Optical imaging device

Abstract

Provided in the embodiments of the present disclosure is an optical imaging device, comprising: a housing having an accommodating space, a top wall of the housing being provided with a through hole; a lens, fixed to the top wall of the housing and covering the through hole; an image sensor module, provided in the accommodating space, the image sensor module comprising an image sensor chip and a support carrying the image sensor chip; an elastic supporting member, provided in the accommodating space, wherein the elastic supporting member is connected to a bottom wall and the support, so as to suspend the image sensor module in the accommodating space; and a driving assembly, provided in the accommodating space. Observed in the optical axis direction of the lens, the driving assembly and the image sensor chip at least partially overlap; the driving assembly comprises a magnetic circuit system and a driving coil provided opposite to the magnetic circuit system; one of the driving coil and the magnetic circuit system is fixed to the support, and the other of the driving coil and the magnetic circuit system is fixed to the bottom wall of the housing; the driving coil cooperates with the magnetic circuit system so as to drive the image sensor module to move in a direction perpendicular to the optical axis of the lens.

Description

An optical imaging device Technical Field

[0001] The embodiments disclosed herein belong to the field of imaging equipment technology, and specifically relate to an optical imaging device. Background Technology

[0002] Currently, the cameras used in AR glasses are limited by size and weight, and are all fixed-focus and without image stabilization. Therefore, small-size image stabilization design is very necessary.

[0003] In image stabilization design, conventional lens-moving solutions result in a larger screen opening, affecting the screen-to-body ratio. In addition, using a lens-moving solution requires reserving space for the lens movement within the housing of the optical imaging device, which is not conducive to the miniaturization design of the device, and the lateral dimensions of the device cannot be effectively controlled.

[0004] Therefore, how to solve the above-mentioned technical problems has become a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0005] The embodiments disclosed herein are intended to at least address one of the technical problems existing in the prior art, and to provide an optical imaging device.

[0006] One aspect of the embodiments of this disclosure provides an optical imaging apparatus, comprising:

[0007] A housing having a receiving space, the housing including a top wall, a bottom wall disposed opposite to the top wall, and a side wall connecting the top wall and the bottom wall, the top wall being provided with a through hole communicating the receiving space with the outside;

[0008] The lens is fixed to the top wall of the housing and covers the through hole;

[0009] An image sensor assembly is disposed in the receiving space, the image sensor assembly including an image sensor chip and a bracket supporting the image sensor chip;

[0010] An elastic support member is disposed in the receiving space, the elastic support member connecting the bottom wall and the bracket to suspend the image sensor assembly within the receiving space;

[0011] A driving assembly is disposed in the receiving space and viewed along the optical axis of the lens. The driving assembly at least partially overlaps with the image sensor chip. The driving assembly includes a magnetic circuit system and a driving coil disposed opposite to the magnetic circuit system. One of the driving coil and the magnetic circuit system is fixed to the bracket, and the other of the driving coil and the magnetic circuit system is fixed to the bottom wall of the housing. The driving coil cooperates with the magnetic circuit system to drive the image sensor assembly to move along a direction perpendicular to the optical axis of the lens.

[0012] Optionally, the drive coil is electrically connected to the elastic support.

[0013] Optionally, the magnetic circuit system includes a first magnetic circuit and a second magnetic circuit stacked along the optical axis of the lens. The first magnetic circuit is closer to the drive coil than the second magnetic circuit. The first magnetic circuit includes a first annular inner magnet and a first annular outer magnet spaced apart from the first annular inner magnet. The second magnetic circuit is an integrally magnetized magnet and includes a second annular inner magnet, a second annular outer magnet spaced apart from the second annular inner magnet, and a non-magnetic portion disposed between the second annular inner magnet and the second annular outer magnet.

[0014] Both the first annular inner magnet and the second annular inner magnet are magnetized along the optical axis and their magnetization directions are the same. Both the first annular outer magnet and the second annular outer magnet are magnetized along the optical axis and their magnetization directions are the same. The magnetization directions of the first annular inner magnet and the first annular outer magnet are opposite.

[0015] Optionally, the magnetic circuit system includes a first magnetic circuit and a second magnetic circuit stacked along the optical axis of the lens. The first magnetic circuit is closer to the drive coil than the second magnetic circuit. The first magnetic circuit includes a first annular inner magnet and a first annular outer magnet spaced apart from the first annular inner magnet. The second magnetic circuit includes a second annular inner magnet and a second annular outer magnet spliced ​​together.

[0016] Both the first annular inner magnet and the second annular inner magnet are magnetized along the optical axis and their magnetization directions are the same. Both the first annular outer magnet and the second annular outer magnet are magnetized along the optical axis and their magnetization directions are the same. The magnetization directions of the first annular inner magnet and the first annular outer magnet are opposite.

[0017] Optionally, the magnetic circuit system is an integral magnetized magnet and includes an inner annular magnet, an outer annular magnet spaced apart from the inner annular magnet, and a non-magnetic part disposed between the inner annular magnet and the outer annular magnet;

[0018] Both the inner and outer annular magnets are magnetized along the optical axis, but their magnetization directions are opposite.

[0019] Optionally, the magnetic circuit system is an integral magnetized magnet and includes an inner annular magnet, an outer annular magnet, and an intermediate magnetic part disposed between the inner annular magnet and the outer annular magnet;

[0020] Both the inner and outer annular magnets are magnetized along the optical axis, but their magnetization directions are opposite. The intermediate magnetic part is magnetized in a direction perpendicular to the optical axis, and the polarity of the surface of the intermediate magnetic part near the outer annular magnet is the same as the polarity of the surface of the outer annular magnet facing the lens.

[0021] Optionally, the elastic support includes a first connecting portion connected to the bottom wall of the housing, a second connecting portion connected to the image sensor assembly, and a third connecting portion connecting the first connecting portion and the second connecting portion, the third connecting portion extending along the side wall of the housing; the first connecting portion bends from the third connecting portion and extends along the bottom wall, and the second connecting portion bends from the third connecting portion and extends along the surface of the image sensor assembly.

[0022] Optionally, the third connecting portion is frame-shaped, the first connecting portion bends from the outside of the third connecting portion and extends horizontally outward toward the frame, and the second connecting portion bends from the inside of the third connecting portion and extends horizontally inward toward the frame.

[0023] Optionally, the third connecting portion is frame-shaped, and both the first connecting portion and the second connecting portion are bent from the inside of the third connecting portion and extend horizontally toward the inside of the frame.

[0024] Furthermore, it also includes: a first reinforcing piece disposed at the bent portion of the first connecting portion; and / or the first reinforcing piece disposed at the bent portion of the second connecting portion.

[0025] Furthermore, the third connecting portion is rectangular; the imaging device also includes:

[0026] The second reinforcing piece is disposed on the inside of the bent portion of the rectangular third connecting part, and / or on the outside of the bent portion.

[0027] Optionally, the bracket includes a frame connected to the elastic support member, and a circuit board disposed on the frame and electrically connected to the elastic support member; the image sensor chip is disposed on the circuit board and electrically connected thereto.

[0028] Optionally, the bracket includes a frame connected to the elastic support member, and a circuit board disposed on the frame and electrically connected to the elastic support member;

[0029] The sidewall of the frame has a bent transition portion, the elastic support is connected to the bent transition portion to suspend the frame in the receiving space, and the second connection portion bends from the third connection portion at the bent transition portion and extends along the bent transition portion toward the inside of the frame.

[0030] Optionally, the frame has a mounting cavity for accommodating the drive coil or the magnetic circuit system on the side facing the bottom wall, and a support platform for supporting the circuit board on the side facing the top wall. The support platform and the mounting cavity are connected through an opening, and the first connecting part is disposed in the opening, and the surface of the first connecting part facing the circuit board is flush with the platform surface of the support platform.

[0031] Furthermore, the image sensor assembly also includes: a filter and a support frame for supporting the filter, the filter being disposed between the lens and the image sensor chip, and the support frame covering the image sensor chip and mounted on the circuit board.

[0032] Optionally, four drive coils are provided and are respectively arranged at intervals with the first magnetic circuit. The four drive coils are arranged at circumferential intervals along the first magnetic circuit, and the winding hole of each drive coil corresponds to the interval area between the first inner annular magnet and the first outer annular magnet.

[0033] Optionally, four drive coils are provided and are respectively arranged at intervals with the magnetic circuit system. The four drive coils are arranged at circumferential intervals along the magnetic circuit system, and the winding hole of each drive coil corresponds to the non-magnetic part.

[0034] Optionally, four drive coils are provided and are respectively arranged at intervals with the magnetic circuit system. The four drive coils are arranged at circumferential intervals along the magnetic circuit system, and the winding hole of each drive coil corresponds to the intermediate magnetic part.

[0035] The beneficial effects of the embodiments of this disclosure include:

[0036] In this invention, the fixed-focus image stabilization design employs a moving image sensor assembly, eliminating the need for additional movement space for the lens assembly. The image sensor assembly can move precisely within a smaller space, thus avoiding the need to increase the screen aperture size of the lens and effectively improving the screen-to-body ratio. Furthermore, compared to existing lens movement solutions, the projection of the driving assembly along the optical axis in this invention at least partially overlaps with the projection of the image sensor chip in the image sensor assembly. This fully utilizes the space between the image sensor chip and the driving assembly along the optical axis, significantly reducing the lateral space within the housing and facilitating device miniaturization. Moreover, since the image sensor assembly can move directly in a direction perpendicular to the optical axis, a larger optical axis adjustment range can be achieved, resulting in a larger field of view (FOV) with the same screen aperture size. Attached Figure Description

[0037] Figure 1 is a schematic diagram of the structure of an optical imaging device according to an embodiment of the present invention;

[0038] Figure 2 is a cross-sectional view of the optical imaging device shown in Figure 1 along the AA direction, which shows the positional relationship between the drive assembly, the image sensor assembly and the lens.

[0039] Figure 3 is an enlarged schematic diagram of part of the structure of the optical imaging device shown in Figure 2;

[0040] Figure 4 is a three-dimensional exploded view of the optical imaging device shown in Figure 1;

[0041] Figure 5 is a partial structural schematic diagram of an optical imaging device according to an embodiment of the present invention; wherein, the positional relationship of the driving component, the elastic support member and the image sensor chip is shown.

[0042] Figure 6 is an exploded three-dimensional view of the diagram shown in Figure 5;

[0043] Figure 7 is a schematic diagram of the structure of a driving component in one embodiment of the present invention;

[0044] Figure 8 is a perspective exploded view of the magnetic circuit system of one embodiment of the present invention;

[0045] Figure 9 is a cross-sectional view of a magnetic circuit system according to an embodiment of the present invention; the figure shows a first magnetic circuit made in a split manner and a second magnetic circuit made in an integrated manner using a four-pole magnetization process, and illustrates the magnetization direction of the first inner ring magnet, the first outer ring magnet, the second inner ring magnet, and the second outer ring magnet, wherein the magnetization direction is the direction of the arrow, that is, the direction from the S pole to the N pole.

[0046] Figure 10 is a cross-sectional view of a magnetic circuit system according to an embodiment of the present invention; the figure shows a first magnetic circuit made in a split manner and a second magnetic circuit made in an integral manner using a splicing process, and illustrates the magnetization direction of the first inner ring magnet, the first outer ring magnet, the second inner ring magnet and the second outer ring magnet, wherein the magnetization direction is the direction of the arrow, that is, the direction from the S pole to the N pole.

[0047] Figure 11 is a cross-sectional view of a magnetic circuit system according to an embodiment of the present invention; the figure shows the first magnetic circuit and the second magnetic circuit integrally manufactured using the Heilbeck process, and illustrates the first inner annular magnet, the first outer annular magnet, the second inner annular magnet, the second outer annular magnet, and the magnetization direction of the middle magnetic part, wherein the magnetization direction is the direction of the arrow, that is, the direction from the S pole to the N pole.

[0048] Figure 12 is a cross-sectional view of a magnetic circuit system according to an embodiment of the present invention; the figure shows a magnetic circuit system manufactured in one piece using a four-pole magnetization process, and illustrates the magnetization direction of the inner and outer annular magnets, wherein the magnetization direction is the direction of the arrow, that is, the direction from the S pole to the N pole;

[0049] Figure 13 is a cross-sectional view of a magnetic circuit system according to an embodiment of the present invention; the figure shows a magnetic circuit system manufactured in one piece using the Hellbeck process, and illustrates the inner annular magnet, the outer annular magnet, and the magnetization direction of the middle magnetic part, wherein the magnetization direction is the direction of the arrow, that is, the direction from the S pole to the N pole;

[0050] Figure 14 is a schematic diagram of the overall structure of the elastic support member in one embodiment of the present invention;

[0051] Figure 15 is a perspective exploded view of a portion of the structure of an optical imaging device according to an embodiment of the present invention; wherein the positional relationship of the image sensor chip, frame and circuit board is shown.

[0052] Figure 16 is a cross-sectional view of an optical imaging device according to another embodiment of the present invention along the AA direction, which shows the positional relationship between the driving component, the image sensor component and the lens.

[0053] Figure 17 is a partial enlarged schematic diagram of the optical imaging device shown in Figure 16;

[0054] Figure 18 is an exploded perspective view of the image sensor assembly, elastic support, and drive assembly shown in Figure 16.

[0055] Figure 19 is an exploded perspective view of a portion of the structure of an optical imaging device according to another embodiment of the present invention; wherein the positional relationship of the image sensor chip, frame and circuit board is shown.

[0056] Figure 20 is a partial enlarged schematic diagram of the optical imaging device shown in Figure 19;

[0057] Figure 21 is a structural schematic diagram of the elastic support and drive assembly shown in Figure 16;

[0058] Figure 22 is an exploded perspective view of the image sensor assembly, elastic support, and drive assembly shown in Figure 19.

[0059] Figure 23 is a schematic diagram of the magnetic circuit system shown in Figure 19;

[0060] Figure 24 is an exploded perspective view of the elastic support shown in Figure 22;

[0061] Figure 25 is a structural schematic diagram of the load-bearing frame shown in Figure 4.

[0062] In the figure, 100 is the optical imaging device; 10 is the housing; 20 is the lens; 30 is the image sensor assembly; 40 is the elastic support; 50 is the drive assembly; 60 is the first reinforcing plate; 70 is the second reinforcing plate; 11 is the receiving space; 12 is the top wall; 13 is the bottom wall; 14 is the side wall; 121 is the through hole; 21 is the optical axis; 31 is the image sensor chip; 32 is the bracket; 321 is the frame; 322 is the circuit board; 323 is the filter; 324 is the support frame; 3211 is the bending transition section; 3212 is the mounting cavity; 3213 is the support platform; 3214 is the opening; 321 31. Platform; 3241. Receiving cavity; 3242. Supporting groove; 41. First connecting part; 42. Second connecting part; 43. Third connecting part; 51. Magnetic circuit system; 52. Drive coil; 511. First magnetic circuit; 512. Second magnetic circuit; 513. Spacing area; 5111. First annular inner magnet; 5112. First annular outer magnet; 5121. Second annular inner magnet; 5122. Second annular outer magnet; 5123. Non-magnetic part; 5124. Splicing part; 514. Annular inner magnet; 515. Annular outer magnet; 516. Intermediate magnetic part; 521. Winding hole. Detailed Implementation

[0063] To enable those skilled in the art to better understand the technical solutions of this disclosure, the disclosure will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0064] The embodiments of this application will be further described in detail below with reference to the accompanying drawings and examples. The detailed descriptions and accompanying drawings of the following embodiments are used to exemplarily illustrate the principles of this application, but should not be used to limit the scope of this application; that is, this application is not limited to the described embodiments. In the description of this application, it should be noted that, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," etc., indicating orientation or positional relationships are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. "Vertical" is not strictly vertical, but within the allowable error range. "Parallel" is not strictly parallel, but within the allowable error range.

[0065] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application depending on the specific circumstances.

[0066] As shown in Figures 1-4, an optical imaging device 100 includes a driving device comprising a housing 10, a lens 20, an image sensor assembly 30, an elastic support 40, and a driving assembly 50.

[0067] The housing 10 has a receiving space 11. The housing 10 includes a top wall 12, a bottom wall 13 opposite to the top wall 12, and a side wall 14 connecting the top wall 12 and the bottom wall 13. The top wall 12 is provided with a through hole 121 that communicates the receiving space 11 with the outside. The lens 20 is fixed to the top wall 12 of the housing 10 and covers the through hole 121.

[0068] The image sensor assembly 30 is disposed in the housing space 11. The image sensor assembly 30 includes an image sensor chip 31 and a support 32 that carries the image sensor chip 31.

[0069] An elastic support 40 is disposed in the receiving space 11. The elastic support 40 connects the bottom wall 13 and the bracket 32 ​​to suspend the image sensor assembly 30 within the receiving space 11.

[0070] The drive assembly 50 is disposed in the housing space 11. When viewed along the optical axis 21 of the lens 20, the drive assembly 50 at least partially overlaps with the image sensor chip 31. The drive assembly 50 includes a magnetic circuit system 51 and a drive coil 52 disposed opposite to the magnetic circuit system 51. One of the drive coil 52 and the magnetic circuit system 51 is fixed to the bracket 32, and the other of the drive coil 52 and the magnetic circuit system 51 is fixed to the bottom wall 13 of the housing 10. The drive coil 52 and the magnetic circuit system 51 cooperate to drive the image sensor assembly 30 to move along the optical axis 21 perpendicular to the lens 20.

[0071] In this invention, the fixed-focus image stabilization design employs a movable image sensor assembly 30, eliminating the need for additional movement space for the lens 20 assembly. The image sensor assembly 30 can move precisely within a smaller space, thus avoiding the need to increase the screen aperture size of the lens 20 and effectively improving the screen-to-body ratio. Furthermore, compared to existing lens 20 movement schemes, the projection of the drive assembly 50 along the optical axis 21 in this invention at least partially overlaps with the projection of the image sensor chip 31 of the image sensor assembly 30. This fully utilizes the space between the image sensor chip 31 and the drive assembly 50 along the optical axis 21, significantly reducing the lateral space within the housing 10 and facilitating device miniaturization. Moreover, since the image sensor assembly 30 can move directly in the direction perpendicular to the optical axis 21, a larger adjustment range for the optical axis 21 can be achieved, resulting in a larger field of view (FOV) with the same screen aperture size.

[0072] Specifically, the axis of the through hole 121 in the top wall 12 of the housing 10 coincides with the optical axis 21 of the lens 20. The image sensor assembly 30 is arranged along the optical axis 21 of the lens 20 by means of the elastic support 40 and corresponds to the position of the lens 20.

[0073] In some embodiments, the drive coil 52 is electrically connected to the elastic support 40, thereby electrically connecting the circuit board 322 and the drive coil 52 through the elastic support 40.

[0074] In some embodiments, referring to Figures 7-8, the magnetic circuit system 51 includes a first magnetic circuit 511 and a second magnetic circuit 512 stacked along the optical axis 21 of the lens 20. The first magnetic circuit 511 is closer to the drive coil 52 than the second magnetic circuit 512. The first magnetic circuit 511 includes a first annular inner magnet 5111 and a first annular outer magnet 5112 spaced apart from the first annular inner magnet 5111. The second magnetic circuit 512 is a single magnetized magnet and includes a second annular inner magnet 5121, a second annular outer magnet 5122 spaced apart from the second annular inner magnet 5121, and a non-magnetic portion 5123 disposed between the second annular inner magnet 5121 and the second annular outer magnet 5122.

[0075] The first annular inner magnet 5111 and the second annular inner magnet 5121 are both magnetized along the optical axis 21 and their magnetization directions are the same. The first annular outer magnet 5112 and the second annular outer magnet 5122 are both magnetized along the optical axis 21 and their magnetization directions are the same. The magnetization directions of the first annular inner magnet 5111 and the first annular outer magnet 5112 are opposite.

[0076] Referring to Figures 9-11, in one embodiment of the present invention, both the first annular inner magnet 5111 and the second annular inner magnet 5121 are magnetized along the optical axis 21, and their magnetization directions are the same and both point towards the bottom wall 13. Similarly, both the first annular outer magnet 5112 and the second annular outer magnet 5122 are magnetized along the optical axis 21, and their magnetization directions are the same and both point towards the top wall 12. It can be understood that the first magnetic circuit 511 being closer to the drive coil 52 than the second magnetic circuit 512 means that along the optical axis 21, the first magnetic circuit 511 is spaced closer to the drive coil 52, while the second magnetic circuit 512 is farther from the drive coil 52 and is located on the side of the first magnetic circuit 511 opposite to the drive coil 52.

[0077] Specifically, the axis of the first annular outer magnet 5112 coincides with the axis of the first annular inner magnet 5111, so that the magnetic field distribution between the axis of the first annular outer magnet 5112 and the first annular inner magnet 5111 is more uniform.

[0078] Furthermore, both the first annular inner magnet 5111 and the first annular outer magnet 5112 are rectangular annular in shape. The first annular outer magnet 5112 has a rectangular inner annular space, and the first annular inner magnet 5111 has a circular inner annular space. The first annular inner magnet 5111 is disposed within the rectangular inner annular space. The first annular inner magnet 5111 and the first annular outer magnet 5112 together form a rectangular annular interval region 513, and the shape of the interval region 513 corresponds to the position of the drive coil 52.

[0079] Specifically, the axis of the second inner ring magnet 5121 coincides with the axis of the second outer ring magnet 5122, so that the magnetic field distribution between the second inner ring magnet 5121 and the second outer ring magnet 5122 is more uniform.

[0080] Furthermore, both the second annular inner magnet 5121 and the second annular outer magnet 5122 are rectangular annular in shape. The second annular outer magnet 5122 has a rectangular inner annular space, and the second annular inner magnet 5121 has a circular inner annular space. The second annular inner magnet 5121 is disposed within the rectangular inner annular space.

[0081] Referring to Figures 7 and 10, in some embodiments, the magnetic circuit system 51 includes a first magnetic circuit 511 and a second magnetic circuit 512 stacked along the optical axis 21 of the lens 20. The first magnetic circuit 511 is closer to the drive coil 52 than the second magnetic circuit 512. The first magnetic circuit 511 includes a first annular inner magnet 5111 and a first annular outer magnet 5112 spaced apart from the first annular inner magnet 5111. The second magnetic circuit 512 includes a second annular inner magnet 5121 and a second annular outer magnet 5122 spliced ​​together.

[0082] The first annular inner magnet 5111 and the second annular inner magnet 5121 are both magnetized along the optical axis 21 and their magnetization directions are the same. The first annular outer magnet 5121 and the second annular outer magnet 5122 are both magnetized along the optical axis 21 and their magnetization directions are the same. The magnetization directions of the first annular inner magnet 5111 and the first annular outer magnet 5121 are opposite.

[0083] Specifically, the second inner annular magnet 5121 and the second outer annular magnet 5122 are spliced ​​together by a splicing part 5124, and the splicing part 5124 corresponds to the interval 513 between the first inner annular magnet 5111 and the first outer annular magnet 5112.

[0084] Both the first annular inner magnet 5111 and the second annular inner magnet 5121 are magnetized along the optical axis 21, and their magnetization directions are the same and both point towards the bottom wall 13. Similarly, both the first annular outer magnet 5112 and the second annular outer magnet 5122 are magnetized along the optical axis 21, and their magnetization directions are the same and both point towards the top wall 12. It can be understood that the first magnetic circuit 511 being closer to the drive coil 52 than the second magnetic circuit 512 means that along the optical axis 21, the first magnetic circuit 511 is spaced close to the drive coil 52, while the second magnetic circuit 512 is located away from the drive coil 52 and is situated on the side of the first magnetic circuit 511 opposite to the drive coil 52.

[0085] In some embodiments, the first annular inner magnet 5111 and the first annular outer magnet 5112 are integrally formed using a quadrupole magnetization process. Specifically, along the direction pointing towards the optical axis 21, the end of the first annular inner magnet 5111 facing the top wall 12 is magnetized as the S pole, and the end of the first annular inner magnet 5111 facing away from the top wall 12 is magnetized as the N pole. The end of the first annular outer magnet 5112 facing the top wall 12 is magnetized as the N pole, and the end of the first annular outer magnet 5112 facing away from the top wall 12 is magnetized as the S pole, wherein the space between the first annular inner magnet 5111 and the first annular outer magnet 5112 is filled with a non-magnetic portion. It can be understood that quadrupole magnetization refers to magnetizing the magnets into four alternating magnetic poles (NSNS), forming four magnetic pole regions. This arrangement can ensure that the magnetic field is uniformly distributed in multiple directions, reducing magnetic field distortion. In addition, the multi-pole magnetic field can better cooperate with the drive coil 52 to provide a more concentrated electromagnetic force, improve driving efficiency and response speed, and make it easier to achieve fine magnetic field control, which helps to improve the accuracy and stability of the movement of the sensor assembly 20.

[0086] Referring to Figure 11, in some embodiments, the first annular inner magnet 5111 and the first annular outer magnet 5112 are integrally formed using a Hellbeck process. Specifically, along the direction pointing towards the optical axis 21, the end of the first annular inner magnet 5111 facing the top wall 12 is magnetized as the S pole, and the end of the first annular inner magnet 5111 away from the top wall 12 is magnetized as the N pole. The end of the first annular outer magnet 5112 facing the top wall 12 is magnetized as the N pole, and the end of the first annular outer magnet 5112 away from the top wall 12 is magnetized as the S pole. An intermediate magnetic portion is filled between the first annular inner magnet 5111 and the first annular outer magnet 5112. Along the direction perpendicular to the optical axis 21, the end of the intermediate magnetic portion near the first annular inner magnet 5111 is magnetized as the S pole, and the end of the intermediate magnetic portion near the first annular outer magnet 5112 is magnetized as the N pole.

[0087] Referring to Figure 9, in some embodiments, the second annular inner magnet 5121 and the second annular outer magnet 5122 are integrally formed using a four-pole magnetization process. Specifically, along the direction pointing towards the optical axis 21, the end of the second annular inner magnet 5121 facing the first magnetic circuit 511 is magnetized as the S pole, and the end of the second annular inner magnet 5121 away from the first magnetic circuit 511 is magnetized as the N pole. The end of the second annular outer magnet 5122 facing the first magnetic circuit 511 is magnetized as the N pole, and the end of the second annular outer magnet 5122 away from the first magnetic circuit 511 is magnetized as the S pole, wherein the first annular inner magnet 5111 and the first annular outer magnet 5112 are filled with a non-magnetic portion 5123.

[0088] Referring to Figure 11, in some embodiments, the second annular inner magnet 5121 and the second annular outer magnet 5122 are integrally formed using a Hellbeck process. Specifically, along the direction pointing towards the optical axis 21, the end of the second annular inner magnet 5121 facing the first magnetic circuit 511 is magnetized as the S pole, and the end of the second annular inner magnet 5121 away from the first magnetic circuit 511 is magnetized as the N pole. The end of the second annular outer magnet 5122 facing the first magnetic circuit 511 is magnetized as the N pole, and the end of the second annular outer magnet 5122 away from the first magnetic circuit 511 is magnetized as the S pole. An intermediate magnetic portion is filled between the second annular inner magnet 5121 and the second annular outer magnet 5122. Along the direction perpendicular to the optical axis 21, the end of the intermediate magnetic portion near the second annular inner magnet 5121 is magnetized as the S pole, and the end of the intermediate magnetic portion near the second annular outer magnet 5122 is magnetized as the N pole.

[0089] Referring to Figure 12, in some embodiments, the magnetic circuit system 51 is a single magnetized steel and includes an inner annular magnet 514, an outer annular magnet 515 spaced apart from the inner annular magnet 514, and a non-magnetic portion 5123 disposed between the inner annular magnet 514 and the outer annular magnet 515. Both the inner annular magnet 514 and the outer annular magnet 515 are magnetized along the optical axis 21, but their magnetization directions are opposite.

[0090] In one embodiment of the present invention, the inner annular magnet 514 is magnetized along the optical axis 21 and its magnetization direction points towards the top wall 12, and the outer annular magnet 515 is magnetized along the optical axis 21 and its magnetization direction points towards the bottom wall 13.

[0091] In some embodiments, the inner annular magnet 514 and the outer annular magnet 515 are integrally formed using a four-pole magnetization process. Specifically, along the direction pointing towards the optical axis 21, the end of the inner annular magnet 514 facing the top wall 12 is magnetized as the N pole, and the end of the inner annular magnet 514 away from the top wall 12 is magnetized as the S pole. The end of the outer annular magnet 515 facing the top wall 12 is magnetized as the S pole, and the end of the outer annular magnet 515 away from the top wall 12 is magnetized as the N pole. The inner annular magnet 514 and the outer annular magnet 515 are filled with a non-magnetic portion 5123.

[0092] Referring to Figures 13 and 23, in some embodiments, the magnetic circuit system 51 is a single magnetized magnet and includes an inner annular magnet 514, an outer annular magnet 515, and an intermediate magnetic portion 516 disposed between the inner annular magnet 514 and the outer annular magnet 515. Both the inner annular magnet 514 and the outer annular magnet 515 are magnetized along the optical axis 21, but in opposite directions. The intermediate magnetic portion 516 is magnetized in a direction perpendicular to the optical axis 21, and the polarity of the surface of the intermediate magnetic portion near the outer annular magnet 515 is the same as the polarity of the surface of the outer annular magnet 515 facing the lens.

[0093] In one embodiment of the present invention, the inner annular magnet 514 is magnetized along the optical axis 21 and its magnetization direction points towards the top wall 12, the outer annular magnet 515 is magnetized along the optical axis 21 and its magnetization direction points towards the bottom wall 13, and the middle magnetic part 516 is magnetized in a direction perpendicular to the optical axis 21, and the polarity of the surface of the middle magnetic part 516 near the outer annular magnet 515 is the same as the polarity of the surface of the outer annular magnet 515 facing the lens, wherein the magnetization direction of the middle magnetic part 516 points from the outer annular magnet 515 to the inner annular magnet 514.

[0094] Specifically, the inner annular magnet 514 and the outer annular magnet 515 are integrally formed using a Hellbeck process. Specifically, along the direction pointing towards the optical axis 21, the end of the inner annular magnet 514 facing the top wall 12 is magnetized as the N pole, and the end facing away from the top wall 12 is magnetized as the S pole. The end of the outer annular magnet 515 facing the top wall 12 is magnetized as the S pole, and the end facing away from the top wall 12 is magnetized as the N pole. An intermediate magnetic portion 516 fills the space between the inner and outer annular magnets 514 and 515. Along the direction perpendicular to the optical axis 21, the end of the intermediate magnetic portion 516 closest to the inner annular magnet 514 is magnetized as the N pole, and the end of the intermediate magnetic portion 516 closest to the outer annular magnet 515 is magnetized as the S pole.

[0095] In some embodiments, the first annular inner magnet 5111 and the first annular outer magnet 5112 of the first magnetic circuit 511 are designed separately, and the second annular inner magnet 5121 and the second annular outer magnet 5122 of the second magnetic circuit 512 are also designed separately. It is understood that the first annular inner magnet 5111 and the first annular outer magnet 5112 are designed separately, meaning that both are fabricated individually and assembled to form the first magnetic circuit 511. Similarly, the second annular inner magnet 5121 and the second annular outer magnet 5122 of the second magnetic circuit 512 are designed separately, meaning that both are fabricated individually and assembled to form the second magnetic circuit 512.

[0096] In some embodiments, the first annular inner magnet 5111 and the first annular outer magnet 5112 of the first magnetic circuit 511 are designed separately, while the second annular inner magnet 5121 and the second annular outer magnet 5122 of the second magnetic circuit 512 are designed as a single unit. It is understood that the second magnetic circuit 512 is integrally formed using the four-pole magnetization process described in the above embodiments, or integrally formed using a 5124 splicing process.

[0097] In some embodiments, the first annular inner magnet 5111 and the first annular outer magnet 5112 of the first magnetic circuit 511 are integrated into one piece, and the second annular inner magnet 5121 and the second annular outer magnet 5122 of the second magnetic circuit 512 are also integrated into one piece. That is, both the first magnetic circuit 511 and the second magnetic circuit 512 are integrally formed using the four-pole magnetization process described in the above embodiments, or both are integrally formed using the Heilbeck process.

[0098] Referring to Figures 14 and 24, in some embodiments, the elastic support 40 includes a first connecting portion 41 connected to the bottom wall 13 of the housing 10, a second connecting portion 42 connected to the image sensor assembly 30, and a third connecting portion 43 connecting the first connecting portion 41 and the second connecting portion 42. The third connecting portion 43 extends along the side wall 14 of the housing 10, the first connecting portion 41 bends from the third connecting portion 43 and extends along the bottom wall 13, and the second connecting portion 42 bends from the third connecting portion 43 and extends along the surface of the image sensor assembly 30.

[0099] Specifically, the first connecting part 41 bends from the lower edge of the third connecting part 43 and extends along the upper surface of the bottom wall 13, the second connecting part 42 bends from the upper edge of the third connecting part 43 and extends along the lower surface of the circuit board 322, and the third connecting part 43 can be attached to the side wall 14 or extend along the optical axis 21 at a certain distance from the side wall.

[0100] Referring specifically to Figure 14, in some embodiments, the third connecting portion 43 is frame-shaped, the first connecting portion 41 bends from the outside of the third connecting portion 43 and extends horizontally outward from the frame, and the second connecting portion 42 bends from the inside of the third connecting portion 43 and extends horizontally inward from the frame. It can be understood that the inside of the third connecting portion 43 is the side inside the frame, and the outside of the third connecting portion 43 is the side outside the frame.

[0101] An embodiment of the present invention includes: a third connecting portion 43 in the shape of a rectangular frame, a first connecting portion 41 and a second connecting portion 42 both in the shape of a sheet, the first connecting portion 41 being bent from the outside of the third connecting portion 43 and extending horizontally outward toward the frame until it is connected to the bottom wall 13 of the housing 10, and the second connecting portion 42 being bent from the inside of the third connecting portion 43 and extending horizontally inward toward the frame until it is connected to the lower surface of the circuit board 322.

[0102] Referring specifically to Figure 24, in some embodiments, the third connecting portion 43 is frame-shaped, and the first connecting portion 41 and the second connecting portion 42 are both bent from the inside of the third connecting portion 43 and extend horizontally toward the inside of the frame.

[0103] An embodiment of the present invention includes: a third connecting portion 43 in the shape of a rectangular frame, a first connecting portion 41 and a second connecting portion 42 both in the shape of a sheet, the first connecting portion 41 bending inward from the lower edge of the third connecting portion 43 and extending horizontally toward the inside of the frame until it is connected to the bottom wall 13 of the housing 10, and the second connecting portion 42 bending inward from the upper edge of the third connecting portion 43 and extending horizontally toward the inside of the frame until it is connected to the lower surface of the circuit board 322.

[0104] Referring to Figures 22 and 24, in some embodiments, the optical imaging device 100 further includes a first reinforcing piece 60 disposed at the bent portion of the first connecting portion 41, and / or the first reinforcing piece 60 disposed at the bent portion of the second connecting portion 42. The first reinforcing piece 60 has a curvature adapted to the bent portions of the first connecting portion 41 and the second connecting portion 42.

[0105] One embodiment of the present invention includes: a first reinforcing piece 60 disposed at the bent portion of the first connecting portion 41 to enhance the structural strength of the bent portion of the first connecting portion 41.

[0106] Another embodiment of the present invention includes: a first reinforcing piece 60 disposed at the bent portion of the second connecting portion 42 to enhance the structural strength of the bent portion of the second connecting portion 42.

[0107] Another embodiment of the present invention includes: a first reinforcing piece 60 is simultaneously disposed at the bending portions of the first connecting portion 41 and the second connecting portion 42 to enhance the structural strength of the bending portions of the first connecting portion 41 and the second connecting portion 42.

[0108] In some embodiments, the third connecting portion 43 is rectangular, and the imaging device further includes a second reinforcing plate 70, which is disposed inside the bent portion of the rectangular third connecting portion 43 and / or outside the bent portion. It is understood that the rectangular third connecting portion 43 has four bent portions along the circumferential direction.

[0109] One embodiment of the present invention includes: a second reinforcing piece 70 is provided on the inner side of the bending portion of the third connecting portion 43 to enhance the structural strength of the bending portion of the third connecting portion 43.

[0110] Another embodiment of the present invention includes: a second reinforcing piece 70 is provided on the outer side of the bending portion of the third connecting portion 43 to enhance the structural strength of the bending portion of the third connecting portion 43.

[0111] Another embodiment of the present invention includes: the third connecting portion 43 is provided with a second reinforcing piece 70 on both the outer side and the outer side of the bent portion, for enhancing the structural strength of the bent portion of the third connecting portion 43.

[0112] In some embodiments, the bracket 32 ​​includes a frame 321 connected to the elastic support 40, and a circuit board 322 disposed on the frame 321 and electrically connected to the elastic support 40, wherein the image sensor chip 31 is disposed on the circuit board 322 and electrically connected thereto.

[0113] It is understood that in other embodiments, the circuit board 322 is used only as a support, with one side electrically connected to the elastic support 40 and the other side used to support the image sensor chip 31, so as to connect the image sensor chip 31 to the elastic support 40 and suspend the image sensor chip 31 in the receiving space.

[0114] Referring to Figures 5 and 15, 19 and 21, in one embodiment of the present invention, the bracket 32 ​​includes a frame 321 connected to an elastic support 40, and a circuit board 322 disposed on the frame 321 and electrically connected to the elastic support 40.

[0115] The side wall 14 of the frame 321 has a bent transition portion 3211. An elastic support member 40 is connected to the bent transition portion 3211 to suspend the frame 321 in the receiving space 11. The second connecting portion 42 bends from the third connecting portion 43 at the bent transition portion 3211 and extends along the bent transition portion 3211 toward the inside of the frame. The curvature of the bent transition portion 3211 is consistent with the curvature of the bent portion of the second connecting portion 42.

[0116] In some embodiments, the frame 321 has a mounting cavity 3212 for accommodating the drive coil 52 or the magnetic circuit system 51 on the side facing the bottom wall 13, and a support platform 3213 for supporting the circuit board 322 on the side facing the top wall 12. The support platform 3213 and the mounting cavity 3212 are connected through an opening 3214. A first connecting part 41 is provided in the opening 3214, and the surface of the first connecting part 41 facing the circuit board 322 is flush with the table surface 32131 of the support platform 3213.

[0117] Referring to Figures 4 and 25, in some embodiments, the image sensor assembly 30 further includes a filter 323 and a support frame 324 for carrying the filter 323. The filter 323 is disposed between the lens 20 and the image sensor chip 31, and the support frame 324 covers the image sensor chip 31 and is mounted on the circuit board 322.

[0118] Specifically, the support frame 324 has a receiving cavity 3241 for accommodating the image sensor chip 31 and a supporting groove 3242 for accommodating the filter 323. The receiving cavity 3241 and the supporting groove 3242 are connected through the opening of the receiving cavity 3241, and the size of the supporting groove 3242 is adapted to the size of the filter 323. Along the optical axis 21, the projection of the support frame 324 completely covers the projection of the image sensor chip 31 and the projection of the filter 323.

[0119] In some embodiments, four drive coils 52 are provided and are respectively spaced and corresponding to the first magnetic circuit 511. The four drive coils 52 are arranged circumferentially along the first magnetic circuit 511, and the winding hole 521 of each drive coil 52 corresponds to the interval 513 between the first annular inner magnet 5111 and the first annular outer magnet 5112.

[0120] Referring to Figures 5-7 and 14, one embodiment of the present invention includes: a magnetic circuit system 51 and a drive coil 52 are spaced apart within a mounting cavity 3212 of a frame 321 along the optical axis 21. The upper surface of the second connecting portion 42 of the elastic support member 40 is electrically connected to a circuit board 322, and the lower surface of the second connecting portion 42 is electrically connected to the drive coil 52. The magnetic circuit system 51 is disposed on the bottom wall 13. The drive assembly 50 includes four drive coils 52 and a ring-shaped magnetic circuit system 51. The four drive coils 52 are respectively spaced apart from a first magnetic circuit 511, and the four drive coils 52 are arranged circumferentially along the first magnetic circuit 511. The winding hole 521 of each drive coil 52 corresponds to the gap 513 between the inner magnet 5111 and the outer magnet 5112 of the first ring.

[0121] Referring to Figures 16-18, one embodiment of the present invention includes: a magnetic circuit system 51 and a drive coil 52 are spaced apart in the mounting cavity 3212 of a frame 321 along the optical axis 21. The upper surface of the second connecting portion 42 of the elastic support member 40 is electrically connected to the circuit board 322, and the magnetic circuit system 51 is disposed on the lower surface of the second connecting portion 42. The drive coil 52 is disposed on the upper surface of the first connecting portion 41 of the elastic support member 40, so as to be electrically connected to the circuit board 322 through the elastic support member 40. The drive assembly 50 includes four drive coils 52 and a ring-shaped magnetic circuit system 51. The four drive coils 50 are respectively spaced apart from the first magnetic circuit 511, and the four drive coils 52 are arranged circumferentially along the first magnetic circuit 511. The winding hole 521 of each drive coil 52 corresponds to the interval 513 between the inner magnet 5111 and the outer magnet 5112 of the first ring.

[0122] Another embodiment of the present invention includes: along the optical axis 21, a magnetic circuit system 51 and a drive coil 52 are spaced apart within the mounting cavity 3212 of the frame 321, wherein the upper surface of the second connecting portion 42 of the elastic support member 40 is electrically connected to the circuit board 322, and the lower surface of the second connecting portion 42 is electrically connected to the drive coil 52, and the magnetic circuit system 51 is disposed on the bottom wall 13. The drive assembly 50 includes four drive coils 52 and a ring-shaped magnetic circuit system 51. The four drive coils 50 are respectively spaced apart from the first magnetic circuit 511, and the four drive coils 52 are arranged circumferentially along the first magnetic circuit 511. The winding hole 521 of each drive coil 52 corresponds to the gap area 513 between the first annular inner magnet 5111 and the first annular outer magnet 5112, and the splicing portion 5124 between the second annular inner magnet 5121 and the second annular outer magnet 5122 (as shown in FIG10).

[0123] Another embodiment of the present invention includes: along the optical axis 21, a magnetic circuit system 51 and a drive coil 52 are spaced apart in the mounting cavity 3212 of the frame 321, wherein the upper surface of the second connecting portion 42 of the elastic support member 40 is electrically connected to the circuit board 322, the lower surface of the second connecting portion 42 is provided with the magnetic circuit system 51, and the drive coil 52 is provided on the upper surface of the first connecting portion 41 of the elastic support member 40 so as to be electrically connected to the circuit board 322 through the elastic support member 40. The drive assembly 50 includes four drive coils 52 and a ring-shaped magnetic circuit system 51. The four drive coils 50 are respectively arranged at intervals with the first magnetic circuit 511, and the four drive coils 52 are arranged circumferentially along the first magnetic circuit 511. The winding hole 521 of each drive coil 52 corresponds to the interval area 513 between the first inner ring magnet 5111 and the first outer ring magnet 5112, and the splicing part 5124 between the second inner ring magnet 5121 and the second outer ring magnet 5122 (as shown in Figure 10).

[0124] In some embodiments, four drive coils 52 are provided and are respectively arranged at intervals with the magnetic circuit system 51. The four drive coils 52 are arranged at circumferential intervals along the magnetic circuit system 51, and the winding hole 521 of each drive coil 52 corresponds to the non-magnetic part 5123.

[0125] One embodiment of the present invention includes: a magnetic circuit system 51 and a drive coil 52 are spaced apart and disposed within a mounting cavity 3212 of a frame 321 along the optical axis 21. The upper surface of the second connecting portion 42 of the elastic support member 40 is electrically connected to a circuit board 322, and the lower surface of the second connecting portion 42 is electrically connected to the drive coil 52. The magnetic circuit system 51 is disposed on the bottom wall 13. The drive assembly 50 includes four drive coils 52 and a ring-shaped magnetic circuit system 51. The four drive coils 50 are respectively spaced apart from the magnetic circuit system 51, and the four drive coils 52 are arranged circumferentially along the magnetic circuit system 51. The winding hole 521 of each drive coil 52 corresponds to the non-magnetic portion 5123 between the inner annular magnet 514 and the outer annular magnet 515.

[0126] Referring to Figures 20-22, another embodiment of the present invention includes: along the optical axis 21, a magnetic circuit system 51 and a drive coil 52 are spaced apart within the mounting cavity 3212 of a frame 321. The upper surface of the second connecting portion 42 of the elastic support member 40 is electrically connected to the circuit board 322. The magnetic circuit system 51 is disposed on the lower surface of the second connecting portion 42. The drive coil 52 is disposed on the upper surface of the first connecting portion 41 of the elastic support member 40, so as to be electrically connected to the circuit board 322 through the elastic support member 40. The drive assembly 50 includes four drive coils 52 and a ring-shaped magnetic circuit system 51. The four drive coils 50 are respectively spaced apart from the magnetic circuit system 51, and the four drive coils 52 are arranged circumferentially along the magnetic circuit system 51. The winding hole 521 of each drive coil 52 corresponds to the non-magnetic portion 5123 between the inner annular magnet 514 and the outer annular magnet 515.

[0127] In some embodiments, four drive coils 52 are provided and are respectively arranged at intervals with the magnetic circuit system 51. The four drive coils 52 are arranged at circumferential intervals along the magnetic circuit system 51, and the winding hole 521 of each drive coil 52 corresponds to the central magnetic part 516.

[0128] One embodiment of the present invention includes: a magnetic circuit system 51 and a drive coil 52 are spaced apart and disposed within a mounting cavity 3212 of a frame 321 along the optical axis 21. The upper surface of the second connecting portion 42 of the elastic support member 40 is electrically connected to a circuit board 322, and the lower surface of the second connecting portion 42 is electrically connected to the drive coil 52. The magnetic circuit system 51 is disposed on the bottom wall 13. The drive assembly 50 includes four drive coils 52 and a ring-shaped magnetic circuit system 51. The four drive coils 50 are respectively spaced apart from the magnetic circuit system 51, and the four drive coils 52 are arranged circumferentially along a first magnetic circuit 511. The winding hole 521 of each drive coil 52 corresponds to the intermediate magnetic portion 516 between the inner annular magnet 514 and the outer annular magnet 515.

[0129] Another embodiment of the present invention includes: along the optical axis 21, a magnetic circuit system 51 and a drive coil 52 are spaced apart within the mounting cavity 3212 of a frame 321. The upper surface of the second connecting portion 42 of the elastic support member 40 is electrically connected to the circuit board 322. The magnetic circuit system 51 is disposed on the lower surface of the second connecting portion 42. The drive coil 52 is disposed on the upper surface of the first connecting portion 41 of the elastic support member 40, so as to be electrically connected to the circuit board 322 through the elastic support member 40. The drive assembly 50 includes four drive coils 52 and a ring-shaped magnetic circuit system 51. The four drive coils 50 are respectively spaced apart from the magnetic circuit system 51, and the four drive coils 52 are arranged circumferentially along the magnetic circuit system 51. The winding hole 521 of each drive coil 52 corresponds to the intermediate magnetic portion 516 between the inner annular magnet 514 and the outer annular magnet 515.

[0130] The elastic support 40 has a flexible circuit board printed on it so that the elastic support 40 can conduct current from the image sensor assembly 30 to the drive coil 52.

[0131] A second aspect of the present invention provides AR glasses, which include the optical imaging device 100 described above.

[0132] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of this disclosure, and this disclosure is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and substance of this disclosure, and these modifications and improvements are also considered to be within the scope of protection of this disclosure.

Claims

1. An optical imaging device, characterized in that, include: A housing having a receiving space, the housing including a top wall, a bottom wall disposed opposite to the top wall, and a side wall connecting the top wall and the bottom wall, the top wall being provided with a through hole communicating the receiving space with the outside; The lens is fixed to the top wall of the housing and covers the through hole; An image sensor assembly is disposed in the receiving space, the image sensor assembly including an image sensor chip and a bracket supporting the image sensor chip; An elastic support member is disposed in the receiving space, the elastic support member connecting the bottom wall and the bracket to suspend the image sensor assembly within the receiving space; A driving assembly is disposed in the receiving space and viewed along the optical axis of the lens. The driving assembly at least partially overlaps with the image sensor chip. The driving assembly includes a magnetic circuit system and a driving coil disposed opposite to the magnetic circuit system. One of the driving coil and the magnetic circuit system is fixed to the bracket, and the other of the driving coil and the magnetic circuit system is fixed to the bottom wall of the housing. The driving coil cooperates with the magnetic circuit system to drive the image sensor assembly to move along a direction perpendicular to the optical axis of the lens.

2. An optical imaging device according to claim 1, characterized in that, The drive coil is electrically connected to the elastic support.

3. An optical imaging device according to claim 1, characterized in that, The magnetic circuit system includes a first magnetic circuit and a second magnetic circuit stacked along the optical axis of the lens. The first magnetic circuit is closer to the drive coil than the second magnetic circuit. The first magnetic circuit includes a first annular inner magnet and a first annular outer magnet spaced apart from the first annular inner magnet. The second magnetic circuit is an integrally magnetized magnet and includes a second annular inner magnet, a second annular outer magnet spaced apart from the second annular inner magnet, and a non-magnetic part disposed between the second annular inner magnet and the second annular outer magnet. Both the first annular inner magnet and the second annular inner magnet are magnetized along the optical axis and their magnetization directions are the same. Both the first annular outer magnet and the second annular outer magnet are magnetized along the optical axis and their magnetization directions are the same. The magnetization directions of the first annular inner magnet and the first annular outer magnet are opposite.

4. An optical imaging device according to claim 1, characterized in that, The magnetic circuit system includes a first magnetic circuit and a second magnetic circuit stacked along the optical axis of the lens. The first magnetic circuit is closer to the drive coil than the second magnetic circuit. The first magnetic circuit includes a first annular inner magnet and a first annular outer magnet spaced apart from the first annular inner magnet. The second magnetic circuit includes a second annular inner magnet and a second annular outer magnet spliced ​​together. Both the first annular inner magnet and the second annular inner magnet are magnetized along the optical axis and their magnetization directions are the same. Both the first annular outer magnet and the second annular outer magnet are magnetized along the optical axis and their magnetization directions are the same. The magnetization directions of the first annular inner magnet and the first annular outer magnet are opposite.

5. An optical imaging device according to claim 1 or 2, characterized in that, The magnetic circuit system is a single magnetized steel and includes an inner annular magnet, an outer annular magnet spaced apart from the inner annular magnet, and a non-magnetic part disposed between the inner annular magnet and the outer annular magnet; Both the inner and outer annular magnets are magnetized along the optical axis, but their magnetization directions are opposite.

6. An optical imaging device according to claim 1 or 2, characterized in that, The magnetic circuit system is an integral magnetized magnet and includes an inner annular magnet, an outer annular magnet, and an intermediate magnetic part disposed between the inner annular magnet and the outer annular magnet; Both the inner and outer annular magnets are magnetized along the optical axis, but their magnetization directions are opposite. The intermediate magnetic part is magnetized in a direction perpendicular to the optical axis, and the polarity of the surface of the intermediate magnetic part near the outer annular magnet is the same as the polarity of the surface of the outer annular magnet facing the lens.

7. An optical imaging device according to claim 1 or 2, characterized in that, The elastic support includes a first connecting portion connected to the bottom wall of the housing, a second connecting portion connected to the image sensor assembly, and a third connecting portion connecting the first connecting portion and the second connecting portion, the third connecting portion extending along the side wall of the housing; the first connecting portion bends from the third connecting portion and extends along the bottom wall, and the second connecting portion bends from the third connecting portion and extends along the surface of the image sensor assembly.

8. An optical imaging device according to claim 7, characterized in that, The third connecting part is frame-shaped, the first connecting part bends from the outside of the third connecting part and extends horizontally outward toward the frame, and the second connecting part bends from the inside of the third connecting part and extends horizontally inward toward the frame.

9. An optical imaging device according to claim 7, characterized in that, The third connecting part is frame-shaped, and both the first connecting part and the second connecting part are bent from the inside of the third connecting part and extend horizontally toward the inside of the frame.

10. An optical imaging device according to claim 7, characterized in that, Also includes: A first reinforcing piece is disposed at the bent portion of the first connecting part; and / or the first reinforcing piece is disposed at the bent portion of the second connecting part.

11. An optical imaging device according to claim 7, characterized in that, The third connecting portion is rectangular; the imaging device further includes: The second reinforcing piece is disposed on the inside of the bent portion of the rectangular third connecting part, and / or on the outside of the bent portion.

12. An optical imaging device according to claim 1, characterized in that, The bracket includes a frame connected to the elastic support member, and a circuit board disposed on the frame and electrically connected to the elastic support member; the image sensor chip is disposed on the circuit board and electrically connected thereto.

13. An optical imaging device according to claim 7, characterized in that, The bracket includes a frame connected to the elastic support member, and a circuit board disposed on the frame and electrically connected to the elastic support member; The sidewall of the frame has a bent transition portion, the elastic support is connected to the bent transition portion to suspend the frame in the receiving space, and the second connection portion bends from the third connection portion at the bent transition portion and extends along the bent transition portion toward the inside of the frame.

14. An optical imaging device according to claim 13, characterized in that, The frame has a mounting cavity for accommodating the drive coil or the magnetic circuit system on the side facing the bottom wall, and a support platform for supporting the circuit board on the side facing the top wall. The support platform and the mounting cavity are connected through an opening. The first connecting part is disposed in the opening, and the surface of the first connecting part facing the circuit board is flush with the platform surface of the support platform.

15. An optical imaging device according to claim 12, characterized in that, The image sensor assembly further includes: a filter and a support frame for supporting the filter, the filter being disposed between the lens and the image sensor chip, and the support frame covering the image sensor chip and mounted on the circuit board.

16. An optical imaging device according to any one of claims 3 and 4, characterized in that, The driving coil is provided with four coils, which are respectively arranged at intervals with the first magnetic circuit. The four driving coils are arranged at circumferential intervals along the first magnetic circuit, and the winding hole of each driving coil corresponds to the interval area between the first inner annular magnet and the first outer annular magnet.

17. An optical imaging device according to claim 5, characterized in that, The driving coils are provided in four and are respectively arranged at intervals with the magnetic circuit system. The four driving coils are arranged at circumferential intervals along the magnetic circuit system, and the winding hole of each driving coil corresponds to the non-magnetic part.

18. An optical imaging device according to claim 6, characterized in that, The driving coils are provided in four and are respectively arranged at intervals with the magnetic circuit system. The four driving coils are arranged at circumferential intervals along the magnetic circuit system, and the winding hole of each driving coil corresponds to the middle magnetic part.

Images