Heat dissipation apparatus and electronic apparatus

Abstract

The present invention provides a heat dissipation apparatus and an electronic apparatus. The heat dissipation apparatus comprises a circuit board, a heat source device and a liquid cooling plate; the heat source device is fixedly mounted on the circuit board; the liquid cooling plate comprises a first cover plate, a second cover plate and a middle plate sandwiched between the first cover plate and the second cover plate; the side of the middle plate close to the first cover plate is recessed to form a first accommodating space, and the side of the middle plate close to the second cover plate is recessed to form a second accommodating space; the liquid cooling plate further comprises a heat dissipation member provided in the first accommodating space, the first accommodating space being filled with a phase change liquid; the middle plate is provided with a liquid inlet hole and a liquid outlet hole both communicated with the second accommodating space; the liquid cooling plate further comprises a liquid inlet pipe and a liquid outlet pipe communicated with the second accommodating space via the liquid inlet hole and the liquid outlet hole, the second accommodating space being filled with a cooling liquid; the second cover plate is provided with a clearance hole isolated from the second accommodating space, and the heat source device passes through the clearance hole and is fitted to the middle plate. Compared with the related art, the heat dissipation apparatus of the present invention has better heat dissipation performance.

Description

Heat dissipation devices and electronic devices Technical Field

[0001] This invention relates to the field of heat dissipation technology, and more particularly to a heat dissipation device and an electronic device. Background Technology

[0002] With the development of electronic and electrical technology and the increasing demands of users, electronic products used in daily life, scientific research, and education are becoming increasingly functional and powerful, leading to more severe heat generation. Vapor chambers (VCs) are thin and lightweight heat dissipation components. Due to their divergent vapor paths and excellent 2D surface thermal conductivity, they can be applied to various electronic products, enhancing their heat dissipation performance. They are currently an ideal solution for addressing the heat dissipation problems of various electronic products. Technical issues

[0003] Existing vapor chamber solutions typically place the heat source device between the heat source and the product's metal casing. Heat generated by the heat source is conducted to the vapor chamber, and then dissipated through the heat conduction of the product's metal casing. However, existing vapor chamber solutions rely on passive heat dissipation from the product's metal casing. For large chip modules that generate significant heat, such as the heat source modules in laptops, the passive heat dissipation effect based on casing attachment is limited. When high performance is required for laptop operation, performance issues can easily arise due to untimely heat dissipation, meaning that existing solutions have poor heat dissipation performance.

[0004] Therefore, it is necessary to provide a new heat dissipation solution to address the above problems. Technical solutions

[0005] The technical problem to be solved by the present invention is to provide a heat dissipation device and electronic device with better heat dissipation effect.

[0006] To solve the above-mentioned technical problems, the present invention provides a heat dissipation device, which includes a circuit board, a heat source device, and a liquid cooling plate, wherein:

[0007] The heat source device is fixedly mounted on the circuit board;

[0008] The liquid cooling plate includes a first cover plate, a second cover plate, and a middle plate sandwiched between the first cover plate and the second cover plate. The middle plate is recessed towards the second cover plate on the side closest to the first cover plate to form a first receiving space. The liquid cooling plate also includes a heat dissipation component disposed within the first receiving space, which is filled with a phase change liquid. The middle plate is also recessed towards the first cover plate on the side closest to the second cover plate to form a second receiving space. The middle plate has an inlet hole and an outlet hole, both communicating with the second receiving space. The liquid cooling plate also includes an inlet pipe communicating with the second receiving space through the inlet hole, and an outlet pipe communicating with the second receiving space through the outlet hole. The second receiving space is filled with coolant.

[0009] The second cover plate has a clearance hole that is isolated from the second receiving space, and the heat source device passes through the clearance hole and fits against the middle plate.

[0010] Furthermore, the middle plate includes a recessed portion that surrounds the second cover plate to form the second receiving space, and a fitting portion that is in contact with the heat source device. The fitting portion is recessed in the direction away from the second cover plate to form a groove, and the groove includes a groove bottom surface that is in contact with the heat source device.

[0011] Furthermore, the heat source device includes a first device having a first thickness and a second device having a second thickness less than the first thickness. The first device is fixedly mounted on the surface of the circuit board and the second device is fixedly mounted on the surface of the circuit board at the same horizontal plane. The fitting portion includes a protrusion that protrudes from the bottom surface of the groove toward the heat source device, and the second device is fitted to the protrusion.

[0012] Furthermore, the heat dissipation device also includes a plurality of spaced support structures disposed within the second receiving space; the support structures disposed within the second receiving space are supported between the second cover plate and the recess.

[0013] Furthermore, the second cover plate is provided with a first interface mounting position and a second interface mounting position respectively facing the liquid inlet and the liquid outlet. The liquid inlet pipe is mounted at the first interface mounting position and communicates with the liquid inlet to form a liquid inlet channel that connects the second receiving space with the outside. The liquid outlet pipe is mounted at the second interface mounting position and communicates with the liquid outlet to form a liquid outlet channel that connects the second receiving space with the outside.

[0014] Furthermore, the heat dissipation device also includes a fixing screw, a threaded hole, and a fixing hole. The threaded hole is located on the second cover plate and on the side close to the circuit board. The fixing hole passes through the circuit board and is directly opposite the threaded hole. The fixing screw passes through the fixing hole along the circuit board toward the liquid cooling plate and forms a threaded connection with the threaded hole.

[0015] Furthermore, the liquid cooling plate includes a plurality of heat dissipation components arranged in an array, wherein the heat dissipation components are heat spreaders with capillary structures.

[0016] The present invention also provides an electronic device, the electronic device including the heat dissipation device as described above. Beneficial effects

[0017] Compared with related technologies, the heat dissipation device of the present invention includes a circuit board, a heat source device, and a liquid cooling plate. The heat source device is fixedly mounted on the circuit board. The liquid cooling plate includes a first cover plate, a second cover plate, and a middle plate sandwiched between the first cover plate and the second cover plate. The side of the middle plate near the first cover plate is recessed towards the second cover plate to form a first receiving space. The liquid cooling plate also includes a heat dissipation component disposed within the first receiving space, and the first receiving space is filled with a phase change liquid. The side of the middle plate near the second cover plate is recessed towards the first cover plate to form a second receiving space. The middle plate is provided with an inlet hole and an outlet hole, both communicating with the second receiving space. The liquid cooling plate also includes an inlet pipe communicating with the second receiving space through the inlet hole and an outlet pipe communicating with the second receiving space through the outlet hole. The second receiving space is filled with coolant. The second cover plate has a clearance hole that isolates it from the second receiving space, and the heat source device passes through the clearance hole and fits against the middle plate. In the above structure, based on the middle plate, the heat dissipation structure is embedded in the liquid cooling plate. Combining the efficient heat conduction capacity of the heat dissipation structure with the rapid heat dissipation capacity of the liquid cooling plate, the overall heat conduction capacity of the circuit board is improved, which is more conducive to directly controlling the heat generation of heat source devices on the circuit board. Compared with related technologies, the heat dissipation device of the present invention has better heat dissipation performance. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein:

[0019] Figure 1 is a three-dimensional structural schematic diagram of the heat dissipation device provided in an embodiment of the present invention;

[0020] Figure 2 is a cross-sectional view along line AA in the three-dimensional structural schematic diagram of the heat dissipation device in Figure 1;

[0021] Figure 3 is an exploded view of the overall structure of the heat dissipation device provided in an embodiment of the present invention.

[0022] Figure 4 is a schematic diagram of the exploded structure of the liquid cooling plate in the heat dissipation device provided in an embodiment of the present invention. Embodiments of the present invention

[0023] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0024] Please refer to Figures 1-4. This embodiment of the invention provides a heat dissipation device 100, which includes a circuit board 1, a liquid cooling plate 2, and a heat source device 3, wherein:

[0025] The heat source device 3 is fixedly mounted on the circuit board 1.

[0026] Referring to Figure 4, the liquid cooling plate 2 includes a first cover plate 21, a second cover plate 23, and a middle plate 22 sandwiched between the first cover plate 21 and the second cover plate 23. The side of the middle plate 22 closest to the first cover plate 21 is recessed towards the second cover plate 23 to form a first receiving space 221. The liquid cooling plate 2 also includes a heat dissipation component 20 disposed within the first receiving space 221, which is filled with a phase change liquid. The side of the middle plate 22 closest to the second cover plate 23 is recessed towards the first cover plate 21 to form a second receiving space 222. The middle plate 22 is provided with an inlet hole 223 and an outlet hole 224, both communicating with the second receiving space 222. The liquid cooling plate 2 also includes an inlet pipe 24 communicating with the second receiving space 222 through the inlet hole 223, and an outlet pipe 25 communicating with the second receiving space 222 through the outlet hole 224. The second receiving space 222 is filled with coolant. The second cover plate 23 has a clearance hole 231 that is isolated from the second receiving space 222, and the heat source device 3 passes through the clearance hole 231 and fits against the middle plate 22.

[0027] The heat generated by the heat source device 3 is transferred to the first containment space 221. Through the action of the heat sink 20 and the phase change liquid, the heat is evenly distributed in the first containment space 221 and then transferred to the second containment space 222. The coolant in the second containment space 222 circulates through the inlet pipe 24 and the outlet pipe 25, thereby achieving rapid heat dissipation.

[0028] In this embodiment, the heat sink 20 is a heat spreader with a capillary structure. Specifically, the liquid cooling plate 2 includes a plurality of heat sinks 20 arranged in an array, further enhancing the heat dissipation effect of the heat dissipation device 100.

[0029] Generally, the inlet pipe 24 and the outlet pipe 25 are connected to an external condenser pump to form a liquid cooling channel that transports the coolant in the second containment space 222 back and forth. The coolant moves rapidly through the liquid cooling channel and, together with external heat sinks, fans and other devices, dissipates heat and returns to the second containment space 222, thereby keeping the liquid cooling plate 2 at a low temperature.

[0030] In this embodiment of the invention, by directly contacting the heat source device 3 with the middle plate 22, the heat generated by it can be directly transferred to the first receiving space 221 through the middle plate 22, which has a better heat dissipation effect compared with contact with the first cover plate 21 and the second cover plate 23.

[0031] Specifically, the middle plate 22 includes a recessed portion 225 that surrounds the second cover plate 23 to form the second receiving space 222, and a fitting portion 226 that fits against the heat source device 3. The fitting portion 226 is recessed inward toward the surface of the heat source device 3 to form a groove 2261, and the groove 2261 includes a groove bottom surface 2262 that fits against the heat source device 3. When the heat source device 3 is a device with a uniform thickness, its fit with the groove bottom surface 2262 can ensure that heat is transferred to the first receiving space 221 to the maximum extent.

[0032] Furthermore, the heat source device 3 includes a first device 31 with a first thickness and a second device 32 with a second thickness less than the first thickness. The first device 31 is fixedly mounted on the surface of the circuit board 1, and the second device 32 is fixedly mounted on the surface of the circuit board 1 at the same horizontal plane. The fitting portion 224 includes a protrusion 2263 that protrudes from the bottom surface 2262 of the groove toward the heat source device 3, and the second device 32 fits against the protrusion 2263. By providing the protrusion 2263, even when the heat source device 3 includes devices of different thicknesses, it can still fit tightly against the middle plate 22, achieving a good heat dissipation effect.

[0033] The second cover plate 23 is provided with a first interface mounting position 232 and a second interface mounting position 233 respectively facing the liquid inlet hole 223 and the liquid outlet hole 224. The liquid inlet pipe 24 is engaged with the first interface mounting position 232 and communicates with the liquid inlet hole 223 to form a liquid inlet channel connecting the second receiving space 222 to the outside. The liquid outlet pipe 25 is engaged with the second interface mounting position 233 and communicates with the liquid outlet hole 224 to form a liquid outlet channel connecting the second receiving space 222 to the outside. The arrangement of the first interface mounting position 232 and the second interface mounting position 233 facilitates the installation of the liquid inlet pipe 24 and the liquid outlet pipe 25.

[0034] The heat dissipation device 100 further includes a fixing screw 4, a threaded hole 5, and a fixing hole 6. The threaded hole 5 is located on the side of the second cover plate 23 closest to the circuit board 1. The fixing hole 6 passes through the circuit board 1 and is directly opposite the threaded hole 5. The fixing screw 4 passes through the fixing hole 5 along the direction from the circuit board 1 toward the liquid cooling plate 2 and forms a threaded connection with the threaded hole 6. Preferably, for the plate-shaped liquid cooling plate 2, multiple sets of fixing screws 4, threaded holes 5, and fixing holes 6 can be designed to achieve stable fixing of the overall plate shape, so that the surface of the liquid cooling plate 2 and the heat source device 3 have a certain contact pressure and a tighter fit.

[0035] In this embodiment of the invention, preferably, the liquid cooling plate 2 is manufactured using ECP (Electrochemical Plating) technology, which is a process for depositing metallic copper on a semiconductor substrate through electrochemical methods. The liquid cooling plate 2 in this embodiment can be manufactured using a high thermal conductivity material as the substrate through the ECP process. The substrate material can be copper, aluminum, stainless steel, titanium alloy, etc., all of which have good thermal conductivity.

[0036] The heat dissipation device 100 further includes a plurality of spaced support structures 26 disposed within the second receiving space 222; the support structures 26 disposed within the second receiving space 222 are supported between the second cover plate 22 and the recess 225. The design of the support structures 26 inside the second receiving space 222 is beneficial to increasing the heat exchange area of ​​the middle plate 22, thereby improving the overall heat conduction and heat dissipation effect of the heat dissipation device 100.

[0037] This invention also provides an electronic device, which includes the heat dissipation device 100 as described in the above embodiments. It is understood that the electronic device designed based on the heat dissipation device 100 provided in this invention can achieve better heat dissipation performance based on the heat dissipation device 100's heat dissipation plate embedded thermal conductive design and efficient liquid cooling plate heat dissipation structure, as described in the above embodiments, and will not be repeated here.

[0038] Compared with related technologies, the heat dissipation device of the present invention includes a circuit board, a heat source device, and a liquid cooling plate. The heat source device is fixedly mounted on the circuit board. The liquid cooling plate includes a first cover plate, a second cover plate, and a middle plate sandwiched between the first cover plate and the second cover plate. The side of the middle plate near the first cover plate is recessed towards the second cover plate to form a first receiving space. The liquid cooling plate also includes a heat dissipation component disposed within the first receiving space, and the first receiving space is filled with a phase change liquid. The side of the middle plate near the second cover plate is recessed towards the first cover plate to form a second receiving space. The middle plate is provided with an inlet hole and an outlet hole, both communicating with the second receiving space. The liquid cooling plate also includes an inlet pipe communicating with the second receiving space through the inlet hole and an outlet pipe communicating with the second receiving space through the outlet hole. The second receiving space is filled with coolant. The second cover plate has a clearance hole that isolates it from the second receiving space, and the heat source device passes through the clearance hole and fits against the middle plate. In the above structure, based on the middle plate, the heat dissipation structure is embedded in the liquid cooling plate. Combining the efficient heat conduction capacity of the heat dissipation structure with the rapid heat dissipation capacity of the liquid cooling plate, the overall heat conduction capacity of the circuit board is improved, which is more conducive to directly controlling the heat generation of heat source devices on the circuit board. Compared with related technologies, the heat dissipation device of the present invention has better heat dissipation performance.

[0039] The above description is merely an embodiment of the present invention. It should be noted that those skilled in the art can make improvements without departing from the inventive concept of the present invention, but these improvements all fall within the protection scope of the present invention.

Claims

1. A heat dissipation device, comprising a circuit board, a heat source device, and a liquid cooling plate, characterized in that: The heat source device is fixedly mounted on the circuit board; The liquid cooling plate includes a first cover plate, a second cover plate, and a middle plate sandwiched between the first cover plate and the second cover plate. The middle plate is recessed towards the second cover plate on the side closest to the first cover plate to form a first receiving space. The liquid cooling plate also includes a heat dissipation component disposed within the first receiving space, which is filled with a phase change liquid. The middle plate is also recessed towards the first cover plate on the side closest to the second cover plate to form a second receiving space. The middle plate has an inlet hole and an outlet hole, both communicating with the second receiving space. The liquid cooling plate also includes an inlet pipe communicating with the second receiving space through the inlet hole, and an outlet pipe communicating with the second receiving space through the outlet hole. The second receiving space is filled with coolant. The second cover plate has a clearance hole that is isolated from the second receiving space, and the heat source device passes through the clearance hole and fits against the middle plate.

2. The heat dissipation device according to claim 1, characterized in that, The middle plate includes a recessed portion that surrounds the second cover plate to form the second receiving space, and a fitting portion that is in contact with the heat source device. The fitting portion is recessed in the direction away from the second cover plate to form a groove, and the groove includes a bottom surface that is in contact with the heat source device.

3. The heat dissipation device according to claim 2, characterized in that, The heat source device includes a first device having a first thickness and a second device having a second thickness less than the first thickness. The first device is fixedly mounted on the surface of the circuit board and the second device is fixedly mounted on the surface of the circuit board at the same horizontal plane. The fitting portion includes a protrusion that protrudes from the bottom surface of the groove toward the heat source device, and the second device is fitted to the protrusion.

4. The heat dissipation device according to claim 2, characterized in that, The heat dissipation device further includes a plurality of spaced support structures disposed within the second receiving space; the support structures disposed within the second receiving space are supported between the second cover plate and the recess.

5. The heat dissipation device according to claim 1, characterized in that, The second cover plate is provided with a first interface mounting position and a second interface mounting position respectively facing the liquid inlet and the liquid outlet. The liquid inlet pipe is mounted in the first interface mounting position and communicates with the liquid inlet to form a liquid inlet channel that connects the second receiving space with the outside. The liquid outlet pipe is mounted in the second interface mounting position and communicates with the liquid outlet to form a liquid outlet channel that connects the second receiving space with the outside.

6. The heat dissipation device according to claim 1, characterized in that, The heat dissipation device also includes a fixing screw, a threaded hole, and a fixing hole. The threaded hole is located on the second cover plate and on the side close to the circuit board. The fixing hole passes through the circuit board and is directly opposite the threaded hole. The fixing screw passes through the fixing hole along the circuit board toward the liquid cooling plate and forms a threaded connection with the threaded hole.

7. The heat dissipation device according to claim 1, characterized in that, The liquid cooling plate includes a plurality of heat dissipation components arranged in an array, and the heat dissipation components are heat spreaders with capillary structures.

8. An electronic device, characterized in that, The electronic device includes the heat dissipation device as described in claim 1.

Images