Chip carrier device assembly

Abstract

A system and method for manufacturing chip carrier devices. A chip carrier device frame may be injection molded. A gasket and an analysis chip may be placed in the chip carrier device frame and retained with a retainer. The chip carrier device can have one or more fluidic channels to transport a fluidic sample to the analysis chip.

Description

19582.0016WOU1 | 2025-25077-P-WOCHIP CARRIER DEVICE ASSEMBLYCROSS-REFERENCE TO RELATED APPLICATION

[0001] This application is being filed on January 14, 2026, as a PCT International application and claims the benefit of and priority to U.S. Provisional Application No.63 / 746,869, filed on January 17. 2025, the disclosure of which is hereby incorporated by reference in its entirety.BACKGROUND

[0002] In recent years, there has been considerable development in the use of semiconductor chips in performing fluid sample analysis (e.g. testing of clinical, biological, or environmental samples). The use of semiconductor chips in the field of medical diagnostics has been shown to be desirable in terms of enabling smaller, more efficient systems that can both provide more detailed analysis of biological samples and accelerate the time to result.

[0003] The standard approach of utilizing semiconductor chips, such as "lab on a chip" devices, is generally a complex, time-consuming, and costly endeavor.Furthermore, the chip must typically be incorporated into a chip carrier device which can interface with larger systems that ty pically utilize complex fluidic transport means to transport a fluid sample to the chip device. In the field of medical diagnostics, to make high functionality semiconductor chip technologies feasible in the context of high-volume diagnostic testing, the costs of the device should be as low as possible to allow for sufficient scalability and widespread accessibility7.

[0004] These challenges often minimize the advantages and benefits of such "lab on a chip" devices and present a practical barrier to their widespread use and acceptance in many fields, including diagnostic testing.SUMMARY

[0005] In general terms, this disclosure is directed to chip carrier device assemblies. In a non-limiting example, the disclosure is related to a system and method for assembling chip carrier device assemblies.

[0006] One aspect is a chip carrier device assembly comprising: a molded frame including an exterior and an interior; an access point arranged at the exterior of the molded frame; a chip receiving region formed in the interior of the molded frame; a fluidic channel extending at least partially through the interior of the molded frame and19582.0016WOU1 | 2025-25077-P-WOextending from the access point to the chip receiving region; and a gland for receiving a circular gasket formed in the interior of the molded frame.

[0007] Another aspect is a chip carrier device assembly comprising: a molded frame including an exterior and an interior; an access point arranged at the exterior of the molded frame; a chip receiving region formed in the interior of the molded frame; a fluidic channel extending at least partially through the interior of the molded frame and extending from the access point to the chip receiving region; and at least one rail for receiving a retainer formed at the exterior of the molded frame.

[0008] A further aspect is a method of assembling a diagnostic chip carrier device assembly, the method comprising: placing a gasket into a recessed region of a frame; placing a diagnostic chip on top of the gasket; and coupling a retainer to the frame to seal an interface between the diagnostic chip and the gasket.BRIEF DESCRIPTION OF THE DRAWINGS

[0009] FIG. 1 is a schematic diagram illustrating an example sample analyzer.

[0010] FIG. 2 is a perspective view of an example sample cartridge.

[0011] FIG. 3 is an exploded view of an example chip carrier device assembly.

[0012] FIG. 4 is a flow chart illustrating an example method of assembling a chip carrier device assembly.

[0013] FIG. 5 is a section view of an example frame of an example chip carrier device assembly.

[0014] FIG. 6 is a perspective view illustrating the placement of an example gasket into an example frame of an example chip carrier device assembly.

[0015] FIG. 7 is a perspective view illustrating the placement of an analysis chip on top of the example gasket.

[0016] FIG. 8 is another perspective view illustrating the placement of an analysis chip on top of the example gasket.

[0017] FIG. 9 is a perspective view illustrating sealing the example gasket and analysis chip with an example retainer.

[0018] FIG. 10 is a perspective view of an example retainer.

[0019] FIG. 11 is a perspective view of an example frame of an example chip carrier device assembly with a rail for receiving a retainer.

[0020] FIG. 12 is a section view of an example chip carrier device assembly.

[0021] FIG. 13 is a perspective view of an example chip carrier device assembly.19582.0016WOU1 | 2025-25077-P-WO

[0022] FIG. 14 is a perspective view illustrating sealing the example gasket and analysis chip with another example retainer.

[0023] FIG. 15 is a perspective view an example frame of an example chip carrier device assembly with a rail for receiving a retainer.

[0024] FIG. 16 is a perspective view' of an example frame of an example chip carrier device assembly with a rail for receiving a retainer.

[0025] FIG. 17 is a perspective view of an example frame of an example chip carrier device assembly with a rail for receiving a retainer.

[0026] FIG. 18 is a perspective view of another example retainer.

[0027] FIG. 19 is a perspective view of another example frame of an example chip carrier device assembly with a rail for receiving a retainer.

[0028] FIG. 20 is a section view of another example chip carrier device assembly.

[0029] FIG. 21 is a perspective view of another example chip carrier device assembly.

[0030] FIG. 22 is a plane view of an example frame of an example chip carrier device assembly.

[0031] FIG. 23 is a plane view of another example frame of an example chip carrier device assembly.DETAILED DESCRIPTION

[0032] Various embodiments will be described in detail with reference to the drawings, wherein the reference numerals represent like parts and assemblies throughout the several views. Reference to various embodiments does not limit the scope of the claims attached hereto. Additionally, any examples set forth in this specification are not intended to be limiting and merely set forth some of the many possible embodiments for the appended claims.

[0033] FIG. 1 is a schematic diagram illustrating an example sample analyzer 100. The sample analyzer 100 includes a receiving module 102 and a module door 104. Also illustrated is a sample cartridge assembly 110. The sample cartridge assembly 110 includes a sample cartridge 112 and a chip carrier device assembly 114. The chip carrier device assembly 114 includes an analysis chip 116.

[0034] The sample analyzer 100 measures properties of a biological sample. In some embodiments, the sample analyzer 100 is a laboratory instrument. In some examples, the sample analyzer 100 can perform one or more of a variety of different assays on a sample such as to detect a disease or presence of genetic material. In some embodiments, the19582.0016WOU1 | 2025-25077-P-WOsample analyzer 100 operates to receive the sample cartridge 112. As shown in the example depicted in FIG. 1. in some embodiments, the sample analyzer 100 includes a module door 104 that can be opened to allow the sample cartridge 112 to be loaded into the receiving module 102. In some embodiments, the sample analyzer includes more than one (e.g., a plurality7of) receiving module 102, each with its ow n respective module door 104.

[0035] The receiving module 102 receives the sample cartridge 112. In some examples, the receiving module 102 facilitates the powering and detection of the analysis chip 116. For example, the receiving module 102 can include electrical contacts and one or more detection units. In some embodiments, the receiving module 102 can include electrical contacts that engage with the analysis chip 116 to allow the sample analyzer 100 to electrically power, control, and communicate with the analysis chip 116. In other embodiments, the receiving module 102 can also include an optical detection unit to detect fluorescence. In other examples, the receiving module 102 can also power the fluidics of the sample cartridge 112 and analysis chip 116.

[0036] The module door 104 provides an opening for the sample cartridge 112 to be inserted into the receiving module 102. In some examples, the module door can switch between open and closed positions. For example, the module door can change between open and closed positions by pivoting or swinging on a hinge. For example, the module door 104 can change into an open position to allow the sample cartridge 112 to be loaded into the receiving module. Once the sample cartridge 112 is loaded into the receiving module, the module door 104 can pivot into a closed position and the sample analyzer 100 can initiate processing of the sample within the sample cartridge 112. Once the sample analyzer 100 has finished processing the sample within the sample cartridge 112, the module door 104 can again pivot into an open position to allow the sample cartridge 112 to be removed.

[0037] The sample cartridge assembly 110 includes components for receiving and processing a biological sample for analysis by the sample analyzer 100. The sample cartridge assembly 110 includes the sample cartridge 112 and the chip carrier device assembly 114.

[0038] The sample cartridge 112 is configured receive a biological sample and secure the chip carrier device assembly 114. The sample cartridge 112 can include one or more chambers configured to receive and process a biological sample. In some examples, the biological sample can be a fluid sample. Once a biological sample is added19582.0016WOU1 | 2025-25077-P-WOto the sample cartridge 112, the sample cartridge assembly 110 can be loaded into the receiving module 102 for processing and analysis.

[0039] The chip carrier device assembly 114 is configured to secure the analysis chip 116. In some embodiments, the chip carrier device assembly 114 can facilitate proper alignment of the analysis chip 116 with the electrical contacts or the detection units housed within the receiving module 102. In some examples, the chip carrier device assembly 114 can also fluidically couple the analysis chip to the sample cartridge 112. For example, the chip carrier device assembly 114 can include one or more fluidic channel 136 that transport a biological sample from the sample cartridge 112 to the analysis chip 116. Examples of the fluidic channel 136 are illustrated and described with reference to FIGS. 22 and 23.

[0040] The analysis chip 116 analyzes a biological sample. In some embodiments, the analysis chip 116 facilitates analysis of the biological sample by the sample analyzer 100. For example, the analysis chip 116 can be a sensing chip such as a silicon sensing chip. In one example, the analysis chip 116 has an active surface. In some examples, the analysis chip 116 is sealingly engaged with the chip carrier device assembly 114. For example, the analysis chip 116 can be sealingly engaged with one or more fluidic channels of the chip carrier device assembly 114. In some embodiments, the analysis chip 116 is a semiconductor diagnostic chip. For example, the analysis chip 116 can be configured to perform sequencing of a nucleic acid target molecule by utilizing fluorescence detection the active surface of the analysis chip 116. In other examples, the analysis chip 116 can be configured to perform sequencing of a nucleic acid target molecule by other means, such as nanopore sequencing that detects changes in electrical conductivity. In still other examples, the analysis chip 116 can utilize surface plasmon resonance to provide analysis of a target molecule. In some embodiments, the receiving module of the sample analyzer 100 can include electrical contacts that engage with corresponding contacts on the analysis chip 116 secured by the sample cartridge 112.

[0041] FIG. 2 is a perspective view of an example sample cartridge 112. The example sample cartridge 112 includes a chip carrier receptacle 120. Also shown is an example chip carrier device assembly 114. In this example, the chip carrier device assembly 114 includes the analysis chip 116.

[0042] The sample cartridge 112 is a container that receives and processes a biological sample. In some examples, the sample cartridge 112 includes one or more processing chambers. For example, the processing chambers can include reagents, filters,19582.0016WOU1 | 2025-25077-P-WObeads, and other technologies necessary to prepare the sample, such as to extract, purify, and / or amplify a target molecule.

[0043] The chip carrier receptacle 120 is a region formed in the sample cartridge 112. In some embodiments, the chip carrier receptacle 120 receives and secures the chip carrier device assembly 114. For example, the chip carrier receptacle 120 can secure the chip such that the analysis chip 116 is fluidically engaged to the sample cartridge 112. In some embodiments, the chip carrier receptacle 120 secures the chip carrier device assembly 114 such that the analysis chip 116 remains accessible to the receiving module 102.

[0044] FIG. 3 is an exploded view of an example chip carrier device assembly 114. In this example, the chip carrier device assembly 114 utilizes one or more swage bar 142 to create a fluid seal between the frame 132 and the analysis chip 116. The example chip carrier device assembly 114 includes the analysis chip 116, a frame 132, and a gasket 146. The example frame 132 includes an access point 134, a fluidic channel 136, a gasket receiving lip 138, a chip receiving region 140 and one or more swage bar 142.

[0045] The frame 132 supports and secures the analysis chip 116 therein. For example, the frame 132 can be a molded frame. In some implementations, the frame 132 can be molded by an injection molding system. For example, the frame 132 can include an exterior and an interior. In some examples, the exterior can include an assembly side. For example, the analysis chip 116 can be inserted and sealed on the assembly side. In some examples, the frame 132 includes at least one access point 134 for receiving a biological sample. In some embodiments, the frame 132 includes one or more fluidic channel 136 to transport a sample to the active surface of the analysis chip 116. In some embodiments, the frame 132 includes a chip receiving region 140 shaped to fit the analysis chip 116. In other embodiments, the frame 132 includes one or more geometries to ensure that the gasket 146 maintains proper alignment with the analysis chip 116. For example, the frame 132 can include a gasket receiving lip 138 to align the gasket 146 within the frame 132.

[0046] The access point 134 receives a biological sample. For example implementations, the access point is arranged at the exterior of the frame 132. In some embodiments, the access point 134 is arranged at an exterior of the frame 132. For example, the access point 134 can be fluidically coupled to the sample cartridge 112. In some embodiments, the access point 134 can direct a biological sample to one or more fluidic channel 136.19582.0016WOU1 | 2025-25077-P-WO

[0047] The fluidic channel 136 defines a fluidic pathway for a biological sample. In some examples, the fluidic channel 136 is formed in the interior of the frame 132. In some examples, more than one fluidic channel 136 is formed in the interior of the frame 132. For example, the fluidic channel 136 can provide a pathway from the access point 134 to the analysis chip 116. In some embodiments, the fluidic channel 136 can provide a fluidic pathway for a biological sample from the access point 134 to the analysis chip 116. Examples of the fluidic channel 136 are illustrated and described with reference to FIGS. 22 and 23.

[0048] The gasket receiving lip 138 aligns the gasket 146 within the frame 132. For example, the gasket receiving lip 138 can provide an interface for properly centering the gasket over the analysis chip 116. In some embodiments, the gasket receiving lip 138 can prevent the gasket 146 from slipping out of alignment.

[0049] The chip receiving region 140 aligns the analysis chip 116 against the fluidic channel 136. In some implementations, the chip receiving region 140 is formed in the interior of the frame 132. In some examples, the chip receiving region 140 is a recessed region formed in the frame 132. For example, the chip receiving region 140 can be a recessed region with at least one wall to retain the analysis chip 116.

[0050] The swage bar 142 retains the analysis chip 116 in the chip carrier device assembly 114. For example, more than one swage bar 142 can be formed on either side of the chip receiving region 140. In this example, thermal swaging is used to melt and reform the swage bars into a confined shape to retain the analysis chip 116 in place using heated probe. As the swage bar 142 is swaged over the analysis chip 116, the analysis chip 116 is secured to the frame 132. Additionally, as the swage bar 142 is swaged over the analysis chip 116, the gasket 146 is compressed between the analysis chip 116 and the frame 132 such that a fluidic seal is formed. However, the swaging process is timeconsuming and error prone due to variation in thermal swage processes. For example, the swaging process can lead uneven swage bar shapes or additional stress to the frame 132 which can in-tum lead to leaks or cracks in the chip carrier device assembly 114. Furthermore, the use of a gasket 146 with one or more alignment features can lead to alignment errors that can also result in leaks. In some embodiments, the use of swage bar 142 and gasket 146 lead to an assembly time of at least about 1 minute.

[0051] The target region 144 is the region that is analyzed by the sample analyzer 100. For example, the sample analyzer 100 can assess signals from the analysis chip 116 at the target region. In some implementations, the target region is accessed by the sample19582.0016WOUI | 2025-25077-P-WOanalyzer 100 from the assembly side of the frame 132. In other implementations, the target region 144 is accessed by the sample analyzer 100 on the side of the frame 132 opposite from the assembly side. For example, the target region 144 can include a window that the analysis chip 116 is visible through. In some implementations, the target region 144 include an opening of the frame 132. In some embodiments, the target region 144 can be a transparent region of the frame 132.

[0052] The gasket 146 seals the fluidic interface between the frame 132 and the analysis chip 116. In some embodiments, the gasket 146 couples to the frame. In some embodiments, the gasket 146 can have rectangular webbing shaped to fit within the chip receiving region 140. For example, the rectangular shape of the gasket 146 can ensure that the gasket can only be placed within the frame 132 in one orientation. In some examples, the gasket 146 includes tabs for a placement tool to pick up the gasket 146 and place it into the frame 132. In some examples, a compression ring can be included in the center of the gasket 146 to form a seal between the analysis chip 116 and the frame 132.

[0053] FIG. 4 is a flow chart illustrating an example method 200 of assembling a chip carrier device assembly 114. The example method 200 includes operations 202, 204, and 206. Other embodiments can include more, fewer, or different operations than the example illustrated in FIG. 4. In some embodiments, the example method 200 results in an assembly process that lasts less than 20 seconds. In some embodiments, the example method 200 results in an assembly process that lasts about 5 seconds. In some implementations, the example method 200 results in an assembly process that lasts less than 5 seconds.

[0054] The operation 202 is performed to place a circular gasket 270 into the frame 132. An example of operation 202 is illustrated and described in further detail with reference to FIG. 6.

[0055] The operation 204 is performed to place the analysis chip 116 on top of the gasket 146. An example of operation 204 is illustrated and described in further detail with reference to FIGS. 7 and 8.

[0056] The operation 206 is performed to seal the circular gasket 270 and the analysis chip 116 with a retainer 170. Examples of operation 206 are illustrated and described in further detail with reference to FIGS. 9 and 14.

[0057] FIG. 5 is a section view of an example frame 132 of an example chip carrier device assembly 114. The frame 132 includes a chip receiving region 140, target region 144, and a gland 250. The chip receiving region 140 includes a first edge 240 and a19582.0016WOUI | 2025-25077-P-WOsecond edge 242. The gland 250 includes an outer wall 252, an inner wall 254, and a base 256.

[0058] The frame 132 is a portion of the chip carrier device assembly 114 that secures the analysis chip 116. In some embodiments, the frame 132 is injection molded. In some implementations, the frame can be formed of a substantially clear or transparent material. In some implementations, the frame is formed of an optical high performance plastic material. In some embodiments, the frame can be made of thermoplastic material. In further embodiments, the thermoplastic material can have high optical clarity. For example, the frame can be formed of Cyclo Olefin Polymer (COP) or polycarbonate (PC). In some implementations, the frame is formed of one or more of: cyclo olefin polymer (COP), polycarbonate (PC), cyclic block copolymer (CBC), cyclic olefin copolymer (COC), acrylic, clarified polypropylene, and other high performance plastic materials. In some embodiments, the frame can be formed of a plastic resin combined with a modifier. In some implementations, the frame can be formed of COP modified with glass fibers. In another implementation, the frame can be formed of COP modified with impact modifiers. In a different implementation, the frame can be formed of polypropylene modified with a clarifier. In some implementations, the frame 132 includes an exterior and an interior. In some examples, the frame 132 can include one or more fluidic channel 136. In some embodiments the fluidic channel 128 is formed in the interior of the frame 132. Examples of the fluidic channel 136 are illustrated and described with reference to FIGS. 22 and 23.

[0059] The chip receiving region 140 receives the analysis chip 116. The chip receiving region 140 prevents the analysis chip 116 from slipping. The chip receiving region 140 has a first edge 240 that prevents the analysis chip 116 from slipping in a first direction. The chip receiving region 140 has a second edge 242 that prevents the analysis chip 116 from slipping in a second direction. The distance between the first edge 240 and the second edge 242 is wide enough to accommodate the width of the analysis chip 116.

[0060] The target region 144 is an area that is analyzed to the sample analyzer 100. For example, the sample analyzer 100 can assess signals from the analysis chip 116 at the target region. For example, the target region 144 must be visible to the sample analyzer 100. The target region 144 must be free from cracks or leaks. In some implementations, the target region 144 can be at an opening of the frame 132. In some embodiments, the target region 144 can be at a transparent region of the frame 132. In other embodiments, the target region 144 can be at a transparent window coupled to the19582.0016WOU1 | 2025-25077-P-WOframe 132. In some implementations, the target region 144 can have a length and a width. In other implementations, the target region 144 can have a diameter.

[0061] The gland 250 is a recessed region formed in the interior of the frame 132. For example, the gland 250 is an interface for receiving a gasket 146. In some implementations, the gland is formed in the interior region of the frame 132. In some embodiments, the gland 250 is formed in the chip receiving region 140 of the frame 132. In some implementations, the gland 250 is formed around the target region 144. For example, the gland 250 can be formed to receive a gasket 146 having a circular shape. In some examples, the gland is circular or substantially circular. In other examples, the gland is not circular.

[0062] The outer wall 252 of the gland 250 forms a boundary between the gland 250 and the chip receiving region 140. For example, the outer wall 252 prevents the circular gasket 270 from slipping into the chip receiving region 140. In some embodiments, the outer wall 252 has dimensions that span from the first edge 240 of the chip receiving region 140 to the second edge 242 of the chip receiving region 140. In other embodiments, the outer wall 252 does not span the distance from the first edge 240 the second edge 242. In some examples, the outer wall 252 has a height that is less than the thickness of the circular gasket 270. In other examples, the outer wall 252 has a height that is greater than the thickness of the circular gasket. In still other examples, the outer wall 252 has a height that is equal to the thickness of the circular gasket.

[0063] The inner wall 254 of the gland 250 forms a boundary between the gland 250 and the target region 144. For example, the inner wall 254 prevents the gland 250 from blocking the target region 144. In some embodiments, the inner wall 254 has dimensions that frame the target region 144. In some examples, the inner wall 254 has a height that is less than the thickness of the circular gasket. In other examples, the inner wall 254 has a height that is greater than the thickness of the circular gasket. In still other examples, the inner wall 254 has a height that is equal to the thickness of the circular gasket.

[0064] The base 256 of the gland 250 is a surface formed between the outer wall 252 and the inner wall 254. The base 256 provides a surface for securely receiving the circular gasket 270.

[0065] FIG. 6 is a perspective view illustrating operation 202, placing a circular gasket 270 into the frame 132. The frame 132 is part of an example chip carrier device assembly 114. The frame 132 includes a gland 250. The gland 250 includes a ribbed19582.0016WOUI | 2025-25077-P-WOregion 278. The circular gasket 270 includes an outer edge 272, an inner edge 274, and a surface 276.

[0066] The circular gasket 270 seals the fluidic interface between the frame 132 and the analysis chip 116. For example, the circular gasket 270 prevents the biological sample from leaking as it is introduced to the analysis chip 116. In some implementations, the circular gasket 270 is formed of silicone or liquid silicone rubber (LSR). In some implementations, the circular gasket is formed of an elastomeric material. In some embodiments, the circular gasket 270 can be placed into the gland 250 without use of complicated tools. For example, the circular gasket 270 can be dropped into the gland 250. Advantageously, the circular gasket 270 can be placed in the gland 250 in any orientation. This saves valuable time in the assembly process. This also eliminates defects due to improper orientation that can lead to catastrophic failure in the final assembly such as leaks. In some implementations, the circular gasket 270 is an elliptical gasket. In some embodiments, the gasket can be overmolded onto the frame. In some implementations, overmolding the gasket on the frame can further enhance the final assembly by providing additional sealing benefits, prevention of leakage, and the like. For example, in some further implementations, the gasket can be dropped into the recessed region of the frame and overmolded on the frame.

[0067] The outer edge 272 interfaces with the outer wall 252 of the gland 250. For example, the outer edge 272 forms an outer diameter of the circular gasket 270. In some implementations, the outer diameter of the circular gasket 270 can span from the first edge 240 of the chip receiving region 140 to the second edge 242 of the chip receiving region 140.

[0068] The inner edge 274 interfaces with the inner wall 254 of the gland 250. For example, the inner edge 274 forms an inner diameter of the circular gasket 270. In some implementations, the inner diameter of the circular gasket 270 is larger than the diameter of the target region 144. In other implementations, the inner diameter of the circular gasket 270 is larger than the length and width of the target region 144. For example, the inner diameter of the circular gasket 270 can frame the target region 144.

[0069] The surface 276 is formed between the outer edge 272 and the inner edge 274. A first side of the surface 276 interfaces with the analysis chip 116. A second side of the surface 276 interfaces with the gland 250. In some implementations, the surface 276 is substantially smooth.19582.0016WOUI | 2025-25077-P-WO

[0070] The ribbed region 278 of the gland 250 is a series of one or more notches for securing the circular gasket 270. In some embodiments, the ribbed region 278 is formed on the outer wall 252. In other embodiments, the ribbed region 278 is formed on the inner wall 254. In example implementations, the ribbed region 278 is formed on the outer wall 252 and the inner wall 254. For example, the ribbed region 278 formed on the outer wall 252 receives the outer edge 272 of the circular gasket 270. In some embodiments, the ribbed region 278 formed on the inner wall 254 receives the inner edge 274 of the circular gasket 270.

[0071] FIG. 7 is a perspective view illustrating operation 204, placing the analysis chip 116 on top of the circular gasket 270. The circular gasket 270 is held within the frame 132 of the example chip carrier device assembly 114. The frame 132 includes an example chip receiving region 140.

[0072] The analysis chip 116 analyzes a biological sample. In some implementations, the analysis chip 116 is placed in the chip receiving region 140. For example, the analysis chip 116 can be placed such that at least one edge of the analysis chip 116 aligns with at least one edge of the chip receiving region 140. In some embodiments, the analysis chip 116 is placed on top of the circular gasket 270 such that the at least one edge of the chip receiving region prevents the analysis chip 116 from shifting. In some examples, the analysis chip 116 has an active surface that is detected by the sample analyzer 100. For example, the analysis chip 116 can be oriented such that the active surface is visible at the target region 144. In some examples, the analysis chip 116 can be placed in the chip receiving region such that the active surface of the analysis chip remains visible for optical detection by the sample analyzer 100. In some implementations, the analysis chip 116 is placed such that the active surface faces the circular gasket 270. In some implementations, the analysis chip 116 includes contacts and is placed in the chip carrier device assembly 114 such that the contacts remain accessible to the sample analyzer 100. In some examples, the contacts are on the opposite surface of the analysis chip 116 from the active surface. In other examples, the contacts are on the same surface of the analysis chip 116 as the active surface.

[0073] FIG. 8 is another perspective view illustrating operation 204, placing the analysis chip 116 on top of the circular gasket 270. The circular gasket 270 is held within a frame 132 of another example chip carrier device assembly 114. The example frame 132 includes an access point 134 and a chip receiving region 140. The chip receiving region 140 includes a notch 290.19582.0016WOU1 | 2025-25077-P-WO

[0074] The chip receiving region 140 receives the analysis chip 116. The chip receiving region 140 prevents the analysis chip 116 from slipping out of alignment. In this example, the chip receiving region 140 includes a notch 290.

[0075] The notch 290 prevents the analysis chip 116 from slipping in a first direction. In some examples, the first direction can be away from the access point 134. In some implementations, the notch 290 interfaces with a retainer 400 as illustrated and described with respect to FIG. 21

[0076] The chip receiving region 140 has a first edge 240 that prevents the analysis chip 116 from slipping in a first direction. The chip receiving region 140 has a second edge 242 that prevents the analysis chip 116 from slipping in a second direction. The distance between the first edge 240 and the second edge 242 is wide enough to accommodate the width of the analysis chip 116.

[0077] FIG. 9 is a perspective view illustrating operation 206, sealing the circular gasket 270 and analysis chip 116 with an example retainer 300. The analysis chip 116 is held within the frame 132 of the example chip earner device assembly 114. The frame 132 includes a rail 310.

[0078] The retainer 300 a piece that retains the analysis chip 116. For example, coupling the retainer to the frame 132 can seal the interface between the analysis chip 116 and the circular gasket 270. In some implementations, the retainer is coupled to the frame 132 by being inserted into the rail. Example retainers are illustrated and described in further detail with reference to FIGS. 10 and 21.

[0079] The rail 310 receives the retainer. For example, the rail 310 can be formed at the exterior of the frame 132. In some implementations, only a first rail 310A is formed at the exterior of the frame 132. In other implementations, a second rail 310B is be formed at the exterior of the frame 132. In other embodiments, more than two rails can be formed at the exterior of the frame 132. In some embodiments, the rail 310 is not contiguous. In other embodiments, the rail 310 has sections removed to reduce rigidity. In still other implementations, the rail 310 has increased thickness to improve stiffness. Further embodiments of rail designs are illustrated and described in further detail with reference to FIGS. 11, 15, 16, 17, and 19.

[0080] FIG. 10 is a perspective view of an example retainer 300. The retainer 300 has a first segment 322, a second segment 324, a third segment 326, and a bumper 332. Each of the first segment 322 and the third segment 326 include a rounded end 328 and a rail interfacing portion 330.19582.0016WOU1 | 2025-25077-P-WO

[0081] The retainer 300 is a piece that retains the analysis chip 116. For example, the retainer can be substantially flat. In some embodiments, the retainer can be made of thermoplastic or metallic material. In some examples, the retainer is formed of liquid crystal polymer (LCP), polycarbonate (PC), acrylonitrile butadiene styrene (ABS), polypropylene, or stainless steel. In some implementations, the retainer can have three segments forming a u shape. For example, the retainer can include a first segment 322, a second segment 324, and a third segment 326. In some examples, a fourth segment can be formed between the first segment 322 and the third segment 326 to provide additional structural stability. Advantageously, the retainer 300 can be flipped such that the first segment 322 and the third segment 326 can interchangeably interface with either the first rail 310A or the second rail 310B. For example, the top and bottom faces of the retainer 300 are substantially the same.

[0082] The first segment 322 interfaces with the first rail 310A. In some embodiments, the first segment 322 interfaces with the second rail 310B. The first segment 322 includes the rounded end 328A and the rail interfacing portion 330A.

[0083] The second segment 324 connects the first segment 322 and the third segment 326. The second segment 324 is perpendicular to both the first segment 322 and the third segment 326.

[0084] The third segment 326 interfaces with the second rail 310B. In other embodiments, the third segment 326 interfaces with the first rail 31 OA. The third segment 326 is parallel to the first segment 322. The third segment 326 includes the rounded end 328B and the rail interfacing portion 330B.

[0085] A rounded end 328 forms the end of the first segment 322 and third segment 326. The rounded end 328 can prevent the retainer 300 from scratching or damaging the frame 132.

[0086] The rail interfacing portion 330 of the first segment 322 and the third segment 326 is inserted the first rail 310A or the second rail 31 OB, interchangeably. In some implementations, the rail interfacing portion 330 has a length such that it spans at least the length of the analysis chip 116. In some implementations, the rail interfacing portion 330 has a width such that it covers at least part of the analysis chip 116 such that it creates a downward force on the analysis chip 116.

[0087] The bumper 332 prevents the retainer 300 from being overextended into the rail 310. In some implementations, the bumper 332 can prevent the second segment 324 of the retainer 300 from hitting the top edge of the analysis chip 116. The bumper 33219582.0016WOU1 | 2025-25077-P-WOextends past the rail interfacing portion 330 of the first segment 322 and the third segment 326. In some implementations, the bumper 332 interfaces with the top of the first rail 310A. In some examples, the bumper 332 interfaces with the top of second rail 310B. In other examples, the bumper 332 interfaces with the top of the first rail 310A and the top of the second rail 31 OB. In some implementations, the bumper 332 interfaces with a stop notch 340 at the exterior of the frame 132. For example, the bumper 332 can interface with a stop notch 340 at the top of the rail 310.

[0088] FIG. 11 is a perspective view of an example frame 132 of an example chip carrier device assembly 114 with a rail 310 for receiving a retainer 300. The rail 310 includes a stop notch 340, a chip retaining region 342. and a tapered region 344. Also shown is the top edge 346 of the frame 132.

[0089] The rail 310 is formed at the exterior of the frame 132. In some embodiments, the rail 310 begins at the top edge 346 of the frame 132 and extends past the analysis chip 116. In other embodiments, the rail 310 begins below the top edge 346 and extends past the analysis chip 116. In some implementations the rail 310 extends to a region between the top edge 346 of the frame 132 and the access point 134.

[0090] The stop notch 340 interfaces with the retainer 300. In some implementations, the stop notch 340 interfaces with the bumper 332 of the retainer 300. In some examples, the stop notch 340 forms a surface substantially parallel to the top edge 346 of the frame 132.

[0091] The chip retaining region 342 holds the retainer 300 on top of the analysis chip 116. For example, the chip retaining region 342 can create a downward pressure against the retainer 300. In some implementations, the chip retaining region 342 of the rail 310 is wider than segments of the rail 310 extending above or below the analysis chip 116.

[0092] The tapered region 344 forms one end of the rail 310. In some implementations, the tapered region 344 is at the top of the rail 310. In other implementations, the bottom of the rail 310 ends in a tapered region 344. In some embodiments, both the top of the rail 310 and the bottom of the rail 310 end in a tapered region 344.

[0093] FIG. 12 is a section view of an example chip carrier device assembly 114. The example chip carrier device assembly 114 includes an analysis chip 116, a frame 132, a circular gasket 270, and a retainer 300. The frame 132 includes a rail 310. The rail 310 includes a top surface 370, a side surface 372, and a bottom surface 374.19582.0016WOUI | 2025-25077-P-WO

[0094] The retainer 300 is inserted in the rail 310 to secure the analysis chip 116. In this example, the retainer 300 is partially covered by the rail 310. For example, a portion of the retainer 300 extends laterally out of the rail 310. In some implementations, a portion of the retainer 300 that extends laterally from the rail is on top of the analysis chip.

[0095] The rail 310 forms a clamp around the retainer 300. For example, the interior of the rail 310 has at least three surfaces that engage with the retainer 300. In some implementations, the interior of the rail has a top surface 370, a side surface 372, and a bottom surface 374. In some examples, the top surface 370 interfaces with at least a portion of the top of the retainer 300. In some examples, the side surface 372 interfaces with one side of the retainer 300. In some embodiments, the bottom surface 374 interfaces with at last a portion of the bottom of the retainer 300. In some examples, the top surface 370 is substantially parallel to the bottom surface 374. In some implementations, the side surface 372 is perpendicular to the bottom surface 374. In other implementations, the side surface 372 forms an angle between the top surface 370 and the bottom surface 374. For example, the angle of the side surface 372 can provide greater retention force against the retainer 300.

[0096] FIG. 13 is a perspective view of an example chip carrier device assembly 114. The chip carrier device assembly 114 includes a frame 132, an analysis chip 116 and a retainer 300. The frame 132 includes a rail 310. The rail 310 includes a bumper 332. The retainer 300 includes a second segment 324 and a stop notch 340.

[0097] The retainer 300 is inserted into the rail 310 and secures the analysis chip 116. In some implementations, the stop notch 340 is engaged with the bumper 332 of the retainer 300. For example, the stop notch 340 can engage with the bumper 332 to prevent further insertion of the retainer 300. For example, the stop notch 340 can prevent the second segment 324 of the retainer 300 from colliding with the analysis chip 116. In some examples, there is a gap between the second segment 324 of the retainer 300 and the analysis chip 116.

[0098] FIG. 14 is a perspective view illustrating operation 206, sealing the circular gasket 270 and analysis chip 116 with another example retainer 400. The analysis chip 116 is held within the frame 132 of the example chip carrier device assembly 114. The frame 132 includes a rail 410 and a top edge 346. The example retainer 400 includes an angled rail interfacing region 402. The example rail 410 includes an angled cutout 412 and end face 414.19582.0016WOU1 | 2025-25077-P-WO

[0099] The retainer 400 a piece that retains the analysis chip 116. For example, coupling the retainer 400 to the frame 132 can seal the interface between the analysis chip 116 and the circular gasket 270. In some implementations, the retainer 400 is coupled to the frame 132 by being inserted into the rail 410. In some implementations, the retainer 400 is inserted into the rail 410 manually. In other implementations, the retainer 400 is inserted into the rail 410 by a machine. In some examples, the retainer 400 includes an angled rail interfacing region 402. Examples of the retainer 400 is illustrated and described in further detail with reference to FIG. 18.

[0100] The rail 410 receives the retainer 300. For example, the rail 410 can be formed at the exterior of the frame 132. In some implementations, only a first rail 410A is formed at the exterior of the frame 132. In other implementations, a second rail 410B is be formed at the exterior of the frame 132. In other embodiments, more than two rails can be formed at the exterior of the frame 132. In some examples, the rail 410 can include the angled cutout 412. For example, the angled cutout 412 can correspond with an angled rail interfacing region 402 of the retainer 300. In some implementations, the rail 410 can also include the end face 414 that interfaces with a second end 450 of the retainer 300. For example, the end face 414 can prevent the retainer 400 from being overextended into the rail 410. In some implementations, the end face 414 is parallel to the top edge 346 of the frame 132. In some embodiments, the rail 410 is not contiguous. In other embodiments, the rail 410 has sections removed to reduce rigidity. In still other implementations, the rail 410 has increased thickness to improve stiffness. Further embodiments of rail designs are illustrated and described in further detail with reference to FIGS. 11, 15, 16, 17, and 19.

[0101] FIG. 15 is an example frame 132 of an example chip carrier device assembly with a rail 411 for receiving a retainer. In this embodiment, the rail 411 is not contiguous. For example, the rail 411 and the exterior of the frame 132 has a space that splits the rail into two features. Advantageously, this improves flexibility of the rail 411 to prevent the frame 132 from cracking. In some implementations, multiple non-contiguous rails can be provided to improve function.

[0102] FIG. 16 is an example frame 132 of an example chip carrier device assembly with a rail 413 for receiving a retainer. In this example, part of the rail 413 is removed to reduce rigidity such that the retainer 400 and the rail 413 such that the rail 413 can deflect from one another. Advantageously, this configuration improves the flexibility of the rail19582.0016WOU1 | 2025-25077-P-WO413. In some embodiments, the rail 413 can have multiple cut-outs or parts removed or to improve function.

[0103] FIG. 17 is an example frame 132 of an example chip carrier device assembly with a rail 415 for receiving a retainer. In this implementation, the rail 415 has increased thickness. Advantageously, this configuration can improve the stiffness of the rail 415 thereby providing increased support for the retainer and prevention of cracking. In the example illustrated in FIG. 17, the width of features 710, 740, 742, and 744 are increased to provide additional stiffness to the frame 132.

[0104] FIG. 18 is a perspective view of another example retainer 400. The example retainer 400 has a first segment 422, a second segment 424 and a third segment 426. The first segment 422 and the third segment 426 each include an angled rail interfacing region 402, a first end 430, a top face 432, an angled surface 434, an outer face 440, a first inner face 442, a second inner face 444, and a second end 450. The second end 450 includes an interior side 460 and an exterior side 470. The interior side 460 includes a first edge 462 and a second edge 464. The exterior side 470 includes a first rounded comer 472 and a second rounded comer 474. The second segment 424 includes a bumper 480.

[0105] The retainer 400 is inserted in the rail 410 to secure the analysis chip 116. In some embodiments, the retainer 400 can be w edge shaped. For example, the retainer 400 can be an angled wedge. In some examples, the retainer is formed of liquid crystal polymer (LCP), polycarbonate (PC), acrylonitrile butadiene styrene (ABS), polypropylene, or stainless steel. In some implementations, the retainer 400 can have three segments forming a u shape. For example, the retainer can include a first segment 422, a second segment 424, and a third segment 426. In some examples, a fourth segment can be formed between the first segment 422 and the third segment 426 to provide additional structural stability.

[0106] The first segment 422 interfaces with the first rail 410A. In some embodiments, the first segment 422 interfaces with the second rail 410B.

[0107] The second segment 424 connects the first segment 422 and the third segment 426. In some embodiments, the second segment 424 is perpendicular to both the first segment 422 and the third segment 426. In some implementations, the second segment 324 includes the bumper 480.

[0108] The third segment 426 interfaces with the second rail 410B. In other embodiments, the third segment 426 interfaces with the first rail 410A. In some embodiments, the third segment 426 is parallel to the first segment 422.19582.0016WOU1 | 2025-25077-P-WO

[0109] The angled rail interfacing region 402 slides into the rail 410. The angled rail interfacing region 402 can be slidably secured within the rail 410. In some embodiments, the angle of the angled rail interfacing region 402 can interface with a corresponding angle of the angled cutout 412.

[0110] The first end 430 is one end of the retainer 400. For example, the first end 430 can be aligned with the top edge 346 of the frame 132 as illustrated in FIG. 20. In some embodiments, the first end 430 can extend beyond the top edge 346 of the frame 132. In other embodiments, the first end 430 can be positioned below the top edge 346 of the frame 132. In some examples, the first end 430 has rounded edges. For example, the rounded edges can the retainer 400 from scratching the frame 132. In some embodiments, the first end 430 aligns with the top surface of the second segment 424. In other embodiments, the first end 430 extends beyond the top surface of the second segment 424.

[0111] The top face 432 is the top surface of the retainer 400. In some examples, the top face 432 can be parallel to the bottom face of the retainer. In some embodiments, an angled surface 434 can connect the top face 432 to the first end 430.

[0112] The outer face 440 is an outer surface of the retainer 400. The outer face 440 stabilizes the retainer 400 once inserted into the rail 410. In some examples, the outer face 440 is perpendicular to the top face 432. In some embodiments, the outer face 440 is inset with respect to the angled rail interfacing region 402.

[0113] The first inner face 442 is an inner surface of the retainer 400. In some embodiments, the first inner face 442 forms a surface opposite to the outer face 440. In some examples, the first inner face 442 is substantially parallel to the outer face 440.

[0114] The second inner face 444 is an inner surface of the retainer 400. For example, the second inner face 444 can interface with a side surface 512 of the analysis chip 116 as illustrated in FIG. 19. In some embodiments, the second inner face 444 is inset with respect to the first inner face 442. In other embodiments, the second inner face 444 extends beyond the first inner face 442. In some examples, the second inner face 444 is substantially parallel to the first inner face 442.

[0115] The second end 450 is a second end of the retainer 400. In some embodiments, the second end 450 interfaces with the end face 414 of the rail 410. The second end 450 includes an interior side 460 and an exterior side 470.

[0116] The interior side 460 interfaces with the analysis chip 116. The interior side 460 includes a first edge 462 and a second edge 464.19582.0016WOU1 | 2025-25077-P-WO

[0117] The first edge 462 interfaces with atop surface 510 of the analysis chip 116 as illustrated in FIG. 20. In some embodiments, the first edge 462 is parallel to the top surface 500 of the analysis chip 116. In some examples, the first edge 462 is perpendicular to the first inner face 442. In some examples, the first edge 462 is perpendicular to the second inner face 444. In some implementations, the first edge 462 is perpendicular to both the first inner face 442 and the second inner face 444.

[0118] The second edge 464 interfaces with a side surface 512 of the analysis chip 116 as illustrated in FIG. 20. In some embodiments, the second edge 464 is perpendicular to the first edge 462.

[0119] The exterior side 470 interfaces with the rail 410. In some embodiments, the exterior side 470 includes the first rounded comer 472. In some embodiments, the exterior side 470 includes the second rounded comer 474. In some implementations, the exterior side 470 includes both the first rounded comer 472 and the second rounded comer 474. Advantageously, the use of rounded comers can provide a smoother interface between the retainer 400 and the rail 410. For example, a smoother interface can lead to more efficient assembly and reduce scratches to the frame 132.

[0120] The bumper 480 prevents the retainer 300 from being overextended into the rail 410. In some implementations, the bumper 480 extends from a surface of the second segment 324. For example, the bumper 480 can extend from the bottom surface of the second segment 324. In some examples, the bumper 480 can prevent the second segment 324 of the retainer 300 from hitting the top edge of the analysis chip 116. In some examples, the bumper 480 interfaces with the analysis chip 116. In some implementations, the bumper 480 interfaces with the exterior of the frame 132. In some examples, the bumper 480 interfaces with the top of the rail 410. In some examples, the bumper 480 interfaces with a stop notch 340 on the rail 410. In other implementations, the bumper 480 interfaces with the interior of the frame 132. For example, the bumper 480 can interface with a notch 290 arranged at one end of the chip receiving area 140.

[0121] FIG. 19 is a perspective view of another example frame 132 of an example chip carrier device assembly 114 with an example rail 410 for receiving a retainer 400. The example rail 410 includes a chip retaining region 490, and a tapered region 492. Also shown is the top edge 346 of the frame 132.

[0122] The rail 410 is formed at the exterior of the frame 132. In some embodiments, the rail 410 begins at the top edge 346 of the frame 132 and extends past the analysis chip 116. In other embodiments, the rail 410 begins below the top edge 346 and extends19582.0016WOU1 | 2025-25077-P-WOpast the analysis chip 116. In some implementations the rail 410 extends to a region between the top edge 346 of the frame 132 and the access point 134.

[0123] The chip retaining region 490 holds the retainer 300 on top of the analysis chip 116. For example, the chip retaining region 490 can create a downward pressure against the retainer 400. In some implementations, the chip retaining region 490 of the rail 410 is wider than segments of the rail 410 extending above or below the analysis chip 116.

[0124] The tapered region 492 forms one end of the rail 410. In some implementations, the tapered region 492 is at the top of the rail 410. In other implementations, the bottom of the rail 410 ends in a tapered region 492. In some embodiments, both the top of the rail 410 and the bottom of the rail 410 end in a tapered region 492.

[0125] FIG. 20 is a section view of another example chip carrier device assembly 114. The example chip carrier device assembly 114 includes an analysis chip 116, a frame 132, a circular gasket 270. and a retainer 400. The analysis chip 116 includes atop surface 510 and a side surface 512. The frame includes a rail 410. The rail 410 includes an inner face 520. The retainer 400 includes an outer face 440, a first edge 462 and a second edge 464.

[0126] The retainer 400 is inserted in the rail 410 to secure the analysis chip 116. In some embodiments, the outer face 440 of the rail 410 interfaces with the inner face 520 of the rail 410. In this example, the first edge 462 of the retainer 400 interfaces with the analysis chip 116. In some examples, the first edge 462 extends laterally from the rail 410 to interface with the analysis chip 116. In this example, the second edge 464 interfaces with the side surface 512 of the analysis chip. In some implementations, the second edge 464 can extend laterally from the rail 410. For example, the second edge 464 can extend laterally from the rail 410 to interface with the side surface 512 of the analysis chip 116. In other embodiments, the second edge 464 does not extend laterally from the rail 410. In other implementations, there is a gap between the second edge 464 and the analysis chip 116. For example, in some embodiments only the first edge 462 interfaces with the analysis chip 116.

[0127] FIG. 21 is a perspective view of another example chip carrier device assembly 114. In this example, the chip carrier device assembly 114 includes a frame 132, an analysis chip 116, and a retainer 400. The frame 132 includes atop edge 346 and a rail 410. The retainer includes a second segment 424 and a bumper 480.19582.0016WOUI | 2025-25077-P-WO

[0128] The retainer 400 is inserted into the rail 410 and secures the analysis chip 116. In some implementations, the bumper 480 is engaged with the frame 132 to prevent further insertion of the retainer 400. For example, the bumper 480 can prevent the second segment 424 of the retainer 400 from colliding with the analysis chip 116. In some examples, there is a gap between the second segment 424 of the retainer 400 and the analysis chip 116.

[0129] FIG. 22 is a plane view of an example frame 132 of an example chip carrier device assembly 114. The frame includes an access point 134, a target region 144, a fluidic channel 700 and an access opening 720. The fluidic channel 700 includes a first segment 710, a second segment 712, and a connection point. An exterior plane 730 outside of the frame 132 is also shown.

[0130] The fluidic channel 700 extends from the access point 134 to the target region 144. In this some examples, the access point 134 is arranged at an exterior side of the frame 132 adjacent to the exterior plane 730. In some implementations, the fluidic channel extends at least partially through the interior of the frame. For example, the first segment 710 can extend from the access point 134 to a region adj acent to the target region 144. In some implementations, the first segment 710 can tapper from a larger radius to a smaller radius as it extends away from the access point 134. The second segment 712 can extend from the first segment 710 to the target region 144. In some implementations, the second segment 712 is perpendicular to the first segment 710. In some examples, the first segment 710 and the second segment 712 meet at a connection point 714. In some examples, the fluidic channel 700 can be formed by a collapsible core mechanism. In some embodiments, the fluidic channel 700 has a volume of about 20-25 microliters.

[0131] The access opening 720 is an opening that extends through the frame 132. For example, the access opening 720 permits the analysis chip 116 to be accessed by the sample analyzer 100 from either side of the frame 132. For example, the access opening 720 can align with contacts on the analysis chip 116 that are received by corresponding contacts at the receiving module 102. In some implementations, the receiving module 102 can include electrical contacts that engage with the analysis chip 116 to electrically power, control, and communicate with the analysis chip 116.

[0132] FIG. 23 is a plane view of another example frame 132 of an example chip carrier device assembly 114. The frame includes an access point 134, a target region 144, an access opening 720, and a fluidic channel 800. Also illustrated is a circle C with a radius R. Also depicted are three points where the circle C intersects with the frame 132:19582.0016WOU1 | 2025-25077-P-WOan access point intersection 810, an interior region intersection 812, and a target region intersection 814. An exterior plane 730 outside of the frame 132 is also shown.

[0133] The fluidic channel 800 extends from the access point 134 to the target region 144. In this some examples, the access point 134 is arranged at an exterior side of the frame 132 adjacent to the exterior plane 730. In some embodiments, the fluidic channel 800 can be formed in the interior of the frame 132. For example, in some implementations, the fluidic channel extends at least partially through the interior of the frame 132. In this example, the fluidic channel 800 is a curved channel. As shown in FIG. 23, the fluidic channel 800 extends from the access point 134 to the target region 144 along a curved path that avoids the access opening 720. For example, the fluidic channel 800 can guide a fluid sample from the access point 134. navigating around the access opening 720, ultimately reaching the target region 144. In some embodiments, the fluidic channel 800 is formed of a single curved segment. Advantageously, the use of a single curved path to form the fluidic channel 800 can prevent unwanted excess plastic from forming on parting lines, gaps, or edges which can result when using multiple segments to create a path.

[0134] In some embodiments, the fluidic channel 800 has a radius of curvature R that is sufficient to avoid the access opening 720. For example, the fluidic channel 800 can be in the interior of the frame 132 along the circumference of the circle C, which intersects with at least two points with the frame 132: the access point intersection 810 and the target region intersection 814. The radius R of the circle C can be determined by selecting a third intersection point with the molded body 182. For example, by providing the interior region intersection 812, the radius R of the circle and, thereby, the path of a curved fluidic channel from the access point 134 to the target region 144 can be determined. The radius R of the circle can vary, depending on where, within interior of the frame 132, the path of the fluidic channel is desired.

[0135] In some embodiments, two or more fluidic channels 800 can be formed having the same or different radius R as the example depicted in FIG. 23. For example, a first curved channel 800A can be formed on one side of the target region 144. In some implementations, a second curved channel 800B can be formed on the opposite side of the target region 144, mirroring the first curved channel 800 A. In another example, the second curved channel 800B can have a larger or smaller radius the first curved channel 800 A. For example, the second curved channel 800B can be formed on the same side of the molded component as the first curved channel 800A to reach a different second target19582.0016WOU1 | 2025-25077-P-WOpoint. Other arrangements or combinations of curved channels can be formed in the frame 132.

[0136] The present disclosure and claims sometimes utilize the words '‘first,” “second,” “third,” etc. as labels to particularly identify particular objects. Unless required by the context, such terms are used only as labels and do not require any particular order or arrangement with respect to each other or with respect to other objects.

[0137] The various embodiments described above are provided by way of illustration only and should not be construed to limit the claims attached hereto. While certain examples with certain combinations of features are illustrated and described herein, other combinations can be possible as well. Those skilled in the art will readily recognize various modifications and changes that may be made without following the example embodiments and applications illustrated and described herein, and without departing from the true spirit and scope of the following claims.

Claims

19582.0016WOU1 | 2025-25077-P-WOWHAT IS CLAIMED IS:

1. A chip carrier device assembly comprising:a molded frame including an exterior and an interior;an access point arranged at the exterior of the molded frame;a chip receiving region formed in the interior of the molded frame;a fluidic channel extending at least partially through the interior of the molded frame and extending from the access point to the chip receiving region; anda gland for receiving a circular gasket formed in the interior of the molded frame.

2. The chip carrier device of claim 1, further comprising at least one rail for receiving a retainer arranged at the exterior of the molded frame3. The chip carrier device assembly of any one of claims 1-2, wherein the fluidic channel extends in a circular arc from the access point to the chip receiving region.

4. The chip carrier device assembly of any one of claims 1-3, wherein the fluidic channel is formed by a collapsible core mechanism.

5. The chip carrier device assembly of any one of claims 1-4, wherein the frame is formed of an optical high performance plastic material, the optical high performance plastic material including one or more of: cyclo olefin polymer (COP), polycarbonate (PC), cyclic block copolymer (CBC). cyclic olefin copolymer (COC), acrylic, clarified polypropylene.

6. The chip carrier device assembly of any one of claims 1-5, wherein the circular gasket is formed of liquid silicone rubber (LSR).

7. A chip carrier device assembly comprising:a molded frame including an exterior and an interior;an access point arranged at the exterior of the molded frame;a chip receiving region formed in the interior of the molded frame;a fluidic channel extending at least partially through the interior of the molded frame and extending from the access point to the chip receiving region; andat least one rail for receiving a retainer formed at the exterior of the molded frame.19582.0016WOU1 | 2025-25077-P-WO8. The chip carrier device assembly of claim 7, further comprising a retainer.

9. The chip carrier device of claim assembly of claim 8, wherein the retainer comprises three segments forming a u shape.

10. The chip carrier device assembly of any one of claims 8-9, wherein the retainer is substantially flat.

11. The chip carrier device assembly of any one of claims 8-10, wherein the retainer is an angled wedge.

12. The chip carrier device assembly of any one of claims 8-11, wherein the retainer is formed of liquid crystal polymer (LCP), polycarbonate (PC), acrylonitrile butadiene styrene (ABS), polypropylene, or stainless steel.

13. The chip earner device assembly of any one of claims 7-12, further comprising a gland for receiving a circular gasket formed in the interior of the molded frame.

14. A method of assembling a diagnostic chip carrier device assembly, the method comprising:placing a gasket into a recessed region of a frame;placing a diagnostic chip on top of the gasket; andcoupling a retainer to the frame to seal an interface between the diagnostic chip and the gasket.

15. The method of claim 14, wherein the gasket is dropped into the recessed region of the frame and is overmolded onto the frame.

16. The method of claim 15, wherein the gasket is a circular or an elliptical gasket.19582.0016WOU1 | 2025-25077-P-WO17. The method of any one of claims 14-16, wherein the frame further comprises at least one rail and the retainer is coupled to the frame by inserting the retainer into the at least one rail.

18. The method of any one of claims 14-17, wherein retainer is coupled to the frame by laser welding.

19. The method of claim 18, wherein the retainer is substantially flat.

20. The method of any one of claims 14-18, wherein the retainer is wedge shaped.

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