Transparent antenna substrate and antenna device comprising same

Abstract

A transparent antenna substrate according to an embodiment comprises: a transparent base; and an antenna pattern layer disposed on the transparent base, wherein the antenna pattern layer includes a first metal layer disposed on the transparent base and a second metal layer disposed on the first metal layer, the second metal layer includes a first portion containing a first metal material, and a second portion, which is disposed on the first portion and contains a metal oxide of the first metal material, the second portion of the second metal layer being spaced apart from the transparent base.

Description

Transparent antenna substrate and antenna device including the same

[0001] An embodiment relates to a transparent antenna substrate and an antenna device including the same.

[0002] Antennas are an essential component for wireless communication. As communication technologies applied to mobile devices and vehicles advance, and as IoT (Internet on Things) technology develops, the demands on antenna performance are also increasing.

[0003] In particular, technology for applying antennas to displays, windows, etc. is being attempted. To this end, the antenna needs to be implemented as a transparent one. Furthermore, to improve antenna characteristics, the transparent antenna must have a fine width (e.g., 3㎛ or less, or 2.8㎛ or less, or 2.5㎛ or less, or 2㎛ or less).

[0004] To this end, according to conventional technology, a transparent antenna can be realized by coating Ag nanowires on a glass substrate. At this time, in order to improve the performance of the antenna, the concentration and thickness of the Ag nanowires must be increased, but there is a problem that the transmittance of the antenna decreases as the concentration and thickness of the Ag nanowires increase.

[0005] Alternatively, a transparent antenna may be realized by depositing an Ag alloy onto a film using a sputtering technique and then patterning the Ag alloy. However, in this case, there is a problem of inefficiency in terms of cost because a significant amount of time may be required to deposit the Ag alloy to a thickness greater than a certain level using the sputtering technique, and a large amount of Ag alloy may be lost due to the patterning process.

[0006] In addition, according to the prior art, a process is performed to form an antenna pattern layer that fills the recess after forming a recess in a transparent base film. In this case, the manufacturing process becomes complex as the process of forming the recess is added, and furthermore, there are limitations in reducing the width of the antenna pattern layer as the recess must be formed, or there are restrictions on the type of transparent base film for forming the recess.

[0007] Therefore, a new transparent antenna substrate is required to solve the aforementioned problems.

[0008] An embodiment provides a slim transparent antenna substrate and an antenna device including the same.

[0009] In addition, the embodiment provides a transparent antenna substrate having excellent electrical and physical properties and an antenna device including the same.

[0010] In addition, the embodiment provides a transparent antenna substrate that can simplify the manufacturing process and an antenna device including the same.

[0011] In addition, the embodiment provides a transparent antenna substrate with improved antenna characteristics and an antenna device including the same.

[0012] The technical problems to be solved in the proposed embodiments are not limited to those mentioned above, and other unmentioned technical problems will be clearly understood by those skilled in the art to which the proposed embodiments belong from the description below.

[0013] A transparent antenna substrate according to an embodiment comprises a transparent base; and an antenna pattern layer disposed on the transparent base, wherein the antenna pattern layer comprises a first metal layer disposed on the transparent base and a second metal layer disposed on the first metal layer, wherein the second metal layer comprises a first portion comprising a first metal material and a second portion disposed on the first portion comprising an oxide metal of the first metal material, and the second portion of the second metal layer is spaced apart from the transparent base.

[0014] In addition, the first metal layer includes a second metal material different from the first metal material.

[0015] In addition, the first metal material includes copper, and the second metal material includes nickel and chromium.

[0016] Additionally, the second metal layer comprises a first sub-metal layer disposed on the first metal layer and a second sub-metal layer disposed on the first sub-metal layer, and the thickness of the second sub-metal layer in the vertical direction is greater than the thickness of the first sub-metal layer in the vertical direction.

[0017] In addition, the second portion of the second metal layer is provided on the side of the first sub-metal layer, the side of the second sub-metal layer, and the upper surface of the second sub-metal layer.

[0018] In addition, the first sub-metal layer and the second sub-metal layer have different grain sizes.

[0019] In addition, the grain size of the second sub-metal layer is larger than the grain size of the first sub-metal layer.

[0020] Additionally, the first sub-metal layer includes a first surface in contact with the first metal layer and a second surface in contact with the second sub-metal layer, and the first surface and the second surface of the first sub-metal layer have different surface roughness.

[0021] In addition, the second portion of the second metal layer does not overlap with the first metal layer along the horizontal direction.

[0022] In addition, the first metal layer and the second metal layer have the same width in the horizontal direction.

[0023] In addition, the width of the first metal layer in the horizontal direction is smaller than the width of the second metal layer in the horizontal direction, and at least a portion of the second part of the second metal layer does not overlap with the first metal layer along the vertical direction.

[0024] In addition, the transparent antenna substrate further includes a protective layer disposed on the transparent base and the antenna pattern layer and embedding the antenna pattern layer.

[0025] In addition, the antenna pattern layer is arranged in a mesh shape on the transparent base.

[0026] Additionally, the transparent antenna substrate further includes a dummy pattern layer disposed on the transparent base and spaced apart from the antenna pattern layer.

[0027] In addition, the dummy pattern layer has the same layer structure as the antenna pattern layer.

[0028] In addition, the dummy pattern layer includes a plurality of dummy patterns, the plurality of dummy patterns are spaced apart from each other on the transparent base, and the dummy pattern layer connecting the plurality of dummy patterns has a mesh shape corresponding to the mesh shape of the antenna pattern layer.

[0029] A transparent antenna substrate according to an embodiment includes a transparent base and an antenna pattern layer disposed on the transparent base. In this case, the antenna pattern layer may include a first metal layer disposed on the transparent base and a second metal layer disposed on the first metal layer. In this case, the second metal layer may include an oxide layer. Additionally, the oxide layer of the second metal layer may be spaced apart from the transparent base and thus may not come into contact with the transparent base. Through this, the embodiment can improve the antenna characteristics of the antenna pattern layer without affecting the electrical characteristics of the antenna pattern layer by utilizing the oxide layer.

[0030] Additionally, the oxide layer of the second metal layer may be a blackened oxide layer. Through this, the embodiment can prevent the second metal layer and further the antenna pattern layer from being visually perceived from the outside of the transparent antenna substrate. Accordingly, the embodiment can improve product reliability and further enhance design freedom.

[0031] For example, if the second metal layer contains copper, the antenna pattern layer may be recognized from the outside of the transparent antenna substrate due to the color of the copper, and consequently, product satisfaction may be reduced. Therefore, the embodiment comprises a blackened oxide layer in the second metal layer, thereby preventing the antenna pattern layer from being recognized from the outside of the transparent antenna substrate and further improving product satisfaction.

[0032] Additionally, the second metal layer may be provided as a plurality of layers. That is, the second metal layer may include a first sub-metal layer and a second sub-metal layer containing the same metal material. The first sub-metal layer and the second sub-metal layer may have different grain sizes, thereby allowing the interface between them to be distinguished. That is, the grain size of the first sub-metal layer may be smaller than the grain size of the second sub-metal layer. Accordingly, the embodiment forms a second sub-metal layer having a grain size larger than the grain size of the first sub-metal layer on the first sub-metal layer. Through this, the embodiment can further improve the antenna characteristics of the antenna pattern layer. Furthermore, the embodiment can enable the antenna device to operate more stably.

[0033] Additionally, the width of the upper surface and the width of the lower surface of the antenna pattern layer may differ from each other. For example, the width of the first metal layer may differ from the width of the second metal layer. Preferably, the width of the first metal layer may be smaller than the width of the second metal layer. Accordingly, at least a portion of the oxide layer of the second metal layer may not come into contact with the first metal layer.

[0034] That is, the embodiment ensures that the amount of etching of the first metal layer in the process of manufacturing the antenna pattern layer is greater than the amount of etching of the first sub-metal layer. Through this, the embodiment can completely remove the first metal layer on the transparent base, thereby further improving the antenna characteristics.

[0035] Additionally, the transparent antenna substrate may further include a dummy pattern layer spaced apart from the antenna pattern layer on a transparent base. The dummy pattern layer may allow the antenna pattern layer to be disposed on the transparent base with a uniform thickness. Preferably, if the dummy pattern layer is not disposed on the transparent base, it may be difficult to ensure that the antenna pattern layer is disposed with a uniform thickness over the entire area of ​​the transparent base. Therefore, the embodiment may place a dummy pattern layer in the area on the transparent base where the antenna pattern layer is not disposed. Accordingly, the embodiment may make the thickness of the antenna pattern layer uniform and further improve the antenna characteristics.

[0036] In addition, the dummy pattern layer may have a planar shape corresponding to the planar shape of the antenna pattern layer. For example, the dummy pattern layer may have a mesh shape identical to the mesh shape of the antenna pattern layer. Through this, the embodiment can prevent the difference between the dummy pattern layer and the antenna pattern layer from being perceived from the outside, as they have different planar shapes, thereby further improving product satisfaction.

[0037] Additionally, the dummy pattern layer of the embodiment may include a plurality of spaced-apart dummy patterns. Furthermore, the embodiment may have a structure in which the dummy pattern layer includes a plurality of spaced-apart dummy patterns, thereby further preventing the dummy pattern layer from being recognized from the outside.

[0038] FIG. 1 is a perspective view of a transparent antenna substrate according to an embodiment.

[0039] Figure 2 is a plan view of the transparent antenna substrate of Figure 1.

[0040] Figure 3 is a cross-sectional view obtained along the AA' direction of Figure 2.

[0041] FIG. 4 is an enlarged view of one area of ​​FIG. 3 according to the first embodiment.

[0042] Figure 5 is an optical microscope image of the antenna pattern layer of Figure 4.

[0043] FIG. 6 is an enlarged view of one area of ​​FIG. 3 according to a second embodiment.

[0044] Figure 7 is a diagram showing various embodiments of the antenna pattern layer of Figure 2.

[0045] FIG. 8 is a plan view of a transparent antenna substrate according to another embodiment.

[0046] FIG. 9 is a plan view of a transparent antenna substrate according to another embodiment.

[0047] FIGS. 10a to 10h are cross-sectional views showing the manufacturing method of a transparent antenna substrate according to an embodiment in process order.

[0048] FIG. 11 is a perspective view showing an antenna device according to an embodiment.

[0049] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

[0050] However, the technical concept of the present invention is not limited to some of the described embodiments but can be implemented in various different forms, and within the scope of the technical concept of the present invention, one or more of the components among the embodiments may be selectively combined or substituted.

[0051] In addition, terms used in the embodiments of the present invention (including technical and scientific terms) may be interpreted in a sense that is generally understood by those skilled in the art to which the present invention belongs, unless explicitly and specifically defined otherwise. Terms that are commonly used, such as terms defined in advance, may be interpreted in consideration of their meaning in the context of the relevant technology.

[0052] Furthermore, the terms used in the embodiments of the present invention are for the purpose of describing the embodiments and are not intended to limit the present invention. In this specification, the singular form may include the plural form unless specifically stated otherwise in the text, and when described as “and at least one of B and C (or more than one),” it may include one or more of all combinations that can be formed from A, B, and C.

[0053] In addition, terms such as first, second, A, B, (a), (b), etc., may be used when describing the components of the embodiments of the present invention. These terms are used merely to distinguish the components from other components and are not intended to limit the essence, order, or sequence of the components.

[0054] And, where it is stated that a component is 'connected', 'combined', or 'joined' to another component, that component may include not only cases where it is directly connected, combined, or joined to the other component, but also cases where it is 'connected', 'combined', or 'joined' due to another component located between the component and the other component.

[0055] Furthermore, when described as being formed or placed on the “top or bottom” of each component, “top or bottom” includes not only cases where two components are in direct contact with each other, but also cases where one or more other components are formed or placed between the two components. Additionally, when expressed as “top or bottom,” it may include the meaning of a downward direction as well as an upward direction relative to a single component.

[0056]

[0057] FIG. 1 is a perspective view of a transparent antenna substrate according to an embodiment, FIG. 2 is a plan view of the transparent antenna substrate of FIG. 1, FIG. 3 is a cross-sectional view obtained along the AA' direction of FIG. 2, FIG. 4 is an enlarged view of one area of ​​FIG. 3 according to a first embodiment, FIG. 5 is an optical microscope photograph of the antenna pattern layer of FIG. 4, FIG. 6 is an enlarged view of one area of ​​FIG. 3 according to a second embodiment, FIG. 7 is a drawing showing various embodiments of the antenna pattern layer of FIG. 2, FIG. 8 is a plan view of a transparent antenna substrate according to another embodiment, and FIG. 9 is a plan view of a transparent antenna substrate according to yet another embodiment.

[0058] Hereinafter, a transparent antenna substrate according to an embodiment will be described in detail with reference to FIGS. 1 to 9.

[0059] Referring to FIGS. 1 to 3, the transparent antenna substrate (100) includes a transparent base (110), an antenna pattern layer (120), and a protective layer (130).

[0060] At this time, although the antenna pattern layer (120) is depicted in the drawing as being placed on only one side of the transparent base (110), it is not limited thereto. For example, the antenna pattern layer (120) may be placed on both sides of the transparent base (110).

[0061] The transparent base (110) may include a flexible transparent film. The transparent film used in the transparent base (110) may be made of any one of the following: polyethylene terephthalate (PET) film, Teflon film, polycarbonate (PC) film, acrylonitrile-butadiene-styrene copolymer (ABS) film, polymethyl methacrylate (PMMA) film, polyethylene naphthalate (PEN) film, polyether sulfone (PES) film, cyclic olefin copolymer (COC) film, triacetylcellulose (TAC) film, polyvinyl alcohol (PVA) film, polyimide (PI) film, and polystyrene (PS) film. This is just one example and is not necessarily limited thereto.

[0062] Here, the Teflon film may be made of a resin made of polytetrafluoroethylene (PTFE). When the transparent base (110) is a PET film, a dielectric constant of about 3.4 can be obtained, and when it is a Teflon film, a dielectric constant of about 2.5 can be obtained. Accordingly, when the transparent base (110) is a PET film or a Teflon film, especially when the transparent base (110) is a Teflon film, a transparent antenna that has a low dielectric constant and flexibility and can be applied to a curved surface can be obtained.

[0063] An antenna pattern layer (120) may be disposed on a transparent base (110). An antenna pattern layer (120) may be disposed on the transparent base (110) such that it extends from one another along a plurality of horizontal directions. For example, the antenna pattern layer (120) may include a first conductive line disposed in a first horizontal direction (D1) on the transparent base (110), and a second conductive line disposed in a second horizontal direction (D2) different from the first horizontal direction (D1). Additionally, the first conductive line and the second conductive line of the antenna pattern layer (120) may intersect each other. For example, the antenna pattern layer (120) may have a mesh shape and be disposed on the transparent base (110).

[0064] A protective layer (130) may be placed on a transparent base (110). The protective layer (130) may be placed on the transparent base (110) while embedding an antenna pattern layer (120). The protective layer (130) may include an insulating material. The protective layer (130) may protect the antenna pattern layer (120) placed on the transparent base (110). The protective layer (130) may include any one of a solder resist, an adhesive member, an optically clear adhesive (OCA), and an optically clear resin (OCR).

[0065] Referring to FIG. 4, the antenna pattern layer (120) may include a plurality of metal layers disposed on a transparent base (110).

[0066] For example, the antenna pattern layer (120) may include a first metal layer (121) disposed on a transparent base (110) and a second metal layer (122) disposed on the first metal layer (121). In this case, the first metal layer (121) and the second metal layer (122) may include different metal materials.

[0067] The first metal layer (121) may be disposed on a transparent base (110). The first metal layer (121) may be a seed layer. For example, the first metal layer (121) may function as a seed layer for forming a second metal layer (122) of an antenna pattern layer (120) on the transparent base (110) by electroplating.

[0068] For example, as the adhesion between the second metal layer (122) and the transparent base (110) is low, it may be difficult to directly place the transparent base (110) on the second metal layer (122). Therefore, the first metal layer (121) can also function as a buffer layer that is placed on the transparent base (110) to improve adhesion with the transparent base (110).

[0069] At this time, the first metal layer (121) may include nickel and chromium. That is, the first metal layer (121) may include a metal material that functions as a seed layer for forming the second metal layer (122) by electroplating, and as a buffer layer that can improve adhesion with the transparent base (110).

[0070] The first metal layer (121) can be formed on a transparent base (110) by a sputtering method. However, the embodiment is not limited thereto, and the first metal layer (121) can be formed by other methods to have a uniform thickness to function as a seed layer and a buffer layer.

[0071] The first metal layer (121) may be disposed on the transparent base (110) with a certain thickness. The thickness (T1) of the first metal layer (121) in the vertical direction (D3) may satisfy a range of 0.01 μm to 0.1 μm, or 0.01 μm to 0.08 μm, or 0.01 μm to 0.02 μm. If the thickness (T1) in the vertical direction (D3) of the first metal layer (121) is less than 0.01 μm, it may be difficult to form the first metal layer (121) on the transparent base (110) with a uniform thickness. Additionally, if the thickness (T1) in the vertical direction (D3) of the first metal layer (121) is less than 0.01 μm, the adhesion between the first metal layer (121) and the transparent base (110) may be reduced. Additionally, if the thickness (T1) in the vertical direction (D3) of the first metal layer (121) is less than 0.01 μm, the first metal layer (121) may have difficulty functioning as a seed layer. Also, if the thickness (T1) in the vertical direction (D3) of the first metal layer (121) exceeds 0.1 μm, the process time in the process of removing the first metal layer (121) by etching may increase. Additionally, if the thickness (T1) in the vertical direction (D3) of the first metal layer (121) exceeds 0.1 μm, the manufacturing cost may increase.

[0072] A second metal layer (122) may be disposed on the first metal layer (121). The second metal layer (122) may be disposed on the first metal layer (121) and may include a metal material different from the metal material of the first metal layer (121). For example, the second metal layer (122) may include copper. However, the embodiments are not limited thereto, and the second metal layer (122) may include other metal materials that can improve antenna characteristics while including a metal material different from the first metal layer (121).

[0073] At this time, the second metal layer (122) may be provided as a plurality of layers on the first metal layer (121). For example, the second metal layer (122) may be provided as a plurality of layers formed in different ways.

[0074] The second metal layer (122) may include a first sub-metal layer (122-1) disposed on the first metal layer (121), and a second sub-metal layer (122-2) disposed on the first sub-metal layer (122-1). Additionally, the first sub-metal layer (122-1) and the second sub-metal layer (122-2) may each include the same metal material, for example, copper.

[0075] The first sub-metal layer (122-1) can be formed on the first metal layer (121) by performing an electroplating process with the first metal layer (121) as a seed layer. The first sub-metal layer (122-1) can be disposed on the first metal layer (121) with a certain thickness. The thickness (T2) of the first sub-metal layer (122-1) in the vertical direction (D3) can have a range of 0.2㎛ to 1.2㎛, or 0.3㎛ to 1.0㎛, or 0.4㎛ to 0.8㎛.

[0076] If the thickness (T2) in the vertical direction (D3) of the first sub-metal layer (122-1) is less than 0.2 μm, it may be difficult to form a second sub-metal layer (122-2) having a uniform thickness on the first sub-metal layer (122-1). Additionally, if the thickness (T2) in the vertical direction (D3) of the first sub-metal layer (122-1) exceeds 1.2 μm, the process time in the process of finally removing the first sub-metal layer (122-1) by etching may increase. Furthermore, if the thickness (T2) in the vertical direction (D3) of the first sub-metal layer (122-1) exceeds 1.2 μm, the width of the antenna pattern layer (120) in the horizontal direction may decrease, and the antenna characteristics may be degraded. In addition, if the thickness (T2) in the vertical direction (D3) of the first sub-metal layer (122-1) exceeds 1.2 μm, electrical characteristics such as open conduction lines of the antenna pattern layer may be degraded.

[0077] At this time, the transparent base (110), the first metal layer (121), and the first sub-metal layer (122-1) may be raw materials that serve as the basis for manufacturing the transparent antenna substrate (100). For example, the embodiment may manufacture the transparent antenna substrate (100) using a raw material in which the transparent base (110), the first metal layer (121), and the second sub-metal layer (122-1) are stacked along the vertical direction (D3).

[0078] Here, the thickness of the first sub-metal layer (122-1) in the original material in the vertical direction (D3) may be greater than 2 μm, or greater than 2.5 μm, or greater than 3 μm. Accordingly, in the process of manufacturing the transparent antenna substrate (100), the embodiment may perform a process of reducing the thickness of the first sub-metal layer (122-1) of the original material, thereby allowing the thickness (T2) of the above-described range to be obtained.

[0079] Accordingly, the first sub-metal layer (122-1) may include surfaces having different surface roughness. For example, the first sub-metal layer (122-1) may include a first surface in contact with the first metal layer (121), and a second surface opposite to the first surface and in contact with the first sub-metal layer (122-1). In addition, the first surface and the second surface of the first sub-metal layer (122-1) may have different surface roughness. For example, the first surface of the first sub-metal layer (122-1) may follow the surface roughness of the original material, and the second surface of the first sub-metal layer (122-1) may have a surface roughness different from the first surface by a process of thinning the thickness. For example, the surface roughness of the second surface of the first sub-metal layer (122-1) may be greater than the surface roughness of the first surface of the first sub-metal layer (122-1). Through this, the embodiment can further improve the adhesion between the first sub-metal layer (122-1) and the second sub-metal layer (122-2).

[0080] The second sub-metal layer (122-2) can be formed by performing electroplating on the first sub-metal layer (122-1). The thickness (T3) in the vertical direction (D3) of the second sub-metal layer (122-2) may be different from the thickness (T2) in the vertical direction (D3) of the first sub-metal layer (122-1). Preferably, the thickness (T3) in the vertical direction (D3) of the second sub-metal layer (122-2) may be greater than the thickness (T2) in the vertical direction (D3) of the first sub-metal layer (122-1).

[0081] The first sub-metal layer (122-1) and the second sub-metal layer (122-2) contain the same metal material but are formed by different equipment, and thus have different grain sizes, so the interface between them can be distinguished.

[0082] That is, referring to FIG. 5, the interface between the first sub-metal layer (122-1) and the second sub-metal layer (122-2) can be distinguished. Additionally, the grain size of the first sub-metal layer (122-1) may be smaller than the grain size of the second sub-metal layer (122-2). Accordingly, the embodiment forms a second sub-metal layer (122-2) having a grain size larger than the grain size of the first sub-metal layer (122-1) on the first sub-metal layer (122-1). Through this, the embodiment can further improve the antenna characteristics of the antenna pattern layer (120). Furthermore, the embodiment can enable the antenna device to operate more stably.

[0083] The thickness (T3) in the vertical direction (D3) of the second sub-metal layer (122-2) may have a range of 1 μm to 5 μm. If the thickness (T3) in the vertical direction (D3) of the second sub-metal layer (122-1) is less than 1 μm, the antenna characteristics may be degraded. Additionally, if the thickness (T3) in the vertical direction (D3) of the second sub-metal layer (122-2) exceeds 5 μm, the width (W1) in the horizontal direction of the second sub-metal layer (122-2) may increase, and thereby it may be difficult for the antenna pattern layer (120) to have a width within the target range.

[0084] That is, an antenna pattern layer (120) comprising a first metal layer (121), a first sub-metal layer (122-1), and a second sub-metal layer (122-2) may be disposed on a transparent base (110) having a certain width (W1). For example, the width (W1) of the antenna pattern layer (120) may be 3 μm or less, or 2.8 μm or less, or 2.5 μm or less, or 2 μm or less. Through this, the embodiment may have the antenna pattern layer (120) comprising a first metal layer (121), a first sub-metal layer (122-1), and a second sub-metal layer (122-2) having a thickness within the above-described range, thereby allowing the antenna pattern layer (120) to have a fine width (W1) within the above-described range.

[0085] At this time, the second metal layer (122) may be divided into multiple parts. For example, the second metal layer (122) may include a first part containing a metal material corresponding to copper, and a second part disposed on the first part and containing a metal oxide. For example, the second part of the second metal layer (122) may contain copper oxide.

[0086] That is, the second metal layer (122) may include an oxide layer formed by oxidizing a chemical. In other words, a portion of the second metal layer (122) may be made to include an oxide layer by using a chemical.

[0087] At this time, the oxide layer of the second metal layer (122) may be a blackened oxide layer. Through this, the embodiment can prevent the second metal layer (122) and further the antenna pattern layer (120) from being visually recognized from the outside of the transparent antenna substrate (100). Accordingly, the embodiment can improve product reliability and further enhance design freedom.

[0088] For example, if the second metal layer (122) contains copper, the antenna pattern layer (120) may be recognized from the outside of the transparent antenna substrate (100) due to the color of the copper, and thus product satisfaction may be reduced. Therefore, the embodiment may include a blackened oxide layer in the second metal layer (122), thereby preventing the antenna pattern layer (120) from being recognized from the outside of the transparent antenna substrate (100), and thus further improve product satisfaction.

[0089] That is, each of the first sub-metal layer (122-1) and the second sub-metal layer (122-2) may include an oxide layer.

[0090] For example, the first sub-metal layer (122-1) may include a first part (122-1a) containing copper, and a second part (122-1b) disposed on the first part (122-1a). For example, the second part (122-1b) of the first sub-metal layer (122-1) may be disposed on the side of the first part (122-1a). For example, in the oxidation process, the upper and lower surfaces of the first sub-metal layer (122-1) are covered with the second sub-metal layer (122-2) and the first metal layer (121), and accordingly, the second part (122-1b) of the first sub-metal layer (122-1) may be disposed only on the side of the first part (122-1a) of the first sub-metal layer (122-1).

[0091] Additionally, the second sub-metal layer (122-2) may include a first part (122-2a) containing copper, and a second part (122-2b) disposed on the first part (122-2a). For example, the second part (122-2b) of the second sub-metal layer (122-2) may be disposed on the upper surface and side surface of the first part (122-2a). For example, in the oxidation process, the lower surface of the second sub-metal layer (122-2) is covered with the second sub-metal layer (122-2), and accordingly, the second part (122-2b) of the second sub-metal layer (122-2) may be disposed on the upper surface and side surface of the first part (122-2a) of the second sub-metal layer (122-2).

[0092] At this time, the thickness of the oxide layer of the second metal layer (122) may have a range of 0.3 μm to 0.6 μm. For example, the thickness of the second part (122-1b) of the first sub-metal layer (122-1) and the second part (122-2b) of the second sub-metal layer (122-2) may have a range of 0.3 μm to 0.6 μm. Through this, the embodiment can use the oxide layer so as not to affect the electrical characteristics of the antenna pattern layer (120).

[0093] Additionally, the oxide layer of the second metal layer (122) may not come into contact with the transparent base (110). That is, the oxide layer of the second metal layer (122) may be spaced apart from the transparent base (110) with the first metal layer (121) in between.

[0094] At this time, the width of the upper surface and the width of the lower surface of the antenna pattern layer (120) may be the same. That is, the width of the first metal layer (121) in the horizontal direction, the width of the first sub-metal layer (122-1), and the width of the second sub-metal layer (122-2) may be the same as each other.

[0095] Additionally, referring to FIG. 6, the width of the upper surface and the width of the lower surface of the antenna pattern layer (120) may be different from each other. For example, the width of the first metal layer (121) may be different from the width of the second metal layer (122). Preferably, the width of the first metal layer (121) may be smaller than the width of the second metal layer (122). Thus, at least a portion of the oxide layer of the second metal layer (122) may not come into contact with the first metal layer (121).

[0096] That is, the embodiment is configured such that the amount of etching of the first metal layer (121) in the process of manufacturing the antenna pattern layer (120) is greater than the amount of etching of the first sub-metal layer (122-1). Through this, the embodiment can completely remove the first metal layer (121) on the transparent base (110), thereby further improving the antenna characteristics.

[0097] Meanwhile, referring to FIG. 7, the antenna pattern layer (120) can be arranged on the transparent base (110) with various shapes. For example, as shown in FIG. 2, the antenna pattern layer (120) can have a square mesh shape and be arranged on the transparent base (110).

[0098] Also, referring to FIG. 7 (a), the antenna pattern layer (120) may have a honeycomb-shaped hexagonal shape.

[0099] Also, referring to Fig. 7(b), the antenna pattern layer (120) may have a rhombus shape.

[0100] However, the shape of the antenna pattern layer (120) of the embodiment is not limited thereto, and the antenna pattern layer (120) may have a regular mesh shape such as a polygonal shape, a triangular shape, or a circular shape, or may have an irregular mesh shape in which various shapes are combined.

[0101] Meanwhile, referring to FIG. 8, the transparent antenna substrate (100) may further include a dummy pattern layer (140) disposed on a transparent base (110). The dummy pattern layer (140) may be disposed on the transparent base (110) spaced apart from the antenna pattern layer (120).

[0102] The dummy pattern layer (140) can allow the antenna pattern layer (120) to be placed on the transparent base (110) with a uniform thickness. Preferably, if the dummy pattern layer (140) is not placed on the transparent base (110), it may be difficult to place the antenna pattern layer (120) with a uniform thickness over the entire area of ​​the transparent base (110). Therefore, the embodiment may place the dummy pattern layer (140) in an area on the transparent base (110) where the antenna pattern layer (120) is not placed. Accordingly, the embodiment may make the thickness of the antenna pattern layer (120) uniform and further improve the antenna characteristics.

[0103] Additionally, the dummy pattern layer (140) may have a planar shape corresponding to the planar shape of the antenna pattern layer (120). For example, the dummy pattern layer (140) may have a mesh shape identical to the mesh shape of the antenna pattern layer (120). Through this, the embodiment can prevent the difference between the dummy pattern layer (140) and the antenna pattern layer (120) from being recognized from the outside as they have different planar shapes, thereby further improving product satisfaction.

[0104] At this time, the dummy pattern layer (140) may include a conductive line connected throughout.

[0105] Alternatively, referring to FIG. 9, the dummy pattern layer (140) may include a plurality of spaced-apart dummy patterns (141, 142). Additionally, the embodiment may have a structure in which the dummy pattern layer (140) includes a plurality of spaced-apart dummy patterns (141, 142), thereby further preventing the dummy pattern layer (140) from being recognized from the outside.

[0106]

[0107] FIGS. 10a to 10h are cross-sectional views showing the manufacturing method of a transparent antenna substrate according to an embodiment in process order.

[0108] Referring to FIG. 10a, the embodiment may prepare a base material for manufacturing a transparent antenna substrate (100). For example, the embodiment may prepare a raw material for manufacturing a transparent antenna substrate (100).

[0109] For example, an embodiment may prepare a base material in which a transparent base (110), a first metal layer (121), and a first sub-metal layer (122-1) are laminated along a vertical direction (D3). In this case, the first sub-metal layer (122-1) in the base material may have a thickness (T2') exceeding 2 μm.

[0110] Subsequently, referring to FIG. 10b, the embodiment may perform a process to reduce the thickness (T2') of the first sub-metal layer (122-1) in the original material. That is, the embodiment may perform a process to have the thickness (T2) of the first sub-metal layer (122-1) in the range of 0.2㎛ to 1.2㎛, or 0.3㎛ to 1.0㎛, or 0.4㎛ to 0.8㎛.

[0111] Next, referring to FIG. 10c, the embodiment may proceed with the process of forming a mask (M1) on the first sub-metal layer (122-1). That is, the embodiment may form a mask (M1) including an open region on the first sub-metal layer (122-1). At this time, the open region in the mask (M1) may be provided to correspond to the region where the antenna pattern layer (120) is to be placed, preferably the region where the second sub-metal layer (122-2) is to be placed.

[0112] Next, referring to FIG. 10d, the embodiment may proceed with a plating process to fill the open area of ​​the mask (M1). For example, the embodiment may proceed with an electrolytic plating process to form a second sub-metal layer (122-2) that fills the open area of ​​the mask (M1) by using the first metal layer (121) and the first sub-metal layer (122-1) as seed layers.

[0113] Next, referring to FIG. 10e, the embodiment can proceed with a process of removing the mask (M1).

[0114] Subsequently, referring to FIG. 10f, the embodiment may proceed with a process of removing the first metal layer (121) and the first sub-metal layer (122-1) by etching. Specifically, the embodiment may proceed with a process of removing the first metal layer (121) and the first sub-metal layer (122-1) in an area that does not overlap with the second sub-metal layer (122-2) along the vertical direction (D3).

[0115] Next, referring to FIG. 10g, the embodiment may proceed with a process of oxidizing the exposed surfaces of the first sub-metal layer (122-1) and the second sub-metal layer (122-2). Preferably, the embodiment may blacken the exposed surfaces of the first sub-metal layer (122-1) and the second sub-metal layer (122-2). Accordingly, the embodiment may have each of the first sub-metal layer (122-1) and the second sub-metal layer (122-2) include a first part (122-1a, 122-2a), and a second part (122-1b, 122-2b), which is an oxide layer disposed on the first part (122-1a, 122-2a).

[0116] Next, referring to FIG. 10h, the embodiment may form a protective layer (130) that embeds a first metal layer (121), a first sub-metal layer (122-1), and a second sub-metal layer (122-2) on a transparent base (110).

[0117]

[0118] FIG. 11 is a perspective view showing an antenna device according to an embodiment.

[0119] Referring to FIG. 11, the antenna device may include a feed substrate (200) and a transparent antenna substrate (100).

[0120] The transparent antenna substrate (100) may be the transparent antenna substrate (100) described in FIGS. 1 to 9. In this case, the transparent antenna substrate (100) of the embodiment may operate in a coupling manner. For example, the antenna pattern layer (120) of the transparent antenna substrate (100) may be electrically coupled with the feed substrate (200) to transmit and receive antenna signals.

[0121] Through this, a feed substrate (200) can be placed at a position spaced apart from the transparent antenna substrate (100).

[0122] The power supply board (200) may include an insulating base (210), a power supply line (220) disposed on the lower surface of the insulating base (210), and a ground pattern (230) disposed on the upper surface of the insulating base (210). In addition, the power supply line (220) and the ground pattern (230) in the power supply board (200) may be electrically connected through a via (not shown) penetrating the insulating base (210) along the vertical direction (D3).

[0123]

[0124] A transparent antenna substrate according to an embodiment includes a transparent base and an antenna pattern layer disposed on the transparent base. In this case, the antenna pattern layer may include a first metal layer disposed on the transparent base and a second metal layer disposed on the first metal layer. In this case, the second metal layer may include an oxide layer. Additionally, the oxide layer of the second metal layer may be spaced apart from the transparent base and thus may not come into contact with the transparent base. Through this, the embodiment can improve the antenna characteristics of the antenna pattern layer without affecting the electrical characteristics of the antenna pattern layer by utilizing the oxide layer.

[0125] Additionally, the oxide layer of the second metal layer may be a blackened oxide layer. Through this, the embodiment can prevent the second metal layer and further the antenna pattern layer from being visually perceived from the outside of the transparent antenna substrate. Accordingly, the embodiment can improve product reliability and further enhance design freedom.

[0126] For example, if the second metal layer contains copper, the antenna pattern layer may be recognized from the outside of the transparent antenna substrate due to the color of the copper, and consequently, product satisfaction may be reduced. Therefore, the embodiment comprises a blackened oxide layer in the second metal layer, thereby preventing the antenna pattern layer from being recognized from the outside of the transparent antenna substrate and further improving product satisfaction.

[0127] Additionally, the second metal layer may be provided as a plurality of layers. That is, the second metal layer may include a first sub-metal layer and a second sub-metal layer containing the same metal material. The first sub-metal layer and the second sub-metal layer may have different grain sizes, thereby allowing the interface between them to be distinguished. That is, the grain size of the first sub-metal layer may be smaller than the grain size of the second sub-metal layer. Accordingly, the embodiment forms a second sub-metal layer having a grain size larger than the grain size of the first sub-metal layer on the first sub-metal layer. Through this, the embodiment can further improve the antenna characteristics of the antenna pattern layer. Furthermore, the embodiment can enable the antenna device to operate more stably.

[0128] Additionally, the width of the upper surface and the width of the lower surface of the antenna pattern layer may differ from each other. For example, the width of the first metal layer may differ from the width of the second metal layer. Preferably, the width of the first metal layer may be smaller than the width of the second metal layer. Accordingly, at least a portion of the oxide layer of the second metal layer may not come into contact with the first metal layer.

[0129] That is, the embodiment ensures that the amount of etching of the first metal layer in the process of manufacturing the antenna pattern layer is greater than the amount of etching of the first sub-metal layer. Through this, the embodiment can completely remove the first metal layer on the transparent base, thereby further improving the antenna characteristics.

[0130] Additionally, the transparent antenna substrate may further include a dummy pattern layer spaced apart from the antenna pattern layer on a transparent base. The dummy pattern layer may allow the antenna pattern layer to be disposed on the transparent base with a uniform thickness. Preferably, if the dummy pattern layer is not disposed on the transparent base, it may be difficult to ensure that the antenna pattern layer is disposed with a uniform thickness over the entire area of ​​the transparent base. Therefore, the embodiment may place a dummy pattern layer in the area on the transparent base where the antenna pattern layer is not disposed. Accordingly, the embodiment may make the thickness of the antenna pattern layer uniform and further improve the antenna characteristics.

[0131] In addition, the dummy pattern layer may have a planar shape corresponding to the planar shape of the antenna pattern layer. For example, the dummy pattern layer may have a mesh shape identical to the mesh shape of the antenna pattern layer. Through this, the embodiment can prevent the difference between the dummy pattern layer and the antenna pattern layer from being perceived from the outside, as they have different planar shapes, thereby further improving product satisfaction.

[0132] Additionally, the dummy pattern layer of the embodiment may include a plurality of spaced-apart dummy patterns. Furthermore, the embodiment may have a structure in which the dummy pattern layer includes a plurality of spaced-apart dummy patterns, thereby further preventing the dummy pattern layer from being recognized from the outside.

Claims

1. Transparent base; and It includes an antenna pattern layer disposed on the above-mentioned transparent base, and The above antenna pattern layer is, It includes a first metal layer disposed on the transparent base, and a second metal layer disposed on the first metal layer, The second metal layer comprises a first part including a first metal material, and a second part disposed on the first part and including an oxide metal of the first metal material. The second portion of the second metal layer is a transparent antenna substrate spaced apart from the transparent base.

2. In Paragraph 1, A transparent antenna substrate comprising a first metal layer having a second metal material different from the first metal material.

3. In Paragraph 2, The first metal material above includes copper, and The above second metal material is a transparent antenna substrate comprising nickel and chromium.

4. In Paragraph 1, The second metal layer comprises a first sub-metal layer disposed on the first metal layer and a second sub-metal layer disposed on the first sub-metal layer, and A transparent antenna substrate in which the thickness in the vertical direction of the second sub-metal layer is greater than the thickness in the vertical direction of the first sub-metal layer.

5. In Paragraph 4, The second portion of the second metal layer is a transparent antenna substrate provided on the side of the first sub-metal layer, the side of the second sub-metal layer, and the upper surface of the second sub-metal layer.

6. In Paragraph 4, A transparent antenna substrate having a first sub-metal layer and a second sub-metal layer having different grain sizes.

7. In Paragraph 6, A transparent antenna substrate in which the grain size of the second sub-metal layer is larger than the grain size of the first sub-metal layer.

8. In Paragraph 4, The first sub-metal layer includes a first surface in contact with the first metal layer and a second surface in contact with the second sub-metal layer, and A transparent antenna substrate having a first surface and a second surface of the first sub-metal layer having different surface roughness.

9. In Paragraph 1, A transparent antenna substrate in which the second portion of the second metal layer does not overlap with the first metal layer along the horizontal direction.

10. In Paragraph 1, A transparent antenna substrate having the same width in the horizontal direction as the first metal layer and the second metal layer.

11. In Paragraph 1, The width of the first metal layer in the horizontal direction is smaller than the width of the second metal layer in the horizontal direction, and A transparent antenna substrate in which at least a portion of the second part of the second metal layer does not overlap with the first metal layer along the vertical direction.

12. In Paragraph 1, A transparent antenna substrate further comprising a protective layer disposed on the above-mentioned transparent base and the above-mentioned antenna pattern layer and embedding the above-mentioned antenna pattern layer.

13. In Paragraph 1, The above antenna pattern layer is a transparent antenna substrate arranged in a mesh shape on the transparent base.

14. In Paragraph 13, A transparent antenna substrate further comprising a dummy pattern layer disposed on the transparent base and spaced apart from the antenna pattern layer.

15. In Paragraph 14, A transparent antenna substrate having the same layer structure as the dummy pattern layer above, the same layer structure as the antenna pattern layer above.

16. In Paragraph 14, The above dummy pattern layer includes a plurality of dummy patterns, and The plurality of dummy patterns are spaced apart from each other on the transparent base, A transparent antenna substrate having a dummy pattern layer connecting the plurality of dummy patterns, the dummy pattern layer having a mesh shape corresponding to the mesh shape of the antenna pattern layer.

17. A feed board including feed lines and ground patterns, and It includes a transparent antenna substrate disposed on the above-mentioned feed substrate and electrically coupled to the feed line and the ground pattern of the above-mentioned feed substrate, and The above transparent antenna substrate is Transparent base; and It includes an antenna pattern layer disposed on the above-mentioned transparent base, and The antenna pattern layer comprises a first metal layer disposed on the transparent base and a second metal layer disposed on the first metal layer, and The second metal layer comprises a first part including a first metal material, and a second part disposed on the first part and including an oxide metal of the first metal material. The second part of the second metal layer is a transparent antenna device spaced apart from the transparent base.

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