Protective case and preparation method for protective case
By incorporating a rigid and flexible layer design, the problems of difficult disassembly and assembly and low operational sensitivity of the protective case are solved, achieving flexibility and stability of the protective case and improving the operational reliability and protection effect of electronic devices.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- SHENZHEN LINGYI INNOVATION TECH CO LTD
- Filing Date
- 2025-01-23
- Publication Date
- 2026-07-30
AI Technical Summary
Existing protective cases are too rigid, making them difficult to install and remove, affecting the operational sensitivity of electronic devices, and failing to effectively protect the function keys of electronic devices.
It adopts a one-piece rigid and flexible layer design. The rigid layer has an opening, and the flexible layer covers the opening to form a flexible area. It is formed into a one-piece structure through high temperature and high pressure treatment, forming a local flexible area and an overall rigid area.
It reduces the difficulty of disassembling and assembling the protective case, improves the sensitivity and reliability of external operation, while maintaining effective protection for electronic devices, and saves material costs and structural stability.
Smart Images
Figure CN2025074281_30072026_PF_FP_ABST
Abstract
Description
Protective shell and its preparation method [Technical Field]
[0001] This application relates to the field of electronic device accessories technology, and in particular to a protective case and a method for preparing the protective case. [Background Technology]
[0002] Electronic devices such as mobile phones and laptops are usually protected by protective cases. In order to protect electronic devices, protective cases are usually rigid and difficult to install or remove from electronic devices, and it is also difficult to operate the buttons on electronic devices through the protective case. [Summary of the Invention]
[0003] This application provides a protective case and a method for manufacturing the protective case, so as to reduce the difficulty of disassembling and assembling the protective case, improve the sensitivity of external operation to control electronic devices, and enhance the reliability of the protective case.
[0004] To solve the above-mentioned technical problems, this application proposes a protective shell, the protective shell comprising at least one rigid layer and at least one flexible layer integrally formed, the rigid layer having a harder hardness than the flexible layer, the rigid layer having an opening, and the flexible layer at least covering the opening to form a flexible area at the opening.
[0005] To address the aforementioned technical problems, this application proposes a method for preparing a protective shell. The method includes: preparing a base material, comprising obtaining at least one flexible layer and at least one rigid layer matching the shape and size of an electronic device, wherein the rigid layer has an opening; the hardness of the flexible layer is less than the hardness of the rigid layer; material shaping treatment, comprising placing the rigid layer and the flexible layer between a first release film and a second release film, and pressing them together to obtain a shaped material sandwiched between the first and second release films; wherein the flexible layer at least covers the opening; vacuum sealing treatment, comprising placing the shaped material, the first release film, and the second release film in a flexible container, extracting air from the flexible container, and then sealing the flexible container; high-temperature and high-pressure treatment, comprising placing the sealed flexible container in an autoclave, and subjecting it to a preset pressure and temperature for a preset time, wherein the shaped material is integrally formed into a shaped body after the high-temperature and high-pressure treatment; wherein the shaped body includes a rigid region and a flexible region, the hardness of the flexible region is less than the hardness of the rigid region, and the flexible region corresponds to the opening.
[0006] The beneficial effects of this application's technical solution are as follows: the protective shell provided by this application includes at least one rigid layer and at least one flexible layer integrally formed. The rigid layer has a higher hardness than the flexible layer. The rigid layer has an opening, and the flexible layer at least covers the opening to form a flexible area at the opening. In this way, on the one hand, this application can form a flexible area at the opening position of the rigid layer, thereby making the protective shell have a local flexible area. The flexible area is easily deformed under external force, which can reduce the difficulty of disassembling and assembling the protective shell and / or improve the sensitivity and reliability of external operation on electronic devices. Moreover, the flexible layer can also cover the opening, which can improve the problem of the corresponding position of the electronic device being exposed and not effectively protected. On the other hand, the position of the rigid layer without an opening can form a rigid area of the protective shell. The rigid area, as the main body of the protective shell, can achieve effective protection for the entire electronic device. Furthermore, the integral forming of the rigid layer and the flexible layer can improve the structural stability of the protective shell and reduce its thickness and other dimensions, which can save material costs and facilitate the miniaturization of the combined structure of the protective shell and the electronic device. [Attached Image Description]
[0007] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein:
[0008] Figure 1 is a structural schematic diagram of the first embodiment of the protective shell of this application;
[0009] Figure 2 is a schematic diagram of the layered structure of the protective shell portion of the embodiment in Figure 1;
[0010] Figure 3 is a schematic diagram of the structure of an embodiment of the electronic device of this application;
[0011] Figure 4 is a schematic diagram of the sidewall structure in the second embodiment of the protective shell of this application;
[0012] Figure 5 is a schematic diagram of the layered structure of a portion of the protective shell according to the fourth embodiment of this application;
[0013] Figure 6 is a schematic diagram of the layered structure of a portion of the protective shell in the fifth embodiment of this application;
[0014] Figure 7 is a schematic diagram of the layered structure of a portion of the protective shell according to the sixth embodiment of this application;
[0015] Figure 8 is a schematic diagram of the layered structure of a portion of the protective shell in the seventh embodiment of this application;
[0016] Figure 9 is a schematic diagram of the layered structure of a portion of the protective shell of the eighth embodiment of this application;
[0017] Figure 10 is a schematic flowchart of an embodiment of the method for preparing the protective shell of this application.
Detailed Implementation Methods
[0018] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be particularly noted that the following embodiments are for illustrative purposes only and do not limit the scope of the application. Similarly, the following embodiments are only some, not all, embodiments of the present application, and all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of the present application.
[0019] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application based on the specific circumstances.
[0020] In the embodiments of this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0021] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the embodiments of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.
[0022] The protective case provided in this application can be used on mobile phones, tablets, cameras, and other electronic devices or portable electronic devices, and can improve the protection of electronic devices. The embodiments of this application will be described using a mobile phone as an example, and the protective case will also be described using a mobile phone protective case as an example.
[0023] In some embodiments, as shown in Figures 1, 2, and 3, Figure 1 is a structural schematic diagram of a first embodiment of the protective shell of this application, Figure 2 is a layered structural schematic diagram of a portion of the protective shell structure of the embodiment of Figure 1, and Figure 3 is a structural schematic diagram of an embodiment of the electronic device of this application. The protective shell 10 of this embodiment includes at least one rigid layer 20 and at least one flexible layer 30 integrally formed. The hardness of the rigid layer 20 is greater than the hardness of the flexible layer 30. The rigid layer 20 is provided with an opening 21, and the flexible layer 30 at least covers the opening 21 to form a flexible region 31 at the opening 21.
[0024] The statement that the rigid layer 20 has a higher hardness than the flexible layer 30 means that the rigid layer 20 has a greater local resistance to intrusion from external objects than the flexible layer 30. The rigid layer 20 and the flexible layer 30 can be made of different materials to achieve different hardnesses; alternatively, the rigid layer 20 can be made of the same material as the flexible layer 30, but the thickness of the rigid layer 20 is greater than that of the flexible layer 30, thus making the rigid layer 20 harder than the flexible layer 30. The statement that the rigid layer 20 has a higher hardness than the flexible layer 30 means that the rigid layer 20, when made into the protective shell 10, has a higher hardness than the flexible layer 30 when made into the protective shell 10.
[0025] The thickness direction z of the protective shell 10 can be defined, and the thickness direction z is related to the arrangement direction of the protective shell 10 and the electronic device 200 (here referring to the arrangement direction of the local structure). The opening 21 on the rigid layer 20 is a slot that penetrates the rigid layer 20 along the thickness direction z, so that the flexible layer 30 located at the opening 21 is exposed on both the side facing the electronic device 200 and the side away from the electronic device 200.
[0026] Wherein, the flexible layer 30 at least covers the opening 21 means that the projection of the flexible layer 30 along the thickness direction z toward the rigid layer 20 covers the opening 21, so that the opening area of the opening 21 is correspondingly set with the flexible area 31.
[0027] On the one hand, this embodiment can form a flexible region 31 at the opening 21 of the rigid layer 20, thereby giving the protective shell 10 a local flexible region 31. The flexible region 31 is easily deformed under external force, which can reduce the difficulty of disassembling and assembling the protective shell 10 and / or improve the sensitivity and reliability of external operation on the electronic device 200. In addition, the flexible layer 30 can also cover the opening 21, which can improve the problem that the corresponding position of the electronic device 200 is exposed and not effectively protected. On the other hand, the rigid region 22 of the protective shell can be formed at the position where the rigid layer 20 does not have the opening 21. The rigid region 22, as the main body of the protective shell 10, can effectively protect the electronic device 200 as a whole. Furthermore, the rigid layer 20 and the flexible layer 30 are integrally formed, which can improve the structural stability of the protective shell 10 and reduce the thickness and other dimensions, save material costs, and facilitate the miniaturization of the combined structure of the protective shell 10 and the electronic device 200.
[0028] The protective shell 10 is integrally formed from at least one rigid layer 20 and at least one flexible layer 30, making it a one-piece unit. There are various methods of integral forming, such as melting related substances in at least two material layers through heating or pressurization, allowing them to flow to a specific location under pressure or a mold, and then solidifying under the influence of temperature or pressure; alternatively, the material layers can be bonded together with adhesive or similar materials and then cured. This integral forming results in at least two material layers forming an inseparable whole without violent intervention; this inseparable whole is also called a "one-piece unit." Specifically, at least one rigid layer 20 itself forms the rigid region 22 of the protective shell 10, or the overlapping portion of the rigid layer 20 and the flexible layer 30 forms the rigid region 22 of the protective shell 10, and the portion of the flexible layer 30 that does not overlap with the rigid layer 20, i.e., the opening area of the opening 21, forms the flexible region 31 of the protective shell 10. In this application, rigidity and flexibility are relative concepts; the hardness of the flexible region 31 is less than the hardness of the rigid region 22. Understandably, the portion overlapping the flexible layer 30 still exhibits the characteristics of the rigid region 22 in terms of the protective angle of the protective shell 10 (mainly considering its outer surface). Furthermore, the flexible region 31 is connected to the edge of the opening 21 as a single piece.
[0029] In some embodiments, the rigid layer 20 comprises a composite layer of aramid fibers and thermosetting resin. The aramid fibers, pre-impregnated with a thermosetting resin (e.g., epoxy resin), serve as the rigid layer 20 after molding. In other embodiments, the material of the rigid layer can also be man-made fibers such as carbon fiber and glass fiber, or metals, rigid plastics, or inorganic materials such as silicon compounds.
[0030] In some embodiments, the flexible layer 30 comprises a composite layer of aramid fibers and TPU (thermoplastic polyurethane rubber). The aramid fibers pre-impregnated with a thermoplastic resin (e.g., polyurethane) are used as the flexible layer 30 after molding, or a laminate of aramid fibers and TPU is used as the flexible layer 30. In other embodiments, the flexible layer can also be made of materials such as silicone, latex, or rubber.
[0031] The hardness of the aramid fiber layer pre-impregnated with epoxy resin after being made into a protective shell is greater than that of the aramid fiber layer pre-impregnated with polyurethane after being made into a protective shell.
[0032] In some embodiments, the flexible layer 30 includes an aramid fiber dry cloth and TPU applied to opposite sides of the aramid fiber dry cloth.
[0033] Because TPU has advantages such as good transparency, good moldability, high melting point, and good adhesion to other film layers, this embodiment uses TPU to realize the flexible layer 30. This reduces the difficulty of the molding process and improves the reliability of the flexible layer 30 and the protective shell 10. It also improves the visibility of aramid fibers and enhances the aesthetics of the protective shell 10. Furthermore, the use of aramid fibers enables the flexible area 31 to have excellent texture, superior softness, and good pressing and rebound feel.
[0034] In some embodiments, the rigid layer 20 and the flexible layer 30 may be made of the same material, such as thermoplastic elastomers, with the only difference being that the thickness of the rigid layer 20 is greater than that of the flexible layer 30, thereby providing a relative comparison between the hardness of the rigid layer 20 and the flexible layer 30.
[0035] In some embodiments, as shown in Figures 1, 2, and 3, the protective shell 10 has a sidewall 11 and a bottom wall 12. The sidewall 11 is disposed on the outer periphery of the bottom wall 12 and extends bent toward one side of the bottom wall 12 to form a receiving cavity A, which is configured to receive an electronic device 200. A rigid layer 20 is located at least on the bottom wall 12, a flexible layer 30 is located at least on the sidewall 11, and a flexible region 31 is located on the sidewall 11. An opening 21 is located on the sidewall 11 to form the flexible region 31 on the sidewall 11.
[0036] When the electronic device 200 is in use, the side facing the user is defined as the front, and the side away from the user is defined as the back. When the protective case 10 is mounted on the electronic device 200, the bottom wall 12 of the protective case 10 is correspondingly set to the back of the electronic device 200, and the side wall 11 of the protective case 10 is correspondingly set to the side of the electronic device 200.
[0037] Wherein, the rigid layer 20 being at least located on the bottom wall 12 means that the rigid layer 20 at least forms the bottom wall 12 of the protective shell 10 to improve the overall hardness of the protective shell 10 and enhance its protective performance; the rigid layer 20 may also form part of the side wall 11 of the protective shell 10. The flexible layer 30 being at least located on the side wall 11 means that the flexible layer 30 at least forms part or all of the side wall 11 of the protective shell 10, and may form at least part of the bottom wall 12 of the protective shell 10.
[0038] When the protective case 10 is assembled onto the electronic device 200, the bottom wall 12 is used to abut against the back of the electronic device 200 to protect the back; the side wall 11 is used to protect the sides of the electronic device 200 and to ensure that the protective case 10 is stably fitted onto the outside of the electronic device 200; the flexible area 31 on the side wall 11 abuts against the function key 23 on the side of the electronic device 200. In this embodiment, the bottom wall 12 is a rigid area, and the side wall 11 is wholly or partially a flexible area 31. Because the flexible area 31 has better deformation capability than the rigid area 22, it is convenient to operate the function key 23 on the side of the electronic device 200 and to easily install and remove the protective case 100.
[0039] Since the area of the side wall 11 is smaller than that of the bottom wall 12, setting the flexible area 31 on the side wall 11 can increase its deformation capability and improve the external operation capability and / or disassembly capability of the function keys 23 on the side of the electronic device 200.
[0040] The protective shell 10 is a combination of the rigid area 22 and the flexible area 31, which not only better protects the electronic device 200, but also enhances the wrapping protection of the sides of the electronic device 200, and is easier to disassemble.
[0041] In some embodiments, the bottom wall 12 of the protective case 10 may also be disposed corresponding to the front of the electronic device 200, and the flexible region 31 may be located on the bottom wall 12 or the side wall 11 of the protective case 10.
[0042] In some embodiments, a local flexible region 31 may be formed on the overall rigid region 22, or a local rigid region 22 may be formed on the overall flexible region 31.
[0043] In some embodiments, as shown in FIG4, FIG4 is a structural schematic diagram of the second embodiment of the protective shell of this application. The flexible region 31 extends through the side wall 11 away from the bottom wall 12 to form a semi-enclosed flexible region 31.
[0044] The opening 21 is a notch located at the edge of the side wall 11. The opening side of the notch has no rigid area 22, which can increase the deformation capability of the flexible area 31, thereby further reducing the difficulty of disassembling and assembling the protective shell 10 and / or improving the sensitivity and reliability of external forces to the operation of the electronic device 200.
[0045] In some embodiments, as shown in FIG1, the flexible region 31 is located in the middle region of the sidewall 11 to form a fully enclosed flexible region 31. The opening 21 is a through hole provided in the sidewall 11, and a rigid region 22 is provided around the through hole, which can improve the structural stability between the flexible region 31 and the rigid region 22.
[0046] In some embodiments, the opening may be a through-hole structure disposed on the bottom wall; or the opening may be partially located on the side wall and partially located on the bottom wall, etc.
[0047] In some embodiments, as shown in Figures 1 and 3, the protective case 10 is configured to protect an electronic device 200, which has function keys 23. When the electronic device 200 is mounted on the protective case 10, the flexible area 31 covers at least part of the function keys 23.
[0048] Wherein, the flexible region 31 at least covers part of the function key 23 means that the projection of the flexible layer 30 along the thickness direction z toward the electronic device 200 covers one or more (two or more) of the multiple function keys 23 on the electronic device 200, so that the flexible region 31 is set to correspond with part of the function key 23.
[0049] In this embodiment, a flexible area 31 is provided at the position of the function key 23 of the protective shell 10 and the electronic device 200. Because the flexible area 31 has low hardness, it has a strong ability to deform under external force. The flexible area 31 can transmit external operations faster and more accurately, thereby improving the sensitivity and reliability of the external operation function key 23.
[0050] Furthermore, when assembling or disassembling the protective case 10 from the electronic device 200, the assembly or disassembly operation can also be performed in the flexible area 31. The deformation of the flexible area 31 can reduce the difficulty of assembling or disassembling the protective case 10.
[0051] Compared to the related technologies that expose the function keys 23 of the electronic device 200 by setting through holes, the protective shell 10 of this embodiment can not only protect the function keys 23 of the electronic device 200 from being exposed by the flexible layer 30, but also reduce the impact of the protective shell 10 on the operation of the function keys 23 because the function keys 23 are provided with a flexible area 31.
[0052] In some embodiments, the sidewalls of the protective shell are entirely or partially rigid regions, while the bottom wall is a flexible region. This design also facilitates the assembly and disassembly of the protective shell. If the flexible region is entirely located on the bottom wall, the opening is a through-hole structure.
[0053] In some embodiments, the flexible region 31 corresponds to other positions of the electronic device 200 where no function keys are provided, such as the positions on the upper, lower, and side surfaces of the protective shell 10 and the electronic device 200 where no function keys are provided. This allows the protective shell 10 to form a local flexible region 31, thereby enabling disassembly and assembly operations to be performed in the flexible region 31. The deformation of the flexible region 31 may reduce the difficulty of disassembling and assembling the protective shell 10.
[0054] In some embodiments, a flexible area may be provided in the area of one or more (two or more) function keys of the electronic device corresponding to the protective case; or a flexible area may be provided in both the area of the function keys and the area of the non-function keys of the electronic device corresponding to the protective case, as long as the overall structural rigidity of the protective case can be guaranteed and the protective effect on the electronic device can be guaranteed.
[0055] In some embodiments, function key 23 includes a touch button 231.
[0056] In this embodiment, the flexible area 31 is an insulator, which can reduce the electromagnetic interference of the flexible area 31 to the sensing button 231 when the user or other conductive body operates the sensing button 231, thereby improving the protective effect of the protective shell 10 and the control sensitivity and reliability of the electronic device 200.
[0057] In some embodiments, the rigid region 22 of the protective case 10 is used to protect the entire electronic device 200. A touch button 231 is provided on the outer surface of the electronic device 200. The flexible region 31 of the protective case 10 abuts against the outer surface of the touch button 231 to protect the touch button 231 and to facilitate the user to operate the touch button 231 by touching the flexible region 31.
[0058] The sensing button 231 may include a capacitive sensing button or a resistive sensing button, etc.
[0059] In some embodiments, the sensing button 231 is a capacitive sensing button. The deformable properties of the flexible region 31 can be used to transmit external pressing operations to the capacitive sensing button, thereby realizing the first function operation of the electronic device 200 through the pressing operation. Because the flexible region 31 is an insulator, there will still be a capacitive coupling effect between the user or other conductive body and the capacitive sensing button. Therefore, when the conductive body moves relative to the flexible region 31, the coupling capacitance value and / or coupling position of the capacitive sensing button will change, which can identify the control of the capacitive sensing button by the conductive body, thereby realizing the second function operation of the electronic device 200.
[0060] The first function and the second function mentioned above can be two different functions of the electronic device 200, or different operations of the same function of the electronic device 200.
[0061] In some embodiments, the sensing button 231 can be a resistive sensing button. The deformable properties of the flexible area 31 can be used to transmit external pressing operations to the resistive sensing button, thereby controlling the electronic device 200 through pressing operations. Furthermore, different functions of the electronic device 200 can be controlled by different pressing durations and other parameters.
[0062] In some embodiments, multiple function keys 23 of an electronic device can be implemented by a combination of capacitive sensing buttons, resistive sensing buttons, etc.
[0063] In some embodiments, as shown in Figures 1 and 3, the electronic device 200 includes a mobile phone 201, the sensing button 211 includes a camera button A, the protective case 10 is provided with a sidewall 11 for surrounding the side of the mobile phone 201, and a flexible region 31 is provided on the sidewall 11.
[0064] The display surface of the mobile phone 201 is defined as the front surface, and when the display surface faces the user, the side facing away from the user is the back surface; the bottom wall 12 of the protective case 10 is set to correspond to the back surface of the mobile phone 201; the flexible area 31 is set to correspond to the shooting button A on the mobile phone 201, so that the shooting button A can be operated through the flexible area 31.
[0065] To improve the ease of operation of the mobile phone 201, the function keys 23 of the mobile phone 201 are usually located on the right side of the mobile phone 201 (in the default screen display mode). The flexible area 31 on the protective case 10 is located on the right wall 111 of the protective case 10, corresponding to the function keys 23 of the mobile phone 201. Among them, the function keys 23 include a sensor button 231, which includes a shooting button A for realizing the mobile phone's camera function. The shooting button A is electrically connected to the main control of the electronic device 200, such as a microprocessor unit. The shooting button A can convert the user's pressing operation and / or touch operation on the shooting button A into an electrical signal and transmit it to the microprocessor unit, so that the microprocessor unit can control the camera component and other related functional components of the electronic device 200 to work, thereby realizing at least one of the functions such as camera opening and closing, focus adjustment, shooting, and video recording.
[0066] In some embodiments, the flexible area 31 may also be connected to other function keys of the electronic device 200, which may be touch buttons or press-buttons, and may also perform functions such as power on / off, volume adjustment, and screenshot.
[0067] In some embodiments, the thickness of the flexible region 31 is 0.1 mm to 1.2 mm. A thickness of less than or equal to 1.2 mm not only enhances the deformation capability of the flexible region 31, enabling effective transmission of pressing operations, but also reduces the operating distance between the user and the electronic device 200, thus minimizing the impact of the flexible region 31 on the user's control of the electronic device 200 and improving the sensitivity and reliability of the electronic device 200's operation. Conversely, a thickness greater than or equal to 0.1 mm enhances the protection of the function key 23, reducing the risk of breakage during operation.
[0068] In some embodiments, the specific thickness of the flexible region 31 can be 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1.0mm, 1.1mm, 1.2mm, etc.
[0069] The flexible area 31 is attached to the surface of the sensor button 231 of the electronic device 200; and the effective thickness range of the flexible area 31 is limited, thereby ensuring that the user can easily operate the sensor button 231 of the electronic device 200 through the protective case.
[0070] In some embodiments, the outer surface of the flexible region 31 is flush with or has a height difference H with the outer surface of the rigid region 22 on its periphery, the height difference H being 0.1 mm to 0.5 mm. Specifically, the height difference H can be 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, etc.
[0071] The outer surface of the flexible region 31 refers to the side of the flexible region 31 that faces away from the electronic device 200 after the protective shell 10 is assembled with the electronic device 200.
[0072] In this way, the outer surface of the flexible region 31 is flush with the outer surface of the rigid region 22 around it, which improves the aesthetics of the outer surface of the protective shell 10. There is a height difference H between the outer surface of the flexible region 31 and the outer surface of the rigid region 22 around it, and the height difference H is 0.1mm to 0.5mm, which improves the recognizability of the flexible region 31 when it is touched, without affecting the aesthetics of the protective shell 10.
[0073] In some embodiments, the flexible region 31 is elliptical, rectangular, or rounded rectangular in shape, and its size and area are preferably large enough to cover the outer surface of the sensor button 231. Taking a rectangular or rounded rectangular flexible region 31 as an example, its maximum length ranges from 15mm to 50mm, and its maximum width ranges from 2mm to 12mm. Specifically, the maximum length can be 15mm, 20mm, 25mm, 30mm, 35mm, 40mm, 45mm, 50mm, etc., and the maximum width can be 2mm, 4mm, 6mm, 8mm, 10mm, 12mm, etc.
[0074] It should be noted that the rigid layer 20 of this application has an area for setting the opening 21 and other areas, which includes the opening area and the outer peripheral area surrounding the opening area.
[0075] In some embodiments, the flexible layer 30 portion located in the flexible region 31 can be arranged with the opening 21 along the thickness direction z after molding.
[0076] In some embodiments, as shown in FIG2, at least one rigid layer 20 includes a first rigid layer 24, at least one flexible layer 30 includes a first flexible layer 32, the first rigid layer 24 is provided with an opening 21, and the first flexible layer covers the opening 21 and the outer peripheral area of the opening 21.
[0077] In this embodiment, the protective shell 10 is achieved through the first flexible layer 32 and the first rigid layer 24, which simplifies the manufacturing process of the protective shell 10 and reduces the thickness and material cost of the protective shell 10.
[0078] In some embodiments, the first flexible layer 32 covers at least the outer side of the peripheral region of the opening 21.
[0079] Wherein, the first flexible layer 32 at least covers the outer side of the outer peripheral area of the opening 21 means that, along the thickness direction z of the protective shell 10, the first flexible layer 32 is located on the side of the first rigid layer 24 away from the accommodating cavity A, that is, the first flexible layer 32 is at least partially located on the outer side of the first rigid layer 24.
[0080] In some embodiments, the first flexible layer covers at least the inside of the opening and the outer peripheral region of the opening.
[0081] In some embodiments, as shown in Figures 5 to 9, the opening 21 includes a first opening 211 and a second opening 212, at least one rigid layer 20 includes a second rigid layer 25 and a third rigid layer 26, at least one flexible layer 30 includes a second flexible layer 33, the second rigid layer 25 is provided with the first opening 211, the third rigid layer 26 is provided with the second opening 212 corresponding to the first opening 211, the second flexible layer 33 is at least located on the side of the second rigid layer 25 facing the third rigid layer 26, and its projection onto the second rigid layer 25 covers the first opening 211 and the outer peripheral area of the first opening 211; and / or the second flexible layer 33 is at least located on the side of the third rigid layer 26 facing the second rigid layer 25, and its projection onto the third rigid layer 26 at least covers the second opening 212 and the outer peripheral area of the second opening 212.
[0082] The first opening 211 and the second opening 212 are correspondingly arranged such that, along the thickness direction z of the protective shell 10, the opening area of the first opening 211 and the opening area of the second opening 212 at least partially overlap, so that the second flexible layer 33 forms a flexible area 31 in the overlapping area of the opening area of the first opening 211 and the opening area of the second opening 212; the second flexible layer 33 can be a flexible aramid fiber material.
[0083] In this embodiment, the rigid layer 20 of the protective shell 10 is achieved through the second rigid layer 25 and the third rigid layer 26, which can increase the overall hardness of the protective shell 10 and improve its protective effect on the electronic device 200; and the second rigid layer 25 and the third rigid layer 26 are respectively provided with corresponding first opening 211 and second opening 212, which can cooperate with the second flexible layer 33 to realize the flexible area 31.
[0084] In some embodiments, as shown in Figures 5 to 7, the second flexible layer 33 is at least disposed between the second rigid layer 25 and the third rigid layer 26, and along the stacking direction z1 of the second rigid layer 25, the second flexible layer 33 and the third rigid layer 26, that is, the thickness direction z of the second flexible layer 33 and the protective shell 10, the second flexible layer 33 at least covers the first opening 211, the second opening 212, the outer peripheral region of the first opening 211 and the outer peripheral region of the second opening 212.
[0085] The stacking direction z1 of the second rigid layer 25, the second flexible layer 33, and the third rigid layer 26 is consistent with the thickness direction z of the protective shell 10. The second flexible layer 33 covers not only the first opening 211 and the second opening 212, but also the outer peripheral areas of the first opening 211 and the second opening 212. Alternatively, the second flexible layer 33 may further cover other areas of the second rigid layer 25 and the third rigid layer 26. The second rigid layer 25 is located inside the protective shell 10.
[0086] In this embodiment, a flexible layer 30, namely the second flexible layer 33, is provided between the two rigid layers 20, namely the second rigid layer 25 and the third rigid layer 26. On the one hand, this increases the overall rigidity of the protective shell 10; on the other hand, it increases the protection and connection stability of the flexible layer 30, thereby improving the reliability of the protective shell 10. Furthermore, the second flexible layer 33 at least covers the first opening 211, the second opening 212, the outer peripheral area of the first opening 211, and the outer peripheral area of the second opening 212. That is, the second flexible layer 33 extends perpendicularly to the thickness direction z and covers the rigid area 22 of the second rigid layer 25 and the third rigid layer 26. This not only increases the connection area between the second flexible layer 33 and the second rigid layer 25 and the third rigid layer 26, improving structural stability, but also reduces the risk of the second flexible layer 33 moving along the thickness direction z during the molding process, thus providing a certain positioning function, thereby improving molding efficiency and the reliability of the molded protective shell 10.
[0087] During the molding process, the second flexible layer 33 has a certain deformation capability. The area of the second flexible layer 33 covering the first opening 211 and the second opening 212 may be partially or completely moved into the first opening 211 or the second opening 212, or partially located in the first opening 211 and partially located in the second opening 212; or the molding process may not cause the second flexible layer 33 to deform along the thickness direction z. Along the thickness direction z, the second flexible layer 33 is always located between the second rigid layer 25 and the third rigid layer 26.
[0088] In some embodiments, as shown in FIG5, the first opening 211 and the second opening 212 are the same size and are completely aligned, and the projection of the second flexible layer 33 along the thickness direction z covers the first opening 211 and its outer peripheral region, the second opening 212 and its outer peripheral region.
[0089] In some embodiments, as shown in FIG6, the size of the first opening 211 is larger than the size of the second opening 212, and the two overlap at least partially along the thickness direction z. The projection of the second flexible layer 33 along the thickness direction z covers the first opening 211 and its outer peripheral region, the second opening 212 and its outer peripheral region.
[0090] In some embodiments, as shown in FIG7, the size of the first opening 211 is smaller than the size of the second opening 212, and the two overlap at least partially along the thickness direction z. The projection of the second flexible layer 33 along the thickness direction z covers the first opening 211 and its outer peripheral region, the second opening 212 and its outer peripheral region.
[0091] In some embodiments, as shown in Figures 5 to 9, the first opening 211 and the second opening 212 at least partially overlap in the stacking direction z1.
[0092] The phrase "at least partially overlap between the first opening 211 and the second opening 212" means that the projections of the opening regions of the first opening 211 and the second opening 212 along the stacking direction z1 at least partially overlap. This reduces the occlusion of the second opening 212 by the peripheral region of the first opening 211 and the occlusion of the first opening 211 by the peripheral region of the second opening 212, thereby forming a flexible region 31 in the overlapping portion. Alternatively, it can be understood as the opening regions of the first opening 211 and the second opening 212 being at least partially aligned.
[0093] In some embodiments, as shown in Figures 8 and 9, the first opening 211 and the second opening 212 have different diameters, and the larger diameter is defined as a large hole and the smaller diameter is defined as a small hole. Along the thickness direction z of the second flexible layer 33, the small hole is located inside the large hole, and the second flexible layer 33 is disposed inside the large hole. The second flexible layer 30 covers the small hole and the outer peripheral area of the small hole.
[0094] As shown in Figure 8, the diameter of the second opening 212 on the third rigid layer 26 is larger than that of the first opening 211 on the second rigid layer 25. The second flexible layer 33 is placed inside the second opening 212, and along the thickness direction z of the second flexible layer 33, the second flexible layer 33 covers the small hole and the outer peripheral area of the small hole, so that the second rigid layer 25 can have a positioning function on the edge of the second flexible layer 33, thereby improving the structural stability of the protective shell 10.
[0095] As shown in Figure 9, the diameter of the second opening 212 on the third rigid layer 26 is smaller than that of the first opening 211 on the second rigid layer 25. The second flexible layer 33 is placed inside the first opening 211, and along the thickness direction z of the second flexible layer 33, the second flexible layer 33 covers the small hole and the outer peripheral area of the small hole, so that the third rigid layer 26 can have a positioning function on the edge of the second flexible layer 33, thereby improving the structural stability of the protective shell 10.
[0096] In some embodiments, as shown in FIG8, the second rigid layer 25 is located inside the protective shell 10; along the thickness direction z, the outer peripheral region of the first opening 211 projects onto the third rigid layer 26 to cover part of the second opening 212; the second flexible layer 33 is disposed in the second opening 212, and the outer peripheral region of the first opening 211 has a positioning function for the second flexible layer 33 in the second opening 212.
[0097] In some embodiments, as shown in FIG9, the second rigid layer 25 is located inside the protective shell 10; along the thickness direction z, the outer peripheral region of the second opening 212 projects onto the second rigid layer 25 to cover part of the first opening 211; the second flexible layer 33 is disposed in the first opening 211, and the outer peripheral region of the second opening 212 has a positioning function for the second flexible layer 33 in the first opening 211.
[0098] In some embodiments, the flexible region 31 is provided with an identifiable portion. The provision of the identifiable portion can improve the efficiency and reliability of identifying the flexible region 31, thereby improving the operational efficiency and reliability of the electronic device.
[0099] The identifiable portion can be achieved by making the flexible region 31 protrude or recess relative to the rigid region 22, or by setting the flexible region 31 and the rigid region 22 to have different textures, colors, reflectivities, etc. For example, surface treatments such as fluorescent treatment can be applied to the outer surface of the flexible region 31 to make the flexible region 31 noticeable to the user at first glance. In one specific embodiment, a fluorescent agent is added to the material layer of the flexible region 31 to help the user better notice the presence of the flexible region 31 in dark environments.
[0100] In some embodiments, the thickness of the flexible region 31 is greater than or equal to 0.2 mm and less than or equal to 0.6 mm. This thickness not only ensures that the flexible region 31 protects the corresponding function keys and other structures on the electronic device 200, but also does not affect the touch sensitivity of external operations on function keys, such as capacitive keys.
[0101] The thickness of the flexible region 31 can be 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, etc.
[0102] In some embodiments, when the electronic device 200 is assembled within the protective housing 10, the projection of the flexible region 31 toward the electronic device 200 covers at least a portion of the outer peripheral area of the function key 23 and the functional component 23 of the electronic device 200. The flexible region 31 covering the functional component 23 and its outer peripheral area increases the operating area of the functional component 23, thereby improving operational reliability.
[0103] In some embodiments, the protective shell 30 may further include other membrane layers, such as a sandwich layer disposed between the flexible layer 30 and the rigid layer 20, a sandwich layer disposed between two rigid layers 20, or each layer disposed inside the rigid layer 20. These other membrane layers do not cover the opening 21 along the thickness direction z.
[0104] This application further proposes a method for preparing a protective shell, as shown in Figure 10. Figure 10 is a schematic flowchart of an embodiment of the method for preparing a protective shell according to this application. The method for preparing a protective shell in this embodiment includes steps S201 to S204.
[0105] Step S201: Prepare the base material, including obtaining at least one flexible layer and at least one rigid layer that match the shape and size of the electronic device, wherein the rigid layer has an opening; the hardness of the flexible layer is less than the hardness of the rigid layer.
[0106] The rigid material layer and the flexible material layer are cut according to the size and shape of the electronic device into at least one flexible layer and at least one rigid layer that match the shape and size of the electronic device.
[0107] Step S202: Material shaping process, including placing a rigid layer and a flexible layer between a first release film and a second release film, and obtaining a shaped material sandwiched between the first release film and the second release film by molding and pressing; wherein the flexible layer at least covers the opening.
[0108] The first release film and the second release film are made of soft materials, for example, the first release film and the second release film are silicone layers, etc.
[0109] Step S203: Vacuum sealing process, which includes placing the molding material, the first release film, and the second release film inside the flexible container, extracting the air from the flexible container, and then sealing the flexible container.
[0110] Step S204: High temperature and high pressure treatment, including placing the sealed flexible container in a thermostatic precipitator and maintaining it at a preset pressure and temperature for a preset time, so that the shaping material is integrally formed into a plastic body after high temperature and high pressure treatment; wherein, the plastic body includes a rigid region and a flexible region, the hardness of the flexible region is less than the hardness of the rigid region, and the flexible region is provided with an opening.
[0111] The rigid layer itself forms a rigid region, or the part of the rigid layer that overlaps with the flexible layer forms a rigid region; the part of the flexible layer that does not overlap with the rigid layer forms a flexible region.
[0112] For example, flexible containers are foil bags or aluminum foil bags. Because foil bags are thinner and softer, they can transmit pressure more evenly to the first release film and the second release film. The plastic material inside is squeezed by the first release film and the second release film, causing the plastic material to soften and deform further under high pressure and high temperature.
[0113] On the one hand, this embodiment can form a flexible area at the opening position of the rigid layer, thereby giving the protective shell a local flexible area. The flexible area is easily deformed under external force, which can reduce the difficulty of disassembling and assembling the protective shell and / or improve the sensitivity and reliability of external operation on electronic devices. In addition, the flexible layer can also cover the opening, which can improve the problem that the corresponding position of the electronic device is exposed and not effectively protected. On the other hand, the position of the rigid layer without opening can form a rigid area of the protective shell. The rigid area, as the main body of the protective shell, can achieve effective protection for the entire electronic device. Furthermore, the rigid layer and the flexible layer are integrally molded, which can improve the structural stability of the protective shell and reduce the thickness and other dimensions, which can save material costs and facilitate the miniaturization of the combined structure of the protective shell and the electronic device.
[0114] In some embodiments, the preset pressure of the autoclave ranges from 0.3 to 0.9 MPa, and one stage involves maintaining the temperature at 120 to 130 degrees Celsius for 10 to 20 minutes; in an alternative embodiment, the preset pressure of the autoclave ranges from 0.3 to 0.9 MPa, and one stage involves maintaining the temperature at 130 to 140 degrees Celsius for 30 to 50 minutes; in yet another embodiment, the preset pressure of the autoclave ranges from 0.3 to 0.9 MPa, first maintaining the temperature at 120 to 130 degrees Celsius for 10 to 20 minutes, and then maintaining the temperature at 130 to 140 degrees Celsius for 30 to 50 minutes.
[0115] In some embodiments, the autoclave heats the sealed flexible container from its initial temperature to 125 degrees Celsius and holds it for 15 minutes at 0.4–0.8 MPa, and then heats it to 135 degrees Celsius and holds it for 40 minutes.
[0116] In some embodiments, as shown in FIG2, at least one rigid layer 20 includes a first rigid layer 24, and at least one flexible layer 30 includes a first flexible layer 32. The first rigid layer 24 has an opening 21, and the first flexible layer covers the opening 21 and the outer peripheral region of the opening 21. The first flexible layer 32 also covers at least the outer side of the outer peripheral region of the opening 21. This embodiment can achieve the above step S202 by the following method: firstly, the first rigid layer 24 located on the inner side is stacked on the first release film, then the first flexible layer 32 located on the outer side is stacked, and finally the second release film is applied.
[0117] In some embodiments, as shown in Figures 5 to 9, the opening 21 includes a first opening 211 and a second opening 212, the at least one rigid layer 20 includes a second rigid layer 25 and a third rigid layer 26, the at least one flexible layer includes a second flexible layer 33, the second rigid layer 25 is provided with the first opening 211, and the third rigid layer 26 is provided with the second opening 212. This embodiment can achieve step S202 as follows: stacking the second rigid layer 25 and the third rigid layer 26, and stacking the first opening 211 and the second opening 212 to form an opening, and placing the second flexible layer 33 at the position corresponding to the opening; wherein, after high temperature and high pressure treatment, the area of the second flexible layer 33 corresponding to the opening is used as the flexible area 31; the second flexible layer 33 is at least located on the side of the second rigid layer 25 facing the third rigid layer 26, and the projection of the second rigid layer 25 onto the second opening 211 and the outer peripheral area of the first opening 211; and / or the second flexible layer 33 is at least located on the side of the third rigid layer 26 facing the second rigid layer 25, and the projection of the third rigid layer 26 onto the third rigid layer 26 at least covers the second opening 212 and the outer peripheral area of the second opening 212.
[0118] In some embodiments, as shown in Figures 5 to 9, the size of the second flexible layer 33 is at least larger than one of the first opening 211 and the second opening 212; after high temperature and high pressure treatment, the second flexible layer 33 is located within the first opening 211 or the second opening 212 with a larger size, or is located between the first opening 211 and the second opening 212.
[0119] The method for preparing the protective shell proposed in this application is used to prepare the protective shell in the above embodiments. It can be adjusted based on different structures of the protective shell, and all of them are included within the scope of patent protection of this application.
[0120] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.
Claims
1. A protective shell, wherein, It includes at least one rigid layer and at least one flexible layer integrally formed, wherein the hardness of the rigid layer is greater than the hardness of the flexible layer, the rigid layer has an opening, and the flexible layer at least covers the opening to form a flexible region at the opening.
2. The protective shell according to claim 1, wherein, The protective case is configured to protect an electronic device, which has function keys. When the electronic device is mounted on the protective case, the flexible area at least partially covers the function keys.
3. The protective shell according to claim 2, wherein, The function keys include touch-sensitive buttons.
4. The protective shell according to claim 3, wherein, The sensing button includes a capacitive sensing button.
5. The protective shell according to claim 3, wherein, The electronic device includes a mobile phone, the sensing button includes a camera button, the protective case has a sidewall for surrounding the side of the mobile phone, and the flexible area is provided on the sidewall.
6. The protective shell according to claim 1, wherein, The thickness of the flexible region is 0.1 mm to 1.2 mm.
7. The protective shell according to claim 1, wherein, The protective shell has a side wall and a bottom wall. The side wall is located on the outer periphery of the bottom wall to form a receiving cavity, which is configured to accommodate the electronic device. The rigid layer is located at least on the bottom wall, the flexible layer is located at least on the side wall, and the flexible region is located on the side wall.
8. The protective shell according to claim 7, wherein, The flexible region extends through the side of the sidewall away from the bottom wall to form a semi-enclosed flexible region.
9. The protective shell according to claim 7, wherein, The flexible region is located in the middle region of the sidewall to form a fully enclosed flexible region.
10. The protective shell according to claim 1, wherein, The at least one rigid layer includes a first rigid layer, the at least one flexible layer includes a first flexible layer, the first rigid layer has the opening, and the first flexible layer covers the opening and the outer peripheral area of the opening.
11. The protective shell according to claim 10, wherein, The first flexible layer covers at least the outer side of the peripheral region of the opening.
12. The protective shell according to claim 1, wherein, The opening includes a first opening and a second opening; the at least one rigid layer includes a second rigid layer and a third rigid layer; the at least one flexible layer includes a second flexible layer; the second rigid layer has the first opening; the third rigid layer has a second opening corresponding to the first opening; the second flexible layer is at least located on the side of the second rigid layer facing the third rigid layer, and its projection onto the second rigid layer covers the first opening and the outer peripheral area of the first opening; and / or the second flexible layer is at least located on the side of the third rigid layer facing the second rigid layer, and its projection onto the third rigid layer at least covers the second opening and the outer peripheral area of the second opening.
13. The protective shell according to claim 12, wherein, The second flexible layer is disposed at least between the second rigid layer and the third rigid layer, and along the thickness direction of the second flexible layer, the second flexible layer at least covers the first opening, the second opening, the outer peripheral region of the first opening and the outer peripheral region of the second opening.
14. The protective shell according to claim 12, wherein, The first opening and the second opening have different diameters, and the larger diameter is defined as a large hole and the smaller diameter is defined as a small hole. Along the thickness direction of the second flexible layer, the small hole is located inside the large hole, and the second flexible layer is disposed inside the large hole. The second flexible layer covers the small hole and the outer peripheral area of the small hole.
15. The protective shell according to claim 6, wherein, The thickness of the flexible region is greater than or equal to 0.2 mm and less than or equal to 0.6 mm.
16. The protective shell according to claim 1, wherein, When an electronic device is assembled inside the protective casing, the projection of the flexible area toward the electronic device covers the function keys of the electronic device and at least a portion of the outer peripheral area of the function keys.
17. The protective shell according to claim 1, wherein, The flexible layer comprises a composite layer of aramid fibers and TPU.
18. The protective shell according to claim 1, wherein, The flexible layer includes an aramid fiber dry cloth and TPU applied to both opposite sides of the aramid fiber dry cloth.
19. The protective shell according to claim 1, wherein, The rigid layer comprises a composite layer of aramid fiber and thermosetting resin.
20. The protective shell according to claim 1, wherein, The outer surface of the flexible region is flush with or has a height difference from the outer surface of its peripheral region, wherein the height difference is 0.1 mm to 0.5 mm.
21. The protective shell according to claim 1, wherein, The flexible region has an identifiable portion.
22. A method for preparing a protective shell, characterized in that, include: The preparation of the base material includes obtaining at least one flexible layer and at least one rigid layer that match the shape and size of the electronic device, wherein the rigid layer has an opening; the hardness of the flexible layer is less than the hardness of the rigid layer; Material shaping process includes placing the rigid layer and the flexible layer between a first release film and a second release film, and pressing them together to obtain a shaped material sandwiched between the first release film and the second release film; wherein the flexible layer at least covers the opening; Vacuum sealing process includes placing the molding material, the first release film, and the second release film inside a flexible container, extracting the air from the flexible container, and then sealing the flexible container. High temperature and high pressure treatment includes placing the sealed flexible container in an autoclave and maintaining it at a preset pressure and temperature for a preset time, so that the plastic material is integrally molded into a plastic body after high temperature and high pressure treatment; The shaped body includes a rigid region and a flexible region, wherein the hardness of the flexible region is less than that of the rigid region, and the flexible region is provided corresponding to the opening.
23. The preparation method according to claim 22, wherein, The opening includes a first opening and a second opening; the at least one rigid layer includes a second rigid layer and a third rigid layer; the at least one flexible layer includes a second flexible layer; the second rigid layer is provided with the first opening; and the third rigid layer is provided with the second opening. The step of placing the rigid layer and the flexible layer between the first release film and the second release film, and then pressing them together to obtain a molding material sandwiched between the first release film and the second release film includes: The second rigid layer and the third rigid layer are stacked, and the first opening and the second opening are stacked to form an opening. The second flexible layer is placed at the position corresponding to the opening. Wherein, after the high temperature and high pressure treatment, the area of the second flexible layer corresponding to the opening is the flexible area; the second flexible layer is at least located on the side of the second rigid layer facing the third rigid layer, and its projection toward the second rigid layer covers the first opening and the outer peripheral area of the first opening; and / or the second flexible layer is at least located on the side of the third rigid layer facing the second rigid layer, and its projection toward the third rigid layer at least covers the second opening and the outer peripheral area of the second opening.
24. The preparation method according to claim 22, wherein, The size of the second flexible layer is at least larger than either the first opening or the second opening; After the high temperature and high pressure treatment, the second flexible layer is located in the first opening or the second opening with a larger size, or between the first opening and the second opening.