Electronic device including heat dissipation structure

Abstract

An electronic device according to an embodiment of the present disclosure may comprise: a first housing; a second housing; and at least one hinge device rotatably connecting the first housing with the second housing about a folding axis. The electronic device may comprise an electronic component disposed in the first housing. The electronic device may comprise a bracket comprising a first coupling groove extending in a first direction parallel to the folding axis and a second coupling groove extending in a second direction perpendicular to the first direction and connected to the first coupling groove. The electronic device may comprise a first heat dissipation member which is disposed in the first housing and to which heat generated from the electronic component is transferred, the first heat dissipation member comprising a first portion inserted into the first coupling groove of the bracket and a second portion extending from the first portion. The electronic device may comprise a second heat dissipation member which is inserted into the second coupling groove of the bracket and is in contact with the first portion of the first heat dissipation member inside the bracket, and at least a portion of which is disposed in the second housing. The electronic device may comprise a heat transfer material that is applied to the interior of the bracket and is in contact with the first heat dissipation member and the second heat dissipation member. Various other embodiments are possible.

Description

Electronic device including a heat dissipation structure

[0001] The various embodiments disclosed in this document relate to electronic devices including a heat dissipation structure.

[0002] Electronic components in electronic devices can generate heat during operation. If the heat generated by these components is not efficiently dissipated to the outside of the device, performance degradation may occur. Therefore, various types of heat dissipation structures are being designed into electronic devices to release the heat generated by the components to the outside.

[0003] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0004] An electronic device such as a notebook PC may include a first housing and a second housing connected by a hinge device so as to be foldable or unfoldable. Electronic components that are high heat sources, such as a processor (e.g., Central Processing Unit) or a communication module, may be placed in the first housing. A display module may be placed in the second housing. Meanwhile, an electronic device having different housings can secure heat dissipation performance by conducting heat generated from electronic components to a housing other than the one in which the electronic components are placed. For example, heat generated from electronic components can be dissipated by transferring it to the second housing through a heat pipe placed in the first housing and a heat pipe placed in the second housing.

[0005] The heat pipe can be positioned parallel to the folding axis of the hinge device. For example, the heat pipe can be inserted into a separate bracket parallel to the folding axis and rotate relative to the bracket during the folding or folding operation of the electronic device.

[0006] Meanwhile, a heat transfer material (e.g., thermal grease) may be applied to the interior of the bracket to enhance the thermal conductivity of the heat pipe and the bracket. For instance, the heat transfer material may be applied to the interior of the bracket before inserting the heat pipe. The direction of application of the heat transfer material may be the same as the direction in which the heat pipe is inserted into the bracket. In this case, leakage of the heat transfer material to the outside of the bracket may occur during the process of applying the material to the interior of the bracket. Furthermore, if the heat pipe is inserted into the bracket in the direction in which the heat transfer material was applied after the heat transfer material has been inserted, the heat transfer material applied inside the bracket may leak to the outside of the bracket.

[0007] In addition, during the process of inserting the heat pipe into the bracket, air may be inserted into the bracket, forming an air gap between the bracket and the heat pipe. Consequently, the heat transfer efficiency between the heat pipe and the bracket may be reduced.

[0008] The technical tasks intended to be accomplished in this document are not limited to those mentioned above, and other technical tasks not mentioned will be clearly understood by those skilled in the art to which this document belongs from the description below.

[0009] According to one embodiment of the present disclosure, an electronic device may include a first housing, a second housing, and at least one hinge device that rotatably connects the first housing and the second housing with respect to a folding axis. The electronic device may include an electronic component disposed in the first housing. The electronic device may include a bracket comprising a first coupling groove extending in a first direction parallel to the folding axis and a second coupling groove extending in a second direction perpendicular to the first direction and connected to the first coupling groove. The electronic device may include a first heat dissipation member disposed in the first housing to transfer heat generated from the electronic component, and comprising a first portion inserted into the first coupling groove of the bracket and a second portion extending from the first portion. The electronic device may include a second heat dissipation member inserted into the second coupling groove of the bracket, in contact with the first portion of the first heat dissipation member inside the bracket, and having at least a portion disposed in the second housing. The electronic device may include a heat transfer material that is applied to the interior of the bracket and is in contact with the first heat dissipation member and the second heat dissipation member.

[0010] A heat dissipation structure disposed in an electronic device comprising at least one hinge device that rotatably connects a first housing and a second housing with respect to a folding axis, according to one embodiment of the present disclosure, may include a bracket comprising a first coupling groove extending in a first direction parallel to the folding axis and a second coupling groove extending in a second direction perpendicular to the first direction and connected to the first coupling groove. The heat dissipation structure may include a first heat dissipation member comprising a first portion inserted into the first coupling groove of the bracket and a second portion extending from the first portion, wherein at least a portion thereof is disposed in the first housing. The heat dissipation structure may include a second heat dissipation member which is inserted into the second coupling groove of the bracket and contacts the first portion of the first heat dissipation member inside the bracket, and at least a portion thereof is disposed in the second housing. The heat dissipation structure may include a heat transfer material that is applied inside the bracket and contacts the first heat dissipation member and the second heat dissipation member.

[0011] According to various embodiments disclosed in this document, a structure can be provided in which a heat transfer material can be applied within a bracket while a first heat dissipation member (e.g., a heat pipe) is coupled within the bracket. For example, the bracket may have a coupling groove into which a first heat dissipation member disposed in a first housing can be inserted, and a coupling groove into which a second heat dissipation member disposed in a second housing can be inserted. By applying a heat transfer material within the bracket after the first heat dissipation member is inserted into the bracket, the heat transfer material can be uniformly applied within the bracket so that no air gap is formed within the bracket.

[0012] Subsequently, the second heat dissipation member can be coupled to the bracket and come into contact with the first heat dissipation member. Therefore, heat generated from the electronic component placed in the first housing can be dissipated to the second housing through the first heat dissipation member and the second heat dissipation member.

[0013] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs from the description below.

[0014] In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0015] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0016] FIG. 2a is a perspective view of an electronic device according to various embodiments disclosed in this document.

[0017] Figure 2b is the transparency of the electronic device of Figure 2a.

[0018] FIG. 3a is an assembly diagram of a heat dissipation structure of an electronic device according to one embodiment of the present disclosure.

[0019] FIG. 3b is a perspective view of a heat dissipation structure of an electronic device according to one embodiment of the present disclosure.

[0020] FIG. 3c is a drawing of a folded embodiment of a heat dissipation structure of an electronic device according to one embodiment of the present disclosure.

[0021] FIG. 4a is a drawing in which a first heat dissipation member and a second heat dissipation member of a heat dissipation structure according to one embodiment of the present disclosure are coupled to a bracket.

[0022] FIGS. 4b and 4c are assembly drawings of a bracket of a heat dissipation structure, a first heat dissipation member, and a second heat dissipation member according to one embodiment of the present disclosure.

[0023] Figure 5 is a cross-sectional view taken along line 5-5 of Figure 4a.

[0024] FIG. 6 is a drawing of a state in which a first heat dissipation member rotates relative to a second heat dissipation member within a bracket according to one embodiment of the present disclosure.

[0025] FIG. 7a is a drawing of an embodiment in which a bracket of a heat dissipation structure is slidably coupled with a hinge device according to one embodiment of the present disclosure.

[0026] FIGS. 7b and 7c are drawings of an embodiment according to one embodiment of the present disclosure in which a bracket of a heat dissipation structure and a hinge device are joined through a pin.

[0027] FIGS. 8A and FIGS. 8B are drawings of an embodiment according to one embodiment of the present disclosure in which a bracket is composed of two parts.

[0028] FIGS. 9A and 9B are drawings of an embodiment in which a cover member is assembled to a bracket according to one embodiment of the present disclosure.

[0029] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to one embodiment. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0030] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), for example, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0031] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence is performed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0032] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0033] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0034] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0035] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0036] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0037] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0038] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0039] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0040] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0041] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0042] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0043] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0044] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0045] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0046] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0047] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197). According to one embodiment, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0048] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0049] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0050] FIG. 2a is a perspective view of an electronic device according to various embodiments disclosed in this document. FIG. 2b is a transparency of the electronic device of FIG. 2a.

[0051] According to various embodiments disclosed in this document, an electronic device (200) (e.g., the electronic device (101) of FIG. 1) may include an electronic device (200) in the form of a notebook PC as shown in FIG. 2a. The electronic device (200) may include a first housing (201) and a second housing (202) that are combined to be foldable. In one embodiment, the first housing (201) may accommodate a printed circuit board of the electronic device (200) (e.g., the electronic device (101) of FIG. 1), a battery (e.g., the battery (189) of FIG. 1), a heat dissipation structure, an antenna module (e.g., the antenna module (197) of FIG. 1), a communication module (e.g., the communication module (190) of FIG. 1), a sensor module (e.g., the sensor module (176) of FIG. 1), an acoustic output module (e.g., the acoustic output module (155) of FIG. 1), a physical keyboard (280), and a touch-sensitive touchpad (240). A physical keyboard (280) and a touchpad (240) may be placed in a position visible to the user. For example, the physical keyboard (280) and the touchpad (240) may be placed on a first cover (250), as shown in FIG. 2a. A display module (230) capable of displaying information of the electronic device (200) may be placed in the second housing (202). In some embodiments, the electronic device (200) may omit at least one of the above-described components or add at least one other component.

[0052] According to one embodiment, as illustrated in FIG. 2b, the electronic device (200) may include at least one hinge device (210) that connects a first housing (201) and a second housing (202) so as to be rotatable (or foldable). For example, the first housing (201) and the second housing (202) may rotate about a folding axis of the hinge device (210) (e.g., the AA axis illustrated in FIG. 2a). The electronic device (200) may be folded so that a physical keyboard (280) placed in the first housing (201) and a display module (230) placed in the second housing (202) (e.g., the display module (160) of FIG. 1) face each other. The hinge device (210) may include a first hinge portion (211) coupled to a first housing (201) and a second hinge portion (212) coupled to a second housing (202). In one embodiment, the first hinge portion (211) and the second hinge portion (212) may be spaced apart at a predetermined interval along a folding axis (AA).

[0053] In one embodiment, the first housing (201) and the second housing (202) can be rotated at various angles through a hinge device (210). The angle or distance between the first housing (201) and the second housing (202) may vary depending on whether the electronic device (200) is in an unfolded state, a folded state, or an intermediate state.

[0054] In one embodiment, referring to FIG. 2a, the first housing (201) and the second housing (202) are positioned on both sides of the folding axis of the hinge device (210) (e.g., the AA axis shown in FIG. 2a) and may have a shape that is symmetrical with respect to the folding axis (AA). In another embodiment, the first housing (201) and the second housing (202) may have an asymmetrical shape with respect to the folding axis (AA).

[0055] According to various embodiments, the exterior of the first housing (201) may consist of a first cover (250), a second cover (260), and a frame (270) that surrounds the space between the first cover (250) and the second cover (260). The frame (270) may constitute the side exterior of the electronic device (200). In one embodiment, the frame (270) may be formed integrally with at least one of the first cover (250) and the second cover (260). In another embodiment, the frame (270) may be manufactured separately from the first cover (250) and the second cover (260) and may be combined with at least one of the first cover (250) and the second cover (260). For example, the first cover (250), the second cover (260), and the frame (270) may have several segmented parts connected to each other in various ways (e.g., bonding with adhesive, bonding with welding, bolting). Likewise, the second housing (202) can be made with the same configuration as the first housing (201).

[0056] According to various embodiments, a vent hole (not shown) including at least one opening may be formed in the first housing (201). Here, the vent hole may refer to a passage through which heat generated inside the electronic device (200) is released to the outside of the electronic device (200). Heat generated inside the electronic device (200) may be released to the outside of the electronic device (200), where the temperature is relatively low, through the opening formed in the vent hole. In one embodiment, the vent hole may be formed in the frame (270) along the extension direction of the folding axis (AA) of the hinge device (210) (e.g., the X-axis direction with respect to FIG. 2a). In one embodiment, a plurality of openings may be formed in parallel in the frame (270) along the extension direction of the folding axis (AA).

[0057] According to various embodiments, various connector ports (not shown) may be formed in the frame (270). The connector ports may include a connector (e.g., a USB connector or an IF module (interface connector port module)) for transmitting and receiving power and / or data with an external electronic device. In some embodiments, the connector ports may perform the function of transmitting and receiving audio signals with an external electronic device, or may further include a separate connector port (e.g., an earphone jack hole) for performing the function of transmitting and receiving audio signals.

[0058] According to various embodiments, the first housing (201) and the second housing (202) constituting the electronic device (200) may be formed from various materials. The first housing (201) and the second housing (202) may be formed from a material having a certain strength to protect the internal components (e.g., electronic components) of the electronic device (200) from external impact. For example, at least a portion of the first housing (201) and the second housing (202) may be formed from a metal material and / or a non-metal material. Here, the metal material may include alloys such as aluminum, stainless steel (STS, SUS), iron, magnesium, and titanium, and the non-metal material may include synthetic resin, ceramic, and engineering plastic. Additionally, the first housing (201), the second housing (202), and the frame (260) may be manufactured in various ways. For example, they may be formed by methods such as injection molding or die casting. The shape, material, and formation method of the first housing (201), second housing (202), and frame (260) illustrated in FIG. 2a described above are merely examples and can be varied to the extent that a person skilled in the art can implement them.

[0059] According to various embodiments, an antenna module (350) may be disposed in the electronic device (200). The antenna module (350) may be disposed in at least one of the first housing (201) and the second housing (202). The antenna module (350) may receive radio waves provided by a carrier's repeater or transmit radio waves. In one embodiment, the antenna module (350) may be a mmWave antenna module. The antenna module (350) may transmit or receive signals in a designated high-frequency band (e.g., mmWave band). In some embodiments, the antenna module (350) may include a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna module (350) may, for example, communicate near-field with an external device or wirelessly transmit and receive power required for charging. In one embodiment, the antenna module (350) can form an antenna structure through a combination with at least one of a first cover (240), a second cover (250), and a frame (260).

[0060] According to one embodiment, as illustrated in FIG. 2b, various electronic components (220) may be disposed in the first housing (201). For example, the electronic components (220) may be a central processing unit (e.g., the processor (120) of FIG. 1), a communication module, and an antenna module connected to the communication module to transmit or receive communication signals with an external electronic device (200). In one embodiment, the electronic components (220) may be disposed on a printed circuit board disposed in the first housing (210). Additionally, the electronic components (220) disposed in the first housing (201) may be electronic components that generate heat during operation. In one embodiment, a heat dissipation structure may be disposed in the first housing (201) and the second housing (202) to diffuse the heat generated from the electronic components (220) to the surroundings.

[0061] According to one embodiment, as illustrated in FIG. 2b, a heat dissipation structure disposed in a first housing (201) and a second housing (202) may include a first heat dissipation plate (310) in contact with an electronic component (220) disposed in the first housing (201), a first heat dissipation member (340) in contact with the first heat dissipation plate (310), a second heat dissipation plate (320) disposed in the second housing (202), and / or a second heat dissipation member (350) in contact with the first heat dissipation member (340) and the second heat dissipation plate (320). In addition to the configuration described above, at least one additional configuration may be added to the heat dissipation structure. For example, the heat dissipation structure may include a first plate (331) in contact with an electronic component (220) and a first heat dissipation plate (310), and / or a first heat dissipation member (340) and a second plate (332) in contact with the first heat dissipation plate (310).

[0062] In one embodiment, the first heat sink (310), the second heat sink (320), the first heat dissipation member (340), the second heat dissipation member (350), the first plate (331) and / or the second plate (332) may be formed of a metal material (e.g., aluminum, copper, stainless steel) or a thermally conductive material such as graphite.

[0063] In one embodiment, the first heat sink (310) may be in contact with an electronic component (220) placed in the first housing (201) and / or a printed circuit board on which the electronic component (220) is placed. In one embodiment, the first heat sink (310) and the second heat sink (320) may be vapor chambers. In one embodiment, the first heat dissipation member (340) may be a heat pipe that dissipates absorbed heat through a process in which a working fluid evaporates as heat is absorbed from an external heat source, and the generated vapor releases heat and liquefies. In one embodiment, the second heat dissipation member (350) may be a vapor chamber or a block (e.g., a plate) formed of a thermally conductive material.

[0064] According to one embodiment, heat generated from an electronic component (220) placed in a first housing (201) can be transferred to a second housing (202) through a heat dissipation structure. Thus, heat generated from the electronic component (220) can be dissipated through a diffusion process. For example, heat generated from the electronic component (220) can be transferred to a second housing (202) in which a display module (230) is placed, through a first heat sink (310) - a first heat dissipation member (340) - a second heat dissipation member (350) - a second heat sink (320). Therefore, as heat dissipation of the electronic component is smoothly carried out, the problem of performance degradation of the electronic device (200) can be alleviated or resolved.

[0065] FIG. 3a is an assembly drawing of a heat dissipation structure of an electronic device according to one embodiment of the present disclosure. FIG. 3b is a perspective view of a heat dissipation structure of an electronic device according to one embodiment of the present disclosure. FIG. 3c is a drawing of a folded embodiment of a heat dissipation structure of an electronic device according to one embodiment of the present disclosure. FIG. 4a is a drawing in which a first heat dissipation member and a second heat dissipation member of a heat dissipation structure according to one embodiment of the present disclosure are coupled to a bracket. FIG. 4b and FIG. 4c are assembly drawings of a bracket, a first heat dissipation member, and a second heat dissipation member of a heat dissipation structure according to one embodiment of the present disclosure. FIG. 5 is a cross-sectional view cut along line 5-5 of FIG. 4a.

[0066] According to one embodiment, as illustrated in FIGS. 3a to 3c, the first heat dissipation member (340) and the second heat dissipation member (350) can be coupled to a bracket (300) (e.g., a housing). Before describing the structure in which the first heat dissipation member (340) and the second heat dissipation member (350) are coupled to the bracket (300), the structure of the first heat dissipation member (340) and the structure of the second heat dissipation member (350) will be described.

[0067] In one embodiment, referring to FIGS. 3a through 3c, the first heat dissipation member (340) may include a first portion (341) extending in a direction parallel to the folding axis (AA) of the hinge device (210) and a second portion (342) extending from the first portion. In one embodiment, a portion of the second portion (342) may extend in a direction parallel to the folding axis (AA) and be parallel to the first portion (341). In one embodiment, the first portion (341) of the first heat dissipation member (340) may be inserted into a bracket (300). The second portion (342) may be placed on a first heat dissipation plate (310) placed in a first housing (201). In one embodiment, the second portion (342) of the first heat dissipation member (340) may be fixed to a second plate (332) to which at least a portion is fixed to the first heat dissipation plate (310).

[0068] In one embodiment, referring to FIGS. 3a through 3c, the second heat dissipation member (350) may be coupled to a second heat dissipation plate (320) disposed in a second housing (202). In one embodiment, the second heat dissipation member (350) may include a body (351) and an extension (352) protruding from the body (351). In one embodiment, the extension (352) of the second heat dissipation member (350) may be inserted into a bracket (300). In one embodiment, the extension (352) of the second heat dissipation member (350) may be in contact with a first part (341) of the first heat dissipation member (340) inside the bracket (300). In some embodiments, the extension (352) may come into contact with the first portion (341) of the first heat dissipation member (340) through a heat transfer material (T) (e.g., the heat transfer material (T) of FIG. 4c) applied to the first portion (341) of the first heat dissipation member (340) within the bracket (300). Thus, heat generated from the electronic component (220) may spread to the first heat dissipation plate (310) - the second plate (332) - the first heat dissipation member (340) - the second heat dissipation member (350) - the second heat dissipation plate (320).

[0069] According to one embodiment, as illustrated in FIG. 4b, the bracket (300) may include a first coupling groove (301) (e.g., first coupling hole, first hole, first recess, first opening) into which a first part (341) of the first heat dissipation member (340) is inserted, and a second coupling groove (302) (e.g., second coupling hole, second hole, second recess, second opening) into which an extension (352) of the second heat dissipation member (350) is inserted. In one embodiment, the first coupling groove (301) and the second coupling groove (302) of the bracket (300) may be formed at different locations so that the first part (341) of the first heat dissipation member (340) and the extension (352) of the second heat dissipation member (350) can be inserted into the bracket (300) from different directions. In one embodiment, the first coupling groove (301) may extend in a first direction (e.g., the first direction of FIG. 4b) parallel to the folding axis (AA) (e.g., the folding axis (AA) of FIG. 2b). For example, the extension direction of the first coupling groove (301) and the extension direction of the folding axis (AA) may be substantially the same while the bracket (300) is positioned inside the electronic device (200). The second coupling groove (302) may be formed by extending in a second direction (e.g., the second direction of FIG. 4b) substantially perpendicular to the first coupling groove (301). In one embodiment, referring to FIG. 3b and FIG. 4a through 4c, the first portion (341) of the first heat dissipation member (340) may be inserted in a first direction relative to the first coupling groove (301) of the bracket (300). The extension (352) of the second heat dissipation member (350) can be inserted in a second direction into the second coupling groove (302) of the bracket (300). In one embodiment, the first coupling groove (301) and the second coupling groove (302) can be connected to each other inside the bracket (300). Accordingly, the first part (341) of the first heat dissipation member (340) inserted into the first coupling groove (301) of the bracket (300) and the extension (352) of the second heat dissipation member (350) inserted into the second coupling groove (302) of the bracket (300) can be in contact inside the bracket (300).

[0070] According to one embodiment, the first housing (201) and the second housing (202) of the electronic device (200) can be folded with respect to a folding axis (AA) through a hinge device (210). In one embodiment, the bracket (300) can be rotated about an axis of a first part (341) of a first heat dissipation member (340) disposed in the first housing (201) based on the rotational movement of the first housing (201) relative to the second housing (202). In one embodiment, the first part (341) can be extended in a direction parallel to the folding axis (AA). Thus, the rotational direction of the bracket (300) about the first part (341) and the rotational direction about the folding axis (AA) can be the same.

[0071] In one embodiment, at least a portion of the bracket (300) may be coupled to the second housing (202). In one embodiment, the bracket (300) may be coupled to the second housing (202) through a bolt connection. Referring to FIGS. 8a through 9b to be described later, the bracket (300) may be coupled to a portion of the hinge device (210) coupled to the second housing (202). Thus, as a portion of the first heat dissipation member (340) (e.g., a second portion (342)) is placed in the first housing (201) and the bracket (300) is coupled to the second housing (202), the bracket (300) may rotate around the first portion (341) of the first heat dissipation member (340) as an axis based on the rotation of the first housing (201) relative to the second housing (202).

[0072] In the description above, the bracket (300) is described as being coupled to the second housing (202) and / or the hinge device (210), but is not limited thereto. In one embodiment, the bracket (300) may be coupled only to the first part (341) of the first heat dissipation member (340) and the second part (352) of the second heat dissipation member (350).

[0073] In one embodiment, referring to FIG. 4c, a heat transfer material (T) (e.g., thermal grease) may be applied to the interior of the bracket (300). The heat transfer material (T) may be applied to the interior of the bracket (300). The first part (341) of the first heat dissipation member (340) and the extension (352) of the second heat dissipation member (350) may come into contact with the heat transfer material (T). Thus, the heat transfer efficiency between the first heat dissipation member (340) and the second heat dissipation member (350) can be improved through the heat transfer material (T). Meanwhile, the heat transfer material (T) may provide a lubricating function when the first part (341) of the first heat dissipation member (340) rotates relative to the bracket (300).

[0074] According to one embodiment, as illustrated in FIGS. 4b, 4c and 5, a sealing member (360, 370) may be disposed on the bracket (300) to prevent leakage of a heat transfer material (T) applied inside the bracket (300) to the outside of the bracket (300). In one embodiment, the first sealing member (360) may be inserted into the first coupling groove (301) of the bracket (300) to prevent leakage of the heat transfer material (T) through the first coupling groove (301). The second sealing member (370) may shield the second coupling groove (302) of the bracket (300) to prevent leakage of the heat transfer material (T) through the second coupling groove (302).

[0075] According to one embodiment, as illustrated in FIGS. 4b and 4c, the first sealing member (360) may be placed in the first portion (341) of the first heat dissipation member (340) and placed in the first coupling groove (301) of the bracket (300). In one embodiment, the first sealing member (360) may be in close contact with the first coupling groove (301) of the bracket (300) in an area adjacent to the entrance of the first coupling groove (301). The entrance of the first coupling groove (301) may be an opening into which the first portion (341) is inserted, which is a portion connected to the outside of the bracket (300). As the first sealing member (360) is fitted into the first coupling groove (301) of the bracket (300), the heat transfer material (T) applied inside the bracket (300) may not leak through the entrance of the first coupling groove (301) of the bracket (300).

[0076] According to one embodiment, as illustrated in FIGS. 4b and 4c, the second sealing member (370) may be inserted into the extension (352) of the second heat dissipation member (350) and positioned between the bracket (300) and the body (351) of the second heat dissipation member (350). In one embodiment, referring to FIG. 5, the second sealing member (370) may be in close contact with the body (351) of the second heat dissipation member (350) and one surface of the bracket (300) between the body (351) of the second heat dissipation member (350) and the bracket (300). Thus, the heat transfer material (T) applied inside the bracket (300) may not leak through the opening of the second coupling groove (302) of the bracket (300). The opening of the second coupling groove (302) may be an opening into which the extension (352) is inserted, which is a part connected to the outside of the bracket (300).

[0077] According to one embodiment, the first sealing member (360) and the second sealing member (370) may be formed from various materials. In one embodiment, the first sealing member (360) and the second sealing member (370) may include non-metallic materials (e.g., rubber, plastic) and / or metallic materials. In one embodiment, the first sealing member (360) may be an O-ring comprising a rubber material. The second sealing member (360) may be a gasket formed from a metallic or non-metallic material.

[0078] In the above description, the first sealing member (360) and the second sealing member (370) were described as separate components of the first heat dissipation member (340) and the second heat dissipation member (350), but they may not be limited thereto. In one embodiment, the first sealing member (360) may be integrally formed on the first part (341) of the first heat dissipation member (340) to shield the entrance of the first coupling groove (301). In one embodiment, the second sealing member (370) may be integrally formed on the second heat dissipation member (350) to shield the entrance of the second coupling groove (302).

[0079] According to one embodiment, the process of combining heat dissipation members (340, 350) with a bracket (300) and the process of applying a heat transfer material (T) may be as follows.

[0080] In one embodiment, a first sealing member (360) may be inserted into a first portion (341) of the first heat dissipation member (340). The first portion (341) of the first heat dissipation member (340) may be inserted into a first coupling groove (301) of the bracket (300). The first sealing member (360) may be placed in a region (e.g., an inlet) of the first coupling groove (301). A heat transfer material (T) may be applied to the interior of the bracket (300) while the first portion (341) of the first heat dissipation member (340) is inserted into the bracket (300). In this case, as the heat transfer material (T) is uniformly applied to the inside of the bracket (300) without the second coupling groove (302) being shielded, an air gap may not be formed between the heat transfer material (T) and the components (e.g., bracket (300), first heat dissipation member (340)). Subsequently, the extension (352) of the second heat dissipation member (350) coupled with the second sealing member (370) can be inserted into the second coupling groove (302) of the bracket (300) and come into contact with the heat transfer material (T) and the first part (341) of the first heat dissipation member (340). Accordingly, compared to the case where an air gap is formed in the heat transfer material (T), the heat dissipation efficiency between the first heat dissipation member (340) and the second heat dissipation member (350) inside the bracket (300) can be improved.

[0081] According to one embodiment, as illustrated in FIG. 5, the first sealing member (360) may include at least one rib (361) formed along the circumference of the first sealing member (360) on the outer surface of the first sealing member (360). In one embodiment, a groove (303) into which the rib (361) is inserted may be formed in the area where the first sealing member (360) is disposed in the first coupling groove (301). In one embodiment, the rib (361) of the first sealing member (360) can prevent the heat transfer material (T) from leaking into the inlet of the first coupling groove (301). Additionally, the rib (361) can reduce friction acting between the bracket (300) and the first sealing member (360) when the bracket (300) rotates about the first part (341) of the first heat dissipation member (340) as an axis. In one embodiment, a lubricant (e.g., grease) may be applied between the bracket (300) and the first sealing member (360) so as to reduce friction between the bracket (300) and the first sealing member (360).

[0082] FIG. 6 is a drawing of a state in which a first heat dissipation member rotates relative to a second heat dissipation member within a bracket according to one embodiment of the present disclosure.

[0083] According to one embodiment, as illustrated in FIG. 6, a recess (353) may be formed in the extension (352) of the second heat dissipation member (350) to which the first part (341) of the first heat dissipation member (340) is seated. In one embodiment, the first part (341) of the first heat dissipation member (340) may be placed in the recess (353) and come into contact with the extension (352) of the second heat dissipation member (350) together with a heat transfer material (T).

[0084] In one embodiment, referring to FIG. 6 (a), (b), and (c), the first portion (341) of the first heat dissipation member (340) may maintain contact with the extension portion (352) of the second heat dissipation member (350) during the rotational operation of the first heat dissipation member (340) of the bracket (300). In one embodiment, the contact area between the first portion (341) and the extension portion (352) may be constant regardless of the rotational state of the bracket (300) with respect to the first heat dissipation member (340). Therefore, uniform heat transfer from the first heat dissipation member (340) to the second heat dissipation member (350) may be possible.

[0085] FIG. 7a is a drawing of an embodiment according to one embodiment of the present disclosure in which a bracket of a heat dissipation structure is slidably coupled with a hinge device. FIG. 7b and FIG. 7c are drawings of an embodiment according to one embodiment of the present disclosure in which a bracket of a heat dissipation structure and a hinge device are coupled through a pin.

[0086] According to one embodiment, as illustrated in FIG. 7a and FIG. 5 above, a bracket (300) may be coupled to a part of a hinge device (210). In one embodiment, the hinge device (210) (e.g., a first hinge part (211), a second hinge part (212)) may include a part coupled to the first housing (201) and a part coupled to the second housing (202) so that the first housing (201) and the second housing (202) can be folded. In one embodiment, the bracket (300) may be coupled to the part of the hinge device (210) coupled to the second housing (202). In one embodiment, the bracket (300) may be coupled to the hinge device (210) and be in close contact with the second housing (202). In this case, the bracket (300) can be in close contact with the second heat dissipation member (350) placed in the second housing (202). Thus, leakage of the heat transfer material (T) (e.g., the heat transfer material (T) of FIG. 4c) through the second coupling groove (302) of the bracket (300) can be prevented or avoided.

[0087] According to one embodiment, the bracket (300) and the hinge device (210) can be combined in various ways. In one embodiment, one end of the bracket (300) can be connected to the hinge device (210) via sliding connection or through a pin. In one embodiment, referring to the aforementioned FIG. 5 and FIG. 7a, a fastening portion (401) may be formed on one end of the bracket (300). The fastening portion (401) of the bracket (300) can be connected to a fastening groove (402) formed in the first hinge portion (211). For example, the fastening portion (401) of the bracket (300) can be inserted into the fastening groove (402) of the first hinge portion (211) via a sliding method and connected to the fastening groove (402) via a hook connection method. Conversely, the fastening portion (401) may be formed on the first hinge portion (211) and the fastening groove (402) may be formed on one end of the bracket (300).

[0088] In one embodiment, referring to FIGS. 7b and 7c, a fastening portion (401) may be formed at one end of the bracket (300). The fastening portion (401) of the bracket (300) may be inserted into a fastening groove (402) formed in the first hinge portion (211). In this state, a pin (403) passing through the fastening groove (402) may be inserted into the opening (4011) formed in the fastening portion (401). Thus, the bracket (300) may be coupled to the first hinge portion (211). In some embodiments, conversely, the fastening portion (401) may be formed in the first hinge portion (211), and the fastening groove (402) may be formed at one end of the bracket (300).

[0089] In one embodiment, the other end of the bracket (300) may be connected to the second housing (202) or a part of the second hinge portion (212) disposed in the second housing (202) through a bolt connection. Accordingly, the bracket (300) may be connected to a part of the first hinge portion (211) (e.g., the part where the first hinge portion (211) is connected to the second housing (202)) and the other end may be connected to the second housing (202) or a part of the second hinge portion (212) (e.g., the part where the second hinge portion (212) is connected to the second housing (202)), thereby being in close contact with the second heat dissipation member (350) disposed in the second housing (202).

[0090] FIGS. 8A and FIGS. 8B are drawings of an embodiment according to one embodiment of the present disclosure in which a bracket is composed of two parts.

[0091] According to one embodiment, as illustrated in FIG. 8a and FIG. 8b, a bracket (500) (e.g., bracket (300) of FIG. 4a) may include a first part (500a) and a second part (500b). In one embodiment, a first coupling groove (501) (e.g., first coupling groove (301) of FIG. 4b) into which a first part (341) of a first heat dissipation member (340) is inserted may be formed through the coupling of the first part (500a) and the second part (500b). A second coupling groove (502) (e.g., second coupling groove (302) of FIG. 4b) into which an extension (352) of a second heat dissipation member (350) is inserted may be formed through the coupling of the first part (500a) and the second part (500b). In one embodiment, the first part (500a) and the second part (500b) may be joined through a fixing member (F) so that the first portion (341) of the first heat dissipation member (340) and the extension portion (352) of the second heat dissipation member (350) are received inside. In one embodiment, the extension portion (352) of the second heat dissipation member (350) may be joined to the bracket (500) through the fixing member (F).

[0092] In one embodiment, the bracket (500) is composed of a plurality of parts (500a, 500b), so that the application of a heat transfer material (T) (e.g., the heat transfer material (T) of FIG. 4c) inside the bracket (500) may be easier compared to the case where the bracket (500) is composed of a single part. For example, the heat transfer material (T) may be applied to the first part (341) of the first heat dissipation member (340) and the extension (352) of the second heat dissipation member (350) before combining the first part (500a) and the second part (500b). Thus, as the heat transfer material (T) is uniformly applied inside the bracket (500), an air gap may not be formed between the heat transfer material (T) and the components (e.g., the bracket (300), the first heat dissipation member (340)). Accordingly, compared to the case where an air gap is formed in the heat transfer material (T), the heat dissipation efficiency between the first heat dissipation member (340) and the second heat dissipation member (350) inside the bracket (500) can be improved.

[0093] FIGS. 9A and 9B are drawings of an embodiment in which a cover member is assembled to a bracket according to one embodiment of the present disclosure.

[0094] According to one embodiment, as illustrated in FIG. 9a and FIG. 9b, a bracket (600) (e.g., bracket (300) of FIG. 4a) may include a first part (600a) and a second part (600b). In one embodiment, a first coupling groove (601) (e.g., first coupling groove (301) of FIG. 4b) into which a first part (341) of a first heat dissipation member (340) is inserted may be formed through the coupling of the first part (600a) and the second part (600b). For example, the first part (600a) may be in an open state and the first coupling groove (601) may be formed as it is coupled with the second part (600b). In one embodiment, the second part (600b) may be coupled to the first part (600a) through a hook coupling method. In one embodiment, a second coupling groove (602) into which an extension (352) of the second heat dissipation member (350) is inserted (e.g., the second coupling groove (302) of FIG. 4b) may be formed in the first part (500a).

[0095] In one embodiment, the bracket (600) is composed of a plurality of parts (600a, 600b), so that the application of a heat transfer material (T) (e.g., the heat transfer material (T) of FIG. 4c) inside the bracket (600) may be easier compared to the case where the bracket (600) is composed of a single part. For example, the heat transfer material (T) may be applied to the first part (341) of the first heat dissipation member (340) and the extension (352) of the second heat dissipation member (350) before combining the first part (600a) and the second part (600b). Accordingly, the heat dissipation efficiency between the first heat dissipation member (340) and the second heat dissipation member (350) inside the bracket (600) may be improved compared to the case where an air gap is formed in the heat transfer material (T).

[0096] According to one embodiment of the present disclosure, an electronic device (101, 200) may include a first housing (201), a second housing (202), and at least one hinge device (210) that rotatably connects the first housing and the second housing with respect to a folding axis (AA). The electronic device may include an electronic component disposed in the first housing. The electronic device may include a bracket (300) comprising a first coupling groove (301) extending in a first direction parallel to the folding axis and a second coupling groove (302) extending in a second direction perpendicular to the first direction and connected to the first coupling groove. The electronic device may include a first heat dissipation member (340) disposed in the first housing to which heat generated from the electronic component is transferred, and comprising a first part (341) inserted into the first coupling groove of the bracket and a second part (342) extending from the first part. The electronic device may include a second heat dissipation member (350) that is inserted into a second coupling groove of the bracket and contacts a first portion of the first heat dissipation member inside the bracket, and at least a portion thereof is disposed in the second housing. The electronic device may include a heat transfer material (T) that is applied inside the bracket and contacts the first heat dissipation member and the second heat dissipation member.

[0097] In one embodiment, the bracket is disposed in the second housing and can rotate about a first portion of the first heat dissipation member around the folding axis based on the rotation of the second housing relative to the first housing.

[0098] In one embodiment, the electronic device may include a first heat sink disposed in the first housing and in contact with the electronic component and a second portion of the first heat dissipation member. The electronic device may include a second heat sink (320) disposed in the second housing and in contact with the second heat dissipation member.

[0099] In one embodiment, it may include a first sealing member (360) that is inserted into a first portion of the first heat dissipation member and is in close contact with a first coupling groove of the bracket.

[0100] In one embodiment, the first sealing member may include a rib (361) formed on an outer surface and along the circumference of the first sealing member. The bracket may include a groove (303) into which the rib of the first sealing member is inserted.

[0101] In one embodiment, the second heat dissipation member may include a body (351) covering a second coupling groove of the bracket and an extension (352) protruding from the body, inserted into the second coupling groove, and in contact with a first part of the first heat dissipation member.

[0102] In one embodiment, the electronic device may further include a second sealing member (370) that is inserted into an extension of the second heat dissipation member and is in close contact with the body and the bracket between the body of the second heat dissipation member and the bracket.

[0103] In one embodiment, the extension of the second heat dissipation member may include a recess (353) on which a first portion of the first heat dissipation member is seated.

[0104] In one embodiment, the bracket may be coupled with the hinge device.

[0105] In one embodiment, the electronic device may include a fastening portion (401) formed on either the end of the bracket or the hinge device. The electronic device may include a fastening groove (402) formed on the other end of the bracket or the hinge device, into which the fastening portion is inserted.

[0106] In one embodiment, the fastening portion is inserted into the fastening groove and can be fixed within the fastening groove through a pin (403) passing through the fastening portion and the fastening groove.

[0107] In one embodiment, the first heat dissipation member may be a heat pipe through which fluid flows.

[0108] In one embodiment, the bracket may include a first part (500a, 600a) and a second part (500b, 600b) coupled to the first part. The first coupling groove may be formed through the coupling of the first part and the second part.

[0109] In one embodiment, the hinge device may include a first hinge portion (211) coupled to the first housing and the second housing, and a second hinge portion (212) spaced apart from the first hinge portion in a direction parallel to the folding axis and coupled to the first housing and the second housing. The bracket may have one end coupled to the first hinge portion and the other end coupled to the second hinge portion.

[0110] According to one embodiment of the present disclosure, a heat dissipation structure disposed in an electronic device (101, 200) comprising at least one hinge device (210) that rotatably connects a first housing (201) and a second housing (202) with respect to a folding axis (AA) may include a bracket (300) comprising a first coupling groove (301) extending in a first direction parallel to the folding axis and a second coupling groove (302) extending in a second direction perpendicular to the first direction and connected to the first coupling groove. The heat dissipation structure may include a first heat dissipation member (340) having at least a portion disposed in the first housing and comprising a first portion (341) inserted into the first coupling groove of the bracket and a second portion (342) extending from the first portion. The heat dissipation structure may include a second heat dissipation member (350) that is inserted into a second coupling groove of the bracket and contacts a first portion of the first heat dissipation member inside the bracket, and at least a portion thereof is disposed in the second housing. The heat dissipation structure may include a heat transfer material (T) that is applied to the interior of the bracket and contacts the first heat dissipation member and the second heat dissipation member.

[0111] In one embodiment, the bracket is disposed in the second housing and can rotate about a first portion of the first heat dissipation member about the folding axis based on the rotation of the second housing relative to the first housing.

[0112] In one embodiment, the heat dissipation structure may include a first heat dissipation plate (310) disposed in the first housing and in contact with an electronic component (220) and a second portion of the first heat dissipation member, and a second heat dissipation plate (320) disposed in the second housing and in contact with the second heat dissipation member.

[0113] In one embodiment, the heat dissipation structure may further include a first sealing member (360) that is inserted into a first portion of the first heat dissipation member and is in close contact with a first coupling groove of the bracket.

[0114] In one embodiment, the second heat dissipation member may include a body (351) covering a second coupling groove of the bracket and an extension (352) protruding from the body and inserted into the second coupling groove.

[0115] In one embodiment, the heat dissipation structure may further include a second sealing member (370) that is inserted into an extension of the second heat dissipation member and is in close contact with the body and the bracket between the body of the second heat dissipation member and the bracket.

[0116] According to various embodiments disclosed in this document, a structure can be provided in which a heat transfer material (T) can be applied within a bracket (300, 500, 600) while a first heat dissipation member (340) (e.g., a heat pipe) is coupled within the bracket. For example, the bracket may have a first coupling groove (301) into which a first heat dissipation member (340) disposed in a first housing (201) can be inserted, and a second coupling groove (302) into which a second heat dissipation member (350) disposed in a second housing (202) can be inserted. After the first heat dissipation member is inserted into the bracket, the heat transfer material can be applied within the bracket so that an air gap is not formed between the components (e.g., the bracket, the first heat dissipation member) within the bracket.

[0117] Subsequently, the second heat dissipation member can be coupled to the bracket and come into contact with the first heat dissipation member. Accordingly, heat generated from the electronic component (220) placed in the first housing can be dissipated to the second housing through the first heat dissipation member and the second heat dissipation member.

[0118] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs from the description below.

[0119] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0120] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as “coupled” or “connected” to another (e.g., 2nd) component, with or without the terms “functionally” or “communicationly,” it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0121] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0122] Various embodiments of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0123] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or an application store (e.g., Play Store). TM It can be distributed online (e.g., downloaded or uploaded) through ) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0124] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device (101, 200), First housing (201); Second housing (202); At least one hinge device (210) that rotatably connects the first housing and the second housing with respect to a folding axis (AA); Electronic components (220) placed in the first housing above; A bracket (300) comprising a first coupling groove (301) extending in a first direction parallel to the folding axis and a second coupling groove (302) extending in a second direction perpendicular to the first direction and connected to the first coupling groove; A first heat dissipation member (340) comprising a first portion (341) that is inserted into a first coupling groove of the bracket and is disposed in the first housing to transfer heat generated from the electronic component, and a second portion (342) that extends from the first portion; A second heat dissipation member (350) inserted into a second coupling groove of the bracket and in contact with a first portion of the first heat dissipation member inside the bracket, with at least a portion disposed in the second housing; and An electronic device comprising a heat transfer material (T) applied to the interior of the bracket and in contact with the first heat dissipation member and the second heat dissipation member.

2. In Paragraph 1, The above bracket is, An electronic device disposed in the second housing and rotating about a first portion of the first heat dissipation member around the folding axis based on the rotation of the second housing relative to the first housing.

3. In Paragraph 1, A first heat sink (310) disposed in the first housing and in contact with the electronic component and the second part of the first heat dissipation member; and An electronic device comprising: a second heat sink (320) disposed in the second housing and in contact with the second heat dissipation member.

4. In Paragraph 1, An electronic device further comprising: a first sealing member (360) inserted into a first part of the first heat dissipation member and in close contact with a first coupling groove of the bracket.

5. In Paragraph 4, The first sealing member above is, It includes a rib (361) formed on the outer surface and formed along the circumference of the first sealing member, The above bracket is, An electronic device comprising a groove (303) into which a rib of the first sealing member is inserted.

6. In Paragraph 1, The above second heat dissipation member is, An electronic device comprising a body (351) covering a second coupling groove of the bracket and an extension (352) protruding from the body, inserted into the second coupling groove, and in contact with a first portion of the first heat dissipation member.

7. In Paragraph 6, An electronic device further comprising: a second sealing member (370) inserted into an extension of the second heat dissipation member and in close contact with the body and the bracket between the body of the second heat dissipation member and the bracket.

8. In Paragraph 6, The extension of the second heat dissipation member is, An electronic device comprising a recess (353) in which a first portion of the first heat dissipation member is seated.

9. In Paragraph 1, The above bracket is an electronic device coupled with the above hinge device.

10. In Paragraph 1, A fastening portion (401) formed on either the end of the bracket and one of the hinge devices; and An electronic device further comprising: a fastening groove (402) formed at the end of the bracket and on the other one of the hinge devices, into which the fastening part is inserted.

11. In Paragraph 10, The above fastening part is, An electronic device inserted into the fastening groove and fixed within the fastening groove through the fastening part and a pin (403) passing through the fastening groove.

12. In Paragraph 1, The above-mentioned first heat dissipation member is an electronic device that is a heat pipe through which fluid flows.

13. In Paragraph 1, The above bracket is, It includes a first part (500a, 600a) and a second part (500b, 600b) coupled to the first part, and The first coupling groove above is, An electronic device formed by combining the first part and the second part.

14. In Paragraph 1, The above hinge device is, It includes a first hinge portion (211) coupled to the first housing and the second housing, and a second hinge portion (212) spaced apart from the first hinge portion in a direction parallel to the folding axis and coupled to the first housing and the second housing. The above bracket is, An electronic device in which one end is connected to the first hinge part and the other end is connected to the second hinge part.

15. A heat dissipation structure disposed in an electronic device (101, 200) comprising at least one hinge device (210) that rotatably connects a first housing (201) and a second housing (202) with respect to a folding axis (AA), wherein A bracket (300) comprising a first coupling groove (301) extending in a first direction parallel to the folding axis and a second coupling groove (302) extending in a second direction perpendicular to the first direction and connected to the first coupling groove; A first heat dissipation member (340) comprising at least a portion disposed in the first housing and inserted into a first coupling groove of the bracket, and a second portion (342) extending from the first portion; A second heat dissipation member (350) inserted into a second coupling groove of the bracket and in contact with a first portion of the first heat dissipation member inside the bracket, with at least a portion disposed in the second housing; and A heat dissipation structure comprising: a heat transfer material (T) applied to the interior of the bracket and in contact with the first heat dissipation member and the second heat dissipation member.

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