Camera module

Abstract

A camera module is provided. The camera module according to an aspect of the present invention comprises: a base including a lower plate part and a side plate protruding upward from the upper surface of the lower plate part, the base having a first adhesive part disposed in one region of the side plate; and a substrate disposed on the outer surface of the side plate and having a second adhesive part disposed in the region corresponding to the one region of the side plate, wherein the second adhesive part includes a light-transmitting layer disposed on the outer surface of the substrate and made of a light-transmitting material, and the first adhesive part and the second adhesive part may be disposed so as to overlap each other in the direction from the one region of the side plate to the substrate.

Description

Camera module

[0001] The present invention relates to a camera module.

[0002] A camera is a device that captures subjects in photos or videos, and it is mounted on portable devices, drones, vehicles, etc. To improve image quality, camera modules may feature Image Stabilization (IS) to correct or prevent image shake caused by user movement, Auto Focusing (AF) to automatically adjust the distance between the image sensor and the lens to align the lens focal length, and Zooming to increase or decrease the magnification of distant subjects using a zoom lens.

[0003] To implement the aforementioned functions, the camera module includes a substrate, and at least one electronic component is disposed on the surface of the substrate. The substrate is coupled to a body that forms the external shape of the camera module. However, since insufficient coupling force between the substrate and the body may impair the configuration function of the camera module, it is necessary to ensure sufficient coupling force between multiple components.

[0004] The bonding of the substrate and body is typically achieved through thermal curing using organic adhesives. However, problems can arise where the substrate is bonded to the body while misaligned during the alignment process prior to adhesion, or where thermal expansion occurs as the temperature rises during the curing process, leading to reduced adhesion or delamination of the substrate from the body. In particular, as camera modules become smaller, the bonding space between the substrate and the body shrinks and bonding within a narrow area is required, which can cause these issues to occur more frequently. Consequently, damage or operational errors may occur during the camera module assembly process, resulting in reduced product reliability.

[0005] The problem that the present invention aims to solve is to provide a camera module capable of improving adhesion between a base and a substrate by utilizing a light-transmitting layer, a metal part, and solder.

[0006] A camera module according to one aspect of the present invention for achieving the above objective is,

[0007] A base comprising a lower plate and a side plate protruding upward from the upper surface of the lower plate, wherein a first adhesive portion is disposed in a portion of the side plate; and a substrate disposed on the outer surface of the side plate and wherein a second adhesive portion is disposed in a portion corresponding to a portion of the side plate, wherein the second adhesive portion comprises a light-transmitting layer disposed on the outer surface of the substrate and made of a light-transmitting material, and wherein the first adhesive portion and the second adhesive portion may be disposed so as to overlap each other in the direction of the substrate in a portion of the side plate.

[0008] Through this embodiment, the camera module is bonded by positioning a first adhesive part and a second adhesive part on the base and the substrate, respectively, at mutually overlapping locations, thereby enabling the base and the substrate to be aligned accurately and without error. In particular, since bonding is possible while the base and the substrate are precisely fixed even with the miniaturization of the substrate and base, the assembly process is facilitated, and product reliability is improved due to the alignment.

[0009] In addition, since adhesion is possible by irradiating a laser onto the light-transmitting layer when the first and second adhesive parts are bonded, not only is adhesion easy, but because the second adhesive part is positioned at one end, which is the bonding starting point of the substrate, the process of placing the substrate on the base after bonding the first and second adhesive parts is facilitated.

[0010] FIG. 1 is a perspective view of a camera module according to the present embodiment.

[0011] FIG. 2 is an exploded perspective view of a camera module according to the present embodiment.

[0012] FIG. 3 is a perspective view of a base and a substrate according to the present embodiment.

[0013] FIG. 4 is a perspective view of an AF carrier according to the present embodiment.

[0014] FIG. 5 is a cross-sectional view taken along line A-A' of FIG. 1.

[0015] FIG. 6 is a diagram illustrating a magnetic levitation operation according to another embodiment of the present invention.

[0016] FIG. 7 is a cross-sectional view of a camera module according to the present embodiment.

[0017] FIG. 8 is an enlarged view of areas A and B of FIG. 7.

[0018] FIG. 9 is a cross-sectional view of a camera module according to another embodiment of the present invention.

[0019] FIG. 10 is a cross-sectional view of a camera module according to another embodiment of the present invention.

[0020] FIG. 11 is a cross-sectional view of FIG. 10 seen from a different angle.

[0021] FIG. 12 is a cross-sectional view of a camera module according to another embodiment of the present invention.

[0022] FIG. 13 is an enlarged view of regions P and Q of FIG. 12.

[0023] FIG. 14 is a perspective view of FIG. 3 seen from a different angle.

[0024] FIG. 15 is a perspective view of a base according to an embodiment of the present invention.

[0025] FIG. 16 is a perspective view of a substrate according to an embodiment of the present invention.

[0026] FIG. 17 is a plan view of a flattened substrate according to an embodiment of the present invention.

[0027] FIG. 18 is a cross-sectional view of the BB' region of FIG. 16.

[0028] FIG. 21 is an exploded perspective view of a camera device according to the present embodiment.

[0029] FIG. 22 is a perspective view of a mobile terminal with a camera module applied according to the present embodiment.

[0030] FIG. 23 is a perspective view of a mobile terminal with a camera module applied according to another embodiment of the present invention.

[0031] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

[0032] However, the technical concept of the present invention is not limited to some of the described embodiments but can be implemented in various different forms, and within the scope of the technical concept of the present invention, one or more of the components among the embodiments may be selectively combined or substituted.

[0033] In addition, terms used in the embodiments of the present invention (including technical and scientific terms) may be interpreted in a sense that is generally understood by those skilled in the art to which the present invention belongs, unless explicitly and specifically defined otherwise. Terms that are commonly used, such as terms defined in advance, may be interpreted in consideration of their meaning in the context of the relevant technology.

[0034] Furthermore, the terms used in the embodiments of the present invention are for the purpose of describing the embodiments and are not intended to limit the present invention.

[0035] In this specification, the singular form may include the plural form unless specifically stated otherwise in the text, and when described as "at least one of A and B and C (or more than one)," it may include one or more of all combinations that can be formed from A, B, and C.

[0036] In addition, terms such as first, second, A, B, (a), (b), etc., may be used when describing the components of the embodiments of the present invention. These terms are used merely to distinguish the components from other components and are not intended to limit the essence, order, or sequence of the components.

[0037] And, where it is stated that a component is 'connected', 'combined', or 'connected' to another component, this may include not only cases where the component is directly 'connected', 'combined', or 'connected' to the other component, but also cases where it is 'connected', 'combined', or 'connected' due to another component located between the component and the other component.

[0038] Furthermore, when described as being formed or placed "above" or "below" each component, "above" or "below" includes not only cases where two components are in direct contact with each other, but also cases where one or more other components are formed or placed between the two components. Additionally, when expressed as "above" or "below," it may include the meaning of a downward direction as well as an upward direction relative to a single component.

[0039] As used below, the 'Optical Axis Direction' is defined as the optical axis direction of the lens and / or image sensor coupled to the lens driving device.

[0040] As used below, the 'vertical direction' may be a direction parallel to or the same as the optical axis. The vertical direction may correspond to the 'z-axis direction'. As used below, the 'horizontal direction' may be a direction perpendicular to the vertical direction. That is, the horizontal direction may be a direction perpendicular to the optical axis. Therefore, the horizontal direction may include the 'x-axis direction' and the 'y-axis direction'.

[0041] As used below, the 'Auto Focus (AF) function' is defined as a function that automatically focuses on a subject by adjusting the distance to the image sensor through the movement of the lens along the optical axis according to the distance to the subject, so that a sharp image of the subject can be obtained on the image sensor. Additionally, 'Closed-loop Auto Focus (CLAF) control' is defined as real-time feedback control of the lens position by detecting the distance between the image sensor and the lens to improve the accuracy of focus adjustment.

[0042] The 'optical image stabilization (OIS) function' used below is defined as a function that moves or tilts the lens in a direction perpendicular to the optical axis to offset hand shake in order to prevent the image or video from shaking due to the user's hand shake. Additionally, 'closed-loop auto focus (CLAF) control' is defined as a function that detects the position of the lens relative to the image sensor and provides real-time feedback control of the lens position to improve the accuracy of image stabilization.

[0043] In the following, either "AF moving part" or "OIS moving part" may be referred to as "first moving part" and the other as "second moving part".

[0044] In the following, either the "AF drive unit" or the "OIS drive unit" may be referred to as the "first drive unit" and the other as the "second drive unit."

[0045] In the following description, any one of the "AF drive unit," "OIS-x drive unit," and "OIS-y drive unit" may be referred to as the "first drive unit," the other as the "second drive unit," and the other as the "third drive unit."

[0046] In the following, one of "AF magnet (410)", "OIS-x magnet (510)" and "OIS-y magnet (610)" may be referred to as "first magnet", another as "second magnet", and the other as "third magnet".

[0047] In the following, one of the “AF coil (420)”, “OIS-x coil (520)”, and “OIS-y coil (620)” may be referred to as the “first coil”, another as the “second coil”, and the other as the “third coil”.

[0048] In the following, one of “AF magnet (410)”, “OIS-x magnet (510)”, “OIS-y magnet (610)”, “AF coil (420)”, “OIS-x coil (520)”, and “OIS-y coil (620)” may be referred to as the “first driving unit”, another as the “second driving unit”, another as the “third driving unit”, another as the “fourth driving unit”, another as the “fifth driving unit”, and another as the “sixth driving unit”.

[0049] In the following, one of the “AF sensor (430),” “OIS-x sensor (530)” and “OIS-y sensor (630)” may be referred to as the “first sensor,” the other as the “second sensor,” and the other as the “third sensor.”

[0050] FIG. 1 is a perspective view of a camera module according to the present embodiment, FIG. 2 is an exploded perspective view of a camera module according to the present embodiment, FIG. 3 is a perspective view of a base according to the present embodiment, FIG. 4 is a perspective view of an AF carrier according to the present embodiment, FIG. 5 is a cross-sectional view taken along line A-A' of FIG. 1, FIG. 6 is a drawing for explaining magnetic levitation operation according to another embodiment of the present invention, FIG. 7 is a cross-sectional view of a camera module according to the present embodiment, FIG. 8 is an enlarged view of regions A and B of FIG. 7, FIG. 9 is a cross-sectional view of a camera module according to another embodiment of the present invention, FIG. 10 is a cross-sectional view of a camera module according to yet another embodiment of the present invention, FIG. 11 is a cross-sectional view taken from a different angle of FIG. 10, FIG. 12 is a cross-sectional view of a camera module according to yet another embodiment of the present invention, and FIG. 13 is an enlarged view of regions P and Q of FIG. 12.

[0051] The lens driving device (10) according to the present embodiment is a lens driving actuator using a voice coil motor (VCM) method and can perform auto-focusing (AF) and optical image stabilization (OIS) functions.

[0052] The lens driving device (10) according to the present embodiment may include a fixed part and a moving part that can move in the direction of the optical axis (Z-axis) or in a direction perpendicular to the optical axis (X-axis, Y-axis) within the fixed part.

[0053] The lens driving device (10) may largely include a base (110) that supports the lower part of the moving part, a substrate (120) that surrounds the outer surface of the base (110) and forms a circuit, a cover (700) that is coupled to the base (110) and protects the interior, an AF carrier (210) that accommodates the lens and moves in the direction of the optical axis, an OIS carrier (310) that is accommodated inside the AF carrier (210) and moves in a direction perpendicular to the optical axis, and an elastic member (150) that elastically supports the moving part.

[0054] Additionally, the lens driving device (10) may include an AF magnet (410) placed in the AF carrier (210) for driving, a corresponding AF coil (420) and AF sensor (430), an AF yoke (160), an OIS-x magnet (510) and an OIS-y magnet (610) placed in the OIS carrier (310), and corresponding OIS-x coil (520), OIS-x sensor (530), OIS-y coil (620), and OIS-y sensor (630).

[0055] Furthermore, the lens driving device (10) may further include a first guide magnet part (Ma) (including first, third, fifth, and seventh guide magnets (M1, M3, M5, M7)) disposed on the AF carrier (210) for guiding and controlling the posture of the moving part, and a second guide magnet part (Mb) (including second, fourth, sixth, and eighth guide magnets (M2, M4, M6, M8)) or a guide coil part (Ca) (including first and second guide coils (C1, C2)) disposed on the base (110).

[0056] Each component is explained below.

[0057] The base (110) is configured to be positioned at the bottom of the lens driving device (10) to support the moving part. The base (110) may include a square plate-shaped bottom plate (190) and four side plates (170) protruding upward from the edge of the bottom plate (190). An opening (192) that penetrates in the direction of the optical axis is formed in the center of the bottom plate (190) to provide an optical path between the image sensor and the lens. A first hole (113), a second hole (112), and a third hole (111) that are penetrated or recessed may be formed in the side plates (170) so that a coil can be placed therein. The third hole (111) may correspond to the AF coil (420), the second hole (112) to the OIS-x coil (520), and the first hole (113) to the OIS-y coil (620), respectively. A stepped portion (180) protruding outward is formed at the lower outer surface of the base (110) to provide a seating guide for the cover (700) and the substrate (120).

[0058] The substrate (120) includes a flexible printed circuit board (FPCB) and may be arranged to wrap around the outer surface of the side plate (170) of the base (110). The substrate (120) may include a first substrate (121), a second substrate (122), a third substrate (123), and a fourth substrate (124) arranged sequentially corresponding to the four sides of the base (110). A second adhesive portion (125) may be disposed at one end of the substrate (120). The substrate (120) may be electrically connected to each coil (420, 520, 620) and sensor (430, 530, 630).

[0059] The cover (700) is a shield can that is coupled to the base (110) to protect internal components and block electromagnetic waves. The cover (700) may include a top plate (710) that covers the upper surface and a side plate (720) that extends downward from the top plate (710) and is coupled to a stepped portion (180) of the base (110).

[0060] The elastic member (150) includes a plate spring, etc., and can elastically support the movement of the moving part. The elastic member (150) is formed to support OIS driving, and can prevent mechanical play and ensure driving stability by pressing the OIS guide member, etc., in the direction of the AF moving part.

[0061] The AF carrier (210) is a housing that accommodates a lens and can be positioned inside the base (110) so as to be movable in the direction of the optical axis. The AF carrier (210) includes a bottom plate and a side wall, and various magnets can be placed on the side wall.

[0062] The AF magnet (410) is a permanent magnet means disposed on the first side wall of the AF carrier (210). The AF coil (420) is disposed on the substrate (120) and exposed through the third hole (111) of the base (110), and can cause electromagnetic interaction with the AF magnet (410). The AF sensor (430) includes a Hall sensor and is disposed on the inside of the AF coil (420), etc., to detect changes in the position of the AF magnet (410) and perform feedback control (CLAF). The AF yoke (160) can assist the driving force or prevent leakage magnetic flux by exerting an attractive force with the AF magnet (410). Z-axis driving can be achieved by the AF magnet (410), AF coil (420), AF sensor (430), and AF yoke (160).

[0063] The OIS carrier (310) is accommodated in the inner space of the AF carrier (210) and is a means having a space (311) on which a lens is seated. The OIS carrier (310) can be positioned to be movable in a direction perpendicular to the optical axis.

[0064] An OIS-x magnet (510) may be disposed on the second side of the OIS carrier (310). Correspondingly, an OIS-x coil (520) and an OIS-x sensor (530) are disposed on the substrate (120) at the location of the second hole (112) of the base (110) to perform X-axis direction driving and position detection.

[0065] An OIS-y magnet (610) may be disposed on the third side of the OIS carrier (310). Correspondingly, an OIS-y coil (620) and an OIS-y sensor (630) may be disposed on the substrate (120) at the location of the first hole (113) of the base (110) to perform Y-axis direction driving and position detection. The OIS sensors (530, 630) can detect the position of the magnet and be utilized for hand shake correction feedback control.

[0066] The lens driving device (10) of the present embodiment may adopt a magnetic levitation guide method using repulsive or attractive forces between magnets without using ball bearings. To this end, a first guide magnet part (Ma) and a second guide magnet part (Mb) may be used.

[0067] The first guide magnet part (Ma) may be placed on the outer surface of the side wall of the AF carrier (210). It may include a first guide magnet (M1) and a third guide magnet (M3) symmetrically placed on both sides with respect to the AF magnet (410).

[0068] The second guide magnet part (Mb) can be placed on the inner side wall of the base (110). The second guide magnet (M2) can be placed facing the first guide magnet (M1), and the fourth guide magnet (M4) can be placed facing the third guide magnet (M3).

[0069] The optical axis direction length (Lb) of the second guide magnet part (Mb) on the base (110) side can be formed to be longer than the optical axis direction length (La) of the first guide magnet part (Ma) on the AF carrier (210) side (Lb > La). This allows the overlap state between the guide magnets to be maintained even when the AF carrier (210) moves over the entire stroke section.

[0070] When the first guide magnet part (Ma) and the second guide magnet part (Mb) are arranged to have the same polarity, mutual repulsion is generated, so that the AF carrier (210) is guided without friction while floating from the base (110), and operation due to magnetic levitation can be achieved.

[0071] In addition, if the polarities of the first guide magnet part (Ma) and the second guide magnet part (Mb) are arranged differently along the optical axis direction (e.g., NSNS), AF driving driving force can be generated through the combined action of attraction and repulsion, thereby increasing the driving speed.

[0072] Additionally, magnets may be added to enhance the anti-tilting force. A fifth guide magnet (M5) and a seventh guide magnet (M7) are added to the AF carrier (210), and a corresponding sixth guide magnet (M6) and an eighth guide magnet (M8) are added to the base (110) so as to be arranged to maintain balance in diagonal directions, etc.

[0073] The opposing surfaces of the base (110) and the AF carrier (210) have a stepped structure in the form of an uneven surface rather than a simple flat surface, which can act as a mechanical stopper when tilting excessively.

[0074] The inner surface of the side wall of the base (110) has a shape in which a second surface (116a) on which a second guide magnet (M2) is placed and a third surface (116b) on which a fourth guide magnet (M4) is placed protrude inward, based on the first surface (115) on which a third hole (111) is formed. A first stepped surface (117a) may be connected between the first surface (115) and the second surface (116a), and a second stepped surface (117b) may be connected between the first surface (115) and the third surface (116b).

[0075] The outer surface of the side wall of the AF carrier (210) may have a shape in which the fifth surface (212a) where the first guide magnet (M1) is placed and the sixth surface (212b) where the third guide magnet (M3) is placed are recessed inward, based on the fourth surface (211) where the AF magnet (410) is placed. A third stepped surface (213a) may be connected between the fourth surface (211) and the fifth surface (212a), and a fourth stepped surface (213b) may be connected between the fourth surface (211) and the sixth surface (212b).

[0076] The stepped surfaces (117a, 117b) of the base (110) and the stepped surfaces (213a, 213b) of the AF carrier (210) may be arranged facing each other and spaced apart at a certain distance. This structure does not interfere during normal operation, but if tilting occurs due to external impact, they come into contact with each other to prevent excessive tilting or detachment of the carrier.

[0077] The guide coil portion (Ca) may include a first guide coil (C1) and a second guide coil (C2) positioned at a location corresponding to the existing first guide magnet portion position on the inner side wall of the base (110). This may correspond to the P region and Q region shown in FIG. 12.

[0078] In this case, the second guide magnet part (Mb) is positioned on the side of the base (110) or AF carrier (210) and can be positioned to face the guide coil part (Ca).

[0079] When power is applied to the guide coil part (Ca), electromagnetic interaction occurs, generating a force that moves the AF carrier (210) in a specific direction or controls its attitude, thereby reinforcing the AF driving force and controlling tilting.

[0080]

[0081] Hereinafter, an adhesive structure for bonding the base (110) and the substrate (120) will be described. FIG. 14 is a perspective view of FIG. 3 seen from a different angle, FIG. 15 is a perspective view of the base according to an embodiment of the present invention, FIG. 16 is a perspective view of the substrate according to an embodiment of the present invention, FIG. 17 is a plan view of the substrate according to an embodiment of the present invention unfolded, and FIG. 18 is a cross-sectional view of the BB' region of FIG. 16.

[0082] Referring to FIGS. 14 to 18, the base (110) according to an embodiment of the present invention may include a bottom plate (190), a side plate (170), and a stepped portion (180) as described above.

[0083] An opening (192) is positioned in the center of the lower plate (190), and an image sensor and a lens can be positioned facing each other in the direction of the optical axis through the opening (192). The lower plate (190) can support the lower surface of the AF moving unit. The lower plate (190) may include an upper surface (137) that supports the lower surface of the AF moving unit and an inner surface (136) that forms the inner wall of the opening (192). The upper surface (137) and the inner surface (136) may be positioned perpendicular to each other.

[0084] The side plate (170) may have a shape that protrudes upward from the upper surface of the bottom plate (190). The side plate (170) may include four side plates, and the four side plates may include a first side plate and a third side plate positioned opposite each other, and a second side plate and a fourth side plate positioned opposite each other. Each of the four side plates may be positioned perpendicularly to an adjacent side plate. The side plate (170) may have a rectangular cross-sectional shape due to the four side plates. In this case, the side plate (170) in which the first hole (113) is positioned may be defined as the first side plate, the side plate (170) in which the second hole (112) is positioned may be defined as the second side plate, the side plate (170) in which the third hole (111) is positioned may be defined as the third side plate, and the side plate in which no hole is formed may be defined as the fourth side plate.

[0085] The side plate (170) may include an outer surface (131) and an inner surface (135) opposite to the outer surface (131). A substrate (120) may be attached to the outer surface (131) of the side plate (170). The substrate (120) may be positioned to surround the outer surface (131) of the side plate (170). The outer surface of the side plate (170) may be surrounded by the substrate (120).

[0086] A portion of the outer surface (131) of the side plate (170) may have a shape that protrudes outwardly in a direction perpendicular to the optical axis direction compared to other areas. For example, the outer surface (131) of the side plate (170) may include a first outer surface (132) positioned in a corner area and a second outer surface (133) positioned between a plurality of corner areas. The first outer surface (132) may be positioned in a corner area of ​​the side plate (170) to connect a plurality of second outer surfaces (133). The first outer surface (132) may protrude outwardly in a direction perpendicular to the optical axis direction compared to the second outer surface (133). The first outer surface (132) and the second outer surface (133) may be positioned in a stepped manner in a direction perpendicular to the optical axis direction.

[0087] In this case, the substrate (120) may have regions of different thicknesses in a direction perpendicular to the optical axis. For example, the substrate (120) may include a first region and a second region that is thicker than the first region. The first region of the substrate (120) may be in contact with the first outer surface (132). The inner surface of the second region of the substrate (120) may have a shape that protrudes inwardly relative to the inner surface of the first region, so as to be in contact with the outer surface of the second region (133).

[0088] The base (110) may further include a first adhesive portion (138). The first adhesive portion (138) is configured to be placed on the side plate (170) of the base (110) so that the substrate (120), which will be described later, is primarily adhered thereto. The first adhesive portion (138) may be placed on the first side plate of the base (110). The first adhesive portion (138) may be placed on one end of the first side plate of the base (110). However, it is not limited thereto, and as long as it is not a part that is electrically connected for the operation of the camera module while adhering the base (110) and the substrate (120), there is no restriction on where the first adhesive portion (138) may be placed on the side plate (170) of the base (110).

[0089] The first adhesive portion (138) may include a first adhesive groove (138a) and a first solder (138b). The first adhesive groove (138a) is a means for forming a groove into which the first solder (138b) is inserted, disposed on the side plate (170) of the base (110). The first adhesive groove (138a) may be formed on a part of the side plate (170) of the base (110). The first adhesive groove (138a) may be disposed on the first side plate of the base (110).

[0090] The first solder (138b) may have a shape corresponding to the shape of the first adhesive groove (138a). The first solder (138b) may be inserted and positioned in the first adhesive groove (138a). The first solder (138b) may be positioned so that one side is exposed to the outside from the side plate (170) of the base (110). The first solder (138b) may be formed to have a width equal to the depth of the first adhesive groove (138a). Accordingly, when the first solder (138b) is inserted into the first adhesive groove (138a), the surface of the first solder (138b) and the surface of the side plate (170) of the base (110) may be formed to have surfaces of the same height.

[0091] However, the first adhesive groove (138a) may be omitted as necessary. In this case, the first adhesive groove (138a) may not be formed, and only the first solder (138b) may be placed on the side plate (170) of the base (110). That is, the first adhesive portion (138) may be made up only of the first solder (138b).

[0092] The first solder (138b) may be made of a metal material. Here, the metal material may include a material capable of performing the role of a solder for joining the base (110) and the substrate (120). The first solder (138b) may be made of a material having a melting point higher than the heat curing temperature of the adhesive. For example, the first solder (138b) may be made of one or more of tin (Sn), lead (Pb), silver (Ag), bismuth (Bi), indium (In), antimony (Sb), zinc (Zn), nickel (Ni), gold (Au), and copper (Cu), or an alloy combining these. Preferably, the first solder (138b) may be made of one or more of tin (Sn) and bismuth (Bi) or an alloy thereof. For example, the first solder (138b) may include one or more of the materials in Table 1 below. Since the first solder (138b) is made of a material that is soldered at a low temperature, the thermal deformation of the injection molded base (110) is minimized. Furthermore, since it is made of a material having a melting point higher than the curing temperature of the adhesive described later, there is no separate change when the adhesive is cured later, thus improving the reliability of the bond.

[0093] 제1 솔더Solidus (°C)Liquidus (°C)Sn-58%Bi136.1139.1Sn-58%Bi139.3147.6Sn-58%Bi139.4148.0Sn-58%Bi-0.5Ag135.7138.2Sn-58%Bi-0.1Ag136 .2139.7Sn-58%Bi-0.5Ag-0.1RE136.6139.1Sn-58%Bi-3.0wt%In119.9140.5Sn-58%Bi-4.0wt%Ag138.1145.5Sn-58%Bi- 3In4Ag116.9138.4Sn-52Bi-1.8Sb140.6152.0Sn-44Bi-1.8Sb141.9180.5Sn-48Bi-1.0Sb140.6168.7Sn-48Bi-1.4Sb14 1.2170.4Sn-48Bi-1.8Sb140.9172.7Sn-48Bi-2.0Sb142.3169.7Sn-48Bi-2.4Sb142.8169.3Sn-48Bi-2.8Sb143.6168.4

[0094] The substrate (120) may include four substrates disposed on the side plate of the base (110). The substrate (120) may include a first substrate (121) disposed on the first side plate of the base (110), a second substrate (122) disposed on the second side plate, a third substrate (123) disposed on the third side plate, and a fourth substrate (124) disposed on the fourth side plate. The first to fourth substrates (121, 122, 123, 124) may be arranged continuously along one direction, and accordingly, the first substrate (121), the second substrate (122), the third substrate (123), and the fourth substrate (124) may be disposed in order on the side plate of the base (110). Each substrate (120) may include an insulating layer and a circuit layer disposed on the insulating layer and electrically connected. The substrate (120) may include a second adhesive portion (125). The second adhesive portion (125) may be disposed at one end of the substrate (120). The second adhesive portion (125) may be disposed on any one of the first to fourth substrates. The second adhesive portion (125) may be disposed in an area of ​​the substrate (120) where no electrical connection is made, and there is no restriction on its location. For example, the second adhesive portion (125) may be disposed in an insulating area of ​​the substrate (120) where the circuit layer is not electrically connected. That is, the second adhesive portion (125) may be disposed in an insulating area of ​​the substrate (120) that is electrically insulated.

[0095] As shown in FIG. 16, four substrates may be arranged in a row before the substrate (120) is bonded to the base (110). For example, the substrate (120) may be arranged in a row in order from the first to the fourth substrate. The second adhesive portion (125) may be placed at one end of the substrate (120). The second adhesive portion (125) may be placed at one end of the first substrate (121) or the fourth substrate (124). As the second adhesive portion (125) is placed at one end of the substrate (120), in the process of bonding the substrate (120) to the base (110), the area on the substrate (120) where the second adhesive portion (125) is placed may be the location where bonding begins. Through this, as alignment occurs at the location where adhesion between the substrate (120) and the base (110) begins, the overall adhesion alignment error between the substrate (120) and the base (110) is reduced.

[0096] The second adhesive portion (125) may include a light-transmitting layer (125a) and a metal portion (125b). The light-transmitting layer (125a) and the metal portion (125b) may be sequentially arranged from the outer surface to the inner surface of the substrate (120) in the second adhesive portion (125).

[0097] The light-transmitting layer (125a) may be made of a material through which light is transmitted. The light-transmitting layer (125a) may include a light-transmitting organic material. The light-transmitting organic material may include an amorphous polymer. In the case of a crystalline polymer, there is a problem that light cannot be transmitted and adhesion is difficult because a density difference occurs depending on the degree of crystallization of the crystallized region, resulting in a non-uniform phase. In the case of a semi-crystalline polymer, there is a problem that light cannot be transmitted and adhesion is difficult because refraction and reflection occur due to a density difference between media depending on the size of the particles contained inside, so light cannot be transmitted in non-uniform media with different densities. Amorphous polymers may include one or more of polystyrene (PS), polycarbonate (PC), polymethyl methacrylate (PMMA), polyvinyl chloride (PVC), acrylonitrile-butadiene-styrene (ABS), polyester, polyurethane (PU), polysulfone (PSU), polyamide-imide (PAI), ethylene vinyl acetate (EVA), and polyimide (PI).

[0098] The light-transmitting layer (125a) may be made of a material through which light in the infrared region is transmitted. Here, the wavelength of light transmitted through the light-transmitting layer (125a) may be 700 to 1,550 nm, and, for example, may be composed of a semiconductor diode that emits near-infrared rays with a wavelength of 850 to 940 nm. In this case, the light-transmitting layer (125a) may be formed to have a light transmittance of 70 to 90% in the infrared region. For example, when the light-transmitting layer (125a) is made of polyimide, since polyimide has a light transmittance of 75 to 90% at 400 to 700 nm and 70 to 90% at 800 to 1,100 nm, light having a wavelength in that region can be irradiated onto the light-transmitting layer (125a). However, this is just one example and is not limited thereto; as needed, light of a different wavelength may be irradiated depending on the material of the light-transmitting layer (125a).

[0099] The metal part (125b) is a means to increase wettability and strengthen adhesion with the first solder (138b) of the first adhesive part (138) or the second solder (125c) to be described later in adhesion with the first adhesive part (138). For example, the metal part (125b) may be made of one or more materials among copper (Cu), nickel (Ni), gold (Au), silver (Ag), tin (Sn), and palladium (Pd). However, it is not limited thereto, and any metal material that has high wettability with the first solder (138b) or the second solder (125c) may be used.

[0100] The metal part (125b) may be made of copper (Cu). When manufacturing a circuit board, the material forming the circuit layer within the insulating layer is generally made of copper. The second adhesive part (125) placement process may be performed after the substrate (120) formation process. In the second adhesive part (125) placement process, the light-transmitting layer (125a) of the second adhesive part (125) is placed in the insulating area among the areas where the circuit layer has already been formed in the substrate (120) formation process. Since only the light-transmitting layer (125a) is added without the need to separately form the metal part (125b) in the second adhesive part (125) placement process, the time and cost of the placement process are reduced.

[0101] The second adhesive portion (125) may further include a second solder (125c). In this case, the light-transmitting layer (125a), the metal portion (125b), and the second solder (125c) may be sequentially arranged from the outer surface to the inner surface of the second adhesive portion (125). However, the second solder (125c) may be omitted if the first solder (138b) is arranged on the first adhesive portion (138) of the base (110).

[0102] The second solder (125c) may be made of a metal material. Here, the metal material may include a material capable of performing the role of solder for joining the base (110) and the substrate (120). The second solder (125c) may be made of a material having a melting point higher than the heat curing temperature of the adhesive. The second solder (125c) may be made of the same material as the first solder (138b). For example, the second solder (125c) may use one or more of tin (Sn), lead (Pb), silver (Ag), bismuth (Bi), indium (In), antimony (Sb), zinc (Zn), nickel (Ni), gold (Au), and copper (Cu), or an alloy combining these. Preferably, the second solder (125c) may use one or more of tin (Sn) and bismuth (Bi) or an alloy thereof. For example, the second solder (125c) may include one or more of the materials listed in Table 1 above. Since the second solder (125c) is made of a material that is soldered at a low temperature, the thermal deformation of the substrate (120) is minimized. Furthermore, since it is made of a material that has a melting point higher than the curing temperature of the adhesive described later, there is no separate change when the adhesive is cured later, so the adhesive reliability is improved.

[0103] Either the first solder (138b) or the second solder (125c) may be omitted. If the first solder (138b) is placed on the first adhesive portion (138), the second solder (125c) of the second adhesive portion (125) may be omitted. If the second solder (125c) is placed on the second adhesive portion (125), the first solder (138b) may be omitted. However, this is merely an example, and there is no problem even if both the first solder (138b) and the second solder (125c) are placed.

[0104] When the substrate (120) is placed on the base (110), the second adhesive portion (125) of the substrate (120) may be placed on the first adhesive portion (138) of the base (110). In this case, the second adhesive portion (125) of the substrate (120) and the first adhesive portion (138) of the base (110) may be placed so as to overlap each other. If necessary, the second adhesive portion (125) of the substrate (120) and the first adhesive portion (138) of the base (110) may be placed so as to be in contact with each other.

[0105] When the substrate (120) is placed on the base (110), the light-transmitting layer (125a) of the second adhesive portion (125) may be positioned so as to be exposed to the outside. When the substrate (120) is placed on the base (110), the second solder (125c) of the second adhesive portion (125) may be positioned so as to overlap the first solder (138b) of the first adhesive portion (138). The second solder (125c) of the second adhesive portion (125) may be positioned to be in contact with the first solder (138b).

[0106] The base (110) and the substrate (120) can be bonded by the first adhesive portion (138) and the second adhesive portion (125). When a laser is irradiated onto the light-transmitting layer (125a) of the second adhesive portion (125) of the substrate (120), the laser passes through the light-transmitting layer (125a) and is irradiated onto the metal portion (125b), thereby increasing the temperature of the metal portion (125b). In this process, receiving high temperature from the metal portion (125b), one or more of the first solder (138b) of the first adhesive portion (138) and the second solder (125c) of the second adhesive portion (125) are melted, and the first adhesive portion (138) and the second adhesive portion (125) of the base (110) and the substrate (120) can be bonded.

[0107] If necessary, the base (110) and the substrate (120) may be additionally bonded by an adhesive. In this case, the second adhesive portion (125) placed on the substrate (120) and the first adhesive portion (138) placed on the base (110) may be bonded primarily, and the substrate (120) and the base (110) may be bonded secondarily by an adhesive. When the base (110) and the substrate (120) are bonded by an adhesive, the adhesive may be placed in an area between the base (110) and the substrate (120) where the first adhesive portion (138) and the second adhesive portion (125) are not placed.

[0108] Hereinafter, a coupling structure of the base (110) and the substrate (120) of a camera module according to another embodiment of the present invention and a method for improving adhesion through the surface structure of the base (110) will be described.

[0109] FIG. 19 is a perspective view of a base according to an embodiment of the present invention, and FIG. 20 is an image drawing of the 3D surfaces of a base according to an embodiment of the present invention and a comparative example.

[0110] Referring to FIGS. 19 and FIGS. 20, the base (110) according to an embodiment of the present invention may include a bottom plate (190), a side plate (170), and a stepped portion (180) as described above.

[0111] An opening (192) is positioned in the center of the lower plate (190), and an image sensor and a lens can be positioned facing each other in the direction of the optical axis through the opening (192). The lower plate (190) can support the lower surface of the AF moving unit. The lower plate (190) may include an upper surface (137) that supports the lower surface of the AF moving unit and an inner surface (136) that forms the inner wall of the opening (192). The upper surface (137) and the inner surface (136) may be positioned perpendicular to each other.

[0112] The side plate (170) may have a shape that protrudes upward from the upper surface of the bottom plate (190). The side plate (170) includes four side plates, and the four side plates may include a first side plate and a third side plate positioned opposite each other, and a second side plate and a fourth side plate positioned opposite each other. Each of the four side plates may be positioned perpendicularly to an adjacent side plate. The side plate (170) may have a rectangular cross-sectional shape due to the four side plates.

[0113] The side plate (170) may include an outer surface (131) and an inner surface (135) opposite to the outer surface (131). A substrate (120) may be attached to the outer surface (131) of the side plate (170). The substrate (120) may be positioned to surround the outer surface (131) of the side plate (170). The outer surface of the side plate (170) may be surrounded by the substrate (120).

[0114] A portion of the outer surface (131) of the side plate (170) may have a shape that protrudes outwardly in a direction perpendicular to the optical axis direction compared to other areas. For example, the outer surface (131) of the side plate (170) may include a first outer surface (132) positioned in a corner area and a second outer surface (133) positioned between a plurality of corner areas. The first outer surface (132) may be positioned in a corner area of ​​the side plate (170) to connect a plurality of second outer surfaces (133). The first outer surface (132) may protrude outwardly in a direction perpendicular to the optical axis direction compared to the second outer surface (133). The first outer surface (132) and the second outer surface (133) may be positioned in a stepped manner in a direction perpendicular to the optical axis direction.

[0115] In this case, the substrate (120) may have regions of different thicknesses in a direction perpendicular to the optical axis. For example, the substrate (120) may include a first region and a second region that is thicker than the first region. The first region of the substrate (120) may be in contact with the first outer surface (132). The inner surface of the second region of the substrate (120) may have a shape that protrudes inwardly relative to the inner surface of the first region, so as to be in contact with the outer surface of the second region (133).

[0116] Although the above description is based on the assumption that the substrate (120) is placed on the outer surface (131) of the side plate (170) of the base (110), the substrate (120) may also be placed on the inner surface of the side plate (170) of the base (110). Therefore, below, the contact portion of the base (110) where the substrate (120) is placed is defined as an overlapping portion that overlaps with the substrate. The overlapping portion can be understood as a portion where the substrate (120) is placed on one side of the base (110) and overlaps.

[0117] The base (110) may include an injection molded product. For example, the base (110) may include an injection molded product produced by a mold. The side plate (170) of the base (110) may include an injection molded product. The injection molded product may include resin, filler, and additives. The injection molded product will be described in detail below.

[0118] As the main material of the injection-molded product, a covalent composite polymer may be used. The resin may be a non-hydrophilic covalent composite polymer. The resin may include a semi-crystalline polymer and / or an amorphous polymer.

[0119] Semicrystalline polymers are polymers in which regular crystallized regions are formed in some regions and disordered amorphous regions are formed in other regions, and are resins with high flexibility and impact resistance along with improved strength. Semicrystalline polymers may include one or more of LCP (Liquid crystal polymer), PPA (Polyphthalamide), PPS (Polyphenylene Sulfide), PET (Polyethylene terephthalate), PBT (Polypylene terephthalate), PA66 (Polyamide 66, Nylon 66), PP (Polyphenylene), and PE (Polyethylene).

[0120] Amorphous polymers are resins that maintain a non-crystalline amorphous state in which polymer chains are irregularly arranged in all regions, and thus lack a crystalline structure, making them transparent or translucent as well as flexible and deformable. Amorphous polymers may include one or more of PSU (Polysulfone), PEI (Polyetherimide), PC (Polycarbonate), PPO (Poly(p-phenylene oxide)), PMMA (Poly(methyl methacrylate)), and ABS (Acrylonitrile butadiene styrene).

[0121] Fillers are components added to resin to improve the mechanical properties of the resin and serve to increase the durability and strength of the injection-molded product. Fillers may include inorganic fillers. Fillers may include glass fillers and mineral fillers. For example, glass fillers may include one or more of glass fiber, glass flake, glass beads, and glass balloon, and mineral fillers may include one or more of wollastonite, potassium, titanate, talc, mica, silica, and BaSO4 (barium sulfate).

[0122] Additives are used to maintain the strength or surface wettability characteristics of the injection-molded product, and one or more of the following may be used: a dispersant for uniform dispersion of the filler; a thixotropic agent for controlling the viscosity of the resin and filler and improving dispersibility; a leveling agent for controlling the surface roughness of the injection-molded product and forming a uniform thickness; a crosslinking agent for increasing the crosslinkability of the resin; a plasticizer for increasing the flexibility of the resin and improving processability; and a characterizing additive for increasing heat resistance, chemical resistance, and conductivity. However, additives may be omitted as necessary.

[0123] In the following description, adhesion is explained based on the base (110), but other components for adhesion to the substrate (120) may also be formed from injection molded parts. Therefore, it should be noted that the injection molded parts are not limited to being used only on the base (110).

[0124] The surface of the overlapping portion of the base (110) may have surface characteristics within a specific range. For example, when a substrate (120) is attached to the outer surface (131) of the side plate (170) of the base (110), the outer surface (131) of the side plate (170) to which the substrate (120) is attached may have surface characteristics within a specific range. Here, the surface characteristics within a specific range may include Sa (Arithmetic mean height), Sdr (Developed interfacial area ratio), and Spc (Peak count density).

[0125] Sa (Arithmetic mean height) can be defined as the arithmetic mean height of a surface, or as a numerical value representing the average of the absolute height differences between points relative to the mean plane of the surface. Sa can be calculated by measuring the height at each point on a specific surface and averaging those values. Sa is an indicator of how uniform and consistent the height of a surface is. The measurement of Sa can be calculated using the following formula.

[0126]

[0127] Here, A is the area of ​​the measured region, h(x,y) is a height function of the surface where x and y are the coordinates of the point, and dA represents the infinitesimal area element. The unit of the measurement value of Sa may be μm.

[0128] The outer surface (131) of the side plate (170) of the base (110) may have a Sa value of 10 µm or more and 100 µm or less. If Sa has a value of less than 10 µm, a problem occurs in which the adhesiveness decreases as the arithmetic mean height of the surface decreases. In addition, if Sa has a value of 100 µm or more, a problem occurs in which the adhesive stability decreases as the average height of the entire surface increases.

[0129] Sdr (Developed interfacial area ratio) is one of the 3D surface analysis indicators used to quantitatively evaluate surface roughness and complexity. It can be defined as the ratio of the developed interfacial area, where the developed area is defined as the surface area of ​​the measured shape. In other words, Sdr indicates how much the developed area has increased compared to the area viewed vertically relative to the measurement area. The measurement of Sdr can be calculated using the following formula.

[0130]

[0131] Here, Aactual refers to the actual 3D surface area, meaning the area including all surface relief (roughness), while Aprojected refers to the area projected onto a plane, meaning a simple 2D area ignoring surface relief. The unit of measurement for Sdr can be %.

[0132] The outer surface (131) of the side plate (170) of the base (110) may have an Sdr value of 2.5% or more and 20% or less. If the Sdr value is less than 2.5%, a problem may occur where the roughness is low and the adhesiveness is low as the development area ratio decreases. If the Sdr value is 20% or more, not only is it impossible to manufacture the injection molded part constituting the base (110), but the thickness of the injection molded part may not be uniform, causing the injection molded part to break, or during the camera module assembly process, a part of the base (110) may pass through the adhesive and come into contact with the substrate (120), causing damage to the substrate (120).

[0133] Spc (Peak count density) can be defined as the number of peaks on a surface per unit area. Spc is a value obtained by counting the number of peaks within each region when the surface is divided into equal sizes and normalizing that number with respect to the area; it allows for the determination of how densely fine protrusions are packed on the surface, as well as their density and frequency. The measurement of Spc can be calculated using the following formula.

[0134]

[0135] Here, Npeak represents the number of peaks appearing on the surface, and A represents the measured surface area. The unit of the measurement value of Spc may be 1 / mm.

[0136] The outer surface (131) of the side plate (170) of the base (110) may have a Spc value of 10 / mm or more and 30 / mm or less. If the Spc value is less than 10 / mm, a problem of poor adhesion occurs due to insufficient density of the peaks, and if the Spc value exceeds 30 / mm, not only is there no substantial improvement in adhesion due to excessive density of the peaks, but a problem of breakage of the injection molded product may also occur as the thickness of some areas of the injection molded product becomes excessively thin.

[0137] Below, the peel strength test results of an injection molded product used in the base (110) of a camera module according to an embodiment of the present invention and an injection molded product having different standards are described. As an experimental example, an injection molded product used in the base (110) of a camera module according to an embodiment of the present invention was used with surface characteristics Sa of 11.7 µm, Sdr of 4.428%, and Spc of 14.556 / mm. There were a total of two comparative examples: Comparative Example 1 used surface characteristics Sa of 6.4 µm, Sdr of 0.791%, and Spc of 6.935 / mm, and Comparative Example 2 used surface characteristics Sa of 11.4 µm, Sdr of 1.508%, and Spc of 7.043 / mm.

[0138] In order to ensure that the injection molded products of Experimental Example, Comparative Example 1, and Comparative Example 2 all possess the surface characteristics described above, the surface roughness of the mold was designed separately for each product. Specifically, when manufacturing the injection molded product in the mold, the surface characteristic value of the injection molded product was controlled by adjusting the surface roughness of the mold that contacts the part for controlling the surface characteristics of the injection molded product. This control of the mold roughness was designed so that the surface roughness of the mold surface itself produces the surface characteristic value of the injection molded product, or so that the temperature and time of the area where the surface of the injection molded product is formed in the mold are different from the temperature and time of other areas, thereby causing the surface characteristic value of the injection molded product to be different in each area.

[0139] Experimental Example, Comparative Example 1, and Comparative Example 2 were conducted with the same composition except for the surface, using Liquid Crystal Polymer (LCP) as the resin and a 1:1 mixture of Barium Sulfate (BaSO4) and glass fiber as the filler. The surface characteristics of each sample were measured using Keyence’s VR-3000 equipment. When the injection molding process is captured using this equipment, surface characteristics such as Sa, Spc, and Sdr can be measured along with a 3D surface image as shown in Fig. 15. Experiments were conducted based on these measured results, and the peel strength test measured the adhesion by peeling off the material adhered to the surface of the injection-molded product at a 90-degree angle. The measurement results are shown in the table below.

[0140] In FIG. 15, (a) represents the surface 3D image of the experimental example, (b) represents the surface 3D image of comparative example 1, and (c) represents the surface 3D image of comparative example 2. The method for measuring peel strength is performed in the following steps. A substrate used in the embodiment of the present invention is attached to the surface of the specimens of the experimental example and comparative example with 2.5 g of epoxy, which is an adhesive material, applied. Subsequently, the adhesive is cured in an oven at a temperature of 80 degrees for 30 minutes while applying a load of 150 g to the substrate. Then, the Peel Strength value is measured and analyzed during the process of peeling off the substrate at a 90-degree angle while the substrate and the specimen are attached.

[0141] Injection Molded Product Peel Strength (kgf / cm2) Experimental Example 2.50 Comparative Example 11.18 Comparative Example 21.32

[0142] Referring to Table 2, in the case of the example used in the base (110) according to another embodiment of the present invention, the peel strength was measured to be 2.52, which was confirmed to be the highest, and in the case of Comparative Example 1, it was 1.18 and in the case of Comparative Example 2, it was confirmed to be 1.32, so it can be confirmed that the peel strength of the example is the highest. In particular, it can be confirmed that the peel strength of the injection molded product of the example is higher than that of a surface-treated injection molded product even though a separate surface treatment process is not performed.

[0143] Hereinafter, a camera device according to the present embodiment will be described with reference to the drawings.

[0144] FIG. 21 is an exploded view of a camera device according to the present embodiment.

[0145] The camera device (10A) may include a camera module.

[0146] The camera device (10A) may include a lens module (20). The lens module (20) may include at least one lens. The lens may be positioned at a location corresponding to the image sensor (60). The lens module (20) may include a lens and a barrel. The lens module (20) may be coupled to the OIS carrier (310) of the lens drive device (10). The lens module (20) may be coupled to the OIS carrier (310) by screw coupling and / or adhesive. The lens module (20) may move integrally with the OIS carrier (310).

[0147] The camera device (10A) may include a filter (30). The filter (30) may serve to block light of a specific frequency band from passing through the lens module (20) from entering the image sensor (60). The filter (30) may be positioned parallel to the xy plane. The filter (30) may be positioned between the lens module (20) and the image sensor (60). The filter (30) may be positioned on the sensor base (40). As a variation, the filter (30) may be positioned on the base (110). The filter (30) may include an infrared filter. The infrared filter may block light in the infrared region from entering the image sensor (60).

[0148] The camera device (10A) may include a sensor base (40). The sensor base (40) may be positioned between the lens driving device (10) and the printed circuit board (50). The sensor base (40) may include a protrusion (41) on which a filter (30) is positioned. An opening may be formed in the portion of the sensor base (40) on which the filter (30) is positioned so that light passing through the filter (30) can be incident on the image sensor (60). An adhesive member may bond or bond the base (110) of the lens driving device (10) to the sensor base (40). The adhesive member may additionally serve to prevent foreign substances from entering the interior of the lens driving device (10). The adhesive member may include one or more of epoxy, thermosetting adhesive, and UV-curing adhesive.

[0149] The camera device (10A) may include a printed circuit board (PCB) (50). The printed circuit board (50) may be a board or a circuit board. A lens driving device (10) may be placed on the printed circuit board (50). A sensor base (40) may be placed between the printed circuit board (50) and the lens driving device (10). The printed circuit board (50) may be electrically connected to the lens driving device (10). An image sensor (60) may be placed on the printed circuit board (50). The printed circuit board (50) may be equipped with various circuits, components, control units, etc., to convert an image formed on the image sensor (60) into an electrical signal and transmit it to an external device.

[0150] The camera device (10A) may include an image sensor (60). The image sensor (60) may be configured such that an image is formed when light passing through a lens and a filter (30) is incident. The image sensor (60) may be mounted on a printed circuit board (50). The image sensor (60) may be electrically connected to the printed circuit board (50). For example, the image sensor (60) may be coupled to the printed circuit board (50) by Surface Mounting Technology (SMT). As another example, the image sensor (60) may be coupled to the printed circuit board (50) by flip chip technology. The image sensor (60) may be positioned so that its optical axis aligns with that of the lens. That is, the optical axis of the image sensor (60) and the optical axis of the lens may be aligned. The image sensor (60) can convert light irradiated onto an effective image area of ​​the image sensor (60) into an electrical signal. The image sensor (60) may be any one of a CCD (charge coupled device), a MOS (metal oxide semiconductor), a CPD, and a CID.

[0151] The camera device (10A) may include a motion sensor (70). The motion sensor (70) may be mounted on a printed circuit board (50). The motion sensor (70) may be electrically connected to a control unit (80) through a circuit pattern provided on the printed circuit board (50). The motion sensor (70) may output rotational angular velocity information based on the movement of the camera device (10A). The motion sensor (70) may include a 2-axis or 3-axis gyro sensor or an angular velocity sensor.

[0152] The camera device (10A) may include a control unit (80). The control unit (80) may be placed on a printed circuit board (50). The control unit (80) may be electrically connected to a coil (330) of a lens driving device (10). The control unit (80) may individually control the direction, strength, and amplitude of the current supplied to the coil (330). The control unit (80) may control the lens driving device (10) to perform an autofocus function and / or a hand image correction function. Furthermore, the control unit (80) may perform autofocus feedback control and / or hand image correction feedback control for the lens driving device (10).

[0153] The camera device (10A) may include a connector (90). The connector (90) may be electrically connected to a printed circuit board (50). The connector (90) may include a port for electrically connecting to an external device.

[0154] Hereinafter, an optical device according to the present embodiment will be described with reference to the drawings.

[0155] FIG. 22 is a perspective view of a mobile terminal with a camera module applied according to the present embodiment, and FIG. 23 is a perspective view of a mobile terminal with a camera module applied according to another embodiment of the present invention.

[0156] The optical device (1) may include one or more of a mobile phone, mobile phone, portable terminal, mobile terminal, smartphone, smart pad, portable smart device, digital camera, laptop computer, digital broadcasting terminal, PDA (Personal Digital Assistants), PMP (Portable Multimedia Player), and navigation. The optical device (1) may include any device for capturing images or photographs.

[0157] The optical device (1) may include a main body (20). The optical device (1) may include a camera device (10A). The camera device (10A) may be placed on the main body (20). The camera device (10A) may photograph a subject. The optical device (1) may include a display. The display may be placed on the main body (20). The display may output one or more of the video and images captured by the camera device (10A). The display may be placed on a first surface of the main body (20). The camera device (10A) may be placed on one or more of the first surface of the main body (20) and a second surface opposite the first surface. As shown in FIG. 17, the camera device (10A) may have a triple camera arranged vertically. As shown in FIG. 18, the camera device (10A-1) may have a triple camera arranged horizontally.

[0158] In the foregoing, although all components constituting an embodiment of the present invention have been described as being combined or operating in combination, the present invention is not necessarily limited to such embodiments. That is, within the scope of the purpose of the present invention, all components may be selectively combined in one or more ways to operate. Furthermore, terms such as "include," "constitute," or "have" described above, unless specifically stated otherwise, mean that the relevant component may be inherent; thus, they should be interpreted as allowing for the inclusion of additional components rather than excluding other components. All terms, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which the present invention pertains, unless otherwise defined. Terms commonly used, such as those defined in advance, should be interpreted in accordance with their meaning in the context of the relevant technology and should not be interpreted in an ideal or overly formal sense unless explicitly defined in the present invention.

[0159] The foregoing description is merely an illustrative explanation of the technical concept of the present invention, and those skilled in the art to which the present invention pertains will be able to make various modifications and variations within the scope of the essential characteristics of the present invention. Accordingly, the embodiments disclosed in the present invention are intended to explain, not limit, the technical concept of the present invention, and the scope of the technical concept of the present invention is not limited by such embodiments. The scope of protection of the present invention shall be interpreted by the claims below, and all technical concepts within an equivalent scope shall be interpreted as being included within the scope of rights of the present invention.

Claims

1. A base comprising a lower plate and a side plate protruding upward from the upper surface of the lower plate, wherein a first adhesive portion is disposed in one area of ​​the side plate; and A substrate comprising a second adhesive portion disposed on the outer surface of the side plate and in an area corresponding to one area of ​​the side plate, and The second adhesive portion comprises a light-transmitting layer disposed on the outer surface of the substrate and made of a light-transmitting material, and A camera module in which the first adhesive portion and the second adhesive portion are arranged to overlap each other in the direction of the substrate in one area of ​​the side plate.

2. In Paragraph 1, The above first adhesive part is, A camera module comprising a first adhesive groove disposed on the side plate and a first solder inserted into the adhesive groove.

3. In Paragraph 2, The first solder comprises one or more of tin (Sn), lead (Pb), silver (Ag), bismuth (Bi), indium (In), antimony (Sb), zinc (Zn), nickel (Ni), gold (Au), and copper (Cu), forming a camera module.

4. In Paragraph 1, The second adhesive part above is, A camera module comprising a metal part disposed on one side of the light-transmitting layer and a second solder disposed on one side of the metal part.

5. In Paragraph 4, The above light-transmitting layer is a camera module comprising an amorphous polymer.

6. In Paragraph 4, The above metal part is a camera module made of one or more materials selected from copper (Cu), nickel (Ni), gold (Au), silver (Ag), tin (Sn), and palladium (Pd).

7. In Paragraph 4, The second solder comprises one or more of tin (Sn), lead (Pb), silver (Ag), bismuth (Bi), indium (In), antimony (Sb), zinc (Zn), nickel (Ni), gold (Au), and copper (Cu). The camera module comprises one or more of mineral material fillers.

8. In Paragraph 1, The side plate of the base comprises four side plates, including a first side plate and a third side plate positioned opposite each other, and a second side plate and a fourth side plate positioned between the first side plate and the third side plate and opposite each other. The first adhesive portion is a camera module disposed at the end of the first side plate or the fourth side plate.

9. In Paragraph 8, The above substrate includes a first substrate disposed on the first side plate, a second substrate disposed on the second side plate, a third substrate disposed on the third side plate, and a fourth substrate disposed on the fourth side plate. The first to fourth substrates are arranged continuously along one direction, and the second adhesive portion is disposed at the end of the first substrate or the fourth substrate in a camera module.

10. In Paragraph 1, A camera module further comprising an adhesive disposed in an area between the substrate and the base where the first adhesive portion and the second adhesive portion do not overlap.

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