Controlling peripheral devices on a substrate processing tool utilizing a common interface device

Abstract

One example provides a common interface device for a substrate processing tool. The common interface device comprises a tool interface configured to connect to a control network on the substrate processing tool and a peripheral interface configured to connect to one or more peripheral devices. The common interface device further comprises a controller connected to the tool interface and the peripheral interface. The controller is configured to receive, over the tool interface, one or more tool inputs indicating an operation mode of the substrate processing tool, and control, over the peripheral interface, operation of at least a first peripheral device from the one or more peripheral devices based at least upon detecting a change in the operation mode of the substrate processing tool.

Description

Docket No. LRC24323PPCTCONTROLLING PERIPHERAL DEVICES ON A SUBSTRATE PROCESSING TOOL UTILIZING A COMMON INTERFACE DEVICEBACKGROUND

[0001] Substrate processing tools are used in semiconductor manufacturing to perform chemical and / or physical processes on substrates, such as silicon wafers. Substrate processing tools can utilize various peripheral devices to enable the processing of substrates. Example peripheral devices include vacuum pumps and abatement systems.SUMMARY

[0002] This Summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter. Furthermore, the claimed subject matter is not limited to implementations that solve any or all disadvantages noted in any part of this disclosure.

[0003] One example provides a common interface device for a substrate processing tool. The common interface device comprises a tool interface configured to connect to a control network on the substrate processing tool and a peripheral interface configured to connect to one or more peripheral devices. The common interface device further comprises a controller connected to the tool interface and the peripheral interface. The controller is configured to receive, over the tool interface, one or more tool inputs indicating an operation mode of the substrate processing tool, and control, over the peripheral interface, operation of at least a first peripheral device from the one or more peripheral devices based at least upon detecting a change in the operation mode of the substrate processing tool.

[0004] In some such examples, the controller is alternatively or additionally configured to control the operation of the first peripheral device by one or more of changing a safety interlock state of the first peripheral device or switching the first peripheral device to a resource saving state.

[0005] In some such examples, the controller is alternatively or additionally configured to switch the first peripheral device to the resource saving state by switchingDocket No. LRC24323PPCTthe first peripheral device to an idle state when a change in the operation mode of the substrate processing tool comprises a change to an idle operation mode.

[0006] In some such examples, the peripheral interface is configured to connect to an abatement system, and the controller is alternatively or additionally configured to switch the abatement system to the resource saving state by switching the abatement system from a first temperature abatement state to a second temperature abatement state when a change in the operation mode of the substrate processing tool comprises a change in chamber chemistry to not comprise species for abatement.

[0007] In some such examples, the controller is alternatively or additionally configured to switch the first peripheral device to the resource saving state by switching the first peripheral device to a nitrogen bypass state or a nitrogen conservation state.

[0008] In some such examples, the controller is alternatively or additionally configured to switch the operation of the first peripheral device further based upon one or more peripheral inputs received over the peripheral interface.

[0009] Another example provides a substrate processing tool comprising a processing chamber, processing systems operable to process substrates in the processing chamber, a control network connected to the processing systems, and a common interface device. The common interface device comprises a tool interface connected to the control network, a peripheral interface configured to connect to one or more peripheral devices, and a controller connected to the tool interface and the peripheral interface. The controller is configured to receive, over the tool interface, one or more tool inputs indicating an operation mode of the substrate processing tool, and control, over the peripheral interface, operation of at least a first peripheral device from the one or more peripheral devices based at least upon detecting a change in the operation mode of the substrate processing tool.

[0010] In some such examples, the controller is alternatively or additionally configured to control the operation of the first peripheral device by one or more of changing a safety interlock state of the first peripheral device or switching the first peripheral device to a resource saving state.

[0011] In some such examples, the controller is alternatively or additionally configured to switch the first peripheral device to the resource saving state by switching the first peripheral device to an idle state when a change in the operation mode of the substrate processing tool comprises a change to an idle operation mode.Docket No. LRC24323PPCT

[0012] In some such examples, the first peripheral device includes an abatement system and the controller is alternatively or additionally configured to switch the abatement system to the resource saving state by switching the abatement system from a first temperature abatement state to a second temperature abatement state when the change in the operation mode of the substrate processing tool comprises a change in chamber chemistry to not comprise species for abatement.

[0013] In some such examples, the controller is alternatively or additionally configured to switch the first peripheral device to the resource saving state by switching the first peripheral device to a nitrogen bypass state or a nitrogen conservation state.

[0014] In some such examples, the controller is alternatively or additionally configured to control the operation of the first peripheral device further based upon one or more peripheral inputs received over the peripheral interface.

[0015] In some such examples, the controller is alternatively or additionally configured to receive a soft shutdown request from a facility over the peripheral interface and in response, to issue a soft shutdown command to the substrate processing tool over the tool interface.

[0016] Another example provides a method enacted on a substrate processing tool comprising a common interface device including a tool interface and a peripheral interface. The peripheral interface is connected to a peripheral device associated with the substrate processing tool. The method comprises receiving, over the tool interface, one or more tool inputs indicating an operation mode of the substrate processing tool, and performing, over the peripheral interface, one or more of changing a safety interlock state of the peripheral device or switching the peripheral device to a resource saving state based at least upon detecting a change in the operation mode of the substrate processing tool.

[0017] In some such examples, switching the peripheral device to the resource saving state alternatively or additionally comprises switching the peripheral device to an idle state when the change in the operation mode of the substrate processing tool comprises a change to an idle operation mode.

[0018] In some such examples, the peripheral device includes an abatement system. In such examples, switching the abatement system to the resource saving state alternatively or additionally comprises switching the abatement system from a first temperature abatement state to a second temperature abatement state when the changeDocket No. LRC24323PPCTin the operation mode of the substrate processing tool comprises a change in chamber chemistry to not comprise species for abatement.

[0019] In some such examples, the peripheral device comprises an abatement system, and switching the abatement system to the resource saving state alternatively or additionally comprises switching the abatement system to a nitrogen bypass state when a change in the operation mode of the substrate processing tool comprises a change in chamber chemistry to an exclusive nitrogen chemistry.

[0020] In some such examples, switching the peripheral device to the resource saving state alternatively or additionally comprises changing the peripheral device to a nitrogen conservation state.

[0021] In some such examples, the peripheral device is a first peripheral device, and the method alternatively or additionally comprises receiving one or more peripheral inputs over the peripheral interface from a second peripheral device, wherein the one or more of the changing the safety interlock state of the first peripheral device or the switching the peripheral device to a resource saving state is alternatively or additionally based at least upon the one or more peripheral inputs.

[0022] In some such examples, the method alternatively or additionally comprises receiving a soft shutdown request from a facility over the peripheral interface, and in response, issuing a soft shutdown command to the substrate processing tool over the tool interface.BRIEF DESCRIPTION OF THE DRAWINGS

[0023] FIG. 1 depicts a block diagram of an example processing environment comprising a substrate processing tool utilizing a common interface device to control peripheral devices.

[0024] FIG. 2 shows a flowchart illustrating an example method for controlling peripheral devices for a substrate processing tool using a common interface device.

[0025] FIG. 3 schematically depicts an example deposition processing tool utilizing a common interface device for controlling a peripheral exhaust system.

[0026] FIG. 4 shows a flowchart illustrating an example method for controlling the peripheral exhaust system of FIG. 3.

[0027] FIG. 5 depicts a block diagram of an example computing system.Docket No. LRC24323PPCTDETAILED DESCRIPTION

[0028] The term “abatement system” may generally represent a device that treats specified species through chemical modification, such as by oxidation.

[0029] The term “chamber chemistry” may generally represent a gaseous environment within a processing chamber.

[0030] The term “common interface device” may generally represent hardware, firmware, and / or software configured as a control node in a distributed control system on a substrate processing tool for controlling peripheral devices.

[0031] The term “control network” may generally represent communication infrastructure on a substrate processing that connects control nodes of a distributed control system.

[0032] The term “deposition” and variants thereof may generally represent a process in which a film is formed on a substrate from one or more precursor chemicals. Examples of deposition processes include chemical vapor deposition (CVD) and atomic layer deposition (ALD).

[0033] The term “etch” and variants thereof may generally represent a chemical or physical process by which material is removed from a surface. Etching may be utilized during a cleaning operation mode of a substrate processing tool to remove film residue from a processing chamber.

[0034] The term “NOx” may generally represent nitrogen oxide compounds, such as nitric oxide (NO) and nitrogen dioxide (NO2).

[0035] The term “operation mode” may generally represent a series of tasks performed by a substrate processing tool when in a selected configuration of a set of configurations. Examples of operation modes can comprise an idle operation mode (for lower electrical power consumption than other modes), a processing operation mode (for performing processes on substrates), a cleaning operation mode (for removing residues from surfaces of a processing chamber), and a tripped interlock mode (where one or more safety interlocks of a substrate processing tool have been activated).

[0036] The term “peripheral device” may generally represent a hardware component associated with a substrate processing tool that can expand capabilities of the substrate processing tool. Examples of peripheral devices include vacuum pumps, abatement systems, bypass systems, dilution systems, and heat exchange devices.Docket No. LRC24323PPCT

[0037] The term “peripheral interface” may generally represent communication hardware on a common interface device configured to connect to one or more peripheral devices.

[0038] The term “processing chamber” may generally represent an enclosure in which chemical and / or physical processes are performed on substrates.

[0039] The term “processing platform” may generally represent a machine including software and hardware to move substrates through one or more attached substrate processing tools to perform a processing recipe.

[0040] The term “processing systems” may generally represent various hardware on a substrate processing tool that supports performing processes in a processing chamber.

[0041] The term “resource saving state” may generally represent a configuration for operation of a peripheral device in which the peripheral device consumes less resources in comparison to a non-resource saving state of the peripheral device. Examples of such resource consumption include electrical power consumption, natural gas consumption, and nitrogen consumption. Examples of resource saving states comprise an idle state, a second temperature abatement state, a nitrogen bypass state, and a nitrogen conservation state.

[0042] The term “safety interlock” may generally represent a mechanism and / or protocol for safe operation of processes performed on a substrate processing tool. A safety interlock is considered activated, or tripped, when a set of conditions are met for interrupting operation(s) of designated processing system(s). As used herein, the term “safety interlock state” refers to a condition of safety interlock(s) on a peripheral device.

[0043] The term “soft shutdown” may generally represent a procedure in which a shutdown requested is enacted after completion of a currently running process.

[0044] The term “species for abatement” may generally represent atoms or molecules that are to be chemically altered in exhaust from a substrate processing tool.

[0045] The term “substrate” may generally represent any object onto which chemical and / or physical processes are performed in a processing chamber.

[0046] The term “substrate processing tool” may generally represent a machine including one or more processing chambers and related processing systems that are configured to enable processing to be carried out in the processing chamber.Docket No. LRC24323PPCT

[0047] The term “tool interface” may generally represent communication hardware on a common interface device that communicates with other control nodes on a substrate processing tool through a control network.

[0048] As mentioned above, a substrate processing tool can utilize various peripheral devices to enable the processing of substrates. Examples include vacuum pumps, abatement systems, bypass systems, dilution systems, and heat exchange devices.

[0049] Peripheral devices can be configured to implement current trends in resource savings, such as standards put forth by industry organizations (e.g., SEMI of Milpitas, California, USA). However, introducing these resource saving operations for the peripheral devices may require additional safety interlocks concerning the peripheral devices.

[0050] Peripheral devices can be reliant on a control system on the substrate processing tool to coordinate operation of the peripheral devices with operations of the substrate processing tool. Current control solutions take a piecemeal approach for coordinating the resource saving operations of the peripheral devices with the substrate processing tool. Such a piecemeal approach may result in the development of a variety of different interface hardware between different substrate processing tools and various peripheral devices. This can result in significant cost / time expenditure during development and maintenance of the substrate processing tools. Further, different peripheral devices may have different interface hardware and / or protocols. This can lead to even wider variations between current piecemeal solutions for various tool and peripheral device associations.

[0051] To address such concerns, examples are disclosed that relate to utilizing a common interface device for controlling operation of peripheral devices in relation to an operation mode of a substrate processing tool. Such operations of the peripheral devices can include resource saving operations (e.g., a resource saving state) and safety interlock states. Briefly, the common interface device comprises a tool interface configured to connect to a control network on a substrate processing tool. The common interface device can be configured to connect to a variety of different substrate processing tools without piecemeal modifications. The tool interface is configured to receive tool inputs indicating an operation mode of a substrate processing tool to which it is connected. Further, the tool interface also is configured to send various information to a control network of the substrate processing tool.Docket No. LRC24323PPCT

[0052] The common interface device also comprises a peripheral interface configured to connect to the peripheral devices. The peripheral interface can connect to a variety of different types of peripheral devices and / or from different manufacturers. The peripheral interface provides corresponding outputs to the peripheral devices and optionally can receive corresponding peripheral inputs from the peripheral devices. In such a manner, both the tool interface and the peripheral interface enable the common interface device to be used as interface hardware between various different substrate tools and corresponding various peripheral devices without piecemeal modifications for each substrate processing tool and / or peripheral device. As such, the common interface device provides common hardware for interfacing between a substrate processing tool and associated peripheral devices.

[0053] The common interface device also includes a controller connected to the tool interface and the peripheral interface. The controller is configured to control, over the peripheral interface, the operation of at least one of the peripheral devices based at least upon detecting a change in the operation mode of the substrate processing tool. Further, the controller also can be configured to control at least peripheral device based upon one or more of the peripheral inputs received over the peripheral interface. Thus, the common interface device can control the respective operations of the peripheral devices based upon a current operation mode of the substrate processing tool. As such, the controller enables the common interface device to provide a common solution for controlling the peripheral devices.

[0054] In some examples, the operations of the one peripheral device can further be based upon a state of another peripheral device as determined from a peripheral input from the other peripheral device. As will be discussed in more detail below, in some examples, changing the operation of the peripheral device can comprise changing a safety interlock state of the peripheral device and / or switching the peripheral device to a resource saving state. As previously mentioned, resource saving states help enable conservation of resource(s) over non-resource saving states on the peripheral device. Additionally, some resource saving states may relatively reduce emissions generated by the peripheral device, such as NOx emissions from abatement systems. This can help to address particular NOx emissions regulations in some localities (e.g., states and / or countries).

[0055] The common interface device provides common hardware and common control solutions (e.g., software) for interface communications between differentDocket No. LRC24323PPCTsubstrate processing tools and various associated peripheral devices. Further, the common interface device provides common interface communications for utilizing resource saving state on peripheral devices.

[0056] FIG. 1 illustrates a block diagram of an example processing platform 100 connected to a plurality of substrate processing tools. Here, the plurality of substrate processing tools includes a substrate processing tool 102 and additional substrate processing tools 104A - 104N. The processing platform 100 includes a platform controller 106 configured to perform corresponding process recipes on substrates using the plurality of substrate processing tools. As depicted, one or more peripheral devices 108 are associated with the substrate processing tool 102 to help perform processes based at least upon a process recipe received from the platform controller 106. Likewise, each of the additional substrate processing tools 104A - 104N has additional associated peripheral devices 110A - 110N. In various examples, the substrate processing tools 102, 104A - 104N can be configured to perform suitable deposition processes, suitable etch processes, and / or combinations thereof. For clarity, components of the additional substrate processing tools 104A - 104N are not depicted in FIG. 1, but it will be understood that they can comprise similar components as the substrate processing tool 102. While depicted here with three substrate processing tools, a processing platform can have one, two, or more than three attached substrate processing tools in other examples.

[0057] As depicted, the substrate processing tool 102 comprises a processing chamber 112 and a plurality of processing systems 114 for performing the processes in the processing chamber 112. As example processing systems, one or more heaters 116 are included to heat corresponding structure(s) in the processing chamber 112. Further, a chemical flow control system 118 is included to direct a flow of chemicals, e.g., in gas form, during processing. Additionally, a plasma system 120 is included to generate plasma, for example, during suitable etch processes or a cleaning process. As mentioned, the peripheral devices 108 provide expanded capabilities to the processing chamber 112. As example peripheral devices, a vacuum pump 122 is included to evacuate gases from the processing chamber 112. The evacuated gases are referred to herein as “residual gases.” Additionally, an abatement system 124 is included to treat the residual gases. Further, a heat exchange device 126 is included to provide heating / cooling to fluids used to heat or cool various components on the substrate processing tool 102. As will be discussed below, the abatement system 124, the vacuumDocket No. LRC24323PPCTpump 122, and the heat exchange device 126 are each configured to operate in one or more resource saving states. These resource saving states can reflect applicable energy saving modes outlined in the El 67 and El 75 SEMI standards by the international SEMI association. Further aspects of the vacuum pump 122 and the abatement system 124 are discussed with reference to FIG. 3. In other examples, the peripheral devices 108 can further include other suitable peripheral devices and / or omit one or more of the depicted peripheral devices.

[0058] The substrate processing tool 102 further comprises a plurality of processing system control nodes 130 for controlling various aspects of the substrate processing tool 102. Additionally, a control network 132 is connected to each processing system 114 and each processing system control node 130. In such a configuration, the processing system control nodes 130 operate as a distributed control system. As such, each processing system control node 130 (e.g., control node) is configured to control a respective processing system 114. In some examples, the control network 132 is configured to support suitable digital communications, such as EtherCAT (Ethernet for control automation technology), for example. Further, each processing system control node 130 can determine and issue control commands based at least upon suitable information received over the control network 132, for example a relevant portion of the processing recipe from the platform controller 106. A benefit of such a distributed control system is that new control node(s) can easily be added to the system without significant redesign of existing control nodes. More particularly, a new control node can be added to the distributed control system by connecting the new control node to the control network 132. As example processing system control nodes 130, one or more heater control nodes 134 are included to control operation of the heaters 116. Further, a plasma control node 136 is included to control operations of the plasma system 120, for example, to perform a cleaning process in the processing chamber 112. Additionally, one or more flow control nodes 138 are included to control operations of the chemical flow control system 118. In other examples, another suitable set of processing system control nodes may be used.

[0059] Here, the processing system control nodes 130 are operable to change an operation mode of the substrate processing tool 102, for example, in response to one or more inputs received from the platform controller 106. As a specific example, the substrate processing tool 102 can be changed between a processing operation mode and a cleaning operation mode. In the processing operation mode, the substrate processingDocket No. LRC24323PPCTtool 102 performs processes on substrates (e.g., deposition processes or etch processes). In the cleaning operation mode, the substrate processing tool 102 performs a cleaning process in which undesired film residues and particles from the processing operation mode are removed from surfaces of the processing chamber 112. In some examples, the cleaning process can include a plasma etching process to remove the undesired film residues and particles. As another example, the operation mode of the substrate processing tool 102 can be changed to an idle operation mode in which processes are not performed in the processing chamber 112. As such, each processing system control node 130 can control the corresponding processing system 114 to operate with relatively lower electrical power consumption compared to non-idle operation modes (e.g., the processing operation mode and the cleaning operation mode). For example, upon determining that the substrate processing tool 102 has finished processing the substrates in the processing chamber 112 and that no incoming substrates are expected for the substrate processing tool 102, the platform controller 106 can request that the operation mode of the substrate processing tool 102 is changed to the idle operation mode. In other examples, other suitable operation modes can be used for the substrate processing tool 102.

[0060] The substrate processing tool 102 further includes a tool interlock control node 140 connected to each processing system control node 130. This enables the tool interlock control node 140 to control safety interlocks on the substrate processing tool 102, for example, to comply with standards such as the SEMI S2 standard (environmental, health, and safety guideline for semiconductor manufacturing equipment). More specifically, the tool interlock control node 140 can interrupt / lock-out operation(s) of the substrate processing tool 102 resulting in the operation mode of the substrate processing tool 102 changing to a tripped interlock mode. For example, the tool interlock control node 140 can monitor status information from the processing system control nodes 130 to determine when to activate the tripped interlock mode on the substrate processing tool 102. It will be understood by one skilled in the art that the tripped interlock mode can include various subsets of tripped interlocks from a plurality of safety interlocks on the substrate processing tool 102. As will be discussed below, the tool interlock control node 140 can also monitor status information from the peripheral devices 108. This helps to enable checks and balances (e.g., safety interlocks) involved with coordinating operation of the substrate processing tool 102 and the peripheral devices 108.Docket No. LRC24323PPCT

[0061] The substrate processing tool 102 also comprises a common interface device 142 for controlling the peripheral devices 108. Here, the common interface device 142 is configured as a control node in the distributed control system on the substrate processing tool 102. Therefore, the common interface device 142 can be added, as discussed above, to an existing control system on suitable substrate processing tools, including existing substrate processing tools in the field, without significant redesign of the existing control nodes. This can help to reduce hardware and / or software variability in control systems across different substrate processing tools that may arise from the current piecemeal solutions. Additionally, this reduction in variability can help to reduce development time and / or cost of a substrate processing tool over current peripheral device control solutions.

[0062] Similar to the processing system control nodes 130, the common interface device 142 is connected to the control network 132 and the tool interlock control node 140. Specifically, the common interface device 142 comprises a tool interface 144 to connect to the control network 132. The tool interface 144 is configured to receive one or more tool inputs that indicate the operation mode of the substrate processing tool 102. In various examples, the tool inputs can include sensor data obtained from the processing chamber 112, status information from the processing system control node(s) 130, or other suitable information over the control network 132. The common interface device 142 further comprises a peripheral interface 146 connected to each peripheral device 108. It will be understood by one skilled in the art that the peripheral interface 146 includes a corresponding plurality of interface hardware (e.g., connection ports) for the peripheral devices 108. In various examples, the peripheral interface 146 can include interface hardware for EtherCAT interfaces, discrete IO (input / output) interfaces (e.g., pin connectors), RS232 interfaces (recommended standard 232 for serial communication), and / or other suitable interface hardware. In some examples, a cable adaptor may be used between the EtherCAT interface or the direct IO interface on the peripheral interface 146 and the peripheral device 108. Such a configuration enables the common interface device 142 to connect to various peripheral devices, for example, from different manufactures. Additionally, the peripheral interface 146 is configured to receive peripheral input(s) from one or more of the peripheral devices 108.

[0063] The common interface device 142 also can include inputs / outputs other than peripheral inputs / outputs and tool inputs / outputs. For example, the commonDocket No. LRC24323PPCTinterface device 142 can be configured to communicate at a facility -level, depicted here as facility 128. Here, the facility 128 can communicate various information to the substrate processing tool 102 through the common interface device 142. Likewise, the facility 128 can also communicate with the additional substrate processing tools 104A - 104N. In some examples, the facility 128 may communicate suitable shutdown signals, for example, a soft shutdown signal to the substrate processing tool 102. The soft shutdown signal, when asserted, causes the substrate processing tool 102 to finish performing the processes on the substrates currently in the processing chamber 112 but to not accept new substrates for processing. After the soft shutdown signal is deasserted, for example after a relevant issue has been resolved, the substrate processing tool 102 can accept the new substrates and resume performing processes on the new substrates. The soft shutdown can help to reduce substrate loss compared to stopping the processes on the substrates currently in the processing chamber 112. Further aspects of the soft shutdown are discussed with reference to FIG. 2. Alternatively or additionally, the common interface device 142 can include other configurable input / outputs from the facility 128 and / or another suitable communication endpoint.

[0064] The common interface device 142 also comprises a controller 148 connected to the tool interface 144 and the peripheral interface 146. Briefly, the controller 148 is configured to control, over the peripheral interface 146, operation of at least one of the peripheral devices 108 based at least upon detecting a change in the operation mode of the substrate processing tool 102. In such a configuration, the common interface device 142 can control the operation of the peripheral device 108 to track the operation mode of the substrate processing tool 102, such as when the substrate processing tool 102 switches between the processing and cleaning operation modes, for example.

[0065] More particularly, the controller 148 is configured to control the operation of the peripheral device 108 by switching the peripheral device 108 to a resource saving state of the peripheral device 108. Such a resource saving state may follow the E167 and / or E175 SEMI standards. For example, when the change in the operation mode of the substrate processing tool 102 comprises a change to the idle operation mode, the controller 148 switches the peripheral device 108 to an idle state. In some examples, the controller 148 is configured to switch the peripheral device 108 to the idle state after a specified time delay from detecting the change of the operation mode of the substrate processing tool 102 to the idle operation mode. For example, theDocket No. LRC24323PPCTplatform controller 106 can relay the specified time delay from a user interface on the processing platform 100. Similar to when the substrate processing tool 102 is in the idle operation mode, the peripheral device 108, in the idle state, operates with relatively lower electrical power consumption than a non-idle state. In response to switching the peripheral device 108 to the idle state, the controller 148 can receive, over the peripheral interface 146, a peripheral input including a notification that the peripheral device 108 has successfully entered the idle state in some examples. Further, the controller 148 can forward the notification to at least the tool interlock control node 140, thereby enabling the tool interlock control node 140 to monitor the status information related to the peripheral devices 108. Thus, feedback from the peripheral devices 108 can be incorporated into the control of the safety interlocks on the substrate processing tool 102. As a specific example, the tool interlock control node 140 may interrupt the control of the chemical flow control system 118 while the abatement system 124 and / or the vacuum pump 122 are in the idle state. In other examples, the common interface device 142 can forward other suitable information based at least upon the peripheral input(s) received over the peripheral interface 146.

[0066] As previously mentioned, utilizing the resource saving states of the peripheral devices 108 can result in additional safety interlocks on the substrate processing tool 102. Therefore, the controller 148 is also configured to control the operation of the peripheral device 108 by changing a safety interlock state of the peripheral device 108. As discussed, the safety interlock state of the peripheral device 108 can be changed when the change in the operation mode of the substrate processing tool 102 comprises a change to the tripped interlock mode. Additionally, the controller 148 can change the safety interlock state of the peripheral device 108 further based upon the peripheral input(s) received over the peripheral interface 146 in some examples. As a specific example, the abatement system 124 may not be allowed to switch to the idle state while the vacuum pump 122 is not in the idle state. In such a manner, the controller 148 can change the safety interlock state of the peripheral device 108 to comply with the SEMI S2 standard. Further aspects of the controller 148 controlling the operation of the peripheral device 108 are discussed with reference to FIGS. 2, 3, and 4. In various examples, the controller 148 can be implemented in logic circuits, firmware, software, and / or suitable combinations thereof. In some such examples, the firmware and / or the software may have a relatively small update between substrate processing tools to handle a different process chemistry. Such a configurationDocket No. LRC24323PPCTenables the common interface device 142 to be utilized on different substrate processing tools without significant redesign of the common interface device 142. Further, the controller 148 helps to enable the common interface device 142 to perform common control communications with peripheral devices on different substrate processing tools.

[0067] As previously discussed, a common interface device is utilized to control peripheral devices associated with a substrate processing tool. Thus, FIG. 2 illustrates a flowchart of an example method 200 for controlling the peripheral devices 108. For example, the controller 148 can be configured to perform the method 200. While discussed here with reference to the substrate processing tool 102 of FIG. 1, the method 200 can be performed by another suitable common interface device in other examples.

[0068] The method 200 comprises, at 202, receiving, over the tool interface 144, one or more tool inputs. The tool inputs indicate an operation mode of the substrate processing tool 102 (e.g., an idle operation mode, a processing operation mode, a cleaning operation mode, or a tripped interlock mode). The method 200 optionally comprises, at 204, receiving one or more peripheral inputs over the peripheral interface 146. These peripheral inputs can originate from one or more of the peripheral devices 108. For at least a first peripheral device from the plurality of the peripheral devices 108, the method 200 comprises, at 206, controlling, over the peripheral interface 146, operation of the first peripheral device based at least upon detecting a change in the operation mode of the substrate processing tool 102. In examples where the peripheral inputs are received, controlling the operation of the peripheral device can further be based upon the one or more peripheral inputs received over the peripheral interface 146, as indicated at 208.

[0069] Controlling the operation of the first peripheral device can comprise, at 210, changing a safety interlock state of the first peripheral device. In some such examples, the safety interlock state may be changed when the change in the operation mode of the substrate processing tool 102 comprises a change to the tripped interlock mode. Alternatively or additionally, changing the safety interlock state of the first peripheral device can further be based upon peripheral input(s) from a second peripheral device. For example, the safety interlock state of the abatement system 124 and / or the vacuum pump 122 may depend on a status of the other device. In some such examples, the status of the peripheral device may also be forwarded to the tool interlock control node 140 for coordination of safety interlocks on the substrate processing tool 102. In such a configuration, information related to the safety interlocks can beDocket No. LRC24323PPCTcoordinated across the substrate processing tool 102 and, for example, can enable SEMI S2 compliant interlocks that include operation information from the peripheral devices. Alternatively or additionally, controlling the operation of the first peripheral device can comprise switching the first peripheral device to a resource saving state, as indicated at 212. In some examples, switching the first peripheral device to the resource saving state can further be based upon one or more of the peripheral inputs. In examples where the change in the operation mode of the substrate processing tool 102 comprises the change to the idle operation mode, switching the first peripheral device comprises switching the first peripheral device to an idle state as indicated at 214. In other examples, other resource saving states may be used, including the examples discussed below with reference to FIG. 4.

[0070] The method 200 can optionally comprise controlling operation of one or more additional peripheral devices from the peripheral devices 108, as indicated at 216. Here, the method 200 can repeat a suitable subset of 208, 210, 212, and / or 214 for any suitable subset from the peripheral devices 108 and / or other suitable peripheral devices associated with the substrate processing tool 102.

[0071] In some examples where the common interface device 142 communicates with the facility 128, the method 200 can optionally comprise, at 218, receiving a soft shutdown request from the facility 128 over the peripheral interface 146 and in response, issuing a soft shutdown command to the substrate processing tool 102 over the tool interface 144. In such examples, the substrate processing tool 102 completes processes on current substrates before shutting down, as discussed with reference to FIG. 1. In other examples, other suitable operations of a peripheral device may be controlled.

[0072] The above examples discuss general operation of a common interface device on a substrate processing tool. Next, additional aspects of the common interface device will be discussed with reference to a deposition tool and a peripheral exhaust system for handling residual gases from the deposition tool. FIG. 3 schematically depicts an example substrate processing tool 300 in the form of a deposition tool along with a peripheral exhaust system 302. As depicted, the peripheral exhaust system 302 transports exhaust from the substrate processing tool 300 to a building exhaust system 304 for treating residual gases, as will be discussed in more detail below.

[0073] The substrate processing tool 300 is an example implementation of the substrate processing tool 102. Therefore, similar to the substrate processing tool 102,Docket No. LRC24323PPCTthe substrate processing tool 300 includes a processing chamber 306 and a plurality of processing systems 308. Further, the substrate processing tool 300 includes a control network 310 connected to a common interface device 312, a plurality of processing system control nodes 314, and the plurality of processing systems 308. Likewise, a tool interlock control node 316 is connected to the common interface device 312 and the plurality of processing system control nodes 314.

[0074] Here, the common interface device 312 is an example of the common interface device 142. As such, the common interface device 312 comprises a controller 318 connected to a tool interface 320 and a peripheral interface 322. In the current example, the peripheral interface 322 is connected to various peripheral devices of the peripheral exhaust system 302. Further, the tool interface 320 is connected to the control network 310. The peripheral interface 322 can also connect to other suitable communication endpoints, such as the facility 128, for example.

[0075] As depicted, the substrate processing tool 300 includes a first station 324A and a second station 324B arranged in the processing chamber 306 for processing multiple substrates in parallel. While depicted here with two stations, any suitable number of stations may be used in other examples. The first station 324A comprises a first substrate holder 326A configured to support a first substrate 328A during processing. The first station 324A also comprises a first process gas outlet 330A in fluid connection with one or more process gas sources 332 that provide a corresponding one or more process gases. For example, the process gas source(s) 332 can provide precursor gas(es), e.g., as part of chemical vapor deposition. As another example, the process gas source(s) 332 can provide an etching agent, e.g., as part of a plasma cleaning process.

[0076] The process gas(es) introduced into the processing chamber 306 form a chamber chemistry to perform an intended process within the processing chamber 306. In some instances, the chamber chemistry can comprise species for abatement, for example, when performing substrate processing in the substrate processing chamber 306. In such instances, abatement can be in a first temperature abatement state to abate the species for abatement, such nitrogen trifluoride (NF3). In other instances, the chamber chemistry can comprise species for abatement that may pose a risk of NOx production, such as ammonia (NH3) or nitrous oxide (N2O) for example. In such instances, the abatement can be in a second temperature abatement state to help reduce NOx formation. This state also can provide resource savings (e.g., reduced fuel use)Docket No. LRC24323PPCTcompared to the first temperature abatement state. Other species may be present in the chamber chemistry where the abatement can be in the second temperature abatement state, for example, SiH4, H2, TEOS, B2H6, or WFe. In further instances, the chamber chemistry can comprise species that do not require abatement, but that can be converted into less desirable species when abated. An example is during a nitrogen flush, as nitrogen can be converted into NOx compounds during abatement. As such, a nitrogen bypass state may be used during the nitrogen flush. Each of these states are described in more detail below along with the respective peripheral device(s).

[0077] The first station 324A is also in fluid connection with the peripheral exhaust system 302 through a first exhaust line 334A for evacuating residual gases from the processing chamber 306. Likewise, the second station 324B has a second substrate holder 326B to support a second substrate 328B during processing. Further, the one or more process gas sources 332 are also in fluid connection with a second process gas outlet 330B of the second station 324B. In other examples, the first and second process gas outlets 330 can be in fluid connection with separate process gas sources. The second station 324B is also in fluid connection with a second exhaust line 334B to the peripheral exhaust system 302.

[0078] As previously mentioned, the peripheral exhaust system 302 is configured to treat the residual gases before reaching the building exhaust system 304. This enables a more specialized treatment of the residual gases than may be possible with just the building exhaust system 304. While the peripheral exhaust system 302 is depicted with a single endpoint at the building exhaust system 304, it is understood that a peripheral exhaust system may have a different endpoint and / or additional endpoints in other examples.

[0079] In the current example, the various peripheral devices of the peripheral exhaust system 302 include a vacuum pump 336, a nitrogen dilution system 338, an abatement system 340 (for the previously-mentioned abatement), and a bypass system 342. In other examples, a peripheral exhaust system may include other suitable peripheral devices. Here, the vacuum pump 336 is configured to controllably pump residual gases from the processing chamber 306. In some examples, the composition of the residual gases may need to be diluted in the peripheral exhaust system 302, for example, to a concentration lower than a LFL (lower flammability limit) of downstream devices. Therefore, the nitrogen dilution system 338 is configured to controllably introduce nitrogen gas upstream of the vacuum pump 336. Such dilution can help to notDocket No. LRC24323PPCTunintentionally ignite the residual gases when entering the abatement system 340, for example. Additionally, introducing the nitrogen gas upstream of the vacuum pump 336 can help sufficient material to be present in the peripheral exhaust system 302 for operation of the vacuum pump 336. In other examples the nitrogen dilution system 338 may be integrated into the vacuum pump 336.

[0080] Moving downstream in the peripheral exhaust system 302, the abatement system 340 is configured for thermal abatement (e.g., oxidation) of at least some of the residual gases in the peripheral exhaust system 302. As examples, the abatement system 340 can inject oxygen and methane (CH4) gases as fuel for the thermal abatement. To sufficiently treat the species for abatement, the abatement system 340 can be operated selectively in a first temperature abatement state to provide sufficient thermal energy for substantially complete abatement of the species for abatement. However, the first temperature abatement state can generate N0xfrom nitrogen in the residual gases. As previously mentioned, some localities may regulate NOx emissions. As such, to help reduce the amount of NOXgenerated, the abatement system 340 is selectively controllable to switch to a second temperature abatement state in which relatively less oxygen and / or methane gases are injected into the abatement system 340 for a relatively lower temperature abatement than in the first temperature abatement state. For example, the abatement system 340 can selectively be in the second temperature abatement state when species with nitrogen (other than fluorine-containing species such as NF3) are present in the residual gases. Such species may be abated at a relatively lower temperature than other residual species. As such, switching to the second temperature abatement state for species with nitrogen and that can be abated at relatively lower temperatures may help to save resources (e.g., methane) while also reducing NOx production compared to abating at relatively higher temperatures.

[0081] As depicted, the bypass system 342 is connected upstream of an input of the abatement system 340 to selectively direct the residual gases around the abatement system 340 and into the building exhaust system 304 or another suitable endpoint. For example, the residual gases may bypass the abatement system 340 when the chamber chemistry include a high partial pressure of nitrogen, e.g., during a nitrogen flush. Such a configuration enables the nitrogen flush to not be treated by the abatement system 340 and thereby, not generate NOx. Thus, the bypass system 342 can help to reduce NOx generation compared to abating the nitrogen flush in the abatement system 340. In other examples, the bypass system 342 can be omitted or incorporated into theDocket No. LRC24323PPCTabatement system 340. In further examples, a peripheral exhaust system may have another configuration.

[0082] In the current example, the controller 318 of the common interface device 312 controls corresponding operations of the peripheral devices of the peripheral exhaust system 302 based at least upon detecting a change in the operation mode of the substrate processing tool 300 in a likewise manner to the common interface device 142 of FIG. 1. Therefore, the controller 318 can change a safety interlock state of the nitrogen dilution system 338, the vacuum pump, the abatement system 340, and / or the bypass system 342. Likewise, the controller 318 can also switch the nitrogen dilution system 338, the vacuum pump 336, the abatement system 340, and / or the bypass system 342 to corresponding resource saving state(s). Additional aspects of controlling such operations of the peripheral exhaust system 302 are discussed with reference to FIG. 4. FIG. 3 is illustrative. In other examples, the common interface device 312 can be utilized to control additional peripheral devices not depicted in FIG. 3.

[0083] FIG. 4 illustrates an example method 400 for controlling the corresponding operations of the peripheral devices of the peripheral exhaust system 302 of FIG. 3. Therefore, the method 400 is discussed here with reference to the common interface device 312 but can also be performed on another suitable substrate processing tool in other examples. As a specific example, the controller 148 and the controller 318 can be configured to perform the method 400. Similar to the method 200, the method 400 comprises receiving, over the tool interface 320, one or more tool inputs indicating an operation mode of the substrate processing tool 300, as indicated at 402. Further, the method 400 optionally comprises, at 404, receiving one or more peripheral inputs over the peripheral interface 322.

[0084] The method 400 further comprises, at 406, controlling operation of at least one peripheral device of the peripheral exhaust system 302 based at least upon detecting a change in the operation mode of the substrate processing tool 300. In some examples, controlling the operation of the peripheral device can further optionally be based upon the one or more peripheral inputs received over the peripheral interface 322, as indicated at 408. As examples, controlling the operation of the peripheral device can comprise changing, at 410, a safety interlock state of the peripheral device, and / or switching, at 412, the peripheral device to a resource saving state.

[0085] In the current example, changing the safety interlock state of the peripheral device can comprise changing the safety interlock state further based uponDocket No. LRC24323PPCTthe peripheral inputs received over the peripheral interface 322. Specifically, the respective safety interlock states of the nitrogen dilution system 338, the vacuum pump 336, and / or the abatement system 340 can be based upon feedback (e.g., peripheral inputs) from the other peripheral devices in the peripheral exhaust system 302 along with the detected change in the operation mode of the substrate processing tool 300. As a specific example, when the safety interlock state of the abatement system 340 includes a tripped safety interlock, the controller 318 may also change the safety interlock state of the vacuum pump 336, for example, to include a tripped safety interlock. Likewise, the nitrogen dilution system 338 can have a safety interlock state that is dependent on the current operation of the vacuum pump 336.

[0086] Switching the abatement system 340 to the resource saving state can comprise switching the abatement system 340 from a first temperature abatement state to a second temperature abatement state when the change in the operation mode of the substrate processing tool 300 comprises a change in chamber chemistry to not comprise species for abatement, as indicated at 414. Such a configuration enables the abatement system 340 to consume less methane gas than in the first temperature abatement state, and also may reduce N0xgeneration.

[0087] Alternatively or additionally, in some examples, switching the abatement system 340 to the resource saving state comprises switching the abatement system 340 to a nitrogen bypass state as indicated at 416. The nitrogen bypass state may be used when the change in the operation mode of the substrate processing tool 300 comprises a change in the chamber chemistry to an exclusive nitrogen chemistry, such as when performing a nitrogen flush, for example. In such examples, the abatement system 340 can utilize the bypass system 342 to redirect the nitrogen flush around the abatement system 340 (e.g., to the building exhaust system 304, as discussed with reference to FIG. 3). This can help avoid generating N0x. In other such examples, the abatement system 340 may redirect the nitrogen flush in another suitable manner in the nitrogen bypass state.

[0088] Alternatively or additionally, in some examples, switching the peripheral device to the resource saving state can comprise, at 418, switching the peripheral device to a nitrogen conservation state. As a specific example, the nitrogen dilution system 338 can be changed to the nitrogen conservation state when the change in the operation mode of the substrate processing tool 300 comprises a change in the chamber chemistry to a composition that does not need dilution, such as the exclusiveDocket No. LRC24323PPCTnitrogen chemistry, for example. In such a manner, nitrogen consumption can be reduced for the nitrogen dilution system 338 in the nitrogen conservation state. In other examples, the nitrogen conservation state may be performed in another suitable manner.

[0089] Alternatively or additionally, switching the peripheral device to the resource saving state further can comprise switching the peripheral device to an idle state when the change in the operation mode of the substrate processing tool 300 comprises a change to an idle operation mode, as indicated at 420. As previously mentioned, in the idle operation mode, the substrate processing tool 300 is not performing processes, and thus no process gases are introduced into the processing chamber 306. Therefore, treatment within the peripheral exhaust system 302 is in lower demand than in non-idle operation modes of the substrate processing tool 300. For example, switching to the idle state can comprise switching the nitrogen dilution system 338 to the nitrogen conservation state. As another example, switching the abatement system 340 to the idle state can comprise stopping methane gas injection into the abatement system 340 and retaining a pilot light. Additionally, the method 400 can optionally comprise, at 422, controlling one or more additional peripheral devices associated with the substrate processing tool 300. Here, the method 400 can repeat any suitable subset of 408, 410, 412, 414, 416, 418, and / or 420 for each additional peripheral device of the peripheral devices. In other examples, 420 and / or 422 may be omitted. FIG. 4 is illustrative. In other examples, other suitable operations of a peripheral device may be controlled.

[0090] A common interface device as configured herein can enable coordinating operations between a substrate processing tool and associated peripheral devices. Such operations comprise changing safety interlock states of the peripheral devices and switching the peripheral device to a resource saving state. Further, the operations are based upon a current operation mode of the substrate processing tool and optionally upon peripheral inputs from other peripheral devices. Thus, safety interlocks can be coordinated across the substrate processing tool that incorporate feedback regarding statuses of the peripheral devices. This enables the substrate processing tool to support SEMI E167 and E175 enabled peripheral devices and also helps to comply with SEMI S2, safety guidelines. Further, supporting SEMI E167 and E175 enabled abatement systems can help to reduce N0xemissions over not operating in resource saving states.Docket No. LRC24323PPCT

[0091] Additionally, the common interface device is configured as a control node for the distributed control systems on different substrate processing tools. As discussed, this enables the common interface device to be added to control systems on new substrate processing tools and to the control systems on existing substrate processing tools without significant redesign of the other control nodes. As such, different types of substrate processing tools can utilize the common interface device for controlling associated peripheral devices instead of developing another piecemeal solution. Therefore, the common interface device provides common control communications between the different substrate processing tools and corresponding associated peripheral devices. Such control communications include a common hardware and software solution.

[0092] FIG. 5 schematically shows a non-limiting example of a computing system 500 that can enact one or more of the methods and processes described above. Computing system 500 is shown in simplified form. Computing system 500 may take the form of one or more personal computers, workstations, computers integrated with substrate processing tools, and / or network accessible server computers.

[0093] Computing system 500 includes a logic subsystem 502 and a storage subsystem 504. Computing system 500 may optionally include a display subsystem 506, input subsystem 508, communication subsystem 510, and / or other components not shown in FIG. 5. For example, the common interface device 142 and / or the common interface device 312 can utilize components of the computing system 500.

[0094] Logic subsystem 502 includes one or more physical devices configured to execute instructions. For example, the logic machine may be configured to execute instructions that are part of one or more applications, services, programs, routines, libraries, objects, components, data structures, or other logical constructs. Such instructions may be implemented to perform a task, implement a data type, transform the state of one or more components, achieve a technical effect, or otherwise arrive at a desired result. For example, the logic subsystem 502 may perform the method 200 and / or the method 400.

[0095] The logic machine may include one or more processors configured to execute software instructions. Additionally or alternatively, the logic machine may include one or more hardware or firmware logic machines configured to execute hardware or firmware instructions. Processors of the logic machine may be single-core or multi-core, and the instructions executed thereon may be configured for sequential,Docket No. LRC24323PPCTparallel, and / or distributed processing. Individual components of the logic machine optionally may be distributed among two or more separate devices, which may be remotely located and / or configured for coordinated processing. Aspects of the logic machine may be virtualized and executed by remotely accessible, networked computing devices configured in a cloud-computing configuration.

[0096] Storage subsystem 504 includes one or more physical devices configured to hold instructions 512 executable by the logic machine to implement the methods and processes described herein. When such methods and processes are implemented, the state of storage subsystem 504 may be transformed — e.g., to hold different data.

[0097] Storage subsystem 504 may include removable and / or built-in devices. Storage subsystem 504 may include optical memory (e.g., CD, DVD, HD-DVD, Blu-Ray Disc, etc.), semiconductor memory (e.g., RAM, EPROM, EEPROM, etc.), and / or magnetic memory (e.g., hard-disk drive, floppy-disk drive, tape drive, MRAM, etc.), among others. Storage subsystem 504 may include volatile, nonvolatile, dynamic, static, read / write, read-only, random-access, sequential-access, location-addressable, file-addressable, and / or content-addressable devices.

[0098] It will be appreciated that storage subsystem 504 includes one or more physical devices. However, aspects of the instructions described herein alternatively may be propagated by a communication medium (e.g., an electromagnetic signal, an optical signal, etc.) that is not held by a physical device for a finite duration.

[0099] Aspects of logic subsystem 502 and storage subsystem 504 may be integrated together into one or more hardware-logic components. Such hardware-logic components may include field-programmable gate arrays (FPGAs), program- and application-specific integrated circuits (PASIC / ASICs), program- and applicationspecific standard products (PSSP / ASSPs), system-on-a-chip (SOC), and complex programmable logic devices (CPLDs), for example.

[0100] When included, display subsystem 506 may be used to present a visual representation of data held by storage subsystem 504. This visual representation may take the form of a graphical user interface (GUI). As the herein described methods and processes change the data held by the storage machine, and thus transform the state of the storage machine, the state of display subsystem 506 may likewise be transformed to visually represent changes in the underlying data. Display subsystem 506 may include one or more display devices utilizing virtually any type of technology. SuchDocket No. LRC24323PPCTdisplay devices may be combined with logic subsystem 502 and / or storage subsystem 504 in a shared enclosure, or such display devices may be peripheral display devices.

[0101] When included, input subsystem 508 may comprise or interface with one or more user-input devices such as a keyboard, mouse, or touch screen. In some examples, the input subsystem may comprise or interface with selected natural user input (NUI) componentry. Such componentry may be integrated or peripheral, and the transduction and / or processing of input actions may be handled on- or off-board. Example NUI componentry may include a microphone for speech and / or voice recognition, and an infrared, color, stereoscopic, and / or depth camera for machine vision and / or gesture recognition.

[0102] When included, communication subsystem 510 may be configured to communicatively couple computing system 500 with one or more other computing devices. Communication subsystem 510 may include wired and / or wireless communication devices compatible with one or more different communication protocols. As non-limiting examples, the communication subsystem may be configured for communication via a wireless telephone network, or a wired or wireless local- or wide-area network. In some examples, the communication subsystem may allow computing system 500 to send and / or receive messages to and / or from other devices via a network such as the Internet.

[0103] It will be understood that the configurations and / or approaches described herein are exemplary in nature, and that these specific examples or examples are not to be considered in a limiting sense, because numerous variations are possible. The specific routines or methods described herein may represent one or more of any number of processing strategies. As such, various acts illustrated and / or described may be performed in the sequence illustrated and / or described, in other sequences, in parallel, or omitted. Likewise, the order of the above-described processes may be changed.

[0104] The subject matter of the present disclosure includes all novel and non-obvious combinations and sub-combinations of the various processes, systems and configurations, and other features, functions, acts, and / or properties disclosed herein, as well as any and all equivalents thereof.

Claims

Docket No. LRC24323PPCTCLAIMS:

1. A common interface device for a substrate processing tool, the common interface device comprising:a tool interface configured to connect to a control network on the substrate processing tool;a peripheral interface configured to connect to one or more peripheral devices; anda controller connected to the tool interface and the peripheral interface, the controller configured toreceive, over the tool interface, one or more tool inputs indicating an operation mode of the substrate processing tool, andcontrol, over the peripheral interface, operation of at least a first peripheral device from the one or more peripheral devices based at least upon detecting a change in the operation mode of the substrate processing tool.

2. The common interface device of claim 1, wherein the controller is configured to control the operation of the first peripheral device by one or more of changing a safety interlock state of the first peripheral device or switching the first peripheral device to a resource saving state.

3. The common interface device of claim 2, wherein the controller is configured to switch the first peripheral device to the resource saving state by switching the first peripheral device to an idle state when a change in the operation mode of the substrate processing tool comprises a change to an idle operation mode.

4. The common interface device of claim 2, wherein the peripheral interface is configured to connect to an abatement system, and wherein the controller is configured to switch the abatement system to the resource saving state by switching the abatement system from a first temperature abatement state to a second temperature abatement state when a change in the operation mode of the substrate processing tool comprises a change in chamber chemistry to not comprise species for abatement.Docket No. LRC24323PPCT5. The common interface device of claim 2, wherein the controller is configured to switch the first peripheral device to the resource saving state by switching the first peripheral device to a nitrogen bypass state or a nitrogen conservation state.

6. The common interface device of claim 1, wherein the controller is configured to switch the operation of the first peripheral device further based upon one or more peripheral inputs received over the peripheral interface.

7. A substrate processing tool comprising:a processing chamber;processing systems operable to process substrates in the processing chamber; a control network connected to the processing systems; anda common interface device comprisinga tool interface connected to the control network,a peripheral interface configured to connect to one or more peripheral devices, anda controller connected to the tool interface and the peripheral interface, the controller configured toreceive, over the tool interface, one or more tool inputs indicating an operation mode of the substrate processing tool, andcontrol, over the peripheral interface, operation of at least a first peripheral device from the one or more peripheral devices based at least upon detecting a change in the operation mode of the substrate processing tool.

8. The substrate processing tool of claim 7, wherein the controller is configured to control the operation of the first peripheral device by one or more of changing a safety interlock state of the first peripheral device or switching the first peripheral device to a resource saving state.

9. The substrate processing tool of claim 8, wherein the controller is configured to switch the first peripheral device to the resource saving state by switching the first peripheral device to an idle state when a change in the operation mode of the substrate processing tool comprises a change to an idle operation mode.Docket No. LRC24323PPCT10. The substrate processing tool of claim 8, wherein the first peripheral device includes an abatement system, and wherein the controller is configured to switch the abatement system to the resource saving state by switching the abatement system from a first temperature abatement state to a second temperature abatement state when the change in the operation mode of the substrate processing tool comprises a change in chamber chemistry to not comprise species for abatement.

11. The substrate processing tool of claim 8, wherein the controller is configured to switch the first peripheral device to the resource saving state by switching the first peripheral device to a nitrogen bypass state or a nitrogen conservation state.

12. The substrate processing tool of claim 7, wherein the controller is configured to control the operation of the first peripheral device further based upon one or more peripheral inputs received over the peripheral interface.

13. The substrate processing tool of claim 7, wherein the controller is further configured to receive a soft shutdown request from a facility over the peripheral interface and in response, to issue a soft shutdown command to the substrate processing tool over the tool interface.

14. A method enacted on a substrate processing tool comprising a common interface device including a tool interface and a peripheral interface, the peripheral interface being connected to a peripheral device associated with the substrate processing tool, the method comprising:receiving, over the tool interface, one or more tool inputs indicating an operation mode of the substrate processing tool; andperforming, over the peripheral interface, one or more of changing a safety interlock state of the peripheral device or switching the peripheral device to a resource saving state based at least upon detecting a change in the operation mode of the substrate processing tool.

15. The method of claim 14, wherein switching the peripheral device to the resource saving state comprises switching the peripheral device to an idle state when the changeDocket No. LRC24323PPCTin the operation mode of the substrate processing tool comprises a change to an idle operation mode.

16. The method of claim 14, wherein the peripheral device includes an abatement system, and wherein switching the abatement system to the resource saving state comprises switching the abatement system from a first temperature abatement state to a second temperature abatement state when the change in the operation mode of the substrate processing tool comprises a change in chamber chemistry to not comprise species for abatement.

17. The method of claim 14, wherein the peripheral device comprises an abatement system, and wherein switching the abatement system to the resource saving state comprises switching the abatement system to a nitrogen bypass state when a change in the operation mode of the substrate processing tool comprises a change in chamber chemistry to an exclusive nitrogen chemistry.

18. The method of claim 14, wherein switching the peripheral device to the resource saving state comprises changing the peripheral device to a nitrogen conservation state.

19. The method of claim 14, wherein the peripheral device is a first peripheral device, and the method further comprises receiving one or more peripheral inputs over the peripheral interface from a second peripheral device, and wherein the one or more of the changing the safety interlock state of the first peripheral device or the switching the peripheral device to the resource saving state is further based at least upon the one or more peripheral inputs.

20. The method of claim 14, further comprising receiving a soft shutdown request from a facility over the peripheral interface and in response, issuing a soft shutdown command to the substrate processing tool over the tool interface.

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