Array substrate, light-emitting substrate, and display device

Abstract

The present application provides an array substrate, a light-emitting substrate, and a display device. The array substrate comprises a base, a protruding portion, a first reflective layer, a second reflective layer, and a conductive layer. The base comprises a first surface and a second surface opposite to each other. The first surface is provided with a recess. The protruding portion is located in the recess and spaced apart from a side surface of the recess. In a direction from the first surface to the second surface, the area of a cross section of the protruding portion parallel to the second surface gradually increases. The first reflective layer at least covers a side surface of the protruding portion. The second reflective layer is located on the side of the base distant from the second surface, the second reflective layer is provided with an opening, and the orthographic projection of one opening on the second surface is located within the orthographic projection of one recess on the second surface. The conductive layer is located on the side of the second reflective layer facing away from the base, and the conductive layer comprises a conductive pad. A color conversion layer is located on the side of the conductive layer facing the base, and the color conversion layer is made of a fluorescent material.

Description

Array substrate, light-emitting substrate and display device Technical Field

[0001] This application relates to the field of display technology, and in particular to an array substrate, a light-emitting substrate, and a display device. Background Technology

[0002] With the development of LED technology, light-emitting substrates using LEDs at the sub-millimeter (Mini) or even micrometer (Micro) scale have been widely applied. This allows products utilizing these substrates, such as liquid crystal displays (LCDs), to achieve screen contrast levels comparable to organic light-emitting diode (OLED) displays, while retaining the technological advantages of LCDs, thus enhancing display quality and providing users with a superior visual experience. Summary of the Invention

[0003] This application provides an array substrate, a light-emitting substrate, and a display device.

[0004] According to a first aspect of the embodiments of this application, an array substrate is provided. The array substrate includes:

[0005] The substrate includes opposing first and second surfaces; the first surface is provided with a groove.

[0006] A protrusion is located within the groove and spaced apart from the side surface of the groove; in the direction from the first surface to the second surface, the area of ​​the cross section of the protrusion parallel to the second surface gradually increases;

[0007] The first reflective layer covers at least the side surface of the protrusion;

[0008] The second reflective layer is located on the side of the substrate away from the second surface. The second reflective layer has an opening, and the orthographic projection of the opening on the second surface is located within the orthographic projection of the groove on the second surface.

[0009] A conductive layer is located on the side of the second reflective layer opposite to the substrate, and the conductive layer includes a conductive pad;

[0010] A color conversion layer is located on the side of the conductive layer facing the substrate, and the material of the color conversion layer is a fluorescent material.

[0011] In one embodiment, the color conversion layer is located on the side of the second reflective layer away from the substrate, and the orthographic projection of the color conversion layer on the second surface covers the orthographic projection of the opening on the second surface.

[0012] In one embodiment, the orthographic projection of the color conversion layer on the second surface covers the orthographic projection of the second reflective layer on the second surface and the orthographic projection of the opening on the second surface.

[0013] In one embodiment, the color conversion layer is located within the groove, and the array substrate further includes an auxiliary layer located on the side of the groove away from the first surface, the auxiliary layer being configured to reflect at least a portion of the incident light; a portion of the orthographic projection of the color conversion layer on the second surface falls outside the orthographic projection of the first reflective layer on the second surface and falls within the orthographic projection of the auxiliary layer on the second surface.

[0014] In one embodiment, the auxiliary layer is provided with a through hole, and the orthographic projection of the through hole on the second surface falls within the orthographic projection of the first reflective layer on the second surface.

[0015] In one embodiment, the edge of the orthographic projection of the through-hole on the second surface is located inside the outer edge of the orthographic projection of the first reflective layer on the second surface.

[0016] In one embodiment, the auxiliary layer is a semi-permeable membrane or a metal membrane.

[0017] In one embodiment, the outer edge of the orthographic projection of the auxiliary layer on the second surface is the first edge, the outer edge of the orthographic projection of the color conversion layer on the second surface is the second edge, and the first edge is located outside the second edge.

[0018] In one embodiment, the auxiliary layer is a semi-permeable membrane, and the distance between the first edge and the second edge is greater than or equal to the distance from the surface of the color conversion layer away from the second surface to the auxiliary layer.

[0019] In one embodiment, the auxiliary layer is a metal layer, and the width of the auxiliary layer is less than 100 μm.

[0020] In one embodiment, the auxiliary layer includes a plurality of inorganic layers stacked together, the plurality of inorganic layers including alternating first inorganic layers and second inorganic layers, wherein the refractive index of the first inorganic layer is less than the refractive index of the second inorganic layer.

[0021] In one embodiment, the orthographic projection of the opening on the second surface falls within the orthographic projection of the first reflective layer on the second surface.

[0022] In one embodiment, the array substrate further includes a planarization layer, a portion of which is located within the opening and a portion of which is located on the side of the second reflective layer away from the substrate.

[0023] In one embodiment, the second reflective layer includes a first reflective portion, the orthographic projection of the first reflective portion on the second surface does not overlap with the orthographic projection of the groove on the second surface, and the surface of the first reflective portion facing the substrate is provided with a plurality of uniform light structures arranged in an array.

[0024] According to a second aspect of the present application, a light-emitting substrate is provided, the light-emitting substrate including a plurality of light-emitting elements and the array substrate described above; the light-emitting elements include a plurality of pins, each of the pins being bonded to a conductive pad.

[0025] According to a third aspect of the present application, a display device is provided, the display device including a display panel and the above-described light-emitting substrate; the display panel is located on the side of the substrate away from the light-emitting element.

[0026] The array substrate, light-emitting substrate, and display device provided in this application embodiment have the following advantages: Since the cross-section of the protrusion located in the groove of the substrate gradually increases in the direction from the first surface to the second surface, light incident from one side of the first surface of the substrate onto the side of the protrusion covered by the first reflective layer is reflected by the first reflective layer. The light reflected by the first reflective layer is then incident on the second reflective layer and reflected again. A portion of the light reflected by the second reflective layer exits directly through the surface of the substrate away from the second reflective layer, while the other portion exits through the second surface of the substrate after multiple reflections within the substrate. This improves the uniformity of the emitted light, thus eliminating the need for a uniform light film layer or reducing the number of uniform light film layers on the array substrate, which is beneficial for reducing the thickness of the array substrate. Furthermore, since the color conversion layer is made of a fluorescent material, which has good water and oxygen resistance, the array substrate does not need an encapsulation layer for encapsulating the color conversion layer, further reducing the thickness of the array substrate and lowering its manufacturing cost. Attached Figure Description

[0027] Figure 1 is a partial cross-sectional view of an array substrate provided in an exemplary embodiment of this application;

[0028] Figure 2 is a partial cross-sectional view of an array substrate provided in another exemplary embodiment of this application;

[0029] Figure 3 is a partial cross-sectional view of an array substrate provided in another exemplary embodiment of this application;

[0030] Figure 4 is a top view of an array substrate provided in an exemplary embodiment of this application;

[0031] Figure 5 is a top view of a portion of the structure of the array substrate shown in Figure 3;

[0032] Figure 6 is a partial cross-sectional view of an array substrate provided in another exemplary embodiment of this application;

[0033] Figure 7 is a partial cross-sectional view of an array substrate provided in another exemplary embodiment of this application;

[0034] Figure 8 is a partial enlarged view of the array substrate shown in Figure 6;

[0035] Figure 9 is a partial enlarged view of the array substrate shown in Figure 7;

[0036] Figure 10 is a partial cross-sectional view of the first intermediate structure of the array substrate provided in an exemplary embodiment of this application;

[0037] Figure 11 is a partial top view of the first intermediate structure of the array substrate provided in an exemplary embodiment of this application;

[0038] Figure 12 is a partial cross-sectional view of the second intermediate structure of the array substrate provided in an exemplary embodiment of this application;

[0039] Figure 13 is a partial cross-sectional view of the third intermediate structure of the array substrate provided in an exemplary embodiment of this application;

[0040] Figure 14 is a partial cross-sectional view of the fourth intermediate structure of the array substrate provided in an exemplary embodiment of this application;

[0041] Figure 15 is a partial cross-sectional view of the fifth intermediate structure of the array substrate provided in an exemplary embodiment of this application;

[0042] Figure 16 is a partial cross-sectional view of the sixth intermediate structure of the array substrate provided in an exemplary embodiment of this application;

[0043] Figure 17 is a partial cross-sectional view of the seventh intermediate structure of the array substrate provided in an exemplary embodiment of this application;

[0044] Figure 18 is a partial cross-sectional view of the eighth intermediate structure of the array substrate provided in an exemplary embodiment of this application;

[0045] Figure 19 is a partial cross-sectional view of the ninth intermediate structure of the array substrate provided in an exemplary embodiment of this application;

[0046] Figure 20 is a partial cross-sectional view of a light-emitting substrate provided in an exemplary embodiment of this application;

[0047] Figure 21 is a top view of a light-emitting substrate provided in an exemplary embodiment of this application. Detailed Implementation

[0048] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0049] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The singular forms “a,” “the,” and “the” used in this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0050] It should be understood that although the terms first, second, third, etc., may be used in this application to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, without departing from the scope of this application, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "when," "when," or "in response to determination."

[0051] This application provides an array substrate, a light-emitting substrate, and a display device. The array substrate, light-emitting substrate, and display device of this application will be described in detail below with reference to the accompanying drawings. Unless otherwise specified, the features in the following embodiments can complement or combine with each other.

[0052] This application provides an array substrate. As shown in Figures 1 to 3, the array substrate includes a substrate 10, a protrusion 20, a first reflective layer 50, a second reflective layer 30, a conductive layer 40, and a color conversion layer 60.

[0053] The substrate 10 includes a first surface 101 and a second surface 102 opposite to each other. The first surface 101 has a groove 11. The protrusion 20 is located within the groove 11 and is spaced apart from the side surface of the groove 11. In the direction from the first surface 101 to the second surface 102, the area of ​​the cross section of the protrusion 20 parallel to the second surface 102 gradually increases. The first reflective layer 50 at least covers the side surface of the protrusion 20. The second reflective layer 30 is located on the side of the substrate 10 away from the second surface 102. The second reflective layer 30 has an opening 303. The orthographic projection of the opening 303 on the second surface 102 of the substrate 10 lies within the orthographic projection of the groove 11 on the second surface 102 of the substrate 10. The conductive layer 40 is located on the side of the second reflective layer 30 away from the substrate 10. The conductive layer 40 includes a conductive pad 41. The color conversion layer 60 is located on the side of the conductive layer 40 facing the substrate 10. The material of the color conversion layer 60 is a fluorescent material.

[0054] The array substrate provided in this application embodiment has an array substrate in which the cross-section of the protrusion 20 located in the groove 11 of the substrate 10 gradually increases in the direction from the first surface 101 of the substrate 10 to the second surface 102. As a result, light incident from one side of the first surface 101 of the substrate 10 onto the side of the first reflective layer 50 covering the protrusion 20 is reflected by the first reflective layer 50. The light reflected by the first reflective layer 50 is then incident onto the second reflective layer 30 and reflected again. Part of the light reflected by the second reflective layer 30 passes directly through the surface of the substrate 10 away from the second reflective layer 30 and exits. The other part of the light is reflected multiple times within the substrate 10 and exits through the second surface 102 of the substrate 10. This improves the uniformity of the emitted light. Thus, the array substrate can be without a light-diffusing film layer or have a reduced number of light-diffusing film layers, which is beneficial for reducing the thickness of the array substrate. Since the material of the color conversion layer 60 is a fluorescent material, which has good water and oxygen resistance, the array substrate can be without an encapsulation layer for encapsulating the color conversion layer 60, which can further reduce the thickness of the array substrate and reduce the manufacturing cost of the array substrate.

[0055] In this embodiment, the side surface of the groove 11 refers to the continuous portion of the inner surface of the groove 11, and the side surface of the groove 11 is opposite to the protrusion 20; the bottom surface of the groove 11 refers to the continuous portion of the inner surface of the groove 11, the bottom surface of the groove 11 is not opposite to the protrusion 20, and the bottom surface of the groove 11 is continuous with the bottom surface of the protrusion 20. The distance from any point on the bottom surface of the groove 11 to the second surface 102 of the substrate 10 is not greater than the distance from any point on the side surface to the second surface 102 of the substrate 10.

[0056] In one embodiment, the refractive index of the substrate 10 is greater than that of air. With this configuration, when light reflected by the second reflective layer 30 is incident on the second surface 102 of the substrate 10, a portion of the light can undergo total internal reflection and be re-incidentally incident on the second reflective layer 30. This further improves the uniformity of the emitted light. In some embodiments, the material of the substrate 10 can be any one of glass, quartz, polymethyl methacrylate (PMMA), etc.

[0057] In one embodiment, the distance from the surface of the protrusion 20 away from the second surface 102 to the second surface 102 is less than or equal to the distance from the first surface 101 to the second surface 102. In the embodiments shown in Figures 1 to 3 and Figure 7, the distance from the surface of the protrusion 20 away from the second surface 102 to the second surface 102 is less than the distance from the first surface 101 to the second surface 102. In the embodiment shown in Figure 6, the distance from the surface of the protrusion 20 away from the second surface 102 to the second surface 102 is equal to the distance from the first surface 101 to the second surface 102.

[0058] In one embodiment, the material of the protrusion 20 is the same as or similar to the material of the substrate 10, which can improve the optical consistency of the structure at the corresponding position.

[0059] Further, as shown in FIG1, the protrusion 20 and the substrate 10 are integrally formed. In another embodiment, as shown in FIG2, the protrusion 20 and the substrate 10 are not integrally formed.

[0060] In one embodiment, the longitudinal cross-sectional shape of the protrusion 20 includes a quasi-arc, a quasi-straight, or a quasi-broken line profile. "Quasi-arc" means having a generally arc-shaped form, but is not limited to a standard arc. That is, "arc" here includes not only the shape of a basic arc, but also shapes resembling arcs. For example, some points in the longitudinal cross-section of the protrusion 20 are not on the same circle as other points. "Quasi-straight" means being generally straight, but is not limited to a standard straight line. That is, "straight" here includes not only the shape of a basic straight line, but also shapes resembling straight lines. For example, some points in the longitudinal cross-section of the protrusion 20 are not on the same straight line as other points. "Quasi-broken line" means being generally broken, but is not limited to a standard broken line. That is, "broken line" here includes not only the shape of a basic broken line, but also shapes resembling broken lines. For example, a segment in the longitudinal cross-section of the protrusion 20 is arc-shaped. "Longitudinal" refers to the direction perpendicular to the second surface 102 of the substrate.

[0061] In one embodiment, as shown in FIG4, the substrate 10 is provided with a plurality of spaced grooves 11, and the second reflective layer 30 is provided with a plurality of openings 303. The openings 303 correspond one-to-one with the grooves 11, and the orthographic projection of each opening 303 on the second surface 102 of the substrate 10 lies within the orthographic projection of the corresponding groove 11 on the second surface 102 of the substrate 10. It should be noted that FIG4 is a schematic diagram, and in reality, the number of grooves 11 on the array substrate is much greater than the number of grooves 11 shown in FIG4.

[0062] In one embodiment, as shown in FIG4, the orthographic projection of each of the openings 303 on the second surface 102 falls within the orthographic projection of a first reflective layer 50 on the second surface 102. This arrangement allows the first reflective layer 50 to reflect more light, helping to improve the uniformity of the emitted light.

[0063] In one embodiment, in the direction from the first surface 101 to the second surface 102, the area of ​​the groove 11 parallel to the cross section of the second surface 102 gradually decreases.

[0064] In one embodiment, as shown in Figures 1 to 3, the area surrounding the protrusion 20 on the bottom surface of the groove 11 is a plane.

[0065] In one embodiment, the line connecting the geometric center of the protrusion 20 and the geometric center of the groove 11 is perpendicular to the second surface 102 of the substrate 10.

[0066] Furthermore, the center of the orthographic projection of the protrusion 20 on the second surface 102 of the substrate 10 coincides with the center of the orthographic projection of the groove 11 on the second surface 102 of the substrate 10.

[0067] Further, as shown in FIG4, the outer contour of the orthographic projection of the protrusion 20 on the second surface 102 of the substrate 10 is circular, and the outer contour of the orthographic projection of the groove 11 on the second surface 102 of the substrate 10 is circular; the center of the outer contour of the orthographic projection of the protrusion 20 on the second surface 102 of the substrate 10 coincides with the center of the outer contour of the orthographic projection of the groove 11 on the second surface 102 of the substrate 10.

[0068] Furthermore, the protrusion 20 includes a vertex, and the orthographic projection of the vertex of the protrusion 20 on the second surface 102 of the substrate 10 coincides with the center of the orthographic projection of the groove 11 on the second surface 102 of the substrate 10.

[0069] In one embodiment, the ratio of the radius of the outer contour of the orthographic projection of the protrusion 20 on the second surface 102 of the substrate 10 to the radius of the outer contour of the orthographic projection of the groove 11 on the second surface 102 of the substrate 10 is less than 0.5.

[0070] In one embodiment, as shown in Figures 1 to 3, the edge of the orthographic projection of the opening 303 of the second reflective layer 30 onto the second surface 102 of the substrate 10 is located inside the edge of the orthographic projection of the corresponding groove 11 onto the second surface 102 of the substrate 10. With this configuration, a portion of the light reflected by the first reflective layer 50 enters the portion of the second reflective layer 30 opposite to the groove 11 and ultimately exits from the surface of the substrate 10 away from the second reflective layer 30. This configuration helps improve light efficiency compared to a scheme where the second reflective layer 30 does not include the portion opposite to the groove 11.

[0071] In one embodiment, the conductive layer 40 further includes a plurality of signal lines for providing signals to the inorganic light-emitting diode and / or the driver chip. The plurality of signal lines may include a common voltage line, a drive voltage line, a source power supply line, a source address line, a clock signal line, a data line, etc. In some embodiments, the thickness of the conductive layer 40 may range from 2 μm to 7 μm.

[0072] In one embodiment, when the light emitted by the light-emitting element in the light-emitting substrate where the array substrate is located is non-white light, the color conversion layer 60 converts the non-white light into white light under the excitation of the non-white light, so as to improve the utilization rate of light energy.

[0073] In one embodiment, as shown in Figures 1 and 2, the color conversion layer 60 is located on the side of the second reflective layer 30 away from the substrate 10. The orthographic projection of the color conversion layer 60 on the second surface 102 covers the orthographic projection of the opening 303 on the second surface 102. Since the orthographic projection of the color conversion layer 60 on the second surface 102 covers the orthographic projection of the opening 303 on the second surface 102, the light entering the groove 11 through the opening 303 must first pass through the color conversion layer 60, ensuring that the final emitted light is basically the converted light.

[0074] In one embodiment, as shown in Figures 1 and 2, the orthographic projection of the color conversion layer 60 on the second surface 102 overlaps with the orthographic projection of the second reflective layer 30 on the second surface 102 and the orthographic projection of the opening 303 on the second surface 102. That is, the color conversion layer 60 is a full-surface film. This configuration eliminates the need for a photomask when forming the color conversion layer 60, helping to reduce the fabrication cost of the array substrate. In some embodiments, a coating process can be used to form the color conversion layer 60.

[0075] In one embodiment, as shown in Figures 1 and 2, the orthographic projection of the opening 303 of the second reflective layer 30 onto the second surface 102 falls within the orthographic projection of the first reflective layer 50 onto the second surface 102. With this configuration, almost all the light rays incident into the groove 11 through the opening 303 are incident onto the first reflective layer 50 and reflected, effectively improving the uniformity of the emitted light.

[0076] Furthermore, the orthographic projection of the second reflective layer 30 on the second surface 102 overlaps with the orthographic projection of the first reflective layer 50 on the second surface 102. This further improves the uniformity of the emitted light.

[0077] In one embodiment, as shown in Figures 1 and 2, the array substrate further includes a transparent organic layer 71 filled within the groove 11. The transmittance of the transparent organic layer 71 may be greater than or equal to 95%, and the refractive index of the transparent organic layer is less than the refractive index of the substrate 10.

[0078] In one embodiment, as shown in Figures 1 and 2, the array substrate further includes a planarization layer 72, which is partially located within the opening 303 and partially located on the side of the second reflective layer 30 away from the substrate 10. The surface of the planarization layer 72 away from the substrate 10 can be substantially planar. The planarization layer 72 can improve the film formation quality of the color conversion layer 60. When the material of the second reflective layer 30 includes a conductive material, the signal interference of the second reflective layer 30 to the conductive layer 40 can be reduced because the planarization layer 72 covers the second reflective layer 30.

[0079] In some embodiments, the material of the planarization layer 72 may be an inorganic material or an organic material.

[0080] In one embodiment, as shown in FIG3, the color conversion layer 60 is located within the groove 11. This further reduces the thickness of the array substrate.

[0081] Further, as shown in FIG3, the array substrate further includes an auxiliary layer 73 located on the side of the groove 11 away from the first surface 101. The auxiliary layer 73 is configured to reflect at least part of the incident light. A portion of the orthographic projection of the color conversion layer 60 on the second surface 102 falls outside the orthographic projection of the first reflective layer 50 on the second surface 102, and falls within the orthographic projection of the auxiliary layer 73 on the second surface 102. Light incident on the color conversion layer 60 through the opening 303 of the second reflective layer 30 excites the color conversion layer 60. The light emitted by the color conversion layer 60 is directed in various directions. Some light will exit from the outer region of the first reflective layer 50 toward the second surface 102. If this part of the light is directly emitted, it will cause the brightness of the light-emitting substrate in the region surrounding the first reflective layer 50 to be relatively large, visually presenting a bright ring, affecting the light emission uniformity of the light-emitting substrate and the user experience. By providing the auxiliary layer 73, at least part of the light is reflected by the auxiliary layer 73 when it propagates from the outer region of the first reflective layer 50 toward the second surface 102, which can improve the problem of high brightness of the light-emitting substrate in the region surrounding the first reflective layer 50.

[0082] In one embodiment, the auxiliary layer 73 is a semi-permeable film or a metal film. When the auxiliary layer 73 is a semi-permeable film, some light can pass through, thus preventing dark areas from appearing on the light-emitting substrate; when the auxiliary layer 73 is a metal film, almost all the light incident on the auxiliary layer 73 is reflected. In some embodiments, the transmittance of the semi-permeable film is no more than 5%. In some embodiments, the material of the metal film may be silver or the like.

[0083] In one embodiment, as shown in Figures 3 and 5, the auxiliary layer 73 is provided with a through hole 731. The orthographic projection of the through hole 731 on the second surface 102 falls within the orthographic projection of the first reflective layer 50 on the second surface 102. By providing the through hole 731 in the auxiliary layer 73, some light can be emitted through the through hole 731, avoiding a large dark area in the area corresponding to the first reflective layer 50 on the light-emitting substrate. Since the orthographic projection of the through hole 731 on the second surface 102 falls within the orthographic projection of the first reflective layer 50 on the second surface 102, the problem of excessive brightness in some areas of the light-emitting substrate can be avoided, as the light emitted by the color conversion layer 60 directly passes through the gap between the first reflective layer 50 and the auxiliary layer 73.

[0084] Furthermore, as shown in Figure 3, the edge of the orthographic projection of the through-hole 731 on the second surface 102 is located inside the edge of the orthographic projection of the first reflective layer 50 on the second surface 102. This arrangement can more effectively prevent the light emitted by the color conversion layer 60 from directly exiting through the gap between the first reflective layer 50 and the auxiliary layer 73, thus avoiding the problem of excessive brightness in some areas of the light-emitting substrate.

[0085] In one embodiment, as shown in FIG5, the outer edge of the orthographic projection of the auxiliary layer 73 on the second surface 102 is the first edge 732, and the outer edge of the orthographic projection of the color conversion layer 60 on the second surface 102 is the second edge 601, with the first edge 732 located outside the second edge 601. This arrangement allows more light emitted by the color conversion layer 60 to enter the auxiliary layer 73, reducing the amount of light emitted by the color conversion layer 60 that directly exits through the second surface 102, further improving the problem of excessive brightness in certain areas of the light-emitting substrate.

[0086] Furthermore, when the auxiliary layer 73 is a semi-permeable film, the distance between the first edge 732 and the second edge 601 is the first distance, and the distance from the surface of the color conversion layer 60 away from the second surface 102 to the auxiliary layer 73 is the second distance; the first distance is greater than or equal to the second distance. When the substrate 10 is made of glass, in the light emitted by the color conversion layer 60, when the incident angle to the second surface 102 is greater than or equal to 45°, total internal reflection will occur; when the incident angle to the second surface 102 is less than 45°, the light can exit through the second surface 102. By setting the first distance to be greater than or equal to the second distance, almost all the light emitted by the color conversion layer 60 that propagates from the periphery of the first reflective layer 50 to the second surface 102 with an incident angle less than 45° can be incident on the auxiliary layer 73, thus effectively improving the problem of high brightness in some areas of the light-emitting substrate.

[0087] In one embodiment, as shown in FIG3, the auxiliary layer 73 is located on the side of the second surface 102 of the substrate 10 away from the first surface 101. In this way, the auxiliary layer 73 is directly formed on the second surface 102, which reduces the difficulty of fabricating the auxiliary layer 73.

[0088] In one embodiment, when the auxiliary layer 73 is a metal layer, the width of the auxiliary layer 73 is less than 100 μm. This avoids the auxiliary layer 73 being too large, which would result in a noticeable dark area visible to the human eye when observing the light-emitting substrate.

[0089] In one embodiment, the auxiliary layer 73 comprises a plurality of stacked inorganic layers, including alternating first and second inorganic layers, wherein the refractive index of the first inorganic layer is less than that of the second inorganic layer. With this configuration, the auxiliary layer 73 constitutes a DBR (Distributed Bragg Reflector), which can selectively reflect light of specific wavelengths, thereby improving the color purity of the emitted light.

[0090] In one embodiment, as shown in FIG3, the array substrate further includes a planarization layer 72, which is located on the side of the conductive layer 40 facing the substrate 10. Specifically, the planarization layer 72 is located between the conductive layer 40 and the substrate 10. The planarization layer 72 partially fills the openings 303 of the second reflective layer 30 and partially is located on the side of the second reflective layer 30 away from the substrate 10. The surface of the planarization layer 72 away from the substrate 10 can be substantially planar. The planarization layer 72 can improve the film formation quality of the conductive layer 40; and the planarization layer 72 can prevent the conductive layer 40 from directly contacting the second reflective layer 30, thus avoiding short circuits between different conductive pads 41, and can also reduce signal interference from the second reflective layer 30 to the conductive layer 40.

[0091] In one embodiment, the first reflective layer 50 includes a first metal film layer. The reflectivity of the first metal film layer is greater than or equal to 85%, and its material may include at least one of aluminum, silver, copper, and platinum. In some embodiments, the first reflective layer 50 further includes a first transparent metal oxide layer located on the side of the first metal film layer facing the substrate 10, and a second transparent metal oxide layer located on the side of the first metal film layer away from the substrate 10. The materials of the first transparent metal oxide layer and the second transparent metal oxide layer may be indium tin oxide or indium zinc oxide, which can prevent the first metal film layer from being oxidized and causing a decrease in its reflectivity. In other embodiments, the material of the first reflective layer 50 may include white ink and / or silicone-based white adhesive.

[0092] In one embodiment, as shown in Figures 1 to 3, the second reflective layer 30 includes a second metal film layer 31. The reflectivity of the second metal film layer 31 is greater than or equal to 85%, and its material may include at least one of aluminum, silver, copper, and platinum. In some embodiments, the second reflective layer 30 further includes a third transparent metal oxide layer 32 located on the side of the second metal film layer 31 facing the substrate 10, and a fourth transparent metal oxide layer 33 located on the side of the second metal film layer 31 away from the substrate 10. The materials of the third transparent metal oxide layer 32 and the fourth transparent metal oxide layer 33 may be indium tin oxide or indium zinc oxide, which can prevent the second metal film layer 31 from being oxidized, thus reducing its reflectivity. In other embodiments, the material of the second reflective layer 30 may include white ink and / or silicone-based white adhesive.

[0093] In one embodiment, as shown in Figures 1 to 3, the second reflective layer 30 includes a first reflective portion 301 and a second reflective portion 302. The orthographic projection of the first reflective portion 301 on the second surface 102 of the substrate 10 does not overlap with the orthographic projection of the groove 11 on the second surface 102 of the substrate 10. The orthographic projection of the second reflective portion 302 on the second surface 102 of the substrate 10 falls within the orthographic projection of the groove 11 on the second surface 102 of the substrate 10.

[0094] In one embodiment, as shown in Figures 1 to 3, the first reflective portion 301 and the second reflective portion 302 respectively include a first metal film layer 31, a third transparent metal oxide layer 32 and a portion of a fourth transparent metal oxide layer 33. The first metal film layer 31 of the first reflective portion 301 is continuous with the first metal film layer 31 of the second reflective portion 302, the third transparent metal oxide layer 32 of the first reflective portion 301 is continuous with the third transparent metal oxide layer 32 of the second reflective portion 302, and the fourth transparent metal oxide layer 33 of the first reflective portion 301 is continuous with the fourth transparent metal oxide layer 33 of the second reflective portion 302.

[0095] In one embodiment, as shown in Figures 6 and 7, the surface of the first reflective portion 301 facing the substrate is provided with a plurality of uniform light structures 311 arranged in an array. The uniform light structures 311 can disperse the light incident on the second reflective layer 30 to scatter it in various directions. Specifically, the light reflected by the first reflective layer 50 is dispersed by the uniform light structures 311 after incident on the second reflective layer 30, changing the propagation direction of the light, and after being reflected by the second reflective layer 30, it exits through the second surface 102 of the substrate 10 away from the second reflective layer 30, which can improve the brightness uniformity of the light-emitting substrate.

[0096] In one embodiment, the light-diffusing structure 311 is uniformly dispersed at various points on the surface of the first reflective portion 301 facing the substrate 10, and the distance between the light-diffusing structure 311 closest to the edge of the groove 11 and the groove 11 is less than or equal to 5 μm. This arrangement avoids a large distance between the light-diffusing structure 311 and the groove 11, which would prevent light reflected by the first reflective layer 50 from reaching the light-diffusing structure 311 when incident on the area between the light-diffusing structure 311 and the groove 11, thus preventing sufficient scattering of this portion of the light.

[0097] In one embodiment, the ratio of the maximum width to the height of the light-diffusing structure in the direction parallel to the second surface ranges from 1.5 to 3.5. This configuration results in better light-diffusing effect. In some embodiments, the ratio is 1.5, 2, 2.5, 3, 3.5, etc.

[0098] In one embodiment, as shown in Figures 7 and 9, the light-diffusing structure 311 includes a plurality of arrayed recessed structures 312, and the array substrate further includes a plurality of support portions 13 located between the second reflective layer 30 and the substrate 10, the plurality of support portions 13 being arrayed. The second reflective layer 30 is in direct contact with the support portions 13. The provision of the support portions 13 facilitates the formation of the recessed structures 312.

[0099] In one embodiment, the support portion 13 may be made of a transparent resin material. The maximum dimension of the cross-section of the support portion 13 parallel to the second surface of the substrate 10 ranges from 5 μm to 50 μm. This configuration allows for better light uniformity in the formed uniform light structure 311, and also makes the support portion 13 easier to fabricate. In some embodiments, the maximum dimension of the cross-section of the support portion 13 parallel to the surface of the substrate 10 is 5 μm, 15 μm, 25 μm, 35 μm, 45 μm, 50 μm, etc.

[0100] In one embodiment, as shown in Figures 7 and 9, the recessed structure 312 is formed on the surface of the third transparent metal oxide layer 32 facing the substrate 10, and the regions opposite to the second metal film layer 31 and the fourth transparent metal oxide layer 33 also have recessed structures.

[0101] In one embodiment, the support portion 13 may be generally conical, pyramidal, or spherical cap in shape. "Generally conical and pyramidal" means that it is generally conical or pyramidal in shape, but is not limited to standard conical or pyramidal shapes. That is, "conical and pyramidal" here includes not only the shapes of basic cones and pyramids, but also shapes similar to cones and pyramids. For example, the apex of a conical or pyramidal shape is a curved surface. "Generally spherical cap" means that it is generally spherical cap in shape, but is not limited to a standard spherical cap. That is, "spherical cap" here includes not only the shape of a basic spherical cap, but also shapes similar to spherical caps. For example, the upper half of a spherical cap is a standard spherical cap, and the lower half is a cylinder.

[0102] In one embodiment, as shown in Figures 6 and 8, the light-diffusing structure 311 includes a plurality of arrayed protrusions 313 facing the substrate 10, and a plurality of arrayed recesses 12 are provided on the surface of the substrate 10 facing the conductive layer 40, with the protrusions 313 located within the recesses 12. Each protrusion 313 corresponds one-to-one with a recess 12, with each protrusion 313 located within its corresponding recess 12. The formation of the protrusions 313 is facilitated by providing recesses 12 on the surface of the substrate 10.

[0103] In one embodiment, as shown in Figures 6 and 8, the protrusion structure 313 is formed on the side of the third transparent metal oxide layer 32 facing the substrate 10, and the regions opposite to the second metal film layer 31 and the fourth transparent metal oxide layer 33 also have protrusion structures.

[0104] In one embodiment, the shape of the protrusion may be approximately one of a cone, a pyramid, and a spherical cap.

[0105] In one embodiment, as shown in Figures 1 to 3, the array substrate further includes an alignment structure 74 located between the substrate 10 and the second reflective layer 30. The alignment structure 74 facilitates mask alignment during the array substrate fabrication process. The alignment structure can be made of amorphous silicon. The thickness of the alignment structure can be approximately 1000 angstroms.

[0106] In one embodiment, the thickness of the first reflective layer 50 is approximately 6000 angstroms; the thickness of the second reflective layer 30 is approximately 1500 angstroms; when the color conversion layer 60 is located between the substrate 10 and the second reflective layer 30, the thickness of the color conversion layer 60 is approximately 20 μm to 30 μm; and the thickness of the auxiliary layer 73 is approximately 1500 angstroms.

[0107] In one embodiment, as shown in FIG1, a portion of the longitudinal cross-section of the surface of the groove 11 is an arc, the radius of which is a first dimension d1; a portion of the longitudinal cross-section of the surface of the groove 11 may be a straight line, with the arc connected to the straight line and the arc located on the side of the straight line away from the second surface 102. The depth of the groove is h; the longitudinal cross-section of the side and bottom surfaces of the protrusion 20 is an arc, the radius of which is a second dimension d2, and the first dimension d1, the second dimension d2, and the depth h of the groove 11 are all equal.

[0108] In the embodiments of this application, the cross-sectional views shown in Figures 1 to 3, 6 and 7 are schematic diagrams obtained by cutting the array substrate shown in Figure 4 along AA.

[0109] This application also provides a method for fabricating an array substrate.

[0110] The following describes the detailed process of the fabrication method using the array substrate shown in Figure 7 as an example:

[0111] First, a mask layer is formed on the substrate.

[0112] This step yields the first intermediate structure shown in Figures 10 and 11. As shown in Figures 10 and 11, a mask layer 81 is disposed on the first surface of a substrate 82. The mask layer 81 includes a first mask portion 811 and a second mask portion 812. The first mask portion 811 has a through-hole, and the second mask portion 812 is located within the through-hole of the first mask portion 811, with a gap between the second mask portion 812 and the first mask portion 811. The surface of the second mask portion 812 may be circular, the through-hole of the first mask portion 811 may be circular, and the center of the surface of the second mask portion 812 may coincide with the center of the through-hole of the first mask portion 811. The diameter of the surface of the second mask portion 812 is D1, the diameter of the through-hole of the first mask portion 811 may be D2, and the distance between the edge of the through-hole of the first mask portion 811 and the edge of the second mask portion 812 is a, then D2 = D1 + 2a.

[0113] In some embodiments, D1 ≥ 5 μm. The value of D1 is related to the height of the subsequently formed protrusion; the larger D1 is, the greater the height of the formed protrusion. By setting D1 ≥ 5 μm, it is possible to avoid the protrusion being too small, which would result in the first reflective layer covering the side of the protrusion being too small, causing less light emitted by the light-emitting element to be reflected by the first reflective layer and failing to effectively improve the uniformity of the light.

[0114] In one embodiment, a ≥ 2 μm. This setting avoids the distance between the edge of the through hole of the first mask portion 811 and the edge of the second mask portion 812 being too small, which would affect the contact between the etching solution and the substrate.

[0115] In one embodiment, the mask layer 81 may be made of a metal, such as molybdenum. A photomask may be used to form the mask layer.

[0116] Subsequently, a wet etching process is used to etch the substrate to form grooves, resulting in a substrate including the grooves and protrusions located within the grooves.

[0117] In this step, the etching solution contacts the substrate 82 through the gap between the first mask portion 811 and the second mask portion 812, and etches the substrate 82. Due to the presence of the second mask portion 812, the area of ​​the substrate 82 covered by it is not completely etched away; the retained area is the protrusion. This step yields the second intermediate structure shown in Figure 12. As shown in Figure 12, both the substrate 10 and the protrusion 20 are part of the substrate 82, meaning that the substrate 10 and the protrusion 20 are integrally formed; there is a gap between the protrusion 20 and the side of the groove 11. In this step, the etching solution etches the second mask portion 812 simultaneously with the substrate 82. After the etching of the substrate 82 is completed, the second mask portion 812 can be completely etched away.

[0118] Then, the first mask portion is removed.

[0119] This step yields the third intermediate structure shown in Figure 13. In this step, a wet etching process can be used to remove the first mask portion 811.

[0120] Subsequently, a first reflective layer is formed within the groove.

[0121] This step yields the fourth intermediate structure shown in Figure 14. In this step, a mask can be used to form the first reflective layer 50.

[0122] Subsequently, a transparent organic layer is formed within the groove.

[0123] This step yields the fifth intermediate structure shown in Figure 15. As shown in Figure 15, the transparent organic layer 71 fills the groove 11. The transparent organic layer can be formed using a dispensing process.

[0124] Subsequently, a plurality of support portions are formed on the surface of the substrate.

[0125] This step yields the sixth intermediate structure shown in Figure 16. In this step, a mask can be used to form the support portion.

[0126] Subsequently, a second reflective layer is formed.

[0127] This step yields the seventh intermediate structure shown in Figure 17. As shown in Figure 17, a uniform light structure 311 is formed in the area of ​​the second reflective layer 30 that contacts the support portion 13 on the surface facing the substrate. The uniform light structure 311 is a recessed structure.

[0128] Subsequently, a flat layer is formed.

[0129] This step yields the eighth intermediate structure shown in Figure 18.

[0130] Subsequently, a color conversion layer is formed.

[0131] This step yields the ninth intermediate structure shown in Figure 19.

[0132] Subsequently, a conductive layer is formed.

[0133] This step yields the array substrate shown in Figure 7.

[0134] The embodiments of the array substrate fabrication method provided in this application belong to the same inventive concept as the embodiments of the array substrate. The relevant details and beneficial effects can be referred to each other, and will not be repeated here.

[0135] This application also provides a light-emitting substrate. The light-emitting substrate includes a plurality of light-emitting elements and an array substrate as described in any of the above embodiments. The array substrate in the light-emitting substrate shown in FIG20 is the array substrate shown in FIG1, but is not limited thereto. As shown in FIG20, the light-emitting element 91 includes a plurality of pins 911, each of the pins 911 being bonded to a conductive pad 41.

[0136] In one embodiment, as shown in FIG20, the light-emitting element 91 includes a light-emitting region 912. The orthographic projection of the light-emitting region 912 on the second surface 102 of the substrate 10 falls within the orthographic projection of a groove 11 on the second surface 102 of the substrate 10. It should be noted that the light-emitting region 912 refers to the area where the light emitted by the light-emitting element 91 can be emitted when it is working. The pins 911 of the light-emitting element 91 are typically made of a metal or alloy material with good conductivity. The light emitted by the light-emitting element 91 can be emitted from all areas except the area where the pins 911 are located. In FIG20, the light-emitting region 912 is located between the pins 911; however, this light-emitting region 912 is not necessarily a regular area in practice.

[0137] In one embodiment, the edge of the orthographic projection of the light-emitting area of ​​each light-emitting element 91 onto the second surface 102 of the substrate 10 is located inside the edge of the orthographic projection of an opening 303 of the second reflective layer 30 onto the second surface 102 of the substrate 10. This arrangement prevents light emitted by the light-emitting element 91 from being reflected off the surface of the second reflective layer 30 away from the substrate 10, thus helping to reduce light loss.

[0138] In one embodiment, as shown in FIG20, the light-emitting substrate further includes a third reflective layer 93, which covers the light-emitting element 91, and has a light-emitting aperture 931 on the side of the third reflective layer 93 facing the array substrate. The orthographic projection of the light-emitting area 912 of the light-emitting element 91 onto the second surface 102 of the substrate 10 falls within the orthographic projection of a light-emitting aperture 931 onto the second surface 102 of the substrate 10. The third reflective layer 93 can reflect the light emitted by the light-emitting element 91 from the non-light-emitting area, thereby improving the light utilization rate. The third reflective layer 93 can cover the surface of the light-emitting element 91 away from the array substrate, the side of the light-emitting element 91, and the portion of the surface of the light-emitting element 91 facing the array substrate.

[0139] In one embodiment, the material of the third reflective layer 93 includes at least one of white ink and silicone-based white adhesive. For example, the material of the third reflective layer 93 may be white ink or silicone-based white adhesive.

[0140] In one embodiment, as shown in FIG20, the light-emitting substrate further includes an insulating protective layer 92, which covers the leads 911 and conductive pads 41 of the light-emitting element 91, thereby protecting the leads 911 and conductive pads 41 of the light-emitting element 91. The insulating protective layer 92 may be made of a transparent resin material, and the light transmittance of the transparent resin material may be greater than 95%.

[0141] In one embodiment, the light-emitting element 91 may include a Micro LED and / or a Mini LED. The Micro LED has a size (e.g., length) of less than 50 micrometers, for example, 10 micrometers to 50 micrometers. The Mini LED has a size (e.g., length) of 50 micrometers to 150 micrometers, for example, 80 micrometers to 120 micrometers.

[0142] In one embodiment, as shown in FIG21, the light-emitting substrate includes a light-emitting region 130 and a peripheral region 140. A light-emitting element 91 is disposed in the light-emitting region 130.

[0143] In one embodiment, the conductive layer 40 includes a plurality of conductive pads 41, which are divided into a plurality of conductive pad groups. Each light-emitting element is bonded to a conductive pad 41 in a conductive pad group. The number of pins 911 included in the light-emitting element 91 is the same as the number of conductive pads 41 included in its corresponding conductive pad group, and each pin 911 is bonded to a conductive pad 41.

[0144] In one embodiment, as shown in FIG21, the light-emitting substrate further includes a non-light-emitting element 94, such as a driver chip or a sensor chip. The orthographic projection of the non-light-emitting element 94 onto the second surface 102 of the substrate 10 does not overlap with the orthographic projection of the groove 11 onto the second surface 102 of the substrate 10. The non-light-emitting element 94 includes pins, and each pin of the non-light-emitting element 94 is bonded to a conductive pad in a conductive pad group. The number of pins included in the non-light-emitting element 94 is the same as the number of conductive pads included in its corresponding conductive pad group. The non-light-emitting element 94 may be located in the peripheral region 140.

[0145] It should be noted that Figure 21 is a schematic diagram. In reality, the number of light-emitting elements 91 included in the light-emitting substrate is much greater than the number of light-emitting elements 91 shown in Figure 21.

[0146] This application also provides a display device, which includes a display panel and the above-described light-emitting substrate; the display panel is located on the side of the substrate away from the light-emitting element.

[0147] The display panel may be a liquid crystal display device, and the array substrate may serve as a backlight module.

[0148] This application does not impose specific limitations on the application of display devices, which can be any product or component with flexible display function, such as televisions, laptops, tablets, wearable display devices, mobile phones, in-vehicle displays, navigation systems, e-books, digital photo frames, and advertising light boxes.

[0149] It should be noted that the dimensions of layers and regions may be exaggerated in the accompanying drawings for clarity. Furthermore, it is understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element, or there may be intermediate layers. Additionally, it is understood that when an element or layer is referred to as being "below" another element or layer, it can be directly below the other element, or there may be more than one intermediate layer or element. Furthermore, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between the two layers or two elements, or there may be more than one intermediate layer or element. Similar reference numerals throughout indicate similar elements.

[0150] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the following claims.

[0151] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. An array substrate, characterized in that, The array substrate includes: The substrate includes opposing first and second surfaces; the first surface is provided with a groove. A protrusion is located within the groove and spaced apart from the side surface of the groove; in the direction from the first surface to the second surface, the area of ​​the cross section of the protrusion parallel to the second surface gradually increases; The first reflective layer covers at least the side surface of the protrusion; The second reflective layer is located on the side of the substrate away from the second surface. The second reflective layer has an opening, and the orthographic projection of the opening on the second surface is located within the orthographic projection of the groove on the second surface. A conductive layer is located on the side of the second reflective layer opposite to the substrate, and the conductive layer includes a conductive pad; A color conversion layer is located on the side of the conductive layer facing the substrate, and the material of the color conversion layer is a fluorescent material.

2. The array substrate according to claim 1, characterized in that, The color conversion layer is located on the side of the second reflective layer away from the substrate, and the orthographic projection of the color conversion layer on the second surface covers the orthographic projection of the opening on the second surface.

3. The array substrate according to claim 2, characterized in that, The orthographic projection of the color conversion layer on the second surface covers the orthographic projection of the second reflective layer on the second surface and the orthographic projection of the opening on the second surface.

4. The array substrate according to claim 1, characterized in that, The color conversion layer is located within the groove, and the array substrate further includes an auxiliary layer located on the side of the groove away from the first surface. The auxiliary layer is configured to reflect at least a portion of the incident light. A portion of the orthographic projection of the color conversion layer on the second surface falls outside the orthographic projection of the first reflective layer on the second surface and falls within the orthographic projection of the auxiliary layer on the second surface.

5. The array substrate according to claim 4, characterized in that, The auxiliary layer is provided with a through hole, and the orthographic projection of the through hole on the second surface falls within the orthographic projection of the first reflective layer on the second surface.

6. The array substrate according to claim 5, characterized in that, The edge of the orthographic projection of the through hole on the second surface is located inside the outer edge of the orthographic projection of the first reflective layer on the second surface.

7. The array substrate according to claim 4, characterized in that, The auxiliary layer is a semi-permeable membrane or a metal membrane.

8. The array substrate according to claim 4, characterized in that, The outer edge of the orthographic projection of the auxiliary layer on the second surface is the first edge, and the outer edge of the orthographic projection of the color conversion layer on the second surface is the second edge. The first edge is located outside the second edge.

9. The array substrate according to claim 8, characterized in that, The auxiliary layer is a semi-permeable membrane, and the distance between the first edge and the second edge is greater than or equal to the distance from the surface of the color conversion layer away from the second surface to the auxiliary layer.

10. The array substrate according to claim 4, characterized in that, The auxiliary layer is a metal layer, and the width of the auxiliary layer is less than 100 μm.

11. The array substrate according to claim 4, characterized in that, The auxiliary layer includes multiple inorganic layers stacked together. The multiple inorganic layers include alternating first inorganic layers and second inorganic layers, wherein the refractive index of the first inorganic layer is less than the refractive index of the second inorganic layer.

12. The array substrate according to claim 1, characterized in that, The orthographic projection of the opening on the second surface falls within the orthographic projection of the first reflective layer on the second surface.

13. The array substrate according to claim 1, characterized in that, The array substrate further includes a planarization layer, part of which is located within the opening and part of which is located on the side of the second reflective layer away from the substrate.

14. The array substrate according to claim 1, characterized in that, The second reflective layer includes a first reflective portion, the orthographic projection of the first reflective portion on the second surface does not overlap with the orthographic projection of the groove on the second surface, and the surface of the first reflective portion facing the substrate is provided with a plurality of uniform light structures arranged in an array.

15. A light-emitting substrate, characterized in that, The light-emitting substrate includes a plurality of light-emitting elements and an array substrate as described in any one of claims 1 to 14; the light-emitting elements include a plurality of pins, each of the pins being bonded to a conductive pad.

16. A display device, characterized in that, The display device includes a display panel and a light-emitting substrate as described in claim 15; the display panel is located on the side of the substrate away from the light-emitting element.

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