetic plate (500) is placed on the flexible substrate (400), the first conductive pads (401) may be covered by the magnetic plate (500) and not exposed to the outside of the magnetic plate (500) when viewed from a direction perpendicular to the magnetic plate (500). During the process of soldering the magnetic plate (500) through the solder applied to the first conductive pads (401) of the flexible substrate (400), the solder may support the corner area of ​​the magnetic plate (500). As the magnetic plate (500) is supported at least four points (or four regions) with respect to the flexible substrate (400) through soldering, tilting of the flexible substrate (400) during the soldering process can be prevented or mitigated.

[0117] FIG. 9b is a drawing of an embodiment in which a magnetic plate of the present disclosure is placed on a flexible substrate, and a conductive pad of the flexible substrate is positioned between adjacent corner regions of the magnetic plate.

[0118] In the following description, the second conductive pad (402) may be omitted from the flexible substrate (400) described through FIGS. 6a to 8b.

[0119] The following description may be an embodiment in which, when the magnetic plate (500) is placed on a flexible substrate (400), the first conductive pads (401) are positioned adjacent to the corners (e.g., edges) of the magnetic plate (500) rather than the corner regions of the magnetic plate (500). For example, the first conductive pads (401 (e.g., first-1 conductive pad (4011), first-2 conductive pad (4012), first-3 conductive pad (4013), first-4 conductive pad (4014)) may be positioned adjacent to the corners between the corner regions of the magnetic plate (500).

[0120] According to one embodiment, as illustrated in FIG. 9b, the first conductive pads (401) may be located at different corner regions (e.g., edges) of the magnetic plate (500) when the magnetic plate (500) is placed on the flexible substrate (400). The corner regions may be areas adjacent to the corners that constitute the edges of the magnetic plate (500). In one embodiment, the magnetic plate (500) may be supported at four points (or four regions) through solder during the soldering process through the solder applied to the first conductive pads (401) of the flexible substrate (400). As the magnetic plate (500) is supported at different corner regions through solder, tilting of the flexible substrate (400) may be prevented or mitigated during the soldering process.

[0121] FIG. 9c is a drawing of an embodiment in which a magnetic plate of the present disclosure is placed on a flexible substrate, and a conductive pad of the flexible substrate is located between the corner region of the magnetic plate and adjacent corner regions.

[0122] In the following description, the second conductive pad (402) may be omitted from the flexible substrate (400) described through FIGS. 6a to 8b.

[0123] In the following example, when the magnetic plate (500) is placed on a flexible substrate (400), the first conductive pads (401) of FIG. 9a are located in different corner regions of the magnetic plate (500), and the third conductive pads (403) (e.g., the first conductive pads (401) of FIG. 9b) are located in different corner regions of the magnetic plate (500).

[0124] According to one embodiment, as illustrated in FIG. 9c, first conductive pads (401) (e.g., first-1 conductive pad (4011), first-2 conductive pad (4012), first-3 conductive pad (4013), first-4 conductive pad (4014)) may be located in different corner regions of the magnetic plate (500) when the magnetic plate (500) is placed on the flexible substrate (400). Third conductive pads (403) (e.g., third-1 conductive pad (4031), third-2 conductive pad (4032), third-3 conductive pad (4033), third-4 conductive pad (4034)) may be located in different corner regions of the magnetic plate (500) when the magnetic plate (500) is placed on the flexible substrate (400). For example, the third conductive pads (403) may each be located between adjacent first conductive pads (401). Accordingly, as the first conductive pads (401) and the third conductive pads (403) are located along the edge of the magnetic plate (500), the magnetic plate (500) is supported by solder during the soldering process through the solder applied to the conductive pads (401, 403), thereby preventing or mitigating tilting of the flexible substrate (400).

[0125] The number of conductive pads (401, 403) shown in FIG. 9c above is merely an example, and the number of conductive pads (401, 403) can be varied.

[0126] FIG. 9d is a drawing of an embodiment in which a magnetic plate of the present disclosure is placed on a flexible substrate, and a conductive pad of the flexible substrate is located at the corner of the magnetic plate along the perimeter of the magnetic plate.

[0127] In the following description, the second conductive pad (402) may be omitted from the flexible substrate (400) described through FIGS. 6a to 8b.

[0128] In the following description, the flexible substrate (400) may include a conductive pad (404) located in the corner area of ​​the magnetic plate (500) along the perimeter of the magnetic plate (500) when the magnetic plate (500) is placed on the flexible substrate (400).

[0129] According to one embodiment, as illustrated in FIG. 9d, the conductive pad (404) may be formed in a closed loop shape. In one embodiment, the conductive pad (404) is placed in the corner area of ​​the magnetic plate (500) when the magnetic plate (500) is placed on the flexible substrate (400), and may be covered by the magnetic plate (500) so as not to be exposed to the outside when the magnetic plate (500) is viewed vertically. As the conductive pad (404) is positioned along the edge of the magnetic plate (500), the magnetic plate (500) may be supported by solder during the soldering process through the solder applied to the conductive pads (404), thereby preventing or mitigating tilting of the flexible substrate (400).

[0130] FIG. 10a is a drawing of an embodiment in which a magnetic plate of the present disclosure is disposed between a plurality of coils. FIG. 10b is a drawing illustrating the positional relationship between a conductive pad coupled to the magnetic plate of the present disclosure and a coil pad coupled to the coil.

[0131] According to one embodiment, as illustrated in FIG. 10a, a plurality of coils (610, 620) may be disposed on a flexible substrate (400). In one embodiment, the plurality of coils (610, 620) may wrap around the magnetic plate (500) on the outside of the magnetic plate (500).

[0132] In one embodiment, referring to FIG. 10b, a coil pad (606) connecting the coils (610, 620) and the flexible substrate (400) may be positioned outside the magnetic plate (500), the first conductive pads (401), and the second conductive pad (402). For example, the coil pad (606) may be positioned in the + Y direction and / or - Y direction of FIG. 10b with respect to the magnetic plate (500), the first conductive pads (401), and the second conductive pad (402). Thus, the magnetic plate (500) may be soldered to the conductive pads (610, 402) between the coils (610, 620).

[0133] For convenience of explanation, the carrier (330) described in FIGS. 3 to 4b will be defined as the first carrier, and the magnet (M) will be defined as the first magnet for the following description.

[0134] According to one embodiment, as illustrated in FIG. 10a and FIG. 10b, a magnetic plate (500) (e.g., the magnetic plate (500) of FIG. 4b) may be placed between a plurality of coils (610, 620). In one embodiment, a camera module (300) (e.g., the camera module (300) of FIG. 3) may perform an auto focus (AF) function that automatically adjusts the focus of the lens (312) on a subject by moving the lens assembly (310) (e.g., the lens assembly (310) of FIG. 3) along the optical axis (e.g., the OA and Z axis directions of FIG. 3) through the electromagnetic force acting between the plurality of coils (610, 620) and the magnet (e.g., the magnet (M) of FIG. 4b) included in the camera module (300). In one embodiment, the camera module (300) can perform the function of an optical image stabilizer that corrects image shake by moving the lens assembly (310) in a direction perpendicular to the optical axis (OA) (e.g., the X-axis direction and / or the Y-axis direction of FIG. 3) through the electromagnetic force acting between a plurality of coils (610, 620) and a magnet.

[0135] According to one embodiment, the camera module (300) may include a first carrier (e.g., carrier (330) of FIG. 4b) that accommodates a lens assembly (310) and a second carrier (not shown) that accommodates the first carrier (330) and is accommodated in a camera housing (350) (e.g., camera housing (350) of FIG. 4b). In one embodiment, a bearing ball (e.g., OIS ball) may be disposed between the camera housing (350) and the second carrier to guide the movement of the second carrier relative to the camera housing (350) (e.g., movement in a direction perpendicular to the optical axis (OA)). In one embodiment, the second carrier may include a second magnet and a third magnet that face a side portion (352) of the camera housing (350) and face a side portion (352) other than the side portion (352) facing the first magnet (M) disposed on the first carrier (330). In one embodiment, a second coil and a third coil may be disposed on a flexible substrate (400) (e.g., the flexible substrate (400) of FIG. 4b) disposed on a side portion (352) of a camera housing (350), facing a second magnet and a third magnet, respectively. In some embodiments, the second magnet and the third magnet may be disposed on the bottom surface of a second carrier so as to face a support portion (351) of the camera housing (352). In this case, the second coil and the third coil may be disposed on the support portion (351) of the camera housing (350) and face the second magnet and the third magnet, respectively. In one embodiment, the camera module (300) may correct image shake by moving the second carrier under the control of the processor (120). In one embodiment, the second carrier can move in a direction perpendicular to the optical axis (OA) of the lenses (312) (e.g., the X-axis direction and / or the Y-axis direction in FIG. 3) through the electromagnetic force acting between the second coil and the second magnet and / or the electromagnetic force acting between the third coil and the third magnet. Since the lens assembly (310) is placed on the first carrier (330) and accommodated in the second carrier, it can move together with the second carrier in a direction perpendicular to the optical axis (OA).Therefore, image shaking can be corrected in the camera module (300).

[0136] According to one embodiment, the second carrier may be accommodated in the first carrier (330). In this case, the lens assembly (310) may be accommodated in the second carrier and placed on the first carrier (330). In one embodiment, a bearing ball (e.g., an OIS ball) may be disposed between the first carrier (330) and the second carrier to guide the movement of the second carrier relative to the first carrier (330) (e.g., movement in a direction perpendicular to the optical axis (OA)). In one embodiment, the second carrier may include a second magnet and a third magnet facing the side portion (352) of the camera housing (350). In one embodiment, the second magnet and the third magnet may face a side of the side portion (352) of the camera housing (350) other than the side facing the first magnet (M) placed on the first carrier (330). In one embodiment, a second coil and a third coil may be disposed on a flexible substrate (400) disposed on a side portion (352) of a camera housing (350), each facing a second magnet and a third magnet, respectively. In some embodiments, the second magnet and the third magnet may be disposed on the bottom surface of a second carrier so as to face the support portion (351) of the camera housing (352). In this case, the second coil and the third coil may be disposed on one surface of a first carrier (330) corresponding to the support portion (351) of the camera housing (350) so as to face the second magnet and the third magnet, respectively. In one embodiment, the camera module (300) may correct image shake by moving the second carrier under the control of the processor (120). In one embodiment, the second carrier can move in a direction perpendicular to the optical axis (OA) of the lenses (312) (e.g., the X-axis direction and / or the Y-axis direction in FIG. 3) through the electromagnetic force acting between the second coil and the second magnet and / or the electromagnetic force acting between the third coil and the third magnet. Since the lens assembly (310) is accommodated in the second carrier, it can move together with the second carrier in a direction perpendicular to the optical axis (OA). Thus, image shake in the camera module (300) can be corrected.Meanwhile, the first carrier (330) can move in the direction of the optical axis (OA) of the lenses (312) (e.g., the lenses (312) of FIG. 3) through the electromagnetic force acting between the first magnet (M) and the first coil (410). Since the lens assembly (310) is placed on the first carrier (330) while being accommodated in the second carrier, it can move in the direction of the optical axis (OA) together with the first carrier (330). Thus, the camera module (300) can perform an auto focus (AF) function that automatically adjusts the focus of the lens (312) for a subject.

[0137] In one embodiment, one of the coils (610, 620) may be a first coil (410) that provides a driving force in the direction of the optical axis (OA) to the first carrier (330), and the other of the coils (610, 620) may be a second coil that provides a driving force in the direction perpendicular to the optical axis (OA) to the second carrier. A magnetic plate (500) may be placed between the first coil (410) and the second coil on a flexible substrate (400) and may face the first magnet (M) and the second magnet. The magnetic plate (500) may provide a driving force in the direction of the optical axis (OA) to the first carrier (330) on which the magnet (M) is placed and a driving force in the direction perpendicular to the optical axis (OA) to the second carrier on which the second magnet is placed through magnetic force acting with the first magnet (M) and the second magnet.

[0138] In one embodiment, the coils (610, 620) may be a second coil and a third coil that provide a driving force to the second carrier in a direction perpendicular to the optical axis (OA). A magnetic plate (500) is positioned between the second coil and the third coil on a flexible substrate (400) and may face the second magnet and the third magnet. The magnetic plate (500) may provide a driving force to the second carrier on which the second magnet and the third magnet are positioned in a direction perpendicular to the optical axis (OA) (e.g., the X-axis direction and / or the Y-axis direction in FIG. 3) through a magnetic force acting with the second magnet and the third magnet.

[0139] FIG. 11 is a drawing of an embodiment in which a coil is disposed between a plurality of magnetic plates according to one embodiment of the present disclosure.

[0140] In the description of FIGS. 4a to 9d above, the magnetic plate (500) is described as being disposed inside the coil (410), but it may not be limited thereto. In one embodiment, referring to FIG. 11, the camera module (300) may include a plurality of magnetic plates (500a, 500b) (e.g., magnetic plate (500) of FIG. 4b) located outside the coil (710) (e.g., coil (410) of FIG. 4b). In one embodiment, the magnetic plates (500a, 500b) may be fixed to the flexible substrate (400) through first conductive pads (401) and second conductive pads (402) disposed on the flexible substrate (400), as shown in FIG. 7 above. In one embodiment, the first magnetic plate (500a) may have first conductive pads (4011a, 4012a, 4013a, 4014a) located in the corner area and a second conductive pad (402a) located in the center. The second magnetic plate (500b) may have first conductive pads (4011b, 4012b, 4013b, 4014b) located in the corner area and a second conductive pad (402b) located in the center.

[0141] In one embodiment, the camera module (300) (e.g., the camera module (300) of FIG. 3) can perform an auto focus (AF) function that automatically adjusts the focus of the lens (312) for a subject by moving the first carrier that accommodates the lens assembly (310) (e.g., the lens assembly (310) of FIG. 3) along the optical axis (e.g., the OA and Z axis directions of FIG. 3) through the electromagnetic force acting between the coil (710) and the first magnet (e.g., the magnet (M) of FIG. 4b) disposed on the first carrier (e.g., the carrier (330) of FIG. 4b) and the magnetic force acting between at least one of the plurality of magnetic plates (500a, 500b) and the first magnet (M).

[0142] In one embodiment, the camera module (300) can perform an optical image stabilizer function to correct image shake by moving the lens assembly (310) in a direction perpendicular to the optical axis (OA) (e.g., X-axis direction and / or Y-axis direction in FIG. 3) through an electromagnetic force acting between a second magnet and a third magnet disposed in a second carrier that accommodates a first carrier (330) and a second coil and a third coil of a flexible substrate (400) (e.g., flexible substrate (400) in FIG. 4b) and a magnetic force acting between at least one of a plurality of magnetic plates (500a, 500b) and the second magnet and / or third magnet.

[0143] According to one embodiment of the present disclosure, a camera module (180, 205, 212, 300) may include a lens assembly (310) comprising at least one lens (312) aligned along an optical axis (OA). The camera module may include a carrier (330) that accommodates the lens assembly. The camera module may include a camera housing (350) that accommodates the carrier. The camera module may include a first magnet (M) disposed on the carrier. The camera module may include a first coil (410) facing the first magnet and providing a driving force to the carrier through an electromagnetic force acting with the first magnet. The camera module may include a flexible substrate (400) disposed on the camera housing and connected to the first coil, comprising a plurality of first conductive pads (401). The camera module may include a magnetic plate (500) that covers the plurality of first conductive pads, is coupled to the first conductive pads through solder applied to the plurality of first conductive pads, and faces the first magnet. The plurality of first conductive pads may each be located in different corner regions of the magnetic plate.

[0144] In one embodiment, the plurality of first conductive pads can support the magnetic plate at least four points without being exposed to the outside of the magnetic plate when viewed from a direction perpendicular to the magnetic plate.

[0145] In one embodiment, the plurality of first conductive pads and the magnetic plate may be disposed inside the first coil.

[0146] In one embodiment, the flexible substrate may include a second conductive pad (402) that is coupled to the magnetic plate through solder. A plurality of the first conductive pads may be disposed outside of the second conductive pad.

[0147] In one embodiment, the second conductive pad may be disposed at least partially in the center of the magnetic plate.

[0148] In one embodiment, the plurality of first conductive pads may be formed with a size smaller than that of the second conductive pad.

[0149] In one embodiment, the plurality of first conductive pads may include a first-1 conductive pad (4011), a first-2 conductive pad (4012) positioned at a first interval (L1) facing a first direction relative to the first-1 conductive pad, a first-3 conductive pad (4013) positioned at a second interval (L2) facing a second direction perpendicular to the first direction relative to the first-2 conductive pad, and a first-4 conductive pad (4014) positioned at the first interval facing a third direction opposite to the first direction relative to the first-3 conductive pad.

[0150] In one embodiment, the first-1 conductive pad and the first-4 conductive pad may be formed integrally. The first-2 conductive pad and the first-3 conductive pad may be formed integrally.

[0151] In one embodiment, the flexible substrate may include a plurality of third conductive pads (403) disposed in different corner regions of the magnetic plate between adjacent corner regions of the magnetic plate. The third conductive pads may be joined to the magnetic plate through solder. The third conductive pads may not be exposed to the outside of the magnetic plate when viewed from a direction perpendicular to the magnetic plate.

[0152] In one embodiment, one surface of the magnetic plate facing the flexible substrate may be flat (501) or curved (502).

[0153] In one embodiment, the carrier can move in the direction of the optical axis through the electromagnetic force acting between the first magnet and the first coil.

[0154] In one embodiment, the carrier can move in a direction perpendicular to the optical axis through the electromagnetic force acting between the first magnet and the first coil.

[0155] In one embodiment, the camera module may include a second magnet and a second coil facing the second magnet, connected to the flexible substrate, and providing a driving force to the carrier through an electromagnetic force acting with the second magnet. The magnetic plate may be disposed between the first coil and the second coil.

[0156] In one embodiment, the carrier can move in the optical axis or in a direction perpendicular to the optical axis through the electromagnetic force acting between the first magnet and the first coil. The carrier can move in the optical axis or in a direction perpendicular to the optical axis through the electromagnetic force acting between the second magnet and the second coil.

[0157] According to one embodiment of the present disclosure, a camera module (180, 205, 212, 300) may include a lens assembly (310) comprising at least one lens (312) aligned along an optical axis (OA). In one embodiment, the camera module may include a carrier (330) that accommodates the lens assembly. In one embodiment, the camera module may include a camera housing (350) that accommodates the carrier. In one embodiment, the camera module may include a first magnet (M) disposed on the carrier. In one embodiment, the camera module may include a first coil (410) that faces the first magnet and provides a driving force to the carrier through an electromagnetic force acting with the first magnet. In one embodiment, the camera module may include a flexible substrate (400) disposed on the camera housing and connected to the first coil, comprising a plurality of first conductive pads (401, 403). In one embodiment, the camera module may include a magnetic plate (500) that covers the plurality of first conductive pads, is coupled to the first conductive pads through solder applied to the plurality of first conductive pads, and faces the first magnet. The plurality of first conductive pads may be disposed in different corner regions of the magnetic plate between adjacent corner regions of the magnetic plate.

[0158] In one embodiment, the plurality of first conductive pads may not be exposed to the outside of the magnetic plate when viewed from a direction perpendicular to the magnetic plate.

[0159] In one embodiment, the plurality of first conductive pads and the magnetic plate may be disposed inside the first coil.

[0160] In one embodiment, the flexible substrate includes a second conductive pad (402) that is coupled to the magnetic plate through solder, and a plurality of the first conductive pads may be disposed outside of the second conductive pad.

[0161] In one embodiment, one surface of the magnetic plate facing the flexible substrate may be flat (501) or curved (502).

[0162] According to one embodiment of the present disclosure, a camera module (180, 205, 212, 300) may include a lens assembly (310) comprising at least one lens (312) aligned along an optical axis (OA). In one embodiment, the camera module may include a carrier (330) that accommodates the lens assembly. In one embodiment, the camera module may include a camera housing (350) that accommodates the carrier. In one embodiment, the camera module may include a first magnet (M) disposed on the carrier. In one embodiment, the camera module may include a first coil (410) facing the first magnet and providing a driving force to the carrier through an electromagnetic force acting with the first magnet. In one embodiment, the camera module may include a flexible substrate (400) disposed on the camera housing and connected to the first coil, comprising a plurality of first conductive pads (404). In one embodiment, the camera module may include a magnetic plate (500) that covers the plurality of first conductive pads, is coupled to the first conductive pads through solder applied to the plurality of first conductive pads, and faces the first magnet. The plurality of first conductive pads may be disposed along the perimeter of the magnetic plate in the corner regions of the magnetic plate.

[0163] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0164] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as “coupled” or “connected” to another (e.g., 2nd) component, with or without the terms “functionally” or “communicationly,” it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0165] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0166] Various embodiments of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0167] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or an application store (e.g., Play Store). TM It can be distributed online (e.g., downloaded or uploaded) through ) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0168] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In a camera module (180, 205, 212, 300), A lens assembly (310) comprising at least one lens (312) aligned along the optical axis (OA); A carrier (330) that accommodates the above lens assembly; A camera housing (350) that accommodates the above carrier; A first magnet (M) disposed on the above carrier; A first coil (410) facing the first magnet and providing driving force to the carrier through the electromagnetic force acting with the first magnet; A flexible substrate (400) disposed in the camera housing and connected to the first coil, and comprising a plurality of first conductive pads (401); and A magnetic plate (500) that covers the plurality of first conductive pads, is coupled to the first conductive pads through solder applied to the plurality of first conductive pads, and faces the first magnet; The above plurality of first conductive pads are, Camera modules located at different corner regions of the magnetic plate.

2. In Paragraph 1, The above plurality of first conductive pads are, A camera module that supports the magnetic plate at least four points without being exposed to the outside of the magnetic plate when viewed from a direction perpendicular to the magnetic plate.

3. In Paragraph 1, The plurality of first conductive pads and the magnetic plate are a camera module disposed inside the first coil.

4. In Paragraph 1, The above flexible substrate is, It includes a second conductive pad (402) that is coupled to the magnetic plate through solder, and A plurality of the above-mentioned first conductive pads, A camera module positioned on the outside of the second conductive pad.

5. In Paragraph 4, The second conductive pad above is, A camera module in which at least a portion is positioned at the center of the magnetic plate.

6. In Paragraph 4, The above plurality of first conductive pads are, A camera module formed with a size smaller than the second conductive pad.

7. In Paragraph 1, The above plurality of first conductive pads are, 1-1 conductive pad (4011), A first-2 conductive pad (4012) positioned at a first interval (L1) facing a first direction relative to the first-1 conductive pad, A first-third conductive pad (4013) positioned at a second interval (L2) toward a second direction perpendicular to the first direction with respect to the first-second conductive pad, and A camera module comprising a first-fourth conductive pad (4014) positioned at the first interval facing the third direction opposite to the first direction with respect to the first-third conductive pad.

8. In Paragraph 7, The above-mentioned first-1 conductive pad and the above-mentioned first-4 conductive pad are formed integrally, and The above-mentioned first-2 conductive pad and the above-mentioned first-3 conductive pad are integrally formed in a camera module.

9. In Paragraph 1, The above flexible substrate is, It includes a plurality of third conductive pads (403) disposed in different corner regions of the magnetic plate between adjacent corner regions of the magnetic plate, and The above-mentioned third conductive pad is, It is joined to the magnetic plate through solder, and A camera module that is not exposed to the outside of the magnetic plate when viewed from a direction perpendicular to the magnetic plate.

10. In Paragraph 1, A camera module in which one side of the magnetic plate facing the flexible substrate is flat (501) or curved (502).

11. In Paragraph 1, The above carrier is, A camera module that moves in the direction of the optical axis through the electromagnetic force acting between the first magnet and the first coil.

12. In Paragraph 1, The above carrier is, A camera module that moves in a direction perpendicular to the optical axis through the electromagnetic force acting between the first magnet and the first coil.

13. In Paragraph 1, Second magnet; and A second coil facing the second magnet, connected to the flexible substrate, and providing a driving force to the carrier through an electromagnetic force acting with the second magnet; The above magnetic plate is, It is positioned between the first coil and the second coil, and The above carrier is, It moves in the optical axis or in a direction perpendicular to the optical axis through the electromagnetic force acting between the first magnet and the first coil, and A camera module that moves in the optical axis or in a direction perpendicular to the optical axis through the electromagnetic force acting between the second magnet and the second coil.

14. In the camera module (180, 205, 212, 300), A lens assembly (310) comprising at least one lens (312) aligned along the optical axis (OA); A carrier (330) that accommodates the above lens assembly; A camera housing (350) that accommodates the above carrier; A first magnet (M) disposed on the above carrier; A first coil (410) facing the first magnet and providing driving force to the carrier through the electromagnetic force acting with the first magnet; A flexible substrate (400) disposed in the camera housing and connected to the first coil, comprising a plurality of first conductive pads (401, 403); and A magnetic plate (500) that covers the plurality of first conductive pads, is coupled to the first conductive pads through solder applied to the plurality of first conductive pads, and faces the first magnet; The above plurality of first conductive pads are, A camera module positioned in different corner regions of the magnetic plate between adjacent corner regions of the magnetic plate.

15. In the camera module (180, 205, 212, 300), A lens assembly (310) comprising at least one lens (312) aligned along the optical axis (OA); A carrier (330) that accommodates the above lens assembly; A camera housing (350) that accommodates the above carrier; A first magnet (M) disposed on the above carrier; A first coil (410) facing the first magnet and providing driving force to the carrier through the electromagnetic force acting with the first magnet; A flexible substrate (400) disposed in the camera housing and connected to the first coil, and comprising a plurality of first conductive pads (404); and A magnetic plate (500) that covers the plurality of first conductive pads, is coupled to the first conductive pads through solder applied to the plurality of first conductive pads, and faces the first magnet; The above plurality of first conductive pads are, A camera module positioned at the corner area of ​​the magnetic plate along the perimeter of the magnetic plate.

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