Laser etching method and apparatus

Abstract

A laser etching apparatus and process wherein an array of lasers is used to create defined etchings or markings in a material. These markings include alphanumeric code, bar codes, QR codes, and other symbols and illustrations. The apparatus includes multiple laser heads configured to etch on demand and as the material moves continuously through the apparatus. The laser heads are mounted in arrays, with offset mounting of the laser heads being set at different elevations relative to each other and the material which ensures all etchings meet specifications. This offset mounting eliminates errors caused by the slight differences and imperfections in the material specifications. The laser heads receive data from a controller that is interpreting and translating digital drawing files to control the lasers in real time. The data received determines what markings to etch.

Description

LASER ETCHING METHOD AND APPARATUSI. CROSS REFERENCE TO RELATED APPLICATION

[0001] This application is based on and claims the priority of United States provisional application 63745417 filed on January 15, 2025, and is fully incorporated herein by reference.II. Background and Summary of the Invention

[0002] Without limiting the applicability of this invention, it is particularly well suited for use in the invention entitled Digitally Automated Framing System filed as PCT / US2020 / 076624, United States application serial number 18286651 filed on October 12, 2023 and published as W02023 / 056170 Al on April 6, 2023, which application is incorporated herein in its entirety by reference. In the Digitally Automated Framing System referenced patent application, building location indicia is etched on framing members, namely tracks and studs. The instant invention is an improvement on the method and apparatus for laser etching the printed indicia on the framing members.

[0003] Laser etching is a process where a laser is used to delicately melt a material to create defined markings. These markings include alphanumeric code, bar codes, QR codes, and other symbols and illustrations. The invention described herein is a stationary or moving chassis with multiple laser heads configured to etch on demand and on the fly.

[0004] On the fly occurs as material is moving. On demand is changing the code or marking at each etching. The invention is capable of etching on multiple surfaces simultaneously and determines what markings to etch by reading from or interpreting digital files, for example from three-dimensional or computer aided design (CAD) drawings. It is not preprogrammed with specifications on what to mark, as is the case with other laser devices and etching. Rather it receives data from a controller that is interpreting and translating digital drawing files (.dwg) to control the lasers in real time.

[0005] The digital files are interpreted by the laser employing software where algorithms interpret .dwg files to create specific alphanumeric code and symbols that are marked on materials passing through the device. The invention described herein can also mark thegeometry or shapes of how elements align (see Fig. 7 for an example) when assembled. These etchings are particularly useful in aiding precise, efficient assembly of materials (see Fig. 7), effectively eliminating interpretation, measuring, or referring to instructions or plans to perform the work with precision and reducing errors. The invention etches materials for a build-by-numbers approach to assemble studs in a track or cords in a web such as seen in Fig. 7. The invention can also etch other types of useful code and directions that guide other stakeholders who may be involved in the assembly process .

[0006] Further, this device is capable, because of its multi-head configuration, of eliminating errors caused by the slight differences and imperfections in material specifications, which causes the elevation, or distance, relative to the laser heads to change. If material is being laser etched and the surface distance is variable, moving closer or further from the laser, etching will not be consistent, or may not occur at all. The invention eliminates issues caused by out of specification materials because of its multi-head design where the lasers are set at different elevations relative to each other (thereby from the materials) and can etch individually or in combination with each other to ensure all etchings meet specifications.III. DESCRIPTION OF THE DRAWINGS

[0007] Fig. l is a perspective view of the light gauge steel profiles entering the marking station that houses the lasers.

[0008] Fig. 2 is a perspective view of the marking station with the housing enclosure removed.

[0009] Fig. 3 is a perspective view of the laser heads positioned around the processing lane on which the light gauge steel profile is mounted.

[0010] Fig. 4 is an end view of the three arrays of laser heads mounted around the light gauge steel profile.

[0011] Fig. 5 is a top view of the three arrays of laser heads illustrated in Fig. 4.

[0012] Fig. 6 is an end view of two of the three arrays of laser heads.

[0013] Fig. 7 is a perspective view of the etchings on chords and on a track in which the chords are mounted to facilitate mounting and fastening the chords to the web.

[0014] Fig. 8 a flow chart illustrating the flow of data from the initial CAD / BTM framing model through the various steps until it reaches the laser controllers.IV. DESCRIPTION OF THE PREFERRED EMBODIMENT

[0015] Turning first to Fig. 1, there is a light gauge steel profile 10 mounted on a support track 11. A marking station 12 has a housing 13 which encloses the marking station 12. There is a feed end 14 into which the steel profile 10 is fed, either manually or more commonly, by an automated feeder (not illustrated). The feeder may be controlled by stepper motors, servo motors, or other commonly known means that provide accurate movement and positioning of the profile 10. The light gauge steel profile 10 may be, for example, a chord, web, or stud. The marked light gauge steel profile 10 exists the marking station 12 from an exit end 16 and is received on a processing lane 18 which moves the marked light gauge steel profile 10 to other stations for further processing or handling.

[0016] In Fig. 2 the housing 13 for the marking station 12 has been removed. A frame 20 supports several laser heads 22. As seen in Fig. 3 there are three arrays of lasers each comprised of three laser heads resulting in a total of nine laser heads. 22a, 22b, 22c comprise one array, 22d, 22e, 22f comprise a second array, and 22g, 22h, 22i comprise the third array. The laser heads 22 are all connected to a power source and central controller (not illustrated) by electrical cables 24. The laser heads generate a highly focused and coherent laser beam of light in a conventional manner when energized.

[0017] Fig. 4 illustrates an end view with the processing lane 18 removed, with the laser heads 22 mounted on a supporting frame 26 to allow the laser head to be pivoted to the proper angle with respect to the light gauge steel profile 10. The supporting frame 26 is attached to the frame 20. It can be seen that the three arrays of lasers are each substantially perpendicular to the processing lane 18 and the steel profile 10 so that the desired etching can be placed on any of the three outer surfaces of the steel profile 10.

[0018] Figs. 5 and 6 illustrate how the laser heads are slightly shifted in relation to each other and at a slightly varying distance in relation to each other with respect to the surface of the light gauge steel profile 10 that is to be etched. The distances, dl, d2 and d3 are 1-2 mmdifference between laser heads as illustrated in Figs 5 and 6. This slight difference in distances of each of the sets of laser heads such as 22d, 22e, and 22f (See Fig. 6) with respect to each other accommodates for profile surface inaccuracies. Similarly, laser heads 22g, 22h, and 22i and 22a, 22b, and 22c are mounted with slight differences in distance with respect to each other and the light gauge steel profile 10 to accommodate profile surface inaccuracies. For example, it can be seen that the distance DI is essentially zero as the laser head 22d is mounted in the frame 20 at a desired reference distance to the steel profile 10. The other laser heads 22e and 22f in this array are set at distances d2 and d3 respectively which are slightly closer to the steel profile 10.

[0019] The steel profile 10 may have imperfections in its surface resulting in the surface being at different distances from the laser heads in a particular array. By placing the laser heads in a particular array at different distances from the steel profile, we maximize the probability that at least one of the laser heads will be at the optimum distance from the steel profile 10 to render a clear image of the marking on the steel profile.

[0020] In operation, the steel profile is fed through the marking station 12. The controller sends signals to the specific laser heads with instructions as to what and where to etch on the steel profile 10. As seen in Fig. 4, the profile is located between the three arrays of laser heads so that the profile can have etching placed on any of the three sides 28, 30 or 32 of the profile 10.

[0021] The steel profile is continuously fed into the marking station 12 at an accurately controlled speed which is synchronized with the energizing and etching of the lasers. There is one laser beam per head which moves through the etching of the entire image with some shape correction due to movement. There is a formula that allows the calculation of the proper laser beam path in real time which includes the speed of the steel profile. This algorithm is prepared by the laser provider.

[0022] All three laser heads, such as 22a, 22b and 22c are all energized in proper synchronization with the exact location of the steel profile 10 that is to have the etching. For example laser 22a will first etch the desired image on the steel profile 10. As the steel profile moves forward, laser 22b etches the same image on the steel profile in the same exact location as the location that laser 22a etched the image. As the steel profile continues being fed toward the exit end 16, the third laser 22c etches the same image on the steel profile in the same exactlocation as the location that lasers 22a and 22b etched the image. In this manner at least one of the lasers 22a, 22b or 22c are at the proper distance with respect to the steel profile to etch a clear image and also accommodate for imperfections and variances in the surface of the steel profile 10. Fig. 7 illustrates several types of etchings 33 that can be etched on the steel profile 10.

[0023] An advantage over the prior art laser printing devices is that this invention allows the steel profile to be continuously fed through the marking station 12 without stopping the steel profile 10 at a location and waiting for the lasers to print the image. This invention also provides for etching a clear image on the steel profile by utilizing three lasers in an array positioned at slightly different distances from the surface of the steel profile 10 to accommodate imperfections in the steel profile 10.

[0024] Fig. 8 is the flow chart illustrating the flow of data from the initial CAD / BIM framing model through the various steps until it reaches the laser controllers. At step 34 the geometry data is generated in the CAD / BIM software based on the architectural and structural requirements. This includes items as the profiles, connections, brackets and their locations. At step 36, which is the data platform, the geometry data from step 34 is translated to the data layer in the Product data management system (“PDM”). This includes the location and content of the prints on the parts. At step 38, the site services, the PDM data is transferred to the dedicated services located in containers with specific devices such as the marking stations.

[0025] From the site services in step 38, two sets of data are generated. Printing data 40 is generated and received in laser service 42 where the printing data is prepared to communicate with the laser’s software. The printing data 40 in the form of text and CAD is generated and received in the Software Development Kit (“SDK”) library at step 44. The SDK is prepared by the laser’s producer. It translates the text and CAD to raw laser data and transfers this information to a laser controller in step 46.

[0026] In step 38 there is a second set of data generated. A production schedule, manufacturing data, prints and locations are generated at step 48. This data is received at step 50 at a programmable logic controller. The controller keeps the information about the location of the prints and it releases the prints based on the profile movement. The signals to etch based on the profile location per each laser head 52 is generated and received at the laser controller 46.

[0027] The laser controller 46 drives the hardware including such items as the light sources, galvanometers, mirrors, etc. to navigate and control the various laser beams in the proper timing and orientation to etch the desired etching in each profile. This ensures that the laser beams move synchronously with the steel profile 10 as it moves along the support track 11 through the marking station 12.

[0028] Thus there has been presented a laser etching method and apparatus that includes multiple laser heads configured to etch on demand and as the material moves continuously through the apparatus. The configuration of arrays, with offset mounting of the laser heads being set at different elevations relative to each other and the material, ensures all etchings meet specifications. While the invention has been described in conjunction with a specific embodiment, it is evident that many alternatives, modifications and variations will be apparent to those skilled in the art in light of the foregoing description. Accordingly, it is intended to embrace all such alternatives, modifications and variations as fall within the spirit and scope of the appended claims.

Claims

What is claimed is:

1. A laser etching apparatus comprising:a material feeding track for receiving a material to be marked with an etching, the material feeding track having opposite sides and a front end and a tail end, drive means continuously moving the material from the front end to the tail end, at least a first array of lasers having at least two laser heads, a first laser head mounted at a first distance from the material and a second laser head mounted at a second distance closer to the material than the first distance,the first laser head etching indicia into the material as the material moves along the material feeding track and the second laser head etching the same indicia at the same location as the first laser head for providing a clear image of the indicia regardless of imperfections in the material that result in the imperfections being at varying distances to the first and second laser heads.

2. The laser etching apparatus of claim 1 wherein the first array of lasers further comprise a third laser head mounted at a third distance closer to the material than the second distance, the third laser head etching the same indicia at the same location as the first and second laser heads.

3. The laser etching apparatus of claim 2 and further comprising a second array of lasers having a fourth and a fifth laser head, the first array of lasers oriented laterally and on one side from the feeding track and the second array of lasers oriented vertically from the feeding track, the fourth laser head in the second array mounted at a fourth distance from the material and the fifth laser head mounted at a fifth distance closer to the material than the fourth distance.

4. The laser etching apparatus of claim 3 wherein the second array of lasers further comprise a sixth laser head mounted at a sixth distance closer to the material than the fifth distance, the sixth laser head etching the same indicia at the same location as the fourth and fifth laser heads.

5. The laser etching apparatus of claim 4 and further comprising a third array of lasers having a seventh and an eighth laser head, the third array of lasers oriented laterally from the feeding track and on the opposite side of the feeding track than the first array of lasers, the seventh laser head in the third array mounted at a seventh distance from the material and the eighth laser head mounted at an eighth distance closer to the material than the seventh distance.

6. The laser etching apparatus of claim 5 wherein the third array of lasers further comprise a ninth laser head mounted at a ninth distance closer to the material than the eighth distance, the ninth laser head etching the same indicia at the same location as the seventh and eighth laser heads.

7. The laser etching apparatus of claim 1 and further comprising a controller for sending information to the first array of lasers indicating the indicia to be etched.

8. The laser etching apparatus of claim 7 wherein the controller sends signals for synchronizing the movement of laser beams emitted from the laser heads with the movement of the material along the material feeding track.

9. A method for etching indicia on materials comprising:selecting the material that is to have the indicia etched thereon;placing the material on a track having opposite sides and a feed end and a tail end; mounting a printing station around the track between the feed end and the tail end; mounting an array of lasers having a first laser head and a second laser head in the printing station adjacent to the feed track,moving the material from the feed end towards the tail end and through the printing station;positioning the first laser head in the printing station at a first distance from the material and positioning the second laser head at a second distance closer to the material than the first distance when the material is in the printing station,continuously moving the material through the printing station and etching the indicia with the first laser head onto the material at a desired location on the material and etching the same indicia onto the material in the same desired location with the second laser head as the material is continuously moved through the printing station, andforming a clear etching of the indicia on the material with the first and second laser heads.

10. The method for etching indicia on materials of claim 8 and the further step of mounting a third laser head in the array, and positioning the third laser head a third distance from the material which is closer to the material than the first distance and the second distance when the material is in the printing station.

11. The method for etching indicia on materials of claim 9 and the further step of mounting a second array of lasers having a fourth laser head and a fifth laser head in the printing station adjacent to the feed track, mounting the first array of lasers laterally on one side from the feeding track and mounting the second array of lasers vertically from the feeding track and positioning the fourth laser head at a fourth distance from the material and the fifth laser head positioned at a fifth distance closer to the material than the fourth distance.

12. The method for etching indicia on materials of claim 10 and the further step of mounting a sixth laser head in the second array, and positioning the sixth laser head a sixth distance from the material which is closer to the material than the fourth distance and the fifth distance when the material is in the printing station.

13. The method for etching indicia on materials of claim 11 and the further step of mounting a third array of lasers having a sixth laser head and a seventh laser head in the printing station adjacent to the feed track, mounting the third array of lasers laterally from the feeding track and on the opposite side of the feeding track than the first array of lasers, and positioning the sixth laser head at a sixth distance from the material and the seventh laser head positioned at a seventh distance closer to the material than the sixth distance.

14. The method for etching indicia on materials of claim 11 and the further step of mounting an eighth laser head in the third array, and positioning the eighth laser head an eighth distance from the material which is closer to the material than the seventh distance and the eighth distance when the material is in the printing station.

Images