Protective circuit for preventing damage to electronic device

Abstract

The present disclosure relates to a protective circuit for preventing damage to a depth camera in an electronic device. The electronic device may comprise: a camera module including a distance sensor; a power management circuit configured to output a plurality of driving voltages for driving the camera module; and the protective circuit configured to form a path for bypassing a second driving voltage among the plurality of driving voltages to a ground terminal on the basis of a first driving voltage among the plurality of driving voltages. The discharge time due to the interruption of power supply to the power management circuit may be shorter for the first driving voltage than the second driving voltage.

Description

Protection circuit to prevent damage to electronic devices

[0001] The present disclosure relates to a protection circuit for preventing damage to an electronic device, for example, to a protection circuit for preventing damage to a camera module.

[0002] With the development of digital technology, various types of electronic devices such as mobile communication terminals, PDAs (personal digital assistants), electronic notebooks, smartphones, tablet PCs (personal computers), or wearable devices are widely used. It is common for these electronic devices to have built-in batteries for portability.

[0003] Portable electronic devices may experience a sudden power interruption due to reasons such as dropping them due to user carelessness or submersion. In such cases, an unstable power supply environment is created inside the device, which can lead to the burnout of internal components. In particular, components vulnerable to electrical stimuli, such as pixels that receive light in light-receiving sensors used for distance measurement, need to be protected from situations where the power supply is suddenly cut off.

[0004] The information described above may be provided as related art for the purpose of aiding understanding of this document. None of the foregoing is to be claimed as prior art related to this document, nor is it to be used to determine prior art.

[0005] In the present disclosure, when the power supply to an electronic device using a distance sensor is unexpectedly cut off, a protection device can be provided that reduces the discharge time of a discharge voltage capable of damaging an internal component by utilizing a discharge voltage that discharges relatively quickly internally.

[0006] As an example, the electronic device may include a camera module including a distance sensor. The electronic device may include a power management circuit configured to output a plurality of driving voltages for driving the camera module. The electronic device may include a protection circuit configured to form a path to bypass a second driving voltage, which is one of the plurality of driving voltages, to a ground terminal based on a first driving voltage, which is one of the plurality of driving voltages. The discharge time resulting from the interruption of power supply to the power management circuit may be relatively shorter for the first driving voltage compared to the second driving voltage.

[0007] As an example, the electronic device may include a battery. The electronic device may include a camera module comprising a transmitting assembly configured to output a transmitting optical signal for distance measurement and a receiving assembly configured to receive a receiving optical signal reflected back from a specific object and output an electrical signal to be used to measure the distance to the specific object. The electronic device may include a transmitting power management module that supplies a plurality of transmitting driving voltages to the transmitting assembly using power supplied by the battery. The electronic device may include a receiving power management module that supplies a plurality of receiving driving voltages to the receiving assembly using power supplied by the battery. The electronic device may include first capacitors configured to be charged by the plurality of receiving driving voltages. The electronic device may include second capacitors configured to be charged by the plurality of transmitting driving voltages. The electronic device may include a protection circuit configured to form a path for bypassing a second discharge voltage to a ground terminal based on a first discharge voltage. The first discharge voltage may be a voltage discharged by a specific capacitor among the second capacitors with a relatively short discharge time due to the interruption of the power supply from the battery. The second discharge voltage may be a voltage discharged by a specific capacitor among the first capacitors with a relatively long discharge time due to the interruption of the power supply from the battery.

[0008] In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0009] FIG. 1 is a partially exploded perspective view of AR glasses as an augmented reality device according to one embodiment of the present disclosure.

[0010] FIG. 2a is a front perspective view of an electronic device according to one embodiment of the present disclosure.

[0011] FIG. 2b is a perspective view of the electronic device of FIG. 2a viewed from the rear.

[0012] FIGS. 3a to 3d are drawings for illustrating an example of the arrangement of hardware components of a head-mounted display device in an AR device according to one embodiment of the present disclosure.

[0013] FIG. 4 is an exemplary block diagram of an electronic device in a network environment according to various embodiments.

[0014] FIG. 5 is a block diagram illustrating a camera module according to various embodiments.

[0015] FIG. 6 is a block diagram of a power management module and a battery according to various embodiments.

[0016] FIG. 7 is a cross-sectional structural diagram of a distance sensor module according to one embodiment.

[0017] FIG. 8 is a block diagram of a protection device for controlling power supply from an electronic device to a distance sensor module according to one embodiment.

[0018] Figure 9 is a diagram illustrating an exemplary configuration of the power management circuit of Figure 8.

[0019] FIG. 10a or FIG. 10b is a drawing for illustrating an exemplary configuration of the protection circuit of FIG. 8.

[0020] FIG. 11a is a timing diagram illustrating an example in which a switch connected inside a pixel of a distance sensor is burned out due to a sudden power interruption.

[0021] FIG. 11b is a timing diagram to explain how damage to a pixel or switch inside a distance sensor is prevented by an unexpected power interruption according to one embodiment.

[0022] FIG. 12a, FIG. 12b, or FIG. 12c is a drawing for illustrating examples of the arrangement of a protection circuit according to one embodiment.

[0023] Hereinafter, embodiments of the present disclosure are described in detail with reference to the drawings so that those skilled in the art can easily practice them. However, the present disclosure may be embodied in various different forms and is not limited to the embodiments described herein. In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and brevity.

[0024] In the present disclosure, the ‘AR system’ represents a system that displays a virtual image together within a physical environment space of the real world or displays a virtual image together with a real object. In the present disclosure, the ‘AR device’ is a device capable of expressing ‘augmented reality’ and may include AR glasses (100) in the shape of glasses worn by a user on the face, an HMD device (300) worn on the head, a virtual reality headset (VRH), or an augmented reality helmet.

[0025] In the present disclosure, a "real scene" is a scene of the real world viewed by a user through an AR device and may include real-world objects. A "virtual image" is an image generated through an optical engine and may include both static and dynamic images. The virtual image may be observed together with the real scene and may be an image displaying information about real-world objects within the real scene, information about the operation of the augmented reality device, or control menus.

[0026] The embodiments proposed in this disclosure assume AR technology as an immersive technology capable of experiencing a simulation environment, but may also be applicable to electronic devices based on virtual reality (VR) technology, mixed reality (MR) technology, or extended reality (XR) technology. XR technology may be a technology that encompasses various immersive technologies, including VR technology, AR technology, or MR technology. For example, since the power on / off time may vary depending on the immersive technology to be applied, the desired power on / off time can be obtained by adjusting the capacitance of a capacitor placed in the power supply path.

[0027] According to one example, an AR device is equipped with an optical engine for generating a virtual image composed of light generated from a light source, and a waveguide formed of a transparent material to guide the virtual image generated by the optical engine to the user's eyes and to allow the user to view a scene of the real world as well. Since the AR device must be able to observe a scene of the real world as well, an optical element is required to change the path of light that basically has straight-line propagation in order to guide the light generated by the optical engine to the user's eyes through the waveguide. At this time, the light path may be changed by using reflection by a mirror, etc., or by diffraction by a diffractive element such as a DOE (diffractive optical element) or HOE (holographic optical element), but is not limited to these.

[0028] FIG. 1 is a partially exploded perspective view of augmented reality glasses (hereinafter referred to as 'AR glasses (100)') as an augmented reality (AR) device according to one embodiment of the present disclosure.

[0029] Referring to FIG. 1, the AR device (100) may be a device that provides an AR experience to a user by applying AR technology. The AR device (100) may be implemented as a wearable device that can be worn by a user. For example, the AR device (100) may include AR glasses (or smart glasses) in the shape of glasses worn on the user's face (hereinafter referred to as 'AR glasses'), or a Head Mounted Display (HMD) device, a virtual reality headset (VRH), or an AR helmet worn on the user's head. Although the AR device (100) in FIG. 1 is exemplarily assumed to be AR glasses, it is understood that the examples proposed in this disclosure are not limited to AR glasses but can be commonly applied to other types or forms of AR devices (100).

[0030] The AR device (100) can render or output a display in front of the user's eyes. The AR device (100) can display visually expanded reality content through the display. The visually expanded reality content can provide visual information to the user. The AR device (100) can move the screen according to the user's eye movements (e.g., gaze) to provide a real scene or a realistic virtual image.

[0031] The AR device (100) can provide an AR service that outputs at least one virtual object overlaid in an area determined to be the user's field of view (FOV). For example, the area determined to be the user's FOV may be an area determined to be perceptible to a user wearing the AR device (100). For example, the area determined to be the user's FOV may be an area that includes the whole or at least a part of the display of the AR device (100). The AR device (100) may include a plurality of transparent members corresponding to each of the user's two eyes.

[0032] According to one example, the AR device (100) may include a support (110), a rim (120) (e.g., a left rim (120-1) and a right rim (120-2)), a bridge (130), or a lens part (140) (e.g., a left lens part (140-1) and a right lens part (140-2)). The support (110) may include a left support (110-1) and / or a right support (110-2). The rim (120) may include a left rim (120-1) and / or a right rim (120-2). For example, the rim (120) may include a microphone (121) (e.g., a left microphone (121-1) and / or a right microphone (121-2)). The lens portion (140) may include a left lens portion (140-1) and / or a right lens portion (140-2). The left lens portion (140-1) may be attached to the left rim (120-1). For example, the left lens portion (140-1) may be fitted and fixed to the left rim (120-1). The right lens portion (140-2) may be attached to the right rim (120-2). For example, the right lens portion (140-2) may be fitted and fixed to the right rim (120-2). The bridge (130) may connect the left rim (120-1) and the right rim (120-2). The bridge (130) may be connected to the left rim (120-1) by, for example, a left connecting member (131-1) having a certain elasticity. The bridge (130) can be connected to the right rim (120-2) by, for example, a right connecting member (131-2) having a certain elasticity. The bridge (130) can have a structure that can be fixed by being placed over the user's nose when the user wears the AR device (100).

[0033] The support member (110) may include a temple (111). The temple (111) is a long arm extending from one side (side) of the rim (120) and may serve to secure the AR device (100) to the user's face when worn. The support member (110) may include a hinge portion for attachment to one side of the rim (120). The left support member (110-1) may include a left temple (111-1). According to one example, the left temple (111-1) may be provided with a left display module (117-1), a left camera module (119-1), a left printed circuit board (PCB) (114-1), a left speaker (115-1), or a left battery (116-1). The right support member (110-2) may include a right temple (111-2). According to one example, the right temple (111-2) may be provided with a right display module (117-2), a right camera module (119-2), a right PCB (114-2), a right speaker (115-2), or a right battery (116-2). The components provided in the illustrated left temple (111-1) and / or right temple (111-2) are merely exemplary, and some components may be omitted or new components may be added. For convenience of explanation thereafter, the left display module (117-1) and the right display module (117-2) may be collectively referred to as the display module (117), and the left camera module (119-1) and the right camera module (119-2) may be collectively referred to as the camera module (119). Additionally, the left PCB (114-1) and the right PCB (114-2) can be collectively referred to as PCB (114), the left speaker (115-1) and the right speaker (115-2) can be collectively referred to as speaker (115), and the left battery (116-1) and the right battery (116-2) can be collectively referred to as battery (116).

[0034] A camera module (119) may be attached to the inner side of a temple (111). The camera module (119) may capture an image corresponding to the user's FOV or measure the distance to an object. The camera module (119) may be used for head tracking or spatial recognition. The camera module (119) may also recognize the user's movement. The camera module (119) may be used to detect the movement of an object, i.e., an image corresponding to the user's FOV, or for spatial recognition. The camera module (119) may be used to detect the user's pupil. The camera module (119) may be used to track the user's pupil. The camera module (119) may be used to adjust the center of the virtual image projected onto the AR device (100) so that it is positioned according to the direction in which the pupil of the user wearing the AR device (100) gazes. For example, the camera module (119) may be a GS (global shutter) camera. The GS camera can detect the pupil and track rapid pupil movements without delay. The camera module (119) may include a left camera module (119-1) and / or a right camera module (119-2). For example, at least one of the left camera module (119-1) and / or the right camera module (119-2) may include a distance detection sensor (hereinafter referred to as 'distance sensor'). The distance sensor may also be referred to as a depth sensor. As an example, the distance sensor may be a direct Time of Flight (ToF) sensor. A ToF sensor may, for example, emit light (e.g., infrared (IR)) toward a specific object and receive the light reflected back by the specific object to measure the distance to the specific object. In this disclosure, a ToF sensor will be described as an example of a distance sensor, but the distance sensor must not be specified as a ToF sensor.That is, sensors of a different type other than the ToF sensor may be used as distance sensors. Additionally, a depth sensor may also be referred to as a depth camera, and a ToF sensor may also be referred to as a ToF camera. Although these terms may be used interchangeably in this disclosure, they may be used to refer to substantially the same object.

[0035] The camera module (119) may include a distance sensor.

[0036] For example, the distance sensor included in the camera module (119) may include a light emitter (112) (e.g., left light emitter (112-1) and / or right light emitter (112-2)) and a light receiver (113) (e.g., left light receiver (113-1) and / or right light receiver (113-2)). Since the distance sensor may be composed of a emitter (112) (e.g., the transmitting assembly (710) of FIG. 7) and a receiver (113) (e.g., the receiving assembly (720) of FIG. 7) as a single assembly, it may also be referred to as a distance sensor module (e.g., the distance sensor module (700) of FIG. 7). The detailed configuration of the distance sensor module will be described below with reference to FIG. 7. The emitter (112) may include an IR LED (118) of an infrared wavelength rather than a visible light wavelength (e.g., a left IR LED (118-1) and / or a right IR LED (118-2)). As an example, the emitter (112) may generate at least two optical signals (e.g., IR signals) having different wavelengths (e.g., 850 nm & 940 nm) and output them as incident light. The optical signal generated by the emitter (112) (e.g., infrared with a wavelength of 850 nm) is, for example, It can be transmitted to a forward object by passing through the reflective surface of the lens portion (140). A light signal generated by the emitter (112) (e.g., infrared light with a wavelength of 940 nm) may, for example, not pass through the reflective surface of the lens portion (140) but be reflected and transmitted to the user's eyeball. The receiver (113) can receive a light signal that is reflected back from the target object from the incident light output by the emitter (112). For example, the receiver (113) can classify the received light signal into at least two reflected waves (e.g., IR signals) having different wavelengths (e.g., 850 nm & 940 nm). The receiver (113) can convert the reflected waves into electrical signals and output them.

[0037] The display module (117) may include a lens unit (140) (e.g., a left lens unit (140-1) and / or a right lens unit (140-2)). A virtual object output through the display module (117) may include information related to an application program running on the AR device (100). A virtual object output through the display module (117) may include information related to a real object located in a space / region corresponding to an area determined as the user's field of view (FOV). For example, the AR device (100) may identify an external object included in at least a portion of the image information related to the real space obtained through the camera module (119) that corresponds to an area determined as the user's FOV.

[0038] The AR device (100) can output a virtual object related to an external object identified in at least part of the AR device (100) through an area of ​​the display area of ​​the AR device (100) that is determined to be the user's FOV. The external object may include an object existing in real space (e.g., a real scene).

[0039] The lens portion (140) may include a condensing lens, a vision correction lens, or a waveguide in a transparent member. For example, the transparent member may be formed from a glass plate, a plastic plate, or a polymer. The transparent member may be made to be completely transparent or translucent. The transparent member may include a left lens portion (140-1) facing the left eye of a user wearing the AR device (100). The transparent member may include a right lens portion (140-2) facing the right eye of a user wearing the AR device (100). If the display is transparent, the screen may be provided at a position facing the user's eyes. The waveguide may transmit light generated from the light source of the display to the user's eyes. For example, the waveguide may be located at least partially in a part of the lens portion (140).

[0040] The lens portion (140) may include a display panel or a lens (e.g., glass). For example, the display panel may be a transparent material such as glass or plastic. The lens portion (140) may be composed of a transparent element. A user may perceive the actual space in front by passing through the lens portion (140). The lens portion (140) may display a virtual object in at least a portion of the transparent element so that it appears to the user as if the virtual object is superimposed on at least a part of the actual space.

[0041] A PCB (114) provided in the support portion (110-1, 110-2) can transmit electrical signals to each component of the AR device (100). A speaker (115) provided in the support portion (110) can output audio signals. A battery (116-1, 116-2) provided in the support portion (110) can supply power for operating the AR device (100). A microphone (121) provided in the rim (120) can receive the user's voice and ambient sounds.

[0042] FIG. 2a is a front view of an electronic device (e.g., a smartphone) according to one embodiment of the present disclosure, and FIG. 2b is a rear view of the electronic device of FIG. 2a.

[0043] Referring to FIG. 2a or FIG. 2b, the electronic device (200) may include a housing (210) comprising a first surface (or front) (210A), a second surface (or rear) (210B), or a side (210C) surrounding the space between the first surface (210A) and the second surface (210B). For example, the housing may refer to a structure forming some of the first surface (210A), the second surface (210B), and the side (210C) of FIG. 2. The first surface (210A) may be formed by a front plate (202) (e.g., a glass plate or a polymer plate including various coating layers) in which at least a portion is substantially transparent. The second surface (210B) may be formed by a rear plate (211) that is substantially opaque. The rear plate (211) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side (210C) may be formed by a side bezel structure (or “side member”) (218) comprising metal and / or polymer, which is combined with the front plate (202) and the rear plate (211). The rear plate (211) or the side bezel structure (218) may be formed integrally and may comprise the same material (e.g., a metallic material such as aluminum).

[0044] In the illustrated example, the front plate (202) may include two first regions (210D) that are curved seamlessly from the first surface (210A) toward the rear plate (211) at both ends of the long edge of the front plate (202). The rear plate (211) may include two second regions (210E) that are curved seamlessly from the second surface (210B) toward the front plate (202) at both ends of the long edge. For example, the front plate (202) (or the rear plate (211)) may include only one of the first regions (210D) (or the second regions (210E)). For example, the front plate (202) (or the rear plate (211)) may not include some of the first regions (210D) or the second regions (210E). For example, when viewed from the side of the electronic device (200), the side bezel structure (218) may have a first thickness (or width) on the side that does not include the first regions (210D) or the second regions (210E), and a second thickness that is thinner than the first thickness on the side that includes the first regions (210D) or the second regions (210E).

[0045] For example, the electronic device (200) may include at least one of a display (201), an audio module (203, 207, 214), a sensor module (204, 216, 219), a camera module (205, 212, 213), a key input device (217), a light-emitting element (206), a pen input device (220), and a connector hole (208, 209). The electronic device (200) may omit at least one of the components (e.g., a key input device (217), or a light-emitting element (206)) or additionally include other components.

[0046] The display (201) may be exposed, for example, through a significant portion of the front plate (202). For example, at least a portion of the display (201) may be visually exposed through the front plate (202) forming the first surface (210A) and the first area (210D) of the side (210C). In some embodiments, the corners of the display (201) may be formed to be largely identical to the adjacent outer shape of the front plate (202). In one embodiment (not shown), to expand the area where the display (201) is exposed, the gap between the outer edge of the display (201) and the outer edge of the front plate (202) may be formed to be largely identical.

[0047] In one embodiment (not shown), a recess or opening is formed in a part of the screen display area of ​​the display (201), and at least one of an audio module (214), a sensor module (204), a camera module (205), and a light-emitting element (206) may be included that are aligned with the recess or the opening. In one embodiment (not shown), at least one of an audio module (214), a sensor module (204), a camera module (205) (e.g., the camera module (480) of FIG. 4), a fingerprint sensor (216), and a light-emitting element (206) may be included on the back surface of the screen display area of ​​the display (201). In one embodiment (not shown), the display (201) may be combined with or adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field type stylus pen. In some embodiments, at least a portion of the sensor module (204, 219) and / or at least a portion of the key input device (217) may be placed in the first regions (210D) and / or the second regions (210E).

[0048] The audio module (203, 207, 214) may include a microphone hole (203) and a speaker hole (207, 214). A microphone for acquiring external sound may be placed inside the microphone hole (203), and in some embodiments, a plurality of microphones may be placed to detect the direction of sound. The speaker hole (207, 214) may include an external speaker hole (207) and a receiver hole (214) for calls. In some embodiments, the speaker hole (207, 214) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included without the speaker hole (207, 214) (e.g., a piezo speaker).

[0049] The sensor modules (204, 216, 219) can generate electrical signals or data values ​​corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor modules (204, 216, 219) may include, for example, a first sensor module (204) (e.g., proximity sensor) and / or a second sensor module (not shown) (e.g., fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) (e.g., HRM sensor) and / or a fourth sensor module (216) (e.g., fingerprint sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be placed on the first surface (210A) (e.g., display (201)) of the housing (210) as well as on the second surface (210B). The electronic device (200) may further include at least one sensor module not illustrated, e.g., a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0050] The camera module (205, 212, 213) may include a first camera device (205) disposed on a first surface (210A) of the electronic device (200), a second camera device (212) disposed on a second surface (210B), and / or a flash (213). The camera devices (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light-emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one surface of the electronic device (200). As an example, the camera module (205, 212, 213) may include a ToF sensor. A ToF sensor may include, for example, a light-emitting module configured to emit light toward a specific object and a light-receiving module configured to receive light that is reflected back by the specific object from the light emitted by the light-emitting module.

[0051] A key input device (217) may be placed on a side (210C) of the housing (210). In one embodiment, the electronic device (200) may not include some or all of the aforementioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (201). In some embodiments, the key input device may include a sensor module (216) placed on a second side (210B) of the housing (210).

[0052] A light-emitting element (206) may be disposed, for example, on a first surface (210A) of a housing (210). The light-emitting element (206) may, for example, provide state information of an electronic device (200) in the form of light. In one embodiment, the light-emitting element (206) may, for example, provide a light source that is coupled with the operation of a camera module (205). The light-emitting element (206) may include, for example, an LED, an IR LED, and a xenon lamp.

[0053] The connector holes (208, 209) may include a first connector hole (208) capable of receiving a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and a second connector hole (e.g., an earphone jack) (209) capable of receiving a connector for transmitting and receiving audio signals with an external electronic device.

[0054] A pen input device (220) (e.g., a stylus pen) can be guided into the interior of the housing (210) through a hole (221) formed on the side of the housing (210) and inserted or removed, and may include a button to facilitate removal. The pen input device (220) may have a separate resonant circuit built in so as to be coupled with an electromagnetic induction panel (e.g., a digitizer) included in the electronic device (200). The pen input device (220) may include an EMR (electro-magnetic resonance) method, an AES (active electrical stylus) method, and an ECR (electric coupled resonance) method.

[0055] FIGS. 3a to 3d are drawings for illustrating an example of the arrangement of hardware components of a head-mounted display (HMD) device (hereinafter referred to as 'HMD device (300)') as an AR device according to one embodiment of the present disclosure.

[0056] Referring to FIGS. 3a through 3d, the HMD device (300) may include a front portion that is visually exposed to the outside or an inner surface facing the wearer. The front portion of the HMD device (300) may be configured with an external sensor portion including left / right depth cameras (311a, 311b), left / right side cameras (313a, 313b), left / right downward cameras (315a, 315b), or left / right IR sensors (317a, 317b) (see FIG. 3a). As an example, the left / right depth cameras (311a, 311b) may include ToF sensors. The ToF sensor (e.g., the distance sensor module (700) of FIG. 7) may include, for example, a light-emitting module (e.g., the transmitting assembly (710) of FIG. 7) configured to emit light to a specific object and a light-receiving module (e.g., the receiving assembly (720) of FIG. 7) configured to receive light that is reflected back by the specific object from the light emitted by the light-emitting module. The positions where the left / right depth cameras (311a, 311b), left / right side cameras (313a, 313b), left / right downward cameras (315a, 315b) or left / right IR sensors (317a, 317b) are placed on the front are not necessarily fixed and may be determined during the design of the HMD device (300).

[0057] An eye recognition unit including a plurality of IR cameras (321a, 321b, 321c, 321d) or left / right LED rings (323a, 323b) may be configured on the inner surface of the HMD device (300). A sound unit including left / right microphones (341a, 341b) or left / right speakers (343a, 343b) may be configured on the inner surface of the HMD device (300) (see FIG. 3b).

[0058] The HMD device (300) may include at least one processor (361) inside. The HMD device (300) may be equipped with a position recognition unit including an IMU (inertial measurement unit) sensor (331) or an UWB (ultra-wideband) (333) inside (see FIG. 3c).

[0059] A display unit (350) including a display (351) or a lens (353) may be configured on the inner surface of the HMD device (300) (see FIG. 3d).

[0060] FIG. 4 is an exemplary block diagram of an electronic device (401) (e.g., the electronic device (300) of FIG. 3) in a network environment (400) according to various embodiments.

[0061] Referring to FIG. 4, in a network environment (400), an electronic device (401) may communicate with an electronic device (402) through a first network (498) (e.g., a short-range wireless communication network) or with at least one of an electronic device (404) or a server (408) through a second network (499) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (401) may communicate with the electronic device (404) through a server (408). According to one embodiment, the electronic device (401) may include a processor (420), memory (430), input module (450), sound output module (455), display module (460), audio module (470), sensor module (476), interface (477), connection terminal (478), haptic module (479), camera module (480), power management module (488), battery (489), communication module (490), subscriber identification module (496), or antenna module (497). In some embodiments, at least one of these components (e.g., connection terminal (478)) may be omitted from the electronic device (401), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (476), camera module (480), or antenna module (497)) may be integrated into a single component (e.g., display module (460)).

[0062] The processor (420) can control at least one other component (e.g., a hardware or software component) of the electronic device (401) connected to the processor (420) by executing software (e.g., a program (440)), for example, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (420) can store commands or data received from other components (e.g., a sensor module (476) or a communication module (490)) in volatile memory (432), process the commands or data stored in volatile memory (432), and store the resulting data in non-volatile memory (434). According to one embodiment, the processor (420) may include a main processor (421) (e.g., a central processing unit or an application processor) or an auxiliary processor (423) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (401) includes a main processor (421) and an auxiliary processor (423), the auxiliary processor (423) may be configured to use less power than the main processor (421) or to be specialized for a designated function. The auxiliary processor (423) may be implemented separately from the main processor (421) or as part thereof.

[0063] The auxiliary processor (423) may control at least some of the functions or states associated with at least one component of the electronic device (401) (e.g., display module (460), sensor module (476), or communication module (490)) on behalf of the main processor (421) while the main processor (421) is in an inactive (e.g., sleep) state, or together with the main processor (421) while the main processor (421) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (423) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (480) or communication module (490)). According to one embodiment, the auxiliary processor (423) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (401) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (408)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0064] The memory (430) can store various data used by at least one component of the electronic device (401) (e.g., processor (420) or sensor module (476)). The data may include, for example, software (e.g., program (440)) and input data or output data for related commands. The memory (430) may include volatile memory (432) or non-volatile memory (434).

[0065] The program (440) may be stored as software in memory (430) and may include, for example, an operating system (442), middleware (444), or an application (446).

[0066] The input module (450) can receive commands or data to be used for a component of the electronic device (401) (e.g., processor (420)) from outside the electronic device (401) (e.g., user). The input module (450) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0067] The sound output module (455) can output a sound signal to the outside of the electronic device (401). The sound output module (455) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0068] The display module (460) can visually provide information to an external (e.g., user) of the electronic device (401). The display module (460) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (460) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0069] The audio module (470) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (470) can acquire sound through the input module (450) or output sound through the sound output module (455) or an external electronic device (e.g., electronic device (402)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (401).

[0070] The sensor module (476) can detect the operating state of the electronic device (401) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (476) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0071] The interface (477) may support one or more specified protocols that can be used for the electronic device (401) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (402)). According to one embodiment, the interface (477) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0072] The connection terminal (478) may include a connector through which the electronic device (401) can be physically connected to an external electronic device (e.g., electronic device (402)). According to one embodiment, the connection terminal (478) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0073] The haptic module (479) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (479) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0074] The camera module (480) can capture still images and video. According to one embodiment, the camera module (480) may include one or more lenses, image sensors, image signal processors, or flashes.

[0075] The power management module (488) can manage power supplied to the electronic device (401). According to one embodiment, the power management module (488) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0076] The battery (489) can supply power to at least one component of the electronic device (401). According to one embodiment, the battery (489) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0077] The communication module (490) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (401) and an external electronic device (e.g., electronic device (402), electronic device (404), or server (408)), and the performance of communication through the established communication channel. The communication module (490) may include one or more communication processors that operate independently of the processor (420) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (490) may include a wireless communication module (492) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (494) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (404) through a first network (498) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (499) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (492) can identify or authenticate the electronic device (401) within a communication network such as the first network (498) or the second network (499) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (496).

[0078] The wireless communication module (492) can support 5G networks and next-generation communication technologies following 4G networks, such as new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (492) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (492) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (492) can support various requirements specified in the electronic device (401), external electronic device (e.g., electronic device (404)), or network system (e.g., second network (499)). According to one embodiment, the wireless communication module (492) may support a Peak data rate (e.g., 20 Gbps or more) for eMBB realization, loss coverage (e.g., 164 dB or less) for mMTC realization, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for URLLC realization.

[0079] An antenna module (497) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (497) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (497) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (498) or a second network (499), may be selected from the plurality of antennas, for example, by a communication module (490). A signal or power may be transmitted or received between the communication module (490) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (497).

[0080] According to various embodiments, the antenna module (497) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0081] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0082] According to one embodiment, commands or data may be transmitted or received between the electronic device (401) and an external electronic device (404) through a server (408) connected to a second network (499). Each of the external electronic devices (402, or 404) may be the same or a different type of device as the electronic device (401). According to one embodiment, all or part of the operations performed on the electronic device (401) may be performed on one or more of the external electronic devices (402, 404, or 408). For example, if the electronic device (401) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (401) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (401). The electronic device (401) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (401) may provide ultra-low latency services, for example, using distributed computing or mobile edge computing. In one embodiment, the external electronic device (404) may include an Internet of Things (IoT) device. The server (408) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (404) or the server (408) may be included within the second network (499).The electronic device (401) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0083] FIG. 5 is a block diagram (500) illustrating a camera module (e.g., the camera module (480) of FIG. 4) according to various embodiments.

[0084] Referring to FIG. 5, the camera module (480) may include a lens assembly (510), a flash (520), an image sensor (530), an image stabilizer (540), a memory (550) (e.g., a buffer memory), or an image signal processor (560). The lens assembly (510) may collect light emitted from a subject that is the target of image capture. The lens assembly (510) may include one or more lenses. According to one embodiment, the camera module (480) may include a plurality of lens assemblies (510). In this case, the camera module (480) may form, for example, a dual camera, a 360-degree camera, or a spherical camera. Some of the plurality of lens assemblies (510) may have the same lens properties (e.g., angle of view, focal length, autofocus, f-number, or optical zoom), or at least one lens assembly may have one or more lens properties different from the lens properties of other lens assemblies. The lens assemblies (510) may include, for example, a wide-angle lens or a telephoto lens.

[0085] A flash (520) may emit light used to enhance light emitted or reflected from a subject. According to one embodiment, the flash (520) may include one or more light-emitting diodes (e.g., RGB (red-green-blue) LED, white LED, infrared LED, or ultraviolet LED), or a xenon lamp. An image sensor (530) may acquire an image corresponding to the subject by converting light emitted or reflected from the subject and transmitted through the lens assembly (510) into an electrical signal. According to one embodiment, the image sensor (530) may include, for example, one image sensor selected from image sensors with different properties such as an RGB sensor, a BW (black and white) sensor, an IR sensor, or a UV sensor, a plurality of image sensors having the same properties, or a plurality of image sensors having different properties. Each image sensor included in the image sensor (530) can be implemented using, for example, a CCD (charged coupled device) sensor or a CMOS (complementary metal oxide semiconductor) sensor.

[0086] The image stabilizer (540) may move at least one lens or image sensor (530) included in the lens assembly (510) in a specific direction or control the operational characteristics of the image sensor (530) (e.g., adjusting read-out timing, etc.) in response to the movement of the camera module (480) or the electronic device (401) containing it. This allows for compensating for at least some of the negative effects caused by the movement on the image being captured. According to one embodiment, the image stabilizer (540) may detect such movement of the camera module (480) or the electronic device (401) using a gyroscope sensor (not shown) or an accelerometer sensor (not shown) placed inside or outside the camera module (480). According to one embodiment, the image stabilizer (540) may be implemented, for example, as an optical image stabilizer. The memory (550) may temporarily store at least a portion of the image acquired through the image sensor (530) for the next image processing operation. For example, if image acquisition by the shutter is delayed or multiple images are acquired at high speed, the acquired original image (e.g., a Bayer-patterned image or a high-resolution image) is stored in the memory (550), and the corresponding copy image (e.g., a low-resolution image) can be previewed through the display module (460). Subsequently, when a specified condition is satisfied (e.g., user input or system command), at least a portion of the original image stored in the memory (550) may be acquired and processed by, for example, an image signal processor (560). According to one embodiment, the memory (550) may be configured as at least a portion of the memory (430) or as a separate memory that operates independently thereof.

[0087] The image signal processor (560) can perform one or more image processing operations on an image obtained through the image sensor (530) or an image stored in memory (550). The above one or more image processing methods may include, for example, depth map generation, 3D modeling, panorama generation, feature point extraction, image synthesis, or image compensation (e.g., noise reduction, resolution adjustment, brightness adjustment, blurring, sharpening, or softing). Additionally or generally, the image signal processor (560) may perform control (e.g., exposure time control, or readout timing control, etc.) over at least one of the components included in the camera module (480) (e.g., image sensor (530)). The image processed by the image signal processor (560) may be stored back in memory (550) for further processing or provided to an external component of the camera module (480) (e.g., memory (430), display module (460), electronic device (402), electronic device (404), or server (408)). According to one embodiment, the image signal processor (560) is at least part of the processor (420). It may be configured as a separate processor that operates independently of the processor (420). If the image signal processor (560) is configured as a separate processor from the processor (420), at least one image processed by the image signal processor (560) may be displayed through the display module (460) as is or after additional image processing by the processor (420).

[0088] According to one embodiment, the electronic device (401) may include a plurality of camera modules (480) each having different attributes or functions. In this case, for example, at least one of the plurality of camera modules (480) may be a wide-angle camera and at least another may be a telephoto camera. Similarly, at least one of the plurality of camera modules (480) may be a front camera and at least another may be a rear camera.

[0089] According to various embodiments of the present disclosure, the camera module (480) described with reference to FIG. 5 may be applied substantially identically or similarly to the left / right camera module (119-1, 119-2) of FIG. 1, the camera module (205, 212, 213) of FIG. 2a and 2b, or the left / right depth camera (311a, 311b) of FIG. 3a. For example, according to an embodiment, when applied to the left / right camera module (119-1, 119-2) of FIG. 1, the camera module (205, 212, 213) of FIG. 2a and 2b, or the left / right depth camera (311a, 311b) of FIG. 3a, some of the components shown in FIG. 5 may be omitted, or new components not shown (e.g., ToF sensor) may be added. The detailed structure of the ToF sensor that can be added to the camera module (480) will be described in detail below with reference to FIG. 7.

[0090] According to various embodiments of the present disclosure, a ToF sensor that may be included in a camera module (480) is a sensor developed to sense distant objects by utilizing light, such as a LiDAR (light detection and ranging). For example, methods that can be applied to a ToF sensor can be broadly classified into a direct Time of Flight (dToF) method or an indirect Time of Flight (iToF) method. A dToF sensor (hereinafter referred to as 'dToF sensor') can calculate the distance to a specific object by transmitting individual pulses and the time it takes for them to be reflected back from a specific object. An iToF sensor (hereinafter referred to as 'iToF sensor') can calculate the distance to a specific object by comparing the phase of the transmitted pulse train with the phase of the pulse train reflected from a specific object. For example, a dToF sensor may be suitable for measuring the distance to an object located at a distance, while an iToF sensor may be suitable for measuring the distance to an object located at a short distance. In the disclosure to be described below, the ToF sensor included in the camera (113-1, 113-2) of FIG. 1, the camera module (205, 212, 213) of FIG. 2a and 2b, or the left / right depth camera (311a, 311b) of FIG. 3a may be referred to as a 'distance sensor'.

[0091] According to one example, the camera module (480) may operate in conjunction with a distance sensor or include a ToF camera in which a distance sensor is integrated (or combined). For example, the ToF method may represent a method of calculating distance (depth) by measuring the time of flight, that is, the time it takes to emit light (e.g., infrared) and have it reflected back. The distance sensor (or ToF sensor) included in the camera module (480) may consist of a light source that emits light and a detector that detects light as a pair. The camera module (480) may be capable of capturing an image (e.g., a 3D image) containing distance (or depth) information using the ToF method. For example, the ToF sensor may represent a 3D sensor that calculates the time it takes for light emitted from an object via infrared wavelengths to be reflected back, thereby recognizing the three-dimensionality and spatial information and / or movement of the object.

[0092] FIG. 6 is a block diagram (600) of a power management module (e.g., power management module (488) of FIG. 4) and a battery (e.g., battery (489) of FIG. 4) according to various embodiments.

[0093] Referring to FIG. 6, the power management module (488) may include a charging circuit (610), a power regulator (620), or a power gauge (630). The charging circuit (610) can charge the battery (489) using power supplied from an external power source to the electronic device (401). According to one embodiment, the charging circuit (610) can select a charging method (e.g., normal charging or fast charging) based on the type of external power source (e.g., power adapter, USB, or wireless charging), the magnitude of power that can be supplied from the external power source (e.g., about 20 watts or more), or at least some of the attributes of the battery (489), and can charge the battery (489) using the selected charging method. The external power source may be wired to the electronic device (401), for example, through a connection terminal (478), or wirelessly connected through an antenna module (497).

[0094] The power regulator (620) can generate multiple powers having different voltage or different current levels by adjusting the voltage level or current level of the power supplied from, for example, an external power source or a battery (489). The power regulator (620) can adjust the power of the external power source or battery (489) to a voltage or current level suitable for each of the components included in the electronic device (401). According to one embodiment, the power regulator (620) may be implemented in the form of a low drop-out (LDO) regulator or a switching regulator. The power gauge (630) can measure usage status information for the battery (489) (e.g., capacity of the battery (489), number of charge / discharge cycles, voltage, or temperature).

[0095] The power management module (488) can determine charge state information (e.g., lifespan, overvoltage, undervoltage, overcurrent, overcharge, overdischarge, overheating, short circuit, or swelling) related to the charging of the battery (489) based at least part of the measured usage state information, using, for example, a charging circuit (610), a power regulator (620), or a power gauge (630). The power management module (488) can determine whether the battery (489) is normal or abnormal based at least part of the determined charge state information. If the state of the battery (489) is determined to be abnormal, the power management module (488) can adjust the charging of the battery (489) (e.g., reducing the charging current or voltage, or stopping the charging). According to one embodiment, at least some of the functions of the power management module (488) may be performed by an external control device (e.g., a processor (420)).

[0096] According to one embodiment, the battery (489) may include a battery protection circuit module (PCM) (640). The battery protection circuit (640) may perform one or more of various functions (e.g., a pre-shutdown function) to prevent performance degradation or burnout of the battery (489). The battery protection circuit (640) may additionally or substantially be configured as at least part of a battery management system (BMS) capable of performing various functions including cell balancing, measuring battery capacity, measuring charge / discharge cycles, measuring temperature, or measuring voltage.

[0097] According to one embodiment, at least a portion of the usage status information or charge status information of the battery (489) may be measured using a corresponding sensor (e.g., temperature sensor) among the sensor modules (476), a power gauge (630), or a power management module (488). According to one embodiment, the corresponding sensor (e.g., temperature sensor) among the sensor modules (476) may be included as part of the battery protection circuit (640) or may be placed near the battery (489) as a separate device.

[0098] According to various embodiments of the present disclosure, the power management module (488) may include a protection device (e.g., the protection device (800) of FIG. 8) to prevent the camera module (e.g., the camera (113-1, 113-2) of FIG. 1, the camera modules (205, 212, 213) of FIG. 2a and 2b, the left / right depth camera (311a, 311b) of FIG. 3a, or the camera module (480) of FIG. 5) from being burned out due to an abnormal interruption of power supply, such as a sudden power off (SPO) (hereinafter referred to as 'sudden power off'). A sudden power off situation, such as an SPO, may be a situation in which the power supply is cut off due to an unexpected cause, such as the detachment, disconnection, or destruction of the battery. For example, an unexpected sudden power off situation, such as the detachment, disconnection, or destruction of the battery due to dropping or submersion of the device, may occur. The protection device (800) can supply driving voltages to the camera module (480), particularly the distance sensor module (e.g., the distance sensor module (700) of Fig. 7), using power supplied from a battery (e.g., the battery (489) of Fig. 6). The driving voltages supplied to the distance sensor module (700) may have various potential differences suitable for the application. As an example, the protection device (800) may be configured to provide a path to rapidly discharge residual voltage that could cause damage to internal components (e.g., the receiving sensor) by using a driving voltage that drops rapidly to a low level (0V) when the power supply is suddenly cut off. In this way, the protection device (800) can prevent internal components (e.g., the internal components of the distance sensor module (700) (e.g., the receiving sensor)) from being burned out due to the power supply to the distance sensor module (700) being cut off for abnormal reasons. For detailed configuration and / or operation of the protection device (800), see Figs. 8 through 12c. It will be explained in detail with reference.

[0099] FIG. 7 is a cross-sectional structural diagram of a distance sensor module (700) according to one embodiment.

[0100] Referring to FIG. 7, the distance sensor module (700) may utilize either a dToF method or an iToF method. The dToF method may be a method that converts time into distance by analyzing a histogram using an internal counter during the time of flight of light that hits an object and returns. The iToF method may be a method that obtains distance by extracting phases from multiple (e.g., 3 to 4) phase-delayed images relative to the modulation frequency. Although the protection device (800) proposed in this disclosure will be described assuming a dToF method distance sensor module (700), the implementation examples proposed in this disclosure may also be applied to an iToF method distance sensor module with substantially the same or slight modifications.

[0101] According to one example, the distance sensor module (700) may include a transmitting assembly (710) that emits an optical pulse (hereinafter referred to as 'transmitting optical signal') synchronized with light in a defined field of view, and a receiving assembly (720) that detects an optical pulse (hereinafter referred to as 'receiving optical signal') that hits an object and returns. The transmitting assembly (710) and / or the receiving assembly (720) may be mounted on a printed circuit board (PCB) (730).

[0102] The transmitting assembly (710) may include a vertical cavity surface emitting laser (VCSEL) array (715) which is an infrared light source, a driving chip (e.g., VCSEL driver IC) (713) capable of driving the VCSEL array (715), or a collimator or diffractive optical element (DOE) (717) configured to make the transmitted optical signal emitted by the VCSEL array (715) spatially parallel. As an example, the transmitting assembly (710) may have a structure in which the driving chip (713) and the VCSEL array (715) are stacked on a substrate (711). The driving chip (713) can drive the VCSEL array (715) using transmission driving voltages supplied from a power management module (e.g., the power management module (488) of FIG. 6). The VCSEL array (715) can be driven by a driving chip (713) and operate as a light source that generates a transmitted optical signal for distance measurement. The DOE (717) causes the transmitted optical signal generated by the VCSEL array (715) to be transmitted spatially parallel toward the front. For example, the DOE (717) can utilize diffraction and / or interference characteristics to make the transmitted optical signal generated by the VCSEL array (715) consist of spatially arranged points. For example, it may be configured as a micro-lens array instead of the DOE (717). To increase light efficiency, the transmitting assembly (710) may use a collimator lens or a meta lens instead of the DOE (717). In this case, the distance sensor module (700) can be manufactured to be more compact.The transmission assembly (710) may also multiply, such as 3x3 or 5x5, using a tiling DOE to increase the number of points to be rearranged by the transmission optical signal.

[0103] The receiving assembly (720) may include a light receiving lens (721), a band transmission filter (723), or a sensor (725). The light receiving sensor (721) may have a structure that facilitates receiving a light signal that is reflected back from one or more objects from a transmitted light signal output by the transmitting assembly (710). The band transmission filter (723) may be configured to allow only the received light signal of a specific wavelength band to pass through among the received light signals collected by the light receiving lens (721), and to block the received light signals of the remaining wavelength bands. The sensor (725) may be configured to convert light energy corresponding to the received light signal transmitted through the band transmission filter (723) into an electrical signal, which is electrical energy.

[0104] Not limited to what is described above, the distance sensor module (700) may further include one or more other components in addition to the transmitting assembly (710) or the receiving assembly (720), or some of the components shown in the transmitting assembly (710) or the receiving assembly (720) may be omitted, or new components may be further included, which may be obvious to those skilled in the art. For example, the distance sensor module (700) may further include a processor (e.g., image signal processor (560) of FIG. 5) for obtaining information regarding the distance to the object based on an electrical signal provided from the sensor (725). In addition, the distance sensor module (700) may further include a memory (e.g., EEPROM) for storing calibration information.

[0105] Additionally, FIG. 7 assumes a structure of a distance sensor module (700) in which the transmitting assembly (710) and the receiving assembly (720) are formed as a single unit, but it is not limited thereto. For example, the embodiments proposed in this disclosure can be equally applied to a distance sensor module in which the transmitting assembly (710) and the receiving assembly (720) are arranged separately.

[0106] FIG. 8 is a block diagram of a protection device (800) for controlling power supply from an electronic device (e.g., AR glasses (100) of FIG. 1, the electronic device (200) of FIG. 2a or FIG. 2b, or the HMD device (300) of FIG. 3a to FIG. 3d) according to one embodiment to a distance sensor module (e.g., distance sensor module (700) of FIG. 7).

[0107] Referring to FIG. 8, the protection device (800) may be configured to prevent the distance sensor module (700) from being damaged by a voltage discharged for a predetermined time interval by the power management circuit (820) due to a sudden power cutoff. For example, the protection device (800) may include a battery (810) (e.g., battery (489) in FIG. 6), a power management circuit (e.g., power management module (488) in FIG. 6), or a protection circuit (830).

[0108] The battery (810) supplies power (V) to the power management circuit (820). IN (811)) can be supplied. The battery (810) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0109] The power management circuit (820) receives power (V) supplied from the battery (810). IN (811)) can be used to provide the driving voltage (840) required for the distance sensor module (700) to perform normal operation. For example, the driving voltage (840) provided to the distance sensor module (700) by the power management circuit (820) is the first to nth driving voltage (VD1 (840-1), V D2 (840-2), V D3 (840-3), … … , V Dn It may include (840-n). The first to nth driving voltages (V D1 (840-1), V D2 (840-2), V D3 (840-3), … … , V Dn (840-n) can each be supplied as a component to perform the corresponding operation in the distance sensor module (700). The first to nth driving voltages (V D1 (840-1), V D2 (840-2), V D3 (840-3), … … , V Dn (840-n) can have different potential differences.

[0110] As an example, the first to nth driving voltages (V D1 (840-1), V D2 (840-2), V D3 (840-3), … … , V Dn (840-n) may include transmission driving voltages for operating a transmission module (e.g., transmission assembly (710) of FIG. 7) included in the distance sensor module (700). For example, the transmission driving voltages may include a first transmission driving voltage (e.g., LD 1.8V) for analog and I / O power supply (e.g., V of FIG. 9). TX1 ), a second transmission drive voltage for an analog power supply (e.g., LD 3.3V) (e.g., V in FIG. 9) TX2 or V D2 (840-2)), or a third transmit driving voltage for the laser VCSEL power supply (e.g., LDVCC 11V) (e.g., V in FIG. 9) TX3 or V D3(840-3)) may be included. The first transmission driving voltage (e.g., LD 1.8V), the second transmission driving voltage (e.g., LD 3.3V), or the third transmission driving voltage (e.g., LDVCC 11V) may have a predetermined discharge time interval. The predetermined discharge time interval is based on the characteristics of the capacitor provided in the power management circuit (820) corresponding to the transmission driving voltage. For example, the discharge time interval may be determined by the time required until the voltage charged in the capacitor corresponding to the transmission driving voltage is completely discharged, as the transmission driving voltage is not generated by the power management circuit (820) due to a sudden power cutoff. Accordingly, the discharge time interval of the first transmission driving voltage (e.g., LD 1.8V), the second transmission driving voltage (e.g., LD 3.3V), or the third transmission driving voltage (e.g., LDVCC 11V) may be determined by the capacitance of the capacitor to be charged by the corresponding transmission driving voltage and / or the potential difference of the corresponding transmission driving voltage. For example, the first transmission discharge time interval of the first transmission driving voltage (e.g., LD 1.8V) may be approximately 0.7ms. For example, the second transmission discharge time interval of the second transmission driving voltage (e.g., LD 3.3V) may be approximately 0.5ms. For example, the third transmission discharge time interval of the third transmission driving voltage (e.g., LDVCC 11V) may be approximately 10s.

[0111] As an example, the first to nth driving voltages (V D1 (840-1), V D2 (840-2), V D3 (840-3), … … , V Dn(840-n) may include receiving driving voltages for operating a receiving module (e.g., the receiving assembly (720) of FIG. 7) included in the distance sensor module (700). For example, the receiving driving voltages may include a first receiving driving voltage (e.g., VRLD -20.5V) for a SPAD (single-photon avalanche diode) breakdown voltage power supply (e.g., V of FIG. 9). RX1 or V D1 (840-1)), a second receiving drive voltage for an analog power supply (e.g., VDDA 3V) (e.g., V in FIG. 9) RX2 ), third receiver driving voltage for input / output power supply (I / O power supply) (e.g., VDDIO 1.8V) (e.g., V in Fig. 9) RX3 ), or a fourth receiving driving voltage for a digital power supply (e.g., VDDD 1.1V) (e.g., V in FIG. 9) RX4It may include ). The first receiving driving voltage (e.g., VRLD -20.5V), the second receiving driving voltage (e.g., VDDA 3V), the third receiving driving voltage (e.g., VDDIO 1.8V), or the fourth receiving driving voltage (e.g., VDDD 1.1V) may have a predetermined discharge time interval. The predetermined discharge time interval is based on the characteristics of the capacitor provided in the power management circuit (820) corresponding to the corresponding receiving driving voltage. For example, the discharge time interval may be determined by the time required until the voltage charged in the capacitor corresponding to the corresponding receiving driving voltage is completely discharged, as the corresponding receiving driving voltage is not generated by the power management circuit (820) due to a sudden power cutoff. Accordingly, the discharge time interval of the first receiving drive voltage (e.g., VRLD -20.5V), the second receiving drive voltage (e.g., VDDA 3V), the third receiving drive voltage (e.g., VDDIO 1.8V), or the fourth receiving drive voltage (e.g., VDDD 1.1V) may be determined by the capacitance of the capacitor to be charged by the corresponding receiving drive voltage and / or the potential difference of the corresponding receiving drive voltage. For example, the first receiving discharge time interval of the first receiving drive voltage (e.g., VRLD -20.5V) may be approximately 10s. For example, the second receiving discharge time interval of the second receiving drive voltage (e.g., VDDA 3V) may be approximately 10ms. For example, the third receiving discharge time interval of the third receiving drive voltage (e.g., VDDIO 1.8V) may be approximately 4ms. For example, the fourth receiving discharge time interval of the fourth receiving driving voltage (e.g., VDDD 1.1V) may be approximately 18ms.

[0112] The protection circuit (830) is the second transmission driving voltage (V D2 In response to a state transition of (840-2)) (e.g., reaching a critical level where the potential difference is substantially 0V), the first receiving driving voltage (V D1A path connecting to ground can be formed so that (840-1) can be discharged quickly. For example, if a holding voltage is required for a switch element (e.g., switch (831) of FIG. 10a) used in a protection circuit (830) to maintain a switching state, a third transmission driving voltage (V D3 (840-3) can be used as the state holding voltage of the corresponding switch element. For example, if a holding voltage is not required for the switch element used in the protection circuit (830) (e.g., switch (833) of FIG. 10b) to maintain the switching state, the third transmission driving voltage (V D3 (840-3) may not be provided as a protection circuit (830).

[0113] FIG. 9 is a diagram illustrating an exemplary configuration of the power management circuit (820) of FIG. 8.

[0114] Referring to FIG. 9, the power management circuit (820) may include a receiving power management module (910) or a transmitting power management module (920). The receiving power management module (910) has a supply voltage (V) supplied by a battery (e.g., the battery (810) of FIG. 8). IN Receiving driving voltages (V) for operating a receiving module (e.g., receiving assembly (720) of FIG. 7) included in a distance sensor module (e.g., distance sensing module (700) of FIG. 7) using (811)). RX1 , V RX2 , V RX3 , V RX4 It can be configured to supply ). The transmission power management module (920) is configured to supply a supply voltage (V) supplied by the battery (810). IN Transmission driving voltages (V) for operating a transmission module (e.g., transmission assembly (710) of FIG. 7) included in a distance sensor module (e.g., distance sensing module (700) of FIG. 7) using (811)). TX1 , V TX2 , V TX3 It can be configured to supply ).

[0115] In the receiving power management module (910), the receiving driving voltages (V RX1 , V RX2 , V RX3 , V RX4 Between the output terminal and the ground terminal where ) will be output respectively, there are 1-1 to 1-4 capacitors (C 11 , C 12 , C 13 , C 14 ) can be connected in series. 1-1 to 1-4 capacitors (C 11 , C 12 , C 13 , C 14 ) is the corresponding receiving driving voltage (V RX1 , V RX2 , V RX3 , or V RX4 It can be charged by ). 1-1 to 1-4 capacitors (C 11 , C 12 , C 13 , C 14 ) is the corresponding reception driving voltage (V) from the reception power management module (910). RX1 , V RX2 , V RX3 , or V RX4 If ) is not output, the charging voltage can be discharged during a predetermined discharge time interval. As an example, the 1-1 to 1-4 capacitors (C 11 , C 12 , C 13 , C 14 Among the voltages discharged from ), the 1st-1st capacitor (C 11 Voltage discharged at ) (V D1 (840-1)) can be provided as a protection circuit (e.g., protection circuit (830) of FIG. 8).

[0116] According to one example, the first receiving driving voltage (e.g., VRLD -20.5V)(V RX1 ), second receiver driving voltage (e.g., VDDA 3V)(V RX2 ), third receiver driving voltage (e.g., VDDIO 1.8V)(V RX3), or 4th receiver driving voltage (e.g., VDDD 1.1V)(V RX4 ) may have a predetermined discharge time interval. The predetermined discharge time interval is a capacitor (C) provided in correspondence with the corresponding receiving driving voltage. 11 , C 12 , C 13 , C 14 It is due to the characteristics of ). For example, during the discharge interval, because the corresponding receiving driving voltage is not generated by the power management circuit (820) due to sudden power cutoff, the capacitor (C) corresponding to the corresponding receiving driving voltage 11 , C 12 , C 13 , C 14 It can be determined by the time required until the voltage charged in ) is completely discharged. Accordingly, the discharge interval of the first receiving driving voltage (e.g., VRLD -20.5V), the second receiving driving voltage (e.g., VDDA 3V), the third receiving driving voltage (e.g., VDDIO 1.8V), or the fourth receiving driving voltage (e.g., VDDD 1.1V) is the capacitor (C) to be charged by the corresponding receiving driving voltage. 11 , C 12 , C 13 , C 14 It can be determined by the capacitance of ) and / or the potential difference of the corresponding receiving driving voltage. For example, a first-1 capacitor (C) charged by a first receiving driving voltage (e.g., VRLD -20.5V). 11 The first receiving discharge time interval of ) may be approximately 10s. For example, the first-second capacitor (C) charged by the second receiving driving voltage (e.g., VDDA 3V). 12 The second reception discharge interval of ) can be approximately 10ms. For example, the first-third capacitor (C) charged by the third reception driving voltage (e.g., VDDIO 1.8V). 13 The third receiving discharge time interval of ) can be approximately 4ms. For example, the first-fourth capacitors (C) charged by the fourth receiving driving voltage (e.g., VDDD 1.1V) 14The 4th reception discharge time interval of ) can be approximately 18ms.

[0117] Transmission driving voltages (V) in the transmission power management module (920) TX1 , V TX2 , V TX3 Between the output terminal and the ground terminal where ) will be output respectively, there are 2-1 to 2-3 capacitors (C 21 , C 22 , C 23 ) can be connected in series. 2-1 to 2-3 capacitors (C 21 , C 22 , C 23 ) is the corresponding transmission driving voltage (V TX1 , V TX2 , or V TX3 It can be charged by ). 2-1 to 2-3 capacitors (C 21 , C 22 , C 23 ) is the corresponding transmission driving voltage (V) from the transmission power management module (920). TX1 , V TX2 , or V TX3 If ) is not output, the charging voltage can be discharged for a predetermined discharge time interval. As an example, the 2-1 to 2-3 capacitors (C 21 , C 22 , C 23 Among the voltages discharged from ), the 2-2 capacitor (C 22 Voltage discharged at ) (V D2 (840-2)) can be provided as a protection circuit (e.g., protection circuit (830) of FIG. 8). As an example, 2-1 to 2-3 capacitors (C 21 , C 22 , C 23 Among the voltages discharged from ), the 2nd and 3rd capacitors (C 23 Voltage discharged at ) (V D3 (840-3)) can be provided as a protection circuit (e.g., protection circuit (830) of FIG. 8).

[0118] According to one example, the first transmission driving voltage (e.g., LD 1.8V) (VTX1 ), second transmission driving voltage (e.g., LD 3.3V)(V TX2 ), or third transmission driving voltage (e.g., LDVCC 11V)(V TX3 ) may have a predetermined discharge time interval. The predetermined discharge time interval is a capacitor (C) provided in correspondence with the corresponding receiving driving voltage. 21 , C 22 , C 23 It is due to the characteristics of ). For example, during the discharge interval, because the corresponding transmission driving voltage is not generated by the power management circuit (820) due to sudden power cutoff, the capacitor (C) corresponding to the corresponding transmission driving voltage 21 , C 22 , C 23 It can be determined by the time required until the voltage charged in ) is completely discharged. Therefore, the first transmission driving voltage (e.g., LD 1.8V) (V TX1 ), second transmission driving voltage (e.g., LD 3.3V)(V TX2 ), or third transmission driving voltage (e.g., LDVCC 11V)(V TX3 The discharge time interval of ) is the capacitor (C) to be charged by the corresponding transmission driving voltage. 21 , C 22 , C 23 It can be determined by the capacity of ) and / or the potential difference of the corresponding transmission driving voltage. For example, the first transmission driving voltage (e.g., LD 1.8V) (V TX1 The 2-1 capacitor (C) charged by ) 21 The first transmission discharge time interval of ) can be approximately 0.7ms. For example, the second transmission driving voltage (e.g., LD 3.3V) (V TX2 The second-second capacitor (C) charged by ) 22 The second transmission discharge time interval of ) can be approximately 0.5ms. For example, the third transmission driving voltage (e.g., LDVCC 11V) (V TX3 The second and third capacitors (C) charged by ) 23 The third transmission discharge interval of ) can be approximately 10s.

[0119] FIG. 10a is a drawing for illustrating an exemplary configuration of the protection circuit (830) of FIG. 8.

[0120] Referring to FIG. 10a, the protection circuit (830) may include at least one switch element (831). The protection circuit (830) may include an input terminal (801), an output terminal (802), and a control terminal (803). The protection circuit (830) may include a switch element (831) for which a holding voltage is required to maintain a switching state. In this case, the protection circuit (830) may include a terminal (804) for receiving the holding voltage. As an example, the protection circuit (830) may have the input terminal (801) electrically connected to the input terminal of the switch element (831), the output terminal (802) electrically connected to the output terminal of the switch element (831), and the control terminal (803) electrically connected to the control terminal of the switch element (831).

[0121] The switch element (831) is the potential difference (V) of the control terminal (803). en Switching operation can be performed by ). Potential difference (V) at control terminal (803) en In order for ) to occur, a predetermined resistance (R) is present between the control terminal (803) and the ground terminal. en ) can be provided. The switch element (831) is the potential difference (V) of the control terminal (803). en The input and output terminals can be switched so that they are connected when the voltage drops to a low level (e.g., 0V) or drops to a predetermined threshold potential. For example, at the control terminal (803) of the switch element (831), capacitors (C) provided in the transmission power management module (e.g., the transmission power management module (920) of FIG. 9) are provided. 21 , C 22 , C 23 Among them, the 2-2 capacitor (C) where the fastest discharge will occur 22 Discharge voltage (V) of ) D2 (840-2)) can be input. For example, the 2-2 capacitor (C 22The discharge interval of ) can be approximately 0.5ms.

[0122] At the input terminal (801) of the switch element (831), capacitors (C) provided in the receiving power management module (e.g., the receiving strategy management module (910) of FIG. 9) are provided. 11 , C 12 , C 13 , C 14 ) Among them, the 1st-1st capacitor (C) with a relatively long discharge interval 11 Discharge voltage (V) of ) D1 (840-1)) is a predetermined resistance (R in It can be input through ). For example, the 1-1 capacitor (C 11 The discharge time interval of ) can be approximately 10s. At this time, since the switch element (831) maintains the state where the input terminal (801) and the output terminal (802) are connected, the first-1 capacitor (C) input to the input terminal (801) 11 Discharge voltage (V) of ) D1 (840-1)) can be quickly discharged to the ground terminal through the output terminal (802). To this end, a predetermined resistance (R) is provided between the output terminal (802) and the ground terminal. out ) can be prepared.

[0123] The switch element (831) can maintain a state in which the input terminal (801) and the output terminal (802) are connected by the potential difference of the control terminal (803) by the holding voltage input to the terminal (804). For example, at the terminal (804) of the switch element (831), capacitors (C) provided in the transmission power management module (e.g., the transmission power management module (920) of FIG. 9) are provided. 21 , C 22 , C 23 ) Among them, the 2nd and 3rd capacitors (C) with a relatively long discharge time interval 23 Discharge voltage (V) of ) D3 (840-3)) can be input. In this case, the switch element (831) is a specific capacitor (e.g., C) provided in the receiving power management module (e.g., the receiving power management module (910) of FIG. 9). 11Voltage discharged by ) (V D1 (840-1)) can ensure sufficient discharge time to be completely discharged. For example, the second and third capacitors (C 23 The discharge interval of ) can be relatively long compared to approximately 10s (e.g., approximately 15s).

[0124] In FIG. 10a, resistors (R) for generating a potential difference at the input terminal (801), output terminal (802), or control terminal (803) in , R out , R en It is assumed that ) is provided outside the protection circuit (830), but it is not limited thereto. For example, the corresponding resistors (R in , R out , R en Some or all of ) may be included within the protection circuit (830). For example, a resistor (R) provided at the input terminal (801). in A resistor (R) provided at the ) and / or output terminal (802) out The impedance value of ) is the first-1 capacitor (C 11 Discharge voltage (V) of ) D1 It can be determined by considering the optimization of the discharge time interval (τ) of (840-1)) (e.g., τ = RC). The first capacitor (C 11 Discharge voltage (V) of ) D1 The discharge time interval of (840-1)) is a resistor (R) provided at the input terminal (801). in A resistor (R) provided at the ) and / or output terminal (802) out It can be adjusted in proportion to the impedance value of ). For example, the first-1 capacitor (C 11 Discharge voltage (V) of ) D1 The discharge time interval of (840-1)) is a resistor (R) provided at the input terminal (801). in A resistor (R) provided at the ) and / or output terminal (802) out The discharge time can be longer as the impedance value of increases. That is, the discharge time can be longer as the impedance value increases.

[0125] FIG. 10b is a drawing for illustrating an exemplary configuration of the protection circuit (830) of FIG. 8.

[0126] Referring to FIG. 10b, the protection circuit (830) may include at least one switch element (833). The protection circuit (830) may include an input terminal (805), an output terminal (806), and a control terminal (807). The protection circuit (830) may include a switch element (833) for which a holding voltage is not required to maintain a switching state. In this case, the protection circuit (830) may not provide a terminal (804) for receiving a holding voltage. The switching element (833) may be, for example, a P-channel JFET (junction field effect transistor). For example, the protection circuit (830) may have an input terminal (805) electrically connected to the input terminal (drain) of the switch element (833), an output terminal (806) electrically connected to the output terminal (source) of the switch element (833), and a control terminal (807) electrically connected to the control terminal (gate) of the switch element (833).

[0127] The switch element (833) can perform a switching operation based on the potential difference of the control terminal (807). In order for a potential difference to occur at the control terminal (807), a predetermined resistance (R) is present between the control terminal (807) and the ground terminal. g A )(e.g., 10KΩ) may be provided. The switch element (833) may be switched so that the input terminal and the output terminal are connected when the potential difference of the control terminal (807) drops to a low level (e.g., 0V) or drops to a predetermined threshold potential. As an example, capacitors (C) provided in the transmission power management module (e.g., the transmission power management module (920) of FIG. 9) may be provided at the control terminal (807) of the switch element (833). 21 , C 22 , C 23 Among them, the 2-2 capacitor (C) where the fastest discharge will occur 22 Discharge voltage (V) of )D2 (840-2)) can be input. For example, the 2-2 capacitor (C 22 The discharge interval of ) can be approximately 0.5ms.

[0128] At the input terminal (805) of the switch element (833), capacitors (C) provided in the receiving power management module (910) are installed. 11 , C 12 , C 13 , C 14 ) Among them, the 1st-1st capacitor (C) with a relatively long discharge interval 11 Discharge voltage (V) of ) D1 (840-1)) can be input. For example, the first-1 capacitor (C 11 The discharge time interval of ) can be approximately 10s. At this time, since the switch element (833) is connected to the input terminal (805) and the output terminal (806), the first-1 capacitor (C) input to the input terminal (805) 11 Discharge voltage (V) of ) D1 (840-1)) can be quickly discharged to the ground terminal through the output terminal (806). To this end, a predetermined resistance (R) is placed between the output terminal and the ground terminal of the switch element (833). s ) can be prepared.

[0129] In FIG. 10b, resistors (R) for generating a potential difference at the control terminal or output terminal of the switch element (833) g , R s It is assumed that ) is provided inside the protection circuit (830), but it is not limited thereto. For example, the corresponding resistors (R g , R s Some or all of ) may be provided outside the protection circuit (830). For example, a resistor (R) provided between the output terminal and the ground terminal of the switch element (833). s The impedance value of ) is the first-1 capacitor (C 11 Discharge voltage (V) of ) D1 It can be determined by considering the optimization of the discharge time interval of (840-1). 1-1 Capacitor (C11 Discharge voltage (V) of ) D1 The discharge time interval of (840-1)) is a resistor (R) provided between the output terminal and the ground terminal of the switch element (833). s It can be adjusted in proportion to the impedance value of ). For example, the first-1 capacitor (C 11 Discharge voltage (V) of ) D1 The discharge time interval of (840-1)) is a resistor (R) provided between the output terminal and the ground terminal of the switch element (833). s The length can increase as the impedance value of ) increases.

[0130] FIG. 11a is a timing diagram illustrating an example in which a switch connected inside a pixel of a distance sensor (e.g., sensor (725) of the distance sensing module (700) of FIG. 7) is burned out due to a sudden power interruption (e.g., SPO).

[0131] The discharge pattern of the signals shown in Fig. 11a is depicted as dropping to a low level at a specific point in time, but this is for the purpose of helping to understand the operation. In reality, the potential difference may decrease gradually.

[0132] Referring to FIG. 11a, if the power supply from the battery (e.g., the battery (810) of FIG. 8) is abnormally interrupted (1100), the corresponding capacitor (e.g., the first-1 to first-4 capacitors (C) of FIG. 9) 11 , C 12 , C 13 , C 14 ) or 2-1 to 2-3 capacitors (C 21 , C 22 , C 23 Voltages charged in )) (e.g., transmission driving voltages (V) of FIG. 9 RX1 , V RX2 , V RX3 , V RX4 ) or receiving driving voltages (V RX1 , V RX2 , V RX3 , V RX4 ) can be discharged during a predetermined discharge time interval. For example, the order from longest discharge time interval is VD3 (e.g., LDVCC 11V)(e.g., V in Fig. 9) TX3 or V D3 (840-3)), V D1 (e.g., VRLD -20.5V)(e.g., V in Fig. 9) RX1 or V D1 (840-1)), V D6 (e.g., VDDD 1.1V)(e.g., V in Fig. 9) RX4 ), V D5 (e.g., VDDA 3V)(e.g., V in Fig. 9) RX2 ), V D4 (e.g., VDDIO 1.8V)(e.g., V in Fig. 9) RX3 ), V D2 (e.g., LD 3.3V)(e.g., V in Fig. 9) TX2 or V D2 (840-2)) may apply.

[0133] As described, V with a long discharge time (1110) at the point (1100) when the power supply from the battery (810) is cut off by an unexpected power interruption (e.g., SPO). D1 (e.g., VRLD -20.5V)(e.g., V in Fig. 9) RX1 or V D1 (840-1)) can damage the pixels of the light receiving sensor (e.g., sensor (725) in Fig. 7).

[0134] FIG. 11b is a timing diagram to explain how a pixel or switch inside a distance sensor (e.g., the sensor (725) of the distance sensing module (700) of FIG. 7) is prevented from burning out due to a sudden power interruption according to one embodiment.

[0135] The discharge pattern of the signals shown in Fig. 11b is depicted as dropping to a low level at a specific point in time, but this is for the purpose of helping to understand the operation. In reality, the potential difference may decrease gradually.

[0136] Referring to FIG. 11b, if the power supply from the battery (e.g., battery (810) of FIG. 8) is abnormally interrupted (1100), the protection circuit (e.g., protection circuit (830) of FIG. 8) corresponds to the capacitor (e.g., capacitors 1-1 to 1-4 (C) of FIG. 9). 11 , C 12 , C 13 , C 14 Voltages charged in ) (e.g., transmission driving voltages of FIG. 9 (V RX1 , V RX2 , V RX3 , V RX4 )) or 2-1 to 2-3 capacitors (C 21 , C 22 , C 23 Voltages charged in )) (e.g., receiving driving voltages (V) of FIG. 9 RX1 , V RX2 , V RX3 , V RX4 V, which has the shortest discharge interval among ) D2 (e.g., LD 3.3V)(e.g., V in Fig. 9) TX2 or V D2 In response to the falling edge (1120) of (840-2)), the input terminal can be connected to a grounded output terminal. Thus, V input to the protection circuit (830) D1 (e.g., VRLD -20.5V)(e.g., V in Fig. 9) RX1 or V D1 (840-1)) can be rapidly discharged to the ground terminal. In this case, V D1 Since it can have a relatively short discharge time interval (1130) compared to other discharge voltages, the time during which damage can be inflicted on the pixels of the receiving sensor (725) can be reduced. For example, the corresponding capacitor (e.g., the first-1 to first-4 capacitors (C) of FIG. 9) 11 , C 12 , C 13 , C 14 Among the voltages discharged from ), V D3 (e.g., LDVCC 11V)(e.g., V in Fig. 9) TX3 or V D3(840-3)) has a relatively long discharge time interval (1140) compared to other discharge voltages, so it can be supplied as the driving voltage of the protection circuit (830).

[0137] FIG. 12a, FIG. 12b, or FIG. 12c is a drawing for illustrating examples of the arrangement of a protection circuit according to one embodiment (e.g., the protection circuit (830) of FIG. 10a or FIG. 10b).

[0138] Referring to FIG. 12a, the protection circuit (1215a) may be mounted on the first PCB (1210a) together with the transmit power management circuit (Tx PMIC) (1211a) (e.g., transmit power management module (920) of FIG. 9) and / or receive power management circuit (Rx PMIC) (1213a) (e.g., receive power management module (910) of FIG. 9).

[0139] The protection circuit (1215a) supplies a first driving voltage (e.g., V in FIG. 7) corresponding to at least one transmission driving voltage (e.g., LDVCC 11V and / or LD 3.3V) among the transmission driving voltages supplied to a transmission module (Tx) (1225a) (e.g., transmission assembly (710) in FIG. 7) included in a distance sensor module (1223a) (e.g., distance sensor module (700) in FIG. 7) on the first PCB (1210a) where the TX PMIC (1211a) is mounted on the second PCB (1220a) (e.g., distance sensor module (700) in FIG. 7). D2 (840-2) and / or V D3 (840-3)) can be provided as input. The transmission driving voltages output by the Tx PMIC (1211a) can be provided to the transmission module (Tx) (1225a) through the connector (1221a) mounted on the second PCB (1220a).

[0140] The protection circuit (1215a) may receive as input a second driving voltage corresponding to at least one of the receiving driving voltages (e.g., VRLD -20.5V) among the receiving driving voltages supplied to a receiving module (Tx) (1227a) (e.g., receiving assembly (720) of FIG. 7) included in a distance sensor module (1223a) (e.g., distance sensor module (700) of FIG. 7) mounted on the first PCB (1210a) by the Rx PMIC (1213a) on the second PCB (1220a). The receiving driving voltages output by the Rx PMIC (1213a) may be provided to the receiving module (Rx) (1227a) through a connector (1221a) mounted on the second PCB (1220a).

[0141] For example, under normal power supply conditions, at least one transmit drive voltage output by the Tx PMIC (1211a) (e.g., LDVCC 11V and / or LD 3.3V) is a first drive voltage (e.g., V in FIG. 9). D2 (840-2) or V D3 (840-3)) can be provided, and at least one receiving drive voltage (e.g., VRLD -20.5V) output by the Rx PMIC (1213a) can be provided as the second drive voltage. The normal power supply state corresponds to a state in which power is supplied normally from the battery (e.g., battery (810) in FIG. 8) to the Tx PMIC (1211a), for example, or a state in which the power supply is cut off through normal procedures. In this case, the first drive voltage and the second drive voltage can be maintained at a constant potential difference. Therefore, in the normal power supply state, the distance sensor module (1223a) may not be damaged even without the operation of the protection circuit (1215a).

[0142] For example, in an abnormal power supply condition, a specific capacitor (e.g., C in FIG. 9) charged by at least one transmit drive voltage (e.g., LDVCC 11V and / or LD 3.3V) output by the Tx PMIC (1211a). 22 or C23 The discharge voltage of ) is the first driving voltage (e.g., V in Fig. 9). D2 (840-2) or V D3 (840-3)) may be provided as a specific capacitor (e.g., C in FIG. 9) charged by at least one receiving drive voltage (e.g., VRLD -20.5V) output by the Rx PMIC (1213a). 11 The discharge voltage of ) is the second driving voltage (e.g., V in Fig. 9). D1 It may be provided as (840-1). An abnormal power supply condition may correspond to a state in which the power supply from the battery (e.g., battery (810) in FIG. 8) to the Tx PMIC (1211a) is forcibly interrupted due to external factors such as, for example, external shock or flooding. In this case, the first driving voltage may gradually decrease in potential difference during a predetermined discharge time interval. The predetermined discharge time interval is a specific capacitor (e.g., C in FIG. 9). 22 or C 23 It can be determined by the capacity of ). Therefore, in an abnormal power supply condition, the protection circuit (1215a) can operate to prevent damage to the distance sensor module (1223a).

[0143] The protection circuit (1215a) may not provide any particular operation in a normal power supply state in which the transmission driving voltages and reception driving voltages are normally supplied from the Tx PMIC (1211a) and Rx PMIC (1213a) to the transmission module (Tx) (1225a) and the reception module (Rx) (1227a).

[0144] The protection circuit (1215a) can operate to form a path to bypass the second driving voltage to the ground terminal based on the first driving voltage when the transmission driving voltages and reception driving voltages supplied from the Tx PMIC (1211a) and Rx PMIC (1213a) to the transmission module (Tx) (1225a) and the reception module (Rx) (1227a) are abnormally cut off. At this time, the discharge time interval of the first driving voltage may be relatively shorter than the discharge time interval of the second driving voltage. For example, the protection circuit (1215a) may be switched to form a path to rapidly discharge the second driving voltage to the ground terminal in response to the first driving voltage, which undergoes a relatively rapid discharge, reaching a specific threshold potential difference. In this case, the discharge time interval of the second driving voltage can be reduced, thereby preventing the distance sensor module (700) from being burned out by the second driving voltage.

[0145] Referring to FIG. 12b, a transmit power management circuit (Tx PMIC) (1211b) (e.g., transmit power management module (920) of FIG. 9) and / or a receive power management circuit (Rx PMIC) (1213b) (e.g., receive power management module (910) of FIG. 9) may be mounted on the first PCB (1210b).

[0146] The protection circuit (1229b) may be mounted on the second PCB (1220b) together with the transmission module (Tx) (1225b) (e.g., transmission assembly (710) of FIG. 7), the reception module (Rx) (1227b) (e.g., reception assembly (720) of FIG. 7) included in the distance sensor module (1223b) (e.g., distance sensor module (700) of FIG. 7), and / or the connector (1221b).

[0147] The protection circuit (1229b) is a first driving voltage (e.g., V in FIG. 9) corresponding to at least one of the transmission driving voltages (e.g., LDVCC 11V and / or LD 3.3V) among the transmission driving voltages supplied to the transmission module (Tx) (1225b) (e.g., transmission assembly (710) in FIG. 7) through the connector (1221b) on the second PCB (1220b). D2 (840-2) and / or V D3 (840-3)) can be provided as input. Transmission driving voltages supplied to the transmission module (Tx) (1225b) (e.g., transmission assembly (710) of FIG. 7) through the connector (1221b) can be provided by the Tx PMIC (1211b).

[0148] The protection circuit (1229b) may receive as input a second driving voltage corresponding to at least one of the receiving driving voltages supplied to the receiving module (Rx) (1227b) (e.g., the receiving assembly (720) of FIG. 7) through the connector (1221b) on the second PCB (1220b). The receiving driving voltages supplied to the receiving module (Rx) (1227b) (e.g., the receiving assembly (720) of FIG. 7) through the connector (1221b) may be provided by the Rx PMIC (1213b).

[0149] Referring to FIG. 12c, a protection circuit (1230c) may be provided between the first PCB (1210c) and the second PCB (1220c). The first PCB (1210c) may be equipped with a transmit power management circuit (Tx PMIC) (1211c) (e.g., the transmit power management module (920) of FIG. 9) and / or a receive power management circuit (Rx PMIC) (1213c) (e.g., the receive power management module (910) of FIG. 9). The second PCB (1220c) may be equipped with a transmission module (Tx) (1225c) (e.g., transmission assembly (710) of FIG. 7), a reception module (Rx) (1227c) (e.g., reception assembly (720) of FIG. 7) included in a distance sensor module (1223c) (e.g., distance sensor module (700) of FIG. 7), and / or a connector (1221c).

[0150] The protection circuit (1230c) is a first driving voltage (e.g., V in FIG. 9) corresponding to at least one of the transmission driving voltages (e.g., LDVCC 11V and / or LD 3.3V) among the transmission driving voltages supplied by the transmission power management circuit (Tx PMIC) (1211c) mounted on the first PCB (1210c) to the transmission module (Tx) (1225c) mounted on the second PCB (1220c). D2 (840-2) and / or V D3 (840-3)) can be provided as input.

[0151] The protection circuit (1230c) can receive as input a second driving voltage corresponding to at least one of the receiving driving voltages (e.g., VRLD -20.5V) among the receiving driving voltages supplied to the receiving module (Rx) (1227c) mounted on the second PCB (1220c) by the receiving power management circuit (Rx PMIC) (1213c) mounted on the first PCB (1210c).

[0152] The technical problems to be solved in this disclosure are not limited to those mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art to which this disclosure belongs.

[0153] As an example, the electronic device (100, 200, 300) may include a camera module (700) including a distance sensor. The electronic device (100, 200, 300) may include a power management circuit (PMIC) (820) configured to output a plurality of driving voltages for driving the camera module (700). The electronic device (100, 200, 300) may include a first driving voltage (V1) which is one of the plurality of driving voltages. D2 (840-2)) based on the second driving voltage (V) which is one of the plurality of driving voltages above D1 It may include a protection circuit (830) configured to form a path for bypassing (840-1)) to the ground terminal. Here, the discharge time resulting from the interruption of power supply to the power management circuit (820) is the first driving voltage (V D2 (840-2)) the second driving voltage (V) above D1 It can be relatively shorter compared to (840-1).

[0154] As an example, the electronic device (100, 200, 300) comprises one or more capacitors (C 11 , C 22 , C 23 It may include ). The one or more capacitors (C 11 , C 22 , C 23 ) is configured to be charged by the corresponding driving voltage during the time interval in which power is supplied to the power management circuit (820). The one or more capacitors (C 11 , C 22 , C 23 ) is configured so that the charging voltage discharges during the time interval when the power supply to the power management circuit (820) is cut off.

[0155] As an example, the protection circuit (830) is the first driving voltage (V D2It may include a switch element (831, 833) configured to be switched by a potential difference based on (840-2).

[0156] As an example, the protection circuit (830) is configured with a pull-down resistor (R) between the output terminal and the ground terminal of the switch elements (831, 833). OUT , R S It may include ).

[0157] As an example, the switch element (831, 833) is the first driving voltage (V D2 The second driving voltage (V) applied to the input terminal by (840-2)) D1 (840-1)) can be output to the above output terminal.

[0158] As an example, the protection circuit (830) is a third driving voltage (V) which is one of the plurality of driving voltages. D3 (840-3)) can be configured to use as the holding voltage.

[0159] As an example, the second driving voltage (V) above D1 (840-1)) Considering that the protection circuit (830) bypasses the ground terminal, among the plurality of driving voltages, the third driving voltage (V D3 (840-3)) The discharge time may be longest when the power supply to the above power management circuit (820) is cut off.

[0160] As an example, the protection circuit (830) is the first driving voltage (V D2 In response to the potential difference that can be varied by (840-2)) reaching a critical potential difference, the second driving voltage (V D1 (840-1)) can be configured to form a path to bypass to the ground terminal.

[0161] As an example, the above critical potential difference can be substantially 0 volts.

[0162] As an example, the protection circuit (830) may be mounted on a printed circuit board (1210a) on which the power management circuit (820) is mounted.

[0163] As an example, the protection circuit (830) may be included in the camera module (700).

[0164] As an example, the protection circuit (830) may be provided on the path through which the plurality of driving voltages are supplied from the power management circuit (820) to the camera module (700).

[0165] As an example, the electronic device (100, 200, 300) may include a battery (810). The electronic device (100, 200, 300) may include a camera module (700) comprising a transmitting assembly (710) configured to output a transmitting optical signal for distance measurement and a receiving assembly (720) configured to receive a receiving optical signal that is reflected back from a specific object and output an electrical signal to be used to measure the distance to said specific object. The electronic device (100, 200, 300) uses power (711) supplied by the battery (810) to transmit a plurality of transmitting driving voltages (V) to the transmitting assembly (710). RX1 , V RX2 , V RX3 , V RX4 It may include a transmission power management module (920) that supplies ). The electronic device (100, 200, 300) uses power supplied by the battery (810) to supply a plurality of reception driving voltages (V) to the reception assembly (720). TX1 , V TX2 , V TX3 It may include a receiving power management module (910) that supplies ). The electronic device (100, 200, 300) may include the plurality of receiving driving voltages (V RX1 , V RX2 , V RX3 , V RX4First capacitors (C) configured to be charged by ) 11 , C 12 , C 13 , C 14 ) may include. The electronic device (100, 200, 300) may include the plurality of transmission driving voltages (V TX1 , V TX2 , V TX3 Second capacitors (C) configured to be charged by ) 21 , C 22 , C 23 ) may include. The electronic device (100, 200, 300) may include a first discharge voltage (V D2 (840-2)) based on the second discharge voltage (V D1 It may include a protection circuit (830) configured to form a path for bypassing (840-1)) to the ground terminal. The first discharge voltage (V D2 (840-2)) is the second capacitors (C) due to the power (711) supply from the battery (810) being cut off. 21 , C 22 , C 23 Among ), a specific capacitor (C) with a relatively short discharge time 22 It may be a voltage discharged by ). The second discharge voltage (V D1 (840-1)) is the first capacitors (C) due to the power (711) supply from the battery (810) being cut off. 11 , C 12 , C 13 , C 14 Among ), a specific capacitor (C) with a relatively long discharge time 11 It can be a voltage discharged by ).

[0166] As an example, the protection circuit (830) has the first discharge voltage (V D2 It may include a switch element (831, 833) configured to be switched by a potential difference based on (840-2).

[0167] As an example, the protection circuit (830) is configured with a pull-down resistor (R) between the output terminal and the ground terminal of the switch elements (831, 833). OUT , R S It may include ).

[0168] As an example, the switch element (831, 833) is the first discharge voltage (V D2 The second discharge voltage (V) applied to the input terminal by (840-2)) D1 (840-1)) can be output to the above output terminal.

[0169] As an example, the protection circuit (830) is configured such that the second capacitors (C) are cut off when the power supply (711) from the battery (810) is cut off. 21 , C 22 , C 23 Among ), a specific capacitor (C) with a relatively long discharge time 23 Voltage discharged by ) (V D3 (840-3)) can be configured to be used as a holding voltage to maintain the operating state of the switch elements (831, 833).

[0170] As an example, the protection circuit (830) is configured such that the second capacitors (C) are cut off when the power supply (711) from the battery (810) is cut off. 21 , C 22 , C 23 The specific capacitor (C) with the longest discharge time among ) 23 Voltage discharged by ) (V D3 (840-3)) can be configured to be used as a holding voltage to maintain the operating state of the switch elements (831, 833).

[0171] As an example, the protection circuit (830) is, the first discharge voltage (V D2 In response to the potential difference that can be varied by (840-2)) reaching a critical potential difference, the second discharge voltage (V D1(840-1)) can be configured to form a path to bypass to the ground terminal.

[0172] As an example, the above critical potential difference can be substantially 0 volts.

[0173] As an example, the protection circuit (830) may be mounted on a printed circuit board (1210a) on which the transmission power management module (920) and / or the reception power management module (910) are mounted.

[0174] As an example, the protection circuit (830) may be included in the camera module (700).

[0175] As an example, the protection circuit (830) is configured to control the plurality of transmission driving voltages (V) in the transmission power management module (920) and / or the reception power management module (910). TX1 , V TX2 , V TX3 ) and / or the plurality of receiving driving voltages (V RX1 , V RX2 , V RX3 , V RX4 ) can be provided on the path supplied to the camera module (700).

[0176] As an example, the first discharge voltage (V) above D2 (840-2)) is the above second capacitors (C 21 , C 22 , C 23 The specific capacitor (C) with the shortest discharge time among ) 22 It can be a voltage discharged by ).

[0177] As an example, the second discharge voltage (V D1 (840-1)) is the first capacitors (C 11 , C 12 , C 13 , C 14 The specific capacitor (C) with the longest discharge time among ) 11 It can be a voltage discharged by ).

[0178] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs.

[0179] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0180] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as "coupled" or "connected" to another (e.g., 2nd) component, with or without the terms "functionally" or "communicationly," it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0181] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0182] Various embodiments of this document may be implemented as software (e.g., a program) comprising one or more instructions stored in a storage medium (e.g., memory (430)) readable by a machine (e.g., electronic device (100, 200, 300, 400)). For example, a processor (e.g., processor (420)) of a machine (e.g., electronic device (100, 200, 300, 400)) may call at least one of the one or more instructions stored from the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' is a device in which the storage medium is tangible, and It merely means that it does not contain a signal (e.g., electromagnetic waves), and this term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily on a storage medium.

[0183] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0184] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

In the electronic device (100, 200, 300), A camera module (700) including a distance sensor; A power management circuit (PMIC) (820) configured to output a plurality of driving voltages for driving the camera module (700); and A first driving voltage (V) which is one of the plurality of driving voltages mentioned above. D2 (840-2)) based on the second driving voltage (V) which is one of the plurality of driving voltages above D1 (840-1)) includes a protection circuit (830) configured to form a path to bypass to the ground terminal, Here, the discharge time resulting from the interruption of power supply to the power management circuit (820) is the first driving voltage (V D2 (840-2)) the above second driving voltage (V D1 Electronic device (100, 200, 300), which is relatively short compared to (840-1). In paragraph 1, One or more capacitors (C 11 , C 22 , C 23 Includes ), Here, the one or more capacitors (C 11 , C 22 , C 23 An electronic device (100, 200, 300) configured such that charging is performed by the corresponding driving voltage during the time interval when power is supplied to the power management circuit (820), and the charging voltage is discharged during the time interval when power is supplied to the power management circuit (820). In paragraph 1 or 2, The above protection circuit (830), The above first driving voltage (V D2 Switching elements (831, 833) configured to be switched by a potential difference based on (840-2); and A pull-down resistor (R) configured between the output terminal and the ground terminal of the above switch elements (831, 833). OUT , R S Includes ), Here, the switch elements (831, 833) are the first driving voltage (V D2 The second driving voltage (V) applied to the input terminal by (840-2)) D1 An electronic device (100, 200, 300) that outputs (840-1)) to the above output terminal. In any one of paragraphs 1 through 3, The above protection circuit (830) is a third driving voltage (V) which is one of the plurality of driving voltages. D3 (840-3)) is configured to use as a holding voltage, and The above second driving voltage (V D1 (840-1)) Considering that the protection circuit (830) bypasses the ground terminal, among the plurality of driving voltages, the third driving voltage (V D3 (840-3)) The electronic device (100, 200, 300) having the longest discharge time as the power supply to the above power management circuit (820) is cut off. In any one of paragraphs 1 through 4, The above protection circuit (830) is, The above first driving voltage (V D2 In response to the potential difference that can be varied by (840-2)) reaching a critical potential difference, the second driving voltage (V D1 (840-1)) is configured to form a path to bypass to the ground terminal, and An electronic device (100, 200, 300) in which the above critical potential difference is substantially 0 volts. In any one of paragraphs 1 through 5, An electronic device (100, 200, 300) in which the protection circuit (830) is mounted on a printed circuit board (1210a) on which the power management circuit (820) is mounted. In any one of paragraphs 1 through 6, The above protection circuit (830) is included in the camera module (700), an electronic device (100, 200, 300). In any one of paragraphs 1 through 6, An electronic device (100, 200, 300) in which the protection circuit (830) is provided on the path through which the plurality of driving voltages are supplied from the power management circuit (820) to the camera module (700). In the electronic device (100, 200, 300), Battery (810); A camera module (700) comprising a transmitting assembly (710) configured to output a transmitting optical signal for distance measurement and a receiving assembly (720) configured to receive a receiving optical signal that is reflected back from a specific object and output an electrical signal to be used to measure the distance to the specific object; A plurality of transmission driving voltages (V) to the transmission assembly (710) using power (711) supplied by the battery (810). RX1 , V RX2 , V RX3 , V RX4 A transmission power management module (920) that supplies ) Using power supplied by the battery (810), a plurality of receiving driving voltages (V) are supplied to the receiving assembly (720). TX1 , V TX2 , V TX3 A receiving power management module (910) that supplies ) The above plurality of receiving driving voltages (V RX1 , V RX2 , V RX3 , V RX4 First capacitors (C) configured to be charged by ) 11 , C 12 , C 13 , C 14 ); The above plurality of transmission driving voltages (V TX1 , V TX2 , V TX3 Second capacitors (C) configured to be charged by ) 21 , C 22 , C 23 ); and First discharge voltage (V D2 (840-2)) based on the second discharge voltage (V D1 (840-1)) includes a protection circuit (830) configured to form a path to bypass to the ground terminal, Here, the first discharge voltage (V D2 (840-2)) is the second capacitors (C) due to the power (711) supply from the battery (810) being cut off. 21 , C 22 , C 23 Among ), a specific capacitor (C) with a relatively short discharge time 22 It is the voltage discharged by ), and The above second discharge voltage (V D1 (840-1)) is the first capacitors (C) due to the power (711) supply from the battery (810) being cut off. 11 , C 12 , C 13 , C 14 Among ), a specific capacitor (C) with a relatively long discharge time 11 The voltage discharged by ). Electronic device (100, 200, 300). In Paragraph 9, The above protection circuit (830), The above first discharge voltage (V D2 Switching elements (831, 833) configured to be switched by a potential difference based on (840-2); and A pull-down resistor (R) configured between the output terminal and the ground terminal of the above switch elements (831, 833). OUT , R S Includes ), The second capacitors (C) due to the interruption of the power (711) supply from the battery (810) 21 , C 22 , C 23 Among ), a specific capacitor (C) with a relatively long discharge time 23 Voltage discharged by ) (V D3 (840-3)) is configured to be used as a holding voltage to maintain the operating state of the switch elements (831, 833), and Here, the switch element (831, 833) is the first discharge voltage (V D2 The second discharge voltage (V) applied to the input terminal by (840-2)) D1 An electronic device (100, 200, 300) that outputs (840-1)) to the above output terminal. In any one of paragraphs 9 through 10, The above protection circuit (830) is, The above first discharge voltage (V D2 In response to the potential difference that can be varied by (840-2)) reaching a critical potential difference, the second discharge voltage (V D1 (840-1)) is configured to form a path to bypass to the ground terminal, and An electronic device (100, 200, 300) in which the above critical potential difference is substantially 0 volts. In any one of paragraphs 9 through 11, An electronic device (100, 200, 300) in which the protection circuit (830) is mounted on a printed circuit board (1210a) equipped with the transmission power management module (920) and / or the reception power management module (910). In any one of paragraphs 9 through 11, The above protection circuit (830) is included in the camera module (700), an electronic device (100, 200, 300). In any one of paragraphs 9 through 11, The protection circuit (830) above is used for the plurality of transmission driving voltages (V) in the transmission power management module (920) and / or the reception power management module (910). TX1 , V TX2 , V TX3 ) and / or the plurality of receiving driving voltages (V RX1 , V RX2 , V RX3 , V RX4 An electronic device (100, 200, 300) provided on a path through which the above-mentioned camera module (700) is supplied. In any one of paragraphs 9 through 14, The above first discharge voltage (V D2 (840-2)) is the above second capacitors (C 21 , C 22 , C 23 The specific capacitor (C) with the shortest discharge time among ) 22 It is the voltage discharged by ), and The above second discharge voltage (V D1 (840-1)) is the first capacitors (C 11 , C 12 , C 13 , C 14 The specific capacitor (C) with the longest discharge time among ) 11 The voltage discharged by ). Electronic device (100, 200, 300).

Images